Touch Sensor and Display Device Having the Same

Abstract

A touch sensor and a display device having the touch sensor are disclosed. The touch sensor includes: a substrate layer including a sensing region and a non-sensing region; a first sensor pattern and a second sensor pattern disposed in the sensing region and arranged along a first direction and a second direction, respectively; a first bridging pattern arranged along the first direction; a second bridging pattern arranged along the second direction; and sensing lines disposed in the non-sensing region and connected to each of the first sensor pattern and the second sensor pattern, wherein each of the sensing lines includes a first metal layer and a second metal layer, and an insulating layer is inserted between the first metal layer and the second metal layer, each of the sensing lines has a first portion and a second portion, the second portion corresponds to at least one of the first bridging patterns disposed at a corner of the sensing region, and the second portion of at least one of the sensing lines has a single-layer structure including only the second metal layer.

Description

[0001] This application claims the priority and benefit of Korean Patent Application No. 10-2019-0082276, filed on Jul. 8, 2019, which is hereby incorporated by reference in its entirety for all purposes as if fully set forth herein. BACKGROUND OF THE INVENTION

[0002] Exemplary embodiments of the invention generally relate to a touch sensor and a display device having the touch sensor. TECHNICAL FIELD

[0003] A touch sensor is a type of information input device and can be provided and used in a display device. For example, the touch sensor can be attached to one surface of a display panel or can be integrally manufactured with the display panel. A user can input information by pressing or touching the touch sensor while viewing an image displayed on the screen of the display device.

[0004] The touch sensor may include a sensing area provided with sensor patterns and a non-sensing area provided with sensing lines. In this case, there may be a density difference of electrode patterns per unit area between the sensing area provided with sensor patterns and the non-sensing area provided with sensing lines. Due to the density difference of electrode patterns per unit area between the sensing area and the non-sensing area, some components of the sensor patterns provided in a specific area of the sensing area, for example, the width (or thickness) of a bridge, may be reduced. If the width of the bridge is reduced, a short-circuit defect may occur in a specific area of the sensing area, thereby reducing the sensing sensitivity of the touch sensor.

[0005] The above information disclosed in this background art section is only for understanding the background of the inventive concept, and thus, it may include information that does not constitute the prior art. SUMMARY OF THE INVENTION

[0006] A touch sensor constructed according to an exemplary embodiment of the invention and a display device including the touch sensor can enhance the sensing sensitivity at a corner by forming at least one sensing line adjacent to a bridging pattern located at a corner of a sensing area as a single layer including a metal layer different from the bridging pattern, such that the density of electrode patterns per unit area in the sensing area is similar to the density of electrode patterns per unit area in the non-sensing area.

[0007] Additional features of the inventive concept will be set forth in the description below, and will be in part apparent from the description, or may be learned by practice of the inventive concept.

[0008] A touch sensor according to an exemplary embodiment includes: a substrate layer including a sensing region and a non-sensing region; a plurality of first sensor patterns disposed in the sensing region and arranged along a first direction; a plurality of first bridging patterns arranged along the first direction, with at least one of the first bridging patterns disposed at a corner of the sensing region; a plurality of second sensor patterns disposed in the sensing region and arranged along a second direction intersecting the first direction; a plurality of second bridging patterns arranged along the second direction; and a plurality of sensing lines disposed in the non-sensing region and connected to each of the first sensor patterns and the second sensor patterns, wherein each of the sensing lines includes a first metal layer and a second metal layer disposed on the first metal layer, and an insulating layer is inserted between the first metal layer and the second metal layer, each of the sensing lines has a first portion and a second portion, the second portion corresponds to at least one of the first bridging patterns, and the second portion of at least one of the sensing lines has a single-layer structure including only the second metal layer.

[0009] The first bridging pattern may be disposed on a layer different from the layer on which the first sensor pattern, the second sensor pattern, and the second bridging pattern are disposed.

[0010] The first metal layer may be disposed on the same layer as the first bridging pattern, and the second metal layer may be disposed on the same layer as the first sensor pattern, the second sensor pattern, and the second bridging pattern.

[0011] The insulating layer may include at least one contact hole, and the first metal layer and the second metal layer are electrically connected through the at least one contact hole.

[0012] The first portion of at least one of the sensing lines may have a double-layer structure including the first metal layer and the second metal layer stacked on the first metal layer.

[0013] The first portion of each of the sensing lines may have a double-layer structure including the first metal layer and the second metal layer disposed on the first metal layer.

[0014] The first metal layer of each of the sensing lines may have the same size. The same size may include one of the same width, the same length, and the same thickness.

[0015] The first metal layer of each of the sensing lines may have different sizes from each other.

[0016] The size of the first metal layer of each of the sensing lines may increase as it is set to be farther from the sensing region.

[0017] The second portion of each of the sensing lines may have a single-layer structure including only the second metal layer.

[0018] Each of the second metal layers of the sensing lines may have the same dimensions. The same dimensions may include one of the same width, the same length, and the same thickness.

[0019] Each of the second metal layers of the sensing lines may have different dimensions from each other.

[0020] The second portion may overlap at least one of the first bridging patterns along the first direction.

[0021] Each of the sensing lines may include a third portion and a fourth portion extending in the first direction. The third portion may correspond to a first bridging pattern disposed in the same column as at least one of the first bridging patterns, and the third portion may have a single-layer structure including only the second metal layer.

[0022] The fourth portion of each of the sensing lines that does not correspond to a first bridging pattern disposed in the same column as at least one of the first bridging patterns may have a double-layer structure including a first metal layer and a second metal layer disposed on the first metal layer.

[0023] A display device according to another exemplary embodiment includes a display panel and a touch sensor. The display panel includes a plurality of pixels and a packaging layer disposed on the plurality of pixels. Each of the plurality of pixels includes a light-emitting element. The touch sensor is disposed on the packaging layer. The touch sensor includes: a substrate layer including a sensing region and a non-sensing region; a plurality of first sensor patterns disposed in the sensing region and arranged along a first direction; a plurality of first bridging patterns arranged along the first direction, at least one of the first bridging patterns being disposed at a corner of the sensing region; a plurality of second sensor patterns disposed in the sensing region and arranged along a second direction intersecting the first direction; a plurality of second bridging patterns arranged along the second direction; and a plurality of sensing lines disposed in the non-sensing region and connected to each of the first sensor patterns and the second sensor patterns. Each of the sensing lines includes a first metal layer and a second metal layer disposed on the first metal layer, and an insulating layer is inserted between the first metal layer and the second metal layer. Each of the sensing lines has a first portion and a second portion. The second portion corresponds to at least one of the first bridging patterns, and the second portion of at least one of the sensing lines has a single-layer structure including only the second metal layer.

[0024] The first metal layer may be disposed on the same layer as the first bridging pattern, and the second metal layer may be disposed on the same layer as the first sensor patterns, the second sensor patterns, and the second bridging patterns.

[0025] The first portion of each of the sensing lines may have a double-layer structure including a first metal layer and a second metal layer disposed on the first metal layer.

[0026] Each of the first metal layers in the sensing lines may have the same dimensions. The same dimensions may include one of the same width, the same length, and the same thickness.

[0027] The display panel may include a substrate including a display area provided with a plurality of pixels and a non-display area provided on at least one side of the display area. Each of the plurality of pixels includes: a pixel circuit layer provided on the substrate and including at least one transistor; and a display element layer provided on the pixel circuit layer and including a light-emitting element that emits light. A packaging layer may be provided on the display element layer.

[0028] It will be understood that the foregoing general description and the following detailed description are both exemplary and explanatory and are intended to provide further explanation of the claimed invention. Description of the Drawings

[0029] The drawings illustrate exemplary embodiments of the invention and, together with the description, are used to explain the inventive concept, wherein the drawings are included to provide a further understanding of the invention and are incorporated into and constitute a part of this specification.

[0030] Figure 1A is a perspective view of a display device according to an exemplary embodiment.

[0031] Figure 1B is Figure 1A a schematic cross-sectional view of the display device of.

[0032] Figure 2 is Figure 1B a schematic plan view of the display panel of.

[0033] Figure 3A is a schematic equivalent circuit diagram showing the electrical connection relationship between components included in one pixel shown in Figure 2 the.

[0034] Figure 3B is Figure 2 an enlarged cross-sectional view of a part of the display panel of.

[0035] Figure 4 is Figure 1B a schematic cross-sectional view of the touch sensor of.

[0036] Figure 5 is Figure 1B a schematic plan view of the touch sensor of.

[0037] Figure 6 exemplarily shows Figure 5 an enlarged schematic plan view of the area EA1 of the.

[0038] Figure 7A alongFigure 6 A cross-sectional view taken along line I-I’

[0039] Figure 7B Exemplarily shows Figure 6 An enlarged schematic plan view of region EA3

[0040] Figure 8 Exemplarily shows Figure 5 An enlarged schematic plan view of region EA2

[0041] Figure 9 Is along Figure 8 A cross-sectional view taken along line II-II’

[0042] Figure 10 Is Figure 5 A schematic plan view of a region at a corner of the touch sensor, showing only the second sensing line and the first bridging pattern adjacent thereto

[0043] Figure 11 Is along Figure 10 A cross-sectional view taken along line III-III’

[0044] Figure 12 Is Figure 5 A plan view of a region at a corner of the touch sensor, showing the second sensing line and the first bridging pattern adjacent thereto according to another exemplary embodiment

[0045] Figure 13 Is Figure 5 A plan view of a region at a corner of the touch sensor, showing the second sensing line and the first bridging pattern adjacent thereto according to another exemplary embodiment

[0046] Figure 14 Is along Figure 13 A cross-sectional view taken along line IV-IV’

[0047] Figure 15 Is Figure 5 A plan view of a region at a corner of the touch sensor, showing the second sensing line and the first bridging pattern adjacent thereto according to another exemplary embodiment

[0048] Figure 16 Is along Figure 15 A cross-sectional view taken along line V-V’

[0049] Figure 17 Is Figure 5 A plan view of a region at a corner of the touch sensor, showing the first sensing line and the first bridging pattern adjacent thereto

[0050] Figure 18 Is along Figure 17A cross-sectional view taken along line VI-VI'. Detailed implementation manners

[0051] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various exemplary embodiments or implementations of the invention. As used herein, "embodiment" and "implementation" are interchangeable words that serve as non-limiting examples of a device or method that employs one or more of the inventive concepts disclosed herein. However, it is evident that the various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Additionally, the various exemplary embodiments can be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shapes, configurations, and characteristics of an exemplary embodiment can be used or implemented in another exemplary embodiment.

[0052] Unless otherwise stated, the exemplary embodiments shown are understood to provide exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Thus, unless otherwise stated, the features, components, modules, layers, films, panels, regions, and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments can be combined, separated, interchanged, and / or rearranged in other ways without departing from the inventive concept.

[0053] The use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless stated otherwise, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement regarding the specific materials, material properties, dimensions, ratios, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. Additionally, in the drawings, for clarity and / or descriptive purposes, the dimensions and relative dimensions of the elements can be exaggerated. When the exemplary embodiments can be implemented differently, the specific process sequences can be performed in an order different from that described. For example, two consecutively described processes can be performed substantially simultaneously or in an order opposite to that described. Additionally, the same reference numerals denote the same elements.

[0054] When an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, the element or layer can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, no intervening elements or layers are present. For this reason, the term "connected" can refer to physical connection, electrical connection, and / or fluid connection with or without intervening elements. Further, the D1 axis, D2 axis, and D3 axis are not limited to the three axes such as the x-axis, y-axis, and z-axis of a rectangular coordinate system, but can be interpreted in a broader sense. For example, the D1 axis, D2 axis, and D3 axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as by way of example XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0055] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the disclosure.

[0056] Spatial relative terms such as "beneath", "below", "under", "lower", "above", "upper", "on top of", "higher", "side" (e.g., as in "sidewall"), etc. may be used herein for descriptive purposes to describe the relationship of one element to another (additional) element as shown in the figures. Spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as "beneath" or "under" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "beneath" can encompass both an orientation above and below. Further, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and accordingly, the spatial relative descriptors used herein are to be interpreted accordingly.

[0057] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms. Additionally, when the terms "comprises," "comprising," and / or their variants are used in this specification, they specify the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms "substantially," "about," and other similar terms are used as approximate terms and not as terms of degree, and as such, are used to interpret the inherent deviations of measured, calculated, and / or provided values that would be recognized by a person of ordinary skill in the art.

[0058] Herein, various exemplary embodiments are described with reference to cross-sectional views and / or exploded views that are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. As such, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the specifically shown shapes of regions, but rather will include deviations in shape due to, for example, manufacturing. In this manner, the regions shown in the drawings are essentially schematic, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and as such, are not necessarily intended to be limiting.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0060] Figure 1A is a perspective view of a display device according to an exemplary embodiment. Figure 1B is Figure 1A a schematic cross-sectional view of the display device of

[0061] Referring to Figure 1A and Figure 1B , the display device DD may include a display module DM and a window WD.

[0062] The display device DD can be set to various shapes. For example, the display device DD can be set to a rectangular plate having two pairs of sides that are substantially parallel to each other. However, the inventive concept is not limited thereto. For example, when the display device DD has a rectangular plate shape, one of the two pairs of sides can be longer than the other pair. Hereinafter, the display device DD will be described as having a rectangular shape with a pair of long sides and a pair of short sides. The extending direction of the long sides is represented by the second direction DR2, the extending direction of the short sides is represented by the first direction DR1, and the direction perpendicular to the extending directions of the long sides and the short sides is represented by the third direction DR3. As described above, in the display device DD having a rectangular plate shape, the corner where one long side and one short side meet can have a circular shape.

[0063] According to an exemplary embodiment, at least a part of the display device DD can be flexible, and the display device DD can be folded at the flexible part.

[0064] The display device DD can include a display area DD_DA for displaying an image and a non-display area DD_NDA provided on at least one side of the display area DD_DA. The non-display area DD_NDA can be an area where no image is displayed.

[0065] In some exemplary embodiments, the display device DD can include a sensing area SA and a non-sensing area NSA. The display device DD can display an image through the sensing area SA and can also detect light incident from the front. The non-sensing area NSA can surround the sensing area SA, but the inventive concept is not limited thereto. In Figure 1A it, the sensing area SA is shown as having a shape including rounded corners and corresponding to the display area DD_DA. However, the inventive concept is not limited thereto, and in some exemplary embodiments, a part of the display area DD_DA can correspond to the sensing area SA.

[0066] The shape, size, and arrangement position of the sensing area SA of the above-described display device DD can be variously modified according to the sensor electrodes to be described later.

[0067] The display module DM can include a display panel DP and a touch sensor TS. The touch sensor TS can be directly provided on the display panel DP or provided on the display panel DP with a separate layer such as an adhesive layer or a substrate inserted between the touch sensor TS and the display panel DP.

[0068] The display panel DP can display images. A self-emissive display panel such as an organic light-emitting diode (OLED) display panel can be used as the display panel DP. However, the inventive concept is not limited thereto, and in some exemplary embodiments, a non-emissive display panel such as a liquid crystal display (LCD) panel, an electrophoretic display (EPD) panel, and an electro-wetting display (EWD) panel can be used as the display panel DP. When the non-emissive display panel is used as the display panel DP, the display device DD can include a backlight unit that supplies light to the display panel DP.

[0069] The touch sensor TS can be disposed on the surface where the image of the display panel DP is emitted to receive a user's touch input. The touch sensor TS can recognize a touch event of the display device DD by a user's hand or a separate input means. The touch sensor TS can recognize the touch event in a capacitive manner. However, the inventive concept is not limited thereto, and in some exemplary embodiments, the touch sensor TS can detect the touch input in a mutual capacitance manner or a self-capacitance manner.

[0070] The window WD can be disposed on the display module DM to protect the exposed surface of the display module DM. The window WD can protect the display module DM from external impacts and provide an input surface and / or a display surface to the user. The window WD can be bonded to the display module DM through an optically clear adhesive (OCA) member OCA.

[0071] The window WD can have a multi-layer structure and can include at least one of a glass substrate, a plastic film, and a plastic substrate. The multi-layer structure can be formed by a continuous process or an adhesive process using an adhesive layer. All or part of the window WD can be flexible.

[0072] Figure 2 is Figure 1B a schematic plan view of the display panel.

[0073] Referring to Figure 1A 、 Figure 1B and Figure 2 As shown in, the display panel DP can include a substrate SUB, pixels PXL disposed on the substrate SUB, a driver disposed on the substrate SUB and driving the pixels PXL, and a wiring portion connecting the pixels PXL and the driver.

[0074] The substrate SUB can be formed as a single part having a substantially rectangular shape. However, the inventive concept is not limited thereto, and in some exemplary embodiments, the substrate SUB can be formed as multiple parts, and the substrate SUB can have different shapes according to the number of parts of the substrate SUB.

[0075] The substrate SUB may include insulating materials such as glass and resin. Additionally, the substrate SUB may include a flexible material so as to be bent or folded, and may have a single-layer structure or a multi-layer structure. For example, the flexible material may include at least one of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. The material forming the substrate SUB may be variously modified. For example, in some exemplary embodiments, the substrate SUB may include glass fiber reinforced plastic (FRP).

[0076] The substrate SUB may include a display area DA and a non-display area NDA. The display area DA may be an area where pixels PXL are provided to display an image. The non-display area NDA may be an area where no pixels PXL are provided, and thus, no image is displayed. Although only one pixel PXL is shown in Figure 2 , however, a plurality of pixels PXL may be provided in the display area DA of the substrate SUB.

[0077] The display area DA of the display panel DP may correspond to the display area DD_DA of the display device DD, and the non-display area NDA of the display panel DP may correspond to the non-display area DD_NDA of the display device DD.

[0078] A part of a driver for driving the pixels PXL and a wiring portion connecting the pixels PXL and the driver may be provided in the non-display area NDA. The non-display area NDA may correspond to a bezel area of the display device DD.

[0079] The pixels PXL may be provided in the display area DA of the substrate SUB. Each of the pixels PXL may be a minimum unit for displaying an image. The pixels PXL may include organic light emitting diodes that emit white light and / or colored light. Each of the pixels PXL may emit light of one of red, green, and blue. However, the inventive concept is not limited thereto, and in some exemplary embodiments, the pixels PXL may emit colored light such as cyan, magenta, and yellow.

[0080] The pixels PXL may be arranged in a matrix along rows extending in a first direction DR1 and columns extending in a second direction DR2 that intersects the first direction DR1. However, the arrangement of the pixels PXL is not particularly limited, and may be arranged in various forms.

[0081] The driver may supply signals to each of the pixels PXL through the wiring portion and control the driving of the pixels PXL. In Figure 2 , the wiring portion is not shown, and reference will be made to Figure 3ADescribe the wiring section in more detail.

[0082] The driver may include a scan driver SDV for transmitting a scan signal to each of the pixels PXL through a scan line, a light emission driver EDV for providing a light emission control signal to each of the pixels PXL through a light emission control line, a data driver DDV for providing a data signal to each of the pixels PXL through a data line, and a timing controller. The timing controller may control the scan driver SDV, the light emission driver EDV, and the data driver DDV.

[0083] Figure 3A is a diagram showing Figure 2 the electrical connection relationship between components included in one pixel shown in

[0084] Referring to Figure 1A 、 Figure 1B 、 Figure 2 and Figure 3A , each of the pixels PXL may include a light emitting element OLED and a pixel circuit PC for driving the light emitting element OLED. According to an exemplary embodiment, the light emitting element OLED may include an organic light emitting diode (OLED).

[0085] The pixel circuit PC may be connected to the i-th scan line Si and the j-th data line Dj of the corresponding pixel PXL. For example, when the pixel PXL is disposed in the i-th row (“i” is a natural number) and the j-th column (“j” is a natural number) of the display area DA of the display panel DP, the pixel circuit PC of the pixel PXL may be connected to the i-th scan line Si and the j-th data line Dj of the display area DA. In some exemplary embodiments, the pixel circuit PC may also be connected to at least one other scan line. For example, a pixel PXL disposed in the i-th row of the display area DA of the display panel DP may also be connected to the (i - 1)-th scan line Si-1 and / or the (i + 1)-th scan line Si+1. In some exemplary embodiments, the pixel circuit PC may also be connected to a third power supply other than the first pixel power supply ELVDD and the second pixel power supply ELVSS. For example, the pixel circuit PC may be connected to an initialization power supply Vint.

[0086] The pixel circuit PC may include a first transistor T1 to a seventh transistor T7 and a storage capacitor Cst.

[0087] One electrode (e.g., the source electrode) of the first transistor T1 (e.g., the driving transistor) can be connected to the power line to which the first pixel power supply ELVDD is applied via the fifth transistor T5, and the other electrode (e.g., the drain electrode) can be connected to the light-emitting element OLED via the sixth transistor T6. The gate electrode of the first transistor T1 can be connected to the first node N1. The first transistor T1 can control the driving current flowing between the first pixel power supply ELVDD and the second pixel power supply ELVSS via the light-emitting element OLED according to the voltage of the first node N1.

[0088] The second transistor T2 (e.g., the switching transistor) can be connected between the j-th data line Dj connected to the pixel PXL and the source electrode of the first transistor T1. The gate electrode of the second transistor T2 can be connected to the i-th scan line Si connected to the pixel PXL. The second transistor T2 can be turned on when a scan signal with a gate conduction voltage (e.g., a low voltage) is supplied from the i-th scan line Si to electrically connect the j-th data line Dj to the source electrode of the first transistor T1. When the second transistor T2 is turned on, the data signal supplied from the j-th data line Dj is transmitted to the first transistor T1.

[0089] The third transistor T3 can be connected between the drain electrode of the first transistor T1 and the first node N1. The gate electrode of the third transistor T3 can be connected to the i-th scan line Si. The third transistor T3 can be turned on when a scan signal with a gate conduction voltage is supplied from the i-th scan line Si to electrically connect the drain electrode of the first transistor T1 to the first node N1.

[0090] The fourth transistor T4 can be connected between the first node N1 and the initialization power line to which the initialization power supply Vint is applied. The gate electrode of the fourth transistor T4 can be connected to the previous scan line, e.g., the (i - 1)-th scan line Si - 1. The fourth transistor T4 can be turned on when a scan signal with a gate conduction voltage is supplied to the (i - 1)-th scan line Si - 1 to transmit the voltage of the initialization power supply Vint to the first node N1. Here, the initialization power supply Vint can have a voltage less than or equal to the lowest voltage of the data signal.

[0091] The fifth transistor T5 can be connected between the first pixel power supply ELVDD and the first transistor T1. The gate electrode of the fifth transistor T5 can be connected to the corresponding emission control line, e.g., the i-th emission control line Ei. The fifth transistor T5 can be turned off when an emission control signal with a gate cut-off voltage is supplied to the i-th emission control line Ei, and can be turned on in other cases.

[0092] The sixth transistor T6 can be connected between the first transistor T1 and the light-emitting element OLED. The gate electrode of the sixth transistor T6 can be connected to the i-th emission control line Ei. The sixth transistor T6 can be turned off when an emission control signal of a gate cut-off voltage is supplied to the i-th emission control line Ei, and can be turned on in other cases.

[0093] The seventh transistor T7 can be connected between the light-emitting element OLED and an initialization power supply line to which an initialization power supply Vint is applied. The gate electrode of the seventh transistor T7 can be connected to any one of the subsequent scan lines, for example, the (i + 1)-th scan line Si+1. The seventh transistor T7 can be turned on when a scan signal of a gate conduction voltage is supplied to the (i + 1)-th scan line Si+1 to supply the voltage of the initialization power supply Vint to the light-emitting element OLED.

[0094] The storage capacitor Cst can be connected between the first pixel power supply ELVDD and the first node N1. The storage capacitor Cst can store a voltage corresponding to a data signal supplied to the first node N1 and a threshold voltage of the first transistor T1 in each frame period.

[0095] The anode electrode of the light-emitting element OLED can be connected to the first transistor T1 via the sixth transistor T6, and the cathode electrode of the light-emitting element OLED can be connected to the second pixel power supply ELVSS. The light-emitting element OLED can generate light with a predetermined luminance in response to the amount of current supplied from the first transistor T1. The voltage of the first pixel power supply ELVDD can be set to be higher than the voltage of the second pixel power supply ELVSS so that current can flow to the light-emitting element OLED. During the emission period of the pixel PXL, the potential difference between the first pixel power supply ELVDD and the second pixel power supply ELVSS can be set to be equal to or greater than the threshold voltage of the light-emitting element OLED.

[0096] Figure 3B is Figure 2 An enlarged cross-sectional view of a part of the display panel.

[0097] In Figure 3B only a cross-sectional view of a part corresponding to the second transistor and the sixth transistor among the first transistor to the seventh transistor shown in Figure 3A is exemplarily shown.

[0098] Referring to Figure 1A 、 Figure 1B 、 Figure 2 、 Figure 3A and Figure 3B the display panel DP can include a substrate SUB, a pixel circuit layer PCL, a display element layer DPL, and a thin film encapsulation layer TFE.

[0099] The substrate SUB may include an insulating material such as glass, an organic polymer, quartz, etc. Additionally, the substrate SUB may include a flexible material so as to be bent or folded, and may have a single-layer structure or a multi-layer structure.

[0100] The pixel circuit layer PCL may include a buffer layer BFL, a second transistor T2, a sixth transistor T6, and a passivation layer PSV.

[0101] The buffer layer BFL may be disposed on the substrate SUB, and may prevent impurities from diffusing into the second transistor T2 and the sixth transistor T6. The buffer layer BFL may be disposed as a single layer or a multi-layer of at least two layers. In some exemplary embodiments, the buffer layer BFL may be omitted depending on the material of the substrate SUB and the process conditions.

[0102] Each of the second transistor T2 and the sixth transistor T6 may include a semiconductor layer SCL, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0103] The semiconductor layer SCL of each of the second transistor T2 and the sixth transistor T6 may be disposed on the buffer layer BFL. The semiconductor layer SCL may include a source region and a drain region that are respectively in contact with the source electrode SE and the drain electrode DE. The region between the source region and the drain region may be a channel region.

[0104] The semiconductor layer SCL may be a semiconductor pattern including polysilicon, amorphous silicon, an oxide semiconductor, etc. The channel region may be an intrinsic semiconductor pattern that is not doped with impurities. In this case, impurities such as n-type impurities, p-type impurities, and metal impurities may be used. The source region and the drain region may be semiconductor patterns doped with impurities.

[0105] The gate electrode GE of each of the second transistor T2 and the sixth transistor T6 may be disposed on the corresponding semiconductor layer SCL, and a gate insulating layer GI is inserted between the gate electrode GE and the semiconductor layer SCL.

[0106] The source electrode SE of each of the second transistor T2 and the sixth transistor T6 may be in contact with the source region of the corresponding semiconductor layer SCL through a contact hole that penetrates the interlayer insulating layer ILD and the gate insulating layer GI. For example, the source electrode SE of the second transistor T2 may be in contact with the source region of the corresponding semiconductor layer SCL through a first contact hole CH1 that penetrates the interlayer insulating layer ILD and the gate insulating layer GI, and the source electrode SE of the sixth transistor T6 may be in contact with the source region of the corresponding semiconductor layer SCL through a third contact hole CH3 that penetrates the interlayer insulating layer ILD and the gate insulating layer GI.

[0107] The drain electrode DE of each of the second transistor T2 and the sixth transistor T6 may be in contact with the drain region of the corresponding semiconductor layer SCL through a contact hole penetrating the interlayer insulating layer ILD and the gate insulating layer GI. For example, the drain electrode DE of the second transistor T2 may be in contact with the drain region of the corresponding semiconductor layer SCL through a second contact hole CH2 penetrating the interlayer insulating layer ILD and the gate insulating layer GI, and the drain electrode DE of the sixth transistor T6 may be in contact with the drain region of the corresponding semiconductor layer SCL through a fourth contact hole CH4 penetrating the interlayer insulating layer ILD and the gate insulating layer GI.

[0108] According to an exemplary embodiment, each of the interlayer insulating layer ILD and the gate insulating layer GI may be formed of an inorganic insulating film including an inorganic material or an organic insulating film including an organic material.

[0109] A passivation layer PSV may be provided on the second transistor T2 and the sixth transistor T6 to cover the second transistor T2 and the sixth transistor T6. The passivation layer PSV may include a fifth contact hole CH5 exposing a part of the drain electrode DE of the sixth transistor T6 to the outside.

[0110] The display element layer DPL may include a light-emitting element OLED provided on the passivation layer PSV and emitting light.

[0111] The light-emitting element OLED may include a first electrode AE and a second electrode CE, and a light-emitting layer EML provided between the first electrode AE and the second electrode CE. One of the first electrode AE and the second electrode CE may be an anode electrode, and the other may be a cathode electrode. For example, the first electrode AE may be an anode electrode, and the second electrode CE may be a cathode electrode. When the light-emitting element OLED is a top-emitting organic light-emitting device, the first electrode AE may be a reflective electrode, and the second electrode CE may be a transmissive electrode. Hereinafter, the light-emitting element OLED will be exemplarily described as a top-emitting organic light-emitting device, in which case the first electrode AE may be an anode electrode.

[0112] The first electrode AE may be electrically connected to the drain electrode DE of the sixth transistor T6 through the fifth contact hole CH5 penetrating the passivation layer PSV. The first electrode AE may include a reflective film capable of reflecting light and a transparent conductive film provided above or below the reflective film. At least one of the transparent conductive film and the reflective film may be electrically connected to the drain electrode DE of the sixth transistor T6.

[0113] The display element layer DPL may further include a pixel defining layer PDL having an opening OP exposing a part of the first electrode AE (for example, a part of the upper surface of the first electrode AE).

[0114] Each pixel PXL provided in the display panel DP may be provided in a pixel region included in the display area DA. According to an exemplary embodiment, the pixel region may include a light-emitting region EMA and a non-light-emitting region NEMA adjacent to the light-emitting region EMA. The non-light-emitting region NEMA may surround the light-emitting region EMA. In the illustrated exemplary embodiment, the light-emitting region EMA may be defined to correspond to a portion of the first electrode AE exposed by the opening OP.

[0115] The display element layer DPL may include a hole control layer HCL and an electron control layer ECL.

[0116] The hole control layer HCL may be commonly provided in the light-emitting region EMA and the non-light-emitting region NEMA. In some exemplary embodiments, a common layer such as the hole control layer HCL may be commonly formed in a plurality of pixels PXL.

[0117] The light-emitting layer EML may be provided on the hole control layer HCL. The light-emitting layer EML may be provided in a region corresponding to the opening OP. More specifically, the light-emitting layer EML may be provided in each of the plurality of pixels PXL. The light-emitting layer EML may include an organic material and / or an inorganic material. In the illustrated exemplary embodiment of the present invention, the light-emitting layer EML is shown to be patterned in each pixel PXL. However, in some exemplary embodiments, the light-emitting layer EML may be commonly provided in the pixel PXL. The color of the light generated in the light-emitting layer EML may be one of red, green, blue, and white, but the inventive concept is not limited thereto. For example, the color of the light generated in the light-emitting layer EML may be one of magenta, cyan, and yellow.

[0118] The electron control layer ECL may be provided on the light-emitting layer EML. The electron control layer ECL may be commonly formed in the pixel PXL and may inject and / or transport electrons to the light-emitting layer EML.

[0119] The second electrode CE may be provided on the electron control layer ECL. The second electrode CE may be commonly provided in the pixel PXL.

[0120] The thin film encapsulation layer TFE may be provided on the second electrode CE to cover the second electrode CE.

[0121] The thin film encapsulation layer TFE may be formed of a single layer or multiple layers. The thin film encapsulation layer TFE may include a plurality of insulating layers covering the light-emitting element OLED. Specifically, the thin film encapsulation layer TFE may include at least one inorganic layer and at least one organic layer. For example, the thin film encapsulation layer TFE may have a structure in which the inorganic layer and the organic layer are alternately stacked. In another exemplary embodiment, the thin film encapsulation layer TFE may be a encapsulation substrate provided on the light-emitting element OLED and bonded to the substrate SUB by a sealant.

[0122] Figure 4 is Figure 1B a schematic cross-sectional view of a touch sensor.

[0123] Referring to Figure 1A 、 Figure 1B 、 Figure 2 、 Figure 3A 、 Figure 3B and Figure 4 ,the touch sensor TS may include a substrate layer BSL, a first conductive pattern CP1, a first insulating layer INS1, a second conductive pattern CP2, and a second insulating layer INS2.

[0124] The first conductive pattern CP1 may be directly disposed on the substrate layer BSL. The substrate layer BSL may be an insulating layer disposed between the first conductive pattern CP1 and the thin film encapsulation layer TFE of the display panel DP, but the inventive concept is not limited thereto. In some exemplary embodiments, the first conductive pattern CP1 may be directly disposed on the thin film encapsulation layer TFE of the display panel DP. In some exemplary embodiments, the substrate layer BSL may be the uppermost layer of the thin film encapsulation layer TFE.

[0125] Each of the first conductive pattern CP1 and the second conductive pattern CP2 may have a single-layer structure or a multi-layer structure stacked in the thickness direction. The conductive pattern of the single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. Additionally, the transparent conductive layer may include PEDOT, metal nanowires, and graphene.

[0126] The conductive pattern of the multi-layer structure may include multi-layer metal layers. The multi-layer metal layer may have, for example, a three-layer structure of titanium / aluminum / titanium. The conductive pattern of the multi-layer structure may include a single metal layer and a single transparent conductive layer. The conductive pattern of the multi-layer structure may include multi-layer metal layers and multi-layer transparent conductive layers.

[0127] According to an exemplary embodiment, each of the first conductive pattern CP1 and the second conductive pattern CP2 may include a sensor pattern and a sensing line.

[0128] Each of the first insulating layer INS1 and the second insulating layer INS2 may include an inorganic insulating film containing an inorganic material or an organic insulating film containing an organic material. The inorganic insulating film may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic insulating film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, silicone resin, polyimide resin, polyamide resin, and perylene resin.

[0129] Figure 5 is Figure 1B a schematic plan view of a touch sensor. Figure 6 exemplarily shows Figure 5 an enlarged schematic plan view of the region EA1 of. Figure 7A is a cross-sectional view taken along Figure 6 the line I-I’ of. Figure 7B exemplarily shows Figure 6 an enlarged schematic plan view of the region EA3 of.

[0130] Referring to Figures 1A to 7B the touch sensor TS may include a substrate layer BSL, and the substrate layer BSL includes a sensing region SA capable of sensing a touch input and a non-sensing region NSA surrounding at least a part of the sensing region SA.

[0131] The substrate layer BSL may be made of tempered glass, transparent plastic, transparent film, etc.

[0132] The sensing region SA may be disposed in a central region of the substrate layer BSL and overlap with a display region DA of the display panel DP. The sensing region SA may have a shape substantially the same as the shape of the display region DA, but the inventive concept is not limited thereto. Sensor electrodes for sensing a touch input are disposed and / or formed in the sensing region SA.

[0133] The non-sensing region NSA may be disposed at an edge of the substrate layer BSL and overlap with a non-display region NDA of the display panel DP. Sensing lines SL electrically connected to the sensor electrodes to receive and transmit touch sensing signals may be disposed and / or formed in the non-sensing region NSA. In addition, a pad (or "bonding pad") portion PDA connected to the sensing lines SL and electrically connected to the sensor electrodes of the sensing region SA may be disposed in the non-sensing region NSA. The pad portion PDA may include a plurality of pads PD.

[0134] The sensor electrodes may include a plurality of sensor patterns SP and a first bridging pattern BRP1 and a second bridging pattern BRP2.

[0135] The sensor pattern SP may include a plurality of first sensor patterns SP1 and a plurality of second sensor patterns SP2 that are electrically insulated from the first sensor patterns SP1.

[0136] The first sensor patterns SP1 may be arranged in a first direction DR1 and are electrically connected to adjacent first sensor patterns SP1 through first bridging patterns BRP1 to form at least one sensor row. The second sensor patterns SP2 may be arranged in a second direction DR2 that intersects the first direction DR1 and are electrically connected to adjacent second sensor patterns SP2 through second bridging patterns BRP2 to form at least one sensor column.

[0137] Each of the first sensor patterns SP1 and the second sensor patterns SP2 may be electrically connected to each pad PD through a corresponding sensing line SL.

[0138] According to an exemplary embodiment, the touch sensor TS may identify a user's touch by sensing a change amount of capacitance formed between the first sensor pattern SP1 and the second sensor pattern SP2.

[0139] According to an exemplary embodiment, as Figure 7B shown, each of the second sensor patterns SP2 may include a plurality of conductive thin lines CFL1 and CFL2. For example, the second sensor pattern SP2 may include a plurality of first conductive thin lines CFL1 and a plurality of second conductive thin lines CFL2. The plurality of first conductive thin lines CFL1 are parallel to each other and extend in an inclined direction with respect to the first direction DR1, and the plurality of second conductive thin lines CFL2 are parallel to each other and extend in an inclined direction with respect to the second direction DR2. Due to the first conductive thin lines CFL1 and the second conductive thin lines CFL2, each of the second sensor patterns SP2 may have a mesh structure. The mesh structure may include a plurality of openings, for example, an area where the first conductive thin lines CFL1 and the second conductive thin lines CFL2 cross each other.

[0140] In the drawings, each of the second sensor patterns SP2 is shown as having a mesh structure, but the inventive concept is not limited thereto. For example, in some exemplary embodiments, the first sensor pattern SP1 and the first bridging pattern BRP1 and the second bridging pattern BRP2 may also have a mesh structure including the first conductive thin lines CFL1 and the second conductive thin lines CFL2.

[0141] When the first sensor pattern SP1 and the second sensor pattern SP2 have a mesh structure, the area where the first sensor pattern SP1 and the second sensor pattern SP2 overlap with the display panel DP may be reduced through the openings. In this way, electromagnetic interference between the first sensor pattern SP1 and the second sensor pattern SP2 and the display panel DP can be prevented or at least suppressed.

[0142] A first sensor pattern SP1 in which each electrical connection in a first bridging pattern BRP1 is arranged side by side along a first direction DR1. Each in the first bridging pattern BRP1 may also be arranged to extend in the first direction DR1. Each in the first bridging pattern BRP1 may include a 1-1 bridging pattern BRP1_1 and a 1-2 bridging pattern BRP1_2.

[0143] A second sensor pattern SP2 in which each electrical connection in a second bridging pattern BRP2 is arranged side by side along a second direction DR2. Each in the second bridging pattern BRP2 may also be arranged to extend in the second direction DR2. According to an exemplary embodiment, the second bridging pattern BRP2 may be integrally provided with the second sensor pattern SP2. When the second bridging pattern BRP2 is integrally provided with the second sensor pattern SP2, the second bridging pattern BRP2 may be an area of the second sensor pattern SP2.

[0144] As Figure 4 shown, the touch sensor TS may include a first conductive pattern CP1 provided on a substrate layer BSL, a first insulating layer INS1 provided on the first conductive pattern CP1, a second conductive pattern CP2 provided on the first insulating layer INS1, and a second insulating layer INS2 provided on the second conductive pattern CP2.

[0145] The substrate layer BSL may be provided on a thin film encapsulation layer TFE of a display panel DP. The substrate layer BSL may include an organic insulating film containing an organic material or an inorganic insulating film containing an inorganic material. In an exemplary embodiment, the substrate layer BSL may include a flexible material so as to be bent or folded, and may have a single-layer structure or a multi-layer structure. To implement a touch screen function, the touch sensor TS may be combined with the display panel DP for displaying an image. Accordingly, the touch sensor TS may have a transparency that can transmit light.

[0146] In some exemplary embodiments, the substrate layer BSL may be the uppermost layer of the thin film encapsulation layer TFE of the display panel DP. For example, the substrate layer BSL may be an inorganic insulating layer (or inorganic layer) that is the uppermost layer of the thin film encapsulation layer TFE. In some exemplary embodiments, the substrate layer BSL may be an inorganic insulating layer (e.g., an inorganic buffer layer) additionally provided on the thin film encapsulation layer TFE. For example, the substrate layer BSL may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc.

[0147] The first conductive pattern CP1 may be directly provided on the substrate layer BSL. In some exemplary embodiments, the first conductive pattern CP1 may be arranged to overlap with a pixel defining layer PDL.

[0148] As Figure 6 andFigure 7A As shown, the first conductive pattern CP1 may include a first bridging pattern BRP1.

[0149] The first conductive pattern CP1 may include a conductive material. The conductive material may include a transparent conductive oxide or a metal material. Additionally, the first conductive pattern CP1 may include a plurality of stacked metal layers. Examples of the transparent conductive oxide include indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), and tin oxide (SnO2). Examples of the metal material include copper, silver, gold, platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, and lead. The first conductive pattern CP1 may have a single-layer structure or a multi-layer structure.

[0150] The first insulating layer INS1 may be disposed on the first conductive pattern CP1. The first insulating layer INS1 may include a material substantially the same as the base layer BSL, but is not limited thereto. In an exemplary embodiment, the first insulating layer INS1 may include an organic insulating film containing an organic material or an inorganic insulating film containing an inorganic material.

[0151] The second conductive pattern CP2 may include a single conductive material layer or a plurality of stacked conductive material layers similar to the first conductive pattern CP1. As Figure 4 , Figure 6 and Figure 7A shown, the second conductive pattern CP2 may include a first sensor pattern SP1, a second sensor pattern SP2, and a second bridging pattern BRP2 disposed on the first insulating layer INS1. The first sensor patterns SP1 adjacent to each other in the first direction DR1 may be electrically and / or physically connected to each other through the first bridging pattern BRP1 formed in the contact hole CNT passing through the first insulating layer INS1.

[0152] The second insulating layer INS2 may be disposed on the first insulating layer INS1 on which the second conductive pattern CP2 is disposed. The second insulating layer INS2 may prevent the second conductive pattern CP2 from being exposed to the outside, thereby preventing corrosion of the second conductive pattern CP2. The second insulating layer INS2 may be formed of an organic insulating film including an organic material. The organic material may include one of acrylic resin, polyimide (PI), polyamide (PA), and benzocyclobutene (BCB). The second insulating layer INS2 made of the organic insulating film may be transparent and have fluidity, such that the curvature of the lower structure may be alleviated and flattened. In some exemplary embodiments, the second insulating layer INS2 may be formed of an inorganic insulating film including an inorganic material.

[0153] According to the illustrated exemplary embodiments, the first bridging pattern BRP1 is described as being included in the first conductive pattern CP1, and the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 are described as being included in the second conductive pattern CP2. However, the inventive concept is not limited thereto. In some exemplary embodiments, the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 may be included in the first conductive pattern CP1, and the first bridging pattern BRP1 may be included in the second conductive pattern CP2. More specifically, the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 may be formed and / or disposed on the substrate layer BSL, and the first bridging pattern BRP1 may be formed and / or disposed on the first insulating layer INS1. Even in this case, each of the first sensor patterns SP1 may be connected to the corresponding first bridging pattern BRP1 through a contact hole CNT passing through the first insulating layer INS1, and may be electrically and / or physically connected to the first sensor patterns SP1 disposed adjacent to each other in the first direction DR1.

[0154] In an exemplary embodiment, the first conductive pattern CP1 may be disposed on the substrate layer BSL, and the second conductive pattern CP2 may be disposed on the first insulating layer INS1. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the first conductive pattern CP1 may be disposed on the first insulating layer INS1, and the second conductive pattern CP2 may be disposed on the substrate layer BSL.

[0155] In addition, the first sensor pattern SP1 and the second sensor pattern SP2 according to the illustrated exemplary embodiments are described as being disposed on the same layer, but the inventive concept is not limited thereto. In some exemplary embodiments, the first sensor pattern SP1 and the second sensor pattern SP2 may be disposed on different layers from each other.

[0156] The first sensor pattern SP1, the second sensor pattern SP2, the first bridging pattern BRP1, and the second bridging pattern BPR2 as described above may be formed of a light-transmissive conductive layer such as ITO, IZO, or ZnO.

[0157] The sensor electrodes provided and / or formed in the sensing area SA may include dummy electrodes provided to be separated between a first sensor pattern SP1 and a second sensor pattern SP2. As floating electrodes, the dummy electrodes are not electrically connected to the first sensor pattern SP1 and the second sensor pattern SP2. Since the dummy electrodes are provided in the sensing area SA, the boundary area between the first sensor pattern SP1 and the second sensor pattern SP2 is not visible to the user. Additionally, the fringe effect between the first sensor pattern SP1 and the second sensor pattern SP2 can be controlled by adjusting the width and thickness of the dummy electrodes. In this way, the capacitance between the first sensor pattern SP1 and the second sensor pattern SP2 can be optimized.

[0158] As Figure 6 shown, the touch sensor TS may be constructed in a repeated arrangement of unit sensor blocks USB. The unit sensor block USB may be a virtual unit block having a predetermined area including at least a portion of an adjacent first sensor pattern SP1 and at least a portion of an adjacent second sensor pattern SP2. The unit sensor block USB may correspond to the minimum repeating unit of the arrangement pattern of the first sensor pattern SP1 and the second sensor pattern SP2. The unit sensor block USB may be the minimum unit for image capture for checking defects in the touch sensor TS. Defects in the touch sensor TS can be detected by taking images corresponding to the unit sensor block USB for each area and comparing the captured images. In this case, the minimum unit for image capture for defect inspection may correspond to the unit sensor block USB.

[0159] According to an exemplary embodiment, the sensing lines SL may include a plurality of first sensing lines SL1 connected to the first sensor pattern SP1 and a plurality of second sensing lines SL2 connected to the second sensor pattern SP2.

[0160] The first sensing lines SL1 may be connected to the first sensor pattern SP1. Each of the first sensing lines SL1 may be connected to one sensor row formed by a plurality of first sensor patterns SP1 arranged along a first direction DR1. In a plan view, the first sensing lines SL1 may be bent at least once in the non-sensing area NSA. The first sensing lines SL1 may include a portion extending along the first direction DR1 and a portion extending along a second direction DR2.

[0161] The second sensing line SL2 may be connected to the second sensor pattern SP2. Each of the second sensing lines SL2 may be connected to one sensor column formed by a plurality of second sensor patterns SP2 arranged along the second direction DR2. In a plan view, the second sensing line SL2 may be bent at least once in the non-sensing area NSA. The second sensing line SL2 may include a portion extending along the first direction DR1 and a portion extending along the second direction DR2.

[0162] The first sensing line SL1 and the second sensing line SL2 may be made of a conductive material. Metals, metal alloys, conductive polymers, conductive metal oxides, nano-conductive materials, etc. may be used as conductive materials. In an exemplary embodiment, the metal may include copper, silver, gold, platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, lead, etc. Examples of conductive polymers may include polythiophene compounds, polypyrrole compounds, polyaniline compounds, polyacetylene compounds, polyphenylene compounds, and mixtures thereof. Specifically, in polythiophene compounds, PEDOT / PSS compounds may be used. Examples of conductive metal oxides may include indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), etc. In addition, nano-conductive materials may include silver nanowires (AgNW), carbon nanotubes, graphene, etc.

[0163] In an exemplary embodiment, the first sensing line SL1 and the second sensing line SL2 may include a first portion formed by a double layer including one metal layer included in the first conductive pattern CP1 and another metal layer included in the second conductive pattern CP2, and a second portion formed by a single layer including only the other metal layer. The first portion and the second portion of each of the first sensing line SL1 and the second sensing line SL2 will be described in more detail later.

[0164] Each of the first sensor patterns SP1 may receive a driving signal for touch sensing through a corresponding first sensing line SL1, and each of the second sensor patterns SP2 may send a touch sensing signal through a corresponding second sensing line SL2. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, each of the second sensor patterns SP2 may receive a driving signal for touch sensing through a corresponding second sensing line SL2, and each of the first sensor patterns SP1 may send a touch sensing signal through a corresponding first sensing line SL1.

[0165] Figure 8 It is shown as an example Figure 5 An enlarged schematic plan view of area EA2. Figure 9 It is along Figure 8A cross-sectional view taken along line II-II'.

[0166] In Figure 8 region EA2 is shown to have the same dimensions as the Figure 6 region EA1. Specifically, Figure 5 region EA1 and region EA2 are shown to have the same dimensions.

[0167] Referring to Figures 1A to 9 , a first sensor pattern SP1, a second sensor pattern SP2, a first bridging pattern BRP1, and a second bridging pattern BRP2 may be disposed in a sensing region SA included in a corner of the touch sensor TS, and a second sensing line SL2 may be disposed in a non-sensing region NSA included in the corner.

[0168] Hereinafter, the sensing region SA included in the corner of the touch sensor TS is referred to as the "corner sensing region SA", and the non-sensing region NSA included in the corner of the touch sensor TS is referred to as the "corner non-sensing region NSA".

[0169] One first bridging pattern BRP1, two first sensor patterns SP1 connected by the first bridging pattern BRP1, one second bridging pattern BRP2, and two second sensor patterns SP2 connected by the second bridging pattern BRP2 may be disposed in the corner sensing region SA.

[0170] According to an exemplary embodiment, the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 may be disposed on a different layer from the first bridging pattern BRP1. For example, the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 may be disposed on the first bridging pattern BRP1, and a first insulating layer INS1 is inserted between the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 and the first bridging pattern BRP1. More specifically, the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 may be formed of a second conductive pattern CP2, and the first bridging pattern BRP1 may be formed of a first conductive pattern CP1.

[0171] A plurality of second sensing lines SL2 may be disposed in the corner non-sensing region NSA. For example, a 2a-th sensing line SL2_a to a 2e-th sensing line SL2_e may be disposed in the corner non-sensing region NSA.

[0172] According to an exemplary embodiment, a second sensing line SL2 disposed in a corner non-sensing area NSA may be disposed on the same layer as a first sensor pattern SP1, a second sensor pattern SP2, and a second bridging pattern BRP2 disposed in a corner sensing area SA, and may include substantially the same material. For example, the second sensing line SL2 may be formed of a second conductive pattern CP2. More specifically, the second sensing line SL2 disposed in the corner non-sensing area NSA may be formed of a single layer including only the second conductive pattern CP2.

[0173] The second sensing line SL2 disposed in the corner non-sensing area NSA, the first sensor pattern SP1, the second sensor pattern SP2, the first bridging pattern BRP1, and the second bridging pattern BRP2 disposed in the corner sensing area SA may be formed by a mask process using a photoresist pattern.

[0174] Generally, the second sensing line SL2 may be formed of a double layer to minimize distortion caused by signal delay. For example, the second sensing line SL2 may be formed of a double layer including a first metal layer formed of a first conductive pattern CP1 and a second metal layer formed of a second conductive pattern CP2 and connected to the first metal layer. However, when the second sensing line SL2 disposed in the corner non-sensing area NSA is formed of a double layer, there may be a density difference in the photoresist pattern between the corner non-sensing area NSA and the corner sensing area SA. For example, the amount of the photoresist pattern used to form the first conductive pattern CP1 during the mask process is larger in the corner non-sensing area NSA than in the corner sensing area SA.

[0175] In this case, a relatively large amount of the photoresist is dissolved in the corner sensing area SA where the photoresist pattern is disposed at a lower density during the development process compared to the corner non-sensing area NSA where the photoresist pattern is disposed at a higher density. Thus, the concentration of the developer applied to the corner sensing area SA is reduced, and a concentration difference occurs between the developer applied to the corner sensing area SA and the developer in the corner non-sensing area NSA. When there is a concentration difference in the developer between the corner sensing area SA and the corner non-sensing area NSA, the high-concentration developer moves toward the low-concentration developer by the diffusion principle. Thus, the photoresist pattern in the corner sensing area SA is overdeveloped and the thickness of the photoresist pattern in the corner sensing area SA becomes uneven, which may cause defects, for example, a short-circuit defect of the first bridging pattern BRP1 including the first conductive pattern CP1 may occur in the corner sensing area SA.

[0176] Specifically, since the first bridging pattern BRP1 provided in the corner sensing region SA is closer to the second sensing line SL2 than the first bridging pattern BRP1 provided in other regions except the corners of the touch sensor TS, the first bridging pattern BRP1 provided in the corner sensing region SA is further affected by the density difference of the photoresist pattern for each region. Therefore, during the masking process of the first conductive pattern CP1 at the corner of the touch sensor TS, a short-circuit defect of the first bridging pattern BRP1 provided in the corner sensing region SA will occur.

[0177] To compensate for the density difference of the photoresist pattern between the corner sensing region SA and the corner non-sensing region NSA, the second sensing line SL2 provided in the corner non-sensing region NSA according to the exemplary embodiment is formed of a single layer including only the second conductive pattern CP2 instead of a double layer. In this way, the density of the photoresist pattern can be formed to be uniform for each region of the touch sensor TS.

[0178] As described above, since the second sensing line SL2 provided in the corner non-sensing region NSA is formed of a single layer including only the second conductive pattern CP2, among the components at the corner of the touch sensor TS, only the first bridging pattern BRP1 can be formed of the first conductive pattern CP1, and the remaining components can be formed of the second conductive pattern CP2. In this way, the corner of the touch sensor TS can have a density of the conductive pattern (or metal pattern) that is substantially the same as or similar to the density of the conductive pattern (or metal pattern) of the unit sensor block USB located in one region of the sensing region SA of the touch sensor TS.

[0179] Figure 10 is Figure 5 A schematic plan view of a region at the corner of the touch sensor, showing only the second sensing line and the first bridging pattern adjacent thereto. Figure 11 is a cross-sectional view taken along the line III-III’ of Figure 10 .

[0180] In Figure 10 , for ease of description, the first sensor pattern, the second sensor pattern, and the second bridging pattern provided in the sensing region SA at the corner of the touch sensor TS are not shown.

[0181] In Figure 10 , one corner first bridging pattern BRP1’ provided in the sensing region SA at the corner of the touch sensor TS and two first bridging patterns BRP1 provided in the same column as the corner first bridging pattern BRP1’ are shown.

[0182] Referring to Figures 1A to 11, a corner portion of the touch sensor TS may include a corner sensing region SA provided with a first corner bridging pattern BRP1' and a corner non-sensing region NSA provided with a second sensing line SL2. The corner non-sensing region NSA may surround the corner sensing region SA.

[0183] The first corner bridging pattern BRP1' may be formed of a first conductive pattern CP1 provided and / or formed on the substrate layer BSL. Among the first bridging patterns BRP1 provided in the sensing region SA of the touch sensor TS, the first corner bridging pattern BRP1' may be the first bridging pattern BRP1 closest to the second sensing line SL2.

[0184] The second sensing line SL2 may include a 2a-th sensing line SL2_a to a 2e-th sensing line SL2_e. Each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may include a first portion FA formed of a double layer including a first metal layer MTL1 and a second metal layer MTL2 and a second portion MA formed of a single layer including only the second metal layer MTL2.

[0185] The first portion FA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may be formed of a double layer including a first metal layer MTL1 and a second metal layer MTL2 provided on the first metal layer MTL1, and a first insulating layer INS1 is inserted between the first metal layer MTL1 and the second metal layer MTL2. The first metal layer MTL1 and the second metal layer MTL2 may be electrically connected and / or physically connected through at least one contact hole CH passing through the first insulating layer INS1. According to an exemplary embodiment, the first metal layer MTL1 may be included in the first conductive pattern CP1, and the second metal layer MTL2 may be included in the second conductive pattern CP2.

[0186] In a first portion FA of each of the second a sensing line SL2_a to the second e sensing line SL2_e, the first metal layer MTL1 may have substantially the same dimensions (or area or length) as an adjacent first metal layer MTL1. For example, the first metal layer MTL1 included in the first portion FA of the second a sensing line SL2_a may have substantially the same dimensions (or area or length) as the dimensions (or area or length) of the first metal layer MTL1 of the second b sensing line SL2_b. The first metal layer MTL1 included in the first portion FA of the second b sensing line SL2_b may have substantially the same dimensions (or area or length) as the dimensions (or area or length) of the first metal layer MTL1 of the second c sensing line SL2_c. The first metal layer MTL1 included in the first portion FA of the second c sensing line SL2_c may have substantially the same dimensions (or area or length) as the dimensions (or area or length) of the first metal layer MTL1 of the second d sensing line SL2_d. The first metal layer MTL1 included in the first portion FA of the second d sensing line SL2_d may have substantially the same dimensions (or area or length) as the dimensions (or area or length) of the first metal layer MTL1 of the second e sensing line SL2_e. According to an exemplary embodiment, the same dimensions may include one of the same width, the same length, and the same thickness.

[0187] A second portion MA of each of the second a sensing line SL2_a to the second e sensing line SL2_e may be formed of a single layer including a second metal layer MTL2. In an exemplary embodiment, the second metal layer MTL2 may be included in a second conductive pattern CP2 disposed and / or formed on the first insulating layer INS1.

[0188] According to an exemplary embodiment, the first portion FA of each of the second a sensing line SL2_a to the second e sensing line SL2_e may not correspond to the corner first bridging pattern BRP1', and the second portion MA of each of the second a sensing line SL2_a to the second e sensing line SL2_e may correspond to the corner first bridging pattern BRP1'. More specifically, the second a sensing line SL2_a to the second e sensing line SL2_e may be formed of a single layer including only the second metal layer MTL2 at a portion corresponding to the corner first bridging pattern BRP1', and may be formed of a double layer including the first metal layer MTL1 and the second metal layer MTL2 at a portion not corresponding to the corner first bridging pattern BRP1'. According to an exemplary embodiment, the second portion MA of the sensing line SL2 "corresponding" to the corner first bridging pattern BRP1' may mean that the second portion MA overlaps at least a portion of the corner first bridging pattern BRP1' along the first direction DR1 and / or the second direction DR2.

[0189] According to an exemplary embodiment, the second metal layer MTL2 included in the second portion MA of each of the second sensing lines SL2_a to SL2_e may have a size (or area or length) different from that of the second metal layer MTL2 included in the second portion MA of an adjacent second sensing line SL2. For example, the size (or area or length) of the second metal layer MTL2 included in the second portion MA of the second sensing line SL2_a closest to the corner first bridging pattern BRP1' may be the smallest, and the size (or area or length) of the second metal layer MTL2 included in the second portion MA of the second sensing line SL2_e farthest from the corner first bridging pattern BRP1' may be the largest. The different sizes may include one of different widths, different lengths, and different thicknesses.

[0190] As described above, at the corner of the touch sensor TS, only the corner first bridging pattern BRP1' may be formed of the first conductive pattern CP1, and other components (such as the first sensor pattern SP1 and the second sensor pattern SP2, the second bridging pattern BRP2, and the second portion MA of the second sensing line SL2) may be formed of the second conductive pattern CP2.

[0191] In this case, when the first conductive pattern CP1 is formed at the corner of the touch sensor TS, the sharp density difference between the photoresist pattern of the corner sensing region SA and the photoresist pattern of the corner non-sensing region NSA may be alleviated, so that the density difference between the corner sensing region SA and the corner non-sensing region NSA can be minimized. Therefore, defects that may occur due to the density difference of the photoresist patterns in the corner sensing region SA and the corner non-sensing region NSA can be prevented or at least suppressed. For example, a short-circuit defect caused by uneven thickness of the corner first bridging pattern BRP1' provided in the corner sensing region SA can be prevented.

[0192] In addition, since only the corner first bridging pattern BRP1' at the corner of the touch sensor TS is formed of the first conductive pattern CP1, the density of the conductive pattern per unit area between the corner of the touch sensor TS and the unit sensor block USB provided in the sensing region SA other than the corner can be similar to each other. Thus, the sensing sensitivity of the touch sensor TS can be increased and the reliability can be improved.

[0193] Figure 12 Yes Figure 5 A plan view of a region at the corner of a touch sensor, showing a second sensing line and an adjacent first bridging pattern according to another exemplary embodiment.

[0194] Figure 12The touch sensor is substantially similar to the above-described touch sensor. Therefore, a repetitive description of substantially the same elements thereof will be omitted to avoid redundancy. The same reference numerals indicate the same components, and similar reference numerals represent similar components.

[0195] In Figure 12 for ease of description, the first sensor pattern, the second sensor pattern, and the second bridging pattern disposed in the sensing region SA at the corner of the touch sensor TS are not shown.

[0196] Referring to Figures 1A to 7A and Figure 12 the corner of the touch sensor TS may include a corner sensing region SA in which at least one corner first bridging pattern BRP1' is disposed and a corner non-sensing region NSA in which a second sensing line SL2 is disposed.

[0197] The corner first bridging pattern BRP1' may be formed of a first conductive pattern CP1 disposed and / or formed on the substrate layer BSL.

[0198] The second sensing line SL2 may include a 2a-th sensing line SL2_a to a 2e-th sensing line SL2_e. Each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may be divided into a first part FA and a second part MA. In an exemplary embodiment, the first part FA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may not correspond to or may partially correspond to the corner first bridging pattern BRP1', and the second part MA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may correspond to the corner first bridging pattern BRP1'.

[0199] The first part FA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may be formed of a double layer including a first metal layer MTL1 and a second metal layer MTL2 disposed on the first metal layer MTL1, a first insulating layer INS1 being inserted between the first metal layer MTL1 and the second metal layer MTL2, and the second metal layer MTL2 being connected to the first metal layer MTL1 through a contact hole CH. In an exemplary embodiment, the first metal layer MTL1 may be formed of a first conductive pattern CP1, and the second metal layer MTL2 may be formed of a second conductive pattern CP2.

[0200] The second part MA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may be formed of a single layer including only the second metal layer MTL2.

[0201] In the first portion FA of each of the second a sensing line SL2_a to the second e sensing line SL2_e, the first metal layer MTL1 may have a size (or area or length) different from that of the adjacent first metal layer MTL1. For example, the size (or area or length) of the first metal layer MTL1 included in the first portion FA of the second a sensing line SL2_a closest to the first corner bridging pattern BRP1' may be the smallest, and the size (or area or length) of the first metal layer MTL1 included in the first portion FA of the second e sensing line SL2_e farthest from the first corner bridging pattern BRP1' (BRP1) may be the largest. More specifically, the size (or area or length) of the first metal layer MTL1 included in the first portion FA of the second sensing line SL2 may increase as the distance from the first corner bridging pattern BRP1' increases. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the size (or area or length) of the first metal layer MTL1 included in the first portion FA of the second sensing line SL2 may decrease as the distance from the first corner bridging pattern BRP1' increases.

[0202] According to an exemplary embodiment, at a portion corresponding to the first corner bridging pattern BRP1' of the corner of the touch sensor TS, only the first corner bridging pattern BRP1' may be formed of the first conductive pattern CP1, and the remaining components may be formed of the second conductive pattern CP2.

[0203] In this case, when the first conductive pattern CP1 is formed at the corner of the touch sensor TS, a sharp density difference between the photoresist pattern of the corner sensing region SA and the photoresist pattern of the corner non-sensing region NSA may be alleviated, so that the density difference between the corner sensing region SA and the corner non-sensing region NSA may be minimized. Therefore, short circuit defects caused by uneven thickness of the first corner bridging pattern BRP1' provided in the corner sensing region SA can be prevented.

[0204] Figure 13 is Figure 5 A plan view of a region at the corner of the touch sensor, showing a second sensing line and an adjacent first bridging pattern according to another exemplary embodiment. Figure 14 is a cross-sectional view taken along line IV-IV' of Figure 13 The touch sensors of

[0205] Figure 13 and Figure 14 are substantially the same as the above-described touch sensor. Therefore, a repeated description of substantially the same elements will be omitted to avoid redundancy. The same reference numerals indicate the same components, and similar reference numerals represent similar components.

[0206] In Figure 13 it, for ease of description, the first sensor pattern, the second sensor pattern, and the second bridging pattern provided in the sensing region SA at the corner of the touch sensor TS are not shown.

[0207] Referring to Figures 1A to 7B , Figure 13 and Figure 14 , the corner of the touch sensor TS may include a corner sensing region SA in which at least one corner first bridging pattern BRP1’ is provided and a corner non-sensing region NSA in which a second sensing line SL2 is provided.

[0208] The corner first bridging pattern BRP1’ may be formed of a first conductive pattern CP1 provided and / or formed on the substrate layer BSL.

[0209] The second sensing line SL2 may include a 2a-th sensing line SL2_a to a 2e-th sensing line SL2_e. Some of the second sensing lines SL2 may be divided into a first portion FA formed of a double layer and a second portion MA formed of a single layer. The remaining second sensing lines SL2 may be formed of a double layer.

[0210] The first portion FA may have a double layer including a first metal layer MTL1 and a second metal layer MTL2 provided on the first metal layer MTL1, a first insulating layer INS1 being inserted between the first metal layer MTL1 and the second metal layer MTL2, and the second metal layer MTL2 being connected to the first metal layer MTL1 through a contact hole CH. The second portion MA may have a single layer including only the second metal layer MTL2. In an exemplary embodiment, the first metal layer MTL1 may be formed of the first conductive pattern CP1, and the second metal layer MTL2 may be formed of the second conductive pattern CP2.

[0211] According to the illustrated exemplary embodiment, some of the second sensing lines SL2 adjacent to the corner first bridging pattern BRP1' in the second sensing lines SL2 may include a first portion FA and a second portion MA, and other second sensing lines SL2 disposed away from the corner first bridging pattern BRP1' may include only the first portion FA. For example, among the second sensing lines SL2, the 2a-th sensing line SL2_a, the 2b-th sensing line SL2_b, and the 2c-th sensing line SL2_c adjacent to the corner first bridging pattern BRP1' may include a first portion FA formed of a double layer including a first metal layer MTL1 and a second metal layer MTL2, and a second portion MA formed of a single layer including only the second metal layer MTL2. Additionally, among the second sensing lines SL2, the 2d-th sensing line SL2_d and the 2e-th sensing line SL2_e disposed away from the corner first bridging pattern BRP1' may include only the first portion FA formed of a double layer including the first metal layer MTL1 and the second metal layer MTL2.

[0212] When forming the corner first bridging pattern BRP1' formed of the first conductive pattern CP1, the corner first bridging pattern BRP1' is further affected by the density difference of the second sensing lines SL2 closest to the corner first bridging pattern BRP1' for each region of the photoresist pattern. Thus, according to the illustrated exemplary embodiment, some of the second sensing lines SL2 closest to the corner first bridging pattern BRP1' in the second sensing lines SL2 may be formed to include only a single layer of the second metal layer MTL2 at a portion corresponding to the corner first bridging pattern BRP1'.

[0213] Figure 15 is Figure 5 A plan view of a region at a corner of a touch sensor, showing second sensing lines and a first bridging pattern adjacent thereto according to another exemplary embodiment. Figure 16 is a cross-sectional view taken along line Figure 15 V-V' of

[0214] Figure 15 and Figure 16 The touch sensors of

[0215] are substantially the same as the above-described touch sensor. Therefore, repeated descriptions of substantially the same elements thereof will be omitted. The same reference numerals indicate the same components, and similar reference numerals represent similar components.

[0215] In Figure 15 for ease of description, the first sensor pattern, the second sensor pattern, and the second bridging pattern provided in the sensing region SA at the corner of the touch sensor TS are not shown.

[0216] Referring to Figures 1A to 9 、 Figure 15 and Figure 16, a corner of the touch sensor TS may include a corner sensing region SA in which at least one first corner bridging pattern BRP1’ is disposed and a corner non-sensing region NSA in which a second sensing line SL2 is disposed.

[0217] The first corner bridging pattern BRP1’ may be formed of a first conductive pattern CP1 disposed and / or formed on a substrate layer BSL.

[0218] The second sensing line SL2 may include a 2a-th sensing line SL2_a to a 2e-th sensing line SL2_e. Each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may be divided into a first part FA and a second part MA.

[0219] According to an exemplary embodiment, the first part FA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may not correspond to each of the first corner bridging pattern BRP1’ and the first bridging pattern BRP1 located in the same column as the first corner bridging pattern BRP1’. In addition, the second part MA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may correspond to each of the first corner bridging pattern BRP1’ and the first bridging pattern BRP1 located in the same column as the first corner bridging pattern BRP1’.

[0220] The first part FA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may be formed of a double layer including a first metal layer MTL1 and a second metal layer MTL2 disposed on the first metal layer MTL1 and connected to the first metal layer MTL1 through a contact hole CH, and a first insulating layer INS1 is inserted between the first metal layer MTL1 and the second metal layer MTL2. According to an exemplary embodiment, the first metal layer MTL1 may be formed of the first conductive pattern CP1, and the second metal layer MTL2 may be formed of a second conductive pattern CP2.

[0221] The second part MA of each of the 2a-th sensing line SL2_a to the 2e-th sensing line SL2_e may be formed of a single layer including only the second metal layer MTL2.

[0222] According to an exemplary embodiment, at a corner of the touch sensor TS, only the first corner bridging pattern BRP1’ and the first bridging pattern BRP1 located in the same column as the first corner bridging pattern BRP1 are formed of the first conductive pattern CP1, and the remaining components may be formed of the second conductive pattern CP2.

[0223] In the above exemplary embodiments, the second sensing line SL2 of the sensing lines SL disposed in the non-sensing area NSA of the touch sensor TS has been described as including a first portion FA and a second portion MA. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the first sensing line SL1 may also include a first portion FA and a second portion MA, which will be described in more detail below.

[0224] Figure 17 is Figure 5 A plan view of a region at a corner of the touch sensor, showing a first sensing line and a first bridging pattern adjacent thereto. Figure 18 is a cross-sectional view taken along line Figure 17 VI-VI' of.

[0225] Figure 17 and Figure 18 The touch sensors of and are substantially the same as the above touch sensor. Therefore, a repeated description of substantially the same elements thereof will be omitted. The same reference numerals indicate the same components, and similar reference numerals represent similar components.

[0226] In Figure 17 for ease of description, the first sensor pattern, the second sensor pattern, and the second bridging pattern disposed in the sensing area SA at the corner of the touch sensor TS are not shown.

[0227] Referring to Figures 1A to 7B , Figure 17 and Figure 18 , the corner of the touch sensor TS may include a corner sensing area SA in which at least one corner first bridging pattern BRP1' is disposed and a corner non-sensing area NSA in which the first sensing line SL1 is disposed. The corner non-sensing area NSA may surround the corner sensing area SA.

[0228] The corner first bridging pattern BRP1' may be formed of a first conductive pattern CP1 disposed and / or formed on the base layer BSL. Among the first bridging patterns BRP1 disposed in the sensing area SA of the touch sensor TS, the corner first bridging pattern BRP1' may be the first bridging pattern BRP1 closest to the first sensing line SL1.

[0229] The first sensing line SL1 may include a 1a sensing line SL1_a to a 1f sensing line SL1_f. Each of the 1a sensing line SL1_a to the 1f sensing line SL1_f may include a first portion FA formed of a double layer including a third metal layer MTL3 and a fourth metal layer MTL4 and a second portion MA formed of a single layer including only the fourth metal layer MTL4.

[0230] According to an exemplary embodiment, each of the first a sensing lines SL1_a to the first f sensing lines SL1_f may be divided into a first portion FA and a second portion MA.

[0231] The first portion FA of each of the first a sensing lines SL1_a to the first f sensing lines SL1_f may be formed of a double layer including a third metal layer MTL3 and a fourth metal layer MTL4 disposed on the third metal layer MTL3, and a first insulating layer INS1 is inserted between the third metal layer MTL3 and the fourth metal layer MTL4. The third metal layer MTL3 and the fourth metal layer MTL4 may be electrically connected and / or physically connected through at least one contact hole CH passing through the first insulating layer INS1. The third metal layer MTL3 may be included in the first conductive pattern CP1, and the fourth metal layer MTL4 may be included in the second conductive pattern CP2.

[0232] According to an exemplary embodiment, the third metal layer MTL3 of each of the first sensing lines SL1 may be disposed on the same layer as the first metal layer MTL1 of the second sensing line SL2 (see Figure 10 ). The third metal layer MTL3 of each of the first sensing lines SL1 may include substantially the same material as the first metal layer MTL1 of the second sensing line SL2 (see Figure 10 ) and may be formed by the same process. Additionally, the third metal layer MTL3 of each of the first sensing lines SL1 may be disposed on the same layer as the corner first bridging pattern BRP1'. The third metal layer MTL3 of each of the first sensing lines SL1 may include substantially the same material as the corner first bridging pattern BRP1' and may be formed by the same process.

[0233] The fourth metal layer MTL4 of each of the first sensing lines SL1 may be disposed on the same layer as the second metal layer MTL2 of the second sensing line SL2 (see Figure 10 ). The fourth metal layer MTL4 of each of the first sensing lines SL1 may include substantially the same material as the second metal layer MTL2 of the second sensing line SL2 (see Figure 10 ) and may be formed by the same process. Additionally, the fourth metal layer MTL4 of each of the first sensing lines SL1 may be disposed on the same layer as the first sensor pattern SP1 and the second sensor pattern SP2 and the second bridging pattern BRP2 disposed in the sensing area SA of the touch sensor TS. The fourth metal layer MTL4 of each of the first sensing lines SL1 may include substantially the same material as the first sensor pattern SP1 and the second sensor pattern SP2 and the second bridging pattern BRP2 disposed in the sensing area SA of the touch sensor TS and may be formed by the same process.

[0234] In a first portion FA of each of the first sensing lines SL1_a to SL1_f, the third metal layer MTL3 may have substantially the same size (or area or length) as an adjacent third metal layer MTL3.

[0235] A second portion MA of each of the first sensing lines SL1_a to SL1_f may be formed of a single layer including only the fourth metal layer MTL4.

[0236] According to an exemplary embodiment, the first portion FA of each of the first sensing lines SL1_a to SL1_f may not correspond to the corner first bridging pattern BRP1', and the second portion MA of each of the first sensing lines SL1_a to SL1_f may correspond to the corner first bridging pattern BRP1'. More specifically, the first sensing lines SL1_a to SL1_f may be formed of a single layer including only the fourth metal layer MTL4 at a portion corresponding to the corner first bridging pattern BRP1', and may be formed of a double layer including the third metal layer MTL3 and the fourth metal layer MTL4 at a portion not corresponding to the corner first bridging pattern BRP1'.

[0237] According to an exemplary embodiment, the fourth metal layer MTL4 included in the second portion MA of each of the first sensing lines SL1_a to SL1_f may have a size (or area or length) different from that of the fourth metal layer MTL4 included in the second portion MA of an adjacent first sensing line SL1. For example, the size (or area or length) of the fourth metal layer MTL4 included in the second portion MA of the first sensing line SL1_a closest to the corner first bridging pattern BRP1' may be the smallest, and the size (or area or length) of the fourth metal layer MTL4 included in the second portion MA of the first sensing line SL1_f set farthest from the corner first bridging pattern BRP1' may be the largest. More specifically, the size (or area or length) of the fourth metal layer MTL4 included in the second portion MA of the first sensing line SL1 may increase as the distance from the corner first bridging pattern BRP1' increases.

[0238] As described above, at the corner of the touch sensor TS, only the corner first bridging pattern BRP1' may be formed of the first conductive pattern CP1, and the remaining components (such as the first sensor pattern SP1 and the second sensor pattern SP2, the second bridging pattern BRP2, and the second portion MA of the first sensing line SL1) may be formed of the second conductive pattern CP2.

[0239] In this case, when the first conductive pattern CP1 is formed at the corner of the touch sensor TS, the sharp density difference between the photoresist pattern of the corner sensing region SA and the photoresist pattern of the corner non-sensing region NSA can be alleviated, so that the density difference between the corner sensing region SA and the corner non-sensing region NSA can be minimized. Accordingly, defects that may occur due to the density difference of the photoresist patterns in the corner sensing region SA and the corner non-sensing region NSA can be prevented. For example, a short-circuit defect caused by non-uniform thickness of the corner first bridging pattern BRP1' disposed in the corner sensing region SA can be prevented.

[0240] In the touch sensor according to an exemplary embodiment and a display device having the touch sensor, at least one sensing line adjacent to a bridging pattern positioned at a corner of a sensing region may be formed of a single layer. In this way, a short-circuit defect of the bridging pattern can be prevented to improve sensing sensitivity at the corner.

[0241] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those of ordinary skill in the art.

Claims

1. A touch sensor, the touch sensor comprising: A substrate layer including a sensing region and a non-sensing region; A plurality of first sensor patterns disposed in the sensing region and arranged along a first direction; A plurality of first bridging patterns arranged along the first direction, at least one of the first bridging patterns being disposed at a corner of the sensing region; A plurality of second sensor patterns disposed in the sensing region and arranged along a second direction intersecting the first direction; A plurality of second bridging patterns arranged along the second direction; And A plurality of sensing lines disposed in the non-sensing region and connected to each of the first sensor patterns and the second sensor patterns, Wherein each of the sensing lines includes a first metal layer and a second metal layer disposed on the first metal layer, and an insulating layer is inserted between the first metal layer and the second metal layer, Wherein each of the sensing lines has a first portion and a second portion, the second portion corresponding to at least one of the first bridging patterns, Wherein the second portion of at least one of the sensing lines has a single-layer structure including only the second metal layer, and Wherein the first portion of at least one of the sensing lines has a double-layer structure including the first metal layer and the second metal layer stacked on the first metal layer.

2. The touch sensor according to claim 1, wherein, The first bridging pattern is disposed on a layer different from the layer on which the first sensor pattern, the second sensor pattern, and the second bridging pattern are disposed.

3. The touch sensor according to claim 2, wherein: The first metal layer and the first bridging pattern are disposed on the same layer, and the second metal layer and the first sensor pattern, the second sensor pattern, and the second bridging pattern are disposed on the same layer, and The insulating layer includes at least one contact hole, and the first metal layer and the second metal layer are electrically connected through the at least one contact hole.

4. The touch sensor according to claim 3, wherein, The first portion of each of the sensing lines has a double-layer structure including the first metal layer and the second metal layer disposed on the first metal layer.

5. The touch sensor according to claim 4, wherein: The first metal layer of each of the sensing lines has the same size, and The same size includes one of the same width, the same length, and the same thickness.

6. The touch sensor according to claim 4, wherein, The first metal layer of each of the sensing lines has different sizes from each other.

7. The touch sensor according to claim 6, wherein The size of the first metal layer of each of the sensing lines increases as it is disposed further away from the sensing region.

8. The touch sensor according to claim 3, wherein, The second portion of each of the sensing lines has a single-layer structure including only the second metal layer.

9. The touch sensor according to claim 8, wherein: The second metal layer of each of the sensing lines has the same size, and The same size includes one of the same width, the same length, and the same thickness.

10. The touch sensor according to claim 8, wherein, The second metal layer of each of the sensing lines has different sizes from each other.

11. The touch sensor according to claim 3, wherein, The second part overlaps with at least one of the first bridging patterns along the first direction.

12. The touch sensor according to claim 3, wherein: Each of the sensing lines includes a third part and a fourth part extending in the first direction; The third part corresponds to the first bridging pattern that is arranged in the same column as at least one of the first bridging patterns; And The third part has a single-layer structure including only the second metal layer.

13. The touch sensor according to claim 12, wherein, The fourth part of each of the sensing lines that does not correspond to the first bridging pattern that is arranged in the same column as at least one of the first bridging patterns has a double-layer structure including the first metal layer and the second metal layer disposed on the first metal layer.

14. A display device, the display device comprising: A display panel including a plurality of pixels and an encapsulation layer disposed on the plurality of pixels, each of the plurality of pixels including a light-emitting element; And A touch sensor disposed on the encapsulation layer, the touch sensor including: a substrate layer including a sensing area and a non-sensing area; a plurality of first sensor patterns disposed in the sensing area and arranged along a first direction; a plurality of first bridging patterns arranged along the first direction, at least one of the first bridging patterns being disposed at a corner of the sensing area; a plurality of second sensor patterns disposed in the sensing area and arranged along a second direction intersecting the first direction; a plurality of second bridging patterns arranged along the second direction; and a plurality of sensing lines disposed in the non-sensing area and connected to each of the first sensor patterns and the second sensor patterns, Wherein each of the sensing lines includes a first metal layer and a second metal layer disposed on the first metal layer, and an insulating layer is inserted between the first metal layer and the second metal layer, Wherein each of the sensing lines has a first part and a second part, the second part corresponding to at least one of the first bridging patterns, Wherein the second part of at least one of the sensing lines has a single-layer structure including only the second metal layer, and Wherein the first part of at least one of the sensing lines has a double-layer structure including the first metal layer and the second metal layer stacked on the first metal layer.

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