Mask and method for patterning pixels of organic light emitting display device using the same

Abstract

Disclosed are a method for pixel patterning and pixel position inspection of an organic light-emitting display device and a pixel patterning mask for an organic light-emitting display device, wherein the method comprises: using a first mask to form a first color film layer corresponding to a first pixel pattern and a first pixel positioning pattern for inspecting the position of a first pixel on a substrate; moving the first mask from a position associated with forming the first color film layer to a determined spacing; aligning the moved first mask relative to the substrate; and using the moved first mask to form a second color film layer corresponding to the first pixel pattern and the first pixel positioning pattern for inspecting the position of the first pixel on the substrate.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2015-0069351, filed on May 19, 2015, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Example embodiments relate to formation of a thin film, and more particularly, to a mask and a method of forming and inspecting positional accuracy of a thin film pattern using the mask through a deposition process. Background Art

[0004] Vapor deposition generally involves generating vapor from a deposition source and allowing the vapor to attach to a substrate surface. For example, a mask may be disposed on (or above) a substrate, and vapor from a deposition source may be allowed to pass through openings in the mask and onto the substrate to form a desired thin film pattern on the substrate. This thin film manufacturing technique may be used to form thin film patterns associated with flat panel display devices such as organic light emitting devices (OLEDs). For example, the thin film pattern may correspond to a thin film pixel pattern.

[0005] The above information disclosed in this Background section is only for enhancement of understanding of the background of the inventive concept and therefore it may contain information that does not form the prior art that is already known in the art to a person of ordinary skill in the art. Summary of the invention

[0006] Example embodiments provide a mask for forming a thin film pixel pattern for an organic light emitting display device.

[0007] Example embodiments provide a method for patterning pixels and inspecting pixel positioning in an organic light emitting display device.

[0008] Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the disclosure, or may be learned by practice of the inventive concepts.

[0009] According to one or more exemplary embodiments, a method for pixel patterning and pixel position inspection of an organic light-emitting display device includes: forming a first color film layer on a substrate using a first mask, the first mask including a first pixel pattern and a first pixel positioning pattern for inspecting a first pixel position, wherein the first color film layer corresponds to the first pixel pattern and the first pixel positioning pattern for inspecting the first pixel position; moving the first mask by a determined spacing from a position associated with forming the first color film layer; aligning the moved first mask relative to the substrate; and forming a second color film layer on the substrate using the moved first mask, wherein the second color film layer corresponds to the first pixel pattern and the first pixel positioning pattern for inspecting the first pixel position.

[0010] According to one or more exemplary embodiments, a pixel patterning mask for an organic light-emitting display device includes: a pixel pattern, a first inspection pattern, and a second inspection pattern, wherein the first inspection pattern is used to inspect a first pixel position, and the first inspection pattern is configured to facilitate measurement of position accuracy of a thin film layer formed on a substrate through the pixel pattern; and the second inspection pattern is used to inspect a second pixel position, and the second inspection pattern is configured to facilitate measurement of position accuracy of a thin film layer formed on a substrate through the pixel pattern; the second inspection pattern is formed at a different position from the first inspection pattern.

[0011] The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. These drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of the specification.

[0013] Figure 1 is a schematic diagram of a thin film deposition apparatus according to one or more exemplary embodiments.

[0014] Figure 2 According to one or more exemplary embodiments, Figure 1 A cross-sectional view of a unit pixel structure of an organic light-emitting display device formed by a thin film deposition device.

[0015] Figure 3 is a plan view of a thin film pattern and a mask formed on a substrate according to one or more exemplary embodiments, wherein the thin film pattern may be used to accurately position a mask associated with a pixel for thin film deposition.

[0016] Figure 4A , Figure 4B , Figure 4C and Figure 4D A method of patterning an emission layer of a first pixel and an emission layer of a second pixel using a first mask according to one or more exemplary embodiments is illustrated.

[0017] Figure 5A , Figure 5B , Figure 5C and Figure 5D The use of one or more exemplary embodiments is shown Figure 4A , Figure 4B , Figure 4C and Figure 4D A method for patterning an emission layer of a first pixel and an auxiliary layer of the first pixel using a first mask.

[0018] Fig. 6A , Figure 6B , Figure 6C and Fig.6D A method of patterning an emission layer of a third pixel and an auxiliary layer of the third pixel using a second mask according to one or more exemplary embodiments is illustrated. DETAILED DESCRIPTION

[0019] For the purpose of explanation, a number of specific details are set forth in the following description to provide a full understanding of the exemplary embodiments. However, it is apparent that the exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid unnecessary confusion of the exemplary embodiments.

[0020] In the drawings, the size and relative sizes of layers, films, panels, regions, etc. may be exaggerated for clarity and descriptive purposes. Additionally, the same reference numerals denote the same elements.

[0021] When an element or layer is referred to as being "on", "connected to" or "coupled to" another element or layer, it may be directly on, directly connected to or directly coupled to another element or layer, or there may be an inserted element or layer. However, when an element or layer is referred to as being "directly" "on", "directly connected to" or "directly coupled to" another element or layer, there is no inserted element or layer. For the purposes of this disclosure, "at least one of X, Y and Z" and "at least one selected from the group consisting of X, Y and Z" may be interpreted as any combination of only X, only Y, only Z or two or more of X, Y and Z, such as, for example, XYZ, XYY, YZ and ZZ. Throughout the specification, the same reference numerals represent the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the listed related items.

[0022] Although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or part from another element, component, region, layer and / or part. Therefore, without departing from the teachings of the present disclosure, the first element, component, region, layer and / or part discussed below may be referred to as a second element, component, region, layer and / or part.

[0023] For descriptive purposes, spatially relative terms such as "under," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature shown in the drawings to another element or feature. Spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture other than the orientation shown in the drawings. For example, if the device in the drawings is inverted, the elements described as being "under" or "beneath" other elements or features will be oriented to be "above" the other elements or features described above. Thus, the exemplary term "below" may include an orientation above as well as an orientation below. In addition, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and similarly, the spatially relative descriptors used herein are understood accordingly.

[0024] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms. In addition, the terms "comprises", "comprising", "includes", and / or "including" when used in this specification indicate the presence of the described features, wholes, steps, operations, elements, parts, and / or their groups, without excluding the presence or addition of one or more other features, wholes, steps, operations, elements, parts, and / or their groups. Unless otherwise described, the specific process sequence may be performed differently from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously, or in an order opposite to the described order.

[0025] Various exemplary embodiments are described herein with reference to cross-sectional views, wherein the cross-sectional views are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Similarly, differences in shapes in the figures are expected due to, for example, manufacturing techniques and / or tolerances. Therefore, the exemplary embodiments disclosed herein should not be interpreted as being limited to the specific regional shapes described, but rather include shape deviations due to, for example, manufacturing. For example, an implanted region illustrated as a rectangle will typically have circular or arc-shaped features, and / or have a gradient of implant concentration at its edges, not a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface where the implantation occurs. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of the region of the device, and are not intended to be limiting.

[0026] Unless otherwise defined, the terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by people with ordinary skills in the field of which the present disclosure is a part. Unless explicitly defined herein, terms (such as those defined in commonly used dictionaries) will be understood to have a meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal manner.

[0027] Figure 1 is a schematic diagram of a thin film deposition apparatus according to one or more exemplary embodiments.

[0028] like Figure 1 As shown, the thin film deposition apparatus includes a mask 200 and a deposition source unit 100, wherein the mask 200 is used to form a desired pattern on a substrate 300 as a deposition object. The deposition source unit 100 may be configured to reciprocate inside a chamber 400 and spray (or otherwise release) a deposition gas toward the substrate 300. Therefore, when the deposition source unit 100 sprays the deposition gas in the chamber 400, the deposition gas may pass through the opening formed in the mask 200 and may be deposited on the substrate 300, thereby forming a thin film in a determined pattern.

[0029] Figure 2 According to one or more exemplary embodiments, Figure 1 A cross-sectional view of a unit pixel structure of an organic light-emitting display device formed by a thin film deposition device. For example, Figure 1 The substrate 300 may be Figure 2A substrate 300 of an organic light emitting display device. A unit pixel may include three color sub-pixels, such as a red (R) sub-pixel, a green (G) sub-pixel, and a blue (B) sub-pixel. However, it is contemplated that any suitable color and number of sub-pixels may be formed for use in association with the exemplary embodiments described herein. For ease of description, hereinafter, each sub-pixel of a unit pixel will be referred to as a pixel.

[0030] Reference Figure 2 , a unit pixel may include: a buffer layer 330 formed on a substrate 300, a thin film transistor TFT_R for a red pixel R, a thin film transistor TFT_G for a green pixel G, and a thin film transistor TFT_B for a blue pixel B, wherein these thin film transistors are disposed on a surface (e.g., an upper surface) of the buffer layer 330. Each of the thin film transistors TFT_R, TFT_G, and TFT_B may include a semiconductor active layer 331, a gate insulating layer 332 covering the semiconductor active layer 331, and a gate electrode 333 disposed on the gate insulating layer 332 (e.g., disposed on an upper surface of the gate insulating layer 332). An interlayer insulating layer 334 is formed to cover the gate electrode 333. A source electrode 335 and a drain electrode 336 are formed on an upper portion of the interlayer insulating layer 334. The source electrode 335 and the drain electrode 336 are in contact with a source region and a drain region of the semiconductor active layer 331 through corresponding contact holes formed in the gate insulating layer 332 and the interlayer insulating layer 334, respectively.

[0031] The corresponding pixel electrodes 320_R, 320_G and 320_B of each organic light emitting device EL_R, EL_G and EL_B are respectively connected to the drain electrode 336 of the color pixel. Each pixel electrode 320_R, 320_G and 320_B may be formed on a planarization layer 337. The pixel electrodes 320_R, 320_G and 320_B may be covered by a pixel defining layer 338. An intermediate layer is formed on the pixel electrodes 320_R, 320_G and 320_B, wherein the intermediate layer includes an emission layer 323_R, 323_G and 323_B and an auxiliary layer. A relative electrode 326 is formed on each intermediate layer.

[0032] The auxiliary layer includes hole injection layers 321_R and 321_G, a hole transport layer 322, an electron transport layer 324, and an electron injection layer 325. Figure 2As shown, hole injection layers 321_R and 321_G are not arranged to be associated with blue pixel B, but are arranged to be associated with red pixel R and green pixel G. Hole injection layers 321_R and 321_G are arranged to be associated with emission layers 323_R and 323_G, respectively. In this way, emission layers 323_R and 323_G overlap with hole injection layers 321_R and 321_G, respectively. Like the relative electrode 326, hole transport layer 322, electron transport layer 324 and electron injection layer 325 are common layers formed in association with each pixel region. Similarly, relative electrode 326, hole transport layer 322, electron transport layer 324 and electron injection layer 325 can be formed by an open mask without any specific pattern, or in other words, can be formed to cover the entire surface of the lower layer (underlying layer) located on substrate 300. The emission layer 323_R of the red pixel R and the emission layer 323_B of the blue pixel B have the same pattern, but are spaced apart from each other by a determined interval corresponding to the interval between the red pixel R and the blue pixel B.

[0033] According to one or more exemplary embodiments, a method for forming emission layers 323_R, 323_G and 323_B and hole injection layers 321_R and 321_G at an accurate position by accurate patterning and accurate overlapping conditions is provided. In this way, the mask used to form emission layers 323_R and 323_B may be different from the mask used to form emission layer 323_G. In addition, since blue pixel B does not include a hole injection layer, one or more masks used to form hole injection layers 321_R and 321_G may not be used to form a portion of blue pixel B. To this end, emission layers 323_R, 323_G and 323_B and hole injection layers 321_R and 321_G should be patterned at an accurate position in each pixel. However, when the mask is not located at an accurate position, the position of the thin film deposited on substrate 300 may be offset from the desired position, and this may reduce the display quality of the pixel. To help avoid (or at least reduce the likelihood of) such shifting of the mask, the method may include a process for accurately measuring pixel locations so as to accurately deposit the film in association therewith.

[0034] Figure 3 is a plan view of thin film patterns and marks formed on a substrate according to one or more exemplary embodiments, wherein the thin film patterns may be used to accurately position a mask associated with a pixel for thin film deposition.

[0035] In order to measure the deposition position accuracy, a mark M (eg, Figure 3 As shown), and patterns G1', R1', G2' and R2' (as shown Figure 4A and Fig. 6AThe thin film layers G1, R1, B, G2, and R2 for inspection may be formed as shown in FIG. The thin film layers G1, R1, B, G2, and R2 may be formed on a reference center point C1, wherein the reference center point C1 is aligned with a virtual extension line extending from the mark M in the first direction D1. In this manner, when the emission layers 323_R, 323_G, and 323_B and the hole injection layers 321_R and 321_G are formed, the thin film layers G1, R1, B, G2, and R2 for inspection may also be deposited and formed on the substrate 300. Therefore, when the mask is accurately positioned, the center point C2 of the thin film layers G1, R1, B, G2, and R2 for inspection will coincide with the reference center point C1 associated with the mark M. However, when the mask is not accurately positioned, and thus, for example, is offset in the second direction D2, the center point C2 of the thin film layers G1, R1, B, G2, and R2 for inspection will not coincide with the reference center point C1 associated with the mark M. Instead, there will be a gap interval in the second direction D2 between the reference center point C1 and the center point C2, such as Figure 3 As shown. The gap spacing can be measured as an offset misalignment of the mask. The measured gap spacing can be used to reposition the mask so that the offset can be eliminated for the next deposition process.

[0036] Although not shown, it is also contemplated that one or more marks may be formed on a second side of the substrate 300 that is perpendicular (or substantially perpendicular) to the first side of the substrate 300 (or formed in another portion of the substrate) to measure and adjust for positioning accuracy associated with the first direction D1. In other words, the gap spacing may also be measured in the first direction D1 based on the offset of the reference center point C1 and the center point C2 in the first direction D1. In this manner, the mask may be accurately positioned in both the first direction D1 and the second direction D2.

[0037] The following will be combined Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 5A , Figure 5B , Figure 5C , Figure 5D , Fig. 6A , Figure 6B , Figure 6C and Fig.6D An exemplary method of forming the emission layers 323_R, 323_G, and 323_B, the hole injection layers 321_R and 321_G, and the respective thin film layers G1, R1, B, G2, and R2 for inspection is described.

[0038] Figure 4A , Figure 4B , Figure 4C and Figure 4DA method of patterning the emission layer of a first pixel and the emission layer of a second pixel using a first mask according to one or more exemplary embodiments is shown. For example, the emission layer of the first pixel may be the emission layer 323_R of the red pixel R, and the emission layer of the second pixel may be the emission layer 323_B of the blue pixel B. For this purpose, the first mask will be referred to as mask 210a.

[0039] like Figure 4A and Figure 4B As shown, the first mask 210a may include: a first pixel pattern located in the active area 211 and in the dummy area 212 disposed outside the active area 211, a pattern R1' for inspecting the first pixel position, and a pattern R2' for inspecting the second pixel position. The active area 211 is a pattern area for actually forming the emission layers 323_R, 323_G and 323_B and the hole injection layers 321_R and 321_G. The dummy area 212 is an edge pattern area disposed outside the active area 211 (e.g., surrounding the active area 211). The pattern R1' for inspecting the first pixel position is a pattern for forming the thin film layer R1 for the first inspection, as shown in FIG. Figure 4C The pattern R1' is used when forming the emission layer 323_R of the red pixel R. The pattern R2' for inspecting the second pixel position is a pattern for forming the thin film layer R2 for the third inspection, as shown in FIG. Figure 4C and Figure 4D shown.

[0040] According to one or more exemplary embodiments, during the process of forming the emission layer 323_R of the red pixel R and the emission layer 323_B of the blue pixel B, the pattern R2' for checking the second pixel position may not be used. For example, the pattern R2' for checking the second pixel position may be an opening formed in the first mask 210a, and similarly, in Figure 4C and Figure 4D During the deposition process shown, a thin film layer R2 for the third inspection is formed on the substrate 300. However, it should be noted that the thin film layer R2 for the third inspection is formed at a position different from the position of the mark M, so that the thin film layer R2 for the third inspection is not used for the first inspection. In addition, the thin film layer R2 will not interfere with the first inspection.

[0041] When forming the emission layer 323_R of the red pixel R using the first mask 210a, the first mask 210a is aligned on the substrate 300 and deposition is performed, as shown in FIG. Figure 4A In this way, red (R) color (hereinafter referred to as the first color) thin film layers 301, 302, R1 and R2 are formed on the substrate 300, as shown in FIG. Figure 4CAs shown. The active area 301 and the dummy area 302 of the first color thin film layer are respectively formed on the substrate 300 corresponding to the first pixel pattern in the active area 211 and the dummy area 212 of the first mask 210a. The thin film layers R1 and R2 for the first inspection and the third inspection are respectively formed on the areas corresponding to the patterns R1' and R2' for inspecting the first pixel position and the second pixel position of the first mask 210a. The thin film layer corresponding to the active area 301 will become the emission layer 323_R of the red pixel R.

[0042] In order to check whether the first color thin film layers 301, 302, R1 and R2 including the emission layer 323_R of the red pixel R are accurately formed, the position of the center point C2 of the thin film layer R1 for the first inspection is compared with the position of the reference center point C1 associated with the mark M, as shown in FIG. Figure 3 When the comparison result shows that the first mask 210a is offset, the position of the first mask 210a is adjusted so that the offset can be eliminated (or at least reduced) when forming the next first color thin film layers 301, 302, R1 and R2.

[0043] According to one or more exemplary embodiments, the first mask 210a for forming the emission layer 323_R of the red pixel R may be used even when forming the emission layer 323_B of the blue pixel B. However, it is contemplated that the first mask 210a may be used to form the emission layer 323_R of the red pixel R but may not be used to form the emission layer 323_B of the blue pixel B. In this way, another first mask 210a may be used.

[0044] like Figure 4A As shown, the first mask 210a is disposed on the substrate 300, and as shown in FIG. Figure 4B As shown, the first mask 210a is moved by a determined pitch and aligned with the substrate 300 based at least in part on the formation of the emission layer 323_R of the red pixel R. In other words, because the emission layer 323_R of the red pixel R and the emission layer 323_B of the blue pixel B have the same pattern (if the emission layer 323_R of the red pixel R is moved by a determined pitch over the emission layer 323_B of the blue pixel B, the emission layer 323_R of the red pixel R and the emission layer 323_B of the blue pixel B will overlap each other), the first mask 210a can be moved by a determined pitch to form the emission layer 323_B of the blue pixel B. Similarly, when the first mask 210a used to form the emission layer 323_R of the red pixel R is moved by a determined pitch, the emission layer 323_B of the blue pixel B can be formed. By taking the determined pitch into account, the moving distance can be adjusted by 1 pitch, 3 pitches, etc. To this end, it should be noted that the movement of the first mask 210a should be performed within the width "d" of the dummy region in the movement direction.

[0045] Therefore, if Figure 4B As shown, when the first mask 210a is moved by a determined distance relative to the substrate 300, the first pixel pattern of the active area 211 and the dummy area 212 and the patterns R1' and R2' for checking the first pixel position and the second pixel position are also moved and aligned. Similarly, when the deposition process is performed, blue (B) color (hereinafter referred to as the second color) thin film layers 301, 302, B and R2 are formed, and the above-mentioned thin film layers are moved by a determined distance from the first color thin film layer, as shown by comparing Figure 4C and Figure 4D As can be seen. The active area 301 and the dummy area 302 of the second color thin film layer are formed on the areas of the substrate 300 corresponding to the first pixel patterns of the active area 211 and the dummy area 212 of the first mask 210a, respectively. To this end, the thin film layer B for the second inspection and the thin film layer R2 for the third inspection are formed on the areas corresponding to the patterns R1' and R2' for the first pixel position and the second pixel position of the first mask 210a for inspection, respectively. In this way, the thin film layer corresponding to the active area 301 will become the emission layer 323_B of the blue pixel B.

[0046] In order to check whether the second color thin film layers 301, 302, B and R2 including the emission layer 323_B of the blue pixel B are accurately formed, the position of the center point C2 of the thin film layer B for the second inspection and the position of the reference center point C1 associated with the mark M can be compared with each other, as shown in FIG. Figure 3 When the comparison result shows that the first mask 210a is offset, the position of the first mask 210a can be adjusted so that the offset can be eliminated (or at least reduced) when forming the next second color thin film layers 301, 302, B and R2.

[0047] The first mask 210 a may also be used to form a hole injection layer 321_R, wherein the hole injection layer 321_R is an auxiliary layer of the red pixel R.

[0048] Figure 5A , Figure 5B , Figure 5C and Figure 5D The use of one or more exemplary embodiments is shown Figure 4A , Figure 4B , Figure 4C and Figure 4D As mentioned above, the first pixel may be a red pixel R, so that the emission layer of the first pixel may be the emission layer 323_R of the red pixel R and the auxiliary layer of the first pixel may be the hole injection layer 321_R of the red pixel R.

[0049] Reference Figure 5A , Figure 5B , Figure 5C and Figure 5D By setting a first mask 210a and a Figure 5A and Figure 5C Deposition is performed as in the above to form the first color thin film layers 301, 302, R1, and R2. After the first color thin film layers 301, 302, R1, and R2 are formed, a process of correcting the offset by comparing the position of the center point C2 of the thin film layer R1 for the first inspection with the position of the reference center point C1 associated with the mark M is performed. This correction process is the same as Figure 4A and Figure 4C , and similarly, repeated descriptions will be omitted so as not to obscure the exemplary embodiments.

[0050] The first mask 210a is used to form a hole injection layer 321_R, wherein the hole injection layer 321_R is an auxiliary layer (hereinafter referred to as a first auxiliary layer) of the red pixel R. However, it should be noted that the portion of the first mask 210a used to form the emission layer 323_R of the red pixel R is different from the portion of the first mask 210a used to form the hole injection layer 321_R of the red pixel. It is also contemplated that a different first mask may be used to form the hole injection layer 321_R of the red pixel R.

[0051] like Figure 5A As shown, the first mask 210a is disposed on the substrate 300. The first mask 210a is rotated 180 degrees from a position associated with the emission layer 323_R forming the red pixel R. To this end, the rotational configuration of the first mask 210a is aligned relative to the substrate 300. In other words, because the emission layer 323_R of the red pixel R and the hole injection layer 321_R of the red pixel R are thin film layers of the same pattern formed at the same position, the first mask 210a of the same type as the first mask for forming the emission layer 323_R of the red pixel R can be used. In addition, because a pattern of the same shape as the shape of the emission layer 323_R for forming the red pixel R is repeatedly formed, the pattern can be maintained without change even when the first mask 210a is rotated 180 degrees. However, it should be noted that a certain offset may occur, but the offset can be determined and adjusted by the next offset correction process.

[0052] When the first mask 210a is rotated 180 degrees, the pattern R2' for checking the second pixel position described above corresponds to a position that can be compared with the mark M on the substrate 300. In this way, when deposition is performed, as shown in FIG. Figure 5D In this way, thin film layers 301, 302, R1 and R2 associated with the first auxiliary layer are formed. The thin film layer corresponding to the active area 301 will become the hole injection layer 321_R of the red pixel R.

[0053] In order to check whether the thin film layers 301, 302, R1 and R2 of the first auxiliary layer including the hole injection layer 321_R of the red pixel R are accurately formed, the position of the center point C2 of the thin film layer R2 for the third inspection and the position of the reference center point C1 of the mark M may be compared with each other, as shown in FIG. Figure 3 When it is determined as a result of the comparison that the first mask 210a is offset, the position of the first mask 210a may be adjusted so that the offset may be eliminated (or at least reduced) when forming the thin film layers 301, 302, R1 and R2 of the next first auxiliary layer.

[0054] Although the formation of the emission layer 323_R of the red pixel R has been described first for the convenience of description, based on the reference Figure 2 In the stacking order described, the hole injection layer 321_R of the red pixel R is formed before the emission layer 323_R of the red pixel R. In this way, since the emission layer 323_R of the red pixel R, the emission layer 323_B of the blue pixel B, and the hole injection layer 321_R of the red pixel R can be formed using the same first mask 210a, not only the possibility of error is reduced, but also the manufacturing time and cost are reduced. In addition, it is easier to manage the entire manufacturing process.

[0055] Fig. 6A , Figure 6B , Figure 6C and Fig.6D A method of patterning the emission layer of the third pixel and the auxiliary layer of the third pixel using the second mask according to one or more exemplary embodiments is shown. For example, the emission layer of the third pixel may be the emission layer 323_G of the green pixel G, and the auxiliary layer of the third pixel may be the hole injection layer 321_G of the green pixel G. The second mask will be referred to as mask 210b.

[0056] Assuming that the emission layer 323_G and the hole injection layer 321_G of the green pixel G have patterns different from those of the red pixel R and the blue pixel B, the emission layer 323_G and the hole injection layer 321_G are not formed by moving or rotating the first mask 210a, but instead a second mask 210b is used to form the emission layer 323_G and the hole injection layer 321_G, wherein the second mask 210b has a second pixel pattern located in the active area 213 and the dummy area 214 and patterns G1', G2' for checking the third pixel position and the fourth pixel position of the green pixel G.

[0057] According to one or more exemplary embodiments, Fig. 6AThe second mask 210b is aligned on the substrate 300 and deposition is performed. Green (G) color (referred to herein as the third color) thin film layers 303, 304, G1 and G2 are formed on the substrate 300, as shown in FIG. Figure 6C As shown. The active area 303 and the dummy area 304 of the third color thin film layer are formed on the substrate 300 respectively corresponding to the second pixel pattern in the active area 213 and the dummy area 214 of the second mask 210b. The thin film layers G1 and G2 for the fourth inspection and the fifth inspection are formed on the areas corresponding to the patterns G1' and G2' for inspecting the third pixel position and the fourth pixel position of the second mask 210b respectively. The thin film layer corresponding to the active area 303 will become the emission layer 323_G of the green pixel G.

[0058] In order to check whether the third color thin film layers 303, 304, G1 and G2 including the emission layer 323_G of the green pixel G are accurately formed, the position of the center point C2 of the thin film layer G1 for the fourth inspection and the position of the reference center point C1 associated with the mark M are compared with each other, as shown in FIG. Figure 3 When the comparison result determines that the second mask 210b is offset, the position of the second mask 210b can be adjusted so that the offset can be eliminated (or at least reduced) when forming the next third color thin film layers 303, 304, G1 and G2.

[0059] The second mask 210b may also be used to form a hole injection layer 321_G, which is an auxiliary layer (hereinafter referred to as a second auxiliary layer) of the green pixel G. However, it is contemplated that when forming the hole injection layer 321_G of the green pixel G, the second mask 210b used when forming the emission layer 323_G of the green pixel G may not be used, but another second mask 210b may be used instead.

[0060] like Fig. 6A As shown, the second mask 210b is disposed on the substrate 300. The second mask 210b is rotated 180 degrees from the position where the emission layer 323_G of the green pixel G is formed and aligned relative to the substrate 300. In other words, because the emission layer 323_G of the green pixel G and the hole injection layer 321_G of the green pixel G are thin film layers with the same pattern formed at the same position, the second mask 210b can be used. In addition, because the pattern of the same shape is repeatedly formed, the pattern can be maintained without change even when the second mask 210b is rotated 180 degrees. However, it should be noted that a certain offset may occur, but the offset can be adjusted by the next offset correction process.

[0061] In addition, when the second mask 210b is rotated 180 degrees, the pattern G2' for checking the fourth pixel position corresponds to such a position that can be compared with the mark M on the substrate 300. In this way, when the deposition is performed, the thin film layers 303, 304, G1 and G2 of the second auxiliary layer can be formed, as shown in FIG. Fig.6D The thin film layer corresponding to the active area 303 will become the hole injection layer 321_G of the green pixel G.

[0062] In order to check whether the thin film layers 303, 304, G1 and G2 of the second auxiliary layer including the hole injection layer 321_G of the green pixel G are accurately formed, the position of the center point C2 of the thin film layer G2 for the fifth inspection and the position of the reference center point C1 associated with the mark M may be compared with each other, as shown in FIG. Figure 3 When the comparison result determines that the second mask 210b is offset, the position of the second mask 210b can be adjusted so that the offset can be eliminated (or at least reduced) when forming the thin film layers 303, 304, G1 and G2 of the next second auxiliary layer.

[0063] Although the formation of the emission layer 323_G of the green pixel G has been described first for the convenience of description, based on the combination of Figure 2 In the stacking order described, the hole injection layer 321_G of the green pixel G is formed before the emission layer 323_G of the green pixel G. In this way, since the emission layer 323_G of the green pixel G and the hole injection layer 321_G of the green pixel G can be formed using the same second mask 210b, not only the possibility of error is reduced, but also the manufacturing time and cost are reduced. In addition, it is easier to manage the entire manufacturing process.

[0064] Therefore, the emission layers 323_R, 323_G, and 323_B of the red pixel R, the green pixel G, and the blue pixel B and the hole injection layers 321_R and 321_G of the red pixel R and the green pixel G can be formed in two different orientations using two masks (e.g., the first mask 210a and the second mask 210b). In this way, the exemplary embodiment not only makes it possible to reduce the possibility of errors, but also makes it possible to reduce manufacturing time and cost. In addition, it is easier to manage the entire manufacturing process and productivity can be increased.

[0065] While specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from these descriptions. Therefore, the inventive concept is not limited to these embodiments, but rather to the broader scope of the submitted claims and various obvious modifications and equivalent arrangements.

Claims

1. An organic light emitting display device, comprising: A substrate, comprising an active region and a dummy region located outside the active region; A first pixel electrode, located in the active area; A first auxiliary layer, located on the pixel electrode; as well as A first color emission layer is located on the first auxiliary layer, wherein the first color emission layer and the first auxiliary layer are configured to be formed using the same patterning mask, and The same patterned mask for forming the first auxiliary layer is adjusted by a predetermined amount relative to the arrangement of the substrate to form the first color emission layer. 2 . The organic light emitting display device according to claim 1 , wherein the first color emission layer is a red emission layer. 3 . The organic light emitting display device according to claim 1 , wherein the first color emission layer is a green emission layer.

4. The organic light emitting display device according to claim 1, further comprising: A second pixel electrode, located in the active area; as well as A second color emission layer is located on the second pixel electrode, wherein the first color emission layer and the second color emission layer have different colors, and Wherein, the distance between the first color emission layer and the first pixel electrode is greater than the distance between the second color emission layer and the second pixel electrode. 5 . The organic light emitting display device of claim 1 , wherein a position of the same patterning mask for forming the first auxiliary layer is moved by a predetermined distance to form the first color emission layer.

6. A method for manufacturing an organic light emitting display device, the method comprising: forming a pixel electrode at a central portion of a substrate, the central portion corresponding to an active area of ​​the organic light emitting display device; forming a first layer on the pixel electrode using a first mask; as well as forming a first color emission layer on the first layer using the first mask, The forming of the first color emission layer comprises: After forming the first layer on the pixel electrode, the arrangement of the first mask relative to the substrate is adjusted by a predetermined amount to form the first color emission layer. The method of claim 6 , wherein the first color emission layer is a red emission layer. The method according to claim 6 , wherein the first color emission layer is a green emission layer.

9. The method of claim 6, wherein the first layer is an auxiliary layer of the first color emission layer.

10. The method of claim 6, wherein the first layer is located between the first color emission layer and the pixel electrode.

11. The method according to claim 6, wherein forming the first color emission layer comprises: After forming the first layer on the pixel electrode, the position of the first mask is moved by a predetermined distance to form the first color emission layer.

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