Display device

Abstract

A display device is provided. The display device includes: a display panel including: a first substrate; a second substrate; and a light emitting element layer disposed between the first substrate and the second substrate and outputting light toward the second substrate; a first sound generator disposed on the first substrate and outputting a first sound by vibrating the display panel; a source circuit board disposed on the first substrate; and a first sound circuit board connecting the first sound generator and the source circuit board.

Description

[0001] This application claims priority to and all benefits arising from Korean Patent Application No. 10-2019-0013991, filed on February 1, 2019, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] An exemplary embodiment of the invention relates to a display device. Background Art

[0003] With the development of the information society, the demand for display devices for displaying images is increasing in various forms. Display devices are applied to various electronic devices such as smart phones, digital cameras, notebook computers, navigation devices, and smart televisions ("TV"). The display device may be a flat panel display device such as a liquid crystal display device, a field emission display device, and an organic light emitting display device. Summary of the invention

[0004] The display device may include a display panel for displaying an image and a speaker for providing sound. Here, due to the space limitation of the display device, the speaker may be disposed on the lower surface or the side surface of the display panel. In this case, although the sound output from the speaker is expected to be output forward from the display device, the sound is output backward or to the side from the display device. Therefore, the sound quality may be reduced.

[0005] An exemplary embodiment of the invention provides a display device capable of outputting sound forward using a sound generator by vibrating a display panel to improve sound quality.

[0006] Exemplary embodiments of the invention also provide a display device in which a sound generator disposed on a lower surface of a heat dissipation film and a circuit board disposed on a lower surface of a lower cover can be easily connected.

[0007] However, the exemplary embodiments of the invention are not limited to the one exemplary embodiment set forth herein. The following and other exemplary embodiments of the invention will become more apparent to those of ordinary skill in the art to which the invention pertains by referring to the detailed description of the invention given below.

[0008] An exemplary embodiment of the invention provides a display device, comprising: a display panel including a first substrate, a second substrate, and a light emitting element layer, the light emitting element layer being disposed between the first substrate and the second substrate and outputting light toward the second substrate; a first sound generator being disposed on the first substrate and outputting a first sound by vibrating the display panel; a source circuit board being disposed on the first substrate; and a first sound circuit board connecting the first sound generator and the source circuit board.

[0009] Another exemplary embodiment of the invention provides a display device, which includes a display panel, including a first substrate, a packaging film, and a light-emitting element layer, the light-emitting element layer is arranged between the first substrate and the packaging film, and outputs light toward the packaging film; a first sound generator, which is arranged on the first substrate and outputs a first sound by vibrating the display panel; a source circuit board, which is arranged on the first substrate; and a first sound circuit board, which connects the first sound generator and the source circuit board.

[0010] Other features and embodiments may be apparent from the drawings, the claims, and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] These and / or other exemplary embodiments will become apparent and more readily understood from the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a perspective view of an exemplary embodiment of a display device;

[0013] Figure 2 is an exploded perspective view of an exemplary embodiment of a display device;

[0014] Figure 3 is a bottom view of an exemplary embodiment of a display device;

[0015] Figure 4 is from Figure 3 A bottom view of the display device excluding the lower cover and the control circuit board;

[0016] Figure 5 is a side view of an exemplary embodiment of a display device;

[0017] Figure 6 It is along Figure 4 A cross-sectional view taken along line VI-VI';

[0018] Figures 7 to 10 The arrangement of the blocking member and the sound generator is shown;

[0019] Fig.11 is a cross-sectional view of an exemplary embodiment of a display area of ​​a display panel;

[0020] Fig.12 is a perspective view of an exemplary embodiment of a first sound generator and a second sound generator;

[0021] Fig.13 It is along Fig.12 A sectional view taken along line XIII-XIII';

[0022] Fig.14An exemplary embodiment of a method of vibrating each of a first sound generator and a second sound generator is shown;

[0023] Fig.15 and Fig.16 An exemplary embodiment is shown in which a display panel is vibrated by vibration of each of a first sound generator and a second sound generator;

[0024] Fig.17 It is along Figure 3 A sectional view taken along line XVII-XVII';

[0025] Fig.18 and Fig.19 An exemplary embodiment showing a case where the display panel is vibrated by the vibration of the third sound generator;

[0026] Fig. 20 An exemplary embodiment showing sound pressure level with respect to each frequency of sound generated by a sound generator;

[0027] Fig.21 is a bottom view of an exemplary embodiment of a display device;

[0028] Fig. 22 is a cross-sectional view of an exemplary embodiment of a display device;

[0029] Fig.23 is a bottom view of an exemplary embodiment of a display device;

[0030] Fig.24 yes Fig.23 A cross-sectional view of an exemplary embodiment of a display device;

[0031] Fig.25 is a bottom view of an exemplary embodiment of a display device;

[0032] Fig.26 is a flow chart showing an exemplary embodiment of a process for manufacturing a display device;

[0033] Fig. 27 is a flow chart showing an exemplary embodiment of a process for manufacturing a display device; and

[0034] Fig.28 is a flow chart illustrating an exemplary embodiment of a process of manufacturing a display device. DETAILED DESCRIPTION

[0035] By referring to the detailed description of the following embodiments and drawings, the features of the invention and its implementation method can be more easily understood. However, the invention can be implemented in many different forms and should not be interpreted as being limited to the exemplary embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention will be thorough and complete, and these embodiments will fully convey the concept of the invention to those skilled in the art, and the invention will be limited only by the appended claims. Throughout the specification, the same reference numerals represent the same elements.

[0036] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0037] For ease of description, spatially relative terms such as "below", "below", "below", "above", "on", etc. may be used here to describe the relationship of one element or feature to another element or feature as shown in the drawings. It will be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientation depicted in the drawings. In an exemplary embodiment, when the device in the drawings is turned over, the elements described as "below" or "below" other elements or features will then be positioned as "above" the other elements or features. Therefore, the exemplary term "below" can include both above and below orientations. In addition, the device can be positioned otherwise (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used here are interpreted accordingly.

[0038] It will be understood that, although the terms first, second, etc. can be used here to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the invention, the first element, first component, first region, first layer or first part discussed below can be named as the second element, second component, second region, second layer or second part.

[0039] As used herein, "approximately" or "approximately" includes the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "approximately" can mean within one or more standard deviations or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0040] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in common dictionaries) should be interpreted as having the same meaning as they have in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless so clearly defined herein.

[0041] Exemplary embodiments are described herein with reference to cross-sectional views of schematic diagrams of idealized embodiments. As such, variations in the shapes of the diagrams caused by, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the regions as shown here, but will include deviations in shapes caused by, for example, manufacturing. For example, a region shown or described as flat may typically have rough features and / or nonlinear features. In addition, the sharp angles shown may be rounded. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the regions, and are not intended to limit the scope of the claims.

[0042] Hereinafter, embodiments of the invention will be described with reference to the accompanying drawings.

[0043] Although the exemplary embodiment of the display device 10 is described here as an organic light-emitting display device using an organic light-emitting element as a light-emitting element, the invention is not limited to this case. That is, the display device 10 in the exemplary embodiment may also be an inorganic light-emitting display device using a micro light-emitting diode or an inorganic semiconductor (inorganic light-emitting diode) as a light-emitting element.

[0044] Figure 1 is a perspective view of an exemplary embodiment of the display device 10 . Figure 2 is an exploded perspective view of an exemplary embodiment of the display device 10 .

[0045] Reference Figure 1 and Figure 2The display device 10 in the exemplary embodiment includes a fixed cover 100, a display panel 110, a source driving circuit 121, a flexible film 122, a heat dissipation film 130, a source circuit board 140, a cable 150, a control circuit board 160, a timing control circuit 170 and a lower cover 180.

[0046] In the specification, the terms "above", "top" and "upper surface" refer to the direction along which the second substrate 112 is arranged relative to the first substrate 111 of the display panel 110 (i.e., the Z-axis direction), and the terms "below", "bottom" and "lower surface" refer to the direction along which the heat dissipation film 130 is arranged relative to the first substrate 111 of the display panel 110 (i.e., the direction opposite to the Z-axis direction). In addition, "left", "right", "upper" and "lower" refer to directions when the display panel 110 is viewed in a plan view. For example, "left" refers to the X-axis direction, "right" refers to the direction opposite to the X-axis direction, "lower" refers to the Y-axis direction, and "upper" refers to the direction opposite to the Y-axis direction.

[0047] The fixing cover 100 may surround the edge of the display panel 110. The fixing cover 100 may cover the non-display area of ​​the display panel 110 except the display area. Figure 2 As shown in , the fixing cover 100 may include an upper fixing cover 101 and a lower fixing cover 102. The upper fixing cover 101 may cover the edge of the upper surface of the display panel 110, and the lower fixing cover 102 may cover the lower surface and the side surface of the display panel 110. The upper fixing cover 101 and the lower fixing cover 102 may be combined with each other by a fixing member such as a screw or an adhesive member such as a double-sided tape or an adhesive. The upper fixing cover 101 and the lower fixing cover 102 may include plastic or metal, or may include both plastic and metal.

[0048] The display panel 110 may be rectangular in plan view. In an exemplary embodiment, for example, Figure 2 As shown in , the display panel 110 may have a rectangular plane shape having a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction). Each corner where the long side extending in the first direction (X-axis direction) and the short side extending in the second direction (Y-axis direction) meet may be a right angle or be rounded with a predetermined curvature. The plane shape of the display panel 110 is not limited to a rectangular shape, but may also be another polygonal shape, a circular shape, or an elliptical shape.

[0049] exist Figure 2 In the embodiment, the display panel 110 is arranged to be flat. However, the present invention is not limited to this case. The display panel 110 may also be curved with a predetermined curvature.

[0050] The display panel 110 may include a first substrate 111, a second substrate 112, and a pixel array layer 113. Figure 5 and Fig.11 A detailed description of the pixel array layer 113 is described. The first substrate 111 and the second substrate 112 may be rigid or flexible. The first substrate 111 may include glass or plastic, and the second substrate 112 may include glass, plastic, an encapsulation film, or a barrier film. In an exemplary embodiment, the plastic may be polyethersulfone ("PES"), polyacrylate ("PA"), polyarylate ("PAR"), polyetherimide ("PEI"), polyethylene naphthalate ("PEN"), polyethylene terephthalate ("PET"), polyphenylene sulfide ("PPS"), polyallyl ester (compound), polyimide ("PI"), polycarbonate ("PC"), cellulose triacetate ("CAT"), cellulose acetate propionate ("CAP"), or any combination of these materials. The encapsulation film or barrier film may be a film in which a plurality of inorganic layers are stacked.

[0051] In another exemplary embodiment, the second substrate 112 may be omitted. In this case, a thin film encapsulation layer may be disposed on the first substrate 111 instead of the second substrate 112 .

[0052] The display panel 110 may include Fig.11 In this case, the first substrate 111 may be a thin film transistor substrate in which the thin film transistor layer TFTL, the light emitting element layer EML, and the packaging film 345 are disposed, the second substrate 112 may be a color filter substrate in which the wavelength conversion layer QDL and the color filter layer CFL are disposed, and the filler FL may be disposed between the packaging film 345 of the first substrate 111 and the wavelength conversion layer QDL of the second substrate 112. Fig.11 The thin film transistor layer TFTL, the light emitting element layer EML, the filler FL, the wavelength conversion layer QDL, and the color filter layer CFL of the display panel 110 are described in detail.

[0053] One side of each flexible film 122 may be attached to the surface of the first substrate 111 of the display panel 110, and the other side may be attached to the surface of one of the source circuit boards 140. Specifically, since the size of the first substrate 111 is larger than that of the second substrate 112, one side of the first substrate 111 may be exposed without being covered by the second substrate 112. The flexible film 122 may be attached to the exposed side of the first substrate 111 that is not covered by the second substrate 112. Each flexible film 122 may be attached to the surface of the first substrate 111 and the surface of one of the source circuit boards 140 through an anisotropic conductive film.

[0054] Each flexible film 122 may be a tape carrier package ("TCP") or a chip on film ("COF"). Each flexible film 122 is bendable. Figure 3 and Figure 4 As shown in FIG. 1 , the flexible film 122 may be bent toward the lower surface of the first substrate 111 . In this case, the source circuit board 140 , the cable 150 , and the control circuit board 160 may be disposed on the lower surface of the first substrate 111 .

[0055] Despite Figure 2 Eight flexible films 122 are attached to the first substrate 111 of the display panel 110 , but the number of the flexible films 122 is not limited to eight.

[0056] The source driving circuits 121 may be respectively disposed on the surface of the flexible film 122. The source driving circuits 121 may be provided as integrated circuits ("IC"). Each source driving circuit 121 converts digital video data into an analog data voltage according to a source control signal of the timing control circuit 170, and provides the analog data voltage to the data line of the display panel 110 through the flexible film 122.

[0057] Each source circuit board 140 may be connected to the control circuit board 160 via a cable 150. To this end, each source circuit board 140 may include a first connector 151a for connecting to the cable 150. The source circuit board 140 may be a flexible printed circuit board ("FPCB") or a printed circuit board ("PCB"). The cable 150 may be a flexible cable.

[0058] The control circuit board 160 may be connected to the source circuit board 140 via the cable 150. To this end, the control circuit board 160 may include a second connector 152 for connecting to the cable 150. The control circuit board 160 may be an FPCB or a PCB.

[0059] Despite Figure 2 In the embodiment, four cables 150 connect the source circuit board 140 and the control circuit board 160, but the number of cables 150 is not limited to four. Figure 2 Two source circuit boards 140 are shown in FIG. 1 , but the number of the source circuit boards 140 is not limited to two.

[0060] The timing control circuit 170 may be disposed on the surface of the control circuit board 160. The timing control circuit 170 may be configured as an IC. The timing control circuit 170 may receive digital video data and a timing signal from a system-on-chip of a system circuit board, and generate a source control signal for controlling the timing of the source driving circuit 121 according to the timing signal.

[0061] The system on chip may be provided (e.g., mounted) on a system circuit board connected to the control circuit board 160 via another flexible cable, and may be provided as an IC. The system on chip may be a processor of a smart TV, a central processing unit ("CPU") or a graphics card of a computer or a notebook computer, or an application processor of a smart phone or a tablet personal computer ("PC"). The system circuit board may be an FPCB or a PCB.

[0062] The power supply circuit may be additionally attached to the surface of the control circuit board 160. The power supply circuit may generate a voltage required to drive the display panel 110 by the main power received from the system circuit board, and supply the generated voltage to the display panel 110. In an exemplary embodiment, for example, the power supply circuit may generate a high potential voltage, a low potential voltage, and an initialization voltage for driving an organic light emitting element, and supply the generated voltage to the display panel 110. In addition, the power supply circuit may generate a driving voltage for driving a source driving circuit 121, a timing control circuit 170, etc., and supply the generated voltage. The power supply circuit may be set as an IC. In an optional exemplary embodiment, the power supply circuit may be set on a power circuit board set separately from the control circuit board 160. The power circuit board may be an FPCB or a PCB.

[0063] The heat dissipation film 130 may be disposed on a surface of the first substrate 111 that does not face the second substrate 112 (i.e., disposed on a lower surface of the first substrate 111). In addition, the first to third sound generators 210 to 230 may be disposed on a surface of the heat dissipation film 130 that does not face the first substrate 111 (i.e., disposed on a lower surface of the heat dissipation film 130). The heat dissipation film 130 dissipates heat generated by the first to third sound generators 210 to 230. To this end, the heat dissipation film 130 may include a metal layer having high thermal conductivity, such as graphite, silver (Ag), copper (Cu), or aluminum (Al).

[0064] In addition, the heat dissipation film 130 may include a plurality of graphite layers or a plurality of metal layers arranged in the first direction (X-axis direction) and the second direction (Y-axis direction) instead of in the third direction (Z-axis direction). In this case, since the heat generated by the first to third sound generators 210 to 230 can be diffused in the first direction (X-axis direction) and the second direction (Y-axis direction), the heat can be released more effectively. Therefore, the heat dissipation film 130 can minimize the influence of the heat generated by the first to third sound generators 210 to 230 on the display panel 110.

[0065] In an exemplary embodiment, referring to Figure 5, the thickness D1 of the heat dissipation film 130 may be different from the thickness D2 of the first substrate 111 and the thickness D3 of the second substrate 112. Specifically, in order to prevent the heat generated by the first to third sound generators 210 to 230 from affecting the display panel 110, the thickness D1 of the heat dissipation film 130 may be greater than the thickness D2 of the first substrate 111 and the thickness D3 of the second substrate 112.

[0066] The size of the heat dissipation film 130 may be smaller than that of the first substrate 111. Therefore, the edge of the surface of the first substrate 111 may be exposed without being covered by the heat dissipation film 130. In another exemplary embodiment, the heat dissipation film 130 may be omitted.

[0067] The first to third sound generators 210 to 230 may be disposed on the heat dissipation film 130. The first to third sound generators 210 to 230 may be vibration devices capable of vibrating the display panel 110 in a third direction (Z-axis direction). In this case, the display panel 110 may function as a diaphragm for outputting sound.

[0068] Specifically, each of the first sound generator 210 and the second sound generator 220 may be as follows: Fig.12 and Fig.13 , a piezoelectric element that vibrates the display panel 110 by contracting or expanding according to an applied voltage. The first sound generator 210 and the second sound generator 220 may function as a high-pitched sound generator that outputs a high-pitched sound.

[0069] In addition, the third sound generator 230 may be as follows Figures 17 to 19 , which generates a magnetic force by using a voice coil to vibrate the display panel 110, or may be a linear resonant actuator ("LRA") or an eccentric rotating mass ("ERM") actuator that generates a magnetic force by using a voice coil to vibrate the display panel 110. The following will mainly describe the case where the third sound generator 230 is an exciter. The third sound generator 230 may be used as a mid-low pitch sound generator that outputs a mid-low pitch sound lower than the sound output by the first sound generator 210 and the second sound generator 220.

[0070] Despite Figures 2 to 4 The display device 10 includes three sound generators 210 to 230, but the number of the sound generators 210 to 230 is not limited to three. Figures 12 to 16 The first sound generator 210 and the second sound generator 220 are described in detail. Figures 17 to 19 The third sound generator 230 is described in detail.

[0071] The blocking member 200 (see Figure 4) may be disposed on a surface of the heat dissipation film 130. The blocking member 200 prevents propagation of vibration of the display panel 110 caused by each of the first to third sound generators 210 to 230 or transmission of sound generated by the vibration of the display panel 110. The blocking member 200 may be attached to a surface of the heat dissipation film 130 and a surface of the lower cover 180 to block propagation of vibration of the display panel 110 or transmission of sound.

[0072] The blocking member 200 may be disposed at four edges of the heat dissipation film 130. The blocking member 200 may define a vibration area of ​​each sound generator and prevent vibration generated by a sound generator on one side from affecting adjacent sound generators on other sides. The blocking member 200 may be disposed between the heat dissipation film 130 and the lower cover 180 so that the surface of the heat dissipation film 130 and the surface of the lower cover 180 are joined. Figures 6 to 10 The blocking member 200 is described in detail.

[0073] The lower cover 180 may be disposed on the surface of the heat dissipation film 130. The lower cover 180 may be formed by the first adhesive member 115 (see Figure 5 ) is attached to the edge of the surface of the first substrate 111 of the display panel 110. The first adhesive member 115 may be a double-sided tape including a buffer layer such as foam. The lower cover 180 may be metal or tempered glass. In an exemplary embodiment, a cable hole CH1 penetrating the lower cover 180 may be defined in the lower cover 180. This will be described in detail later.

[0074] As mentioned above, Figure 1 and Figure 2 The display device 10 shown in FIG. 1 can output sound using the display panel 110 as a diaphragm through the first to third sound generators 210 to 230. That is, since the sound can be output forward from the display device 10, the sound quality can be improved. In addition, the first to third sound generators 210 to 230 make it possible to omit a speaker that is generally provided on the lower surface or side of a conventional display panel.

[0075] Although the display device 10 in the exemplary embodiment includes Figure 1 and Figure 2The display device 10 in the exemplary embodiment may be a large or medium-sized display device including a plurality of source driving circuits 121, but the invention is not limited to this case. That is, the display device 10 in the exemplary embodiment may also be a small display device including one source driving circuit 121. In this case, the flexible film 122, the source circuit board 140, and the cable 150 may be omitted. In addition, the source driving circuit 121 and the timing control circuit 170 may be integrated into one IC and then attached to one flexible circuit board or to the first substrate 111 of the display panel 110. Examples of large or medium-sized display devices include monitors and televisions, and examples of small display devices include smart phones and tablet PCs.

[0076] Figure 3 is a bottom view of an exemplary embodiment of the display device 10 . Figure 4 is from Figure 3 FIG. 1 is a bottom view of the display device 10 excluding the lower cover 180 and the control circuit board 160 . Figure 5 is a side view of an exemplary embodiment of the display device 10 .

[0077] Reference Figures 3 to 5 , the flexible film 122 may be bent toward the lower surface of the display panel 110 . Therefore, the source circuit board 140 may be disposed on the surface of the heat dissipation film 130 .

[0078] While the source circuit board 140 is disposed on the surface of the heat dissipation film 130, the control circuit board 160 is disposed on the surface of the lower cover 180. That is, the source circuit board 140 is disposed between the surface of the heat dissipation film 130 and the other surface of the lower cover 180. Therefore, the cable 150 connected to the first connector 151a of the source circuit board 140 can be connected to the second connector 152 of the control circuit board 160 through the cable hole CH1 penetrating the lower cover 180. This can further simplify the wiring connection and ensure process economic feasibility.

[0079] The first sound generator 210 and the second sound generator 220 may be attached to the surface of the heat dissipation film 130 by an adhesive member such as a double-sided adhesive. The first sound generator 210 may be connected to the 1B connector 151b of the source circuit board 140 by the first sound circuit board 250, and the second sound generator 220 may be connected to the 1B connector 151b of the source circuit board 140 by the second sound circuit board 260. A first pad (or "pad") and a second pad connected to the first electrode and the second electrode provided on the surface of the first sound generator 210 may be provided on one side of the first sound circuit board 250. The first pad and the second pad connected to the first electrode and the second electrode provided on the surface of the second sound generator 220 may be provided on one side of the second sound circuit board 260. A connection portion for connecting to the 1B connector 151b of the source circuit board 140 may be provided on the other side of the first sound circuit board 250 and the other side of the second sound circuit board 260. That is, the first sound generator 210 may be electrically connected to the source circuit board 140 through the first sound circuit board 250, and the second sound generator 220 may be electrically connected to the source circuit board 140 through the second sound circuit board 260. The first sound circuit board 250 and the second sound circuit board 260 may be FPCBs or PCBs.

[0080] The sound driving circuit 171 and the third sound generator 230 as well as the timing control circuit 170 may be disposed on the control circuit board 160 .

[0081] The sound driving circuit 171 may receive a sound control signal as a digital signal from a system circuit board. The sound driving circuit 171 may be configured as an IC and may be disposed on the control circuit board 160 or the system circuit board. In an exemplary embodiment, the sound driving circuit 171 may include: a digital signal processor ("DSP") for processing the sound control signal as a digital signal; a digital-to-analog converter ("DAC") for converting the digital signal processed by the DSP into a driving voltage as an analog signal; and an amplifier ("AMP") for amplifying the analog driving voltage output from the DAC and outputting the amplified analog driving voltage. The analog driving voltage may include a positive driving voltage and a negative driving voltage.

[0082] The sound driving circuit 171 may generate a first sound signal including a 1A driving voltage and a 1B driving voltage for driving the first sound generator 210 and a second sound signal including a 2A driving voltage and a 2B driving voltage for driving the second sound generator 220 according to the sound control signal. In addition, the sound driving circuit 171 may generate a third sound signal including a 3A driving voltage and a 3B driving voltage for driving the third sound generator 230 according to the sound control signal.

[0083] The first sound generator 210 may receive a first sound signal including the 1A driving voltage and the 1B driving voltage from the sound driving circuit 171. The first sound generator 210 may output sound by vibrating the display panel 110 according to the 1A driving voltage and the 1B driving voltage.

[0084] The second sound generator 220 may receive a second sound signal including the 2A driving voltage and the 2B driving voltage from the sound driving circuit 171. The second sound generator 220 may output sound by vibrating the display panel 110 according to the 2A driving voltage and the 2B driving voltage.

[0085] like Figure 3 As shown in , when the sound driving circuit 171 and the third sound generator 230 are disposed on the control circuit board 160 , the sound driving circuit 171 and the third sound generator 230 may be electrically connected through a metal wire of the control circuit board 160 .

[0086] It should be noted that the number of sound generators implemented as actuators and the number of sound generators implemented as piezoelectric elements are not limited to Figure 3 and Figure 4 Those shown in .

[0087] In addition, the sound driving circuit 171 may be provided on the control circuit board 160, and the first sound generator 210 and the second sound generator 220 may be provided on the surface of the heat dissipation film 130. In this case, the first sound signal of the sound driving circuit 171 may be transmitted to the first sound generator 210 via the cable 150, the source circuit board 140, and the first sound circuit board 250. In addition, the second sound signal of the sound driving circuit 171 may be transmitted to the second sound generator 220 via the cable 150, the source circuit board 140, and the second sound circuit board 260.

[0088] exist Figures 3 to 5 In the exemplary embodiment of the present invention, the first sound generator 210 and the source circuit board 140 are connected through the first sound circuit board 250, and the second sound generator 220 and the source circuit board 140 are connected through the second sound circuit board 260. Therefore, even when the first sound generator 210 and the second sound generator 220 are disposed on the surface of the heat dissipation film 130 and the control circuit board 160 is disposed on the surface of the lower cover 180, the control circuit board 160 and the first sound generator 210 can be easily electrically connected to each other, and the control circuit board 160 and the second sound generator 220 can also be easily electrically connected to each other.

[0089] The arrangement of the blocking member 200 will now be described in more detail. Figure 6 It is along Figure 4 A cross-sectional view taken along line VI-VI'.

[0090] Reference Figure 6 , the blocking member 200 of the display device 10 in the exemplary embodiment may be disposed between the first sound circuit board 250 and the heat dissipation film 130. Specifically, the blocking member 200 may be attached to the surface of the heat dissipation film 130, and the first sound generator 210 and the source circuit board 140 may be connected to each other. In this case, one surface of the blocking member 200 may contact the heat dissipation film 130, and the other surface of the blocking member 200 may contact the first sound circuit board 250. Since the blocking member 200 is disposed on the heat dissipation film 130 to directly contact the heat dissipation film 130, the vibration generated by the adjacent sound generator may be more effectively blocked.

[0091] In addition, although only the first acoustic circuit board 250 is shown in the drawings, the present invention is not limited to this case, and the blocking member 200 may also be disposed between the second acoustic circuit board 260 and the heat dissipation film 130 .

[0092] Figures 7 to 10 The arrangement of the blocking member 200 and the sound generators 210 to 230 is shown.

[0093] exist Figures 7 to 10 In the embodiment, for ease of description, only the first substrate 111 of the display panel 110, the heat dissipation film 130, the blocking member 200, and the first to third sound generators 210 to 230 are shown. Figures 7 to 10 The source driving circuit 121, the flexible film 122, the source circuit board 140, the cable 150, the control circuit board 160, the timing control circuit 170 and the lower cover 180 are omitted.

[0094] Figure 7 The arrangement of the blocking member 200 in Figure 4 The arrangement of the blocking member 200 is substantially the same. Figure 7 , the size of the heat dissipation film 130 may be smaller than that of the first substrate 111. Therefore, four edges of the surface of the first substrate 111 may be exposed without being covered by the heat dissipation film 130.

[0095] The blocking member 200 may be disposed at four edges of the surface of the first substrate 111. Figure 7 As shown in FIG. 1 , the surface of the heat dissipation film 130 may be divided into first to fourth areas A1 to A4 by the blocking member 200 .

[0096] The first area A1 is an area where the first sound generator 210 is disposed, and may be defined by the blocking member 200 disposed to surround the first sound generator 210. The second area A2 is an area where the second sound generator 220 is disposed, and may be defined by the blocking member 200 disposed to surround the second sound generator 220. The size of the first area A1 and the size of the second area A2 may be substantially the same.

[0097] The third area A3 is an area where the third sound generator 230 is disposed, and may be defined by the blocking member 200 disposed to surround the third sound generator 230. In an exemplary embodiment, the size of the first area A1 and / or the size of the second area A2 may be different from the size of the third area A3. Specifically, the size of the first area A1 and / or the size of the second area A2 may be smaller than the size of the third area A3.

[0098] The fourth area A4 is an area where the source circuit board 140 is disposed, and may be defined by a blocking member 200 disposed to surround the source circuit board 140. Due to the fourth area A4, the source circuit board 140, the source driving circuit 121, and the flexible film 122 may be prevented from being affected by the first sound generator 210 of the first area A1 to the third sound generator 230 of the third area A3, or the influence may be reduced.

[0099] exist Figure 7 In the exemplary embodiment shown in FIG. 1 , each of the first to third sound generators 210 to 230 is surrounded by the blocking member 200. Therefore, the vibration of the display panel 110 caused by each of the first to third sound generators 210 to 230 can be prevented from being affected by the vibration of the display panel 110 caused by the adjacent sound generators, or the influence can be reduced.

[0100] In addition, if Figure 8 As shown in FIG. 1 , the surface of the heat dissipation film 130 may be divided into first to third areas A1 to A3 by the blocking member 200 .

[0101] The first to third regions A1 to A3 may be vertically separated by a plurality of blocking members 200 extending in the second direction (Y-axis direction) and may be arranged parallel to each other in the first direction (X-axis direction). In another exemplary embodiment, the fourth region A4 in which the source circuit board 140 is disposed may be omitted.

[0102] In addition, if Fig. 9 As shown in FIG. 1 , the surface of the heat dissipation film 130 may be divided into first to third areas A1 to A3 by the blocking member 200 .

[0103] The first area A1 may be defined by a barrier member 200 disposed to surround the first sound generator 210. The second area A2 may be defined by a barrier member 200 disposed to surround the second sound generator 220. The third area A3 may be an area other than the first area A1 and the second area A2. In an exemplary embodiment, the size of the first area A1 and / or the size of the second area A2 may be different from the size of the third area A3. Specifically, the size of the first area A1 and / or the size of the second area A2 may be smaller than the size of the third area A3.

[0104] Compared to Figure 7 The blocking member 200 shown in FIG. Fig. 9 The blocking member 200 shown in FIG. 2 is disposed closer to the first sound generator 210 and the second sound generator 220. Therefore, the vibration generated by each of the first sound generator 210 and the second sound generator 220 can be prevented from affecting another adjacent sound generator, or the influence can be reduced.

[0105] In addition, if Fig.10 As shown in FIG. 1 , the surface of the heat dissipation film 130 may be divided into first to fourth areas A1 to A4 by the blocking member 200 .

[0106] Specifically, the arrangement of the first area A1 to the third area A3 can be Fig. 9 , but a fourth area A4 in which the source circuit board 140 is disposed may be further disposed below the first area A1 to the third area A3. As described above, due to the fourth area A4, the source circuit board 140, the source driving circuit 121, and the flexible film 122 may be prevented from being affected by the first sound generator 210 of the first area A1 to the third sound generator 230 of the third area A3, or the influence may be reduced.

[0107] Fig.11 is a cross-sectional view of an exemplary embodiment of a display area of ​​the display panel 110. Fig.11 , the display panel 110 (refer to Figure 2 ) may include a first substrate 111, a second substrate 112 (refer to Figure 2 ), a thin film transistor layer TFTL, a light emitting element layer EML, a filler FL, a wavelength conversion layer QDL and a color filter layer CFL.

[0108] The buffer layer 302 may be disposed on a surface of the first substrate 111 facing the second substrate 112. The buffer layer 302 may be disposed on the first substrate 111 to protect the thin film transistor 335 and the light emitting element from moisture introduced through the first substrate 111 susceptible to moisture penetration. The buffer layer 302 may include a plurality of inorganic layers alternately stacked. In an exemplary embodiment, the buffer layer 302 may be a layer in which, for example, silicon oxide (SiO x ) layer, silicon nitride (SiN x ) layer and a SiON layer. In another exemplary embodiment, the buffer layer 302 may be omitted.

[0109] The thin film transistor layer TFTL is provided on the buffer layer 302. The thin film transistor layer TFTL includes a thin film transistor 335, a gate insulating layer 336, an interlayer insulating film 337, a protective layer 338, and a planarization layer 339.

[0110] The thin film transistors 335 are disposed on the buffer layer 302. Each thin film transistor 335 includes an active layer 331, a gate electrode 332, a source electrode 333, and a drain electrode 334. Fig.11 In the embodiment, each thin film transistor 335 is configured as a top gate type in which the gate electrode 332 is located above the active layer 331. However, it should be noted that the invention is not limited to this case. That is, each thin film transistor 335 can also be configured as a bottom gate type in which the gate electrode 332 is located below the active layer 331 or a dual gate type in which the gate electrode 332 is located both above and below the active layer 331.

[0111] The active layer 331 is disposed on the buffer layer 302 . The active layer 331 may include a silicon-based semiconductor material or an oxide-based semiconductor material. A light shielding layer may be disposed between the buffer layer 302 and the active layer 331 to block external light from entering the active layer 331 .

[0112] The gate insulating layer 336 may be disposed on the active layer 331. In an exemplary embodiment, the gate insulating layer 336 may be an inorganic layer, for example, SiO x Layer, SiN x layer or a plurality of layers including these layers.

[0113] The gate electrode 332 and the gate line may be disposed on the gate insulating layer 336. Each of the gate electrode 332 and the gate line may be a single layer or a multilayer including, for example, any one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0114] The interlayer insulating film 337 may be disposed on the gate electrode 332 and the gate line. In an exemplary embodiment, the interlayer insulating film 337 may be an inorganic layer, for example, SiO x Layer, SiN x layer or a plurality of layers including these layers.

[0115] The source electrode 333, the drain electrode 334, and the data line may be disposed on the interlayer insulating film 337. Each of the source electrode 333 and the drain electrode 334 may be connected to the active layer 331 through a contact hole penetrating the gate insulating layer 336 and the interlayer insulating film 337. In an exemplary embodiment, each of the source electrode 333, the drain electrode 334, and the data line may be a single layer or a multilayer including any one or more of, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0116] A protective layer 338 for insulating the thin film transistor 335 may be disposed on the source electrode 333, the drain electrode 334, and the data line. In an exemplary embodiment, the protective layer 338 may be an inorganic layer, for example, SiO x Layer, SiN x layer or a plurality of layers including these layers.

[0117] The planarization layer 339 may be disposed on the protection layer 338 to planarize a step caused by the thin film transistor 335. In an exemplary embodiment, the planarization layer 339 may include an organic layer such as acrylic resin, epoxy resin, phenol resin, polyamide resin, or polyimide resin.

[0118] The light emitting element layer EML is disposed on the thin film transistor layer TFTL and includes a light emitting element and a pixel defining layer 344 .

[0119] The light emitting element and the pixel defining layer 344 are disposed on the planarization layer 339. The light emitting element may be an organic light emitting device. In this case, each light emitting element may include an anode 341, a light emitting layer 342, and a cathode 343.

[0120] The anode 341 may be disposed on the planarization layer 339. The anode 341 may be connected to the drain electrode 334 of the thin film transistor 335 through a contact hole penetrating the protection layer 338 and the planarization layer 339.

[0121] The pixel defining layer 344 may be disposed on the planarization layer 339 and may cover the edge of the anode 341 to define the pixel. That is, the pixel defining layer 344 serves as a pixel defining layer for defining the sub-pixels PX1 to PX3. Each of the sub-pixels PX1 to PX3 is a region in which the anode 341, the light emitting layer 342, and the cathode 343 are sequentially stacked so that holes from the anode 341 and electrons from the cathode 343 are combined in the light emitting layer 342 to emit light.

[0122] The light emitting layer 342 is disposed on each of the anode 341 and the pixel defining layer 344. The light emitting layer 342 may be an organic light emitting layer. The light emitting layer 342 may emit light having a short wavelength, such as blue light or ultraviolet light. The blue light may have a peak wavelength range of about 450 nanometers (nm) to about 490nm, and the ultraviolet light may have a peak wavelength range of less than 450nm. In this case, the light emitting layer 342 may be a common layer commonly provided for all sub-pixels PX1 to PX3. In this case, the display panel 110 may include: a wavelength conversion layer QDL for converting short wavelength light such as blue light or ultraviolet light emitted from the light emitting layer 342 into red light, green light, and blue light; and a color filter layer CFL for transmitting each of the red light, green light, and blue light.

[0123] The light emitting layer 342 may include a hole transport layer, a light emitting layer, and an electron transport layer. In addition, the light emitting layer 342 may be provided in a series structure of two or more stacks, in which case a charge generation layer may be provided between the stacks.

[0124] The cathode 343 is disposed on the light emitting layer 342. The cathode 343 may be disposed to cover the light emitting layer 342. The cathode 343 may be a common layer commonly disposed for all sub-pixels PX1 to PX3.

[0125] The light emitting element layer EML may be arranged to be a top emission type that emits light toward the second substrate 112 (i.e., in an upward direction). In this case, the anode 341 may include a metal material having a high reflectivity, such as a stacked structure of Al and Ti (Ti / Al / Ti), a stacked structure of Al and indium tin oxide ("ITO") ("ITO / Al / ITO"), an Ag-Pd-Cu ("APC") alloy, or a stacked structure of an APC alloy and ITO ("ITO / APC / ITO"). The APC alloy is an alloy of Ag, palladium (Pd), and Cu. In addition, the cathode 343 may include a transparent conductive material ("TCO") capable of transmitting light (such as ITO or indium zinc oxide ("IZO")) or a semi-transmissive conductive material (such as magnesium (Mg), Ag, or an alloy of Mg and Ag). When the cathode 343 includes a semi-transmissive conductive material, the light output efficiency may be improved by a microcavity.

[0126] The encapsulation film 345 is disposed on the light emitting element layer EML. The encapsulation film 345 is used to prevent oxygen or moisture from penetrating the light emitting layer 342 and the cathode 343. To this end, the encapsulation film 345 may include at least one inorganic layer. The inorganic layer may include silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. In addition, the encapsulation film 345 may also include at least one organic layer. The organic layer may be set to a sufficient thickness to prevent particles from penetrating the encapsulation film 345 and entering the light emitting layer 342 and the cathode 343. In an exemplary embodiment, the organic layer may include, for example, any one of epoxy resin, acrylate, and urethane acrylate.

[0127] The color filter layer CFL is disposed on a surface of the second substrate 112 facing the first substrate 111. The color filter layer CFL may include a black matrix 360 and a color filter 370.

[0128] The black matrix 360 may be disposed on the surface of the second substrate 112. The black matrix 360 may not overlap the sub-pixels PX1 to PX3 but may overlap the pixel defining layer 344. The black matrix 360 may include a black dye or an opaque metal material capable of blocking light.

[0129] The color filter 370 may overlap the sub-pixels PX1 to PX3. The first color filter 371 may overlap the first sub-pixel PX1, the second color filter 372 may overlap the second sub-pixel PX2, and the third color filter 373 may overlap the third sub-pixel PX3. In this case, the first color filter 371 may be a first color light transmission filter that transmits light of the first color, the second color filter 372 may be a second color light transmission filter that transmits light of the second color, and the third color filter 373 may be a third color light transmission filter that transmits light of the third color. In an exemplary embodiment, for example, the first color may be red, the second color may be green, and the third color may be blue. In this case, for example, the peak wavelength range of red light transmitted through the first color filter 371 may be about 620nm to about 750nm, the peak wavelength range of green light transmitted through the second color filter 372 may be about 500nm to about 570nm, and the peak wavelength range of blue light transmitted through the third color filter 373 may be about 450nm to about 490nm.

[0130] In addition, edges of two adjacent color filters may overlap the black matrix 360. Therefore, the black matrix 360 may prevent color mixing that occurs when light emitted from the light emitting layer 342 of any one sub-pixel travels to the color filter of an adjacent sub-pixel.

[0131] An overcoat layer may be disposed on the color filter 370 to planarize a step caused by the color filter 370 and the black matrix 360. In another exemplary embodiment, the overcoat layer may be omitted.

[0132] The wavelength conversion layer QDL is disposed on the color filter layer CFL and may include a first capping layer 351 , a first wavelength conversion layer 352 , a second wavelength conversion layer 353 , a third wavelength conversion layer 354 , a second capping layer 355 , an interlayer organic film 356 , and a third capping layer 357 .

[0133] The first capping layer 351 may be disposed on the color filter layer CFL. The first capping layer 351 may prevent moisture or oxygen from penetrating from the outside through the color filter layer CFL into the first wavelength conversion layer 352, the second wavelength conversion layer 353, and the third wavelength conversion layer 354. In an exemplary embodiment, the first capping layer 351 may include an inorganic layer such as silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

[0134] The first wavelength conversion layer 352 , the second wavelength conversion layer 353 , and the third wavelength conversion layer 354 may be disposed on the first capping layer 351 .

[0135] The first wavelength conversion layer 352 may overlap the first sub-pixel PX1. The first wavelength conversion layer 352 may convert short-wavelength light such as blue light or ultraviolet light emitted from the light emitting layer 342 of the first sub-pixel PX1 into light of a first color. To this end, the first wavelength conversion layer 352 may include a first base resin, a first wavelength converter, and a first scatterer.

[0136] The first matrix resin may be a material having high light transmittance and excellent dispersion characteristics for the first wavelength converter and the first scatterer. In an exemplary embodiment, for example, the first matrix resin may include an organic material such as epoxy resin, acrylic resin, cardo resin, or imide resin.

[0137] The first wavelength converter can convert or transform the wavelength range of the incident light. In an exemplary embodiment, for example, the first wavelength converter can be a quantum dot, a quantum rod or a phosphor. In an exemplary embodiment, when the first wavelength converter is a quantum dot, the quantum dot can be a semiconductor nanocrystal material and has a specific band gap according to its composition and size. Therefore, for example, the first wavelength converter can absorb the incident light and then emit light with a unique wavelength. In addition, the first wavelength converter can have a core-shell structure, which includes a core containing nanocrystals and a shell around the core. In this case, examples of nanocrystals forming the core include IV group nanocrystals, II-VI group compound nanocrystals, III-V group compound nanocrystals, IV-VI group compound nanocrystals, and any combination thereof. The shell can be used as a protective layer for maintaining semiconductor properties by preventing chemical denaturation of the core, and / or as a charged layer for imparting electrophoretic properties to the quantum dot. In addition, the shell can be a single layer or multiple layers. The shell can be, for example, a metal or non-metal oxide, a semiconductor compound, or any combination thereof.

[0138] The first scatterer may have a refractive index different from that of the first matrix resin and may form an optical interface with the first matrix resin. In an exemplary embodiment, for example, the first scatterer may be light scattering particles. In an exemplary embodiment, for example, the first scatterer may be metal oxide particles, such as titanium oxide (TiO 2 ), silicon oxide (SiO 2 )、ZrO 2 ), aluminum oxide (Al 2 O 3 ), indium oxide (In 2 O 3 ), zinc oxide (ZnO) or tin oxide (SnO 2 ). In an alternative exemplary embodiment, the first scatterer may be organic particles, such as acrylic resin or urethane resin.

[0139] The first scatterer can scatter incident light in random directions without substantially changing the wavelength of light transmitted through the first wavelength conversion layer 352. Therefore, this can increase the length of the path of light transmitted through the first wavelength conversion layer 352, thereby improving the color conversion efficiency of the first wavelength converter.

[0140] In addition, the first wavelength conversion layer 352 may overlap the first color filter 371. Therefore, a portion of the short wavelength light such as blue light or ultraviolet light provided from the first subpixel PX1 may pass through the first wavelength conversion layer 352 as it is without being converted into the light of the first color by the first wavelength converter. However, the short wavelength light such as blue light or ultraviolet light that is incident on the first color filter 371 without being converted by the first wavelength conversion layer 352 may not pass through the first color filter 371. The light of the first color output from the first wavelength conversion layer 352 may pass through the first color filter 371 and proceed toward the second substrate 112.

[0141] The second wavelength conversion layer 353 may be overlapped with the second sub-pixel PX2. The second wavelength conversion layer 353 may convert short-wavelength light such as blue light or ultraviolet light emitted from the light-emitting layer 342 of the second sub-pixel PX2 into light of a second color. To this end, the second wavelength conversion layer 353 may include a second base resin, a second wavelength converter, and a second scatterer. The second base resin, the second wavelength converter, and the second scatterer of the second wavelength conversion layer 353 are substantially the same as the first base resin, the first wavelength converter, and the first scatterer of the first wavelength conversion layer 352, and thus a detailed description thereof is omitted. When the first wavelength converter and the second wavelength converter are quantum dots, the diameter of the second wavelength converter may be smaller than the diameter of the first wavelength converter.

[0142] In addition, the second wavelength conversion layer 353 may overlap with the second color filter 372. Therefore, a portion of the short wavelength light such as blue light or ultraviolet light provided from the second subpixel PX2 may pass through the second wavelength conversion layer 353 as it is without being converted into the light of the second color by the second wavelength converter. However, the short wavelength light such as blue light or ultraviolet light that is incident on the second color filter 372 without being converted by the second wavelength conversion layer 353 may not pass through the second color filter 372. The light of the second color output from the second wavelength conversion layer 353 may pass through the second color filter 372 and proceed toward the second substrate 112.

[0143] The third wavelength conversion layer 354 may overlap the third sub-pixel PX3. The third wavelength conversion layer 354 may convert short-wavelength light such as blue light or ultraviolet light emitted from the light emitting layer 342 of the third sub-pixel PX3 into light of a third color. To this end, the third wavelength conversion layer 354 may include a third base resin and a third scatterer. The third base resin and the third scatterer of the third wavelength conversion layer 354 are substantially the same as the first base resin and the first scatterer of the first wavelength conversion layer 352, and thus a detailed description thereof is omitted.

[0144] In addition, the third wavelength conversion layer 354 may overlap the third color filter 373. Therefore, short wavelength light such as blue light or ultraviolet light provided from the third subpixel PX3 may pass through the third wavelength conversion layer 354 as it is, and the light passing through the third wavelength conversion layer 354 may pass through the third color filter 373 and proceed toward the second substrate 112.

[0145] The second capping layer 355 may be disposed on the first wavelength conversion layer 352, the second wavelength conversion layer 353, the third wavelength conversion layer 354, and a portion of the first capping layer 351 not covered by the wavelength conversion layers 352 to 354. The second capping layer 355 prevents moisture or oxygen from penetrating from the outside into the first wavelength conversion layer 352, the second wavelength conversion layer 353, and the third wavelength conversion layer 354. In an exemplary embodiment, the second capping layer 355 may include an inorganic layer such as silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

[0146] The interlayer organic film 356 may be disposed on the second capping layer 355. The interlayer organic film 356 may be a planarization layer for planarizing steps caused by the wavelength conversion layers 352 to 354. In an exemplary embodiment, the interlayer organic film 356 may include an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0147] The third capping layer 357 may be disposed on the interlayer organic film 356. In exemplary embodiments, the third capping layer 357 may include an inorganic layer such as silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

[0148] The filler FL may be disposed between the encapsulation film 345 disposed on the first substrate 111 and the third cover layer 357 disposed on the second substrate 112. The filler FL may include a material having a buffering function. In an exemplary embodiment, for example, the filler FL may include an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0149] In addition, a sealing material for bonding the first substrate 111 and the second substrate 112 may be provided in the non-display region of the display panel 110. When viewed in a plan view, the filler FL may be surrounded by the sealing material. The sealing material may be frit or a sealant.

[0150] exist Fig.11In an exemplary embodiment of the present invention, the first to third subpixels PX1 to PX3 may emit short-wavelength light such as blue light or ultraviolet light. The light of the first subpixel PX1 is converted into light of a first color by the first wavelength conversion layer 352 and then output through the first color filter 371. The light of the second subpixel PX2 is converted into light of a second color by the second wavelength conversion layer 353 and then output through the second color filter 372. The light of the third subpixel PX3 is output through the third wavelength conversion layer 354 and the third color filter 373. Therefore, white light may be output.

[0151] In addition, Fig.11 In an exemplary embodiment, each of the sub-pixels PX1 to PX3 is configured as a top emission type that emits light toward the second substrate 112 (ie, in an upward direction). Therefore, a heat dissipation film 130 including an opaque material such as graphite or aluminum may be disposed on a surface of the first substrate 111.

[0152] The above-mentioned sound generator will now be described in more detail.

[0153] The display device 10 in the exemplary embodiment may include three sound generators 210 to 230 .

[0154] Fig.12 is a perspective view of an exemplary embodiment of the first sound generator 210 and the second sound generator 220 . Fig.13 It is along Fig.12 A cross-sectional view taken along line XIII-XIII'. Fig.14 An exemplary embodiment of a method of vibrating each of the first sound generator 210 and the second sound generator 220 is shown. Fig.15 and Fig.16 An exemplary embodiment is shown in which the display panel 110 is vibrated by the vibration of each of the first sound generator 210 and the second sound generator 220 .

[0155] Reference Figures 12 to 16 , each of the first sound generator 210 and the second sound generator 220 in the exemplary embodiment may be as follows Figures 12 to 16 In this case, each of the first sound generator 210 and the second sound generator 220 may include a vibration layer 511, a first electrode 512, a second electrode 513, a first pad electrode, and a second pad electrode.

[0156] The first electrode 512 may include a first trunk electrode 5121 and first branch electrodes 5122. The first trunk electrode 5121 may be disposed on only one side surface of the vibration layer 511, or on a plurality of side surfaces of the vibration layer 511. The first trunk electrode 5121 may also be disposed on an upper surface of the vibration layer 511. The first branch electrodes 5122 may branch from the first trunk electrode 5121. The first branch electrodes 5122 may be arranged in parallel with each other.

[0157] The second electrode 513 may include a second trunk electrode 5131 and a second branch electrode 5132. The second trunk electrode 5131 may be disposed on the other side surface of the vibration layer 511, or on multiple side surfaces of the vibration layer 511. In this case, the first trunk electrode 5121 may be disposed on any side surface of the side surfaces on which the second trunk electrode 5131 is disposed. The second trunk electrode 5131 may be disposed on the upper surface of the vibration layer 511. The first trunk electrode 5121 and the second trunk electrode 5131 may not overlap each other. The second branch electrode 5132 may branch from the second trunk electrode 5131. The second branch electrodes 5132 may be arranged in parallel with each other.

[0158] The first branch electrode 5122 and the second branch electrode 5132 may be arranged parallel to each other in the horizontal direction (X-axis direction or Y-axis direction). In addition, the first branch electrode 5122 and the second branch electrode 5132 may be arranged alternately in the vertical direction (Z-axis direction). That is, the first branch electrode 5122 and the second branch electrode 5132 may be repeatedly arranged in the vertical direction (Z-axis direction) in the order of the first branch electrode 5122, the second branch electrode 5132, the first branch electrode 5122 and the second branch electrode 5132.

[0159] The first electrode 512 and the second electrode 513 may be connected to the first sound circuit board 250 (refer to Figure 4 ) or the second sound circuit board 260 (refer to Figure 4 ) of the metal wire or pad electrode. The metal wire or pad electrode of the first sound circuit board 250 or the second sound circuit board 260 may be connected to the first sound generator 210 (refer to Figure 4 ) or the second sound generator 220 (refer to Figure 4 ) on the surface of the first electrode 512 and the second electrode 513.

[0160] The vibration layer 511 may be a piezoelectric element that is deformed according to a first driving voltage applied to the first electrode 512 and a second driving voltage applied to the second electrode 513. In this case, the vibration layer 511 may be any one of a piezoelectric material such as a polyvinylidene fluoride ("PVDF") film or lead zirconate titanate ("PZT") and an electroactive polymer.

[0161] Since the production temperature of the vibration layer 511 is high, the first electrode 512 and the second electrode 513 may include silver (Ag) having a high melting point or an alloy of Ag and palladium (Pd). When the first electrode 512 and the second electrode 513 include an alloy of Ag and Pd, in order to increase the melting point of the first electrode 512 and the second electrode 513, the Ag content may be higher than the Pd content.

[0162] The vibration layer 511 may be disposed between each pair of the first branch electrodes 5122 and the second branch electrodes 5132. The vibration layer 511 may contract or expand according to a difference between a first driving voltage applied to each first branch electrode 5122 and a second driving voltage applied to the corresponding second branch electrode 5132.

[0163] Specifically, Fig.13 As shown in , the polarity direction of the vibration layer 511 disposed between the first branch electrode 5122 and the second branch electrode 5132 disposed below the first branch electrode 5122 may be an upward direction (↑). In this case, the vibration layer 511 has a positive polarity in an upper region adjacent to the first branch electrode 5122, and has a negative polarity in a lower region adjacent to the second branch electrode 5132. In addition, the polarity direction of the vibration layer 511 disposed between the second branch electrode 5132 and the first branch electrode 5122 disposed below the second branch electrode 5132 may be a downward direction (↓). In this case, the vibration layer 511 has a negative polarity in an upper region adjacent to the second branch electrode 5132, and has a positive polarity in a lower region adjacent to the first branch electrode 5122. The polarity direction of the vibration layer 511 may be determined by a polarization process in which an electric field is applied to the vibration layer 511 using the first branch electrode 5122 and the second branch electrode 5132.

[0164] Reference Fig.14 , when the polarity direction of the vibration layer 511 disposed between the first branch electrode 5122 and the second branch electrode 5132 disposed below the first branch electrode 5122 is an upward direction (↑), when the 1A driving voltage or the 2A driving voltage of the positive polarity is applied to the first branch electrode 5122, and the 1B driving voltage or the 2B driving voltage of the negative polarity is applied to the second branch electrode 5132, the vibration layer 511 may contract according to the first force F1. The first force F1 may be a compressive force. In addition, when the 1A driving voltage or the 2A driving voltage of the negative polarity is applied to the first branch electrode 5122, and the 1B driving voltage or the 2B driving voltage of the positive polarity is applied to the second branch electrode 5132, the vibration layer 511 may expand according to the second force F2. The second force F2 may be a tensile force.

[0165] In addition, when the polarity direction of the vibration layer 511 disposed between the second branch electrode 5132 and the first branch electrode 5122 disposed below the second branch electrode 5132 is in the downward direction (↓), when the 1A driving voltage or the 2A driving voltage of the positive polarity is applied to the second branch electrode 5132, and the 1B driving voltage or the 2B driving voltage of the negative polarity is applied to the first branch electrode 5122, the vibration layer 511 can expand according to the tensile force. In addition, when the 1A driving voltage or the 2A driving voltage of the negative polarity is applied to the second branch electrode 5132, and the 1B driving voltage or the 2B driving voltage of the positive polarity is applied to the first branch electrode 5122, the vibration layer 511 can contract according to the compressive force.

[0166] exist Fig.12 and Fig.13 In the exemplary embodiment shown in , when the 1A driving voltage or the 2A driving voltage applied to the first electrode 512 and the 1B driving voltage or the 2B driving voltage applied to the second electrode 513 are repeatedly alternated between positive polarity and negative polarity, the vibration layer 511 can repeatedly contract and expand, thereby causing each of the first sound generator 210 and the second sound generator 220 to vibrate.

[0167] Since each of the first sound generator 210 and the second sound generator 220 is disposed on the lower surface of the display panel 110, when the vibration layer 511 of each of the first sound generator 210 and the second sound generator 220 contracts and expands, as shown in FIG. Fig.15 and Fig.16 As shown in , the display panel 110 may vibrate up and down due to pressure. That is, since the display panel 110 vibrates by each of the first sound generator 210 and the second sound generator 220, the display device 10 may output sound.

[0168] Fig.17 It is along Figure 3 A cross-sectional view taken along line XVII-XVII'. Fig.18 and Fig.19 An exemplary embodiment of a case where the display panel 110 is vibrated by the vibration of the third sound generator 230 is shown.

[0169] The third sound generator 230 may be Figures 17 to 19 The actuator shown in , which generates magnetic force by using a voice coil to vibrate the display panel 110, or may be an LRA or ERM actuator which generates magnetic force by using a voice coil to vibrate the display panel 110.

[0170] When the third sound generator 230 is an exciter, the third sound generator 230 may include a magnet 211 , a bobbin 212 , a voice coil 213 , a damper 214 , and a lower plate 215 .

[0171] The magnet 211 is a permanent magnet, and a sintered magnet such as barium ferrite may be used. In an exemplary embodiment, for example, the material of the magnet 211 may be, but is not limited to, ferric oxide (Fe 2 O 3 ), barium carbonate (BaCO 3 ), neodymium magnets, strontium ferrite with improved magnetic components, or aluminum (Al), nickel (Ni) or cobalt (Co) alloy casting magnets. In an exemplary embodiment, for example, the neodymium magnet may be, for example, neodymium iron boron (Nd-Fe-B).

[0172] The magnet 211 may include a plate 211a, a central protrusion 211b protruding from the center of the plate 211a, and a side wall 211c protruding from the edge of the plate 211a. The central protrusion 211b and the side wall 211c may be spaced apart from each other by a predetermined distance. Therefore, a predetermined space may be defined between the central protrusion 211b and each side wall 211c. That is, the shape of the magnet 211 may be similar to a cylinder, specifically, a cylinder having a circular space defined in any one matrix of the cylinder. Figure 2 The lower fixing cover 102 shown in FIG. 1 may be fixed to the plate 211 a of the magnet 211 .

[0173] The central protrusion 211b of the magnet 211 may have north (N) magnetic properties, and the plate 211a and the sidewall 211c may have south (S) magnetic properties. Therefore, an external magnetic field may be generated between the central protrusion 211b of the magnet 211 and the plate 211a and between the central protrusion 211b and the sidewall 211c.

[0174] The bobbin 212 may be cylindrical. The central protrusion 211b of the magnet 211 may be disposed inside the bobbin 212. That is, the bobbin 212 may surround the central protrusion 211b of the magnet 211. In addition, the side wall 211c of the magnet 211 may be disposed outside the bobbin 212. That is, the side wall 211c of the magnet 211 may surround the bobbin 212. A space may be defined between the bobbin 212 and the central protrusion 211b of the magnet 211 and between the bobbin 212 and the side wall 211c of the magnet 211.

[0175] The bobbin 212 may include a material obtained by processing pulp or paper, aluminum or magnesium or an alloy thereof, a synthetic resin such as polypropylene, or polyamide-based fibers. One end of the bobbin 212 may be attached to the heat dissipation film 130 using an adhesive member. In an exemplary embodiment, the adhesive member may be, for example, a double-sided tape.

[0176] The voice coil 213 is wound on the outer peripheral surface of the bobbin 212. One end of the voice coil 213 adjacent to the one end of the bobbin 212 may receive a 3A driving voltage, and the other end of the voice coil 213 adjacent to the other end of the bobbin 212 may receive a 3B driving voltage. Therefore, a current may flow through the voice coil 213 according to the 3A driving voltage and the 3B driving voltage. An applied magnetic field may be generated around the voice coil 213 according to the current flowing through the voice coil 213. The direction of the current flowing through the voice coil 213 when the 3A driving voltage is a positive voltage and the 3B driving voltage is a negative voltage may be opposite to the direction of the current flowing through the voice coil 213 when the 3A driving voltage is a negative voltage and the 3B driving voltage is a positive voltage. Therefore, the N pole and the S pole of the applied magnetic field generated around the voice coil 213 may be changed according to the alternating current ("AC") driving of the 3A driving voltage and the 3B driving voltage. Therefore, attractive force and repulsive force act alternately on the magnet 211 and the voice coil 213. Therefore, the bobbin 212 on which the voice coil 213 is wound can be as follows Fig.18 and Fig.19 As shown in FIG. 1 , the display panel 110 and the heat dissipation film 130 reciprocate in the third direction (Z-axis direction). Therefore, the display panel 110 and the heat dissipation film 130 vibrate in the third direction (Z-axis direction), thereby outputting sound.

[0177] The damper 214 is disposed between a portion of the upper side of the bobbin 212 and the side wall 211c of the magnet 211. The damper 214 adjusts the up and down vibration of the bobbin 212 by contraction or relaxation according to the up and down movement of the bobbin 212. That is, since the damper 214 is connected to the bobbin 212 and the side wall 211c of the magnet 211, the up and down movement of the bobbin 212 can be limited by the restoring force of the damper 214. In an exemplary embodiment, for example, when the bobbin 212 vibrates above a predetermined height or vibrates below a predetermined height, the bobbin 212 can return to its initial position by the restoring force of the damper 214.

[0178] The lower plate 215 may be disposed on the lower surface of the magnet 211. The lower plate 215 may be integral with the magnet 211, or may be disposed separately from the magnet 211. When the lower plate 215 is disposed separately from the magnet 211, the magnet 211 may be attached to the lower plate 215 with an adhesive member such as a double-sided tape.

[0179] The lower plate 215 may be fixed to the control circuit board 160 by a fixing member 216 such as a screw. Therefore, the magnet 211 of the third sound generator 230 may be fixed to the control circuit board 160.

[0180] Although the case where the magnet 211 of the third sound generator 230 is fixed to the control circuit board 160 is described here as an example, the invention is not limited to this case. That is, the magnet 211 of the third sound generator 230 may be fixed to a system circuit board, a power circuit board, or a dummy circuit board instead of the control circuit board 160. The dummy circuit board refers to a circuit board on which no circuit other than the third sound generator 230 is provided. The dummy circuit board may be an FPCB or a PCB.

[0181] Each of the first sound generator 210 and the second sound generator 220 may function as a high-frequency speaker that outputs a sound having a high sound pressure level in a high frequency band. The third sound generator 230 may function as a low-frequency speaker that outputs a sound having a high sound pressure level in a low frequency band. In an exemplary embodiment, for example, the high frequency band may be a frequency band of about 1 kilohertz (kHz) or higher, and the low frequency band may be a frequency band of about 800 Hz or lower.

[0182] In an exemplary embodiment, the first sound generator 210 may be disposed close to the right side of the display panel 110, and the second sound generator 220 may be disposed close to the left side of the display panel 110. Although the third sound generator 230 is Figures 1 to 4 The third sound generator 230 is disposed near the upper side of the display panel 110, but the position of the third sound generator 230 is not limited to this position because the third sound generator 230 acts as a low-frequency speaker having a lower sound directivity than the high-frequency speaker. Therefore, the first sound is output forward from the right side of the display panel 110 through the first sound generator 210, the second sound is output forward from the left side of the display panel 110 through the second sound generator 220, and the third low-pitched sound is output through the third sound generator 230. Therefore, the display device 10 can provide 2.1-channel stereo to the user.

[0183] Fig. 20 An exemplary embodiment of the sound pressure level with respect to each frequency of the sound generated by the sound generator is shown. Fig. 20 , the X-axis represents frequency (Hz) and the Y-axis represents sound pressure level (dB).

[0184] exist Fig. 20, each of W1, W2, W3 and W4 corresponds to the sound pressure level of each frequency of the sound of the sound generator used as a low frequency speaker. The fundamental frequency (F0) of each of W1, W2, W3 and W4 may be within the low frequency region LFR. The F0 of each of W1, W2, W3 and W4 is about 800 Hz or less, preferably about 400 Hz or less. Each of W1, W2, W3 and W4 may decrease with a predetermined slope in the middle frequency region MFR and the high frequency region HFR. The absolute value of the slope of W1, the absolute value of the slope of W2, the absolute value of the slope of W3 and the absolute value of the slope of W4 may become larger from W1 toward W4 in the middle frequency region MFR and the high frequency region HFR. In consideration of the characteristics of the sound, the sound of the sound generator used as a low frequency speaker may be set to any one of W1, W2, W3 and W4.

[0185] exist Fig. 20 In the embodiment of the present invention, each of T1, T2, T3 and T4 corresponds to a sound pressure level for each frequency of the sound of the sound generator used as a tweeter. The F0 of each of T1, T2, T3 and T4 may be within the high frequency region HFR. The F0 of each of T1, T2, T3 and T4 may be about 1kHz or greater. Each of T1, T2, T3 and T4 may increase with a predetermined slope in the low frequency region LFR and the middle frequency region MFR. The absolute value of the slope of T1, the absolute value of the slope of T2, the absolute value of the slope of T3 and the absolute value of the slope of T4 may become larger from T1 toward T4 in the low frequency region LFR and the middle frequency region MFR. In consideration of the characteristics of the sound, the sound of the sound generator used as a tweeter may be set to any one of T1, T2, T3 and T4.

[0186] In an exemplary embodiment, F0 of each of the first sound generator 210 and the second sound generator 220 may be about 1 kHz or more. F0 for the first sound generator 210 and the second sound generator 220 refers to the minimum frequency at which the vibration displacement of the display panel 110 exceeds the reference displacement due to the sound generator, and F0 for the third sound generator 230 refers to the maximum frequency at which the vibration displacement of the display panel 110 exceeds the reference displacement due to the sound generator. When the vibration displacement of the display panel 110 exceeds the reference displacement due to the sound generator, the sound pressure level may exceed the reference sound pressure level. In an exemplary embodiment, F0 of the third sound generator 230 may be about 800 Hz, preferably, about 400 Hz or less.

[0187] The output sound characteristics of the first sound generator 210 may be substantially the same as the output sound characteristics of the second sound generator 220. In an exemplary embodiment, F0 of the first sound generator 210 and F0 of the second sound generator 220 may be substantially the same, and the frequency VS sound pressure level of the first sound generator 210 and the frequency VS sound pressure level of the second sound generator 220 may be, for example, any one of T1, T2, T3, and T4. Here, since the display device 10 includes the third sound generator 230 for outputting low-pitched sounds, the frequency VS sound pressure level of the first sound generator 210 and the frequency VS sound pressure level of the second sound generator 220 may be T3 or T4 because they do not need to be high in the low frequency region LFR. The frequency VS sound pressure level of the third sound generator 230 may be Fig. 20 Any one of W1, W2, W3 and W4.

[0188] In an alternative exemplary embodiment, the output sound characteristics of the first sound generator 210 and the output sound characteristics of the second sound generator 220 may be different from each other. In an exemplary embodiment, for example, the frequency VS sound pressure level of the first sound generator 210 and the frequency VS sound pressure level of the second sound generator 220 may be different from each other. In another exemplary embodiment, for example, the F0 of the first sound generator 210 may be different from the F0 of the second sound generator 220.

[0189] The display device 10 in the exemplary embodiment outputs sound with a high sound pressure level in a high frequency band through the first sound generator 210 and the second sound generator 220, and outputs sound with a high sound pressure level in a low frequency band through the third sound generator 230. Therefore, the display device 10 can provide 2.1 channel stereo to the user.

[0190] Hereinafter, other exemplary embodiments will be described. In the following embodiments, the same elements as those of the above-described embodiments will be denoted by the same reference numerals, and redundant descriptions thereof will be omitted or briefly given.

[0191] Fig.21 1 is a bottom view of an exemplary embodiment of the display device 10_1. Fig.21 is a bottom view, so it should be noted that the left and right sides of the display device 10_1 are different from Figure 1 and Figure 2 The left side is inverted compared to the right side.

[0192] Reference Fig.21 According to the exemplary embodiment shown, the display device 10_1 and Figures 1 to 4 The exemplary embodiment of FIG. 1 is different in that the display device 10_1 further includes a fourth sound generator 240 and a third sound circuit board 270 .

[0193] The fourth sound generator 240 may be a piezoelectric element that vibrates the display panel 110 by contracting or expanding according to an applied voltage. In this case, the fourth sound generator 240 may function as a tweeter that outputs sound with a high sound pressure level in a high frequency band.

[0194] The first sound generator 210 may be disposed near the right side of the display panel 110, the second sound generator 220 may be disposed near the left side of the display panel 110, and the fourth sound generator 240 may be disposed near the center of the display panel 110. Therefore, the first sound is output forward from the right side of the display panel 110 through the first sound generator 210, the second sound is output forward from the left side of the display panel 110 through the second sound generator 220, the fourth sound is output forward from the center of the display panel 110 through the fourth sound generator 240, and the third low-pitched sound is output through the third sound generator 230. Therefore, the display device 10_1 can provide 3.1-channel stereo sound to the user.

[0195] In an exemplary embodiment, the F0 of the fourth sound generator 240 may be about 1 kHz or greater. The output sound characteristics of the fourth sound generator 240 may be substantially the same as the output sound characteristics of the first sound generator 210 and / or the output sound characteristics of the second sound generator 220. In an exemplary embodiment, for example, the F0 of the first sound generator 210, the F0 of the second sound generator 220, and the F0 of the fourth sound generator 240 may be substantially the same, and the frequency VS sound pressure level of the first sound generator 210, the frequency VS sound pressure level of the second sound generator 220, and the frequency VS sound pressure level of the fourth sound generator 240 may be Fig. 20 Here, since the display device 10_1 includes the third sound generator 230 for outputting the low-pitched sound, the frequency VS sound pressure level of the first sound generator 210, the frequency VS sound pressure level of the second sound generator 220, and the frequency VS sound pressure level of the fourth sound generator 240 may be T3 or T4 because they do not need to be high in the low frequency region LFR.

[0196] In an alternative exemplary embodiment, the output sound characteristics of the first sound generator 210, the output sound characteristics of the second sound generator 220, and / or the output sound characteristics of the fourth sound generator 240 may be different. In an exemplary embodiment, for example, the frequency VS sound pressure level of the first sound generator 210, the frequency VS sound pressure level of the second sound generator 220, and the frequency VS sound pressure level of the fourth sound generator 240 may be different. In another exemplary embodiment, for example, the F0 of the first sound generator 210, the F0 of the second sound generator 220, and the F0 of the fourth sound generator 240 may be different.

[0197] The display device 10_1 according to the illustrated exemplary embodiment outputs sound having a high sound pressure level in a high frequency band through the first sound generator 210, the second sound generator 220, and the fourth sound generator 240, and outputs sound having a high sound pressure level in a low frequency band through the third sound generator 230. Therefore, the display device 10_1 can provide 3.1 channel stereo sound to the user.

[0198] Fig. 22 is a cross-sectional view of an exemplary embodiment of a display device 10_2. Fig. 22 is along with Figure 4 A cross-sectional view taken at a position corresponding to line VI-VI'.

[0199] Reference Fig. 22 According to the exemplary embodiment shown, the display device 10_2 and Figure 6 The exemplary embodiment of FIG. 1 is different in that the blocking member 200 is disposed on the heat dissipation film 130 and the first sound circuit board 250 .

[0200] Specifically, the first sound generator 210 and the source circuit board 140 may be connected through the first sound circuit board 250, and the blocking member 200 may be disposed on the heat dissipation film 130 and the first sound circuit board 250. In this case, one surface of the first sound circuit board 250 may be in contact with the heat dissipation film 130, and the other surface of the first sound circuit board 250 may be in contact with the blocking member 200. In addition, although not shown in the drawings, one surface of the blocking member 200 may be in contact with the first sound circuit board 250, and the other surface of the blocking member 200 may be in contact with the lower cover 180. In this case, in order to more effectively block the vibration generated by the adjacent sound generator, an adhesive material may also be disposed between the first sound circuit board 250 and the blocking member 200.

[0201] Although only the first acoustic circuit board 250 is shown in the drawings, the present invention is not limited to this case, and the blocking member 200 may also be provided on the second acoustic circuit board 260 .

[0202] Fig.23 is a bottom view of an exemplary embodiment of the display device 10_3. Fig.24 is a cross-sectional view of an exemplary embodiment of a display device 10_3. Fig.23 It is a bottom view of the display device 10_3 excluding the lower cover 180, the control circuit board 160, etc. Fig.24 is along with Fig.23 A cross-sectional view taken at a position corresponding to line VI-VI'.

[0203] Reference Fig.23 and Fig.24According to the exemplary embodiment shown, the display device 10_3 and Figures 3 to 6 The exemplary embodiment of FIG. 1 is different in that the blocking member 200 is not provided on the first sound circuit board 250 .

[0204] Specifically, the first sound generator 210 may be connected to the connector of the source circuit board 140 through the first sound circuit board 250. In this case, the blocking member 200 may be partially cut away in the region where the first sound circuit board 250 is disposed. Therefore, the blocking member 200 may not overlap the first sound circuit board 250.

[0205] Fig.25 is a bottom view of an exemplary embodiment of a display device 10_4.

[0206] Reference Fig.25 According to the exemplary embodiment shown, the display device 10_4 and Figure 3 The exemplary embodiment of the present invention is different in that a sound driving circuit board 300 is further provided on the lower cover 180. Specifically, the sound driving circuit board 300 may be connected to the control circuit board 160 via the cable 150'. To this end, the control circuit board 160 may include a third connector 153 for connecting to the cable 150'. In addition, the sound driving circuit board 300 may include a fourth connector 154 for connecting to the cable 150'.

[0207] The sound driving circuit board 300 may include a second sound driving circuit 171'. Specifically, the second sound driving circuit 171' may receive a sound control signal as a digital signal from the system circuit board. The second sound driving circuit 171' may be provided as an IC, and may include a DSP for processing the sound control signal as a digital signal, a DAC for converting the digital signal processed by the DSP into a driving voltage as an analog signal, an AMP for amplifying the analog driving voltage output from the DAC and outputting the amplified analog driving voltage, and the like.

[0208] When the sound driving circuit board 300 is Fig.25 When the first sound generator 210 and the second sound generator 220 are disposed on the surface of the heat dissipation film 130, the first sound signal of the second sound driving circuit 171' can be transmitted to the first sound generator 210 via the cables 150 and 150', the control circuit board 160, the source circuit board 140, and the first sound circuit board 250. In addition, the second sound signal of the second sound driving circuit 171' can be transmitted to the second sound generator 220 via the cables 150 and 150', the control circuit board 160, the source circuit board 140, and the second sound circuit board 260.

[0209] In addition, when the sound driving circuit board 300 is disposed on the lower cover 180 and the third sound generator 230 is disposed on the control circuit board 160 , the sound driving circuit board 300 and the third sound generator 230 may be electrically connected through the cable 150 ′ and the metal wire of the control circuit board 160 .

[0210] Fig.25 The second sound driving circuit 171′ shown in FIG. Figure 3 The sound driving circuit 171 shown in FIG. 1 is substantially the same as that in FIG. 1 , and thus a detailed description thereof is omitted.

[0211] exist Fig.25 In the exemplary embodiment shown in , the first sound generator 210 and the source circuit board 140 are connected through the first sound circuit board 250, and the second sound generator 220 and the source circuit board 140 are connected through the second sound circuit board 260. Therefore, even when the sound driving circuit board 300 is provided on the lower cover 180, the control circuit board 160 is provided on the surface of the lower cover 180, and the first sound generator 210 and the second sound generator 220 are provided on the surface of the heat dissipation film 130, the sound driving circuit board 300, the control circuit board 160, and the first sound generator 210 can be easily electrically connected to each other, and the sound driving circuit board 300, the control circuit board 160, and the second sound generator 220 can also be easily electrically connected to each other.

[0212] An exemplary embodiment of a process for displaying a device will now be described. Figures 1 to 6 The elements are substantially the same elements, and the detailed reference numerals will be omitted.

[0213] Fig.26 is a flowchart illustrating an exemplary embodiment of a process of manufacturing the display device 10 .

[0214] Reference Fig.26 , the method of manufacturing the display device 10 in an exemplary embodiment may include: placing a first sound generator 210 and a source circuit board 140 on a first substrate 111 (operation S11); placing a blocking member 200 on the first substrate 111 (operation S12); connecting the first sound generator 210 and the source circuit board 140 using a first sound circuit board 250 (operation S13); placing a lower cover 180 including a cable hole CH1 on the first substrate 111 (operation S14); placing a control circuit board 160 on the lower cover 180 (operation S15); and connecting the source circuit board 140 and the control circuit board 160 using a cable 150 passing through the cable hole CH1 (operation S16).

[0215] Reference Fig.26 as well as Figures 1 to 6First, the first sound generator 210 and the source circuit board 140 are placed on the first substrate 111 (operation S11). The first sound generator 210 and the source circuit board 140 may be attached to the surface of the first substrate 111 by an adhesive member such as a double-sided adhesive.

[0216] Next, the blocking member 200 is placed on the first substrate 111 (operation S12). The blocking member 200 may also be attached to the surface of the first substrate 111 by an adhesive member.

[0217] Next, the first sound generator 210 and the source circuit board 140 are connected using the first sound circuit board 250 (operation S13). Specifically, the first sound generator 210 may be connected to the 1B-th connector 151b of the source circuit board 140 through the first sound circuit board 250. First and second pads connected to the first and second electrodes provided on the surface of the first sound generator 210 may be provided on one side of the first sound circuit board 250. A connection portion for connecting to the 1B-th connector 151b of the source circuit board 140 may be provided on the other side of the first sound circuit board 250. That is, the first sound generator 210 may be electrically connected to the source circuit board 140 through the first sound circuit board 250.

[0218] Next, the lower cover 180 including the cable hole CH1 is placed on the first substrate 111 (operation S14). The lower cover 180 may be attached to the edge of the surface of the first substrate 111 of the display panel 110 by the first adhesive member 115. The first adhesive member 115 may be a double-sided tape including a buffer layer such as foam.

[0219] Next, the control circuit board 160 is placed on the lower cover 180 (operation S15). The control circuit board 160 may be attached to the surface of the lower cover 180 by an adhesive member such as a double-sided adhesive.

[0220] Next, the source circuit board 140 and the control circuit board 160 are connected using the cable 150 passing through the cable hole CH1 (operation S16), thereby completing the operation as shown in FIG. Figures 1 to 6 Specifically, the cable 150 connected to the first connector 151a of the source circuit board 140 can be connected to the second connector 152 of the control circuit board 160 through the cable hole CH1 penetrating the lower cover 180. As described above, this can further simplify the wiring connection and ensure process economic feasibility.

[0221] An exemplary embodiment of a process for manufacturing a display device will now be described. Fig. 22 The same reference numerals are used to represent the same process as the display device 10_2. Fig. 22The elements are substantially the same elements, and the detailed reference numerals will be omitted.

[0222] Fig. 27 It shows the manufacturing Fig. 22 Flowchart of an exemplary embodiment of a process for display device 10_2.

[0223] Reference Fig. 27 , according to the manufacturing process of the exemplary embodiment shown and Fig.26 The manufacturing process of FIG. 1 is different in that the blocking member 200 is placed after the first sound generator 210 and the source circuit board 140 are connected.

[0224] The method of manufacturing the display device 10_2 according to the exemplary embodiment shown may include: placing a first sound generator 210 and a source circuit board 140 on a first substrate 111 (operation S21); connecting the first sound generator 210 and the source circuit board 140 using a first sound circuit board 250 (operation S22); placing a blocking member 200 on the first sound circuit board 250 (operation S23); placing a lower cover 180 including a cable hole CH1 on the first substrate 111 (operation S24); placing a control circuit board 160 on the lower cover 180 (operation S25); and connecting the source circuit board 140 and the control circuit board 160 using a cable 150 passing through the cable hole CH1 (operation S26).

[0225] Reference Fig. 27 and Fig. 22 First, the first sound generator 210 and the source circuit board 140 are placed on the first substrate 111 (operation S21). This operation can be similar to the above reference Fig.26 The described operation S11 is substantially the same.

[0226] Next, the first sound generator 210 and the source circuit board 140 are connected using the first sound circuit board 250 (operation S22). This operation can be similar to that described above. Fig.26 The described operation S13 is substantially the same.

[0227] Next, the blocking member 200 is placed on the first sound circuit board 250 (operation S23). The blocking member 200 may be attached to the surface of the first sound circuit board 250 by an adhesive member such as a double-sided adhesive.

[0228] Next, the lower cover 180 including the cable hole CH1 is placed on the first substrate 111 (operation S24). This operation can be similar to the above-mentioned Fig.26 The described operation S14 is substantially the same.

[0229] Next, the control circuit board 160 is placed on the lower cover 180 (operation S25). This operation can be similar to the above-mentioned Fig.26 The described operation S15 is substantially the same.

[0230] Next, the source circuit board 140 and the control circuit board 160 are connected using the cable 150 passing through the cable hole CH1 (operation S26), thereby completing the operation as shown in FIG. Fig. 22 The display device 10_2 shown in FIG.

[0231] An exemplary embodiment of a process for manufacturing a display device will now be described. Fig.24 and Fig.23 The same reference numerals are used to represent the same process as the display device 10_3. Fig.23 and Fig.24 The elements are substantially the same elements, and the detailed reference numerals will be omitted.

[0232] Fig.28 It shows the manufacturing Fig.23 and Fig.24 Flowchart of an exemplary embodiment of a process for display device 10_3.

[0233] Reference Fig.28 , according to the manufacturing process of the exemplary embodiment shown and Fig.26 The manufacturing process of FIG. 1 is different in that a partially cut-off blocking member 200 is placed on the first substrate 111 .

[0234] The method of manufacturing the display device 10_3 according to the exemplary embodiment shown may include: placing a first sound generator 210 and a source circuit board 140 on a first substrate 111 (operation S31); placing a partially cut-off blocking member 200 on the first substrate 111 (operation S32); connecting the first sound generator 210 and the source circuit board 140 using a first sound circuit board 250 (operation S33); placing a lower cover 180 including a cable hole CH1 on the first substrate 111 (operation S34); placing a control circuit board 160 on the lower cover 180 (operation S35); and connecting the source circuit board 140 and the control circuit board 160 using a cable 150 passing through the cable hole CH1 (operation S36).

[0235] Reference Fig.28 , Fig.23 and Fig.24 First, the first sound generator 210 and the source circuit board 140 are placed on the first substrate 111 (operation S31). This operation can be similar to the above reference Fig.26 The described operation S11 is substantially the same.

[0236] Next, the partially cut blocking member 200 is placed on the first substrate 111 (operation S32). The blocking member 200 may be attached to the surface of the first substrate 111 by an adhesive member such as a double-sided adhesive.

[0237] Next, the first sound generator 210 and the source circuit board 140 are connected using the first sound circuit board 250 (operation S33). This operation can be similar to the above-mentioned Fig.26 The described operation S13 is substantially the same. The blocking member 200 may be partially cut away in a region in which the first sound circuit board 250 is disposed. Therefore, the first sound circuit board 250 and the blocking member 200 may not overlap each other.

[0238] In addition, Fig.28 In the embodiment, after the blocking member 200 is placed (operation S32), the first sound generator 210 and the source circuit board 140 are connected (operation S33). However, after the first sound generator 210 and the source circuit board 140 are connected (operation S32), the blocking member 200 may also be placed so as not to overlap with the first sound circuit board 250 (operation S33).

[0239] Next, the lower cover 180 including the cable hole CH1 is placed on the first substrate 111 (operation S34). This operation can be similar to the above-mentioned Fig.26 The described operation S14 is substantially the same.

[0240] Next, the control circuit board 160 is placed on the lower cover 180 (operation S35). This operation can be similar to the above-mentioned Fig.26 The described operation S15 is substantially the same.

[0241] Next, the source circuit board 140 and the control circuit board 160 are connected using the cable 150 passing through the cable hole CH1 (operation S36), thereby completing the operation as shown in FIG. Fig.24 The display device 10_3 shown in FIG.

[0242] According to the embodiment, since the sound generator disposed on the surface of the display panel uses the display panel as a diaphragm to output sound, the sound can be output forward from the display device. Therefore, the sound quality can be improved, and the speaker disposed on the lower surface or side of the conventional display panel can be omitted.

[0243] In addition, the wiring connection structure of the sound generator, source circuit board and control circuit board is simplified to ensure process economic feasibility.

[0244] However, the effects of the exemplary embodiments are not limited to the effects set forth herein. The above and other effects of the exemplary embodiments will become more apparent to those of ordinary skill in the art to which the exemplary embodiments belong by referring to the claims.

Claims

1. A display device, comprising: The display panel comprises: a first substrate; a second substrate; and a light emitting element layer disposed between the first substrate and the second substrate and outputting light toward the second substrate; a first sound generator disposed on the first substrate and outputting a first sound by vibrating the display panel; A source circuit board, disposed on the first substrate; a first sound circuit board, connecting the first sound generator and the source circuit board; and a blocking member disposed on the first substrate, Wherein, the blocking member is disposed between the first substrate and the first sound circuit board.

2. The display device according to claim 1, further comprising a lower cover disposed on the first substrate, wherein: The lower cover includes a cable hole penetrating the lower cover. 3 . The display device according to claim 2 , further comprising a circuit board disposed on the lower cover. 4 . The display device according to claim 3 , further comprising a timing control circuit disposed on the circuit board.

5. The display device according to claim 4, further comprising a sound driving circuit board electrically connected to the circuit board, wherein: The sound driving circuit board also includes a sound driving circuit that outputs a sound signal to the first sound generator. 6 . The display device according to claim 3 , further comprising a cable passing through the cable hole and connecting the source circuit board and the circuit board.

7. The display device according to claim 2, in, The first sound generator is surrounded by the blocking member, and the blocking member does not overlap the first sound circuit board in a plan view.

8. A display device, comprising: The display panel comprises: a first substrate; a second substrate; and a light emitting element layer disposed between the first substrate and the second substrate and outputting light toward the second substrate; a first sound generator disposed on the first substrate and outputting a first sound by vibrating the display panel; A source circuit board, disposed on the first substrate; a first sound circuit board, connected to the first sound generator and the source circuit board; a lower cover, disposed on the first substrate; and a blocking member disposed on the first substrate, Wherein, the lower cover includes a cable hole penetrating the lower cover, and Wherein, the blocking member is disposed on the first substrate and the first sound circuit board.

9. A display device, comprising: The display panel comprises: a first substrate; a second substrate; and a light emitting element layer disposed between the first substrate and the second substrate and outputting light toward the second substrate; a first sound generator disposed on the first substrate and outputting a first sound by vibrating the display panel; a source circuit board, disposed on the first substrate; and a first sound circuit board, connected to the first sound generator and the source circuit board, Wherein, the first sound generator comprises: a first electrode to which a first driving voltage is applied; a second electrode to which a second driving voltage is applied; and The vibration layer is provided between the first electrode and the second electrode and has a piezoelectric element that contracts or expands according to the first driving voltage applied to the first electrode and the second driving voltage applied to the second electrode.

10. A display device, comprising: The display panel comprises: a first substrate; a packaging film; and a light emitting element layer disposed between the first substrate and the packaging film and outputting light toward the packaging film; a first sound generator disposed on the first substrate and outputting a first sound by vibrating the display panel; A source circuit board, disposed on the first substrate; a first sound circuit board, connecting the first sound generator and the source circuit board; and a blocking member disposed on the first substrate, The blocking member is disposed between the first substrate and the first sound circuit board or the blocking member is disposed on the first substrate and the first sound circuit board.

Images