SPILL DETECTION SENSOR ARRAY SYSTEM AND METHOD FOR SENSOR SEALING

Abstract

This description includes a downhole sensor array system, a method for manufacturing the downhole sensor array system, and a method for collecting downhole measurements. The downhole sensor array system includes a tube encapsulation cable (TEC) and a downhole sensor array disposed within the TEC. The downhole sensor array includes one or more temperature sensors, one or more pressure sensors, and one or more printed circuit boards (PCBs).The method for forming a downhole sensor array system includes splicing one or more temperature sensors, one or more pressure sensors, and one or more printed circuit boards (PCBs) onto a raw cable to form a downhole sensor array, forming a protective layer around the downhole sensor array to form an encapsulated cable, and forming an outer sheath around the encapsulated cable to form a tube-encapsulated cable (TEC). The TEC has an outside diameter of approximately 1.27 cm (0.5 in) to approximately 1.91 cm (0.75 in).