An 8-in-1 full-color SMD LED

Abstract

The present invention discloses an 8-in-1 full-color SMD LED. It includes a bracket, the bracket includes a substrate, the substrate is symmetrically provided with a display module on both sides, the display module includes a first pixel unit, a second pixel unit, a third pixel unit, a fourth pixel unit, a first common positive electrode connecting bar, a second common positive electrode connecting bar, a third common positive electrode connecting bar, a fourth common positive electrode connecting bar, a red negative electrode connecting bar, two green negative electrode connecting bars and two blue negative electrode connecting bars, and each pixel unit includes a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip. The present invention integrates eight pixel points, and one mounting action is equivalent to eight times of a traditional device, and the efficiency is significantly improved. After the device is integrated, the lamp beads are relatively large, easy to identify, and the risk of collision is low. Moreover, the large device can be manually maintained to improve the yield rate. In addition, it has many pins, and the total area of ​​bonding with the PCB pad is large. After mounting and tinning, the thrust is increased, and the firmness performance is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to an 8-in-1 full-color SMD LED. Background Art

[0002] LED display screens are composed of many single-pixel LED lamp beads corresponding to a certain dot pitch. In the current display screen manufacturing process, each lamp bead needs to go through the SMT process to be attached to the display screen PCB board. Each LED lamp bead needs to go through a mounting process, which is relatively inefficient and has a high mounting cost. When the display screen develops to the era of small pitch below P1.875, SMT is very difficult. Take chip0808 lamp beads and P1.25 display screens as an example. After mounting on the PCB, the gap between the lamp beads is only 0.45mm. During the SMT process, the risk of collision is extremely high. Once the patch is offset, the lamp bead fails, the cost of maintenance is very high, and it cannot be repaired manually. Therefore, the yield rate of producing small pitch displays below P1.875 is not high.

[0003] The existing full-color SMD LED lamp beads are packaged in a single independent pixel structure, and the SMT efficiency is not high. The yield rate of small-pitch displays below P1.875 is low, and the maintenance cost is high. In addition, the existing SMD LED lamp beads have only 4 pins, and the total area of ​​the pins and PCB pads is small. After mounting, the thrust on the PCB board is not high, and the material is easily knocked off during production and transportation, which has a great impact on the quality of the screen and poses a quality risk. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides an 8-in-1 full-color SMD LED, which integrates eight pixels. One mounting action is equivalent to eight times of a traditional device, and the efficiency is significantly improved. After the device is integrated, the lamp beads are relatively large and easy to identify, and the risk of lamp collision is low. Moreover, large devices can be manually maintained to improve the yield. In addition, it has many pins and a large total area for bonding with the PCB pad. After mounting and tinning, the thrust is increased, the firmness is greatly improved, and the product quality is improved.

[0005] In order to solve the above problems, the present invention adopts the following technical solutions:

[0006] The present invention discloses an 8-in-1 full-color SMD LED, comprising a bracket, the bracket comprising a substrate, the upper and lower sides of the substrate are symmetrically provided with display modules, the display module comprises a first pixel unit, a second pixel unit, a third pixel unit, a fourth pixel unit, a first common positive electrode connecting bar, a second common positive electrode connecting bar, a third common positive electrode connecting bar, a fourth common positive electrode connecting bar, a red negative electrode connecting bar, two green negative electrode connecting bars and two blue negative electrode connecting bars, each pixel unit comprises a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip, the first pixel unit, the second pixel unit, the third pixel unit and the fourth pixel unit are arranged in a straight line from left to right, the first common positive electrode connecting bar is located on the left side of the first pixel unit and is electrically connected to the positive electrodes of all chips in the first pixel unit, the second common positive electrode connecting bar is located on the right side of the second pixel unit and is electrically connected to the positive electrodes of all chips in the second pixel unit The third common positive electrode connecting bar is located on the left side of the third pixel unit and is electrically connected to the positive electrodes of all chips in the third pixel unit. The fourth common positive electrode connecting bar is located on the right side of the fourth pixel unit and is electrically connected to the positive electrodes of all chips in the fourth pixel unit. The four pixel units are arranged on the red negative electrode connecting bar and the negative electrodes of the red light-emitting chips of the four pixel units are electrically connected to the red negative electrode connecting bar. The two green negative electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each green negative electrode connecting bar is electrically connected to the negative electrodes of the green light-emitting chips of the pixel units adjacent to the left and right sides. The two blue negative electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each blue negative electrode connecting bar is electrically connected to the negative electrodes of the blue light-emitting chips of the pixel units adjacent to the left and right sides.

[0007] This solution is a common anode design, and the red light-emitting chip uses a reverse polarity red light-emitting chip. The bracket is a BT board with a non-cup chip structure. The BT board is black, gray or white. The red light-emitting chip, blue light-emitting chip, and green light-emitting chip in the pixel unit constitute the RGB three-primary color chip. The packaging method is molding, and the packaging glue material includes solid or liquid epoxy resin, silicone resin, epoxy modified materials and other traditional materials.

[0008] The 8-in-1 full-color SMD LED package has 8 pixel units, arranged in 2 rows and 4 columns. The light-emitting chip in each pixel unit is welded to the pad with gold wire, alloy wire or copper wire to make the electrical circuit conductive. There are 4 common positive pads on the bracket, and each common positive pad forms a conductive circuit relationship with one pixel unit above and below.

[0009] One mounting operation of 8-in-1 full-color SMD LED is equivalent to 8 times of traditional devices, which significantly improves efficiency. On the other hand, it can improve the yield of the display screen. After the integration of 8-in-1 full-color SMD LED, the lamp beads are relatively large, easy to identify, and the risk of collision is low. In addition, large devices can be manually maintained, which improves the yield.

[0010] Preferably, the first common positive connecting bar of the two display modules is connected to the first common positive pad on the substrate, the second common positive connecting bar of the two display modules is connected to the second common positive pad on the substrate, the third common positive connecting bar of the two display modules is connected to the third common positive pad on the substrate, the fourth common positive connecting bar of the two display modules is connected to the fourth common positive pad on the substrate, the red negative connecting bar is provided with a red negative pad, the green negative connecting bar is provided with a green negative pad, the blue negative connecting bar is provided with a blue negative pad, the two green negative pads of the display module are connected via a wire on the back side of the substrate, and the two blue negative pads of the display module are connected via a wire on the back side of the substrate.

[0011] Preferably, a first common positive pin connected to the first common positive pad, a second common positive pin connected to the second common positive pad, a third common positive pin connected to the third common positive pad, and a fourth common positive pin connected to the fourth common positive pad are provided on the back side of the substrate. A red negative pin, a green negative pin, and a blue negative pin corresponding to each display module are also provided on the back side of the substrate. The red negative pin is connected to the red negative pad of the corresponding display module. The two green negative pads of the display module are connected to the corresponding green negative pins after being connected through wires on the back side of the substrate. The two blue negative pads of the display module are connected to the corresponding blue negative pins after being connected through wires on the back side of the substrate.

[0012] The 8-in-1 full-color SMD LED has 10 pins. The total area of ​​the pins and the PCB pad is large. After mounting and tinning, the thrust is increased, the firmness is greatly improved, and the product quality is improved.

[0013] Preferably, the spacings between adjacent pixel units of the display module are equal.

[0014] Preferably, the blue light emitting chip, the green light emitting chip and the red light emitting chip in the pixel unit are arranged in a straight line from top to bottom along the vertical direction.

[0015] The present invention discloses an 8-in-1 full-color SMD LED, comprising a bracket, the bracket comprising a substrate, the upper and lower sides of the substrate are symmetrically provided with display modules, the display module comprises a first pixel unit, a second pixel unit, a third pixel unit, a fourth pixel unit, a first common cathode connection bar, a second common cathode connection bar, a third common cathode connection bar, a fourth common cathode connection bar, a red positive connection bar, two green positive connection bars and two blue positive connection bars, each pixel unit comprises a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip, the first pixel unit, the second pixel unit, the third pixel unit and the fourth pixel unit are arranged in a straight line from left to right, the first common cathode connection bar is located on the left side of the first pixel unit and is electrically connected to the cathode of all chips in the first pixel unit, the second common cathode connection bar is located on the right side of the second pixel unit and is electrically connected to the cathode of all chips in the second pixel unit The third common negative electrode connecting bar is located on the left side of the third pixel unit and is electrically connected to the negative electrodes of all chips in the third pixel unit. The fourth common negative electrode connecting bar is located on the right side of the fourth pixel unit and is electrically connected to the negative electrodes of all chips in the fourth pixel unit. The four pixel units are arranged on the red positive electrode connecting bar and the positive electrodes of the red light-emitting chips of the four pixel units are electrically connected to the red positive electrode connecting bar. The two green positive electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each green positive electrode connecting bar is electrically connected to the positive electrodes of the green light-emitting chips of the pixel units adjacent to the left and right sides. The two blue positive electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each blue positive electrode connecting bar is electrically connected to the positive electrodes of the blue light-emitting chips of the pixel units adjacent to the left and right sides.

[0016] This solution is a common cathode design, and the red light-emitting chip uses a positive polarity red light-emitting chip. The bracket is a BT board with a non-cup chip structure. The BT board is black, gray or white. The red light-emitting chip, blue light-emitting chip, and green light-emitting chip in the pixel unit constitute the RGB three-primary color chip. The packaging method is molding, and the packaging glue material includes solid or liquid epoxy resin, silicone resin, epoxy modified materials and other traditional materials.

[0017] The 8-in-1 full-color SMD LED package has 8 pixel units, arranged in 2 rows and 4 columns. The light-emitting chip in each pixel unit is welded to the pad with gold wire, alloy wire or copper wire to make the electrical circuit conductive. There are 4 common positive pads on the bracket, and each common positive pad forms a conductive circuit relationship with one pixel unit above and below.

[0018] One mounting operation of 8-in-1 full-color SMD LED is equivalent to 8 times of traditional devices, which significantly improves efficiency. On the other hand, it can improve the yield of the display screen. After the integration of 8-in-1 full-color SMD LED, the lamp beads are relatively large, easy to identify, and the risk of collision is low. In addition, large devices can be manually maintained, which improves the yield.

[0019] Preferably, the first common negative electrode connecting bar of the two display modules is connected to the first common negative electrode pad on the substrate, the second common negative electrode connecting bar of the two display modules is connected to the second common negative electrode pad on the substrate, the third common negative electrode connecting bar of the two display modules is connected to the third common negative electrode pad on the substrate, and the fourth common negative electrode connecting bar of the two display modules is connected to the fourth common negative electrode pad on the substrate. The red positive electrode connecting bar is provided with a red positive electrode pad, the green positive electrode connecting bar is provided with a green positive electrode pad, and the blue positive electrode connecting bar is provided with a blue positive electrode pad. The two green positive electrode pads of the display module are connected via wires on the back side of the substrate, and the two blue positive electrode pads of the display module are connected via wires on the back side of the substrate.

[0020] Preferably, the back side of the substrate is provided with a first common negative electrode pin connected to the first common negative electrode pad, a second common negative electrode pin connected to the second common negative electrode pad, a third common negative electrode pin connected to the third common negative electrode pad, and a fourth common negative electrode pin connected to the fourth common negative electrode pad. The back side of the substrate is also provided with a red positive electrode pin, a green positive electrode pin, and a blue positive electrode pin corresponding to each display module. The red positive electrode pin is connected to the red positive electrode pad of the corresponding display module, and the two green positive electrode pads of the display module are connected to the corresponding green positive pins after being connected by wires on the back side of the substrate. The two blue positive electrode pads of the display module are connected to the corresponding blue positive pins after being connected by wires on the back side of the substrate.

[0021] The 8-in-1 full-color SMD LED has 10 pins. The total area of ​​the pins and the PCB pad is large. After mounting and tinning, the thrust is increased, the firmness is greatly improved, and the product quality is improved.

[0022] Preferably, the spacings between adjacent pixel units of the display module are equal.

[0023] Preferably, the blue light emitting chip, the green light emitting chip and the red light emitting chip in the pixel unit are arranged in a straight line from top to bottom along the vertical direction.

[0024] The beneficial effects of the present invention are as follows: (1) One device integrates eight pixels, and one mounting operation is equivalent to eight times of a traditional device, which significantly improves efficiency. (2) After the device is integrated, the lamp beads are relatively large and easy to identify, and the risk of lamp collision is low. In addition, large devices can be manually maintained, which improves the yield rate. (3) The device has 10 pins, and the total area of ​​the device that fits with the PCB pad is large. After mounting and tinning, the thrust is increased, the firmness is greatly improved, and the product quality is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of Example 1;

[0026] Figure 2 yes Figure 1 Rear view of

[0027] Figure 3 is a circuit schematic diagram of Embodiment 1;

[0028] Figure 4 is a schematic structural diagram of Example 2;

[0029] Figure 5 yes Figure 4 Rear view of

[0030] Figure 6 is the circuit schematic diagram of Example 2.

[0031] In the figure: 1, substrate, 2, first pixel unit, 3, second pixel unit, 4, third pixel unit, 5, fourth pixel unit, 6, red light emitting chip, 7, blue light emitting chip, 8, green light emitting chip, 9, first common positive electrode connecting bar, 10, second common positive electrode connecting bar, 11, third common positive electrode connecting bar, 12, fourth common positive electrode connecting bar, 13, red negative electrode connecting bar, 14, green negative electrode connecting bar, 15, blue negative electrode connecting bar, 16, first common positive electrode pad, 17, second common positive electrode pad, 18, third common positive electrode pad, 19, fourth common positive electrode pad, 20, red negative electrode pad, 21, green negative electrode pad, 22, blue negative electrode pad, 23, first common positive electrode pin, 24, second common positive electrode pin, 25, third common positive electrode pin, 26, fourth common positive electrode pad Positive pin, 27, red negative pin, 28, green negative pin, 29, blue negative pin, 30, first common negative connecting bar, 31, second common negative connecting bar, 32, third common negative connecting bar, 33, fourth common negative connecting bar, 34, red positive connecting bar, 35, green positive connecting bar, 36, blue positive connecting bar, 37, first common negative pad, 38, second common negative pad, 39, third common negative pad, 40, fourth common negative pad, 41, red positive pad, 42, green positive pad, 43, blue positive pad, 44, first common negative pin, 45, second common negative pin, 46, third common negative pin, 47, fourth common negative pin, 48, red positive pin, 49, green positive pin, 50, blue positive pin. DETAILED DESCRIPTION

[0032] The technical solution of the present invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0033] Embodiment 1: This embodiment is an 8-in-1 full-color SMD LED, such as Figure 1 , Figure 2As shown, it includes a bracket, the bracket includes a substrate 1, and the display module is symmetrically arranged on the upper and lower sides of the substrate 1, the display module includes a first pixel unit 2, a second pixel unit 3, a third pixel unit 4, a fourth pixel unit 5, a first common positive electrode connecting bar 9, a second common positive electrode connecting bar 10, a third common positive electrode connecting bar 11, a fourth common positive electrode connecting bar 12, a red negative electrode connecting bar 13, two green negative electrode connecting bars 14 and two blue negative electrode connecting bars 15, each pixel unit includes a red light-emitting chip 6, a blue light-emitting chip 7 and a green light-emitting chip 8, the first pixel unit 2, the second pixel unit 3, the third pixel unit 4, and the fourth pixel unit 5 are arranged in a straight line from left to right, the first common positive electrode connecting bar 9 is located on the left side of the first pixel unit 2 and is electrically connected to the positive electrodes of all chips in the first pixel unit 2, the second common positive electrode connecting bar 10 is located on the right side of the second pixel unit 3 and is electrically connected to the positive electrodes of all chips in the second pixel unit 3, and the third common positive electrode connecting bar 11 is located on the right side of the second pixel unit 3 and is electrically connected to the positive electrodes of all chips in the second pixel unit 3. The common positive electrode connecting bar 11 is located on the left side of the third pixel unit 4 and is electrically connected to the positive electrodes of all chips in the third pixel unit 4. The fourth common positive electrode connecting bar 12 is located on the right side of the fourth pixel unit 5 and is electrically connected to the positive electrodes of all chips in the fourth pixel unit 5. The four pixel units are arranged on the red negative electrode connecting bar 13 and the negative electrodes of the red light-emitting chips 6 of the four pixel units are electrically connected to the red negative electrode connecting bar 13. The two green negative electrode connecting bars 14 are respectively located between the first pixel unit 2 and the second pixel unit 3 and between the third pixel unit 4 and the fourth pixel unit 5. Each green negative electrode connecting bar 14 is electrically connected to the negative electrodes of the green light-emitting chips 8 of the pixel units adjacent to the left and right sides. The two blue negative electrode connecting bars 15 are respectively located between the first pixel unit 2 and the second pixel unit 3 and between the third pixel unit 4 and the fourth pixel unit 5. Each blue negative electrode connecting bar 15 is electrically connected to the negative electrodes of the blue light-emitting chips 7 of the pixel units adjacent to the left and right sides.

[0034] The first common positive connecting bar 9 of the two display modules is connected to the first common positive pad 16 on the substrate 1, the second common positive connecting bar 10 of the two display modules is connected to the second common positive pad 17 on the substrate 1, the third common positive connecting bar 11 of the two display modules is connected to the third common positive pad 18 on the substrate 1, the fourth common positive connecting bar 12 of the two display modules is connected to the fourth common positive pad 19 on the substrate 1, the red negative connecting bar 13 is provided with a red negative pad 20, the green negative connecting bar 14 is provided with a green negative pad 21, the blue negative connecting bar 15 is provided with a blue negative pad 22, the two green negative pads 21 of the display module are connected through the wires on the back side of the substrate 1, and the two blue negative pads 22 of the display module are connected through the wires on the back side of the substrate 1.

[0035] The back side of the substrate 1 is provided with a first common positive pin 23 connected to the first common positive pad 16, a second common positive pin 24 connected to the second common positive pad 17, a third common positive pin 25 connected to the third common positive pad 18, and a fourth common positive pin 26 connected to the fourth common positive pad 19. The back side of the substrate 1 is also provided with a red negative pin 27, a green negative pin 28, and a blue negative pin 29 corresponding to each display module. The red negative pin 27 is connected to the red negative pad 20 of the corresponding display module, and the two green negative pads 21 of the display module are connected to the corresponding green negative pin 28 after being connected by wires on the back side of the substrate 1. The two blue negative pads 22 of the display module are connected to the corresponding blue negative pin 29 after being connected by wires on the back side of the substrate 1.

[0036] The spacing between adjacent pixel units of the display module is equal. The blue light emitting chip 7, the green light emitting chip 8, and the red light emitting chip 6 in the pixel unit are arranged in a straight line from top to bottom along the vertical direction.

[0037] This solution is a common anode design, and the red light-emitting chip uses a reverse polarity red light-emitting chip. The bracket is a BT board with a non-cup chip structure. The BT board is black, gray or white. The red light-emitting chip, blue light-emitting chip, and green light-emitting chip in the pixel unit constitute the RGB three-primary color chip. The packaging method is molding, and the packaging glue material includes solid or liquid epoxy resin, silicone resin, epoxy modified materials and other traditional materials.

[0038] The 8-in-1 full-color SMD LED package has 8 pixel units, arranged in 2 rows * 4 columns. The light-emitting chip in each pixel unit is soldered to the pad with gold wire, alloy wire or copper wire to make the electrical circuit conductive. There are 4 common positive pads on the bracket, and each common positive pad forms a conductive circuit relationship with one pixel unit above and below. The circuit schematic diagram of the 8-in-1 full-color SMD LED is shown in the figure below. Figure 3 As shown, the four pixel units in the display module on the upper side of the substrate are numbered 1, 2, 3, and 4 from left to right, and the four pixel units in the display module on the lower side of the substrate are numbered 5, 6, 7, and 8 from left to right.

[0039] One mounting operation of 8-in-1 full-color SMD LED is equivalent to 8 times of traditional devices, which significantly improves efficiency. On the other hand, it can improve the yield of the display screen. After the integration of 8-in-1 full-color SMD LED, the lamp beads are relatively large, easy to identify, and the risk of collision is low. In addition, large devices can be manually maintained, which improves the yield.

[0040] The 8-in-1 full-color SMD LED has 10 pins. The total area of ​​the pins and the PCB pad is large. After mounting and tinning, the thrust is increased, the firmness is greatly improved, and the product quality is improved.

[0041] Embodiment 2: An 8-in-1 full-color SMD LED of this embodiment, such as Figure 4 , Figure 5 As shown, it includes a bracket, the bracket includes a substrate 1, and the display module is symmetrically arranged on the upper and lower sides of the substrate 1. The display module includes a first pixel unit 2, a second pixel unit 3, a third pixel unit 4, a fourth pixel unit 5, a first common negative electrode connecting bar 30, a second common negative electrode connecting bar 31, a third common negative electrode connecting bar 32, a fourth common negative electrode connecting bar 33, a red positive electrode connecting bar 34, two green positive electrode connecting bars 35 and two blue positive electrode connecting bars 36. Each pixel unit includes a red light-emitting chip 6, a blue light-emitting chip 7 and a green light-emitting chip 8. The first pixel unit 2, the second pixel unit 3, the third pixel unit 4, and the fourth pixel unit 5 are arranged in a straight line from left to right. The first common negative electrode connecting bar 30 is located on the left side of the first pixel unit 2 and is electrically connected to the negative electrodes of all chips in the first pixel unit 2. The second common negative electrode connecting bar 31 is located on the right side of the second pixel unit 3 and is electrically connected to the negative electrodes of all chips in the second pixel unit 3. The three common negative electrode connecting bars 32 are located on the left side of the third pixel unit 4 and are electrically connected to the negative electrodes of all chips in the third pixel unit 4. The fourth common negative electrode connecting bar 33 is located on the right side of the fourth pixel unit 5 and is electrically connected to the negative electrodes of all chips in the fourth pixel unit 5. The four pixel units are arranged on the red positive electrode connecting bar 34 and the positive electrodes of the red light-emitting chips 6 of the four pixel units are electrically connected to the red positive electrode connecting bar 34. The two green positive electrode connecting bars 35 are respectively located between the first pixel unit 2 and the second pixel unit 3 and between the third pixel unit 4 and the fourth pixel unit 5. Each green positive electrode connecting bar 35 is electrically connected to the positive electrodes of the green light-emitting chips 8 of the pixel units adjacent to the left and right sides. The two blue positive electrode connecting bars 36 are respectively located between the first pixel unit 2 and the second pixel unit 3 and between the third pixel unit 4 and the fourth pixel unit 5. Each blue positive electrode connecting bar 36 is electrically connected to the positive electrodes of the blue light-emitting chips 7 of the pixel units adjacent to the left and right sides.

[0042] The first common negative electrode connecting bar 30 of the two display modules is connected to the first common negative electrode pad 37 on the substrate 1, the second common negative electrode connecting bar 31 of the two display modules is connected to the second common negative electrode pad 38 on the substrate, the third common negative electrode connecting bar 32 of the two display modules is connected to the third common negative electrode pad 39 on the substrate 1, the fourth common negative electrode connecting bar 33 of the two display modules is connected to the fourth common negative electrode pad 40 on the substrate 1, the red positive electrode connecting bar 34 is provided with a red positive electrode pad 41, the green positive electrode connecting bar 35 is provided with a green positive electrode pad 42, the blue positive electrode connecting bar 36 is provided with a blue positive electrode pad 43, the two green positive electrode pads 42 of the display module are connected through the wires on the back side of the substrate 1, and the two blue positive electrode pads 43 of the display module are connected through the wires on the back side of the substrate 1.

[0043] The back side of the substrate 1 is provided with a first common negative electrode pin 44 connected to the first common negative electrode pad 37, a second common negative electrode pin 45 connected to the second common negative electrode pad 38, a third common negative electrode pin 46 connected to the third common negative electrode pad 39, and a fourth common negative electrode pin 47 connected to the fourth common negative electrode pad 40. The back side of the substrate 1 is also provided with a red positive electrode pin 48, a green positive electrode pin 49, and a blue positive electrode pin 50 corresponding to each display module. The red positive electrode pin 48 is connected to the red positive electrode pad 41 of the corresponding display module, and the two green positive electrode pads 42 of the display module are connected to the corresponding green positive electrode pin 49 after being connected by wires on the back side of the substrate 1. The two blue positive electrode pads 43 of the display module are connected to the corresponding blue positive electrode pin 50 after being connected by wires on the back side of the substrate 1.

[0044] Preferably, the spacings between adjacent pixel units of the display module are equal.

[0045] Preferably, the blue light emitting chip, the green light emitting chip and the red light emitting chip in the pixel unit are arranged in a straight line from top to bottom along the vertical direction.

[0046] This solution is a common cathode design, and the red light-emitting chip uses a positive polarity red light-emitting chip. The bracket is a BT board with a non-cup chip structure. The BT board is black, gray or white. The red light-emitting chip, blue light-emitting chip, and green light-emitting chip in the pixel unit constitute the RGB three-primary color chip. The packaging method is molding, and the packaging glue material includes solid or liquid epoxy resin, silicone resin, epoxy modified materials and other traditional materials.

[0047] The 8-in-1 full-color SMD LED package has 8 pixel units, arranged in 2 rows and 4 columns. The light-emitting chip in each pixel unit is welded to the pad with gold wire, alloy wire or copper wire to make the electrical circuit conductive. There are 4 common positive pads on the bracket, and each common positive pad forms a conductive circuit relationship with one pixel unit above and below.

[0048] The circuit diagram of 8-in-1 full-color SMD LED is as follows: Figure 6 As shown, the four pixel units in the display module on the upper side of the substrate are numbered 1, 2, 3, and 4 from left to right, and the four pixel units in the display module on the lower side of the substrate are numbered 5, 6, 7, and 8 from left to right.

[0049] One mounting operation of 8-in-1 full-color SMD LED is equivalent to 8 times of traditional devices, which significantly improves efficiency. On the other hand, it can improve the yield of the display screen. After the integration of 8-in-1 full-color SMD LED, the lamp beads are relatively large, easy to identify, and the risk of collision is low. In addition, large devices can be manually maintained, which improves the yield.

[0050] The 8-in-1 full-color SMD LED has 10 pins. The total area of ​​the pins and the PCB pad is large. After mounting and tinning, the thrust is increased, the firmness is greatly improved, and the product quality is improved.

Claims

1. An 8-in-1 full-color SMD LED, characterized in that: The invention comprises a bracket, wherein the bracket comprises a substrate, and display modules are symmetrically arranged on the upper and lower sides of the substrate, wherein the display module comprises a first pixel unit, a second pixel unit, a third pixel unit, a fourth pixel unit, a first common positive electrode connecting bar, a second common positive electrode connecting bar, a third common positive electrode connecting bar, a fourth common positive electrode connecting bar, a red negative electrode connecting bar, two green negative electrode connecting bars and two blue negative electrode connecting bars, each pixel unit comprises a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip, the first pixel unit, the second pixel unit, the third pixel unit and the fourth pixel unit are arranged in a straight line from left to right, the first common positive electrode connecting bar is located on the left side of the first pixel unit and is electrically connected to the positive electrodes of all chips in the first pixel unit, the second common positive electrode connecting bar is located on the right side of the second pixel unit and is electrically connected to the positive electrodes of all chips in the second pixel unit, and the The third common positive electrode connecting bar is located on the left side of the third pixel unit and is electrically connected to the positive electrodes of all chips in the third pixel unit. The fourth common positive electrode connecting bar is located on the right side of the fourth pixel unit and is electrically connected to the positive electrodes of all chips in the fourth pixel unit. The four pixel units are arranged on the red negative electrode connecting bar and the negative electrodes of the red light-emitting chips of the four pixel units are electrically connected to the red negative electrode connecting bar. The two green negative electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each green negative electrode connecting bar is electrically connected to the negative electrodes of the green light-emitting chips of the pixel units adjacent to the left and right sides. The two blue negative electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each blue negative electrode connecting bar is electrically connected to the negative electrodes of the blue light-emitting chips of the pixel units adjacent to the left and right sides.

2. The 8-in-1 full-color SMD LED according to claim 1, characterized in that: The first common positive connecting strips of the two display modules are connected to the first common positive pad on the substrate, the second common positive connecting strips of the two display modules are connected to the second common positive pad on the substrate, the third common positive connecting strips of the two display modules are connected to the third common positive pad on the substrate, the fourth common positive connecting strips of the two display modules are connected to the fourth common positive pad on the substrate, the red negative connecting strip is provided with a red negative pad, the green negative connecting strip is provided with a green negative pad, the blue negative connecting strip is provided with a blue negative pad, the two green negative pads of the display module are connected via a wire on the back side of the substrate, and the two blue negative pads of the display module are connected via a wire on the back side of the substrate.

3. The 8-in-1 full-color SMD LED according to claim 2, characterized in that: The back side of the substrate is provided with a first common positive pin connected to the first common positive pad, a second common positive pin connected to the second common positive pad, a third common positive pin connected to the third common positive pad, and a fourth common positive pin connected to the fourth common positive pad. The back side of the substrate is also provided with a red negative pin, a green negative pin, and a blue negative pin corresponding to each display module. The red negative pin is connected to the red negative pad of the corresponding display module, and the two green negative pads of the display module are connected to the corresponding green negative pins after being connected by wires on the back side of the substrate. The two blue negative pads of the display module are connected to the corresponding blue negative pins after being connected by wires on the back side of the substrate.

4. The 8-in-1 full-color SMD LED according to claim 1, characterized in that: The spacing between adjacent pixel units of the display module is equal.

5. The 8-in-1 full-color SMD LED according to claim 1, characterized in that: The blue light emitting chip, the green light emitting chip and the red light emitting chip in the pixel unit are arranged in a straight line from top to bottom along the vertical direction.

6. An 8-in-1 full-color SMD LED, characterized in that: The invention comprises a bracket, wherein the bracket comprises a substrate, and display modules are symmetrically arranged on the upper and lower sides of the substrate, wherein the display module comprises a first pixel unit, a second pixel unit, a third pixel unit, a fourth pixel unit, a first common negative electrode connecting bar, a second common negative electrode connecting bar, a third common negative electrode connecting bar, a fourth common negative electrode connecting bar, a red positive electrode connecting bar, two green positive electrode connecting bars and two blue positive electrode connecting bars, each pixel unit comprises a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip, the first pixel unit, the second pixel unit, the third pixel unit and the fourth pixel unit are arranged in a straight line from left to right, the first common negative electrode connecting bar is located on the left side of the first pixel unit and is electrically connected to the negative electrodes of all chips in the first pixel unit, the second common negative electrode connecting bar is located on the right side of the second pixel unit and is electrically connected to the negative electrodes of all chips in the second pixel unit, and the The third common negative electrode connecting bar is located on the left side of the third pixel unit and is electrically connected to the negative electrodes of all chips in the third pixel unit. The fourth common negative electrode connecting bar is located on the right side of the fourth pixel unit and is electrically connected to the negative electrodes of all chips in the fourth pixel unit. The four pixel units are arranged on the red positive electrode connecting bar and the positive electrodes of the red light-emitting chips of the four pixel units are electrically connected to the red positive electrode connecting bar. The two green positive electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each green positive electrode connecting bar is electrically connected to the positive electrodes of the green light-emitting chips of the pixel units adjacent to the left and right sides. The two blue positive electrode connecting bars are respectively located between the first pixel unit and the second pixel unit and between the third pixel unit and the fourth pixel unit. Each blue positive electrode connecting bar is electrically connected to the positive electrodes of the blue light-emitting chips of the pixel units adjacent to the left and right sides.

7. The 8-in-1 full-color SMD LED according to claim 6, characterized in that: The first common negative electrode connecting bar of the two display modules is connected to the first common negative electrode pad on the substrate, the second common negative electrode connecting bar of the two display modules is connected to the second common negative electrode pad on the substrate, the third common negative electrode connecting bar of the two display modules is connected to the third common negative electrode pad on the substrate, and the fourth common negative electrode connecting bar of the two display modules is connected to the fourth common negative electrode pad on the substrate. The red positive electrode connecting bar is provided with a red positive electrode pad, the green positive electrode connecting bar is provided with a green positive electrode pad, and the blue positive electrode connecting bar is provided with a blue positive electrode pad. The two green positive electrode pads of the display module are connected via a wire on the back side of the substrate, and the two blue positive electrode pads of the display module are connected via a wire on the back side of the substrate.

8. The 8-in-1 full-color SMD LED according to claim 7, characterized in that: The back side of the substrate is provided with a first common negative electrode pin connected to the first common negative electrode pad, a second common negative electrode pin connected to the second common negative electrode pad, a third common negative electrode pin connected to the third common negative electrode pad, and a fourth common negative electrode pin connected to the fourth common negative electrode pad. The back side of the substrate is also provided with a red positive electrode pin, a green positive electrode pin, and a blue positive electrode pin corresponding to each display module. The red positive electrode pin is connected to the red positive electrode pad of the corresponding display module, and the two green positive electrode pads of the display module are connected to the corresponding green positive pins after being connected by wires on the back side of the substrate. The two blue positive electrode pads of the display module are connected to the corresponding blue positive pins after being connected by wires on the back side of the substrate.

9. The 8-in-1 full-color SMD LED according to claim 6, characterized in that: The spacing between adjacent pixel units of the display module is equal.

10. The 8-in-1 full-color SMD LED according to claim 6, characterized in that: The blue light emitting chip, the green light emitting chip and the red light emitting chip in the pixel unit are arranged in a straight line from top to bottom along the vertical direction.

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