A tube adapter, liquid cold plate heat sink, and computing device

By designing pipe adapters and flow channel structures in the liquid cooling plate heat sink, the problem of performance imbalance caused by chip temperature differences was solved, achieving balanced stability of chip operating frequency and ultimate improvement in device performance.

CN112066114BActive Publication Date: 2026-06-26SHENZHEN MICROBT ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN MICROBT ELECTRONICS TECH CO LTD
Filing Date
2020-09-14
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In existing technologies, temperature differences between chips in different voltage layers of electronic computing devices lead to performance imbalances, affecting the overall performance improvement.

Method used

By using pipe fittings and liquid cooling plate heat sinks, the cross-section of the coolant channel is smoothly transitioned through the design of the transition section, ensuring uniform coolant flow rate, thereby making the chip temperature consistent within the same voltage layer. The coolant channel structure design also makes the chip operating frequency balanced and stable.

Benefits of technology

This achieves consistent chip temperature within the same voltage level, improves the balanced stability of the operating frequency of each chip, and maximizes the overall performance of the electronic computing device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a pipe fitting adapter liquid cooling plate radiator and a computing device. The pipe fitting adapter comprises a first connecting part, a transition part and a second connecting part. The shape of the inner hole section of the first connecting part matches the shape of the opening of the flow channel. The second connecting part matches the pipe fitting. The transition part is between the first connecting part and the second connecting part. In the transition part, the inner hole section of the transition part smoothly transitions from the inner hole section shape of the second connecting part to the inner hole section shape of the first connecting part from the junction with the second connecting part to the junction with the first connecting part. The pipe fitting adapter of the application is used between the flow channel openings with different cross-sectional shapes and the pipe fittings, so that the cooling liquid therein can keep the flow rate uniform in the transition part along with the smooth transition of the transition part, and the uniform cooling effect of the cooling liquid entering the cooling liquid flow channel is realized.
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Citation Information

Patent Citations

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