Composition and cured layer

Abstract

The present invention provides a composition suitable for forming a patterned film layer using an inkjet printing process and possessing excellent storage stability, wherein the resulting cured layer maintains high chemical resistance, solder resistance, and adhesion while also exhibiting excellent fold resistance. [Solution] The composition comprises 100 parts by weight of a first monomer, 1 to 10 parts by weight of a second monomer, 10 to 30 parts by weight of a urethane acrylate, and 15 to 35 parts by weight of a blocked isocyanate compound. The first monomer is a monoacrylate compound, a monomethacrylate compound, a vinyl aromatic compound, an oxetane compound, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, N-vinylformamide, or a combination of the above. The second monomer is an alcohol compound having at least two reactive functional groups, the reactive functional groups being acrylate groups or methacrylate groups.

Description

Technical Field

[0001] The present disclosure relates to a composition and a cured layer formed using the same.

Background Art

[0002] When forming an etching resist, a solder resist, a mark, etc. on a printed circuit board, a conventional method is to apply a high-viscosity ink composition onto a substrate using screen printing. In recent years, as an alternative to screen printing, a method of spraying an ink composition onto a substrate by an inkjet method has been developed. The characteristics of the inkjet method are that the amount of ink used can be reduced and it can be directly drawn from digital data.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the properties required for the composition used in the inkjet printing (IJP) process are different from those of the composition for conventional screen printing.

[0005] Furthermore, in recent years, electronic devices such as mobile phones, cameras, and notebook computers have become smaller and thinner. In the manufacturing process of circuit boards, such as semiconductor package substrates, flexible printed circuit boards (FPCs), or rigid-flexible (RF) substrates, the cured layer of the ink composition used after the inkjet printing process requires high adhesion to the substrate, solder resistance, and chemical resistance. In addition, it must also have bending resistance to prevent the cured layer from breaking and losing its protective effect when the substrate bends.

[0006] Currently, photocurable inkjet compositions applicable to inkjet printing processes are mainly used for rigid substrates, and the materials are epoxy and phenolic resin derivatives, but they tend to become brittle after curing and have poor flexural resistance. [Means for solving the problem]

[0007] Therefore, it is necessary to solve the problems faced by the conventional technology with a novel curable composition.

[0008] According to embodiments of the present disclosure, the present disclosure provides a composition, for example, a curable composition to be applied to an inkjet printing (IJP) process. According to embodiments of the present disclosure, the composition comprises 100 parts by weight of a first monomer, 1 to 10 parts by weight of a second monomer, 10 to 30 parts by weight of a urethane acrylate, and 15 to 35 parts by weight of a blocked isocyanate, wherein the first monomer is a monoacrylate compound, a monomethacrylate compound, a vinyl aromatic compound, an oxetane compound, a maleic anhydride, a dicyclopentadiene, an N-vinylpyrrolidone, an N-vinylformamide, or a combination thereof, and the second monomer is an alcohol compound having at least two reactive functional groups, wherein the reactive functional groups are an acrylate group or a methacrylate group.

[0009] According to embodiments of the present disclosure, the present disclosure also provides a cured layer, which is a cured product of the composition of the present disclosure. [Effects of the Invention]

[0010] Embodiments of this disclosure provide compositions, such as photosensitive curable compositions, that can form a patterned film layer by an inkjet printing (IJP) process and a cured layer by an exposure process. By introducing specific reaction monomers and combining specific components and ratios, the viscosity of the compositions of this disclosure at 25°C ranges from 18 cps to 34 cps, making them highly suitable for forming a patterned film layer using an inkjet printing (IJP) process and possessing excellent storage stability (the viscosity increase is 1% or less after 30 days of storage at 60°C). Furthermore, the cured layers produced using the compositions of this disclosure possess excellent fold resistance while maintaining high chemical resistance, solder resistance, and adhesion, making them highly suitable for use in printed circuit boards. [Modes for carrying out the invention]

[0011] The compositions and cured layers of this disclosure will be described in detail below. It should be understood that the following description presents several different embodiments for carrying out various aspects of this disclosure. The specific elements and arrangements described below are for illustrative purposes only. Naturally, these are merely examples and do not limit this disclosure. In this disclosure, the term "about" means an amount that is more or less than a given amount and would be considered common and reasonable by those skilled in the art.

[0012] Ordinal numbers used in the specification and claims, such as "first," "second," and "third," are used to modify the components of a claim, but they do not mean or represent any preceding ordinal number before the component in that claim, nor do they represent the order of components in one claim and another, or the order in a manufacturing method. These ordinal numbers are used merely to clearly distinguish a component in a claim with a certain name from a component in another claim with the same name.

[0013] The specific embodiments described herein are for the purpose of disclosing specific methods used in the present invention and do not limit the invention. Unless otherwise defined, all terms used in this disclosure (including technical and scientific terms) have the same meaning as that which a person of ordinary skill in the art to which this disclosure belongs would ordinarily understand. It should be further understood that terms defined in commonly used dictionaries should be interpreted in a sense consistent with the relevant art and the content of this disclosure, and not in an idealized or overly strict sense unless expressly defined herein.

[0014] According to embodiments of the present disclosure, the present disclosure provides a composition. According to embodiments of the present disclosure, the composition comprises 100 parts by weight of a first monomer, 1 to 10 parts by weight of a second monomer (e.g., 1.5 parts by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, or 9 parts by weight), 10 to 30 parts by weight of a urethane acrylate (e.g., 12 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, or 28 parts by weight), and 15 to 35 parts by weight of a blocked isocyanate (e.g., 17 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, or 33 parts by weight). According to embodiments of the present disclosure, if the amount of the second monomer is too small, the chemical resistance, solder resistance, and adhesion of the cured layer made from the composition will be lower. If the amount of the second monomer is too high, the viscosity of the cured layer produced from the composition will be too high, making it unsuitable for forming a patterned film layer using an inkjet printing (IJP) process. According to embodiments of this disclosure, if the amount of urethane acrylate is too low, the resulting film layer will have relatively poor folding resistance. If the amount of urethane acrylate is too high, the viscosity of the composition will be too high, making it unsuitable for an inkjet printing process. According to embodiments of this disclosure, if the amount of the blocked isocyanate compound is too low, the resulting film layer will have relatively poor adhesion and solder resistance. If the amount of the blocked isocyanate compound is too high, the viscosity of the composition will be too high, making it unsuitable for an inkjet printing process.

[0015] According to embodiments of the present disclosure, the first monomer may be a monoacrylate compound, a monomethacrylate compound, a vinyl aromatic compound, an oxetane compound, a maleic anhydride, a dicyclopentadiene, an N-vinylpyrrolidone, an N-vinylformamide, or a combination thereof.

[0016] According to embodiments of this disclosure, the monoacrylate compound is methyl acrylate, ethyl acrylate, butyl acrylate, acryloyl morpholine, 2-hydroxy-3-acryloxypropyl acrylate, 2-hydroxy-3-phenoxyethyl acrylate, 1,4-cyclohexanedimethanol monoacrylate, methoxypolyethylene glycol monoacrylate, alkoxylated lauryl acrylate, tetrahydrofurfuryl acrylate, lauryl acrylate, and 2-(2-ethoxyethoxy)ethyl acrylate. acrylate), stearyl acrylate, isodecyl acrylate, 2-phenoxyethyl acrylate, 3,3,5-Trimethylcyclohexyl acrylate, isobornyl acrylate, tridecyl acrylate, ethoxylated nonyl phenol acrylate, octyldecyl acrylate, cyclic trimethylolpropane formal acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, ethylhexyl acrylate, or any combination thereof.

[0017] According to embodiments of this disclosure, the monomethacrylate compound is methyl methacrylate, ethyl methacrylate, butyl methacrylate, methacryloyl morpholine, 2-hydroxy-3-methacryloxypropyl methacrylate, 2-hydroxy-3-phenoxyethyl methacrylate, 1,4-cyclohexanedimethanol monomethacrylate, methoxy polyethylene glycol monomethacrylate, alkoxylated lauryl methacrylate, tetrahydrofurfuryl methacrylate, lauryl methacrylate. methacrylate), 2-(2-ethoxyethoxy)ethyl methacrylate, stearyl methacrylate, isodecyl methacrylate, 2-phenoxyethyl methacrylate, 3,3,5-Trimethylcyclohexyl methacrylate, isobornyl methacrylate, tridecyl methacrylate, ethoxylated nonyl phenol methacrylate, octyldecyl methacrylate, cyclic trimethylolpropane formal methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, ethylhexyl methacrylate, or any combination thereof.

[0018] According to embodiments of the present disclosure, the vinyl aromatic compound may be styrene, methylstyrene, chloromethylstyrene, ethylstyrene, cyclohexylstyrene, vinylbiphenyl, 1-vinyl-5-hexylnaphthalene, vinylnaphthalene, vinylanthracene, or a combination thereof.

[0019] According to an embodiment of the present disclosure, the oxetane compound may be xylylene dioxetane, hydroxyoxetane, 3-ethyl-3-(phenoxymethyl)oxetane, or a combination of the above.

[0020] According to an embodiment of the present disclosure, the first monomer of the present disclosure is liquid at room temperature (e.g., from about 18 °C to 35 °C), and the second monomer, urethane acrylate, and blocked isocyanate compound of the present disclosure are soluble or dispersible in the first monomer. Thus, the composition of the present disclosure has fluidity at room temperature (e.g., from about 18 °C to 35 °C).

[0021] According to an embodiment of the present disclosure, the second monomer of the present disclosure may be an alcohol compound having at least two reactive functional groups, and the reactive functional groups may be acrylate groups or methacrylate groups. According to an embodiment of the present disclosure, the alcohol compound having at least two reactive functional groups may be pentaerythritol diacrylate, pentaerythritol triacrylate (PETIA), dipentaerythritol tetraacrylate (DPTA), dipentaerythritol pentaacrylate (DPPA), 3-(acryloyloxy)-2-hydroxypropyl acrylate, 2-ethyl-2-(hydroxymethyl)-1,3-propanediyl bismethacrylate, or a combination of the above.

[0022] According to embodiments of the present disclosure, the urethane acrylate may be an aromatic urethane acrylate, an aliphatic urethane acrylate, or a combination of the above. According to embodiments of the present disclosure, the urethane acrylate may be an aliphatic urethane diacrylate, an aliphatic urethane triacrylate, an aliphatic urethane hexaacrylate, an aromatic urethane diacrylate, an aromatic urethane hexaacrylate, an aliphatic urethane dimethacrylate, an aliphatic urethane trimethacrylate, an aliphatic urethane hexamethacrylate, an aromatic urethane dimethacrylate, an aromatic urethane hexamethacrylate, or a combination of the above.

[0023] According to an embodiment of the present disclosure, the blocked isocyanate compound may be a reaction product of a multimer of an isocyanate compound and an end-capping agent. In other words, the blocked isocyanate compound may be an isocyanate compound multimer having a protecting group. According to an embodiment of the present disclosure, the blocked isocyanate compound is obtained by end-capping an isocyanate multimer having a biuret structure, an isocyanurate structure, or an adduct structure using an end-capping agent. Further, the blocked isocyanate compound of the present disclosure can generate an isocyanate group by heating (for example, from 90°C to 150°C).

[0024] The isocyanate compounds used to synthesize blocked isocyanate compounds have two or more isocyanate groups in one molecule. For example, isocyanate compounds include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, isophorone diisocyanate, 1,6-hexamethylene diisocyanate, 1,3-trimethylene diisocyanate, 1,4-tetramethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate. Diisocyanate, 1,9-nonamethylene diisocyanate, 1,10-decamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 2,2'-diethyl ether diisocyanate, diphenylmethane-4,4'-diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate, p-xylylene diisocyanate, methylenebis(cyclohexyl isocyanate) isocyanate)), cyclohexane-1,3-dimethyl diisocyanate (1,3-cyclohexanedimethylene diisocyanate, 1,4-cyclohexanedimethylene diisocyanate, 1,5-naphthalene diisocyanate, p-phenylene diisocyanate, 3,3'-methylenebis(o-tolyl diisocyanate), 4,4'-diphenyl ether diisocyanate, tetrachlorophenylene diisocyanate, norbornane diisocyanate, hydrogenated 1,3-xylylene diisocyanate It may be diisocyanate, or hydrogenated 1,4-xylylene diisocyanate.

[0025] According to embodiments of the present disclosure, the end-capping agent that forms the end-capping structure of the blocked isocyanate compound of the present disclosure may be an oxime compound, a lactam compound, a phenol compound, an alcohol compound, an amine compound, an active methylene compound, a pyrazole compound, a thiol compound, an imidazole-based compound, or an imide-based compound. For example, the oxime compound may be acetooxime, formaldoxime, cyclohexaneoxime, methylethylketoxime, cyclohexanoneoxime, or benzophenoneoxime. The lactam compound may be ε-caprolactam or γ-butyrolactam. The phenol compound may be phenol, naphthol, cresol, or xylenol. The alcohol compound may be methanol, ethanol, propanol, butanol, cyclohexanol, ethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, or alkyl lactate ester. The amine compound may be aniline, diphenylamine, ethyleneimine, or polyethyleneimine. The active methylene compound may be diethyl malonate, dimethyl malonate, ethyl acetoacetate, or methyl acetoacetate. The pyrazole compound may be pyrazole, methylpyrazole, or dimethylpyrazole. The thiol compound may be alkylthiol or arylthiol.

[0026] According to embodiments of the present disclosure, the compositions of the present disclosure may further contain 0.1 to 20 parts by weight (e.g., 0.5 parts by weight, 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 10 parts by weight, or 15 parts by weight) of an initiator, such as a photoinitiator. The photoinitiator may be a benzoin-based compound, an acetophenone-based compound, a thioxanthone-based compound, a ketal compound, a benzophenone-based compound, an α-aminoacetophenone compound, an acylphosphine oxide compound, a biimidazole-based compound, a triazine-based compound, or a combination thereof.

[0027] According to embodiments of the present disclosure, the acetophenone compound may be a photoinitiator of Ciba Geigy product numbers Irgacure 2959, Irgacure 184, Irgacure 500, Irgacure 651, Irgacure 369, Irgacure 379, Irgacure 907, or Darocur 1173. According to embodiments of the present disclosure, the initiator of the present disclosure may be a photoinitiator of product numbers IRGACURE 819, IRGACURE 1800, Lucirin TPO, or Lucirin TPO-L. According to embodiments of the present disclosure, the initiator of the present disclosure may be a photoinitiator with product numbers Esacure 1001M, Esacure KIP150, Speedcure BEM, Speedcure EHA, Speedcure BMS, Speedcure MBP, Speedcure PBZ, Speedcure ITX, Speedcure DETX, Speedcure EBD, Speedcure MBB, Speedcure BP from Lambson Corporation, or a photoinitiator with product numbers Irgacure 2100, Irgacure 250, or Irgacure 784 from Ciba Geigy Corporation.

[0028] According to embodiments of the present disclosure, the composition of the present disclosure comprises a first monomer, a second monomer, a urethane acrylate, a blocked isocyanate compound, and an initiator. According to embodiments of the present disclosure, the composition of the present disclosure may consist of a first monomer, a second monomer, a urethane acrylate, a blocked isocyanate compound, and an initiator.

[0029] According to embodiments of the present disclosure, the composition of the present disclosure may further contain 0.1 to 10 parts by weight (e.g., 0.5 parts by weight, 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, or 8 parts by weight) of a photoacid generator. The photoacid generator of the present disclosure may be an onium salt, a triarylsulfonium salt, an alkylarylsulfonium salt, a diaryliodonium salt, a diarychloronium salt, a diarybromonium salt, a sulfonate salt, a diazonium salt, a diazonaphthoquinone sulfonate, or a combination thereof.

[0030] According to embodiments of the present disclosure, the composition of the present disclosure comprises a first monomer, a second monomer, a urethane acrylate, a blocked isocyanate compound, an initiator, and a photoacid generator. According to embodiments of the present disclosure, the composition of the present disclosure may consist of a first monomer, a second monomer, a urethane acrylate, a blocked isocyanate compound, an initiator, and a photoacid generator.

[0031] According to embodiments of the present disclosure, the compositions of the present disclosure may further contain 0.1 to 40 parts by weight (e.g., 1 part by weight, 5 parts by weight, 8 parts by weight, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, or 35 parts by weight) of additives. According to embodiments of the present disclosure, the additives may be conventional additives for curable compositions (e.g., curable compositions that can be used in the manufacturing process of printed circuit boards), such as leveling agents, fillers, colorants (e.g., white pigments, black pigments, green pigments, red pigments, blue pigments, or yellow pigments), dyes, defoamers, flame retardants, viscosity modifiers, thixotropic agents, dispersants, stabilizers, or combinations thereof.

[0032] According to embodiments of the present disclosure, the present disclosure also provides a cured layer, which is a cured product of the composition of the present disclosure. According to embodiments of the present disclosure, the method for producing the cured layer may include the step of forming a pattern layer on a substrate with the composition of the present disclosure using an inkjet printing (IJP) process. Then, the pattern layer is subjected to an exposure process, and if necessary, a bake process is performed to obtain the cured layer. According to embodiments of the present disclosure, the light source for the exposure process may be ultraviolet (UV) light (wavelength may be from 150 nm to 400 nm), and the exposure amount may be 50 mJ / cm². 2 From 200 mJ / cm² 2 (For example, 70 mJ / cm²) 2 , 100 mJ / cm 2 , 120 mJ / cm 2 , 150 mJ / cm 2 , or 180 mJ / cm² 2 ) is acceptable.

[0033] To make the above-mentioned contents of this disclosure, as well as other purposes, features, and advantages, clearer and easier to understand, preferred embodiments are described below in detail with reference to the accompanying drawings.

[0034] curable composition

[0035] Example 1 A mixture was obtained by homogeneously mixing 50 grams of 4-acryloyl morpholine (ACMO), 15 grams of 2-hydroxyethyl acrylate (2-HEA), 15 grams of tetrahydrofurfuryl acrylate (THFA), and 8 grams of diphenyl(2,4,6-trimethylbenzoyl) phosphine oxide (TPO) (used as a photoinitiator). Next, 2 grams of pentaerythritol triacrylate (trade name: 4334), 20 grams of aliphatic urethane diacrylate (trade name: GU3010Z, manufactured by Kokusei Chemical Co., Ltd.), 14 grams of isophorone diisocyanate (IPDI) trimer (end capping agent: 3,5-dimethylpyrazole (DMP) (trade name: BI 7951, manufactured by Anpeng Industrial Co., Ltd.)), and 9 grams of white titanium dioxide (TiO2) (trade name: RFDO) (average particle size approximately 220 to 300 nm) were sequentially added to the mixture. After homogeneous mixing, the resulting mixture was filtered through a 1 μm filter to obtain curable composition (1).

[0036] Example 2 Except for increasing the dose of pentaerythritol triacrylate from 2 grams to 4 grams, decreasing the dose of aliphatic urethane diacrylate from 20 grams to 18 grams, and increasing the dose of isophorone diisocyanate trimer from 14 grams to 16 grams, Example 2 was carried out based on the method for preparing curable composition (1) described in Example 1 to obtain curable composition (2).

[0037] Example 3 Except for increasing the dose of pentaerythritol triacrylate from 2 grams to 4 grams, decreasing the dose of aliphatic urethane diacrylate from 20 grams to 15 grams, and increasing the dose of isophorone diisocyanate trimer from 14 grams to 19 grams, Example 3 was carried out based on the method for preparing curable composition (1) described in Example 1 to obtain curable composition (3).

[0038] Example 4 Except for increasing the dose of pentaerythritol triacrylate from 2 grams to 4 grams, decreasing the dose of aliphatic urethane diacrylate from 20 grams to 10 grams, and increasing the dose of isophorone diisocyanate trimer from 14 grams to 24 grams, Example 4 was carried out based on the method for preparing curable composition (1) described in Example 1 to obtain curable composition (4).

[0039] Comparative Example 1 A mixture was obtained by uniformly mixing 83 grams of 1,6-Hexanediol diacrylate (trade name SR238NS) and 8 grams of diphenyl(2,4,6-trimethylbenzoyl) phosphine oxide (TPO) (used as a photoinitiator). Next, 18 grams of biphenol A diglycidyl ether (trade name Epon 828), 4 grams of pentaerythritol triacrylate (trade name Soken 4334), 12 grams of isophorone diisocyanate (IPDI) trimer (trade name BI 7951, manufactured by Anpo Jitsugyo Co., Ltd.), and 9 grams of white titanium dioxide (TiO2) (trade name RFDO) (average particle size approximately 220 to 300 nm) were sequentially added to the mixture. After homogeneous mixing, the resulting mixture was filtered through a 1 μm filter to obtain a curable composition (5).

[0040] Comparative Example 2 Comparative Example 2 was carried out based on the method for preparing curable composition (5) described in Comparative Example 1, except that 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (trade name DOUBLEMER 421P, manufactured by Souken Chemical Co., Ltd.) was used instead of biphenol A diglycidyl ether (Epon 828), the amount of diphenyl (2,4,6-trimethylbenzoyl)phosphine oxide (TPO) was reduced from 8 grams to 6 grams, and 2 grams of photoacid generator (trade name CPI®-100, manufactured by San-Apro Co., Ltd.) were added, to obtain curable composition (6).

[0041] Comparative Example 3 Comparative Example 3 was carried out based on the method for preparing curable composition (5) described in Comparative Example 1, except that the dose of biphenol A diglycidyl ether (Epon 828) was reduced from 18 grams to 9 grams, 9 grams of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (trade name DOUBLEMER 421P, manufactured by Souken Chemical Co., Ltd.) were added, the dose of diphenyl (2,4,6-trimethylbenzoyl)phosphine oxide (TPO) was reduced from 8 grams to 7 grams, and 2 grams of photoacid generator (trade name CPI®-100, manufactured by San-Apro Co., Ltd.) were added, to obtain curable composition (7).

[0042] Comparative Example 4 A mixture was obtained by homogeneously mixing 83 grams of 1,6-hexanediol diacrylate (trade name SR238NS), 3 grams of 2-hydroxyethyl acrylate (2-HEA), 4 grams of tetrahydrofurfuryl acrylate (THFA), and 8 grams of diphenyl(2,4,6-trimethylbenzoyl) phosphine oxide (TPO) (used as a photoinitiator). Then, 38 grams of aliphatic urethane diacrylate (trade name GU3010Z, manufactured by Kokusei Chemical Co., Ltd.), 4 grams of pentaerythritol triacrylate (trade name 4334), and 9 grams of white titanium dioxide (TiO2) (trade name RFDO) (average particle size approximately 220 to 300 nm) were sequentially added to the mixture. After uniform mixing, the resulting mixture was filtered through a 1 μm filter to obtain a curable composition (8).

[0043] Comparative Example 5 Comparative Example 5 was carried out based on the method for preparing curable composition (8) described in Comparative Example 4, except that 38 grams of aliphatic urethane diacrylate were replaced with isophorone diisocyanate (IPDI) trimer (trade name BI 7951, manufactured by Anpo Jitsugyo Co., Ltd.), and curable composition (9) was obtained.

[0044] Comparative Example 6 Comparative Example 6 was carried out based on the method for preparing curable composition (5) described in Comparative Example 1, except that the dose of 1,6-hexanediol diacrylate was increased from 83 grams to 94 grams and the isophorone diisocyanate trimer was not added, thereby obtaining curable composition (10).

[0045] Next, the viscosity of curable compositions (1) to (10) at 25°C was measured to evaluate their storage stability. The results are shown in Table 1. The storage stability evaluation method was as follows: First, the viscosity (V1) of the curable composition at 25°C was measured. Then, after the curable composition was placed at 60°C for 30 days, its viscosity (V2) was measured again, and the viscosity increase (V2-V1) of the curable composition was calculated. After storage at 60°C for 30 days, if the viscosity increase was 2 cps or less, it was recorded as ○; if the viscosity increase was greater than 2 cps but 10 cps or less, it was recorded as △; and if the viscosity increase was greater than 10 cps, or if the composition had no fluidity, it was recorded as ×. Viscosity was measured using a high shear rate viscometer (CAP2000 H, Brookfield).

[0046] [Table 1]

[0047] As can be seen from Table 1, by using a specific composition and proportion, the curable composition of this disclosure has a viscosity of 33 cps or less at room temperature and an increase in viscosity of 2 cps or less (1% or less) after storage at 60°C for 30 days, exhibiting extremely excellent storage stability.

[0048] Evaluation of cured material and its properties Using an inkjet printing (IJP) process (nozzle model number KM1020, manufactured by Kyocera), pattern layers (thickness 15 ± 1 μm) were formed on a copper foil substrate (dimensions 10 cm × 10 cm) having a polyimide (PI) coating layer, using curable compositions (1) to (10). Next, the pattern layers were subjected to an exposure process (using ultraviolet light with a wavelength of 395 nm as the light source), and the pattern layers were baked at 150°C to obtain cured layers (1) to (10) placed on the polyimide coating layer. The chemical resistance, solder resistance (at 288°C), folding resistance, and adhesion of the cured layers (1) to (10) were then evaluated. The results are shown in Table 2. Chemical resistance was evaluated as follows. The hardened layer (along with the copper foil substrate) was cut to make test pieces (dimensions 10mm x 100mm), and immersed in sulfuric acid aqueous solution (concentration 10wt%) and sodium hydroxide aqueous solution (concentration 10wt%) respectively, and stirred at 25°C. After 20 minutes, the hardened layer was removed and observed. If there were no scratches on the surface of the hardened layer, it was recorded as ○; if there were minor scratches on the surface of the hardened layer, it was recorded as △; and if the hardened layer was clearly swollen or peeled off from the copper foil substrate, it was recorded as ×. Solder resistance was evaluated as follows: The hardened layer (along with the copper foil substrate) was cut to make test pieces (dimensions 10mm x 100mm), and placed in a solder bath at 288°C. After 10 minutes, the hardened layer was removed and observed. If there were no scratches on the surface of the hardened layer, it was recorded as ○; if there were minor scratches on the surface of the hardened layer, it was recorded as △; and if the hardened layer was clearly swollen or peeled off from the copper foil substrate, it was recorded as ×. Folding resistance was evaluated as follows: The hardened layer (along with the copper foil substrate) was cut to form a test specimen (dimensions 10 mm x 100 mm), and the specimen was bent from the center with a radius of curvature of 1.0 mm (bending angle 180 degrees, load 1 kg, number of bends 3 times). If there was no fracture in the hardened layer, it was recorded as ○; if there were minor cracks or scratches in the hardened layer, it was recorded as △; and if a large area of ​​the hardened layer fractured or peeled off from the copper foil substrate, it was recorded as ×. Adhesion was evaluated by the cross-cut method (according to ASTM D3359).

[0049] Furthermore, using an inkjet printing (IJP) process (nozzle model number KM1020, manufactured by Kyocera), pattern layers (thickness 15 ± 1 μm) were formed on a paper phenolic laminate (FR-1, dimensions 10 cm × 10 cm) using curable compositions (1) to (10). Next, the pattern layers were subjected to an exposure process (using ultraviolet light with a wavelength of 395 nm as the light source), and the pattern layers were baked at 150°C to obtain cured layers (11) to (20) placed on the phenolic resin. Subsequently, the adhesion of cured layers (11) to (20) was evaluated. The results are shown in Table 2.

[0050] [Table 2]

[0051] As can be seen from Table 2, by using specific compositions and ratios, the cured layers obtained using the curable compositions of this disclosure will have desirable chemical resistance, solder resistance, and adhesion, as well as 180-degree bending resistance, making them suitable for forming patterned layers on flexible, bendable / flexible substrates in inkjet processes.

[0052] In summary, by introducing specific reaction monomers and using specific components and compositional ratios, the composition of this disclosure achieves a viscosity of 18 cps to 34 cps at 25°C, making it highly suitable for forming patterned film layers in inkjet printing (IJP) processes, and also possessing extremely excellent storage stability (viscosity increase of 1% or less after 30 days of storage at 60°C). Furthermore, the cured layer produced using the composition of this disclosure maintains high chemical resistance, solder resistance, and adhesion, while also possessing excellent fold resistance, making it highly suitable for use on printed circuit boards.

[0053] Although the present disclosure has been disclosed in part by several embodiments, these embodiments are not intended to limit the present disclosure. Any person with ordinary skill in the art may make any modifications and alterations without departing from the spirit and scope of the present disclosure, and the scope of protection of the present disclosure shall be as defined in the attached claims.

Claims

1. A composition, 100 parts by weight of a first monomer which is a monoacrylate compound, a monomethacrylate compound, a vinyl aromatic compound, an oxetane compound, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, N-vinylformamide, or a combination thereof, A second monomer is an alcohol compound having at least two reactive functional groups, wherein the reactive functional groups are acrylate groups or methacrylate groups, and the second monomer is present in 1 to 10 parts by weight. 10 to 30 parts by weight of urethane acrylate, 15 to 35 parts by weight of a blocked isocyanate compound and A composition containing the following:

2. The composition according to claim 1, wherein the viscosity of the composition at 25°C is 18 cps to 34 cps.

3. The aforementioned monoacrylate compound is methyl acrylate, ethyl acrylate, butyl acrylate, acryloyl morpholine, 2-hydroxy-3-acryloxypropyl acrylate, 2-hydroxy-3-phenoxyethyl acrylate, 1,4-cyclohexanedimethanol monoacrylate (1,4-cyclohexane dimethanol monoacrylate, methoxy polyethylene glycol monoacrylate, alkoxylated lauryl acrylate, tetrahydrofurfuryl acrylate, lauryl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, stearyl acrylate, isodecyl acrylate, 2-phenoxyethyl acrylate, 3,3,5-trimethylcyclohexyl acrylate, isobornyl acrylate, tridecyl acrylate, ethoxylated nonyl phenol acrylate, octyldecyl acrylate The composition according to claim 1, which is acrylate, cyclic trimethylolpropane formal acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, ethylhexyl acrylate, or a combination of the above.

4. The aforementioned monomethacrylate compound is methyl methacrylate, ethyl methacrylate, butyl methacrylate, methacryloyl morpholine, 2-hydroxy-3-methacryloxypropyl methacrylate, 2-hydroxy-3-phenoxyethyl methacrylate, 1,4-cyclohexanedimethanol monomethacrylate (1,4-cyclohexane dimethanol monomethacrylate, methoxy polyethylene glycol monomethacrylate, alkoxylated lauryl methacrylate, tetrahydrofurfuryl methacrylate, lauryl methacrylate, 2-(2-ethoxyethoxy)ethyl methacrylate, stearyl methacrylate, isodecyl methacrylate, 2-phenoxyethyl methacrylate, 3,3,5-trimethylcyclohexyl methacrylate, isobornyl methacrylate, tridecyl methacrylate, ethoxylated nonyl phenol methacrylate, octyldecyl methacrylate The composition according to claim 1, which is methacrylate, cyclic trimethylolpropane formal methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, ethylhexyl methacrylate, or a combination of the above.

5. The composition according to claim 1, wherein the vinyl aromatic compound is styrene, methylstyrene, chloromethylstyrene, ethylstyrene, cyclohexylstyrene, vinylbiphenyl, 1-vinyl-5-hexylnaphthalene, vinylnaphthalene, vinylanthracene, or a combination thereof.

6. The composition according to claim 1, wherein the oxetane compound is xylylene dioxetane, hydroxyoxetane, 3-ethyl-3-(phenoxymethyl)oxetane, or a combination thereof.

7. The composition according to claim 1, wherein the alcohol compound having at least two reactive functional groups is pentaerythritol diacrylate, pentaerythritol triacrylate (PETIA), dipentaerythritol tetraacrylate (DPTA), dipentaerythritol pentaacrylate (DPPA), 3-(acryloyloxy)-2-hydroxypropyl acrylate, 2-ethyl-2-(hydroxymethyl)-1,3-propanediyl bismethacrylate, or a combination thereof.

8. The composition according to claim 1, wherein the urethane acrylate is an aromatic urethane acrylate, an aliphatic urethane acrylate, or a combination thereof.

9. The composition according to claim 1, wherein the blocked isocyanate compound is a reaction product of a multimer of the isocyanate compound and an end-capping agent.

10. The composition according to claim 1, further comprising 1 to 20 parts by weight of an initiator.

11. A cured layer, wherein the cured layer is a cured product of the composition described in any one of claims 1 to 10.

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