Copper foil substrate for flexible printed circuit boards

A technology of copper foil substrate and flexible printing, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc., and can solve problems such as complicated production procedures, easy-to-interpret circuit design distribution, and influence on product market sales and company operations. , to achieve the effect of high heat dissipation, high brightness and heat dissipation

CN102950835BActive Publication Date: 2015-07-01KUSN APLUS TEC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2015-07-01

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Abstract

The invention discloses a copper foil substrate for flexible printed circuit boards. The copper foil substrate comprises a first copper foil, a polyimide layer and a second copper foil, wherein the polyimide layer is positioned between the first copper foil and the second copper, the thickness of the polyimide layer ranges from 7 micrometers to 150 micrometers, a first reflective layer is arranged between the second copper foil and the polyimide layer, or further, a second reflective layer is arranged between the first copper foil and the polyimide layer. The copper foil substrate with small thickness and low lightness can be obtained by adjusting the thickness of the polyimide layer, and the lightness of the copper foil substrate can be changed by adjusting content of additives contained in the first reflective layer and the second reflective layer. In addition, compared with the conventional copper foil substrate, the copper foil substrate has the advantages of higher lightness and higher heat dissipation, and meets requirements on white shielding or heat dissipation for flexible copper foil circuit substrates of electronic products.
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Description

technical field

[0001] The invention relates to a copper foil substrate, in particular to a copper foil substrate used for a flexible printed circuit board. Background technique

[0002] At present, electronic systems are developing in the direction of lightness, thinness, high heat resistance, multi-functionality, high density, high reliability, and low cost. Therefore, the selection of substrates has become a very important factor. A good substrate must have material properties of high thermal conductivity, high color shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Polyimide resin has high thermal stability and excellent heat dissipation, mechanical strength, and adhesiveness, and is often used in various electronic materials, such as flexible printed circuit boards (Flexible Printed Circuit).

[0003] Polyimide resin has been widely used in electronic materials, among which, the polyimide copper foil substrate used fo...

Examples

Embodiment 1

[0025] Example 1: figure 1 Shown is the copper foil substrate 100 for a flexible printed circuit board according to Embodiment 1 of the present invention, which is presented in the form of a double panel. The copper foil substrate 100 is provided with a first copper foil 101a, a polyimide layer 102, a second A reflective layer 103 and a second copper foil 101b.

[0026] The first copper foil 101a and the second copper foil 101b in this example can be electrolytic copper foil or rolled copper foil, and generally, the thicknesses of the first copper foil 101a and the second copper foil 101b can be between 9 and 35 microns, and the thickness difference between the first copper foil and the second copper foil is less than 26 microns.

[0027] In order to reduce the light transmittance and incomplete heat dissipation of the flexible circuit boards produced, the copper foil substrate of the present invention obtains a thinner but more flexible circuit board by adjusting the thickne...

Embodiment 2

[0035] Example 2: figure 2 Shown is the flexible printed circuit board copper foil substrate 200 of the embodiment 2 of the present invention, the copper foil substrate of this example is double-sided copper foil substrate, is provided with first copper foil 201a, polyimide layer 202, the second A reflective layer 203a, a second reflective layer 203b and a second copper foil 201b.

[0036]The difference between this embodiment and the copper foil substrate 100 of Embodiment 1 is that this embodiment further includes a second reflective layer 203 b formed between the first copper foil 201 a and the polyimide layer 202 . The second reflection layer 203b is made of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin and bismaleimide resin. One or more resins from the group consisting of resins, and one or more additives selected from the group consisting of white pigments, titanium dioxide and boron nitride, and the thickness of the second reflecti...