Anti-shake photosensitive component, anti-shake camera module and electronic device

Abstract

The present application provides an anti-shake photosensitive component, an anti-shake camera module and an electronic device. The anti-shake photosensitive component includes: a circuit board, including a configuration surface; a driver, arranged on the configuration surface of the circuit board, the driver includes an electrically connected driving part and a fixing part, and the fixing part is arranged on one side of the driving part; a photosensitive element, arranged on the side of the driving part of the driver away from the circuit board and electrically connected to the driving part; and a substrate, arranged on the configuration surface of the circuit board and electrically connected to the circuit board, the substrate is located on the side of the fixing part away from the driving part, and a receiving groove is provided on the side of the substrate close to the fixing part, at least part of the fixing part is located in the receiving groove, and is electrically connected to the substrate. The above-mentioned anti-shake photosensitive component realizes the anti-shake function of the anti-shake camera module by moving the photosensitive element through the driving part of the driver; because at least part of the fixing part of the driver is located in the receiving groove, the substrate can effectively protect the fixing part when the anti-shake camera module falls, and the imaging quality is relatively stable.

Description

Technical Field

[0001] The present application relates to the technical field of optical imaging, and particularly to an anti-shake photosensitive component, an anti-shake camera module, and an electronic device. Background Art

[0002] In recent years, electronic products, smart devices, etc. have increasingly developed towards miniaturization and high performance. Consumers have put forward more stringent requirements for the size and imaging ability of the camera modules of such devices. This has also caused the vast majority of existing electronic products and smart devices to pursue the compactness and functional integration of camera modules. The anti-shake function is integrated into the camera module in this wave of development to achieve the anti-shake function of the camera module.

[0003] With the emergence of the Micro-Electro-Mechanic System (MEMS for short), in the prior art, the anti-shake function is realized by directly attaching the MEMS to the circuit board and then attaching the photosensitive chip to the MEMS, so as to move the photosensitive chip through the MEMS to compensate for the offset of the photosensitive chip caused by shaking, thereby realizing the anti-shake function of the camera module. In the process of implementing the present application, the inventor found that there are at least the following problems in the prior art: The place where the camera module is most impacted when it drops is between the circuit board and the MEMS. Due to the large stress at this position, the MEMS is prone to the problem of dropping failure, which affects the imaging quality of the camera module. Summary of the Invention

[0004] In view of this, it is necessary to provide an anti-shake photosensitive component, an anti-shake camera module, and an electronic device to solve the above problems.

[0005] An embodiment of the present application provides an anti-shake photosensitive component, including:

[0006] A circuit board, the circuit board includes a configuration surface;

[0007] A driver, disposed on the configuration surface of the circuit board, the driver includes a driving part and a fixing part that are electrically connected, and the fixing part is disposed on one side of the driving part;

[0008] A photosensitive element, disposed on the side of the driving part of the driver away from the circuit board and electrically connected to the driving part; and

[0009] A substrate, disposed on the configuration surface of the circuit board and electrically connected to the circuit board, the substrate is located on the side of the fixing part away from the driving part, and a receiving groove is formed on the side of the substrate close to the fixing part. At least a part of the fixing part is located in the receiving groove and is electrically connected to the substrate.

[0010] The above anti-shake photosensitive component moves the photosensitive element through the driving part of the driver to compensate for the offset of the photosensitive element caused by shaking, thereby realizing the anti-shake function of the anti-shake camera module; moreover, since at least part of the fixing part of the driver is located in the receiving groove, when the anti-shake camera module drops, the substrate can effectively protect the fixing part, and the problem that the driver is prone to dropping defects can be avoided, and the imaging quality of the anti-shake camera module is relatively stable.

[0011] In some embodiments, the substrate has a first connection surface and an inner side surface. The first connection surface is disposed close to the circuit board and fixedly connected to the configuration surface. Part of the inner side surface extends toward the optical axis to form a protruding portion. One side of the protruding portion close to the circuit board has a second connection surface. The receiving groove is formed by enclosing the second connection surface, the inner side surface and the configuration surface. The substrate further has a conductive portion. One end of the conductive portion is electrically connected to the circuit board, and the other end of the conductive portion is electrically connected to the fixing portion.

[0012] In this way, the substrate is fixedly connected to the circuit board through the first connection surface, realizes the electrical connection between the fixing portion of the driver and the circuit board through the conductive portion, and forms effective protection for the driver when the anti-shake camera module drops through the second connection surface of the protruding portion, and the problem that the driver appears dropping defects can be avoided.

[0013] In some embodiments,

[0014] the conductive portion is disposed in the substrate;

[0015] or, the conductive portion is disposed on the surface of the substrate;

[0016] or, part of the conductive portion is disposed in the substrate and the other part is disposed on the surface of the substrate.

[0017] In this way, the conductive portion can be disposed in the substrate, on the surface of the substrate, and part in the substrate and part on the surface of the substrate as needed.

[0018] In some embodiments, one side of the fixing portion facing away from the configuration surface of the circuit board is electrically connected to the conductive portion through a solder joint.

[0019] In this way, the electrical connection between the circuit board and the fixing portion can be realized.

[0020] In some embodiments, a filling space is formed between the receiving groove and the fixing portion of the driver. The anti-shake photosensitive component further includes:

[0021] a filling body filled in the filling space.

[0022] In this way, the filling body can connect the circuit board, the fixing portion of the driver and the circuit board into a whole, and increase the anti-drop performance of the driver.

[0023] In some embodiments, it further includes:

[0024] A buffer member disposed between the configured surface of the circuit board and the driver.

[0025] In this way, the buffer member can buffer the force exerted on the driver when the anti-shake camera module drops.

[0026] In some embodiments, there is a gap between one end of the buffer member close to the inner side surface of the substrate and the inner side surface.

[0027] In this way, it can ensure that the buffer member is installed between the driver and the configured surface of the circuit board.

[0028] In some embodiments, a receiving groove is formed on the configured surface, and the buffer member is disposed in the receiving groove.

[0029] In this way, the position of the buffer member can be limited to prevent the buffer member from shifting when the anti-shake camera module drops, and it can also ensure that the buffer member buffers the force exerted on the driver.

[0030] In some embodiments, it further includes:

[0031] A first wire bonding, one end of the first wire bonding is connected to the driving part of the driver, and the other end is connected to the fixing part of the driver.

[0032] In this way, the first wire bonding can conduct the driving part and the fixing part, and the elastic deformation of the first wire bonding can also be used to avoid the influence of the fixing part on the movement of the driving part.

[0033] In some embodiments, it further includes:

[0034] A second wire bonding, one end of the second wire bonding is connected to the photosensitive element, and the other end is connected to the driving part of the driver.

[0035] In this way, the second wire bonding can conduct the photosensitive element and the driving part, and the elastic deformation of the second wire bonding can also be used to avoid the influence of the driving part on the movement of the photosensitive element.

[0036] In some embodiments, the driving part and the fixing part together form a microelectromechanical system.

[0037] In this way, the microelectromechanical system can drive the photosensitive element to move to compensate for the offset of the photosensitive element due to jitter, thereby realizing the anti-shake function of the anti-shake camera module.

[0038] The embodiment of the present application also provides an anti-shake camera module, including:

[0039] The anti-shake photosensitive component as described above; and

[0040] An optical lens is disposed on the light-sensing path of the anti-shake light-sensing component.

[0041] In the anti-shake imaging module described above, the anti-shake light-sensing component moves the light-sensing element through the driving part of the driver to compensate for the offset of the light-sensing element caused by shaking, thereby realizing the anti-shake function of the anti-shake imaging module; and, since at least part of the fixing part of the driver is located in the accommodation groove, when the anti-shake imaging module drops, the substrate can effectively protect the fixing part, and the problem that the driver is prone to dropping defects can be avoided, and the imaging quality of the anti-shake imaging module is relatively stable.

[0042] An embodiment of the present application further provides an electronic device, including:

[0043] A main body; and

[0044] The anti-shake imaging module as described above, and the anti-shake imaging module is disposed on the main body.

[0045] The above-mentioned electronic device includes an anti-shake imaging module. In the anti-shake imaging module, the anti-shake light-sensing component moves the light-sensing element through the driving part of the driver to compensate for the offset of the light-sensing element caused by shaking, thereby realizing the anti-shake function of the anti-shake imaging module; and, since at least part of the fixing part of the driver is located in the accommodation groove, when the anti-shake imaging module drops, the substrate can effectively protect the fixing part, and the problem that the driver is prone to dropping defects can be avoided, and the imaging quality of the anti-shake imaging module is relatively stable. Description of the Drawings

[0046] Figure 1 It is a schematic cross-sectional view of the anti-shake imaging module provided by the first embodiment of the present application.

[0047] Figure 2 is Figure 1 A schematic cross-sectional view of the anti-shake light-sensing component in the anti-shake imaging module shown.

[0048] Figure 3 is Figure 2 A schematic structural view of the driver in the anti-shake imaging module shown in.

[0049] Figure 4 It is a schematic cross-sectional view of the anti-shake light-sensing component in the anti-shake imaging module provided by the second embodiment of the present application.

[0050] Figure 5 It is a schematic three-dimensional structural view of the electronic device provided by the third embodiment of the present application.

[0051] Description of the Main Element Symbols

[0052] Electronic device 1000

[0053] Anti-shake camera module 100, 200

[0054] Anti-shake photosensitive component 10, 210

[0055] Circuit board 11, 211

[0056] Configuration surface 112, 2112

[0057] Receiving groove 1122

[0058] Driver 12, 212

[0059] Drive part 122, 2122

[0060] Moving part 1221

[0061] Carrier 1222

[0062] Fixing part 124, 2124

[0063] Outer frame 1241

[0064] Cross-shaped bracket 1242

[0065] Drive part 1243

[0066] Photosensitive element 13, 213

[0067] Substrate 14, 214

[0068] Receiving groove 141, 2141

[0069] First connection surface 142

[0070] Inner side surface 143

[0071] Protruding part 144

[0072] Second connection surface 145

[0073] Conductive part 146

[0074] Filling space 147

[0075] First wire bonding 15

[0076] Second wire bonding 16

[0077] Connector 17

[0078] Buffer 18

[0079] Filling body 19

[0080] Optical lens 20, 220

[0081] Optical axis 22

[0082] Body 300 Detailed implementation manners

[0083] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0084] It should be noted that when a component is referred to as being "electrically connected" to another component, it can be directly on the other component or there can also be an intermediate component. When a component is considered to be "electrically connected" to another component, it can be a contact connection. For example, it can be in the form of a wire connection, or it can be a non-contact connection. For example, it can be in the form of non-contact coupling.

[0085] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the description of this application in this specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0086] The following will describe in detail some implementation manners of this application with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0087] Please refer to Figure 1 , the first embodiment of this application provides an anti-shake camera module 100, including an anti-shake photosensitive component 10 and an optical lens 20.

[0088] Please refer to Figure 2 , the anti-shake photosensitive component 10 includes a circuit board 11, a driver 12, a photosensitive element 13, and a substrate 14.

[0089] The circuit board 11 includes a configuration surface 112. The driver 12 is disposed on the configuration surface 112 of the circuit board 11. The driver 12 includes a driving portion 122 and a fixing portion 124 that are electrically connected. The fixing portion 124 is disposed on one side of the driving portion 122. The photosensitive element 13 is disposed on the side of the driving portion 122 of the driver 12 facing away from the circuit board 11 and is electrically connected to the driving portion 122. The substrate 14 is disposed on the configuration surface 112 of the circuit board 11 and is electrically connected to the circuit board 11. The substrate 14 is located on the side of the fixing portion 124 facing away from the driving portion 122, and a receiving groove 141 is formed on the side of the substrate 14 close to the fixing portion 124. A part of the fixing portion 124 is located in the receiving groove 141 and is electrically connected to the substrate 14.

[0090] In the first embodiment, the anti-shake photosensitive component 10 in the anti-shake imaging module 100 moves the photosensitive element 13 through the driving part 122 of the driver 12 to compensate for the offset of the photosensitive element 13 caused by shaking, thereby realizing the anti-shake function of the anti-shake imaging module 100. Moreover, since part of the fixing part 124 of the driver 12 is located in the receiving groove 141, the substrate 14 can effectively protect the fixing part 124 when the anti-shake imaging module 100 drops, avoiding the problem of poor dropping of the driver 12 and making the imaging quality of the anti-shake imaging module 100 relatively stable.

[0091] The circuit board 11 can be any one of a flexible printed circuit (FPC), a printed circuit board (PCB), and a rigid-flex circuit board, and can be specifically set according to actual needs. In this embodiment, the configuration surface 112 of the circuit board 11 is the upper surface shown in the figure, and the configuration surface 112 is a flat surface.

[0092] The driver 12 mainly drives the photosensitive element 13 to move.

[0093] Please refer to Figure 3 , the fixing part 124 includes an outer frame 1241, a cross-shaped bracket 1242, and a driving member 1243. The fixing part 124 is fixed on the circuit board 11. Specifically, the driving member 1243 is fixed on the cross-shaped bracket 1242, and the outer frame 1241 and the cross-shaped bracket 1242 are fixed on the configuration surface 112 of the circuit board 11.

[0094] The driving part 122 includes a moving member 1221 and a carrier 1222. One part of the moving member 1221 is connected to the carrier 1222, and the other part is connected to the cross-shaped bracket 1242 in the fixing part 124. The surface of the carrier 1222 facing away from the circuit board 11 is used to carry the photosensitive element 13.

[0095] In this embodiment, by setting the driving member 1243 to drive the moving member 1221 to move, driving the carrier 1222 to move, so that the photosensitive element 13 carried on the carrier 1222 moves accordingly, thereby aligning the position of the photosensitive element 13 with the optical lens 20 to achieve the anti-shake effect.

[0096] It can be understood that when a plane coordinate system XY is established with the configuration surface 112 of the circuit board 11, the driving part 122 of the driver 12 provided on the configuration surface 112 of the circuit board 11 can translate in the X-axis direction and the Y-axis direction, and rotate in the XY plane, thereby realizing the anti-shake function of translating in the X-axis direction and the Y-axis direction and rotating in the XY plane through the driver 12.

[0097] In this embodiment, the number of drivers 12 is four and they are arranged in a rectangular shape. Correspondingly, the number of photosensitive elements 13 is also four, and the four drivers 12 and the four photosensitive elements 13 are arranged in one-to-one correspondence. It can be understood that in other embodiments, the number of drivers 12 can also be one, two or five, but is not limited thereto.

[0098] In this embodiment, the fixing part 124 and the driving part 122 of the driver 12 together form a Micro-Electro-Mechanic System (MEMS for short). The micro-electro-mechanical system can drive the photosensitive element 13 to move to compensate for the offset of the photosensitive element 13 caused by jitter, thereby realizing the anti-shake function of the anti-shake camera module 100.

[0099] Among them, the anti-shake photosensitive component 10 further includes a first bonding wire 15.

[0100] One end of the first bonding wire 15 is connected to the driving part 122 of the driver 12, and the other end is connected to the fixing part 124 of the driver 12 to realize the electrical connection between the driving part 122 and the fixing part 124. Specifically, a connection pad is provided on the upper surface of both the driving part 122 and the fixing part 124, and both ends of the first bonding wire 15 are fixedly connected to the connection pads of the driving part 122 and the fixing part 124 by welding.

[0101] In this way, the first bonding wire 15 can conduct the driving part 122 and the fixing part 124, and can also use the elastic deformation of the first bonding wire 15 to prevent the fixing part 124 from affecting the movement of the driving part 122.

[0102] It can be understood that there are multiple first bonding wires 15, such as four, five, six, etc., but are not limited thereto, and can be specifically set according to actual needs. Multiple first bonding wires 15 combined together can play the role of suspending the driving part 122.

[0103] It can be understood that the first bonding wire 15 can be made of a conductive material with a certain elasticity such as copper wire, aluminum wire, gold wire, etc., and both ends of the first bonding wire 15 are respectively arranged on the fixing part 124 and the driving part 122 through a wire bonding process.

[0104] The photosensitive element 13 can adopt a Complementary Metal Oxide Semiconductor (CMOS) image sensor or a Charge-coupled Device (CCD).

[0105] Among them, the anti-shake photosensitive component 10 further includes a second bonding wire 16.

[0106] One end of the second bonding wire 16 is connected to the photosensitive element 13, and the other end is connected to the driving part 122 of the driver 12 to achieve the electrical connection between the photosensitive element 13 and the driving part 122. Specifically, a connection pad is also provided on the upper surface of the photosensitive element 13, and both ends of the second bonding wire 16 are fixedly connected to the connection pads of the driving part 122 and the photosensitive element 13 by welding respectively.

[0107] In this way, the second bonding wire 16 can conduct the photosensitive element 13 and the driving part 122, and the elastic deformation of the second bonding wire 16 can also be used to prevent the driving part 122 from affecting the movement of the photosensitive element 13.

[0108] It can be understood that the second bonding wire 16 can be made of a conductive material with a certain elasticity, such as copper wire, aluminum wire, gold wire, etc., and both ends of the second bonding wire 16 are respectively arranged on the photosensitive element 13 and the driving part 122 through a wire bonding process.

[0109] In this embodiment, the ends of the first bonding wire 15 and the second bonding wire 16 connected to the driving part 122 are connected together by a connecting member 17. It can be understood that the connecting member 17 can be a solder pad, conductive adhesive, but is not limited thereto.

[0110] The anti-shake photosensitive component 10 further includes a buffer member 18.

[0111] The buffer member 18 is arranged between the configuration surface 112 of the circuit board 11 and the driver 12.

[0112] In this way, the buffer member 18 can buffer the force received by the driver 12 when the anti-shake imaging module 100 drops.

[0113] Wherein, a receiving groove 1122 is formed on the configuration surface 112, and the buffer member 18 is arranged in the receiving groove 1122.

[0114] In this way, the position of the buffer member 18 can be limited to prevent the buffer member 18 from shifting when the anti-shake imaging module 100 drops, and it can also ensure that the buffer member 18 buffers the force received by the driver 12.

[0115] It can be understood that the buffer member 18 is made of a flexible material and has a certain buffering performance, such as rubber.

[0116] In some embodiments, there is a gap between one end of the buffer member 18 close to the inner side surface 143 of the substrate 14 and the inner side surface 143.

[0117] In this way, it can ensure that there is enough installation gap so that the buffer member 18 is installed between the driver 12 and the configuration surface 112 of the circuit board 11.

[0118] The substrate 14 is a rotating body. The substrate 14 has a first connection surface 142 and an inner side surface 143.

[0119] In this embodiment, the first connection surface 142 is the lower bottom surface of the substrate 14. The first connection surface 142 is disposed close to the circuit board 11 and fixedly connected to the configuration surface 112. Specifically, the first connection surface 142 and the configuration surface 112 are fixedly connected by welding. Before welding, an anisotropic conductive film (ACF) needs to be coated at the position of the configuration surface 112 corresponding to the first connection surface 142.

[0120] A part of the inner side surface 143 extends towards the optical axis to form a protruding portion 144. A second connection surface 145 is provided on the side of the protruding portion 144 close to the circuit board 11. The accommodation groove 141 is formed by enclosing the second connection surface 145, the inner side surface 143, and the configuration surface 112.

[0121] The substrate 14 further has a conductive portion 146. One end of the conductive portion 146 penetrates through the first connection surface 142 and is electrically connected to the circuit board 11, and the other end of the conductive portion 146 penetrates through the second connection surface 145 and is electrically connected to the fixing portion 124. In this embodiment, the substrate 14 is made of a ceramic material, and the conductive portion 146 is made of a metal material, such as copper or aluminum. The conductive portion 146 is formed inside the substrate 14. In this way, the substrate 14 is fixedly connected to the circuit board 11 through the first connection surface 142, the electrical connection between the fixing portion 124 of the driver 12 and the circuit board 11 is realized through the conductive portion 146, and the second connection surface 145 of the protruding portion 144 effectively protects the driver 12 when the anti-shake camera module 100 drops, and the problem of poor dropping of the driver 12 can be avoided.

[0122] It can be understood that in other embodiments, the conductive portion 146 is disposed on the surface of the substrate 14. Specifically, the conductive portion 146 can form a coating on the surface of the substrate 14 by electroplating.

[0123] It can be understood that in other embodiments, a part of the conductive portion 146 is disposed inside the substrate 14, and the other part is disposed on the surface of the substrate 14, such as at least one of the second connection surface 145 and the inner side surface 143.

[0124] It can be understood that in other embodiments, the substrate 14 can also be composed of two circuit boards.

[0125] In this embodiment, the connection pad on the side of the fixing portion 124 facing away from the configuration surface 112 of the circuit board 11 is electrically connected to the conductive portion 146 through a solder joint. In this way, the electrical connection between the circuit board 11 and the fixing portion 124 can be realized.

[0126] In this embodiment, a filling space 147 is formed between the receiving groove 141 and the fixing portion 124 of the driver 12. The filling space 147 is generally annular and is disposed around the driver 12.

[0127] In some embodiments, the anti-shake photosensitive component 10 further includes:

[0128] A filling body 19, which is filled in the filling space 147.

[0129] In this way, the filling body 19 can connect the circuit board 11, the fixing portion 124 of the driver 12 and the substrate into a whole, increasing the anti-drop performance of the driver 12.

[0130] The optical lens 20 is disposed on the light-sensitive path of the light-sensitive element 23 to form an anti-shake imaging module 100.

[0131] The number of the optical lenses 20 can be one or multiple. Each optical lens 20 can include one lens or multiple lenses, which can be specifically set according to actual needs and are not limited herein.

[0132] Please refer to Figure 4 , a second embodiment of the present application provides an anti-shake imaging module 200, including an anti-shake photosensitive component 210 and an optical lens 220. The anti-shake photosensitive component 110 includes a circuit board 211, a driver 212, a photosensitive element 213 and a substrate 214. The circuit board 211 includes a configuration surface 2112. The driver 212 is disposed on the configuration surface 2112 of the circuit board 211. The driver 212 includes a driving portion 2122 and a fixing portion 2124 that are electrically connected. The fixing portion 2124 is disposed on one side of the driving portion 2122. The photosensitive element 213 is disposed on the side of the driving portion 2122 of the driver 212 away from the circuit board 211 and is electrically connected to the driving portion 2122. The substrate 214 is disposed on the configuration surface 2112 of the circuit board 211 and is electrically connected to the circuit board 211. The substrate 214 is located on the side of the fixing portion 2124 away from the driving portion 2122, and a receiving groove 2141 is formed on the side of the substrate 214 close to the fixing portion 2124. The structure of the anti-shake imaging module 200 in the second embodiment is substantially the same as that of the anti-shake imaging module 100 in the first embodiment, except that: the fixing portion 2124 is located in the receiving groove 2141 and is electrically connected to the substrate 214.

[0133] In the anti-shake photosensitive component 10 of the second embodiment, the photosensitive element 13 is moved by the driving part 122 of the driver 12 to compensate for the offset of the photosensitive element 13 caused by shaking, thereby realizing the anti-shake function of the anti-shake imaging module 100; moreover, since the entire fixing part 124 of the driver 12 is located in the receiving groove 141, when the anti-shake imaging module 100 drops, the substrate 14 can effectively protect the fixing part 124, and the problem of poor drop of the driver 12 can be avoided, making the imaging quality of the anti-shake imaging module 100 relatively stable.

[0134] Please refer to Figure 5 , an electronic device 1000 is further provided in an embodiment of the present application, including a main body 300 and the anti-shake imaging module 100 in the first embodiment or the anti-shake imaging module 200 in the second embodiment, and the anti-shake imaging module 100 in the first embodiment or the anti-shake imaging module 200 in the second embodiment is disposed on the main body 300.

[0135] The electronic device 1000 includes, but is not limited to, electronic devices that support imaging such as smart phones, tablet computers, laptop computers, e-book readers, portable multimedia players (PMPs), portable telephones, video telephones, digital still cameras, mobile medical devices, wearable devices, etc.

[0136] The above-mentioned electronic device 1000 includes an anti-shake imaging module 100. In the anti-shake imaging module 100, the anti-shake photosensitive component 10 moves the photosensitive element 13 through the driving part 122 of the driver 12 to compensate for the offset of the photosensitive element 13 caused by shaking, thereby realizing the anti-shake function of the anti-shake imaging module 100; moreover, since a part of the fixing part 124 of the driver 12 is located in the receiving groove 141, when the anti-shake imaging module 100 drops, the substrate 14 can effectively protect the fixing part 124, and the problem of poor drop of the driver 12 can be avoided, making the imaging quality of the anti-shake imaging module 100 relatively stable.

[0137] The above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit them. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application. Those skilled in the art can also make other changes within the spirit of the present application for use in the design of the present application, as long as they do not deviate from the technical effects of the present application. These changes made in accordance with the spirit of the present application should all be included within the scope claimed by the present application.

Claims

1. An anti-shake photosensitive component, characterized in that, Comprising: A circuit board, the circuit board including a configured surface; A driver, disposed on the configured surface of the circuit board, the driver including a driving portion and a fixing portion that are electrically connected, the fixing portion being disposed on one side of the driving portion, the fixing portion including an outer frame, a cross-shaped bracket, and a driving member, the driving member being fixedly disposed on the cross-shaped bracket, the outer frame and the cross-shaped bracket being fixed on the configured surface; the driving portion including a moving member and a stage, a part of the moving member being connected to the stage, and another part being connected to the cross-shaped bracket; wherein when a planar coordinate system XY is established with the configured surface of the circuit board, the driving portion of the driver disposed on the configured surface of the circuit board can translate in the X-axis direction and the Y-axis direction, and rotate in the XY plane, so as to achieve anti-shake of translating in the X-axis direction and the Y-axis direction and rotating in the XY plane through the driver; A photosensitive element, disposed on the side of the stage of the driving portion of the driver facing away from the circuit board, and electrically connected to the driving portion, the driving member driving the moving member to move and driving the stage to move, so that the photosensitive element mounted on the stage follows the movement; and A substrate, disposed on the configured surface of the circuit board and electrically connected to the circuit board, the substrate being located on the side of the fixing portion facing away from the driving portion, and a receiving groove being formed on the side of the substrate close to the fixing portion, at least a part of the fixing portion being located in the receiving groove and electrically connected to the substrate, the substrate having a conductive portion therein, one end of the conductive portion being electrically connected to the circuit board, and the other end of the conductive portion being electrically connected to the fixing portion.

2. The anti-shake photosensitive component according to claim 1, wherein The substrate has a first connection surface and an inner side surface, the first connection surface being disposed close to the circuit board and fixedly connected to the configured surface, a part of the inner side surface extending towards the optical axis to form a protruding portion, a second connection surface being provided on the side of the protruding portion close to the circuit board, and the receiving groove being formed by enclosing the second connection surface, the inner side surface, and the configured surface.

3. The anti-shake photosensitive component according to claim 2, wherein The conductive portion is disposed inside the substrate; Or, the conductive portion is disposed on the surface of the substrate; Or, a part of the conductive portion is disposed inside the substrate, and another part is disposed on the surface of the substrate.

4. The anti-shake photosensitive component according to claim 2, wherein The side of the fixing portion facing away from the configured surface of the circuit board is electrically connected to the conductive portion through a solder joint.

5. The anti-shake photosensitive component according to claim 1, wherein A filling space is formed between the receiving groove and the fixing portion of the driver, and the anti-shake photosensitive assembly further includes: A filling body, filled in the filling space.

6. The anti-shake photosensitive component according to claim 2, wherein Further including: A buffer member, disposed between the configured surface of the circuit board and the driver.

7. The anti-shake photosensitive component according to claim 6, wherein One end of the buffer member close to the inner side surface of the substrate has a gap with the inner side surface.

8. The anti-shake photosensitive component according to claim 6 or 7, characterized in that, The configured surface is provided with a receiving groove, and the buffer member is disposed in the receiving groove.

9. The anti-shake photosensitive component according to claim 1, wherein, Further including: A first wire bonding, one end of the first wire bonding being connected to the driving portion of the driver, and the other end being connected to the fixing portion of the driver.

10. The anti-shake photosensitive component according to claim 1, characterized in that Further including: A second wire bonding, one end of the second wire bonding being connected to the photosensitive element, and the other end being connected to the driving portion of the driver.

11. The anti-shake photosensitive component according to claim 1, characterized in that The driving part and the fixing part together form a microelectromechanical system.

12. An anti-shake camera module, characterized in that, Comprising: An anti-shake photosensitive component according to any one of claims 1-11; And An optical lens disposed on the photosensitive path of the anti-shake photosensitive component.

13. An electronic device, characterized in that, Comprising: A body; And An anti-shake imaging module according to claim 12, the anti-shake imaging module being disposed on the body.

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