Laminate
Patent Information
- Application Number
- JP2025053708
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-03-29
- Filing Date
- 2025-03-27
- Publication Date
- 2026-06-09
- Estimated Expiration
- 2045-03-27
Smart Images

Figure 0007872402000001 
Figure 0007872402000002
Abstract
Claims
1. It comprises a heat-seal layer and a base layer, The solid content per unit area of the heat seal layer is 0.05 to 1.5 g / m². 2 And, The heat seal layer comprises a thermoplastic resin (A) having a melting point Tm(A), The aforementioned underlayer contains thermoplastic resin (B), The thermoplastic resin (B) has a melting point Tm(B) of (Tm(A) + 10°C) or higher and (Tm(A) + 60°C) or lower. The content of thermoplastic resin having a melting point of less than (Tm(A) + 10°C) in the aforementioned underlayer is 20% by mass or less. A laminate in which the content of the thermoplastic resin (B) in the underlying layer is 20 to 50% by mass.
2. The aforementioned underlayer further contains thermoplastic resin (C), The laminate according to claim 1, wherein the thermoplastic resin (C) has a melting point Tm(C) of (Tm(A) + 60°C) or higher.
3. The laminate according to claim 1 or 2, wherein the underlying layer further comprises particles.
4. The laminate according to claim 1 or 2, wherein the thickness of the aforementioned underlayer is 0.5 to 10 μm.
5. The laminate according to claim 1 or 2, wherein the content of the thermoplastic resin (A) in the heat seal layer is 50% by mass or more.
Citation Information
Patent Citations
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