Heat exchange component for a communication system

Abstract

A heat exchange assembly (100) includes a heat bridge (200) that includes upper and lower bridge elements (202, 204) that include upper and lower plates (250) disposed in a plate stack. The lower plate includes a lower fin plate (260) and a lower spacer plate (262) having a lower end (258) configured to be mechanically and thermally coupled to an electrical component (104). The upper plate (210) includes an upper fin plate (220) and an upper spacer plate (222) having an upper end (218) configured to be mechanically and thermally coupled to a heat exchanger (110). The upper fin plate is staggered with the lower fin plate. The heat exchange assembly includes a mounting spring element (120) that is coupled between the lower plate and the upper plate and is biased against the upper and lower plates during installation. After the upper and lower plates are coupled to the electrical component and the heat exchanger, the mounting spring element is removable to remove the biasing force between the lower plate and the upper plate.

Description

Field of the Invention

[0001] The subject matter of this disclosure generally relates to a heat exchange assembly for a communication system. Background Art

[0002] It may be desirable to transfer thermal energy (or heat) away from a designated electrical component of a system or device. For example, a package such as a processor, a chip, etc. may be mounted to a main circuit board that generates heat when transmitting data. Typically, a heat exchanger such as a heat sink or a cold plate is used to dissipate heat from the electrical component. A common challenge faced by developers of such systems is thermally coupling the heat exchanger to the electrical component and maintaining an absolute thermal interface between the surfaces of the heat exchanger and the electrical component. For example, due to manufacturing tolerances and thermal expansion / contraction of the heat exchanger and the electrical component, non-planar (e.g., non-flat) surfaces may occur at the thermal interface. Additionally, compared to the electrical component, the heat exchanger is typically large and bulky, and due to the positioning of other components on the main circuit board around the electrical component, positioning the heat exchanger at the surface of the electrical component may be impractical or impossible.

[0003] Some known communication systems utilize a thermal bridge between the heat exchanger and the electrical component. Positioning the thermal bridge between the heat exchanger and the electrical component may be difficult. Additionally, the thermal bridge may suffer from similar problems, i.e., maintaining an absolute thermal interface between the thermal bridge and the electrical component and / or the heat exchanger. To overcome these problems, some known thermal bridges utilize a biasing element to maintain a positive pressure at the interfaces of the thermal bridge with the heat exchanger and the electrical component. However, the biasing element constantly applies a biasing force that may cause, for example, damage or breakage of the electrical component. Additionally, the biasing force causes friction or traction between the interfaces (e.g., between the thermal bridge and the electrical component), which may cause warping and damage to the electrical component.

[0004] Accordingly, there is a need for a reliable heat exchange assembly for a communication system. Summary of the Invention

[0005] According to the present invention, a heat exchange assembly for a communication system having electrical components is provided. The heat exchange assembly includes a heat bridge that includes an upper bridge element and a lower bridge element that is separated and discrete from the upper bridge element. The upper bridge element is thermally coupled to the lower bridge element. The lower bridge element includes a lower plate disposed in a lower plate stack. The lower plate includes a lower fin plate and a lower spacer plate between the lower fin plates. The lower plate includes a lower end configured to be mechanically and thermally coupled to an electrical component to dissipate heat from the electrical component. The lower fin plate includes a side surface extending from the lower end to an inner end. A lower channel is defined between the side surfaces of the lower fin plate. The lower spacer plate is received in a corresponding channel between the side surfaces of the lower fin plate. The lower plate extends between a front end and a rear end of the lower bridge element. The upper bridge element includes an upper plate disposed in an upper plate stack. The upper plate includes an upper fin plate and an upper spacer plate between the upper fin plates. The upper plate includes an upper end configured to be mechanically and thermally coupled to a heat exchanger, and the heat exchanger is operable to remove heat from the electrical component through the heat bridge. The upper fin plate includes a side surface extending from the upper end to an inner end. An upper channel is defined between the side surfaces of the upper fin plate. The upper spacer plate is received in a corresponding channel between the side surfaces of the upper fin plate. The upper plate extends between a front end and a rear end of the upper bridge element. The upper fin plate is received in a corresponding lower channel, and the lower fin plate is received in a corresponding upper channel such that the upper fin plate and the lower fin plate are staggered, and the side surfaces of the upper fin plate face the side surfaces of the lower fin plate to effect heat exchange between the lower bridge element and the upper bridge element. The heat exchange assembly includes a mounting spring element that is coupled between the lower plate and the upper plate. The mounting spring element includes a lower spring arm that is biased against the lower plate during installation, and the mounting spring element includes an upper spring arm that is biased against the upper plate during installation to bias the lower end of the lower plate into the electrical component and bias the upper end of the upper plate into the heat exchanger. After the lower plate is coupled to the electrical component and after the upper plate is coupled to the heat exchanger, the mounting spring element can be removed from the heat bridge to remove the biasing force between the lower plate and the upper plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a front perspective view of a heat exchange assembly formed in accordance with an exemplary embodiment of a communication system.

[0007] Figure 2 is a perspective cross-sectional view of a heat exchange assembly according to an exemplary embodiment.

[0008] Figure 3 is a side elevational view of a heat exchange assembly according to an exemplary embodiment, showing a removable mounting spring element installed in the heat bridge.

[0009] Figure 4 is a side elevational view of a heat exchange assembly according to an exemplary embodiment, in which the mounting spring element is removed from the heat bridge.

[0010] Figure 5Is a partial side elevational view of a heat exchange assembly and a portion of a communication system in accordance with an exemplary embodiment. Detailed Description

[0011] Figure 1 Is a front perspective view of a heat exchange assembly 100 formed in accordance with an exemplary embodiment for a communication system 102. The communication system 102 includes electrical components 104 mounted to a mounting area 106 (e.g., upper surface) of a main circuit board 108. The electrical components 104 are heat generating components. For example, the electrical components 104 generate heat when transmitting data. In an exemplary embodiment, the electrical components 104 are processors, memory modules, electronic packages, chips such as ASICs, etc.

[0012] The heat exchange assembly 100 includes a heat exchanger 110 and a heat bridge 200 for thermally coupling the heat exchanger 110 to the electrical component 104. The heat exchanger 110 is configured to dissipate heat from the electrical component. The heat exchanger 110 can be a heat sink, a heat spreader, a cooling plate, etc. The heat exchanger 110 can dissipate heat to the external environment, for example, through an air flow over the heat exchanger 110. In various other embodiments, the heat exchanger 110 can dissipate heat to a cooling fluid, such as water or refrigerant through the heat exchanger 110. For example, the heat exchanger can include channels and / or pipes. In various embodiments, the heat exchanger 110 can be a solid block.

[0013] The heat exchanger 110 includes a lower surface 112 and an upper surface 114. The heat exchanger 110 can include fins (not shown) extending along the upper surface 114, such as vertical plates or posts. The fins allow an air flow through the heat exchanger 110. The fins increase the surface area of the heat exchanger 110 to enhance heat dissipation to the external environment. The heat bridge 200 is thermally coupled to the heat exchanger 110 at the lower surface 112. In an exemplary embodiment, the heat bridge 200 is mechanically fixed to the heat exchanger 110 at the lower surface 112. For example, a thermally conductive adhesive can be used to adhere the heat bridge 200 to the heat exchanger 110. The adhesive creates a thermal interface between the heat bridge 200 and the heat exchanger 110. In an alternative embodiment, the heat bridge 200 can be coupled to the heat exchanger 110 by other means, such as using thermal grease, welding, etc. In various embodiments, the heat bridge 200 is coupled to the heat exchanger 110 using another structure such as a support frame.

[0014] The thermal bridge 200 is thermally coupled to the electrical component 104. In an exemplary embodiment, the thermal bridge 200 is mechanically fixed to the electrical component 104. For example, a thermally conductive adhesive may be used to adhere the thermal bridge 200 to the electrical component 104. The adhesive creates a thermal interface between the thermal bridge 200 and the electrical component 104. In an alternative embodiment, the thermal bridge 200 may be coupled to the electrical component 104 by other means, such as using thermal grease, welding, etc. In various embodiments, the thermal bridge 200 is coupled to the electrical component 104 using another structure such as a support frame.

[0015] In an exemplary embodiment, the heat exchange assembly 100 includes a removable mounting spring element 120 used during the installation and assembly of the heat exchange assembly 100 and the electrical component 104. The mounting spring element 120 is configured to be removed from the thermal bridge 200 after the thermal bridge 200 is coupled to the electrical component 104 and the heat exchanger 110. For example, the mounting spring element 120 is used to hold the thermal bridge 200 while the adhesive between the thermal bridge 200 and the electrical component 104 solidifies and / or while the adhesive between the thermal bridge 200 and the heat exchanger 110 solidifies. After the adhesive has solidified, the thermal bridge 200 is fixed between the electrical component 104 and the heat exchanger 110, and the mounting spring element 120 can be removed. The mounting spring element 120 is removed and not used during the normal operation of the communication system 102. Thus, during the normal operation of the communication system 102, the mounting spring element 120 does not apply a spring biasing force to the thermal bridge 200. During thermal expansion and thermal contraction of the electrical component 104 and / or the heat exchanger 110, the mounting spring element 120 does not affect the electrical component 104 or the heat exchanger 110.

[0016] Figure 2 is a perspective cross-sectional view of the heat exchange assembly 100 and the communication system 102 according to an exemplary embodiment. In an exemplary embodiment, the thermal bridge 200 includes an upper bridge element 202, a lower bridge element 204, and a removable mounting spring element 120 between the upper bridge element 202 and the lower bridge element 204. The lower bridge element 204 is configured to thermally engage the electrical component 104. The upper bridge element 202 is configured to engage the heat exchanger 110. The upper bridge element 202 is in thermal communication with the lower bridge element 204 and dissipates heat from the lower bridge element 204 to cool the electrical component 104. Optionally, the upper bridge element 202 and the lower bridge element 204 may be positioned relative to each other to allow air flow through the thermal bridge 200. In an exemplary embodiment, the upper bridge element 202 and the lower bridge element 204 may be movable relative to each other to allow for thermal expansion and thermal contraction of the electrical component 104 and / or the heat exchanger 110.

[0017] In an exemplary embodiment, the heat exchange assembly 100 includes a frame 300 coupled to the thermal bridge 200( Figure 2(A part is shown). The frame 300 can be coupled to the upper bridge element 202 and / or the lower bridge element 204. The frame 300 is used to hold the upper bridge element 202 relative to the lower bridge element 204. Optionally, the frame 300 holds the lateral movement of the upper bridge element 202 and / or the lower bridge element 204. The frame 300 can be used to prevent the forward and backward movement of the upper bridge element 202 and / or the lower bridge element 204. In an exemplary embodiment, the upper bridge element 202 and / or the lower bridge element 204 can move vertically within the frame 300 to allow for thermal expansion and thermal contraction of the electrical component 104 and / or the heat exchanger 110. The frame 300 can receive the mounting spring element 120, for example, through an opening in the frame 300. Optionally, the mounting spring element 120 can be removed from the frame 300, for example, through the opening.

[0018] During assembly, the mounting spring element 120 is located between the upper bridge element 202 and the lower bridge element 204. In an exemplary embodiment, the mounting spring element 120 is located at the front end 206 ( Figure 1 as shown) of the thermal bridge 200 and the rear end 208 of the thermal bridge 200. In alternative embodiments, other locations are possible. The mounting spring element 120 forces the upper bridge element 202 and the lower bridge element 204 apart from each other. The mounting spring element 120 forces the upper bridge element 202 towards the heat exchanger 110 in a first biasing direction (e.g., upward). For example, during the curing or solidification of the adhesive, the mounting spring element 120 forces the upper bridge element 202 into the heat exchanger 110 to ensure sufficient mechanical and thermal coupling between the upper bridge element 202 and the heat exchanger 110. The mounting spring element 120 forces the lower bridge element 204 towards the electrical component 104 in a second biasing direction (e.g., downward). For example, during the curing or solidification of the adhesive, the mounting spring element 120 presses the lower bridge element 204 into the electrical component 104 to ensure sufficient mechanical and thermal coupling between the lower bridge element 204 and the electrical component 104.

[0019] In an exemplary embodiment, each mounting spring element 120 is a stamping formed part. The mounting spring element 120 can be made of a thin metal material piece such that the mounting spring element 120 is flexible. The mounting spring element 120 includes an upper spring arm 122, a lower spring arm 124, and a folding portion 126 between the upper spring arm 122 and the lower spring arm 124. In various embodiments, the folding portion 126 can be U-shaped or V-shaped. The folding portion 126 is flexible and configured to separate the upper spring arm 122 and the lower spring arm 124 when the folding portion is bent or compressed. In an exemplary embodiment, the mounting spring element 120 includes a removal tab 128 for removing the mounting spring element 120 from the thermal bridge 200. The removal tab 128 is actuated to compress the mounting spring element 120. The removal tab 128 can be exposed outside the side and / or end of the thermal bridge 200 for actuation.

[0020] During installation, the upper spring arm 122 biases upward against the upper bridge element 202, and the lower spring arm 124 biases downward against the lower bridge element 204. The mounting spring element 120 is compressible and expandable. For example, the upper spring arm 122 and the lower spring arm 124 can be compressed relative to each other toward each other and can be expanded relative to each other away from each other. In various embodiments, the upper spring arm 122 and / or the lower spring arm 124 and / or the folding portion 126 can be segmented to allow relatively independent movement of the segments.

[0021] In an exemplary embodiment, each of the bridge elements 202, 204 includes a plurality of plates that are arranged together in a plate stack. The plates are interleaved with each other to provide thermal communication between the upper bridge element 202 and the lower bridge element 204. Each plate is movable relative to the others such that the plates can be individually articulated to conform to the upper surface of the electrical component 104 and the lower surface of the heat exchanger 110 to improve the contact and / or proximity between the thermal bridge 200 and the electrical component 104 and the heat exchanger 110.

[0022] In an exemplary embodiment, the upper bridge element 202 includes a plurality of upper plates 210 arranged in an upper plate stack 212. Each upper plate 210 has a side surface 214 that extends between a lower or inner end 216 and an outer or upper end 218 of the upper plate 210. The inner end 216 faces the lower bridge element 204. The upper end 218 faces the heat exchanger 110. Optionally, the various upper plates 210 can have different heights between the inner end 216 and the outer end 218. For example, some upper plates 210 can be taller to form an upper fin plate 220 for the thermal bridge 200, and some upper plates 210 can be shorter to form upper spacer plates 222. The upper spacer plates 222 are located between the upper fin plates 220. The upper fin plates 220 form upper channels 224 therebetween. The upper spacer plates 222 are received in corresponding upper channels 224.

[0023] In an exemplary embodiment, each upper fin plate 220 includes a base 226 at the outer end 218. The base 226 is aligned with the upper spacer plate 222. The side surface 214 of the upper fin plate 220 at the base 226 faces the side surface 214 of the upper spacer plate 222. The upper spacer plate 222 is thermally coupled to the base 226 of the upper fin plate 220 to transfer heat across the entire upper end of the upper bridge element 202 to effectively transfer heat to the heat exchanger 110.

[0024] In an exemplary embodiment, the lower bridge element 204 includes a plurality of lower plates 250 disposed in the lower plate stack 252. Each lower plate 250 has a side surface 254 extending between an upper or inner end 256 and a lower or outer end 258 of the lower plate 250. The inner end 256 faces the upper bridge element 202. The lower end 258 faces the electrical component 104. Optionally, the respective lower plates 250 may have different heights between the inner end 256 and the outer end 258. For example, some of the lower plates 250 may be taller to form a lower fin plate 260 for the heat bridge 200, and some of the lower plates 250 may be shorter to form a lower spacer 262. The lower spacers 262 are located between the lower fin plates 260. The lower fin plates 260 form a lower channel 264 therebetween. The lower spacers 262 are received in the corresponding lower channels 264.

[0025] In an exemplary embodiment, each lower fin plate 260 includes a base 266 at the lower end 258. The base 266 is aligned with the lower spacer 262. The side surface 254 of the lower fin plate 260 at the base 266 faces the side surface 254 of the lower spacer 262. The lower spacer 262 is thermally coupled to the base 266 of the lower fin plate 260 to transfer heat throughout the entire lower end of the lower bridge element 204 to effectively transfer heat to the electrical component 104.

[0026] When assembled, the upper plates 210 are staggered with the lower plates 250. The upper plates 210 and the lower plates 250 are held in the frame 300, for example, stacked together or sandwiched between opposite sides and ends of the frame 300. The upper plates 210 and the lower plates 250 are held in a vertical orientation in the frame. The upper fin plates 220 are received in the lower channels 264, and the lower fin plates 260 are received in the upper channels 224. For example, the upper fin plates 220 may be aligned with the lower spacers 262 in the lower channels 264, and the lower fin plates 260 may be aligned with the upper spacers 222 in the upper channels 224.

[0027] In an exemplary embodiment, the upper fin plate 220 abuts the lower fin plate 260 at the heat bridge interface 280. The upper bridge element 202 is thermally coupled to the lower bridge element 204 at the heat bridge interface 280. The side surface 214 faces the side surface 254 at the heat bridge interface 280. The side surfaces 214, 254 overlap by an overlapping distance sufficient to allow effective heat transfer between the lower plate 250 and the upper plate 210. The side surfaces 214, 254 may slide relative to each other to allow movement between the upper plate 210 and the lower plate 250 and to change the overlapping distance. In an exemplary embodiment, the upper fin plate 220 may move relative to the lower fin plate 260 at the heat bridge interface 280, for example, during thermal expansion and contraction of the electrical component 104 and / or the heat exchanger 110. The upper channel 224 and the lower channel 264 accommodate relative movement of the upper fin plate 220 and the lower fin plate 260, for example, during thermal expansion and contraction of the electrical component 104 and / or the heat exchanger 110.

[0028] When assembled, the upper plate 210 is firmly fixed to the heat exchanger 110, and the lower plate 250 is firmly fixed to the electrical component 104. For example, an upper adhesive layer 230 is provided between the upper plate 210 and the heat exchanger 110, and a lower adhesive layer 270 is provided between the lower plate 250 and the electrical component 104. The upper adhesive layer 230 fixes the upper plate 210 to the heat exchanger 110 so that the upper plate 210 moves together with the heat exchanger 110, for example, during thermal expansion and thermal contraction of the heat exchanger 110. The lower adhesive layer 270 fixes the lower plate 250 to the electrical component 104 so that the lower plate 250 moves together with the electrical component 104, for example, during thermal expansion and thermal contraction of the electrical component 104. The inner ends 216, 256 of the upper plate 210 and the lower plate 250 are slidable relative to each other at the thermal bridge interface 280.

[0029] Figure 3 is a side elevational view of the heat exchange assembly 100 and the communication system 102 according to an exemplary embodiment, which shows the removable mounting spring element 120 installed in the thermal bridge 200. Figure 4 is a side elevational view of the heat exchange assembly 100 and the communication system 102 according to an exemplary embodiment, which shows the mounting spring element 120 removed from the thermal bridge 200. The thermal bridge 200 thermally couples the heat exchanger 110 to the electrical component 104 to dissipate heat from the electrical component 104. The upper bridge element 202 is thermally coupled to the lower bridge element 204 at the thermal bridge interface 280. The mounting spring element 120 can be positioned between the upper bridge element 202 and the lower bridge element 204 during installation and assembly of the heat exchange assembly 100, and can be removed from the thermal bridge 200 after the upper bridge element 202 and the lower bridge element 204 are respectively coupled to the heat exchanger 110 and the electrical component 104.

[0030] In an exemplary embodiment, the thermal bridge 200 includes a front spring pocket 290 at the front end 206 and a rear spring pocket 292 at the rear end 208. The front and rear spring pockets 290, 292 removably house the mounting spring element 120. The spring pockets 290, 292 are sized and shaped to house the mounting spring element 120 such that the upper spring arm 122 can be positioned below the upper bridge element 202 and the lower spring arm 124 can be positioned above the lower bridge element 204. In an exemplary embodiment, the upper plate 210 includes an upper lip 232 at the front end 206 and an upper lip 234 at the rear end 208. The lower plate 250 includes a lower lip 272 at the front end 206 and a lower lip 274 at the rear end 208. The front spring pocket 290 is defined between the upper lip 232 and the lower lip 272. The rear spring pocket 292 is defined between the upper lip 234 and the lower lip 274. Optionally, the lips 232, 234, 272, 274 may be angled to accommodate the shape of the mounting spring element 120. For example, the lips 232, 234 may have a shape complementary to the upper spring arm 122 to accommodate the upper spring arm 122 of the mounting spring element 120, while the lips 272, 274 may have a shape complementary to the lower spring arm 124 to accommodate the lower spring arm 124 of the mounting spring element 120. The upper spring arm 122 presses upward against the upper plate 210, e.g., against the upper lips 232, 234. The lower spring arm 124 presses downward against the lower plate 250, e.g., against the lower lips 272, 274.

[0031] During assembly, the mounting spring elements 120 are positioned in spring pockets 290, 292 between the lower plate 250 and the upper plate 210 of the thermal bridge 200. In an exemplary embodiment, the lower end 258 of the lower plate 250 is bonded to the electrical component 104 using an adhesive at the lower bonding layer 270 to secure the lower plate 250 to the electrical component 104. When the adhesive of the lower bonding layer 270 solidifies and permanently secures the lower plate 250 to the electrical component 104, the mounting spring elements 120 bias the lower plate 250 against the electrical component 104. In an exemplary embodiment, the upper end 218 of the upper plate 210 is bonded to the heat exchanger 110 using an adhesive at the upper bonding layer 230 to secure the upper plate 210 to the heat exchanger 110. When the adhesive of the upper bonding layer 230 solidifies to permanently secure the upper plate 210 to the heat exchanger 110, the mounting spring elements 120 bias the upper plate 210 against the heat exchanger 110. Once the thermal bridge 200 is installed, the upper bridge element 202 is supported (e.g., hangs from) by the heat exchanger 110, while the lower bridge element 204 is supported (e.g., rests on) by the electrical component 104. The mounting spring elements 120 are no longer needed to support the upper bridge element 202 relative to the lower bridge element 204. The heat exchanger 110 can be separately supported or positioned relative to the electrical component 104, for example, using mounting hardware. Thus, the heat exchanger 110 and the electrical component 104 are separately used to support the upper bridge element 202 relative to the lower bridge element 204. For example, when the electrical component 104 is fixed in place, the lower bridge element 204 is fixed in place with the electrical component 104, and when the heat exchanger 110 is fixed in place, the upper bridge element 202 is fixed in place with the heat exchanger 110.

[0032] After installing the thermal bridge 200 between the electrical component 104 and the heat exchanger 110, the mounting spring elements 120 are removed. After removing the mounting spring elements 120, the upper plate 210 of the upper plate stack 212 is free to move relative to the lower plate 250 of the lower plate stack 252 without spring biasing forces acting on the upper plate 210 or the lower plate 250. After the bonding layers 230, 270 have solidified, the mounting spring elements 120 can be removed from the spring pockets 290, 292. In an exemplary embodiment, the mounting spring elements 120 are removed to eliminate the biasing forces on the lower plate 250 and the upper plate 210. The mounting spring elements 120 are removed to allow the lower plate 250 and the upper plate 210 to be freely positioned relative to each other by the relative positions of the electrical component 104 and the heat exchanger 110, without the mounting spring elements 120 pressing outward against the upper bridge element 202 and the lower bridge element 204. When the mounting spring elements 120 are removed, the pre-stress or positive pressure acting on the upper bridge element 202 and the lower bridge element 204 is eliminated, allowing for free thermal expansion and contraction of the electrical component 104 and the heat exchanger 110.

[0033] Figure 5Partial side elevational view of a heat exchange assembly 100 and a portion of a communication system 102 in accordance with an exemplary embodiment. Figure 5 Shows a removable mounting spring element 120 mounted in a heat bridge 200 in a released state. In the released state, the mounting spring element 120 is removed from the biased position. The mounting spring element 120 is not biased against the heat bridge 200. The mounting spring element 120 does not press outwardly on the upper bridge element 202.

[0034] After the heat bridge 200 is coupled to the electrical component 104 and the heat exchanger 110, the mounting spring element 120 moves to the released state. For example, after the upper bridge element 202 is bonded to the heat exchanger 110, the mounting spring element 120 is moved to the released state. In this way, the upper bridge element 202 is supported by the heat exchanger 110 and the mounting spring element 120 is no longer needed to support the upper bridge element 202. In various embodiments, the mounting spring element 120 is moved to the released state by plastically deforming the mounting spring element 120. Optionally, the mounting spring element 120 may be made of a material that plastically deforms at a temperature. For example, the mounting spring element 120 may be rigid and compressible at the mounting temperature, but may soften and plastically deform at the adhesive curing temperature or the operating temperature of the heat exchange assembly 100 such that the mounting spring element 120 does not exert a spring force during operation. During operation of the communication system 102, after the heat bridge 200 is mounted, the mounting spring element 120 is inoperative.

Claims

1. A heat exchange assembly (100) for a communication system (102) having an electrical component (104), the heat exchange assembly comprising: a heat bridge (200) including an upper bridge element (202) and a lower bridge element (204) separated and discrete from the upper bridge element, the upper bridge element being thermally coupled to the lower bridge element; the lower bridge element includes a lower plate (250) disposed in a lower plate stack (252), the lower plate including a lower fin plate (260) and a lower spacer plate (262) between the lower fin plates, the lower plate including a lower end (258) configured to be mechanically and thermally coupled to the electrical component to dissipate heat from the electrical component, the lower fin plate including a side surface (254) extending from the lower end to an inner end (256), a lower channel (264) being defined between the side surfaces of the lower fin plate, the lower spacer plate being received in a corresponding channel between the side surfaces of the lower fin plate, the lower plate extending between a front end and a rear end of the lower bridge element; the upper bridge element includes an upper plate (210) disposed in an upper plate stack (212), the upper plate including an upper fin plate (220) and an upper spacer plate (222) between the upper fin plates, the upper plate including an upper end (218) configured to be mechanically and thermally coupled to a heat exchanger (110), the heat exchanger (110) being operable to remove heat from the electrical component through the heat bridge, the upper fin plate including a side surface (214) extending from the upper end to an inner end (216), an upper channel (224) being defined between the side surfaces of the upper fin plate, the upper spacer plate being received in a corresponding channel between the side surfaces of the upper fin plate, the upper plate extending between a front end (206) and a rear end (208) of the upper bridge element; wherein the upper fin plate is received in a corresponding lower channel and the lower fin plate is received in a corresponding upper channel such that the upper fin plate and the lower fin plate are interleaved, and the side surfaces of the upper fin plate face the side surfaces of the lower fin plate to effect heat exchange between the lower bridge element and the upper bridge element; and a mounting spring element (120) coupled between the lower plate and the upper plate, the mounting spring element including a lower spring arm (124) biased against the lower plate during installation, and the mounting spring element including an upper spring arm (122) biased against the upper plate during installation to bias the lower end of the lower plate into the electrical component and bias the upper end of the upper plate into the heat exchanger; wherein, after the lower plate is coupled to the electrical component and after the upper plate is coupled to the heat exchanger, the mounting spring element is removable from the heat bridge to remove the biasing force between the lower plate and the upper plate.

2. The heat exchange assembly (100) according to claim 1, wherein, During installation of the thermal bridge (200) between the electrical component (104) and the heat exchanger (110), the mounting spring element (120) is positioned between the lower plate (250) and the upper plate (210), and after installation of the thermal bridge between the electrical component and the heat exchanger, the mounting spring element (120) is removed.

3. The heat exchange assembly (100) according to claim 1, wherein, the upper plate stack (212) is freely movable relative to the lower plate stack (252), and the mounting spring element (120) is removed without spring biasing force acting on the upper plate (210) or the lower plate (250).

4. The heat exchange assembly (100) according to claim 1, wherein, the lower end (258) of the lower plate (250) is configured to be adhered to the electrical component (104) using an adhesive to fix the lower plate to the electrical component, and the upper end (218) of the upper plate (210) is configured to be adhered to the heat exchanger (110) using an adhesive to fix the upper plate to the heat exchanger. The mounting spring element (120) biases the lower plate against the electrical component when the adhesive sets, the mounting spring element biases the upper plate against the heat exchanger when the adhesive sets, and the mounting spring element is removed from the thermal bridge (200) after the adhesive has set.

5. The heat exchange assembly (100) according to claim 1, further comprising a lower adhesive layer (270) between the lower plate (250) and the electrical component (104) and an upper adhesive layer (230) between the upper plate (210) and the heat exchanger (110). After the lower adhesive layer fixes the lower plate to the electrical component and after the upper adhesive layer fixes the upper plate to the heat exchanger, the mounting spring element (120) is removed from the thermal bridge (200).

6. The heat exchange assembly (100) according to claim 1, wherein, the mounting spring element (120) includes a removal tab (128) extending therefrom, and the removal tab is operable to remove the mounting spring element from between the upper bridge element (202) and the lower bridge element (204).

7. The heat exchange assembly (100) according to claim 1, wherein, without physically removing the mounting spring element from between the lower bridge element (204) and the upper bridge element (202), the mounting spring element (120) can be removed from the thermal bridge (200) by removing the spring force acting on the lower plate (250) and the upper plate (210).

8. The heat exchange assembly (100) according to claim 1, wherein, The lower plate (250) includes lower lips (272, 274) at the front end (206) of the heat bridge (200), and the upper plate (210) includes upper lips (232, 234) at the front end of the heat bridge. The heat bridge includes a front spring pocket (290) between the lower lips and the upper lips. The front spring pocket houses the mounting spring element (120), and the mounting spring element is removable from the front spring pocket.

9. The heat exchange assembly (100) according to claim 1, wherein, the upper plate (210) is movable relative to the lower plate (250).

10. The heat exchange assembly (100) according to claim 1, wherein, the mounting spring element (120) is a front mounting spring element that engages the lower plate (250) and the upper plate (210) at the front end (206) of the heat bridge (200). The heat exchange assembly further includes a rear mounting spring element that engages the lower plate and the upper plate at the rear end (208) of the heat bridge. The rear mounting spring element is removable from the heat bridge after the lower plate is coupled to the electrical component (104) and after the upper plate is coupled to the heat exchanger (110) to remove the biasing force between the lower plate and the upper plate.

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