Loading device, loading method and testing equipment

Abstract

This invention discloses a support device, a support method, and a testing device. The support device includes a first substrate and a second substrate, which are stacked and configured to move relative to each other. The first substrate has at least three non-collinear adjusting posts and a first limiting mechanism for moving the adjusting posts along a first trajectory. The second substrate has a second limiting mechanism for moving the adjusting posts along a second trajectory. The first and second trajectories intersect at a point. When the first and second substrates move relative to each other to multiple consecutive positions, the centers of the at least three adjusting posts share a common circumference, and the first center of the circumference is the same, but the radii are different. This support device facilitates the placement of the object to be supported and ensures that the center of the object placed on it overlaps with the center of the support device. Furthermore, the alignment process is simple and fast.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing equipment, in particular to a carrying device for carrying wafers during wafer production and testing. The present invention also relates to a method for carrying wafers, and wafer testing equipment. Background Art

[0002] The wafer serves as the substrate of the chip. If there are defects on the wafer, the defects will cause the prepared chip to fail, thereby reducing the yield of the chip and increasing the manufacturing cost. To solve the above problems, defects on the wafer surface are usually detected before or during chip preparation.

[0003] At present, the commonly used technology for wafer surface defect detection is optical detection technology, which has the advantages of fast detection speed and no pollution. During the detection process, the wafer is first placed on the detection table, and then the detection device is used to detect the wafer on the detection table. Since the position between the detection device and the detection table is relatively fixed, if the wafer deviates far from the center position on the detection table, the detection signal of some areas of the wafer to be tested will be weak or some areas will not be successfully detected.

[0004] Therefore, when testing the wafer, the wafer needs to be placed in the center of the testing table to facilitate the testing device to test it. Summary of the invention

[0005] The object of the present invention is to provide a carrying device which is convenient for placing an object to be carried and enables the center of the object to be carried placed thereon to overlap with the center of the carrying device, and the alignment process is simple and fast.

[0006] Another object of the present invention is to provide a method for carrying an object to be carried using the carrying device.

[0007] Another object of the present invention is to provide a detection device provided with the carrying device.

[0008] To achieve the above-mentioned purpose, the present invention provides a carrying device, including a first substrate and a second substrate, the first substrate and the second substrate are arranged in a stacked form, and the second substrate and the first substrate are configured to move relative to each other; the first substrate is provided with at least three non-collinear adjustment columns, the first substrate has a first limiting mechanism, the first limiting mechanism is used to move the adjustment column along a first trajectory, and the second substrate has a second limiting mechanism, the second limiting mechanism is used to move the adjustment column along a second trajectory; the projections of the first trajectory and the second trajectory intersect at a point, when the first substrate and the second substrate move relative to each other to multiple continuous positions, the centers of at least three adjustment columns share a circumference, the circumference has a first center, the first center of the circumference at the multiple continuous positions is the same and the radius is different, and the adjustment column is located at the upper end of the area above the second substrate to form an action part for driving the object to be carried to move.

[0009] Preferably, the second substrate and the first substrate are configured to translate along a translation line parallel to the plane where the circumference lies.

[0010] Preferably, the at least three adjusting columns include a first adjusting column, a second adjusting column and a third adjusting column; the first trajectories of the first adjusting column and the second adjusting column are symmetrical about the translation line; the first trajectory of the third adjusting column is the same as the first trajectory of the first adjusting column, or the first trajectory of the third adjusting column is the same as the first trajectory of the second adjusting column; the second trajectories of the first adjusting column and the second adjusting column are symmetrical about the translation line; the second trajectory of the third adjusting column is the same as the second trajectory of the first adjusting column, or the second trajectory of the third adjusting column is the same as the second trajectory of the second adjusting column, and the relative movement direction of the second substrate and the first substrate is equal to the angle formed by the first trajectory and the second trajectory.

[0011] Preferably, the first limiting mechanism is a first slot or a first sliding mechanism; the second limiting mechanism is a second slot or a second sliding mechanism; one end of the adjusting column is limited by the first slot or the first sliding mechanism, and the part of the adjusting column located between the two ends is limited by the second slot or the second sliding mechanism.

[0012] Preferably, the adjusting column is in a "T" shape, the diameter of the upper end thereof is larger than the diameter of the lower end, and the outer peripheral surface of the upper end forms a portion in contact with the object to be carried.

[0013] Preferably, the first sliding mechanism includes a sliding groove and a slider arranged on the top of the first substrate; the lower end of the adjusting column is connected to the slider, the slider is arranged in the sliding groove, and the slider can slide in the sliding groove so that the adjusting column can slide along the sliding groove.

[0014] Preferably, it further comprises a driving mechanism and a transmission mechanism; the driving mechanism is arranged on the first substrate and connected to the second substrate through the transmission mechanism to drive the second substrate to move relative to the first substrate.

[0015] Preferably, the first substrate is provided with a plurality of positioning posts, and the second substrate is provided with positioning grooves corresponding to the positioning posts, and the positioning posts and the positioning grooves cooperate with each other to limit the position change of the second substrate relative to the first substrate.

[0016] Preferably, the positioning column is in the shape of a circular wheel, and an annular groove is provided on the outer peripheral surface of the positioning column. The positioning groove is a notch groove opening toward the outside, and the notch groove is arc-shaped or straight-line-shaped. An arc-shaped protrusion is provided on the side wall of the notch groove to match the annular groove of the positioning column.

[0017] Preferably, it also includes a supporting column arranged on the first substrate, a plurality of the supporting columns are distributed around the center of the first substrate, and the top of each supporting column has a supporting surface for placing the object to be carried; the supporting surface is higher than the upper surface of the second substrate, and the second substrate is provided with a notch or groove corresponding to each of the supporting columns, and there is a gap margin between the supporting column and the notch or groove in the forward and reverse rotation directions of the second substrate.

[0018] Preferably, the number of the supporting columns is greater than or equal to three.

[0019] Preferably, a hollow circle is provided at the center of the first substrate and the second substrate, and an adsorption device for adsorbing the object to be carried is provided at the position of the hollow circle.

[0020] Preferably, it further comprises an elastic component, and two ends of the elastic component are respectively connected to the first substrate and the second substrate.

[0021] Preferably, the adjusting columns include a first group of adjusting columns and / or a second group of adjusting columns, and the distance between the second group of adjusting columns and the corresponding limiting mechanisms and the center of the first circle is greater than the distance between the first group of adjusting columns and the corresponding limiting mechanisms and the center of the first circle, so as to be used to place objects of different sizes to be carried.

[0022] Preferably, a height between the top of the first group of adjusting columns and the upper surface of the second substrate is smaller than a height between the top of the second group of adjusting columns and the upper surface of the second substrate.

[0023] To achieve the above another object, the present invention provides a bearing method, using any of the above bearing devices, comprising:

[0024] driving the second substrate to move relative to the first substrate along a first direction so that the radius of the circle formed by the at least three adjustment columns becomes larger;

[0025] Placing the object to be carried in the carrying area above the first substrate of the carrying device;

[0026] The second substrate is driven to move relative to the first substrate along a second direction, the second direction being opposite to the movement direction of the first direction, so that the radius of the circle becomes smaller; thereby driving the center of the object to be carried placed in the carrying area to axially coincide with the center of the circle of the first substrate of the carrying device.

[0027] To achieve the above-mentioned further object, the present invention provides a detection device, comprising:

[0028] A carrying device as described in any one of the above items, wherein the carrying device is used to adjust the center position of the object to be carried to be detected;

[0029] A detection system, used for detecting the object to be carried after being adjusted by the carrying device;

[0030] The robot is used to place the object to be carried in the carrying area of ​​the carrying device before detection, and to take the object to be carried from the carrying area of ​​the carrying device after detection.

[0031] The carrying device provided by the present invention is provided with a first substrate and a second substrate that can move relative to the first substrate, and a movable adjustment column is provided on the first substrate, the first substrate has a first limiting mechanism, which can make the adjustment column move along a first track, and the second substrate has a second limiting mechanism, which can make the adjustment column move along a second track. When the first substrate and the second substrate move relatively to multiple continuous positions, the centers of at least three adjustment columns share a circumference, and the circumference has a first center. Since the first centers of the circumferences at multiple continuous positions are the same and the radii are different, the adjustment column can drive the object to be carried to move to a position where the center coincides with the center of the first substrate axially through the action part during the movement process, so as to achieve center alignment, which is not only convenient for placing the object to be carried, but also the alignment process is simple, stable and fast.

[0032] The present invention also provides a load-bearing method and a detection device. Since the load-bearing device has the above-mentioned technical effects, the load-bearing method using the load-bearing device and the detection device provided with the load-bearing device should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A top view of a carrying device disclosed in an embodiment of the present invention;

[0034] Figure 2 for Figure 1An axonometric view of the carrier device after the second substrate is separated from the first substrate;

[0035] Figure 3 A top view of another carrying device disclosed in an embodiment of the present invention;

[0036] Figure 4 for Figure 3 A schematic diagram showing a second substrate of the carrying device translated to the left by a certain distance relative to the first substrate;

[0037] Figure 5 for Figure 3 The schematic diagram shows that the second substrate of the carrying device is translated to the right by a certain distance relative to the first substrate.

[0038] In the figure:

[0039] 1. First substrate 2. Second substrate 3. Adjustment column (first group) 4. Slot (first group) 5. Driving mechanism 6. Transmission mechanism 61. Swing arm 7. Sliding block (first group) 8. Sliding groove (first group) 9. Positioning column 91. Annular groove 10. Positioning groove 101. Arc-shaped protrusion 11. Bearing column (first group) 12. Notch 13. Spring 14. Adjustment column (second group) 15. Slot (second group) 16. Sliding groove (second group) 17. Sliding block (second group) 18. Bearing column (second group) 19. Through groove 21. First adjustment column 22. Second adjustment column 23. Third adjustment column DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0041] In this article, the terms "upper, lower, inside, outside" and the like are established based on the positional relationships shown in the drawings. The corresponding positional relationships may also change depending on the drawings, and therefore cannot be understood as absolute limitations on the scope of protection; moreover, relational terms such as "first" and "second" and the like are merely used to distinguish one component from another with the same name, and do not necessarily require or imply any actual relationship or order between these components.

[0042] Please refer to Figure 1 , Figure 2 , Figure 1 A top view of a carrying device disclosed in an embodiment of the present invention; Figure 2 for Figure 1 An axonometric view of the carrier device after the second substrate is separated from the first substrate.

[0043] In one embodiment, the carrying device provided by the present invention is used to carry a wafer, so that the wafer to be tested is placed on a testing table, and the wafer is adjusted to the center position of the testing table, thereby ensuring the accuracy of the test.

[0044] As shown in the figure, the supporting device is mainly composed of a first substrate 1, a second substrate 2, an adjustment column and other components. The main part of the first substrate 1 is generally a square with the four corners cut off, and the shape of the second substrate 2 is the same as the first substrate 1. In other embodiments, the shape of the outer periphery of the first substrate and the second substrate can be circular, rectangular or irregular.

[0045] The first substrate 1 includes a first surface; the second substrate 2 includes an opposite second surface and a third surface.

[0046] The second substrate 2 is arranged in parallel with the first substrate 1 in a stacked form, specifically, the second surface is arranged toward the first surface, and an appropriate distance is maintained between the first substrate 1 and the second substrate 2 .

[0047] In this embodiment, the second substrate has a rotation axis that rotates relative to the first substrate.

[0048] A first hollow circle is provided at the center of the first substrate 1, and a second hollow circle is provided at the center of the second substrate 2, and the centers of the first hollow circle and the second hollow circle coincide or do not coincide in the axial direction. In this embodiment, the first hollow area and the second hollow area are circular. In other embodiments, the first hollow area and the second hollow area are elliptical, polygonal or irregular in shape. In another embodiment, the first substrate does not have the first hollow area, and / or the second substrate does not have the second hollow area.

[0049] In this embodiment, the rotation axis passes through the center of the first hollow area, and the rotation axis passes through the circle of the second hollow area. In other embodiments, the rotation axis does not pass through the center of the first hollow area, and / or the rotation axis does not pass through the center of the second hollow area.

[0050] The upper surface of the first substrate 1 is provided with a plurality of adjustment columns 3 distributed around the center of the first substrate 1 , and the number of the first adjustment columns is greater than or equal to 3. Specifically, in this embodiment, the number of the first adjustment columns 3 is 4.

[0051] The centers of the plurality of first adjustment columns 3 are located in the same plane, and the plane where the plurality of first adjustment columns 3 are located is perpendicular to the rotation axis, and the focus with the rotation axis is the rotation center.

[0052] Each adjusting column 3 is movably connected to the first substrate 1 through its lower end, and the arc formed by the distribution of the four adjusting columns 3 exceeds a semicircle, that is, the four adjusting columns 3 are distributed along a circumferential arc greater than 180° with the center of the first substrate 1 and the second substrate 2 as the center.

[0053] The second substrate 2 is provided with a slot 4 corresponding to each adjustment column 3. The adjustment column 3 passes through the slot 4, exceeds the third surface of the second substrate 2, and is located on the side of the third surface of the second substrate 2 away from the second surface to drive the wafer to align.

[0054] The first substrate 1 is provided with a lateral extension, and a driving mechanism 5 and a transmission mechanism 6 are provided on the lateral extension. The driving mechanism 5 is fixedly mounted on the lateral extension, and its power output end is connected to the second substrate 2 through the transmission mechanism 6 to drive the second substrate 2 to rotate around the rotation axis relative to the first substrate 1. The driving mechanism 5 can be a motor or other power source, and the transmission mechanism 6 can be a chain transmission mechanism. The transmission mechanism 6 is movably connected to the driving mechanism 5 and the second substrate 2 respectively. The transmission mechanism 6 shown in the figure is provided with a swing arm 61 that is generally triangular, and the wider end of the swing arm 61 is connected to the second substrate 2, and one end of the swing arm 61 is connected to the driving mechanism 5, and the connection holes of the two are oblong. In this way, when the motor is running, the transmission member connected to the swing arm 61 performs telescopic movement, and then pushes the second substrate 2 to rotate counterclockwise through the swing arm 61, or pulls the second substrate 2 to rotate clockwise.

[0055] During the rotation process, the second substrate 2 can drive the adjustment column 3 to move relative to the first substrate 1 through the card slot 4, so that the distance between the adjustment column 3 and the center of the circle of the first substrate 1 can be reduced or increased at the same time. When the second substrate 2 rotates in the positive direction (clockwise or counterclockwise) relative to the first substrate 1, the distance between the adjustment column 3 and the center of the circle of the first substrate 1 can be increased at the same time, thereby leaving enough space for placing the object to be carried. When the second substrate 2 rotates in the reverse direction (counterclockwise or clockwise) relative to the first substrate 1, the distance between the adjustment column 3 and the center of the circle of the first substrate 1 can be reduced at the same time.

[0056] Since the centers of the multiple adjustment columns 3 share a common circumference, the circumference has a first center, and the first center is the same. In this embodiment, the first center coincides with the center of the first substrate 1. The adjustment column 3 can drive the wafer to move to a position where the center coincides axially with the center of the first substrate 1 during movement, thereby achieving center alignment. This not only facilitates the removal and placement of the wafer, but also makes the alignment process simple, stable and fast.

[0057] The first substrate has a first limiting mechanism, which is used to move the adjusting column along a first track, and the first limiting mechanism is a first slot or a first sliding mechanism; the second substrate has a second limiting mechanism, which is used to move the adjusting column along a second track, and the second limiting mechanism is a second slot or a second sliding mechanism; the projections of the first track and the second track intersect at a point.

[0058] Each adjusting column 3 is movably mounted on the first substrate 1 through a sliding mechanism. The sliding mechanism is mainly composed of a slider 7 and a sliding groove 8. The sliding groove 8 is fixedly arranged in the first surface of the first substrate 1. The lower end of the adjusting column 3 is fixedly connected to the slider 7. The slider 7 is arranged in the sliding groove 8 and can slide in the sliding groove 8 so that the adjusting column 3 can slide along the long side of the sliding groove 8.

[0059] The sliding groove 8 on the first substrate 1 is a linear sliding groove, and the card slot 4 on the second substrate 2 is a linear through groove. The card slot 4 includes a long side and a short side, and is diamond-shaped in a top view. The length of the long side is greater than the length of the short side and greater than the diameter of the adjustment column 3. The adjustment column 3 can move in the card slot 4 along the long side direction.

[0060] In other embodiments, the first sliding groove 8 may be arc-shaped.

[0061] The sliding groove 8 extends along the radial direction passing through the center of the circle on the first surface of the first substrate 1, with one end of the first track close to the first center of the circle and the other end away from the first center of the circle; the card slot 4 is provided on the second substrate 2, with one end of the second track close to the first center of the circle and the other end away from the first center of the circle; and the first track and the second track are not parallel, and the orthographic projections of the two intersect. The first track and the second track here are the moving routes of the center point of the first adjustment column 3. Since the adjustment column 3 is provided in the card slot 4, it can only move along the long side direction of the card slot 4. The actual moving path of the adjustment column 3 is defined by the long side direction of the sliding groove 8 and the long side direction of the card slot 4.

[0062] The adjusting column 3 is in a "T" shape, the diameter of the upper end is larger than the diameter of the lower end, and the outer circumferential surface of the upper end forms a portion in contact with the wafer. During installation, the lower end of the adjusting column 3 can pass through the card slot 4 on the second substrate 2 from top to bottom and connect with the first slider 7 in the sliding slot 8 on the first substrate 1. During the adjustment process, when the outer circumferential surfaces of the upper ends of all adjusting columns 3 are tangent to the wafer, the wafer is in a position where the center coincides axially with the center of the circle of the first substrate 1 and the second substrate 2.

[0063] The carrying device further comprises a positioning mechanism, and the positioning mechanism is used to limit the relative movement between the first substrate and the second substrate. Specifically, in this embodiment, the positioning mechanism is used to enable the first substrate and the second substrate to rotate relative to each other only around the rotation axis.

[0064] The positioning structure includes a positioning column 9 and a positioning groove 10 .

[0065] In this embodiment, the positioning mechanism is configured to convert the translational motion transmitted by the driving mechanism 5 and the transmission mechanism 6 into the rotational motion of the first substrate relative to the second substrate. The first substrate 1 can be provided with a plurality of positioning posts 9, four positioning posts 9 are shown in the figure, and at the same time, positioning grooves 10 corresponding to the positioning posts 9 are provided on the second substrate 2. Through the mutual cooperation of the positioning posts 9 and the positioning grooves 10, the rotation range of the second substrate 2 relative to the first substrate 1 can be limited.

[0066] For example, the positioning post 9 may be in the shape of a circular wheel, with an annular groove 91 provided on its outer circumference, and the positioning groove 10 is a notch groove with its opening facing outward, and the notch groove is in an arc shape. There are two positioning grooves 10 shown in the figure, one on each side, which are distributed in a symmetrical manner. The positioning grooves 10 on each side correspond to two positioning posts 9, and the arc-shaped side walls thereof are provided with an arc-shaped protrusion 101 that matches the annular groove 91 of the positioning post 9. Of course, each positioning post 9 may also be provided with a positioning groove 10 separately, and the spacing between the positioning post 9 and the two ends of the positioning groove 10 limits the rotatable angle of the second substrate 2 relative to the first substrate 1, which can prevent the first adjustment post 3 and the side wall of the card slot 4 from being squeezed and deformed due to excessive rotation angle of the second substrate.

[0067] When the first substrate 1 rotates relative to the second substrate 2, the arc-shaped protrusion 101 in the positioning groove 10 always slides in the annular groove 91 of the positioning column 9, so that the second substrate 2 can only rotate along the arc-shaped notch groove, ensuring that the first substrate 1 and the second substrate 2 always maintain an appropriate distance, avoiding the lower surface of the second substrate 2 directly contacting and rubbing with the upper surface of the first substrate 1, so that the second substrate 2 can rotate stably without moving up and down or offsetting.

[0068] In at least one embodiment, a supporting column 11 is further provided on the first substrate 1. Four supporting columns 11 are shown in the figure. The four supporting columns 11 are distributed around the center of the first substrate 1. Each supporting column 11 is semicircular in cross section, with a flat inner side and an arcuate outer side. The top is in a step shape with the outer side higher than the inner side, and the step surface forms a supporting surface for placing the wafer; the second substrate 2 is provided with notches 12 corresponding to each supporting column 11 one by one, and the supporting column 11 passes through the notch 12 on the second substrate 2 and extends beyond the third surface away from the first substrate. Its supporting surface is higher than the upper surface of the second substrate 2, so as to support the edge of the wafer and avoid direct contact between the wafer and the second substrate 2. The robot can be inserted from the gap between the supporting surface and the surface of the second substrate 2, so as to place the wafer on the supporting surface or remove the wafer from the supporting surface.

[0069] The notch 12 on the second substrate 2 has a certain curvature, and there is a gap margin between the supporting column 11 and both ends of the notch 12 in the forward and reverse rotation directions of the second substrate 2 to prevent the second substrate 2 from interfering with the first supporting column 11 during rotation.

[0070] In another embodiment, the first supporting column 11 is located on the third surface of the second substrate and is fixedly connected to the second substrate.

[0071] In other embodiments, an adsorption device (not shown in the figure) is provided at the position of the hollow circle of the first substrate 1 and the second substrate 2. When the wafer is located at the center position of the wafer supporting device, the adsorption device can generate a certain adsorption force on the wafer by vacuuming, thereby fixing the wafer.

[0072] In this embodiment, the carrying device may further be provided with an elastic component between the first substrate 1 and the second substrate 2, and two ends of the elastic component are respectively connected to the first substrate and the second substrate.

[0073] Specifically, the elastic component includes a spring 13. In this embodiment, rectangular holes for placing the spring 13 are respectively provided on the first substrate 1 and the second substrate 2. Both ends of the rectangular holes are appropriately thinned, and connecting holes are opened in the thinned parts. One end of the spring 13 is hooked in the connecting hole of the first substrate 1, and the other end is hooked in the connecting hole at the opposite end of the second substrate 2. By adding the spring 13, it is possible to prevent the first adjustment column 3 from exerting too much force on the wafer to damage the wafer, and to reduce the alignment error caused by the wear of the adjustment column 3.

[0074] Through the above arrangement, the second substrate 2 can change its position relative to the first substrate 1, and its position change amount is limited by the positioning column 9 and the positioning groove 10. When the second substrate 2 changes its position relative to the first substrate 1, it will drive the change of the relative position of the adjustment column 3 in the card slot 4, further causing the distance of multiple adjustment columns 3 relative to the center of the circle O to change. At this time, a manipulator can be used to place the wafer to be tested on the first supporting column 11 of the wafer supporting device; after the wafer is placed thereon, the driving mechanism drives the second substrate 2 to move in the opposite direction through the transmission mechanism, so that the position of the second substrate 2 relative to the first substrate 1 changes in the opposite direction (relative to the movement direction before the wafer is placed), and at the same time drives the adjustment column 3 to change in the opposite direction relative to the card slot 4, so that the distance between the multiple adjustment columns 3 and the center of the circle O is reduced at the same time, and at the same time drives the position of the wafer placed thereon to change. When the wafer to be tested and the multiple adjustment columns 3 are in a tangent position, the center of the wafer coincides with the central axis of the wafer supporting device.

[0075] In this embodiment, two or more groups of adjustment posts and slots are arranged on the first substrate 1 and the second substrate 2 at the same time, that is, a group of adjustment posts 14 and slots 15 are arranged on the periphery of the adjustment posts 3 and slots 4. The distribution form, matching mode, sliding mechanism, etc. of the adjustment posts 14 and slots 5 are basically the same as those of the adjustment posts 3 and slots 4, and they have sliding slots 16, sliders 17 and bearing posts 18. The difference is that the distance between the adjustment posts 14 and slots 15 and the center O is greater than the distance between the adjustment posts 3 and slots 4 and the center O. The adjustment posts 3 and slots 4 are used to adjust wafers with relatively small diameters, and the adjustment posts 14 and slots 15 are used to adjust wafers with relatively large diameters. In this way, they can be used to place wafers to be tested of different sizes, respectively, to improve the compatibility of the wafer bearing device. Moreover, when automatically aligning different objects to be carried, the first adjustment post 3 or the second adjustment post 14 only needs to be slightly displaced to achieve rapid alignment of the objects to be carried. Since the position of the adjustment posts changes slightly during the alignment process, the bearing device maintains a high reliability.

[0076] The second sliding groove 16 shown in the figure is a linear groove, and the first sliding groove 8 in the same position is also a linear groove. The two can be in the same straight line. The second sliding groove 16 and the first sliding groove 8 in the same position shown in the figure have a distance in the linear direction. As a possible improvement, the second sliding groove 16 and the first sliding groove 8 can also be connected as a whole through a connecting groove, so that only one sliding groove is provided to cooperate with the adjusting column 3 and the adjusting column 14 at the same time. The specific connecting groove is a linear groove or an arc groove.

[0077] In addition, the thickness of the upper end of the adjusting column 14 is greater than the thickness of the upper end of the adjusting column 3, and the tops of the adjusting columns 3 and 14 are both provided with a straight groove to facilitate the screwing operation; the height of the supporting column 14 is greater than the height of the supporting column 3, and a through groove 19 corresponding to the supporting column 14 is opened on the second substrate 2, and there is a gap margin between the supporting column 14 and the two ends of the through groove 19 in the forward and reverse rotation directions of the second substrate 2 to avoid the second substrate 2 from interfering with the supporting column 14 during rotation.

[0078] Please refer to Figure 3 , Figure 4 , Figure 5 , Figure 3 A top view of another carrying device disclosed in an embodiment of the present invention; Figure 4 for Figure 3 A schematic diagram showing a second substrate of the carrying device translated to the left by a certain distance relative to the first substrate; Figure 5 for Figure 3 The schematic diagram shows that the second substrate of the carrying device is translated to the right by a certain distance relative to the first substrate.

[0079] In another embodiment, the second substrate 2 and the first substrate 1 are configured to translate along a translation line (indicated by the dotted arrow) parallel to the plane where the circumference is located. The first substrate 1 and the second substrate 2 are schematically represented by circles in the figure. The first substrate 1 and the second substrate 2 can have various actual shapes and structures. Their adjustment columns, card slots, sliders, sliding grooves and other structures can be basically the same as those in the first embodiment mentioned above. The main difference lies in that its driving mechanism is used to drive the second substrate 2 to translate relative to the first substrate 1. Through translation, the adjustment column can drive the object to be carried to move to the center to coincide with the center of the circle of the first substrate 1 during the movement, thereby achieving center alignment.

[0080] Specifically, the adjusting column in this embodiment includes a first adjusting column 21, a second adjusting column 22 and a third adjusting column 23, wherein the sliding grooves 8 of the first adjusting column 21 and the second adjusting column 22 are symmetrical about the translation line, the sliding grooves 8 define the first trajectories of the first adjusting column 21 and the second adjusting column 22, the sliding grooves 8 of the third adjusting column 23 are the same as the sliding grooves 8 of the second adjusting column 22, and the two are parallel to each other; the card slots 4 of the first adjusting column 21 and the second adjusting column 22 are symmetrical about the translation line, the card slots 4 define the second trajectories of the first adjusting column 21 and the second adjusting column 22, the card slots 4 of the third adjusting column 23 are the same as the card slots 4 of the second adjusting column 22, and when observed from a top view, it is equivalent to translating the card slots 4 and the sliding grooves 8 of the second adjusting column 22 to form the card slots 4 and the sliding grooves 8 of the third adjusting column 23.

[0081] Of course, the first trajectory of the third adjusting column 23 may also be the same as the first trajectory of the first adjusting column 21, and the second trajectory of the third adjusting column 23 may also be the same as the second trajectory of the first adjusting column 21, that is, the card slot 4 and the sliding slot 8 of the first adjusting column 21 can be translated to form the card slot 4 and the sliding slot 8 of the third adjusting column 23.

[0082] The card slot 4 and the sliding slot 8 of the first adjusting column 21 are linear slots, and the card slot 4 and the sliding slot 8 of the second adjusting column 22 are also linear trajectories, and the card slots 4 and the sliding slots 8 of the two are perpendicular to each other in projection. When the centers of the first substrate 1 and the second substrate 2 coincide, the first adjusting column 21 and the second adjusting column 22 are radially symmetrical along the diameter direction passing through the center of the circle, and the angles formed by the translation line and the card slot 4 and the sliding slot 8 of the first adjusting column 21 and the card slot 4 and the sliding slot 8 of the second adjusting column 22 are equal, both of which are 45°.

[0083] In this way, on the basis that the center of the second substrate 2 coincides with the center of the first substrate 1, if the second substrate 2 is relative to the first substrate 1 along Figure 4 If the second substrate 2 moves leftward in the direction indicated by the arrow, the centers of the three adjustment columns will be on the same circumference, the first center of the circumference will always coincide with the center of the first substrate 1, and the radius of the circumference will gradually decrease; if the second substrate 2 moves relative to the first substrate 1 along Figure 5Move rightward in the direction indicated by the arrow, and the centers of the three adjustment posts will share a circumference, and the first center of the circumference will always coincide with the center of the first substrate 1, and the radius of the circumference will gradually increase; when the radius of the circumference increases, the object to be carried can be placed, and when the radius of the circumference decreases, the object to be carried can be clamped, so that during the translation process, the object to be carried can be driven to move to a position where the center coincides axially with the center of the first substrate 1, thereby achieving center alignment, which is not only convenient for placing the object to be carried, but also makes the alignment process simple, stable and fast.

[0084] In this embodiment, the clamping slot 4 may be a straight slot or an arcuate slot, and the sliding slot may also be a straight slot or an arcuate slot.

[0085] The above embodiments are only preferred solutions of the present invention, and are not limited thereto. On this basis, targeted adjustments can be made according to actual needs to obtain different implementation methods. For example, the sliding grooves 8 and 16 extend along the radial direction away from the center of the circle at the top of the first substrate 1, or the card slots 4 and 15 are arc-shaped card slots, or the adjustment columns 3 and 4 are split assembly structures, respectively formed by connecting two parts or three parts, etc. Since there are many possible implementation methods, they will not be described one by one here.

[0086] In addition to the above-mentioned wafer carrying device, the present invention also provides a wafer carrying method, which uses the above-mentioned wafer carrying device to align and adjust the wafer, including:

[0087] When used to carry a wafer with a smaller diameter, the driving mechanism 5 drives the second substrate 2 to rotate counterclockwise relative to the first substrate 1, so that the distances between the adjustment column 3 and the adjustment column 14 relative to the center of the first substrate 1 and the second substrate 2 are increased at the same time;

[0088] Place the wafer on the carrying surface of the carrying column 11 by a robot;

[0089] The second substrate 2 is driven to rotate clockwise relative to the first substrate 1, so that the distances between the adjustment column 3 and the adjustment column 14 relative to the centers of the first substrate 1 and the second substrate 2 are simultaneously reduced; and then the center of the wafer placed on the supporting column 11 is driven by the first adjustment column 3 to axially coincide with the centers of the first substrate 1 and the second substrate 2.

[0090] When used to carry a wafer with a larger diameter, the second substrate 2 is driven by the driving mechanism 5 to rotate counterclockwise relative to the first substrate 1, so that the distances between the first adjustment column 3 and the second adjustment column 14 relative to the centers of the first substrate 1 and the second substrate 2 are simultaneously increased;

[0091] Place the wafer on the carrying surface of the carrying column 18 by a robot;

[0092] The second substrate 2 is driven to rotate in a clockwise direction relative to the first substrate 1, and the spring 13 also generates a certain resilience force on the second substrate 2, so that the distances between the first adjustment column 3 and the adjustment column 14 relative to the centers of the first substrate 1 and the second substrate 2 are simultaneously reduced; and then the center of the wafer placed on the supporting column 18 is driven by the adjustment column 14 to coincide axially with the centers of the first substrate 1 and the second substrate 2.

[0093] The present invention also provides a detection device, comprising:

[0094] The carrying device as described above is used to adjust the center position of the wafer to be inspected;

[0095] A detection system, used for detecting the wafer adjusted by the carrier;

[0096] The robot is used to place the wafer on the carrying surface of the first carrying column 11 or the second carrying column 18 of the carrying device before detection, and remove the wafer from the carrying surface of the first carrying column 11 or the second carrying column 18 after detection. For other structures of the detection equipment, please refer to the prior art and will not be repeated in this article.

[0097] The above is a detailed introduction to the load-bearing device, load-bearing method and detection equipment provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A carrying device, characterized in that: It includes a first substrate and a second substrate, which are arranged in a stacked form, and the second substrate and the first substrate are configured to move relative to each other; the first substrate is provided with at least three non-collinear adjustment columns, the first substrate has a first limiting mechanism, the first limiting mechanism is used to move the adjustment column along a first track, and the second substrate has a second limiting mechanism, the second limiting mechanism is used to move the adjustment column along a second track; the projections of the first track and the second track intersect at a point, when the first substrate and the second substrate move relative to each other to multiple continuous positions, the centers of at least three adjustment columns share a circumference, the circumference has a first center, the first centers of the circumferences at the multiple continuous positions are the same and the radii are different, and the adjustment columns are located in the area above the second substrate to form an action site for driving the movement of the object to be carried.

2. The carrying device according to claim 1, characterized in that: The second substrate and the first substrate are configured to translate along a translation line parallel to the plane where the circumference is located.

3. The carrying device according to claim 2, characterized in that: The at least three adjusting columns include a first adjusting column, a second adjusting column and a third adjusting column; the first trajectories of the first adjusting column and the second adjusting column are symmetrical about the translation line; the first trajectory of the third adjusting column is the same as the first trajectory of the first adjusting column, or the first trajectory of the third adjusting column is the same as the first trajectory of the second adjusting column; the second trajectories of the first adjusting column and the second adjusting column are symmetrical about the translation line; the second trajectory of the third adjusting column is the same as the second trajectory of the first adjusting column, or the second trajectory of the third adjusting column is the same as the second trajectory of the second adjusting column, and the relative movement direction of the second substrate and the first substrate is equal to the angle formed by the first trajectory and the second trajectory.

4. The carrying device according to claim 1, characterized in that: The first limiting mechanism is a first slot or a first sliding mechanism; the second limiting mechanism is a second slot or a second sliding mechanism; one end of the adjusting column is limited by the first slot or the first sliding mechanism, and the part of the adjusting column located between the two ends is limited by the second slot or the second sliding mechanism.

5. The carrying device according to claim 1, characterized in that: The adjusting column is in a "T" shape, the diameter of the upper end is larger than the diameter of the lower end, and the outer peripheral surface of the upper end forms a portion in contact with the object to be carried.

6. The carrying device according to claim 5, characterized in that: The first sliding mechanism includes a sliding groove and a slider arranged on the top of the first substrate; the lower end of the adjusting column is connected to the slider, the slider is arranged in the sliding groove, and the slider can slide in the sliding groove so that the adjusting column can slide along the sliding groove.

7. The carrying device according to claim 1, characterized in that: It also includes a driving mechanism and a transmission mechanism; the driving mechanism is arranged on the first substrate and connected to the second substrate through the transmission mechanism to drive the second substrate to move relative to the first substrate.

8. The carrying device according to any one of claims 1 to 3, characterized in that: The first substrate is provided with a plurality of positioning posts, and the second substrate is provided with positioning grooves corresponding to the positioning posts. The positioning posts and the positioning grooves cooperate with each other to limit the position change of the second substrate relative to the first substrate.

9. The carrying device according to claim 8, characterized in that: The positioning column is in the shape of a circular wheel, and an annular groove is provided on the outer circumference of the positioning column. The positioning groove is a notch groove with an opening toward the outside, and the notch groove is arc-shaped or straight-line-shaped. An arc-shaped protrusion matching the annular groove of the positioning column is provided on the side wall of the notch groove.

10. The carrying device according to any one of claims 1 to 3, characterized in that: It also includes a supporting column arranged on the first substrate, a plurality of the supporting columns are distributed around the center of the first substrate, the top of each supporting column has a supporting surface for placing the object to be carried; the supporting surface is higher than the upper surface of the second substrate, the second substrate is provided with a notch or groove corresponding to each of the supporting columns, and there is a gap margin between the supporting column and the notch or groove in the forward and reverse rotation directions of the second substrate.

11. The carrying device according to claim 10, characterized in that: The number of the supporting columns is greater than or equal to three.

12. The carrying device according to claim 1, characterized in that: A hollow circle is provided at the center of the first substrate and the second substrate, and an adsorption device for adsorbing the object to be carried is provided at the position of the hollow circle.

13. The carrying device according to claim 1, characterized in that: It also includes an elastic component, with two ends of the elastic component connected to the first substrate and the second substrate respectively.

14. The carrying device according to any one of claims 1 to 7, 9, 11 to 13, characterized in that: The adjusting columns include a first group of adjusting columns and / or a second group of adjusting columns, and the distance between the second group of adjusting columns and the corresponding limiting mechanisms and the first center of the circle is greater than the distance between the first group of adjusting columns and the corresponding limiting mechanisms and the first center of the circle, so as to be used to place objects of different sizes to be carried.

15. The carrying device according to claim 14, characterized in that: A height between the top of the first group of adjusting columns and the upper surface of the second substrate is smaller than a height between the top of the second group of adjusting columns and the upper surface of the second substrate.

16. A bearing method, characterized in that: The carrying device according to any one of claims 1 to 15 comprises: driving the second substrate to move relative to the first substrate along a first direction so that the radius of the circle formed by the at least three adjustment columns becomes larger; Placing the object to be carried in the carrying area above the first substrate of the carrying device; The second substrate is driven to move relative to the first substrate along a second direction, the second direction being opposite to the movement direction of the first direction, so that the radius of the circle becomes smaller; thereby driving the center of the object to be carried placed in the carrying area to axially coincide with the center of the circle of the first substrate of the carrying device.

17. Testing equipment, including: A carrying device as claimed in any one of claims 1 to 15, wherein the carrying device is used to adjust the center position of the object to be carried to be detected; A detection system, used for detecting the object to be carried after being adjusted by the carrying device; The robot is used to place the object to be carried in the carrying area of ​​the carrying device before detection, and to take the object to be carried from the carrying area of ​​the carrying device after detection.

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