Display device

Abstract

A display device is disclosed. The display device includes: a substrate including an island portion and connecting portions extending from the island portion in different directions from each other; a display unit located on the island portion, the display unit including at least one display element; and an encapsulation layer covering at least one display element and including an inorganic encapsulation layer and an organic encapsulation layer. Wherein, the display unit includes: at least one organic insulating layer; and an inorganic insulating layer located on the at least one organic insulating layer, the inorganic insulating layer having a tip that protrudes beyond a side surface of the at least one organic insulating layer in a direction parallel to an upper surface of the substrate, and the inorganic encapsulation layer is juxtaposed with the tip of the inorganic insulating layer.

Description

[0001] This application claims the priority and benefit of Korean Patent Application No. 10-2019-0074116, filed on Jun. 21, 2019, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to a display device and a structure for the display device that encapsulates display elements included therein to prevent introduction of impurities and maintains optimal resolution of the display device even when the display device may undergo a change in its shape. Background Art

[0003] As display devices for visually displaying electrical signals have evolved, various devices among such devices having excellent characteristics such as reduced thickness, low weight, and low power consumption have been introduced. Flexible display devices that can be bent or curled have become the focus of research and development, as have stretchable display devices. Summary of the Invention

[0004] In the case of a display device whose shape can be changed, the resolution may deteriorate due to the change in shape. One or more embodiments may include aspects in which the display device can be capable of achieving high resolution according to the changed shape. However, the disclosure may not be limited to these and other aspects.

[0005] Additional aspects will be partially set forth in the following description, will become apparent from the description, or may be learned by practice of the disclosed embodiments.

[0006] According to one or more embodiments, a display device includes: a substrate including an island portion and connection portions extending from the island portion in different directions from each other; a display unit disposed on the island portion, the display unit including at least one display element; and an encapsulation layer covering the at least one display element and including an inorganic encapsulation layer and an organic encapsulation layer, wherein the display unit includes: at least one organic insulating layer; and an inorganic insulating layer disposed on the at least one organic insulating layer, the inorganic insulating layer having a tip that protrudes beyond a side surface of the at least one organic insulating layer in a direction parallel to an upper surface of the substrate, and the inorganic encapsulation layer may be juxtaposed with the tip of the inorganic insulating layer.

[0007] The inorganic encapsulation layer may be juxtaposed with a bottom surface of the tip of the inorganic insulating layer.

[0008] A portion of the inorganic encapsulation layer may extend from the bottom surface of the tip and may cover a side surface of the at least one organic insulating layer and a side surface of the substrate.

[0009] At least one display element may include a first display element that emits red light, a second display element that emits blue light, and a third display element that emits green light. According to the plan view, the tip of the inorganic insulating layer may be located around the first display element, the second display element, and the third display element.

[0010] At least one display element may include: a pixel electrode located on the inorganic insulating layer; a pixel defining layer located on the pixel electrode, the pixel defining layer having an opening that overlaps with the pixel electrode; an intermediate layer having an emission layer that overlaps with the pixel electrode; and a counter electrode located on the intermediate layer.

[0011] The counter electrode may cover the island portion.

[0012] The intermediate layer may include at least one functional layer located between the pixel electrode and the counter electrode.

[0013] The area where the tips of the inorganic encapsulation layer and the inorganic insulating layer are side by side with each other may be an inorganic contact area, and the inorganic contact area is located around at least one display element.

[0014] The display device may further include a spacer located on the island portion, wherein a part of the inorganic contact area is located between the spacer and at least one display element.

[0015] In the plan view, the inorganic insulating layer may have a second tip that protrudes beyond the side surface of at least one organic insulating layer. The inorganic encapsulation layer may be side by side with the second tip of the inorganic insulating layer, and the area where the second tips of the inorganic encapsulation layer and the inorganic insulating layer are side by side with each other may be a second inorganic contact area. The second inorganic contact area may be separated from the inorganic contact area and is located around the spacer.

[0016] The display device may further include a power supply voltage line located on the island portion, wherein the contact portion between the counter electrode and the power supply voltage line may be located inside the area inside the inorganic contact area.

[0017] The power supply voltage line may extend from the island portion to at least one of the connection portions.

[0018] The display device may further include a second inorganic insulating layer located between the island portion and at least one connection portion, wherein the second inorganic insulating layer covers a part of the upper surface of the power supply voltage line, and the second inorganic insulating layer may overlap with the inorganic contact area.

[0019] The substrate may include basic units that are repeatedly arranged, and each basic unit includes an island portion and a connection portion. A closed line may be formed between adjacent basic units among the basic units, and the closed line defines an interval area where there may be no island portion and a portion of the connection portion.

[0020] According to one or more embodiments, a display device may include: a substrate; display units located on the substrate and separated from each other; and an encapsulation layer located on the display units. The encapsulation layer may include an inorganic encapsulation layer and an organic encapsulation layer. Wherein, the substrate may include island portions separated from each other and connection portions connecting adjacent island portions among the island portions, and the display units are all arranged on corresponding ones of the island portions. Wherein, a first display unit that may be arranged on a first island portion among the island portions may include: a pixel circuit that may include a thin-film transistor and a storage capacitor; at least one organic insulating layer located on the pixel circuit; an inorganic insulating layer located on the at least one organic insulating layer; and a display element that may be electrically connected to the pixel circuit and may include a pixel electrode, an intermediate layer including an emission layer, and a counter electrode. Wherein, the inorganic insulating layer may include tips that protrude beyond a side surface of the at least one organic insulating layer in a direction parallel to an upper surface of the substrate, and the tips may be juxtaposed with the inorganic encapsulation layer.

[0021] The inorganic encapsulation layer may be juxtaposed with a bottom surface of the tip of the inorganic insulating layer.

[0022] The inorganic encapsulation layer may extend from the bottom surface of the tip and may cover the side surface of the at least one organic insulating layer and the side surface of the first island portion.

[0023] A depression in the at least one organic insulating layer in a thickness direction may be located below the tip of the inorganic insulating layer.

[0024] The display device may further include a second inorganic insulating layer that may be stacked with the depression.

[0025] A bottom surface of the depression and an upper surface of the second inorganic insulating layer may be in the same plane.

[0026] An area where the tip of the inorganic insulating layer and the inorganic encapsulation layer are juxtaposed with each other may be an inorganic contact area around the display element.

[0027] The connection portion may include a first connection portion connecting the first island portion and a second island portion adjacent to the first island portion, and a line electrically connecting the first display unit and a second display unit on the second island portion may be arranged on the first connection portion.

[0028] The line may be stacked with a part of the inorganic contact area.

[0029] The line may include a power voltage supply line electrically connected to the counter electrode.

[0030] A contact portion between the power voltage supply line and the counter electrode may be located inside an area inside the inorganic contact area.

[0031] The display device may further include a spacer located on the first island portion, wherein a part of the inorganic contact region may be located between the spacer and the display element.

[0032] The portion of the inorganic insulating layer that may be located between the inorganic contact region and the spacer may include a second tip that protrudes beyond the side surface of at least one organic insulating layer in a direction parallel to the upper surface of the substrate, and the inorganic encapsulation layer may directly contact the second tip to form a second inorganic contact region.

[0033] In a plan view, the second inorganic contact region may be separated from the inorganic contact region and located around the spacer.

[0034] The display device may further include a groove located between the inorganic contact region and the second inorganic contact region.

[0035] Each of the tip and the second tip may protrude toward the center of the groove, and both the counter electrode and at least one organic material layer that may be included in the intermediate layer may be separated by the tip and the second tip. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and other aspects, features, and advantages of the disclosed embodiments will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0037] Figure 1 A plan view of a display device according to an embodiment is shown;

[0038] Figure 2 It is shown Figure 1 A schematic plan view of an enlarged portion of

[0039] Figure 3 A plan view of the structure of a basic unit of a display device according to an embodiment is shown;

[0040] Figure 4 A schematic diagram of an equivalent circuit of any pixel of a display device according to an embodiment is shown;

[0041] Figure 5 A schematic cross-sectional view of a display device according to an embodiment is shown and corresponds to a cross-section taken along line V-V' of Figure 3 ;

[0042] Figure 6A A schematic cross-sectional view of a display device according to an embodiment is shown and corresponds to a cross-section taken along line VI-VI' of Figure 3 ;

[0043] Figure 6B A schematic cross-sectional view of a display device according to an embodiment is shown and corresponds to a cross-section taken along line Figure 3corresponds to the cross-section taken along line VI-VI';

[0044] Figure 7 shows a schematic cross-sectional view of a display device according to an embodiment, and corresponds to the cross-section taken along Figure 3 line VII-VII';

[0045] Figure 8 shows an enlarged plan view of a part of a display device according to an embodiment;

[0046] Figure 9 shows a schematic cross-sectional view of a display device according to an embodiment, and corresponds to the cross-section taken along Figure 3 line IX-IX';

[0047] Figure 10 shows a plan view of an inorganic contact area and a second inorganic insulating layer of a display device according to an embodiment;

[0048] Figure 11 is a plan view of the structure of a basic unit of a display device according to an embodiment;

[0049] Figure 12 shows a schematic cross-sectional view of the cross-section taken along Figure 11 line XII-XII';

[0050] Figure 13 is a plan view of the structure of a basic unit of a display device according to an embodiment;

[0051] Figure 14 shows a schematic cross-sectional view of the cross-section taken along Figure 13 line XIV-XIV';

[0052] Figure 15 is a schematic cross-sectional view of a display device according to an embodiment; and

[0053] Figure 16 is a schematic cross-sectional view of a display device according to an embodiment. DETAILED DESCRIPTION

[0054] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals always refer to like elements. In this regard, the embodiments may have different forms and should not be construed as limited to the description set forth herein. Accordingly, the embodiments may be described below with reference to the accompanying drawings to explain the described aspects. As used herein, the term "and / or" includes any combination and all combinations of one or more of the associated listed items. Expressions such as "at least one of..." when following a list of elements modify the entire list of elements and not individual elements in the list.

[0055] It will be understood that the terms "first", "second", etc. may be used herein to describe various components, and these components should not be limited by these terms. These terms may be used only to distinguish one component from another.

[0056] As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms.

[0057] It will also be understood that the terms "comprises" and / or its variations as used herein specify the presence of the stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0058] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, the layer, region, or component may be formed directly or indirectly on the other layer, region, or component. That is, for example, there may be intermediate layers, regions, or components.

[0059] For ease of explanation, the dimensions of the elements in the drawings may be exaggerated. In other words, since the dimensions and thicknesses of the components in the drawings may be arbitrarily shown for ease of explanation, the following embodiments may not be limited thereto.

[0060] When the embodiments can be implemented differently, the specific process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order.

[0061] In the following embodiments, it will be understood that when an element, region, or layer is referred to as being connected to another element, region, or layer, the element, region, or layer may be directly or indirectly connected to the other element, region, or layer. For example, in this specification, it will be understood that when an element, region, or layer is referred to as being in contact with or electrically connected to another element, region, or layer, the element, region, or layer may be directly or indirectly in contact with or electrically connected to the other element, region, or layer.

[0062] In addition, in the specification, the phrase "in a plan view" means when observing the object part from above, and the phrase "in a cross-sectional view" means when observing the cross-section taken by vertically cutting the element part from the side. In addition, the term "superposed" or its variants means that the first object can be above, below, or beside the second object, and vice versa. Additionally, the term "superposed" can include layers, stacks, facing or its variants, extending over, covering or partially covering, or any other suitable term that those of ordinary skill in the art will appreciate and understand. The term "facing" and its variants mean that the first element can be directly or indirectly opposite the second element. In the case where a third element is between the first element and the second element, although still facing each other, the first element and the second element can be understood as being indirectly opposite each other. When an element is described as "not superposed" with another element or using a similar expression, this can include the elements being spaced apart from each other, offset from each other, or separated from each other, or any other suitable term that those of ordinary skill in the art will appreciate and understand. When a layer, region, substrate, or area is referred to as being "on" another layer, region, substrate, or area, the layer, region, substrate, or area can be directly on the other layer, region, substrate, or area, or there can be intermediate layers, regions, substrates, or areas therebetween. In contrast, when a layer, region, substrate, or area is referred to as being "directly on" another layer, region, substrate, or area, there will be no intermediate layers, regions, substrates, or areas therebetween. In addition, when a layer, region, substrate, or area is referred to as being "below" another layer, region, substrate, or area, the layer, region, substrate, or area can be directly below the other layer, region, substrate, or area, or there can be intermediate layers, regions, substrates, or areas therebetween. In contrast, when a layer, region, substrate, or area is referred to as being "directly below" another layer, region, substrate, or area, there will be no intermediate layers, regions, substrates, or areas therebetween. In addition, "above" or "on" can include being positioned on or below an object and does not necessarily mean the direction based on gravity.

[0063] For ease of description, spatially relative terms such as "below", "beneath", "lower", "above", "upper", etc. may be used herein to describe the relationship of one element or component to another element or component as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, in the case where the device shown in the figures is flipped, a device positioned "below" or "beneath" another device can be positioned "above" the other device. Thus, the illustrative term "below" can include both the lower position and the upper position. The device can also be positioned in other directions, and thus the spatially relative terms can be interpreted differently depending on the orientation.

[0064] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense, unless expressly so defined in the description.

[0065] Figure 1 A plan view of a display device 1 according to an embodiment is shown, and Figure 2 is Figure 1 a schematic plan view of an enlarged portion of

[0066] Referring to Figure 1 , the display device 1 may include a substrate 100 and a display unit 200 on the substrate 100.

[0067] The substrate 100 may include various materials such as glass, metal, or organic materials. According to an embodiment, the substrate 100 may include a flexible material. For example, the substrate 100 may include ultra-thin flexible glass (e.g., having a thickness of several tens of μm to several hundreds of μm) or a polymer resin. When the substrate 100 may include a polymer resin, the substrate 100 may include polyimide (PI). As another example, the substrate 100 may include polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), triacetyl cellulose (TAC), and / or cellulose acetate propionate (CAP).

[0068] The substrate 100 may include island portions 101 that may be separated from each other, connection portions 102 connecting the island portions 101, and a spacer region V located between the connection portions 102 and passing through the substrate 100.

[0069] The island portions 101 may be arranged in a planar grid pattern to be repeatedly arranged in a first direction (i.e., the x-direction) and a second direction different from the first direction (i.e., the y-direction). The first direction and the second direction may cross each other. The first direction and the second direction may form an obtuse angle or an acute angle.

[0070] The display unit 200 may be disposed on each of the island portions 101 and may define at least one pixel, and the pixel may include a display element that emits light in a visible light region. For example, red pixels, green pixels, and blue pixels may be arranged on each of the island portions 101. Red pixels, green pixels, blue pixels, and white pixels may be arranged on each of the island portions 101. The structure of the corresponding pixels is as follows with reference to Figure 5 .

[0071] The connecting part 102 can connect the adjacent island parts 101 to each other. For example, four connecting parts 102 can be connected to each island part 101. The four connecting parts 102 connected to one island part 101 can each extend in different directions, and each connecting part 102 can be connected to another island part 101 arranged adjacent to the aforementioned island part 101. For example, one island part 101 can be connected to four other island parts 101 positioned along the circumferential direction of the aforementioned island part 101 via four connecting parts 102 respectively.

[0072] The island part 101 and the connecting part 102 can be formed of the same material. For example, the island part 101 and the connecting part 102 can be integrally formed into an integral structure.

[0073] One island part 101 and the connecting part 102 connected thereto can be referred to as a basic unit U. The basic unit U can be repeatedly arranged in the first direction and the second direction. For example, the substrate 100 can include basic units U that are repeatedly arranged and connected to each other. Two adjacent basic units U can be symmetric. For example, Figure 1 two basic units U adjacent to each other in the left - right direction in Figure 1 can be vertically symmetric based on a symmetry axis, and the symmetry axis can be located between the two basic units U and parallel to the y - direction. Similarly,

[0074] two basic units U adjacent to each other in the up - down direction in Figure 1 can be horizontally symmetric based on a symmetry axis AX, and the symmetry axis AX can be located between the two basic units U and parallel to the x - direction.

[0075] Adjacent basic units U (for example, Figure 1 the four basic units U shown in Figure 1 ) can form a closed line CL between the four basic units U. The closed line CL can be an area or part of the substrate 100 that can follow the edges of the adjacent island parts 101 and at least one connecting part 102. The closed line CL can define an interval region V, and the interval region V can be an empty space, that is, a space where no part of the island part 101 and / or the connecting part 102 exists. That is, the interval region V can be defined by the closed line CL such that the interval region V is bounded by the closed line CL.

[0075] Each spacer region V can penetrate through the upper and lower surfaces of the substrate 100. Since there will be no islands 101 and connection parts 102 within the spacer region V, each spacer region V can provide a spacing area between the islands 101, reduce the weight of the substrate 100, and increase the flexibility of the substrate 100. When an external force (e.g., a winding force, a bending force, or a tensile force, etc.) can be applied to the substrate 100, the shape of the spacer region V can be changed to conveniently reduce the stress that may occur on the display device 1 when the structure of the substrate 100 can be changed according to its shape. As a result, abnormal deformation of the substrate 100 can be prevented, and the substrate 100 can have improved durability. Therefore, the user convenience regarding the use of the display device 1 can be improved. Among the many advantages mentioned above, there can be the ability to conveniently apply the display device 1 to a wearable device.

[0076] The angle θ between the edge of the island 101 included in one basic unit U and the edge of each connection part 102 included in the basic unit U can be an acute angle. As Figure 2 shown, when an external force (e.g., a force pulling the substrate 100) can be applied, the angle θ' between the edge of the island 101 and the edge of each connection part 102 can increase (θ'>θ), and the area or shape of the spacer region V' can change together with the position of the island 101. Figure 2 A plan view of the substrate 100 extending in the first and second directions is shown. When the described force can be applied to the substrate 100, as a result of the change in the angle θ', the increase in the area and / or the change in the shape of the spacer region V', each island 101 can rotate by a predetermined angle. Due to the rotation of each island 101, the distance between the islands 101 (e.g., the first distance d1' and the second distance d2') can change according to the position of each island 101.

[0077] When a tensile force can be applied to the substrate 100, stress may concentrate at the connection part 102 connected to the edge of the island 101. Therefore, in order to prevent damage to the substrate 100, the closed line CL defining the spacer region V can include a curved portion.

[0078] Figure 3 A plan view showing the structure of the basic unit of a display device according to an embodiment is shown, Figure 4 A schematic diagram showing the equivalent circuit of any pixel of a display device according to an embodiment is shown.

[0079] Referring to Figure 3 , pixels can be arranged on the islands 101 of the substrate 100, and each pixel can include a display element. The light emitted from the display element can be provided through an emission region having a predetermined area in the plan view. In this regard, Figure 3The emission regions of each pixel are shown. For example, a red emission region EAr, a blue emission region EAb, and a green emission region EAg may be located on the island portion 101.

[0080] As Figure 4 shown, the red pixel, the green pixel, and the blue pixel may each include a pixel circuit PC and a light-emitting diode LED as a display element connected to the pixel circuit PC. The light-emitting diode LED may include an organic light-emitting diode, an inorganic light-emitting diode, or a quantum dot light-emitting diode. Hereinafter, for convenience of explanation, it will be described that the light-emitting diode LED of each pixel may include an organic light-emitting diode.

[0081] The pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst. Each pixel may emit, for example, red light, green light, or blue light, or red light, green light, blue light, or white light through the light-emitting diode LED. The second thin-film transistor T2 may include a switching thin-film transistor and may be connected to a scan line SL and a data line DL. The second thin-film transistor T2 may transfer a data voltage input from the data line DL to the first thin-film transistor T1 according to a switching voltage that may be input from the scan line SL. The storage capacitor Cst may be connected to the second thin-film transistor T2 and a driving voltage line PL and may store a voltage corresponding to the difference between the voltage received from the second thin-film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0082] The first thin-film transistor T1 may include a driving thin-film transistor and may be connected to the driving voltage line PL and the storage capacitor Cst. In addition, the first thin-film transistor T1 may control a driving current flowing through the light-emitting diode LED from the driving voltage line PL corresponding to the voltage value stored in the storage capacitor Cst. The light-emitting diode LED may emit light with a predetermined brightness based on the driving current. The counter electrode (e.g., cathode) of the light-emitting diode LED may receive a second power supply voltage ELVSS.

[0083] Figure 4 The case where the pixel circuit PC includes two thin-film transistors and one storage capacitor is shown. However, the disclosure is not limited thereto. The number of thin-film transistors and the number of storage capacitors may be modified in various ways according to the design of the pixel circuit PC.

[0084] Referring again to Figure 3, the red emission region EAr of the red pixel, the blue emission region EAb of the blue pixel, and the green emission region EAg of the green pixel can be arranged separately from each other in a given direction. For example, the red emission region EAr, the blue emission region EAb, and the green emission region EAg can be arranged separately from each other in the second direction (i.e., the y direction), and the distance between adjacent emission regions can be substantially the same. For example, the distance d3 between the red emission region EAr and the blue emission region EAb can be substantially the same as the distance d4 between the blue emission region EAb and the green emission region EAg.

[0085] The red, blue, and green pixels on the island portion 101 can be completely surrounded by the inorganic contact region ICA. In other words, the red, blue, and green pixels can be defined by the inorganic contact region ICA such that the inorganic contact region ICA can be around the periphery of the island portion 101 to enclose the pixels within the inorganic contact region ICA. In this regard, Figure 3 It is shown that the red emission region EAr, the blue emission region EAb, and the green emission region EAg are completely surrounded or defined by the inorganic contact region ICA in a plan view.

[0086] The inorganic contact region ICA can be formed by including at least two layers, the at least two layers including inorganic materials and being in direct contact with each other. In other words, at least two layers including inorganic materials can be side by side. The inorganic contact region ICA can prevent external moisture from penetrating into the display elements included in each pixel. The inorganic contact region ICA can extend along the edge of the island portion 101 to form a boundary along those edges, and the pixels can be arranged inside the boundary formed by and through the inorganic contact region ICA.

[0087] In a plan view, a counter electrode contact portion CECNP (hereinafter referred to as the contact portion) for applying a predetermined voltage to the counter electrode of each display element can be provided inside the ring of the inorganic contact region ICA. The spacer 217 can be positioned outside the ring of the inorganic contact region ICA in a plan view. The spacer 217 can be completely defined by an inorganic contact region ICA' (hereinafter referred to as the second inorganic contact region), which is different from the inorganic contact region ICA surrounding the pixels. In other words, the second inorganic contact region ICA' can be entirely around the periphery of the spacer 217.

[0088] Figure 5 A schematic cross-sectional view of a display device according to an embodiment is shown and corresponds to the cross-section taken along Figure 3 the line V-V'.

[0089] Referring to Figure 5, a pixel circuit PC and a light-emitting diode LED that can be a display element electrically connected to the pixel circuit PC can be arranged on the island portion 101 of the substrate 100. As described with reference to Figure 4 , the pixel circuit PC may include a thin-film transistor TFT and a storage capacitor Cst.

[0090] A buffer layer 201 may be arranged between the substrate 100 and the pixel circuit PC, and can prevent impurities from penetrating into the thin-film transistor TFT. The buffer layer 201 may include an inorganic insulating material (such as silicon nitride (SiN x ), silicon oxynitride (SiON), and silicon oxide (SiO x )) and may include a single layer or multiple layers containing the inorganic insulating materials described above.

[0091] The thin-film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. Figure 5 A top-gate type thin-film transistor TFT is shown, in which the gate electrode GE may be arranged on the semiconductor layer Act with a gate insulating layer 203 therebetween. However, according to another embodiment, the thin-film transistor TFT may include a bottom-gate type thin-film transistor TFT.

[0092] The semiconductor layer Act may include polysilicon. The semiconductor layer Act may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include a conductive material containing Mo, Al, Cu, Ti, etc. and may include a single layer or multiple layers containing the conductive materials described above.

[0093] The gate insulating layer 203 between the semiconductor layer Act and the gate electrode GE may include an inorganic insulating material such as SiO x , SiN x , SiON, aluminum oxide, titanium oxide, tantalum oxide, and hafnium oxide. The gate insulating layer 203 may include a single layer or multiple layers containing the materials described above.

[0094] The source electrode SE and the drain electrode DE may be located on the same layer (e.g., the second interlayer insulating layer 207) and may include the same material as each other. The source electrode SE and the drain electrode DE may include a highly conductive material. The source electrode SE and the drain electrode DE may include a conductive material containing Mo, Al, Cu, Ti, etc. and may include a single layer or multiple layers containing the materials described above. According to an embodiment, the source electrode SE and the drain electrode DE may have a multi-layer structure including a titanium layer, an aluminum layer, and a titanium layer (Ti / Al / Ti).

[0095] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2 that are stacked or face each other, and a first interlayer insulating layer 205 therebetween. The storage capacitor Cst may be stacked or face the thin film transistor TFT. Figure 5 It is shown that the gate electrode GE of the thin film transistor TFT may be the lower electrode CE1 of the storage capacitor Cst. According to another embodiment, the storage capacitor Cst may not be stacked or face the thin film transistor TFT. The storage capacitor Cst may be covered by a second interlayer insulating layer 207. The upper electrode CE2 of the storage capacitor Cst may include a conductive material including Mo, Al, Cu, Ti, etc., and may include a multi-layer or a single layer including the materials described above.

[0096] The first interlayer insulating layer 205 and the second interlayer insulating layer 207 may include an inorganic insulating material such as SiO x , SiN x and SiON. The first interlayer insulating layer 205 and the second interlayer insulating layer 207 may include a single layer or multi-layers including the materials described above.

[0097] The peripheral portions of the buffer layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 may be covered by an organic material layer 220. For example, the organic material layer 220 may cover the edges of the buffer layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207, and the edges may have a step difference, i.e., a height difference, with respect to the upper surface of the substrate 100. The organic material layer 220 may reduce the amount of stress caused by the inorganic insulating material layers contacting each other around the edge of the substrate 100 (i.e., the edge of the island portion 101). The organic material layer 220 may include an organic insulating material such as PI, and may be positioned between the second interlayer insulating layer 207 and the first inorganic insulating layer 208.

[0098] The thin film transistor TFT and the storage capacitor Cst may be covered by a first organic insulating layer 209, and the first inorganic insulating layer 208 may be positioned below the first organic insulating layer 209. The first inorganic insulating layer 208 may include an inorganic insulating layer including an inorganic insulating material such as SiN x , SiO x and SiON).

[0099] The driving voltage line PL may include a lower driving voltage line PL1 and an upper driving voltage line PL2 that are electrically connected to each other, and a first organic insulating layer 209 is between the lower driving voltage line PL1 and the upper driving voltage line PL2. The lower driving voltage line PL1 may be positioned on the same layer as the source electrode SE and the drain electrode DE and may include the same material as the source electrode SE and the drain electrode DE. In the case where the driving voltage line PL may be formed as a multi-layer structure including an insulating layer as described above, an increase in the resistance of the driving voltage line PL can be prevented, and the width of the driving voltage line PL can be reduced. According to another embodiment, the driving voltage line PL may include only the lower driving voltage line PL1 or only the upper driving voltage line PL2.

[0100] The second organic insulating layer 211 and the third organic insulating layer 213 may be sequentially disposed on the first organic insulating layer 209. The first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213 may include an organic insulating material. The organic insulating material may include, for example, general polymers (such as PMMA or PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, parylene polymers, vinyl alcohol polymers, and their blends.

[0101] The third inorganic insulating layer 214 may be positioned on the third organic insulating layer 213, and the pixel electrode 221 may be disposed on the third inorganic insulating layer 214. The third inorganic insulating layer 214 may include an inorganic insulating layer containing an inorganic insulating material (such as SiN x 、SiO x and SiON).

[0102] The pixel electrode 221 may be electrically connected to the thin film transistor TFT of the pixel circuit PC. Figure 5 It is shown that the thin film transistor TFT and the pixel electrode 221 may be electrically connected to each other via a first contact metal CM1 on the first organic insulating layer 209 and a second contact metal CM2 on the second organic insulating layer 211.

[0103] The pixel electrode 221 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). According to another embodiment, the pixel electrode 221 may include a reflective layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and / or a mixture thereof. According to another embodiment, the pixel electrode 221 may include, above / below the reflective layer described above, one including ITO, IZO, ZnO, and / or In 2 O3 layers. For example, the pixel electrode 221 may include a three-layer structure in which an ITO layer, an Ag layer, and an ITO layer may be stacked.

[0104] The pixel defining layer 215 may cover the edge of the pixel electrode 221 and may have an opening 215OP that overlaps or faces the central portion of the pixel electrode 221. The opening 215OP of the pixel defining layer 215 may define an emission region. For example, the width of the opening 215OP of the pixel defining layer 215 may correspond to the width of the red emission region EAr described with reference to Figure 3 Similarly, as another example, the blue emission region EAb ( Figure 3 ) and the green emission region EAg ( Figure 3 ) may each be defined by the width of the opening 215OP of the pixel defining layer 215 on the pixel electrode 221.

[0105] The pixel defining layer 215 may include an organic insulating material such as PI. As another example, the pixel defining layer 215 may include an inorganic insulating material. As another example, the pixel defining layer 215 may include an organic insulating material and an inorganic insulating material.

[0106] The intermediate layer 222 may be disposed on the pixel defining layer 215. The intermediate layer 222 may include an emission layer 222b. The emission layer 222b may include an organic emission material, such as a high molecular weight organic material or a low molecular weight organic material that emits light of a predetermined color. As another example, the emission layer 222b may include an inorganic emission material or quantum dots.

[0107] Figure 5 shows a cross-section taken along the line V-V' passing through the Figure 3 red emission region EAr in, and thus, Figure 5 the emission layer 222b of may emit red light. Figure 5 The structure of the light-emitting diode LED shown in may be uniformly applied to the light-emitting diodes included in other pixels. However, the color of the light emitted by the emission layer in each pixel may be different, and thus, the specific material of the emission layer in each pixel may be different.

[0108] The first functional layer 222a and the second functional layer 222c may be disposed below and above the emission layer 222b, respectively.

[0109] The first functional layer 222a may include a single layer or multiple layers. For example, the first functional layer 222a may include a hole transport layer (HTL) having a single-layer structure and may include poly(3,4-ethylenedioxythiophene) (PEDOT) or polyaniline (PANI). As another example, the first functional layer 222a may include a hole injection layer (HIL) and an HTL.

[0110] The second functional layer 222c may include a single layer or multiple layers. The second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0111] Figure 5 It is shown that the intermediate layer 222 may include both the first functional layer 222a and the second functional layer 222c. However, according to another embodiment, the intermediate layer 222 may selectively include the first functional layer 222a and the second functional layer 222c. For example, the intermediate layer 222 may not include the second functional layer 222c.

[0112] The emission layer 222b of the intermediate layer 222 may be disposed in each pixel. However, the first functional layer 222a and the second functional layer 222c may be formed as a single body to extend over multiple pixels. For example, the first functional layer 222a and the second functional layer 222c may be formed as a single body to extend over a red pixel region, a blue pixel region, and a green pixel region (e.g., Figure 3 EAr, EAb, and EAg in).

[0113] The counter electrode 223 may include a conductive material having a low work function. For example, the counter electrode 223 may include a (semi)transparent layer containing Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, and / or an alloy thereof. As another example, the counter electrode 223 may further include a layer on the (semi)transparent layer containing the materials described above, such as ITO, IZO, ZnO, or In 2 O 3 . The counter electrode 223 may be formed as a single body to extend over the pixels in the above-mentioned red pixel region, blue pixel region, and green pixel region (i.e., Figure 3 EAr, EAb, EAg in). For example, the counter electrode 223 may completely cover the island portion 101 of the substrate 100. The area of the counter electrode 223 may be different from the areas of the first functional layer 222a and the second functional layer 222c described above.

[0114] The encapsulation layer 300 may cover the upper portion of the counter electrode 223. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. According to an embodiment, the encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 that may be sequentially stacked.

[0115] Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic insulating material. The inorganic insulating material may include alumina, tantalum oxide, hafnium oxide, zinc oxide, SiO x , SiN xand / or SiON. The organic encapsulation layer 320 may include a polymeric material. The polymeric material may include an acrylic resin, an epoxy resin, PI, polyethylene, etc. The acrylic resin may include, for example, PMMA, polyacrylic acid, etc. The organic encapsulation layer 320 may be located only on the corresponding island portions 101 of the substrate 100. Therefore, it can be understood that the display device 1 described with reference to Figure 1 and Figure 2 may include organic encapsulation layers 320 arranged separately from each other on the island portions 101.

[0116] At least one inorganic encapsulation layer of the encapsulation layer 300 may directly contact a part of the third inorganic insulating layer 214 at the peripheral region of the island portion 101 to be side by side with each other and form an inorganic contact area ICA.

[0117] A part of the third inorganic insulating layer 214 may extend in the horizontal direction (i.e., the direction parallel to the upper surface of the substrate 100), and may protrude more in the horizontal direction than the side surfaces of at least one layer directly provided below the third inorganic insulating layer 214 to form a tip PT. The at least one layer may be the third organic insulating layer 213. A recess R may be formed as a space sunken relative to the first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213 below the tip PT, and the depth d of the recess R R may correspond to the depth that can penetrate at least the third organic insulating layer 213.

[0118] As an example, the depth d of the recess R R may be substantially the same as the sum of the thickness t1 of the third organic insulating layer 213, the thickness t2 of the second organic insulating layer 211, and the thickness t3 of the first organic insulating layer 209. The recess R may be formed by removing at least one layer provided below the third inorganic insulating layer 214. For example, Figure 5 shows that the recess R may be formed by removing the peripheral portions of the third organic insulating layer 213, the second organic insulating layer 211, and the first organic insulating layer 209.

[0119] The peripheral portions of the third organic insulating layer 213, the second organic insulating layer 211, and the first organic insulating layer 209 may be removed by an etching process. The first inorganic insulating layer 208 may be provided below the first organic insulating layer 209 and may be used as an etch stop. The upper surface of the first inorganic insulating layer 208 may correspond to the bottom surface of the recess R. The end portion (such as the tip PT) of the third inorganic insulating layer 214 may protrude farther from the emission region in the horizontal direction than the side surfaces of the third organic insulating layer 213, the second organic insulating layer 211, and the first organic insulating layer 209.

[0120] Due to the overhang (e.g., eaves and / or undercut) formed by the end of the third inorganic insulating layer 214 that protrudes beyond the side surface of the third organic insulating layer 213, at least one organic material layer (such as the first functional layer 222a and / or the second functional layer 222c) included in the intermediate layer 222 can be disconnected from the pixel defining layer 215. The overhang described above can be formed before the intermediate layer 222 can be formed. Due to the overhang, the organic material layers (such as the first functional layer 222a and the second functional layer 222c) of the light-emitting diode LED can be disconnected from the pixel defining layer 215, and the organic material layers can be integrally formed to cover the emission region as shown in Figure 3 As shown. For example, most of each of the first functional layer 222a and the second functional layer 222c can be positioned on the pixel defining layer 215, while the remaining portions of each of the first functional layer 222a and the second functional layer 222c can be set to be adjacent to the bottom surface of the recess R. For example, the remaining portions of each of the first functional layer 222a and the second functional layer 222c can be set on the first inorganic insulating layer 208 during the formation of the first functional layer 222a and the second functional layer 222c.

[0121] Similarly, due to the overhang, the counter electrode 223 can be disconnected from the pixel defining layer 215. Like the first functional layer 222a and the second functional layer 222c, most of the counter electrode 223 can be positioned on the pixel defining layer 215. However, the peripheral portion of the counter electrode 223 can be set to be adjacent to the bottom surface of the recess R. For example, the peripheral portion of the counter electrode 223 can be set on the first inorganic insulating layer 208 during the formation of the counter electrode 223.

[0122] The bottom surface of the end of the overhang formed by the third inorganic insulating layer 214 (i.e., the bottom surface 214B of the tip PT) can be in direct contact with at least one inorganic encapsulation layer included in the encapsulation layer 300. In other words, the bottom surface 214B of the tip PT can be side by side with at least one inorganic encapsulation layer included in the encapsulation layer 300. For example, the inorganic contact area ICA can be formed when the first inorganic encapsulation layer 310 of the encapsulation layer 300 is in direct contact with the bottom surface 214B of the tip PT of the third inorganic insulating layer 214. In other words, the inorganic contact area ICA can be formed such that the first inorganic encapsulation layer 310 covers the tip PT and is side by side with the tip PT of the third inorganic insulating layer 214, and is in contact with the side surface of the third organic insulating layer 213.

[0123] As referred to above Figure 3As described, the inorganic contact area ICA can extend to completely surround or be located around the emission area in a plan view (similarly, in a vertical view with respect to the upper surface of the substrate 100). The tip PT of the third inorganic insulating layer 214 can extend along the peripheral area of the island portion 101 to completely surround or be located around the emission area. In other words, the formation of the tip PT provides a bonding point along the peripheral area of the island portion 101, making the inorganic contact area ICA the outermost boundary of the island portion 101, and the emission area is contained within the outermost boundary of the island portion 101. The width of the inorganic contact area ICA can depend on the width α of the tip PT of the third inorganic insulating layer 214. According to an embodiment, the width α of the tip PT can be less than about 2 μm.

[0124] Different from the first functional layer 222a, the second functional layer 222c, and the counter electrode 223, the first inorganic encapsulation layer 310 formed by chemical vapor deposition can have relatively excellent step coverage. Therefore, the first inorganic encapsulation layer 310 can be formed on the bottom surface 214B with respect to the surface of the substrate 100. As Figure 5 shown, the first inorganic encapsulation layer 310 can extend from the end of the organic encapsulation layer 320 towards the substrate 100 in the downward direction (i.e., the -z direction), and can continuously extend to cover the bottom surface 214B of the tip PT, the side surfaces of the first to third organic insulating layers 209, 211, and 213, and the side surface of the substrate 100.

[0125] Similar to the first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330 can continuously extend from the upper surface of the display device 1 in the lateral direction of the display device 1 to the side surface of the display device 1 to cover each of those surfaces to prevent, for example, water from being introduced. For example, the second inorganic encapsulation layer 330 can prevent water from penetrating through the side surface of the organic material layer 220 and / or the side surfaces of the first to third organic insulating layers 209, 211, and 213.

[0126] Figure 6A and Figure 6B shows a schematic cross-sectional view of a display device according to an embodiment, and corresponds to the cross-section taken along the Figure 3 line VI-VI'.

[0127] Referring to Figure 6A and Figure 6B , the first power supply voltage line WLD and the second power supply voltage line WLS can be arranged on the island portion 101 of the substrate 100. The first power supply voltage line WLD can provide the first power supply voltage ELVDD (see Figure 4 ), and the second power supply voltage line WLS can provide the second power supply voltage ELVSS.

[0128] The first power supply voltage line WLD and the second power supply voltage line WLS may be located on different layers. For example, the first power supply voltage line WLD may be located on the first organic insulating layer 209, and the second power supply voltage line WLS may be located on the second organic insulating layer 211. In the case where the first power supply voltage line WLD and the second power supply voltage line WLS may be arranged on different layers, the spatial utilization with respect to the arrangement of these lines and the intermediate layer on the substrate 100 may be optimized for the manufacture of the display device 1.

[0129] Although not shown, the first power supply voltage line WLD may be electrically connected to the driving voltage line PL described above with reference to Figure 5 and may supply the first power supply voltage EVLDD.

[0130] The second power supply voltage line WLS may be electrically connected to the counter electrode 223. Referring to Figure 3 、 Figure 6A and Figure 6B ,the second power supply voltage line WLS may be electrically connected to the counter electrode 223 to form the contact portion CECNP. The contact portion CECNP may be located in the inner region of the island portion 101 where the inorganic contact area ICA is provided around it.

[0131] The layer between the second power supply voltage line WLS and the counter electrode 223 may include holes to form the contact portion CECNP. For example, the third organic insulating layer 213 may include the first hole 213H that overlaps or faces the second power supply voltage line WLS. The third inorganic insulating layer 214 may include the second hole 214H, and the pixel defining layer 215 may include the third hole 215H. The first hole 213H, the second hole 214H, and the third hole 215H may overlap or face each other.

[0132] The connection electrode 225 may be arranged on the third inorganic insulating layer 214, and the second power supply voltage line WLS and the counter electrode 223 may be electrically connected to each other via the connection electrode 225. The connection electrode 225 may be connected to the second power supply voltage line WLS via the first hole 213H of the third organic insulating layer 213 and the second hole 214H of the third inorganic insulating layer 214, and the counter electrode 223 may be connected to the connection electrode 225 via the third hole 215H of the pixel defining layer 215.

[0133] The width of the contact portion CECNP may be defined according to the hole having the smaller width among the widths of the first hole 213H, the second hole 214H, and the third hole 215H. According to an embodiment, Figure 6AIt is shown that the second hole 214H may have a width smaller than that of the third hole 215H, and the third hole 215H may have a width smaller than that of the first hole 213H. According to another embodiment, as Figure 6B shown, the second hole 214H may have a width that may be larger than that of the first hole 213H. In the case where the second hole 214H may have such a large width, the connection electrode 225 may directly contact the side surface of the third organic insulating layer 213 that defines the first hole 213H. According to another embodiment, the second hole 214H may have a width larger than that of the third hole 215H, and the width of the third hole 215H may be larger than that of the first hole 213H.

[0134] The first functional layer 222a and the second functional layer 222c, both of which are located below the counter electrode 223, may not cover the contact portion CECNP. For example, the edge 222ae of the first functional layer 222a and the edge 222ce of the second functional layer 222c may be separated from the inorganic contact area ICA by a certain distance, and the contact portion CECNP is therebetween.

[0135] Figure 7 A schematic cross-sectional view of a display device according to an embodiment is shown, and it corresponds to the cross-section taken along the Figure 3 line VII-VII', Figure 8 and an enlarged plan view of a part of the display device according to an embodiment is shown.

[0136] Referring to Figure 3 and Figure 7 , the spacer 217 may be positioned on the island portion 101 of the substrate 100. The spacer 217 may be positioned between the inorganic contact area ICA and the edge of the island portion 101. The spacer 217 may prevent the structure of the display device 1 including the layers disposed below the spacer 217 from being damaged by the mask that may be used in the process of forming the intermediate layer 222 and the counter electrode 223.

[0137] The size of the opening area of the mask for forming the intermediate layer 222 and the size of the opening area of the mask for forming the counter electrode 223 may be different from each other. For example, the opening area of the mask for forming the first functional layer 222a and the second functional layer 222c may be smaller than the opening area of the mask for forming the counter electrode 223. As described above with reference to Figure 6A and Figure 6B , each of the first functional layer 222a and the second functional layer 222c may have an area covering the emission area on the island portion 101 of the substrate 100. For example, as Figure 7As shown, each of the edge 222ae of the first functional layer 222a and the edge 222ce of the second functional layer 222c may be positioned on the upper surface of the spacer 217, and the end of the counter electrode 223 may extend more toward the edge of the substrate 100 than the edge 222ae of the first functional layer 222a and the edge 222ce of the second functional layer 222c.

[0138] The spacer 217 may include an organic insulating material such as PI. The spacer 217 may include the same material as that of the pixel defining layer 215 and may be formed in the same mask process that can be used to form the pixel defining layer 215. The spacer 217 may be surrounded by the second inorganic contact region ICA' as Figure 3 shown. In other words, the second inorganic contact region ICA' may be located around the periphery of the spacer 217. The second inorganic contact region ICA' may be formed similarly to the inorganic contact region ICA described above with reference to Figure 5 this.

[0139] For example, the end of the third inorganic insulating layer 214 may extend in the width direction of the spacer 217 (i.e., the horizontal direction parallel to the upper surface of the substrate 100) and may protrude more in the horizontal direction than at least one layer below the third inorganic insulating layer 214 to form a tip PT'. For example, as Figure 7 shown at the left part of the spacer 217 in, the end of the third inorganic insulating layer 214 may extend farther from the spacer 217 in the horizontal direction than the side surfaces of the first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213 to form an overhang. Further, as Figure 7 shown at the right part of the spacer 217 in, the end of the third inorganic insulating layer 214 may extend farther from the spacer 217 in the horizontal direction than the side surface of the third organic insulating layer 213 to form an overhang. In other words, the third inorganic insulating layer 214 may extend beyond the facing portion of the side surface of the third organic insulating layer 213 to form a tip PT'. The end of the third inorganic insulating layer 214 (e.g., the bottom surface 214B' of the tip PT') may directly contact the first inorganic encapsulation layer 310 to form the second inorganic contact region ICA'. In other words, the bottom surface 214B' of the tip PT' may be juxtaposed with the first inorganic encapsulation layer 310 to form the second inorganic contact region ICA'.

[0140] The inorganic contact region ICA and the second inorganic contact region ICA' may be as Figure 3 and Figure 7are separated from each other as shown, and a gap portion GP may exist between the inorganic contact area ICA and the second inorganic contact area ICA'. The gap portion GP may form a groove with respect to an imaginary line VL passing through the center of the gap portion GP, and overhang portions of the inorganic contact area ICA and the second inorganic contact area ICA' may be formed on both sides of the groove. As Figure 8 shown, the gap portion GP may extend along the edges of the inorganic contact area ICA and the second inorganic contact area ICA', and may extend between the inorganic contact area ICA and the second inorganic contact area ICA'.

[0141] As Figure 7 shown, overhang portions may be formed on each side of the gap portion GP. For example, since the end of the third inorganic insulating layer 214 may protrude more toward the center of the gap portion GP than the side surface of the third organic insulating layer 213 below the third inorganic insulating layer 214, tips PT and PT' may be formed. Since the bottom surface 214B of the tip PT and the bottom surface 214B' of the tip PT' may directly contact the first inorganic encapsulation layer 310, the inorganic contact area ICA and the second inorganic contact area ICA' may be formed, respectively. In other words, since the bottom surface 214B of the tip PT and the bottom surface 214B' of the tip PT' may be juxtaposed with the first inorganic encapsulation layer 310, the inorganic contact area ICA and the second inorganic contact area ICA' may be formed, respectively.

[0142] As described above, due to the overhang portions on both sides of the gap portion GP, the first functional layer 222a, the second functional layer 222c, and the counter electrode 223 may be disconnected from the pixel defining layer 215.

[0143] Depressions R' corresponding to each of the overhang portions on both sides of the gap portion GP and depressions R formed along the edge of the island portion 101 may be formed together (i.e., simultaneously). However, due to the formation of the second inorganic insulating layer 212 at the gap portion GP, the depression R' corresponding to the overhang portions on both sides of the gap portion GP may be prevented from completely extending through the third organic insulating layer 213. The second inorganic insulating layer 212 may have a width larger than the width GP-W of the bottom surface of the gap portion GP. The second inorganic insulating layer 212 may be used as, for example, an etch stop in the process of forming the overhang portions and the depression R'. The second inorganic insulating layer 212 may include an inorganic insulating layer containing an inorganic insulating material (such as SiN x , SiO x and SiON).

[0144] Figure 9 shows a schematic cross-sectional view of a display device according to an embodiment and corresponds to the cross-section taken along Figure 3 line IX-IX', Figure 10A plan view of an inorganic contact region and a second inorganic insulating layer of a display device according to an embodiment is shown.

[0145] Referring Figure 9 , the island portion 101 and the connection portion 102 of the substrate 100 may be integrally formed similarly to those in Figure 3 and Figure 7 . The first power supply voltage line WLD and the second power supply voltage line WLS that respectively supply the first power supply voltage and the second power supply voltage to the pixel circuit PC and the counter electrode 223 on the island portion 101 may extend onto the connection portion 102. The signal line WL may be connected to the pixel circuit PC, and may apply a data signal and / or a scan signal to the pixel circuit PC while extending from the island portion 101 onto the connection portion 102. For example, the signal line WL may include a data line and / or a scan line.

[0146] The first organic insulating layer 209 may support the first power supply voltage line WLD and may extend from the island portion 101 onto the connection portion 102. Similarly, the second organic insulating layer 211 may support the second power supply voltage line WLS and may extend from the island portion 101 onto the connection portion 102. The signal line WL may be positioned below the first organic insulating layer 209.

[0147] The inorganic insulating layer on the island portion 101 may not extend onto the connection portion 102. For example, the edges of the buffer layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 may be positioned on the island portion 101 and may be covered by the organic material layer 220. Similarly, the first inorganic insulating layer 208 and the third inorganic insulating layer 214 may not extend onto the connection portion 102.

[0148] As Figure 3 and Figure 9 shown, the inorganic contact region ICA may be positioned adjacent to the connection portion 102 on the island portion 101. As described in the enlarged view with reference to Figure 5 above, since the end portion of the third inorganic insulating layer 214 having an overhang portion (e.g., the bottom surface 214B of the tip PT) contacts the first inorganic encapsulation layer 310, the inorganic contact region ICA may be formed. The third inorganic insulating layer 214 may not be positioned on the connection portion 102.

[0149] The first functional layer 222a and the second functional layer 222c may be positioned on the island portion 101 and may not extend onto the connection portion 102. However, the counter electrode 223 may be positioned on the island portion 101 and the connection portion 102, and may be disconnected from the pixel defining layer 215 due to the overhang formed by the tip PT of the third inorganic insulating layer 214. According to another embodiment, the counter electrode 223 may not be positioned on the connection portion 102 when the size of the opening region of the mask for forming the counter electrode 223 is adjusted not to cover the connection portion 102.

[0150] To prevent damage to the second power supply voltage line WLS in a process (e.g., an etching process) for forming an overhang at the end of the third inorganic insulating layer 214 protruding beyond the side surface of the third organic insulating layer 213, the second inorganic insulating layer 212 may be positioned on the second power supply voltage line WLS. At least a portion of the second inorganic insulating layer 212 may overlap or face the inorganic contact region ICA. For example, as Figure 10 shown, the second inorganic insulating layer 212 may be positioned between the island portion 101 and each connection portion 102, and a portion of the second inorganic insulating layer 212 may overlap or face the inorganic contact region ICA.

[0151] Although the organic encapsulation layer 320 of the encapsulation layer 300 is only positioned on each island portion 101, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be continuously formed to be positioned on the island portion 101 and the connection portion 102. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may contact the bottom surface 214B of the tip PT and be side by side with the bottom surface 214B of the tip PT to form the inorganic contact region ICA, and may continuously extend to contact each other on the connection portion 102.

[0152] According to the embodiment described with reference to Figures 1 to 9 the encapsulation layer 300 may include the first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330, and the organic encapsulation layer 320. However, in an embodiment, the organic encapsulation layer 320 of the encapsulation layer 300 may be omitted. For example, the encapsulation layer 300 may include only one or more inorganic encapsulation layers. However, the embodiments of the encapsulation layer 300 are not limited thereto.

[0153] Figure 9 Illustrated is Figure 3 the schematic cross-sectional structure between the island portion 101 shown in and any one of the four connection portions 102. However, the embodiment is not limited thereto. Figure 3 The structure between the island portion 101 shown in and other connection portions 102 may be the same as the structure described above with reference to Figure 9 the description.

[0154] Figure 11It is a plan view of the structure of the basic unit of the display device according to an embodiment.

[0155] Referring to Figure 11 , pixels can be arranged on the island portion 101 of the substrate 100, and each pixel can include a display element. The light emitted from the display element can be provided through an emission region having a predetermined area in a planar view. For example, as Figure 11 shown, a red emission region EAr, a blue emission region EAb, and a green emission region EAg can be positioned at a predetermined distance from each other or provided on the island portion 101.

[0156] The substrate 100 can include a connection portion 102, which can be integrally formed with the above-described island portion 101 and extend from the edge or multiple edges of the island portion 101. Its detailed structure is as described above.

[0157] In a planar view, the island portion 101 can be completely surrounded by the spacer 217, and a gap portion GP can be arranged inside the spacer 217 or arranged side by side with the spacer 217.

[0158] An inorganic contact region (hereinafter, referred to as the first inorganic contact region ICA) can be arranged inside the gap portion GP or arranged side by side with the gap portion GP, and another inorganic contact region (hereinafter, referred to as the second inorganic contact region ICA') can be arranged outside the gap portion GP. The first inorganic contact region ICA and the second inorganic contact region ICA' can be spaced apart from each other, and the gap portion GP is therebetween.

[0159] A third inorganic contact region ICA'' can be spaced apart from the second inorganic contact region ICA', and the spacer 217 is therebetween. The emission regions (e.g., the red emission region EAr, the blue emission region EAb, and the green emission region EAg) can be surrounded or completely surrounded by the first inorganic contact region ICA, the second inorganic contact region ICA', and the third inorganic contact region ICA''.

[0160] As described above, the distance between the emission regions can be constant, and a contact portion (or, for example, a counter electrode contact portion CECNP) for applying a predetermined or selected voltage to each display element can be provided inside the inorganic contact region ICA. For example, the distance d3 between the red emission region EAr and the blue emission region EAb can be substantially equal to the distance d4 between the blue emission region EAb and the green emission region EAg. However, the distance is not limited thereto. The counter electrode contact portion CECNP can be positioned or provided inside the island portion 101, adjacent to the first inorganic contact region ICA.

[0161] Figure 12 is a schematic cross-sectional view of the display device according to an embodiment, and can be alongFigure 11 corresponds to the cross-section taken along the line XII-XII'.

[0162] Referring to Figure 12 , an insulating layer (such as a buffer layer 201, a gate insulating layer 203, a first interlayer insulating layer 205, a second interlayer insulating layer 207, a first inorganic insulating layer 208, a first organic insulating layer 209, a second organic insulating layer 211, and a third organic insulating layer 213) may be formed or provided on the island portion 101 of the substrate 100.

[0163] The edge of each of the buffer layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 may be positioned or provided inwardly from the edge of the island portion 101 and may be covered by an organic material layer 220.

[0164] The gap portion GP may be positioned or provided between the first inorganic contact region ICA and the second inorganic contact region ICA'. The gap portion GP may be a type of groove in which, in a cross-sectional view, a hanging structure or a plurality of hanging structures may be formed on opposite sides thereof with respect to a virtual vertical line passing through the center of the gap portion GP.

[0165] The hanging structure may be formed at the side with respect to the center of the gap portion GP. For example, the end of the third inorganic insulating layer 214 may protrude more toward the center of the gap portion GP than the side surface of the third organic insulating layer 213 to form tips PT and PT', the third organic insulating layer 213 may be positioned or provided below the third inorganic insulating layer 214, and may define a recess R'. As described above, the first functional layer 222a, the second functional layer 222c, and the counter electrode 223 may be disconnected or separated by the hanging structure or a plurality of hanging structures positioned or provided at the side of the gap portion GP.

[0166] As Figure 12 shown, the recess R' corresponding to the gap portion GP of the third organic insulating layer 213 may have a concave shape in the thickness direction of the third organic insulating layer 213. As Figure 12 shown, the recess R' may not penetrate the third organic insulating layer 213, and the depth of the recess R' may be smaller than the thickness of the third organic insulating layer 213. According to another embodiment, for example, as described above with reference to Figure 7 , the recess R' may penetrate the third organic insulating layer 213.

[0167] The first inorganic encapsulation layer 310 may directly contact the bottom surface 214B1 of the tip PT and the bottom surface 214B2 of the tip PT' to form the first inorganic contact region ICA and the second inorganic contact region ICA', respectively.

[0168] For example, the bottom surface 214B1 of the third inorganic insulating layer 214 corresponding to the tip PT positioned or disposed inside the gap portion GP may contact or directly contact the first inorganic encapsulation layer 310, and thus a first inorganic contact area ICA may be formed. The bottom surface 214B2 of the third inorganic insulating layer 214 corresponding to the tip PT' positioned or disposed outside the gap portion GP may contact or directly contact the first inorganic encapsulation layer 310, and thus a second inorganic contact area ICA' may be formed.

[0169] While the bottom surface 214B3 of the tip PT” of the third inorganic insulating layer 214 protruding in a direction away from the center of the island portion 101 contacts the first inorganic encapsulation layer 310, a third inorganic contact area ICA” spaced apart from the second inorganic contact area ICA' with respect to the spacer 217 may be formed. The tip PT” of the third inorganic insulating layer 214 extending away from the center of the island portion 101 may protrude more in the horizontal direction than the side surfaces of the first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213, and the first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213 may be disposed below the third inorganic insulating layer 214 and may define a recess R.

[0170] The counter electrode 223 may be disconnected through the recess R below the third inorganic contact area ICA”. In this regard, Figure 12 It is shown that a part of the counter electrode 223 may be disposed on the first inorganic insulating layer 208.

[0171] The organic encapsulation layer 320 of the encapsulation layer 300 may fill at least a part of the gap portion GP. The edge of the organic encapsulation layer 320 may be positioned or disposed inside the spacer 217. The second inorganic encapsulation layer 330 may extend beyond the edge of the organic encapsulation layer 320 toward the edge of the first inorganic encapsulation layer 310. The second inorganic encapsulation layer 330 and the first inorganic encapsulation layer 310 may contact each other on the spacer 217 and / or on the side surface of the display device.

[0172] The light-emitting diode LED may have a stacked structure including a pixel electrode 221, an intermediate layer 222, and a counter electrode 223. The edges 222ae of the first functional layer 222a and the edges 222ce of the second functional layer 222c disposed below and above the emission layer 222b of the intermediate layer 222 may be disposed on the spacer 217. For example, the detailed description thereof is referred to above Figure 7 has been described.

[0173] As Figure 12As shown, the encapsulation layer 300 may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320. However, in other embodiments, the organic encapsulation layer 320 of the encapsulation layer 300 may be omitted. For example, the encapsulation layer 300 may include only one or more inorganic encapsulation layers. However, the embodiments are not limited thereto.

[0174] Figure 13 is a plan view of the structure of a basic unit of a display device according to an embodiment, Figure 14 showing along Figure 13 a schematic cross-sectional view of a cross-section taken along line XIV-XIV'.

[0175] Referring to Figure 13 , a red emission region EAr, a blue emission region EAb, and a green emission region EAg may be positioned or disposed on the island portion 101 of the substrate 100. As described above, the island portion 101 may be connected to adjacent island portions 101 through connection portions 102, and the connection portions 102 may be integrally formed with the island portion 101 and extend from the edge or edges of the island portion 101.

[0176] In a planar view, the island portion 101 may be surrounded or completely surrounded by the spacer 217, and a gap portion GP may be disposed inside the spacer 217 or side by side with the spacer 217.

[0177] A first inorganic contact region ICA may be disposed inside the gap portion GP or side by side with the gap portion GP, and a second inorganic contact region ICA' may be disposed outside the gap portion GP or side by side with the gap portion GP. The first inorganic contact region ICA and the second inorganic contact region ICA' may be spaced apart from each other, with the gap portion GP therebetween.

[0178] Different from the display device described with reference to Figure 11 , Figure 13 the display device shown in Figure 11 may not include a third inorganic contact region ICA'' as shown in

[0179] According to an embodiment, as Figure 14 shown, for example, the edge of the insulating layer disposed on the substrate 100 may be disposed on the same vertical line as the edge of the island portion 101 of the substrate 100. The side surfaces of the substrate 100 (e.g., the side surfaces of the island portion 101), the side surfaces of the insulating layer on the substrate 100 (e.g., the side surfaces of the organic material layer 220, the side surfaces of the first to third organic insulating layers 209, 211, and 213, and the side surface of the third inorganic insulating layer 214), and the side surface of the pixel defining layer 215 may be covered with the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. Different from the display device described with reference to Figure 12 ​Figure 14 The display device shown in Figure 12 may not include the third inorganic contact area ICA” shown in Figure 12 . However, the features of other components may be the same as or similar to those of the other components described with reference to Figure 14 . In this regard, in Figure 12 , the same reference numerals are used for components that are the same as the components shown in

[0180] Figure 15 is a schematic cross-sectional view of a display device according to an embodiment and may correspond to a schematic cross-section taken along line XII-XII' of Figure 11 .

[0181] Referring to Figure 15 , the structure related to the third inorganic contact area ICA” may be different from the structure described with reference to Figure 12 . Hereinafter, among the components of Figure 15 , the components that are the same as the components of Figure 12 are shown using the same reference numerals in Figure 15 . For ease of description, the following description will be made based on the differences.

[0182] Referring to Figure 15 , the third inorganic contact area ICA” may be formed using the layer 219 between the island portion 101 of the substrate 100 and the pixel electrode 221. The layer 219 may include a material different from the organic material. The layer 219 may include an inorganic insulating layer containing an inorganic insulating material (such as silicon oxide, silicon oxynitride, or silicon nitride), or may include a metal layer containing a metal. The metal layer included in the layer 219 may include metal elements (e.g., molybdenum, titanium, and / or aluminum), and the metal elements do not include carbon. The metal layer may be classified as an inorganic material layer because it does not include carbon.

[0183] A part of the first organic insulating layer 209 may be etched to form a recess R. The recess R may be disposed below the layer 219. The layer 219 may protrude more in the horizontal direction than the side surface of the first organic insulating layer 209 that may define the recess R to form a tip PT”.

[0184] The counter electrode 223 may be disconnected by a hanging structure or a plurality of hanging structures formed as part of the layer 219. For example, the edge of the layer 219 may protrude more than the side surface of the first organic insulating layer 209. In this regard, Figure 15 shows that a part of the counter electrode 223 may be disposed on the bottom surface of the recess R, for example, disposed on the first inorganic insulating layer 208.

[0185] The bottom surface 219B3 of the tip PT of layer 219 may contact or directly contact the first inorganic encapsulation layer 310. The contact portion between the bottom surface 219B3 of layer 219 and the first inorganic encapsulation layer 310 may form a third inorganic contact area ICA”. When layer 219 includes an inorganic insulating material, the contact portion between layer 219 and the first inorganic encapsulation layer 310 (e.g., the third inorganic contact area ICA”) may include contact between inorganic insulating materials. Layer 219 may include a metal as described above. Since the metal does not include carbon, it can be classified as an inorganic material. Therefore, the contact portion between layer 219 and the first inorganic encapsulation layer 310 (e.g., the third inorganic contact area ICA”) may include contact between an inorganic insulating material and a metal.

[0186] Figure 15 It is shown that the tips PT and PT' protruding toward the center of the gap portion GP may be part of the third inorganic insulating layer 214, and the tips PT and PT' of the third inorganic insulating layer 214 may contact the first inorganic encapsulation layer 310. As an example, referring to Figure 16 , the tips PT and PT' protruding toward the center of the gap portion GP may be part of layer 219.

[0187] Figure 16 is a schematic cross-sectional view of a display device according to an embodiment, and may correspond to a schematic cross-section taken along the line XII-XII' of Figure 11 . Hereinafter, among the components of Figure 16 , the components identical to those of Figure 12 may be shown with the same reference numerals in Figure 16 . For ease of description, the following description will be made based on the differences.

[0188] Referring to Figure 16 , layer 219 may include a hole overlapping with the gap portion GP. Layer 219 defines a hole in layer 219 and may include tips PT and PT' extending toward the center of the gap portion GP.

[0189] For example, layer 219 may have a pair of tips PT and PT' extending toward the center of the gap portion GP and a tip PT” extending toward the edge of the substrate 100 (e.g., the island portion 101). The structure of the tip PT” extending toward the edge of the island portion 101 (or horizontally extending in a direction away from the center of the island portion 101) is as described with reference to Figure 15 .

[0190] A pair of tips PT and PT' extending towards the center of the gap portion GP extend in the horizontal direction and may protrude more towards the center of the gap portion GP than the side surfaces of at least one layer (e.g., the first organic insulating layer 209) directly disposed below the tips PT and PT'. Here, the side surfaces of the first organic insulating layer 209 may represent the side surfaces of the first organic insulating layer 209 that define the recess R'.

[0191] At least one organic layer (e.g., the first functional layer 222a and / or the second functional layer 222c) provided in the intermediate layer 222 may be disconnected by a hanging structure or a plurality of hanging structures formed as part of the layer 219. For example, the pair of tips PT and PT' may protrude more than the side surfaces of the first organic insulating layer 209. Similarly, the counter electrode 223 may also be disconnected by the hanging structure or the plurality of hanging structures described above.

[0192] While at least a part of the first organic insulating layer 209 may be removed in the thickness direction of the first organic insulating layer 209, the recesses R and R' of the first organic insulating layer 209 may be formed. Depending on the degree of removal of the first organic insulating layer 209 in the thickness direction, the depths of the recesses R and R' may be equal to or less than the thickness of the first organic insulating layer 209.

[0193] While a stacked structure including the first organic insulating layer 209, the layer 219, the second organic insulating layer 211, the third organic insulating layer 213, the third inorganic insulating layer 214, and the pixel defining layer 215 may be removed in the thickness direction of the stacked structure, the gap portion GP may be formed. In an embodiment, the gap portion GP may have a structure in which the recess R' of the first organic insulating layer 209, the hole passing through the layer 219, the hole passing through the second organic insulating layer 211, the hole passing through the third organic insulating layer 213, the hole passing through the third inorganic insulating layer 214, and the hole passing through the pixel defining layer 215 may be stacked on top of each other in the vertical direction.

[0194] The first inorganic encapsulation layer 310 of the encapsulation layer 300 may contact or directly contact the bottom surface 219B1 of the tip PT of the layer 219, the bottom surface 219B2 of the tip PT', and the bottom surface 219B3 of the tip PT'' to form a first inorganic contact area ICA, a second inorganic contact area ICA', and a third inorganic contact area ICA'', respectively.

[0195] Figure 15 and Figure 16 It is shown that the layer 219 may be disposed below the pixel electrode 221 and may be disposed on the first organic insulating layer 209. However, in other embodiments, the layer 219 may be disposed on the second organic insulating layer 211 or on the third organic insulating layer 213.

[0196] Figure 15 and Figure 16 shows a first inorganic contact area ICA, a second inorganic contact area ICA', and a third inorganic contact area ICA". However, in other embodiments, one of the first inorganic contact area ICA, the second inorganic contact area ICA', and the third inorganic contact area ICA" may be omitted. For example, as referred to above with reference to Figure 13 and Figure 14 described, the third inorganic contact area ICA" may be omitted.

[0197] Figure 15 and Figure 16 shows that the encapsulation layer 300 may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320. However, in other embodiments, the organic encapsulation layer 320 of the encapsulation layer 300 may be omitted. For example, the encapsulation layer 300 may include only one or more inorganic encapsulation layers. However, the disclosure is not limited thereto.

[0198] According to one or more of the described embodiments, a structure for encapsulating a display unit may be provided. Accordingly, a part of the inorganic insulating layer may have an overhang. In addition, the spatial availability of the substrate may be improved.

[0199] It should be understood that the embodiments described herein should be considered only in a descriptive sense and not for purposes of limitation. The description of each feature or aspect in each embodiment should generally be considered available for other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those of ordinary skill in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the claims.

Claims

1. A display device, the display device comprising: a substrate including an island portion and a plurality of connection portions extending from the island portion in different directions from each other; a display unit located on the island portion, the display unit including at least one display element; and a encapsulation layer covering the at least one display element and including an inorganic encapsulation layer and an organic encapsulation layer, wherein the display unit includes: at least one organic insulating layer; and an inorganic insulating layer located on the at least one organic insulating layer, the inorganic insulating layer having a tip that protrudes beyond a side surface of the at least one organic insulating layer in a direction parallel to an upper surface of the substrate, and a part of the inorganic encapsulation layer extends toward a bottom surface of the tip to overlap with the bottom surface of the tip of the inorganic insulating layer.

2. The display device according to claim 1, wherein the part of the inorganic encapsulation layer is in direct contact with the bottom surface of the tip of the inorganic insulating layer.

3. The display device according to claim 2, wherein the part of the inorganic encapsulation layer further extends from the bottom surface of the tip and covers the side surface of the at least one organic insulating layer and the side surface of the substrate.

4. The display device according to claim 1, wherein the at least one display element includes a first display element that emits red light, a second display element that emits blue light, and a third display element that emits green light, and according to a plan view, the tip of the inorganic insulating layer is located around the first display element, the second display element, and the third display element.

5. The display device according to claim 1, wherein the at least one display element includes: a pixel electrode located on the inorganic insulating layer; a pixel defining layer located on the pixel electrode, the pixel defining layer having an opening that overlaps with the pixel electrode; an intermediate layer having an emission layer that overlaps with the pixel electrode; and a counter electrode located on the intermediate layer, wherein the counter electrode covers the island portion.

6. The display device according to claim 5, wherein the intermediate layer includes at least one functional layer located between the pixel electrode and the counter electrode.

7. The display device according to claim 5, wherein a region where the part of the inorganic encapsulation layer and the bottom surface of the tip of the inorganic insulating layer are in direct contact with each other is an inorganic contact region, and the inorganic contact region is located around the at least one display element.

8. The display device according to claim 7, the display device further comprising: a spacer located on the island portion, wherein a part of the inorganic contact region is located between the spacer and the at least one display element.

9. The display device according to claim 8, wherein In a plan view, the inorganic insulating layer has a second tip protruding beyond the side surface of the at least one organic insulating layer. The inorganic encapsulation layer is in direct contact with the second tip of the inorganic insulating layer, and the region where the inorganic encapsulation layer and the second tip of the inorganic insulating layer are in direct contact with each other is a second inorganic contact region. The second inorganic contact region is separated from the inorganic contact region and is located around the spacer.

10. The display device according to claim 7, the display device further comprises: A power supply voltage supply line located on the island portion, wherein the contact portion between the counter electrode and the power supply voltage supply line is located inside the region inside the inorganic contact region.

11. The display device according to claim 10, wherein, the power supply voltage supply line extends from the island portion to at least one of the plurality of connection portions.

12. The display device according to claim 11, the display device further comprises: A second inorganic insulating layer located between the island portion and the at least one connection portion, wherein the second inorganic insulating layer covers a part of the upper surface of the power supply voltage supply line and overlaps with the inorganic contact region.

13. The display device according to claim 1, wherein, the substrate includes a basic unit arranged repeatedly, and each basic unit includes the island portion and the plurality of connection portions, and a closed line is formed between adjacent basic units among the basic units, and the closed line defines an interval region where there is no island portion and a portion of the plurality of connection portions.

14. A display device, the display device comprises: A substrate; A plurality of display units located on the substrate and separated from each other; and An encapsulation layer located on the plurality of display units, the encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer, wherein the substrate includes a plurality of island portions separated from each other and a plurality of connection portions connecting adjacent island portions, and the plurality of display units are each arranged on a corresponding island portion. Among them, the first display unit arranged on the first island portion among the plurality of island portions includes: A pixel circuit including a thin film transistor and a storage capacitor; At least one organic insulating layer located on the pixel circuit; An inorganic insulating layer located on the at least one organic insulating layer; and A display element electrically connected to the pixel circuit and including a pixel electrode, an intermediate layer including an emission layer, and a counter electrode, wherein the inorganic insulating layer includes a tip protruding beyond the side surface of the at least one organic insulating layer in a direction parallel to the upper surface of the substrate, and a part of the inorganic encapsulation layer extends toward the bottom surface of the tip to overlap with the bottom surface of the tip of the inorganic insulating layer.

15. The display device according to claim 14, wherein, the part of the inorganic encapsulation layer is in direct contact with the bottom surface of the tip of the inorganic insulating layer.

16. The display device according to claim 15, wherein, The portion of the inorganic encapsulation layer further extends from the bottom surface of the tip and covers the side surfaces of the at least one organic insulating layer and the side surfaces of the first island portion.

17. The display device according to claim 14, wherein, the depression in the thickness direction of the at least one organic insulating layer is located below the tip of the inorganic insulating layer.

18. The display device according to claim 17, the display device further comprises: a second inorganic insulating layer, which is stacked with the depression, wherein, the bottom surface of the depression and the upper surface of the second inorganic insulating layer are in the same plane.

19. The display device according to claim 14, wherein, the region where the bottom surface of the tip of the inorganic insulating layer and the portion of the inorganic encapsulation layer are in direct contact with each other is the inorganic contact region around the display element.

20. The display device according to claim 19, wherein, the plurality of connection portions include a first connection portion, the first connection portion connects the first island portion and a second island portion adjacent to the first island portion, and the line electrically connecting the first display unit and the second display unit on the second island portion is arranged on the first connection portion, wherein, the line overlaps with a part of the inorganic contact region.

21. The display device according to claim 20, wherein, the line includes a power voltage supply line electrically connected to the counter electrode, wherein, the contact portion between the power voltage supply line and the counter electrode is located inside the region inside the inorganic contact region.

22. The display device according to claim 19, the display device further comprises: a spacer, which is located on the first island portion, wherein, a part of the inorganic contact region is located between the spacer and the display element, wherein, the portion of the inorganic insulating layer between the inorganic contact region and the spacer includes a second tip, the second tip protrudes beyond the side surface of the at least one organic insulating layer in the direction parallel to the upper surface of the substrate, and the inorganic encapsulation layer is in direct contact with the second tip to form a second inorganic contact region, and wherein, in a plan view, the second inorganic contact region is separated from the inorganic contact region and is located around the spacer.

23. The display device according to claim 22, the display device further comprises: a groove, which is located between the inorganic contact region and the second inorganic contact region, wherein, each of the tip and the second tip protrudes towards the center of the groove, and both the counter electrode and at least one organic material layer included in the intermediate layer are separated by the tip and the second tip.

Images