Optical fingerprint module and mobile terminal

Abstract

The present invention provides an optical fingerprint module and mobile terminal, relating to the field of fingerprint module technology. The optical fingerprint module comprises a reinforcement plate, a circuit board, and a chip. The reinforcement plate defines a first groove, within which the circuit board is positioned. The chip is located within the first groove and electrically connected to the circuit board. The placement of the circuit board within the first groove of the reinforcement plate reduces the overall height of the optical fingerprint module, occupies less space, and facilitates the ultra-thin design of the optical fingerprint module and electronic products.

Description

Technical Field

[0001] The present invention relates to the technical field of fingerprint modules, and in particular to an optical fingerprint module and a mobile terminal. Background Art

[0002] With the increasing popularity of terminals, especially mobile terminals, users are demanding higher and higher user experience, and fingerprint recognition technology is becoming increasingly popular in terminals. Current terminals typically install fingerprint recognition modules in a fixed area under the screen, making the terminals thicker and unable to meet users' demand for thinner and lighter terminals. Summary of the Invention

[0003] The purpose of the present invention includes providing an optical fingerprint module that can effectively reduce the overall height of the optical fingerprint module and provide an optical fingerprint module with a thinner thickness.

[0004] The present invention aims to provide a mobile terminal that can increase the screen-to-body ratio and enhance the user experience.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, an embodiment provides an optical fingerprint module, comprising a reinforcement plate, a circuit board, and a chip, wherein a first groove is provided on the reinforcement plate, and the circuit board is disposed in the first groove; the chip is disposed on the bottom wall of the first groove, or on a side of the circuit board away from the reinforcement plate, and the chip is electrically connected to the circuit board.

[0007] In an optional embodiment, a second groove is defined on a side of the circuit board away from the reinforcing plate, and the chip is disposed in the second groove. Alternatively, a first through hole is defined on the circuit board, and the chip is located in the first through hole and connected to the bottom wall of the first groove.

[0008] In an optional embodiment, a plurality of first through holes arranged at intervals are provided on the circuit board, and the number of the chips is multiple, and each chip is correspondingly arranged in one of the first through holes.

[0009] In an optional embodiment, the circuit board includes a connecting boss formed between two adjacent first through holes, and the chip is electrically connected to the connecting boss.

[0010] In an optional embodiment, the periphery of the chip is filled with sealant, and a sealant layer is provided on a side of the circuit board away from the reinforcing plate, the sealant layer being located around the periphery of the sealant.

[0011] In an optional embodiment, the chip and the reinforcing plate are bonded together by adhesive, and the circuit board and the reinforcing plate are connected by an adhesive.

[0012] In an optional embodiment, the reinforcement plate is made of steel sheet.

[0013] In a second aspect, this embodiment provides a mobile terminal, comprising a display screen, a back cover, and an optical fingerprint module according to any one of the aforementioned embodiments, wherein the display screen is connected to the back cover and a receiving cavity is formed therebetween, and the optical fingerprint module is disposed in the receiving cavity.

[0014] In an optional embodiment, a middle frame is further included, one side of the middle frame is connected to the display screen, and the other side is connected to the back cover; a second through hole is opened on the side of the middle frame close to the display screen, and the optical fingerprint module is arranged in the second through hole.

[0015] In an optional embodiment, the middle frame includes a supporting portion and a mounting portion formed by a surface of the supporting portion protruding toward the display screen from a side thereof proximal to the display screen, the supporting portion having a second through hole defined therein. The reinforcing plate includes a bottom portion and an extension portion connected to each other, the bottom portion being the bottom wall of the first groove, and the extension portion protruding radially outward from a sidewall of the first groove away from the bottom portion; the bottom portion is disposed within the second through hole, and the extension portion is disposed on the supporting portion.

[0016] In an optional embodiment, foam is provided between the reinforcement plate and the display screen.

[0017] The optical fingerprint module and mobile terminal provided by the present invention have the following beneficial effects:

[0018] The optical fingerprint module provided by the present invention has a first groove opened on the reinforcement plate, and the circuit board and the chip are both arranged in the first groove. Compared with the existing installation method of directly setting the circuit board and the chip on the surface of the reinforcement plate, the optical fingerprint module provided by the present invention has a lower overall height, which is more conducive to providing an ultra-thin optical fingerprint module and occupies less space in the terminal product.

[0019] The mobile terminal provided by the present invention adopts the above-mentioned optical fingerprint module. Since the optical fingerprint module is thin, it can be set below the mobile terminal display screen without occupying the screen area, which is conducive to increasing the screen-to-body ratio of the mobile terminal and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic structural diagram of an optical fingerprint module provided by the first embodiment of the present invention;

[0022] Figure 2 Another structural diagram of the optical fingerprint module provided by the first embodiment of the present invention;

[0023] Figure 3 A schematic structural diagram of the optical fingerprint module provided by the first embodiment of the present invention from another perspective;

[0024] Figure 4 A schematic diagram of the filling structure of the sealing member of the optical fingerprint module provided by the first embodiment of the present invention;

[0025] Figure 5 A schematic structural diagram of an optical fingerprint module provided in a second embodiment of the present invention;

[0026] Figure 6 A schematic structural diagram of an optical fingerprint module provided by the second embodiment of the present invention from another perspective;

[0027] Figure 7 A schematic structural diagram of a mobile terminal provided by a third embodiment of the present invention;

[0028] Figure 8 A schematic structural diagram of a middle frame of a mobile terminal provided in a third embodiment of the present invention;

[0029] Figure 9 Another structural diagram of a middle frame of a mobile terminal provided by the third embodiment of the present invention;

[0030] Figure 10 A structural diagram of a mobile terminal provided by the fourth embodiment of the present invention.

[0031] Icons: 100-optical fingerprint module; 110-reinforcement plate; 111-first groove; 115-bottom; 117-extension portion; 120-circuit board; 121-first through hole; 123-second groove; 125-first mounting hole; 126-second mounting hole; 127-connecting boss; 128-first boss; 129-second boss; 130-chip; 1301-chip acquisition area; 131-acquisition chip; 133- Driver chip; 140-gold wire; 151-bonding glue; 153-resistive glue layer; 155-adhesive; 160-sealant; 200-mobile terminal; 210-display screen; 220-middle frame; 221-second through hole; 222-third groove; 223-bearing part; 225-installation part; 226-support platform; 230-battery assembly; 240-back cover; 260-foam; 261-first subdivision; 263-second subdivision. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0036] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0037] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0038] This embodiment provides an optical fingerprint module 100 and a mobile terminal 200 including the optical fingerprint module 100. By providing a first groove 111 on the reinforcement plate 110 of the optical fingerprint module 100, the height of the entire optical fingerprint module 100 is reduced, thereby achieving a miniaturized and ultra-thin design of the optical fingerprint module 100. Due to its small thickness, the ultra-thin optical fingerprint module 100 can be completely installed below the display screen 210 of the mobile terminal 200. As an under-screen optical fingerprint module 100, it does not require physical or virtual buttons, significantly increasing the screen-to-body ratio and enhancing the user experience.

[0039] First embodiment

[0040] Please refer to Figure 1This embodiment provides an optical fingerprint module 100, comprising a reinforcement plate 110, a circuit board 120, and a chip 130. The reinforcement plate 110 is provided with a first groove 111, and the circuit board 120 is disposed in the first groove 111. Optionally, the circuit board 120 is adhered and fixed to the bottom wall of the first groove 111 by an adhesive 155. Compared to installing the circuit board 120 on an ungrooved reinforcement plate 110, the circuit board 120 in this embodiment is sunken to lower the installation position of the circuit board 120, thereby reducing the overall height of the optical fingerprint module 100. The chip 130 is located in the first groove 111 and is electrically connected to the circuit board 120. Optionally, the chip 130 is provided on the reinforcement plate 110, that is, the chip 130 is directly connected to the bottom wall of the first groove 111; or the chip 130 is provided on the circuit board 120 and is located on the side of the circuit board 120 away from the bottom wall of the first groove 111 of the reinforcement plate 110. In this embodiment, the circuit board 120 is a flexible circuit board, and of course, it can also be a printed circuit board or a soft-hard combination circuit board; the chip 130 can be, but is not limited to, an optical fingerprint chip, and the chip 130 and the circuit board 120 are connected by gold wire 140; the reinforcement plate 110 is made of steel sheet, and of course, the reinforcement plate 110 can also be made of other materials, such as FR4, PET or PI, etc., which are not specifically limited here.

[0041] Furthermore, a second groove 123 is formed on a side of the circuit board 120 away from the reinforcing plate 110. Figure 2 The chip 130 is disposed on the bottom wall of the second groove 123. For example, the chip 130 can be attached to the bottom wall of the second groove 123 by bonding. Compared with directly disposing the chip 130 on the surface of the circuit board 120, this method further reduces the overall height of the optical fingerprint module 100.

[0042] Optionally, combine Figure 1 and Figure 3 , a first through hole 121 is provided on the circuit board 120, that is, the depth of the first through hole 121 directly penetrates the thickness of the circuit board 120, exposing the bottom wall of the first groove 111. The chip 130 is located in the first through hole 121, and the chip 130 is connected to the bottom wall of the first groove 111. The chip 130 is bonded to the bottom wall of the first groove 111 on the reinforcement plate 110 by a bonding adhesive 151, for example, the chip 130 bonding adhesive 151 can be bonded by ACF (Anisotropic Conductive Film) chip 130 bonding adhesive 151, so that the chip 130 is bonded and fixed to the bottom wall of the first groove 111. By providing the first through hole 121 on the circuit board 120, the installation position of the chip 130 can be lowered as much as possible, thereby reducing the overall height of the optical fingerprint module 100 as much as possible, providing an ultra-thin optical fingerprint module 100.

[0043] like Figure 4The periphery of the chip 130 is filled with a sealant 160, which not only protects the chip 130, but also prevents oxidation and corrosion of the gold wire 140, and further secures the chip 130. Optionally, the sealant 160 is filled between the chip 130 and the wall of the first through hole 121. A layer of sealant 160 is also provided on the upper surface of the chip 130 away from the reinforcing plate 110 to prevent dust and other contamination of the chip 130, thereby sealing and protecting the chip 130 and improving the imaging quality of the optical fingerprint module 100.

[0044] A rubber barrier layer 153 is provided on the bottom wall of the first groove 111 of the circuit board 120, away from the reinforcement plate 110. This layer is located around the sealant 160 and is arranged in a circular pattern to prevent the sealant 160 from overflowing. In this embodiment, the rubber barrier layer 153 is made of a PI (Polyimide) reinforcement plate 110 to prevent the sealant 160 from overflowing. Of course, in other optional embodiments, the rubber barrier layer 153 can also be made of materials such as foam, which is not specifically limited here.

[0045] In the optical fingerprint module 100 provided in this embodiment, the circuit board 120 is disposed in the first groove 111 of the reinforcement plate 110, and the chip 130 is disposed on the circuit board 120 by hollowing out a groove or through-hole. This greatly reduces the overall height of the optical fingerprint module 100, which is conducive to providing an ultra-thin optical fingerprint module 100.

[0046] It can be understood that the present embodiment only shows the case where one chip 130 is provided. The number of chips 130 can also be multiple, and multiple chips 130 are arranged side by side, and each chip 130 is electrically connected to the circuit board 120. For example, the optical fingerprint module 100 is used under the display screen 210 of an electronic product. Since each chip 130 includes a portion of the chip collection area 1301, the display screen 210 corresponding to the chip collection area 1301 is the sensing surface, and the electronic product can be operated by touching the sensing surface with a finger. If multiple chips 130 are provided in the optical fingerprint module 100 and multiple chips 130 are spliced ​​together, the area of ​​the collection area will be increased, providing an ultra-large sensing surface, so that the user can realize fingerprint recognition by touching a larger area on the display screen 210, thereby improving the user experience.

[0047] Second embodiment

[0048] like Figure 5 and Figure 6The optical fingerprint module 100 provided in this embodiment includes a reinforcement plate 110, a circuit board 120, and multiple chips 130. A first groove 111 is defined in the reinforcement plate 110, and the circuit board 120 is attached to the bottom wall of the first groove 111. Multiple second grooves 123 or multiple first through holes 121 are defined on the side of the circuit board 120 away from the bottom wall of the first groove 111. The chips 130 are disposed in the second grooves 123 or first through holes 121 to reduce the overall height of the optical fingerprint module 100.

[0049] It should be noted that the chip 130 used in this embodiment is an optical fingerprint chip 130, which includes a driving chip 133 and an acquisition chip 131. The driving chip 133 and the acquisition chip 131 can be set separately as two chips 130, or the two chips 130 can be combined into one and integrated on one chip 130. Figures 1 to 4 The optical fingerprint chip 130 shown in FIG is integrated into one. Figure 5 and Figure 6 The optical fingerprint chip 130 shown in FIG is configured in a manner that the two are separately provided.

[0050] In this embodiment, a circuit board 120 is provided with multiple first through holes 121 as an example. The circuit board 120 has multiple first through holes 121 spaced apart from each other. There are multiple chips 130, each of which is disposed within a corresponding first through hole 121. The circuit board 120 includes a connecting boss 127 formed between two adjacent first through holes 121, and the chip 130 is electrically connected to the connecting boss 127.

[0051] The figure only shows two first through-holes 121 and two chips 130. For ease of description, the two first through-holes 121 are defined as a first mounting hole 125 and a second mounting hole 126, respectively. The acquisition chip 131 is positioned within the first mounting hole 125, and the driver chip 133 is positioned within the second mounting hole 126. The circuit board 120 includes a central connection boss 127 and two side bosses 128 and 129. The first mounting hole 125 is located between the first boss 128 and the connection boss 127, and the second mounting hole 126 is located between the second boss 129 and the connection boss 127. The acquisition chip 131 is electrically connected to the connection boss 127 and the first boss 128, respectively. The driver chip 133 is electrically connected to the second boss 129 and the connection boss 127, respectively. Forming the connection boss 127 between the two first through-holes 121 facilitates electrical connection between the chip 130 and the circuit board 120.

[0052] The periphery of the acquisition chip 131 is filled with a sealant 160 ( Figure 5 Not shown, see Figure 4), the gap between the first mounting hole 125 and the acquisition chip 131 is filled with a sealant 160 to protect the acquisition chip 131 from being contaminated by foreign matter such as dust, and also to prevent the gold wire 140 from being oxidized and corroded. The periphery of the driver chip 133 is filled with a sealant 160, and the gap between the second mounting hole 126 and the driver chip 133 is filled with a sealant 160 to protect the driver chip 133 from being contaminated by foreign matter such as dust, and also to prevent the gold wire 140 from being oxidized and corroded. A resistive layer 153 is provided on the periphery of the sealant 160 on the side of the bottom wall of the first groove 111 of the circuit board 120 away from the reinforcement plate 110 to prevent the sealant 160 from overflowing to the periphery. The resistive layer 153 can be reinforced with PI to form a reinforcement ring on the periphery of the sealant 160; alternatively, the resistive layer 153 can also be made of a material such as foam.

[0053] It is easy to understand that there can be multiple first mounting holes 125 and second mounting holes 126, and the number of acquisition chips 131 and driver chips 133 can also be multiple. Multiple acquisition chips 131 and multiple driver chips 133 are arranged side by side and respectively connected to the circuit board 120. This can increase the acquisition area of ​​the acquisition chip 131, thereby providing a larger sensing surface on the display screen 210 for user operation and improving the user experience. Of course, this is not limited to this. In other optional embodiments, a first through hole 121 with a larger aperture can be provided on the circuit board 120, and multiple chips 130 can be simultaneously arranged in the first through hole 121, and each chip 130 is electrically connected to the circuit board 120. This is not specifically limited here.

[0054] The situation of providing a plurality of second grooves 123 on the circuit board 120 is similar to the above. Other contents not mentioned in this embodiment are similar to those described in the first embodiment and will not be described in detail here.

[0055] The optical fingerprint module 100 provided in this embodiment has a first groove 111 defined in the reinforcing plate 110, with the circuit board 120 mounted on the bottom wall of the first groove 111. Furthermore, a first through-hole 121 is defined in the circuit board 120, with the chip 130 mounted in the first through-hole 121. This reduces the overall height of the optical fingerprint module 100, providing an ultra-thin optical fingerprint module 100. Furthermore, the embodiment illustrates the arrangement of multiple chips 130 on the reinforcing plate 110, accommodating the installation of various types of optical fingerprint chips 130. The simultaneous arrangement of multiple chips 130 facilitates the provision of an extremely large sensing surface, significantly enhancing the user experience.

[0056] Third embodiment

[0057] like Figure 7This embodiment provides a mobile terminal 200, comprising a display screen 210, a back cover 240, a middle frame 220, a battery assembly 230, and an optical fingerprint module 100 according to any of the aforementioned embodiments. The display screen 210 and the back cover 240 are positioned opposite each other, forming a cavity therebetween. The optical fingerprint module 100 and the battery assembly 230 are located within the cavity, and the middle frame 220 is used to connect the display screen 210 and the back cover 240. In this mobile terminal 200, the optical fingerprint module 100 is positioned completely beneath the display screen 210 (between the display screen 210 and the back cover 240). This under-screen optical fingerprint module 100 eliminates the need for physical or virtual buttons, significantly increasing the screen-to-body ratio of the mobile terminal 200. Because the optical fingerprint module 100 is suitable for applications where multiple chips 130 are spliced ​​together, it provides an extremely large sensing area. Users can perform fingerprint recognition by simply touching a designated area of ​​the display screen 210 of the mobile terminal 200. This allows for 360-degree touch recognition in any direction, significantly improving the user experience.

[0058] Alternatively, as Figure 8 One side of the middle frame 220 is connected to the display screen 210, and the other side is connected to the back cover 240; a third groove 222 is provided on the side of the middle frame 220 close to the display screen 210, and the optical fingerprint module 100 is arranged in the third groove 222. By providing the third groove 222, the installation position of the optical fingerprint module 100 is sunken, thereby reducing the thickness of the entire mobile terminal 200. The battery assembly 230 is provided on the side of the middle frame 220 away from the display screen 210, that is, between the middle frame 220 and the back cover 240. Optionally, the middle frame 220 includes a bearing portion 223 and a mounting portion 225 formed by a surface of the bearing portion 223 close to the display screen 210 protruding toward the display screen 210, and the mounting portion 225 and the bearing portion 223 form the third groove 222. The mounting portion 225 is connected to the display screen 210 , and the side of the supporting portion 223 away from the display screen 210 is connected to the back cover 240 ; the optical fingerprint module 100 is disposed on the side of the supporting portion 223 close to the display screen 210 .

[0059] Furthermore, if Figure 9The supporting portion 223 defines a second through-hole 221. It should be understood that the diameter of the second through-hole 221 is smaller than the diameter of the third recess 222, forming a support 226 between the supporting portion 223 and the mounting portion 225. The reinforcing plate 110 includes a bottom portion 115 and an extension portion 117, which are interconnected. The bottom portion 115 forms the bottom wall of the first recess 111. The extension portion 117 protrudes radially outward from the side surface of the first recess 111, distal from the bottom wall. The bottom portion 115 is positioned within the second through-hole 221, and the extension portion 117 is positioned on the support 226 of the supporting portion 223. By defining the second through-hole 221 in the supporting portion 223, the mounting position of the optical fingerprint module 100 is lowered as much as possible, thereby minimizing the assembly thickness of the optical fingerprint module 100. This leaves more space in the thickness direction for the battery assembly 230 and also helps reduce the overall thickness of the mobile terminal 200.

[0060] In this embodiment, a mobile terminal 200 includes the optical fingerprint module 100 provided in the first embodiment. When the chip 130 in the optical fingerprint module 100 is integrated into a whole using the driver chip 133 and the acquisition chip 131, the assembly of the optical fingerprint module 100 within the mobile terminal 200 is shown in the figure. A foam 260 is provided between the reinforcement plate 110 and the display screen 210. Optionally, the display screen 210 utilizes an OLED light-emitting display. The side of the extension 117 on the reinforcement plate 110 near the display screen 210 is pressed against the foam 260 by light shielding to reduce the assembly thickness of the optical fingerprint module 100. Furthermore, the foam 260 includes a first section 261 and a second section 263, which are interconnected. One side of the first section 261 is in contact with the extension 117, and the other side is in contact with the display screen 210. The second section 263 extends radially inwardly from the second through hole 221. Optionally, a rubber barrier layer 153 is provided on the side of the circuit board 120 away from the bottom 115 to prevent the sealant 160 from overflowing. The second portion 263 extends to the end surface of the rubber barrier layer 153 near the sealant 160 and is attached between the rubber barrier layer 153 and the display 210. The foam 260 is used to cover the circuit board 120 around the chip 130, reducing the amount of light from the OLED display screen incident on the first through hole 121, thereby reducing the interference of stray light on the chip 130 and improving the imaging quality of the optical fingerprint module 100.

[0061] Since the optical fingerprint module 100 is completely disposed below the display screen 210, multiple chips 130 can be provided in the optical fingerprint module 100, which does not affect the screen-to-body ratio and can also increase the sensing surface, thereby meeting the security requirements of mobile payments and achieving 360-degree touch recognition in any direction, significantly improving the user experience. Of course, in addition to being used on mobile terminals 200, such as mobile phones and tablets, the optical fingerprint module 100 can also be used on other touch devices and terminal devices, which are not specifically limited here.

[0062] Fourth embodiment

[0063] like Figure 10 This embodiment provides a mobile terminal 200 that utilizes the optical fingerprint module 100 provided in the second embodiment. When the chip 130 in the optical fingerprint module 100 utilizes a driver chip 133 and an acquisition chip 131 that are separately provided, both the driver chip 133 and the acquisition chip 131 need to be provided on the reinforcing plate 110. The optical fingerprint module 100 is assembled within the mobile terminal 200 as shown in the figure.

[0064] The optical fingerprint module 100 is mounted in the second through-hole 221 of the middle frame 220. Two first through-holes 121 are provided on the circuit board 120. An acquisition chip 131 is disposed in one of the first through-holes 121, and a driver chip 133 is disposed in the other first through-hole 121. A connecting boss 127 is formed between the two first through-holes 121. The gaps between the acquisition chip 131 and the first through-hole 121, and the gaps between the driver chip 133 and the first through-hole 121, are both filled with sealant 160. A resistive layer 153 is disposed around the periphery of the sealant 160. The resistive layer 153 is disposed on the circuit board 120 to prevent the sealant 160 from overflowing. The figure only shows the sealant 160 in the second mounting hole 126; the sealant 160 in the first mounting hole 125 is not shown. In addition, sealant 160 is added to the side of the driver chip 133 away from the reinforcement plate 110, i.e., above the driver chip 133, to encapsulate both the driver chip 133 and the connecting boss 127. The first section 261 of the foam 260 is bonded between the reinforcing plate 110 and the display screen 210. The second section 263 of the foam 260 extends further to the sealant 160 above the connecting boss 127. Specifically, the second section 263 of the foam 260 extends radially inwardly along the second through-hole 221 to the sealant 160 above the connecting boss 127, covering the driver chip 133 and the connecting boss 127. One side of the second section 263 is bonded to the sealant 160 of the optical fingerprint module 100, and the other side is bonded to the display screen 210. This arrangement reduces the amount of light from the OLED display screen incident on the first through-hole 121, thereby reducing the interference of stray light on the chip 130 and improving the imaging quality of the optical fingerprint module 100.

[0065] In other optional embodiments, the mobile terminal 200 may also be provided with multiple driver chips 133 and multiple acquisition chips 131 under the screen to increase the sensing surface, meet the security requirements of mobile payment, achieve 360-degree touch recognition in any direction, and significantly improve the user experience. In addition, other contents not mentioned in this embodiment are similar to those in the third embodiment and will not be repeated here.

[0066] In summary, the embodiments of the present invention provide an optical fingerprint module 100 and a mobile terminal 200. The optical fingerprint module 100 has a first groove 111 defined on a reinforcement plate 110, within which a circuit board 120 is disposed. A first through-hole 121 is defined on the circuit board 120, within which a chip 130 is disposed. The circuit board 120 and the chip 130 are mounted downwardly, which greatly reduces the overall height of the optical fingerprint module 100 and facilitates the realization of an ultra-thin optical fingerprint module 100. This ultra-thin optical fingerprint module 100 can be used on a mobile terminal 200 as an under-screen optical fingerprint module 100 of the mobile terminal 200. Since the optical fingerprint module 100 is completely mounted below the display screen 210, there is no need to provide physical or virtual buttons on the display screen 210, which can significantly increase the screen-to-body ratio of the mobile terminal 200 and enhance the visual effect.

[0067] Secondly, the optical fingerprint module 100 can support multi-chip 130 splicing applications, that is, multiple chips 130 are set in the optical fingerprint module 100 to increase the collection area of ​​the chip 130, thereby providing an ultra-large sensing surface for the mobile terminal 200. Finally, by providing a second through hole 221 in the middle frame 220 to install the optical fingerprint module 100, the assembly height of the optical fingerprint module 100 and the mobile terminal 200 is reduced, providing more space in the thickness direction for the battery assembly 230, etc. Therefore, the mobile terminal 200 has a high screen-to-body ratio, a large sensing surface, and a thin thickness, which can meet the security requirements of mobile payment and can realize 360-degree touch recognition in any direction, greatly improving the user experience.

[0068] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An optical fingerprint module, characterized in that: It includes a reinforcing plate, a circuit board and a chip, wherein a first groove is provided on the reinforcing plate, and the circuit board is arranged in the first groove; the chip is electrically connected to the circuit board; A second groove is formed on a side of the circuit board away from the reinforcing plate, and the chip is disposed in the second groove; or a first through hole is formed on the circuit board, and the chip is located in the first through hole, and the chip is connected to the bottom wall of the first groove; The reinforcing plate includes an extension portion, which protrudes radially outward from a side surface of the side wall of the first groove away from the bottom wall, and is used to be connected to the middle frame of the mobile terminal.

2. The optical fingerprint module according to claim 1, characterized in that: The circuit board is provided with a plurality of first through holes arranged at intervals. There are a plurality of chips, and each chip is correspondingly arranged in one of the first through holes.

3. The optical fingerprint module according to claim 2, characterized in that: The circuit board includes a connecting boss formed between two adjacent first through holes, and the chip is electrically connected to the connecting boss.

4. The optical fingerprint module according to claim 1, characterized in that: The periphery of the chip is filled with sealant, and a sealant layer is provided on a side of the circuit board away from the reinforcing plate. The sealant layer is located on the periphery of the sealant.

5. The optical fingerprint module according to any one of claims 1 to 4, characterized in that: The circuit board is connected to the reinforcing plate by an adhesive, and the chip is bonded to the reinforcing plate by a bonding adhesive.

6. A mobile terminal, characterized in that: The optical fingerprint module comprises a display screen, a back cover and the optical fingerprint module according to any one of claims 1 to 5, wherein the display screen is connected to the back cover and a receiving cavity is formed therebetween, and the optical fingerprint module is arranged in the receiving cavity.

7. The mobile terminal according to claim 6, wherein: It also includes a middle frame, one side of which is connected to the display screen, and the other side is connected to the back cover; a second through hole is opened on the side of the middle frame close to the display screen, and the optical fingerprint module is arranged in the second through hole.

8. The mobile terminal according to claim 7, wherein: The middle frame includes a bearing portion and a mounting portion formed by a surface of the bearing portion close to the display screen and protruding toward the display screen, and the bearing portion is provided with the second through hole; The reinforcing plate includes a bottom and an extension portion that are interconnected, the bottom being the bottom wall of the first groove, and the extension portion protruding radially outward from a side of the side wall of the first groove away from the bottom; the bottom is arranged in the second through hole, and the extension portion is arranged on the bearing portion.

9. The mobile terminal according to claim 6, wherein: Foam is provided between the reinforcing plate and the display screen.

Images