A portable power module testing device

Abstract

The present invention provides a portable power module testing device, comprising: a box and a display component, a processor, an FPGA, a power distribution component, and a current pulse amplifier arranged inside the box; the processor is respectively connected to the display component, the power distribution component, and the display component, and is connected to the current pulse amplifier through the FPGA; the power distribution component comprises: a power filter, composed of a common-mode filter inductor and a capacitor, for attenuating EMI energy conducted along a power line and suppressing EMI radiation; an RS232 interface, which expands the processor through a first chip to transmit current and voltage data output to a device under test to the processor; the FPGA receives test information of the device under test transmitted by the processor through a PCIE interface and transmits a level pulse signal to an electro-optical converter with a preset frequency pulse; and a photoelectric converter, which receives a pulse signal input from the device under test and transmits it to the FPGA.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic product testing and inspection, and specifically relates to a portable power module testing device. Background Art

[0002] With the advancement of electronics, network, and big data technologies, industry requirements for the functional testing, inspection, and quality of electronic products are becoming increasingly stringent. The inspection and testing processes for electronic products require high stability, real-time performance, and a high degree of automation. Quality information tracking and historical data for electronic products also require traceability. Therefore, to reduce labor costs and workload and improve the accuracy and reliability of tested products, automated and networked testing, as well as electronic data collection, are essential.

[0003] In the railway industry, EMU power modules are a critical component of traction and auxiliary converters, subject to stringent quality requirements during development, production, and operation. Traditional testing methods for power modules during production and EMU operation rely on discrete measurement methods, requiring separate dedicated equipment for each function, such as oscilloscopes, signal generators, and multimeters. This requires separate power supplies for both the dedicated test equipment and the device under test. The testing process is manual, requiring test cables to connect the test instrument to the device under test, manual setup of the test instrument's test conditions, and manual recording of test results. This manual involvement in the entire testing process is time-consuming, inefficient, and prone to errors. For example, when testing submodules such as the pulse distribution board and driver board, a pulse generator must be used, with different pulse patterns set and output manually. The waveform of the feedback fault pulses can then be observed using an oscilloscope. This manual setup process is time-consuming, labor-intensive, and prone to errors, significantly impacting measurement results. Testing multiple interfaces simultaneously creates a significant workload. Furthermore, test data is manually recorded in paper form, making it difficult to store and query historical data. Summary of the Invention

[0004] The present application provides a portable power module testing device to at least solve the problems in existing testing solutions that require separate power supply for dedicated testing equipment and tested equipment, as well as manual operation throughout the testing process, which is inefficient and prone to errors.

[0005] According to the description of the present application, a portable power module testing device is provided, comprising: a box and a display component, a processor, an FPGA, a power distribution component, and a current pulse amplifier arranged inside the box;

[0006] The processor is connected to the display component, the power distribution component, and the display component respectively, and is connected to the current pulse amplifier through the FPGA; wherein,

[0007] Power distribution components include:

[0008] The power filter, composed of common-mode filter inductors and capacitors, is used to attenuate EMI energy conducted along the power line and suppress EMI radiation;

[0009] An RS232 interface connects the processor to the power distribution assembly and expands the processor via a first chip to transmit current and voltage data output to the device under test to the processor;

[0010] The FPGA receives the test information of the device under test transmitted by the processor through the PCIE interface, and the FPGA transmits the level pulse signal to the electro-optical converter at a preset frequency pulse. The photoelectric converter receives the optical signal of the device under test and converts it into an electrical signal and transmits it to the FPGA;

[0011] The current pulse amplifier is provided with a level pulse input and output interface and a current pulse input and output interface, which receives the pulse signal input of the device under test and transmits the converted pulse signal to the FPGA;

[0012] The processor tests the device under test according to the pulse signal input.

[0013] In one embodiment, the processor, FPGA, power distribution components, and current pulse amplifier are integrated on a computer board;

[0014] The processor has a USB expansion interface and is connected to the rear panel via the USB expansion interface;

[0015] The processor also expands the storage device through the interface for storing test data.

[0016] In one embodiment, the FPGA is externally connected to a DDS chip, which is used to generate a signal source and can achieve precise control of pulse output.

[0017] In one embodiment, the FPGA is connected to an optical-to-electrical converter, which is used to convert optical signals into electrical signals.

[0018] In one embodiment, a second chip is further integrated in the current pulse amplifier. The second chip is connected to the FPGA. The second chip is used to transform the electrical signal and input it into the FPGA.

[0019] In one embodiment, the power distribution assembly is installed close to the side wall of the box;

[0020] The power distribution assembly integrates the power supply and EMI power filter.

[0021] In one embodiment, an input component is disposed in the housing, and the input component is connected to the display component and the processor respectively.

[0022] In one embodiment, a grounding stake is provided on the outside of the box, which is used to ground the test device when testing the device under test to ensure the safety of the test process.

[0023] In one embodiment, a closable rotating door is provided on one side of the box body for inspecting the testing device.

[0024] In one embodiment, the box is further provided with a heat dissipation fan, a power output terminal and a pulse interface.

[0025] The present application provides a multifunctional testing device, which can not only realize convenient and automated inspection, measurement and testing of power modules, but also has a high degree of integration and portability. It also adopts an intelligent AC power supply design and provides multiple power supply interfaces without the need for an external power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is the unpacking structure diagram of the test device for this application.

[0028] Figure 2 This is a block diagram of the internal system structure principle of the test device of this application.

[0029] Figure 3 This is a structural block diagram of the multi-function computer board of the test device of this application.

[0030] Figure 4 This is a block diagram of the pulse input principle in an embodiment of the present application.

[0031] Figure 5 This is a block diagram of the current-type pulse input and output principles in an embodiment of the present application.

[0032] Figure 6 This is a block diagram of the power supply principle in the power distribution module in an embodiment of the present application.

[0033] Figure 7 This is a front view of the external structure of the test device in an embodiment of the present application.

[0034] Figure 8 This is a diagram of the external back structure of the test device in an embodiment of the present application.

[0035] Figure 9 This is a block diagram of the pulse output principle in the embodiment of this application.

[0036] Figure 10 This is a schematic diagram of the pulse signal output module in an embodiment of the present application.

[0037] Explanation of symbols:

[0038] 1. Wrap corners;

[0039] 2. Buzzer;

[0040] 3. Handle;

[0041] 4. Heat dissipation holes;

[0042] 5. Revolving door;

[0043] 6. Touchpad;

[0044] 7. Keyboard;

[0045] 8. Function buttons;

[0046] 9. Display screen;

[0047] 10. AC power supply interface;

[0048] 11. Pulse interface;

[0049] 12. Grounding pile;

[0050] 13. Power supply output interface;

[0051] 14. USB and Ethernet ports;

[0052] 15. Cooling fan. DETAILED DESCRIPTION

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0054] The testing and maintenance of EMU power modules during production and operation usually adopts a discrete measurement scheme, and corresponding dedicated equipment is used to measure different functions, and the test equipment and the tested equipment need to be powered separately. The entire test process is manually operated, the measurement time is long and prone to errors, and the test data is manually recorded in paper documents, which is not conducive to storage and quick query. Based on the above problems, the present application provides a portable power module testing device, including: a box and a display component, a processor, an FPGA, a power distribution component, a current pulse amplifier (OPA), a photoelectric converter and an electro-optical converter arranged inside the box;

[0055] The processor is connected to the display component, the power distribution component, and the display component respectively, and is connected to the current pulse amplifier through the FPGA; wherein the power distribution component includes:

[0056] The power filter, composed of common-mode filter inductors and capacitors, is used to attenuate EMI energy conducted along the power line and suppress EMI radiation;

[0057] An RS232 interface connects the processor to the power distribution assembly and expands the processor via a first chip to transmit current and voltage data output to the device under test to the processor;

[0058] The FPGA receives the test information of the device under test transmitted by the processor through the PCIE interface. The FPGA transmits the level pulse signal to the electro-optical converter at a preset frequency pulse. The photoelectric converter receives the optical signal of the device under test and converts it into an electrical signal and transmits it to the FPGA.

[0059] The current pulse amplifier is provided with a level pulse input and output interface and a current pulse input and output interface, which receives the pulse signal input of the device under test and transmits the converted pulse signal to the FPGA;

[0060] The processor tests the device under test according to the pulse signal input.

[0061] A power filter is provided at the input end of the power distribution module.

[0062] In one specific embodiment, EMI filtering is incorporated into the CPCI power supply design. The EMI power filter, comprised of common-mode filter inductors and capacitors, effectively suppresses electromagnetic interference between lines and between lines and ground. It not only attenuates EMI energy conducted along the power lines but also significantly suppresses EMI radiation. The integrated design of the EMI filter and power supply optimizes the overall system layout, reduces unreliable interconnections within the chassis, and thus improves overall system reliability.

[0063] In a specific embodiment, the test device integrates automated test software, and the test software supports instrument parameter setting, test process, test parameter setting, test item selection, real-time data display, real-time display of test curves, real-time data processing and storage, historical data query, management, user management and other functions.

[0064] In one specific embodiment, the test device uses an AC power supply mode, which is internally converted into DC or AC power for external output, and provides multiple external power supply interfaces to directly provide the required power to the device under test (power module) without the need for an external power supply. At the same time, the test device provides multiple pulse input and output interfaces, and the output mode and frequency can be software-configured to achieve automated and intelligent measurement of the power module. For example, it can adopt 6-channel level signal pulse output, 6-channel current signal pulse output, 6-channel optical signal pulse output, 6-channel level signal pulse input, and 6-channel optical signal pulse input, but this application is not limited to this.

[0065] In a specific embodiment, if Figure 1 and Figure 2 As shown, the display component can use a 14-inch high-brightness industrial display screen 9, which can meet the measurement and testing requirements in the field or under strong light. In addition, the test device provided by this application can also support single instrument testing, that is, only a certain type of power supply can be provided when testing the device under test, and single testing can be performed under software control.

[0066] In one embodiment, the processor (embedded computer module, see Figure 3 ), FPGA, power distribution components and current pulse amplifier (OPA) are integrated on a computer board.

[0067] The processor has a USB expansion interface and is connected to the rear panel via the USB expansion interface;

[0068] The processor also extends the storage device through the interface to store test data.

[0069] In a specific embodiment, if Figure 2As shown, a single substrate can be configured with three components: a multifunctional computer board, a power distribution module (power distribution assembly), and an optical power amplifier (OPA). The OPA is used to convert electrical level signals into current signals. These three components can be soldered to the substrate using an electronic chip integration process. The multifunctional computer board is equipped with multiple interfaces, one of which is connected to the power distribution module, and another to the OPA, for providing pulse output and receiving feedback from the OPA. The multifunctional computer board also features six optical pulse output and input interfaces, six electrical output and input interfaces, an RS232 interface, a USB interface, an Ethernet port, an indicator light interface, and a power button interface. The power distribution module integrates an STM32F103RBT6 ARM microcontroller. The power distribution module also features voltage output and input interfaces, a current and voltage acquisition module, a power indicator light, and other hardware for collecting the output voltage and current. Test data is transmitted to the application software on the multifunctional computer board via the RS232 interface on the power distribution module, where it is displayed in real time.

[0070] In one embodiment, the power distribution module is integrated with an ARM single-chip microcomputer STM32F103RBT6, and the power distribution module is provided with a voltage output and input interface, and is also integrated with hardware such as a current and voltage acquisition module and a power indicator light, so as to realize the acquisition of the voltage and current output to the outside, and transmit the test data to the application software on the multi-function computer board through the RS232 interface on the power distribution module, and display it in real time on the application software.

[0071] In a specific embodiment, the multifunctional computer board is constructed using an embedded I7 computer module, such as Figure 3 The principle block diagram is shown as follows:

[0072] The embedded computer module (processor) has two USB2.0 interfaces and one network port, which corresponds to the network port on the baseboard. The embedded computer module (processor) is connected to a 1TB electronic disk via a SATA interface. The electronic disk is used to store data generated during the test process, so as to facilitate later data tracking and historical data review. The processor also has an LVDS display interface, which connects the processor to the display component (display) to complete the display function. The processor uses SuPER The IO chip W83627F (first chip) completes the RS232 interface function expansion and is connected to the power distribution module through the RS232 interface, so that the power distribution module can transmit data to the onboard application software through the interface; the processor is also connected to the FPGA through the PCI-E interface to complete the pulse interface function expansion, and the processor transmits the test information to the FPGA through the PCI-E interface; the processor completes the external level pulse output interface expansion through a 74ALVC164245 chip, and completes the external level pulse input interface expansion through another 74ALVC164245 chip; the processor is also provided with an AFBR-1639Z electro-optical converter to realize the function of optical pulse output interface expansion and an AFBR-2539Z photoelectric converter to realize the function of optical pulse input interface expansion, and realizes the interface expansion of current pulse input and output signals through OPA.

[0073] In one embodiment, the FPGA is externally connected to a DDS chip, which is used to generate a signal source and can achieve precise control of pulse output.

[0074] In the specific embodiment, the DDS chip uses the AD9851 model. The AD9851 is a highly integrated DDS frequency synthesizer manufactured based on DDS technology. It includes a programmable DDS system, a high-performance DAC, and a high-speed comparator, which can realize the frequency synthesis and clock generation functions of full digital programmable control. The DDS chip can be used as a reference signal source to achieve a 1Hz step. In the specific test process, Figure 9 As shown in Figure 1, the processor transmits the test information to the FPGA through the PCI-E interface. The FPGA starts the DDS chip according to the test data in the received test information. After the DDS chip is started, it generates a pulse to the FPGA. The FPGA uses the pulse as a reference source to drive the 74ALVC164245 chip and the electro-optical converter AFBR-1639Z to complete the conversion between the level pulse signal and the electro-optical signal. The signal principle diagram of the DDS chip is shown in Figure 1. Figure 10 shown.

[0075] In one embodiment, the FPGA receives the test information of the device under test transmitted by the processor through the PCIE interface, and the FPGA transmits the level pulse signal to the electro-optical converter with a preset frequency pulse. The photoelectric converter receives the optical signal of the device under test and converts it into an electrical signal and transmits it to the FPGA.

[0076] In a specific embodiment, if Figure 4 Figure 2 shows the pulse input block diagram. The photoelectric converter AFBR-2539Z converts the optical signal into a 3.3V electrical signal, which is then fed into the FPGA for signal acquisition. The current pulse amplifier chip 74ALVC164245 converts the 5V signal into a 3.3V signal acceptable to the FPGA, which then samples the signal. The processor reads the FPGA's sampling information in real time via the PCI-E interface and displays it in the included test software.

[0077] In one embodiment, a second chip is further integrated in the current pulse amplifier. The second chip is connected to the FPGA and is used to transform the electrical signal and input it into the FPGA.

[0078] In a specific embodiment, the test device integrates 6 current-type pulse inputs and pulse outputs. Figure 5 As shown, the processor transmits test information to the FPGA through the PCI-E interface. The FPGA starts the DDS according to the data in the test information. The DDS chip (the second chip) generates a frequency pulse to the FPGA. The FPGA uses the pulse as a reference source and transmits the level pulse signal to the OPA. The OPA converts the level pulse signal into a current pulse signal by converting the pulse signal, thereby realizing the output of the current-type pulse signal.

[0079] The OPA receives input from an external current-type pulse signal and converts it into a voltage-type pulse signal and transmits it to the FPGA. The FPGA detects it in real time and transmits it to the computer through the PCIE interface. The computer test software displays the waveform information in real time and stores the data.

[0080] In one embodiment, the power distribution assembly is installed close to the side wall of the box;

[0081] The power distribution assembly integrates the power supply and EMI power filter.

[0082] The power distribution assembly is installed close to the side wall of the test device's box, which can effectively dissipate the heat generated during operation through the chassis, preventing heat from being stored in the chassis and causing the temperature inside the chassis to be too high, which may cause the test device to malfunction.

[0083] In a specific embodiment, the power supply in the power distribution assembly of the test device is designed according to the system requirements to have an input voltage of AC220V, 50HZ, and an output voltage of: +12VDC, +110VDC, 5~26VDC adjustable output; the output power is not less than 75W. The schematic diagram of the power supply is as follows Figure 6 As shown: The AC filter circuit filters the input AC power, effectively suppressing the electromagnetic interference between lines and between lines and ground, and then transforms the AC power through the rectifier module and the transformer module for output.

[0084] In one specific embodiment, EMI filtering is incorporated into the CPCI power supply design. The EMI power filter, comprised of common-mode filter inductors and capacitors, effectively suppresses electromagnetic interference between lines and between lines and ground. It not only attenuates EMI energy conducted along the power lines but also significantly suppresses EMI radiation. The integrated design of the EMI filter and power supply optimizes the overall system layout, reduces unreliable interconnections within the chassis, and thus improves overall system reliability.

[0085] When selecting a power supply, we chose one with high frequency, low loss, and good shielding performance. For example, when converting high voltage to 12V, we chose a Vicor power module. This gives the entire power supply advantages such as high power density, low conducted and radiated noise, fast response, and high conversion efficiency.

[0086] In one embodiment, if Figure 1 and Figure 7 As shown, an input component is provided in the box, and the input component is connected to the display component and the processor respectively.

[0087] In one embodiment, the test device housing can be constructed from an aluminum alloy, with each component machined from the aluminum alloy. The housing integrates the display and input components and is equipped with a handle 3 for easy portability. The display component can be a 14-inch high-brightness industrial display, and the input components can include a keyboard, touchpad 6, and mouse, facilitating measurement and testing operations. The test device also includes a function button 8 for activating power supply to the test device and starting and stopping external power supply.

[0088] In a specific embodiment, the box body of the test device is provided with corners 1 around it to protect the box body; a handle 3 is provided on one side of the box body for easy carrying.

[0089] In one embodiment, if Figure 8 As shown, a grounding stake 12 is provided on the outside of the box, which is used to ground the test device when testing the device under test to ensure the safety of the test process.

[0090] In a specific embodiment, 13 grounding piles 12 are provided on the outside of the box for grounding during testing to ensure safety during the test; at the same time, the outside of the box also has an AC power supply interface 10, a pulse input and output interface, a power supply output interface, a USB and a Gigabit Ethernet interface 14, etc. The AC power supply input interface is used to power the entire test device, and the pulse input and output interface further includes 6-way level pulse output and input, 6-way current signal pulse output, 6-way current type pulse feedback input and other interfaces. The power supply output interface 13 adopts DC110 and 5-26V adjustable output voltage.

[0091] In one embodiment, a closable rotating door is provided on one side of the box body for inspecting the testing device.

[0092] In a specific embodiment, a revolving door is provided on one side of the box. Opening the revolving door allows for easy inspection of the interior of the device and facilitates maintenance. When a device fails, troubleshooting and maintenance can be performed without disassembling the device. At the same time, the input and output of the optical signal are also led out from the revolving door.

[0093] In one embodiment, a heat dissipation fan 15 , a power supply output terminal and a pulse interface 11 are further provided on the box.

[0094] In one embodiment, the box is provided with heat dissipation holes 4 and a heat dissipation fan 15. The heat dissipation fan 15 dissipates the temperature inside the test device through the heat dissipation holes 4. The test device is also provided with an alarm device, which can be a buzzer 2, which sounds an alarm when the power module under test is abnormal.

[0095] In a specific embodiment of this application, a portable power module test device is a test-type embedded computer device that provides power supply, drive control, data acquisition, data processing, communication, real-time curve display, and data storage for the module under test. The test device is an integrated portable structure, with all functional modules integrated into several portable chassis. External interface signals are connected through the left side and rear panel of the chassis, and all signals are connected using high-reliability dedicated connectors.

[0096] The test device mainly consists of the following modules:

[0097] a) Test module box:

[0098] The box body is made of aluminum alloy, and each component is machined from aluminum alloy. The interior of the box body adopts an integrated structure of display, keyboard 7 and mouse, and is equipped with a handle 3, which is light and easy to carry.

[0099] b) Multi-function computer module (multi-function computer board):

[0100] The multifunctional computer module is integrated in the test device housing. The computer adopts X86 architecture. The computer board integrates functions such as level pulse output, level pulse input signal acquisition, relay output interface (controls the short circuit and disconnection of the specified pins in the power module DB25), communication, indicator light control, data storage and display.

[0101] The computer board integrates 6-channel electrical pulse signal outputs and 6-channel electrical pulse signal receptions; it also integrates 6-channel optical pulse signal outputs and 6-channel optical pulse signal receptions. The specific output channel can be flexibly configured through software.

[0102] The multifunctional computer module (MCM) is a highly integrated and reliable multifunctional computer, integrating analog acquisition, pulse signal sampling, pulse signal output, power output, communication, display, and storage. The embedded computer in the module, with the COM-E computer at its core, utilizes a highly integrated design, integrating diverse functional requirements onto a single motherboard. Functions are expanded via the PCIE bus, enabling data interaction with various sub-functions. This results in a highly integrated, miniaturized, and boardless test computer, enhancing system reliability and stability.

[0103] c) Power supply module: This module mainly realizes three groups of power output:

[0104] +12V power supply, 75W, used to power the multi-function computer board.

[0105] +110V output, used to output DC 110V power to the outside, not less than 75W;

[0106] Adjustable power output, DC 5V~26V adjustable output, 75W;

[0107] d)OPA module (OPA board):

[0108] The OPA module is connected to the computer board, and receives 6-way electrical pulse signals at the same time, and converts them into 6-way current pulse signal outputs. The computer board also receives 6-way electrical pulse signals fed back by the OPA board. These pulse signals can be displayed on the software interface, and the specific output pulse can be flexibly configured according to the actual situation.

[0109] e) Display module:

[0110] 14-inch display screen for real-time display of test information;

[0111] f) Software:

[0112] The test device is equipped with a Windows 7 32-bit operating system and integrated with automatic test application software. The test application software can realize real-time display of output voltage and current, output pulse frequency control, output channel selection, real-time acquisition of input pulses, waveform display, fault diagnosis and other functions.

[0113] The above is the hardware configuration of the test device. The main performance and configuration indicators of the test device are shown in Table 1 below:

[0114] Table 1 Main performance and configuration indicators of multifunctional portable tester

[0115]

[0116]

[0117] The environmental adaptability of the test device is shown in Table 2 below:

[0118] Table 2 Environmental adaptability

[0119] Serial number project index 1 Operating temperature -10℃～45℃ 2 Storage temperature -20℃～55℃ 3 relative humidity ≤95％

[0120] Table 2 above gives an example of the environmental adaptability of the test device. Its power adaptability is shown in Table 3:

[0121] Table 3 Power adaptability

[0122] Serial number project Index requirements Remark 1 Power adaptability AC 220V, 50HZ 2 Power supply ≤200W

[0123] The above introduction is the hardware configuration and adaptability of the test device in a specific embodiment of the present application. Next, its supporting software is introduced:

[0124] The test device is equipped with system software and driver software. The multi-function computer is pre-installed with the Windows 7 Professional operating system and provides drivers for the motherboard, graphics card, and network port. It also provides user-customized test software. Its main functions include:

[0125] 1) Real-time display of test process;

[0126] 2) Real-time display of input interface signal waveform, such as input pulse waveform, etc.;

[0127] 3) Set the frequency of the output pulse and display the output waveform in real time. The output waveform is divided into normal mode and development mode. The normal mode can be set according to the power module interface definition. Among them, channel 1 and channel 2 are complementary, channel 3 and channel 4 are complementary, and channel 5 and channel 6 are complementary. In development mode, the waveform of each channel can be edited arbitrarily, and any channel can be selected for output;

[0128] 4) 110V output power control and real-time display of output voltage and current values;

[0129] 5) Output voltage setting of 5~26V programmable power supply, real-time display of voltage and current;

[0130] 6) Real-time data storage.

[0131] The above is an introduction to the software included with the test device. Regarding the specific structural details of the test device, in one embodiment, the side of the test device's enclosure is also equipped with a three-phase AC input socket, an aviation connector for level pulse output, a 110V power output, a 5V-26V adjustable power output connector, a cooling fan 15, a USB port, an Ethernet port, an RS232 port, and other components. The optical signal interface is located within the chassis' swing door 5, and measurement can be performed by opening the swing door 5.

[0132] The power module integrates the ARM single-chip microcomputer STM32F103RBT6 to realize the acquisition of the external output voltage and current, and transmits the data to the application software through the RS232 interface, and displays it in real time on the application software.

[0133] The front panel features indicator lights, a power button, and other features. The test equipment achieves functional expansion through highly reliable, integrated circuit interconnection. This eliminates the need for plug-and-play boards, significantly reducing system interconnection complexity and improving overall reliability. Furthermore, compatibility and interchangeability were fully considered during the design of each module, enabling flexible and multifunctional system configuration.

[0134] All purchased components and electronic accessories that make up this test equipment are industrial-grade or higher. To meet the equipment's requirements for strength, light weight, and compact size, and while fully considering processing methods and product performance-price ratios while meeting design requirements, the primary materials used were LY12-CZ hard aluminum alloy sheet and GB13237-91 10F steel.

[0135] The box body is made of hard aluminum alloy. Hard aluminum alloy LY12-CZ is a high-strength hard aluminum with medium plasticity in annealing and new quenching state and good welding performance. It is mainly used for high-strength structural parts. Its strength is close to that of steel, and its mechanical properties are good. The tensile strength can reach 460N / mm. 2 , hardness HBS is 105, but its density is relatively low, which makes it very suitable for use in situations where the weight of parts is critical. Moreover, its cutting performance and weldability are also good, which can meet design requirements.

[0136] GB13237-91 10F steel is a common manganese-containing steel with a carbon content of 0.07 to 0.14, making it a low-carbon, high-quality steel. This low carbon content results in lower hardness, high plasticity and toughness, excellent forgeability, and excellent weldability. This results in excellent sheet metal fabrication performance, making it easy to form by stamping and welding, meeting product requirements.

[0137] The test device provided in this application proposes the following optimized designs based on existing actual test operations:

[0138] 1) Reliability design

[0139] The test system adopts mature technology, simplified design, fault-tolerant design, redundant design, derating design, aging screening and other effective measures to improve reliability and enhance product reliability.

[0140] 2) Simplify the design

[0141] Minimize the number of components and parts to meet product functions, and minimize and control the types, models, and quantities of components and raw materials. Give priority to the use of standard parts to improve interchangeability and standardization.

[0142] 3) Fault tolerance, redundancy and error prevention design

[0143] The test system has taken the following measures in terms of fault tolerance, redundancy and error prevention:

[0144] a) The power cables inside the system are marked with different colors.

[0145] b) All connections are printed with line numbers and labels, and the logo of each unit is printed inside the chassis;

[0146] c) Different interfaces use different connectors to prevent mis-insertion.

[0147] d) Derating design

[0148] Derating design involves subjecting components to stresses below their rated values ​​during use, in order to slow parameter degradation and improve reliability. Derating different components based on their specific applications can significantly increase equipment reliability, but more derating is not always better. Excessive derating can lead to an unnecessary increase in the number of components, ultimately increasing the size and weight of the equipment, which in turn negatively impacts reliability.

[0149] Different components have different derating methods. The derating method for resistors is mainly to reduce the power ratio, the derating method for capacitors is mainly to reduce their operating voltage, the derating method for semiconductors is mainly to keep the operating power consumption within the rated power consumption, digital integrated circuits are derated by the ambient temperature and electrical load, and linear integrated circuits, large-scale integrated circuits and semiconductor memories are also mainly derated by reducing the ambient temperature.

[0150] Derating design can be achieved in two ways: one is to reduce the applied stress of components, and the other is to increase the working strength of components. Selecting components with higher working strength is the most practical method.

[0151] 4) Heat dissipation design

[0152] When electronic devices are operating, their output power often only accounts for a fraction of their input power, and this power loss is generally dissipated as heat. Thermal design refers to the temperature control of the heat-consuming components of electronic equipment, as well as the entire device or system. Its goal is to keep the operating temperature of components within the electronic device within its temperature limits, thereby ensuring stable and reliable operation of the device under predetermined environmental conditions. The raw materials used in the manufacture of electronic devices have certain temperature limits. Beyond these limits, their physical properties deteriorate, and the device may no longer function as intended. Devices may also fail after prolonged operation at the rated temperature. Statistics show that electronic component failures are closely linked to their operating temperature. The goal of thermal design is to provide a low thermal resistance path from the heat source (electronic component or assembly) to the heat sink (the ultimate heat sink), ensuring that the temperature of the component or device remains within the design reliability range, thereby achieving high reliability.

[0153] 5) Environmental protection design

[0154] Product failures are often related to the environment in which they are located. The environmental protection design of the test system includes: temperature protection design, three-proof design against moisture and heat, smoke and mildew, as well as anti-dust and anti-static design.

[0155] In addition to the above five optimized designs, the test device provided in this application also has good maintainability and practicality:

[0156] In order to improve the maintainability of the test device, this application has taken the following measures:

[0157] 1) Simplify the design

[0158] In order to reduce maintenance skill requirements and reduce support resources such as spare parts, tools and equipment, the variety of equipment should be minimized when selecting equipment for the test device.

[0159] 2) Modular design

[0160] The key to maintainability is fault isolation time, disassembly time, replacement time, and assembly time. To reduce fault isolation time, the design not only considers improving fault diagnosis capabilities but also adopts modular design.

[0161] 3) Error prevention measures and identification marks

[0162] The connections between the printed circuit boards (base boards or substrates) of each device and the cables connecting the printed circuit boards to the chassis are all marked with numbers to prevent incorrect insertion. The printed circuit board power supply uses different types of connectors to prevent incorrect insertion.

[0163] 4) Maintenance safety

[0164] There are no high-voltage circuits inside this machine, but it is necessary to prevent static electricity from damaging the components on the printed circuit board. When repairing, the static electricity on the human body should be discharged and the equipment should be reliably grounded.

[0165] 5) Maintenance manuals and maintenance tools

[0166] The test device is provided with an instruction manual, which includes a maintenance manual. The maintenance manual describes various faults and repair methods in detail. Common tools such as screwdrivers, soldering irons, tweezers, etc. are used to repair the test device.

[0167] 6) Reduce the skill requirements for maintenance personnel

[0168] Since a detailed maintenance manual is provided, maintenance personnel only need to be trained to repair most faults of the test system, which reduces the skill requirements for maintenance personnel.

[0169] 7) Simplify the self-test and calibration process

[0170] The test device uses some common test instruments and calibration and self-test modules, which can independently complete calibration and self-test without relying on the system under test, simplifying the calibration and self-test process.

[0171] In order to improve the environmental adaptability of the test device of the present application, the present application has made an electromagnetic compatibility design for the test device, the purpose of which is to reduce the device's electromagnetic interference to the outside world and enhance the device's ability to resist external electromagnetic interference, so that the electronic equipment can work normally in a certain electromagnetic environment. Under normal circumstances, the main means of magnetic compatibility design is to cut off the transmission channel of interfering electromagnetic waves. There are three main ways for interfering electromagnetic waves to enter and exit the device: radiation, conduction and coupling. The electromagnetic compatibility design of the present application is to ensure that the electronic equipment, based on the conventional electromagnetic compatibility design, takes measures such as shielding, source suppression, and grounding for the operating frequency and power of the radio frequency signal and the anti-interference rate range to reduce the radiation emission intensity and enhance the ability to resist electromagnetic interference. In order to prevent electromagnetic interference signals from being conducted and emitted through the power line, the present application installs a filter at the power inlet of the power control combination. The filter attenuates the electromagnetic interference signals transmitted through the power line, protects the equipment from harm, and can suppress the electromagnetic interference signals generated by the equipment itself. When installing the filter, the input and output ends must be isolated to achieve a good shielding effect.

[0172] The test device of the present application also adopts a grounding design, which can release the charge accumulated and stored on the chassis due to electrostatic induction, avoiding excessive charge accumulation to form high voltage, causing equipment discharge and interfering with the entire test process. The design of the grounding structure provides the necessary safety protection for the equipment operators while suppressing electromagnetic noise and preventing electromagnetic interference, thereby improving the stability of the equipment operation.

[0173] Specifically, in one embodiment of the present application, the above grounding design is achieved through the following five points:

[0174] (1) Design a special grounding column on the base plate to connect to the ground wire of the box;

[0175] (2) Design a chassis with good electrical conductivity;

[0176] (3) When designing the substrate inside the chassis, copper cladding is designed around the core components and the substrate to provide a low-impedance connection to the chassis, using the chassis as a reference plane.

[0177] (4) When designing the power module, high-voltage signals are isolated from low-voltage signals, and the isolation distance reaches the insulation level. Warning signs are designed on the high-voltage line part, and low impedance is ensured between the reinforced structural parts and the safety ground;

[0178] (5) The substrate ensures the shortest path of the signal loop by covering a large area of ​​copper or designing a ground plane. The switch matrix control board and the power control combination control board are four-layer boards, one of which is a ground plane, thereby ensuring the control signal's requirements for the ground plane.

[0179] Based on all the above embodiments, the portable testing device provided by this application has the following advantages:

[0180] 1. The whole device is light and easy to carry.

[0181] 2. The power module and test equipment do not need to be powered separately and can be powered directly.

[0182] 3. Automatic measurement can be achieved throughout the entire process, with low manual participation.

[0183] 4. All test data can be saved and not easily lost.

[0184] 5. The test results do not need to be recorded manually, as the test device can save them automatically.

[0185] In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples, unless they contradict each other. The above is only an embodiment of the embodiment of this specification and is not intended to limit the embodiment of this specification. For those skilled in the art, the embodiment of this specification may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiment of this specification shall be included within the scope of the claims of the embodiment of this specification.

Claims

1. A portable power module test device for on-site testing of EMU power modules, characterized in that: include: A housing and a display assembly, a processor, an FPGA, a power distribution assembly, a current pulse amplifier, an electro-optical converter, and a photoelectric converter arranged inside the housing, wherein the processor, the FPGA, the power distribution assembly, the current pulse amplifier, the electro-optical converter, and the photoelectric converter are arranged on a substrate inside the housing; The processor is connected to the display component, the power distribution component, and the display component respectively, and is connected to the current pulse amplifier, the photoelectric converter, and the electro-optical converter through the FPGA; wherein, The power distribution assembly comprises: The power filter, composed of common-mode filter inductors and capacitors, is used to attenuate EMI energy conducted along the power line and suppress EMI radiation; An RS232 interface, connecting the processor and the power distribution assembly, and extending the processor via a first chip to transmit current and voltage data output to the device under test to the processor; The FPGA receives the device under test test information transmitted by the processor through the PCIE interface, and the FPGA transmits the level pulse signal to the electro-optical converter at a preset frequency pulse. The photoelectric converter receives the optical signal of the device under test and converts it into an electrical signal and transmits it to the FPGA; The current pulse amplifier is provided with a level pulse input and output interface and a current pulse input and output interface, which receives the pulse signal input of the device under test and transmits the converted pulse signal to the FPGA; the FPGA is externally connected to a DDS chip, which is used to generate a signal source and can achieve precise control of the pulse output. During the pulse output process, the DDS chip generates a frequency pulse to the FPGA, and the FPGA uses the frequency pulse as a reference source to transmit the level pulse signal to the current pulse amplifier, and then the current pulse amplifier converts the level pulse signal into a current pulse signal for output; during the pulse input process, the current pulse amplifier receives an external current-type pulse signal and converts it into a voltage-type pulse signal and inputs it into the FPGA; The processor tests the device under test according to the pulse signal input; The substrate is designed with a special grounding post for connecting to the ground wire of the box; when designing the substrate, copper is clad around the core components and the substrate, and is connected to the box with low impedance, using the box as a reference plane; when designing the power module in the distribution component, the high-voltage signal is isolated from the low-voltage signal, and the isolation distance reaches the insulation level. The high-voltage line part is designed with a warning sign, and low impedance is guaranteed between the reinforced structural parts and the safety ground; the substrate ensures the shortest path of the signal loop by cladding copper over a large area or designing a ground plane. The switch matrix control board and the power-on control combination control board are four-layer boards, one of which is a ground plane, thereby ensuring the control signal's requirements for the ground plane.

2. The testing device according to claim 1, wherein: The processor, the FPGA, the power distribution component, and the current pulse amplifier are integrated on a computer board; The processor has a USB expansion interface, is connected to the rear panel of the box through the USB expansion interface, and expands the storage device through the interface for storing test data.

3. The testing device according to claim 1, wherein: The power distribution assembly is installed close to the side wall of the box; The power distribution component is integrated with the power supply and the power supply filter.

4. The testing device according to claim 1, wherein: An input component is provided in the box, and the input component is connected to the display component and the processor respectively.

5. The testing device according to claim 1, wherein: A grounding stake is provided on the outside of the box body, which is used to ground the test device when testing the device under test to ensure the safety of the test process.

6. The testing device according to claim 1, wherein: A closable rotating door is provided on one side of the box body for inspecting the testing device.

7. The testing device according to claim 1, characterized in that The box body is also provided with a heat dissipation fan, a power supply output terminal and a pulse interface.

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