Resin coating device and resin coating method

Abstract

A resin coating device and a resin coating method are provided, wherein a solid resin is used to coat the resin. The resin coating device includes: a storage portion; a cover portion; a cover portion driving portion that drives the cover portion in a manner that allows it to be opened and closed relative to the storage portion; a resin supply portion that supplies solid resin to the workpiece; a vacuum pump that makes the processing space sealed by the storage portion and the cover portion a vacuum; and an atmosphere release valve that supplies atmosphere to the processing space to cool the resin coated on the workpiece. The storage portion includes a holding table and a holding table driving portion that drives the holding table in the up-down direction. The cover portion includes an upper table, which expands and coats the resin on the workpiece by being opposed to the holding table and relatively close to the holding table, and the cover portion covers the opening of the storage portion to form a closed processing space.

Description

Technical Field

[0001] The invention relates to a resin coating device and a resin coating method. Background Art

[0002] When grinding and thinning various plate-shaped workpieces such as semiconductor wafers, resin package substrates, ceramic substrates, and glass substrates, or dividing them using a cutting tool or a laser beam, the workpiece is held by a chuck table. In order to prevent the held surface from being damaged or contaminated by contact with the chuck table during the processing of the workpiece, or to enable the workpiece to be transported together after being divided, a technology of coating the held surface with a liquid resin is known (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2009-148866

[0004] However, liquid resin is difficult to handle and is bulky, so there is a problem that it takes a lot of time to transport and store it. Summary of the invention

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a resin coating device and a resin coating method for coating a resin using a solid resin.

[0006] According to one embodiment of the present invention, a resin coating device is provided, which coats a surface of a workpiece with resin, wherein the resin coating device comprises: a storage portion with an opening, which includes a holding table for sucking and holding the workpiece and a holding table driving portion for driving the holding table in the up-down direction; a cover portion, which covers the opening of the storage portion to form a closed processing space; a cover driving portion, which connects the storage portion and the cover portion and drives the cover portion in a manner that it can be opened and closed relative to the storage portion; and a resin supply portion, which supplies a resin to the holding portion. A solid resin is provided to the workpiece held by the worktable; a vacuum pump is used to make the processing space sealed by the storage part and the cover part into a vacuum; and an atmosphere release valve is used to supply atmosphere to the processing space and cool the resin covering the workpiece. The cover part includes an upper worktable, which is opposite to the holding worktable and relatively close to the holding worktable so that the resin provided to the workpiece is expanded and covers the workpiece. One or both of the holding worktable and the upper worktable have a heating component to melt the resin.

[0007] In the above-mentioned resin coating device, it is also possible that the cover driving part has: a track limiting part, which limits the track of the cover that moves relative to the storage part; and a drive control part, which applies a driving force to the track limiting part to make the cover move relative to the storage part, the track limiting part has: a fixed arm, which is fixed to the storage part side; a movable arm, which is fixed to the cover part side and moves together with the cover part; and a fulcrum part, which connects the fixed arm and the movable arm to each other in a manner that can rotate relative to each other, and the drive control part has a cylinder body that extends and contracts along an axial direction to apply the driving force, one end of the cylinder body is rotatably connected to the storage part side, and the other end is rotatably connected to the movable arm, by extending and contracting the cylinder body, the angle formed between the fixed arm and the movable arm is changed at the fulcrum part, so that the cover is moved relative to the storage part.

[0008] Alternatively, the resin coating device further includes a conveying arm for moving the workpiece out of the holding worktable, the conveying arm including: an adsorption pad for adsorbing the workpiece; and a pad driving unit for driving the adsorption pad, the holding worktable including: a holding surface for holding the workpiece; a suction groove formed on the holding surface; and a connecting path for connecting the suction groove and a suction source, wherein at least three lifting pins and pin driving units for moving the lifting pins up and down are formed on the holding surface, the lifting pins are driven to be at a height below the holding surface when holding the workpiece, and higher than the holding surface when moving the workpiece out of the holding worktable, the conveying arm is inserted between the workpiece formed by the lifting pins and the holding worktable to convey the workpiece.

[0009] In addition, according to another embodiment of the present invention, a resin coating method is provided, wherein a resin coating device is used to coat a workpiece with resin, and the resin coating device comprises: a storage portion with an opening, which includes a holding table for sucking and holding the workpiece and a holding table driving portion for driving the holding table in the up-down direction; a cover portion, which covers the opening of the storage portion to form a closed processing space; a cover driving portion, which connects the storage portion and the cover portion and drives the cover portion in a manner that it can be opened and closed relative to the storage portion; and a resin supply portion, which supplies a resin to the holding table. The processing unit comprises a vacuum pump for providing a solid resin to the workpiece to be processed; a vacuum pump for making the processing space sealed by the storage unit and the cover unit vacuum; and an atmosphere release valve for providing atmosphere to the processing space and cooling the resin covering the workpiece, the cover unit comprises an upper worktable, the upper worktable is opposed to the holding worktable and is relatively close to the holding worktable, so that the resin provided to the workpiece is expanded and covers the workpiece, and one or both of the holding worktable and the upper worktable have a heating member for melting the resin, wherein the resin covering method comprises The method comprises the following steps: a heating step of heating the holding workbench; a holding step of holding the workpiece by the holding workbench; a resin supplying step of supplying solid resin to the upper surface of the workpiece held by the holding workbench; a resin liquefying step of liquefying the resin by the heated holding workbench; a sealing step of closing the cover to cover the opening of the storage part, thereby forming the processing space sealed by the storage part and the cover; a vacuuming step of vacuumizing the processing space by the vacuum pump; and a resin coating step of , raising the holding table, allowing the resin to expand and cover the workpiece between the holding table and the upper table; a resin cooling step, stopping the heating of the holding table while the holding table is raised, introducing the atmosphere from the atmosphere opening valve, cooling the resin and solidifying the resin; a holding table lowering step, using the holding table to attract and hold the workpiece and lowering the holding table; and a moving-out step, after implementing the holding table lowering step, opening the cover and moving the workpiece coated with the resin out of the holding table.

[0010] According to one or another embodiment of the present invention, the resin can be coated using a solid resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a cross-sectional view showing one state of the resin coating device according to the embodiment.

[0012] Figure 2 It is a cross-sectional view showing another state of the resin coating device according to the embodiment.

[0013] Figure 3It is shown Figure 1 and Figure 2 A top view of the main parts of the holding table and transfer arm.

[0014] Figure 4 1 is a flowchart showing a resin coating method according to an embodiment.

[0015] Figure 5 It is shown Figure 4 A cross-sectional view of an example of a heating step, a holding step, and a resin providing step.

[0016] Figure 6 It is shown Figure 4 A cross-sectional view of an example of a resin liquefaction step.

[0017] Figure 7 It is shown Figure 4 A cross-sectional view of an example of a sealing step and a vacuum step.

[0018] Figure 8 It is shown Figure 4 A cross-sectional view of an example of a resin coating step.

[0019] Fig. 9 It is shown Figure 4 A cross-sectional view of an example of a resin cooling step.

[0020] Fig.10 It is shown Figure 4 A cross-sectional view of an example of a step for keeping the worktable lowered.

[0021] Fig.11 It is shown Figure 4 A cross-sectional view of an example of a carrying-out step.

[0022] Fig.12 This is a cross-sectional view showing an example of a remainder cutting step in the resin coating method according to the embodiment.

[0023] Fig.13 It is a cross-sectional view showing one state of the resin coating device according to the first modified example of the embodiment.

[0024] Fig.14 It is a cross-sectional view showing a resin coating method according to a fourth modified example of the embodiment.

[0025] Fig.15 It is a cross-sectional view showing a frame unit obtained by the resin coating method according to the fourth modified example of the embodiment.

[0026] Description of symbols

[0027] 1, 1-2: resin coating device; 2-1, 2-2: housing; 3: frame; 4: processing space; 4-1, 4-2: space; 4-3, 4-4: opening; 5, 6: protrusion; 10: storage part; 11: holding table; 12: holding surface; 13: holding table drive unit; 14, 24: heating member; 16-1: suction source; 16-2: connecting path; 17: suction groove; 18: lifting pin; 19: pin drive unit; 20: cover; 20-1: closed position; 20-2: open position; 21: upper table; 22: pressing surface; 23: upper table drive unit; 30: cover : driving part; 31: track limiting part; 32: driving control part; 33: fixed arm; 34: moving arm; 35: fulcrum part; 36: fixed side fulcrum part; 37: moving side fulcrum part; 38: cylinder; 40: resin supply part; 50: vacuum pump; 60: atmosphere opening part; 61: atmosphere opening path; 62: atmosphere opening valve; 70: conveying arm; 71: adsorption pad; 72: pad driving part; 80: control unit; 100: workpiece; 101: front; 102: back; 109: frame; 109-1: opening; 200: solid resin; 201: liquefied resin; 202: resin. DETAILED DESCRIPTION

[0028] The mode (embodiment) for implementing the present invention is described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural elements described below include substantially the same structural elements that can be easily thought of by those skilled in the art. Moreover, the structures described below can be appropriately combined. In addition, various omissions, substitutions or changes in the structure can be made within the scope of the main purpose of the present invention.

[0029] [Implementation Method]

[0030] A resin coating device 1 and a resin coating method according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 It is a cross-sectional view showing one state of the resin coating device 1 according to the embodiment. Figure 2 It is a cross-sectional view showing another state of the resin coating device 1 according to the embodiment. Figure 3 It is shown Figure 1 and Figure 2 A top view of the main parts of the holding table 11 and the transfer arm 70. Figure 1 and Figure 2 In the figure, a lift pin 18 and a pin driving portion 19 to be described later are omitted.

[0031] Figure 1 and Figure 2 The resin coating device 1 shown in the figure is a solid resin 200 (see Figure 5) in the case of the workpiece 100 (refer to Figure 5 etc.) on one side 101 (see Figure 5 etc.) on the coating resin 202 (refer to Figure 8 Here, as described later, the resin 202 is formed by liquefying the solid resin 200 to form the liquefied resin 201 (see Figure 5 ) after which the liquefied resin 201 is deformed and solidified again to form a coating layer. In addition, the method of coating the resin 202 using the resin coating device 1 of the embodiment is not limited to coating the resin 202 on the front side 101 of the workpiece 100, and the resin 202 may also be coated on the back side 102 of the workpiece 100.

[0032] In the present embodiment, the workpiece 100 that is the coating object of the resin 202 in the resin coating device 1 and the resin coating method of the embodiment is a disc-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, gallium arsenide, etc. as a substrate. The workpiece 100 is formed with unillustrated devices in each area of ​​the front 101 divided by a plurality of intersecting (vertical in the embodiment) predetermined dividing lines that are not shown. The back 102 of the workpiece 100 on the opposite side of the front 101 is formed flat. By processing using a cutting tool or a laser beam that is not shown, the workpiece 100 is divided along each predetermined dividing line, thereby being divided into individual devices. In addition, in the present embodiment, the front of the device of the workpiece 100 can be flat, or it can be equipped with electrode bumps and the like and have bumps and depressions.

[0033] like Figure 1 and Figure 2 As shown, the resin coating device 1 according to the embodiment of the present invention includes a storage unit 10, a cover 20, a cover driving unit 30, a resin supply unit 40, a vacuum pump 50, an atmosphere opening unit 60, a transfer arm 70, and a control unit 80 for controlling each unit.

[0034] like Figure 1 and Figure 2 As shown, the storage section 10 includes a housing 2-1 and a frame 3. The housing 2-1 is disposed on the upper side of the frame 3 in the vertical direction. The frame 3 is formed by assembling frame materials into a series of cuboids, and supports and fixes the lower surface side of the housing 2-1 on the upper side in the vertical direction. The housing 2-1 has a space 4-1 formed inside, and has an opening 4-3 that opens the space 4-1 toward the upper side in the vertical direction.

[0035] like Figure 1 and Figure 2As shown, the storage section 10 includes: a holding table 11, which sucks and holds the workpiece 100; and a holding table driving unit 13, which drives the holding table 11 in the up-down direction. The holding table 11 is arranged in the space 4-1 inside the housing 2-1. Specifically, the up-down direction in which the holding table driving unit 13 drives the holding table 11 is a height direction perpendicular to the holding surface 12 of the holding table 11 holding the workpiece 100.

[0036] like Figure 3 As shown, the holding table 11 includes: a holding surface 12, which holds the workpiece 100; a suction groove 17, which is formed on the holding surface 12; and a connecting path 16-2, which connects the above-mentioned suction groove 17 with the suction source 16-1. The holding table 11 introduces negative pressure from the suction source 16-1 to the holding surface 12 via the connecting path 16-2 and the suction groove 17, thereby using the holding surface 12 to suck and hold the workpiece 100. In this embodiment, the holding table 11 is formed on the holding surface 12 with suction grooves 17-1 and 17-2 that are concentric with the outer periphery of the holding surface 12 and a suction groove 17-3 that radially connects the suction grooves 17-1 and 17-2, but the present invention is not limited to this, as long as it is a method that can use the entire holding surface 12 to suck and hold the workpiece 100, it can be any method.

[0037] like Figure 1 and Figure 2 As shown, the holding table 11 further includes a heating member 14 such as a resistance heater inside, and the heating member 14 heats the holding table 11 to melt the solid resin 200 supplied to the workpiece 100 held by the holding surface 12 .

[0038] like Figure 3 As shown, the holding table 11 is further provided with three or more lift pins 18 and a pin driving unit 19 for moving the lift pins 18 up and down on the holding surface 12. Specifically, the pin driving unit 19 drives the lift pins 18 in a vertical direction perpendicular to the holding surface 12. Figure 3 In the embodiment shown, the lift pins 18 are arranged at equal intervals, for example, with a phase angle of 120°, avoiding the suction groove 17-3 in the area between the suction groove 17-1 and the suction groove 17-2 of the retaining surface 12, but the present invention is not limited to this and may be arranged at more than four positions and may be arranged at uneven intervals.

[0039] When the holding table 11 uses the holding surface 12 to hold the workpiece 100 by suction, the pin driving unit 19 drives the upper end of the lift pin 18 to a height below the holding surface 12, and when the workpiece 100 is moved out relative to the holding table 11, the pin driving unit 19 drives the upper end of the lift pin 18 to be higher than the holding surface 12. When the holding table 11 uses the holding surface 12 to hold the workpiece 100 by suction, as long as the upper end of the lift pin 18 is at a height below the holding surface 12, it can also be driven to different heights. On the other hand, when the workpiece 100 is moved out relative to the holding table 11, it is preferred that the lift pins 18 be driven to the same height as each other so that the workpiece 100 can be lifted parallel to the holding surface 12.

[0040] like Figure 1 and Figure 2 As shown, the cover 20 has a housing 2-2. The housing 2-2 has a space 4-2 formed therein and has an opening 4-4 ​​for opening the space 4-2. The cover 20 is moved by the cover driving unit 30 to cover the opening 4-3 of the space 4-1 of the storage unit 10. Figure 1 The closed position 20-1 shown in the figure is the same as the position in which the opening 4-3 of the space 4-1 of the storage portion 10 is opened. Figure 2 When the cover 20 is in the closed position 20-1, the opening 4-4 ​​of the space 4-2 communicates with the opening 4-3 of the space 4-1 of the storage section 10, and the space 4-2 and the space 4-1 of the storage section 10 together form a closed processing space 4. When the cover 20 is in the open position 20-2, the space 4-2 is separated from the space 4-1 of the storage section 10.

[0041] When the cover 20 is in the closed position 20-1, the surface of the storage portion 10 on the opening 4-3 side and the surface of the cover 20 on the opening 4-4 ​​side are opposed to each other. Preferably, when the cover 20 is in the closed position 20-1, a sealing member (not shown) is provided on either of the surface of the opening 4-3 side of the storage portion 10 and the surface of the opening 4-4 ​​side of the cover 20, which are opposed to each other, and the sealing member improves the airtightness of the processing space 4 by sealing the two surfaces more tightly. As the sealing member, an O-ring or the like which improves the sealing performance by being flattened is exemplified as a preferred sealing member.

[0042] like Figure 1 and Figure 2As shown, the cover 20 includes an upper workbench 21. The upper workbench 21 is arranged in the space 4-2 inside the housing 2-2. When the cover 20 is located at the closed position 20-1, the upper workbench 21 is opposite to the holding workbench 11 of the storage section 10. The upper workbench 21 has a flat pressing surface 22, and when the cover 20 is located at the closed position 20-1, the pressing surface 22 is opposite to the holding surface 12 of the holding workbench 11. When the cover 20 is located at the closed position 20-1, the upper workbench 21 is relatively close to the holding workbench 11 on the pressing surface 22 side. In the present embodiment, specifically, by pressing the holding workbench 11 toward the pressing surface 22 side, the pressing surface 22 is used to spread the liquefied resin 201 after the solid resin 200 provided to the workpiece 100 held by the holding workbench 11 is liquefied, thereby covering the workpiece 100. The upper stage 21 has a heating member 24 such as a resistance heater inside, and the heating member 24 heats the upper stage 21 to melt the solid resin 200 pressed against the pressing surface 22 .

[0043] The upper workbench 21 preferably has a release material applied to the pressing surface 22 for pressing the liquefied resin 201. In this case, the adhesion between the pressing surface 22 of the upper workbench 21 and the liquefied resin 201 can be further suppressed. As the release material applied to the pressing surface 22, fluororesin is exemplified as a preferred material. In addition, a flat resin sheet that functions as a release sheet may be pre-arranged on the pressing surface 22, and it may be peeled off from the resin 202 after the unloading step ST20 described later. In addition, the resin sheet arranged on the pressing surface 22 is preferably coated with a release material on the front side.

[0044] In addition, the resin coating device 1 of the embodiment also has a heating component 14 in the holding workbench 11 and a heating component 24 in the upper workbench 21, but the present invention is not limited to this method. As long as there is a heating component 14, 24 in at least one of the holding workbench 11 or the upper workbench 21, the heating component 14, 24 on that side serves to melt the solid resin 200.

[0045] The cover driving unit 30 connects the storage unit 10 and the cover 20, and drives the cover 20 to be opened and closed relative to the storage unit 10. Figure 1 and Figure 2 As shown, the cover driving unit 30 includes a track restricting unit 31 and a driving control unit 32. The track restricting unit 31 restricts the track of the cover 20 that moves relative to the storage unit 10. The driving control unit 32 applies a driving force to the track restricting unit 31, thereby causing the cover 20 to move relative to the storage unit 10.

[0046] like Figure 1 and Figure 2As shown, the track limiting portion 31 has a fixed arm 33, a movable arm 34 and a fulcrum portion 35. The fixed arm 33 is fixedly arranged on the side of the storage portion 10. Specifically, the fixed arm 33 is fixed to a protrusion 5 that protrudes horizontally from the frame 3 of the storage portion 10 to form a two-pronged shape, and is erected from the protrusion 5 toward the upper side in the vertical direction. The movable arm 34 is fixedly arranged on the side of the cover portion 20. Specifically, the movable arm 34 is erected from the side surface of the housing 2-2 of the cover portion 20 toward the outer side perpendicular to the side surface. The fulcrum portion 35 is connected to the fixed arm 33 in a relatively rotatable manner with respect to the pin as the center in a plane perpendicular to the pin by a pin arranged along the horizontal direction. Thus, the track limiting portion 31 limits the track of the cover portion 20 by the track of the movable arm 34 centered on the pin of the fulcrum portion 35.

[0047] When the cover 20 is in the closed position 20-1, the movable arm 34 is substantially parallel to the horizontal direction, and the angle formed at the fulcrum 35 between the movable arm 34 and the fixed arm 33 is substantially 90°. In addition, when the cover 20 is in the open position 20-2, the movable arm 34 is close to the vertical direction, and the angle formed at the fulcrum 35 between the movable arm 34 and the fixed arm 33 is a predetermined obtuse angle smaller than 180°.

[0048] In the resin coating device 1 of the embodiment, since the track restriction portion 31 restricts the track of the cover portion 20 in this manner, the cover portion 20 can be moved from the open position 20 - 2 to the desired closed position 20 - 1 with higher accuracy.

[0049] like Figure 1 and Figure 2 As shown, the drive control unit 32 has a cylinder 38 that extends and contracts along one axial direction to apply a driving force. One end of the cylinder 38 is connected to the storage unit 10 side through the fixed side fulcrum 36 in a relatively rotatable manner. Specifically, one end of the cylinder 38 is connected to the protrusion 6 through the fixed side fulcrum 36 in a rotatable manner, wherein the protrusion 6 protrudes from the frame 3 of the storage unit 10 in the same horizontal direction as the protrusion 5 and is formed in the central area between the two forks of the protrusion 5. The fixed side fulcrum 36 is connected to the protrusion 6 in a relatively rotatable manner with the pin as the center in a plane perpendicular to the pin by a pin provided in the horizontal direction. As a result, one end of the cylinder 38 is substantially connected to the fixed arm 33 through the fixed side fulcrum 36 in a rotatable manner.

[0050] The other end of the cylinder 38 is connected to the movable arm 34 in a relatively rotatable manner via the movable side fulcrum portion 37. The movable side fulcrum portion 37 is connected to the movable arm 34 in a relatively rotatable manner with respect to the pin in a plane perpendicular to the pin and centered on the pin via a pin provided in the horizontal direction.

[0051] The pin of the fulcrum portion 35, the pin of the fixed-side fulcrum portion 36, and the pin of the movable-side fulcrum portion 37 are arranged parallel to each other. Thus, the surface of the relative rotational movement of the movable arm 34 with respect to the fixed arm 33, the surface of the relative rotational movement of the cylinder 38 with respect to the protruding portion 6 and the fixed arm 33, and the surface of the relative rotational movement of the cylinder 38 with respect to the movable arm 34 are parallel to each other. Thus, the relative rotational movement of the movable arm 34 with respect to the fixed arm 33 accompanying the extension and tilt of the cylinder 38 described later can be smooth. In addition, in the present embodiment, the fixed-side fulcrum portion 36 and the movable-side fulcrum portion 37 use fork fittings as preferred fulcrum portions.

[0052] The drive control unit 32 changes the angle formed between the fixed arm 33 and the movable arm 34 in the fulcrum 35 of the rail restricting unit 31 by extending and retracting the cylinder 38, thereby changing the inclination angle of the cylinder 38 relative to the protruding portion 6 and changing the distance between the fixed-side fulcrum 36 and the movable-side fulcrum 37, thereby changing the angle formed between the fixed arm 33 and the movable arm 34 in the fulcrum 35 of the rail restricting unit 31, and moving the cover 20 relative to the storage unit 10. When the cylinder 38 is extended and retracted to open and close the cover 20, the cylinder 38 is rotatably connected to the fixed-side fulcrum 36 and the movable-side fulcrum 37, so that even if the distance between the fixed-side fulcrum 36 and the movable-side fulcrum 37 changes, the inclination also changes. Therefore, the cover drive unit 30 can open and close the cover 20 only by using the extended and retracted cylinder 38.

[0053] Specifically, the drive control unit 32 contracts the cylinder 38 to make the distance between the fixed-side fulcrum 36 and the movable-side fulcrum 37 close, thereby reducing the angle between the fixed arm 33 and the movable arm 34 in the fulcrum 35, and moves the cover 20 toward the closed position 20-1, and positions the cover 20 at the closed position 20-1 by making the angle substantially 90 degrees. In addition, the drive control unit 32 extends the cylinder 38 to make the distance between the fixed-side fulcrum 36 and the movable-side fulcrum 37 farther, thereby increasing the angle between the fixed arm 33 and the movable arm 34 in the fulcrum 35, and moves the cover 20 toward the open position 20-2, and positions the cover 20 at the open position 20-2 by making the angle a predetermined obtuse angle smaller than 180 degrees.

[0054] In the resin coating device 1 of the embodiment, the drive control unit 32 moves the cover 20 within the range limited by the track limiting unit 31 by extending and retracting the cylinder 38, thereby preventing the surface of the opening 4-4 ​​of the cover 20 from exceeding 90° relative to the surface of the opening 4-3 of the storage unit 10. As a result, the cover 20 can be moved toward the open position 20-2 in a safe and space-saving manner.

[0055] like Figure 1 and Figure 2As shown, the resin supply unit 40 is disposed outside the storage unit 10 and the cover unit 20 and close to the opening 4-3 of the space 4-1 of the storage unit 10, and includes a resin box 41 and a supply nozzle 42. The resin box 41 stores solid resin 200. The resin supply unit 40 supplies the solid resin 200 stored in the resin box 41 from the supply port 43 of the supply nozzle 42 to the workpiece 100 held by the holding table 11. The supply nozzle 42 is controlled by the control unit 80 to be able to Figure 2 The provided position 42-1 is shown with Figure 1 The supply position 42-1 is a position where the supply port 43 faces the holding surface 12 of the holding workbench 11 and can supply solid resin 200 to the workpiece 100 held by the holding workbench 11, and the retreat position 42-2 is a position where the supply nozzle 42 including the supply port 43 retreats as a whole from above the holding surface 12 of the holding workbench 11 and can move the cover 20 toward the closed position 20-1.

[0056] The solid resin 200 provided by the resin supply unit 40 may be in any shape as long as it can be provided by the supply nozzle 42, such as powder, granular, flat, block, plate, sheet, ring, surface (fibrous), vortex, etc. Among them, the solid resin 200 provided by the resin supply unit 40 is preferably in granular form in terms of ease of handling, ease of transportation and storage, ease of adjustment of the supply amount, etc.

[0057] In the present embodiment, the solid resin 200 provided by the resin supply unit 40 is preferably a thermoplastic resin. In addition, in the present embodiment, the solid resin 200 provided by the resin supply unit 40 is a rigid body without fluidity in a solidified state at a temperature lower than the softening point, and substantially has no adhesiveness like an adhesive, thereby suppressing adhesion to the front surface 101 of the workpiece 100, etc. In addition, although the solid resin 200 provided by the resin supply unit 40 has fluidity in a softened state at a temperature higher than the softening point, substantially there is almost no adhesiveness like an adhesive, thereby reducing adhesion to the front surface 101 of the workpiece 100, etc.

[0058] Specifically, the solid resin 200 provided by the resin providing unit 40 can be selected from acrylic resin, methacrylic resin, vinyl resin, polyacetal, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, polyethylene, polypropylene, poly (4-methyl-1-pentene), poly (1-butene) and other polyolefins, polyethylene terephthalate, polybutylene terephthalate and other polyesters, nylon-6, nylon-66, polyxylene adipamide and other polyamides, polyacrylates, polymethacrylates, polyvinyl chloride, One or more selected from polyetherimide, polyacrylonitrile, polycarbonate, polystyrene, polysulfone, polyethersulfone, polyphenylene, ether polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, thermoplastic polyurethane resin, phenoxy resin, polyamide-imide resin, fluororesin, ethylene-unsaturated carboxylic acid copolymer resin, ethylene-vinyl acetate copolymer resin, ionomer, ethylene-vinyl acetate-maleic anhydride terpolymer resin, ethylene-vinyl acetate copolymer saponified resin and ethylene-vinyl alcohol copolymer resin.

[0059] The unsaturated carboxylic acid constituting the above-mentioned ethylene-unsaturated carboxylic acid copolymer used in the solid resin 200 provided by the resin providing unit 40 can be exemplified by acrylic acid, methacrylic acid, maleic acid, itaconic acid, monomethyl maleate, monoethyl maleate, maleic anhydride, and itaconic anhydride. Here, the ethylene-unsaturated carboxylic acid copolymer includes not only a binary copolymer of ethylene and an unsaturated carboxylic acid, but also a multi-component copolymer copolymerized with other monomers. As the above-mentioned other monomers that can be copolymerized with the ethylene-unsaturated carboxylic acid copolymer, vinyl esters such as vinyl acetate and vinyl propionate, methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, methyl methacrylate, isobutyl methacrylate, dimethyl maleate, unsaturated carboxylic acid esters such as diethyl maleate, etc. are exemplified.

[0060] In the present embodiment, the softening point of the solid resin 200 provided by the resin supply unit 40 is a temperature in the range of 0°C to 300°C. The solid resin 200 provided by the resin supply unit 40 uses the compound group exemplified above, and therefore has a softening point in the range of 0°C to 300°C. The solid resin 200 provided by the resin supply unit 40 can adjust the softening point by mixing the different types of compounds exemplified above. For example, by adjusting the softening point to a temperature higher than the temperature of the workpiece 100 during dry grinding, that is, about 40°C to 100°C, it is possible to prevent the workpiece 100 from being softened during dry grinding.

[0061] The solid resin 200 provided by the resin supply unit 40 uses, for example, a material whose melt mass flow rate (MFR) is 0.01 g / 10 min or more and 500 g / 10 min or less, preferably 0.1 g / 10 min or more and 100 g / 10 min or less, and more preferably 0.3 g / 10 min or more and 50 g / 10 min or less, at a temperature of 190° C. and a load of 21.18 N under the test method JIS K7210-1 or 7210-2. That is, the solid resin 200 provided by the resin supply unit 40 is exemplified as a hard material that has low fluidity even when softened at a high temperature of 190° C. or more, and has virtually no adhesiveness like an adhesive.

[0062] The solid resin 200 provided by the resin supply unit 40 may be mixed with a filler having a smaller thermal expansion coefficient than the solid resin 200. The filler mixed in the solid resin 200 provided by the resin supply unit 40 is preferably an inorganic filler or an organic filler having a smaller thermal expansion coefficient than the solid resin 200. The solid resin 200 provided by the resin supply unit 40 is mixed with such a filler, so that thermal expansion and thermal contraction generated when the resin 202 is formed can be reduced and prevented as described later, and accordingly, the workpiece 100 can be prevented from being flexed or deformed.

[0063] The filler mixed in the solid resin 200 provided by the resin supply unit 40 is preferably an inorganic filler, and specifically, fused silica, crystalline silica, alumina, calcium carbonate, calcium silicate, barium sulfate, talc, clay, magnesium oxide, aluminum oxide, beryllium oxide, iron oxide, titanium oxide, aluminum nitride, silicon nitride, boron nitride, rock-forming minerals, glass, quartz, mica, etc. are preferably used. In addition, the filler mixed in the solid resin 200 provided by the resin supply unit 40 may also be a mixture of two or more of the above-mentioned fillers. The filler mixed in the solid resin 200 provided by the resin supply unit 40 is preferably a silica such as fused silica or crystalline silica among the above-mentioned inorganic fillers. In this case, the cost of the filler can be appropriately suppressed.

[0064] like Figure 1 and Figure 2 As shown, the vacuum pump 50 is disposed outside the housing 2-1 of the storage section 10 and communicates with the space 4-1 of the storage section 10. When the cover 20 is in the closed position 20-1 to form a sealed processing space 4, the vacuum pump 50 evacuates the sealed processing space 4 from the side of the space 4-1 to make the sealed processing space 4 a vacuum. Here, vacuum refers to a so-called reduced pressure state, for example, the internal pressure of the vacuum chamber is 10 5 Pa~10 2The vacuum pump 50 is preferably a pump that can achieve such a low vacuum, such as a dry pump or an oil rotary pump.

[0065] In the resin coating apparatus 1 of the embodiment, the vacuum pump 50 makes the sealed processing space 4 evacuated, thereby reducing and preventing the entry (intrusion and retention) of air into the resin 202 and between the workpiece 100 and the resin 202 .

[0066] like Figure 1 and Figure 2 As shown, the atmosphere opening portion 60 is installed on the outside of the housing 2-2 of the cover 20, and has an atmosphere opening path 61 and an atmosphere opening valve 62. One end of the atmosphere opening path 61 is connected to the space 4-2 of the cover 20, and the other end is open to the atmosphere. The atmosphere opening valve 62 is provided in the middle of the atmosphere opening path 61, and can be switched between an open state in which the atmosphere opening path 61 is connected and a closed state in which the connection of the atmosphere opening path 61 is interrupted. The atmosphere opening valve 62 is in an open state to make the space 4-2 of the cover 20 connected to the atmosphere through the atmosphere opening path 61, and is in a closed state to make the space 4-2 of the cover 20 closed to the atmosphere in the atmosphere opening path 61.

[0067] When the cover 20 is located in the closed position 20-1 to form a closed processing space 4 and make the processing space 4 a vacuum, the atmospheric opening valve 62 supplies atmosphere to the processing space 4 by becoming open, and the resin 202 covering the workpiece 100 on the holding surface 12 of the holding workbench 11 in the processing space 4 is cooled by the provided atmosphere.

[0068] like Figure 3 As shown, the transport arm 70 includes a suction pad 71 and a pad driving unit 72. The suction pad 71 suctions and holds the workpiece 100. The pad driving unit 72 drives the suction pad 71 to switch between a suction state in which the workpiece 100 is suctioned and a suction release state in which the workpiece 100 is released.

[0069] like Figure 1 , Figure 2 as well as Figure 3 As shown in FIG. 1 , a driving mechanism 75 for moving the conveying arm 70 is provided on the conveying arm 70. The conveying arm 70 is moved by the driving mechanism 75 while the workpiece 100 is adsorbed by the adsorption pad 71, thereby conveying the workpiece 100. Specifically, the conveying arm 70 can carry the workpiece 100 before being coated with the resin 202 into the holding table 11 or carry the workpiece 100 coated with the resin 202 out of the holding table 11.

[0070] The transfer arm 70 is inserted into the gap 300 (see FIG. 1 ) between the lower surface (back surface 102) of the workpiece 100 formed by the lift pin 18 and the holding surface 12 of the holding table 11. Fig.11 ) is formed to be thinner in the thickness direction than the height of the lift pin 18 that is lifted from the holding surface 12 from the holding surface 12, and thinner in the thickness direction than the gap 300. Figure 3 In the embodiment shown, the conveying arm 70 has a fork-like shape with the front end separated into two parts, but the present invention is not limited to this, and any shape may be used as long as it can be inserted into the gap 300 formed by the lift pin 18 without colliding with the lift pin 18.

[0071] In addition, Figure 3 In the embodiment shown, the conveying arm 70 is provided with adsorption pads 71 ​​at two locations symmetrical to each other with respect to the direction in which the conveying arm 70 extends, on the front end side of each of the two separated parts. However, the present invention is not limited to this. As long as the workpiece 100 lifted upward by the lifting pin 18 can be adsorbed and held, the adsorption pad 71 can be provided at only one location, at more than three locations, or at an asymmetric location.

[0072] The control unit 80 controls each component of the resin coating device 1 to cause the resin coating device 1 to perform each operation related to the process of coating the workpiece 100 with the resin 202 .

[0073] In this embodiment, the control unit 80 includes a computer system. The control unit 80 includes: an operation processing device having a microprocessor such as a CPU (central processing unit); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input / output interface device. The operation processing device performs operation processing according to a computer program stored in the storage device, and outputs a control signal for controlling the resin coating device 1 to each component of the resin coating device 1 via the input / output interface device.

[0074] Next, a resin coating method according to the embodiment will be described as an example of the operation of the resin coating device 1 according to the embodiment. Figure 4 1 is a flowchart showing a resin coating method according to an embodiment.

[0075] The resin coating method of the embodiment is a method of coating a workpiece 100 with a resin 202 using the resin coating device 1 of the embodiment, such as Figure 4As shown, there are a heating step ST11, a holding step ST12, a resin providing step ST13, a resin liquefaction step ST14, a sealing step ST15, a vacuum step ST16, a resin coating step ST17, a resin cooling step ST18, a workbench lowering step ST19 and a carrying-out step ST20.

[0076] Figure 5 It is shown Figure 4 The resin coating method of the embodiment starts with the lid 20 being positioned at the open position 20-2 and the space 4-1 of the storage portion 10 and the space 4-2 of the lid 20 being open to the atmosphere.

[0077] like Figure 5 As shown, the heating step ST11 is a step in which the heating member 14 heats the holding table 11. In the heating step ST11, in the present embodiment, since the holding table 11 has the heating member 14, the heating member 14 is operated by the control unit 80, and the heating member 14 heats the holding table 11. In addition, in the second modified example below, a case is described in which the holding table 11 does not have the heating member 14, and the heating step ST11 needs to be implemented using the heating member 24 provided on the upper table 21.

[0078] like Figure 5 As shown, the holding step ST12 is a step of holding the workpiece 100 on the holding table 11. In the holding step ST12, specifically, first, the control unit 80 operates the driving mechanism 75, and the conveying arm 70 is driven by the driving mechanism 75 to convey the workpiece 100 from the opening 4-3 and provide it to the space 4-1 of the storage section 10, and place it on the holding surface 12 of the holding table 11. In the holding step ST12, the control unit 80 then operates the suction source 16-1, and the suction source 16-1 introduces negative pressure to the holding surface 12 via the communication path 16-2 and the suction groove 17, thereby using the holding surface 12 of the holding table 11 to suck and hold the placed workpiece 100.

[0079] In addition, in the resin coating method of the embodiment, in order to coat the front side 101 of the workpiece 100 with the resin 202, in the holding step ST12, the workpiece 100 is held in a manner such that the front side 101 is facing the opening 4-3 side and the back side 102 is facing the holding surface 12, but the present invention is not limited to this. In the case where the back side 102 of the workpiece 100 is coated with the resin 202, in the holding step ST12, the workpiece 100 is held in a manner such that the back side 102 is facing the opening 4-3 side and the front side 101 is facing the holding surface 12.

[0080] The resin providing step ST13 is performed at least after the maintaining step ST12. Figure 5 As shown, the resin supply step ST13 is a step in which the resin supply unit 40 supplies the solid resin 200 to the upper surface of the workpiece 100 held on the holding table 11 in the holding step ST12. In the resin supply step ST13, specifically, first, the control unit 80 positions the supply nozzle 42 of the resin supply unit 40 at the supply position 42-1. In the resin supply step ST13, next, the resin supply unit 40 supplies the solid resin 200 stored in the resin box 41 from the supply port 43 of the supply nozzle 42 to the upper surface of the workpiece 100 held by the holding table 11, that is, the front surface 101 side.

[0081] In the resin supplying step ST13, in this embodiment, the resin supplying unit 40 supplies one or more solid resins 200. In the resin supplying step ST13, it is preferred that the resin supplying unit 40 widely distributes and supplies the solid resins 200 on the front surface 101 of the workpiece 100. Figure 5 In the illustrated embodiment, the resin supply unit 40 supplies seven solid resins 200 , but the present invention is not limited thereto, and may supply one to six solid resins 200 , or may supply eight or more solid resins 200 .

[0082] In the case where the front surface 101 side of the workpiece 100 has irregularities, the solid resin 200 provided in the resin providing step ST13 is placed so as to straddle one or more irregularities. In addition, in the case where the front surface 101 side of the workpiece 100 has irregularities, the solid resin 200 provided in the resin providing step ST13 has a volume that can cover the irregularities on the entire front surface 101 of the workpiece 100. That is, the solid resin 200 provided in the resin providing step ST13 can form a layer that covers the front surface 101 without interruption through the resin coating step ST17 described later, and has a volume that can form a layer thicker than the irregularities on the front surface 101.

[0083] In addition, in the present embodiment, each process is performed in the order of heating step ST11, holding step ST12, and resin providing step ST13, but the present invention is not limited to this. It is sufficient as long as the resin providing step ST13 is performed at least after the holding step ST12. For example, the heating step ST11, holding step ST12, and resin providing step ST13 may also be performed in parallel.

[0084] Figure 6 It is shown Figure 4The resin liquefaction step ST14 is performed after the heating step ST11, the holding step ST12, and the resin supplying step ST13. Figure 6 As shown in FIG. 1 , the resin liquefaction step ST14 is a step of liquefying the solid resin 200 by using the heated holding table 11. Specifically, in the resin liquefaction step ST14, the holding table 11 heated in the heating step ST11 heats the solid resin 200 provided in the resin providing step ST13 via the workpiece 100 held in the holding step ST12 to melt the solid resin 200, thereby forming a liquefied resin (liquid resin) 201. That is, the resin coating device 1 of the embodiment performs the process of the resin liquefaction step ST14, as shown in FIG. Figure 6 As shown, the liquefied resin 201 is formed on the upper surface of the workpiece 100, that is, on the front surface 101 side.

[0085] Figure 7 It is shown Figure 4 The sealing step ST15 is performed at least after the holding step ST12 and the resin supplying step ST13. Figure 7 As shown, the sealing step ST15 is a step of closing the cover 20 to cover the opening 4-3 of the storage section 10, thereby forming a sealed processing space 4 by the storage section 10 and the cover 20. In the sealing step ST15, specifically, the control unit 80 operates the cover driving unit 30, and the cover driving unit 30 moves the cover 20 from the open position 20-2 to the closed position 20-1, so that the surface of the opening 4-4 ​​side of the cover 20 is consistent with the surface of the opening 4-3 side of the storage section 10, and the opening 4-4 ​​of the cover 20 is connected to the opening 4-3 of the storage section 10, so that the sealed processing space 4 composed of the space 4-2 and the space 4-1 is formed.

[0086] The vacuum step ST16 is performed at least after the sealing step ST15. Figure 7 As shown, the vacuum step ST16 is a step of evacuating the processing space 4 formed in the sealing step ST15 by using the vacuum pump 50. In the vacuum step ST16, specifically, the control unit 80 operates the vacuum pump 50, and the vacuum pump 50 evacuates the sealed processing space 4.

[0087] In addition, in the vacuum step ST16, the processing space 4 is switched from the atmospheric pressure to the vacuum state. Therefore, after the processing of the vacuum step ST16, the differential pressure between the negative pressure brought by the suction source 16-1 to the holding surface 12 and the vacuum in the processing space 4 becomes smaller, so the holding table 11 is switched to a state where the workpiece 100 is sucked and held by the holding surface 12 with a weaker suction force.

[0088] Figure 8 It is shown Figure 4 A cross-sectional view of an example of the resin coating step ST17. Figure 8 As shown, the resin coating step ST17 is a step of raising the holding table 11 after the vacuum step ST16 is performed, so that the liquefied resin 201 spreads between the holding table 11 and the upper table 21 and coats the workpiece 100 .

[0089] In the resin coating step ST17, specifically, first, since the holding table 11 is equipped with a holding table driving unit 13, the holding table driving unit 13 is operated by the control unit 80, and the holding table driving unit 13 moves the holding table 11 toward the direction close to the upper table 21. Figure 8 Thus, in the resin coating step ST17, by bringing the holding surface 12 of the holding table 11 and the pressing surface 22 of the upper table 21 facing each other closer, the liquefied resin 201 formed on the front surface 101 side of the workpiece 100 on the holding surface 12 is brought closer to the pressing surface 22 of the upper table 21.

[0090] In the resin coating step ST17, if the holding table driving unit 13 further continues the approaching action of bringing the holding table 11 close to the upper table 21, the pressing surface 22 of the upper table 21 contacts the liquefied resin 201 on the front surface 101 of the workpiece 100 held on the holding surface 12. In the resin coating step ST17, since the upper table 21 has a heating member 24, the heating member 24 is operated by the control unit 80, and the heating member 24 further heats the liquefied resin 201 contacted by the pressing surface 22.

[0091] In the resin coating step ST17, the liquefied resin 201 on the front surface 101 of the workpiece 100 is then pressed by the pressing surface 22 of the upper table 21 as a flat surface, so that the liquefied resin 201 is deformed and expanded along the pressing surface 22 and the front surface 101 of the workpiece 100. Figure 8 As shown, between the pressing surface 22 and the front surface 101 of the workpiece 100, a resin 202 covering the front surface 101 of the workpiece 100 is formed by the liquefied resin 201. In the resin coating step ST17, the surface of the resin 202 on the side pressed by the pressing surface 22 is formed flat along the pressing surface 22, becoming the exposed surface of the resin 202.

[0092] Here, since the resin coating step ST17 is performed after the vacuum step ST16 is performed, the resin coating step ST17 is performed in the vacuumed processing space 4. Therefore, in the resin coating step ST17, the air can be reduced and prevented from entering the inside of the liquefied resin 201 and between the workpiece 100 and the liquefied resin 201, thereby reducing and preventing the air from entering the inside of the resin 202 and between the workpiece 100 and the resin 202.

[0093] Fig. 9 It is shown Figure 4 A cross-sectional view of an example of the resin cooling step ST18. Fig. 9 As shown, the resin cooling step ST18 is a step of stopping the heating of the holding stage 11 while the holding stage 11 is raised after the resin coating step ST17 is performed and introducing air from the air release valve 62 to cool and solidify the resin 202 .

[0094] In the resin cooling step ST18, first, the control unit 80 stops the operation of the heating member 14 of the holding table 11 and the heating member 24 of the upper table 21, thereby stopping the heating of the resin 202 by the heating members 14 and 24. In addition, in the resin cooling step ST18, the control unit 80 stops the operation of the vacuum pump 50, thereby stopping the vacuum pump 50 from evacuating the closed processing space 4. In the resin cooling step ST18, next, the control unit 80 switches the atmosphere opening valve 62 of the atmosphere opening portion 60 from a closed state to an open state, thereby supplying the atmosphere to the processing space 4. In the resin cooling step ST18, the atmosphere supplied from the atmosphere opening portion 60 to the processing space 4 is used to air-cool the resin 202 covering the workpiece 100 on the holding surface 12 of the holding table 11.

[0095] Specifically, the resin cooling step ST18 is performed in a state where the holding surfaces 12 of the holding table 11 and the pressing surface 22 of the upper table 21, which are formed in the resin coating step ST17 and are facing each other, are close to each other. Therefore, after the resin cooling step ST18, the resin 202 is cured while maintaining a layered shape along the pressing surface 22 and the front surface 101 of the workpiece 100, which are close to each other.

[0096] In addition, in the resin cooling step ST18, the vacuum state is switched to the atmospheric pressure in the processing space 4. Therefore, after the resin cooling step ST18, the pressure difference between the negative pressure brought by the suction source 16-1 to the holding surface 12 and the atmospheric pressure in the processing space 4 becomes larger, so the holding table 11 is switched to a state in which the holding surface 12 is used to suck and hold the workpiece 100 with a strong suction force.

[0097] In addition, in the resin cooling step ST18, while maintaining the workbench 11 or the upper workbench 21 with a cooling mechanism utilizing water flow or a cooling mechanism utilizing a cooling plate with high thermal conductivity and heat capacity, these cooling mechanisms can also be used to accelerate the cooling of the resin 202 while introducing atmospheric air into the processing space 4.

[0098] Fig.10 It is shown Figure 4 A cross-sectional view of an example of the step ST19 of keeping the worktable lowered. Fig.10 As shown, the holding table lowering step ST19 is a step of sucking and holding the workpiece 100 by the holding table 11 and lowering the holding table 11 after the resin cooling step ST18 is performed.

[0099] In the holding table lowering step ST19, specifically, after the resin cooling step ST18, the holding table 11 is switched to a state where the holding surface 12 is used to attract and hold the workpiece 100 with a strong attraction force. Therefore, while maintaining this state, the control unit 80 operates the holding table driving unit 13, and the holding table driving unit 13 moves the holding table 11 in a direction away from the upper table 21, that is, Fig.10 Thus, after the processing of the step ST19 of keeping the workbench down, as shown in FIG. Fig.10 As shown, due to the suction holding action on the holding surface 12 of the holding table 11 , the workpiece 100 coated with the resin 202 is in a state of being retained on the holding surface 12 and separated from the pressing surface 22 of the upper table 21 .

[0100] Fig.11 It is shown Figure 4 A cross-sectional view of an example of the unloading step ST20. Fig.11 As shown, the unloading step ST20 is a step of opening the cover 20 and unloading the workpiece 100 coated with the resin 202 from the holding table 11 after the holding table lowering step ST19 is performed.

[0101] In the unloading step ST20, specifically, first, Fig.11As shown, the cover driving unit 30 is operated by the control unit 80, and the cover driving unit 30 moves the cover 20 from the closed position 20-1 to the open position 20-2, thereby separating the processing space 4 into the space 4-2 and the space 4-1. Here, the unloading step ST20 is performed in a state after the processing of the holding table lowering step ST19, that is, in a state where the workpiece 100 coated with the resin 202 is separated from the pressing surface 22 of the upper table 21. Therefore, in the unloading step ST20, the cover driving unit 30 only moves the cover 20 including the upper table 21 and the atmosphere opening part 60 from the closed position 20-1 to the open position 20-2, so that the workpiece 100 coated with the resin 202 can be left on the holding surface 12 of the holding table 11.

[0102] In the unloading step ST20 , the lift pins 18 and the pin driving unit 19 of the holding table 11 are used to make the workpiece 100 coated with the resin 202 ready for unloading by the transport arm 70 , and the workpiece 100 is unloaded by the transport arm 70 .

[0103] In the unloading step ST20, specifically, the control unit 80 operates the pin driving unit 19, and the pin driving unit 19 moves the lift pins 18 to a position where the upper end is higher than the holding surface 12. Thus, in the unloading step ST20, the lift pins 18 lift the workpiece 100 from the back surface 102 side in a direction away from the holding surface 12 upward, thereby forming a gap 300 between the lower surface (back surface 102) of the workpiece 100 and the holding surface 12 of the holding table 11.

[0104] In the unloading step ST20, the pin driving unit 19 moves the lift pin 18, and the control unit 80 operates the holding table driving unit 13, so that the holding table driving unit 13 raises the holding table 11 and moves the holding surface 12 of the holding table 11 to a height above the opening 4-3 of the storage section 10. Thus, in the unloading step ST20, the gap 300 formed is located at a height above the opening 4-3 of the storage section 10, so that the transfer arm 70 can be inserted from the side of the gap 300.

[0105] In the unloading step ST20, the control unit 80 then operates the driving mechanism 75, and the driving mechanism 75 inserts the conveying arm 70 into the gap 300 formed between the lower surface (back surface 102) of the workpiece 100 and the holding surface 12 of the holding table 11. In the unloading step ST20, the driving mechanism 75 slowly raises the conveying arm 70 inserted into the gap 300, so that it contacts the back surface 102 side of the workpiece 100 coated with the resin 202. In the unloading step ST20, the control unit 80 operates the pad driving unit 72, and the pad driving unit 72 switches the suction pad 71 of the conveying arm 70 contacting the back surface 102 side of the workpiece 100 coated with the resin 202 from the suction release state to the suction state, thereby causing the conveying arm 70 to hold the workpiece 100 coated with the resin 202. In the unloading step ST20 , the driving mechanism 75 moves the transfer arm 70 holding the workpiece 100 coated with the resin 202 from above the holding table 11 , thereby unloading the workpiece 100 coated with the resin 202 .

[0106] Here, in the resin coating step ST17, the resin 202 is coated on the front side 101, which is the upper surface of the workpiece 100, and in the unloading step ST20, the back side 102 of the workpiece 100 is sucked and held by the suction pad 71 of the transport arm 70 and is unloaded. Therefore, in the resin coating apparatus 1 and the resin coating method of the embodiment, the workpiece 100 can be unloaded without contacting the coated resin 202.

[0107] Fig.12 2 is a cross-sectional view showing an example of a remaining portion cutting step in the resin coating method of the embodiment. The resin coating method of the embodiment may also have a remaining portion cutting step, such as Fig.12 As shown, in the remaining portion removing step, after the carrying-out step ST20 is performed, the remaining portion 203 of the resin 202 that protrudes in the radial direction from the workpiece 100 is removed.

[0108] In the remaining part removal step, specifically, Fig.12 As shown, a tool 92 of a cutting device 90 is used to cut off a remaining portion 203 formed in a resin 202 of a workpiece 100 held by a holding table 91. Here, the cutting device 90 includes: a circular plate 93, which holds the tool 92 toward the outer periphery of the workpiece 100; and a rotation drive source (not shown) which drives the circular plate 93 to rotate around the axis. By rotating the circular plate 93 around the axis using the rotation drive source, the tool 92 is rotated and moved along the outer periphery of the workpiece 100, thereby cutting off the remaining portion 203.

[0109] The resin coating apparatus 1 of the embodiment implements the resin coating method of the embodiment as described above, and obtains the workpiece 100 coated with the resin 202 .

[0110] As described above, the resin coating device 1 of the embodiment comprises: a storage portion 10, which stores and holds a workbench 11, and the workbench 11 sucks and holds the back side 102 of the workpiece 100 and presses the back side 102; a cover portion 20, which stores an upper workbench 21, and the upper workbench 21 presses the solid resin 200 side provided to the front side 101 side which is the upper surface of the workpiece 100; and a vacuum pump 50, which makes the closed processing space 4 formed by covering the opening 4-3 of the storage portion 10 with the cover portion 20 a vacuum. Here, the resin coating device 1 of the embodiment provides a solid resin 200 by using a resin supply unit 40, heats the solid resin 200 by using a heating member 14 of the holding table 11 and a heating member 24 of the upper table 21 to melt the solid resin 200 to form a liquefied resin 201, and expands the liquefied resin 201 by using the holding table 11 and the upper table 21, thereby forming a resin 202 that covers the workpiece 100. In addition, the solid resin 200 provided by the resin supply unit 40 is easier to handle than a liquid resin, and since it is in a solidified state, it is not large in volume, and does not require time for transportation and storage. On the other hand, when the solid resin 200 provided by the resin supply unit 40 is solidified, it sometimes takes in surrounding air or gas as bubbles, etc.

[0111] Thus, the resin coating device 1 of the embodiment can coat the workpiece 100 with the resin 202 using the solid resin 200 in the closed processing space 4 evacuated by the vacuum pump 50, and thus achieves the following effects: the air or gas taken into the solid resin 200 can be removed, and the air can be reduced and prevented from entering the liquefied resin 201 and between the workpiece 100 and the liquefied resin 201. Thus, the resin coating device 1 of the embodiment achieves the following effects: the air can be reduced and prevented from entering the resin 202 and between the workpiece 100 and the resin 202. As described above, the resin coating device 1 of the embodiment achieves the following effects: the resin 202 can be appropriately coated using the solid resin 200.

[0112] In addition, in the resin coating method of the embodiment, the processing space 4 can be evacuated by the vacuum pump 50 in the vacuum step ST16, and then, in the resin coating step ST17, the resin 202 can be coated on the workpiece 100 in the vacuum processing space 4 using the solid resin 200. Therefore, the resin coating method of the embodiment has the same effect as the resin coating device 1 of the embodiment.

[0113] In addition, in the resin coating device 1 of the embodiment, the cover driving unit 30 includes: a track limiting unit 31 that limits the track of the cover 20; and a drive control unit 32 that moves the cover 20 within the range limited by the track limiting unit 31 by extending and contracting the cylinder 38. Therefore, the resin coating device 1 of the embodiment can move the cover 20 from the open position 20-2 to the desired closed position 20-1 with higher accuracy, and can suppress the surface of the opening 4-4 ​​of the cover 20 from exceeding 90 degrees relative to the surface of the opening 4-3 of the storage unit 10, thereby achieving the following effect: the cover 20 can be moved toward the open position 20-2 safely and in a space-saving manner.

[0114] In addition, the resin coating device 1 of the embodiment further includes a transport arm 70 for transporting the workpiece 100 from the holding table 11, and the transport arm 70 includes an adsorption pad 71 for holding the workpiece 100 and a pad driving unit 72 for driving the adsorption pad 71. In addition, in the resin coating device 1 of the embodiment, the holding table 11 includes: a holding surface 12 for holding the workpiece 100; a suction groove 17 formed on the holding surface 12; and a connecting path 16-2 for connecting the suction groove 17 with the suction source 16-1, and on the holding surface 12, a lift pin 18 and a pin driving unit 19 for moving the lift pin 18 up and down are formed at three or more locations. In addition, in the resin coating device 1 of the embodiment, the lift pins 18 are driven to be at a height below the holding surface 12 when the workpiece 100 is sucked and held, and to be higher than the holding surface 12 when the workpiece 100 is carried out from the holding table 11, and the transport arm 70 is inserted between the workpiece 100 and the holding table 11 formed by the lift pins 18 to transport the workpiece 100. Therefore, the resin coating device 1 of the embodiment has the following effect: the workpiece 100 can be carried out without contacting the coated resin 202.

[0115] In addition, in the resin coating device 1 and the resin coating method of the embodiment, the resin 202 is different from the adhesive layer used in the adhesive tape, and has substantially little adhesiveness like an adhesive, and is in a state of being solidified by cooling and substantially having no adhesiveness, so that the following effect is achieved: even if it is peeled off from the workpiece 100, it will not remain as a residue on the workpiece 100. In addition, in the resin coating device 1 and the resin coating method of the embodiment, the resin 202 is different from the adhesive tape used as a protective member in the past, and the thickness is not specified, so it can be formed to a desired thickness according to the amount of solid resin 200 provided and the amount of pressure when expanding, so that the following effect is achieved: there is no need to increase the types of solid resin 200 to be prepared, and the man-hours for transportation and storage can be reduced, thereby reducing costs.

[0116] [First variant]

[0117] A resin coating device 1 - 2 and a resin coating method according to a first modified example of an embodiment of the present invention will be described with reference to the drawings. Fig.13 1 is a cross-sectional view showing one state of the resin coating device 1-2 according to the first modified example of the embodiment. Fig.13 In the present invention, the same parts as those in the embodiment are denoted by the same reference numerals and description thereof is omitted.

[0118] The resin coating device 1-2 of the first modified example of the embodiment is a resin coating device 1 of the embodiment. Fig.13 As shown, the cover 20 further includes an upper table driving unit 23 that drives the upper table 21 in a direction perpendicular to the pressing surface 22. The other structures of the resin coating device 1-2 of the first variant of the embodiment are the same as the resin coating device 1 of the embodiment. Accordingly, the resin coating method of the first variant of the embodiment is a method in which the resin coating step ST17 is changed in the resin coating method of the embodiment and the table lowering step ST19 is changed to an upper table raising step.

[0119] In the resin coating method of the first variant of the embodiment, as Fig.13 As shown, the resin coating step ST17 is a step in which the upper stage 21 is lowered after the vacuum step ST16 is performed, and the liquefied resin 201 is spread between the upper stage 21 and the holding stage 11 to coat the workpiece 100 .

[0120] In the resin coating step ST17 of the first variant, the upper worktable driving unit 23 is operated by the control unit 80, so that the upper worktable 21 is moved closer to and pressed against the holding worktable 11 by the upper worktable driving unit 23, instead of the situation in the resin coating step ST17 of the implementation method where the holding worktable driving unit 13 is operated by the control unit 80, so that the holding worktable 11 is moved closer to and pressed against the upper worktable 21 by the holding worktable driving unit 13, the other actions of the resin coating step ST17 of the first variant are the same as the resin coating step ST17 of the implementation method.

[0121] In the resin coating method of the first variant of the embodiment, the upper table raising step is a process performed instead of the holding table lowering step ST19 of the embodiment, and is a step of using the holding table 11 to suck and hold the workpiece 100 and raise the upper table 21.

[0122] In the upper worktable rising step, the upper worktable driving unit 23 is actuated by the control unit 80, thereby causing the upper worktable 21 to move apart from the holding worktable 11 through the upper worktable driving unit 23, instead of actuating the holding worktable driving unit 13 by the control unit 80 in the holding worktable lowering step ST19, thereby causing the holding worktable 11 to move apart from the upper worktable 21 through the holding worktable driving unit 13. The other actions of the upper worktable rising step are the same as those of the holding worktable lowering step ST19.

[0123] In addition, the resin coating device 1-2 can also implement the actions of the resin coating method of the embodiment and the resin coating method of the first variant of the embodiment. Specifically, in the resin coating step ST17, the holding table 11 can be moved closer to the upper table 21 by the holding table driving unit 13, and the upper table 21 can be moved closer to the holding table 11 by the upper table driving unit 23. In addition, the holding table lowering step ST19 and the upper table ascending step can be implemented simultaneously and in parallel, the holding table 11 can be moved away from the upper table 21 by the holding table driving unit 13, and the upper table 21 can be moved away from the holding table 11 by the upper table driving unit 23.

[0124] The resin coating device 1-2 and the resin coating method of the first variant of the embodiment are the same as those of the embodiment, and can use solid resin 200 to coat resin 202 on the workpiece 100 in a closed processing space 4 evacuated by a vacuum pump 50, thereby achieving the same effect as the embodiment.

[0125] [Second variant]

[0126] The resin coating device 1 and the resin coating method of the second variant of the embodiment of the present invention are described. In the resin coating method of the second variant of the embodiment, the heating member 14 of the holding table 11 is not used in the resin coating method of the embodiment, but the heating member 24 of the upper table 21 is used to implement the heating step ST11.

[0127] In the resin coating method of the second modified example of the embodiment, after sequentially performing the holding step ST12 and the resin supplying step ST13 similar to the embodiment, the sealing step ST15 and the vacuum step ST16 are sequentially performed. Then, along with the resin coating step ST17 performed thereafter, the heating step ST11 and the resin liquefying step ST14 are performed.

[0128] In the resin coating step ST17 of the second modified example, specifically, first, the heating member 24 is driven by the control unit 80, and the heating member 24 heats the pressing surface 22 of the upper table 21. In the resin coating step ST17 of the second modified example, next, by bringing the holding surface 12 of the holding table 11 and the pressing surface 22 of the upper table 21 close to each other in a vertical direction, the heated pressing surface 22 of the upper table 21 is brought into contact with the solid resin 200 on the front surface 101 side of the workpiece 100 provided on the holding surface 12. Thus, in the resin coating step ST17 of the second modified example, the solid resin 200 and the workpiece 100 are heated via the pressing surface 22, and the holding surface 12 of the holding table 11 is heated via the heating of the solid resin 200 and the workpiece 100, and the heating step ST11 is substantially implemented. In the resin coating step ST17 of the second modified example, the solid resin 200 is heated via the pressing surface 22 to be melted and liquefied into the liquefied resin 201 , and the resin liquefaction step ST14 is substantially performed.

[0129] The resin coating step ST17 of the second modified example is the same as the resin coating step ST17 of the embodiment except that the heating step ST11 and the resin liquefaction step ST14 are performed in the middle. In addition, the resin cooling step ST18, the holding table lowering step ST19 and the unloading step ST20 performed after the resin coating step ST17 are the same as those of the embodiment.

[0130] The resin coating method of the second variant of the embodiment is the same as that of the embodiment, and can coat the workpiece 100 with resin 202 using solid resin 200 in a closed processing space 4 evacuated by a vacuum pump 50, thereby achieving the same effect as that of the embodiment.

[0131] [Third Modification]

[0132] The resin coating device and the resin coating method of the third modified example of the embodiment of the present invention are described. The resin coating device of the third modified example of the embodiment is modified so that the ejector pin 18 is not provided in the resin coating device 1 of the embodiment, and a conveying mechanism having specifications different from those of the conveying arm 70 is provided instead of the conveying arm 70, which holds and conveys the workpiece 100 from above or from the side. Therefore, in the resin coating method of the third modified example of the embodiment, the carrying-out step ST20 is changed in the resin coating method of the embodiment.

[0133] In the carrying-out step ST20 of the third variant of the implementation method, instead of inserting the conveying arm 70 between the workpiece 100 formed by the lifting pin 18 and the holding worktable 11 to convey the workpiece 100, the conveying mechanism of the third variant holds and carries out the workpiece 100 coated with the resin 202 on the holding surface 12 of the holding worktable 11 from above or from the side.

[0134] The resin coating method of the third variant of the implementation method is the same as that of the implementation method, and can use solid resin 200 to coat resin 202 on the workpiece 100 in a closed processing space 4 that is evacuated by a vacuum pump 50. Therefore, in addition to the effects brought by the lifting pin 18 and the conveying arm 70, the same effects as the implementation method are achieved.

[0135] [Fourth Modification]

[0136] A resin coating device 1 and a resin coating method according to a fourth modified example of the embodiment of the present invention will be described with reference to the drawings. Fig.14 It is a cross-sectional view showing a resin coating method according to a fourth modified example of the embodiment. Fig.15 FIG. 4 is a cross-sectional view showing a frame unit 400 obtained by the resin coating method according to the fourth modified example of the embodiment. Fig.14 and Fig.15 In the present invention, the same parts as those in the embodiment are denoted by the same reference numerals and description thereof is omitted.

[0137] A resin coating method according to a fourth modified example of an embodiment of the present invention is a method for coating a resin according to an embodiment of the present invention. Fig.14 As shown in the figure, there is a preparation step of positioning the workpiece 100 in the opening 109-1 of the annular frame 109 before performing the resin providing step ST13, and in the resin coating step ST17, the resin 202 is expanded to cover the opening 109-1 and the frame 109 is fixed to the workpiece 100 by the resin 202. The other processes of the resin coating method of the fourth modified example of the embodiment of the present invention are the same as those of the resin coating method of the embodiment.

[0138] In the preparatory step of the fourth variant of the implementation method, specifically, Fig.14 As shown, the frame 109 and the workpiece 100 are placed on the holding surface 12 of the holding table 11. In addition, in the preparation step of the fourth modified example of the embodiment, it is not necessary to pay attention to the order of placing the workpiece 100 and the frame 109. Thus, in the preparation step, the workpiece 100 is positioned in the opening 109-1 of the annular frame 109 on the holding surface 12 of the holding table 11.

[0139] In the resin providing step ST13 of the fourth variant of the implementation method, in addition to providing solid resin 200 to the surface exposed upward in the workpiece 100, that is, the front side 101, it is also preferred to provide solid resin 200 to the area between the workpiece 100 and the frame 109 on the frame 109 and the holding surface 12 of the holding workbench 11.

[0140] In the resin coating step ST17 of the fourth variant of the embodiment, in addition to spreading the resin 202 on the front surface 101 side of the workpiece 100, the resin 202 is also spread on the frame 109 and in the region between the workpiece 100 and the frame 109 on the holding surface 12 of the holding table 11, thereby fixing the frame 109 to the workpiece 100 with the resin 202, thereby obtaining Fig.15 Frame unit 400 is shown.

[0141] The frame unit 400 is obtained by the resin coating method of the fourth modified example of the embodiment. Fig.15 As shown, there are: a workpiece 100; a frame 109, which surrounds the workpiece 100 in the opening 109-1; and a resin 202, which covers the workpiece 100 and one side of the frame 109 and is adhered to the workpiece 100 and the frame 109. The resin 202 is filled in the area between the outer periphery of the workpiece 100 and the opening 109-1 of the frame 109, so that the workpiece 100 and the frame 109 are firmly integrated, so that the workpiece 100 is firmly fixed in the opening 109-1 of the annular frame 109.

[0142] The resin coating device 1-3 and the resin coating method of the fourth modified example of the embodiment are the same as those of the embodiment, and can coat the workpiece 100 with the resin 202 using the solid resin 200 in the closed processing space 4 evacuated by the vacuum pump 50, thereby achieving the same effects as those of the embodiment. In addition, the resin coating device 1-3 and the resin coating method of the fourth modified example of the embodiment achieve the effect of being able to coat the workpiece 100 with the resin 202 while fixing the workpiece 100 in the opening 109-1 of the annular frame 109.

[0143] In addition, the present invention is not limited to the above-mentioned embodiment. That is, it can be implemented in various modifications within the scope of the main purpose of the present invention. For example, in order to protect the circuit from ultraviolet rays or conceal the circuit, the solid resin 200 used in the above-mentioned embodiment and each modified example can be colored in a dark color such as black, or a UV absorber can be mixed.

Claims

1. A resin coating device, which coats one surface of a workpiece with a resin, wherein: The resin coating device has: A storage portion having an opening, comprising a holding table and a holding table driving portion, wherein the holding table attracts and holds the workpiece on a holding surface of the holding table, and the holding table driving portion drives the holding table in an up-down direction; A cover portion, which covers the opening of the storage portion to form a closed processing space; a cover driving unit that connects the storage unit and the cover and drives the cover so as to be openable and closable relative to the storage unit; A resin supplying unit that supplies solid resin to the workpiece held by the holding table; a vacuum pump for making the processing space sealed by the storage portion and the cover portion into a vacuum; and The atmosphere release valve supplies the atmosphere to the processing space and cools the resin covering the workpiece. The cover includes an upper table, and the upper table is opposed to the holding table and relatively close to the holding table, so that the resin provided to the workpiece spreads and covers the workpiece. The holding table is provided with a heating member, and the heating member heats the holding table and melts the solid resin supplied to the workpiece by the heat from the holding table, thereby forming a liquefied resin. The cover driving unit has: a track limiting portion that limits the track of the cover portion that moves relative to the storage portion; and a drive control unit that applies a driving force to the track limiting unit to move the cover relative to the storage unit, The track limiting part has: A fixed arm fixed to the storage portion; A moving arm fixed to the cover side and moving together with the cover; as well as A fulcrum portion connects the fixed arm and the movable arm to each other in a relatively rotatable manner, The drive control unit has a cylinder that extends and contracts along one axial direction to apply a driving force. One end of the cylinder is rotatably connected to the storage portion, and the other end is rotatably connected to the movable arm. By extending and retracting the cylinder, the angle formed between the fixed arm and the movable arm is changed at the fulcrum, so that the cover moves relative to the storage portion.

2. The resin coating device according to claim 1, wherein: The resin coating device also has a transport arm that carries the workpiece out of the holding table. The transfer arm includes: An adsorption pad that adsorbs the workpiece; and a pad driving unit for driving the adsorption pad, The holding table contains: A holding surface that holds the workpiece; a suction groove formed on the holding surface; and a communication path that connects the suction groove and the suction source, On the holding surface, a lift pin and a pin driving portion for moving the lift pin up and down are formed at three or more locations. The lift pin is driven to be at a height below the holding surface when holding the workpiece, and is higher than the holding surface when the workpiece is removed from the holding table. The transfer arm is inserted between the workpiece formed by the lift pins and the holding table to transfer the workpiece.

3. A resin coating method, comprising coating a workpiece with resin using a resin coating device, the resin coating device comprising: A storage portion having an opening, comprising a holding table and a holding table driving portion, wherein the holding table attracts and holds the workpiece on a holding surface of the holding table, and the holding table driving portion drives the holding table in an up-down direction; A cover portion, which covers the opening of the storage portion to form a closed processing space; a cover driving unit that connects the storage unit and the cover and drives the cover so as to be openable and closable relative to the storage unit; A resin supplying unit that supplies solid resin to the workpiece held by the holding table; a vacuum pump for making the processing space sealed by the storage portion and the cover portion into a vacuum; and The atmosphere release valve supplies the atmosphere to the processing space and cools the resin covering the workpiece. The cover includes an upper table, and the upper table is opposed to the holding table and relatively close to the holding table, so that the resin provided to the workpiece spreads and covers the workpiece. The holding table is provided with a heating member, and the heating member heats the holding table and melts the solid resin supplied to the workpiece by the heat from the holding table, thereby forming a liquefied resin. in, The resin coating method comprises the following steps: A heating step, heating the holding table; A holding step, using the holding worktable to hold the workpiece; A resin supplying step of supplying a solid resin to an upper surface of the workpiece held by the holding table; A resin liquefaction step, liquefying the resin by means of the heated holding table; A sealing step of closing the cover to cover the opening of the receiving portion, thereby forming the processing space sealed by the receiving portion and the cover; A vacuum step, wherein the processing space is made vacuum by the vacuum pump; A resin coating step, after the vacuum step is performed, the holding table is raised, and the resin is spread between the holding table and the upper table to coat the workpiece; a resin cooling step, in which the heating of the holding table is stopped while the holding table is raised, and the atmosphere is introduced from the atmosphere release valve to cool the resin and solidify the resin; a step of lowering a holding table, wherein the workpiece is sucked and held by the holding table and the holding table is lowered; and a carrying-out step, after the holding table lowering step is performed, opening the cover to carry out the workpiece coated with the resin from the holding table, The cover driving unit has: a track limiting portion that limits the track of the cover portion that moves relative to the storage portion; and a drive control unit that applies a driving force to the track limiting unit to move the cover relative to the storage unit, The track limiting part has: A fixed arm fixed to the storage portion; A moving arm fixed to the cover side and moving together with the cover; as well as A fulcrum portion connects the fixed arm and the movable arm to each other in a relatively rotatable manner, The drive control unit has a cylinder that extends and contracts along one axial direction to apply a driving force. One end of the cylinder is rotatably connected to the storage portion, and the other end is rotatably connected to the movable arm. By extending and retracting the cylinder, the angle formed between the fixed arm and the movable arm is changed at the fulcrum, so that the cover moves relative to the storage portion.

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