A new type of Mini LED backlight module with ultra-large luminous angle

Abstract

The present invention discloses a new type of Mini LED backlight module with a large light-emitting angle, comprising a light bar; the light bar comprises a PCB board and a Mini LED lamp bead, and the Mini LED lamp bead is mounted on the PCB board; the Mini LED lamp bead comprises a Mini LED chip, a translucent light-shielding layer, and a diffusion layer, the upper surface of the Mini LED chip is provided with a translucent light-shielding layer, and a diffusion layer is provided above the translucent light-shielding layer; the upper surface of the diffusion layer is an arc surface; the Mini LED chip is a CSP, and the size of the Mini LED chip is 50 to 200 μm. The present invention has the characteristics of increasing the light-emitting angle of the Mini LED lamp bead, reducing the density of the Mini LED lamp bead, and reducing the cost of the backlight module.

Description

Technical Field

[0001] The present invention relates to a new Mini LED backlight module with an ultra-large light-emitting angle, and in particular to a new Mini LED backlight module with an ultra-large light-emitting angle, which has the advantages of increasing the light-emitting angle of Mini LED lamp beads, reducing the density of Mini LED lamp beads, and reducing the cost of the backlight module. Background Art

[0002] In recent years, the Mini LED field has attracted much attention in the industry. Mini LED's flip-chip method does not require lenses for secondary optical design.

[0003] Since the chip itself is relatively small, it is conducive to achieving higher contrast and ultra-thin effects. The conventional Mini LED light-emitting angle is about 130°, and PITCH<8. In order to ensure that there are no visual defects on the light-emitting surface, the distance between LED lights is relatively close, and the number of LEDs used is large. Taking a mainstream 65-inch home TV as an example, a TV Mini LED uses about 18,000 to 20,000 pieces, which increases the overall material cost. Summary of the invention

[0004] The purpose of the present invention is to provide a new Mini LED backlight module with an ultra-large light-emitting angle, which can increase the light-emitting angle of Mini LED lamp beads, reduce the density of Mini LED lamp beads, and reduce the cost of the backlight module.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A new type of Mini LED backlight module with a super large light-emitting angle, including a light bar;

[0007] The light bar includes a PCB board and Mini LED lamp beads, and the Mini LED lamp beads are installed on the PCB board;

[0008] The Mini LED lamp bead comprises a Mini LED chip, a translucent shading layer and a diffusion layer. The upper surface of the Mini LED chip is provided with a translucent shading layer, and the diffusion layer is provided above the translucent shading layer; the upper surface of the diffusion layer is an arc surface;

[0009] The Mini LED chip is a CSP, and the size of the Mini LED chip is 50 to 200 μm;

[0010] A reflective frame is installed on the upper surface of the PCB board outside the Mini LED lamp bead; the Mini LED lamp bead is located in the center of the reflective frame;

[0011] The shape of the reflective frame is a rectangular frame, and the edges of the side edges of the reflective frame are set to be transitional arcs;

[0012] The bottom side of the reflective frame is provided with a reflective frame clamping protrusion; the upper surface of the PCB board is provided with a reflective frame positioning groove that matches the reflective frame clamping protrusion; the reflective frame is positioned and installed on the upper surface of the PCB board through the reflective frame positioning groove;

[0013] The reflective frame is fixed on the reflective frame positioning groove by adhesive bonding;

[0014] The inner side of the reflective frame is provided with a light emitting reflective surface inclined outwards;

[0015] The outer side of the reflective frame is provided with a supporting surface inclined inwardly;

[0016] A plurality of reflective frames are arranged in a matrix through reflective frame connecting rods to form a reflective frame assembly cover, and reflective frame positioning columns are arranged on the bottom sides of the reflective frames at the four corners of the reflective frame assembly cover, and the reflective frame positioning columns extend downward;

[0017] The upper surface of the PCB board is provided with a reflective frame positioning groove, an LED electrode pad, a reflective frame combination cover connecting groove, and a reflective frame combination cover positioning and mounting hole. The LED electrode pad is located directly below the Mini LED lamp bead on the light bar. The LED electrode pad is divided into a positive pad and a negative pad. The positive pad and the negative pad correspond to the positive electrode and the negative electrode of the Mini LED chip respectively; the positive electrode and the negative electrode of the Mini LED chip are welded on the LED electrode pad; the reflective frame combination cover connecting groove is connected to a plurality of reflective frame positioning grooves through a mesh; the reflective frame positioning groove, the reflective frame combination cover connecting groove, and the reflective frame combination cover positioning and mounting hole are respectively matched with the reflective frame card protrusion, the reflective frame connecting rod, and the reflective frame positioning column; the reflective frame combination cover is mounted on the PCB board through the reflective frame card protrusion, the reflective frame connecting rod, and the reflective frame positioning column, and the upper surface of the reflective frame connecting rod is flush with the upper surface of the PCB board;

[0018] The method for installing the reflective frame on the PCB board comprises the following steps:

[0019] Step 1: The reflective frame is formed by hot pressing or mold curing to form a reflective frame assembly cover;

[0020] Step 2: demould the bottom side of the reflective frame assembly cover in the mold, evenly apply a small amount of thermosetting adhesive to the reflective frame clamping protrusion and the reflective frame connecting rod, and scrape off excess thermosetting adhesive with a scraper;

[0021] Step 3: demould the molds on the side and top of the reflective frame assembly cover, and take out the reflective frame assembly cover coated with thermosetting adhesive;

[0022] Step 4: Position the reflective frame assembly cover coated with thermosetting adhesive on the PCB board through the reflective frame positioning column, and evenly press and embed it into the reflective frame positioning groove, the reflective frame assembly cover connecting groove, and the reflective frame assembly cover positioning installation hole on the PCB board, and then heat cure it in a reflow oven;

[0023] The curing temperature of the thermosetting adhesive is 60-80°C.

[0024] The present invention provides a new type of Mini LED backlight module with a large light-emitting angle, which has the characteristics of increasing the light-emitting angle of Mini LED lamp beads, reducing the density of Mini LED lamp beads, and reducing the cost of the backlight module. The beneficial effects of the present invention are: adding a diffusion glue encapsulation process to form a diffusion layer, so that the light emitted by the LED increases the light-emitting angle through the diffusion layer, from the light-emitting angle of the Mini LED chip of 130° to the light-emitting angle of 140°; thereby increasing the original spacing PITCH<8mm between two adjacent Mini LED lamp beads to PITCH=10~15mm, reducing the density of Mini LED lamp beads, thereby reducing the cost of the backlight module;

[0025] The Mini LED chip increases the luminous angle through the luminous angle characteristics of the semi-transparent shading layer and the characteristic of the diffusion layer to increase the luminous angle; the light emitted by the Mini LED chip is refracted three times at the contact surface between the Mini LED chip and the semi-transparent shading layer, the contact surface between the semi-transparent shading layer and the diffusion layer, and the contact surface between the diffusion layer and the air, and the luminous angle is increased to 155°. The PITCH spacing can reach 30mm, further reducing the density of Mini LED lamp beads, reducing the use of Mini LED lamp beads to 1 / 16 of the previous amount, greatly reducing material costs, improving yield rate, shortening production time, and increasing production capacity;

[0026] A serrated gap is formed between the PCB board and the reflective frame through the reflective frame positioning groove and the reflective frame convexity to reduce the light generated by the Mini LED lamp beads in the reflective frame from leaking from the contact surface between the PCB board and the reflective frame, causing uneven light output from the backlight module;

[0027] The light-emitting reflective surface on the reflective frame enhances the light output rate of the Mini LED lamp beads and improves the brightness of the backlight module;

[0028] The light-emitting reflective surface and supporting surface arranged inside and outside the reflective frame make the reflective frame form a dam shape, thereby enhancing the strength of the reflective frame and preventing the reflective frame from being deformed or easily damaged during the installation process;

[0029] A plurality of reflective frames are combined to form a reflective frame combination cover, and the reflective frame combination cover is installed on the PCB board as a whole, thereby improving processing efficiency, shortening production time, and reducing production costs;

[0030] Remove the bottom mold of the reflective frame combination cover, retain the side mold and top mold of the reflective frame combination cover, reduce the flow of thermosetting adhesive to the side of the reflective frame combination cover, and cause the thermosetting adhesive to escape from the reflective frame positioning groove and the reflective frame connecting rod gap during the reflective frame combination cover is installed on the PCB board. The escaped adhesive will cause uneven light pattern after solidification. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0032] Figure 1 This is a schematic diagram of a longitudinal section of a light bar of a new Mini LED backlight module with a super large light-emitting angle according to the present invention;

[0033] Figure 2 It is a top view of the light bar of Example 1;

[0034] Figure 3 This is a schematic diagram of the light bar structure of Example 1;

[0035] Figure 4 is a schematic diagram of the longitudinal cross-section structure of the light bar of Example 1;

[0036] Figure 5 for Figure 4 A magnified image of point A;

[0037] Figure 6 This is the installation diagram of the reflective frame of Example 1;

[0038] Figure 7 Top view of the PCB board of Example 1;

[0039] Figure 8 for Figure 7 The enlarged view of point B;

[0040] Fig. 9 It is a back view of the reflective frame assembly cover of Example 1;

[0041] Fig.10 for Fig. 9 Enlarged view of point C. DETAILED DESCRIPTION

[0042] The purpose of the present invention can be achieved through the following technical solutions:

[0043] A new type of Mini LED backlight module with ultra-large luminous angle, see Figures 1 to 4 , including light bars;

[0044] The light bar comprises a PCB board 1 and a Mini LED lamp bead 2, and the Mini LED lamp bead 2 is mounted on the PCB board 1;

[0045] The Mini LED lamp bead 2 includes a Mini LED chip 4, a translucent shading layer 5, and a diffusion layer 6. The upper surface of the Mini LED chip 4 is provided with a translucent shading layer 5, and the diffusion layer 6 is provided above the translucent shading layer 5; the upper surface of the diffusion layer 6 is an arc surface; the surface of the Mini LED chip 4 is formed with a translucent shading layer 5 by scraping, spin coating or uniform film curing, and the light emitted by the Mini LED chip 4 passes through the uniform mixing of the translucent shading layer 5 and then enters the diffusion layer 6; the diffusion layer 6 is formed by curing the transparent glue; the diffusion layer 6 adjusts the light output angle of the Mini LED lamp bead 2 from the arc surface of the diffusion layer 6 by controlling the glue dripping amount, viscosity, surface tension and curing time of the transparent glue, and coordinating with the refractive index of the glue after curing, so as to realize the mass production of the backlight module on the production line;

[0046] A diffusion glue encapsulation process is added to form a diffusion layer 6, so that the light emitted by the LED increases the light-emitting angle through the diffusion layer 6, and the light-emitting angle of the Mini LED chip 4 is increased from 130° to 140°; thereby increasing the original spacing PITCH<8mm between two adjacent Mini LED lamp beads 2 to PITCH=10-15mm, reducing the density of the Mini LED lamp beads 2, thereby reducing the cost of the backlight module;

[0047] The Mini LED chip 4 increases the light-emitting angle through the light-emitting angle characteristics of the translucent light-shielding layer 5 and the diffusion layer 6; the light emitted by the Mini LED chip 4 is refracted three times along the contact surface between the Mini LED chip 4 and the translucent light-shielding layer 5, the contact surface between the translucent light-shielding layer 5 and the diffusion layer 6, and the contact surface between the diffusion layer 6 and the air, and the light-emitting angle is increased to 155°. The PITCH spacing can reach 30mm, further reducing the density of the Mini LED lamp beads 2, reducing the use of the Mini LED lamp beads 2 to 1 / 16 of the previous amount, greatly reducing the material cost, improving the yield rate, shortening the production time, and increasing the production capacity;

[0048] The Mini LED chip 4 is a CSP, and the size of the Mini LED chip 4 is 50-200 μm; CSP is a chip scale package (Chip Scale Package).

[0049] Example 1

[0050] like Figures 5 to 10 As shown, a new Mini LED backlight module with a large light-emitting angle includes a light bar; the light bar includes a PCB board 1 and a Mini LED lamp bead 2, and the Mini LED lamp bead 2 is installed on the PCB board 1;

[0051] The Mini LED lamp bead 2 includes a Mini LED chip 4, a translucent light shielding layer 5, and a diffusion layer 6. The translucent light shielding layer 5 is arranged on the upper surface of the Mini LED chip 4, and the diffusion layer 6 is arranged above the translucent light shielding layer 5; the upper surface of the diffusion layer 6 is an arc surface;

[0052] The Mini LED chip 4 is a CSP, and the size of the Mini LED chip 4 is 50 μm;

[0053] A reflective frame 3 is installed on the upper surface of the PCB board 1 outside the Mini LED lamp bead 2; the Mini LED lamp bead 2 is located in the center of the reflective frame 3;

[0054] The shape of the reflective frame 3 is a rectangular frame, and the edges of the side edges of the reflective frame 3 are set to be a transitional arc shape; to avoid the reflection area of ​​the edges inside the reflective frame 3 being darker, and presenting a more obvious dark spot on the backlight module;

[0055] The bottom side of the reflective frame 3 is provided with a reflective frame clamping protrusion 8; the upper surface of the PCB board 1 is provided with a reflective frame positioning groove 7 that cooperates with the reflective frame clamping protrusion 8; the reflective frame 3 is positioned and installed on the upper surface of the PCB board 1 through the reflective frame positioning groove 7; a serrated gap is formed between the PCB board 1 and the reflective frame 3 through the reflective frame positioning groove 7 and the reflective frame clamping protrusion 8, so as to reduce the light generated by the Mini LED lamp beads 2 in the reflective frame 3 from leaking from the contact surface of the PCB board 1 and the reflective frame 3, causing uneven light output of the backlight module;

[0056] The reflective frame 3 is fixed on the reflective frame positioning groove 7 by adhesive bonding;

[0057] The inner side of the reflective frame 3 is provided with a light-emitting reflective surface 9 inclined outward, and the light-emitting reflective surface 9 on the reflective frame 3 enhances the light-emitting rate of the Mini LED lamp beads 2 and improves the brightness of the backlight module;

[0058] The outer side of the reflective frame 3 is provided with an inwardly inclined support surface 10. The light emitting reflective surface 9 and the support surface 10 provided inside and outside the reflective frame 3 form a dam shape of the reflective frame 3, thereby enhancing the strength of the reflective frame 3 and preventing the reflective frame 3 from being deformed or easily damaged during the installation process.

[0059] A plurality of reflective frames 3 are arranged in a matrix through reflective frame connecting rods 14 to form a reflective frame assembly cover 13. Reflective frame positioning columns 16 are provided on the bottom sides of the reflective frames 3 at the four corners of the reflective frame assembly cover 13. The reflective frame positioning columns 16 extend downward. A plurality of reflective frames 3 are combined to form the reflective frame assembly cover 13. The reflective frame assembly cover 13 is integrally mounted on the PCB board 1, thereby improving processing efficiency, shortening production time, and reducing production costs.

[0060] The upper surface of the PCB board 1 is provided with a reflective frame positioning groove 7, an LED electrode pad 11, a reflective frame assembly cover connecting groove 12, and a reflective frame assembly cover positioning mounting hole 15. The LED electrode pad 11 is located directly below the Mini LED lamp bead 2 on the light bar. The LED electrode pad 11 is divided into a positive pad and a negative pad. The positive pad and the negative pad correspond to the positive electrode and the negative electrode of the Mini LED chip 4 respectively. The positive electrode and the negative electrode of the LED chip 4 are welded on the LED electrode pad 11; the reflective frame assembly cover connecting groove 12 is meshed to connect a number of reflective frame positioning grooves 7; the reflective frame positioning groove 7, the reflective frame assembly cover connecting groove 12, and the reflective frame assembly cover positioning installation hole 15 are respectively matched with the reflective frame card protrusion 8, the reflective frame connecting rod 14, and the reflective frame positioning column 16; the reflective frame assembly cover 13 is installed on the PCB board 1 through the reflective frame card protrusion 8, the reflective frame connecting rod 14, and the reflective frame positioning column 16, and the upper surface of the reflective frame connecting rod 14 is flush with the upper surface of the PCB board 1; the upper surface of the reflective frame connecting rod 14 and the upper surface of the PCB board 1 are made of the same emissivity material and are flush, so as to reduce the difference in reflection between the upper surface of the reflective frame connecting rod 14 and the upper surface of the PCB board 1, which causes uneven light output from the backlight module;

[0061] The method for installing the reflective frame 3 on the PCB board 1 comprises the following steps:

[0062] Step 1: The reflective frame 3 is formed by hot pressing or mold curing to form a reflective frame assembly cover 13;

[0063] Step 2: demould the bottom side of the reflective frame assembly cover 13 in the mold, evenly brush a small amount of thermosetting adhesive onto the reflective frame convex 8 and the reflective frame connecting rod 14, and scrape off excess thermosetting adhesive with a scraper; remove the bottom mold of the reflective frame assembly cover 13, retain the side mold and the top mold of the reflective frame assembly cover 13, reduce the flow of thermosetting adhesive to the side of the reflective frame assembly cover 13, and cause the thermosetting adhesive to escape from the gap between the reflective frame positioning groove 7 and the reflective frame connecting rod 14 during the process of installing the reflective frame assembly cover 13 to the PCB board 1, and the escaped adhesive will cause the light type to be uneven after solidification;

[0064] Step 3: demould the molds on the side and top of the reflective frame assembly cover 13, and take out the reflective frame assembly cover 13 coated with thermosetting adhesive;

[0065] Step 4: Position the reflective frame assembly cover 13 coated with thermosetting adhesive on the PCB board 1 through the reflective frame positioning column 16, and evenly press and embed it into the reflective frame positioning groove 7, the reflective frame assembly cover connecting groove 12, and the reflective frame assembly cover positioning installation hole 15 on the PCB board 1, and then heat cure it in a reflow oven;

[0066] The curing temperature of the thermosetting adhesive is 60-80°C.

[0067] Beneficial effects of the present invention:

[0068] The present invention forms a translucent light-shielding layer 5 on the surface of the Mini LED chip 4 by means of scraping, spin coating or uniform film curing, and the light emitted by the Mini LED chip 4 passes through the uniform light mixing of the translucent light-shielding layer 5 and then enters the diffusion layer 6; the diffusion layer 6 is formed by transparent glue dripping and curing; the diffusion layer 6 adjusts the light emission angle of the Mini LED lamp bead 2 from the arc surface of the diffusion layer 6 by controlling the dripping amount, viscosity, surface tension and curing time of the transparent glue, and the refractive index of the glue after curing, thereby realizing the production line scale production of the backlight module;

[0069] A diffusion glue encapsulation process is added to form a diffusion layer 6, so that the light emitted by the LED increases the light-emitting angle through the diffusion layer 6, and the light-emitting angle of the Mini LED chip 4 is increased from 130° to 140°; thereby increasing the original spacing PITCH<8mm between two adjacent Mini LED lamp beads 2 to PITCH=10-15mm, reducing the density of the Mini LED lamp beads 2, thereby reducing the cost of the backlight module;

[0070] The Mini LED chip 4 increases the light-emitting angle through the light-emitting angle characteristics of the translucent light-shielding layer 5 and the diffusion layer 6; the light emitted by the Mini LED chip 4 is refracted three times along the contact surface between the Mini LED chip 4 and the translucent light-shielding layer 5, the contact surface between the translucent light-shielding layer 5 and the diffusion layer 6, and the contact surface between the diffusion layer 6 and the air, and the light-emitting angle is increased to 155°. The PITCH spacing can reach 30mm, further reducing the density of the Mini LED lamp beads 2, reducing the use of the Mini LED lamp beads 2 to 1 / 16 of the previous amount, greatly reducing the material cost, improving the yield rate, shortening the production time, and increasing the production capacity;

[0071] The edges of the side of the reflective frame 3 are set to be an excessive arc shape to avoid the reflection area of ​​the edges inside the reflective frame 3 being darker, and presenting a more obvious dark spot on the backlight module;

[0072] A serrated gap is formed between the PCB board 1 and the reflective frame 3 through the reflective frame positioning groove 7 and the reflective frame clamping protrusion 8, so as to reduce the light generated by the Mini LED lamp beads 2 in the reflective frame 3 from leaking from the contact surface between the PCB board 1 and the reflective frame 3, causing uneven light output of the backlight module;

[0073] The light-emitting reflective surface 9 on the reflective frame 3 enhances the light-emitting rate of the Mini LED lamp beads 2 and improves the brightness of the backlight module;

[0074] The light emitting reflective surface 9 and the supporting surface 10 arranged inside and outside the reflective frame 3 make the reflective frame 3 form a dam shape, thereby enhancing the strength of the reflective frame 3 and preventing the reflective frame 3 from being deformed or easily damaged during the installation process;

[0075] A plurality of reflective frames 3 are combined to form a reflective frame assembly cover 13, and the reflective frame assembly cover 13 is integrally mounted on the PCB board 1, thereby improving processing efficiency, shortening production time, and reducing production costs;

[0076] The upper surface of the reflective frame connecting rod 14 and the upper surface of the PCB board 1 are made of the same emissivity material and are flush, so as to reduce the difference in reflection between the upper surface of the reflective frame connecting rod 14 and the upper surface of the PCB board 1, which may cause uneven light output from the backlight module;

[0077] The bottom mold of the reflective frame assembly cover 13 is removed, and the side mold and the top mold of the reflective frame assembly cover 13 are retained to reduce the flow of the thermosetting adhesive to the side of the reflective frame assembly cover 13, resulting in the thermosetting adhesive escaping from the reflective frame positioning groove 7 and the reflective frame connecting rod 14 gap during the reflective frame assembly cover 13 is installed on the PCB board 1. The escaped adhesive causes uneven light pattern abnormality after solidification.

[0078] The present invention provides a new type of Mini LED backlight module with a large light-emitting angle, which has the characteristics of increasing the light-emitting angle of Mini LED lamp beads, reducing the density of Mini LED lamp beads, and reducing the cost of the backlight module. The beneficial effects of the present invention are: adding a diffusion glue encapsulation process to form a diffusion layer, so that the light emitted by the LED increases the light-emitting angle through the diffusion layer, from the light-emitting angle of the Mini LED chip of 130° to the light-emitting angle of 140°; thereby increasing the original spacing PITCH<8mm between two adjacent Mini LED lamp beads to PITCH=10~15mm, reducing the density of Mini LED lamp beads, thereby reducing the cost of the backlight module;

[0079] The Mini LED chip increases the luminous angle through the luminous angle characteristics of the semi-transparent shading layer and the characteristic of the diffusion layer to increase the luminous angle; the light emitted by the Mini LED chip is refracted three times at the contact surface between the Mini LED chip and the semi-transparent shading layer, the contact surface between the semi-transparent shading layer and the diffusion layer, and the contact surface between the diffusion layer and the air, and the luminous angle is increased to 155°. The PITCH spacing can reach 30mm, further reducing the density of Mini LED lamp beads, reducing the use of Mini LED lamp beads to 1 / 16 of the previous amount, greatly reducing material costs, improving yield rate, shortening production time, and increasing production capacity;

[0080] A serrated gap is formed between the PCB board and the reflective frame through the reflective frame positioning groove and the reflective frame convexity to reduce the light generated by the Mini LED lamp beads in the reflective frame from leaking from the contact surface between the PCB board and the reflective frame, causing uneven light output from the backlight module;

[0081] The light-emitting reflective surface on the reflective frame enhances the light output rate of the Mini LED lamp beads and improves the brightness of the backlight module;

[0082] The light-emitting reflective surface and supporting surface arranged inside and outside the reflective frame make the reflective frame form a dam shape, thereby enhancing the strength of the reflective frame and preventing the reflective frame from being deformed or easily damaged during the installation process;

[0083] A plurality of reflective frames are combined to form a reflective frame combination cover, and the reflective frame combination cover is installed on the PCB board as a whole, thereby improving processing efficiency, shortening production time, and reducing production costs;

[0084] Remove the bottom mold of the reflective frame combination cover, retain the side mold and top mold of the reflective frame combination cover, reduce the flow of thermosetting adhesive to the side of the reflective frame combination cover, and cause the thermosetting adhesive to escape from the reflective frame positioning groove and the reflective frame connecting rod gap during the reflective frame combination cover is installed on the PCB board. The escaped adhesive will cause uneven light pattern after solidification.

[0085] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

Claims

1. A new type of Mini LED backlight module with ultra-large light-emitting angle, including a light bar, characterized in that ； The light bar comprises a PCB board (1) and Mini LED lamp beads (2), wherein the Mini LED lamp beads (2) are mounted on the PCB board (1); The Mini LED lamp bead (2) comprises a Mini LED chip (4), a semi-transparent light shielding layer (5), and a diffusion layer (6); the upper surface of the Mini LED chip (4) is provided with a semi-transparent light shielding layer (5), and the diffusion layer (6) is provided above the semi-transparent light shielding layer (5); the upper surface of the diffusion layer (6) is an arc surface; A reflective frame (3) is installed on the upper surface of the PCB board (1) outside the Mini LED lamp bead (2); the Mini LED lamp bead (2) is located at the center of the reflective frame (3); The reflective frame (3) is in the shape of a rectangular frame, and the edges of the side edges of the reflective frame (3) are arranged in a transitional arc shape; The bottom side of the reflective frame (3) is provided with a reflective frame clamping protrusion (8); the upper surface of the PCB board (1) is provided with a reflective frame positioning groove (7) that cooperates with the reflective frame clamping protrusion (8); the reflective frame (3) is positioned and mounted on the upper surface of the PCB board (1) through the reflective frame positioning groove (7); A plurality of reflective frames (3) are arranged in a matrix through reflective frame connecting rods (14) to form a reflective frame assembly cover (13), and reflective frame positioning columns (16) are provided on the bottom sides of the reflective frames (3) at the four corners of the reflective frame assembly cover (13), and the reflective frame positioning columns (16) extend downward; The upper surface of the PCB board (1) is provided with a reflective frame positioning groove (7), an LED electrode pad (11), a reflective frame assembly cover connecting groove (12), and a reflective frame assembly cover positioning mounting hole (15); the LED electrode pad (11) is located directly below the Mini LED lamp bead (2) on the light bar; the LED electrode pad (11) is divided into a positive electrode pad and a negative electrode pad; the positive electrode pad and the negative electrode pad correspond to the positive electrode and the negative electrode of the Mini LED chip (4), respectively; The positive electrode and the negative electrode of the LED chip (4) are welded to the LED electrode pad (11); the reflective frame assembly cover connection groove (12) is connected to a plurality of reflective frame positioning grooves (7) through a mesh; the reflective frame positioning groove (7), the reflective frame assembly cover connection groove (12), and the reflective frame assembly cover positioning installation hole (15) respectively cooperate with the reflective frame clamping protrusion (8), the reflective frame connecting rod (14), and the reflective frame positioning column (16); the reflective frame assembly cover positioning installation hole (15) cooperates with the reflective frame positioning column (16); the reflective frame assembly cover (13) is installed on the PCB board (1) through the reflective frame clamping protrusion (8), the reflective frame connecting rod (14), and the reflective frame positioning column (16), and the upper surface of the reflective frame connecting rod (14) is flush with the upper surface of the PCB board (1).

2. According to claim 1, a new type of Mini LED backlight module with a large light-emitting angle, characterized in that: The Mini LED chip (4) is a CSP, and the size of the Mini LED chip (4) is 50-200 μm.

3. The new Mini LED backlight module with a large light-emitting angle according to claim 1, characterized in that: The reflective frame (3) is fixed to the reflective frame positioning groove (7) by gluing; The inner side surface of the reflective frame (3) is provided with a light emitting reflective surface (9) inclined outwards; An inwardly inclined supporting surface (10) is provided on the outer side of the reflective frame (3).

4. The new Mini LED backlight module with a large light-emitting angle according to claim 1, characterized in that: The method for mounting the reflective frame (3) on the PCB board (1) comprises the following steps: Step 1: The reflective frame (3) is formed by hot pressing or mold curing to form a reflective frame assembly cover (13); Step 2: demould the bottom side of the reflective frame assembly cover (13) in the mold, evenly apply a small amount of thermosetting adhesive to the reflective frame clamping protrusion (8) and the reflective frame connecting rod (14), and scrape off excess thermosetting adhesive with a scraper; Step 3, demoulding the molds on the side and top of the reflective frame assembly cover (13), and taking out the reflective frame assembly cover (13) coated with the thermosetting adhesive; Step 4: Position the reflective frame assembly cover (13) coated with the thermosetting adhesive on the PCB board (1) through the reflective frame positioning column (16), and evenly press it into the reflective frame positioning groove (7), the reflective frame assembly cover connecting groove (12), and the reflective frame assembly cover positioning installation hole (15) on the PCB board (1), and then heat cure it in a reflow oven.

5. The new Mini LED backlight module with ultra-large light-emitting angle according to claim 4, characterized in that: The curing temperature of the thermosetting adhesive is 60-80°C.

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