Thermal stress simulation method for laminated structure

Abstract

Provided in the present invention is a thermal stress simulation method for a laminated structure. The simulation method comprises: importing a simulation model; creating a heat dissipation simulation process; completing relevant settings of a model heat source device; setting a thermal analysis simulation environment; activating a thermal stress analysis option, and selecting the type of fixed support; completing thermal-stress coupling simulation analysis; checking a post-processing result; and modifying a layout design according to the post-processing result. A potential structural risk of an electronic product can be predicted by means of thermal stress simulation, the situations of a temperature field, a stress field and a deformation field of an analysis object are obtained by means of finite element analysis, and theoretical research and an experimental test are effectively verified and supplemented, thereby rapidly implementing the verification and iteration of a product.

Description

A thermal stress simulation method for laminated structures Technical Field

[0001] The present invention relates to the technical field of EDA model layout simulation, and in particular to a thermal stress simulation method for a stacked structure. Background Art

[0002] PCBs are composed of a variety of materials, including copper foil, resin, and glass cloth, each with distinct physical and chemical properties. When a PCB is subjected to steady-state or transient temperature fluctuations, uneven heat absorption and dissipation can occur, leading to thermal expansion and contraction. Differential heating and the varying thermal expansion coefficients of the materials themselves can cause different areas of the PCB to experience varying stresses, leading to deformation. Once the stress exceeds the material's tolerance, the board can become permanently deformed.

[0003] Similarly, for microelectronic packaging structures, their complex internal structures often require the use of multiple materials with different thermal expansion coefficients. When the packaging structure is working, the high temperature phenomenon caused by power loss and other reasons will cause various materials and contact interfaces to generate thermal stresses of different sizes and directions, thereby leading to delamination and damage inside the packaging structure, and fracture of the solder layer between the packaging structure and the PCB, which in turn causes the failure of the electronic equipment.

[0004] Summary of the Invention

[0005] In view of the above problems, the present invention is proposed to provide a thermal stress simulation method for a laminated structure that overcomes the above problems or at least partially solves the above problems.

[0006] According to one aspect of the present invention, a method for simulating thermal stress of a stacked structure is provided, the method comprising:

[0007] Import simulation models;

[0008] Create a thermal simulation process;

[0009] Complete the relevant settings of the model heat source device;

[0010] Set up thermal analysis simulation environment;

[0011] Activate the Thermal Stress Analysis option and select the type of fixed support;

[0012] Complete thermal-stress coupling simulation analysis;

[0013] View post-processing results;

[0014] The layout design is modified according to the post-processing results.

[0015] Optionally, the importing of the simulation model specifically includes:

[0016] It supports multiple model types and filters the network information to be imported during import. After import, the view presents the distribution of each layer of the PCB board in 2D. At the same time, the parameter information of the model is extracted and displayed in the corresponding window.

[0017] Optionally, the parameter information specifically includes: stacking information, material information, device type information and via information.

[0018] Optionally, the heat dissipation simulation process specifically includes:

[0019] Select Thermal simulation process in the analysis type and create a simulation process;

[0020] The simulation wizard interface appears and displays the steps that need to be completed in the simulation process;

[0021] Each step has a status indicator to show whether the step has been completed;

[0022] Multiple Thermal simulation processes can be created in the same project, and each process can be switched freely and display setting information and simulation results.

[0023] Optionally, completing the relevant settings of the model heat source device specifically includes: defining the size, property type, power distribution and heat sink type of the heat source device in sequence.

[0024] Optionally, setting the thermal analysis simulation environment specifically includes:

[0025] Set the type of thermal convection in the simulation environment, the placement of the model, the convection heat transfer coefficient, and the temperature boundary when heat exchange occurs.

[0026] Optionally, when activating the thermal stress analysis option, the type of fixed support selected includes:

[0027] Vertex constraint method, laminated structure side constraint method, laminated structure bottom constraint method and laminated structure positioning hole constraint method.

[0028] Optionally, completing the thermal-stress coupling simulation analysis specifically includes:

[0029] Run simulation analysis, and the information display window will synchronously display the current analysis information and analysis progress;

[0030] After the analysis is completed, the analysis status is displayed, an error message is prompted, or an analysis report is displayed.

[0031] Optionally, the checking of the post-processing results specifically includes:

[0032] Enter post-processing to view the layered temperature cloud map, overall temperature cloud map, cross-section temperature cloud map and temperature maximum points;

[0033] View the X / Y / Z component displacement and Magnitude displacement of the model, and view the stress of the model, including X / Y / Z direction stress, XY / YZ / XZ direction shear stress, first / second / third principal stress and Von Mises stress.

[0034] Optionally, modifying the layout design according to the post-processing result specifically includes:

[0035] According to the temperature results, the problems in the structural design under the temperature field are judged, the model design is optimized and the corresponding parameters are modified.

[0036] The present invention provides a thermal stress simulation method for a laminated structure, comprising: importing a simulation model; creating a heat dissipation simulation process; completing settings related to the model's heat source components; setting up a thermal analysis simulation environment; activating the thermal stress analysis option and selecting the type of fixed support; completing a thermal-stress coupled simulation analysis; reviewing post-processing results; and modifying the layout design based on the post-processing results. This method can truly predict potential structural risks in electronic products. Finite element analysis is used to determine the temperature, stress, and deformation fields of the analyzed object, effectively verifying and supplementing theoretical research and experimental testing, and rapidly completing product verification and iteration.

[0037] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0039] FIG1 is a flow chart of a thermal stress simulation method for a laminate structure provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0040] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0041] The terms "comprises" and "comprising" and any variations thereof in the description, embodiments, claims and drawings of the present invention are intended to cover non-exclusive inclusions, for example, including a series of steps or units.

[0042] The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0043] As shown in FIG1 , a method for simulating thermal stress of a laminated structure includes:

[0044] Import simulation model: supports multiple model types. When importing, you can filter the network information to be imported. After importing, the view presents the distribution of each layer of the PCB board in 2D. At the same time, the model's stacking information, material information, device type information and via information are extracted and displayed in the corresponding window.

[0045] Create a Thermal Simulation Flow: Select the Thermal Simulation Flow in the Analysis Type section and create the flow. The Simulation Wizard will appear, displaying the steps required for the flow. Each step has a status indicator to indicate whether the step has been set up. Multiple Thermal Simulation Flows can be created in the same project, and each flow can be switched freely to display its settings and simulation results.

[0046] Complete the relevant settings of the model heat source device: define the size, property type, power distribution and heat sink type of the heat source device in turn.

[0047] Set up the thermal analysis simulation environment: set the type of thermal convection in the simulation environment, the placement of the model, the convection heat transfer coefficient and the temperature boundary when heat exchange occurs.

[0048] Activate thermal stress analysis options: Select the type of fixed support, including vertex constraint method, stacked structure side constraint method, stacked structure bottom constraint method and stacked structure positioning hole constraint method.

[0049] Complete thermal-stress coupling simulation analysis: Run the simulation analysis, and the information display window will synchronously display the current analysis information and analysis progress. After the analysis is completed, the analysis status will be displayed, and error information or analysis report will be displayed.

[0050] View post-processing results: Enter post-processing to view layered temperature cloud maps, overall temperature cloud maps, cross-section temperature cloud maps, and temperature maximum points; view the model's X / Y / Z component displacement and Magnitude displacement; view the model's stress, including X / Y / Z direction stress, XY / YZ / XZ direction shear stress, first / second / third principal stress, and Von Mises stress.

[0051] Based on the processing results, if the graphic variables of the original design do not meet the requirements, the design plan of the layout will be updated; if there is no risk of failure or fracture, the model design of the stacked structure will be completed.

[0052] Modify the layout design: Based on the temperature results, identify potential structural design issues under the temperature field, optimize the model design, and modify the corresponding parameters. Keep the existing simulation process and analysis results and create a heat dissipation simulation process.

[0053] This paper provides a thermal stress simulation method for laminated structures. Building on the established board-level thermal analysis process, this method adds a structural stress analysis module. Finite element analysis is used to calculate the deformation and stress of the laminated structure (PCB and package) and the package-PCB combined system under multi-physics field coupling. By constructing a digital model, extracting temperature excitation conditions, and setting boundary constraints, this method assesses the structural reliability of laminated products under steady-state and transient temperature fields.

[0054] Thermal stress simulation can predict the potential structural risks of electronic products. Through finite element analysis, the temperature field, stress field, and deformation field of the analysis object can be obtained. This effectively verifies and supplements theoretical research and experimental testing, and quickly completes product verification and iteration.

[0055] The unified Notus heat dissipation simulation system of the present invention implements interactive design during the simulation and design process, that is, it can adjust the model design in real time through simulation results. After the adjustment, the simulation results are called again to check whether they meet the product reliability design, and finally achieve the structural reliability requirements through iterative verification.

[0056] This invention leverages an existing thermal simulation system and adds a structural stress analysis module. This allows for the construction of a stacked structure with realistic layout and routing within a 2D framework, and supports the creation of multiple constraint boundaries to align with real-world product scenarios. The system's coupled temperature and structural field analysis is automatically performed within a single simulation flow, eliminating the need for manual user interaction with data transfer and mesh matching.

[0057] Beneficial Effects: This invention achieves precise depiction of the real layout while accurately describing the model's constraint boundaries. For laminated PCB boards and packaging structures, this system achieves the goal of rapidly verifying product reliability designs. It improves simulation accuracy while overcoming the limitations of simulation analysis due to single boundary constraints. It accurately describes the model's simulation environment, accelerates electronic product development, reduces labor and time costs during the development process, and enhances the market competitiveness of electronic products.

[0058] The above specific implementation methods further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific implementation methods of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for simulating thermal stress of a laminated structure, characterized in that: The simulation method comprises: Import simulation model; Create a thermal simulation process; Complete the relevant settings of the model heat source device; Set up thermal analysis simulation environment; Activate the thermal stress analysis option and select the type of fixed support; Complete thermal-stress coupling simulation analysis; View post-processing results; The layout design is modified according to the post-processing results.

2. The thermal stress simulation method of a laminated structure according to claim 1, characterized in that: The import simulation model specifically includes: It supports multiple model types, and filters the network information to be imported during import. After import, the view presents the distribution of each layer of the PCB board in 2D, and extracts the parameter information of the model and displays it in the corresponding window.

3. The thermal stress simulation method of a laminated structure according to claim 2, characterized in that: The parameter information specifically includes: stacking information, material information, device type information and via information.

4. The thermal stress simulation method of a laminated structure according to claim 1, characterized in that: The heat dissipation simulation process specifically includes: Select Thermal simulation process in the analysis type and create a simulation process; The simulation wizard interface appears and displays the steps that need to be completed in the simulation process; Each step has a status identifier to show whether the step has been completed; Multiple Thermal simulation processes can be created under the same project, and each process can be switched freely and display setting information and simulation results.

5. The thermal stress simulation method of a laminated structure according to claim 1, characterized in that: The completion of the relevant settings of the model heat source device specifically includes: defining the size, property type, power distribution and heat sink type of the heat source device in sequence.

6. The thermal stress simulation method of a laminated structure according to claim 1, characterized in that: The setting of the thermal analysis simulation environment specifically includes: Set the type of thermal convection in the simulation environment, the placement of the model, the convection heat transfer coefficient and the temperature boundary when heat exchange occurs.

7. The method for simulating thermal stress of a laminated structure according to claim 1, characterized in that: When activating the thermal stress analysis option, the type of fixed support selected includes: Vertex constraint method, side constraint method of laminated structure, bottom constraint method of laminated structure and positioning hole constraint method of laminated structure.

8. The method for simulating thermal stress of a laminated structure according to claim 1, characterized in that: The completion of the thermal-stress coupling simulation analysis specifically includes: Run simulation analysis, and the information display window will display the current analysis information and analysis progress simultaneously; After the analysis is completed, the analysis status is displayed, an error message is prompted, or an analysis report is displayed.

9. The method for simulating thermal stress of a laminated structure according to claim 1, characterized in that: The post-processing results of viewing specifically include: Enter post-processing to view the layered temperature cloud map, overall temperature cloud map, cross-section temperature cloud map and temperature maximum points; View the X / Y / Z component displacement and Magnitude displacement of the model, and view the stress of the model, including X / Y / Z direction stress, XY / YZ / XZ direction shear stress, first / second / third principal stress and Von Mises stress.

10. The thermal stress simulation method of a laminated structure according to claim 1, characterized in that: Modifying the layout design according to the post-processing result specifically includes: Based on the temperature results, possible problems in the structural design under the temperature field are determined, the model design is optimized and the corresponding parameters are modified.

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