A resin composition used for encapsulating electronic components, and an electronic component encapsulated with the resin composition.

JP7880040B2Active Publication Date: 2026-06-25NOF CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NOF CORP
Filing Date
2022-03-30
Publication Date
2026-06-25

AI Technical Summary

Benefits of technology

【0007】 本発明によれば、未硬化の状態で高い形状安定性を有し、硬化後は低温下における柔軟性を有し、耐水性に優れる樹脂組成物、および該樹脂組成物を用いて封止された電子部品を提供にすることができる。

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Abstract

To provide a resin composition which has high shape stability in an uncured state and has low-temperature flexibility and excellent water resistance after curing.SOLUTION: A resin composition for sealing an electronic component is provided which contains (A) an urethane (meth)acrylate compound having 2-3 (meth)acrylic groups and (B) a polythiol compound represented by a formula (1). A ratio (thiol groups / (meth)acrylic groups) of the number of moles of thiol groups of (B) to the number of moles of (meth)acrylic groups of (A) is 0.5-5.0. The urethane (meth)acrylate compound (A) has a weight average molecular weight of 2,000-20,000. (R1 and R2 are each independently a hydrogen atom, a C1-12 alkyl group or a phenyl group; and R3, R4, R5 and R6 are each independently selected from a mercaptomethyl group, a mercaptoethyl group and a mercaptopropyl group.)SELECTED DRAWING: None
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Claims

1. (A) A urethane (meth)acrylate compound having 2 to 3 (meth)acrylic groups, (B) A polythiol compound represented by formula (1), 【Chemistry 1】 (R １ and R ２ Each of these independently consists of a hydrogen atom, a C1-C12 alkyl group or a phenyl group, and R ３ , R ４ , R ５ and R ６ Each of these groups is independently selected from mercaptomethyl, mercaptoethyl, and mercaptopropyl groups. It contains, (A) A urethane (meth)acrylate compound having 2 to 3 (meth)acrylic groups is a urethane (meth)acrylate compound obtained by reacting a polyisocyanate compound, a polyol compound, and a (meth)acrylate compound having a hydroxyl group. The polyol compound is one or more selected from the group consisting of polyester polyols and polycarbonate polyols. The ratio of moles of thiol groups in (B) to moles of (meth)acrylic groups in (A) (thiol groups / (meth)acrylic groups) is between 0.5 and 4.

0. (A) A resin composition for use in sealing electronic components, wherein the weight-average molecular weight of the urethane (meth)acrylate compound is 2,000 to 20,000.

2. An electronic component sealed using the resin composition described in claim 1.

Citation Information

Patent Citations

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    JP1997302201A

  • Adhesive for electronic component and method for manufacturing semiconductor chip package

    JP2014077122A

  • Thiol compound, method for synthesizing the same and use of the thiol compound

    JP2020109068A

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