Multiple pitch lead

Abstract

This application is entitled "Multiple Pitch Lead". In some examples, a system includes a die having a plurality of electrical connectors extending from a surface of the die and a lead coupled to the plurality of electrical connectors. The lead includes a first conductive member (1010), a first non-solder metal plating layer (1014) stacked on the first conductive member, an electroplating layer (1020) stacked on the first non-solder metal plating layer, a second non-solder metal plating layer (1008) stacked on the electroplating layer, and a second conductive member (1000) stacked on the second non-solder metal plating layer, the second conductive member being thinner than the first conductive member. The system also includes a molding to at least partially encapsulate the die and the lead.

Description

Summary of the Invention

[0001] In some examples, a system includes a die and leads, the die having a plurality of electrical connectors extending from the surface of the die, the leads being coupled to the plurality of electrical connectors. The leads include: a first conductive member; a first non-solder metal plating stacked on the first conductive member; an electroplated layer stacked on the first non-solder metal plating; a second non-solder metal plating stacked on the electroplated layer; and a second conductive member stacked on the second non-solder metal plating, the second conductive member being thinner than the first conductive member. The system also includes a molding element to at least partially encapsulate the die and leads.

[0002] In some examples, a method includes coupling a first set of leads to a plurality of electrical connectors extending from the surface of a die, wherein the first set of leads has leads arranged in multiple rows. The method also includes selectively plating a second set of leads using a solderless metal to create a metal plate, the second set of leads having multiple portions and being thicker than the first set of leads. The method further includes coupling the metal plate of the second set of leads to the multiple rows using a solderless metal. The method also includes applying a molding compound to at least partially encapsulate the first and second sets of leads. Attached Figure Description

[0003] To describe each example in detail, reference will now be made to the accompanying drawings, in which:

[0004] Figure 1 A perspective view of a die with multiple electrical connectors is depicted according to various examples.

[0005] Figure 2 A perspective view depicting a set of leaders based on the leader frames of various examples.

[0006] Figure 3 A perspective view depicting a set of leads coupled to a lead frame having multiple electrical connectors, according to various examples.

[0007] Figure 4A A perspective view depicting a package with multiple leads, based on various examples.

[0008] Figure 4B A perspective view depicting a package with multiple leads, based on various examples.

[0009] Figure 5A Draw a perspective view of a set of leaders based on the various examples.

[0010] Figure 5B Draw a perspective view of a set of leaders with multiple plates, based on various examples.

[0011] Figure 5C Draw a front view of a set of leaders with multiple plates, based on the various examples.

[0012] Figure 6 A first perspective view of a set of leads having multiple plates, according to various examples, and a second perspective view of the set of leads having an insulating coating.

[0013] Figure 7A A perspective view depicting a set of leads with multiple plates and a package with multiple leads, according to various examples.

[0014] Figure 7B Depicts a front view of a set of leads with multiple plates and a package with multiple leads, according to various examples.

[0015] Figure 7C A side view depicting a set of leads with multiple plates and a package with multiple leads, according to various examples.

[0016] Figure 7D The electroplating of a set of leads with multiple plates and a package with multiple leads are depicted according to various examples.

[0017] Figure 7E The electroplating of a set of leads with multiple plates and a package with multiple leads are depicted according to various examples.

[0018] Figure 8A A front view depicting a set of leads of multiple boards having multiple leads coupled to a package, according to various examples.

[0019] Figure 8B A perspective view depicting a set of leads of multiple boards having multiple leads coupled to a package, according to various examples.

[0020] Figure 8C A side view depicting a set of leads of multiple boards having multiple leads coupled to a package, according to various examples.

[0021] Figure 9A Depict a front view of a package assembly with an exposed set of leads, based on various examples.

[0022] Figure 9B Depict a front view of a package assembly with an exposed set of leads, based on various examples.

[0023] Figure 9C A perspective view depicting a package assembly with an exposed set of leads, based on various examples.

[0024] Figure 9D A side view depicting a package assembly with an exposed set of leads, based on various examples.

[0025] Figure 9E Depicting based on various examples Figure 9A Another perspective view of the package assembly.

[0026] Figure 10A A perspective view depicting a set of leaders based on the leader frames of various examples.

[0027] Figure 10B Depicts a perspective view of a metal plate on a set of leads in a lead frame, according to various examples.

[0028] Figure 10C Draw a perspective view of a set of leaders in a leader frame according to various examples.

[0029] Figure 10D Depict a perspective view of a metal plate on a set of leads in a lead frame, according to various examples.

[0030] Figure 10E A perspective view is depicted of a metal plate on a set of leads in a lead frame, according to various examples, wherein the leads have an insulating coating.

[0031] Figure 10F A perspective view is depicted of a metal plate on a set of leads in a lead frame, according to various examples, wherein the leads have an insulating coating.

[0032] Figure 10G A perspective view depicting a set of leads of a lead frame aligned with a set of leads of another lead frame, the set of leads having an insulating coating, according to various examples.

[0033] Figure 10H A side view of a set of leads of a lead frame, having an insulating coating, is depicted according to various examples and aligned with a set of leads of another lead frame.

[0034] Figure 10I A side view of a set of leads of a lead frame, having an insulating coating, is depicted according to various examples, coupled to another lead frame.

[0035] Figure 10J A perspective view of a set of leads of a lead frame, having an insulating coating, depicting a set of leads coupled to another lead frame according to various examples.

[0036] Figure 10K A perspective view of a set of leads of a lead frame, depicting a set of leads coupled to another lead frame according to various examples.

[0037] Figure 11A A perspective view depicting a die, a first set of leads in a lead frame, and a second set of leads in another lead frame, according to various examples.

[0038] Figure 11B A perspective view depicting a die, according to various examples, housing a first set of leads coupled to a lead frame and a second set of leads to another lead frame.

[0039] Figure 11C A perspective view depicting a package with multiple exposed leads, based on various examples.

[0040] Figure 11D A perspective view depicting a package with multiple exposed leads, based on various examples.

[0041] Figure 12 Describe the manufacturing methods according to each example.

[0042] Figure 13 Describe a flowchart of another manufacturing method based on each example.

[0043] Figure 14 Describe a flowchart of another manufacturing method based on each example. Detailed Implementation

[0044] This disclosure presents several technically advantageous solutions to technical problems arising from the use of certain types of packaged devices, such as power field-effect transistors (FETs). Specifically, these devices are sometimes packaged in a manner that undesirably promotes the degradation of the electrical connection between the device and a printed circuit board (PCB) (or other devices), thereby shortening device life and increasing cost. This problem is typically caused by the design of the lead frame used to package the device. Such a lead frame has leads arranged in rows, and these leads are exposed on the surface of the package so that the leads can be electrically coupled to the PCB. These rows are half-etched in an alternating manner, such that the pitch between the rows is increased (e.g., doubled) relative to the pitch that would otherwise exist, thus eliminating the use of rows with unacceptably fine pitch. The unetched portion of each row is then electrically coupled to the PCB or other devices using solder.

[0045] The above configuration is problematic, at least because the current flowing between the packaged device and the PCB passes through a relatively narrow portion of each lead—that is, through the unetched portion of each lead. This narrow path concentrates the current, which has a detrimental effect on the solder joint coupled to the unetched portion of the lead. For example, the heat generated by this concentrated current flow can damage the solder joint. After an undesirable short period, the joint (and possibly the lead itself) may be damaged, rendering the packaged device unable to perform its intended function.

[0046] This disclosure describes various examples of improved package configurations for the aforementioned devices (e.g., power FETs). The improved package configuration omits the aforementioned lead frame with half-etched leads, instead using a first lead frame with unetched leads. The leads of this first lead frame are electrically coupled to the leads of a second lead frame using a non-solder material (e.g., any metal other than solder). In the example, the leads of the second lead frame are substantially thicker than the leads of the first lead frame. In the example, the number of leads in the second lead frame is less than the number of leads in the first lead frame. In the example, the leads of the second lead frame are positioned substantially orthogonal to the leads of the first lead frame (e.g., within 10 degrees of orthogonality). Each lead in the second lead frame is coupled to an alternating lead in the first lead frame such that no lead in the second lead frame is coupled to any common lead in the first lead frame. Some or all of one or both lead frames are then encapsulated in a molding material (e.g., epoxy resin) to form a complete device. At least the leads of the second lead frame are exposed on the surface of the package to facilitate electrical connection to the PCB or other devices (e.g., using solder).

[0047] Because half-etching is omitted, the current is not concentrated as described above, thus mitigating the detrimental effects on the structure of the packaged device. Additionally, since in some examples the solder is only used to couple the relatively large leads of the second leadframe to the PCB, the current is distributed over a wider lead surface area compared to the case of leads in the first leadframe, thereby mitigating the detrimental effects on the solder joints and maintaining the structural integrity of the packaged device. Exemplary package configurations will now be described in detail with reference to the accompanying drawings.

[0048] Figure 1 Perspective views of die 100 are depicted according to various examples. In some examples, die 100 includes power transistors (such as power FETs). In other examples, die 100 includes other types of devices. Die 100 includes multiple electrical connectors coupled to active portions of die 100 (such as the source and drain terminals of a power FET). For example, electrical connector 108 is coupled to the source terminal of a power FET, while electrical connector 110 is coupled to the drain terminal of a power FET. As shown, electrical connectors 108 and 110 are arranged in alternating rows. In this example, electrical connector 104 is coupled to the source terminal of a power FET. Electrical connector 102 is coupled to, for example, an area of ​​die 100 that generates data and control signals. In some examples, the electrical connectors comprise copper. In some examples, the electrical connectors are cylindrical. In some examples, the electrical connectors are cubic. Other compositions and shapes are conceivable and are included within the scope of this disclosure. In some examples, the spacing between the row containing electrical connector 108 and the row containing electrical connector 110 is approximately 50 micrometers.

[0049] Figure 2 A perspective view depicting the first set of leads of a leadframe 200 according to various examples is shown. As shown, the leadframe 200 includes leads 208 and 210 arranged in an alternating configuration. The leadframe 200 further includes leads 204 and 202. A dam bar 201 connects leads 202, 204, 208, and 210 together. In the example, the leadframe 200 comprises bare copper. In the example, the leadframe 200 comprises plated metal, such as an electroplated copper leadframe. Because the various portions of the leadframe 200 are electrically contacted, electroplating is a feasible plating technique. As shown, in some examples, leads 208 and 210 have rectangular shapes with rounded edges. In some examples, leads 208 and 210 have rectangular shapes with non-rounded edges or with both rounded and non-rounded edges. In some examples, lead 202 has a fan-out shape as depicted. In some examples, the length of lead 208 is similar to the length of the row containing electrical connector 108 (i.e., within reasonable tolerances, such as + / - 5 mm, as judged by a person skilled in the art). In some examples, the length of lead 210 is similar to the length of the row containing electrical connector 110. In some examples, the spacing between lead 208 and lead 210 is approximately 500 micrometers. In some examples, lead 208 and lead 210 are approximately 2 mm long and approximately 300 micrometers wide.

[0050] Figure 3 Describe the coupling to each example Figure 1 100mm die Figure 2 The leads are arranged as follows. As shown, each lead 208 is coupled to a corresponding row containing an electrical connector 108. Similarly, each lead 210 is coupled to a corresponding row containing an electrical connector 110. Lead 204 is coupled to electrical connector 104, and lead 202 is coupled to electrical connector 102. In this example, solder is used to establish the aforementioned connections, but other conductive materials (e.g., metals, alloys) are conceivable and included within the scope of this disclosure. Figure 3 For clarity and ease of explanation, dam section 20)1 is not shown in the accompanying drawings and subsequent figures.

[0051] Figure 4A A perspective view depicting an encapsulation 400 according to various examples is shown. The encapsulation 400 includes components at least partially encapsulated in a molding 401 (e.g., epoxy resin). Figure 3 The assembly depicted. In the example, Figure 3Leads 202, 204, 208, and 210 are exposed on surface 402 of package 400. In this example, leads 202, 204, 208, and 210 are not partially etched; in other words, the exposed portions of the leads have a uniform thickness. Therefore, in such an example, the exposed surfaces of the leads can be uniformly flush with surface 402 of package 400. Similarly, in such an example, if the leads rise above surface 402 of package 400, the leads have a uniform thickness (e.g., 50 micrometers) above surface 402. The scope of this disclosure is not necessarily limited to any particular thickness of the leads or any particular degree of uniformity between the leads. For example, leads with a “uniform” thickness can have thicknesses that are not exactly the same but sufficiently similar to achieve the purposes described in this disclosure. Figure 4B A perspective view depicting another example of package 400. In this view, package 400 and its leads have... Figure 4A The dimensions shown are different sizes.

[0052] Figure 5A A perspective view depicting a set of leads 500 according to various examples. The set of leads 500 includes leads 502, 504, 506, and 508. In the examples, the leads in the set of leads 500 are substantially thicker (e.g., 200 micrometers) than the leads of the lead frame 200. In the examples, the set of leads 500 has fewer leads than the lead frame 200. In the examples, the leads in the set of leads 500 include unplated copper.

[0053] Figure 5B Draw a perspective view of the leaders in group 500 according to the example. As shown in the figure. Figure 5B The leads depicted have a conductive plating layer 510 applied to them. In one example, plating layer 510 is applied to lead 502 to facilitate coupling of lead 502 to lead 202 on package 400. In another example, plating layer 510 is applied to lead 504 to facilitate coupling to lead 210 on package 400. In yet another example, plating layer 510 is applied to lead 506 to facilitate coupling to lead 208 on package 400. Also in another example, plating layer 510 is applied to lead 508 to facilitate coupling to lead 204 on package 400. To facilitate coupling of lead 504 only to lead 210 and lead 506 only to lead 208, plating layer 510 is applied to leads 504 and 506 in an alternating manner, as shown. Figure 5C Depict a front view of a set of leads 500. In the example, plating 510 (and so for the other platings described herein) may be composed of the following materials: nickel; nickel-palladium; nickel-palladium-gold; nickel-tungsten; tin; tin-gold; gold; and silver.

[0054] Figure 6A perspective view depicting a set of leads 500 undergoing a coating process. Specifically, the set of leads 500 is sprayed with a mixture of mercaptopropyltrimethoxysilane (MPTS) and methanol or ethanol or immersed in such a mixture. Applying MPTS to the copper surface of the set of leads 500 results in the leads having a non-conductive coating 512. Although the scope of the invention is not limited to any particular coating technique or the resulting coating composition, in this example, coating 512 is copper sulfide. MPTS does not react with plating 510, therefore no coating is applied to plating 510. Coating 512 can be enhanced by heat curing (e.g., holding at 50 to 60 degrees Celsius for 2–10 minutes). The enhanced coating 512 is better able to withstand chemical and thermal damage during subsequent electroplating.

[0055] Figure 7A A perspective view depicting a set of leads 500 (with a coating) during coupling to package 400. Lead 502 of this set of 500 is aligned with lead 202 of package 400 but not yet coupled. Lead 504 is aligned with lead 210 but not yet coupled. Lead 506 is aligned with lead 208 but not yet coupled. Lead 508 is aligned with lead 204 but not yet coupled.

[0056] Figure 7B A front view depicting the coupling process between a set of leads 500 and a package 400. In the example, at least some of the leads of the set of leads 500 are positioned substantially orthogonal to the leads of the lead frame 200 (e.g., within 10 degrees of orthogonality). In the example, lead 504 is long enough to span the entire array of leads 208, 210. In the example, lead 506 is long enough to span the entire array of leads 208, 210. In the example, each lead in the set of 500 is longer than... Figure 2 The corresponding leads depicted in the diagram have a larger surface area and volume.

[0057] Figure 7C A side view depicting the aforementioned coupling process is shown. As illustrated, each instance of plating 510 is aligned with a corresponding lead on package 400 but not yet coupled. In some examples, the distance between plating 510 and the respective leads of package 400 is between 4 micrometers and 60 micrometers.

[0058] Figure 7D and Figure 7E The process of bridging the spacing between the plating 510 and the various leads of the package 400 is described. Specifically, in Figure 7D In this setup, a set of leads 500 and a package 400 are placed in an electroplating bath (such as a copper or nickel plating bath). Current is then applied to the leads of the set 500. Although not explicitly shown in the accompanying drawings, the leads in the set 500 use, for example, conductive dam bars to form a common electrical path. Figure 7EAs depicted, current and an electroplating bath cause a conductive plating layer 700 (e.g., a copper plating layer) to form between the plating layer 510 and the corresponding leads on the package 400.

[0059] Figure 8A Depicting Figure 7E The assembly is shown in the front view, but the non-conductive coating 512 has been stripped. Coating 412 can be stripped using any suitable solvent such as acetone or pyrrolidone. Figure 8B Depicting Figure 8A A perspective view of the assembly. Figure 8C Depicting Figure 8A Side view of the assembly.

[0060] Figure 9A A front view of a package assembly 900 is depicted, the package assembly 900 including a package 400 (in... Figure 9A It is not explicitly stated in the text, but in Figure 9C and Figure 9D (as depicted in the image) and a molded part (e.g., epoxy resin) 902, the molded part encapsulating Figures 8A to 8C The components depicted are not included within the package 400. As shown, the lead 500 is exposed on the surface of the molded part 902. In this example, the lead 500 is flush with the surface of the molded part 902. Figure 9B Depicting Figure 9A The package assembly 900 has a plating applied to the lead 500 (e.g., using any suitable metal). Figure 9C , Figure 9D and Figure 9E Front, side and rear perspective views of the package assembly 900 are provided respectively.

[0061] In addition to the technical advantages already described, the foregoing examples provide flexibility in coupling fine-pitch devices (e.g., dies) to coarser-pitch devices (e.g., PCBs). More specifically, fine-pitch leads (such as leads 208 and 210) are electrically coupled to die 100. Leads 208 and 210 are coupled to their respective coarser-pitch leads 504 and 506, which in turn are coupled to devices (such as PCBs) well-suited for coarse-pitch electrical connections.

[0062] In many such examples, the package containing die 100 and fine-pitch leads 208 and 210 may already be manufactured and commercially available. In this case, as described above, leads 504 and 506 are coupled to leads 208 and 210, and the complete assembly is then ready to be coupled to a device such as a PCB. However, in some cases, it may be desirable to design fine-pitch lead frames and coarse-pitch lead frames and couple them together before adding any molded parts. Information regarding... Figures 10A to 11D Examples.

[0063] Figure 10A A perspective view depicting the leads in the first set of leads 1000 according to various examples of lead frames. (As mentioned above, for clarity, the dam strips and associated mechanical connections typically present in the lead frame are omitted in these figures.) The set of leads 1000 includes leads 1002, 1004, and 1006. The leads in this set of leads 1000 are finely pitched (e.g., between 10 micrometers and 200 micrometers). The specific configuration of the leads in this set of leads 1000 depends on the configuration of the electrical connections on the variable die that will be coupled to the leads. Figure 10A The following figures assume that the lead configuration is similar to the lead configuration described above. Similar to leads 208 and 210 described above, leads 1002 and 1004 are arranged in an alternating configuration. Lead 1006 may be arranged in a fan-out configuration to accommodate the electrical connection spacing requirements of the PCB to which lead 1006 will be coupled. In the example, each of leads 1002 and 1004 has a width of approximately 50 micrometers and a length of approximately 2 millimeters. In the example, leads 1002, 1004, and 1006 are formed using thin foils (e.g., 10 to 100 micrometers) of copper foil using chemical etching, laser cutting, plasma cutting, or other suitable processes.

[0064] Figure 10B A perspective view is depicted on the metal plating 1008 on the leads of a set of leads 1000, according to various examples. The metal plating 1008 may include any suitable conductive material such as nickel, nickel-palladium, nickel-palladium-gold, tin, nickel-tungsten, etc., other than copper and solder. Copper is avoided to selectively distinguish it from the base metal of the lead frame (because it is desired to later chemically coat the rest of the lead frame and leave the contact area uncoated), and solder is avoided to prevent the aforementioned challenges associated with solder.

[0065] Figure 10C A perspective view of a set of leads 1010 according to various examples is depicted. This set of leads 1010 includes leads 1012, 1013, and 1015. Each of leads 1012 and 1013 is thicker than each of leads 1002 and 1004. Similarly, each of leads 1015 is thicker than each of leads 1006. In the examples, the thickness of leads 1012, 1013, and 1015 is between 50 micrometers and 250 micrometers. In the examples, leads 1012, 1013, and 1015 are made from copper foil using chemical etching, laser cutting, plasma cutting, mechanical stamping, or any other suitable process. In the examples, each of leads 1012 and 1013 has a length of approximately 3 millimeters and a width of approximately 2 millimeters. In the examples, each of leads 1015 has a length of approximately 0.45 millimeters and a width of approximately 0.3 millimeters.

[0066] Figure 10D A perspective view is depicted of a metal plating 1014 deposited on leads 1012, 1013, and 1015 according to various examples. The metal plating material can include any non-copper and non-solder material, such as nickel, nickel-palladium, nickel-palladium-gold, tin, nickel-tungsten, etc. In the examples, the metal plating 1014 is deposited with the metal plating 1008 aligned with the metal plating 1008 when leads 1012, 1013, and 1015 mate with leads 1002, 1004, and 1006, respectively.

[0067] Figure 10E and Figure 10F Perspective views of a set of leads 1000 and a set of leads 1010 are depicted respectively. The sets of leads 1000 and 1010 are coated with MPTS using an immersion or spraying technique. MPTS reacts with and coats the copper surface; however, since the metal plating does not include copper, the metal plate is not coated with MPTS. In the set of leads 1000, numeral 1016 indicates the area coated with MPTS. In the set of leads 1010, numeral 1018 indicates the area coated with MPTS. In the example, MPTS can be cured, for example, at 50 to 60 degrees Celsius for 2 to 10 minutes. As described below, the cured coating is better able to withstand the chemical and thermal effects during subsequent electroplating.

[0068] Figure 10G A perspective view depicting a set of leads 1000 and a set of leads 1010 aligned with each other, while Figure 10H Describe its side view. For example... Figure 10H As depicted, leads 1000 and 1010 are aligned such that the metal plating on each lead is aligned with each other. Figure 10G and Figure 10H In this process, the metal plates do not touch each other, but are kept aligned and close together using spacers and clamps or other suitable equipment (e.g., a distance of 15 micrometers between the metal plates). The set of leads 1000 and the set of leads 1010 are then placed in an electroplating bath and an electric current is applied. Figure 10I A side view depicting a set of leads 1000 and a set of leads 1010 when an electroplating process causes an electroplated layer 1020 to grow between metal plating layers 1008 and 1014, thereby bridging the gap between metal plating layers 1008 and 1014. Figure 10J Depicting Figure 10I A perspective view of the assembly shown. Figure 10K As shown in the perspective view, the MPTS coating can be stripped using solvents such as acetone or pyrrolidone.

[0069] Figure 11AA perspective view of die 1022 is depicted, which has an electrical connector 1024 extending from die 1022. Figure 11A Also depict Figure 10K The assembly is shown in the figure. Electrical connector 1024 is aligned with the corresponding leads 1002, 1004, 1006. Figure 11B yes Figure 11A The view shows the assembly, but the electrical connector 1024 is already electrically coupled (e.g., using solder) to leads 1002, 1004, and 1006. Figure 11B The assembly encapsulated in a molding 1026 (e.g., epoxy resin) is also depicted in the figure, which is shown in the figure as being translucent so as to allow viewing of the interior of the molding 1026. Figure 11C and Figure 11D An alternative perspective view depicting the completed package is shown, in which a set of leads 1010 are exposed on the surface of the molded part 1026 (i.e., exposed on the surface of the package), and a set of leads 1000 are exposed on different surfaces of the molded part 1026 (i.e., exposed on different surfaces of the package). Figure 11D In the middle, the assembly is inverted, making Figure 11C The top surface is Figure 11D The bottom surface of the middle.

[0070] The term "leader" as used herein is not limited to any particular example or embodiment. For example, see references... Figure 10I "Leads" can refer to a stack comprising: conductive components (e.g., a set of leads 1010); a non-solder and / or non-copper metal plating 1014 stacked on the conductive components (e.g., a set of leads 1010); an electroplated layer 1020 stacked on the non-solder and / or non-copper metal plating 1014; a non-solder and / or non-copper metal plating 1008 stacked on the electroplated layer 1020; and conductive components (e.g., a set of leads 1000) stacked on the non-solder and / or non-copper metal plating 1008. Figure 10G As shown, conductive components (e.g., a set of leads 1000) can extend in multiple directions in a common plane, for example, to achieve a fan-out configuration. However, this is not necessarily the case, as the term "lead" can include... Figure 10I The conductive components depicted on the upper left are stacked or Figure 10I The stack of conductive components is depicted on the right side.

[0071] Figure 12A flowchart depicts a manufacturing method 1200 according to various examples. Method 1200 can be used to manufacture one or more of the devices described above, or at least a portion of one or more of the devices described above. Method 1200 begins by coupling a first set of leads to a plurality of electrical connectors extending from the surface of a die, wherein the first set of leads has leads arranged in multiple rows (step 1202). Method 1200 then includes selectively plating a second set of leads using a non-solder metal to produce a metal plate, the second set of leads having multiple portions and being thicker than the first set of leads (step 1204). Method 1200 then includes coupling the metal plate of the second set of leads to the multiple rows using a non-solder metal (step 1206). Method 1200 further includes applying a molding compound to at least partially encapsulate the first set of leads and the second set of leads (step 1208). The steps of method 1200 can be performed in any suitable order and can be modified to add, modify, or remove one or more steps.

[0072] Figure 13 A flowchart depicts a manufacturing method 1300 according to various examples. Method 1300 can be used to manufacture one or more of the devices described above, or at least a portion of one or more of the devices described above. Method 1300 begins by providing a first set of leads (step 1302). Method 1300 includes forming a first non-solder metal plate on the first set of leads (step 1304). Method 1300 includes providing a second set of leads, wherein the spacing between the leads in the second set of leads is not as fine as the spacing between the leads in the first set of leads, and wherein the leads in the second set of leads are thicker than the leads in the first set of leads (step 1306). Method 1300 next includes forming a second non-solder metal plate on the second set of leads (step 1308). Method 1300 further includes coating the first set of leads and the second set of leads with a non-conductive material, and after coating is completed, the first non-solder metal plate and the second non-solder metal plate remain exposed (step 1310). Method 1300 further includes forming a non-solder metal connection between a first non-solder metal plate and a second non-solder metal plate using an electroplating technique (step 1312). Method 1300 includes removing the coating from the first set of leads and the second set of leads (step 1314). The steps of method 1300 can be performed in any suitable order and can be modified by adding, modifying, or removing one or more steps.

[0073] Figure 14A flowchart depicts a manufacturing method 1400 according to various examples. Method 1400 can be used to manufacture one or more of the devices described above, or at least a portion of one or more of the devices described above. Method 1400 begins by providing a chip package including a die coupled to a first plurality of leads, and the first plurality of leads being exposed on the surface of the chip package (step 1402). Method 1400 then includes providing a second plurality of leads, the leads of the second plurality of leads being thicker than the leads of the first plurality of leads, and the first plurality of leads having a finer pitch than the second plurality of leads (step 1404). Method 1400 then includes forming a metal plate on the second plurality of leads (step 1406) and coating the second plurality of leads with a non-conductive material (step 1408). Method 1400 then includes coupling the metal plate of the second plurality of leads to the first plurality of leads using an electroplating process (step 1410). Method 1400 then includes removing the coating from the second plurality of leads (step 1412). Method 1400 includes encapsulating a second plurality of leads using a molded part (step 1414). The steps of method 1400 can be performed in any suitable order, and method 1400 can be modified to add, modify, or remove one or more steps.

[0074] The examples disclosed herein offer advantages beyond those described above. For instance, the different lead pitches allow for the use of dies with finer features than previously seen in power device environments. Furthermore, devices with multiple lead sets enable the use of a wider variety of design rules, lead thicknesses, materials, and suppliers throughout the supply chain. These advantages, in turn, can provide further benefits; for example, increased design flexibility can lead to lower manufacturing costs relative to what would otherwise be incurred. The disclosed examples may also offer other advantages not explicitly described herein.

[0075] In the foregoing discussion and claims, the terms “comprising” and “including” are used in an open-ended manner and should therefore be interpreted as meaning “including, but not limited to…”. Similarly, the term “coupled” is intended to indicate an indirect or direct connection. Thus, if a first device is coupled to a second device, the connection can be a direct connection or an indirect connection via other devices and connections. Similarly, devices coupled between a first component or location and a second component or location can be a direct connection or an indirect connection via other devices and connections. Elements or features “configured” to perform a task or function can be configured by the manufacturer at the time of manufacture (e.g., programmed or structurally designed) to perform the function, and / or can be configured (or reconfigurable) by the user after manufacture to perform the function and / or other additional or alternative functions. Configuration can be made through firmware and / or software programming of the device, through the construction and / or layout of hardware components, and through interconnections of the device, or combinations thereof. Additionally, in the foregoing discussion, the use of the phrase “ground” or similar terms is intended to include chassis ground, earth, floating ground, virtual ground, digital ground, public ground, and / or any other form of ground connection applied to or suitable for the teachings of this disclosure. Unless otherwise stated, “about,” “approximately,” or “substantially” preceding a value means + / - 10% of that value.

[0076] The foregoing discussion is intended to illustrate the principles and various embodiments of this disclosure. Many variations and modifications will become apparent to those skilled in the art once the foregoing disclosure is fully understood. It is intended that the following claims be construed as encompassing all such variations and modifications.

Claims

1. A packaging system comprising: A die having a plurality of electrical connectors extending from the surface of the die; Leads, coupled to the plurality of electrical connectors, the leads comprising: First conductive component; A first non-solder metal plating layer stacked on the first conductive component; An electroplated layer stacked on the first non-solder metal plating layer; A second non-solder metal plating layer is stacked on the electroplated layer; and A second conductive member stacked on the second non-solder metal plating layer, the second conductive member being thinner than the first conductive member; and A molded part that at least partially encapsulates the die and the lead.

2. The packaging system of claim 1, wherein the second conductive member has a larger volume than the first conductive member.

3. The packaging system of claim 1, wherein the second conductive member is orthogonally oriented to the first conductive member.

4. The packaging system of claim 1, wherein the spacing between the second conductive member and another conductive member adjacent to the second conductive member in a common plane is between 10 micrometers and 200 micrometers.

5. The packaging system of claim 1, wherein the second conductive member extends in a plurality of directions in a common plane.

6. The packaging system of claim 1, wherein the first non-solder metal plating and the second non-solder metal plating are non-copper metal platings.

7. The packaging system of claim 1, wherein the die comprises a power transistor, and wherein the first conductive member is coupled to one of the source lead or drain lead of the power transistor.

8. The packaging system of claim 1, wherein the non-solder metal is selected from the group consisting of: nickel; nickel-palladium; nickel-palladium-gold; nickel-tungsten; tin; tin-gold; gold; and silver.

9. The packaging system of claim 1, wherein the electroplating layer comprises electroplated copper.

10. A packaging system comprising: A die having electrical connectors extending from the surface of the die, the electrical connectors being arranged in multiple rows; The first set of leads is arranged in multiple rows, and the multiple rows of leads are coupled to multiple rows of electrical connectors; The second set of leads has a first lead and a second lead, the first lead being coupled to an alternating lead in the multi-row leads via a non-solder metal, and the second lead being coupled to other alternating leads in the multi-row leads via the non-solder metal, the first lead and the second lead being thicker than the first set of leads; as well as A molded part that at least partially encloses the first set of leads and the second set of leads.

11. The packaging system of claim 10, wherein each of the multiple rows of the first set of leads is coupled to a different row of the multiple row electrical connector.

12. The packaging system of claim 10, wherein the non-solder metal is aligned and positioned with the multiple rows of leads on the first lead and the second lead.

13. The packaging system of claim 10, further comprising an additional non-solder metal coupled to the non-solder metal.

14. The packaging system of claim 10, wherein the first lead and the second lead are exposed on the first surface of the molded part.

15. The packaging system of claim 10, wherein the first lead has a length extending across all the multi-row leads of the first set of leads.

16. A packaging system comprising: The die includes a multi-row electrical connector; A plurality of leads, each of the plurality of leads being coupled to an electrical connector in a different row; and A second plurality of leads, positioned in a different plane from the first plurality of leads, wherein a first lead of the second plurality of leads is coupled to a plurality of discontinuous leads of the first plurality of leads having a plurality of non-solder metals, and a second lead of the second plurality of leads is coupled to another plurality of discontinuous leads of the first plurality of leads having a plurality of non-solder metals. The first and second leads in the second plurality of leads are thicker than the leads in the first plurality of leads.

17. The packaging system of claim 16, wherein the spacing between the leads in the first plurality of leads is in the range of 10 micrometers to 200 micrometers.

18. The packaging system of claim 16, wherein the plurality of non-solder metals are identical.

19. A method of manufacturing a package, comprising: The first set of leads is coupled to a plurality of electrical connectors extending from the surface of the die, the first set of leads having leads arranged in multiple rows; A second set of leads is selectively plated with a non-solder metal to produce a metal plate, the second set of leads having multiple sections and being thicker than the first set of leads; The metal plate of the second set of leads is coupled to the multiple rows using a non-solder metal; and Apply a molding to at least partially encapsulate the first set of leads and the second set of leads.

20. The method of claim 19, further comprising applying an insulating coating to the second set of leads, wherein the metal plate remains exposed after the insulating coating is applied.

21. The method of claim 20, further comprising: Place the first set of leads and the second set of leads in an electroplating bath; Apply current to the second set of leads to create a non-solder metal connection between the metal plate and the leads in the first set of leads; and The insulating coating is peeled off from the second set of leads.

22. A method for manufacturing a package, comprising: Provide the first set of leads; A first non-solder metal plate is formed on the first set of leads; A second set of leads is provided, wherein the spacing between the leads in the second set of leads is not as fine as the spacing between the leads in the first set of leads, and the leads in the second set of leads are thicker than the leads in the first set of leads; A second non-solder metal plate is formed on the second set of leads; The first set of leads and the second set of leads are coated with a non-conductive material. After the coating is completed, the first non-solder metal plate and the second non-solder metal plate remain exposed. Electroplating technology is used to form a non-solder metal connection between the first non-solder metal plate and the second non-solder metal plate; and Remove the coated non-conductive material from the first set of leads and the second set of leads.

23. The method of claim 22, wherein one of the leads in the second set of leads has a length extending across the first set of leads.

24. A method of manufacturing a package, comprising: A package is provided, which includes a die coupled to a first plurality of leads, the first plurality of leads being exposed on the surface of the package; A second plurality of leads are provided, wherein the leads in the second plurality of leads are thicker than the leads in the first plurality of leads, and the first plurality of leads have a finer pitch than the second plurality of leads; A metal plate is formed on the second plurality of leads; The second plurality of leads are coated with a non-conductive material; The metal plate of the second plurality of leads is coupled to the first plurality of leads using an electroplating process; Remove the coated non-conductive material from the second plurality of leads; and The second plurality of leads are encapsulated using a molded part.

25. The method of claim 24, wherein the leads in the second plurality of leads have a length extending across the first plurality of leads.

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