Ultrasonic sensing equipment

Abstract

An ultrasonic sensor device includes a housing and at least one sensor device. The housing includes a base and a protrusion connected to the base, one side of the base has a first sensor port facing a first direction, and one side of the protrusion has a second sensor port facing a second direction. Each sensor device includes a plate, a piezoelectric component, an outer shell and a plurality of fixings. The plate is disposed in the housing and covers the first or second sensor port. The piezoelectric component includes a packaging body arranged on the plate and a piezoelectric sheet covered by the packaging body, and the piezoelectric sheet has a sensing surface exposed to the packaging body and away from the plate. The outer shell includes a bottom wall exposed to the first or second sensor port, a top wall disposed on the plate, and a surrounding side wall connected between the bottom wall and the top wall and surrounding the packaging body. A plurality of fixings are used to fix the plate to the top wall of the outer shell.

Description

Technical Field

[0001] The invention relates to a sensing device, in particular to a multi-purpose ultrasonic sensing device. Background Art

[0002] Diesel engines need to be equipped with a selective catalytic reduction (SCR) system to reduce the emission of toxic nitrogen-hydrogen compounds (NOx). The catalytic reduction system adds urea to diesel to neutralize the toxic nitrogen-hydrogen compounds, converting them into water and nitrogen. When the urea concentration in diesel is not enough, the diesel engine may emit too much nitrogen-hydrogen compounds.

[0003] Urea used in diesel engines is mixed with water and stored in a storage tank adjacent to the diesel engine. Usually, a plurality of ultrasonic sensing devices are arranged next to the storage tank to sense the urea concentration or liquid level of the fluid in the storage tank.

[0004] The conventional ultrasonic sensor device mainly includes a housing and a piezoelectric sheet placed in the housing. In order to make the piezoelectric sheet fit the sensing surface of the housing, a packaging colloid must be poured into the housing after the piezoelectric sheet is placed in the housing.

[0005] However, when the piezoelectric chip is damaged, the packaging colloid adheres to the inside of the shell, so that the entire ultrasonic sensor device is scrapped.

[0006] Especially when two piezoelectric sheets with different purposes are encapsulated in the shell of the ultrasonic equipment, the two piezoelectric sheets must be filled with glue separately, and the process is very complicated. When only one of the piezoelectric sheets is damaged, the ultrasonic equipment can only be scrapped as a whole because it cannot be replaced, resulting in a waste of materials. Summary of the invention

[0007] The invention provides an ultrasonic sensor device, which is convenient for disassembling and replacing the sensor device and saving material cost.

[0008] The ultrasonic sensing device provided by the present invention includes a housing and at least one sensing device. The housing includes a base and a protrusion connected to the base, one side of the base has a first sensing port facing a first direction, and one side of the protrusion has a second sensing port facing a second direction. Each sensing device is arranged in the base or the protrusion of the housing and includes a plate body, a piezoelectric component, an outer shell cover and a plurality of fixing parts. The plate body is arranged in the housing and covers the first sensing port and the second sensing port. The piezoelectric component includes a packaging body and a piezoelectric sheet at least partly covered by the packaging body, the packaging body is arranged on the plate body, and the piezoelectric sheet has a sensing surface exposed to the packaging body and away from the plate body. The outer shell cover includes a top wall, a bottom wall and a surrounding side wall connected between the bottom wall and the top wall and surrounding the packaging body, the top wall is arranged on the plate body, and at least the bottom wall of the outer shell cover is exposed to the first sensing port or the second sensing port. A plurality of fixing members are used to fix the plate body to the top wall of the outer shell cover, so that the plate body applies pressure to the packaging body of the piezoelectric component, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.

[0009] In one embodiment of the present invention, the number of the at least one sensor device is two, and respective outer shell covers of the two sensor devices are exposed at the first sensor port and the second sensor port respectively.

[0010] In an embodiment of the present invention, the first direction is perpendicular to the second direction.

[0011] In one embodiment of the present invention, the accommodating shell further includes a plate portion connected to the base on which a reflector is arranged opposite to the second sensing port. When at least one sensing device is arranged in the protrusion, the reflector is used to reflect the vibration signal of the piezoelectric sheet of the at least one sensing device.

[0012] In one embodiment of the present invention, a waveguide is further included which is connected to the first sensing port of the base and extends away from the base along a first direction. When at least one sensing device is disposed in the base, the waveguide is used to concentrate the vibration signal of the piezoelectric piece of the at least one sensing device.

[0013] In one embodiment of the present invention, a wire tube connected to the protrusion is further included, each sensor device includes at least one circuit, and the wire tube is used to guide the at least one circuit to the outside of the accommodating shell.

[0014] In one embodiment of the present invention, the plate is in a bent shape or a flat plate shape.

[0015] In one embodiment of the present invention, the board body is a circuit board.

[0016] In one embodiment of the present invention, the piezoelectric component further includes a positive guide pin having one end connected to the piezoelectric sheet and a negative guide pin having one end connected to the piezoelectric sheet, the positive guide pin and the negative guide pin pass through the packaging body, and the plate body has two openings for the positive guide pin and the negative guide pin to pass through.

[0017] In one embodiment of the present invention, the package body is adhered to the surrounding sidewalls.

[0018] In one embodiment of the present invention, the package body has a surrounding shape conforming to the surrounding sidewall.

[0019] In one embodiment of the present invention, the piezoelectric component further includes a matching layer or a conductive layer disposed on the sensing surface of the piezoelectric sheet and corresponding to the vibration energy of the piezoelectric sheet.

[0020] In an embodiment of the present invention, each fixing member is a screw, the plate body has a plurality of through holes, and the top wall has a plurality of screw holes.

[0021] In one embodiment of the present invention, the package body includes a matching layer and / or an absorption layer corresponding to the vibration energy of the piezoelectric piece.

[0022] The ultrasonic sensor device of the embodiment of the present invention can install the same sensor device at different positions of the housing to perform different sensing tasks, and when any sensor device fails, it can be replaced separately without wasting the entire set and causing waste of materials. In addition, the piezoelectric component in the sensor device has been pre-integrated with the outer shell, the plate body and other components into a module, so even if the sensor device is installed at different positions of the housing in different placement directions, it can be combined with the housing in the same way.

[0023] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A FIG. 1 is a schematic diagram of an explosion of an ultrasonic sensor device according to an embodiment of the present invention.

[0025] Figure 1B for Figure 1A Schematic diagram of the explosion of the sensor device.

[0026] Figure 1C for Figure 1A Schematic diagram of a cross-section of the sensor device.

[0027] Figure 1D FIG. 4 is a schematic diagram of a plate according to another embodiment of the present invention.

[0028] FIG. 2A to FIG. 2D FIG. 4 is a schematic diagram of a manufacturing method of a sensor device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0029] Figure 1Ais an exploded schematic diagram of an ultrasonic sensor device according to an embodiment of the present invention, Figure 1B for Figure 1A An exploded schematic diagram of the sensor device 100 in FIG. Figure 1C for Figure 1A Please refer to the cross-sectional diagram of the sensor device 100 in FIG. Figures 1A to 1C The ultrasonic sensor device 10 of this embodiment includes a housing 101 and at least one sensor device 100 .

[0030] The housing 101 includes a base 102 and a protrusion 103 connected to the base 102. One side of the base 102 has a first sensing port 104 facing the first direction F1, and one side of the protrusion 103 has a second sensing port 105 facing the second direction F2. Each sensor device 100 is disposed in the base 102 or the protrusion 103 of the housing 101 and includes a plate 130, a piezoelectric component 120, an outer cover 110, and a plurality of fixing members 140. The plate 130 is disposed in the housing 101 and covers the first sensing port 104 or the second sensing port 105. The piezoelectric component 120 includes a package 121 and a piezoelectric sheet 122 at least partially covered by the package 121. The package 121 is disposed on the plate 130. The piezoelectric sheet 122 has a sensing surface 1221 exposed from the package 121 and away from the plate 130.

[0031] The outer shell 110 includes a top wall 111, a bottom wall 112, and a surrounding side wall 113 connected between the bottom wall 112 and the top wall 111 and surrounding the package body 121. The top wall 111 is disposed on the plate body 130. At least the bottom wall 112 of the outer shell 110 is exposed to the first sensing port 104 or the second sensing port 105, so as to sense the liquid when the housing 101 is placed in the liquid. In this embodiment, the bottom wall 112 and the surrounding side wall 113 of the outer shell 110 of the sensor device 100 protrude from the first sensing port 104 or the second sensing port 105. A plurality of fixing members 140 are used to fix the plate body 130 to the top wall 111 of the outer shell 110, so that the plate body 130 applies pressure to the package body 121 of the piezoelectric component 120, thereby pressing the sensing surface 1221 of the piezoelectric sheet 122 to the bottom wall 112.

[0032] In this embodiment, there are two sensor devices 100, and the housings 110 of the two sensor devices 100 are exposed at the first sensor port 104 and the second sensor port 105, respectively, but the present invention is not limited thereto. In other embodiments, the sensor device 100 may be disposed only in the base 102 or the protrusion 103.

[0033] In this embodiment, the first direction F1 is perpendicular to the second direction F2, that is, the protrusion 103 is perpendicularly connected to the base 102, but the present invention is not limited thereto. In other embodiments, the protrusion 103 may also be connected to the base 102 at other angles.

[0034] In this embodiment, the accommodating shell 101 further includes a plate portion 106 connected to the base 102, and a reflective sheet 107 may be provided on the plate portion 106 and is relatively arranged at the second sensing port 105. When a sensing device 100 is provided in the protrusion 103, the reflective sheet 107 can be used to reflect the vibration signal of the piezoelectric sheet 122 of the sensing device 100 to sense the concentration of the liquid.

[0035] In this embodiment, a waveguide 108 is further included which is connected to the first sensing port 104 of the base 101 and extends away from the base 101 along the first direction F1. When the sensing device 100 is provided in the base 101, the waveguide 108 can be used to concentrate the vibration signal of the piezoelectric piece 122 of the sensing device 100 to sense the liquid level.

[0036] In this embodiment, a wire tube 109 connected to the protrusion 103 is further included to accommodate at least one circuit 5 connected to the sensor device 100 .

[0037] In this embodiment, the board 130 may include a board of a single material or a board of a composite material. In this embodiment, the board 130 may be a circuit board, for example, the board 130 may be provided with a connector 133 to electrically connect to the piezoelectric sheet 122 or to an external device (not shown). Figure 1A The boards 130 of the two sensor devices 100 can both be circuit boards, or one of the boards 130 can be a circuit board. The two sensor devices 100 are connected by a wire (not shown), and then the signal is transmitted to an external analysis device (not shown) through the line 5.

[0038] In this embodiment, the plate body 130 is in the shape of a flat plate, but is not limited thereto. Figure 1D The plate 130a is shown as a bent plate. One side of the plate 130a has a concave portion 134, and the other side has a corresponding convex portion 135. For example, when the package body 121 protrudes from the opening 1110 of the top wall 111, it can abut against the concave portion 134. For another example, when the package body 121 is recessed in the opening 1110 of the top wall 111, it can abut against the convex portion 135.

[0039] In this embodiment, the package body 121 of the piezoelectric component 120 and the piezoelectric sheet 122 have been pre-combined in a mold, so the manufacturing method of the sensor device 100 of this embodiment is as follows: a. Provide a housing cover 110. b. Provide a piezoelectric component 120. c. Place the piezoelectric component 120 on the bottom wall 111 of the housing cover 110. d. Cover the plate body 130 on the top wall 111. e. Fix the plate body 130 to the top wall 111 through the fixing member 140.

[0040] In this embodiment, the package body 121 of the piezoelectric component 120 has a surrounding shape conforming to the surrounding sidewall 113, for example Figure 1B The package body 121 and the surrounding sidewall 113 may also be in other conformal shapes, such as polygons. The package body 121 may include a matching layer and / or an absorption layer corresponding to the vibration energy of the piezoelectric piece, and the material may include epoxy, silicon oxide (SiOx) or other colloids.

[0041] In this embodiment, the piezoelectric component 120 further includes an adhesive layer 125 disposed on the sensing surface 1221 of the piezoelectric sheet 122 , which may be a matching layer or a conductive layer corresponding to the vibration energy of the piezoelectric sheet 122 .

[0042] In this embodiment, the piezoelectric component 120 further includes a positive electrode guide pin 123 connected to the piezoelectric sheet 122 at one end and a negative electrode guide pin 124 connected to the piezoelectric sheet 122 at one end, the positive electrode guide pin 123 and the negative electrode guide pin 124 pass through the package body 121, and the plate body 130 has an opening 134 and an opening 135 for the positive electrode guide pin 123 and the negative electrode guide pin 124 to pass through respectively. The positive electrode guide pin 123 and the negative electrode guide pin 124 can be connected to an external power supply device (not shown).

[0043] In this embodiment, each fixing member 140 is a screw, and the plate 130 has a plurality of through holes 136, and the top wall 111 of the outer shell 110 has a plurality of screw holes 1111. By locking these fixing members 140 to the screw holes 1111, the plate 130 is fixed to the top wall 111 and pressure is applied to the package body 121. The number of fixing members 140 is at least three to balance the downward pressure of the plate 130, but it is not limited thereto. In other embodiments, the fixing members 140 may also be, for example, clamps or fasteners.

[0044] In this embodiment, the material of the outer shell 110 may be metal such as stainless steel, aluminum alloy or other alloys, but is not limited thereto. The material of the outer shell 110 may also be insulating plastic, such as polyamide (PA), polyethylene (PE) or polypropylene (PP).

[0045] The ultrasonic sensor device 10 of this embodiment can install the same sensor device 100 at different positions of the housing 101 to perform different sensing tasks, and when any sensor device 100 fails, it can be replaced separately without the whole set being scrapped and causing waste of materials. In addition, the piezoelectric component 120 in the sensor device 100 has been pre-integrated with the outer shell 110, the plate 130 and other components into a module, even if the sensor device 100 is installed at different positions of the housing 101 in different placement directions, it can be combined with the housing 101 in the same way.

[0046] FIG. 2A to FIG. 2D FIG. 1 is a schematic diagram of a manufacturing method of a sensor device according to another embodiment of the present invention. The manufacturing method of the sensor device 100a of this embodiment is as follows.

[0047] First, please refer to Figure 2A 1, and cover the bottom wall 112 of the housing cover 110 with a glue layer 125, and then insert the piezoelectric piece 122 into the housing cover 110 through the opening 1110 of the top wall 111 and place it on the bottom wall 111. The glue layer 125 can provide preliminary positioning for the piezoelectric piece 122.

[0048] Please refer to Figure 2B , a liquid colloid 121a is poured into the opening 1110 to cover the piezoelectric sheet 122. The colloid 121a may be Figure 2A The state of the package body 121 before curing.

[0049] Please refer to Figure 2C , provide Figure 1A The plate 130 is provided and covers the top wall 111 of the housing cover 110. The plate 130 can be installed before or after the colloid 121a is cured as required.

[0050] Please refer to Figure 2D The plate 130 is fixed to the top wall 111 by the fixing member 140, so that the plate 130 applies pressure to the colloid 121a, thereby pressing the sensing surface 1221 of the piezoelectric sheet 122 downward to the bottom wall 112.

[0051] When the colloid 121a solidifies into Figure 1A After the packaging body 121 is formed, the sensor device 100a of this embodiment is completed.

[0052] The sensor device 100a of this embodiment is Figure 2A The sensor device 100 is substantially the same as the sensor device 100 of the present embodiment, except that the package body 121 of the present embodiment is cured in the outer shell 110, so the package body 121 is adhered to the side wall 113 of the outer shell 110.

[0053] The ultrasonic sensor device of the embodiment of the present invention can install the same sensor device at different positions of the housing to perform different sensing tasks, and when any sensor device fails, it can be replaced separately without wasting the entire set and causing waste of materials. In addition, the piezoelectric component in the sensor device has been pre-integrated with the outer shell, the plate body and other components into a module, so even if the sensor device is installed at different positions of the housing in different placement directions, it can be combined with the housing in the same way.

[0054] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An ultrasonic sensor device, characterized in that: include: A housing, comprising a base and a protrusion connected to the base, wherein one side of the base has a first sensing port facing a first direction, and one side of the protrusion has a second sensing port facing a second direction; and At least one sensor device, each of the at least one sensor device is disposed in the base or the protrusion of the accommodating shell and includes: A plate body, disposed in the accommodating shell and covering the first sensing port or the second sensing port; A piezoelectric component includes a package and a piezoelectric sheet at least a portion of which is covered by the package, wherein the package is disposed on the plate, and the piezoelectric sheet has a sensing surface exposed from the package and away from the plate; an outer shell, comprising a top wall, a bottom wall, and a surrounding side wall connected between the bottom wall and the top wall and surrounding the package body, the top wall having an opening opposite to the bottom wall at a location connected to the surrounding side wall, and the top wall being disposed on the plate body so that at least the bottom wall of the outer shell is exposed to the first sensing port or the second sensing port; and A plurality of fixing members are used to fix the plate body to the top wall of the outer shell, so that the plate body applies pressure to the packaging body of the piezoelectric component, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.

2. The ultrasonic sensor device according to claim 1, characterized in that The at least one sensor device has two components, and the outer shells of the two sensor devices are respectively exposed at the first sensor port and the second sensor port.

3. The ultrasonic sensor device according to claim 1, characterized in that The first direction is perpendicular to the second direction.

4. The ultrasonic sensor device according to claim 1, characterized in that The accommodating shell further includes a plate portion connected to the base, on which a reflective sheet arranged opposite to the second sensing port is arranged. When the at least one sensing device is arranged in the convex portion, the reflective sheet is used to reflect the vibration signal of the piezoelectric sheet of the at least one sensing device.

5. The ultrasonic sensor device according to claim 1, characterized in that The ultrasonic sensor device further includes a waveguide connected to the first sensing port of the base and extending along the first direction away from the base. When the at least one sensing device is disposed in the base, the waveguide is used to concentrate the vibration signal of the piezoelectric piece of the at least one sensing device.

6. The ultrasonic sensor device according to claim 1 or 5, characterized in that: The ultrasonic sensor device further includes a wire tube connected to the protrusion, each of the at least one sensor device includes at least one circuit, and the wire tube is used to guide the at least one circuit to the outside of the accommodating shell.

7. The ultrasonic sensor device according to claim 1, characterized in that The plate body is in a bent shape or a flat plate shape.

8. The ultrasonic sensor device according to claim 1, characterized in that The board body is a circuit board.

9. The ultrasonic sensor device according to claim 1, characterized in that: The piezoelectric component further includes a positive guide pin with one end connected to the piezoelectric sheet and a negative guide pin with one end connected to the piezoelectric sheet. The positive guide pin and the negative guide pin pass through the packaging body, and the plate body has two openings for the positive guide pin and the negative guide pin to pass through.

10. The ultrasonic sensor device according to claim 1, characterized in that The package body is adhered to the surrounding side wall.

11. The ultrasonic sensor device according to claim 1, characterized in that: The package body has a surrounding shape conforming to the surrounding sidewall.

12. The ultrasonic sensor device according to claim 1, characterized in that The piezoelectric component further includes a matching layer or a conductive layer disposed on the sensing surface of the piezoelectric sheet and corresponding to the vibration energy of the piezoelectric sheet.

13. The ultrasonic sensor device according to claim 1, characterized in that Each of the fixing members is a screw, the plate body has a plurality of through holes, and the top wall has a plurality of screw holes.

14. The ultrasonic sensor device according to claim 1, characterized in that The package body includes a matching layer and / or an absorption layer corresponding to the vibration energy of the piezoelectric piece.

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