Battery pack
A three-dimensional busbar design with increased overlapping areas and ultrasonic bonding addresses joint strength limitations, enhancing stress relief and reducing fatigue failure in battery packs.
Patent Information
- Application Number
- JP2025079189
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-08-05
- Filing Date
- 2025-05-12
- Publication Date
- 2026-06-19
- Estimated Expiration
- 2042-03-23
AI Technical Summary
Existing busbar joining methods, particularly those using USW and FSW, face limitations in joint strength due to a small overlapping area in the planar direction, especially when the distance between electrode terminals is short, leading to potential bonding issues and fatigue failure.
A busbar design with a three-dimensional structure that increases the overlapping area of metal plates by using extending portions and additional joint portions, joined by ultrasonic bonding, to enhance joint strength and stress relief.
The design provides effective stress relief in multiple directions and ensures high bonding strength, reducing the risk of fatigue failure and maintaining flatness at the terminal connections.
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Abstract
Citation Information
Patent Citations
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