A device for closing wounds
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- BOSTON SCIENTIFIC SCIMED INC
- Filing Date
- 2024-11-27
- Publication Date
- 2026-06-22
AI Technical Summary
Wounds, such as those resulting from endoscopic procedures, are difficult to close naturally and can lead to infection risks due to their size and location, especially when larger than the working area of the endoscope, making it challenging to use devices through the endoscope's channel.
A medical device with a closure element that can be deployed around the endoscope's end cap, utilizing shape-memory configurations like coils or knots, activated by photo, thermal, or electrical stimuli, to close wounds by being inserted and activated to contract around the wound, assisted by suction to displace tissue into the end cap.
Effectively closes wounds by approximating tissue edges, reducing the wound area, and promoting healing, while being adaptable to larger wounds and avoiding obstruction of the endoscope's working channel.
Smart Images

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Abstract
Citation Information
Patent Citations
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