Display device

Abstract

A display device is provided. The display device includes: a display panel including a substrate base, a thin film transistor layer on the substrate base, and a light emitting element layer including light emitting elements on the thin film transistor layer; a cover window on the light emitting element layer of the display panel; and a fingerprint recognition sensor layer under the display panel. The substrate base includes a first substrate, a second substrate on the first substrate, and a light blocking layer between the first substrate and the second substrate, and the light blocking layer includes holes through which light reflected by a finger touching the cover window passes.

Description

[0001] This application claims priority and benefit of Korean Patent Application No. 10-2019-0091658, filed on Jul. 29, 2019, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Embodiments of the present disclosure relate to a display device. Background Art

[0003] With the development of multimedia, display devices are becoming increasingly important. Accordingly, various types of display devices, such as liquid crystal display devices and organic light emitting display devices, are being used.

[0004] Among these display devices, an organic light emitting display device uses an organic light emitting diode that generates light through the recombination of electrons and holes to display an image. The organic light emitting display device has characteristics of a fast response speed, high brightness, a wide viewing angle, and low power consumption.

[0005] Recently, technologies for integrating a fingerprint recognition sensor into a display panel, which is a component that occupies the largest area in a portable information communication device, have been studied and developed. Summary of the Invention

[0006] Aspects of embodiments of the present disclosure provide a display device that can implement fingerprint recognition without a separate or external light source.

[0007] Aspects of embodiments of the present disclosure also provide a display device having improved fingerprint recognition characteristics.

[0008] However, aspects of the present disclosure are not limited to the aspects set forth herein. These and other aspects of embodiments of the present disclosure will become more apparent to those of ordinary skill in the art to which the present disclosure pertains by referring to the detailed description of the present disclosure given below.

[0009] An embodiment of a display device includes: a display panel including a substrate base, a thin film transistor layer on the substrate base, and a light emitting element layer including light emitting elements on the thin film transistor layer; a cover window on the light emitting element layer of the display panel; and a fingerprint recognition sensor layer under the display panel, wherein the substrate base includes a first substrate, a second substrate on the first substrate, and a light blocking layer between the first substrate and the second substrate, and wherein the light blocking layer includes holes through which light reflected by a finger touching the cover window passes. Brief Description of the Drawings

[0010] These and / or other aspects of embodiments of the present disclosure will become apparent and more readily appreciated from the following description of embodiments in conjunction with the accompanying drawings, in which:

[0011] Figure 1 and Figure 2 is a schematic plan view of a display device according to an embodiment;

[0012] Figure 3 is a schematic cross-sectional view of a display device according to an embodiment;

[0013] Figure 4 schematically shows the traveling direction of reflected light according to an embodiment;

[0014] Figure 5 is a plan view of a part of a light blocking layer according to an embodiment;

[0015] Figure 6 is a plan view of a part of a light blocking layer according to an embodiment;

[0016] Figure 7 is a plan view of a hole, an image collection area, and a light reception area according to an embodiment;

[0017] Figure 8 is a schematic plan view of a fingerprint recognition sensor layer according to an embodiment;

[0018] Figure 9 is an equivalent circuit diagram of a fingerprint recognition sensor according to an embodiment;

[0019] Figure 10 is a block diagram of a display device according to an embodiment;

[0020] Figure 11 is along Figure 2 a cross-sectional view taken along line I-I';

[0021] Figure 12 schematically shows a fingerprint recognition process according to an embodiment;

[0022] Figure 13 is a plan view of a part of a light blocking layer according to an embodiment;

[0023] Figure 14 schematically shows the traveling direction of reflected light according to an embodiment;

[0024] Figure 15 is a plan view of a hole, an image collection area, and a light reception area according to an embodiment;

[0025] Figure 16 is a plan view of a part of a light blocking layer according to an embodiment;

[0026] Figure 17 is a plan view of a hole, an image collection area, and a light reception area according to an embodiment; and

[0027] Figures 18 to 23 Each figure in Figure 3 is a cross-sectional view of a modified example of the display device shown in Detailed implementation mode

[0028] The subject matter of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. However, the subject matter of the present disclosure may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the subject matter of the present disclosure to those skilled in the art. Throughout the specification, the same reference numerals indicate the same components. In the drawings, the thicknesses of layers and regions may be exaggerated for clarity.

[0029] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on the other layer or substrate, or an intermediate layer may also be present. In contrast, when an element is referred to as being "directly on" another element, no intermediate element is present.

[0030] It will be understood that although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Thus, the first element, component, region, layer or part discussed below may be named the second element, component, region, layer or part without departing from the spirit and scope of the present disclosure.

[0031] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0032] Figure 1 and Figure 2 are schematic plan views of a display device 10 according to an embodiment.

[0033] Referring to Figure 1 , the display device 10 according to an embodiment can be divided into a display area DA and a non-display area NDA.

[0034] The display area DA is defined as an area for displaying an image, and a plurality of sub-pixels SP are in the display area DA. Additionally, the display area DA can be used as a detection component for detecting the external environment. In an embodiment, at least a part of the display area DA can be a fingerprint recognition area FPA for recognizing a user's fingerprint. In some embodiments, the fingerprint recognition area FPA can include a plurality of sub-pixels SP and a plurality of fingerprint recognition sensors FPS. For example, the fingerprint recognition area FPA can display an image and can be used as an area for recognizing a user's fingerprint when it is necessary to recognize the user's fingerprint. In some embodiments, the sub-pixels SP and the fingerprint recognition sensors FPS can be stacked in a third direction (Z-axis direction). In some embodiments, the sub-pixels SP and the fingerprint recognition sensors FPS may not be stacked in the third direction (Z-axis direction), or only some of the sub-pixels SP may be stacked with the fingerprint recognition sensors FPS in the third direction (Z-axis direction).

[0035] The non-display area NDA is outside the display area DA and is defined as an area for not displaying an image. The speaker module 14, the camera module 15, and the sensor module 16 can be in the non-display area NDA. In an embodiment, the sensor module 16 can include at least one of an illuminance sensor, a proximity sensor, an infrared sensor, and an ultrasonic sensor. In an embodiment, the sensor module 16 can also perform a function of recognizing a user's iris. The arrangements of the speaker module 14, the camera module 15, and the sensor module 16 are not limited to Figure 1 the arrangement shown in. In some embodiments, at least one of the speaker module 14, the camera module 15, and the sensor module 16 can be in the display area DA. In this case, since the display area DA is widened, a feeling of being immersed in the image can be provided to the user.

[0036] In an embodiment, the display area DA can have a flat shape. However, at least a part of the display area DA can also be curved. Additionally, the display area DA can be in the edge area of the display device 10.

[0037] Referring to Figure 2 , the fingerprint recognition area FPA can be formed in an area substantially the same as the display area DA. For example, the display area DA and the fingerprint recognition area FPA can coincide. In this case, a fingerprint recognition function can be provided throughout (e.g., substantially throughout) the display area DA.

[0038] Each of the fingerprint recognition sensors FPS in the fingerprint recognition sensor FPS may use a light-emitting element included in at least one adjacent sub-pixel SP as a light source for fingerprint recognition. To this end, each of the fingerprint recognition sensors FPS in the fingerprint recognition sensor FPS may be adjacent to at least one sub-pixel SP. However, the embodiments are not limited to this case, and at least a part of each of the fingerprint recognition sensors FPS in the fingerprint recognition sensor FPS may also overlap with one sub-pixel SP.

[0039] In the display device 10 according to the embodiment, since the fingerprint recognition area FPA including a plurality of fingerprint recognition sensors FPS is provided in the display area DA, the fingerprint recognition function can be provided in the display area DA. In addition, since the display device 10 according to the embodiment uses the light emitted from the sub-pixel SP to recognize the user's fingerprint, the fingerprint recognition function can be implemented without a separate or external light source (for example, a light source separated from the sub-pixel). Therefore, the thickness of the display device 10 having the fingerprint recognition function can be reduced, and the manufacturing cost can be reduced.

[0040] Although the case where the fingerprint recognition area FPA is in the entire (for example, substantially the entire) display area DA is described below, the embodiments are not limited to this case.

[0041] Figure 3 is a schematic cross-sectional view of the display device 10 according to the embodiment.

[0042] Referring to Figure 3 , the display device 10 may include a display panel 100, a cover window CW, and a fingerprint recognition sensor layer FPSL.

[0043] The display panel 100 may include a substrate base SUB, a thin film transistor layer TFTL on the substrate base SUB, a light-emitting element layer EML on the thin film transistor layer TFTL, and a thin film encapsulation layer TFEL.

[0044] The substrate base SUB may include a first substrate B1, a second substrate B2 on the first substrate B1, and a light blocking layer SLL between the first substrate B1 and the second substrate B2.

[0045] Each of the first substrate B1 and the second substrate B2 may be made of an insulating material such as a polymer resin. The polymer material (for example, polymer resin) may be, for example, polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof.

[0046] Each of the first substrate B1 and the second substrate B2 can be a rigid substrate or a flexible substrate that can be bent, folded, and / or curled. When the substrate base SUB or each of the first substrate B1 and the second substrate B2 is a flexible substrate, the substrate base SUB or each of the first substrate B1 and the second substrate B2 can be made of, but not limited to, polyimide (PI).

[0047] The light blocking layer SLL can be a single layer or multiple layers made of any one or more selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys. However, the embodiments are not limited to this case, and in some embodiments, the light blocking layer SLL can be made of a black matrix or can be made of various suitable materials having light blocking properties or light absorbing materials that absorb light.

[0048] The light blocking layer SLL can include holes H. The holes H can be physical holes or through holes that penetrate both surfaces of the light blocking layer SLL. The holes H can be optical channels through which the reflected light L2, which is reflected by the user's fingerprint after the light L1 is output from the light emitting element layer EML, travels toward the fingerprint recognition sensor layer FPSL. In some embodiments, the holes H may not be filled with the material forming the first substrate B1 or the material forming the second substrate B2. For example, the space inside the holes H can be empty. In some embodiments, the holes H can be filled with an optically transparent material (e.g., a material that transmits visible light). For example, a part of the material forming the second substrate B2 can fill the holes H in the process of forming the second substrate B2 on the light blocking layer SLL. Even in this case, if the material forming the second substrate B2 is an optically transparent material, the holes H can still be used as optical channels through which the reflected light L2, which is reflected by the user's fingerprint after the light L1 is output from the light emitting element layer EML, travels toward the fingerprint recognition sensor layer FPSL.

[0049] There can be multiple holes H in the light blocking layer SLL. For example, the holes H can include a plurality of holes spaced apart from each other in the first direction (X-axis direction) and the second direction (Y-axis direction). The size and arrangement of the holes H will be described in more detail below.

[0050] The thin film transistor layer TFTL can be on the second substrate B2. Each thin film transistor of the sub-pixel SP can be in the thin film transistor layer TFTL. Each of the thin film transistors can include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode.

[0051] The light-emitting element layer EML may be on the thin-film transistor layer TFTL. The light-emitting element layer EML may include light-emitting elements, and each light-emitting element includes a first electrode, a light-emitting layer, and a second electrode. Additionally, the light-emitting element layer EML may include a pixel-defining layer for defining sub-pixels SP. The light-emitting layer may be, but is not limited to, an organic light-emitting layer including an organic material. In an example where the light-emitting layer is an organic light-emitting layer, when a set (e.g., predetermined) voltage is applied to the second electrode and a cathode voltage is applied to the first electrode through the thin-film transistor of the thin-film transistor layer TFTL, holes and electrons move to the organic light-emitting layer through the hole transport layer and the electron transport layer, respectively, and combine in the organic light-emitting layer to emit light.

[0052] The thin-film encapsulation layer TFEL may be on the light-emitting element layer EML. The thin-film encapsulation layer TFEL prevents or reduces the penetration of oxygen and / or moisture into the light-emitting element layer EML.

[0053] The cover window CW may be on the display panel 100. For example, the cover window CW may be on the thin-film encapsulation layer TFEL of the display panel 100. In this case, the cover window CW may be attached to the thin-film encapsulation layer TFEL through a transparent adhesive member such as an optically clear adhesive (OCA) film. The cover window CW may be directly touched by the user's finger F.

[0054] In some embodiments, the touch sensor may be between the thin-film encapsulation layer TFEL and the cover window CW. In some embodiments, the touch sensor may include touch electrodes and touch wirings coupled to the touch electrodes.

[0055] The fingerprint recognition sensor layer FPSL may be under the display panel 100. For example, the fingerprint recognition sensor layer FPSL may be under the first substrate B1. Here, as used herein, the term "under the first substrate B1" refers to the side opposite to the side of the first substrate B1 on which the light-blocking layer SLL is located.

[0056] The fingerprint recognition sensor layer FPSL may include Figure 2 the fingerprint recognition sensor FPS shown in. Additionally, the fingerprint recognition sensor layer FPSL may be in the form of an array of fingerprint recognition sensors FPS. The fingerprint recognition sensors FPS included in the fingerprint recognition sensor layer FPSL may be optical sensors. For example, the fingerprint recognition sensor FPS may be a photodiode, a complementary metal-oxide-semiconductor (CMOS) image sensor, or a charge-coupled device (CCD) image sensor.

[0057] When the user's finger F touches the cover window CW, the light L1 output from the light-emitting element layer EML is reflected by the ridges FR or valleys FV of the user's finger F. Among the reflected light L2, the component passing through the hole H is provided to the fingerprint recognition sensor FPS of the fingerprint recognition sensor layer FPSL under the substrate SUB. The fingerprint recognition sensor FPS, which is an optical sensor, can convert the reflected light L2 into an electrical signal and can recognize the user's fingerprint pattern from the electrical signal. Among the reflected light L2, the component not passing through the hole H is blocked by the light blocking layer SLL. For example, the hole H can provide only the components required for fingerprint recognition to the fingerprint recognition sensor FPS. Although the display panel 100 and the fingerprint recognition sensor layer FPSL are shown as separate elements in Figure 3 this is merely an example, and the fingerprint recognition sensor layer FPSL can also be an element of the display panel 100.

[0058] When the fingerprint recognition sensor layer FPSL is under the display panel 100 as described above, the manufacturing process can be simplified, and the fingerprint recognition sensor FPS and the fingerprint recognition area FPA can be easily aligned. In addition, since the fingerprint recognition sensor FPS is not above the path along which the light is output (not above the light-emitting element layer EML), a decrease in resolution can be prevented or reduced.

[0059] Figure 4 The traveling direction of the reflected light according to an embodiment is schematically shown. For ease of description, only the light blocking layer SLL of the display panel 100 is shown, and the light traveling from the cover window CW toward the fingerprint recognition sensor layer FPSL refers to the light reflected by the user's finger.

[0060] Referring to Figure 4 , the cover window CW is on the display panel 100, and the fingerprint recognition sensor layer FPSL is under the display panel 100. The fingerprint recognition sensor layer FPSL can contact (e.g., physically contact or directly contact) the lower surface of the display panel 100, and the fingerprint recognition sensor layer FPSL and the display panel 100 can be closely attached to each other with no air gap therebetween. Since no (or substantially no) air gap is formed between the fingerprint recognition sensor layer FPSL and the display panel 100, the process can be simplified, the reliability of the display device 10 can be improved, and a thin display device 10 can be realized. However, this does not exclude accidental air gaps generated during the manufacturing process.

[0061] The light blocking layer SLL can be in the display panel 100 and include a first hole H1 and a second hole H2. The first hole H1 and the second hole H2 can be spaced apart from each other, and the light reflected by the user's fingerprint can pass through the first hole H1 and the second hole H2 to reach the fingerprint recognition sensor layer FPSL. For ease of description, the light passing through the first hole H1 is defined as the first light, and the light passing through the second hole H2 is defined as the second light.

[0062] In some embodiments, the cover window CW can include an image sensing area IPA. For example, the cover window CW can include a first image sensing area IPA1 and a second image sensing area IPA2. The first image sensing area IPA1 can be an area of the cover window CW that recognizes a fingerprint pattern through the first light, and the second image sensing area IPA2 can be an area of the cover window CW that recognizes a fingerprint pattern through the second light. Additionally, in some embodiments, an overlapping area OA can be formed where the first image sensing area IPA1 and the second image sensing area IPA2 overlap. In this case, the fingerprint pattern of a finger on the cover window CW can be scanned in its entirety.

[0063] The width of the first image sensing area IPA1 of the cover window CW in the first direction (X-axis direction) can depend on the incident angle θ, which is the angle at which the first light is incident on the first hole H1. The incident angle θ can be defined based on a third direction (Z-axis direction) perpendicular to (e.g., substantially perpendicular to) the first direction (X-axis direction). For example, when the light is incident parallel to (e.g., substantially parallel to) the third direction (Z-axis direction), the incident angle θ can be 0 degrees. Additionally, when the light is incident at Figure 4 an acute angle formed clockwise with the third direction (Z-axis direction), the incident angle θ can be defined as a positive angle. Furthermore, when the light is incident at Figure 4 an acute angle formed counterclockwise with the third direction (Z-axis direction), the incident angle θ can be defined as a negative angle.

[0064] In some embodiments, the incident angle θ of the first light can be from about -33 degrees to about 33 degrees. Additionally, the width of the second image sensing area IPA2 of the cover window CW in the first direction (X-axis direction) can depend on the incident angle, which is the angle at which the second light is incident on the second hole H2. The incident angle can be the same (e.g., substantially the same) as the incident angle θ at which the first light is incident on the first hole H1.

[0065] In some embodiments, the fingerprint recognition sensor layer (FPSL) may include a light receiving region (LRA). For example, the fingerprint recognition sensor layer (FPSL) may include a first light receiving region (LRA1) and a second light receiving region (LRA2). The first light receiving region (LRA1) may be a region where the first light that has scanned a fingerprint pattern is input to the fingerprint recognition sensor layer (FPSL), and the second light receiving region (LRA2) may be a region where the second light that has scanned a fingerprint pattern is input to the fingerprint recognition sensor layer (FPSL).

[0066] The width of the first light receiving region (LRA1) in the first direction (X-axis direction) may be less than the width of the first image sensing region (IPA1) in the first direction (X-axis direction), and the width of the second light receiving region (LRA2) in the first direction (X-axis direction) may be less than the width of the second image sensing region (IPA2) in the first direction (X-axis direction). This width difference in the first direction (X-axis direction) between the first light receiving region (LRA1) and the second light receiving region (LRA2) and the first image sensing region (IPA1) and the second image sensing region (IPA2) depends on the position of the light blocking layer (SLL). For example, as the light blocking layer (SLL) approaches the cover window (CW), the widths of the first light receiving region (LRA1) and the second light receiving region (LRA2) in the first direction (X-axis direction) increase, but the widths of the first image sensing region (IPA1) and the second image sensing region (IPA2) in the first direction (X-axis direction) decrease. Conversely, as the light blocking layer (SLL) approaches the fingerprint recognition sensor layer (FPSL), the widths of the first light receiving region (LRA1) and the second light receiving region (LRA2) in the first direction (X-axis direction) decrease, but the widths of the first image sensing region (IPA1) and the second image sensing region (IPA2) in the first direction (X-axis direction) increase.

[0067] In the current embodiment, the light blocking layer (SLL) is closer to the fingerprint recognition sensor layer (FPSL) than to the cover window (CW). However, the position of the light blocking layer (SLL) can be variously changed.

[0068] In some embodiments, the first light receiving region (LRA1) and the second light receiving region (LRA2) may be in contact with each other (e.g., may be in physical contact or direct contact with each other). For example, one side of the first light receiving region (LRA1) and one side of the second light receiving region (LRA2) may be in contact with each other (e.g., may be in physical contact or direct contact with each other). However, this does not exclude an accidental minute (e.g., small) gap or overlap generated between the one side of the first light receiving region (LRA1) and the one side of the second light receiving region (LRA2) during the process.

[0069] In some embodiments, each of the first light receiving region LRA1 and the second light receiving region LRA2 may include an image acquisition area IAA. For example, the first light receiving region LRA1 may include a first image acquisition area IAA1, and the second light receiving region LRA2 may include a second image acquisition area IAA2.

[0070] The first image acquisition area IAA1 may be an area into which the effective fingerprint pattern information among the fingerprint patterns input to the first light receiving region LRA1 is input, and the second image acquisition area IAA2 may be an area into which the effective fingerprint pattern information among the fingerprint patterns input to the second light receiving region LRA2 is input. Among the fingerprint patterns input to the first light receiving region LRA1 and the second light receiving region LRA2, only the fingerprint patterns input to each of the first image acquisition area IAA1 and the second image acquisition area IAA2 may be used to form a fingerprint image.

[0071] The first image acquisition area IAA1 may be the core area remaining after removing the outer edge of the first light receiving region LRA1. The second image acquisition area IAA2 may be the core area remaining after removing the outer edge of the second light receiving region LRA2.

[0072] The fingerprint recognition sensor layer FPSL may stitch (also known as join) the fingerprint patterns input to the first image acquisition area IAA1 and the second image acquisition area IAA2, and perform image enhancement processing to obtain and recognize the final fingerprint image.

[0073] The first image acquisition area IAA1 and the second image acquisition area IAA2 may be spaced apart from each other in a first direction (X-axis direction). For example, the first image acquisition area IAA1 and the second image acquisition area IAA2 may not overlap each other. Therefore, the overlap of the effective fingerprint patterns input to the first image acquisition area IAA1 and the second image acquisition area IAA2 can be prevented or reduced, which would otherwise result in incorrect fingerprint recognition.

[0074] Because the first image acquisition area IAA1 and the second image acquisition area IAA2 are spaced apart from each other as described above, while the first light receiving region LRA1 and the second light receiving region LRA2 are in contact with each other (for example, they may be in physical contact or direct contact with each other), more accurate fingerprint recognition is possible.

[0075] The positions of each of the first light receiving region LRA1 and the second light receiving region LRA2, and the positions of each of the first image collection region IAA1 and the second image collection region IAA2 depend on the spacing P between the first hole H1 and the second hole H2. The spacing P between the first hole H1 and the second hole H2 is defined as the distance in the first direction (X-axis direction) between the center point CP of the first hole H1 and the center point CP of the second hole H2. In some embodiments, the spacing P between the first hole H1 and the second hole H2 may be proportional to the distance between the fingerprint recognition sensor layer FPSL and the light blocking layer SLL. For example, the spacing P between the first hole H1 and the second hole H2 may be defined as the distance or the minimum gap between the center point CP of the hole H (e.g., the center point CP of the first hole H1) and the upper surface of the fingerprint recognition sensor layer FPSL. In some embodiments, the upper surface of the fingerprint recognition sensor layer FPSL may refer to the upper surface of the light receiving region LRA of the fingerprint recognition sensor layer FPSL, the upper surface of the fingerprint recognition sensor FPS, or the upper surface of the light receiving region LRA of the fingerprint recognition sensor FPS. For ease of description, the distance between the center point CP of the hole H and the upper surface of the fingerprint recognition sensor layer FPSL will be referred to as the hole-sensor distance ID hereinafter.

[0076] In some embodiments, the spacing P between the first hole H1 and the second hole H2 may be about 1.3 to about 1.5 times the hole-sensor distance ID, for example, may be about 1.3 times the hole-sensor distance ID. For example, when the incident angle θ of the reflected light on each of the first hole H1 and the second hole H2 is about -33 degrees to about 33 degrees, the spacing P between the first hole H1 and the second hole H2 may be set to about 1.3 times the hole-sensor distance ID so that the first image collection region IAA1 and the second image collection region IAA2 can be spaced apart from each other while the first light receiving region LRA1 and the second light receiving region LRA2 are in contact with each other (e.g., can be in physical contact or direct contact with each other). Accordingly, the fingerprint recognition characteristics of the display device 10 can be effectively improved.

[0077] Figure 5 is a plan view of a part of the light blocking layer SLL according to an embodiment. Figure 6 is a plan view of a part of the light blocking layer SLL_1 according to an embodiment. Figure 7 is a plan view of the hole H, the image collection region IAA, and the light receiving region LRA according to an embodiment.

[0078] Referring to Figure 5 , in some embodiments, the light blocking layer SLL may include a plurality of holes H, and the holes H may be circular in a plan view.

[0079] Each of the holes H may have, but is not limited to, a diameter r of about 3 μm to about 20 μm. In some embodiments, the holes H may be provided with a first pitch P1 in a first direction (X-axis direction). For example, the first pitch P1 may be about 1.3 to about 1.5 times the hole-sensor distance ID (see Figure 4 ), for example, may be about 1.3 times the hole-sensor distance ID. In some embodiments, the holes H may be provided with a second pitch P2 in a second direction (Y-axis direction). The second pitch P2 may be the same as (e.g., substantially the same as) the first pitch P1, but the embodiments are not limited to this case. In some embodiments, the first pitch P1 and the second pitch P2 may be different from each other. Additionally, although in Figure 5 the holes H are aligned parallel to each other (e.g., substantially parallel) in the first direction (X-axis direction) and the second direction (Y-axis direction), this is only an example and the embodiments are not limited to this example. The holes H may also be provided with the first pitch P1 and the second pitch P2, but may not be aligned in the first direction (X-axis direction) and the second direction (Y-axis direction).

[0080] Referring to Figure 6 , in some embodiments, the light blocking layer SLL_1 may include a plurality of square holes H. Each of the holes H may have a first length d1 in a first direction (X-axis direction) and a second length d2 in a second direction (Y-axis direction). The first length d1 may be, but is not limited to, about 3 μm to about 20 μm. Additionally, the second length d2 of each of the holes H may be the same as (e.g., substantially the same as) the first length d1. However, the embodiments are not limited to this case, and the first length d1 and the second length d2 may also be different from each other. Figure 6 The first pitch P1 and the second pitch P2 of the holes H in the light blocking layer SLL_1 of Figure 5 are the same as (e.g., substantially the same as) the first pitch P1 and the second pitch P2 described in Figure 5 and Figure 6 , and thus, the redundant description thereof will not be repeated here. The shape of each of the holes H is not limited to Figure 5 and Figure 6 the circular shape and the square shape shown therein. For example, each of the holes H may have various suitable shapes such as an oval shape and a polygonal shape. Additionally, in some embodiments, the holes H in the light blocking layers SLL and SLL_1 may be composed of holes H having different shapes.

[0081] Referring to Figure 7, in some embodiments, a plurality of holes H, a plurality of image collection regions IAA, and a plurality of light receiving regions LRA may be stacked in the thickness direction. For example, in a plan view, the image collection region IAA may be positioned within the light receiving region LRA, and the hole H may be positioned within the image collection region IAA. Additionally, one hole H, one image collection region IAA, and one light receiving region LRA may form a unit.

[0082] The light receiving regions LRA may be in contact with adjacent light receiving regions LRA (e.g., physical contact or direct contact). For example, the light receiving regions LRA may be in contact with adjacent light receiving regions LRA in a first direction (X-axis direction) and a second direction (Y-axis direction) (e.g., physical contact or direct contact). In some embodiments, one light receiving region LRA may be in contact with four adjacent light receiving regions LRA (e.g., physical contact or direct contact), but may not be stacked with the four adjacent light receiving regions LRA. However, this does not exclude accidental minute (e.g., small) gaps or stacking generated during the process.

[0083] In some embodiments, the image collection regions IAA may be spaced apart from each other. Additionally, the holes H may be spaced apart from each other. The distance between the image collection regions IAA may be less than the distance between the holes H.

[0084] Figure 8 is a schematic plan view of a fingerprint recognition sensor layer FPSL according to an embodiment. Figure 9 is an equivalent circuit diagram of a fingerprint recognition sensor FPS according to an embodiment. Figure 10 is a block diagram of a display device 10 according to an embodiment.

[0085] Referring to Figure 8 , the fingerprint recognition sensor layer FPSL may include a plurality of scan lines SCL, a plurality of readout lines RCL, and a plurality of fingerprint recognition sensors FPS. The region where the fingerprint recognition sensors FPS are located may be defined as a fingerprint recognition region FPA. In some embodiments, the distance between the fingerprint recognition sensors FPS may be from about 5 μm to about 50 μm, and twenty to thirty fingerprint recognition sensors FPS may be positioned in one image collection region IAA (see Figure 7 ).

[0086] The scan lines SCL may be respectively coupled to the corresponding fingerprint recognition sensors FPS among the fingerprint recognition sensors FPS, and the readout lines RCL may be respectively coupled to the corresponding fingerprint recognition sensors FPS among the fingerprint recognition sensors FPS.

[0087] The non - fingerprint recognition area NFPA can be located outside the fingerprint recognition area FPA. The scan line SCL and the scan driving circuit SCV coupled thereto can be on one side of the non - fingerprint recognition area NFPA.

[0088] The read - out line RCL and the read - out circuit RCV coupled thereto can be on one side of the non - fingerprint recognition area NFPA. However, the embodiment is not limited to this case, and signals transmitted from an external integrated circuit can also be transmitted to the read - out line RCL without the read - out circuit RCV.

[0089] Each of the scan line SCL and the read - out line RCL can include a fingerprint recognition sensor pad (pad, or also called "bonding pad" or "pad") PD - FPS coupled to its end.

[0090] The fingerprint recognition sensor pad PD - FPS can be formed in the same process as the transistor for driving the fingerprint recognition sensor FPS.

[0091] Scan signals can be sequentially supplied to the scan line SCL, and the read - out line RCL can receive signals output from the fingerprint recognition sensor FPS and transmit the received signals to the read - out circuit RCV. However, the embodiment is not limited to this case, and signals output from the fingerprint recognition sensor FPS can also be transmitted to another circuit (not shown) for signal processing.

[0092] In Figure 9 the fingerprint recognition sensor FPS coupled to any one scan line SCL and any one read - out line RCL is shown as an example. The structure of the fingerprint recognition sensor FPS is not limited to this example and can be changed.

[0093] The fingerprint recognition sensor FPS can include a first transistor TFT1, a second transistor TFT2, and a sensing capacitor CP - FPS. There is a voltage V1 between the first transistor TFT1 and the second transistor TFT2.

[0094] The first transistor TFT1 is a switching element and has a control electrode coupled to the scan line SCL, an output electrode coupled to the read - out line RCL, and an input electrode coupled to the sensing capacitor CP - FPS. The second transistor TFT2 has an input electrode connected to the input voltage line VDD, an output electrode connected to the sensing capacitor CP - FPS, and a control electrode connected to the common voltage line VSS.

[0095] When the light reflected from an external object is supplied to the second transistor TFT2, a semiconductor in the channel portion made of amorphous silicon or polycrystalline silicon forms an electric current, and the electric current flows toward the sensing capacitor CP-FPS and the first transistor TFT1 by an input voltage input to the input voltage line VDD. In some embodiments, the second transistor TFT2 is a phototransistor. A phototransistor is a type (or kind) of optical sensor that converts light energy into electrical energy and uses the photovoltaic effect, in which the flowing current varies according to the intensity of light. A device that amplifies a photocurrent using a transistor is a phototransistor. When a selection signal is input to the scan line SCL, an electric current flows through the readout line RCL.

[0096] Referring Figure 10 , the display device 10 according to an embodiment may further include a sensor controller SC and a display driver PC.

[0097] The sensor controller SC may control the operation of the fingerprint recognition sensor layer FPSL and identify a user's fingerprint by sensing a change in the amount of light in the fingerprint recognition sensor layer FPSL.

[0098] The display driver PC may control the image display operation of the display panel 100 by supplying an image driving signal to the display panel 100. The display driver PC may generate an image driving signal by using image data and control signals received from an external source. For example, the display driver PC may receive image data and control signals from a host, and the control signals may include a vertical synchronization signal, a horizontal synchronization signal, and a main clock signal. Additionally, the image driving signal may include a scan signal and a data signal generated using the image data.

[0099] The sensor controller SC and the display driver PC may be integrated into a single element. For example, the sensor controller SC and the display driver PC may be implemented as a single integrated circuit.

[0100] The above structure is only an example for describing the driving of the fingerprint recognition sensor FPS for fingerprint recognition, and the embodiment is not limited to this structure. Various suitable sensors capable of recognizing light may be applied as the fingerprint recognition sensor FPS of the present disclosure.

[0101] Figure 11 is a cross-sectional view taken along Figure 2 the line I-I'. Figure 12 Schematically shows a fingerprint recognition process according to an embodiment.

[0102] Referring Figure 11 , in some embodiments, the display device 10 (see Figure 2) may include a fingerprint recognition sensor layer FPSL, a substrate base SUB, a thin film transistor layer TFTL, a light emitting element layer EML, a thin film encapsulation layer TFEL, and a cover window CW. Since the structures of the fingerprint recognition sensor layer FPSL and the substrate base SUB have been described in more detail with reference to Figure 3 and Figures 8 to 10 the redundant descriptions thereof will not be repeated here.

[0103] The thin film transistor layer TFTL may be on the substrate base SUB. The thin film transistor layer TFTL may include thin film transistors 120, a gate insulating layer 130, an interlayer insulating layer 140, a protective layer 150, and a planarization layer 160.

[0104] The buffer layer BF may be on the surface of the substrate base SUB. The buffer layer BF may be formed on the surface of the substrate base SUB to protect the organic light emitting layer 172 of the thin film transistors 120 and the light emitting element layer EML from moisture introduced through the substrate base SUB, which is vulnerable to moisture penetration. The buffer layer BF may be composed of a plurality of inorganic layers stacked alternately. For example, the buffer layer BF may be a multi-layer in which one or more inorganic layers selected from a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are stacked alternately.

[0105] The thin film transistors 120 may be on the buffer layer BF. Each of the thin film transistors 120 may include an active layer 121, a gate electrode 122, a source electrode 124, and a drain electrode 123. In Figure 11 each of the thin film transistors 120 is formed in a top-gate type (or kind) in which the gate electrode 122 is positioned above the active layer 121. However, the embodiments are not limited to this case. For example, each of the thin film transistors 120 may also be formed in a bottom-gate type (or kind) in which the gate electrode 122 is positioned below the active layer 121 or a double-gate type (or kind) in which the gate electrode 122 is positioned both above and below the active layer 121.

[0106] In some embodiments, the thin film transistors 120 may not overlap with the holes H in the light blocking layer SLL in the third direction (Z-axis direction). Therefore, light traveling toward the holes H after being reflected by the user's finger can be prevented or reduced from being reflected by the thin film transistors 120. Additionally, considering the incident angle of the light traveling toward the holes H after being reflected by the user's finger, the thin film transistors 120 may be spaced apart from the holes H in the light blocking layer SLL by a set (e.g., predetermined) distance in the first direction (X-axis direction).

[0107] The active layer 121 may be on the buffer layer BF. The active layer 121 may include polysilicon, single-crystalline silicon, low-temperature polysilicon, amorphous silicon, or an oxide semiconductor. Examples of the oxide semiconductor may include binary compounds (AB x ) containing indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc., ternary compounds (AB x C y ), and quaternary compounds (AB x C y D z ). For example, the active layer 121 may include ITZO (oxide of indium, tin, and titanium) or IGZO (oxide of indium, gallium, and tin). An additional light-blocking layer may be formed between the buffer layer BF and the active layer 121 to block external light from entering the active layer 121.

[0108] The gate insulating layer 130 may be on the active layer 121. The gate insulating layer 130 may be made of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0109] The gate electrode 122 and the gate line may be on the gate insulating layer 130. Each of the gate electrode 122 and the gate line may be a single layer or a multi-layer made of any one or more selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0110] The interlayer insulating layer 140 may be on the gate electrode 122 and the gate line. The interlayer insulating layer 140 may be made of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0111] The source electrode 124 and the drain electrode 123 may be on the interlayer insulating layer 140. Each of the source electrode 124 and the drain electrode 123 may be bonded to the active layer 121 through a contact hole penetrating the gate insulating layer 130 and the interlayer insulating layer 140. Each of the source electrode 124 and the drain electrode 123 may be a single layer or a multi-layer made of any one or more selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0112] The protective layer 150 for isolating the thin film transistor 120 may be on the source electrode 124 and the drain electrode 123. The protective layer 150 may be made of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0113] The planarization layer 160 may be on the protection layer 150 to planarize the steps formed by the thin film transistors 120. The planarization layer 160 may be made of an organic layer such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0114] The light-emitting element layer EML is on the thin film transistor layer TFTL. The light-emitting element layer EML includes a light-emitting element 170 and a pixel defining layer 180.

[0115] The light-emitting element 170 and the pixel defining layer 180 are on the planarization layer 160. Each of the light-emitting elements 170 may include a first electrode 171, an organic light-emitting layer 172, and a second electrode 173.

[0116] The first electrode 171 may be on the planarization layer 160. The first electrode 171 is connected to the source electrode 124 of the thin film transistor 120 through a contact hole penetrating the protection layer 150 and the planarization layer 160. However, the embodiment is not limited to this case. The first electrode 171 may also be connected to the drain electrode 123 of the thin film transistor 120 through a contact hole penetrating the protection layer 150 and the planarization layer 160.

[0117] In a top emission structure in which light is emitted from the organic light-emitting layer 172 toward the second electrode 173, the first electrode 171 may be made of a metal material having a high reflectivity (such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and indium tin oxide (ITO / APC / ITO)). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). However, the embodiment is not limited to this structure. In a bottom emission structure in which light is emitted from the organic light-emitting layer 172 toward the first electrode 171, the first electrode 171 may be made of a transparent conductive material (TCO) capable of transmitting light (such as ITO or IZO) or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), or an alloy of Mg and Ag). In this case, when the first electrode 171 is made of a semi-transmissive conductive material, the light output efficiency may be improved through a microcavity. Hereinafter, a top emission structure in which light is emitted from the organic light-emitting layer 172 toward the second electrode 173 will be described as an example.

[0118] The pixel defining layer 180 may be on the planarization layer 160 to separate the first electrode 171 and serve as a pixel defining layer for defining a sub-pixel SP. The pixel defining layer 180 may cover the edge of the first electrode 171. The pixel defining layer 180 may be made of an organic layer such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0119] Each of the sub-pixels SP is an area where the first electrode 171, the organic light-emitting layer 172, and the second electrode 173 are stacked in sequence such that holes from the first electrode 171 and electrons from the second electrode 173 are combined in the organic light-emitting layer 172 to emit light.

[0120] The organic light-emitting layer 172 is formed on the first electrode 171. Each of the organic light-emitting layers 172 may include an organic material and emit light of a set (e.g., predetermined) color. For example, each of the organic light-emitting layers 172 may include a hole transport layer, an organic material layer, and an electron transport layer. In this case, the organic light-emitting layer 172 of the red sub-pixel may emit red light, the organic light-emitting layer 172 of the green sub-pixel may emit green light, and the organic light-emitting layer 172 of the blue sub-pixel may emit blue light. In some embodiments, the organic light-emitting layer 172 of the sub-pixel SP may emit white light. In this case, the red sub-pixel may further include a red color filter layer, the green sub-pixel may further include a green color filter layer, and the blue sub-pixel may further include a blue color filter layer.

[0121] The second electrode 173 is on the organic light-emitting layer 172 and the pixel defining layer 180. The second electrode 173 may be a common layer shared by all the sub-pixels SP. A cover layer may be on the second electrode 173.

[0122] In a top-emission structure, the second electrode 173 may be made of a transparent conductive material (TCO) (such as ITO or IZO) capable of transmitting light or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), or an alloy of Mg and Ag). When the second electrode 173 is made of a semi-transmissive conductive material, the light output efficiency can be improved through a microcavity.

[0123] The thin film encapsulation layer TFEL is on the light-emitting element layer EML. The thin film encapsulation layer TFEL may include at least one inorganic layer to prevent or reduce the penetration of oxygen and / or moisture into the organic light-emitting layer 172 and the second electrode 173. Additionally, the thin film encapsulation layer TFEL may include at least one organic layer to protect the light-emitting element layer EML from foreign substances such as dust. For example, the thin film encapsulation layer TFEL may include a first inorganic layer on the second electrode 173, an organic layer on the first inorganic layer, and a second inorganic layer on the organic layer. The first inorganic layer and the second inorganic layer may be made of, but not limited to, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may be made of, but not limited to, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0124] The cover window CW may be on the thin film encapsulation layer TFEL. The cover window CW on the thin film encapsulation layer TFEL may protect the components of the display device 10 while transmitting the light output from the light-emitting element layer EML.

[0125] The cover window CW may include transparent glass or a transparent material such as polyethylene terephthalate, polyethylene resin, polyester, etc. However, the embodiments are not limited to this case. The type (or kind) of the cover window CW is not restricted as long as the cover window CW has a suitable or sufficient transmittance to transmit the light output from the light-emitting element layer EML. In some embodiments, a polarizer may be between the cover window CW and the thin film encapsulation layer TFEL.

[0126] Referring to Figure 12 , when the user's finger F touches the cover window CW, the light L1 output from the organic light-emitting layer 172 is reflected by the ridge FR or valley FV of the user's finger F, and the reflected light L2 is received by the fingerprint recognition sensor layer FPSL. Accordingly, the user's fingerprint pattern may be transmitted to the fingerprint recognition sensor layer FPSL.

[0127] Figure 13 is a plan view of a part of the light-blocking layer SLL_2 according to an embodiment. Figure 14 Schematically shows the traveling direction of the reflected light according to an embodiment. Figure 15 is a plan view of the hole H, the image collection area IAA, and the light reception area LRA according to an embodiment. Figures 13 to 15 The embodiment of Figure 4 , Figure 5 and Figure 7 differs from the embodiments of Figure 4 , Figure 5 and Figure 7 in the pitch of the holes H included in the light-blocking layer SLL_2. Redundant descriptions of the elements and features identical to those of the embodiments of Figure 4 , Figure 5 and Figure 7 will not be repeated here, and the differences will be mainly described below.

[0128] Referring to Figure 13 , in some embodiments, the light-blocking layer SLL_2 may include a plurality of holes H. Each of the holes H may have, but is not limited to, a diameter r of about 3 μm to about 20 μm.

[0129] In some embodiments, the holes H may be provided with a first pitch P1_1 in a first direction (X-axis direction). For example, the first pitch P1_1 may be about 0.5 to about 1.2 times the hole-sensor distance ID (see Figure 4 ). In some embodiments, the holes H may be provided with a second pitch P2_1 in a second direction (Y-axis direction). The second pitch P2_1 may be the same as (e.g., substantially the same as) the first pitch P1_1, but the embodiments are not limited to this case. In some embodiments, the first pitch P1_1 and the second pitch P2_1 may be different from each other. Additionally, although in Figure 13The middle holes H are aligned parallel (e.g., substantially parallel) to each other in a first direction (X-axis direction) and a second direction (Y-axis direction), but this is only an example, and the embodiments are not limited to this example. The holes H may also be provided with a first pitch P1_1 and a second pitch P2_1, but may not be aligned in the first direction (X-axis direction) and the second direction (Y-axis direction).

[0130] Referring Figure 14 , the cover window CW is on the display panel 100_1, and the fingerprint recognition sensor layer FPSL is under the display panel 100_1.

[0131] In some embodiments, the light blocking layer SLL_2 may be in the display panel 100_1 and may include a first hole H1 and a second hole H2. The first hole H1 and the second hole H2 may be spaced apart from each other. A first pitch P1_1, which is defined as the distance between the center point CP of the first hole H1 and the center point CP of the second hole H2, may be about 0.5 times to about 1.2 times the hole-sensor distance ID. Because Figure 4 , Figure 5 and Figure 7 compared with the embodiments of, the width of the first pitch P1_1 is reduced, so the amount of light input to the fingerprint recognition sensor layer FPSL increases, thereby improving the fingerprint recognition characteristics.

[0132] In some embodiments, the cover window CW may include a first image sensing region IPA1 and a second image sensing region IPA2, and a first overlapping region OA1 in which the first image sensing region IPA1 and the second image sensing region IPA2 overlap may be formed.

[0133] In some embodiments, the fingerprint recognition sensor layer FPSL may include a light receiving region LRA. For example, the fingerprint recognition sensor layer FPSL may include a first light receiving region LRA1 and a second light receiving region LRA2. The first light receiving region LRA1 and the second light receiving region LRA2 may overlap each other. For example, one side of the first light receiving region LRA1 and one side of the second light receiving region LRA2 may overlap each other to form a second overlapping region OA2. The width of the second overlapping region OA2 in the first direction (X-axis direction) may be less than the width of the first overlapping region OA1 in the first direction (X-axis direction).

[0134] In some embodiments, each of the first light receiving region LRA1 and the second light receiving region LRA2 may include an image collection region IAA. For example, the first light receiving region LRA1 may include a first image collection region IAA1, and the second light receiving region LRA2 may include a second image collection region IAA2.

[0135] The first image collection area IAA1 and the second image collection area IAA2 may be spaced apart from each other in a first direction (X-axis direction). In some embodiments, the first light receiving area LRA1 and the second light receiving area LRA2 may overlap each other, but the first image collection area IAA1 and the second image collection area IAA2 may not overlap each other. Since the amount of light increases due to the overlap of the first light receiving area LRA1 and the second light receiving area LRA2, more accurate fingerprint recognition is possible. In addition, the overlap of the effective fingerprint patterns input to the first image collection area IAA1 and the second image collection area IAA2 can be prevented or reduced, otherwise the overlap of the effective fingerprint patterns will result in incorrect fingerprint recognition.

[0136] In some embodiments, the first image collection area IAA1 and the second image collection area IAA2 may not overlap with the second overlapping area OA2. For example, the first image collection area IAA1 may not overlap with the second light receiving area LRA2, and the second image collection area IAA2 may not overlap with the first light receiving area LRA1. In some embodiments, the first image collection area IAA1 and the second image collection area IAA2 may partially overlap with the second overlapping area OA2. Even in this case, the first image collection area IAA1 and the second image collection area IAA2 may not overlap with each other.

[0137] Refer to Figure 15 , in some embodiments, the plurality of holes H, the plurality of image collection areas IAA, and the plurality of light receiving areas LRA may overlap in the thickness direction. For example, in a plan view, the image collection area IAA may be located within the light receiving area LRA, and the hole H may be located within the image collection area IAA. In addition, one hole H, one image collection area IAA, and one light receiving area LRA may form a unit.

[0138] The light receiving area LRA may overlap with an adjacent light receiving area LRA. For example, the light receiving area LRA may overlap with an adjacent light receiving area LRA in a first direction (X-axis direction) and a second direction (Y-axis direction). In some embodiments, one light receiving area LRA may overlap with four adjacent light receiving areas LRA, and four second overlapping areas OA2 may be formed. Therefore, one image collection area IAA may be surrounded by four second overlapping areas OA2.

[0139] In some embodiments, the image collection areas IAA may be spaced apart from each other and the second overlapping areas OA2 may be interposed between the image collection areas IAA.

[0140] Figure 16 is a plan view of a part of the light blocking layer SLL_3 according to an embodiment. Figure 17It is a plan view of the hole H, the image collection area IAA, and the light reception area LRA according to an embodiment. Figure 16 and Figure 17 The embodiment of Figure 4 , Figure 5 and Figure 7 differs from the embodiments of Figure 4 , Figure 5 and Figure 7 in that the pitch of the holes H in the first region A1 of the light blocking layer SLL_3 is different from the pitch of the holes H in the second region A2. Redundant descriptions of the elements and features that are the same as those of the embodiments of

[0141] will not be repeated here, and the differences will be mainly described below. Figure 16 and Figure 17 Referring to Figure 16 and Figure 17 , the light blocking layer SLL_3 may include a first region A1 and a second region A2. Each of the first region A1 and the second region A2 may include holes H. The holes H in each of the first region A1 and the second region A2 may have a diameter r of about 3 μm to about 20 μm. Although the holes H in each of the first region A1 and the second region A2 have the same (e.g., substantially the same) diameter r in

[0142] and Figure 4 , the embodiment is not limited to this case. The holes H in each of the first region A1 and the second region A2 may also have different diameters r within the range of about 3 μm to about 20 μm.

[0143] In some embodiments, the holes H located in the first region A1 may be provided with a first pitch P1 in the first direction (X-axis direction). For example, the first pitch P1 may be about 1.3 times the hole-sensor distance ID (see

[0144] A plurality of holes H, a plurality of image collection regions IAA, and a plurality of light reception regions LRA located in the first region A1 may be stacked in the thickness direction. For example, in a plan view, the image collection region IAA may be located within the light reception region LRA, and the hole H may be located within the image collection region IAA. Additionally, one hole H, one image collection region IAA, and one light reception region LRA may form a unit.

[0145] The light reception regions LRA located in the first region A1 may be in contact (e.g., physical contact or direct contact) with adjacent light reception regions LRA. For example, the light reception regions LRA may be in contact (e.g., physical contact or direct contact) with adjacent light reception regions LRA in the first direction (X-axis direction) and the second direction (Y-axis direction). In some embodiments, one light reception region LRA located in the first region A1 may be in contact (e.g., direct contact or physical contact) with four adjacent light reception regions LRA, but may not be stacked with the four adjacent light reception regions LRA. However, this does not exclude accidental minute (e.g., small) gaps or stacking generated during the process.

[0146] In some embodiments, the image collection regions IAA located in the first region A1 may be spaced apart from each other. Additionally, the holes H located in the first region A1 may be spaced apart from each other. The distance between the image collection regions IAA may be less than the distance between the holes H.

[0147] In some embodiments, a plurality of light reception regions LRA located in the second region A2 may be stacked with adjacent light reception regions LRA. For example, the light reception regions LRA may be stacked with adjacent light reception regions LRA in the first direction (X-axis direction) and the second direction (Y-axis direction). In some embodiments, one light reception region LRA located in the second region A2 may be stacked with four adjacent light reception regions LRA, and four second stacking regions OA2 may be formed. Thus, one image collection region IAA may be surrounded by four second stacking regions OA2.

[0148] In some embodiments, a plurality of image collection regions IAA located in the second region A2 may be spaced apart from each other by the second stacking regions OA therebetween.

[0149] In some embodiments, some of the light receiving regions LRA in the first region A1 and some of the light receiving regions LRA in the second region A2 may overlap in a region where the first region A1 and the second region A2 are in contact with each other (e.g., direct contact or physical contact). However, the light receiving region LRA of the first region A1 and the light receiving region LRA of the second region A2 may also not overlap in a region where the first region A1 and the second region A2 are in contact with each other (e.g., direct contact or physical contact). As described above, by dividing the light blocking layer SLL_3 into the first region A1 and the second region A2 and setting the pitches P1 and P2 of the holes H in the first region A1 to be different from the pitches P1_1 and P2_1 of the holes H in the second region A2, the fingerprint recognition characteristics of a desired region can be adjusted.

[0150] Figures 18 to 23 Each of the figures in Figure 3 is a cross-sectional view of a modified example of the display device 10 shown in

[0151] Referring to Figure 18 , except that a bonding layer AD is further positioned between the fingerprint recognition sensor layer FPSL and the display panel 100 and the fingerprint recognition sensor layer FPSL and the display panel 100 are bonded together through the bonding layer AD, the display device 10a according to the current embodiment is substantially the same as the display device 10 according to Figure 3 the embodiment of

[0152] The bonding layer AD may be in direct contact (e.g., physical contact) with the lower surface of the display panel 100 and the upper surface of the fingerprint recognition sensor layer FPSL. In some embodiments, the bonding layer AD may include an optically transparent adhesive material. For example, the bonding layer AD may be made of a pressure-sensitive adhesive and may be optically transparent.

[0153] The fingerprint recognition sensor layer FPSL and the display panel 100 may be bonded together through the bonding layer AD. In some embodiments, no air gap is formed between the fingerprint recognition sensor layer FPSL and the display panel 100.

[0154] Referring to Figure 19 , except that an infrared blocking filter layer IRC is further positioned between the bonding layer AD and the fingerprint recognition sensor layer FPSL, the display device 10b according to the current embodiment may be substantially the same as the display device 10a according to Figure 18 the embodiment of

[0155] The infrared blocking filter layer IRC allows light in a band shorter than a set (e.g., predetermined) band among the light incident on the fingerprint recognition sensor layer FPSL to pass through. For example, the infrared blocking filter layer IRC can block or reduce the transmission of light in the infrared band, and transmit light in the visible band and the ultraviolet band. In some embodiments, the infrared blocking filter layer IRC can also block light in the red band and the near-infrared band. For example, the infrared blocking filter layer IRC can block light having a wavelength of about 600 nanometers or greater. Since the light passing through the infrared blocking filter layer IRC is transmitted to the fingerprint recognition sensor layer FPSL, the fingerprint recognition sensor layer FPSL does not receive light in the infrared band or light in the red and near-infrared bands.

[0156] In some embodiments, the infrared blocking filter layer IRC can be attached to the fingerprint recognition sensor layer FPSL through a bonding member. In some embodiments, the infrared blocking filter layer IRC can be formed by directly coating an infrared blocking material on the fingerprint recognition sensor layer FPSL.

[0157] According to the current embodiment, since the infrared blocking filter layer IRC can be used to block or reduce light in the infrared band, the occurrence of recognition errors in the fingerprint recognition sensor layer FPSL due to light in the infrared band among external light such as sunlight can be prevented or reduced.

[0158] In addition, the generation of leakage current in the fingerprint recognition sensor FPS included in the fingerprint recognition sensor layer FPSL due to light in the infrared band can be prevented or reduced.

[0159] The bonding layer AD can be in direct contact (e.g., physical contact) with the lower surface of the display panel 100 and the upper surface of the infrared blocking filter layer IRC.

[0160] In some embodiments, the bonding layer AD and the infrared blocking filter layer IRC can be positioned between the fingerprint recognition sensor layer FPSL and the display panel 100, but no (or substantially no) air gap is formed.

[0161] Referring to Figure 20 , except that the infrared blocking filter layer IRC is positioned between the bonding layer AD and the display panel 100, the display device 10c according to the current embodiment can be substantially the same as the display device 10b according to the Figure 19 embodiment.

[0162] In the current embodiment, the infrared blocking filter layer IRC can be attached to the lower surface of the display panel 100 through a bonding member. In some embodiments, the infrared blocking filter layer IRC can be formed by directly coating an infrared blocking material on the lower surface of the display panel 100.

[0163] The bonding layer AD can directly contact (e.g., physically contact) the lower surface of the infrared blocking filter layer IRC and the upper surface of the fingerprint recognition sensor layer FPSL.

[0164] In some embodiments, the bonding layer AD and the infrared blocking filter layer IRC can be positioned between the fingerprint recognition sensor layer FPSL and the display panel 100, but no (or substantially no) air gap is formed.

[0165] Referring to Figure 21 , except that a protection member PF is further positioned between the display panel 100 and the fingerprint recognition sensor layer FPSL, a first bonding layer AD1 is further positioned between the protection member PF and the display panel 100, and a second bonding layer AD2 is further positioned between the fingerprint recognition sensor layer FPSL and the protection member PF, the display device 10d according to the current embodiment is substantially the same as the display device 10 according to Figure 3 the embodiment of

[0166] The protection member PF can protect the display panel 100. The protection member PF can be bonded to the lower surface of the display panel 100 through the first bonding layer AD1.

[0167] In some embodiments, when the display panel 100 is flexible or when the substrate base SUB is flexible, the protection member PF can inhibit or reduce the sagging of the display panel 100 or the sagging of the substrate base SUB.

[0168] In some embodiments, the protection member PF can have a certain rigidity to support the display panel 100 and can have a certain flexibility to allow folding or bending of the display panel 100. The protection member PF can be made of a plastic material having a certain flexibility and light-transmitting properties. For example, the protection member PF can be made of polyurethane (PU), polyimide (PI), and / or polyethylene terephthalate (PET).

[0169] The fingerprint recognition sensor layer FPSL can be bonded to the protection member PF through the second bonding layer AD2.

[0170] The first bonding layer AD1 and the second bonding layer AD2 can include an optically transparent adhesive material. For example, the first bonding layer AD1 and the second bonding layer AD2 can be made of a pressure-sensitive adhesive and can be optically transparent.

[0171] The first bonding layer AD1 can directly contact (e.g., physically contact) the lower surface of the display panel 100 and the upper surface of the protection member PF, and the second bonding layer AD2 can directly contact (e.g., physically contact) the lower surface of the protection member PF and the upper surface of the fingerprint recognition sensor layer FPSL.

[0172] In some embodiments, the first bonding layer AD1, the protective member PF, and the second bonding layer AD2 may be positioned between the fingerprint recognition sensor layer FPSL and the display panel 100, but no (or substantially no) air gap is formed.

[0173] Refer to Figure 22 , except that an infrared blocking filter layer IRC is further positioned between the second bonding layer AD2 and the fingerprint recognition sensor layer FPSL, the display device 10e according to the current embodiment is substantially the same as the display device 10d according to Figure 21 the embodiment of Figure 19 . Other details of the infrared blocking filter layer IRC are substantially the same as or similar to those of the infrared blocking filter layer IRC described in the embodiment of

[0174] above, and thus, the redundant description thereof will not be repeated here.

[0175] In some embodiments, the first bonding layer AD1, the protective member PF, the second bonding layer AD2, and the infrared blocking filter layer IRC may be positioned between the fingerprint recognition sensor layer FPSL and the display panel 100, but no (or substantially no) air gap is formed.

[0176] Refer to Figure 23 , except that an infrared blocking filter layer IRC is further positioned between the first bonding layer AD1 and the display panel 100, the display device 10f according to the current embodiment is substantially the same as the display device 10d according to Figure 21 the embodiment of Figure 20 . Other details of the infrared blocking filter layer IRC are substantially the same as or similar to those of the infrared blocking filter layer IRC described in the embodiment of

[0177] The first bonding layer AD1 may directly contact (e.g., physically contact) the lower surface of the infrared blocking filter layer IRC and the upper surface of the protective member PF, and the second bonding layer AD2 may directly contact (e.g., physically contact) the lower surface of the protective member PF and the upper surface of the fingerprint recognition sensor layer FPSL.

[0178] In some embodiments, the infrared blocking filter layer IRC, the first bonding layer AD1, the protection member PF, and the second bonding layer AD2 may be positioned between the fingerprint recognition sensor layer FPSL and the display panel 100, but no (or substantially no) air gap is formed.

[0179] The display device according to an embodiment uses the light output from the display panel to recognize a fingerprint. Thus, a fingerprint can be recognized without a separate light source.

[0180] In addition, holes are formed in the light blocking layer in the substrate to form light channels, and the pitch of the holes is adjusted, thereby improving fingerprint recognition characteristics.

[0181] However, the effects of the embodiments are not limited to the effects described herein. By referring to the claims and their equivalents, the above and other effects of the embodiments will become more apparent to those of ordinary skill in the art to which the embodiments pertain.

[0182] Embodiments of the present disclosure have been described above with reference to the accompanying drawings, but those of ordinary skill in the art to which the present disclosure pertains should understand that the subject matter of the present disclosure can be practiced in other specific forms without changing the spirit or scope of the present disclosure. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.

Claims

1. A display device, the display device comprising: A display panel, comprising a substrate base, a thin film transistor layer on the substrate base, and a light-emitting element layer including light-emitting elements on the thin film transistor layer; A cover window, on the light-emitting element layer; A fingerprint recognition sensor layer, under the display panel; A protection member, positioned between the display panel and the fingerprint recognition sensor layer; A first bonding layer, positioned between the display panel and the protection member; And A second bonding layer, positioned between the fingerprint recognition sensor layer and the protection member, Wherein, the protection member is bonded to the display panel through the first bonding layer, and the fingerprint recognition sensor layer is bonded to the protection member through the second bonding layer, Wherein, the substrate base includes a first substrate, a second substrate on the first substrate, and a light-blocking layer between the first substrate and the second substrate, and Wherein, the light-blocking layer includes holes, and light reflected by a finger touching the cover window passes through the holes.

2. The display device according to claim 1, wherein, The pitch of the holes is 1.3 to 1.5 times the hole-sensor distance, and Wherein, the hole-sensor distance is the distance from the center point of any one of the holes to the upper surface of the fingerprint recognition sensor layer.

3. The display device according to claim 2, wherein, The holes include a first hole and a second hole, Wherein, the fingerprint recognition sensor layer includes a first light receiving area and a second light receiving area, the first light receiving area receives a fingerprint pattern scanned by reflected light passing through the first hole, the second light receiving area receives a fingerprint pattern scanned by reflected light passing through the second hole, and Wherein, the first light receiving area and the second light receiving area do not overlap with each other.

4. The display device according to claim 3, wherein, The first light receiving area and the second light receiving area are in contact with each other.

5. The display device according to claim 4, wherein, The first light receiving area includes a first image collection area, and the second light receiving area includes a second image collection area, and Wherein, the first image collection area and the second image collection area are spaced apart from each other.

6. The display device according to claim 5, wherein, The first hole, the first image collection area, and the first light receiving area are stacked in the thickness direction.

7. The display device according to claim 6, wherein, The second hole, the second image collection area, and the second light receiving area are stacked in the thickness direction.

8. The display device according to claim 2, wherein, Each of the holes has a diameter of 3 μm to 20 μm.

9. The display device according to claim 2, wherein The reflected light is incident on the holes at an angle of -33 degrees to 33 degrees.

10. The display device according to claim 1, the display device further comprising a bonding layer, the bonding layer positioned between the display panel and the fingerprint recognition sensor layer, Among them, The fingerprint recognition sensor layer is bonded to the display panel through the bonding layer.

11. The display device according to claim 10, the display device further comprising an infrared blocking filter layer, the infrared blocking filter layer positioned between the display panel and the bonding layer or between the fingerprint recognition sensor layer and the bonding layer.

12. The display device according to claim 1, wherein the display device further comprises an infrared blocking filter layer, and the infrared blocking filter layer is positioned between the display panel and the first bonding layer or between the fingerprint recognition sensor layer and the second bonding layer.

13. A display device, comprising: a display panel, including a substrate base, a thin film transistor layer on the substrate base, and a light emitting element layer including light emitting elements on the thin film transistor layer; a cover window on the light emitting element layer; and a fingerprint recognition sensor layer under the display panel, wherein the substrate base includes a first substrate, a second substrate on the first substrate, and a light blocking layer between the first substrate and the second substrate, wherein the light blocking layer includes holes, and light reflected by a finger touching the cover window passes through the holes, wherein the pitch of the holes is 0.5 times to 1.2 times the hole-sensor distance, and wherein the hole-sensor distance is the distance from the center point of any one of the holes to the upper surface of the fingerprint recognition sensor layer.

14. The display device according to claim 13, wherein, The holes include a first hole and a second hole, wherein the fingerprint recognition sensor layer includes a first light receiving area and a second light receiving area, the first light receiving area receives a fingerprint pattern scanned by reflected light passing through the first hole, the second light receiving area receives a fingerprint pattern scanned by reflected light passing through the second hole, and wherein the first light receiving area and the second light receiving area overlap each other.

15. The display device according to claim 14, wherein, The first light receiving area includes a first image collection area, and the second light receiving area includes a second image collection area, and wherein the first image collection area and the second image collection area are spaced apart from each other.

16. The display device according to claim 15, wherein, The first hole, the first image collection area, and the first light receiving area are stacked in the thickness direction.

17. The display device according to claim 16, wherein, The second hole, the second image collection area, and the second light receiving area are stacked in the thickness direction.

18. The display device according to claim 17, wherein, The first image collection area and the second light receiving area do not overlap each other.

19. The display device according to claim 18, wherein, The second image collection area and the first light receiving area do not overlap each other.

20. A display device, comprising: a display panel, including a substrate base, a thin film transistor layer on the substrate base, and a light emitting element layer including light emitting elements on the thin film transistor layer; a cover window on the light emitting element layer; and a fingerprint recognition sensor layer under the display panel, wherein the substrate base includes a first substrate, a second substrate on the first substrate, and a light blocking layer between the first substrate and the second substrate, wherein the light blocking layer includes holes, and light reflected by a finger touching the cover window passes through the holes, wherein the light blocking layer includes a first region and a second region, wherein the pitch of the holes positioned in the first region is 1.3 times the hole-sensor distance, and the pitch of the holes positioned in the second region is 0.5 to 1.2 times the hole-sensor distance, and Herein, the hole-sensor distance is the distance from the center point of any one of the holes to the upper surface of the fingerprint recognition sensor layer.

21. The display device according to claim 20, wherein, The holes positioned in each of the first region and the second region include a first hole and a second hole. Herein, each of the first region and the second region includes a first light receiving region and a second light receiving region. The first light receiving region receives a fingerprint pattern scanned by reflected light passing through the first hole, and the second light receiving region receives a fingerprint pattern scanned by reflected light passing through the second hole. And herein, the first light receiving region and the second light receiving region included in the first region do not overlap with each other, and the first light receiving region and the second light receiving region included in the second region overlap with each other.

22. The display device according to claim 21, wherein, The first light receiving region included in each of the first region and the second region includes a first image collection region. Herein, the second light receiving region included in each of the first region and the second region includes a second image collection region. And herein, the first image collection region and the second image collection region are spaced apart from each other.

23. The display device according to claim 20, wherein, Each of the holes positioned in the first region and the second region has a diameter of 3 μm to 20 μm.

Images