Assembly units for electrolytic conditioning and surface conditioning using such materials.

Abstract

------12 / 09 / 2561------(OCR) The electrolyte conditioning assembly 100 is attached to the surface conditioning tank 10. The electrolyte used for surface conditioning of workpiece 1, which is designated as the negative electrode, consists of: The 200 injector unit and the 300 positive terminal unit are connected to the injector unit as a single unit. It consists of several 210 nozzle pipes, a 220 manifold, and a 230 piping system fitting which connects the manifold to... The external conduit of the anode unit consists of a 320 anode box and a 330 power receiving section, which are adjusted. Connect the non-melting positive terminal to the external power supply 40 installed in the surface conditioning tank. The anode box contains 310 non-melting anodes, each hanging separately and positioned at an isolated location. From a number of horizontal nozzle tubes and a partition wall arranged separately from the non-melting anode. Horizontal ------------ The electrolyte conditioning assembly 100 is attached to the surface conditioning tank 10. The electrolyte used for surface conditioning of workpiece 1, which is designated as the negative electrode, consists of: The 200 injector unit and the 300 positive terminal unit are connected to the injector unit as a single unit. It consists of several 210 nozzle pipes, a 220 manifold, and a 230 piping system fitting which connects the manifold to... The external conduit of the anode unit consists of a 320 anode box and a 330 power receiving section, which are adjusted. Connect the non-melting positive terminal to the external power supply 40 installed in the surface conditioning tank. The anode box contains 310 non-melting anodes, each hanging separately and positioned at an isolated location. From a number of horizontal nozzle tubes and a partition wall arranged separately from the non-melting anode. Horizontal

Description

Electrolytic treatment assembly and surface treatment apparatus using the same

[0001] The present invention relates to an electrolytic treatment assembly disposed in a surface treatment tank such as an electroplating apparatus and a surface treatment apparatus using the same.

[0002] In a surface treatment apparatus such as an electroplating apparatus, as shown in Patent Document 1 for example, a net box and a nozzle pipe are provided on both sides sandwiching the conveyance path of the workpiece in the plating tank. An anode ball (soluble anode), which is a consumable, is accommodated in the conductive net box. A nozzle pipe is disposed between the workpiece and the net box. A plurality of ejection ports (nozzles) are arranged in a vertical row in the nozzle pipe, and the plating solution can be ejected toward the surface of the workpiece to be treated.

[0003] In Patent Document 2, an insoluble anode plate in which a large number of through holes are formed and a nozzle pipe fixed on the back side of the insoluble anode plate are integrated. The nozzle pipe is fixed to the insoluble anode plate at a position corresponding to the through hole, and the treatment solution is ejected toward the workpiece through the nozzle pipe and the through hole.

[0004] Japanese Patent Application Laid-Open No. 201,2-046,782 Japanese Patent Application Laid-Open No. 2002-226,993

[0005] The soluble electrode of Patent Document 1 has an electrode material that dissolves to become a plating component. The soluble electrode is a consumable and needs to be replaced. Further, the soluble electrode has a drawback in that it is not formed only from the plating component and contains impurities (for example, phosphorus P). On the other hand, the insoluble electrode of Patent Document 2 is superior to the soluble electrode in that the electrode material does not dissolve and metal positive ions (for example, cupric oxide) in the plating solution in the plating tank become the plating component, and the insoluble electrode is used only as an electrode. In particular, when a high current density of, for example, 10 to 10 several A / dm ２ level is achieved, the consumption of the soluble electrode is large, so it is desirable to use an insoluble electrode.

[0006] Further, in Patent Document 2, since the anode and the nozzle pipe are integrally connected, the anode and the nozzle pipe can be integrally removed from the plating tank during maintenance or the like, and the workability is improved.

[0007] However, in Patent Document 2, numerous through-holes are essential in the insoluble anode plate, which increases the electrical resistance of the anode plate. Similarly, an increase in electrical resistance is unavoidable in the conductive mesh box of Patent Document 1. Furthermore, the insoluble anode plate in Patent Document 2 is exposed in the plating tank. To avoid a decrease in plating quality caused by negative ions in the plating tank adhering to the insoluble anode plate, the entire surface of the insoluble anode plate must be covered with an ion exchange film. If the insoluble anode plate is surrounded by a partition to prevent the intrusion of negative ions, the jet flow from the nozzle tube toward the workpiece will also be obstructed by the partition.

[0008] Some aspects of the present invention aim to provide an electrolytic treatment assembly and a surface treatment apparatus using the same, which can integrate an insoluble anode and a nozzle tube without increasing the electrical resistance of the anode and while preventing negative ions in the treatment tank from entering the insoluble anode side, thereby improving the workability of maintenance.

[0009] (1) One aspect of the present invention relates to an electrolytic treatment assembly to be attached to a surface treatment tank for electrolytically treating the surface of a workpiece set as a cathode, comprising: a nozzle unit; an anode unit integrally connected to the nozzle unit, wherein the nozzle unit includes a plurality of nozzle tubes that eject a treatment liquid from different vertical positions, a common pipe that supplies the treatment liquid to the plurality of nozzle tubes, and a pipe joint that connects the common pipe to an external pipe installed in the surface treatment tank, wherein the anode unit comprises at least one insoluble anode positioned at a horizontal distance from the plurality of nozzle tubes, an anode box that includes a partition wall positioned at a horizontal distance from the at least one insoluble anode and surrounds the at least one insoluble anode with the partition wall, and a powered section that connects the at least one insoluble anode to an external power supply section installed in the surface treatment tank.

[0010] According to one aspect of the electrolytic treatment assembly of the present invention, the nozzle unit and anode unit can be attached to and detached from the surface treatment tank as a single unit by attaching and detaching the piping joint of the nozzle unit to the external piping and attaching and detaching the powered part of the anode unit to the external power supply unit. This improves the workability of the assembly's installation and maintenance. Moreover, since the insoluble anode does not require a mesh portion or numerous through holes, the electrical resistance does not increase. Furthermore, the area around the insoluble anode is partitioned from the surface treatment tank by a partition wall, which generally allows metal ions (positive ions) in the treatment liquid to pass through, while preventing negative ions generated in the surface treatment tank from entering the insoluble anode plate side. Since the multiple nozzle tubes are outside the partition wall, the ejection of the treatment liquid from the multiple nozzle tubes is not obstructed by the partition wall.

[0011] (2) In one aspect (1) of the present invention, the powered portion includes a connection terminal portion that is electrically connected to the external power supply portion located at the edge of the upper opening of the surface treatment tank, and the common piping may be formed extending horizontally at the top of the plurality of nozzle pipes, communicating with the upper ends of each of the plurality of nozzle pipes. In this case, the connection between the piping joint of the assembly and the external piping of the surface treatment tank, and the connection between the powered portion of the assembly and the external power supply portion of the surface treatment tank can be performed on the upper side of the surface treatment tank. This improves the workability of attaching and detaching the assembly to and from the surface treatment tank.

[0012] (3) In one embodiment (2) of the present invention, the common piping may be positioned higher than the position of the upper end of the anode unit, and the piping joint may pass above the anode unit and be connected to the external piping positioned at the edge of the upper opening of the surface treatment tank. This eliminates any members that interfere with the assembly when inserting the assembly into the surface treatment tank from directly above the upper opening of the surface treatment tank. The assembly inserted into the surface treatment tank is connected to the external power supply unit and external piping installed at the edge of the upper opening of the surface treatment tank, thereby improving the workability of installing the assembly into the surface treatment tank. This further improves the workability of attaching and detaching the assembly from the surface treatment tank.

[0013] (4) In one embodiment of the present invention (1) to (3), the lower ends of the plurality of nozzle tubes may be fixed to the lower end of the anode box. In this case, the plurality of nozzle tubes are stably supported at their upper and lower ends.

[0014] (5) In one embodiment of the present invention (1) to (4), at least the surface-side partition walls facing the plurality of nozzle tubes may be formed of a material that selectively allows metal ions in the processing liquid to pass through. In this way, metal ions generated within the partition walls can be supplied to the workpiece side through the surface-side partition walls, and the electrolytic treatment of the workpiece surface is promoted.

[0015] (6) In one embodiment (5) of the present invention, the rear partition wall facing the front partition wall may have an opening for the flow of the processing liquid. In this way, the processing liquid can be supplied from above or below the partition wall and discharged from the opening in the rear partition wall, thereby circulating the processing liquid within the partition wall.

[0016] (7) In one aspect (6) of the present invention, the at least one insoluble anode includes a plurality of insoluble anodes arranged with a gap between two adjacent horizontal anodes, and the back partition can have the opening facing the gap between the two insoluble anodes. In this way, the processing liquid between the insoluble anode and the front partition can be guided through the gap to the opening, thereby promoting the circulation of the processing liquid within the partition.

[0017] (8) In one embodiment of the present invention (1) to (7), the anode box can hold a shielding mask that shields a portion of the electric field formed between the at least one insoluble anode and the workpiece. The shielding mask prevents the formation of an electric field in unnecessary areas, thereby improving the electrolytic treatment quality of the workpiece.

[0018] (9) In one aspect of the present invention (8), the shielding mask may include a first shielding mask that shields the lower region of the electrolysis and a second shielding mask that shields the upper region of the electrolysis. This prevents the electric field from concentrating at the upper and lower edges of the workpiece.

[0019] (10) In one aspect of the present invention (9), the anode box may have an adjustment mechanism for adjusting the vertical mounting positions of the first shielding mask and the second shielding mask. The vertical mounting positions of the first and second shielding masks are adjusted so that the height of the opening window for the electric field matches the vertical size of the workpiece.

[0020] (11) Another aspect of the present invention relates to a surface treatment apparatus comprising: a surface treatment tank for electrolytically treating the surface of a workpiece; and an electrolytic treatment assembly according to any one of (1) to (10) above, arranged in the surface treatment tank. According to another aspect of the present invention, a surface treatment apparatus that exhibits the functions and effects described in (1) to (10) above can be provided.

[0021] This is a cross-sectional view of a continuous plating apparatus according to one embodiment of the present invention. This is a front view of the electrolytic treatment assembly in the plating tank of Figure 1, as seen from the workpiece side. This is a plan view of a part of the continuous plating apparatus of Figure 1. This is a diagram showing two assemblies arranged along the longitudinal direction of the plating tank of Figure 1. This is a diagram showing shielding masks held in the assemblies. This is a diagram showing the first shielding mask and the second shielding mask. This is a cross-sectional view of an adjustment mechanism for adjusting the vertical mounting positions of the first shielding mask and the second shielding mask.

[0022] Preferred embodiments of the present invention will be described in detail below. It should be noted that the embodiments described below are not intended to unduly limit the scope of the present invention as described in the claims, and not all of the configurations described in these embodiments are necessarily essential as solutions to the present invention.

[0023] 1. Schematic Figure 1 of the continuous plating apparatus is a cross-sectional view of a surface treatment apparatus, such as a continuous plating apparatus, according to this embodiment, and Figure 2 is a plan view. In Figure 1, the plating tank 10 is a tank that houses a workpiece 1, which is suspended and supported by a transport jig 20, in a plating solution 2 to plate the workpiece 1. The plating tank 10 has a peripheral wall and a bottom wall and contains the plating solution 2, which is the processing liquid.

[0024] Workpiece 1 is a circuit board or flexible circuit board, for example, with both sides being the processing surfaces. The transport jig 20 continuously transports the workpiece and can supply power to workpiece 1. Workpiece 1 functions as the cathode. In practice, a power supply unit (which may be a transport rail) that slides against the transport jig 20 is connected to the negative terminal of the power supply, and workpiece 1 is set as the cathode via the power supply unit and the transport jig 20.

[0025] The workpiece 1, suspended and supported by the transport jig 20, is transported continuously along the transport direction A shown in Figure 2, in a direction perpendicular to the plane of the paper in Figure 1. The means for continuously transporting the workpiece 1 are not shown in the illustration, but can be composed of a chain, cylinder, etc., continuously driven by a sprocket. One workpiece 1 is held by the transport jig 20, and as shown in Figure 2, multiple workpieces 1 are continuously transported in the plating tank 10. If the workpiece 1 is a rigid body such as a circuit board, the transport jig 20 can hold the workpiece 1 in a suspended state by holding its upper end with a chuck 21A. If the workpiece 1 is flexible, such as a flexible circuit board, the transport jig 20 has a frame portion 22, and can hold the lower end of the workpiece 1 with a chuck 21B and pull it downwards.

[0026] 2. Electrolytic Treatment Assembly As shown in Figure 1, an electrolytic treatment assembly 100 is provided in the plating tank 10. This assembly 100 has a nozzle unit 200 and an anode unit 300 integrally connected to the nozzle unit 200.

[0027] Here, Figures 2 and 3 show an assembly 100 positioned at the upstream end of the plating tank 10, but as shown in Figure 4, multiple assemblies 100 can be arranged along the longitudinal direction of the plating tank 10. Also, when processing both sides of the workpiece 1, two assemblies 100 are placed on both sides of the workpiece 1, resulting in a total of four assemblies 100 in Figure 4.

[0028] As shown in Figures 1 to 4, the nozzle unit 200 has a plurality of nozzle tubes 210, a common pipe 220, and a pipe fitting 230. Each of the plurality of nozzle tubes 210 has a plurality of nozzles 211, for example, a plurality of nozzles 211, at different vertical positions, as shown in Figure 1. Plating solution is ejected from each nozzle 211. The plurality of nozzle tubes 210 are made of an insulator and do not adversely affect the electric field acting on the workpiece 1. As shown in Figure 2, the common pipe 220 communicates with one end of each of the plurality of nozzle tubes 210 and supplies the plurality of nozzle tubes 210 with plating solution. As shown in Figures 1 to 3, the pipe fitting 230 is detachable from the external pipe 30 installed in the plating tank 10.

[0029] The anode unit 300 comprises at least one, for example, a plurality of insoluble anodes 310, an anode box 320, and at least one, for example, two powered sections 330. Each of the plurality of insoluble anodes 310 is positioned horizontally away from the nozzle tube 210, as shown in Figures 2 and 4. The anode box 320 includes partition walls 321 (front partition wall 321A, rear partition wall 321B, and side partition wall 321C) positioned horizontally away from the plurality of insoluble anodes 310, and surrounds the plurality of insoluble anodes 310. The partition walls 321 are formed of an insulator and do not adversely affect the electric field acting on the workpiece 1. The powered sections 330 are electrically connected to the plurality of insoluble anodes 310 and are detachable from an external power supply installed in the plating tank 10.

[0030] The nozzle unit 200 and the anode unit 300 can be integrated using appropriate fixing means. In this embodiment, as shown in Figures 1 and 2, the nozzle unit 200 and the anode unit 300 are integrated by two connecting parts 110. As shown in Figure 1, one end of the connecting part 110 is fixed to, for example, a partition wall 321 of the anode unit 300, and the other end is fixed to, for example, a common piping 220 of the nozzle unit 200.

[0031] With this assembly 100, the nozzle unit 200 and the anode unit 300 can be attached to and detached from the plating tank 10 as a single unit by attaching and detaching the pipe fitting 230 of the nozzle unit 200 to the external piping 30 and the powered part 330 of the anode unit 300 to the external power supply unit 40. This improves the workability of installing and maintaining the assembly 100. In this embodiment, the vertical position of the assembly 100 is uniquely determined by placing the powered part 330 on the external power supply unit 40, and the horizontal position of the assembly 100 is uniquely determined by connecting the pipe fitting 230 to the external piping 30.

[0032] In this embodiment, the insoluble anode 310 does not require a mesh portion or numerous through holes, so the electrical resistance does not increase. Furthermore, the area around the insoluble anode 310 is separated from the plating tank 10 by partition walls 321 (321A to 321C). Generally, at least a portion of the partition walls 321 allows metal ions (positive ions) in the plating solution to pass through, while preventing negative ions generated in the plating tank 10 from entering the insoluble anode 310 side (inside the partition walls 321). Since the multiple nozzle tubes 210 are outside the partition walls 321, the ejection of the plating solution from the multiple nozzle tubes 210 is not obstructed by the partition walls 321.

[0033] In this embodiment, the powered section 330 may include, for example, two connection terminals 331 that are electrically connected to, for example, two external power supply sections 40 located at the edge of the upper opening 11 of the plating tank 10. The common piping 220 communicates with the upper ends of the multiple nozzle pipes 210 and is formed extending horizontally at the top of the multiple nozzle pipes 210. This allows the connection between the piping joint 230 of the assembly 100 and the external piping 30, and the connection between the powered section 330 of the assembly 100 and the external power supply sections 40, to be performed on the upper side of the plating tank 10. This improves the workability of attaching and detaching the assembly 100 to and from the plating tank 10. The positions of the two connection terminals 331 are on both sides of the centrally located piping joint 230, as shown in Figure 3, taking into consideration the wiring resistance to the multiple insoluble anodes 310.

[0034] In this case, if the anode unit 300 has a plurality of insoluble anodes 310, as shown in Figures 1 and 5, it has a horizontally extending anode plate (also called an anode bar) 312, and the plurality of insoluble anodes 310 are electrically connected to and supported by the anode plate 312. In this case, the powered portion 330 is electrically connected to the anode plate 312 as shown in Figure 1.

[0035] In this embodiment, the common piping 220 is positioned higher than the upper end of the anode unit 300, as shown in Figures 1 and 2. The piping joint 230 passes above the anode unit 300 and connects to the external piping 30 located at the edge of the upper opening 11 of the plating tank 10, as shown in Figure 1. This eliminates any interference between the assembly 100 and the plating tank 10 when inserting the assembly 100 into the plating tank 10 from directly above the upper opening 11. The assembly 100 inserted into the plating tank 10 is connected to the external power supply unit 40 and the external piping 30, which are installed at the edge of the upper opening 11 of the plating tank 10, thus improving the workability of installing the assembly 100 into the plating tank 10. This further improves the workability of attaching and detaching the assembly 100 to and from the plating tank 10.

[0036] In this embodiment, the lower ends of the multiple nozzle tubes 210 are fixed to the lower end of the anode box 320. For example, as shown in Figure 1, an overhang 322 can be provided that extends horizontally from the surface partition wall 321A, and the lower ends of the multiple nozzle tubes 210 can be fixed to the overhang 322. In this way, the upper and lower ends of the multiple nozzle tubes 210 are stably supported by the common piping 220 and the overhang 322.

[0037] In this embodiment, at least one of the partition walls 321, the surface-side partition wall 321A facing the nozzle tubes 210, is formed of a material that selectively allows metal ions in the plating solution to pass through (for example, a cation exchange film or an ion exchange resin). In this way, metal ions generated within the partition wall 321 can be supplied to the workpiece 1 through the partition wall 321, thereby promoting the electrolytic treatment of the surface of the workpiece 1.

[0038] In this embodiment, as shown in Figure 2, the rear partition wall 321B of the partition wall 321 can have an opening (the area marked with an "x" in Figure 2 is the opening) 321B1 through which the plating solution flows. In this way, the plating solution is supplied from above or below the partition wall 321, and the plating solution is discharged from the opening 321B1 of the rear partition wall 321B, ensuring a circulation path for the plating solution within the partition wall 321.

[0039] In this embodiment, the multiple insoluble anodes 310 can be arranged with a gap 311 between two adjacent anodes in the horizontal direction, as shown in Figure 4. In this case, the rear partition wall 321B can have an opening 321B1 at a position facing the gap 311 between the two insoluble anodes 310, 310 (see Figure 1). In this way, the plating solution between the insoluble anodes 310 and the front partition wall 321A can be guided through the gap 311 to the opening 321B1, thereby promoting the circulation of the plating solution within the partition wall 321.

[0040] In particular, in this embodiment, as shown in Figures 1 and 4, the plating tank 10 has overflow tanks 12A and 12B on both sides. When the liquid level of the plating solution in the plating tank 10 exceeds a certain height, the plating solution in the plating tank 10 is discharged into the overflow tanks 12A and 12B. The aforementioned gap 311 and opening 321B1 can form a flow path for the plating solution in the partition wall 321 to flow into the overflow tanks 12A and 12B.

[0041] In this embodiment, the anode box 320 can hold a shielding mask 350 that shields a portion of the electric field formed between the insoluble anode 310 and the workpiece 1, as shown in Figure 5. The shielding mask 350 prevents the formation of an electric field in unnecessary areas, thereby improving the plating quality of the workpiece 1. It has a mask portion 351 that covers the surface facing the lower end of the workpiece 1. The shielding mask 350 shown in Figure 5 is supported vertically in the region between the surface-side partition wall 321A and the plurality of nozzle tubes 210, as shown in Figure 1. The shielding mask 350 is held in place by a plurality of protrusions 340 that project forward from the surface-side partition wall 321A, as shown in Figure 1. The shielding mask 350 has vertical portions 352 that extend upward on both sides of the mask portion 351, and the upper ends of the vertical portions 352 are held by the surface-side partition wall 321A.

[0042] As shown in Figure 6, the shielding mask 350 may include a first shielding mask 350A and a second shielding mask 350B. The first shielding mask 350A shields the lower region of the electrolysis formed between the insoluble anode 310 and the workpiece 1. The second shielding mask 350B shields the upper region of the electrolysis. The first shielding mask 350A includes a mask portion 351A that shields the lower region of the electric field and vertical portions 352A that extend upward on both sides of the mask portion 351A. The second shielding mask 350B includes a mask portion 351B that shields the upper region of the electric field and vertical portions 352B that extend upward on both sides of the mask portion 351B.

[0043] The anode box 320 can have an adjustment mechanism for adjusting the vertical mounting positions of each of the first shielding mask 350A and the second shielding mask 350B. An example of the adjustment mechanism is shown in FIG. 7 which is an enlarged view of part B in FIG. 6. In FIG. 7, in the upper region of the vertical portion 352A of the first shielding mask 350A, a long hole 353A having a longitudinal axis in the vertical direction is formed. The first shielding mask 350A is allowed to move in the vertical direction within the range of the long hole 353A, and is fixed to a mounting plate 321A1 held by the surface-side partition wall 321A of the anode box 320 by a bolt 354A at a desired position. Thereby, the vertical mounting position of the first shielding mask 350A is adjusted. Similarly, the second shielding mask 350B is also allowed to move in the vertical direction within the range of the long hole 353B, and its vertical mounting position is adjusted by a bolt 354B at a desired position.

[0044] Thus, the vertical mounting positions of the first and second shielding masks 350A and 350B are adjusted so that the height H of the electric field opening window shown in FIG. 7 matches the vertical size of the workpiece 1. In order to facilitate this adjustment, vertical scales may be provided adjacent to the long holes 353A and 353B.

[0045] Although the present embodiment has been described in detail as above, those skilled in the art will easily understand that many modifications are possible without substantially departing from the novel matters and effects of the present invention. Therefore, all such modified examples are intended to be included within the scope of the present invention. For example, in the specification or the drawings, a term described at least once together with a broader or synonymous different term can be replaced with that different term anywhere in the specification or the drawings. Also, all combinations of the present embodiment and the modified examples are included in the scope of the present invention.

[0046] 1 Workpiece, 10 Surface treatment tank, 11 Upper opening, 20 Transfer jig, 30 External piping, 40 External power supply unit, 100 Electrolytic treatment assembly, 110 Connecting part, 200 Nozzle unit, 210 Nozzle tube, 211 Nozzle (outlet), 220 Common piping, 230 Pipe fitting, 300 Anode unit, 310 Insoluble anode, 311 Gap, 312 Anode plate (anode bar), 320 Anode box, 321 Partition, 321A Front side partition, 321B Rear side partition, 321B1 Opening, 321C Side side partition, 322 Protruding part, 330 Powered part, 331 Connection terminal part, 340 Projection, 350 Shielding mask, 350A First shielding mask, 350B Second shielding mask, 353A, 353B, 354A, 354B adjustment mechanism

Claims

------12 / 09 / 2561------(OCR)1. Electrolytic conditioning assembly attached to the surface conditioning tank used for conditioning the workpiece surface specified on the negative electrode with electrolyte. This assembly includes a nozzle unit and an anode unit connected to the nozzle unit as a single unit. The nozzle unit consists of several nozzle tubes that spray conditioning fluid from different positions in a sequential vertical direction, a manifold that supplies conditioning fluid to several nozzle tubes, and a piping system fitting that connects the manifold to an external pipe installed in the surface conditioning tank. The anode unit consists of at least one non-dissolving anode electrode positioned horizontally separate from several nozzle tubes, an anode box consisting of a partition separated from at least one non-dissolving anode electrode horizontally and surrounding at least one non-dissolving anode electrode by a partition, and a power receiving unit that connects at least one non-dissolving anode electrode to an external power supply installed in the surface conditioning tank.2.The electrolytic conditioning assembly under claim 1, where the power receiving part consists of a connector which is electrically connected to an external power supply installed at the edge of the top opening of the surface conditioning tank and the manifold is connected to the upper end of each of the nozzle tubes and extends horizontally above the number of nozzle tubes.

3. The electrolytic conditioning assembly under claim 2, where the manifold is positioned higher than the upper end of the anode unit and the piping system connection crosses the anode unit and is connected to an external pipe installed at the edge of the top opening of the surface conditioning tank.

4. Any one of the electrolytic conditioning assemblies under claims 1 through 3, where the lower end of each of the nozzle tubes is fixed to the lower end of the anode box.

5. Any one of the electrolytic conditioning assemblies under claims 1 through 4, where at least one of the surface-facing walls facing the nozzle tubes is constructed from a material that allows localized permeation of metal ions in the conditioning fluid. 6.

7. An electrolytic conditioning assembly under claim 6 where at least one non-dissolving anode consists of a number of non-dissolving anodes arranged with a gap between two adjacent non-dissolving anodes in a horizontal direction, and the rear barrier has an opening facing the gap between the two non-dissolving anodes.

8. An electrolytic conditioning assembly under any of claims 1 through 7 where the anode box holds a shielding that shields a portion of the electric field generated between at least one non-dissolving anode and the workpiece.

9. An electrolytic conditioning assembly under claim 8 where the shielding consists of a first shielding that shields the lower region of the electric field and a second shielding that shields the upper region of the electric field. 10.Electrolytic conditioning assembly according to claim 9, where the anode box has an adjustment mechanism that adjusts the vertical positioning of each of the first and second shielding sections.

11. Surface conditioning unit which includes a surface conditioning tank used for electrolytic surface conditioning of the workpiece and one of the electrolytic conditioning assemblies according to claims 1 to 10 placed in the surface conditioning tank.------------1.The electrolytic conditioning assembly, attached to the surface conditioning tank, is used for conditioning the workpiece surface on the negative electrode with an electrolyte. It comprises a nozzle unit and an anode unit, which are connected as a single unit. The nozzle unit consists of several nozzle tubes that spray the conditioning fluid from different positions in a sequential vertical direction, a manifold that supplies the conditioning fluid to several nozzle tubes, and piping fittings adapted to connect the manifold to an external pipe installed in the surface conditioning tank. The anode unit consists of at least one non-dissolving anode electrode positioned horizontally, separated from several nozzle tubes; an anode box containing a baffle separating at least one non-dissolving anode electrode horizontally and surrounding it; and a power receiver adapted to connect at least one non-dissolving anode electrode to an external power supply installed in the surface conditioning tank.The electrolytic conditioning assembly under claim 1, where the power receiving part consists of a connector which is electrically connected to an external power supply installed at the edge of the top opening of the surface conditioning tank and the manifold is connected to the upper end of each of the nozzle tubes and extends horizontally above the number of nozzle tubes.

3. The electrolytic conditioning assembly under claim 2, where the manifold is positioned higher than the upper end of the anode unit and the piping system connection crosses the anode unit and is connected to an external pipe installed at the edge of the top opening of the surface conditioning tank.

4. Any one of the electrolytic conditioning assemblies under claims 1 through 3, where the lower end of each of the nozzle tubes is fixed to the lower end of the anode box.

5. Any one of the electrolytic conditioning assemblies under claims 1 through 4, where at least one of the surface-facing walls facing the nozzle tubes is constructed from a material that allows localized permeation of metal ions in the conditioning fluid. 6.

7. An electrolytic conditioning assembly under claim 6 where at least one non-dissolving anode consists of a number of non-dissolving anodes arranged with a gap between two adjacent non-dissolving anodes in a horizontal direction, and the rear barrier has an opening facing the gap between the two non-dissolving anodes.

8. An electrolytic conditioning assembly under any of claims 1 through 7 where the anode box holds a shielding that shields a portion of the electric field generated between at least one non-dissolving anode and the workpiece.

9. An electrolytic conditioning assembly under claim 8 where the shielding consists of a first shielding that shields the lower region of the electric field and a second shielding that shields the upper region of the electric field. 10.The electrolytic conditioning assembly according to claim 9, where the anode box has an adjustment mechanism that adjusts the vertical positioning of each of the first and second shielding sections; 11. The surface conditioner which includes a surface conditioning tank used for electrolytic surface conditioning of the workpiece and one of the electrolytic conditioning assemblies according to claims 1 through 10 placed in the surface conditioning tank;