LED Lighting Device, LED Lamp, and LED Display Screen

By encapsulating phosphor in the LED light emitting unit and combining the heat dissipation body, the light mixing problem of multiple LED light emitting wafers is solved, and efficient light mixing control of LED lamps and display screens is realized.

CN112185942BActive Publication Date: 2025-07-08SHANGHAI SANSI ELECTRONICS ENG +3
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Patent Information

Application Number
CN201910585655.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-07-01
Publication Date
2025-07-08
Estimated Expiration
2039-07-01

AI Technical Summary

Technical Problem

In the prior art, the light distribution design of multi-LED light emitting wafers is difficult to achieve the desired light mixing effect.

Method used

A plurality of LED light emitting units are used to encapsulate a heat dissipation body of phosphor, and the mixed light output is achieved through the cooperation of the phosphor and the LED light emitting wafer.

Benefits of technology

It realizes precise control of mixed light colors, improving the color rendering index and color temperature performance of LED lamps and LED displays.

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Abstract

The LED lighting device, LED lamp, and LED display screen of the present application. The LED lighting device includes: a plurality of LED lighting units mounted on a heat sink; wherein, at least one kind of phosphor is encapsulated in the plurality of LED lighting units. That is to say, by using the same kind of phosphor or multiple kinds of phosphors encapsulated in each LED lighting unit, the light-emitting color and even the mixed light color of multiple LED lighting units can be easily controlled, thus solving the problems of the prior art.
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Description

Technical Field

[0001] This application relates to the field of LED technology, and particularly to LED light-emitting devices, LED lamps, and LED displays. Background Art

[0002] In lighting solutions with multiple LED light-emitting wafers, how to perform light distribution to obtain the required mixed light is a technical problem in design. Summary of the Invention

[0003] In view of the above-mentioned disadvantages of the prior art, the purpose of this application is to provide LED light-emitting devices, LED lamps, and LED displays to solve the problems in the prior art.

[0004] To achieve the above and other related objectives, this application provides an LED light-emitting device, including: a plurality of LED light-emitting units mounted on a heat sink; wherein, at least one kind of phosphor is encapsulated in the plurality of LED light-emitting units.

[0005] In one or more embodiments of this application, the heat sink is made of ceramic material.

[0006] In one or more embodiments of this application, the light emitted by the plurality of LED light-emitting units is mixed into a mixed light of a predetermined color for output.

[0007] In one or more embodiments of this application, the plurality of LED light-emitting units include: one or more first light-emitting units; each first light-emitting unit includes: a first LED light-emitting wafer, and a first optical encapsulation component provided with a first phosphor and encapsulated outside the first LED light-emitting wafer; wherein, the first phosphor is excited by the irradiation of the first LED light-emitting wafer and outputs: light of a color determined by the mixture of the color of the first phosphor and the light-emitting color of the first LED light-emitting wafer.

[0008] In one or more embodiments of this application, the plurality of LED light-emitting units further include: one or more second light-emitting units; each second light-emitting unit includes: a second LED light-emitting wafer, and a second optical encapsulation component encapsulated outside the second LED light-emitting wafer; wherein, the light emitted by the one or more second light-emitting units is used to participate in the mixed light to set the color rendering index and / or color temperature of the mixed light.

[0009] In one or more embodiments of this application, there are multiple first light-emitting units, the light-emitting colors of their first LED light-emitting wafers are the same or different, and the components of the first phosphors are different, resulting in different color temperatures of the light output by each of them.

[0010] In one or more embodiments of the present application, there are multiple first light-emitting units, the light-emitting colors of the first LED light-emitting wafers thereof are the same, and the components of the first phosphor are the same, so that the color temperatures of the emitted lights output by each are the same.

[0011] In one or more embodiments of the present application, the first phosphor includes: phosphors of multiple primary colors for cooperating with the light-emitting color of the first LED light-emitting wafer to form white light.

[0012] In one or more embodiments of the present application, each LED light-emitting unit includes: at least two of the second light-emitting units, which are respectively used to set the color rendering index and color temperature of the mixed light.

[0013] In one or more embodiments of the present application, the second optical encapsulation component contains a transparent phosphor or does not contain a phosphor.

[0014] In one or more embodiments of the present application, the multiple LED light-emitting units include: multiple third light-emitting units; wherein, the light-emitting colors of each third light-emitting unit cooperate with each other to mix into a mixed light of a predetermined color.

[0015] In one or more embodiments of the present application, if the light-emitting color of each third light-emitting unit is white light, the types of mutual cooperation include: three primary colors, or three primary colors cooperating with one or more mixed light colors.

[0016] In one or more embodiments of the present application, each of the third light-emitting units includes: a third LED light-emitting wafer, and a third optical encapsulation component provided with a third phosphor and encapsulated outside the third LED light-emitting wafer.

[0017] In one or more embodiments of the present application, the light-emitting colors of each third LED light-emitting wafer are different, while the components of the third phosphor in each third optical encapsulation component are the same.

[0018] In one or more embodiments of the present application, the light-emitting colors of each third LED light-emitting wafer are the same, while the components of the third phosphor in each third optical encapsulation component are different.

[0019] In one or more embodiments of the present application, the third optical encapsulation components are connected to each other to form an overall encapsulation component with a smooth curved outer surface.

[0020] To achieve the above objectives and other related objectives, the present application provides an LED lamp, including: one or more of the above-mentioned LED light-emitting devices.

[0021] To achieve the above objectives and other related objectives, the present application provides an LED display screen, including: one or more of the above-mentioned LED light-emitting devices.

[0022] As described above, the LED lighting device, LED lamp, and LED display screen of the present application. The LED lighting device includes: a plurality of LED lighting units mounted on a heat sink; wherein, at least one phosphor is encapsulated in the plurality of LED lighting units. That is to say, by using the same phosphor or multiple phosphors encapsulated in each LED lighting unit, the light output color and even the mixed light color of multiple LED lighting units can be easily controlled, solving the problems of the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It shows a schematic structural diagram of the LED lighting device in the first embodiment of the present application.

[0024] Figure 2 It shows a schematic structural diagram of the LED lighting device in the second embodiment of the present application.

[0025] Figure 3 It shows a schematic structural diagram of the LED lighting device in the third embodiment of the present application.

[0026] Figure 4 It shows a schematic structural diagram of the LED lighting device in the fourth embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following uses specific specific examples to illustrate the embodiments of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and application systems without departing from the spirit of the present application. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0028] The following takes the drawings as a reference and details the embodiments of the present application so that those skilled in the art to which the present application pertains can easily implement it. The present application can be embodied in many different forms and is not limited to the embodiments described herein.

[0029] In order to clearly illustrate the present application, components irrelevant to the description are omitted, and the same or similar constituent elements throughout the specification are given the same reference numerals.

[0030] Throughout the specification, when it is said that a component is "connected" to another component, this includes not only the case of "direct connection", but also the case of "indirect connection" with other elements placed therebetween. In addition, when it is said that a certain component "includes" a certain constituent element, unless there is a particularly contrary record, it does not exclude other constituent elements, but means that other constituent elements can also be included.

[0031] When it is said that a component is "above" another component, this can be directly above the other component, but there can also be other components in between. When it is said, in contrast, that a component is "directly" "above" another component, there are no other components in between.

[0032] Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the description of a first interface and a second interface, etc. Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to also include the plural forms unless the context clearly indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the stated features, steps, operations, elements, components, items, kinds, and / or groups, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are to be interpreted as inclusive, or meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition only occurs when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0033] The technical terms used herein are only for referring to specific embodiments and are not intended to limit this application. The singular forms used herein also include the plural forms as long as the context does not clearly indicate the contrary. The meaning of "including" used in the specification is to embody specific characteristics, regions, integers, steps, operations, elements, and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements, and / or components.

[0034] Relative spatial terms such as "lower", "upper", etc. may be used to more easily describe the relationship of one component to another component illustrated in the drawings. Such terms refer not only to the meaning indicated in the drawings, but also to other meanings or operations of the device in use. For example, if the device in the drawing is flipped, a component that was described as "lower" than another component would then be described as "above" the other component. Thus, the exemplary term "lower" includes both above and below. The device can be rotated 90° or other angles, and the relative spatial terms are interpreted accordingly.

[0035] Although not defined differently, including technical and scientific terms used herein, all terms shall have the same meaning as generally understood by those skilled in the technical field to which this application pertains. Terms defined in commonly used dictionaries are additionally interpreted to have meanings consistent with relevant technical literature and the content presented herein. Unless defined otherwise, they shall not be overly interpreted as ideal or highly formulaic meanings.

[0036] In view of the deficiencies of the prior art, this application aims to provide a single type or multiple types of phosphors encapsulated in multiple LED light-emitting units, in combination with various color mixtures that emit light in accordance with the original colors of the LED light-emitting wafers encapsulated therewith, to solve the problems of the prior art.

[0037] The LED light-emitting device provided by this application includes: multiple LED light-emitting units mounted on a heat sink; wherein, at least one type of phosphor is encapsulated in the multiple LED light-emitting units.

[0038] In a possible implementation, each LED light-emitting unit includes an LED light-emitting wafer and an optical encapsulation component that wraps it. The optical encapsulation component may be a lens material or an encapsulation colloid; it is possible to select to provide one or more colors of phosphors in the optical encapsulation component. For example, phosphors are coated in the lens material, or an encapsulation colloid mixed with phosphors is made.

[0039] It can be understood that the phosphor is excited by the light emitted by the LED light-emitting wafer and emits light. Its color and the emission color of the LED light-emitting wafer are complementary, that is, the emission color after exciting the phosphor is a mixed color of the emission color of the LED light-emitting wafer and the color of the phosphor.

[0040] For example, the light emitted by each LED light-emitting unit can be, for example, white light, or can be primary color lights used to mix into white light, such as R (red), G (green), B (blue), etc., or can be other colors; correspondingly, the types and colors of the phosphors in each optical encapsulation component can also be coordinated with the color of the LED light-emitting wafer to be able to mix into white light or the corresponding color light.

[0041] For example, if three primary color phosphors, namely red light phosphor, green light phosphor, and blue light phosphor, are provided in the optical encapsulation component of an LED light-emitting unit, then the LED light-emitting wafer can use, for example, an ultraviolet LED wafer to emit ultraviolet light to excite the three primary color phosphors to form white light; or alternatively, if a yellow phosphor is provided in the optical encapsulation component and the LED light-emitting wafer emits blue light, the blue and yellow lights are mixed to form white light.

[0042] Alternatively, the three LED light-emitting units emit red light, green light, and blue light respectively, which can also be mixed into white light for output; the light-emitting colors of the three LED light-emitting units can be obtained by the corresponding color phosphors being excited by the light emission of, for example, an ultraviolet LED chip, or can be obtained by LED chips that emit light of the corresponding colors.

[0043] The following shows the structures of possible LED light-emitting devices through multiple embodiments.

[0044] As Figure 1 shown, a schematic structural diagram of the LED light-emitting device in the first embodiment of the present application is shown.

[0045] In this embodiment, multiple LED light-emitting units are mounted on the heat sink 101.

[0046] The heat sink is preferably a ceramic heat sink. The multiple LED light-emitting units correspond to multiple LED chips, and there is a lot of heat. Therefore, using a heat sink made of a ceramic material with a high thermal conductivity coefficient to dissipate heat from the multiple LED chips can well solve the heat dissipation problem.

[0047] Among the multiple LED light-emitting units, there are: multiple first light-emitting units 102. Although it is shown as 3 in the illustration of this embodiment, it is not limited thereto.

[0048] In this embodiment, each first light-emitting unit 102 can emit light of a predetermined color (such as white, or other colors such as red, orange, yellow, green, cyan, blue, purple, etc.), and the color temperatures of the colored lights emitted by different first light-emitting units 102 can be different. For example, the color temperatures of the white lights respectively emitted by the first light-emitting unit 102A, the first light-emitting unit 102B, and the first light-emitting unit 102C are different.

[0049] Specifically, in a possible implementation manner, each first light-emitting unit 102 includes: a first LED chip 121 and a first optical encapsulation component 122 provided with a first phosphor and encapsulated outside the first LED chip 121; wherein, the first phosphor is irradiated and excited by the first LED chip 121 to output colored light.

[0050] Optionally, taking the first light-emitting unit 102 as an example of emitting white light, the light-emitting colors of the first LED light-emitting wafers 121 of the first light-emitting unit 102A, the first light-emitting unit 102B, and the first light-emitting unit 102C may be the same, such as all blue light or ultraviolet light, or may be different, such as some being blue light and the other part being ultraviolet light; the components of their first phosphor are different. For example, they are all first phosphors configured by at least three primary color R, G, B phosphors, and among them, the ratios of the R, G, B phosphors, or the contents, or doped with phosphors of other colors other than the R, G, B phosphors (such as yellow Y and / or cyan G, etc.) in one or more of the first phosphors may be different.

[0051] Optionally, the LED light-emitting device further includes: one or more second light-emitting units 103, which are shown as 2 in this embodiment, but not limited thereto.

[0052] The light emitted by the one or more second light-emitting units 103 is used to participate in the mixed light to set the color rendering index and / or color temperature of the mixed light. Optionally, in this embodiment, the second light-emitting unit 103 is shown as 2, that is, there may be at least two. One is used to set the color rendering index of the mixed light (the mixed light of the white light emitted by the first light-emitting unit 102A, the first light-emitting unit 102B, and the first light-emitting unit 102C), and the other is used to set the color temperature of the mixed light.

[0053] The setting means that due to the presence of the second light-emitting unit 103, compared with the case where it does not exist, the light it emits will participate in the mixed light, thereby changing the color temperature / color rendering index of the mixed light; thus, when the light emission of the second light-emitting unit 103 is determined and it is added to the LED light-emitting device, the color temperature / color rendering index of the mixed light can be controlled.

[0054] Each second light-emitting unit 103 includes: a second LED light-emitting wafer 131 and a second optical packaging component 132 encapsulated outside the second LED light-emitting wafer 131. Optionally, a transparent phosphor or no phosphor is provided in the second optical packaging component 132, and the second LED light-emitting wafer 131 can be selected to emit light of the required color, such as blue, etc.; of course, the second optical packaging component 132 can also contain the phosphor of the required color, and the cooperation between the color of the phosphor and the light-emitting color of the LED light-emitting wafer can find corresponding theoretical bases in the above embodiments or existing colorimetry, and will not be elaborated here.

[0055] Another example Figure 2 As shown, it is a schematic structural diagram of the LED light-emitting device in the second embodiment of the present application.

[0056] Compared with the first embodiment, the heat sink 201 is still used to dissipate heat from multiple LED light-emitting units 202. The main difference in this embodiment is that the first phosphors in the first optical encapsulation components 222 of the first light-emitting unit 202A, the first light-emitting unit 202B, and the first light-emitting unit 202C are of the same composition, and the first LED light-emitting wafers 221 in the first optical encapsulation components 222 of the first light-emitting unit 202A, the first light-emitting unit 202B, and the first light-emitting unit 202C can be the same, so as to output mixed light of a fixed color temperature; or, the first LED light-emitting wafers 221 in the first optical encapsulation components 222 of the first light-emitting unit 202A, the first light-emitting unit 202B, and the first light-emitting unit 202C can also be different, such as different in power, light-emitting color, etc.

[0057] The structure of the second light-emitting unit 203 in this embodiment can be similar to that of the second light-emitting unit 103 in the first embodiment, so it will not be repeated here.

[0058] Please refer to Figure 3 again, which shows a schematic structural diagram of the LED light-emitting device in the third embodiment of the present application.

[0059] Multiple LED light-emitting units are mounted on the heat sink 301. Compared with the aforementioned first embodiment and second embodiment, the main difference in this embodiment is:

[0060] The multiple LED light-emitting units include: multiple third light-emitting units 302; wherein, the light-emitting colors of each third light-emitting unit 302 cooperate with each other to mix into mixed light of a desired color.

[0061] In a possible implementation manner, taking the mixed light as white light as an example, the types of the light-emitting colors of each third light-emitting unit 302 cooperating with each other include: three primary colors, or three primary colors combined with one or more mixed light colors.

[0062] For example, in Figure 3 , 4 third light-emitting units 302 are shown. Among them, 3 emit light of R, G, and B colors, so as to be able to mix into white light; the light-emitting color of the remaining one third light-emitting unit 302 is the color for mixed light, such as yellow Y or cyan G.

[0063] Each of the third light-emitting units 302 includes: a third LED light-emitting wafer 321, and a third optical encapsulation component 322 provided with a third phosphor and encapsulating the third LED light-emitting wafer 321.

[0064] Optionally, in some embodiments, the light emissions of the third LED light-emitting wafers 321 of the respective third light-emitting units 302 are different, while the third phosphor components are the same. For example, four third light-emitting LED wafers respectively output light of R, G, B, and Y colors, and each third phosphor can be a transparent phosphor; or, four third LED light-emitting wafers respectively output ultraviolet light, and each third phosphor can be a phosphor corresponding to the R, G, B, and Y colors respectively.

[0065] For another example Figure 4 As shown, it is a schematic structural diagram of the LED light-emitting device in the fourth embodiment of the present application.

[0066] Heat dissipation is still performed using the heat sink 401. Compared with the foregoing third embodiment, the main difference in this embodiment is that:

[0067] The colors among the third phosphors provided in the third optical encapsulation components 432A, 432B, 432C, and 432D included in each third light-emitting unit can be different, while the light-emitting colors of the respective third LED light-emitting wafers (431A, 431B, 431C, 431D) can be the same.

[0068] Optionally, in this embodiment, each of the third optical encapsulation components 432A, 432B, 432C, and 432D (such as encapsulation colloid) can be used as a part, which are joined together to form an overall encapsulation component with a smooth curved outer surface, that is, it looks like a curved lens from the appearance, but in fact, it is formed by splicing the respective third optical encapsulation components 432A, 432B, 432C, and 432D with different shapes as components.

[0069] The LED light-emitting device described in the above embodiments can be applied to actual products, such as LED lamps, LED displays, etc. It can include one or more LED light-emitting devices in the above embodiments. By selecting multiple LED light-emitting units encapsulated with the same or different types of phosphors and capable of achieving the desired color light output, the desired mixed light output can be achieved; and optionally, due to the good heat dissipation performance of the LED light-emitting device that uses a ceramic heat sink to dissipate heat from multiple LED light-emitting units in the embodiments of the present application, the service life of LED lamps and LED displays can be effectively improved, and the user experience can be improved.

[0070] In summary, for the LED light-emitting device, LED lamp, and LED display of the present application, the LED light-emitting device includes: a plurality of LED light-emitting units mounted on a heat sink; wherein, at least one phosphor is encapsulated in the plurality of LED light-emitting units. That is to say, by using the same phosphor or multiple phosphors encapsulated in each LED light-emitting unit, the light output color and even the mixed light color of multiple LED light-emitting units can be easily controlled, solving the problems of the prior art.

[0071] The above embodiments are only illustrative of the principles and effects of the present application and are not intended to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present application should still be covered by the claims of the present application.

Claims

1. An LED lighting device, characterized in that, Comprising: A plurality of LED light-emitting units, mounted on a heat sink; Wherein, at least one kind of phosphor is encapsulated in the plurality of LED light-emitting units; The plurality of LED light-emitting units include: One or more first light-emitting units; each first light-emitting unit includes: a first LED light-emitting chip, and a first optical encapsulation component provided with a first phosphor and encapsulated outside the first LED light-emitting chip; wherein, the first phosphor is excited by the irradiation of the first LED light-emitting chip to output: light of a color determined by the mixture of the color of the first phosphor and the light-emitting color of the first LED light-emitting chip; One or more second light-emitting units; the second light-emitting units are arranged closely adjacent to the first light-emitting units; each second light-emitting unit includes: a second LED light-emitting chip, and a second optical encapsulation component encapsulated outside the second LED light-emitting chip; the second optical encapsulation component contains a transparent phosphor or does not contain a phosphor; wherein, the light output of the one or more second light-emitting units is used to participate in the mixed light to set the color rendering index and / or color temperature of the mixed light; Or the plurality of LED light-emitting units include: a plurality of third light-emitting units; wherein, the light output colors of the respective third light-emitting units cooperate with each other to be mixed into a mixed light of a predetermined color; each of the third light-emitting units includes: a third LED light-emitting chip, and a third optical encapsulation component provided with a third phosphor and encapsulated outside the third LED light-emitting chip; the respective third optical encapsulation components are joined together to form an integral encapsulation component with a smooth curved outer surface.

2. The LED lighting device according to claim 1, wherein The heat sink is made of ceramic material.

3. The LED lighting device according to claim 1, wherein The light output of the plurality of LED light-emitting units is mixed into a mixed light of a predetermined color and output.

4. The LED lighting device according to claim 1, wherein There are a plurality of the first light-emitting units, the light output colors of their first LED light-emitting chips are the same or different, and the components of the first phosphor are different, so that the color temperatures of the light output by each of them are different.

5. The LED lighting device according to claim 1, characterized in that, There are a plurality of the first light-emitting units, the light output colors of their first LED light-emitting chips are the same, and the components of the first phosphor are the same, so that the color temperatures of the light output by each of them are the same.

6. The LED lighting device according to claim 1, wherein The first phosphor includes: phosphors of a plurality of primary colors used to cooperate with the light output color of the first LED light-emitting chip to form white light.

7. The LED lighting device according to claim 1, characterized in that, Each LED light-emitting unit includes: at least two of the second light-emitting units, respectively used to set the color rendering index and color temperature of the mixed light.

8. The LED lighting device according to claim 1, characterized in that, If the light output colors of the respective third light-emitting units are white light, the types of mutual cooperation include: three primary colors, or three primary colors cooperating with one or more mixed light colors.

9. The LED light-emitting device according to claim 8, wherein, The light-emitting colors of the respective third LED light-emitting chips are different, while the components of the third phosphor in the respective third optical encapsulation components are the same.

10. The LED lighting device according to claim 8, wherein The light-emitting colors of the respective third LED light-emitting chips are the same, while the components of the third phosphor in the respective third optical encapsulation components are different.

11. An LED lamp, characterized in that, Comprising: One or more LED light-emitting devices according to any one of claims 1 to 10.

12. An LED display screen, characterized in that, Comprising: One or more LED light-emitting devices according to any one of claims 1 to 10.

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