Resin composition, method for producing the resin composition, and cured resin product
The photocurable resin composition with a silicone-containing acrylate precursor and isocyanate group addresses discoloration and low crosslink density issues, achieving high crosslink density and improved performance in resin cured products.
JP2026109132APending Publication Date: 2026-07-01NIPPON CARBIDE KOGYO KK
Patent Information
- Application Number
- JP2024224035
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2026-07-01
AI Technical Summary
Technical Problem
Thermal curing of epoxy crosslinking in resin compositions leads to discoloration and lower crosslink density, resulting in inferior performance and appearance of cured resin products.
Method used
A photocurable resin composition containing a silicone-containing acrylate resin precursor, a (meth)acrylic monomer with a hydroxyl group, a (meth)acrylate with an isocyanate group, and a photoinitiator, which upon light irradiation, forms a resin cured product with suppressed discoloration and high crosslink density.
Benefits of technology
The resin composition achieves excellent appearance and high crosslink density, improving antifouling function and moldability while preventing silicone bleed-out, with a gel fraction of 95% or more.
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Abstract
A resin composition that can form a cured resin product with suppressed discoloration (i.e., low degree of yellowing), excellent appearance, and a high crosslink density (gel fraction). [Solution] A resin composition comprising a silicone-containing acrylic resin precursor containing 35 to 85% by mass of structural units (1) derived from a silicone-containing (meth)acrylate represented by formula (1) and 10 to 40% by mass of structural units (2) derived from a (meth)acrylic monomer having a hydroxyl group, a (meth)acrylate having an isocyanate group, and a photoinitiator. TIFF2026109132000028.tif60165
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Citation Information
Patent Citations
Resin composition, optical member using the same and its manufacturing method
JP2006307087A
