Display device and electronic device

Abstract

This display device comprises: a display panel; a chassis that covers at least one side of the display panel and includes a board mounting part; and a printed circuit board that can be detachably mounted on the chassis. The printed circuit board includes: a coupling part that can be coupled to the board mounting part; and a grounding part that protrudes from one surface of the coupling part. The printed circuit board and the chassis are configured such that, in a state in which the coupling part is coupled to the board mounting part, the grounding part comes into contact with the board mounting part to ground the printed circuit board to the chassis.

Description

Display devices and electronic devices

[0001] The present disclosure relates to a display device and an electronic device including a printed circuit board.

[0002] Display devices are a type of electronic device capable of converting acquired or stored electrical information into visual information and displaying it to users, and are used in various fields such as homes and workplaces.

[0003] For example, the display device may include a monitor device connected to a personal computer or server computer, a portable computer device, a navigation terminal device, a general television device, an Internet Protocol Television (IPTV) device, a portable terminal device such as a smartphone, a tablet PC, a Personal Digital Assistant (PDA), or a cellular phone, various display devices used to play images such as advertisements or movies in industrial settings, or various other types of audio / video systems.

[0004] For example, a display device may include a display panel and a bottom chassis housing the display panel, and various printed circuit boards for controlling the operation of the display device may be installed on the rear of the bottom chassis. Electromagnetic noise may be generated from the printed circuit board during operation, and to avoid the accumulation of such electromagnetic noise, the printed circuit board must be grounded to the bottom chassis.

[0005] One aspect of the present disclosure provides a display device and an electronic device with enhanced electromagnetic susceptibility (EMS).

[0006] One aspect of the present disclosure provides a display device and an electronic device capable of reducing electromagnetic interference (EMI).

[0007] The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs from the description below.

[0008] According to the present disclosure, a display device comprises a display panel, a chassis covering at least one side of the display panel including a board mounting portion, and a printed circuit board detachably mounted on the bottom chassis. The printed circuit board includes a coupling portion connectable to the board mounting portion and a ground portion protruding from one side of the coupling portion. The printed circuit board and the chassis are configured such that, when the coupling portion is connected to the board mounting portion, the ground portion contacts the board mounting portion to ground the printed circuit board to the chassis.

[0009] According to the present disclosure, an electronic device comprises a chassis including a board mounting portion and a printed circuit board detachably mountable to the chassis. The printed circuit board comprises a coupling portion connectable to the board mounting portion and a grounding portion protruding from one side of the coupling portion and comprising a deformable material. The printed circuit board and the board mounting portion are configured such that, with the coupling portion connected to the board mounting portion, the deformable material is pressed and deformed by the board mounting portion, and the board mounting portion contacts the deformable material to ground the printed circuit board to the chassis.

[0010] FIG. 1 illustrates a display device according to one embodiment of the present disclosure.

[0011] FIG. 2 illustrates a disassembled display device according to one embodiment of the present disclosure.

[0012] FIG. 3 illustrates an enlarged view of a portion of the cross-section of a display panel of a display device according to one embodiment of the present disclosure.

[0013] FIG. 4 illustrates a printed circuit board mounted on the rear side of the bottom chassis of a display device according to one embodiment of the present disclosure.

[0014] Figure 5 shows an enlarged view of part A indicated in Figure 4.

[0015] Figure 6 shows an enlarged view of part B indicated in Figure 5.

[0016] FIG. 7 illustrates the state before a printed circuit board is mounted on the bottom chassis of a display device according to one embodiment of the present disclosure.

[0017] Figure 8 shows an enlarged view of part C indicated in Figure 7.

[0018] Figure 9 shows a cross-section along the DD' line indicated in Figure 6.

[0019] FIG. 10 illustrates a cross-section along the EE' line shown in FIG. 8.

[0020] FIG. 11 illustrates, in enlarged detail, deformation of the ground portion while a printed circuit board is mounted on the bottom chassis of a display device according to one embodiment of the present disclosure.

[0021] FIG. 12 illustrates a state in which solder paste is applied to a printed circuit board of a display device according to one embodiment of the present disclosure.

[0022] FIG. 13 illustrates an enlarged cross-section of a portion of a bottom chassis of a display device according to one embodiment of the present disclosure before a printed circuit board is mounted thereon.

[0023] FIG. 14 illustrates an enlarged cross-section of a printed circuit board mounted on the bottom chassis of a display device according to one embodiment of the present disclosure.

[0024] FIG. 15 illustrates a state in which solder paste is applied to a printed circuit board of a display device according to one embodiment of the present disclosure.

[0025] The embodiments described in this specification and the configurations illustrated in the drawings are merely preferred examples of the disclosed invention, and various modifications that may replace the embodiments and drawings of this specification may exist at the time of filing this application.

[0026] Additionally, the same reference numerals or symbols presented in each drawing of this specification represent parts or components that perform substantially the same function.

[0027] Additionally, the singular form of the noun corresponding to the item may include one or multiple items, unless the relevant context clearly indicates otherwise.

[0028] Additionally, in this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0029] Additionally, the terms "part," "module," and "component" may be implemented in hardware or software. Depending on the embodiments, a plurality of "parts," "modules," and "components" may be implemented as a single component, or a single "part," "module," or "component" may include a plurality of components.

[0030] Furthermore, the terms used in this specification are for describing embodiments and are not intended to limit or / or restrict the disclosed invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0031] Additionally, terms including ordinal numbers, such as "first," "second," etc., used herein may be used to describe various components, but said components are not limited by said terms, and said terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and / or" includes a combination of a plurality of related described items or any one of a plurality of related described items.

[0032] Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0033] When it is said that a component is "connected," "combined," "supported," or "in contact" with another component, this includes not only cases where the components are directly connected, combined, supported, or in contact, but also cases where they are indirectly connected, combined, supported, or in contact through a third component.

[0034] When it is said that a component is located "on" another component, this includes not only cases where one component is in contact with the other, but also cases where another component exists between the two components.

[0035] Meanwhile, terms such as "up / down direction" and "front / back direction" used in the following description are defined based on the drawings, and the shape and position of each component are not limited by these terms. For example, the terms "front" and "rear" below may each be defined based on the X direction shown in the drawings. The terms "up" and "down" below may each be defined based on the Z direction shown in the drawings. The terms "left direction" and "right direction" below may be defined based on the Y direction shown in the drawings. The term "vertical direction" below may each refer to the Z direction shown in the drawings, and the term "horizontal direction" below may each refer to the X direction or Y direction shown in the drawings.

[0036] In the following description of various embodiments of the present disclosure, a display device, which is a type of electronic device, has been described as an example for convenience, but the concept of the present disclosure is not limited thereto. The concept of the present disclosure is applicable to various electronic devices including printed circuit boards.

[0037] Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0038] FIG. 1 illustrates a display device according to one embodiment of the present disclosure.

[0039] Referring to FIG. 1, a display device (1) according to one embodiment of the present disclosure is a device capable of processing an image signal received from the outside and visually displaying the processed image. FIG. 1 illustrates the case where the display device (1) is a television (TV), but is not limited thereto. For example, the display device (1) can be implemented in various forms such as a monitor, which is a type of computer output device, a portable multimedia device, a portable communication device, etc., and the form of the display device (1) is not limited as long as it is a device that visually displays an image.

[0040] In addition, the display device (1) may be a large format display (LFD) installed outdoors, such as on a building rooftop or at a bus stop. Here, the outdoor area is not necessarily limited to an open space; the display device (1) according to one embodiment of the present disclosure may be installed in any place where many people can enter and exit, even if it is indoors, such as a subway station, shopping mall, movie theater, company, or store.

[0041] In FIG. 1, the display device (1) is described as a flat display device with a flat screen, but is not limited thereto. A display device according to the concept of the present disclosure may also be applied to a curved display device or a variable (bendable or flexible) display device in which the flat state and the curved state can be varied. Furthermore, the configuration of the present disclosure may be applied to display devices of various shapes regardless of the screen size or aspect ratio of the display device.

[0042] The display device (1) receives content including video signals and audio signals from various content sources and can output video and audio corresponding to the video signals and audio signals. For example, the display device (1) can receive content data through a broadcast receiving antenna or a wired cable, receive content data from a content playback device, or receive content data from a content provider's content provision server.

[0043] The display device (1) can display an image corresponding to video data and output sound corresponding to audio data. For example, the display device (1) can restore multiple image frames included in the video data and continuously display multiple image frames. In addition, the display device (1) can restore an audio signal included in the audio data and continuously output sound according to the audio signal.

[0044] As illustrated in FIG. 1, the display device (1) may include a main body (11) and a screen (12) that displays an image (I).

[0045] The display device (1) may be installed in a standing manner on an indoor or outdoor floor surface or on furniture, or installed in a wall-mounted manner on a wall surface or inside a wall. For example, the display device (1) may include a support leg (19) provided at the bottom of the main body (11) so that it can be installed in a standing manner on an indoor or outdoor floor surface or on furniture.

[0046] The main body (11) can form the external shape of the display device (1). Inside the main body (11), components for the display device (1) to perform various functions, such as displaying an image (I), may be provided.

[0047] The display device (1) may be configured to display an image (I). Specifically, the screen (12) may be formed on the front of the main body (11), and the display device (1) may display the image (I) through the screen (12). For example, the screen (12) may display a still image or a video. Additionally, the screen (12) may display a two-dimensional planar image or a three-dimensional stereoscopic image using the parallax of the user's two eyes.

[0048] Multiple pixels (P) may be formed on the screen (12). An image (I) displayed on the screen (12) may be formed by light emitted by each of the multiple pixels (P). For example, an image (I) may be formed on the screen (12) by combining the light emitted by the multiple pixels (P) as if in a mosaic.

[0049] Each of the plurality of pixels (P) can emit light of various brightness and various colors. Specifically, each of the plurality of pixels (P) may include subpixels (PR, PG, PB), and the subpixels (PR, PG, PB) may include a red subpixel (PR) capable of emitting red light, a green subpixel (PG) capable of emitting green light, and a blue subpixel (PB) capable of emitting blue light. For example, red light may have a wavelength of approximately 620 nm (nanometer, one-billionth of a meter) to 750 nm, green light may have a wavelength of approximately 495 nm to 570 nm, and blue light may have a wavelength of approximately 450 nm to 495 nm.

[0050] Each of the multiple pixels (P) can emit light of various brightness and various colors through a combination of light emitted from the red subpixel (PR), green subpixel (PG), and blue subpixel (PB), respectively.

[0051] FIG. 2 illustrates a disassembled display device according to one embodiment of the present disclosure.

[0052] Referring to FIG. 2, various components for generating an image (I) on a screen (12) may be provided inside the main body (11) of a display device (1) according to one embodiment of the present disclosure.

[0053] For example, the display device (1) may include a display panel (20). The display panel (20) may be provided in the main body (11). The display panel (20) may be provided to display an image (I). The screen (12) described in FIG. 1 may be formed on the front of the display panel (20).

[0054] For example, the display panel (20) may have a roughly rectangular shape. Specifically, the display panel (20) may have a shape in which the length of the horizontal side and the length of the vertical side are different. That is, the display panel (20) may be provided to have a long side and a short side. The display panel (20) may be provided in the shape of a rectangular plate. However, it is not limited thereto, and the display panel (20) may be provided in the shape of a square plate in which the lengths of the long side and the short side are almost equal.

[0055] The display panel (20) can be provided in various sizes. The ratio of the long side to the short side of the display panel (20) is not limited to common cases such as 16:9 or 4:3, but can be provided in any ratio.

[0056] In a display device (1) according to one embodiment of the present disclosure, the display panel (20) may be composed of a panel of a light-emitting display type, such as a liquid crystal display (LCD).

[0057] On one side of the display panel (20), a cable (20a) for transmitting video data to the display panel (20) and a display driver integrated circuit (DDI, 30) (hereinafter referred to as 'driver IC') for processing digital video data and outputting an analog video signal may be provided.

[0058] The cable (20a) can electrically connect the control assembly / power assembly of the printed circuit board (PCB, 110, see FIG. 4) and the driver IC (30), and can also electrically connect the driver IC (30) and the display panel (20). The cable (20a) may include a flexible flat cable or a film cable, etc.

[0059] The driver IC (30) receives image data and power from the control assembly / power assembly of the printed circuit board (110) through the cable (20a) and can transmit image data and driving current to the display panel (20) through the cable (20a).

[0060] Additionally, the cable (20a) and the driver IC (30) can be implemented as a single unit using a film cable, a chip on film (COF), a tape carrier packet (TCP), etc. In other words, the driver IC (30) can be placed on the cable (20a). However, it is not limited thereto, and the driver IC (30) can be placed on the display panel (20).

[0061] A detailed description of the structure of the display panel (20) will be provided later.

[0062] The display device (1) may include a backlight unit (40) arranged to irradiate light toward the display panel (20). The backlight unit (40) may be provided in the main body (11). The backlight unit (40) may be positioned behind the display panel (20) and arranged to irradiate light toward the front where the display panel (20) is located. In detail, the backlight unit (40) may be composed of a surface light source. The display panel (20) may block or allow light emitted from the backlight unit (40) to pass through.

[0063] The backlight unit (40) may include a point light source that emits monochromatic light or white light, and may be configured to refract, reflect, and scatter light to convert the light emitted from the point light source into uniform surface light. The backlight unit (40) may emit uniform surface light toward the front by refracting, reflecting, and scattering the light emitted from the point light source.

[0064] As illustrated in FIG. 2, the backlight unit (40) may include a light source module (41). The light source module (41) may generate and emit light. In detail, the light source module (41) may be configured to emit monochromatic light or white light.

[0065] The light source module (41) may include a plurality of light sources arranged to irradiate light and a light source substrate on which the plurality of light sources are mounted.

[0066] As illustrated in FIG. 2, the backlight unit (40) may include a reflective sheet (42) provided to reflect light. The reflective sheet (42) may reflect light forward or in a direction close to the front.

[0067] For example, a reflective sheet (42) can be attached to the front of the light source module (41). The reflective sheet (42) can be provided in front of the light source module (41).

[0068] For example, the light source module (41) can emit light in various directions in front of the reflective sheet (42). The light emitted from the light source module (41) can be emitted toward the optical member (43) (e.g., a diffuser plate) to be described later, as well as emitted from the light source module (41) toward the reflective sheet (42), and the reflective sheet (42) can reflect the light emitted toward the reflective sheet (42) toward the optical member (43) (e.g., a diffuser plate).

[0069] Alternatively, as light emitted from the light source module (41) passes through various objects such as an optical member (43) (e.g., a diffuser plate and / or an optical sheet), some of it may be reflected from the surface of the optical member (43) (e.g., a diffuser plate and / or an optical sheet), and the reflective sheet (42) can reflect the reflected light back forward for this reason.

[0070] For example, the backlight unit (40) may include an optical member (43). For example, the optical member (43) may include at least one of a diffuser plate and an optical sheet. The optical member (43) may be provided in front of the reflective sheet (42).

[0071] For example, the optical member (43) may include a diffuser plate provided to uniformly diffuse light. The diffuser plate may be provided in front of the light source module (41) and the reflective sheet (42). The diffuser plate may evenly disperse the light emitted from the light source module (41) and then emit it forward.

[0072] For example, the optical member (43) may include an optical sheet provided to further improve the brightness and uniformity of the brightness of the emitted light. The optical sheet may be provided to refract and scatter light emitted from the front of the diffuser plate. For example, the optical sheet may include various types of sheets such as a diffuser sheet, a prism sheet, a reflective polarizing sheet, and a quantum dot sheet.

[0073] The display device (1) may include a display case provided to support various parts of the main body (11) of the display device (1). In other words, various parts of the main body (11) may be accommodated inside the display case. The display case may form the outer shape of the display device (1).

[0074] For example, the display case can support a display panel (20). For example, the display case can support a backlight unit (40). For example, the display case can support a printed circuit board (110).

[0075] For example, the display device (1) may include a top chassis (13). The top chassis (13) may include a top chassis (13) that supports the front or side of the display panel (20). For example, the top chassis (13) may be provided in the shape of a roughly rectangular frame.

[0076] The top chassis (13) can support the front of the display panel (20) by forming a bezel that is positioned to face the front of the display device (1). However, if the display device (1) is a bezel-less type display device with a very narrow or no bezel, the top chassis (13) may be provided to support only the side of the display panel (20). Alternatively, if the bottom chassis (100) supports the side of the display panel (20), the display device (1) may not include the top chassis (13).

[0077] For example, the display device (1) may include a bottom chassis (100). The bottom chassis (100) may cover the rear of the display panel (20). The bottom chassis (100) may be coupled to the rear of the top chassis (13). The bottom chassis (100) may support various components of the display device (1), such as a backlight unit (40) and a printed circuit board (110).

[0078] The bottom chassis (100) may be formed to have a roughly flat plate shape, but is not limited thereto. The bottom chassis (100) may be constructed to include a material with high thermal conductivity to dissipate heat generated from the light source module (41) to the outside. For example, the bottom chassis (100) may be constructed to include a metal material such as aluminum or SUS, or a plastic material such as ABS.

[0079] For example, the display device (1) may include a middle mold. The middle mold may be positioned between the top chassis (13) and the bottom chassis (100). For example, the middle mold may support at least some components of the backlight unit (40).

[0080] For example, the display device (1) may include a rear cover (16). The rear cover (16) is positioned at the rear of the bottom chassis (100) and can cover the bottom chassis (100) and various components (e.g., printed circuit board (110), etc.) mounted at the rear of the bottom chassis (100).

[0081] Meanwhile, unlike as illustrated in FIG. 2, the display case of the display device (1) according to the concept of the present disclosure may not include some components of the top chassis, middle mold, bottom chassis, and rear cover.

[0082] The configuration of the display device (1) described above with reference to FIG. 2 is merely an example for explaining a display device according to the concept of the present disclosure, and the concept of the present disclosure is not limited thereto. A display device according to the concept of the present disclosure may be provided to include various configurations for performing the function of providing an image through a screen.

[0083] FIG. 3 illustrates an enlarged view of a portion of the cross-section of a display panel of a display device according to one embodiment of the present disclosure.

[0084] Referring to FIG. 3, a display panel (20) included in a display device (1) according to one embodiment of the present disclosure may be configured as a Liquid Crystal Display (LCD) panel to block or allow light emitted from a backlight unit (40). By the operation of the display panel (20) blocking or allowing light emitted from the backlight unit (40) to pass, an image (I) may be formed in front of the display panel (20).

[0085] The front surface of the display panel (20) can form the screen (12) of the display device (1) described above. A plurality of pixels (P) may be provided in the display panel (20). Each of the plurality of pixels (P) provided in the display panel (20) can independently block or pass light from the backlight unit (40), and the light passed by the plurality of pixels (P) can form an image (I) displayed on the screen (12).

[0086] For example, as shown in FIG. 3, the display panel (20) may include a first polarizing film (21), a first transparent substrate (22), a pixel electrode (23), a thin-film transistor (24), a liquid crystal layer (25), a common electrode (26), a color filter (27), a second transparent substrate (28), and a second polarizing film (29).

[0087] The first transparent substrate (22) and the second transparent substrate (28) can fix and support a pixel electrode (23), a thin-film transistor (24), a liquid crystal layer (25), a common electrode (26), and a color filter (27). These first and second transparent substrates (22, 28) may be composed of reinforced glass or a transparent resin.

[0088] A first polarizing film (21) and a second polarizing film (29) may be provided on the outer side of the first and second transparent substrates (22, 28).

[0089] The first polarizing film (21) and the second polarizing film (29) can each allow specific light to pass through and block other light. For example, the first polarizing film (21) allows light having a magnetic field vibrating in a first direction to pass through and blocks other light. Additionally, the second polarizing film (29) allows light having a magnetic field vibrating in a second direction to pass through and blocks other light. At this time, the first direction and the second direction may be orthogonal to each other. Accordingly, the polarization direction of the light passed through by the first polarizing film (21) and the vibration direction of the light passed through the second polarizing film (29) may be orthogonal to each other. As a result, light generally cannot pass through the first polarizing film (21) and the second polarizing film (29) simultaneously.

[0090] A color filter (27) may be provided on the inner side of the second transparent substrate (28).

[0091] The color filter (27) may include, for example, a red filter (27R) that passes red light, a green filter (27G) that passes green light, and a blue filter (27G) that passes blue light, and the red filter (27R), the green filter (27G), and the blue filter (27B) may be arranged side by side. The area where the color filter (27) is formed may correspond to the pixel (P) described above. The area where the red filter (27R) is formed may correspond to a red subpixel (PR), the area where the green filter (27G) is formed may correspond to a green subpixel (PG), and the area where the blue filter (27B) is formed may correspond to a blue subpixel (PB).

[0092] A pixel electrode (23) may be provided on the inner side of the first transparent substrate (22), and a common electrode (26) may be provided on the inner side of the second transparent substrate (28).

[0093] The pixel electrode (23) and the common electrode (26) are made of an electrically conductive metal material and can generate an electric field to change the arrangement of liquid crystal molecules (25a) constituting the liquid crystal layer (25) described below.

[0094] The pixel electrode (23) and the common electrode (26) are made of a transparent material and can pass light incident from the outside. For example, the pixel electrode (23) and the common electrode (26) may be made of indium tin oxide (ITO), indium zinc oxide (IZO), silver nanowire (Ag nano wire), carbon nanotube (CNT), graphene, or PEDOT (3,4-ethylenedioxythiophene). A thin film transistor (TFT) (24) may be provided on the inner side of the second transparent substrate (22).

[0095] The thin-film transistor (24) can pass or block the current flowing through the pixel electrode (23). For example, depending on the turn-on (closed) or turn-off (open) of the thin-film transistor (24), an electric field can be formed or removed between the pixel electrode (23) and the common electrode (26).

[0096] The thin film transistor (24) can be made of polysilicon and can be formed by semiconductor processes such as lithography, deposition, and ion implantation.

[0097] A liquid crystal layer (25) may be formed between the pixel electrode (23) and the common electrode (26). The liquid crystal layer (25) may be filled with liquid crystal molecules (25a).

[0098] Liquid crystals represent an intermediate state between solids (crystals) and liquids. Most liquid crystal materials are organic compounds with molecular shapes resembling long, slender rods; while the arrangement of molecules appears irregular in some directions, it can take on a regular crystalline form in others. As a result, liquid crystals can possess both the fluidity of liquids and the optical anisotropy of crystals (solids).

[0099] Additionally, the liquid crystal can exhibit optical properties depending on changes in the electric field. For example, the direction of the molecular arrangement constituting the liquid crystal can change depending on changes in the electric field. When an electric field is generated in the liquid crystal layer (25), the liquid crystal molecules (25a) of the liquid crystal layer (25) can be arranged according to the direction of the electric field, and when no electric field is generated in the liquid crystal layer (25), the liquid crystal molecules (25a) can be arranged irregularly or along an alignment layer (not shown). As a result, the optical properties of the liquid crystal layer (25) can vary depending on the presence or absence of an electric field passing through the liquid crystal layer (25).

[0100] The structure of the display panel (20) described above with reference to FIG. 3 is merely an example of a structure that a display panel of a display device according to the concept of the present disclosure may have, and the concept of the present disclosure is not limited thereto.

[0101] FIG. 4 illustrates a printed circuit board mounted on the rear side of a bottom chassis of a display device according to one embodiment of the present disclosure. FIG. 5 illustrates an enlarged view of section A indicated in FIG. 4. FIG. 6 illustrates an enlarged view of section B indicated in FIG. 5. FIG. 7 illustrates the state before the printed circuit board is mounted on the bottom chassis of a display device according to one embodiment of the present disclosure. FIG. 8 illustrates an enlarged view of section C indicated in FIG. 7. FIG. 9 illustrates a cross-section along the line DD' indicated in FIG. 6. FIG. 10 illustrates a cross-section along the line EE' indicated in FIG. 8. FIG. 11 illustrates an enlarged view of the deformation of the ground portion while the printed circuit board is mounted on the bottom chassis of a display device according to one embodiment of the present disclosure.

[0102] Referring to FIGS. 4 through 11, a display device (1) according to one embodiment of the present disclosure may include a printed circuit board (110) for controlling the operation of a backlight unit (40) and a display panel (20). For example, the printed circuit board (110) may include a control assembly and a power assembly that supplies power to the backlight unit (40) and the display panel (20). The printed circuit board (110) may be placed on a second side opposite to a first side of a bottom chassis (100) on which the display panel (20) is placed.

[0103] For example, the control assembly of the printed circuit board (110) may include a control circuit that controls the operation of the display panel (20) and the backlight unit (40). The control circuit may process image data received from an external content source, transmit image data to the display panel (20), and transmit dimming data to the backlight unit (40).

[0104] For example, the power assembly of the printed circuit board (110) can supply power to the display panel (20) and the backlight unit (40) so that the backlight unit (40) outputs surface light and the display panel (20) blocks or passes the light of the backlight unit (40).

[0105] The control assembly and power assembly of the printed circuit board (110) can be implemented with various circuits. For example, the power circuit may include a capacitor, a coil, a resistor element, a processor, etc., and a power circuit board on which these are mounted. In addition, the control circuit may include a memory, a processor, and a control circuit board on which these are mounted.

[0106] For convenience of explanation, FIG. 4 shows that one printed circuit board (110) is mounted on the bottom chassis (100), but two or more printed circuit boards (110) may be mounted on the bottom chassis (100).

[0107] A printed circuit board (110) according to one embodiment of the present disclosure may be detachably mounted to a bottom chassis (100). For example, the printed circuit board (110) may be mounted to the bottom chassis (100) in a sliding manner. The printed circuit board (110) may be arranged to be mounted to the bottom chassis (100) as it moves in an extending direction while aligned parallel to the bottom chassis (100) at the rear side of the bottom chassis (100). For example, the printed circuit board (100) may be mounted to the bottom chassis (100) or detached from the bottom chassis (100) by moving in a left-right direction relative to the bottom chassis (100). The bottom chassis (100) and the printed circuit board (110) may be configured so that the printed circuit board (110) is mounted to the bottom chassis (100) without fastening members such as screws.

[0108] The bottom chassis (100) may include a board mounting portion (101) for mounting a printed circuit board (110). The board mounting portion (101) may protrude from the rear of the bottom chassis (100). The board mounting portion (101) may be provided to secure at least one part of the printed circuit board (110). The board mounting portion (101) may be provided to be grounded to at least one part of the printed circuit board (110). The board mounting portion (101) may be connected to a coupling portion (111) of the printed circuit board (110). The board mounting portion (101) may be grounded to a coupling portion (111) of the printed circuit board (110). In FIG. 5, four board mounting portions (101) are shown provided, but the number of board mounting portions (101) is not limited thereto and may be three or fewer or five or more.

[0109] The board mounting portion (101) may include a pressure portion (104) provided to press and deform the ground portion (112) of the printed circuit board (110) while the coupling portion (111) of the printed circuit board (110) is coupled to the board mounting portion (101). The pressure portion (104) may be provided at one end of the board mounting portion (101). The pressure portion (104) may be located closer to the rear of the bottom chassis (100) than the opposite end of the one end where the pressure portion (104) of the board mounting portion (101) is provided.

[0110] For example, the board mounting portion (101) may include a first end where the pressure portion (104) is located and a second end opposite to the first end in the direction in which the printed circuit board (110) is mounted to the bottom chassis (100). The second end of the board mounting portion (101) may be extended to protrude from the rear of the bottom chassis (100). The first end of the board mounting portion (101) may be positioned closer to the rear of the bottom chassis (100) than the second end of the board mounting portion (101) so as to press the printed circuit board (110) in a direction that presses it against the bottom chassis (100). The second end of the board mounting portion (101) may be positioned further from the rear of the bottom chassis (100) than the first end where the pressure portion (104) of the board mounting portion (101) is provided. The board mounting portion (101) may be provided to be inclined from the first end to the second end.

[0111] Referring to FIGS. 9 through 11, the board mounting portion (101) may form a mounting space (103) into which at least a portion of the printed circuit board (110) can be inserted. The mounting space (103) may be formed so that the insertion portion (111) of the printed circuit board (110) can be inserted. As the coupling portion (111) of the printed circuit board (110) is inserted into the mounting space (103), the printed circuit board (110) can be mounted on the bottom chassis (100). For example, the board mounting portion (101) may be provided to form a portion that opens in the direction in which the printed circuit board (110) extends. For example, the board mounting portion (101) may include a portion that opens toward one side according to the left and right directions so that the coupling portion (111) of the printed circuit board (110) can be inserted.

[0112] The bottom chassis (100) may include a mounting guide (102) for guiding the mounting of a printed circuit board (110). The mounting guide (102) may be provided at one end of the board mounting portion (101). The mounting guide (102) may extend in a direction different from the direction in which the board mounting portion (101) extends from the pressure portion (104). The mounting guide (102) may guide the printed circuit board (110) so that the printed circuit board (110) slides into the mounting space (103) when the printed circuit board (110) is mounted on the bottom chassis (100). For example, the mounting guide (102) may include an inclined surface that slopes in a direction that becomes closer to the mounting space (103) as the printed circuit board (110) is inserted into the board mounting portion (101). The mounting guide (102) may extend in a direction different from the board mounting portion (101).

[0113] A printed circuit board (110) may include a coupling portion (111) for mounting to a bottom chassis (100). The coupling portion (111) may be provided in a number corresponding to the number of board mounting portions (101). For example, referring to FIG. 5, as four board mounting portions (101) are provided for one printed circuit board (110), the printed circuit board (110) may include four coupling portions (111). The coupling portion (111) may be inserted into and fixed in a mounting space (103) formed by the board mounting portion (101) of the bottom chassis (100).

[0114] The printed circuit board (110) may include a grounding portion (112) for increasing the grounding area with the bottom chassis (100). The grounding portion (112) may be provided in the coupling portion (111). The grounding portion (112) may be provided on the surface in contact with the board mounting portion (101) when the coupling portion (111) is coupled to the board mounting portion (101). The grounding portion (112) may protrude from one side of the coupling portion (111).

[0115] The grounding portion (112) may include a plurality of protrusions (112a). For example, the grounding portion (112) may be provided such that the plurality of protrusions (112a) are arranged in a grid pattern. For example, the grounding portion (112) may be provided in an embossed shape on one side of the coupling portion (111). The number and / or shape of the plurality of protrusions (112a) of the grounding portion (112) are not limited to those shown in FIG. 8 and may be provided in various ways. For example, the plurality of protrusions (112a) of the grounding portion (112) may be provided in the same size.

[0116] The ground portion (112) may include a deformable material when pressed by the bottom chassis (100). The ground portion (112) may include a deformable material when pressed by the board mounting portion (101). The ground portion (112) of the printed circuit board (110) may include a material that is more flexible than the bottom chassis (100). The ground portion (112) may include a material that is more flexible than the board mounting portion (101). The ground portion (112) may include a material with lower strength than the bottom chassis (100).

[0117] The ground portion (112) of the printed circuit board (110) may include a material different from the bonding portion (111) of the printed circuit board (110). The ground portion (112) may include a material that is more flexible than the bonding portion (111). The ground portion (112) may include a material that has lower strength than the bonding portion (111). For example, the ground portion (112) may include lead. For example, the ground portion (112) may be formed during a soldering process on the printed circuit board (110). For example, the ground portion (112) may be formed by soldering to the bonding portion (111) of the printed circuit board (110). Accordingly, the display device (1) according to one embodiment of the present disclosure has a process advantage as it does not require an additional process to form the ground portion (112).

[0118] The printed circuit board (110) may include a passage (113) through which the board mounting portion (101) of the bottom chassis (100) can pass. The board mounting portion (101) may be inserted into the passage (113). The passage (113) may be formed by penetrating the printed circuit board (110). With the board mounting portion (101) passing through the passage (113), the coupling portion (111) may slide into the mounting space (103) and be inserted.

[0119] The bottom chassis (100) and the printed circuit board (110) may be configured such that when the board mounting portion (101) is inserted into the pass portion (113), the printed circuit board (110) slides relative to the bottom chassis (100), and the coupling portion (111) is received in the mounting space (103) formed by the board mounting portion (101).

[0120] In a display device (1) according to one embodiment of the present disclosure, as the area where the printed circuit board (110) and the bottom chassis (100) are grounded by the grounding portion (112) increases, when static electricity is applied to the printed circuit board (110), it can be discharged quickly, thereby improving electromagnetic susceptibility (EMS), and accordingly, the lifespan of the display device (1) can be increased. In addition, since the display device (1) according to one embodiment of the present disclosure can improve EMS by the grounding portion (112), the use of additional components for EMS improvement can be minimized, and thus, manufacturing costs can be reduced.

[0121] In a display device (1) according to one embodiment of the present disclosure, electromagnetic interference (EMI) can be reduced as the area where the printed circuit board (110) and the bottom chassis (100) are grounded by the grounding portion (112) is increased. In addition, since the display device (1) according to one embodiment of the present disclosure can reduce EMI by the grounding portion (112), the use of additional components for EMI reduction can be minimized, and thus, manufacturing costs can be reduced.

[0122] FIG. 12 illustrates a state in which solder paste is applied to a printed circuit board of a display device according to one embodiment of the present disclosure.

[0123] Referring to FIG. 12, a display device (1) according to one embodiment of the present disclosure may apply solder paste (120) in the same size on a solder mask (119) of a printed circuit board (110) in order to form a plurality of protrusions (112a) of ground portions (112) in the same size on a printed circuit board (110). The solder paste (120) may be applied in the same amount on the solder mask (119) of the printed circuit board (110). A marking portion (119a) for the solder paste (120) may be provided on the solder mask (119). For example, the solder paste (120) may be applied onto the solder mask (119) through a hole in the metal mask while the metal mask is placed on the printed circuit board (110). By forming the hole in the metal mask in the same size, the solder paste (120) can be applied in the same size on the solder mask (119). The solder paste (120) applied on the solder mask (119) can form a plurality of protrusions (112a) of the ground portion (112) as it is heated. For example, the solder paste (120) may be in the form of a paste made by mixing lead and flux particles.

[0124] FIG. 13 illustrates an enlarged cross-sectional view of a portion of a bottom chassis of a display device according to one embodiment of the present disclosure before a printed circuit board is mounted thereon. FIG. 14 illustrates an enlarged cross-sectional view of a portion of a bottom chassis of a display device according to one embodiment of the present disclosure with a printed circuit board mounted thereon. FIG. 15 illustrates a state in which solder paste is applied to a printed circuit board of a display device according to one embodiment of the present disclosure.

[0125] With reference to FIGS. 13 to 15, a grounding portion (212) of a display device (1) according to one embodiment of the present disclosure will be described. In describing the grounding portion (212) shown in FIGS. 13 to 15, the same reference numerals are assigned to components identical to those of the display device (1) shown in FIGS. 1 to 12, and detailed descriptions may be omitted.

[0126] Referring to FIG. 13 and FIG. 14, a grounding portion (212) according to one embodiment of the present disclosure may include a plurality of protrusions (212a, 212b) having different sizes. The plurality of protrusions (212a, 212b) of the grounding portion (212) may be arranged so that their size increases as they move further away from the pressing portion (104) when the coupling portion (111) is coupled to the board mounting portion (101).

[0127] For example, the grounding portion (212) may include a first protrusion (212a) that is pressed by a pressing portion (104) when the coupling portion (111) is coupled to the board mounting portion (101), and a second protrusion (212b) that is spaced apart from the first protrusion (212a) in the direction in which the printed circuit board (110) is mounted to the bottom chassis (100) and has a larger size than the first protrusion (212a).

[0128] Referring to FIG. 15, a display device (1) according to one embodiment of the present disclosure may apply solder paste (220) in different sizes on a solder mask (119) of a printed circuit board (110) in order to form a plurality of protrusions (212a, 212b) of ground portions (212) in different sizes on the printed circuit board (110). The solder paste (220) may be applied in different amounts on the solder mask (119) of the printed circuit board (110). A marking portion (119a) for the solder paste (120) may be provided on the solder mask (119). For example, the solder paste (220) may be applied on the solder mask (119) through a hole in the metal mask while the metal mask is placed on the printed circuit board (110). By forming the hole in the metal mask in different sizes, the solder paste (220) may be applied in different sizes on the solder mask (119). The solder paste (220) applied on the solder mask (119) can form a plurality of protrusions (212a, 212b) of the ground portion (212) as it is heated. For example, the solder paste (220) may be in the form of a paste made by mixing lead and flux particles.

[0129] Referring to FIG. 12 and FIG. 15, a display device (1) according to one embodiment of the present disclosure can adjust the amount of solder paste (120, 220) applied by adjusting the size of the holes in the metal mask without changing the solder mask (119) of the printed circuit board (110), and accordingly, the size of the ground portion (112, 212) can be adjusted.

[0130] A display device according to one embodiment comprises a display panel, a chassis covering at least one side of the display panel including a board mounting portion, and a printed circuit board detachably mounted on the bottom chassis. The printed circuit board includes a coupling portion connectable to the board mounting portion and a ground portion protruding from one side of the coupling portion. The printed circuit board and the chassis are configured such that, when the coupling portion is connected to the board mounting portion, the ground portion contacts the board mounting portion to ground the printed circuit board to the chassis.

[0131] The grounding portion may include a material configured such that, while the coupling portion is coupled to the board mounting portion, the board mounting portion presses and deforms the material.

[0132] The board mounting portion may include a pressure portion configured to apply pressure and deform the material while the coupling portion is coupled to the board mounting portion.

[0133] The grounding portion may include a first protrusion and a second protrusion that is spaced apart from the first protrusion in the direction in which the printed circuit board is mounted on the bottom chassis and has a larger size than the first protrusion. The grounding portion and the board mounting portion may be configured such that, as the coupling portion is coupled to the board mounting portion, the pressing portion presses the second protrusion and presses the first protrusion.

[0134] The board mounting portion may include a first end comprising the pressing portion and a second end opposite to the first end. The second end may protrude from the rear of the chassis. The first end is configured such that the printed circuit board is pressed toward the chassis by the first end while the coupling portion is coupled to the board mounting portion, and may be closer to the rear of the chassis than the second end.

[0135] The board mounting portion may include a mounting guide extending from the pressurizing portion in a direction away from the rear of the chassis. The mounting guide may be configured so that the movement of the coupling portion is guided by the mounting guide as the coupling portion is coupled to the board mounting portion.

[0136] The grounding portion may include a first protrusion and a second protrusion spaced apart from the first protrusion. The size of the first protrusion may be the same as the size of the second protrusion.

[0137] The above grounding portion may include a plurality of protrusions arranged in a grid pattern.

[0138] The above grounding portion may include a material that is more flexible than the material of the board mounting portion.

[0139] The above grounding part may include lead.

[0140] The above ground portion can be soldered to the above joint portion.

[0141] The printed circuit board may include a passage through which the board mounting portion can pass. The board mounting portion may include a mounting space capable of accommodating at least one part of the coupling portion. The chassis and the printed circuit board may be configured such that, when the board mounting portion passes through the passage through and the printed circuit board slides relative to the chassis toward the board mounting portion, a part of the coupling portion is accommodated in the mounting space.

[0142] The above board mounting portion may include a portion that is open in the direction in which the printed circuit board extends.

[0143] The display panel may be on a first side of the chassis. The printed circuit board may be on a second side of the chassis opposite to the first side.

[0144] An electronic device according to one embodiment includes a chassis comprising a board mounting portion and a printed circuit board detachably mountable to the chassis. The printed circuit board includes a coupling portion coupled to the board mounting portion and a grounding portion comprising a deformable material protruding from one side of the coupling portion. The printed circuit board and the board mounting portion are configured such that, when the coupling portion is coupled to the board mounting portion, the deformable material is pressed and deformed by the board mounting portion, and the board mounting portion contacts the deformable material to ground the printed circuit board to the chassis.

[0145] The above ground portion may include a first protrusion and a second protrusion spaced apart from the first protrusion and provided with the same size as the first protrusion.

[0146] The grounding portion may include a first protrusion that is pressed by the board mounting portion when the coupling portion is coupled to the board mounting portion, and a second protrusion that is spaced apart from the first protrusion in the direction in which the printed circuit board is mounted on the bottom chassis and has a larger size than the first protrusion.

[0147] The board mounting portion may include a pressing portion provided to press the coupling portion in a direction in which the printed circuit board adheres to the bottom chassis. The board mounting portion may include a first end where the pressing portion is located and a second end opposite to the first end in the direction in which the printed circuit board is mounted to the bottom chassis. The second end may be extended to protrude from the rear of the bottom chassis. The first end may be provided to be located closer to the rear of the bottom chassis than the second end so as to press the printed circuit board in a direction in which it adheres to the bottom chassis.

[0148] The above grounding part may include lead.

[0149] The bottom chassis may include a mounting guide provided at one end of the board mounting portion to guide the mounting of the coupling portion.

[0150] According to the concept of the present disclosure, the electromagnetic susceptibility (EMS) of the display device and electronic device can be improved because a ground portion is provided on the printed circuit board.

[0151] According to the concept of the present disclosure, the display device and the electronic device can reduce electromagnetic interference (EMI) because a ground portion is provided on the printed circuit board.

[0152] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0153] Specific embodiments have been illustrated and described above. However, the invention is not limited to the embodiments described above, and those skilled in the art may make various modifications without departing from the essence of the technical concept of the invention as described in the following claims.

Claims

1. Display panel; A chassis covering at least one side of the above-mentioned display panel, comprising a board mounting portion; and A printed circuit board detachably mountable to the bottom chassis; comprising The above printed circuit board is, A coupling part capable of being coupled to the board mounting part above; and A grounding portion protruding from one side of the above-mentioned coupling portion; is included, A display device comprising the above printed circuit board and the above chassis, wherein the grounding portion contacts the board mounting portion to ground the printed circuit board to the chassis while the coupling portion is coupled to the board mounting portion.

2. In Paragraph 1, A display device comprising a material in which the above ground portion is configured such that, while the above coupling portion is coupled to the above board mounting portion, the board mounting portion presses and deforms the material.

3. In Paragraph 2, A display device comprising a pressure member configured such that, while the board mounting member is coupled to the board mounting member, the pressure member applies pressure to the material and deforms it.

4. In Paragraph 3, The above grounding part is, First protrusion; and The above-mentioned printed circuit board is spaced apart from the first protrusion in the direction in which it is mounted on the bottom chassis, and includes a second protrusion having a larger size than the first protrusion. A display device configured such that the grounding portion and the board mounting portion are coupled to the board mounting portion, and the pressing portion presses the second protrusion and the first protrusion.

5. In Paragraph 3, The above board mounting part is, A first end including the above-mentioned pressurizing part; and It includes a second end opposite to the first end; and The second end portion protrudes from the rear of the chassis, and A display device in which the first end is configured such that the printed circuit board is pressed toward the chassis by the first end while the coupling portion is coupled to the board mounting portion, and is closer to the rear of the chassis than the second end.

6. In Paragraph 3, A display device comprising a board mounting portion including a mounting guide extending from the pressurizing portion in a direction away from the rear of the chassis, wherein the mounting guide is configured such that the movement of the coupling portion is guided by the mounting guide as the coupling portion is coupled to the board mounting portion.

7. In Paragraph 1, The above grounding part is, First protrusion; and It includes a second protrusion spaced apart from the first protrusion; and A display device in which the size of the first protrusion is the same as the size of the second protrusion.

8. In Paragraph 1, The above ground portion is a display device comprising a plurality of protrusions arranged in a grid pattern.

9. In Paragraph 1, A display device comprising a ground portion that is more flexible than the material of the board mounting portion.

10. In Paragraph 1, The above ground portion is a display device containing lead.

11. In Paragraph 1, The above ground portion is a display device soldered to the above joint portion.

12. In Paragraph 1, The above printed circuit board includes a passage through which the board mounting portion can pass, and The board mounting portion includes a mounting space capable of accommodating at least one part of the coupling portion, and A display device comprising the chassis and the printed circuit board, configured such that, in a state where the board mounting portion passes through the passage portion and the printed circuit board slides toward the chassis toward the board mounting portion, a portion of the coupling portion is received in the mounting space.

13. In Paragraph 1, A display device comprising a board mounting portion that is open in the direction in which the printed circuit board extends.

14. In Paragraph 1, The above display panel is located on the first side of the chassis, and The above printed circuit board is a display device located on the second side opposite to the first side of the chassis.

15. A chassis including a board mounting portion; and A printed circuit board detachably mountable to the above chassis; comprising, The above printed circuit board is, A coupling part capable of being coupled to the board mounting part above; and A grounding portion comprising a deformable material protruding from one side of the above-mentioned joint portion; and An electronic device comprising the above printed circuit board and the board mounting portion, wherein, with the coupling portion coupled to the board mounting portion, the deformable material is pressed and deformed by the board mounting portion, and the board mounting portion is configured to contact the deformable material so as to ground the printed circuit board to the chassis.

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