An electromagnetic heater power supply capable of isolating heat dissipation

Abstract

The present invention discloses an electromagnetic heater power supply capable of isolating heat dissipation, comprising a circuit board and a radiator, wherein the circuit board is electrically connected to the pins of a high-heat-generating component, the radiator has a heat dissipation portion and a heat collection portion, the head of the high-heat-generating component is fixedly connected to the heat collection portion of the radiator by heat conduction, and the circuit board is located in a sealed room; the head of the high-heat-generating component extends out of the sealed room in a sealed manner, and the heat dissipation portion and the heat collection portion of the radiator are located outside the sealed room, or the head of the high-heat-generating component is located in the sealed room, the heat collection portion of the radiator extends into the sealed room in a sealed manner, and the heat dissipation portion of the radiator is located outside the sealed room. The electromagnetic heater power supply capable of isolating heat dissipation can work normally for a long time under harsh environmental conditions, and the circuit board will not fall on dust, and the circuit board will not be short-circuited and burned due to moisture from dust.

Description

Technical Field

[0001] The invention relates to a power supply, in particular to an electromagnetic heater power supply capable of isolating and dissipating heat. Background Art

[0002] The electromagnetic heater power supply is an indispensable power supply device for the electromagnetic heater. Since the applicant applied to the Chinese Patent Office on February 17, 2014 for a patent named "A Handheld Electromagnetic Heater" with the patent number ZL201410053724.2, it has been committed to the development and research of handheld electromagnetic heaters and electromagnetic heater power supplies. Figure 1 As shown, the initial electromagnetic heater power supply includes a chassis 4, and the chassis 4 as a whole constitutes a heat dissipation chamber 5. A circuit board 1 is arranged in the heat dissipation chamber 5. The circuit board is fixed with a radiator 2. The radiator 2 is an aluminum radiator. The heat dissipation chamber 5 is provided with a vent, and the circuit board 1 is designed according to the stable standard voltage of the mains. However, during use, three main technical problems were found. First, after a period of use, the circuit board in the electromagnetic heater power supply was suddenly burned out at startup. After investigation and research, it was found that there were the following three reasons for the electromagnetic heater power supply to burn out. 1. The plug is damaged. 2. Zero point drift. 3. Line voltage drop. The third technical problem is that the heat dissipation effect of the aluminum radiator is not very ideal. When solving the third technical problem, the applicant used a radiator made of pure copper material, which has a very ideal heat dissipation effect, but the manufacturing cost is very high. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide an electromagnetic heater power supply with isolable heat dissipation, which can work normally for a long time under harsh environmental conditions, and the circuit board will not fall on dust, and the circuit board will not be short-circuited and burned due to dust and moisture.

[0004] In order to solve the above technical problems, the present invention provides an electromagnetic heater power supply with isolating heat dissipation, including a circuit board and a radiator, the circuit board is electrically connected to the pins of high-heat-generating components, the radiator has a heat dissipation part and a heat collection part, the head of the high-heat-generating component is thermally and fixedly connected to the heat collection part of the radiator, and the circuit board is located outside the sealed room; the head of the high-heat-generating component extends out of the sealed room in a sealed manner, and the heat dissipation part and heat collection part of the radiator are located outside the sealed room, or the head of the high-heat-generating component is located in the sealed room, the heat collection part of the radiator extends into the sealed room in a sealed manner, and the heat dissipation part of the radiator is located outside the sealed room.

[0005] The high heat generating components are insulated gate bipolar transistors and / or rectifier bridges.

[0006] A plurality of low-heat generating components are also distributed on the circuit board.

[0007] The multiple low-heat generating components are capacitors, inductors, resistors, and integrated circuit chips.

[0008] The sealed chamber is located in the upper part of the chassis.

[0009] The lower part of the chassis is a heat dissipation chamber. Or,

[0010] The sealed chamber is located in the lower part of the chassis.

[0011] The upper part of the chassis is a heat dissipation chamber.

[0012] The sealed chamber is composed of multiple panels;

[0013] At least one of the multiple panels is a detachable panel;

[0014] The detachable panel is sealingly connected to the other panels it is connected to through a sealing strip;

[0015] The multiple panels include multiple panels of the chassis, one panel of the sealing partition, and one panel of the box cover;

[0016] The detachable panel is one panel of the box cover;

[0017] There are two box covers;

[0018] The cross-section of the sealing strip is rectangular, circular, or elliptical;

[0019] The sealing strip is a solid-core sealing strip or a hollow-core sealing strip;

[0020] The overall shape of the sealing strip is in the shape of a "mouth" character, a "day" character, a "day" character missing the lower horizontal stroke, or a "day" character missing the upper horizontal stroke;

[0021] The sealing strip is distributed with screw through holes (screw assembly holes) along the length direction;

[0022] The sealing strip is made of silica gel, foamed silica gel, rubber, foam plastic, fiber cloth, cotton cloth, phenolic paper, asbestos paper, or insulating paper;

[0023] The heat dissipation part of the radiator is located in the heat dissipation chamber.

[0024] The heat dissipation chamber and the sealed chamber are separated by a sealing partition.

[0025] The sealing partition is made of a metal plate, a plastic plate, an epoxy resin plate, or a bakelite plate.

[0026] The sealing partition is provided with pin through holes.

[0027] The pins of the high heat generating components are insulated and sealed through the pin through-holes of the sealing partition and are electrically connected to the circuit board.

[0028] An insulating heat shrink tube is sleeved on the pins of the high-heat generating components.

[0029] The insulating heat shrink tube is sealed and connected to the pin through-hole of the sealing partition through electronic sealant.

[0030] or,

[0031] The sealing partition is provided with a heat dissipation opening.

[0032] The heat dissipation opening is in a rectangular, circular or elliptical shape.

[0033] The upper edge of the heat dissipation opening is sealed and connected to the bottom of the circuit board through a sealing member.

[0034] The sealing member is ring-shaped.

[0035] The sealing element is in the shape of a rectangular ring, a circular ring or an elliptical ring.

[0036] The sealing member and the bottom of the circuit board form a heat collection area.

[0037] The heat collecting part of the radiator passes through the heat dissipation opening and enters the heat collecting area.

[0038] The heat collecting portion of the radiator is insulated and fixedly connected to the circuit board.

[0039] or,

[0040] The circuit board is provided with a through hole at the heat collection area.

[0041] The heat collecting portion of the radiator passes through the through hole.

[0042] The side surface of the heat collecting part of the radiator is sealed and connected to the through hole by electronic glue.

[0043] A heat-conducting insulating sheet is attached to the bottom of the circuit board at the heat collection area, or the bottom of the circuit board is coated with insulating paint.

[0044] The circuit boards include a variable frequency power amplifier circuit board, an overvoltage and undervoltage protection circuit board, a power supply and relay combination circuit board, a control circuit board, and a power supply circuit board.

[0045] The variable frequency power amplifier circuit board, the over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board are electrically connected through an interface.

[0046] The variable frequency power amplifier circuit board is close to the sealing partition.

[0047] The over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board are located above the variable frequency power amplification circuit board.

[0048] The variable frequency power amplifier circuit board is insulated and fixedly connected to the over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board through a supporting column.

[0049] The upper cavity and the lower cavity of the four circuit boards, namely, the over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board, form a circulating air duct.

[0050] At least one circulation fan is arranged on the circulation air duct.

[0051] The circulation fan has one.

[0052] One of the circulation fans is located at the upper rear portion of the sealed chamber.

[0053] There are multiple high heat generating components.

[0054] The plurality of high-heat generating components are electrically connected to the variable frequency power amplifier circuit board.

[0055] The heads of the plurality of high heat generating components are located on the circuit board. Or,

[0056] The tube heads of the plurality of high heat generating components are located below the circuit board.

[0057] The heads of the plurality of high-heat generating components are away from the surface of the circuit board. Or,

[0058] The tube heads of the plurality of high heat generating components are close to the board surface of the circuit board.

[0059] The tube heads of the plurality of high heat generating components are arranged horizontally. Or,

[0060] The tube heads of the plurality of high heat generating components are arranged vertically.

[0061] The tube head of the high-heat-generating component is fixedly connected to the side of the heat collecting part of the radiator through heat conduction. Or,

[0062] The tube head of the high-heat-generating component is fixedly connected to the upper surface of the heat collecting part of the radiator through heat conduction.

[0063] The heat sink is made of aluminum and / or copper.

[0064] The heat sink is a phase change heat sink.

[0065] The phase-change radiator is an aluminum shell phase-change radiator, a copper shell phase-change radiator, or a thermally conductive silicone shell phase-change radiator.

[0066] The heat dissipation part is made of aluminum.

[0067] The heat dissipation part includes a heat dissipation plate and a plurality of heat dissipation fins.

[0068] The plurality of heat sinks are distributed on one side or both sides of the heat sink.

[0069] The heat collecting part is made of copper plate.

[0070] The copper plate is a red copper plate.

[0071] The heat collecting portion is fixedly connected to one surface or a part of one surface of the heat dissipation plate by a first fixing screw.

[0072] Thermal conductive silicone grease is applied between the heat collecting portion and the heat dissipation plate.

[0073] The edge or middle portion of the heat collecting portion extends upward to form an extended heat collecting portion.

[0074] There are multiple radiators.

[0075] A plurality of the heat sinks are fixed together by a connecting plate and a second fixing screw.

[0076] An air inlet is provided at the lower rear portion of the chassis.

[0077] An air outlet is provided at the lower front portion of the chassis.

[0078] At least one cooling fan is arranged between the air inlet and the radiator.

[0079] There are two cooling fans.

[0080] A gap is left between the cooling fan and the air inlet hole.

[0081] A gap between the cooling fan and the air inlet is greater than or equal to 5 mm.

[0082] The upper front part of the chassis is provided with a power switch, a working status indicator light, a time relay, a voltmeter, an ammeter, a potentiometer, and an over-voltage and under-voltage status indicator light.

[0083] There are four working status indicator lights.

[0084] The four working status indicator lights are a temperature protection indicator light, a chip power indicator light, a program lock indicator light, and a working instruction indicator light.

[0085] There are four over-voltage and under-voltage status indicator lights.

[0086] The four over-voltage and under-voltage status indicator lights are an input power indicator light, an under-voltage indicator light, an over-voltage indicator light, and an output power indicator light.

[0087] The over-voltage and under-voltage protection circuit board has an over-voltage and under-voltage protection circuit board. Or,

[0088] The over-voltage and under-voltage protection circuit board has two sub-over-voltage and under-voltage protection circuit boards.

[0089] One of the over-voltage and under-voltage protection circuit boards has an over-voltage and under-voltage protection circuit. Or,

[0090] One of the over-voltage and under-voltage protection circuit boards has two sub-over-voltage and under-voltage protection circuits.

[0091] The two sub-overvoltage and undervoltage protection circuit boards both have sub-overvoltage and undervoltage protection circuits.

[0092] One of the over-voltage and under-voltage protection circuits is a high-voltage over-voltage and under-voltage protection circuit or a low-voltage over-voltage and under-voltage protection circuit or a high-low-voltage over-voltage and under-voltage protection circuit.

[0093] One of the two sub-overvoltage and undervoltage protection circuits is a high-voltage overvoltage and undervoltage protection circuit, and the other is a low-voltage overvoltage and undervoltage protection circuit.

[0094] The sub-overvoltage and undervoltage protection circuit of one of the two sub-overvoltage and undervoltage protection circuit boards is a high-voltage overvoltage and undervoltage protection circuit, and the sub-overvoltage and undervoltage protection circuit of the other sub-overvoltage and undervoltage protection circuit board is a low-voltage overvoltage and undervoltage protection circuit.

[0095] The over-voltage and under-voltage protection circuit includes a rectifier circuit.

[0096] The input end of the rectifier circuit is electrically connected to the output end of the external power supply.

[0097] The output end of the rectifier circuit is electrically connected to the input end of the voltage stabilizing circuit.

[0098] The first output terminal of the voltage stabilizing circuit is electrically connected to the first input terminal of the comparison circuit.

[0099] The second input terminal of the comparison circuit is electrically connected to the output terminal of the AC / DC sampling circuit.

[0100] The third input terminal of the comparison circuit is electrically connected to the output terminal of the reference circuit.

[0101] The input end of the reference circuit is electrically connected to the second output end of the voltage stabilizing circuit.

[0102] The output terminal of the comparison circuit is electrically connected to the first input terminal of the driving circuit.

[0103] The second input terminal of the driving circuit is electrically connected to the output terminal of the delay circuit.

[0104] The output end of the driving circuit is electrically connected to the input end of the execution circuit.

[0105] The execution circuit of the high and low voltage over-voltage and under-voltage protection circuit is divided into a high voltage execution circuit and a low voltage execution circuit.

[0106] The output end of the driving circuit is divided into a first output end and a second output end.

[0107] The first output terminal of the driving circuit is electrically connected to the input terminal of the high-voltage execution circuit.

[0108] The main circuit execution element in the high-voltage execution circuit is a small relay or an intermediate relay or a contactor.

[0109] The second output terminal of the driving circuit is electrically connected to the input terminal of the low-voltage execution circuit.

[0110] The control DC circuit execution element in the low-voltage execution circuit is a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect transistor or a normally closed micro relay.

[0111] The normally closed micro-relay is a normally closed reed switch relay or a normally closed small high-frequency relay.

[0112] The execution circuit of the high-voltage over-voltage and under-voltage protection circuit is a high-voltage execution circuit.

[0113] The output end of the driving circuit is electrically connected to the input end of the high-voltage execution circuit.

[0114] The main circuit execution element in the high-voltage execution circuit is an AC solid-state relay or an electromagnetic relay.

[0115] The AC solid-state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor.

[0116] The execution circuit of the low-voltage over-voltage and under-voltage protection circuit is a low-voltage execution circuit.

[0117] The output end of the driving circuit is electrically connected to the input end of the low-voltage execution circuit.

[0118] The control DC circuit execution element in the low-voltage execution circuit is a DC solid-state relay or a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect transistor or an optical coupler switch element.

[0119] The input end of the AC / DC sampling circuit is electrically connected to the output end of the external power supply.

[0120] The output end of the external power supply is electrically connected to the power input end of the terminal through the control output end of the high-voltage execution circuit.

[0121] A leakage switch, an ammeter, a voltmeter, a fuse and a power switch are electrically connected between the control output end of the high-voltage execution circuit and the power input end of the terminal.

[0122] The first power output end of the binding post is electrically connected to the power input end of the variable frequency power amplifier circuit board.

[0123] The power input and output ends of the variable frequency power amplifier circuit board are electrically connected to the electromagnetic heater gun head.

[0124] The second power output end of the terminal is electrically connected to the power input end of the power supply and relay combination circuit board, the power input end of the time relay, and the power input end of the power circuit board.

[0125] The power supply and relay combination circuit board is electrically connected to the fan in the electromagnetic heater gun head.

[0126] The power supply and relay combination circuit board is electrically connected to an electromagnetic heater switch.

[0127] The power circuit board is electrically connected to two cooling fans and a circulation fan.

[0128] The third power output terminal of the binding post is electrically connected to the power input terminal of the over-voltage and under-voltage protection circuit board.

[0129] The control output end of the low voltage execution circuit of the over- and under-voltage protection circuit board is electrically connected to the control input end of the control circuit board.

[0130] The power input terminal of the control circuit board is electrically connected to the power output terminal of the power circuit board.

[0131] The frequency conversion signal output end of the control circuit board is electrically connected to the frequency conversion signal input end of the frequency conversion power amplifier circuit board.

[0132] The current feedback input terminal of the control circuit board is electrically connected to the current feedback output terminal of the variable frequency power amplifier circuit board.

[0133] The control circuit board is electrically connected with a working status indicator light and a potentiometer.

[0134] The over-voltage and under-voltage protection circuit board is electrically connected to an over-voltage and under-voltage status indicator light.

[0135] The control output end of the low voltage execution circuit of the over- and under-voltage protection circuit board is electrically connected to the control input end of the control circuit board through the time relay and the power supply and relay combination circuit board.

[0136] The over-undervoltage protection circuit board is a bare plate-shaped structure to form a basically plate-shaped over-undervoltage protector; or,

[0137] The over-voltage and under-voltage protection circuit board is packaged by a shell to form an over-voltage and under-voltage protector that is basically a rectangular parallelepiped or a cube;

[0138] The over- and under-voltage protector, which is basically in the shape of a plate, is arranged in the sealed chamber;

[0139] The over- and under-voltage protector, which is substantially in the shape of a rectangular parallelepiped or a cube, is arranged on the wall of the chassis;

[0140] The wall of the chassis is the outer side or the inner side of the front wall of the chassis; or,

[0141] The wall of the chassis is the outer side or the inner side of the rear wall of the chassis.

[0142] Compared with the prior art, the electromagnetic heater power supply capable of isolating heat dissipation of the present invention has the following beneficial effects.

[0143] 1. This technical solution adopts the technical means that the circuit board is located in a sealed room; the head of the high-heat-generating component extends out of the sealed room in a sealed manner, and the heat-dissipating part and the heat-collecting part of the radiator are located outside the sealed room, or the head of the high-heat-generating component is located in the sealed room, the heat-collecting part of the radiator extends into the sealed room in a sealed manner, and the heat-dissipating part of the radiator is located outside the sealed room. Therefore, the electromagnetic heater power supply capable of isolating and dissipating heat can work normally for a long time under harsh environmental conditions, and the circuit board will not fall on dust, and the circuit board will not be short-circuited and burned due to moisture from dust.

[0144] 2. In this technical solution, since the high-heat generating components are insulated gate bipolar transistors and / or rectifier bridges, and a plurality of low-heat generating components are distributed on the circuit board; and the plurality of low-heat generating components are technical means such as capacitors, inductors, resistors, and integrated circuit chips, the components that generate 90% of the heat can be focused on for heat dissipation, thereby greatly improving the heat dissipation efficiency.

[0145] 3. The technical solution adopts the following method: the sealed chamber is located at the upper part of the chassis; the lower part of the chassis is a heat dissipation chamber; or the sealed chamber is located at the lower part of the chassis; the upper part of the chassis is a heat dissipation chamber; the sealed chamber is composed of a plurality of panels; at least one of the plurality of panels is a detachable panel; the detachable surface and the other panels connected thereto are sealed and connected by a sealing strip; the plurality of panels include a plurality of panels of the chassis, a panel of the sealed partition, and a panel of the case cover; the detachable panel is a panel of the case cover; There are two box covers; the cross-section of the sealing strip is rectangular, circular or elliptical; the sealing strip is a solid sealing strip or a hollow sealing strip; the overall shape of the sealing strip is in the shape of a "mouth" or a "sun" or a "sun" with one less lower horizontal line or a "sun" with one less upper horizontal line; the sealing strip is provided with screw through holes (screw assembly holes) along the length direction; the sealing strip is made of silicone or foamed silicone or rubber or foam plastic or fiber cloth or cotton cloth or green shell paper or asbestos paper or insulating paper, so it is not only beneficial to sealing, but also beneficial to heat dissipation.

[0146] 4. The technical solution adopts that the heat dissipation part of the radiator is located in the heat dissipation chamber; the heat dissipation chamber and the sealed chamber are separated by a sealed partition; the sealed partition is made of a metal plate, a plastic plate, an epoxy resin plate or a bakelite plate; the sealed partition is provided with pin holes; the pins of the high-heat-generating components are insulated and sealed through the pin holes of the sealed partition and are electrically connected to the circuit board; an insulating heat shrink tube is sleeved on the pins of the high-heat-generating components; the insulating heat shrink tube and the pin holes of the sealed partition are sealed and connected by electronic sealant (which is conducive to further improving the sealing performance); or, the sealed partition is provided with a heat dissipation port; the shape of the heat dissipation port is rectangular, circular or elliptical; the upper edge of the heat dissipation port is sealed and connected to the bottom of the circuit board through a seal; the shape of the seal is annular; The seal is in the shape of a rectangular ring, a circular ring or an elliptical ring; the seal and the bottom of the circuit board form a heat collection area; the heat collection part of the radiator passes through the heat dissipation port and enters the heat collection area; the heat collection part of the radiator is insulated and fixedly connected to the circuit board (which is conducive to discharging the heat in the sealed chamber out of the sealed chamber); or, the circuit board is provided with a through hole at the heat collection area; the heat collection part of the radiator passes through the through hole; the side of the heat collection part of the radiator is sealed and connected to the through hole by electronic glue; a heat-conducting insulating sheet is attached to the bottom of the circuit board at the heat collection area, or, the bottom of the circuit board is coated with insulating paint (which is conducive to further discharging the heat in the sealed chamber out of the sealed chamber). Therefore, a variety of electromagnetic heater power supplies with isolation and heat dissipation can be produced according to the needs of different users.

[0147] 5. The technical solution adopts the circuit board including the variable frequency power amplifier circuit board, the over-under voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board; the variable frequency power amplifier circuit board, the over-under voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board are electrically connected through an interface; the variable frequency power amplifier circuit board is close to the sealed partition; the over-under voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board are located above the variable frequency power amplifier circuit board; the variable frequency power amplifier circuit board is insulated and fixedly connected with the over-under voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board through a supporting column; the upper cavity and the lower cavity of the four circuit boards, the over-under voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board, form a circulating air duct; at least one circulating fan is arranged on the circulating air duct; the circulating fan has one; the circulating fan is located at the upper rear part of the sealed chamber, so it is beneficial to the heat dissipation of the sealed chamber.

[0148] 6. The technical solution adopts the following technical means: there are multiple high-heat-generating components; multiple high-heat-generating components are electrically connected to the variable-frequency power amplifier circuit board; multiple tube heads of the high-heat-generating components are located on the top of the circuit board; or multiple tube heads of the high-heat-generating components are located below the circuit board; multiple tube heads of the high-heat-generating components are away from the board surface of the circuit board; or multiple tube heads of the high-heat-generating components are close to the board surface of the circuit board; multiple tube heads of the high-heat-generating components are arranged horizontally; or multiple tube heads of the high-heat-generating components are arranged vertically; the tube heads of the high-heat-generating components are fixedly connected to the side of the heat collecting part of the radiator by thermal conductivity; or the tube heads of the high-heat-generating components are fixedly connected to the top of the heat collecting part of the radiator by thermal conductivity. Therefore, a variety of electromagnetic heater power supplies with isolated heat dissipation can be produced according to actual conditions.

[0149] 7. Since the present technical solution adopts the technical means that the radiator is made of aluminum and / or copper (which is conducive to producing a radiator with high heat dissipation efficiency at a lower cost); or, the radiator is a phase change radiator; the phase change radiator is an aluminum shell phase change radiator or a copper shell phase change radiator or a thermally conductive silicone shell phase change radiator, heat dissipation can be performed in a variety of ways.

[0150] 8. The technical solution adopts the following technical means: the heat dissipation part is made of aluminum; the heat dissipation part includes a heat sink and multiple heat sinks; the multiple heat sinks are distributed on one side or both sides of the heat sink; the heat collecting part is made of copper plate; the copper plate is a red copper plate; the heat collecting part is fixedly connected to one side or part of one side of the heat sink by a first fixing screw; thermal conductive silicone grease is applied between the heat collecting part and the heat sink; the edge or middle part of the heat collecting part extends upward to form an extended heat collecting part; there are multiple radiators; and the multiple radiators are fixed together by a connecting plate and a second fixing screw. Therefore, multiple high-heat generating components can be cooled.

[0151] 9. The technical solution adopts the following technical means: an air inlet is provided at the lower rear part of the chassis; an air outlet is provided at the lower front part of the chassis; at least one cooling fan is arranged between the air inlet and the radiator; there are two cooling fans; a gap is left between the cooling fan and the air inlet; and the gap between the cooling fan and the air inlet is greater than or equal to 5 mm, so the heat dissipation efficiency can be greatly improved.

[0152] 10. This technical solution uses the technical means of arranging a power switch, a working status indicator light, a time relay, a voltmeter, an ammeter, a potentiometer, and an over-voltage and under-voltage status indicator light on the upper front part of the chassis, so it is conducive to observing and operating the electromagnetic heater power supply.

[0153] 11. The technical solution adopts the technical means that the over-voltage and under-voltage protection circuit board has one over-voltage and under-voltage protection circuit board; or, the over-voltage and under-voltage protection circuit board has two sub-over-voltage and under-voltage protection circuit boards; one of the over-voltage and under-voltage protection circuit boards has one over-voltage and under-voltage protection circuit; or, one of the over-voltage and under-voltage protection circuit boards has two sub-over-voltage and under-voltage protection circuits; both of the sub-over-voltage and under-voltage protection circuit boards have sub-over-voltage and under-voltage protection circuits; one of the over-voltage and under-voltage protection circuits is a high-voltage over-voltage and under-voltage protection circuit or a low-voltage over-voltage and under-voltage protection circuit or a high-low-voltage over-voltage and under-voltage protection circuit; one of the two sub-over-voltage and under-voltage protection circuits is a high-voltage over-voltage and under-voltage protection circuit, and the other is a low-voltage over-voltage and under-voltage protection circuit; the sub-over-voltage and under-voltage protection circuit of one of the two sub-over-voltage and under-voltage protection circuit boards is a high-voltage over-voltage and under-voltage protection circuit, and the sub-over-voltage and under-voltage protection circuit of the other sub-over-voltage and under-voltage protection circuit is a low-voltage over-voltage and under-voltage protection circuit. Therefore, when the power supply voltage of the electromagnetic heater power supply is too high or too low, the power supply can be quickly cut off to prevent the insulated gate bipolar transistor (i.e., IGPT) from being burned out.

[0154] 12. The technical solution adopts the technical means that the over-voltage and under-voltage protection circuit includes a rectifier circuit; the input end of the rectifier circuit is electrically connected to the output end of the external power supply; the output end of the rectifier circuit is electrically connected to the input end of the voltage stabilizing circuit; the first output end of the voltage stabilizing circuit is electrically connected to the first input end of the comparison circuit; the second input end of the comparison circuit is electrically connected to the output end of the AC / DC sampling circuit; the third input end of the comparison circuit is electrically connected to the output end of the reference circuit; the input end of the reference circuit is electrically connected to the second output end of the voltage stabilizing circuit; the output end of the comparison circuit is electrically connected to the first input end of the drive circuit; the second input end of the drive circuit is electrically connected to the output end of the delay circuit; the output end of the drive circuit is electrically connected to the input end of the execution circuit. Therefore, it can not only prevent the insulated gate bipolar transistor (i.e., IGPT) from being burned out, but also automatically supply power to the electromagnetic heater when the voltage is normal.

[0155] 13. This technical solution adopts the technical means that the execution circuit of the high and low voltage over-voltage and under-voltage protection circuit is divided into a high voltage execution circuit and a low voltage execution circuit; the output end of the drive circuit is divided into a first output end and a second output end; the first output end of the drive circuit is electrically connected to the input end of the high voltage execution circuit; the main circuit execution element in the high voltage execution circuit is a small relay or an intermediate relay or a contactor; the second output end of the drive circuit is electrically connected to the input end of the low voltage execution circuit; the control DC circuit execution element in the low voltage execution circuit is a small PNP triode or a small NPN triode or a small power thyristor or a small power insulated gate field effect tube or a normally closed micro-relay; the normally closed micro-relay is a normally closed reed switch relay or a normally closed small high-frequency relay; Therefore, the transistor output can be used to control the control circuit, and the electromagnetic relay is used to control the main circuit. The control circuit has a fast response time, which is in the nanosecond or microsecond level. The control circuit has no contacts, no noise, and no interference. The transistor components used in the control circuit have low circuit power and low cost. The electromagnetic relay is used to control the main circuit at a low cost of milliseconds. Electromagnetic relays are used to control the main circuit, and are not prone to malfunction and have strong stability. Electromagnetic relays are used to control the main circuit. There is no leakage current and no temperature in the off state. Electromagnetic relays are used to control the main circuit. There is no voltage drop in the on state, and the heat generation is small. No heat dissipation is required, and the continuity is good. The control circuit first cuts off the working signal to put the equipment in standby state. When the electromagnetic relay disconnects the main circuit, there is no current or the current is very small, and there is no spark on the contacts, which is not easy to damage the contacts of the electromagnetic relay. The equipment is in standby state first, and then the electromagnetic relay disconnects the main circuit, which is not easy to damage the equipment. Electromagnetic relays are used to control the load of the main circuit regardless of withstand voltage and AC and DC types. Electromagnetic relays are used to control the main circuit and are isolated components.

[0156] 14. In this technical solution, the execution circuit of the high-voltage over-voltage and under-voltage protection circuit is a high-voltage execution circuit; the output end of the drive circuit is electrically connected to the input end of the high-voltage execution circuit; the main circuit execution element in the high-voltage execution circuit is an AC solid-state relay or an electromagnetic relay; the AC solid-state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor. Therefore, the response time is fast, and the commonly used thyristor (also known as thyristor) has a response time of 10 milliseconds. If the execution element composed of high-speed MOS or IGBT tubes is used, it can reach the nanosecond level to the microsecond level. No contacts, no noise, no interference. It belongs to an isolated component. However, the solid-state relay is large in size and high in price. The on-state voltage drop is large and the heat generation is large, and the load capacity will drop rapidly. The voltage drop is large and the continuity is poor. The off-state leakage current causes the temperature to rise, and the heat dissipation needs to be assisted by a radiator. The load is divided into withstand voltage and AC and DC types. The output of the electromagnetic relay has no voltage drop. Good continuity, small temperature rise, and no need for heat dissipation. Cheap price. It is an isolated component. The load is not affected by voltage and AC / DC. There is no leakage current and temperature in the off state. There is no voltage drop in the on state, and the heat is small, no heat dissipation is required, and the continuity is good. However, the response time of the electromagnetic relay is slow, which is normally 2 to 20 milliseconds, which is in the millisecond level. The larger the size, the slower the response time. The contacts are prone to sparking. The larger the working current of the contacts, the easier it is to spark, and the contact life is short. The larger the working current of the contacts, the easier it is to spark, causing the high temperature of the contacts, which is easy to stick to the contacts and cause malfunction. The larger the working current of the contacts, the easier it is to spark, causing the high temperature of the contacts to oxidize easily, resulting in poor contact. The larger the size, the greater the noise.

[0157] 15. This technical solution adopts the technical means that the execution circuit of the low-voltage over-voltage and under-voltage protection circuit is a low-voltage execution circuit; the output end of the driving circuit is electrically connected to the input end of the low-voltage execution circuit; the control DC circuit execution element in the low-voltage execution circuit is a DC solid-state relay or a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect tube or an optocoupler switch element, so the amplified output type (also called simplified solid-state relay output) such as optocoupler isolation transistor or field effect tube has a fast response time, which is in the nanosecond and microsecond levels, depending on the element. No contact, no noise, no interference. . It is an isolated component, and the current can reach several amperes to more than ten amperes depending on the element. Compared with solid-state relays, the circuit is simple and the cost is low. However, the amplified output load such as optocoupler isolation transistor or field effect tube is divided into withstand voltage and AC and DC types. Compared with solid-state relays, the circuit stability is poor, the output power is low, and it is limited to low requirements and / or low power occasions.

[0158] 16. This technical solution adopts the input end of the AC / DC sampling circuit to be electrically connected to the output end of the external power supply; the output end of the external power supply is electrically connected to the power input end of the terminal through the control output end of the high-voltage execution circuit; a leakage switch, an ammeter, a voltmeter, a fuse, and a power switch are electrically connected between the control output end of the high-voltage execution circuit and the power input end of the terminal; the first power output end of the terminal is electrically connected to the power input end of the variable frequency power amplifier circuit board; the power input and output end of the variable frequency power amplifier circuit board is electrically connected to the electromagnetic heater gun head; the second power output end of the terminal is electrically connected to the power input end of the power supply and relay combination circuit board, the power input end of the time relay, and the power input end of the power supply circuit board; the power supply and relay combination circuit board is electrically connected to the fan in the electromagnetic heater gun head; the power supply and relay combination circuit board is electrically connected to the electromagnetic heater switch; the power supply circuit board is electrically connected to two cooling fans and a circulation fan; The third power output terminal of the terminal is electrically connected to the power input terminal of the over- and under-voltage protection circuit board; the control output terminal of the low-voltage execution circuit of the over- and under-voltage protection circuit board is electrically connected to the control input terminal of the control circuit board; the power input terminal of the control circuit board is electrically connected to the power output terminal of the power circuit board; the frequency conversion signal output terminal of the control circuit board is electrically connected to the frequency conversion signal input terminal of the variable frequency power amplifier circuit board; the current feedback input terminal of the control circuit board is electrically connected to the current feedback output terminal of the variable frequency power amplifier circuit board; the control circuit board is electrically connected with a working status indicator light and a potentiometer; the over- and under-voltage protection circuit board is electrically connected with an over- and under-voltage status indicator light; the control output terminal of the low-voltage execution circuit of the over- and under-voltage protection circuit board is electrically connected to the control input terminal of the control circuit board through the time relay and the power supply and relay combination circuit board. Therefore, the overall circuit of the electromagnetic heater power supply can be optimized and the function of the electromagnetic heater power supply can be fully exerted.

[0159] 17. The technical solution adopts the technical means that the over-voltage and under-voltage protection circuit board is a naked plate structure to form an over-voltage and under-voltage protector that is basically in the shape of a plate (which is beneficial to reducing manufacturing costs and facilitating heat dissipation); or, the over-voltage and under-voltage protection circuit board is encapsulated in a shell to form an over-voltage and under-voltage protector that is basically in the shape of a rectangular parallelepiped or a cube (which is beneficial to flexible installation and easy use); the over-voltage and under-voltage protector that is basically in the shape of a plate is arranged in the sealed chamber; the over-voltage and under-voltage protector that is basically in the shape of a rectangular parallelepiped or a cube is arranged on the wall of the chassis; the wall of the chassis is the outer side surface or the inner side surface of the front wall of the chassis; or, the wall of the chassis is the outer side surface or the inner side surface of the rear wall of the chassis, so a variety of electromagnetic heater power supplies can be manufactured according to the needs of different customers and actual conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0160] The electromagnetic heater power supply capable of isolating and dissipating heat of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0161] Figure 1 It is a schematic diagram of the main structure of the electromagnetic heater power supply in the prior art.

[0162] Figure 2 It is a schematic diagram of the three-dimensional structure of the first electromagnetic heater power supply of the present invention.

[0163] Figure 3 This is a schematic diagram of the main structure of the first electromagnetic heater power supply of the present invention.

[0164] Figure 3A This is a schematic diagram of the main structure of the second electromagnetic heater power supply of the present invention.

[0165] Figure 3B This is a schematic diagram of the main structure of the third electromagnetic heater power supply of the present invention.

[0166] Figure 4 It is a schematic diagram of the main structure of the first high-efficiency heat-conducting radiator in the electromagnetic heater power supply of the present invention.

[0167] Figure 5 It is a right side structural schematic diagram of the first high-efficiency heat-conducting radiator in the electromagnetic heater power supply of the present invention.

[0168] Figure 6 It is a schematic diagram of the structure of the first high-efficiency heat-conducting radiator in the electromagnetic heater power supply of the present invention from a bottom view.

[0169] Figure 7 It is a structural schematic diagram of the first setting of the second high-efficiency thermal heat sink IGBT in the electromagnetic heater power supply of the present invention.

[0170] Figure 8 It is a structural schematic diagram of a second arrangement of a second high-efficiency heat-conducting heat sink IGBT in the electromagnetic heater power supply of the present invention.

[0171] Fig. 9 It is a structural schematic diagram of the third arrangement of the second high-efficiency thermal conductive heat sink IGBT in the electromagnetic heater power supply of the present invention.

[0172] Fig.10 It is a schematic structural diagram of the third type of high-efficiency heat-conducting radiator in the electromagnetic heater power supply of the present invention.

[0173] Fig.11 It is a schematic structural diagram of a fourth type of high-efficiency heat-conducting radiator in the electromagnetic heater power supply of the present invention.

[0174] Fig.12It is a schematic diagram of the first connection structure between the heat sink, IGBT and circuit board in the electromagnetic heater power supply of the present invention.

[0175] Fig.13 This is a schematic diagram of a second connection structure between the heat sink, IGBT, and circuit board in the electromagnetic heater power supply of the present invention.

[0176] Fig.14 This is a schematic diagram of a third connection structure among the heat sink, IGBT and circuit board in the electromagnetic heater power supply of the present invention.

[0177] Fig.15 This is a schematic diagram of a fourth connection structure among the heat sink, IGBT and circuit board in the electromagnetic heater power supply of the present invention.

[0178] Fig.16 This is a schematic diagram of a fifth connection structure among the heat sink, IGBT, and circuit board in the electromagnetic heater power supply of the present invention.

[0179] Fig.17 This is a schematic diagram of the sixth connection structure between the heat sink, IGBT and circuit board in the electromagnetic heater power supply of the present invention.

[0180] Fig.18 This is a schematic diagram of the seventh connection structure between the heat sink, IGBT and circuit board in the electromagnetic heater power supply of the present invention.

[0181] Fig.19 It is a schematic diagram of the electrical connection structure of the electromagnetic heater power supply of the present invention.

[0182] Fig. 20 It is a schematic diagram of the principle of the first over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0183] Fig.21 It is a schematic diagram of the connection structure of the first over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0184] Fig. 22 It is a schematic diagram of the principle of the second over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0185] Fig.23 It is a schematic diagram of the connection structure of the second over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0186] Fig.24 It is a schematic diagram of the principle of the third over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0187] Fig.25 It is a schematic diagram of the connection structure of the third over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0188] Fig.26 It is a schematic diagram of the fourth over-voltage and under-voltage protection circuit principle in the electromagnetic heater power supply of the present invention.

[0189] Fig. 27 It is a schematic diagram of the connection structure of the fourth over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0190] Fig.28 It is a schematic diagram of the fifth over-voltage and under-voltage protection circuit principle in the electromagnetic heater power supply of the present invention.

[0191] Fig.29 It is a schematic diagram of the connection structure of the fifth over-voltage and under-voltage protection circuit in the electromagnetic heater power supply of the present invention.

[0192] The description of the reference numerals is as follows.

[0193] 1~Circuit board;

[0194] 1-1~Frequency conversion power amplifier circuit board;

[0195] 1-2~Overvoltage and undervoltage protection circuit board;

[0196] 1-2-1~High voltage execution circuit;

[0197] 1-2-2~Low voltage execution circuit;

[0198] 1-2-3~AC / DC sampling circuit;

[0199] 1-3 ~ Power supply and relay combination circuit board;

[0200] 1-4~Control circuit board;

[0201] 1-5~Power supply circuit board;

[0202] 1-6~High heat generation components;

[0203] 1-7~Low heat generation components;

[0204] 1-8~Support column;

[0205] 2~Radiator;

[0206] 2-1~Heat dissipation part;

[0207] 2-1-1~Heat radiator;

[0208] 2-1-2~Heat sink;

[0209] 2-2~Heat collecting part;

[0210] 2-3~First fixing screw;

[0211] 2-4~Connecting plate;

[0212] 2-5~Second fixing screw;

[0213] 3. Cooling fan;

[0214] 4~Chassis;

[0215] 4-1~Air inlet;

[0216] 4-2~Air outlet;

[0217] 5~Cooling room;

[0218] 6~Sealed room;

[0219] 7~Sealing partition;

[0220] 8~Seal;

[0221] 9~Circulation fan;

[0222] 10~Power switch;

[0223] 11~Working status indicator light;

[0224] 12~Time relay;

[0225] 13~Voltmeter;

[0226] 14~Ammeter;

[0227] 15~Potentiometer;

[0228] 16~Sealing strip;

[0229] 17~Leakage switch;

[0230] 18~Terminal;

[0231] 19~Fuse tube;

[0232] 20~Electromagnetic heater gun tip;

[0233] 21~Fan inside the electromagnetic heater gun head;

[0234] 22~Electromagnetic heater switch;

[0235] 23~Overvoltage and undervoltage status indicator light. DETAILED DESCRIPTION

[0236] like Figure 2 , Figure 3 , Figure 3AAs shown, this embodiment provides an electromagnetic heater power supply capable of isolating heat dissipation, including a circuit board 1 and a heat sink 2. The circuit board 1 is electrically connected to the pins of high-heat-generating components 1-6. The heat sink 2 has a heat dissipation portion 2-1 and a heat collection portion 2-2. The head of the high-heat-generating component 1-6 is fixedly connected to the heat collection portion 2-2 of the heat sink 2 by thermal conductivity. The circuit board 1 is located in a sealed chamber 6. The head of the high-heat-generating component 1-6 extends out of the sealed chamber 6 in a sealed manner. The heat dissipation portion 2-1 and the heat collection portion 2-2 of the heat sink 2 are located outside the sealed chamber 6. Of course, it can also be as follows Figure 3B As shown, the head of the high heat generating component 1 - 6 is located in the sealed chamber 6 , the heat collecting portion 2 - 2 of the radiator 2 extends into the sealed chamber 6 in a sealed manner, and the heat dissipating portion 2 - 1 of the radiator 2 is located outside the sealed chamber 6 .

[0237] This embodiment adopts the technical means that the circuit board is located in a sealed room; the head of the high-heat-generating component is sealedly extended outside the sealed room, the heat dissipation part and the heat collection part of the radiator are located outside the sealed room, or the head of the high-heat-generating component is located in the sealed room, the heat collection part of the radiator is sealedly extended into the sealed room, and the heat dissipation part of the radiator is located outside the sealed room. Therefore, the electromagnetic heater power supply with isolation and heat dissipation can work normally for a long time under harsh environmental conditions, the circuit board will not fall on dust, and the circuit board will not be short-circuited and burned due to dust and moisture, and the manufacturing cost is not increased much.

[0238] Here, it is particularly emphasized that according to the long-term experience accumulated by the applicant, combined with the meticulous observation of the working state of the electromagnetic heater power supply, through theoretical research and repeated practice, it is finally found that the ratio of the heat generated by the high-heat components (such as insulated gate bipolar transistors and rectifier bridges) on the circuit board in the electromagnetic heater power supply to the heat generated by the low-heat components (capacitors, resistors, inductors, integrated circuit chips) is 9:1. While the number of high-heat components is only a few, the number of low-heat components is dozens or even hundreds. The applicant believes that there is no better way to dissipate heat than using the existing heat dissipation method to dissipate heat for all components on the circuit board. It is almost impossible to effectively isolate and dissipate heat for all components on the circuit board, which has been confirmed by the practice described above. To take a step back, even if it is possible to achieve effective isolation and heat dissipation for all components on the circuit board (such as the principle of air conditioning refrigeration), it will increase the manufacturing cost greatly, which is not worth the loss. Moreover, after further experiments and observations, it was found that the heat generated by the low-heat components (capacitors, inductors, resistors, integrated circuit chips) on the circuit board in the electromagnetic heater power supply will not burn the circuit board, which has been confirmed by repeated experiments. The electromagnetic heater power supply of this embodiment mainly performs heat dissipation treatment on high-heat generating components, and mainly performs isolation treatment on circuit boards and low-heat generating components. In this way, the technical problem of short circuit and burning of circuit boards caused by accumulation of dust and moisture on circuit boards in the prior art is solved, and the manufacturing cost is increased very little.

[0239] like Figure 2 , Figure 3 , Figure 3A , Figure 3B As shown, the high heat generating components 1-6 are insulated gate bipolar transistors and / or rectifier bridges.

[0240] A plurality of low-heat generating components 1-7 are also distributed on the circuit board 1.

[0241] The plurality of low-heat generating components 1-7 are capacitors, inductors, resistors, and integrated circuit chips.

[0242] In this embodiment, since the high-heat generating components are insulated gate bipolar transistors and / or rectifier bridges, and a plurality of low-heat generating components are distributed on the circuit board; and the plurality of low-heat generating components are technical means of capacitors, inductors, resistors, and integrated circuit chips, it is possible to implement focused heat dissipation for components that generate 90% of the heat, thereby greatly improving the heat dissipation efficiency.

[0243] like Figures 2 to 3 As shown, the sealed chamber 6 is located at the upper part of the chassis 4 .

[0244] The lower part of the chassis 4 is a heat dissipation chamber 5. Alternatively,

[0245] The sealed chamber is located in the lower part inside the chassis.

[0246] The upper part inside the chassis is a heat dissipation chamber.

[0247] The sealed chamber 6 is composed of multiple panels.

[0248] At least one of the multiple panels is a detachable panel.

[0249] The detachable panel and the other panels connected thereto are hermetically connected through a sealing strip 16.

[0250] The multiple panels include multiple panels of the chassis 4, one panel of the sealing partition 7, and one panel of the box cover (not shown in the figure).

[0251] The detachable panel is one panel of the box cover (not shown in the figure).

[0252] There are two box covers (not shown in the figure).

[0253] The cross-section of the sealing strip 16 is rectangular, circular or oval.

[0254] The sealing strip 16 is a solid sealing strip or a hollow sealing strip.

[0255] The overall shape of the sealing strip 16 is in the shape of a "mouth", a "day", a "day" with the lower horizontal bar missing, or a "day" with the upper horizontal bar missing.

[0256] The sealing strip 16 is distributed with screw through holes (screw assembly holes) along the length direction.

[0257] The sealing strip 16 is made of silica gel, foamed silica gel, rubber, foam plastic, fiber cloth, cotton cloth, phenolic paper, asbestos paper or insulating paper.

[0258] In this embodiment, the sealed chamber is located at the upper part of the chassis; the lower part of the chassis is a heat dissipation chamber; or, the sealed chamber is located at the lower part of the chassis; the upper part of the chassis is a heat dissipation chamber; the sealed chamber is composed of a plurality of panels; at least one of the plurality of panels is a detachable panel; the detachable surface and the other panels connected to it are sealed and connected by a sealing strip; the plurality of panels include a plurality of panels of the chassis, a panel of the sealing partition, and a panel of the box cover; the detachable panel is a panel of the box cover; the box cover There are two; the cross-section of the sealing strip is rectangular or circular or elliptical; the sealing strip is a solid sealing strip or a hollow sealing strip; the overall shape of the sealing strip is in the shape of a "mouth" or a "sun" or a "sun" with one less lower horizontal line or a "sun" with one less upper horizontal line; the sealing strip is provided with screw through holes (screw assembly holes) along the length direction; the sealing strip is made of silicone, or foamed silicone, or rubber, or foam plastic, or fiber cloth, or cotton cloth, or green shell paper, or asbestos paper, or insulating paper, so it is not only beneficial to sealing, but also beneficial to heat dissipation.

[0259] like Figure 2 , Figure 3 , Figure 3A As shown, the heat dissipation portion 2 - 1 of the radiator 2 is located in the heat dissipation chamber 5 .

[0260] The heat dissipation chamber 5 and the sealing chamber 6 are separated by a sealing partition 7 .

[0261] The sealing partition 7 is made of a metal plate, a plastic plate, an epoxy resin plate or a bakelite plate.

[0262] The sealing partition 7 is provided with pin through holes.

[0263] like Figure 3A As shown, the pins of the high heat generating components 1 - 6 are insulated and sealed through the pin holes of the sealing partition 7 and are electrically connected to the circuit board 1 .

[0264] The pins of the high heat generating components 1-6 are covered with insulating heat shrink tubes.

[0265] The insulating heat shrink tube is sealed and connected to the pin through-hole of the sealing partition 7 by electronic sealant.

[0266] Of course, it can also be Figure 2 and Figure 3 As shown,

[0267] The sealing partition 7 is provided with a heat dissipation opening.

[0268] The heat dissipation opening is in a rectangular, circular or elliptical shape.

[0269] The upper edge of the heat dissipation opening is sealedly connected to the bottom of the circuit board 1 via a sealing member 8 .

[0270] The sealing member 8 is annular in shape.

[0271] The sealing member 8 is in the shape of a rectangular ring, a circular ring or an elliptical ring.

[0272] The sealing member 8 and the bottom of the circuit board 1 form a heat collection area.

[0273] The heat collecting portion 2 - 2 of the radiator 2 passes through the heat dissipation opening and enters the heat collecting area.

[0274] The heat collecting portion 2 - 2 of the heat sink 2 is insulated and fixedly connected to the circuit board 1 .

[0275] It can also be Figure 3B As shown,

[0276] The circuit board 1 is provided with a through hole at the heat collection area.

[0277] The heat collecting portion 2 - 2 of the radiator 2 passes through the through hole.

[0278] The side surface of the heat collecting portion 2 - 2 of the radiator 2 is sealed and connected to the through hole by electronic glue.

[0279] A heat-conducting insulating sheet (not shown) is attached to the bottom of the circuit board 1 at the heat collection area, or the bottom of the circuit board 1 is coated with insulating paint (not shown).

[0280] In this embodiment, the heat dissipation part of the radiator is located in the heat dissipation chamber; the heat dissipation chamber and the sealed chamber are separated by a sealed partition; the sealed partition is made of a metal plate, a plastic plate, an epoxy resin plate, or a bakelite plate; the sealed partition is provided with pin holes; the pins of the high-heat-generating components are insulated and sealed through the pin holes of the sealed partition and are electrically connected to the circuit board; the pins of the high-heat-generating components are sleeved with insulating heat shrink tubes; the insulating heat shrink tubes and the pin holes of the sealed partition are sealed and connected by electronic sealant (which is beneficial to further improve the sealing performance); or, the sealed partition is provided with a heat dissipation port; the shape of the heat dissipation port is rectangular, circular, or elliptical; the upper edge of the heat dissipation port is sealed and connected to the bottom of the circuit board through a seal; the shape of the seal is annular; The seal is in the shape of a rectangular ring, a circular ring or an elliptical ring; the seal and the bottom of the circuit board form a heat collection area; the heat collection part of the radiator passes through the heat dissipation port and enters the heat collection area; the heat collection part of the radiator is insulated and fixedly connected to the circuit board (which is conducive to discharging the heat in the sealed chamber out of the sealed chamber); or, the circuit board is provided with a through hole at the heat collection area; the heat collection part of the radiator passes through the through hole; the side of the heat collection part of the radiator is sealed and connected to the through hole by electronic glue; a heat-conducting insulating sheet is attached to the bottom of the circuit board at the heat collection area, or, the bottom of the circuit board is coated with insulating paint (which is conducive to further discharging the heat in the sealed chamber out of the sealed chamber). Therefore, a variety of electromagnetic heater power supplies with isolation and heat dissipation can be produced according to the needs of different users.

[0281] like Figures 2 to 3 As shown, the circuit board 1 includes a variable frequency power amplifier circuit board 1-1, an over-voltage and under-voltage protection circuit board 1-2, a power supply and relay combination circuit board 1-3, a control circuit board 1-4, and a power supply circuit board 1-5.

[0282] The variable frequency power amplifier circuit board 1-1, the over-voltage and under-voltage protection circuit board 1-2, the power supply and relay combination circuit board 1-3, the control circuit board 1-4, and the power supply circuit board 1-5 are electrically connected through an interface.

[0283] The variable frequency power amplifier circuit board 1 - 1 is close to the sealing partition 7 .

[0284] The over-voltage and under-voltage protection circuit board 1-2, the power supply and relay combination circuit board 1-3, the control circuit board 1-4, and the power supply circuit board 1-5 are located above the variable frequency power amplifier circuit board 1-1.

[0285] The variable frequency power amplifier circuit board 1-1 is insulated and fixedly connected to the over-voltage and under-voltage protection circuit board 1-2, the power supply and relay combination circuit board 1-3, the control circuit board 1-4, and the power supply circuit board 1-5 through a support column 1-8.

[0286] The upper cavity and the lower cavity of the four circuit boards, namely, the over-voltage and under-voltage protection circuit board 1-2, the power supply and relay combination circuit board 1-3, the control circuit board 1-4, and the power supply circuit board 1-5, form a circulating air duct.

[0287] At least one circulation fan 9 is arranged on the circulation air duct.

[0288] The circulating fan 9 has one.

[0289] A circulating fan 9 is located at the upper rear portion of the sealed chamber 6 .

[0290] In this embodiment, the circuit board includes a variable frequency power amplifier circuit board, an over-voltage and under-voltage protection circuit board, a power supply and relay combination circuit board, a control circuit board, and a power supply circuit board; the variable frequency power amplifier circuit board, the over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board are electrically connected through an interface; the variable frequency power amplifier circuit board is close to the sealed partition; the over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board are located above the variable frequency power amplifier circuit board; the variable frequency power amplifier circuit board is insulated and fixedly connected with the over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board through a supporting column; the upper cavity and the lower cavity of the four circuit boards, the over-voltage and under-voltage protection circuit board, the power supply and relay combination circuit board, the control circuit board, and the power supply circuit board, form a circulating air duct; at least one circulating fan is arranged on the circulating air duct; the circulating fan has one; the circulating fan is located at the upper rear part of the sealed chamber, so it is beneficial to the heat dissipation of the sealed chamber.

[0291] like Figures 2 to 6 As shown, there are multiple high heat generating components 1-6.

[0292] The plurality of high heat generating components 1 - 6 are electrically connected to the variable frequency power amplifier circuit board 1 - 1 .

[0293] like Figures 16 to 18 As shown, the heads of the plurality of high heat generating components 1-6 are located on the circuit board 1. Or,

[0294] like Figures 12 to 15 As shown, the heads of the plurality of high heat generating components 1 - 6 are located under the circuit board 1 .

[0295] like Fig.12 and Figure 17 to Figure 18 As shown, the heads of the plurality of high heat generating components 1-6 are away from the surface of the circuit board 1. Or,

[0296] like Figure 15 to Figure 16 As shown, the tube heads of the plurality of high heat generating components 1 - 6 are close to the board surface of the circuit board 1 .

[0297] like Figures 7 to 9 As shown, the tube heads of the plurality of high heat generating components 1-6 are arranged horizontally. Or,

[0298] like Figures 10 to 12 As shown, the tube heads of the plurality of high heat generating components 1-6 are arranged vertically.

[0299] like Figures 10 to 12 As shown, the tube head of the high heat generating component 1-6 is fixedly connected to the side of the heat collecting part 2-2 of the radiator 2 through heat conduction. Or,

[0300] like Figures 7 to 9 As shown, the tube head of the high heat generating component 1 - 6 is fixedly connected to the upper surface of the heat collecting part 2 - 2 of the radiator 2 in a heat-conducting manner.

[0301] Since the present embodiment adopts the technical means that there are multiple high-heat-generating components; multiple high-heat-generating components are electrically connected to the variable-frequency power amplifier circuit board; multiple tube heads of the high-heat-generating components are located on the top of the circuit board; or, multiple tube heads of the high-heat-generating components are located below the circuit board; multiple tube heads of the high-heat-generating components are away from the board surface of the circuit board; or, multiple tube heads of the high-heat-generating components are close to the board surface of the circuit board; multiple tube heads of the high-heat-generating components are arranged horizontally; or, multiple tube heads of the high-heat-generating components are arranged vertically; the tube heads of the high-heat-generating components are fixedly connected to the side of the heat collecting part of the radiator by thermal conduction; or, the tube heads of the high-heat-generating components are fixedly connected to the top of the heat collecting part of the radiator by thermal conduction, a variety of electromagnetic heater power supplies with isolated heat dissipation can be produced according to actual conditions.

[0302] like Figures 4 to 6 As shown, the heat sink 2 is made of aluminum and / or copper. Or,

[0303] The heat sink 2 is a phase change heat sink.

[0304] The phase-change radiator is an aluminum shell phase-change radiator, a copper shell phase-change radiator, or a thermally conductive silicone shell phase-change radiator.

[0305] Since the present embodiment adopts the technical means that the heat sink is made of aluminum and / or copper (which is conducive to producing a heat sink with high efficiency in heat dissipation at a lower cost); or, the heat sink is a phase change heat sink; the phase change heat sink is an aluminum shell phase change heat sink or a copper shell phase change heat sink or a thermally conductive silicone shell phase change heat sink, heat dissipation can be achieved in a variety of ways.

[0306] like Figures 4 to 6 As shown, the heat dissipation part 2-1 is made of aluminum.

[0307] The heat dissipation unit 2-1 includes a heat dissipation plate 2-1-1 and a plurality of heat dissipation fins 2-1-2.

[0308] The plurality of heat sinks 2-1-2 are distributed on one side or both sides of the heat sink 2-1-1.

[0309] The heat collecting part 2 - 2 is made of copper plate.

[0310] The copper plate is a red copper plate.

[0311] The heat collecting portion 2-2 is fixedly connected to one surface or a part of one surface of the heat dissipation plate 2-1-1 by a first fixing screw 2-3.

[0312] Thermal conductive silicone grease is applied between the heat collecting portion 2-2 and the heat dissipation plate 2-1-1.

[0313] The side or middle portion of the heat collecting portion 2 - 2 extends upward to form an extended heat collecting portion.

[0314] There are multiple radiators 2.

[0315] The plurality of heat sinks 2 are fixed together by connecting plates 2 - 4 and second fixing screws 2 - 5 .

[0316] In this embodiment, the heat dissipation part is made of aluminum; the heat dissipation part includes a heat dissipation plate and multiple heat dissipation fins; the multiple heat dissipation fins are distributed on one side or both sides of the heat dissipation plate; the heat collecting part is made of copper plate; the copper plate is a red copper plate; the heat collecting part is fixedly connected to one side or part of one side of the heat dissipation plate by a first fixing screw; thermal conductive silicone grease is applied between the heat collecting part and the heat dissipation plate; the edge or middle part of the heat collecting part extends upward to form an extended heat collecting part; there are multiple radiators; and the multiple radiators are fixed together by a connecting plate and a second fixing screw. Therefore, multiple high-heat generating components can be cooled.

[0317] like Figure 2 As shown, an air inlet 4-1 is provided at the lower rear portion of the chassis 4.

[0318] The lower front portion of the chassis 4 is provided with an air outlet 4 - 2 .

[0319] At least one cooling fan 3 is disposed between the air inlet 4 - 1 and the radiator 2 .

[0320] There are two cooling fans 3 .

[0321] A gap is left between the cooling fan 3 and the air inlet 4 - 1 .

[0322] The gap between the cooling fan 3 and the air inlet 4 - 1 is greater than or equal to 5 mm.

[0323] The gap between the cooling fan 3 and the air inlet 4 - 1 is 5 mm, 10 mm, 15 mm, 20 mm, 50 mm or 100 mm.

[0324] This embodiment adopts the technical means that an air inlet is opened at the lower rear part of the chassis; an air outlet is opened at the lower front part of the chassis; at least one cooling fan is arranged between the air inlet and the radiator; there are two cooling fans; and a 5mm gap is left between the cooling fan and the air inlet, so the heat dissipation efficiency can be greatly improved.

[0325] like Figure 2 As shown, the upper front portion of the chassis 4 is provided with a power switch 10, a working status indicator light 11, a time relay 12, a voltmeter 13, an ammeter 14, a potentiometer 15, and an over-voltage and under-voltage status indicator light 23;

[0326] There are four working status indicator lights 11;

[0327] The four working status indicator lights 11 are a temperature protection indicator light, a chip power indicator light, a program lock indicator light, and a working instruction indicator light;

[0328] There are four over-voltage and under-voltage status indicator lights 23;

[0329] The four over-voltage and under-voltage status indicator lights 23 are an input power indicator light, an under-voltage indicator light, an over-voltage indicator light, and an output power indicator light.

[0330] Since this embodiment adopts the technical means of arranging a power switch, a working status indicator light, a time relay, a voltmeter, an ammeter, a potentiometer, and an over-voltage and under-voltage status indicator light on the upper front part of the chassis, it is conducive to observing and operating the electromagnetic heater power supply.

[0331] like Figure 2 As shown, the over-voltage and under-voltage protection circuit board 1-2 has an over-voltage and under-voltage protection circuit board. Or,

[0332] The over-voltage and under-voltage protection circuit board 1-2 has two sub-over-voltage and under-voltage protection circuit boards.

[0333] One of the over-voltage and under-voltage protection circuit boards has an over-voltage and under-voltage protection circuit. Or,

[0334] One of the over-voltage and under-voltage protection circuit boards has two sub-over-voltage and under-voltage protection circuits.

[0335] The two sub-overvoltage and undervoltage protection circuit boards both have sub-overvoltage and undervoltage protection circuits.

[0336] One of the over-voltage and under-voltage protection circuits is a high-voltage over-voltage and under-voltage protection circuit or a low-voltage over-voltage and under-voltage protection circuit or a high-low-voltage over-voltage and under-voltage protection circuit.

[0337] One of the two sub-overvoltage and undervoltage protection circuits is a high-voltage overvoltage and undervoltage protection circuit, and the other is a low-voltage overvoltage and undervoltage protection circuit.

[0338] The sub-overvoltage and undervoltage protection circuit of one of the two sub-overvoltage and undervoltage protection circuit boards is a high-voltage overvoltage and undervoltage protection circuit, and the sub-overvoltage and undervoltage protection circuit of the other sub-overvoltage and undervoltage protection circuit board is a low-voltage overvoltage and undervoltage protection circuit.

[0339] In this embodiment, the over-voltage and under-voltage protection circuit board has one over-voltage and under-voltage protection circuit board; or, the over-voltage and under-voltage protection circuit board has two sub-over-voltage and under-voltage protection circuit boards; one over-voltage and under-voltage protection circuit board has one over-voltage and under-voltage protection circuit; or, one over-voltage and under-voltage protection circuit board has two sub-over-voltage and under-voltage protection circuits; both sub-over-voltage and under-voltage protection circuit boards have sub-over-voltage and under-voltage protection circuits; one over-voltage and under-voltage protection circuit is a high-voltage over-voltage and under-voltage protection circuit or a low-voltage over-voltage and under-voltage protection circuit or a high-low-voltage over-voltage and under-voltage protection circuit; one of the two sub-over-voltage and under-voltage protection circuits is a high-voltage over-voltage and under-voltage protection circuit, and the other is a low-voltage over-voltage and under-voltage protection circuit; the sub-over-voltage and under-voltage protection circuit of one of the two sub-over-voltage and under-voltage protection circuit boards is a high-voltage over-voltage and under-voltage protection circuit, and the sub-over-voltage and under-voltage protection circuit of the other sub-over-voltage and under-voltage protection circuit board is a low-voltage over-voltage and under-voltage protection circuit. Therefore, when the power supply voltage of the electromagnetic heater power supply is too high or too low, the power supply can be quickly cut off to prevent the insulated gate bipolar transistor (i.e., IGPT) from being burned out.

[0340] like Figures 20 to 29 As shown, the over-voltage and under-voltage protection circuit includes a rectifier circuit.

[0341] The input end of the rectifier circuit is electrically connected to the output end of the external power supply.

[0342] The output end of the rectifier circuit is electrically connected to the input end of the voltage stabilizing circuit.

[0343] The first output terminal of the voltage stabilizing circuit is electrically connected to the first input terminal of the comparison circuit.

[0344] The second input terminal of the comparison circuit is electrically connected to the output terminal of the AC / DC sampling circuit 1 - 2 - 3 .

[0345] The third input terminal of the comparison circuit is electrically connected to the output terminal of the reference circuit.

[0346] The input end of the reference circuit is electrically connected to the second output end of the voltage stabilizing circuit.

[0347] The output terminal of the comparison circuit is electrically connected to the first input terminal of the driving circuit.

[0348] The second input terminal of the driving circuit is electrically connected to the output terminal of the delay circuit.

[0349] The output end of the driving circuit is electrically connected to the input end of the execution circuit.

[0350] This embodiment adopts the technical means that the over-voltage and under-voltage protection circuit includes a rectifier circuit; the input end of the rectifier circuit is electrically connected to the output end of an external power supply; the output end of the rectifier circuit is electrically connected to the input end of a voltage stabilizing circuit; the first output end of the voltage stabilizing circuit is electrically connected to the first input end of a comparison circuit; the second input end of the comparison circuit is electrically connected to the output end of an AC / DC sampling circuit; the third input end of the comparison circuit is electrically connected to the output end of a reference circuit; the input end of the reference circuit is electrically connected to the second output end of the voltage stabilizing circuit; the output end of the comparison circuit is electrically connected to the first input end of a drive circuit; the second input end of the drive circuit is electrically connected to the output end of a delay circuit; and the output end of the drive circuit is electrically connected to the input end of an execution circuit. Therefore, it can not only prevent the insulated gate bipolar transistor (i.e., IGPT) from being burned out, but also automatically supply power to the electromagnetic heater when the voltage is normal.

[0351] like Figure 20 to Figure 21 As shown, the execution circuit of the high and low voltage over-voltage and under-voltage protection circuit is divided into a high voltage execution circuit 1-2-1 and a low voltage execution circuit 1-2-2.

[0352] The output end of the driving circuit is divided into a first output end and a second output end.

[0353] The first output terminal of the driving circuit is electrically connected to the input terminal of the high-voltage execution circuit 1-2-1.

[0354] The main circuit actuator in the high-voltage actuator circuit 1-2-1 is a small relay or an intermediate relay or a contactor.

[0355] The second output terminal of the driving circuit is electrically connected to the input terminal of the low-voltage execution circuit 1-2-2.

[0356] The control DC circuit execution element in the low-voltage execution circuit 1-2-2 is a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect transistor.

[0357] Of course, it is also possible that the control DC circuit actuator in the low-voltage actuator circuit 1-2-2 is a normally closed micro-relay.

[0358] The normally closed micro-relay is a normally closed reed switch relay or a normally closed small high-frequency relay.

[0359] In this embodiment, the execution circuit of the high and low voltage over-voltage and under-voltage protection circuit is divided into a high voltage execution circuit and a low voltage execution circuit; the output end of the drive circuit is divided into a first output end and a second output end; the first output end of the drive circuit is electrically connected to the input end of the high voltage execution circuit; the main circuit execution element in the high voltage execution circuit is a small relay or an intermediate relay or a contactor; the second output end of the drive circuit is electrically connected to the input end of the low voltage execution circuit; the control DC circuit execution element in the low voltage execution circuit is a small PNP triode or a small NPN triode or a small power thyristor or a small power insulated gate field effect tube or a normally closed micro-relay; the normally closed micro-relay is a technical means of a normally closed reed switch relay or a normally closed small high-frequency relay, so it can be realized that the transistor output is used to control the control circuit, and the electromagnetic relay is used to control the main circuit. The control circuit has a fast response time, which is in the nanosecond or microsecond level. The control circuit has no contacts, no noise, and no interference. The transistor components used in the control circuit have low circuit power and low cost. The electromagnetic relay is used to control the main circuit at a low millisecond level. Electromagnetic relays are used to control the main circuit, and are not prone to malfunction and have strong stability. Electromagnetic relays are used to control the main circuit. There is no leakage current and no temperature in the off state. Electromagnetic relays are used to control the main circuit. There is no voltage drop in the on state, and the heat generation is small. No heat dissipation is required, and the continuity is good. The control circuit first cuts off the working signal to put the equipment in standby state. When the electromagnetic relay disconnects the main circuit, there is no current or the current is very small, and there is no spark on the contacts, which is not easy to damage the contacts of the electromagnetic relay. The equipment is in standby state first, and then the electromagnetic relay disconnects the main circuit, which is not easy to damage the equipment. Electromagnetic relays are used to control the load of the main circuit regardless of withstand voltage and AC and DC types. Electromagnetic relays are used to control the main circuit and are isolated components.

[0360] like Figure 22 to Figure 25 As shown, the execution circuit of the high-voltage over-voltage and under-voltage protection circuit is a high-voltage execution circuit 1-2-1.

[0361] The output end of the driving circuit is electrically connected to the input end of the high-voltage execution circuit 1-2-1.

[0362] The main circuit execution element in the high-voltage execution circuit 1-2-1 is an AC solid-state relay or an electromagnetic relay.

[0363] The AC solid-state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor.

[0364] In this embodiment, the execution circuit of the high-voltage over-voltage and under-voltage protection circuit is a high-voltage execution circuit; the output end of the drive circuit is electrically connected to the input end of the high-voltage execution circuit; the main circuit execution element in the high-voltage execution circuit is an AC solid-state relay or an electromagnetic relay; the AC solid-state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor. Therefore, the response time is fast, and the commonly used thyristor (also known as thyristor) has a response time of 10 milliseconds. If the execution element composed of high-speed MOS or IGBT tubes is used, it can reach the nanosecond level to the microsecond level. No contacts, no noise, no interference. It belongs to isolated components. However, the solid-state relay is large in size and high in price. The on-state voltage drop is large and the heat generation is large, the load capacity will drop rapidly, the voltage drop is large, and the continuity is poor. The off-state leakage current causes the temperature to rise, and the heat sink needs to be used to dissipate heat. The load is divided into withstand voltage and AC and DC types. The output of the electromagnetic relay has no voltage drop. Good continuity, small temperature rise, and no need to use heat dissipation. Cheap price. It belongs to isolated components. The load is not affected by voltage level and AC / DC. There is no leakage current and temperature in the off state. There is no voltage drop in the on state, and the heat generation is small, no heat dissipation is required, and the continuity is good. However, the response time of the electromagnetic relay is slow, which is normally 2 to 20 milliseconds, which is in the millisecond level. The larger the size, the slower the response time. The contacts are prone to sparking. The larger the working current of the contacts, the easier it is to spark, and the contact life is short. The larger the working current of the contacts, the easier it is to spark, causing the high temperature of the contacts, which is easy to stick to the contacts and cause malfunction. The larger the working current of the contacts, the easier it is to spark, causing the high temperature of the contacts to oxidize easily, resulting in poor contact. The larger the size, the greater the noise.

[0365] like Figure 26 to Figure 29 As shown, the execution circuit of the low-voltage over-voltage and under-voltage protection circuit is a low-voltage execution circuit 1-2-2.

[0366] The output end of the driving circuit is electrically connected to the input end of the low voltage execution circuit 1-2-2.

[0367] The control DC circuit execution element in the low-voltage execution circuit 1-2-2 is a DC solid-state relay or a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect transistor or an optocoupler switch element.

[0368] In this embodiment, the execution circuit of the low-voltage over-voltage and under-voltage protection circuit is a low-voltage execution circuit; the output end of the driving circuit is electrically connected to the input end of the low-voltage execution circuit; the control DC circuit execution element in the low-voltage execution circuit is a DC solid-state relay or a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect tube or an optocoupler switch element. Therefore, the amplified output type (also called simplified solid-state relay output) such as optocoupler isolation transistor or field effect tube has a fast response time, which belongs to the nanosecond and microsecond level, depending on the element. No contact, no noise, no interference. . It is an isolated component, and the current can reach several amperes to more than ten amperes depending on the element. Compared with solid-state relays, the circuit is simple and the cost is low. However, the amplified output load such as optocoupler isolation transistor or field effect tube is divided into withstand voltage and AC and DC types. Compared with solid-state relays, the circuit stability is poor, the output power is low, and it is limited to low requirements and / or low power occasions.

[0369] like Fig.19 As shown, the input end of the AC / DC sampling circuit 1-2-3 is electrically connected to the output end of the external power supply.

[0370] The output end of the external power supply is electrically connected to the power input end of the terminal 18 through the control output end of the high-voltage execution circuit 1-2-1.

[0371] A leakage switch 17, an ammeter 14, a voltmeter 13, a fuse 19, and a power switch 10 are electrically connected between the control output end of the high-voltage execution circuit 1-2-1 and the power input end of the terminal 18.

[0372] The first power output end of the terminal 18 is electrically connected to the power input end of the variable frequency power amplifier circuit board 1 - 1 .

[0373] The power input and output terminals of the variable frequency power amplifier circuit board 1 - 1 are electrically connected to the electromagnetic heater gun head 20 .

[0374] The second power output end of the terminal 18 is electrically connected to the power input end of the power supply and relay combination circuit board 1-3, the power input end of the time relay 12, and the power input end of the power circuit board 1-5.

[0375] The power supply and relay assembly circuit board 1 - 3 is electrically connected to the fan 21 in the electromagnetic heater gun head.

[0376] The power supply and relay combination circuit board 1 - 3 is electrically connected to an electromagnetic heater switch 22 .

[0377] The power circuit board 1 - 5 is electrically connected to two cooling fans 3 and a circulation fan 9 .

[0378] The third power output terminal of the terminal 18 is electrically connected to the power input terminal of the over-voltage and under-voltage protection circuit board 1 - 2 .

[0379] The control output end of the low voltage execution circuit 1 - 2 - 2 of the over- and under-voltage protection circuit board 1 - 2 is electrically connected to the control input end of the control circuit board 1 - 4 .

[0380] The power input end of the control circuit board 1 - 4 is electrically connected to the power output end of the power circuit board 1 - 5 .

[0381] The frequency conversion signal output terminal of the control circuit board 1 - 4 is electrically connected to the frequency conversion signal input terminal of the frequency conversion power amplifier circuit board 1 - 1 .

[0382] The current feedback input terminal of the control circuit board 1 - 4 is electrically connected to the current feedback output terminal of the variable frequency power amplifier circuit board 1 - 1 .

[0383] The control circuit board 1 - 4 is electrically connected to a working status indicator light 11 and a potentiometer 15 .

[0384] The over-voltage and under-voltage protection circuit board 1 - 2 is electrically connected to an over-voltage and under-voltage status indicator light 23 .

[0385] The control output end of the low voltage execution circuit 1-2-2 of the over- and under-voltage protection circuit board 1-2 is electrically connected to the control input end of the control circuit board 1-4 through the time relay 12 and the power supply and relay combination circuit board 1-3.

[0386] In this embodiment, the input end of the AC / DC sampling circuit is electrically connected to the output end of the external power supply; the output end of the external power supply is electrically connected to the power input end of the terminal through the control output end of the high-voltage execution circuit; a leakage switch, an ammeter, a voltmeter, a fuse, and a power switch are electrically connected between the control output end of the high-voltage execution circuit and the power input end of the terminal; the first power output end of the terminal is electrically connected to the power input end of the variable frequency power amplifier circuit board; the power input and output end of the variable frequency power amplifier circuit board is electrically connected to the electromagnetic heater gun head; the second power output end of the terminal is electrically connected to the power input end of the power supply and relay combination circuit board, the power input end of the time relay, and the power input end of the power supply circuit board; the power supply and relay combination circuit board is electrically connected to the fan in the electromagnetic heater gun head; the power supply and relay combination circuit board is electrically connected to the electromagnetic heater switch; the power supply circuit board is electrically connected to two Cooling fan, circulation fan; the third power output terminal of the terminal is electrically connected to the power input terminal of the over-voltage and under-voltage protection circuit board; the control output terminal of the low-voltage execution circuit of the over-voltage and under-voltage protection circuit board is electrically connected to the control input terminal of the control circuit board; the power input terminal of the control circuit board is electrically connected to the power output terminal of the power circuit board; the frequency conversion signal output terminal of the control circuit board is electrically connected to the frequency conversion signal input terminal of the variable frequency power amplifier circuit board; the current feedback input terminal of the control circuit board is electrically connected to the current feedback output terminal of the variable frequency power amplifier circuit board; the control circuit board is electrically connected with a working status indicator light and a potentiometer; the control output terminal of the low-voltage execution circuit of the over-voltage and under-voltage protection circuit board is electrically connected to the control input terminal of the control circuit board through the time relay and the power supply and relay combination circuit board. Therefore, the overall circuit of the electromagnetic heater power supply can be optimized and the function of the electromagnetic heater power supply can be fully utilized.

[0387] The voltage and current tolerance of IGBT is related to many factors, which are summarized as follows based on the applicant's years of work experience. Taking IGBT model IRGP50B60PD1 as an example, it works in a DC voltage DC305V circuit. The AC voltage AC220V is DC305V after rectification. The safety range of voltage and current for IGBT model IRGP50B60PD1 is as follows:

[0388] 1. The safety voltage is DC291V to DC318V.

[0389] 2. The safest low voltage is DC277V plus or minus 5V, and the safest high voltage is DC332V plus or minus 5V.

[0390] 3. The less safe low voltage is DC263V plus or minus 5V, and the less safe high voltage is DC346V plus or minus 5V.

[0391] 4. The unsafe low voltage is DC249V plus or minus 5V, and the unsafe high voltage is DC360V plus or minus 5V.

[0392] 5. The vulnerable low voltage is DC235V plus or minus 5V, and the vulnerable high voltage is DC374V plus or minus 5V.

[0393] Effects of temperature and current on IGBT:

[0394] When the temperature is below 25 degrees, the IGBT model IRGP50B60PD1 can operate at a current of 75A.

[0395] When the temperature is above 25 degrees below 100 degrees, the IGBT model IRGP50B60PD1 can operate at a current of 45A.

[0396] like Figure 2 , Figures 19 to 29 As shown, the over- and under-voltage protection circuit board 1-2 is a bare plate-like structure forming a basically plate-shaped over- and under-voltage protector.

[0397] Of course, it is also possible that the over-voltage and under-voltage protection circuit board (1-2) is packaged by a shell to form an over-voltage and under-voltage protector that is basically in the shape of a rectangular parallelepiped or a cube.

[0398] The over- and under-voltage protector, which is basically in the shape of a plate, is arranged in the sealed chamber 6 .

[0399] The over- and under-voltage protector, which is substantially in the shape of a rectangular parallelepiped or a cube, is arranged on the wall of the chassis (4).

[0400] The wall of the chassis 4 is the outer side surface or the inner side surface of the front wall of the chassis 4 .

[0401] Of course, it may also be that the wall of the chassis 4 is the outer side surface or the inner side surface of the rear wall of the chassis 4.

[0402] In this embodiment, the over-voltage and under-voltage protection circuit board is a naked plate structure to form an over-voltage and under-voltage protector that is basically in the shape of a plate (which is beneficial to reducing manufacturing costs and facilitating heat dissipation); or, the over-voltage and under-voltage protection circuit board is encapsulated in a shell to form an over-voltage and under-voltage protector that is basically in the shape of a rectangular parallelepiped or a cube (which is beneficial to flexible installation and easy use); the over-voltage and under-voltage protector that is basically in the shape of a plate is arranged in the sealed chamber; the over-voltage and under-voltage protector that is basically in the shape of a rectangular parallelepiped or a cube is arranged on the wall of the chassis; the wall of the chassis is the outer side or inner side of the front wall of the chassis; or, the wall of the chassis is the outer side or inner side of the rear wall of the chassis. Therefore, a variety of electromagnetic heater power supplies can be manufactured according to the needs of different customers and actual conditions.

Claims

1. An electromagnetic heater power supply capable of isolating heat dissipation, comprising a circuit board (1) and a heat sink (2), wherein the circuit board (1) is electrically connected to the pins of a high-heat-generating component (1-6), the heat sink (2) has a heat dissipation portion (2-1) and a heat collection portion (2-2), the head of the high-heat-generating component (1-6) is fixedly connected to the heat collection portion (2-2) of the heat sink (2) by heat conduction, and characterized in that: The circuit board (1) is located inside the sealed chamber (6); the heads of the high-heat-generating components (1-6) extend out of the sealed chamber (6) in a sealed manner, and the heat dissipation part (2-1) and the heat collection part (2-2) of the radiator (2) are located outside the sealed chamber (6), or the heads of the high-heat-generating components (1-6) are located inside the sealed chamber (6), and the heat collection part (2-2) of the radiator (2) extends into the sealed chamber (6) in a sealed manner, and the heat dissipation part (2-1) of the radiator (2) is located outside the sealed chamber (6).

2. The electromagnetic heater power supply capable of isolated heat dissipation according to claim 1, wherein: The high-heat-generating components (1-6) are insulated gate bipolar transistors and / or rectifier bridges; A plurality of low-heat-generating components (1-7) are also distributed on the upper surface of the circuit board (1); The plurality of low-heat-generating components (1-7) are capacitors, inductors, resistors, and integrated circuit chips; The sealed chamber (6) is located in the upper part inside the chassis (4); The lower part inside the chassis (4) is a heat dissipation chamber (5); or, The sealed chamber is located in the lower part inside the chassis; The upper part inside the chassis is a heat dissipation chamber; The sealed chamber (6) is composed of a plurality of panels; At least one of the plurality of panels is a detachable panel; The detachable panel is sealed and connected to the other panels connected thereto through a sealing strip (16); The plurality of panels include a plurality of panels of the chassis (4), a panel of the sealing partition (7), and a panel of the box cover; The detachable panel is a panel of the box cover; There are two box covers; The cross-section of the sealing strip (16) is rectangular, circular, or oval; The sealing strip (16) is a solid-core sealing strip or a hollow-core sealing strip; The overall shape of the sealing strip (16) is in the shape of a "mouth", a "day", a "day" shape with one lower horizontal bar missing, or a "day" shape with one upper horizontal bar missing; Screw through holes are distributed along the length direction of the sealing strip (16); The sealing strip (16) is made of silicone, foamed silicone, rubber, foam plastic, fiber cloth, cotton cloth, phenolic paper, asbestos paper, or insulating paper; The heat dissipation part (2-1) of the radiator (2) is located inside the heat dissipation chamber (5); The heat dissipation chamber (5) and the sealed chamber (6) are separated by a sealing partition (7); The sealing partition (7) is made of a metal plate, a plastic plate, an epoxy resin plate, or an insulating board; The sealing partition (7) is provided with pin through holes; The pins of the high-heat-generating components (1-6) pass through the pin through holes of the sealing partition (7) in an insulated and sealed manner and are electrically connected to the circuit board (1); Insulating heat shrink tubes are sleeved on the pins of the high-heat-generating components (1-6); The insulating heat shrink tubes are sealed and connected to the pin through holes of the sealing partition (7) through electronic sealant; Or, The sealing partition (7) is provided with heat dissipation openings; The shape of the heat dissipation openings is rectangular, circular, or oval; The upper edge of the heat dissipation openings is sealed and connected to the lower surface of the circuit board (1) through a sealing member (8); The shape of the sealing member (8) is annular; The sealing member (8) is in the shape of a rectangular ring, a circular ring or an elliptical ring; The sealing member (8) and the bottom of the circuit board (1) form a heat collection area; The heat collecting portion (2-2) of the radiator (2) passes through the heat dissipation opening and enters the heat collecting area; The heat collecting portion (2-2) of the radiator (2) is insulated and fixedly connected to the circuit board (1); or, The circuit board (1) is provided with a through hole located at the heat collection area; The heat collecting portion (2-2) of the radiator (2) passes through the through hole; The side surface of the heat collecting portion (2-2) of the radiator (2) and the through hole are sealed and connected via electronic glue; A heat-conducting insulating sheet is attached to the bottom of the circuit board (1) at the heat collection area, or the bottom of the circuit board (1) is coated with insulating paint.

3. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 2, characterized in that: The circuit board (1) comprises a variable frequency power amplification circuit board (1-1), an overvoltage and undervoltage protection circuit board (1-2), a power supply and relay combination circuit board (1-3), a control circuit board (1-4), and a power supply circuit board (1-5); The variable frequency power amplifier circuit board (1-1), the overvoltage and undervoltage protection circuit board (1-2), the power supply and relay combination circuit board (1-3), the control circuit board (1-4), and the power supply circuit board (1-5) are electrically connected via an interface; The variable frequency power amplifier circuit board (1-1) is close to the sealing partition (7); The over-voltage and under-voltage protection circuit board (1-2), the power supply and relay combination circuit board (1-3), the control circuit board (1-4), and the power supply circuit board (1-5) are located above the variable frequency power amplification circuit board (1-1); The variable frequency power amplifier circuit board (1-1) is insulated and fixedly connected to the overvoltage and undervoltage protection circuit board (1-2), the power supply and relay combination circuit board (1-3), the control circuit board (1-4), and the power supply circuit board (1-5) through a support column (1-8); The upper cavity and the lower cavity of the four circuit boards, namely, the over-voltage and under-voltage protection circuit board (1-2), the power supply and relay combination circuit board (1-3), the control circuit board (1-4), and the power supply circuit board (1-5), form a circulating air duct; At least one circulation fan (9) is provided on the circulation air duct; There are multiple high heat generating components (1-6); The plurality of high-heat generating components (1-6) are electrically connected to the variable frequency power amplifier circuit board (1-1); The heads of the plurality of high heat generating components (1-6) are located on the circuit board (1); or, The tube heads of the plurality of high-heat generating components (1-6) are located below the circuit board (1); The heads of the plurality of high-heat generating components (1-6) are away from the surface of the circuit board (1); or, The tube heads of the plurality of high-heat generating components (1-6) are close to the board surface of the circuit board (1); The tube heads of the plurality of high heat generating components (1-6) are arranged horizontally; or, The tube heads of the plurality of high heat generating components (1-6) are arranged vertically; The tube head of the high-heat-generating component (1-6) is fixedly connected to the side of the heat collecting portion (2-2) of the radiator (2) in a heat-conducting manner; or, The tube head of the high-heat-generating component (1-6) is fixedly connected to the upper surface of the heat collecting part (2-2) of the radiator (2) in a heat-conducting manner.

4. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 3, characterized in that: The radiator (2) is made of aluminum and / or copper; or, The heat sink (2) is a phase change heat sink; The phase-change radiator is an aluminum shell phase-change radiator, a copper shell phase-change radiator, or a thermally conductive silicone shell phase-change radiator; The heat dissipation part (2-1) is made of aluminum; The heat dissipation part (2-1) comprises a heat dissipation plate (2-1-1) and a plurality of heat dissipation fins (2-1-2); The plurality of heat sinks (2-1-2) are distributed on one side or both sides of the heat sink (2-1-1); The heat collecting part (2-2) is made of a copper plate; The heat collecting portion (2-2) is fixedly connected to one surface or a part of one surface of the heat dissipation plate (2-1-1) via a first fixing screw (2-3); Thermal conductive silicone grease is applied between the heat collecting portion (2-2) and the heat dissipation plate (2-1-1); The side portion or the middle portion of the heat collecting portion (2-2) extends upward to form an extended heat collecting portion; There are multiple radiators (2); A plurality of the heat sinks (2) are fixed together via a connecting plate (2-4) and a second fixing screw (2-5).

5. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 4, characterized in that: An air inlet (4-1) is provided at the lower rear portion of the chassis (4); The lower front portion of the chassis (4) is provided with an air outlet (4-2); At least one cooling fan (3) is arranged between the air inlet (4-1) and the radiator (2); A gap is left between the cooling fan (3) and the air inlet hole (4-1); The gap between the cooling fan (3) and the air inlet (4-1) is greater than or equal to 5 mm; The upper front portion of the chassis (4) is provided with a power switch (10), a working status indicator light (11), a time relay (12), a voltmeter (13), an ammeter (14), a potentiometer (15), and an overvoltage and undervoltage status indicator light (23); There are four working status indicator lights (11); The four working status indicator lights (11) are a temperature protection indicator light, a chip power indicator light, a program lock indicator light, and a working instruction indicator light; There are four over-voltage and under-voltage status indicator lights (23); The four over-voltage and under-voltage status indicator lights (23) are an input power indicator light, an under-voltage indicator light, an over-voltage indicator light, and an output power indicator light.

6. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 5, characterized in that: The over-voltage and under-voltage protection circuit board (1-2) has an over-voltage and under-voltage protection circuit board; or, The over-voltage and under-voltage protection circuit board (1-2) has two sub-over-voltage and under-voltage protection circuit boards; One of the over-voltage and under-voltage protection circuit boards has an over-voltage and under-voltage protection circuit; or, One of the over-voltage and under-voltage protection circuit boards has two sub-over-voltage and under-voltage protection circuits; The two sub-overvoltage and undervoltage protection circuit boards both have sub-overvoltage and undervoltage protection circuits; One of the over-voltage and under-voltage protection circuits is a high-voltage over-voltage and under-voltage protection circuit or a low-voltage over-voltage and under-voltage protection circuit or a high-low-voltage over-voltage and under-voltage protection circuit; One of the two sub-overvoltage and undervoltage protection circuits is a high-voltage overvoltage and undervoltage protection circuit, and the other is a low-voltage overvoltage and undervoltage protection circuit; The sub-overvoltage and undervoltage protection circuit of one of the two sub-overvoltage and undervoltage protection circuit boards is a high-voltage overvoltage and undervoltage protection circuit, and the sub-overvoltage and undervoltage protection circuit of the other sub-overvoltage and undervoltage protection circuit board is a low-voltage overvoltage and undervoltage protection circuit.

7. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 6, characterized in that: The over-voltage and under-voltage protection circuit includes a rectifier circuit; The input end of the rectifier circuit is electrically connected to the output end of the external power supply; The output end of the rectifier circuit is electrically connected to the input end of the voltage stabilizing circuit; The first output terminal of the voltage stabilizing circuit is electrically connected to the first input terminal of the comparison circuit; The second input end of the comparison circuit is electrically connected to the output end of the AC / DC sampling circuit (1-2-3); The third input terminal of the comparison circuit is electrically connected to the output terminal of the reference circuit; The input end of the reference circuit is electrically connected to the second output end of the voltage stabilizing circuit; The output terminal of the comparison circuit is electrically connected to the first input terminal of the driving circuit; The second input end of the driving circuit is electrically connected to the output end of the delay circuit; The output end of the driving circuit is electrically connected to the input end of the execution circuit.

8. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 7, characterized in that: The execution circuit of the high- and low-voltage over- and under-voltage protection circuit is divided into a high-voltage execution circuit (1-2-1) and a low-voltage execution circuit (1-2-2); The output end of the driving circuit is divided into a first output end and a second output end; The first output end of the driving circuit is electrically connected to the input end of the high-voltage execution circuit (1-2-1); The main circuit execution element in the high-voltage execution circuit (1-2-1) is a small relay or an intermediate relay or a contactor; The second output end of the driving circuit is electrically connected to the input end of the low-voltage execution circuit (1-2-2); The control DC circuit execution element in the low-voltage execution circuit (1-2-2) is a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect transistor or a normally closed micro relay; The normally closed micro-relay is a normally closed reed switch relay or a normally closed small high-frequency relay; The execution circuit of the high-voltage over-voltage and under-voltage protection circuit is a high-voltage execution circuit (1-2-1); The output end of the driving circuit is electrically connected to the input end of the high-voltage execution circuit (1-2-1); The main circuit execution element in the high-voltage execution circuit (1-2-1) is an AC solid-state relay or an electromagnetic relay; The AC solid-state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor; The execution circuit of the low-voltage over-voltage and under-voltage protection circuit is a low-voltage execution circuit (1-2-2); The output end of the driving circuit is electrically connected to the input end of the low-voltage execution circuit (1-2-2); The control DC circuit execution element in the low-voltage execution circuit (1-2-2) is a DC solid-state relay or a small PNP transistor or a small NPN transistor or a low-power thyristor or a low-power insulated gate field effect transistor or an optical coupler switch element.

9. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 8, characterized in that: The input end of the AC / DC sampling circuit (1-2-3) is electrically connected to the output end of the external power supply; The output end of the external power supply is electrically connected to the power input end of the terminal (18) through the control output end of the high-voltage execution circuit (1-2-1); A leakage switch (17), an ammeter (14), a voltmeter (13), a fuse (19), and a power switch (10) are electrically connected between the control output end of the high-voltage execution circuit (1-2-1) and the power input end of the terminal (18); The first power output end of the binding post (18) is electrically connected to the power input end of the variable frequency power amplifier circuit board (1-1); The power input and output ends of the variable frequency power amplifier circuit board (1-1) are electrically connected to the electromagnetic heater gun head (20); The second power output end of the terminal (18) is electrically connected to the power input end of the power supply and relay combination circuit board (1-3), the power input end of the time relay (12), and the power input end of the power circuit board (1-5); The power supply and relay combination circuit board (1-3) is electrically connected to a fan (21) in the electromagnetic heater gun head; The power supply and relay combination circuit board (1-3) is electrically connected to an electromagnetic heater switch (22); The power circuit board (1-5) is electrically connected to two cooling fans (3) and a circulation fan (9); The third power output end of the binding post (18) is electrically connected to the power input end of the over-voltage and under-voltage protection circuit board (1-2); The control output end of the low voltage execution circuit (1-2-2) of the over- and under-voltage protection circuit board (1-2) is electrically connected to the control input end of the control circuit board (1-4); The power input end of the control circuit board (1-4) is electrically connected to the power output end of the power circuit board (1-5); The frequency conversion signal output end of the control circuit board (1-4) is electrically connected to the frequency conversion signal input end of the frequency conversion power amplifier circuit board (1-1); The current feedback input end of the control circuit board (1-4) is electrically connected to the current feedback output end of the variable frequency power amplifier circuit board (1-1); The control circuit board (1-4) is electrically connected to a working status indicator light (11) and a potentiometer (15); The over-voltage and under-voltage protection circuit board (1-2) is electrically connected to an over-voltage and under-voltage status indicator light (23).

10. The electromagnetic heater power supply capable of isolating heat dissipation according to claim 9, characterized in that: The over-voltage and under-voltage protection circuit board (1-2) is a bare plate-shaped structure forming a plate-shaped over-voltage and under-voltage protector; or, The over-voltage and under-voltage protection circuit board (1-2) is packaged by a shell to form an over-voltage and under-voltage protector in a rectangular or cube shape; The plate-shaped over- and under-voltage protector is arranged in the sealed chamber (6); The over- and under-voltage protector in the form of a rectangular parallelepiped or a cube is arranged on the wall of the chassis (4); The wall of the chassis (4) is the outer side or inner side of the front wall of the chassis (4); or, The wall of the chassis (4) is the outer side or the inner side of the rear wall of the chassis (4).

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