Procedure for removing the solder mask layer from printed materials using a laser.

Abstract

The procedure for removing the solder mask layer on laser-printed substrates includes: providing... The printing material is coated with an adhesive sheet onto the surface of the printing material. The printing material and the surface of the adhesive sheet are covered with... The mask layer is bonded to the substrate surface; the mask layer is opposite the substrate surface and is the covering layer. The solder mask is opposite the solder pad; this is the cleaning area. The matrix diagram shows a response. The rapid reading of the manufacturing part number of the board on the printed material is done through the data imaging module. The circuit layout will be automatically imported into the laser device, with the circuit layout diagram corresponding to... The part number of the board is printed on the substrate using a laser beam and matches the circuit layout diagram. The cleaning parts are removed sequentially, causing the solder mask layer to form a hollow space. Meanwhile, the printed material is photographed through an imaging module, and the image of the printed material is processed. The resulting printed material processing image is compared and evaluated to resemble a circuit diagram. Alternatively, if they are the same, proceed with completing the processing of the printed materials. Representative image that defines the first image.

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