Bio-information sensor and display device having the same

Abstract

A bio-information sensor and a display device having the same are provided, wherein the bio-information sensor comprises a first substrate and a first sensor electrode disposed on the first substrate. A second sensor electrode is disposed on the first substrate at the same distance from the first substrate as the first sensor electrode. The second sensor electrode is separated from the first sensor electrode. A piezoelectric layer is disposed between the first sensor electrode and the second sensor electrode. A second substrate is disposed on the first sensor electrode, the second sensor electrode and the piezoelectric layer.

Description

[0001] This application claims the priority benefit of Korean Patent Application No. 10-2018-0018190 filed on February 14, 2018 in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] Exemplary embodiments of the present invention relate to a bio-information sensor, and more particularly, to a display device having the bio-information sensor. Background Art

[0003] Accurate user authentication has become a necessary procedure to achieve access to personal data or encrypted data in personal devices or in financial transactions.

[0004] User authentication technologies applicable to personal devices include the use of specific biometric information such as fingerprint and iris recognition. Summary of the invention

[0005] An exemplary embodiment of the present invention provides an ultrasonic bio-information sensor including sensor electrodes disposed on the same layer with each other.

[0006] An exemplary embodiment of the present invention provides a display device including a bio-information sensor.

[0007] According to an exemplary embodiment of the present invention, a bio-information sensor includes a first substrate and a first sensor electrode disposed on the first substrate. A second sensor electrode is disposed on the first substrate at the same distance from the first substrate as the first sensor electrode. The second sensor electrode is separated from the first sensor electrode. A piezoelectric layer is disposed between the first sensor electrode and the second sensor electrode. A second substrate is disposed on the first sensor electrode, the second sensor electrode, and the piezoelectric layer.

[0008] In an exemplary embodiment of the present invention, the piezoelectric layer may cover at least a portion of an upper surface of the first sensor electrode and at least a portion of an upper surface of the second sensor electrode.

[0009] In an exemplary embodiment of the present invention, heights of the piezoelectric layer, the first sensor electrode, and the second sensor electrode located over the first substrate may be substantially the same as each other.

[0010] In an exemplary embodiment of the present invention, when pressure is applied in a direction orthogonal to an upper surface of the first substrate, charge transfer may occur between the first sensor electrode and the second sensor electrode in a first direction parallel to the upper surface of the first substrate.

[0011] In an exemplary embodiment of the present invention, the first sensor electrode, the second sensor electrode, and the piezoelectric layer may form an ultrasonic transmitter that generates ultrasonic waves in response to an ultrasonic wave generation signal or may form an ultrasonic receiver that generates a detection signal in response to reflection of the ultrasonic waves.

[0012] In an exemplary embodiment of the present invention, the first sensor electrode may be electrically connected to a common voltage. The second sensor electrode may be electrically connected to a conductive line that transmits an ultrasonic wave generation signal or receives a detection signal.

[0013] In an exemplary embodiment of the present invention, an insulating layer pattern may be disposed between the first sensor electrode, the second sensor electrode, and the piezoelectric layer and the second substrate to at least partially cover the first sensor electrode, the second sensor electrode, and the piezoelectric layer.

[0014] In an exemplary embodiment of the present invention, the third sensor electrode may be disposed on the first substrate at the same distance from the first substrate as the first sensor electrode and separated from the first sensor electrode and the second sensor electrode. The fourth sensor electrode may be disposed on the piezoelectric layer to overlap with the third sensor electrode. The piezoelectric layer may substantially cover the entire upper surface of the third sensor electrode.

[0015] In an exemplary embodiment of the present invention, when pressure is applied in a direction orthogonal to an upper surface of the first substrate facing the second substrate, charge transfer may occur between the first sensor electrode and the second sensor electrode in a direction parallel to the upper surface of the first substrate. When pressure is applied, charge transfer may occur between the third sensor electrode and the fourth sensor electrode in a direction orthogonal to the upper surface of the first substrate.

[0016] According to an exemplary embodiment of the present invention, a display device includes a substrate and a fingerprint sensor array disposed on the substrate. The fingerprint sensor array includes a plurality of fingerprint sensors having an ultrasonic transmitter and an ultrasonic receiver. An insulating layer is disposed on the fingerprint sensor array. A semiconductor element is disposed on the insulating layer. A pixel structure is disposed on the semiconductor element. An encapsulation layer is disposed on the pixel structure. The fingerprint sensor array includes a first sensor electrode disposed on the substrate. A second sensor electrode is disposed on the substrate at the same distance from the substrate as the first sensor electrode. The second sensor electrode is separated from the first sensor electrode. A piezoelectric layer is disposed between the first sensor electrode and the second sensor electrode.

[0017] In an exemplary embodiment of the present invention, the first sensor electrode may be electrically connected to a common voltage. The second sensor electrode may be electrically connected to a conductive line that transmits an ultrasonic wave generation signal or receives a detection signal.

[0018] In an exemplary embodiment of the present invention, the piezoelectric layer may cover at least a portion of an upper surface of the first sensor electrode and at least a portion of an upper surface of the second sensor electrode.

[0019] In an exemplary embodiment of the present invention, a distance between the first sensor electrode and the second sensor electrode may be shorter than a shortest distance between adjacent fingerprint sensors among the plurality of fingerprint sensors.

[0020] In an exemplary embodiment of the present invention, at least one fingerprint sensor among the plurality of fingerprint sensors may be operated as an ultrasonic transmitter to generate ultrasonic waves when transmitting an ultrasonic wave generating signal through the second sensor electrode.

[0021] In an exemplary embodiment of the present invention, at least one fingerprint sensor among the plurality of fingerprint sensors may be operated as an ultrasonic receiver to generate a detection signal when an ultrasonic wave generating signal is not transmitted through the second sensor electrode.

[0022] In an exemplary embodiment of the present invention, the pixel structure may include an organic light-emitting layer. The pixel structure may include a light-emitting region located at a position corresponding to the organic light-emitting layer and a non-light-emitting region adjacent to the light-emitting region. Each of the fingerprint sensors may overlap the non-light-emitting region.

[0023] In an exemplary embodiment of the present invention, the plurality of second fingerprint sensors may have substantially the same configuration as the plurality of fingerprint sensors. The plurality of second fingerprint sensors and the semiconductor element are arranged above the plurality of fingerprint sensors. The plurality of second fingerprint sensors may not overlap with the fingerprint sensor array.

[0024] According to an exemplary embodiment of the present invention, a display device includes a substrate and a semiconductor element disposed on the substrate. A first sensor electrode is disposed on the substrate. A second sensor electrode is disposed on the substrate at the same distance from the substrate as the first sensor electrode. A piezoelectric material is located between the first sensor electrode and the second sensor electrode. A pixel structure is disposed on the semiconductor element. The pixel structure includes a light-emitting area and a non-light-emitting area adjacent to the light-emitting area. An encapsulation layer is disposed on the pixel structure. The first sensor electrode, the second sensor electrode, and the piezoelectric material form a fingerprint sensor.

[0025] In an exemplary embodiment of the present invention, the fingerprint sensor may overlap the non-light emitting area.

[0026] In an exemplary embodiment of the present invention, the first sensor electrode may be electrically connected to a conductive line transmitting a common voltage, and the second sensor electrode may be electrically connected to a conductive line transmitting an ultrasonic wave generation signal or a detection signal.

[0027] According to an exemplary embodiment of the present invention, a bio-information sensor includes a first substrate and a first sensor electrode disposed on the first substrate. A second sensor electrode is disposed on the first substrate at the same distance from the first substrate as the first sensor electrode, wherein the second sensor electrode is separated from the first sensor electrode in a direction parallel to an upper surface of the first substrate facing the first sensor electrode. The piezoelectric layer is in direct contact with at least one surface of the first sensor electrode and at least one surface of the second sensor electrode. The second substrate is disposed on the first sensor electrode, the second sensor electrode, and the piezoelectric layer.

[0028] In an exemplary embodiment of the present invention, the piezoelectric layer may be in direct contact with a side surface of the first sensor electrode and a side surface of the second sensor electrode opposite to the side surface of the first sensor electrode.

[0029] In an exemplary embodiment of the present invention, the piezoelectric layer may cover at least a portion of an upper surface of the first sensor electrode and at least a portion of an upper surface of the second sensor electrode.

[0030] In an exemplary embodiment of the present invention, the piezoelectric layer may be integrally formed on an upper surface of the first sensor electrode and an upper surface of the second sensor electrode.

[0031] In an exemplary embodiment of the present invention, the third sensor electrode may be disposed on the first substrate at the same distance from the first substrate as the first sensor electrode. The third sensor electrode is spaced apart from the first sensor electrode and the second sensor electrode. The fourth sensor electrode is disposed on the piezoelectric layer.

[0032] In an exemplary embodiment of the present invention, the fourth sensor electrode may overlap the third sensor electrode.

[0033] In an exemplary embodiment of the present invention, the third sensor electrode may be disposed on the piezoelectric layer so as not to overlap with the first sensor electrode and the second sensor electrode. The fourth sensor electrode may be disposed on the piezoelectric layer and may be separated from the third sensor electrode. The fourth sensor electrode may not overlap with the first sensor electrode and the second sensor electrode. When pressure is applied in a second direction orthogonal to the upper surface of the first substrate, charge transfer may occur between the first sensor electrode and the third sensor electrode and between the second sensor electrode and the fourth sensor electrode in a first direction parallel to the upper surface of the first substrate.

[0034] In an exemplary embodiment of the present invention, the piezoelectric layer may be disposed between the first substrate and the first and second sensor electrodes. The piezoelectric layer may be in direct contact with a lower surface of each of the first and second sensor electrodes.

[0035] According to an exemplary embodiment of the present invention, a display device includes a first substrate and a biometric information sensor disposed on the first substrate. The biometric information sensor includes a first fingerprint sensor and a second fingerprint sensor separated from the first fingerprint sensor. The first fingerprint sensor includes a first sensor electrode in direct contact with the first substrate and a second sensor electrode in direct contact with the first substrate and separated from the first sensor electrode. The second fingerprint sensor includes a third sensor electrode in direct contact with the first substrate and a fourth sensor electrode in direct contact with the first substrate and separated from the third sensor electrode. A piezoelectric layer is disposed on the first substrate between the first sensor electrode and the second sensor electrode and between the third sensor electrode and the fourth sensor electrode. The second substrate is disposed on the piezoelectric layer.

[0036] In an exemplary embodiment of the present invention, the second sensor electrode may be located at the same distance from the first substrate as the first sensor electrode.

[0037] In an exemplary embodiment of the present invention, the first sensor electrode, the second sensor electrode, and the piezoelectric layer may form an ultrasonic receiver that receives reflections of ultrasonic waves to generate a detection signal.

[0038] In an exemplary embodiment of the present invention, a distance between the first sensor electrode and the second sensor electrode may be shorter than a distance between the first fingerprint sensor and the second fingerprint sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The above and other features of the present invention will become more apparent through detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, in which:

[0040] Figure 1 is a block diagram of a display device according to an exemplary embodiment of the present invention.

[0041] Figure 2 yes Figure 1 A plan view of an example of a fingerprint sensor array included in a display device.

[0042] Figure 3 is along Figure 2 A cross-sectional view taken along section line II'.

[0043] Figures 4 to 8 Each is a cross-sectional view showing an example of a biological information sensor according to an exemplary embodiment of the present invention.

[0044] Fig. 9 is a cross-sectional view showing an example of a bio-information sensor according to an exemplary embodiment of the present invention.

[0045] Fig.10 It is shown Figure 1 A cross-sectional view of an example of a display device.

[0046] Fig.11A , Fig. 11B , Fig. 11C and Fig.11D All show Figure 1 A cross-sectional view of a deformation example of a display device.

[0047] Fig.12 and Fig.13 All show Figure 1 A cross-sectional view of a deformation example of a display device. DETAILED DESCRIPTION

[0048] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In this regard, the exemplary embodiments may have different forms and should not be understood to be limited to the exemplary embodiments of the present invention described herein. Throughout the specification and the accompanying drawings, the same reference numerals may represent the same elements.

[0049] It will be understood that, although the terms "first" and "second" may be used herein to describe various components, these components should not be limited by these terms.

[0050] Figure 1 is a block diagram of a display device according to an exemplary embodiment of the present invention. Figure 2 yes Figure 1 A plan view of an example of a fingerprint sensor array included in a display device.

[0051] Reference Figure 1 and Figure 2 The display device 1 may include a display panel 10, a sensor array SAR, a display driver 20, and a sensor driver 30. In an exemplary embodiment of the present invention, the sensor array SAR may be disposed above or below the display panel 10 (e.g., in a direction orthogonal to the upper surface of the display panel 10), or may be integrated in the display panel 10.

[0052] The display device 1 may be an organic light-emitting display device or a liquid crystal display device. The display device 1 may be a flat display device, a flexible display device, a curved display device, a foldable display device, or a bendable display device. The display device 1 may be a transparent display device, a head-mounted display device, or a wearable display device; however, exemplary embodiments of the present invention are not limited thereto.

[0053] The display panel 10 may include a plurality of scan lines SL1 to SLn and a plurality of data lines DL1 to DLm, and may further include a plurality of pixels PX connected to the scan lines SL1 to SLn and the data lines DL1 to DLm, wherein n and m are integers greater than 1. The pixels PX may be arranged in a matrix form. The plurality of scan lines SL1 to SLn may be arranged at a certain angle to the plurality of data lines DL1 to DLm, and may cross the plurality of data lines DL1 to DLm. For example, the plurality of scan lines SL1 to SLn may be perpendicular to the plurality of data lines DL1 to DLm.

[0054] The type of the display panel 10 is not particularly limited to a specific type of display device. For example, the display panel 10 may be a self-luminous display panel such as an organic light-emitting display panel. Alternatively, the display panel 10 may include a liquid crystal display (LCD) panel, an electrophoretic display (EPD) panel, or an electrowetting display (EWD) panel, etc. When the display panel 10 is a non-luminous display panel, the display device 1 may further include a backlight unit (BLU) for supplying light to the display panel 10.

[0055] In an exemplary embodiment of the present invention, the display panel 10 may include a sensor array SAR including a bio-information sensor 100. For example, a plurality of bio-information sensors 100 may be arranged (e.g., in a matrix configuration) in an area of ​​the sensor array SAR. The bio-information sensor 100 may be operated ultrasonically. In addition, a conductive line (e.g., a conductive pattern) may be connected to the sensor array SAR to transmit an ultrasonic wave generation signal UGS or a detection signal SEN between the bio-information sensor 100 and the sensor driver 30.

[0056] In an exemplary embodiment of the present invention, the bio-information sensor 100 may be arranged in a non-luminous area between pixels PX. As an example, the bio-information sensor 100 may include a plurality of sensors PS. Each sensor PS may be located in a position adjacent to a corresponding pixel PX. For example, the sensor PS may be located between two adjacent pixels PX, the two adjacent pixels PX being at the mutually opposite sides of the sensor PS. As an example, the pixels PX spaced apart from each other may be arranged in rows or columns, and the corresponding rows or columns of the sensor PS may be located between adjacent rows or columns of the pixels PX.

[0057] According to an exemplary embodiment of the present invention, each sensor PS may be a fingerprint sensor, and hereinafter, the sensor PS may be referred to as a fingerprint sensor PS. Each fingerprint sensor PS may be included in a fingerprint sensor array that may be arranged as described in more detail above.

[0058] According to an exemplary embodiment of the present invention, as described in more detail below, the fingerprint sensors PS in the fingerprint sensor array may all be ultrasonic transmitters or ultrasonic receivers.

[0059] The biometric information sensor 100 may be a sensor for detecting and identifying characteristics of a user such as a fingerprint, an iris, a shape of a bone, or a skin. The biometric information sensor 100 may operate ultrasonically. The biometric information sensor 100 may include a fingerprint sensor. Therefore, the biometric information sensor 100 may be interchangeably referred to as a fingerprint sensor 100 herein. As an example, the fingerprint sensor 100 may be an ultrasonic fingerprint sensor. However, this is an example, and the fingerprint sensor 100 may be replaced or applied with a sensor for detecting an iris, skin, or bone (e.g., depending on the object to be detected).

[0060] The display driver 20 may be electrically connected to the display panel 10. The display driver 20 may apply a signal for driving the display panel 10. For example, the display driver 20 may include at least one of a scan driver 22, a data driver 24, and a timing controller 26 for driving the scan driver 22 and the data driver 24. In an exemplary embodiment of the present invention, at least one of the scan driver 22, the data driver 24, and the timing controller 26 may be integrated in one display driver IC (D-IC). However, the arrangement of the driver is not limited thereto. For example, at least one of the scan driver 22, the data driver 24, and the timing controller 26 may be integrated or mounted on the display panel 10.

[0061] The scan driver 22 may apply a scan signal to the scan lines SL1 to SLn based on a first control signal CONT1 provided from the timing controller 26 .

[0062] The data driver 24 may apply a data signal (or a data voltage) to the data lines DL1 to DLm based on the data control signal DCS and the image data RGB provided from the timing controller 26. The data driver 24 may be integrated on a flexible printed circuit board (FPC) attached to (e.g., mounted on) a substrate of the display panel 10. As an example, the data driver 24 may be in direct contact with the substrate of the display panel 10.

[0063] The timing controller 26 may receive an RGB image signal, a vertical synchronization signal, a horizontal synchronization signal, a main clock signal, or a data enable signal from an external graphics controller, and may generate a first control signal CONT1, a data control signal DCS, and image data RGB corresponding to the RGB image signal based on the received signal. The timing controller 26 may provide the first control signal CONT1 to the scan driver 22 and provide the image data RGB and the data control signal DCS to the data driver 24.

[0064] The sensor driver 30 may control the driving of the sensor array SAR. In an exemplary embodiment of the present invention, the sensor driver 30 may output an ultrasonic wave generation signal UGS for generating ultrasonic waves in the fingerprint sensor 100, and may receive a detection signal SEN to detect a fingerprint (or biometric information) of a user. The detection signal SEN may be generated in the fingerprint sensor 100 by utilizing reflected ultrasonic waves. Information detected by the sensor driver 30 may be provided to the timing controller 26 or an external processor so that driving such as user authentication may be performed.

[0065] Reference Figure 2 , the sensor array SAR (eg, fingerprint sensor array) may include a plurality of fingerprint sensors 100. The fingerprint sensors 100 may be arranged in a matrix form. The fingerprint sensors 100 may each include an ultrasonic transmitter and / or an ultrasonic receiver.

[0066] The fingerprint sensor 100 may be operated as at least one of an ultrasonic transmitter for generating ultrasonic waves and an ultrasonic receiver for receiving ultrasonic waves reflected from a specific part of the user's body to generate a detection signal SEN. In an exemplary embodiment of the present invention, some of the fingerprint sensors 100 may be configured as ultrasonic transmitters, and other of the fingerprint sensors 100 may be configured as ultrasonic receivers. In an exemplary embodiment of the present invention, each fingerprint sensor 100 may be variably operated as an ultrasonic transmitter or an ultrasonic receiver according to circumstances.

[0067] The fingerprint sensor 100 can detect the shape of the fingerprint based on a touch, proximity or pressure that can be applied in the first direction DR1. For example, a charge transfer (or electric field) can be generated in the second direction DR2 that is three-dimensionally perpendicular to the first direction DR1 by a touch in the first direction DR1. As an example, the second direction DR2 and a third direction DR3 perpendicular to the second direction DR2 can define a plane, and the upper surface of the display panel 10 can extend along the plane defined by the second direction DR2 and the third direction DR3. The first direction DR1 can be orthogonal to the second direction DR2 and the third direction DR3. As an example, the user's fingertip can contact the display panel 10 along the first direction DR1. For example, it can contact the uppermost surface of the display panel 10. In addition, pressure can be applied to the display panel 10 (for example, applied to the uppermost surface of the display panel 10) by the user's fingertip along the first direction DR1.

[0068] Each fingerprint sensor 100 may include a first sensor electrode 120, a second sensor electrode 140, and a piezoelectric layer 160. The piezoelectric layer 160 may be disposed between the first sensor electrode 120 and the second sensor electrode 140. For example, the piezoelectric layer 160 may be in direct contact with a surface of the first sensor electrode 120 facing the second sensor electrode 140, and the piezoelectric layer 160 may also be in direct contact with a surface of the second sensor electrode 140 facing the first sensor electrode 120.

[0069] The first sensor electrode 120 and the second sensor electrode 140 may be disposed on the same layer (e.g., the same layer located on or at the same distance above the underlying substrate). The first sensor electrode 120 and the second sensor electrode 140 may be formed on the substrate by a single electrode patterning process. For example, the first sensor electrode 120 and the second sensor electrode 140 may include the same conductive material as each other.

[0070] In an exemplary embodiment of the present invention, the first sensor electrode 120 and the second sensor electrode 140 included in one fingerprint sensor 100 may be spaced apart from each other in the second direction DR2. Therefore, charge transfer may occur between the first sensor electrode 120 and the second sensor electrode 140 in the second direction DR2 or in a direction opposite to the second direction DR2. However, the directions and shapes of the first sensor electrode 120 and the second sensor electrode 140 are not limited thereto. For example, the first sensor electrode 120 and the second sensor electrode 140 may be arranged in a third direction DR3 perpendicular to the second direction DR2. As an example, the first sensor electrode 120 may be spaced apart from the second sensor electrode 140 in the third direction DR3, and the piezoelectric layer 160 may be provided between the first sensor electrode 120 and the second sensor electrode 140 spaced apart in the third direction DR3.

[0071] In an exemplary embodiment of the present invention, the first sensor electrode 120 may be connected to a conductive line or conductive pattern (e.g., a conductive line CH11, CH12, CH13, CH21, CH22, or CH23 described in more detail below) that transmits a common voltage VC. For example, the first sensor electrode 120 may provide a reference voltage for electromotive force generation or charge transfer generation. In an exemplary embodiment of the present invention, the common voltage VC may be provided to the cathode electrode of the pixel PX. However, this is an example, and the common voltage VC is not limited thereto. For example, the common voltage VC may be a ground voltage or a DC voltage provided from a separate voltage source.

[0072] The second sensor electrode 140 may be connected to a conductive line (eg, a conductive line CH11 , CH12 , CH13 , CH21 , CH22 , or CH23 ) for transmitting an ultrasonic wave generation signal UGS or a detection signal SEN.

[0073] When the ultrasonic wave generating signal UGS output from the sensor driver 30 is applied to the fingerprint sensor 100 through the second sensor electrode 140, the piezoelectric material (e.g., piezoelectric layer) 160 may vibrate and may generate ultrasonic waves. For example, the piezoelectric layer 160 may include a piezoelectric material. Therefore, the fingerprint sensor 100 may operate as an ultrasonic transmitter.

[0074] In an exemplary embodiment of the present invention, the fingerprint sensor 100 receiving the ultrasonic wave due to the reflection or pressurization of the user's touch (e.g., the pressure applied to the fingerprint sensor 100) can cause charge transfer in the horizontal direction of the substrate (e.g., the horizontal direction of the sensor array SAR). For example, the charge transfer may occur along the second direction DR2 or the third direction DR3. The detection signal SEN may be generated by the electromotive force between the first sensor electrode 120 and the second sensor electrode 140. The detection signal SEN may be provided to the sensor driver 30 through a conductive line (e.g., CH11). Therefore, the fingerprint sensor 100 may operate as an ultrasonic receiver.

[0075] In an exemplary embodiment of the present invention, an amplifier (e.g., amplifier AMP) for amplifying the ultrasonic generation signal UGS and / or the detection signal SEN may be coupled to the conductive lines CH11, CH12, CH13, CH21, CH22, and CH23, respectively, which may improve detection sensitivity.

[0076] In an exemplary embodiment of the present invention, the piezoelectric layer 160 may be disposed between a side wall of the first sensor electrode 120 and a side wall of the second sensor electrode 140 adjacent to the side wall of the first sensor electrode 120. An electrical signal may be converted into mechanical vibration to generate an ultrasonic wave by the piezoelectric layer 160. When the piezoelectric layer 160 receiving the reflection of the ultrasonic wave vibrates, a detection signal SEN may be generated.

[0077] In an exemplary embodiment of the present invention, the fingerprint sensor 100 operating as an ultrasonic transmitter may be activated in a time series manner (e.g., sequentially) according to an output sequence of an ultrasonic generation signal UGS provided to a sensor array SAR arranged in a matrix form. In an exemplary embodiment of the present invention, the ultrasonic generation signal UGS may be provided to the fingerprint sensor 100 operating as an ultrasonic transmitter substantially synchronously, so that a fingerprint detection operation may be performed on the entire sensor array SAR at the same time. In an exemplary embodiment of the present invention, by selectively providing the ultrasonic generation signal UGS to the fingerprint sensor 100 according to the position where a finger touches a specific fingerprint sensor 100, the fingerprint sensor 100 may be selectively activated.

[0078] Since the ultrasonic biometric information sensor such as the fingerprint sensor 100 can include the first sensor electrode 120 and the second sensor electrode 140 formed by a single conductive layer pattern, the sensor array SAR manufacturing process can be simplified and the manufacturing cost can be reduced. In addition, the thinning of the sensor array SAR can be achieved. Therefore, the display panel 10 including the relatively thin sensor array SAR including the fingerprint sensor 100 described herein can be included in a bendable, foldable or curved display device, and such a display device can be manufactured at a relatively low cost.

[0079] Figure 3 is along Figure 2 A cross-sectional view taken along section line II'.

[0080] Reference Figure 2 and Figure 3 , the fingerprint sensors 100A and 100B may each include a first substrate 110 , first sensor electrodes 120A and 120B, second sensor electrodes 140A and 140B, a piezoelectric layer 160 , and a second substrate 190 .

[0081] The fingerprint sensors 100A and 100B can detect characteristics of an object (e.g., a user's finger) approaching or touching the display device 1 along a first direction DR1 perpendicular to the first substrate 110 (e.g., a Z-axis direction that can be a direction orthogonal to the upper surface of the first substrate 110).

[0082] The first substrate 110 may include a transparent plastic material. In an exemplary embodiment of the present invention, the first substrate 110 may include a transparent resin substrate having flexibility. However, this is an example, and the first substrate 110 may be a transparent rigid substrate. In one example, the first substrate 110 may include polyimide.

[0083] The first sensor electrodes 120A and 120B may be patterned and disposed on the first substrate 110. The first sensor electrodes 120A and 120B may be electrically connected to a conductive line transmitting a common voltage VC to operate as a reference electrode for generating an ultrasonic or detection signal SEN. For example, the first sensor electrodes 120A and 120B may be directly connected to a conductive line transmitting a common voltage VC.

[0084] The first sensor electrodes 120A and 120B may be formed by patterning the first conductive member. In an exemplary embodiment of the present invention, the first sensor electrodes 120A and 120B (e.g., the first conductive member) may include a transparent conductive material. For example, the first sensor electrodes 120A and 120B may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. In an exemplary embodiment of the present invention, the first sensor electrodes 120A and 120B may have a metal conductive layer. For example, the first sensor electrodes 120A and 120B may include at least one of molybdenum, silver, titanium, copper, aluminum, and an alloy of at least two of them. For example, the metal conductive layer may include an alloy of titanium and aluminum.

[0085] The second sensor electrodes 140A and 140B may be disposed on the same layer as the first sensor electrodes 120A and 120B on the first substrate 110. For example, the second sensor electrodes 140A and 140B and the first sensor electrodes 120A and 120B may both be in direct contact with the first substrate 110. The second sensor electrodes 140A and 140B and the first sensor electrodes 120A and 120B may be located at the same distance above the first substrate 110 (e.g., along the first direction DR1) from each other. The upper surface and / or lower surface of each of the second sensor electrodes 140A and 140B and the first sensor electrodes 120A and 120B may be aligned with each other. The second sensor electrodes 140A and 140B may be separated from the first sensor electrodes 120A and 120B. For example, the second sensor electrodes 140A and 140B may be separated from the first sensor electrodes 120A and 120B along the second direction DR2 (e.g., the X-axis direction that may be parallel to the upper surface of the first substrate 110). However, this is an example, and the direction in which the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B are arranged to be separated from each other is not limited thereto. For example, the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B may be arranged to be separated from each other in the Y-axis direction (e.g., the third direction DR3), or may be arranged to be separated from each other diagonally in the X-axis direction.

[0086] The second sensor electrodes 140A and 140B may be formed by patterning the second conductive member. In an exemplary embodiment of the present invention, the second sensor electrodes 140A and 140B may include the same material as the first sensor electrodes 120A and 120B. For example, the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B may be formed by a single patterning process of the conductive member.

[0087] A conventional ultrasonic sensor has a structure in which a first sensor electrode and a second sensor electrode are stacked in a first direction DR1 which may be a direction perpendicular to an upper surface of a substrate, and a piezoelectric material is interposed between the first sensor electrode and the second sensor electrode. For example, a conventional ultrasonic sensor may have a structure in which a plurality of conductive pattern layers are sequentially deposited along the first direction DR1, thereby limiting the thinness of the ultrasonic sensor. In addition, a deposition (or patterning) process for depositing a plurality of conductive pattern layers must be performed more than once.

[0088] However, the fingerprint sensors 100A and 100B according to the exemplary embodiment of the present invention may include the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B patterned in the horizontal direction (e.g., in the second direction DR2) on the first substrate 110, and thus the thickness of the fingerprint sensors 100A and 100B may be reduced. Since the fingerprint sensors 100A and 100B are thinned, the fingerprint sensors 100A and 100B may be integrated in the display device 1 and may be applied to a flexible (e.g., or foldable) electronic device. In addition, since the sensor electrodes may be formed by only one conductive patterning process, the manufacturing process may be simplified and the manufacturing cost may be greatly reduced.

[0089] Piezoelectric layer 160 may be disposed between a sidewall of each of first sensor electrodes 120A and 120B and a sidewall of each of second sensor electrodes 140A and 140B adjacent to the sidewall of each of first sensor electrodes 120A and 120B. Piezoelectric layer 160 may contact the sidewalls of first sensor electrodes 120A and 120B and the sidewalls of second sensor electrodes 140A and 140B adjacent to the sidewalls of first sensor electrodes 120A and 120B.

[0090] The piezoelectric layer 160 may include a transparent organic material having piezoelectric properties or a transparent inorganic material having piezoelectric properties. Therefore, the piezoelectric layer 160 may be interchangeably referred to as a piezoelectric material layer herein. As an example, the piezoelectric layer 160 may include a polyvinylidene fluoride (PVDF)-based piezoelectric material as an organic material, or may include a piezoelectric ceramic material as an inorganic material. Examples of piezoelectric ceramic materials may include lead zirconate titanate (PZT), zinc oxide (ZnO), barium titanate (BaTiO3 ) or aluminum nitride (AlN).

[0091] In an exemplary embodiment of the present invention, the piezoelectric layer 160 may be disposed between the first sensor electrode 120A and the second sensor electrode 140A and between the first sensor electrode 120B and the second sensor electrode 140B, respectively, but should not be disposed in areas other than areas located between the first sensor electrode 120A and the second sensor electrode 140A and between the first sensor electrode 120B and the second sensor electrode 140B, respectively. For example, the piezoelectric layer 160 should not be disposed between the fingerprint sensors 100A and 100B. However, this is an example, and the arrangement of the piezoelectric layer 160 is not limited thereto. The insulating layer pattern 180 may be filled between different fingerprint sensors 100A and 100B. In an exemplary embodiment of the present invention, the insulating layer pattern 180 may include an organic insulating layer and an inorganic insulating layer. In an exemplary embodiment of the present invention, the insulating layer pattern 180 may include the same material as that of the piezoelectric material layer 160. In an exemplary embodiment of the present invention, the insulating layer pattern 180 (for example, see Figure 3 ) is formed therein may be a region in a vacuum state without the insulating layer pattern 180. Therefore, the space between the fingerprint sensors 100A and 100B may be an empty space in a vacuum state.

[0092] The first sensor electrodes 120A and 120B, the second sensor electrodes 140A and 140B, and the piezoelectric layer 160 may have substantially the same height as each other. Therefore, the thickness of the fingerprint sensors 100A and 100B may be minimized.

[0093] The height of the first sensor electrodes 120A and 120B and the height of the second sensor electrodes 140A and 140B may be controlled to control the area of ​​the opposing sides of the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B. The oscillation (e.g., ultrasonic transmission) characteristics and ultrasonic reception characteristics may be controlled according to the height of the first sensor electrodes 120A and 120B and the height of the second sensor electrodes 140A and 140B.

[0094] The piezoelectric layer 160 may be formed by a coating process on the first substrate 110 on which the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B are patterned. Thereafter, an annealing process for heating the piezoelectric layer 160 to a high temperature for a predetermined period of time and / or a polling process for applying a high voltage to the piezoelectric layer 160 in a relatively short time may be performed to increase the piezoelectric characteristics of the piezoelectric layer 160.

[0095] The piezoelectric layer 160 may vibrate by an electrical signal to generate ultrasonic waves, or a detection signal SEN may be generated by vibration of the piezoelectric layer 160 due to ultrasonic reflection. For example, charge transfer may be generated in the piezoelectric material layer 160 included in the ultrasonic receiver along the second direction DR2 due to pressure in the first direction DR1, and an electrical signal (e.g., a detection signal SEN) may be generated. Therefore, biometric information such as fingerprints may be detected.

[0096] In an exemplary embodiment of the present invention, the first fingerprint sensor 100A may operate as an ultrasonic transmitter, and the second fingerprint sensor 100B may operate as an ultrasonic receiver; however, the exemplary embodiments of the present invention are not limited thereto. For example, the first fingerprint sensor 100A may operate as an ultrasonic receiver, and the second fingerprint sensor 100B may operate as an ultrasonic transmitter. Figure 3 , the first fingerprint sensor 100A may be an ultrasonic transmitter that generates ultrasonic waves, and the second fingerprint sensor 100B may be an ultrasonic receiver that receives reflected ultrasonic waves. However, this is an example, and the first fingerprint sensor 100A and the second fingerprint sensor 100B may be variable sensors whose ultrasonic wave receiving and transmitting roles are variable. For example, the ultrasonic wave receiving and transmitting roles may be changed according to a signal provided to the second sensor electrodes 140A and 140B or a conductive line connected to the second sensor electrodes 140A and 140B.

[0097] The second substrate 190 may be disposed on the first sensor electrodes 120A and 120B, the second sensor electrodes 140A and 140B, and the piezoelectric layer 160. The second substrate 190 may substantially cover the first sensor electrodes 120A and 120B, the second sensor electrodes 140A and 140B, and the piezoelectric layer 160. In an exemplary embodiment of the present invention, the second substrate 190 may include a transparent resin or glass having flexibility. In an exemplary embodiment of the present invention, the second substrate 190 may be disposed and have its size corresponding to the base substrate (e.g., the first substrate 110) of the display panel 10. As an example, the fingerprint sensors 100A and 100B may be disposed on the lower portion of the display panel 10 (e.g., attached to the lower portion of the display panel).

[0098] According to an exemplary embodiment of the present invention, the second substrate 190 may be an insulating layer. Therefore, the second substrate 190 may be referred to as an insulating layer 190 herein.

[0099] As described above, the fingerprint sensors 100A and 100B according to the exemplary embodiment of the present invention may include the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B arranged in parallel on the same layer through a single conductive member, and thus, the manufacturing process may be simplified and the manufacturing cost may be reduced.

[0100] Furthermore, it is possible to achieve thinning of the fingerprint sensors 100A and 100B included in the display device 1. Therefore, the fingerprint sensors 100A and 100B may be formed integrally with the display panel 10, or may be formed inside the display panel 10.

[0101] Figures 4 to 8 Each is a cross-sectional view showing an example of a biological information sensor according to an exemplary embodiment of the present invention.

[0102] Refer to the following Figures 4 to 8 Can be omitted and refer to above Figures 1 to 3 The components described are substantially the same or similar to the components described above. Figures 4 to 8 The biometric information sensor is described as a fingerprint sensor as an example; however, exemplary embodiments of the present invention are not limited thereto.

[0103] Reference Figures 4 to 8 , the fingerprint sensors 101A, 102A, 103A, 104A, 105A, 101B, 102B, 103B, 104B, and 105B may each include a first substrate 110, first sensor electrodes 120A and 120B, second sensor electrodes 140A and 140B, and a second substrate 190. As described in more detail below, piezoelectric layers 161, 162, 163, 164, and 165 may be included in the fingerprint sensors 101A, 102A, 103A, 104A, 105A, 101B, 102B, 103B, 104B, and 105B, respectively.

[0104] The structure of the fingerprint sensor may be described in more detail below with reference to the fingerprint sensors 101A, 102A, 103A, 104A, and 105A. The fingerprint sensors 101B, 102B, 103B, 104B, and 105B may have substantially the same or similar configurations as the fingerprint sensors 101A, 102A, 103A, 104A, and 105A, respectively.

[0105] The first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B may be disposed in parallel with each other on the same layer above the first substrate 110. For example, each of the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B may be in direct contact with the first substrate 110. As an example, the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B may be spaced apart from the first substrate 110 by the same distance as each other (e.g., in the first direction DR1).

[0106] Reference Figure 4In an exemplary embodiment of the present invention, piezoelectric layer 161 may be disposed between first sensor electrode 120A and second sensor electrode 140A adjacent to first sensor electrode 120A. Piezoelectric layer 161 may cover at least a portion of an upper surface of first sensor electrode 120A and at least a portion of an upper surface of second sensor electrode 140A. For example, a height of piezoelectric layer 161 (e.g., a thickness in first direction DR1) may be higher than a height of first sensor electrode 120A and second sensor electrode 140A. Therefore, a charge transfer effect between first sensor electrode 120A and second sensor electrode 140A may be increased.

[0107] In an exemplary embodiment of the present invention, the piezoelectric material may not be disposed between the fingerprint sensors 101A and 101B, which may eliminate electrical interference between the fingerprint sensors 101A and 101B.

[0108] In an exemplary embodiment of the present invention, the insulating layer pattern 181 may be disposed on the first sensor electrode 120A, the second sensor electrode 140A, and the piezoelectric material layer 161 to flatten the upper portions of the first sensor electrode 120A, the second sensor electrode 140A, and the piezoelectric material layer 161. The second substrate 190 may be disposed (e.g., deposited) on the insulating layer pattern 181. The second substrate 190 may be in direct contact with the insulating layer pattern 181. In an exemplary embodiment of the present invention, the insulating layer pattern 181 may include at least one of an inorganic insulating material and an organic insulating material. In an exemplary embodiment of the present invention, the insulating layer pattern 181 may include the same material as that of the piezoelectric material layer 161.

[0109] Reference Figure 5, the piezoelectric layer 162 may be formed to cover the first sensor electrodes 120A and 120B, the second sensor electrodes 140A and 140B, and at least a portion of the first substrate 110. For example, the piezoelectric layer 162 may be provided on a portion of the first substrate 110 that is not covered by the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B, and may cover the side surfaces and the upper surfaces of the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B. For example, the piezoelectric layer 162 may be formed by spin coating on the first substrate 110 on which the first sensor electrodes 120A and 120B and the second sensor electrodes 140A and 140B are patterned. The distance D1 between the first sensor electrode 120A and the second sensor electrode 140A included in the fingerprint sensor 102A may be shorter than the shortest distance D2 between the fingerprint sensors 102A and 102B adjacent to each other. For example, the shortest distance D2 between the fingerprint sensors 102A and 102B may be set to reduce or eliminate the influence of the vibration or electric effect (e.g., electric field) of the piezoelectric layer 162 on the adjacent fingerprint sensors 102A and 102B. The shortest distance D2 between the adjacent fingerprint sensors 102A and 102B may be the distance between the closest sensor electrodes between the adjacent fingerprint sensors 102A and 102B. For example, the shortest distance D2 may be the straight-line distance between the second sensor electrode 140A of the first fingerprint sensor 102A and the first sensor electrode 120B of the second fingerprint sensor 102B.

[0110] Therefore, by omitting the reference Figure 3 and Figure 4 The patterning process of the piezoelectric layers 160 and 161 and / or the deposition process of the insulating layer patterns 180 and 181 in the fingerprint sensors 100A and 101A described above can form a reference Figure 5 The fingerprint sensor 102A according to the exemplary embodiment of the present invention is described. Therefore, the manufacturing process of the fingerprint sensor 102A can be further simplified.

[0111] In an exemplary embodiment of the present invention, referring to Figure 6, the piezoelectric layer 163 may be formed (e.g., may be integrally formed) on the upper surface of the first sensor electrode 120A and the second sensor electrode 140A. The insulating layer pattern 183 may be disposed between the first sensor electrode 120A and the second sensor electrode 140A and between the adjacent first fingerprint sensors 103A and the second fingerprint sensors 103B. The distance D1 between the first sensor electrode 120A and the second sensor electrode 140A may be shorter than the shortest distance D2 between the adjacent fingerprint sensors 103A and 103B, which may reduce or eliminate the influence of the vibration or electrical effect of the piezoelectric layer 163 on the adjacent fingerprint sensors 103A and 103B. The piezoelectric layer 163 connecting the first sensor electrode 120A and the second sensor electrode 140A of the first fingerprint sensor 103A may have a substantially uniform thickness, and thus the uniformity of ultrasonic detection may be improved.

[0112] In an exemplary embodiment of the present invention, referring to Figure 7 , piezoelectric layer 164 may be formed (eg, may be integrally formed) below lower surfaces of first sensor electrode 120A and second sensor electrode 140A.

[0113] The insulating layer pattern 184 may be disposed between the first sensor electrode 120A and the second sensor electrode 140A, between the first sensor electrode 120B and the second sensor electrode 140B, and between adjacent first fingerprint sensors 104A and second fingerprint sensors 104B. The distance D1 between the first sensor electrode 120A and the second sensor electrode 140A may be shorter than the shortest distance D2 between adjacent fingerprint sensors 104A and 104B, which may reduce or eliminate the influence of vibration or electrical effect of the piezoelectric layer 164 on the adjacent fingerprint sensors 104A and 104B. When the piezoelectric layer 164 connecting the first sensor electrode 120A and the second sensor electrode 140A of the first fingerprint sensor 104A or the piezoelectric layer 164 connecting the first sensor electrode 120B and the second sensor electrode 140B of the second fingerprint sensor 104B has a substantially uniform thickness, the uniformity of ultrasonic detection may be improved.

[0114] According to an exemplary embodiment of the present invention, the insulating layer pattern 184 may be disposed on a side surface of each of the first sensor electrode 120A, the second sensor electrode 140A, the first sensor electrode 120B, and the second sensor electrode 140B. For example, the insulating layer pattern 184 may be disposed between the second substrate 190 and the piezoelectric layer 164. The insulating layer pattern 184 may be in direct contact with a bottom surface of the second substrate 190 facing the first substrate 110, and may be in direct contact with a top surface of the piezoelectric layer 164 facing the second substrate 190.

[0115] In an exemplary embodiment of the present invention, referring to Figure 8 The fingerprint sensor may include a first fingerprint sensor 105A formed in a second direction DR2 along an extension direction of the first substrate 110 (eg, along an upper surface of the first substrate 110 ) and a second fingerprint sensor 105B stacked in a first direction DR1 perpendicular to the second direction DR2 .

[0116] The first fingerprint sensor 105A may include a first sensor electrode 120A and a second sensor electrode 140A disposed in parallel on the first substrate 110, and a piezoelectric layer 165 substantially (e.g., entirely) covering the first sensor electrode 120A and the second sensor electrode 140A. For example, the piezoelectric layer 165 may substantially cover upper surfaces of the first sensor electrode 120A and the second sensor electrode 140A facing the second substrate 190. According to an exemplary embodiment of the present invention, the piezoelectric layer 165 may have a substantially uniform thickness (e.g., in the first direction DR1).

[0117] According to an exemplary embodiment of the present invention, the first insulating layer pattern 185A may be disposed on an upper surface of the first substrate 110 facing the second substrate 190. The first insulating layer pattern 185A may be disposed between the first sensor electrode 120A and the second sensor electrode 140A and may directly contact the side surfaces of the first sensor electrode 120A and the second sensor electrode 140A. As described in more detail below, the first insulating layer pattern 185A may also directly contact the side surface of the third sensor electrode 121B.

[0118] According to an exemplary embodiment of the present invention, the second insulating layer pattern 185B may be disposed on the piezoelectric layer 165. For example, the second insulating layer pattern 185B may be in direct contact with the upper surface of the piezoelectric layer 165 facing the second substrate 190. The second insulating layer pattern 185B may substantially cover the upper surface of the piezoelectric layer 165 facing the second substrate 190. As described in more detail below, the second insulating layer pattern 185B may also be in direct contact with the side surface of the fourth sensor electrode 141B.

[0119] The second fingerprint sensor 105B may include a third sensor electrode 121B separated from the first sensor electrode 120A and the second sensor electrode 140A (e.g., along the second direction DR2). The third sensor electrode 121B may be disposed on the same layer as the first sensor electrode 120A and the second sensor electrode 140A (e.g., may be located at the same distance from the first substrate 110). The third sensor electrode 121B may be formed by a patterning process substantially the same as the patterning process of the first sensor electrode 120A and the second sensor electrode 140A. The piezoelectric layer 165 may substantially cover the entire upper surface of the third sensor electrode 121B.

[0120] The second fingerprint sensor 105B may further include a fourth sensor electrode 141B overlapping the third sensor electrode 121B on the piezoelectric layer 165 (e.g., along the first direction DR1). A distance D3 between the third sensor electrode 121B and the fourth sensor electrode 141B may be shorter than the shortest distance D2 between the adjacent fingerprint sensors 105A and 105B, so that the influence of vibration or electrical effects of the piezoelectric layer 165 on the adjacent fingerprint sensors 105A and 105B may be reduced or eliminated.

[0121] When a touch of a finger is made in the first direction DR1, the first fingerprint sensor 105A may generate charge transfer in the second direction DR2, and the second fingerprint sensor 105B may generate charge transfer in the first direction DR1. Since the electric field strength in a direction parallel to the direction of the force (e.g., the strength of the electric field by the second fingerprint sensor 105B) may be ten times or more the electric field strength in a direction perpendicular to the direction of the force (e.g., the strength of the electric field by the first fingerprint sensor 105A), the detection reliability (e.g., sensitivity) of the second fingerprint sensor 105B may be higher than the detection reliability of the first fingerprint sensor 105A.

[0122] For example, the first fingerprint sensor 105A may be an ultrasonic transmitter, and the second fingerprint sensor 105B may be an ultrasonic receiver. Therefore, the detection sensitivity may be improved.

[0123] Fig. 9 is a cross-sectional view showing an example of a bio-information sensor according to an exemplary embodiment of the present invention.

[0124] Refer to the following Fig. 9 Can be omitted and refer to above Figures 1 to 3 The components described are substantially the same or similar to the components described above. Fig. 9 The biometric information sensor is described as a fingerprint sensor as an example; however, exemplary embodiments of the present invention are not limited thereto.

[0125] Reference Fig. 9 The first fingerprint sensor 106A may include the first sensor electrode 122 , the piezoelectric layer 166 , and the third sensor electrode 142 , and the second fingerprint sensor 106B may include the second sensor electrode 124 , the piezoelectric layer 166 , and the fourth sensor electrode 144 .

[0126] The first sensor electrode 122 and the second sensor electrode 124 may be disposed on the first substrate 110 and spaced apart from each other. The first sensor electrode 122 and the second sensor electrode 124 may directly contact the first substrate 110. The first sensor electrode 122 and the second sensor electrode 124 may be included in different fingerprint sensors.

[0127] The first insulating layer pattern 186A may be disposed on the first substrate 110 on which the first sensor electrodes 122 and the second sensor electrodes 124 are patterned. The first insulating layer pattern 186A may be in direct contact with the first substrate 110 (e.g., in a region of the first substrate 110 that is not in direct contact with the first sensor electrodes 122 and the second sensor electrodes 124), and may be in direct contact with side surfaces of the first sensor electrodes 122 and the second sensor electrodes 124. The piezoelectric layer 166 may be disposed on the first insulating layer pattern 186A. The piezoelectric layer 166 may be entirely formed on the first insulating layer pattern 186A.

[0128] The third sensor electrode 142 and the fourth sensor electrode 144 may be disposed on the piezoelectric layer 166 and spaced apart from each other (e.g., in the second direction DR2). The third sensor electrode 142 and the fourth sensor electrode 144 do not overlap the first sensor electrode 122 and the second sensor electrode 124. The second insulating layer pattern 186B may be disposed on the piezoelectric layer 166 on which the third sensor electrode 142 and the fourth sensor electrode 144 are patterned. The second insulating layer pattern 186B may be in direct contact with a portion of the piezoelectric layer 166 that is not in direct contact with the third sensor electrode 142 and the fourth sensor electrode 144. The second insulating layer pattern 186B may be in direct contact with the side surfaces of the third sensor electrode 142 and the fourth sensor electrode 144.

[0129] When pressure is applied to the first substrate 110 in a first direction DR1 perpendicular to the first substrate 110, charge transfer may occur between the first sensor electrode 122 and the third sensor electrode 142 in a second direction DR2 parallel to the first substrate 110. For example, the first sensor electrode 122 and the third sensor electrode 142 may form one fingerprint sensor 106A (e.g., an ultrasonic transmitter or an ultrasonic receiver).

[0130] Similarly, charge transfer may occur along the second direction DR2 between the second sensor electrode 124 and the fourth sensor electrode 144. For example, the second sensor electrode 124 and the fourth sensor electrode 144 may form another fingerprint sensor 106B (eg, an ultrasonic transmitter or an ultrasonic receiver).

[0131] The distance D1 between the first sensor electrode 122 and the third sensor electrode 142 may be shorter than the shortest distance D2 between adjacent fingerprint sensors 106A and 106B, which may reduce or eliminate the influence of vibration or electrical effects of the piezoelectric layer 166 on the adjacent fingerprint sensors 106A and 106B.

[0132] Fig.10 It is shown Figure 1 A cross-sectional view of an example of a display device.

[0133] Reference Figure 1 , Figure 2 and Fig.10 The display device 1 may include a first substrate 110 , a fingerprint sensor array having a fingerprint sensor 100 , a second substrate 190 , a backplane structure, a pixel structure 300 , and an encapsulation layer 400 .

[0134] In an exemplary embodiment of the present invention, the second substrate 190 may be an insulating layer including an insulating material. Therefore, the second substrate 190 may be interchangeably referred to herein as the insulating layer 190. Therefore, the insulating layer 190 may be the same as that described above with reference to Figures 3 to 9 The second substrate 190 described is substantially the same or similar.

[0135] The above reference can be omitted below Figures 1 to 9 The fingerprint sensor 100 described in more detail is repeated. Figures 1 to 9 The technical features described can be applied to the following references Fig.10 Exemplary embodiments of the present invention are described.

[0136] The first substrate 110 may include a transparent resin substrate having flexibility. For example, the transparent resin substrate may include a polyimide-based resin. Alternatively, the first substrate 110 may be a rigid substrate.

[0137] The fingerprint sensor 100 may include a first sensor electrode 120, a second sensor electrode 140, and a piezoelectric layer 160 disposed between the first sensor electrode 120 and the second sensor electrode 140. The first sensor electrode 120 may be disposed between the first substrate 110 and the insulating layer 190. The second sensor electrode 140 may be disposed on the same layer as the first sensor electrode 120. For example, the sensor electrodes 120 and 140 may both be disposed on the first substrate 110 (e.g., may be in direct contact with the first substrate 110).

[0138] The first sensor electrode 120 may be electrically connected to a common voltage VC, and the second sensor electrode 140 may be connected to a conductive line (eg, CH11 ) for transmitting an ultrasonic wave generation signal UGS or a detection signal SEN.

[0139] The fingerprint sensor 100 may be operated as an ultrasonic transmitter or an ultrasonic receiver. When the ultrasonic wave generating signal UGS is transmitted through the second sensor electrode 140, the fingerprint sensor 100 including the first sensor electrode 120, the second sensor electrode 140 and the piezoelectric layer 160 may be operated as an ultrasonic transmitter to generate ultrasonic waves. In an exemplary embodiment of the present invention, when the ultrasonic wave generating signal UGS is not transmitted through the second sensor electrode 140 of the fingerprint sensor 100, the corresponding fingerprint sensor 100 may be operated as an ultrasonic receiver to generate a detection signal SEN.

[0140] Although the first sensor electrode 120 and the second sensor electrode 140 may not be in direct contact with the insulating layer 190, the first sensor electrode 120 and the second sensor electrode 140 are not limited thereto. For example, the first sensor electrode 120 and the second sensor electrode 140 may be in direct contact with the insulating layer 190. For example, the upper surfaces of the first sensor electrode 120 and the second sensor electrode 140 facing the insulating layer 190 may be in direct contact with the bottom surface of the insulating layer 190 facing the first substrate 110.

[0141] The insulating layer 190 may be disposed on the first sensor electrode 120, the second sensor electrode 140, and the piezoelectric layer 160. The insulating layer 190 may block the electrical influence between the back plate structure and the fingerprint sensor 100. For example, the insulating layer 190 may reduce or eliminate the electrical influence between the semiconductor element 200 and the biometric information sensor (e.g., fingerprint sensor) 100. In an exemplary embodiment of the present invention, the insulating layer 190 may include a transparent resin substrate having flexibility. For example, the transparent resin substrate may include a polyimide-based resin. In an exemplary embodiment of the present invention, the insulating layer 190 may have a form in which a plurality of transparent organic insulating layers and a plurality of transparent inorganic insulating layers are alternately (e.g., and repeatedly) stacked.

[0142] The buffer layer 215 may be disposed on the insulating layer 190. For example, the buffer layer 215 may be in direct contact with the upper surface of the insulating layer 190 facing away from the first substrate 110. The buffer layer 215 may be entirely disposed on the first substrate 110 corresponding to the first substrate 110. For example, the buffer layer 215 may substantially cover the entire upper surface of the insulating layer 190. The buffer layer 215 may prevent metal ions or impurities from diffusing from the insulating layer 190 to the semiconductor element 200, and may control the heat transfer rate during the crystallization process for forming the active layer 230. In addition, the buffer layer 215 may improve the flatness of the surface of the insulating layer 190 (for example, when the surface such as the upper surface of the insulating layer 190 is uneven).

[0143] A backplane structure including a semiconductor element 200 may be disposed on the buffer layer 215. For example, the semiconductor element 200 may be in direct contact with the upper surface of the buffer layer 215 that faces away from the second substrate 190. The backplane structure may include thin film transistors, capacitors, and wiring for driving pixels. An example configuration of the backplane structure is described in more detail below.

[0144] The active layer 230 may be disposed on the buffer layer 215. The active layer 230 may include an oxide semiconductor, an inorganic semiconductor (eg, amorphous silicon or polycrystalline silicon), or an organic semiconductor.

[0145] The gate insulating layer 235 may be disposed on the active layer 230. The gate insulating layer 235 may have a substantially flat upper surface without forming a step around the active layer 230 while substantially covering the active layer 230, or may be disposed to have a substantially uniform thickness along a profile (e.g., in the first direction DR1) of the active layer 230. The gate insulating layer 235 may include a silicon compound or a metal oxide.

[0146] The first gate electrode 240 may be disposed on the gate insulating layer 235 and may overlap (eg, in the first direction DR1) the active layer 230. The first gate electrode 240 may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other.

[0147] The first insulating interlayer 245 may be disposed on the first gate electrode 240. The first insulating interlayer 245 may have a substantially flat upper surface without forming a step around the first gate electrode 240 while substantially covering the first gate electrode 240, or may be disposed to have a substantially uniform thickness along a profile (e.g., in the first direction DR1) of the first gate electrode 240. The first insulating interlayer 245 may include a silicon compound or a metal oxide.

[0148] The second gate electrode 250 may be disposed on the first insulating interlayer 245 and may overlap (eg, in the first direction DR1) the first gate electrode 240. The second gate electrode 250 may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other.

[0149] The second insulating interlayer 255 may be disposed on the second gate electrode 250. The second insulating interlayer 255 may substantially cover the second gate electrode 250. The second insulating interlayer 255 may have a substantially flat upper surface without forming a step around the second gate electrode 250, or may be disposed to have a substantially uniform thickness along a profile (e.g., in the first direction DR1) of the second gate electrode 250. The second insulating interlayer 255 may include a silicon compound or a metal oxide.

[0150] The gate insulating layer 235 , the first insulating interlayer 245 , and the second insulating interlayer 255 may be collectively referred to as an insulating layer structure.

[0151] The source electrode 260A and the drain electrode 260B may be disposed on the second insulating interlayer 255. The source electrode 260A may be connected to the source region of the active layer 230 through a predetermined first contact hole formed in the insulating layer structure, and the drain electrode 260B may be connected to the drain region of the active layer 230 through a predetermined second contact hole formed in the insulating layer structure. The source electrode 260A and the drain electrode 260B may each include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other. Therefore, a semiconductor element 200 including an active layer 230, a first gate electrode 240, a second gate electrode 250, a source electrode 260A, and a drain electrode 260B may be formed.

[0152] The semiconductor element 200 may have a top gate structure, but the structure of the semiconductor element 200 is not limited thereto. For example, the semiconductor element 200 may have a bottom gate structure.

[0153] The passivation layer 265 may be disposed on the source electrode 260A and the drain electrode 260B. The passivation layer 265 may be disposed to have a substantially uniform thickness along the profiles of the source electrode 260A and the drain electrode 260B (eg, in the first direction DR1) to substantially cover the source electrode 260A and the drain electrode 260B. The passivation layer 265 may include a silicon compound or a metal oxide.

[0154] The first planarization layer 270 may be disposed on the passivation layer 265. The first planarization layer 270 may have a substantially flat upper surface. The first planarization layer 270 may include an organic material or an inorganic material. In an exemplary embodiment of the present invention, the first planarization layer 270 may include an organic material.

[0155] A wiring pattern (e.g., a line pattern) 280 and a connection pattern 285 may be disposed on the first planarization layer 270. The wiring pattern 280 may send a scan signal, a data signal, an initialization signal, or a power supply voltage. The connection pattern 285 may be connected to the drain electrode 260B through a contact hole. The connection pattern 285 may electrically connect the lower electrode 310 of the pixel structure 300 and the drain electrode 260B. The wiring pattern 280 and the connection pattern 285 may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other.

[0156] A second planarization layer 290 substantially covering the wiring patterns 280 and the connection patterns 285 may be disposed on the first planarization layer 270. The second planarization layer 290 may have a substantially planar (eg, flat) upper surface. The second planarization layer 290 may include an organic material or an inorganic material.

[0157] The pixel structure 300 may be disposed on the backplane structure. The pixel structure 300 may correspond to the light emitting region and may include a lower electrode 310 , an organic light emitting layer 320 , and an upper electrode 330 . The pixel structure 300 may be at least partially separated from an adjacent pixel structure 300 by a pixel defining layer 340 .

[0158] The lower electrode 310 may be disposed on the second planarization layer 290. The lower electrode 310 may be connected to the connection pattern 285 through a contact hole and may be electrically connected to the semiconductor element 200. The lower electrode 310 may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material. These may be used alone or in combination with each other.

[0159] The pixel defining layer 340 may be disposed on the second planarization layer 290 to expose a portion of the lower electrode 310. The organic light emitting layer 320 may be disposed on the exposed portion of the lower electrode 310. The pixel defining layer 340 may include an organic material or an inorganic material.

[0160] The organic light emitting layer 320 may be disposed on the lower electrode 310 partially exposed by the pixel defining layer 340. The organic light emitting layer 320 may use at least one of the light emitting materials that emit different colors of light (e.g., red light, green light, or blue light) based on the pixel. Alternatively, the organic light emitting layer 320 may emit white light as a whole by laminating a plurality of light emitting materials that produce different colors of light such as red light, green light, or blue light. A color filter may be disposed on the organic light emitting layer 320. The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. The color filter may include a yellow color filter, a cyan color filter, or a magenta color filter. The color filters may each include a photosensitive resin.

[0161] The upper electrode 330 may substantially entirely cover the pixel defining layer 340 and the organic light emitting layer 320. The upper electrode 330 may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, which may be used alone or in combination with each other.

[0162] The encapsulation layer 400 may be disposed on the upper electrode 330. The encapsulation layer 400 may include a first thin film encapsulation layer 420, a second thin film encapsulation layer 440, and a third thin film encapsulation layer 460.

[0163] The first thin film encapsulation layer 420 may substantially cover the upper electrode 330, and may be disposed along the contour of the upper electrode 330 to have a substantially uniform thickness (e.g., in the first direction DR1). The first thin film encapsulation layer 420 may prevent the pixel structure 300 from being degraded due to, for example, the penetration of moisture or oxygen. In addition, the first thin film encapsulation layer 420 may also protect the pixel structure 300 from external impact. The first thin film encapsulation layer 420 may include an inorganic material.

[0164] The second thin film encapsulation layer 440 may be disposed on the first thin film encapsulation layer 420. The second thin film encapsulation layer 440 may improve the flatness of the display device 1 and protect the pixel structure 300. The second thin film encapsulation layer 440 may include an organic material.

[0165] The third thin film encapsulation layer 460 may be disposed on the second thin film encapsulation layer 440. The third thin film encapsulation layer 460 may also protect the pixel structure 300 from external impact. The third thin film encapsulation layer 460 may include an inorganic material.

[0166] The encapsulation layer 400 may have a laminated structure. The encapsulation layer 400 may include a lowermost layer and an uppermost layer each including an inorganic layer or an organic layer. The encapsulation layer 400 may include organic layers and inorganic layers stacked alternately (eg, and repeatedly).

[0167] In the pixel structure 300, the region corresponding to the organic light emitting layer 320 may correspond to the light emitting region DA, and the region surrounding the light emitting region DA (e.g., the region where the pixel defining layer 340 is disposed) may correspond to the non-light emitting region NA. Ultrasonic waves may deform the conductive material, and the organic light emitting material included in the organic light emitting layer 320 may emit light unintentionally by the ultrasonic waves. In an exemplary embodiment of the present invention, the fingerprint sensor 100 may be disposed in the non-light emitting region NA, which may prevent the above-mentioned deformation and unintentional emission.

[0168] However, this is an example, and the arrangement position of the fingerprint sensor 100 is not limited thereto. The fingerprint sensor 100 overlapped with the non-luminous area NA may be embedded in the backplane structure, embedded in the pixel defining layer 340, or embedded in the touch sensor structure above the encapsulation layer 400. In addition, the fingerprint sensor array including the fingerprint sensor 100 disposed under the insulating layer 190 and the internal fingerprint sensor disposed in the backplane structure or the pixel defining layer 340 may not overlap each other (for example, in the first direction DR1).

[0169] Therefore, the fingerprint sensor array including the fingerprint sensor 100 may be disposed directly below the display panel including the backplane structure and the pixel structure 300 .

[0170] When the fingerprint sensor 100 includes a single conductive layer, the fingerprint sensor array can be thinned and / or a fingerprint sensor integrated display device can be implemented. Therefore, a foldable and / or bendable display device including the fingerprint sensor 100 can be manufactured. In addition, the manufacturing cost of the display device 1 including the fingerprint sensor 100 can be reduced.

[0171] According to an exemplary embodiment of the present invention, for example, referring to Figures 1 to 6 as well as Fig.10, the display device 1 may include a first substrate 110 and a biometric information sensor 100 disposed on the first substrate 110. The biometric information sensor 100 may include a first fingerprint sensor (e.g., fingerprint sensor 102A) and a second fingerprint sensor (e.g., fingerprint sensor 102B) separated from the first fingerprint sensor. The first fingerprint sensor may include a first sensor electrode (e.g., sensor electrode 120A) in direct contact with the first substrate 110 and a second sensor electrode (e.g., sensor electrode 140A) in direct contact with the first substrate 110 and separated from the first sensor electrode. The second fingerprint sensor may include a third sensor electrode (e.g., sensor electrode 120B) in direct contact with the first substrate 110 and a fourth sensor electrode (e.g., sensor electrode 140B) in direct contact with the first substrate 110 and separated from the third sensor electrode. The piezoelectric layer 160 may be disposed on the first substrate 110 between the first sensor electrode and the second sensor electrode and between the third sensor electrode and the fourth sensor electrode. The second substrate 190 may be disposed on the piezoelectric layer 160. The semiconductor element 200 may be located above the second substrate 190.

[0172] In an exemplary embodiment of the present invention, the distance between the first sensor electrode and the second sensor electrode (eg, distance D1 ) may be smaller than the distance between the first fingerprint sensor and the second fingerprint sensor (eg, shortest distance D2 ).

[0173] Fig.11A , Fig. 11B , Fig. 11C and Fig.11D All show Figure 1 A cross-sectional view of a deformation example of a display device.

[0174] Refer to the following Fig.11A , Fig. 11B , Fig. 11C and Fig.11D Can be omitted and refer to above Figures 1 to 3 and / or Fig.10 The components described herein are substantially the same or similar to the components described herein. FIG. 11A to FIG. 11D The display device described above can be Fig.10 The display device described is substantially the same or similar. Figures 1 to 9 The technical features described can be applied to the following references FIG. 11A to FIG. 11D Exemplary embodiments of the present invention are described.

[0175] Reference FIG. 11A to FIG. 11DThe display device may include a substrate 195 or an insulating layer 190 , a fingerprint sensor array having a fingerprint sensor 100 , a backplane structure, a pixel structure 300 , and an encapsulation layer 400 .

[0176] In an exemplary embodiment of the present invention, the semiconductor element 200 and the fingerprint sensor 100 may be included in a back plate structure. The fingerprint sensor 100 may be disposed in the non-light emitting area NA.

[0177] The substrate 195 may include a transparent resin substrate having flexibility. For example, the substrate 195 may include a polyimide-based resin. Alternatively, the substrate 195 may be a rigid substrate.

[0178] Reference Fig.11A In an exemplary embodiment of the present invention, the first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 may be disposed on the same layer as the first gate electrode 240. For example, the first sensor electrode 120 and the second sensor electrode 140 and the first gate electrode 240 of the fingerprint sensor 100 may all be located at the same distance from the substrate 195. For example, the first sensor electrode 120 and the second sensor electrode 140 and the first gate electrode 240 may be formed by one conductive layer patterning process. The piezoelectric layer 160 may be disposed between the first sensor electrode 120 and the second sensor electrode 140. In an exemplary embodiment of the present invention, the first insulating interlayer 245 that substantially covers the first gate electrode 240 may include the same material as that of the piezoelectric material layer 160. For example, the first insulating interlayer 245 and the piezoelectric layer 160 may be formed by a single deposition process.

[0179] Therefore, a fingerprint sensor array including the fingerprint sensor 100 may also be formed by the process of forming the first gate electrode 240 and the first insulating interlayer 245. Therefore, the fingerprint sensor 100 may be embedded inside the display device, the manufacturing process for forming the fingerprint sensor 100 may be simplified, and the manufacturing cost may be reduced.

[0180] Reference Fig. 11BIn an exemplary embodiment of the present invention, the first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 may be disposed on the same layer as the second gate electrode 250. For example, the first sensor electrode 120 and the second sensor electrode 140 and the second gate electrode 250 of the fingerprint sensor 100 may all be located at the same distance from the substrate 195. For example, the first sensor electrode 120 and the second sensor electrode 140 and the second gate electrode 250 may be formed by one conductive layer patterning process. In an exemplary embodiment of the present invention, the second insulating interlayer 255 that substantially covers the second gate electrode 250 may include the same material as that of the piezoelectric material layer 160. For example, the second insulating interlayer 255 and the piezoelectric layer 160 may be formed by a single deposition process.

[0181] In an exemplary embodiment of the present invention, the first sensor electrode 120 and the second sensor electrode 140 and the second gate electrode 250 of the fingerprint sensor 100 may be formed on the same layer through a single conductive layer patterning process.

[0182] Reference Fig. 11C In an exemplary embodiment of the present invention, the first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 may be disposed on the same layer as the wiring pattern 280. For example, the first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 and the wiring pattern 280 may all be located at the same distance from the substrate 195. For example, the first sensor electrode 120 and the second sensor electrode 140 and the wiring pattern 280 may be formed by one conductive layer patterning process. In an exemplary embodiment of the present invention, the second planarization layer 290 that substantially covers the wiring pattern 280 may include the same material as that of the piezoelectric material layer 160. For example, the second planarization layer 290 and the piezoelectric layer 160 may be formed by a single deposition process.

[0183] Reference Fig.11D In an exemplary embodiment of the present invention, the fingerprint sensors 100A and 100B may be provided in a plurality of layers. For example, the fingerprint sensors 100A and 100B may be provided in different layers from each other and may be spaced apart from each other in a direction orthogonal to the upper surface of the first substrate 110. The fingerprint sensors 100A and 100B may be arranged not to overlap each other (e.g., in the first direction DR1), which may prevent unintentional interference of ultrasonic waves generated in a display panel including the fingerprint sensors 100A and 100B.

[0184] The first fingerprint sensor 100A may be disposed in the non-light emitting area NA under the insulating layer 190. For example, a first fingerprint sensor array including the first fingerprint sensor 100A may be disposed under the insulating layer 190.

[0185] The second fingerprint sensor 100B may be disposed in the non-light emitting area NA in the backplane structure. For example, the second fingerprint sensor 100B may be formed on the same layer as the first gate electrode 240 (eg, may be located at the same distance from the first substrate 110), and the second fingerprint sensor array including the second fingerprint sensor 100B may be arranged on the gate insulating layer 235.

[0186] According to an exemplary embodiment of the present invention, the second piezoelectric layer 246 may be located between the first sensor electrode 120B and the second sensor electrode 140B of the second fingerprint sensor 100B. For example, the second piezoelectric layer 246 may directly contact the side surfaces of the first sensor electrode 120B and the second sensor electrode 140B of the second fingerprint sensor 100B.

[0187] However, this is an example, and the arrangement of the fingerprint sensor is not limited thereto. For example, the fingerprint sensor may be arranged at various positions (eg, depending on a wiring structure included in the display panel and the density of components).

[0188] As an example, when a fingerprint sensor array including the ultrasonic fingerprint sensor 100 is embedded in a back panel structure, manufacturing costs can be reduced, and a foldable and / or bendable display device including the fingerprint sensor 100 can be manufactured.

[0189] Fig.12 and Fig.13 All show Figure 1 A cross-sectional view of a deformation example of a display device.

[0190] Refer to the following Fig.12 and Fig.13 Can be omitted and refer to above Figures 1 to 3 and / or Fig.10 The components described herein are substantially the same or similar to the components described herein. Fig.12 and Fig.13 The display device described above can be Fig.10 The display device described is substantially the same or similar. Figures 1 to 9 The technical features described can be applied to the following references Fig.12 and Fig.13 Exemplary embodiments of the present invention are described.

[0191] Reference Fig.12 and Fig.13 The display device may include a substrate 195 , a fingerprint sensor array having a fingerprint sensor 100 , a backplane structure, a pixel structure 300 , and an encapsulation layer 400 .

[0192] In an exemplary embodiment of the present invention, referring to Fig.12 , the fingerprint sensor 100 may be included in the pixel structure 300. The fingerprint sensor 100 may be disposed in the non-luminous area NA. The first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 may be disposed on the same layer as the lower electrode 310. For example, the first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 and the lower electrode 310 may all be located at the same distance from the substrate 195. For example, the first sensor electrode 120 and the second sensor electrode 140 and the lower electrode 310 may be formed by one conductive layer patterning process.

[0193] In an exemplary embodiment of the present invention, referring to Fig.13 , the display device may further include a touch sensor structure 500 located on the encapsulation layer 400, the touch sensor structure 500 including a touch electrode pattern 520, a touch wiring and an insulating structure 540. The display device may further include a protective layer 600 located on the touch sensor structure 500, the protective layer 600 including a transparent material for protecting the lower structure. In an exemplary embodiment of the present invention, the fingerprint sensor 100 may be arranged in the non-luminous area NA within the touch sensor structure 500. The first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 may be arranged on the same layer as the touch electrode pattern 520. For example, the first sensor electrode 120 and the second sensor electrode 140 of the fingerprint sensor 100 and the touch electrode pattern 520 may all be located at the same distance from the substrate 195. For example, the first sensor electrode 120 and the second sensor electrode 140 and the touch electrode pattern 520 may be formed by a conductive layer patterning process. In an exemplary embodiment of the present invention, the insulating structure 540 may include a piezoelectric material.

[0194] As an example, when a fingerprint sensor array including the ultrasonic fingerprint sensor 100 is embedded in the pixel structure 300 or the touch sensor structure 500, manufacturing costs can be reduced and a foldable and / or bendable display device including the fingerprint sensor 100 can be manufactured.

[0195] As an example, an ultrasonic bio-information sensor (e.g., a fingerprint sensor) according to an exemplary embodiment of the present invention and a display device having the same may include a first sensor electrode and a second sensor electrode arranged in parallel on the same layer (e.g., on a single conductive member), and thus, the sensor array manufacturing process can be simplified and the manufacturing cost can be reduced. In addition, the thinning of the sensor array included in the display device can be achieved. Therefore, the fingerprint sensor and the display panel can be formed as a whole, or the fingerprint sensor can be formed inside the display panel.

[0196] In addition, as the thickness of the fingerprint sensor is reduced, a foldable and / or bendable display device including the fingerprint sensor can be manufactured at a reduced manufacturing cost.

[0197] The exemplary embodiments of the present invention may be applied to a biometric information sensor and a system including a display device. For example, the exemplary embodiments of the present invention may be applied to a biometric information sensor that detects fingerprints, irises, shapes of bones, and blood vessels of the skin.

[0198] While the invention has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims

1. A bio-information sensor, comprising: first base; a first sensor electrode, disposed on the first substrate; a second sensor electrode disposed on the first substrate at the same distance from the first substrate as the first sensor electrode and spaced apart from the first sensor electrode; a piezoelectric layer disposed between the first sensor electrode and the second sensor electrode; as well as a second substrate disposed on the first sensor electrode, the second sensor electrode and the piezoelectric layer, When pressure is applied in a direction orthogonal to an upper surface of the first substrate, charge transfer occurs between the first sensor electrode and the second sensor electrode in a direction parallel to the upper surface of the first substrate, the upper surface of the first substrate facing the second substrate.

2. The biological information sensor according to claim 1, wherein: The piezoelectric layer covers at least a portion of an upper surface of the first sensor electrode and at least a portion of an upper surface of the second sensor electrode.

3. The biological information sensor according to claim 1, wherein: The piezoelectric layer, the first sensor electrode, and the second sensor electrode located above the first substrate have the same height as one another.

4. The biological information sensor according to claim 1, wherein: The first sensor electrode, the second sensor electrode, and the piezoelectric layer form an ultrasonic receiver that generates a detection signal in response to reflection of an ultrasonic wave.

5. The biological information sensor according to claim 4, wherein: The first sensor electrodes are electrically connected to a common voltage, and The second sensor electrode is electrically connected to a conductive line that transmits the detection signal.

6. The bio-information sensor according to claim 2, further comprising: An insulating layer pattern is disposed between the first sensor electrode, the second sensor electrode, the piezoelectric layer and the second substrate to at least partially cover the first sensor electrode, the second sensor electrode and the piezoelectric layer.

7. The biological information sensor according to claim 2, further comprising: a third sensor electrode disposed on the first substrate at the same distance from the first substrate as the first sensor electrode and spaced apart from the first sensor electrode and the second sensor electrode; as well as a fourth sensor electrode disposed on the piezoelectric layer to overlap the third sensor electrode, Wherein, the piezoelectric layer covers the entire upper surface of the third sensor electrode.

8. The biological information sensor according to claim 7, wherein: When the pressure is applied in the direction orthogonal to the upper surface of the first substrate facing the second substrate, Charge transfer occurs between the third sensor electrode and the fourth sensor electrode along the direction normal to the upper surface of the first substrate.

9. A display device, comprising: substrate; a fingerprint sensor array disposed on the substrate, the fingerprint sensor array comprising a plurality of fingerprint sensors having an ultrasonic transmitter and an ultrasonic receiver; An insulating layer, disposed on the fingerprint sensor array; A semiconductor element is disposed on the insulating layer; A pixel structure, arranged on the semiconductor element; as well as An encapsulation layer is disposed on the pixel structure. wherein at least one of the plurality of fingerprint sensors comprises: a first sensor electrode disposed on the substrate; a second sensor electrode disposed on the substrate at the same distance from the substrate as the first sensor electrode, wherein the second sensor electrode is separated from the first sensor electrode; and a piezoelectric layer disposed between the first sensor electrode and the second sensor electrode, The distance between the first sensor electrode and the second sensor electrode is shorter than the shortest distance between adjacent fingerprint sensors among the plurality of fingerprint sensors.

10. The display device according to claim 9, wherein: The first sensor electrodes are electrically connected to a common voltage, and Wherein, the second sensor electrode is electrically connected to a conductive line for transmitting an ultrasonic wave generating signal or receiving a detection signal.

11. The display device according to claim 10, wherein: The piezoelectric layer covers at least a portion of an upper surface of the first sensor electrode and at least a portion of an upper surface of the second sensor electrode.

12. The display device according to claim 10, wherein: The ultrasonic transmitter and the ultrasonic receiver are arranged on the same layer.

13. The display device according to claim 10, wherein: At least one fingerprint sensor among the plurality of fingerprint sensors operates as the ultrasonic transmitter to generate ultrasonic waves when transmitting the ultrasonic wave generating signal through the second sensor electrode.

14. The display device according to claim 10, wherein: At least one fingerprint sensor of the plurality of fingerprint sensors operates as the ultrasonic receiver to generate the detection signal when the ultrasonic wave generating signal is not transmitted through the second sensor electrode.

15. The display device according to claim 9, wherein: The pixel structure comprises an organic light emitting layer, The pixel structure includes a light-emitting region located at a position corresponding to the organic light-emitting layer and a non-light-emitting region adjacent to the light-emitting region, and Wherein, each of the plurality of fingerprint sensors overlaps with the non-luminous area.

16. The display device according to claim 15, further comprising: a plurality of second fingerprint sensors having the same structure as the plurality of fingerprint sensors; wherein the plurality of second fingerprint sensors and the semiconductor element are arranged above the plurality of fingerprint sensors, and Wherein, the plurality of second fingerprint sensors do not overlap with the fingerprint sensor array.

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