Integrated circuit package with antenna

Abstract

The purpose of the present invention is to provide a packaging device that can be used for an integrated circuit SiP, which not only provides packaging for the integrated circuit, but also provides an antenna function for the integrated circuit system. The packaging device provided by the present invention has low cost and simple packaging process requirements. The use of the device can effectively improve the packaging yield of the packaged antenna (AiP) and reduce the process flow. The device can be widely used in wireless communication and detection fields such as 5G communication terminals, Internet of Things devices, satellite and ground communications, radar detection, etc.

Description

Technical Field

[0001] The invention relates to an integrated circuit package, in particular to an integrated circuit package with an antenna. Background Art

[0002] SiP technology integrates various functional modules into one package through packaging technology, which can make communication communication miniaturized, low-cost and highly stable. However, antennas, as the main components of wireless communication systems, are difficult to integrate with the system. The reason is that the limitation of the communication frequency band makes the antenna structure relatively large. The present invention provides a packaging structure with an antenna for a wireless communication chip, which can meet the SiP requirements of the wireless communication system for the antenna. Summary of the invention

[0003] The purpose of the present invention is to provide a packaging device that can be used for an integrated circuit SiP, which not only provides packaging for the integrated circuit, but also provides an antenna function for the integrated circuit system. The packaging device provided by the present invention has low cost and simple packaging process requirements. The use of the device can effectively improve the packaging yield of the packaged antenna (AiP) and reduce the process flow. The device can be widely used in wireless communication and detection fields such as 5G communication terminals, Internet of Things devices, satellite and ground communications, radar detection, etc.

[0004] To achieve the above purpose, the technical solution of the present invention is: a microstrip antenna is arranged in the packaging shell, and the antenna feeding point and the internal pad of the packaging are arranged in the same plane. The chip packaging can be realized by cooperating with flip-chip welding. The present invention includes a shell, a microstrip antenna, and an external pad. The shell has a plurality of conductive structures. The microstrip antenna has a feed line and a feed pad. The microstrip feed line connects the microstrip antenna and the feed pad. The external pad of the shell forms an electrical connection with the inside of the shell through the conductive structure, and the internal circuit is led out.

[0005] By selecting a suitable integrated circuit (Chip) and utilizing a flip-chip process, a system-level package (SiP) can be realized on the structure of the present invention.

[0006] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a cross-sectional schematic diagram of the present invention;

[0008] Figure 2 It is a top view schematic diagram of the present invention;

[0009] Figure 3 It is a schematic cross-sectional diagram of the structure after packaging of an embodiment of the present invention;

[0010] Figure 4It is a top view schematic diagram of the packaged embodiment of the present invention. DETAILED DESCRIPTION

[0011] Figure 1 , Figure 2 The present invention is an integrated circuit package with an antenna, comprising a ceramic housing 1, a microstrip antenna 2, and an external pad 3. The housing 1 has 18 conductive structures 11. The microstrip antenna 2 has a feed line 21 and a feed pad 22.

[0012] Eighteen conductive vias 11 are arranged at appropriate positions of the ceramic housing 1 .

[0013] The microstrip antenna 2 is designed as a fixed frequency band according to system requirements. The antenna is side-fed via a feeder 21. The microstrip feeder connects the microstrip antenna 2 and a feed pad 22. The pad 22 is provided with a hole for easy ball implantation.

[0014] The 18 external pads 3 are electrically connected to the interior through the 18 conductive vias 11 to lead out the internal circuit.

[0015] By selecting a suitable integrated circuit (Chip) and utilizing a flip-chip process, a system-level package (SiP) can be realized on the structure of the present invention.

[0016] Figure 3 Schematic diagram of the cross-sectional structure after packaging of an embodiment of the present invention. Figure 4 The top view of the packaged embodiment of the present invention is shown in FIG. As shown in the figure, 19 solder balls 4 are arranged at the positions of 18 conductive holes 11 and 1 feeding pad 22 of the present invention. The pins corresponding to the chip 5 are electrically connected to the 19 solder balls using a flip-chip process, and the chip is sealed in the housing 1 using a process such as potting.

[0017] The package of the present invention has an antenna, has low packaging process requirements, good packaging stability, and high packaging yield. This embodiment only provides one implementation of the present invention. Of course, the present invention can also have other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the art can implement various corresponding variations according to the present invention, but these corresponding changes and variations should all fall within the protection scope of the claims of the present invention.

Claims

1. An integrated circuit package with an antenna, characterized in that: It comprises a ceramic shell, a microstrip antenna, a shell external pad and a chip, wherein the ceramic shell has a plurality of conductive vias, the microstrip antenna has a feed line and a feed pad, the microstrip feed line connects the microstrip antenna and the feed pad, the feed pad is arranged as a hole for easy ball planting, the solder ball is arranged at the position of the conductive via and the feed pad, the pin corresponding to the chip is electrically connected to the solder ball by a flip-chip process, the ceramic shell external pad is electrically connected to the inside of the ceramic shell through the conductive via, the internal circuit is led out, and the antenna feeding point and the package internal pad are arranged coplanarly; The ceramic shell is provided with 18 conductive vias, and the microstrip antenna is designed as a fixed-band form, and the antenna is side-fed through a feeder line; 19 solder balls are arranged at the positions of 18 conductive holes and 1 feeding pad, the corresponding pins of the chip are electrically connected to the 19 solder balls by using a flip-chip process, and the chip is sealed in a housing by using a potting process.

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