A housing with built-in antenna and electronic equipment

By using ceramic composite materials in housing embedded antennas in portable electronic devices, poor antenna contact and space occupation problems are solved, communication efficiency is improved and design is simplified.

CN111668590BActive Publication Date: 2025-04-15SHENZHEN TAOTAO TECH CO LTD
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Patent Information

Application Number
CN202010444058.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-05-22
Publication Date
2025-04-15
Estimated Expiration
2040-05-22

AI Technical Summary

Technical Problem

The problem of poor antenna contact and space occupancy in portable electronic devices affects communication efficiency and the installation of internal devices.

Method used

The shell made of reinforced phase materials and matrix materials is embedded in the antenna, and the antenna is fixed and protected through the carrier part and the density enhancement part to ensure the integration of the antenna and the housing.

Benefits of technology

It improves the communication efficiency of the antenna, avoids the problem of poor antenna contact, and effectively utilizes space, simplifies the design and manufacturing of electronic devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the field of mobile communication technology, and more particularly to a housing and electronic device with an embedded antenna, wherein the housing with the embedded antenna comprises: a carrier portion, the carrier portion is made of a reinforcing phase material; a densification portion for densifying the carrier portion, the densification portion is made of a matrix material; and an antenna fixed to the carrier portion; at least one of the reinforcing phase material and the matrix material is a ceramic material. In the above manner, the present invention can transmit or receive wireless signals with less interference, attenuation or shielding, thereby improving the communication efficiency of the antenna, and can also effectively avoid the defect of poor antenna contact caused by connecting the antenna to the housing alone and the problem of occupying the space of the electronic device.
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Description

Technical Field

[0001] The present invention relates to the technical field of mobile communications, and in particular to a housing with an embedded antenna and an electronic device. Background Art

[0002] With the development of science and technology, wireless communication is increasingly used in portable electronic devices. Portable electronic devices require: first, they must be small enough and strong enough to be easy to carry; second, they must have an efficient communication system. However, reducing the size of portable electronic devices often reduces the space required to package the antenna, and may also reduce the efficiency and / or effectiveness of the antenna system.

[0003] At present, antennas are generally connected using neutral parts such as antenna shrapnel or conductive cloth. The above method will result in poor antenna contact and occupy space in portable electronic devices, which on the one hand affects the communication efficiency of the antenna system, and on the other hand affects the installation of other internal components in the portable electronic device. Summary of the invention

[0004] The present invention provides a housing with an embedded antenna and an electronic device, which can effectively solve the problem of poor antenna contact and occupied electronic device space, and realize the integration of the housing and the antenna.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a housing with an embedded antenna, comprising:

[0006] A carrier part, wherein the carrier part is made of a reinforcement phase material;

[0007] A densification part for densifying the carrier part, wherein the densification part is made of a base material; and

[0008] an antenna fixed on the carrier portion;

[0009] At least one of the reinforcement phase material and the matrix material is a ceramic material.

[0010] According to an embodiment of the present invention, the antenna is attached to the periphery of the carrier portion and / or embedded in the interior of the carrier portion.

[0011] According to an embodiment of the present invention, pores are distributed inside the carrier portion, with a porosity of 30-80%, and the matrix material is filled in the pores to form the densified portion.

[0012] According to an embodiment of the present invention, a hollow receiving portion is provided in the carrier portion, and the antenna is received in the receiving portion.

[0013] According to an embodiment of the present invention, the reinforcement phase material includes ceramic fibers, and the ceramic fibers include ceramic long fibers, ceramic short fibers, and a mixture of the ceramic long fibers and the ceramic short fibers.

[0014] According to an embodiment of the present invention, the ceramic long fibers and the ceramic short fibers are woven along two different directions to form the carrier portion.

[0015] According to one embodiment of the present invention, the carrier portion includes a first preform and a second preform alternately stacked in a height direction, the first preform is woven with the ceramic long fibers, and the second preform is woven with the ceramic short fibers, and the fiber extension directions of the ceramic long fibers and the ceramic short fibers are different.

[0016] According to one embodiment of the present invention, the component of the ceramic fiber includes at least one of aluminum oxide, silicon oxide, zirconium oxide, aluminum nitride and silicon nitride.

[0017] According to one embodiment of the present invention, the matrix material includes at least one of resin, asphalt or silicon carbide, silicon nitride, boron nitride, boron carbide, aluminum oxide, aluminum nitride, zirconium oxide, aluminum phosphate, and zirconium phosphate.

[0018] In order to solve the above technical problem, another technical solution adopted by the present invention is: to provide an electronic device, including the shell with the embedded antenna.

[0019] The beneficial effects of the present invention are as follows: the shell made of the reinforcing phase material and the matrix material has high strength, toughness and durability, and the antenna is fixed to the carrier part of the shell to realize the integration of the shell and the antenna. On the one hand, it allows the transmission or reception of wireless signals with less interference, attenuation or shielding, thereby improving the communication efficiency of the antenna. On the other hand, it can effectively avoid the defects of poor antenna contact caused by connecting the antenna to the shell alone and the problem of occupying the space of the electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a partial structural schematic diagram of a housing of an embedded antenna according to a first embodiment of the present invention;

[0021] Figure 2 is a partial structural schematic diagram of a housing of an embedded antenna according to a second embodiment of the present invention;

[0022] Figure 3 is a schematic structural diagram of an antenna according to an embodiment of the present invention;

[0023] Figure 4 is a schematic diagram of the three-dimensional structure of the housing of the embedded antenna according to the first embodiment of the present invention;

[0024] Figure 5 is a schematic diagram of the exploded structure of the housing of the embedded antenna according to the first embodiment of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The terms "first", "second" and "third" in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0028] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0029] Figure 1 FIG. 2 is a schematic diagram of a partial structure of the housing of the embedded antenna of the first embodiment of the present invention, and FIG. 3 is a schematic diagram of a partial structure of the housing of the embedded antenna of the second embodiment of the present invention. Please refer to FIG. 1 and FIG. Figure 2The shell 100 includes: a carrier part 10, a densification part 20 for densifying the carrier part 10, and an antenna 30 fixed on the carrier part 10. The carrier part 10 is made of a reinforcing phase material, and the densification part 20 is made of a matrix material. At least one of the reinforcing phase material and the matrix material is a ceramic material. Here, it can be understood that the shell 100 is made of a ceramic composite material. The shell 100 made of a ceramic composite material in this embodiment has the following advantages: first, the ceramic composite material has a high dielectric constant, the wavelength is inversely proportional to the square root of the dielectric constant, and the size of the antenna is one tenth to one quarter of the wavelength, that is, the high dielectric constant is conducive to the small size of the antenna, thereby realizing the miniaturization of electronic equipment; second, compared with a single ceramic material or metal material, the shell of the ceramic composite material can allow the transmission or reception of wireless signals with less interference, attenuation or shielding; third, compared with general plastics, the shell of the ceramic composite material has high strength, toughness and durability.

[0030] Furthermore, the antenna 30 is made of antenna material, and the antenna material includes metal material. Figure 3 The antenna 30 made of metal material can be a laminated structure, including a copper layer 31, a nickel layer 32 and a gold layer 33 stacked in sequence, the side close to the carrier part 10 is the copper layer 31, and the side away from the carrier part 10 is the nickel layer 32 and the gold layer 33 in sequence, wherein the number of layers of the gold layer 33 can be adjusted according to actual needs. Further, the thickness of the copper layer 31 is 6 to 12 μm, the thickness of the nickel layer 32 is 2 to 4 μm, and the thickness of the gold layer 33 is not less than 0.05 μm. Furthermore, the antenna 30 also includes a passivation layer 34 coated on the outer surface of the gold layer 33, and the passivation layer 34 can slow down the oxidation rate of the copper layer 31, improve the radio frequency capability of the antenna 30 and extend the service life of the antenna 30.

[0031] Furthermore, the antenna 30 of this embodiment can be located inside the housing 100, with a portion attached to the periphery of the carrier portion 10 and another portion embedded inside the carrier portion 10, such as Figure 1 , Figure 4 and Figure 5 As shown, the antenna 30 of this embodiment can also be entirely embedded in the interior of the carrier portion 10 , as shown in FIG. 2 .

[0032] Furthermore, in this embodiment, pores are distributed inside the carrier portion 10, and the porosity is 30-80%.

[0033] In one embodiment, see Figure 1 When the antenna 30 is disposed on the periphery of the carrier portion 10, the matrix material is filled in the pores and solidified to form the densified portion 20. In this embodiment, the antenna 30 is attached to the inner side of the carrier portion 10 and partially embedded in the interior of the carrier portion 10.

[0034] In another embodiment, if Figure 2 As shown, when the antenna 30 is embedded in the carrier part 10, the matrix material fills the pores and solidifies to form the densified part 20. In this embodiment, a hollow receiving part 11 is provided in the carrier part 10, and the antenna 30 is accommodated in the receiving part 11.

[0035] Further, the reinforcing phase material includes ceramic fibers, and the ceramic fibers include ceramic long fibers, ceramic short fibers, and a mixture of ceramic long fibers and ceramic short fibers. The components of the ceramic fibers include at least one of aluminum oxide, silicon oxide, zirconium oxide, aluminum nitride, and silicon nitride. The matrix material includes at least one of resin, asphalt, or silicon carbide, silicon nitride, boron nitride, boron carbide, aluminum oxide, aluminum nitride, zirconium oxide, aluminum phosphate, and zirconium phosphate.

[0036] In one embodiment, when the reinforcing phase material is ceramic short fibers, the ceramic short fibers are woven to form the carrier portion 10. In another embodiment, when the reinforcing phase material is ceramic long fibers, the ceramic long fibers are woven to form the carrier portion 10. In yet another embodiment, when the reinforcing phase material is a mixture of ceramic long fibers and ceramic short fibers, there are two ways to form the carrier portion 10. Specifically, method one: the ceramic long fibers and the ceramic short fibers are woven in two different directions on the horizontal plane to form the carrier portion 10. Method two: the first preform is woven by ceramic long fibers, and the second preform is woven by ceramic short fibers. The first preform and the second preform are alternately stacked in the height direction to form the carrier portion 10. The fiber extension directions of the ceramic long fibers and the ceramic short fibers are different. Specifically, the fiber extension direction of the ceramic long fibers of the first preform is the horizontal direction on the horizontal plane, and the fiber extension direction of the ceramic short fibers of the second preform is the longitudinal direction on the horizontal plane.

[0037] In this embodiment, the following methods can be used to densify the carrier part 10 using the base material:

[0038] Method 1: When the matrix material is at least one of silicon carbide, silicon nitride, boron nitride, boron carbide, aluminum oxide, aluminum nitride, zirconium oxide, aluminum phosphate, and zirconium phosphate, the particles of the matrix material (such as silicon carbide particles) are poured into the carrier part 10, or the carrier part 10 is immersed in a molten silicon bath to infiltrate the silicon solution into the carrier part 10. At this time, the pores and the outer surface of the carrier part 10 are formed with a densified part 20. When the matrix material is a resin or asphalt, the matrix material is immersed in the carrier part 10, heated and cured, and then cracked at high temperature to transform into ceramics.

[0039] Method 2: Place the carrier part 10 in a deposition furnace to deposit the matrix material. For example, place the carrier part 10 in a chemical vapor deposition CVD box, heat the CVD box and evacuate it, and the reaction gas enters from one end of the CVD box and is discharged from the other end. The CVD heat source enters from the outlet end of the reaction gas to ensure that the reaction gas passes through the carrier part 10, so that the matrix material adheres to the internal structure of the carrier part 10.

[0040] After the carrier part 10 is densified, the outer surface of the shell 100 may be subjected to aesthetic treatment, such as glazing.

[0041] The shell 100 with the embedded antenna 30 in the embodiment of the present invention is made of reinforced phase material and matrix material, and has high strength, toughness and durability. The antenna 30 is arranged on the periphery of the carrier part 10 in the shell 100 or embedded in the carrier part 10 to achieve the integration of the shell 100 and the antenna 30. On the one hand, it allows the transmission or reception of wireless signals with less interference, attenuation or shielding, thereby improving the communication efficiency of the antenna 30. On the other hand, it can effectively avoid the defect of poor contact of the antenna 30 when the antenna 30 is connected to the shell 100 alone and the problem of occupying the space of the electronic device.

[0042] The embodiment of the present invention further provides an electronic device, which adopts the above-mentioned housing 100. In this embodiment, see Figure 6 Taking a mobile phone as an example, the electronic device includes a housing 100, a cover 110 matched with the housing 100, and electronic parts arranged in the housing 100, wherein the electronic parts may include: a control circuit board, a control chip, a camera, a data port, a microphone, a speaker, a Bluetooth module, a Wifi module, and a fingerprint module. In other embodiments, the electronic device may also be an electronic watch, a tablet computer, a PDA, or other electronic devices including the housing 100.

[0043] The shell 100 used in the electronic device of this embodiment sets the antenna 30 on the carrier part 10, so as to integrate the antenna 30 and the shell 100. This can effectively avoid the defect of poor contact of the antenna 30 formed when the antenna 30 is connected to the shell 100 alone and the problem of occupying the space of the electronic device. The process is simple and easy to implement.

[0044] The above are only implementation modes of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A housing with an embedded antenna, characterized in that: include: A carrier part, wherein the carrier part is made of a reinforcement phase material; A densification part for densifying the carrier part, wherein the densification part is made of a base material; and an antenna fixed on the carrier portion; At least one of the reinforcement phase material and the matrix material is a ceramic material; The antenna is attached to the periphery of the carrier portion and / or embedded in the interior of the carrier portion; The carrier part has pores distributed inside, with a porosity of 30-80%, and the matrix material is filled in the pores to form the densified part; The reinforcing phase material includes ceramic fibers, and the ceramic fibers include ceramic long fibers, ceramic short fibers, and a mixture of the ceramic long fibers and the ceramic short fibers; the ceramic long fibers and the ceramic short fibers are woven in two different directions to form the carrier portion, or the carrier portion includes a first preform and a second preform alternately stacked in a height direction, the first preform is woven with the ceramic long fibers, and the second preform is woven with the ceramic short fibers, and the fiber extension directions of the ceramic long fibers and the ceramic short fibers are different; the matrix material includes resin, asphalt or silicon carbide, At least one of silicon nitride, boron nitride, boron carbide, alumina, aluminum nitride, zirconium oxide, aluminum phosphate, and zirconium phosphate; when the matrix material is at least one of silicon carbide, silicon nitride, boron nitride, boron carbide, alumina, aluminum nitride, zirconium oxide, aluminum phosphate, and zirconium phosphate, particles of the matrix material are poured into the carrier portion, or the carrier is immersed in a molten silicon bath, and the silicon solution is infiltrated into the carrier portion, and the pores and outer surface of the carrier portion are formed with the densified portion; when the matrix material is resin or asphalt, the matrix material is immersed in the carrier portion, heated and cured, and then cracked at high temperature to transform into ceramics.

2. The housing according to claim 1, characterized in that A hollow accommodating portion is arranged in the carrier portion, and the antenna is accommodated in the accommodating portion.

3. The housing according to claim 1, characterized in that The ceramic fiber comprises at least one of aluminum oxide, silicon oxide, zirconium oxide, aluminum nitride and silicon nitride.

4. An electronic device comprising a housing with an embedded antenna as claimed in any one of claims 1 to 3.

Citation Information

Patent Citations

  • Middle frame, rear cover, preparation methods of and middle frame rear cover, and electronic equipment

    CN110636158A

  • Shell with embedded antenna and electronic equipment

    CN212848786U