Phenolic resin foam, method for thermal decomposition of phenolic resin foam, product of thermal decomposition of phenolic resin foam, and method for manufacturing phenolic resin foam.

Chemical decomposition of phenolic resin foam under controlled conditions addresses the challenges of incomplete decomposition and by-product generation, enabling the production of high-performance recycled phenolic resin foam with maintained thermal insulation and mechanical strength.

JP7881062B2Active Publication Date: 2026-06-26ASAHI KASEI CONSTRUCTION MATERIALS CO LTD
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Patent Information

Application Number
JP2025516758
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-04-28
Filing Date
2024-04-17
Publication Date
2026-06-26
Estimated Expiration
2044-04-17

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Patent Text Reader

Abstract

This phenolic resin foam exhibits, when being subjected to pyrolysis gas chromatograph mass spectrometry under a heat-application condition of 600°C, [A] / [B] of 2.0-15, where [A] represents the area value of a signal of structural formula (A) and [B] represents the area value of a signal of structural formula (B).
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Citation Information

Patent Citations

  • JP151933A

  • JP183475A

  • Phenolic resin molding material and its production

    JP1996269227A

  • Recycled phenol resin composition

    JP2003183475A

  • Molded item and vacuum heat insulator

    JP2005023327A