Color control member and display device employing the same

Abstract

A color control member and a display device employing the same are disclosed. The color control member includes a substrate including a first pixel area and a second pixel area; a first color conversion layer that converts incident light on the first color conversion layer into light of a first color, the light of the first color being emitted from the first color conversion layer and passing through the first pixel area; a second color conversion layer that converts incident light on the second color conversion layer into light of a second color, the light of the second color being emitted from the second color conversion layer and passing through the second pixel area; and a partition wall disposed between the first color conversion layer and the second color conversion layer to correspond to a light-blocking area of the substrate, wherein light emitted from the first color conversion layer or the second color conversion layer is prevented from being emitted to the other.

Description

TECHNICAL FIELD

[0001] One or more embodiments relate to a color control member and a display device employing the same, and more particularly, to a color control member capable of preventing color mixing between pixel areas of a display device and optimizing transmission of light from the pixel areas. BACKGROUND

[0002] As the demand for display devices increases, the need for display devices usable for various purposes also increases. With this trend, display devices gradually become larger and the thickness of the display devices becomes thinner with such size changes, and the display of accurate and clear colors of an image becomes more important and desirable. SUMMARY

[0003] One or more embodiments include a display device having improved color reproducibility and improved light efficiency. However, it should be understood that the embodiments described herein should be considered in a descriptive sense only and not as a limitation on the present disclosure.

[0004] According to one or more embodiments, a color control member can include a substrate including a plurality of pixel areas including a first pixel area and a second pixel area, a first color conversion layer converting incident light on the first color conversion layer into light of a first color, the light of the first color being emitted from the first color conversion layer and passing through the first pixel area, a second color conversion layer converting incident light on the second color conversion layer into light of a second color, the light of the second color being emitted from the second color conversion layer and passing through the second pixel area, and a barrier wall disposed in a light-blocking area of the substrate, between the first color conversion layer and the second color conversion layer, and defining an air gap corresponding to the light-blocking area of the substrate.

[0005] The barrier wall can further include an interface layer including a first portion and a second portion, the first portion being inclined at a predetermined angle with respect to the substrate, and the second portion being connected to the first portion and spaced apart from the substrate by a predetermined interval in a vertical direction.

[0006] The interface layer can further include a third portion disposed in the plurality of pixel areas of the substrate, and connected to the first portion, the connection being opposite to the connection of the second portion to the first portion.

[0007] The second portion of the interface layer can include a through-hole.

[0008] The barrier wall can further include a reflection layer disposed on at least one of the first portion and the second portion of the interface layer.

[0009] The second portion of the interface layer can include a first through-hole, and the reflective layer can include a second through-hole disposed to overlap the first through-hole of the interface layer.

[0010] The color control member can further include a light blocking member disposed between the substrate and the partition wall and in the air gap.

[0011] The color control member can further include a first color filter layer disposed between the substrate and the first color conversion layer and selectively transmitting light of the first color emitted from the first color conversion layer, and a second color filter layer disposed between the substrate and the second color conversion layer and selectively transmitting light of the second color emitted from the second color conversion layer.

[0012] The color control member can further include a transmission layer disposed in a third pixel area spaced apart from the first and second pixel areas and transmitting incident light on the transmission layer.

[0013] The partition wall can be disposed between the transmission layer and the first color conversion layer and between the transmission layer and the second color conversion layer.

[0014] According to one or more embodiments, a display device can include a first substrate including a plurality of pixel areas including a first pixel area and a second pixel area, a first color conversion layer converting incident light on the first color conversion layer into light of a first color, the light of the first color being emitted from the first color conversion layer and passing through the first pixel area, a second color conversion layer converting incident light on the second color conversion layer into light of a second color, the light of the second color being emitted from the second color conversion layer and passing through the second pixel area, a partition wall disposed in a light blocking area of the substrate, between the first color conversion layer and the second color conversion layer and defining an air gap located corresponding to the light blocking area of the first substrate, a second substrate facing the first substrate, and a plurality of display elements disposed on the second substrate and including first and second display elements respectively emitting incident light on the first and second color conversion layers.

[0015] The partition wall can include an interface layer including a first portion inclined by a predetermined angle with respect to the first substrate and a second portion connected to the first portion and spaced apart from the first substrate by a predetermined distance in a vertical direction.

[0016] The interface layer can further include a third portion disposed in the plurality of pixel areas of the first substrate and connected to the first portion, the connection being opposite to the connection of the second portion to the first portion.

[0017] The second portion of the interface layer can include a through-hole.

[0018] The partition wall can further include a reflection layer disposed on at least one of the first portion and the second portion of the interface layer.

[0019] The second portion of the interface layer can include a first through-hole, and the reflection layer can include a second through-hole disposed to overlap the first through-hole of the interface layer.

[0020] The display device can further include a light blocking member disposed between the first substrate and the partition wall and in the air gap.

[0021] The display device can further include a first color filter layer disposed on the first color conversion layer and selectively transmitting light of the first color emitted from the first color conversion layer, and a second color filter layer disposed on the second color conversion layer and selectively transmitting light of the second color emitted from the second color conversion layer.

[0022] According to one or more embodiments, a display device can include a substrate, first and second display elements disposed on the substrate and each emitting light, a pixel defining layer disposed on the substrate and surrounding the first and second display elements, a first color conversion layer disposed on the first display element and converting light emitted from the first display element into light of a first color, the light of the first color being emitted from the first color conversion layer, a second color conversion layer disposed on the second display element and converting light emitted from the second display element into light of a second color, the light of the second color being emitted from the second color conversion layer, and a partition wall disposed on the pixel defining layer, between the first and second color conversion layers, and defining an air gap on the pixel defining layer.

[0023] The partition wall can include an interface layer including a first portion and a second portion, the first portion being inclined by a predetermined angle with respect to the second substrate, and the second portion being connected to the first portion and spaced apart from the substrate by a predetermined distance in a vertical direction.

[0024] The interface layer can further include a third portion disposed on at least one of the first and second display elements and connected to the first portion, the connection being opposite to the connection of the second portion to the first portion.

[0025] The second portion of the interface layer can include a through-hole.

[0026] The partition wall can further include a reflection layer disposed on at least one of the first portion and the second portion of the interface layer.

[0027] The second portion of the interface layer can include a first through-hole, and the reflective layer can include a second through-hole disposed to overlap the first through-hole of the interface layer.

[0028] The display device can further include a first color filter layer disposed on the first color conversion layer and selectively transmitting light of the first color emitted from the first color conversion layer, and a second color filter layer disposed on the second color conversion layer and selectively transmitting light of the second color emitted from the second color conversion layer.

[0029] The display device can further include an encapsulation member disposed between the first and second display elements of the plurality of display elements and the first and second color conversion layers, and disposed to cover at least the first and second display elements of the plurality of display elements and the pixel definition layer, and a light blocking member disposed between the encapsulation member and the partition wall and in the air gap.

[0030] The display device can further include an encapsulation member disposed to cover the first and second color filter layers, and a light blocking member disposed on the encapsulation member and disposed to overlap the air gap. BRIEF DESCRIPTION OF DRAWINGS

[0031] These and / or other aspects will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which:

[0032] Figure 1 is a perspective view of a display device according to an embodiment;

[0033] Figure 2 is a schematic cross-sectional view of the display device according to an embodiment taken along line I-I' of Figure 1

[0034] Figure 3A is a plan view of a color control member of Figure 2 Figure 3B is a perspective view of a portion of the color control member of Figure 3A Figure 3C is a schematic cross-sectional view of the display device according to an embodiment taken along line II-II' of Figure 3B

[0035] Figure 4 is a schematic cross-sectional view of a color control member according to another embodiment taken along line I-I' of Figure 1

[0036] Figure 5A is a perspective view of a portion of the color control member of Figure 4 Figure 5B is a schematic cross-sectional view of the display device according to an embodiment taken along line II-II' of​​​​​​Figure 5A schematic cross-sectional view of the color control member taken along line III-III' of

[0037] Figure 6

[0038] Figure 7A Figure 2 Figure 7B Figure 7A

[0039] Figure 8A to Figure 8J

[0040] Figure 9

[0041] Figure 10 Figure 11 Figure 1

[0042] Figure 12A to Figure 12J

[0043] Figure 13 Figure 14 Figure 1

[0044] Figure 15A to Figure 15H DETAILED DESCRIPTION

[0045] Reference will now be made in detail to implementations, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, implementations can have different forms and should not be construed as limited to the descriptions set forth herein. Accordingly, the implementations are merely descriptive of aspects of the description and are not intended to limit the description in any way. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when preceding a list of one or more members, modify the entire list of members and do not modify the individual members of the list.

[0046] ​​​​​​​​​​​​​​​Since the present disclosure allows various changes and numerous implementations, embodiments can be illustrated in the drawings and described in detail in the written description. The effects and features of the present disclosure and methods for achieving the effects and features of the present disclosure will be apparent from the following embodiments described in detail with reference to the accompanying drawings. However, the present disclosure is not limited to the embodiments set forth herein and can be implemented in various forms.

[0047] Hereinafter, embodiments of the present disclosure are described in detail with reference to the accompanying drawings. In order to clearly describe the present disclosure, portions unrelated to the description are omitted. When described with reference to the drawings, the same reference numerals are used for the same or corresponding elements, and repetitive description thereof is omitted.

[0048] It will be understood that when a layer, region, or an element is referred to as being "formed on" another layer, region, or element, it can be "directly formed or indirectly formed on the other layer, region, or element. That is, for example, an intervening layer, region, or element can exist. The size of components in the drawings can be exaggerated for the sake of convenience in explanation. For example, the present disclosure is not limited to the configurations shown in the drawings because the size and thickness of each component shown in the drawings have been arbitrarily chosen for the convenience of description.

[0049] It will be understood that when a layer, region, or an element is referred to as being "connected" to another layer, region, or element, it can be "directly connected" to the other layer, region, or element, or can be "indirectly connected" to the other layer, region, or element with other layers, regions, or elements interposed therebetween. For example, it will be understood that when a layer, region, or element is referred to as being "electrically connected" to another layer, region, or element, it can be "directly electrically connected" to the other layer, region, or element, or can be "indirectly electrically connected" to the other layer, region, or element with other layers, regions, or elements interposed therebetween.

[0050] When a certain embodiment can be implemented differently, a certain process sequence can be performed in an order different from that described. For example, two processes described consecutively can be performed substantially simultaneously, or in an order opposite to that described.

[0051] It will be understood that, although the terms "first", "second", etc. can be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that when a certain element "includes" another element, unless otherwise indicated, the other element is not excluded, and it can further include other elements.

[0052] It will be understood that the term "in plan view" designates when the object part is viewed from above, and the term "in schematic cross-sectional view" designates when a vertical cross-section of the object part is viewed from the side. It will be understood that the term "overlapping" includes overlapping in plan view and overlapping in cross-sectional view. Furthermore, it will be understood that the term "overlapping" or "overlapped" means that a first object can be above or below or to one side of a second object, and vice versa.

[0053] Figure 1 is a perspective view of a display device 1 according to an embodiment.

[0054] Referring to Figure 1 , the display device 1 according to an embodiment can include a display area DA and a non-display area NDA. The non-display area NDA can be arranged outside the display area DA to surround the display area DA. Various wiring and driving circuit units that deliver electrical signals to the display area DA can be located in the non-display area NDA. The display device 1 can display a predetermined image by using light emitted from a plurality of pixels arranged in the display area DA. Although not shown, the display device 1 can include a bending area, which is bent, in a partial area of the non-display area NDA.

[0055] The display device 1 can include a quantum dot light emitting display. The display device 1 can be implemented as various electronic devices such as a mobile phone, a notebook computer, and a smart watch.

[0056] Figure 2 is a schematic cross-sectional view of the display device 1 taken along a line I-I' of Figure 1 . Figure 3A is a plan view of a color control member of Figure 2 , Figure 3B is a perspective view of a portion of the color control member of Figure 3A , and Figure 3C is a schematic cross-sectional view of the display device 1 taken along a line II-II' of Figure 3B .

[0057] Referring to Figure 2 , the display device 1 can include a substrate 410, an encapsulation member 300, and a color control member 100a stacked sequentially in a third direction (i.e., z direction), the encapsulation member 300 sealing the substrate 410, and the color control member 100a above the encapsulation member 300.

[0058] The substrate 110 of the color control member 100a can include a pixel area PA and a light blocking area BA corresponding to the effect of the barrier rib and / or the light blocking member discussed below. The pixel area PA emits light and can be surrounded by the light blocking area BA. The pixel area PA can be divided into a first pixel area PA1, a second pixel area PA2, and a third pixel area PA3 according to the color of the emitted light. For example, the first pixel area PA1 can be an area that emits light Lr of a first color, the second pixel area PA2 can be an area that emits light Lg of a second color, and the third pixel area PA3 is an area that emits light Lb of a third color. The light blocking area BA can be an area that does not emit light and can be disposed in a mesh configuration between the first to third pixel areas PA1, PA2, and PA3.

[0059] The pixel layer 450 can be disposed on the substrate 410. Display elements that emit light can be disposed in the pixel layer 450, the display elements corresponding to the pixel areas PA of the color control member 100a. The encapsulation member 300 can be disposed on the pixel layer 450.

[0060] The color control member 100a can be formed separately from the pixel layer 450 on the substrate 410 and then coupled to the substrate 410. The filling layer 200 can be disposed between the color control member 100a and the encapsulation member 300. The light blocking member 350 can be further disposed between the encapsulation member 300 and the filling layer 200. The light blocking member 350 can be provided to correspond to the light blocking area BA of the color control member 100a. The light blocking member 350 can have various colors including black or white. In the case where the light blocking member 350 is black, the light blocking member 350 can include a black matrix. In the case where the light blocking member 350 is white, the light blocking member 350 can include an organic insulating material such as white resin. The light blocking member 350 can include an opaque inorganic insulating material such as CrO x or MoO x or an opaque organic insulating material such as black resin.

[0061] The light blocking member 350 can prevent a portion of the light emitted from the display elements from being incident to the color conversion layer or the transmission layer of an adjacent pixel area. Accordingly, according to the embodiment, because color mixing between the pixel areas is prevented, color consistency and color reproducibility are improved and light efficiency is improved, and thus, power consumption can be reduced.

[0062] Reference Figure 3A to Figure 3CA color control member 100a is described. The color control member 100a can receive incident light Lib and emit light Lr of a first color, light Lg of a second color, light Lb of a third color. The color control member 100a can include a substrate 110, a color filter layer 120, a first color conversion layer 160a, and a second color conversion layer 160b.

[0063] The substrate 110 can include a first pixel area PA1 and a second pixel area PA2 spaced apart from each other, and a light blocking area BA between the first pixel area PA1 and the second pixel area PA2. The first color conversion layer 160a can be disposed in the first pixel area PA1 and convert the incident light Lib into light Lr of a first color. The second color conversion layer 160b can be disposed in the second pixel area PA2 and convert the incident light Lib into light Lg of a second color.

[0064] The color control member 100a can further include a transmission layer 170. The substrate 110 can further include a third pixel area PA3 spaced apart from the first pixel area PA1 and the second pixel area PA2. The transmission layer 170 can be disposed in the third pixel area PA3 and can transmit the incident light Lib.

[0065] Figure 3A The arrangement of the respective pixel areas PA1, PA2, and PA3 shown in FIGS. 1A to 1C is provided as an example, and embodiments are not limited thereto. The first to third pixel areas PA1, PA2, and PA3 can be arranged in various configurations, the first to third pixel areas PA1, PA2, and PA3 corresponding to the arrangement of pixels of the display device 1.

[0066] The light Lr of the first color can be red light, the light Lg of the second color can be green light, and the light Lb of the third color can be blue light. The red light can be light having a peak wavelength of about 580 nm or more and less than about 750 nm. The green light can be light having a peak wavelength of about 495 nm or more and less than about 580 nm. The blue light can be light having a peak wavelength of about 400 nm or more and less than about 495 nm. The incident light Lib can be light of the third color.

[0067] The substrate 110 can be a transparent substrate in which light Lr and light Lg of the first and second colors, respectively, can be emitted through the first and second pixel areas PA1 and PA2, the light Lr and the light Lg being emitted from the first and second color conversion layers 160a and 160b, respectively. The light Lb of the third color can be emitted through the third pixel area PA3 of the substrate 110.

[0068] One or more properties of the substrate 110 can not be particularly limited. For example, the substrate 110 can include an insulating material such as glass, plastic, and crystal. The substrate 110 can be selected by considering mechanical strength, thermal stability, transparency, surface flatness, handling convenience, waterproof performance, and the like.

[0069] The color filter layer 120 can include a pattern of an organic material including a dye or a pigment. The color filter layer 120 can include a first color filter layer 120a, a second color filter layer 120b, and a third color filter layer 120c. The first color filter layer 120a can be arranged at least in the first pixel area PA1, the second color filter layer 120b can be arranged at least in the second pixel area PA2, and the third color filter layer 120c can be arranged at least in the third pixel area PA3. The first color filter layer 120a can selectively transmit only light Lr of a first color, the second color filter layer 120b can selectively transmit only light Lg of a second color, and the third color filter layer 120c can selectively transmit only light Lb of a third color.

[0070] The first color conversion layer 160a, the second color conversion layer 160b, and the transmission layer 170 can each be formed in a concave space defined by the partition wall 180 by using an inkjet method.

[0071] The first color conversion layer 160a overlaps the first color filter layer 120a in the first pixel area PA1, converts incident light Lib into light Lr of a first color, and emits the light Lr toward the substrate 110. The first color conversion layer 160a can include first quantum dots that are excited by the incident light Lib and emit the light Lr of the first color having a wavelength greater than that of the incident light Lib.

[0072] The second color conversion layer 160b can overlap the second color filter layer 120b in the second pixel area PA2, convert incident light Lib into light Lg of a second color, and emit the light Lg toward the substrate 110. The second color conversion layer 160b can include second quantum dots that are excited by the incident light Lib and emit the light Lg of the second color having a wavelength greater than that of the incident light Lib.

[0073] The transmission layer 170 can overlap the third color filter layer 120c in the third pixel area PA3, transmit light Lb of a third color, and emit the light Lb toward the substrate 110.

[0074] A partition 180 may be provided at least in the light-blocking region BA. The partition 180 may surround or enclose the first color conversion layer 160a, the second color conversion layer 160b, and the transmission layer 170. The partition 180 may be disposed between the first color conversion layer 160a, the second color conversion layer 160b, and the transmission layer 170. The partition 180 may include an interface layer 130 and define an air gap AG. The air gap AG may be a cavity. The air gap AG may be covered or surrounded by the interface layer 130. The air gap AG may be formed as an inner cavity within the partition 180. The partition 180 may be defined by the interface layer 130. The partition 180 may have a trapezoidal shape in cross-sectional view. The partition 180 may gradually taper in the z-direction. The partition 180 may have a positive tapered shape in cross-sectional view, such that the width of the partition 180 decreases as it moves away from the substrate 110. For example, the partition 180 may be formed as an opposite portion of the interface layer 130 disposed between adjacent first color conversion layers 160a and second color conversion layers 160b.

[0075] Interface layer 130 can provide a support structure for forming partition 180, and can form side and top surfaces of partition 180 to define partition 180. Interface layer 130 may include a first portion 131 and a second portion 132, the first portion 131 being a side surface of partition 180 and the second portion 132 being a top surface of partition 180. The first portion 131 may have a shape tilted at a predetermined angle relative to substrate 110. The first portion 131 may have an inverted conical cross-sectional shape, the inverted conical having a width that increases away from substrate 110. The angle between the first portion 131 and substrate 110 may be less than about 90°. The first portion 131 may be disposed in light-blocking region BA, and between first color conversion layer 160a and second color conversion layer 160b, between second color conversion layer 160b and transmissive layer 170, and between transmissive layer 170 and first color conversion layer 160a. An air gap AG is formed between a pair of first portions 131 facing each other in light-blocking region BA. The second portion 132 may be disposed in the light-blocking region BA and spaced at a predetermined distance from the substrate 110 in the third direction (i.e., the z-direction). The second portion 132 may extend from the side of the first portion 131 away from the substrate 110 and may be connected to the first portion 131. The second portion 132 may include a through-hole TH.

[0076] Interface layer 130 may further include a third portion 133 disposed in pixel region PA. The third portion 133 may be disposed between color filter layer 120 and first color conversion layer 160a, between color filter layer 120 and second color conversion layer 160b, and between color filter layer 120 and transmissive layer 170. First portion 131 may connect second portion 132 to third portion 133. The first to third portions 131, 132, and 133 may extend continuously to form interface layer 130.

[0077] Interface layer 130 may include materials such as silicon nitride (SiN). x ) and / or silicon oxide (SiO) x A single inorganic layer of inorganic material.

[0078] The partition 180 may further include a reflective layer 140. The reflective layer 140 may be provided on the interface layer 130. The reflective layer 140 can prevent light from penetrating the display element 430 (e.g., ...). Figure 7B The reflected light (as shown) is incident on the color conversion layer or transmission layer of the adjacent pixel area. The reflective layer 140 can prevent the first color light Lr emitted from the first color conversion layer 160a from shining on the second color conversion layer 160b or the transmission layer 170, prevent the second color light Lg emitted from the second color conversion layer 160b from shining on the first color conversion layer 160a or the transmission layer 170, or prevent the third color light Lb emitted from the transmission layer 170 from shining on the first color conversion layer 160a or the second color conversion layer 160b.

[0079] The reflective layer 140 may include a single metal layer comprising a metal having high light reflectivity. The metal layer may include at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, alloys thereof, and compounds thereof. For example, the reflective layer 140 may include Ag. In another embodiment, the reflective layer 140 may have a multilayer structure in which multiple layers are continuously stacked. At least one of the continuously stacked layers may include a metal layer. For example, the reflective layer 140 may include continuously stacked metal oxide layers and metal layers. The metal oxide layer may include AlO₂. x CrO x MoO x TiO x AlNdO x CuMoO x MoTaO x and MoTiO x At least one of them.

[0080] The reflective layer 140 can include a first portion 141 provided on the first portion 131 of the interface layer 130 and a second portion 142 provided on the second portion 132 of the interface layer 130. That is, the first portion 141 can have a shape inclined by a predetermined angle with respect to the substrate 110. The first portion 141 can have a cross-sectional shape of an inverted cone having a width increasing away from the substrate 110. The second portion 142 can be located in the black matrix area BA and can be spaced apart from the substrate 110 by a predetermined interval in the third direction (i.e., the z direction). The second portion 142 can extend from a side of the first portion 141 away from the substrate 110 and can be connected to the first portion 141. The second portion 142 can include a through-hole TH. The through-hole TH of the reflective layer 140 can overlap the through-hole TH of the interface layer 130. The through-hole TH of the interface layer 130 and the through-hole TH of the reflective layer 140 can be provided as holes having a predetermined interval with respect to each other in the second direction (i.e., the y direction). A portion of the first portion 141 of the reflective layer 140 can extend over the third portion 133 of the interface layer 130. In another embodiment, the first portion 141 of the reflective layer 140 can not extend over the third portion 133 of the interface layer 130.

[0081] Figure 3B The barrier wall 180, the through-hole TH of the interface layer 130, and the through-hole TH of the reflective layer 140 are shown between pixel areas different from each other (e.g., pixel areas in the first direction (x direction) in Figure 3A Although not shown, the barrier wall, the interface layer, and the reflective layer between the same pixel areas (e.g., pixel areas in the second direction (i.e., the y direction) in Figure 3A may have the same configuration as the above-described barrier wall 180, interface layer 130, and reflective layer 140.

[0082] The first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170 can be formed inside the trench TC that is a concave space defined by the barrier wall 180.

[0083] The color control member 100a can further include a planarization layer 190 disposed on the first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170 and providing a planar top surface. The planarization layer 190 can be disposed above the substrate 110 so as to cover the first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170. The planarization layer 190 can be transparent so that the plurality of beams of incident light Lib is incident to the first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170. The planarization layer 190 can include a material containing, for example, silicon nitride (SiN x ) and / or silicon oxide (SiOx In another embodiment, the planarization layer 190 can include a transparent organic material such as a polyimide resin, an acrylic resin, and a resist material. The planarization layer 190 can be formed by a wet process such as a slit coating method and a spin coating method, and a dry process such as chemical vapor deposition and vacuum deposition. Other materials and formation methods can also be implemented. The planarization layer 190 can be omitted.

[0084] Figure 4 is a schematic cross-sectional view of the color control member 100a' taken along a line I-I' of Figure 1 Figure 5A is a perspective view of a portion of the color control member 100a' of Figure 4 Figure 5B is a schematic cross-sectional view of the color control member 100a' taken along a line III-III' of Figure 5A The color control member 100a' according to the embodiment shown in

[0085] differs from the color control member 100a shown in Figure 4 in that the color control member 100a' further includes a light-blocking member 150. Figure 2 Referring to

[0086] , Figure 4 , Figure 5A and Figure 5B , the color control member 100a' can further include a light-blocking member 150 inside the air gap AG. The light-blocking member 150 can be disposed in the light-blocking area BA and between the interface layer 130 and the substrate 110, i.e., between the interface layer 130 and the color filter layer 120. The light-blocking member 150 can directly contact the color filter layer 120.

[0087] When light is emitted through the light-blocking area BA, light leakage can occur in the display device 1. The light-blocking member 150 can prevent light from being emitted to the outside through the light-blocking area BA and thus prevent light leakage from occurring. The light-blocking member 150 can have various colors including black or white. In the case where the light-blocking member 150 is black, the light-blocking member 150 can include a black matrix. In the case where the light-blocking member 150 is white, the light-blocking member 150 can include an organic insulating material such as a white resin. The light-blocking member 150 can include an opaque inorganic insulating material such as CrO x or MoO x or include an opaque organic insulating material such as a black resin.

[0088] Figure 6 ​​is an enlarged schematic cross-sectional view of a first color conversion layer 160a, a second color conversion layer 160b, and a transmission layer 170 of a color control member according to an embodiment.

[0089] Referring to Figure 6 The first color conversion layer 160a can convert the blue incident light Lib into light Lr of a first color. The first color conversion layer 160a can include a first photosensitive polymer 161a in which first quantum dots 162a and first scattering particles 163a are dispersed.

[0090] The first quantum dots 162a can be excited by the blue incident light Lib, and can emit light Lr of the first color having a wavelength greater than that of the blue light in an isotropic manner. The first photosensitive polymer 161a can include an organic material having light transmission properties. The first scattering particles 163a can scatter the blue incident light Lib that is not absorbed by the first quantum dots 162a, and allow more first quantum dots 162a to be excited, thereby increasing the color conversion efficiency of the first color conversion layer 160a. The first scattering particles 163a can include, for example, titanium oxide (TiO2) or metal particles. The core of the first quantum dots 162a can include a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, a Group IV element, a Group IV compound, or a combination thereof.

[0091] The second color conversion layer 160b can convert the blue incident light Lib into light Lg of a second color. The second color conversion layer 160b can include a second photosensitive polymer 161b in which second quantum dots 162b and second scattering particles 163b are dispersed.

[0092] The second quantum dot 162b can be excited by the blue incident light Lib, and can emit light Lg of a second color having a wavelength greater than that of the blue light in an isotropic manner. The second photosensitive polymer 161b can include an organic material having light transmission properties, and include the same material as that of the first photosensitive polymer 161a. The second scattering particles 163b can scatter the blue incident light Lib not absorbed by the second quantum dot 162b, and allow more second quantum dots 162b to be excited, thereby increasing color conversion efficiency of the second color conversion layer 160b. The second scattering particles 163b can include, for example, titanium oxide (TiO2) or metal particles, and include the same material as that of the first scattering particles 163a. The core of the second quantum dot 162b can include a group II-VI compound, a group III-V compound, a group IV-VI compound, a group IV element, a group IV compound, or a combination thereof. The second quantum dot 162b can include the same material as that of the first quantum dot 162a. In this case, the size of the second quantum dot 162b can be smaller than that of the first quantum dot 162a.

[0093] The transmission layer 170 can transmit the blue incident light Lib and emit the blue incident light Lib in the direction of the substrate 110. The transmission layer 170 can include a third photosensitive polymer 171 in which third scattering particles 173 are dispersed. The third photosensitive polymer 171 can include an organic material having light transmission properties, such as silicone and epoxy, and include the same material as that of the first and second photosensitive polymers 161a and 161b. The third scattering particles 173 can scatter and emit the blue incident light Lib, and can include the same material as that of the first and second scattering particles 163a and 163b.

[0094] Group II-VI compounds can include one of the following: binary compounds including CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and mixtures thereof; ternary compounds including AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and mixtures thereof; and quaternary compounds including HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and mixtures thereof.

[0095] Group III-V compounds can include one of the following: binary compounds including GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof; ternary compounds including GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InPSb, and mixtures thereof; and quaternary compounds including GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, GaAlNP, and mixtures thereof.

[0096] Group IV-VI compounds can include one of the following: binary compounds including SnS, SnSe, SnTe, PbS, PbSe, PbTe, and mixtures thereof; ternary compounds including SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and mixtures thereof; and quaternary compounds including SnPbSSe, SnPbSeTe, SnPbSTe, and mixtures thereof. Group IV elements can include one of Si, Ge, and mixtures thereof. Group IV compounds can include binary compounds including one of SiC, SiGe, and mixtures thereof.

[0097] The di-element compound, tri-element compound, or tetra-element compound can be in a uniform concentration inside the particle, or can be divided into a state in which the concentration thereof is partially different and exists inside the same particle. In addition, the quantum dot can include a core / shell structure in which one quantum dot surrounds another quantum dot. The interface between the core and the shell can have a concentration gradient in which the concentration of the elements in the shell decreases toward the center of the interface.

[0098] In an embodiment, the quantum dot can include a core-shell structure including a core including a nanocrystal and a shell surrounding the core. The shell of the quantum dot can serve as a protective layer for maintaining a semiconductor property by preventing chemical denaturation of the core and / or as a charging layer for giving electrophoretic properties to the quantum dot. The shell can have a single layer or multiple layers. The interface between the core and the shell can have a concentration gradient in which the concentration of the elements in the shell decreases toward the center of the interface. Examples of the shell of the quantum dot can include a metal or non-metal oxide, a semiconductor compound, or a combination thereof.

[0099] For example, although the metal or non-metal oxide can include a di-element compound such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, and NiO, or a tri-element compound such as MgAl2O4, CoFe2O4, NiFe2O4, and CoMn2O4, embodiments are not limited thereto.

[0100] In addition, the semiconductor compound can include, for example, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, and AlSb, embodiments are not limited thereto.

[0101] The quantum dot can have a full width at half maximum (FWHM) of a light emission wavelength spectrum of about 45 nm or less, preferably about 40 nm or less, more preferably about 30 nm or less, and color saturation or color reproducibility can be improved in this range. In addition, because light emitted by the quantum dot is emitted in all directions, a wide viewing angle can be improved. In addition, the shape of the quantum dot can be a shape commonly used in the related art, and is not particularly limited. Specifically, as the shape of the quantum dot, a spherical quantum dot, a pyramidal quantum dot, a multi-arm quantum dot, or a cubic nanoparticle, a nanotube-shaped quantum dot, a nanowire-shaped quantum dot, a nanofiber-shaped quantum dot, and a nanoplate-shaped particle can be used. The quantum dot can adjust the color of the emitted light according to the size of the particle thereof. Accordingly, the quantum dot can have various light emission colors such as blue, red, and green.

[0102] Figure 7A is a plan view of a portion of the pixel layer of Figure 2 , and Figure 7B is a cross-sectional view of the pixel layer taken along the line IV-IV' of Figure 7A . Hereinafter, the pixel layer 450 is described with reference to Figure 7A and Figure 7B .

[0103] The pixel layer 450 on the substrate 410 can be arranged in a display area DA of the display device 1. A plurality of pixels can be arranged in the pixel layer 450 in a predetermined pattern in a first direction (x direction, row direction) and a second direction (y direction, column direction). The plurality of pixels can include a first pixel PX1, a second pixel PX2, and a third pixel PX3. The sizes or areas of the first pixel PX1, the second pixel PX2, and the third pixel PX3 can be different from each other.

[0104] Figure 7A The arrangement of the first pixel PX1, the second pixel PX2, and the third pixel PX3 shown in FIG. 10 is provided as an example, and embodiments are not limited thereto. For example, the first pixel PX1, the second pixel PX2, and the third pixel PX3 can be arranged in a zigzag form.

[0105] The substrate 410 can include a material such as a glass material, a metal material, and an organic material. For example, the substrate 410 can include a glass material containing SiO2 as a main component, or include various flexible or bendable materials, such as a resin such as reinforced plastic. Although not shown, the substrate 410 can include a bending area in a portion of the non-display area NDA, the substrate 410 being bent.

[0106] The first pixel PX1 can include a display element 430 and a first pixel circuit 420a that controls the display element 430. The second pixel PX2 can include a display element 430 and a second pixel circuit 420b that controls the display element 430. The third pixel PX3 can include a display element 430 and a third pixel circuit 420c that controls the display element 430.

[0107] The first to third pixel circuits 420a, 420b, and 420c of the first to third pixels PX1, PX2, and PX3, respectively, can be arranged in the pixel circuit layer 420. The first to third pixels PX1, PX2, and PX3 can each include a plurality of thin film transistors and at least one capacitor. In addition to the first to third pixel circuits 420a, 420b, and 420c, signal lines and power lines that transmit signals and driving power applied to the first to third pixels PX1, PX2, and PX3 can be arranged in the pixel circuit layer 420. The thin film transistors can each include a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. The semiconductor layer can include amorphous silicon or polycrystalline silicon. The semiconductor layer can include an oxide semiconductor. The semiconductor layer can include a source region, a drain region, and a channel region between the source region and the drain region. The display element 430 can be provided on the pixel circuit layer 420.

[0108] The display element 430 can include an organic light emitting diode OLED. The display element 430 can emit light of a third color, such as blue light, having an amount of light controlled by the first to third pixel circuits 420a, 420b, and 420c. The first to third pixel circuits 420a, 420b, and 420c can each be arranged in the pixel circuit layer 420 as a lower layer below the display element 430 and can partially overlap or partially not overlap with the display element 430.

[0109] The display element 430 can be arranged to correspond to the pixel area PA of the color control member 100a or 100a'. The display element 430 of the first pixel PX1 can be arranged to correspond to the first pixel area PA1 of the color control member 100a or 100a'. The display element 430 of the second pixel PX2 can be arranged to correspond to the second pixel area PA2 of the color control member 100a or 100a'. The display element 430 of the third pixel PX3 can be arranged to correspond to the third pixel area PA3 of the color control member 100a or 100a'.

[0110] At least one insulating layer can be arranged between the first to third pixel circuits 420a, 420b, and 420c and the display element 430. The display element 430 can include a pixel electrode 431, an intermediate layer 433, and a counter electrode 435.

[0111] The pixel electrode 431 can be connected to the source electrode or the drain electrode of the thin film transistor. A portion of the pixel electrode 431 can be exposed through the opening of the pixel-defining layer 437, and the edge of the pixel electrode 431 can be covered by the pixel-defining layer 437. The pixel-defining layer 437 can be disposed to correspond to the light-blocking area BA of the color control member 100a or 100a'. The pixel-defining layer 437 can surround the first to third pixels PX1, PX2, and PX3, and can be positioned between the display elements 430. That is, the areas corresponding to the pixel area PA and the light-blocking area BA of the color control member 100a or 100a' can be the pixel area and the light-blocking area of the substrate 410, respectively.

[0112] The intermediate layer 433 can be disposed on a portion of the pixel electrode 431 exposed by the pixel-defining layer 437. The intermediate layer 433 can include an organic emission layer including a low-molecular-weight organic material or a polymer organic material. The intermediate layer 433 can selectively further include functional layers such as a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0113] The counter electrode 435 can cover the intermediate layer 433 and the pixel-defining layer 437. The counter electrode 435 can include a transparent or semi-transparent electrode. For example, the counter electrode 435 can include a thin layer of a metal having a small work function. The counter electrode 435 can include a transparent conductive oxide (TCO).

[0114] The encapsulation member 300 can be disposed on the display elements 430. The encapsulation member 300 can cover the counter electrode 435, and can be disposed over the entire surface of the substrate 410. The encapsulation member 300 can include a thin film encapsulation layer. The thin film encapsulation layer can include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, the thin film encapsulation layer can have a structure in which a first inorganic encapsulation layer / organic encapsulation layer / second inorganic encapsulation layer is stacked.

[0115] Figure 8A to Figure 8J is a schematic cross-sectional view for explaining a process of manufacturing the color control member 100a' according to an embodiment. Figure 8A to Figure 8J corresponding to the color control member 100a' shown in Figure 4 is shown in cross-section.

[0116] Referring to Figure 8A , the color filter layer 120 can be disposed on the substrate 110 in which the pixel area PA and the light-blocking area BA are defined. The color filter layer 120 can include first to third color filter layers 120a, 120b, and 120c each selectively transmitting only light having a predetermined wavelength.

[0117] The color filter layer 120 can be formed by repeatedly performing a process of coating a color photoresist on the substrate 110 and then patterning the color photoresist by selectively etching the color photoresist. For example, the first color filter layer 120a can be formed by coating a first color photoresist and then etching the first color photoresist, the second color filter layer 120b can be formed by coating a second color photoresist and then etching the second color photoresist, and the third color filter layer 120c can be formed by coating a third color photoresist and then etching the third color photoresist. The order of forming the first to third color filter layers 120a, 120b, and 120c is not limited.

[0118] Referring to Figure 8B , a sacrificial pattern 115 can be formed on the color filter layer 120. The sacrificial pattern 115 can include a photosensitive organic material. For example, the sacrificial pattern 115 can be formed by coating a photosensitive organic material on the entire surface of the substrate 110 using a method such as a slit coating method and a spin coating method and then forming an opening OP through a photolithography process. The sacrificial pattern 115 can be formed in the light-blocking area BA of the substrate 110, and the color filter layer 120 in the pixel area PA can be exposed through the opening OP.

[0119] A sidewall of the sacrificial pattern 115 can be inclined. A cross-section of the sacrificial pattern 115 can have a tapered shape having a width that decreases away from the substrate 110. The opening OP can have a width that increases away from the substrate 110.

[0120] Referring to Figure 8C , a first material layer 130' and a second material layer 140' can be sequentially formed over the substrate 110, the first material layer 130' and the second material layer 140' covering the sacrificial pattern 115. The first material layer 130' can include silicon nitride (SiN x ) and / or silicon oxide (SiO x ). The second material layer 140' can include a material having a light reflecting property, for example, a metal.

[0121] Referring to Figure 8D , a portion of the second material layer 140' is removed, and a reflection layer 140 can be formed. The reflection layer 140 can be formed by coating a photosensitive organic material on the second material layer 140' and then performing a photolithography process. A portion of the first material layer 130' corresponding to the pixel area PA can be exposed through the reflection layer 140. A through-hole TH can be formed in the reflection layer 140, the through-hole TH exposing a portion of the first material layer 130' on the sacrificial pattern 115. A portion of the second material layer 140' can be removed by wet etching or dry etching.

[0122] Referring to Figure 8EA portion of the first material layer 130' can be removed, and an interface layer 130 including the through holes TH can be formed. A portion of the first material layer 130' exposed by the through holes TH of the reflective layer 140 can be removed by using the reflective layer 140 as a mask. The through holes TH of the interface layer 130 can be aligned with the through holes TH of the reflective layer 140.

[0123] The sacrificial pattern 115 can be exposed to the outside through the through holes TH of the interface layer 130 and the reflective layer 140. The sacrificial pattern 115 can be removed through the through holes TH of the interface layer 130 and the reflective layer 140. The interface layer 130 and the color filter layer 120 can form a space defined by surfaces of the interface layer 130 and the color filter layer 120. The space can be the air gap AG of the barrier rib 180.

[0124] The photosensitive pattern of the photosensitive organic material on the reflective layer 140, and the sacrificial pattern 115 can be sequentially removed. The photosensitive pattern and the sacrificial pattern 115 can be removed by a lift-off method.

[0125] The interface layer 130 and the reflective layer 140 can be provided inside the opening OP. The interface layer 130 can cover the bottom surface and the side surface of the opening OP, and the reflective layer 140 can cover the side surface of the opening OP. Accordingly, a trench TC corresponding to the pixel area PA can be formed, the trench TC being defined by the interface layer 130 and the reflective layer 140. As Figure 8E shown in

[0126] Although it is shown in Figure 8E that the interface layer 130 includes the third portion 133 corresponding to the pixel area PA, in another embodiment, as shown in Figure 8F , the third portion 133 of the interface layer 130 corresponding to the pixel area PA can be removed, and thus the interface layer 130 and the reflective layer 140 can have the same pattern. In the structure shown in Figure 8F , the interface layer 130 exposing the color filter layer 120 and including the through holes TH can be formed by removing a portion of the first material layer 130' using the reflective layer 140 as a mask.

[0127] Referring to Figure 8G , a light-blocking material layer 150' can be formed over the substrate 110. The light-blocking material layer 150' can fill the air gap AG through the through holes TH of the interface layer 130 and the reflective layer 140, and can cover the reflective layer 140 and the trench TC. The light-blocking material layer 150' can include a material that is dissolved in a developing solution used during a subsequent developing process.

[0128] Referring to Figure 8HThe light-blocking member 150 can be formed in the light-blocking area BA by leaving only a portion of the light-blocking material layer 150' inside the air gap AG and removing the remaining portion of the light-blocking material layer 150'. Because the material of the light-blocking material layer 150' is provided through the through-hole TH of the interface layer 130 and the reflective layer 140, the light-blocking material layer 150' outside the barrier rib 180 can be removed, and a portion of the light-blocking material layer 150' inside the air gap AG can be left. The embodiment can selectively remove a portion of the light-blocking material layer 150' by using a developing solution without using a photolithography process using a mask. The light-blocking member 150 can have a thickness in the range of about 0.5 μm to about 0.7 μm.

[0129] In another embodiment, a photosensitive organic material is coated on the light-blocking material layer 150', and then only the light-blocking material layer 150' outside the barrier rib 180 can be removed by performing a photolithography process. Because the light-blocking material layer 150' inside the air gap AG is not removed and can be left, the light-blocking member 150 can fill a large portion of the air gap AG, and a predetermined space can be formed so that a liquid droplet can be allowed to overflow into the through-hole TH while the liquid droplet can be coated inside the trench TC, in order to form the first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170.

[0130] The light-blocking member 150 can be disposed between the color filter layer 120 and the barrier rib 180. As shown in Figure 2 When the color control member 100a not including the light-blocking member 150 is manufactured, the processes of Figure 8G and Figure 8H may be omitted.

[0131] Referring to Figure 8I and a description of a conventional inkjet coating process thereof, the first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170 can be formed to overlap the trench TC. The first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170 can be formed by an inkjet coating method. The liquid droplet coated inside the trench TC by the inkjet coating method can be coated to a height T or higher of the barrier rib 180. Accordingly, in a conventional process, such a liquid droplet can overflow to a pixel area representing other colors, and thus color mixing can occur. In contrast, according to the embodiment, because the liquid droplet overflowing to the upper portion of the barrier rib 180 can flow into the air gap AG through the through-hole TH of the interface layer 130 and the reflective layer 140, the liquid droplet can not flow to an adjacent trench TC. Accordingly, color mixing occurring when the liquid droplet overflows to a pixel area representing other colors can be prevented. As shown in Figure 8J The liquid droplet inside the trench TC can be dried and formed to a height substantially the same as a height T' from a top surface of the color filter layer 120 to a top surface of the reflective layer 140.

[0132] The first color conversion layer 160a, the second color conversion layer 160b, and the transmission layer 170 can be formed at predetermined positions according to a predetermined order. Since the first color conversion layer 160a, the second color conversion layer 160b, and the transmission layer 170 can be formed by an inkjet coating method, an optical process is not required. Accordingly, manufacturing costs can be reduced in the case of using the inkjet coating method.

[0133] Referring to Figure 8J , a planarization layer 190 can be further formed above the substrate 110. The planarization layer 190 can be formed on the first color conversion layer 160a, the second color conversion layer 160b, the transmission layer 170, and the reflection layer 140. The planarization layer 190 can include an organic material having a high viscosity, such that the planarization layer 190 can not flow into the air gap AG through the through hole TH.

[0134] As Figure 9 shown, the color control member 100a' can be coupled above the encapsulation member 300 on which the light blocking member 350 is disposed. A filling layer 200 can be formed between the color control member 100a' and the encapsulation member 300. The filling layer 200 can include, for example, at least one of a light-cured epoxy-based material and an acrylate-based material, and embodiments are not limited thereto. Figure 9 is a schematic cross-sectional view according to an embodiment of the color control member 100a' coupled between the color control member 100a' and a bottom substrate 410.

[0135] Figure 10 and Figure 11 is a schematic cross-sectional view of a display device taken along line I-I' of Figure 1 according to another embodiment. Figure 10 and Figure 11 Embodiments of Figure 2 and Figure 4 differ from embodiments of

[0136] Referring to Figure 10 , the display device 1 can include a substrate 410, an encapsulation member 300, and a color control member 100b on the encapsulation member 300, which are sequentially stacked in a third direction (i.e., a z direction). The encapsulation member 300 can seal a surface of the substrate 410.

[0137] A pixel layer 450 can be disposed on the substrate 410. As Figure 7A and Figure 7BAs shown, pixels can be arranged in a predetermined pattern in pixel layer 450. Each pixel can correspond to a pixel region PA of color control member 100b. Pixels can include a first pixel PX1, a second pixel PX2, and a third pixel PX3. Encapsulation member 300 can be disposed above the first pixel PX1, the second pixel PX2, and the third pixel PX3. Encapsulation member 300 can cover the first pixel PX1, the second pixel PX2, and the third pixel PX3, and can be disposed above the entire surface of substrate 410. Encapsulation member 300 can include a thin-film encapsulation layer. Color control member 100b can be disposed on encapsulation member 300.

[0138] The color control component 100b can receive incident light Lib from the first pixel PX1, the second pixel PX2, and the third pixel PX3, and can emit light of the first color Lr, light of the second color Lg, and light of the third color Lb. The incident light Lib may include light of the third color Lb.

[0139] like Figure 3A As shown, the color control component 100b can be divided into a pixel region PA and a light-blocking region BA. The pixel region PA can be further divided into a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3.

[0140] The color control component 100b may include a first color conversion layer 160a, a second color conversion layer 160b, and a transmissive layer 170. The first color conversion layer 160a may be disposed in a first pixel region PA1, converting incident light Lib into light Lr of a first color and emitting light Lr toward the color filter layer 120. The second color conversion layer 160b may be disposed in a second pixel region PA2, converting incident light Lib into light Lg of a second color and emitting light Lg toward the color filter layer 120. The transmissive layer 170 may be disposed in a third pixel region PA3, transmitting light Lb of a third color and emitting light Lb toward the color filter layer 120.

[0141] like Figure 3B and Figure 3C As shown, a partition 180 may be disposed between the first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170. The partition 180 may be provided at least in the light-blocking region BA and may include an air gap AG. The air gap AG may be surrounded by the interface layer 130 and may be the inner cavity of the partition 180. The interface layer 130 may provide a support structure for forming the partition 180 and may form side and top surfaces of the partition 180 to define the partition 180. The air gap AG may be an empty space formed by the encapsulation member 300 and the interface layer 130.

[0142] The interface layer 130 can include a first portion 131 that is a side surface of the partition wall 180 and a second portion 132 that is a top surface of the partition wall 180. The first portion 131 can be disposed in the light-blocking area BA and between the first color conversion layer 160a and the second color conversion layer 160b, between the second color conversion layer 160b and the transmission layer 170, and between the transmission layer 170 and the first color conversion layer 160a. The second portion 132 can be disposed in the light-blocking area BA and spaced apart from the substrate 410 by a predetermined interval in a third direction (i.e., a z direction). The second portion 132 can extend from a side of the first portion 131 that is distal from the substrate 410 and can be connected to the first portion 131. The second portion 132 can include a through-hole TH.

[0143] The interface layer 130 can further include a third portion 133 arranged in the pixel area PA. The third portion 133 can be disposed between the encapsulation member 300 and the first color conversion layer 160a, between the encapsulation member 300 and the second color conversion layer 160b, and between the encapsulation member 300 and the transmission layer 170. The first portion 131 can connect the second portion 132 to the third portion 133. The first to third portions 131, 132, and 133 can continuously extend to constitute the interface layer 130.

[0144] The reflective layer 140 can further be provided on the interface layer 130. The reflective layer 140 can include a first portion 141 provided on the first portion 131 of the interface layer 130 and a second portion 142 provided on the second portion 132 of the interface layer 130. The second portion 142 can extend from a side of the first portion 141 that is distal from the substrate 410 and can be connected to the first portion 141. The second portion 142 can include a through-hole TH. The through-hole TH of the reflective layer 140 can overlap the through-hole TH of the interface layer 130. The through-hole TH of the interface layer 130 and the through-hole TH of the reflective layer 140 can be provided as holes having a predetermined interval with respect to each other in a second direction (i.e., a y direction). A portion of the first portion 141 of the reflective layer 140 can extend on the third portion 133 of the interface layer 130. In another embodiment, the first portion 141 of the reflective layer 140 can not extend on the third portion 133 of the interface layer 130.

[0145] The color control member 100b can further include a first color filter layer 120a on the first color conversion layer 160a, a second color filter layer 120b on the second color conversion layer 160b, and a third color filter layer 120c on the transmission layer 170. The color control member 100b can further include a planarization layer 190 arranged on the color filter layers 120.

[0146] In another embodiment, as shown in Figure 11 The color control member 100b' can further include a light blocking member 150 inside the air gap AG. The light blocking member 150 can be disposed in the light blocking area BA and between the barrier wall 180 and the encapsulation member 300. The light blocking member 150 can directly contact the encapsulation member 300.

[0147] Figure 12A to Figure 12J is a schematic cross-sectional view for explaining a process of manufacturing a color control member according to an embodiment. Figure 12A to Figure 12J is a schematic cross-sectional view for explaining a process of manufacturing Figure 11 a color control member shown in

[0148] Referring to Figure 12A , a sacrificial pattern 115 can be formed on the encapsulation member 300. The sacrificial pattern 115 can include a photosensitive organic material. For example, the sacrificial pattern 115 can be formed by coating a photosensitive organic material on the entire surface of the encapsulation member 300 using a method such as a slit coating method and a spin coating method and then forming an opening OP through a photolithography process. The sacrificial pattern 115 can be formed in the light blocking area BA, and the encapsulation member 300 in the pixel area PA can be exposed through the opening OP.

[0149] The sidewall of the sacrificial pattern 115 can be inclined. When viewed in a cross-section, the shape of the sacrificial pattern 115 can have a taper shape having a width that decreases away from the encapsulation member 300. The width of the opening OP can increase away from the encapsulation member 300.

[0150] A pixel layer 450 can be arranged between the substrate 410 and the encapsulation member 300. The first pixel PX1, the second pixel PX2, and the third pixel PX3 can be arranged in the pixel layer 450. The first to third pixel circuits 420a, 420b, and 420c of the first, second, and third pixels PX1, PX2, and PX3, respectively, can be arranged in a pixel circuit layer 420. A display element 430 can be provided on the pixel circuit layer 420. The display element 430 can include an organic light emitting diode OLED. The display element 430 can emit light of a third color, for example, blue light, having an amount of light controlled by the first to third pixel circuits 420a, 420b, and 420c. The first to third pixel circuits 420a, 420b, and 420c can each partially overlap or partially not overlap with the display element 430.

[0151] The display element 430 can be arranged to correspond to the pixel area PA of the color control member 100b'. The display element 430 can include a pixel electrode 431, an intermediate layer 433, and a counter electrode 435. A portion of the pixel electrode 431 can be exposed through an opening of a pixel defining layer 437, and an edge of the pixel electrode 431 can be covered by the pixel defining layer 437. The pixel defining layer 437 can be arranged to correspond to the light blocking area BA of the color control member 100b'. The encapsulation member 300 can be arranged on the display element 430. The encapsulation member 300 can include a thin film encapsulation layer.

[0152] Referring to Figure 12B The first material layer 130' and the second material layer 140' can be sequentially formed on the encapsulation member 300. The first material layer 130' and the second material layer 140' can cover the sacrificial pattern 115.

[0153] Referring to Figure 12C A portion of the second material layer 140' can be removed, and a reflective layer 140 can be formed. The reflective layer 140 can expose the first material layer 130' in the pixel area PA. A through-hole TH can be formed in the reflective layer 140. The through-hole TH can expose a portion of the first material layer 130' on the sacrificial pattern 115.

[0154] Referring to Figure 12D A portion of the first material layer 130' can be removed, and an interface layer 130 including the through-hole TH can be formed. A portion of the first material layer 130' exposed by the through-hole TH of the reflective layer 140 can be removed by using the reflective layer 140 as a mask. The through-hole TH of the interface layer 130 can be aligned with the through-hole TH of the reflective layer 140.

[0155] The sacrificial pattern 115 can be exposed to the outside through the through-holes TH of the interface layer 130 and the reflective layer 140. The sacrificial pattern 115 can be removed through the through-holes TH of the interface layer 130 and the reflective layer 140. The interface layer 130 and the encapsulation member 300 can form a space defined by a surface of the interface layer 130 and the encapsulation member 300. The space can be the air gap AG of the barrier rib 180.

[0156] The photosensitive pattern of the photosensitive organic material on the reflective layer 140, and the sacrificial pattern 115 can be sequentially removed. The photosensitive pattern and the sacrificial pattern 115 can be removed by a lift-off method.

[0157] The interface layer 130 and the reflective layer 140 can be provided inside the opening OP, the interface layer 130 covering a bottom surface and a side surface of the opening OP, and the reflective layer 140 covering the side surface of the opening OP. Accordingly, a trench TC corresponding to the pixel area PA can be formed, the trench TC being defined by the interface layer 130 and the reflective layer 140. As Figure 12DAs shown in FIG. 1A, the trench TC can have an increased width away from the substrate 410.

[0158] In another embodiment, as Figure 12E shown in FIG. 1A, a third portion 133 of the interface layer 130 corresponding to the pixel area PA can be removed, and thus the interface layer 130 and the reflective layer 140 can have the same pattern. In Figure 12C the structure shown in FIG. 1A, the interface layer 130 can expose the encapsulation member 300 through the via TH, and can be formed by removing a portion of the first material layer 130' using the reflective layer 140 as a mask.

[0159] Referring to Figure 12F , a light-blocking material layer 150' can be formed over the substrate 410. The light-blocking material layer 150' can fill the air gap AG through the via TH of the interface layer 130 and the reflective layer 140, and can cover the reflective layer 140 and the trench TC.

[0160] Referring to Figure 12G , the light-blocking member 150 can be formed in the light-blocking area BA by leaving only a portion of the light-blocking material layer 150' in the air gap AG and removing the remaining portion of the light-blocking material layer 150'. Because the material of the light-blocking material layer 150' can be provided through the via TH of the interface layer 130 and the reflective layer 140, the light-blocking material layer 150' outside the barrier rib 180 can be removed, and a portion of the light-blocking material layer 150' inside the air gap AG can remain.

[0161] The light-blocking member 150 can be disposed between the encapsulation member 300 and the barrier rib 180. As Figure 10 shown in FIG. 1A, when the color control member 100b not including the light-blocking member 150 is manufactured, the processes of Figure 12F and Figure 12G may be omitted.

[0162] Referring to Figure 12H , a first color conversion layer 160a, a second color conversion layer 160b, and a transmissive layer 170 each burying the trench TC can be formed. The first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170 can be formed by an inkjet coating method. Because the droplets can flow over the upper portion of the barrier rib 180 due to the inkjet coating method and can flow into the air gap AG through the via TH, the droplets can not flow to the adjacent trench TC. As Figure 12I shown in FIG. 1A, the droplets inside the trench TC can be dried and formed to a substantially same level as the top surface of the reflective layer 140.

[0163] Referring to Figure 12IA first color filter layer 120a on the first color conversion layer 160a, a second color filter layer 120b on the second color conversion layer 160b, and a third color filter layer 120c on the transmission layer 170 can be further formed. The color filter layers 120 can be formed by repeatedly performing a process of coating a color photoresist on the substrate 410 and then patterning the color photoresist by selectively etching the color photoresist.

[0164] Referring to Figure 12J , a planarization layer 190 can be further formed on the color filter layers 120.

[0165] Figure 13 and Figure 14 is a schematic cross-sectional view of a display device according to another embodiment taken along line I-I' of Figure 1 . Figure 13 and Figure 14 The embodiments of Figure 2 and Figure 4 differ from the embodiments of

[0166] Referring to Figure 13 , the display device 1 can include the substrate 410, the color control member 100c, and the encapsulation member 300 on the color control member 100c, which are sequentially stacked in a third direction (i.e., z direction).

[0167] The pixel layer 450 can be disposed on the substrate 410. As shown in Figure 7A and Figure 7B , the pixels can be disposed in the pixel layer 450 in a predetermined pattern and can correspond to the pixel areas PA of the color control member 100c. The pixels can include a first pixel PX1, a second pixel PX2, and a third pixel PX3. The color control member 100c can be disposed on the pixel layer 450.

[0168] The color control member 100c can receive incident light Lib from the first pixel PX1, the second pixel PX2, and the third pixel PX3 and can emit light Lr of a first color, light Lg of a second color, and light Lb of a third color. The incident light Lib can include the light Lb of the third color.

[0169] As shown in Figure 3A , the color control member 100c can be divided into the pixel areas PA and a light-blocking area BA. The pixel areas PA can be divided into a first pixel area PA1, a second pixel area PA2, and a third pixel area PA3.

[0170] The color control member 100c can include a first color conversion layer 160a, a second color conversion layer 160b, and a transmission layer 170. The first color conversion layer 160a can be disposed in the first pixel area PA1, convert the incident light Lib into light Lr of a first color, and emit the light Lr toward the color filter layer 120. The second color conversion layer 160b can be disposed in the second pixel area PA2, convert the incident light Lib into light Lg of a second color, and emit the light Lg toward the color filter layer 120. The transmission layer 170 can be disposed in the third pixel area PA3, transmit light Lb of a third color, and emit the light Lb toward the color filter layer 120.

[0171] As shown in FIGS. 1A and 1B, the color control member 100c can include a first color conversion layer 160a, a second color conversion layer 160b, and a transmission layer 170. The first color conversion layer 160a can be disposed in the first pixel area PA1, convert the incident light Lib into light Lr of a first color, and emit the light Lr toward the color filter layer 120. The second color conversion layer 160b can be disposed in the second pixel area PA2, convert the incident light Lib into light Lg of a second color, and emit the light Lg toward the color filter layer 120. The transmission layer 170 can be disposed in the third pixel area PA3, transmit light Lb of a third color, and emit the light Lb toward the color filter layer 120. Figure 3B and Figure 3C As shown in FIGS. 1A and 1B, the color control member 100c can include a first color conversion layer 160a, a second color conversion layer 160b, and a transmission layer 170. The first color conversion layer 160a can be disposed in the first pixel area PA1, convert the incident light Lib into light Lr of a first color, and emit the light Lr toward the color filter layer 120. The second color conversion layer 160b can be disposed in the second pixel area PA2, convert the incident light Lib into light Lg of a second color, and emit the light Lg toward the color filter layer 120. The transmission layer 170 can be disposed in the third pixel area PA3, transmit light Lb of a third color, and emit the light Lb toward the color filter layer 120. Figure 15D ) and the interface layer 130. The air gap AG can be surrounded by the interface layer 130 and can be an inner cavity of the barrier wall 180. The interface layer 130 can provide a support structure for forming the barrier wall 180, and can form a side surface and a top surface of the barrier wall 180 to define the barrier wall 180. The air gap AG can be an empty space formed by the counter electrode 435 (see FIG. 1A) and the interface layer 130.

[0172] The interface layer 130 can include a first portion 131 that is a side surface of the barrier wall 180 and a second portion 132 that is a top surface of the barrier wall 180. The first portion 131 can be disposed in the light-blocking area BA and between the first color conversion layer 160a and the second color conversion layer 160b, between the second color conversion layer 160b and the transmission layer 170, and between the transmission layer 170 and the first color conversion layer 160a. The second portion 132 can be located in the light-blocking area BA and spaced apart from the pixel layer 450 by a predetermined gap in the third direction (z direction). The second portion 132 can extend from a side of the first portion 131 distal from the substrate 410 and can be connected to the first portion 131. The second portion 132 can include a through-hole TH.

[0173] The reflective layer 140 can be further provided on the interface layer 130. The interface layer 130 can have the same pattern as that of the reflective layer 140. The reflective layer 140 can include a first portion 141 provided on the first portion 131 of the interface layer 130 and a second portion 142 provided on the second portion 132 of the interface layer 130. The second portion 142 can include a through-hole TH. The through-hole TH of the reflective layer 140 can overlap the through-hole TH of the interface layer 130. The through-hole TH of the interface layer 130 and the through-hole TH of the reflective layer 140 can be provided as holes having a predetermined pitch therebetween in the second direction (i.e., y direction).

[0174] A portion of the first portion 131 of the interface layer 130 and a portion of the first portion 141 of the reflective layer 140 can extend on the counter electrode 435, and thus the extended portion of the interface layer 130 can directly contact the counter electrode 435. In another embodiment, the first portion 131 of the interface layer 130 and the first portion 141 of the reflective layer 140 can not extend on the counter electrode 435.

[0175] The color control member 100c can further include a first color filter layer 120a on the first color conversion layer 160a, a second color filter layer 120b on the second color conversion layer 160b, and a third color filter layer 120c on the transmission layer 170.

[0176] The color control member 100c can further include a planarization layer 190 disposed on the color filter layer 120. The encapsulation member 300 can be disposed on the planarization layer 190. The encapsulation member 300 can cover the color control member 100c and can be disposed on the entire surface of the substrate 410. The encapsulation member 300 can include a thin film encapsulation layer. In another embodiment, the planarization layer 190 can be omitted, and the encapsulation member 300 can be directly disposed on the color filter layer 120.

[0177] In another embodiment, as shown in Figure 14 The color control member 100c' can further include a light-blocking member 350 on the encapsulation member 300. The light-blocking member 350 can be located in the light-blocking area BA. The light-blocking member 350 can directly contact the encapsulation member 300.

[0178] Figure 15A to Figure 15H is a cross-sectional view for explaining a process of manufacturing a color control member according to an embodiment. Figure 15A to Figure 15H is a schematic cross-sectional view for explaining a process of manufacturing Figure 14 a color control member shown in

[0179] Referring to Figure 15AThe sacrificial pattern 115 can be formed over the pixel-defining layer 437 over the substrate 410. The sacrificial pattern 115 can include a photosensitive organic material. For example, the sacrificial pattern 115 can be formed by coating a photosensitive organic material over the entire surface of the counter electrode 435 using a method such as a slit coating method and a spin coating method and then forming an opening OP by a photolithography process. The sacrificial pattern 115 can be formed in the light-blocking area BA, and an upper portion of the display element 430 (i.e., the counter electrode 435) can be exposed through the opening OP.

[0180] The side wall of the sacrificial pattern 115 can be inclined. When viewed in a cross section, the sacrificial pattern 115 can have a tapered shape, and can have a width that decreases away from the pixel-defining layer 437. The width of the opening OP can increase away from the pixel-defining layer 437.

[0181] The first to third pixels PX1, PX2, and PX3 can be arranged in the pixel layer 450. The first to third pixel circuits 420a, 420b, and 420c of the first to third pixels PX1, PX2, and PX3, respectively, can be arranged in the pixel circuit layer 420. The display element 430 can be provided on the pixel circuit layer 420. The display element 430 can include an organic light-emitting diode OLED. The display element 430 can emit light of a third color, such as blue light, having an amount of light controlled by the first to third pixel circuits 420a, 420b, and 420c. The first to third pixel circuits 420a, 420b, and 420c can each partially overlap or partially not overlap with the display element 430.

[0182] The display element 430 can be arranged to correspond to the pixel area PA of the color control member 100c'. The display element 430 can include a pixel electrode 431, an intermediate layer 433, and a counter electrode 435. A portion of the pixel electrode 431 can be exposed through an opening of the pixel-defining layer 437, and an edge of the pixel electrode 431 can be covered by the pixel-defining layer 437. The pixel-defining layer 437 can be arranged to correspond to the light-blocking area BA of the color control member 100c'.

[0183] Reference Figure 15B The first material layer 130' and the second material layer 140' can be sequentially formed on the counter electrode 435. The first material layer 130' and the second material layer 140' can cover the sacrificial pattern 115.

[0184] Reference Figure 15CA portion of the second material layer 140' can be removed, and a reflective layer 140 can be formed. The reflective layer 140 can expose the first material layer 130' in the pixel area PA. The through hole TH can be formed in the reflective layer 140. The through hole TH can expose a portion of the first material layer 130' on the sacrificial pattern 115.

[0185] Referring to Figure 15D A portion of the first material layer 130' can be removed, and an interface layer 130 including the through hole TH can be formed. The interface layer 130 can expose the counter electrode 435 in the pixel area PA. The interface layer 130 can be formed by removing a portion of the first material layer 130' using the reflective layer 140 as a mask. The through hole TH of the interface layer 130 can be aligned with the through hole TH of the reflective layer 140.

[0186] The sacrificial pattern 115 can be exposed to the outside through the through holes TH of the interface layer 130 and the reflective layer 140. The sacrificial pattern 115 can be removed through the through holes TH of the interface layer 130 and the reflective layer 140. The interface layer 130 and the counter electrode 435 can form a space defined by surfaces of the interface layer 130 and the counter electrode 435. The space can be the air gap AG of the barrier rib 180.

[0187] Because the interface layer 130 and the reflective layer 140 are formed, an opening OP2 exposing an upper portion of the display element 430, i.e., an upper portion of the counter electrode 435, in the pixel area PA can be formed. As shown in Figure 15D The width of the opening OP2 can increase away from the substrate 410.

[0188] Referring to Figure 15E The first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170 each burying the opening OP2 can be formed. The first color conversion layer 160a, the second color conversion layer 160b, and the transmissive layer 170 can be formed by an inkjet coating method. In this case, because a droplet overflowing to an upper portion of the barrier rib 180 due to the inkjet coating method can flow into the air gap AG through the through hole TH, the droplet can not flow to an adjacent opening OP2. As shown in Figure 15F The droplet inside the opening OP2 can be dried and formed to substantially the same level as a top surface of the reflective layer 140.

[0189] Referring to Figure 15FA first color filter layer 120a on the first color conversion layer 160a, a second color filter layer 120b on the second color conversion layer 160b, and a third color filter layer 120c on the transmissive layer 170 can be further formed. The color filter layers 120 can be formed by repeatedly performing a process of coating a color photoresist on the substrate 410 and then patterning the color photoresist by selectively etching the color photoresist.

[0190] Referring to Figure 15G A planarization layer 190 can be further formed on the color filter layers 120.

[0191] Referring to Figure 15H An encapsulation member 300 can be disposed on the planarization layer 190. The encapsulation member 300 can cover the color control member 100c', and can be disposed on the entire surface of the substrate 410. The encapsulation member 300 can include a thin film encapsulation layer.

[0192] A light-blocking member 350 can be provided on the encapsulation member 300. The light-blocking member 350 can be formed in a light-blocking area BA by forming a light-blocking material layer on the encapsulation member 300, then leaving only a portion of the light-blocking material layer and removing the remaining portion of the light-blocking material layer.

[0193] When the partition wall includes an organic material, a high-temperature process for hardening the organic material is required. The display device according to the embodiments includes a partition wall that defines an air gap as a cavity of the partition wall. The air gap of the partition wall is located between the color conversion layer and the transmissive layer of the color control member. Thus, since a high-temperature process such as a process of hardening the organic material can be omitted due to the use of the partition wall and its air gap, damage to layers (e.g., color filter layers, display elements, etc.) under the color control member due to such a high-temperature process can be prevented.

[0194] The display device according to the embodiments includes a through-hole in the interface layer that bounds the partition wall. Thus, the partition wall can block inflow of color conversion material that overflows from an adjacent pixel area, thereby preventing color mixing between adjacent pixel areas. In addition, since the reflective layer is provided with the interface layer in a direction of light transmission, escape of light and mixing of colors of light in the direction of light transmission can be prevented.

[0195] According to various embodiments, since color mixing between adjacent pixels is prevented by the partition wall between adjacent color conversion layers, color uniformity, color reproducibility, and efficiency of light emitted from the display device can be increased.

[0196] It is to be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as being applicable to other similar features or aspects in other embodiments.

[0197] While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope as defined by the following claims.

Claims

1. A color control component, comprising: A substrate comprising multiple pixel regions, wherein the multiple pixel regions include a first pixel region and a second pixel region; A first color conversion layer converts incident light on the first color conversion layer into light of a first color, the first color light being emitted from the first color conversion layer and passing through the first pixel region; A second color conversion layer converts incident light on the second color conversion layer into light of a second color, the second color light being emitted from the second color conversion layer and passing through the second pixel region; A partition wall is disposed in the light-blocking region of the substrate, between the first color conversion layer and the second color conversion layer, and defines an air gap corresponding to the light-blocking region of the substrate. as well as A light-blocking component is disposed between the substrate and the partition wall and within the air gap. The partition wall includes an interface layer comprising a first portion and a second portion, the first portion being tilted at a predetermined angle relative to the substrate, and the second portion being connected to the first portion and spaced at a predetermined distance from the substrate in the vertical direction. The light-blocking component is configured to correspond to the second part of the interface layer.

2. The color control component according to claim 1, wherein, The interface layer further includes a third portion disposed in the plurality of pixel regions of the substrate and connected to the first portion, the connection being opposite to the connection from the second portion to the first portion.

3. The color control component according to claim 1, wherein, The second portion of the interface layer includes through-holes.

4. The color control component according to claim 1, wherein, The partition further includes a reflective layer disposed on at least one of the first portion and the second portion of the interface layer.

5. The color control component according to claim 4, wherein, The second portion of the interface layer includes a first through-hole, and The reflective layer includes a second through-hole configured to overlap with the first through-hole of the interface layer.

6. The color control component according to claim 1, further comprising: A first color filter layer is disposed between the substrate and the first color conversion layer, and selectively transmits light of the first color emitted from the first color conversion layer; as well as A second color filter layer is disposed between the substrate and the second color conversion layer, and selectively transmits light of the second color emitted from the second color conversion layer.

7. The color control component according to claim 1, further comprising: A transmissive layer is disposed in a third pixel region separated from the first pixel region and the second pixel region, and transmits incident light through the transmissive layer.

8. The color control component according to claim 7, wherein, The partition is disposed between the transmissive layer and the first color conversion layer, and between the transmissive layer and the second color conversion layer.

9. A display device, comprising: A first substrate comprising multiple pixel regions, wherein the multiple pixel regions include a first pixel region and a second pixel region; A first color conversion layer converts incident light on the first color conversion layer into light of a first color, the first color light being emitted from the first color conversion layer and passing through the first pixel region; A second color conversion layer converts incident light on the second color conversion layer into light of a second color, the second color light being emitted from the second color conversion layer and passing through the second pixel region; A partition wall is disposed in the light-blocking region of the substrate, between the first color conversion layer and the second color conversion layer, and defines an air gap corresponding to the light-blocking region of the first substrate. A light-blocking component is disposed between the first substrate and the partition wall and within the air gap; A second substrate facing the first substrate; as well as A plurality of display elements are disposed on the second substrate, and include a first display element and a second display element that emit the incident light on the first color conversion layer and the second color conversion layer, respectively. The partition wall includes an interface layer comprising a first portion and a second portion. The first portion is tilted at a predetermined angle relative to the first substrate, and the second portion is connected to the first portion and spaced at a predetermined distance from the first substrate in the vertical direction. The light-blocking component is configured to correspond to the second part of the interface layer.

10. The display device according to claim 9, wherein, The interface layer further includes a third portion disposed in the plurality of pixel regions of the first substrate and connected to the first portion, the connection being opposite to the connection from the second portion to the first portion.

11. The display device according to claim 9, wherein, The second portion of the interface layer includes through-holes.

12. The display device according to claim 9, wherein, The partition further includes a reflective layer disposed on at least one of the first portion and the second portion of the interface layer.

13. The display device according to claim 12, wherein, The second portion of the interface layer includes a first through-hole, and The reflective layer includes a second through-hole configured to overlap with the first through-hole of the interface layer.

14. The display device according to claim 9, further comprising: A first color filter layer is disposed on the first color conversion layer and selectively transmits light of the first color emitted from the first color conversion layer; as well as A second color filter layer is disposed on the second color conversion layer and selectively transmits light of the second color emitted from the second color conversion layer.

15. A display device, comprising: substrate; A first display element and a second display element, each emitting light, are disposed on the substrate; A pixel defining layer disposed on the substrate and surrounding the first display element and the second display element; A first color conversion layer is disposed on the first display element and converts light emitted from the first display element into light of a first color, the first color light being emitted from the first color conversion layer; A second color conversion layer is disposed on the second display element and converts light emitted from the second display element into light of a second color, the second color light being emitted from the second color conversion layer; A partition is disposed on the pixel defining layer, between the first color conversion layer and the second color conversion layer, and defines an air gap located on the pixel defining layer; as well as A light-blocking component is disposed between the substrate and the partition wall and within the air gap. The partition wall includes an interface layer comprising a first portion and a second portion, the first portion being tilted at a predetermined angle relative to the substrate, and the second portion being connected to the first portion and spaced at a predetermined distance from the substrate in the vertical direction. The light-blocking component is configured to correspond to the second part of the interface layer.

16. The display device according to claim 15, wherein, The interface layer further includes a third portion disposed on at least one of the first display element and the second display element, and connected to the first portion, the connection being opposite to the connection from the second portion to the first portion.

17. The display device according to claim 15, wherein, The second portion of the interface layer includes through-holes.

18. The display device according to claim 15, wherein, The partition further includes a reflective layer disposed on at least one of the first portion and the second portion of the interface layer.

19. The display device according to claim 18, wherein, The second portion of the interface layer includes a first through-hole, and The reflective layer includes a second through-hole configured to overlap with the first through-hole of the interface layer.

20. The display device according to claim 15, further comprising: A first color filter layer is disposed on the first color conversion layer and selectively transmits light of the first color emitted from the first color conversion layer; as well as A second color filter layer is disposed on the second color conversion layer and selectively transmits light of the second color emitted from the second color conversion layer.

21. The display device according to claim 20, further comprising: An encapsulation component is disposed between the first and second display elements and the first and second color conversion layers among a plurality of display elements, and is configured to at least cover the first and second display elements and the pixel defining layer among the plurality of display elements. The light-blocking component is disposed between the encapsulation component and the partition wall.

22. A display device, comprising: substrate; A first display element and a second display element, each emitting light, are disposed on the substrate; A pixel defining layer disposed on the substrate and surrounding the first display element and the second display element; A first color conversion layer is disposed on the first display element and converts light emitted from the first display element into light of a first color, the first color light being emitted from the first color conversion layer; A second color conversion layer is disposed on the second display element and converts light emitted from the second display element into light of a second color, the second color light being emitted from the second color conversion layer; A partition is disposed on the pixel defining layer, between the first color conversion layer and the second color conversion layer, and defines an air gap located on the pixel defining layer; A first color filter layer is disposed on the first color conversion layer and selectively transmits light of the first color emitted from the first color conversion layer; A second color filter layer is disposed on the second color conversion layer and selectively transmits light of the second color emitted from the second color conversion layer; An encapsulation component configured to cover the first color filter layer and the second color filter layer; as well as A light-blocking member disposed on the encapsulation member and configured to overlap with the air gap. The partition wall includes an interface layer comprising a first portion and a second portion, the first portion being tilted at a predetermined angle relative to the substrate, and the second portion being connected to the first portion and spaced at a predetermined distance from the substrate in the vertical direction. The light-blocking component is configured to correspond to the second part of the interface layer.

Images