Method for constructing device, method for constructing assembly database, method for designing device, and related product

Abstract

Provided in the present application are a method for constructing a device, a method for constructing an assembly database, a method for designing a device, and a related product. The method for constructing a device comprises: on the basis of an assembly path of a device, decomposing the device into several combination assembly relationships in a set sequence, wherein each combination assembly relationship is used for representing a connection relationship between a first target member and a second target member; on the basis of each combination assembly relationship, forming an intermediate configuration of the device, and on the basis of excitation and response data for the intermediate configuration, establishing a quantitative model of the intermediate configuration corresponding to the combination assembly relationship; and combining quantitative models corresponding to intermediate configurations, so as to form a model of the device. On the basis of the intermediate configurations corresponding to the combination assembly relationships, the performance of connection relationships in the device is independently quantified, and when the method is applied to the design of the device, the initial precision and the dynamic characteristics of the designed device can be effectively ensured.

Description

Equipment construction method, assembly database construction method, equipment design method and related products

[0001] The present invention claims priority to Chinese patent application number 202410301837.3, filed with the Patent Office of China on March 17, 2024, entitled “Equipment construction method, assembly database construction method, equipment design method and related products”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of precision equipment design and manufacturing, and in particular to a method for constructing an equipment, a method for constructing an assembly database, a method for designing an equipment, a computer program product, a computer device, and a computer-readable storage medium. Background Art

[0003] Digital twinning leverages data from physical models, sensor updates, and operational history to integrate multidisciplinary, multi-physics, multi-scale, and multi-probability simulation processes, mapping them in virtual space to reflect the corresponding physical equipment. A digital twin is a concept that transcends reality and can be viewed as a digital mapping system for one or more important, interdependent equipment systems.

[0004] Currently known machine tool design methods typically follow machine tool design manuals and other methods, designing individual components, such as the bed and worktable, separately. After the designs are completed, the machine tool is assembled and its performance is measured. While implementing the aforementioned technical solution, the inventors discovered that this design method has significant limitations and cannot guarantee the initial accuracy and dynamic characteristics of the designed machine tool. Summary of the Invention

[0005] In order to solve the existing technical problems, the present application provides a method for constructing equipment, a method for constructing an assembly database, a method for designing equipment, a computer program product, a computer device and a computer-readable storage medium that are conducive to ensuring the initial accuracy and dynamic characteristics of the designed machine tool.

[0006] In a first aspect of an embodiment of the present application, a method for constructing a device is provided, comprising:

[0007] Based on the assembly path of the device, the device is decomposed into a plurality of combined assembly relationships in a set order; wherein each combined assembly relationship is used to represent the connection relationship between the first target part and the second target part;

[0008] According to each combination and assembly relationship, an intermediate configuration of the device is formed, and based on the stimulus and response data for the intermediate configuration, a quantitative model of the intermediate configuration corresponding to the combination and assembly relationship is established;

[0009] The quantitative models corresponding to the intermediate configurations are combined to form a model of the device.

[0010] In a second aspect, a method for constructing an assembly database is provided, comprising:

[0011] Based on the multiple combined assembly relationships obtained by decomposing the assembly path of the equipment, the intermediate configurations corresponding to the combined assembly relationships are respectively constructed; wherein each combined assembly relationship is used to represent the connection relationship between the first target part and the second target part;

[0012] Based on the excitation and response data for each of the intermediate configurations, corresponding quantitative models are established respectively;

[0013] The first target part, the second target part, the corresponding combined assembly relationship, and the quantitative model are synchronized to a database to obtain an assembly database.

[0014] A third aspect provides a device design method, comprising:

[0015] Obtaining an assembly database obtained according to the assembly database construction method provided in an embodiment of the present application;

[0016] Determining a combined assembly relationship between a first target part and a second target part, and based on an intermediate configuration corresponding to the combined assembly relationship, determining a quantitative model of the intermediate configuration corresponding to the combined assembly relationship from the assembly database;

[0017] The quantitative model is used to obtain target evaluation indicators of the connection characteristics of the joint surface contained in the current intermediate configuration, and the intermediate configuration is evaluated according to the target evaluation indicators to determine whether to proceed to the next assembly design step.

[0018] In a fourth aspect, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements a method for constructing a device described in any embodiment of the present application, a method for constructing an assembly database described in any embodiment of the present application, or a method for designing a device described in any embodiment of the present application.

[0019] In a fifth aspect, a computer device is provided, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the device construction method described in any embodiment of the present application, the assembly database construction method described in any embodiment of the present application, or the device design method described in any embodiment of the present application is implemented.

[0020] In a sixth aspect, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, it implements the method for constructing the device described in any embodiment of the present application, the method for constructing the assembly database described in any embodiment of the present application, or the method for designing the device described in any embodiment of the present application.

[0021] The device construction method provided in the above embodiment uses the assembly path of the device to decompose the combined assembly relationship of the device, decomposing the device into several combined assembly relationships in a set order, and combining the quantitative models of each intermediate configuration with the corresponding intermediate configuration of each combined assembly relationship to obtain the model of the device. In this way, according to actual needs, any intermediate configuration in the device can be targeted to perform excitation and response tests, and the connection performance between two components with a connection relationship in the device (or two single components, or an assembled whole component and a single component) can be independently quantified, which is conducive to more accurately reflecting the real-time performance of the device. When applied to the design of the device, it can effectively ensure the initial accuracy and dynamic characteristics of the designed device; and the construction of the device model can be used to judge the real-time physical state of the device, evaluate the real-time performance of the device and predict future performance; for various complex devices containing a large number of connection relationships, their connection relationships can be expressed separately and accurately as needed. Compared with the known method of using external overall response to inversely calculate the performance of each interface, it can effectively save computing power and improve the model accuracy of the device.

[0022] In the above embodiments, the assembly database construction method, the equipment design method, the computer program product, the computer equipment and the computer-readable storage medium all belong to the same concept as the corresponding equipment construction method embodiment, and thus have at least the same technical effect as the corresponding equipment construction method embodiment, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a flow chart of a method for designing a device in one embodiment.

[0024] FIG2 is a flow chart of a method for constructing an assembly database in one embodiment.

[0025] FIG3 is a flow chart of a method for constructing a device in one embodiment.

[0026] FIG4 is a schematic diagram showing the configuration of the device and the evolution of the connection performance of the joint surface in one embodiment.

[0027] FIG5 is a schematic diagram of the structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0028] The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] In order to make the purpose, technical solutions and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limiting this application. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] In the description of this application, the expression "some embodiments" is involved, which describes a subset of all possible embodiments. It should be noted that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

[0031] In the description of this application, the terms "first, second, and third" are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It is understandable that "first, second, and third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0032] Before describing the technical solution of this application, the background of this application is explained as follows:

[0033] The equipment in this application may be various types of precision machining equipment for processing products, materials, etc., such as drilling machines, milling machines, lathes, grinders, etc.

[0034] Machining equipment, such as machine tools, is assembled from multiple parts. The assembly process directly affects its machining accuracy. Therefore, the higher the assembly processability between the various parts of the machining equipment, the higher the machining accuracy of the machining equipment.

[0035] In traditional machine tool design methods, relevant theoretical calculations are performed according to the machine tool design manual to determine the structural strength and assembly relationship of each part of the machine tool. After assembly, the initial accuracy of the entire machine is evaluated.

[0036] After research, the applicant found that this design method has great uncertainty. The consistency of the same parts produced by different manufacturers is different, which will affect the initial assembly accuracy of the machine tool. In addition to the design factors of each component, the initial accuracy of the machine tool is also related to the assembly proficiency of the assembly workers. Generally speaking, the initial assembly accuracy of different assembly teams varies greatly. Therefore, the traditional design method has great limitations and cannot guarantee the initial accuracy of the designed machine tool.

[0037] Based on the above problems, the applicant provides the following equipment design method, which can basically ensure the initial assembly accuracy of equipment (such as machine tools). Please refer to Figure 1. The equipment design method includes but is not limited to steps S10 and S12.

[0038] S10 , determining a combined assembly relationship between a first target part and a second target part, and based on an intermediate configuration corresponding to the combined assembly relationship, determining a quantitative model of the intermediate configuration corresponding to the combined assembly relationship from an assembly database.

[0039] The first target part and the second target part are related to the assembly order of the two target parts in the equipment. For example, if the two target parts are assembled in the first assembly step in the assembly order, the first target part and the second target part are two independent parts with a connection relationship; if the two target parts are assembled after the first assembly step in the assembly order, the first target part is a whole formed by multiple parts that have completed the assembly step before, and the second target part is the part that needs to be assembled with the first target part in the current assembly step.

[0040] A combined assembly relationship refers to the connection relationship between the first target part and the second target part in the equipment. For a machine tool, when the structural design of the machine tool is determined, the overall performance of the machine tool mainly depends on the connection characteristics of the joint surfaces in these combined assembly relationships. In this way, the overall performance of the machine tool can be characterized by the joint surfaces in several combined assembly relationships formed by the assembly of all the components it contains, that is, a quantitative model of the intermediate configuration of the combined assembly relationship corresponding to the first target part and the second target part.

[0041] It is understandable that the degree of influence of the performance of the connection relationship between different components in the equipment on the overall performance of the equipment is usually different. Moreover, during the equipment assembly process, there may be different requirements for the assembly attention between different components based on the experience or professional advantages of the assembly operators. In this way, the connection relationship corresponding to the combined assembly relationship between which components is selected as the main focus can be determined by decomposing the equipment according to the assembly path to form several combined assembly relationships in a set order and then selecting from them. The above-mentioned combined assembly relationship can be applicable to various situations such as between single components and single components, between combined components formed by assembly and single components, and between combined components formed by assembly and combined components formed by assembly.

[0042] Taking the machine tool as an example, in an optional example, the decomposition based on the machine tool assembly path may include, in sequence, assembling the front bed and the rear bed of the machine tool to form the bed (combined assembly relationship 1), and then assembling the bed (a whole formed by multiple parts) with the workbench (combined assembly relationship 2). The first target part and the second target part in the combined assembly relationship 1 are two parts connected to each other in a large part, specifically the front bed and the rear bed in the bed. The first target part and the second target part in the combined assembly relationship 2 are respectively the part formed by the previous assembly and a single part.

[0043] In this embodiment, the intermediate configuration may be a finite element model or other digital model. The quantitative model may be a data model that quantitatively represents the connection characteristics of the joint surface defined by the specified assembly connection relationship between the first target part and the second target part in the corresponding intermediate configuration.

[0044] It should be noted that, in the assembly database, the assembly between the first target part and the second target part may include multiple options, including the selection of different assembly methods, the selection of different connection characteristics under the same assembly method, etc. The assembly database may pre-store the combined assembly relationship between the first target part and the second target part determined accordingly based on various assembly requirements. Taking the assembly of the front bed and the rear bed in the machine tool to form the bed (combined assembly relationship 1) as an example, the assembly database may pre-store the intermediate configuration and corresponding quantitative model of the combined assembly relationship of the front bed and the rear bed connected by welding, as well as the intermediate configuration and corresponding quantitative model of the combined assembly relationship of the front bed and the rear bed connected by nuts.

[0045] It should be noted that, in the embodiments of the present application, aspects such as the assembly of the equipment, the initial accuracy after assembly, and the overall performance after assembly are all solved based on the quantitative determination of the influence of the combined assembly relationship formed by the assembly of components contained in the equipment on the overall performance of the equipment. In the assembly database, the assembly between the first target part and the second target part can also include a one-to-one corresponding combined assembly relationship in which the first target part of different structural configurations is connected to the second target part of different structural configurations. For each group of first target parts and second target parts with a determined structural configuration, a variety of options may be included according to their assembly, such as the selection of different assembly methods, the selection of different connection characteristics under the same assembly method, etc. Optionally, in some embodiments, step S10 includes:

[0046] Selecting combination assembly relationships between different types of first target parts and / or different types of second target parts, and determining intermediate configurations corresponding to each of the combination assembly relationships;

[0047] The quantitative models of the intermediate configurations corresponding to the respective combination assembly relationships are determined from the assembly database, and target combination assembly relationships that meet the requirements are screened based on the quantitative models.

[0048] Here, different types of first target parts and / or different types of second target parts include various combinations of first target parts with different structural configurations or different materials and second target parts with different structural configurations or different materials. Through the quantitative model of the intermediate configuration corresponding to each combined assembly relationship, the evaluation index of the bonding surface contained in each intermediate configuration can be obtained to screen the combined assembly relationship with the relatively optimal performance as the target combined assembly relationship. It can be understood that based on the screening and determination of the target combined assembly relationship in each step of the assembly design, a design scheme that meets the current requirements and has the best performance can be selected from the assembly database.

[0049] In the assembly database, the combined assembly relationship obtained by decomposing the equipment can be used as an index to construct. For example, the combined assembly relationship in the machine tool includes the assembly between the workbench and the bed. The requirement is the combined assembly relationship of "assembly between the workbench and the bed". In response to the above requirement, the "workbench" and "bed" are called from the assembly database as indexes to determine the corresponding intermediate configuration, and the corresponding quantitative model of the "intermediate configuration" is called.

[0050] S12, using the quantitative model to obtain a target evaluation index of the current intermediate configuration, evaluating the intermediate configuration according to the target evaluation index, and determining whether to proceed to the next assembly step.

[0051] The target evaluation index may refer to the connection characteristics of the joint surface, such as stiffness and damping.

[0052] If the stiffness of the intermediate configuration is insufficient, the combination assembly relationship of the currently selected first target part and the second target part is changed, for example, nuts of different diameters and bearings of different inner diameters in the currently selected combination assembly relationship are replaced, the preload force is increased, etc., to increase the stiffness of the combination assembly relationship.

[0053] If the damping of the intermediate configuration is insufficient, the combination assembly relationship of the currently selected first target part and the second target part is changed, for example, the damping between the first target part and the second target part is increased, the surface contact between the two is changed from ordinary plane contact after machining to scraped (manual) surface contact, the material of the first target part / the second target part is changed, or the lubricity of the surface on which the first target part and the second target part contact each other is increased, etc. Furthermore, different scraping types can be adjusted to change the combination assembly relationship.

[0054] For the quantitative models corresponding to different combination assembly relationships, in one example, the quantitative model of the joint surface between the first target part and the second target part can be used as the quantitative model corresponding to the combination assembly relationship, and a variety of response data can be obtained by using different excitation signals as input to form a quantitative model of the joint surface, so as to determine whether the currently selected combination assembly relationship meets the requirements, until the combination assembly relationship between the first target part and the second target part that can meet the requirements is selected, and then the new combination assembly relationship involved in the next assembly is used to return to the step S10; this cycle is repeated until the assembly design is completed and the entire device is obtained.

[0055] In the above embodiment, the assembly of the equipment is disassembled according to the combination assembly relationship. By decomposing the equipment into intermediate configurations corresponding to several combination assembly relationships, based on the assembly database containing the quantitative model of the bonding surface in the combination assembly relationship corresponding to the intermediate configuration, the target evaluation index of the bonding surface contained in the intermediate configuration is determined one by one to meet the requirements, and then the next step of assembly design is executed. In this way, it can be ensured that the connection characteristics of the bonding surfaces in the combination assembly relationship involved in each step of the equipment assembly meet the requirements, thereby ensuring the initial assembly accuracy of the equipment assembly.

[0056] It should be noted that, in the embodiments of the present application, the determination of the assembly design in steps can be combined with the quantitative models of the assembly design in each step to obtain a model of the device, and the device model can be used to test the overall design performance of the device. Optionally, in some embodiments, the device design method further includes:

[0057] After all the assembly designs are completed, a model of the device is formed using the quantitative models of the intermediate configurations corresponding to all the combined assembly relationships;

[0058] An overall evaluation index for the device is obtained based on the model of the device, and the design of the current device is evaluated according to the overall evaluation index.

[0059] Here, the overall evaluation index for the device is obtained based on the model of the device. This can be achieved by giving a corresponding excitation input signal, obtaining the overall response data and the response data of the quantitative model of the intermediate configuration corresponding to each combination assembly relationship in the device, thereby obtaining the overall evaluation index of the device to evaluate the design of the current device.

[0060] It is understandable that the above assembly database needs to be constructed in advance.

[0061] In another aspect of the embodiment of the present application, referring to FIG. 2 , a method for constructing an assembly database is provided, including but not limited to steps S21 , S23 , and S25 , including:

[0062] S21, based on the multiple combined assembly relationships obtained by decomposing the assembly path of the device, constructing intermediate configurations corresponding to each of the combined assembly relationships, wherein each combined assembly relationship is used to represent the connection relationship between the first target component and the second target component.

[0063] Each combined assembly relationship involves an assembly option for the first target part and the second target part, such as a first target part with a different structural configuration and a second target part with a different structural configuration, different assembly methods between the first target part and the second target part, or different connection characteristics between the first target part and the second target part under a certain assembly method. Thus, constructing an intermediate configuration of a combined assembly relationship generally includes the following:

[0064] 1) Build models of various components or parts. Specifically, for components or parts of the same type, use labels produced by different manufacturers to label the models. For different components or parts, use the overall name to label them. In another possible example, the same type of components or different components are labeled according to the age of the components. Here, the differently labeled components can be the first target component with different structural configurations in the combined assembly relationship, or the second target component with different structural configurations.

[0065] 2) Selecting a first target part and a second target part according to requirements, and assembling the first target part and the second target part together in a specified manner to form a corresponding intermediate configuration.

[0066] S23 , establishing corresponding quantitative models based on the excitation and response data for each of the intermediate configurations.

[0067] The natural frequency, damping, mode and other parameters of the above-mentioned intermediate configuration are obtained through hammer tests or exciter tests, and the combined assembly relationship between the first target part and the second target part of the equipment is quantified by combining finite element models and parameter identification (for example, the combined assembly relationship is expressed in terms of connection stiffness and damping); the natural frequency, damping and mode of the equipment can also be obtained through self-excitation of the above-mentioned components in the working state, such as spindle idling, worktable movement, and cutting excitation, and the combined assembly relationship between the first target part and the second target part of the equipment can be quantified by combining finite element models and parameter identification.

[0068] The finite element model established through the basic process of any one of the above methods or a combination of the two methods can reflect the physical state of the joint surface formed by the assembly of the first target part and the second target part at a certain moment of the equipment (for example, the initial state of the assembly), and the corresponding working state of the equipment at that moment can be simulated through the physical state of all the joint surfaces in the equipment.

[0069] S25 , synchronizing the first target part, the second target part, the corresponding combined assembly relationship, and the quantitative model to a database to obtain an assembly database.

[0070] It is understandable that the above basic process needs to be repeated continuously to obtain quantitative models of different combination assembly relationships.

[0071] In the above embodiment, the equipment is disassembled according to the combination assembly relationship based on the assembly path. By decomposing the equipment into several combination assembly relationships, an intermediate configuration is established, which corresponds to the combination assembly relationship formed by the first target part with a determined structural configuration, the second target part with a determined structural configuration, and the first target part and the second target part according to the determined assembly method. The excitation and response data for the intermediate configuration are used to establish a quantitative model that can quantitatively characterize the connection characteristics of the joint surface in the combination assembly relationship corresponding to the intermediate configuration. An assembly database is constructed through the intermediate configurations of different combination assembly relationships and their corresponding quantitative models. The assembly database can be called in the equipment design process to ensure the initial assembly accuracy of the equipment.

[0072] It can be understood that the above-mentioned assembly database can also be used to construct a digital twin model of the equipment.

[0073] In another aspect of the embodiment of the present application, please refer to Figure 3, which provides a method for constructing a device, including but not limited to steps S31, S33 and S35.

[0074] S31, based on the assembly path of the equipment, decomposing the equipment into a plurality of combined assembly relationships in a set order; wherein each combined assembly relationship is used to represent a connection relationship between a first target part and a second target part.

[0075] The assembly path can include information about the equipment's assembly process or assembly sequence. This path can be derived from the assembler's experience or from the equipment's assembly process diagram. It can include the order in which components must be assembled and serve as an assembly guide document for the assembly of each component. The assembly path can be expressed in various formats, such as charts, arrays, and images, to represent the assembly process or assembly sequence.

[0076] In an optional example, the assembly path of the equipment determined according to the assembly process diagram can be expressed as: {(s1)(a1,b1), (s2)(s1,b2)...}, where (s1), (s2)... represent the sequence of assembly steps, (a1,b1), (s1,b2)... represent the combined assembly relationship, a1 and b1 in (a1,b1) are respectively the components included in the equipment, and in (s1,b2), s1 represents the entire component formed by assembling components a1 and b1 in the previous assembly step s1.

[0077] S33 , forming an intermediate configuration of the device according to each combination assembly relationship, and establishing a quantitative model of the intermediate configuration corresponding to the combination assembly relationship based on the stimulus and response data for the intermediate configuration.

[0078] The digital model of the device always changes with the changes in the connection characteristics of each connection point within the object in the world coordinate system. Each combined assembly relationship corresponds to an intermediate configuration of the device. With this intermediate configuration as the test object, excitation and response tests are carried out to obtain one or more sets of data. The test time can be carried out at a preset time interval, so that the corresponding combined assembly relationship can be quantitatively characterized. When the first target part and the second target part are given, the difference in the excitation and response test data is mainly affected by the assembly of the first target part and the second target part. The quantitative characterization of the combined assembly relationship composed of the first target part and the second target part under the corresponding assembly method depends on the connection characteristics of the joint surface in the combined assembly relationship, such as the quantification of mechanical properties such as stiffness and damping.

[0079] A quantitative model refers to a method that uses mathematical formulas, statistical methods, and computer algorithms to describe and predict real-world phenomena. Through quantitative models, mathematical statistics can be applied to scientific data so that the models constructed by mathematical statistics can be supported empirically and numerical results can be obtained.

[0080] The quantitative model of the intermediate configuration corresponding to the combined assembly relationship refers to a functional relationship that quantitatively characterizes the connection characteristics of the joint surface formed by the assembly of the first target part and the second target part involved in the assembly step in the equipment.

[0081] It is understandable that each intermediate configuration may include multiple combination assembly relationships, and the combination assembly relationships correspond one-to-one to the quantitative models.

[0082] For example, let's take the assembly path of a device as {(s1)(a1,b1), (s2)(s1,b2)...}:

[0083] 1) Assembly step s1 corresponds to the combined assembly relationship (a1, b1), and the intermediate configuration corresponding to the combined assembly relationship (a1, b1) is used as the object of the excitation and response test.

[0084] Establish a quantitative model of the joint surface j1 between components a1 and b1, such as ω j1 =f(x j1 );

[0085] 2) The assembly step s2 corresponds to the combined assembly relationship (s1, b2), and the intermediate configuration corresponding to the combined assembly relationship (s1, b2) is used as the object of the excitation and response test.

[0086] A quantitative model of the interface j2 between components s1(a1,b1) and b2 is established. In this process, the interface j1 contained in s1(a1,b1) can be introduced as a known parameter, such as ω j2 =f(x j2 )*ω j1 ;

[0087] 3) Similarly, a quantitative model of the intermediate configuration corresponding to each combination assembly relationship in the equipment can be obtained.

[0088] It should be noted that, the intermediate configuration corresponding to each combined assembly relationship is obtained, and the quantitative model of the connection characteristics of the joint surface in the corresponding combined assembly relationship is obtained by using the excitation and response tests on the intermediate configurations. This can be done by gradually obtaining the excitation and response test data of these intermediate configurations through the process of assembling the physical equipment according to the assembly path. At this time, the combined assembly relationship is decomposed according to the assembly order of the equipment; or it can be done by gradually obtaining the excitation and response test data of these intermediate configurations through the process of disassembling the assembled physical equipment in the reverse direction of the assembly path. At this time, the combined assembly relationship can also be decomposed according to the reverse assembly order of the equipment.

[0089] S35 , combining the quantitative models corresponding to the intermediate configurations to form a model of the device.

[0090] Specifically, the corresponding intermediate configuration can be determined based on the combined assembly relationship, and the connection relationship between the two components of the intermediate configuration can be quantitatively characterized using the joint surface. Then, combined with the assembly path of the equipment, a quantitative model of each intermediate configuration can be established specifically. By combining the quantitative models of these intermediate configurations, the model of the equipment is obtained.

[0091] In the above embodiment, the assembly path of the equipment is used to disassemble the combined assembly relationship of the equipment, and the equipment is decomposed into several combined assembly relationships in a set order. The model of the equipment is obtained by combining the intermediate configurations corresponding to each combined assembly relationship with the quantitative models of each intermediate configuration.

[0092] In this way, according to actual needs, excitation and response tests can be performed on any intermediate configuration of the device in a targeted manner, and the connection relationship between two components with a connection relationship in the device (or two single components, or an assembled whole component and a single component) can be independently quantified, which is conducive to more accurately reflecting the real-time performance of the device, judging the real-time physical state of the device, evaluating the real-time performance of the device and predicting future performance; for various complex devices with a large number of connection relationships, their connection relationships can be expressed in a targeted and accurate manner as needed. Compared with the known method of using external overall response to inversely calculate the performance of each interface, it can effectively save computing power and improve the model accuracy of the device.

[0093] The known method of back-calculating the performance of each joint surface by the external overall response is to perform excitation and response testing on the machine tool as a whole, and then back-calculate the performance of the numerous joints contained therein by the total response of the machine tool. This makes it difficult to independently characterize the performance of each joint surface. In particular, when the number of joint surfaces exceeds a certain number, it is difficult to correctly characterize the connection characteristics of some joint surfaces by back-calculating the total response.

[0094] In the study of how to build a digital twin model that can reflect the real-time performance of a machine tool in real time, the inventors of this application decomposed the overall relationship of the machine tool into the assembly relationship of several component combinations in a set order. For the assembly relationship of each component combination, the intermediate configuration of the corresponding component combination was used for excitation and response testing to obtain a quantitative model that characterizes the corresponding intermediate configuration. Finally, by combining different component combinations, an overall digital twin model that can independently characterize the connection characteristics of each joint surface in the machine tool was obtained. It is understandable that this technical idea is also applicable to any other equipment formed by the assembly of multiple components, and this application does not limit this.

[0095] In some embodiments, in step S31, based on the assembly path of the equipment, the equipment is decomposed into assembly relationships in a set order, including:

[0096] Based on the assembly path of the device, obtaining the components included in the device and the assembly order between the components;

[0097] According to the order of the assembly sequence, between each two adjacent components, a combined assembly relationship is formed by taking the preceding component and its preceding component as a first target component and taking the succeeding component as a second target component, thereby obtaining a combined assembly relationship in a set order after the equipment is disassembled.

[0098] The equipment may be assembled in the order of components, and the corresponding combined assembly relationship may be formed based on whether the joint surface corresponding to the connection relationship formed by the assembly of each two adjacent components is a connection relationship (joint surface) whose connection characteristics need to be characterized.

[0099] It should be noted that the combined assembly relationship between each two adjacent components can be selected based on the performance evaluation of the equipment and the predicted actual needs, rather than absolutely disassembling each assembly sequence in the equipment assembly path one by one to form a combined assembly relationship.

[0100] For the combined assembly relationship formed by disassembling two components in an assembly sequence other than the first step, the first target component is the whole formed by the components that have been assembled in the previous assembly sequence, and the second target component is the component that needs to be added in the current assembly sequence.

[0101] In the above embodiment, the assembly order is used to determine the corresponding combined assembly relationship and obtain the corresponding intermediate configuration, which decomposes the complex equipment with multiple connection relationships into several independent and targeted intermediate configurations, simplifying the construction of the equipment model.

[0102] In some embodiments, establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship based on the stimulus and response data for the intermediate configuration includes:

[0103] Determining an assembly type corresponding to the combined assembly relationship according to a contact type between two adjacent components;

[0104] If the assembly type is a moving contact type, a quantitative model of the intermediate configuration corresponding to the combined assembly relationship is established based on the excitation and response data collected for the intermediate configuration during the period in which the first target part and the second target part in the corresponding combined assembly relationship maintain relative motion.

[0105] Among them, the intermediate configuration of each combination assembly relationship can be used as the test object, and excitation and response tests can be taken to obtain one or more sets of data. The test time can be carried out according to the preset time interval, so that the corresponding combination assembly relationship can be quantitatively characterized, and then a quantitative model of the intermediate configuration corresponding to the combination assembly relationship can be established.

[0106] For a combined assembly relationship with a moving contact type of assembly, during the motion cycle in which the first target part and the second target part in the combined assembly relationship maintain relative movement, tests can be performed at preset time intervals within a certain period, thereby collecting excitation and response data between the two parts with a moving contact type of assembly in different configurations covering the entire motion cycle.

[0107] In one example, the moving contact type assembly type includes a spindle assembly, a lead screw assembly, and / or a guide rail assembly.

[0108] This embodiment distinguishes the contact types between different components and, accordingly, divides the assembly types of the combined assembly relationships obtained after disassembly within the device, thereby more accurately characterizing the types of intermediate configurations corresponding to the combined assembly relationships and facilitating cluster analysis of intermediate configurations of the same type.

[0109] Please refer to FIG4 , which is a schematic diagram of obtaining corresponding excitation and response data of the intermediate configuration of the combined assembly relationship at preset time intervals and establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship.

[0110] In Figure 4, (a) to (c) respectively represent:

[0111] The physical and digital model mapping of the intermediate configuration formed by component A and component B through the combined assembly relationship C at time t0;

[0112] The physical and digital model mapping of the intermediate configuration formed by component A and component B through the combined assembly relationship C at time t1;

[0113] The physical and digital model mapping of the intermediate configuration composed of parts A and B through the combined assembly relationship C at time tn.

[0114] The test period (t0) to (tn) must cover at least one complete motion cycle.

[0115] Taking the guide rail assembly relationship of the workbench as an example, the workbench position and configuration are different at different times within a motion cycle. The change of the guide rail assembly relationship is related to both the configuration and the time. By using the continuous excitation and response related data within the motion cycle, a digital model is established that changes accordingly with the intermediate configuration of the combined assembly relationship over time, forming a quantitative model that accurately characterizes the connection characteristics of the joint surface in the combined assembly relationship, that is, a quantitative model corresponding to the intermediate configuration corresponding to the combined assembly relationship.

[0116] The digital twin model of the equipment constructed in this way can be used to independently evaluate and predict the performance of the corresponding combination assembly relationship in subsequent applications.

[0117] Taking Figure 4 as an example, for the combined assembly relationship C, the quantitative function C(t0) can be used to map the equipment to a specific moment in the subsequent application stage to evaluate or predict the connection characteristics (such as mechanical properties such as stiffness and damping) of the joint surface in the combined assembly relationship C at any specific moment in the future. C*(t0) represents the actual situation of the combined assembly relationship C, and A*(t0) and B*(t0) represent the entities of component A (the first target component) and component B (the second target component), respectively. The quantitative function C(t0) can be used to predict the changes in the intermediate configuration at a specific moment in the future. Similarly, at time (t0) to (tn), the changes in the intermediate configuration at a specific moment in the future can also be predicted according to the above method, which will not be repeated here.

[0118] In this way, the changes in the combination and assembly relationship between the components within the equipment over time can be quantified, the combination and assembly relationship can be evaluated in real time, its change trend can be obtained, and the performance of the equipment at a specific moment in the future can be predicted.

[0119] In some embodiments, in step S33, establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship based on the stimulus and response data for the intermediate configuration includes:

[0120] Determining the assembly type corresponding to the combined assembly relationship according to the contact type of the joint surfaces between two adjacent components;

[0121] If the assembly type is a fixed contact type, based on the excitation and response data collected for the intermediate configuration under the pre-tightening state of different sizes maintained between the first target part and the second target part in the corresponding combined assembly relationship, a quantitative model of the intermediate configuration corresponding to the combined assembly relationship is established.

[0122] Different fixed contact assembly methods for the first and second target parts correspond to different intermediate configurations. Given a given fixed contact assembly method, stimulus and response testing is performed based on the intermediate configuration of the corresponding combined assembly relationship as the test object, acquiring one or more sets of data. Testing can be performed at preset time intervals, thereby quantitatively characterizing the corresponding combined assembly relationship and establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship.

[0123] In this embodiment, the assembly type includes a fixed contact type. For a fixed contact assembly relationship, the excitation and response data of different preload forces between the first target part and the second target part are used to obtain a quantitative model representing the different connection characteristics of the joint surface in the corresponding combined assembly relationship.

[0124] Optionally, the fixed contact type combined assembly relationship may include a bolt connection relationship, an adhesive connection relationship, and / or a tight fit connection relationship.

[0125] In one example, component A (a first target component) and component B (a second target component) are connected via a fixed contact assembly relationship C. The assembly relationship C can be, for example, a bolted connection, an adhesive bond, or a tight fit connection. Over time, the change in the assembly relationship C depends on the change in the fixed connection force between component A and component B. By using the assembly relationship formed between component A and component B to form an intermediate configuration of the corresponding device, this intermediate configuration is used as a test object, and stimulus and response tests are conducted to obtain one or more sets of data. The test time can be conducted at preset time intervals, and a quantitative function is established to characterize the changes in the connection characteristics of the bonding surface at different times. That is, a quantitative model corresponding to the intermediate configuration is established to evaluate and predict the physical properties at a specific time in the future.

[0126] In some embodiments, in step S33, establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship based on the stimulus and response data for the intermediate configuration includes:

[0127] Determining the assembly type corresponding to the combined assembly relationship according to the contact type of the joint surfaces between two adjacent components;

[0128] If the assembly type is a detachable fixed contact type, a quantitative model of the intermediate configuration corresponding to the combined assembly relationship is established based on the excitation and response data collected for the intermediate configuration between the first target part and the second target part in the corresponding combined assembly relationship in the installed state and the disassembled state respectively.

[0129] According to the different connection relationships between the components in the combined assembly relationship, the contact types of the bonding surfaces between the two components are differentiated by type. In the embodiment in which the assembly types corresponding to the combined assembly relationship obtained after disassembly in the device are differentiated by type, the assembly type also includes a detachable fixed contact type. For the combined assembly relationship with the detachable fixed contact type, the excitation and response tests are respectively performed between the first target part and the second target part in the installed state and the disassembled state to obtain the quantitative characterization of the connection characteristics of the bonding surface between the first target part and the second target part in the combined assembly relationship of the detachable fixed contact type. It should be noted that the two components in the combined assembly relationship of the detachable fixed contact type form different intermediate configurations of the device in the installed state and the disassembled state respectively. Based on the corresponding intermediate configuration as the test object, the excitation and response test is taken to obtain one or more sets of data. The test time can be carried out according to the preset time interval, so that the connection characteristics of the bonding surface in the corresponding combined assembly relationship can be quantitatively characterized, and then a quantitative model of the intermediate configuration corresponding to the corresponding combined assembly relationship is established.

[0130] Optionally, the assembly type is a detachable fixed contact type combined assembly relationship, which may include a tool holder and tool assembly relationship.

[0131] In one example, through the combined assembly relationship formed by the connection relationship E between the tool holder C and the tool D, the tool holder C and the tool D form two intermediate configurations of the corresponding equipment in the assembled state and the disassembled state respectively. Based on the excitation and response data of the intermediate configurations formed by the tool holder C and the tool D in the installed state and the disassembled state respectively collected at preset time intervals, a quantitative function is established to characterize the physical properties of the bonding surface obtained by the connection relationship E at different times, so as to evaluate and predict the physical properties of the connection relationship E at a specific future moment.

[0132] In some embodiments, step S33 includes:

[0133] According to each combined assembly relationship, an intermediate configuration of the device corresponding to the combined assembly relationship is established by using a corresponding response output signal obtained after a single excitation input signal;

[0134] Inputting an excitation input signal to the intermediate configuration at preset time intervals and collecting corresponding response output signals respectively; or inputting a continuous excitation input signal to the intermediate configuration and collecting corresponding response output signals at preset time intervals;

[0135] According to the corresponding excitation input signal and the response output signal, a transfer function between the response output signal and the excitation input signal is determined, and a quantitative model of the intermediate configuration corresponding to the corresponding combined assembly relationship is obtained according to the transfer function.

[0136] The transfer function is the ratio of the Laplace transform (or z-transform) of the linear system response (i.e., output) to the Laplace transform of the excitation (i.e., input) under zero initial conditions, and can be expressed as G(s) = Y(s) / U(s). In this embodiment, excitation and response tests are performed on the intermediate configurations of the device corresponding to each combined assembly relationship to obtain the transfer function of the corresponding intermediate configuration, thereby obtaining a quantitative model of the intermediate configuration corresponding to the combined assembly relationship.

[0137] It should be noted that, in some embodiments, a quantitative model that can characterize the trend of connection characteristics of the corresponding bonding surface along the time axis can be established by changing the transfer function along the time axis during the time period of the stimulus and response test.

[0138] Optionally, the excitation input signal is a hammer test signal, an exciter test signal, and / or a self-excitation signal of the device, and the response output signal is a vibration signal and / or a frequency response.

[0139] It should be noted that the physical connection characteristics of the joint surface formed by the connection relationship between the components include multiple performance-related parameters such as the static performance of the equipment, the dynamic performance of the equipment, and the processing stability of the equipment. At different times and in different configurations, the connection physical properties of the joint surface corresponding to the connection relationship between different components of the equipment will age and change to varying degrees. Static properties such as static stiffness, positioning accuracy, and repeatability will change, and dynamic properties such as dynamic stiffness, natural frequency, and mode will also change. Correspondingly, the processing stability and dynamic processing accuracy of the equipment will also change, thereby affecting the processing performance of the equipment. In this embodiment, based on the excitation and response data corresponding to each intermediate configuration, a transfer function that can independently quantify the connection characteristics of each connection in the equipment (the joint surface included in each combined assembly relationship) is obtained, and a quantitative model that quantitatively characterizes the connection characteristics (mechanical properties such as stiffness and damping) of the corresponding joint surface is obtained. Therefore, the connection characteristics of each connection in the equipment (the joint surface included in each combined assembly relationship) after the positioning accuracy changes at a certain moment can be determined by the quantitative model, that is, the static performance of the equipment; or the connection characteristics of each connection in the equipment after the natural frequency or mode changes, that is, the dynamic performance of the equipment, can be predicted by the quantitative model.

[0140] In excitation and response testing, regardless of the type of excitation, whether through a hammer test, a shaker, or self-excitation, the goal is to excite and obtain the response under this excitation.

[0141] Based on the device construction method provided in the embodiments of the present application, the connection relationships between components are disassembled according to the assembly order to obtain each combined assembly relationship. Stimulus and response testing is then used to obtain a quantitative function of the connection characteristics of the interface at each connection point (each combined assembly relationship) within the device at each moment. The quantitative model of the intermediate configuration corresponding to each combined assembly relationship corresponds one-to-one with the quantitative result of the connection characteristics of the interface at each connection point (each combined assembly relationship).

[0142] For example, the intermediate configurations corresponding to each combined assembly relationship are used as test objects. After an excitation is performed, a response is obtained. The corresponding configuration model is first established. When the same excitation as the configuration object is input to the configuration model, the same output can be obtained. Then the inherent properties of the configuration model are also the same as the inherent properties of the configuration object. At this time, it can be determined that the configuration model is equivalent to the configuration object, or it is a quantitative model of the configuration object at this moment.

[0143] Based on test data, the quantitative models of the intermediate configurations corresponding to the various assembly relationships described above are updated. Combining these quantitative models creates a digital twin of the entire device. This not only provides a quantitative model representation of the connection relationships within the device, quantifying the different connection relationships within the device and how these change over time, but also helps improve the accuracy of the overall digital twin.

[0144] Based on the equipment model, its performance can be conveniently evaluated at every moment. For example, after building a digital model of a machine tool, its static and dynamic performance can be evaluated. By analyzing the changing trends of the equipment's physical state and connection relationships at different times, future performance and, furthermore, the equipment's lifespan can be predicted.

[0145] It can be understood that the construction method of the device provided in the embodiment of the present application utilizes the assembly path of the device to disassemble the device into several combined assembly relationships in a set order, and takes the intermediate configuration corresponding to each combined assembly relationship as the object, obtains the quantitative data of the connection characteristics of the bonding surfaces contained in the corresponding combined assembly relationship based on the stimulus and response data, and successively establishes quantitative models that can quantitatively express the connection characteristics of the bonding surfaces contained in the corresponding combined assembly relationships, and combines the quantitative models corresponding to each combined assembly relationship to obtain the model of the device, wherein the process of constructing the model of the device can also be regarded as the design process of the device, according to the combined assembly relationships contained in the model of the device finally constructed (all combined assembly relationships can correspond to the components contained in the device and the assembly methods between the components; the quantitative model corresponding to each combined assembly relationship can be used to pre-determine whether the connection characteristics of the bonding surfaces between the components under the assembly method meet the initial accuracy requirements), it can be applied to the assembly guidance of the physical device.

[0146] On the other hand, the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the device construction method, assembly database construction method, or device design method described in any embodiment of the present application.

[0147] On the other hand, the present application, referring to FIG5 , provides a computing device including a memory 112 and a processor 111, wherein the memory 112 stores a computer program, and when the processor 111 executes the computer program, it implements the device construction method, assembly database construction method, or device design method described in any embodiment of the present application.

[0148] On the other hand, the present application further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the device construction method, assembly database construction method, or device design method described in any embodiment of the present application, and can achieve the same technical effect. To avoid repetition, the details are not repeated here. The computer-readable storage medium is, for example, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0149] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0150] Through the description of the above embodiments, those skilled in the art can clearly understand that the above embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better embodiment. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), including a number of instructions for enabling a terminal (which can be a mobile phone, computer, server, gateway, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0151] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A method for constructing a device, characterized in that: include: Based on the assembly path of the device, the device is decomposed into a plurality of combined assembly relationships in a set order; wherein each combined assembly relationship is used to represent the connection relationship between the first target part and the second target part; According to each combination and assembly relationship, an intermediate configuration of the device is formed, and based on the stimulus and response data for the intermediate configuration, a quantitative model of the intermediate configuration corresponding to the combination and assembly relationship is established; The quantitative models corresponding to the intermediate configurations are combined to form a model of the device.

2. The method for constructing the device according to claim 1, characterized in that: The device-based assembly path decomposes the device into a combination assembly relationship in a set order, including: Based on the assembly path of the equipment, obtaining the components included in the equipment and the assembly order between the components; According to the order of the assembly sequence, a combined assembly relationship is formed between each two adjacent components, with the preceding component and its preceding component as a first target component and the succeeding component as a second target component, thereby obtaining a combined assembly relationship in a set order after the equipment is disassembled.

3. The method for constructing the device according to claim 2, wherein: The step of establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship based on the excitation and response data for the intermediate configuration includes: Determining the assembly type corresponding to the combined assembly relationship according to the contact type of the joint surfaces between two adjacent components; If the assembly type is a moving contact type, based on the excitation and response data collected for the intermediate configuration during the motion cycle in which the first target part and the second target part maintain relative movement in the corresponding combined assembly relationship, a quantitative model of the intermediate configuration corresponding to the combined assembly relationship is established.

4. The method for constructing the device according to claim 2, wherein: The step of establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship based on the excitation and response data for the intermediate configuration includes: Determining the assembly type corresponding to the combined assembly relationship according to the contact type of the joint surfaces between two adjacent components; If the assembly type is a fixed contact type, based on the excitation and response data collected for the intermediate configuration under the pre-tightening state of different sizes maintained between the first target part and the second target part in the corresponding combined assembly relationship, a quantitative model of the intermediate configuration corresponding to the combined assembly relationship is established.

5. The method for constructing the device according to claim 2, wherein: The step of establishing a quantitative model of the intermediate configuration corresponding to the combined assembly relationship based on the excitation and response data for the intermediate configuration includes: Determining the assembly type corresponding to the combined assembly relationship according to the contact type of the joint surfaces between two adjacent components; If the assembly type is a detachable fixed contact type, a quantitative model of the intermediate configuration corresponding to the combined assembly relationship is established based on the excitation and response data collected for the intermediate configuration between the first target part and the second target part in the corresponding combined assembly relationship in the installed state and the disassembled state respectively.

6. The method for constructing the device according to any one of claims 1 to 5, characterized in that: The step of forming an intermediate configuration of the device according to each combination assembly relationship and establishing a quantitative model of the intermediate configuration corresponding to the combination assembly relationship based on stimulus and response data for the intermediate configuration includes: According to each combined assembly relationship, an intermediate configuration of the device corresponding to the combined assembly relationship is established by using a corresponding response output signal obtained after a single excitation input signal; Inputting an excitation input signal to the intermediate configuration at preset time intervals and collecting corresponding response output signals respectively; or inputting a continuous excitation input signal to the intermediate configuration and collecting corresponding response output signals at preset time intervals; According to the corresponding excitation input signal and the response output signal, a transfer function between the response output signal and the excitation input signal is determined, and a quantitative model of the intermediate configuration corresponding to the combined assembly relationship is obtained according to the transfer function.

7. A method for constructing an assembly database, characterized in that: include: Based on the multiple combined assembly relationships obtained by decomposing the assembly path of the equipment, the intermediate configurations corresponding to the combined assembly relationships are respectively constructed; wherein each combined assembly relationship is used to represent the connection relationship between the first target part and the second target part; Based on the excitation and response data for each of the intermediate configurations, corresponding quantitative models are established respectively; The first target part, the second target part, the corresponding combination assembly relationship, and the quantitative model are synchronized to a database to obtain an assembly database.

8. A method for designing a device, characterized in that: include: Acquire an assembly database obtained by the assembly database construction method according to claim 7; Determining a combined assembly relationship between a first target part and a second target part, and based on an intermediate configuration corresponding to the combined assembly relationship, determining a quantitative model of the intermediate configuration corresponding to the combined assembly relationship from the assembly database; The quantitative model is used to obtain a target evaluation index of the current intermediate configuration, and the intermediate configuration is evaluated according to the target evaluation index to determine whether to proceed to the next step of assembly design.

9. The method for designing a device according to claim 8, wherein: The determining of the combined assembly relationship between the first target part and the second target part, and determining a quantitative model corresponding to the combined assembly relationship from the assembly database based on an intermediate configuration corresponding to the combined assembly relationship, includes: Selecting combination assembly relationships between different types of first target parts and / or different types of second target parts, and determining intermediate configurations corresponding to each of the combination assembly relationships; The quantitative models of the intermediate configurations corresponding to the respective combination assembly relationships are determined from the assembly database, and target combination assembly relationships that meet the requirements are screened based on the quantitative models.

10. The method for designing a device according to claim 8, wherein: Also includes: After all the assembly designs are completed, a model of the device is formed using the quantitative models of the intermediate configurations corresponding to all the combined assembly relationships; An overall evaluation index for the device is obtained based on the model of the device, and the design of the current device is evaluated according to the overall evaluation index.

11. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the method for constructing the device according to any one of claims 1 to 6, the method for constructing the assembly database according to claim 7, or the method for designing the device according to any one of claims 8 to 10 is implemented.

12. A computer device comprising a memory and a processor, characterized in that: The memory stores a computer program, and when the processor executes the computer program, it implements the method for constructing the device according to any one of claims 1 to 6, the method for constructing the assembly database according to claim 7, or the method for designing the device according to any one of claims 8 to 10.

13. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, which, when executed by a processor, implements the method for constructing the device according to any one of claims 1 to 6, the method for constructing the assembly database according to claim 7, or the method for designing the device according to any one of claims 8 to 10.

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