Display device

Abstract

A display device is provided. The display device includes a substrate, an insulating layer on a top surface of the substrate, a plurality of light emitting diodes on the insulating layer and including two light emitting diodes separated from each other and having a transmission area between the two light emitting diodes, an encapsulation member covering the plurality of light emitting diodes, and a back cover layer on a back surface of the substrate and including a first portion in the transmission area, wherein the first portion includes a transparent material.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2019-0122504, filed on October 2, 2019, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to a display device, for example, to a display device including a transmission area. Background Technology

[0003] Recently, the applications of display devices have become more diversified. As display devices have become thinner and lighter, their range of uses has gradually expanded.

[0004] The area occupied by the display area of ​​a display device has increased (e.g., relative to the overall size of the display device), and functions that can be combined with or associated with the display device are being added. As a way to add various functions while increasing the area, research is ongoing on display devices that include areas for adding various functions within the display area rather than displaying images. Summary of the Invention

[0005] The area used to add various functions within the display area may include a transmission area capable of transmitting light and / or sound. One or more embodiments include a display device having a structure in which the quality of light transmission in the transmission area can be improved. However, it should be understood that the embodiments described herein are to be considered in a descriptive sense only and are not intended to limit disclosure.

[0006] Additional aspects of the embodiments will be set forth in part in the description which follows, and will be partly obvious from the description, or may be learned by practice of the disclosed embodiments.

[0007] According to one or more embodiments, a display device includes: a substrate; an insulating layer located on a top surface of the substrate; a plurality of light-emitting diodes (LEDs) located on the insulating layer, including two LEDs spaced apart from each other and having a transmission region between the two LEDs; an encapsulation member covering the plurality of LEDs; and a rear cover layer located on a rear surface of the substrate, including a first portion located in the transmission region, wherein the first portion includes a transparent material.

[0008] The difference between the refractive index of the first portion of the back cover layer and the refractive index of the substrate can be 0.5 or less.

[0009] The back surface of the substrate may include a plurality of pits, and at least one of the pits located in the transmission region may be filled with the transparent material of the first portion.

[0010] The substrate may include glass materials and / or polymer resins.

[0011] The insulating layer may include: a first insulating layer located on the top surface of the substrate; a second insulating layer located between the semiconductor layer of the transistor and the gate electrode, the transistor being located on the first insulating layer; and a third insulating layer located between the transistor and a plurality of light-emitting diodes, wherein at least one selected from the first insulating layer, the second insulating layer and the third insulating layer may include a via located in the transmission region.

[0012] Each of the first insulating layer, the second insulating layer, and the third insulating layer may include a through-hole located in the transmission region, and the width of the through-hole having the smallest dimension may be smaller than the width of the first portion.

[0013] The back cover layer may include a first portion and a second portion surrounding the first portion, and the thickness of the second portion may be greater than the thickness of the first portion, such that the first portion and the second portion together form a step difference in the back cover layer.

[0014] The step difference between the first part and the second part can have an inclined surface, and the thickness of the portion of the back cover layer that forms the inclined surface can be greater than the thickness of the first part and less than the thickness of the second part.

[0015] The first part can be separated from the second part.

[0016] The back cover layer may include: a first sublayer located on the back surface of the substrate and including a first portion; and a second sublayer located on the first sublayer and including an opening corresponding to the transmission area.

[0017] The second sublayer may include materials that are different from those in the first sublayer.

[0018] The encapsulation component may include an encapsulation substrate made of glass material.

[0019] The display device may also include an air layer between the substrate and the encapsulation substrate.

[0020] The display device may also include a transparent material layer between the substrate and the encapsulation substrate.

[0021] The encapsulation component may include a thin-film encapsulation layer, which includes at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0022] The thin-film encapsulation layer may include holes corresponding to the transmission area.

[0023] According to one or more embodiments, a display device includes: a substrate; a display layer located on a top surface of the substrate and including two pixels spaced apart from each other and having a transmission region between the two pixels; and a back cover layer located on a rear surface of the substrate and including a first portion corresponding to the transmission region, wherein the first portion of the back cover layer includes a transparent material.

[0024] The difference between the refractive index of the first portion of the back cover layer and the refractive index of the substrate can be 0.5 or less.

[0025] The substrate may include glass materials and / or polymer resins.

[0026] The back surface of the substrate may include a plurality of pits, and at least one of the pits corresponding to the transmission area may be filled with a first portion of transparent material.

[0027] The display layer may include: at least one insulating layer located on the top surface of the substrate and including a via corresponding to the transmission area; and a pixel electrode, a counter electrode, and an intermediate layer, all located on at least one insulating layer, the intermediate layer being located between the pixel electrode and the counter electrode.

[0028] The display layer may include holes located in the transmission area.

[0029] The width of the hole in the display layer can be smaller than the width of the first part.

[0030] The back cover layer may include a first portion and a second portion surrounding the first portion, and the thickness of the second portion may be greater than the thickness of the first portion, such that the first portion and the second portion together form a step difference in the back cover layer.

[0031] The step difference between the first part and the second part can have an inclined surface, and the thickness of the portion of the back cover layer that forms the inclined surface can be greater than the thickness of the first part and less than the thickness of the second part.

[0032] The first part can be separated from the second part.

[0033] The back cover layer may include: a first sublayer located on the back surface of the substrate and including a first portion; and a second sublayer located on the first sublayer and including an opening corresponding to the transmission area.

[0034] The second sublayer may include materials that are different from those in the first sublayer.

[0035] The display device may also include an encapsulation substrate that covers the display layer and includes glass material.

[0036] The display device may also include an air layer between the substrate and the encapsulation substrate.

[0037] The display device may also include a transparent material layer between the substrate and the encapsulation substrate.

[0038] The display device may also include a thin-film encapsulation layer that covers the display layer and includes at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0039] The thin-film encapsulation layer may include holes corresponding to the transmission area.

[0040] The above and other aspects and features of the specific embodiments disclosed will become clearer from the following description, drawings and claims. Attached Figure Description

[0041] The above and other aspects and features of the specific embodiments disclosed will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0042] Figure 1 This is a perspective view of a display device according to an embodiment;

[0043] Figure 2 This is a cross-sectional view of a display device according to an embodiment;

[0044] Figure 3 This is a cross-sectional view of an electronic device including a display device according to an embodiment;

[0045] Figure 4 This is a plan view of the display panel according to an embodiment;

[0046] Figure 5 This is an equivalent circuit diagram of the pixels of the display panel according to an embodiment;

[0047] Figure 6 This is a plan view of a portion of the display panel according to an embodiment;

[0048] Figure 7A This is a cross-sectional view of the display panel according to an embodiment;

[0049] Figure 7B yes Figure 7A An enlarged sectional view of part VII;

[0050] Figure 7C This is a cross-sectional view of the display panel according to an embodiment;

[0051] Figure 8 This is a cross-sectional view of the display panel according to an embodiment;

[0052] Figure 9 This is a cross-sectional view of the display panel according to an embodiment;

[0053] Figure 10 This is a cross-sectional view of the display panel according to an embodiment;

[0054] Figure 11 This is a cross-sectional view of the display panel according to an embodiment;

[0055] Figure 12 This is a cross-sectional view of the display panel according to an embodiment;

[0056] Figure 13 This is a cross-sectional view of the display panel according to an embodiment;

[0057] Figure 14 This is a plan view of a mask for forming a back cover layer according to an embodiment;

[0058] Figure 15 This is a cross-sectional view of the display panel according to an embodiment;

[0059] Figure 16 This is a plan view of a mask for forming a back cover layer according to an embodiment;

[0060] Figure 17 This is a cross-sectional view of the display panel according to an embodiment;

[0061] Figure 18 This is a cross-sectional view of the display panel according to an embodiment;

[0062] Figure 19 It is a cross-sectional view of the display panel according to the embodiment; and

[0063] Figure 20 This is a cross-sectional view of the display panel according to an embodiment. Detailed Implementation

[0064] Referring now to embodiments in more detail, examples of which are shown in the accompanying drawings, wherein the same reference numerals always denote the same elements. In this respect, the given embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments described below are described only with reference to the accompanying drawings to explain aspects of the embodiments described herein. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, and all of a, b, and c, or variations thereof.

[0065] The given embodiments are described in more detail below with reference to the accompanying drawings. In the drawings, the same reference numerals are given to the same or corresponding elements, and repeated descriptions thereof are omitted.

[0066] It will be understood that although the terms “first,” “second,” etc., may be used here to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0067] Unless the context clearly indicates otherwise, the singular forms “a,” “a,” and “the” as used herein are also intended to include the plural forms.

[0068] It will be further understood that the terms “comprising” and / or “including” as used herein indicate the presence of the described feature or component, but do not exclude the presence or addition of one or more other features or components.

[0069] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, that layer, region, or component can be formed directly or indirectly on the other layer, region, or component. For example, intermediate layers, intermediate regions, or intermediate components can exist.

[0070] For ease of explanation, the dimensions of the elements in the accompanying drawings may be exaggerated. In other words, because the dimensions and thicknesses of the components in the accompanying drawings may be arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0071] When an embodiment can be implemented differently, a particular process sequence can be performed in a different order than that described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0072] It will be understood that when a layer, region, or component is referred to as being "bonded" to another layer, region, or component, it can be "directly bonded" to another layer, region, or component, and / or can be "indirectly bonded" to another layer, region, or component, with other layers, regions, or components situated between them. For example, it will be understood that when a layer, region, or component is referred to as being "electrically bonded" to another layer, region, or component, it can be "directly electrically bonded" to another layer, region, or component, and / or can be "indirectly electrically bonded" to another layer, region, or component, with other layers, regions, or components situated between them.

[0073] Figure 1 This is a perspective view of a display device according to an embodiment.

[0074] Reference Figure 1The display device 1 may include a first region A1 and a second region A2 surrounding the first region A1. Multiple pixels (e.g., a pixel array) may be located in the second region A2. In some embodiments, the pixel array is located in the second region A2 and not in the first region A1 (e.g., only the second region A2 may include pixels, while the first region A1 may not include any pixels). The second region A2 may display an image via the pixel array. The second region A2 corresponds to an effective area where an image can be displayed. The first region A1 may be completely surrounded by the second region A2. The first region A1 may be an area in which components can be included, providing various suitable functions for the display device 1. For example, when the components include a light sensor, camera, etc., the first region A1 corresponds to a transmission area that can transmit light (e.g., visible light, infrared light, and / or ultraviolet light) from the sensor or light traveling towards the camera. In some embodiments, when the components include a sound sensor (e.g., ultrasound), the first region A1 corresponds to a transmission area that can transmit sound (e.g., ultrasound) from the sensor. For example, the transmission area can transmit sound (e.g., ultrasound) to or from the sensor.

[0075] The third region A3 can be located between the first region A1 and the second region A2. The third region A3 can be a non-display area where no pixels are arranged. For example, the third region A3 may not contain any pixels. Similarly, the fourth region A4 surrounding the second region A2 can be a non-display area where no pixels are arranged. For example, the fourth region A4 may not contain any pixels. Various suitable types of wiring, circuits, etc., can be located in the fourth region A4.

[0076] Each pixel of the display device 1 may include a light-emitting diode (LED) as a display element capable of emitting light (e.g., visible light) of a set color or a predetermined color. The LED may include an organic light-emitting diode (OLED) comprising an organic material as an emitting layer. In some embodiments, the LED may include an inorganic LED. In some embodiments, the LED may include quantum dots as an emitting layer. Hereinafter, for ease of description, the case of an organic LED will be described, but this disclosure is not limited thereto.

[0077] Despite Figure 1The illustration shows a first region A1 located in the center of a second region A2 in the width direction (e.g., ±x direction) of the display device 1, but the embodiment is not limited thereto. In another embodiment, the first region A1 may be offset to the left or right in the width direction of the display device 1. In some embodiments, the first region A1 may be located in various suitable positions, such as the upper side, center, or bottom side in the longitudinal direction (e.g., ±y direction) of the display device 1. As used herein, the term "±x direction" may refer to along... Figure 1 In either direction of the x-axis shown, the term "±y direction" can refer to along... Figure 1 The y-axis is shown in any direction. Figure 1 The z-axis shown is perpendicular or substantially perpendicular to the x-axis and y-axis.

[0078] Despite Figure 1 The illustration shows a display device 1 including a first region A1, but in another embodiment, the display device 1 may include multiple first regions A1.

[0079] Figure 2 It is along Figure 1 A cross-sectional view of the display device 1 according to the embodiment, taken by line II-II'. Figure 3 This is a cross-sectional view of an electronic device 2 including a display device 1 according to an embodiment.

[0080] Reference Figure 2 The display device 1 may include a display panel 10, a rear cover layer 20 located on the rear side (rear surface) of the display panel 10, an input sensing unit 40 located on the top surface of the display panel 10, and an optical functional unit 50 located on the top surface of the display panel 10. The window 60 may be bonded to the components below it, such as the optical functional unit 50, by means of an adhesive layer (such as optically clear adhesive (OCA)).

[0081] The display panel 10 may include a plurality of diodes in the second region A2. In some embodiments, the plurality of diodes are located only in the second region A2 (e.g., the plurality of diodes are not in the first region A1, the third region A3, and / or the fourth region A4). The rear cover layer 20 may cover at least a portion of the rear side of the display panel 10 while filling the fine recessed structure (hereinafter referred to as a pit) that appears during the manufacturing process of the display panel 10. The recessed structure (e.g., pit) described herein may have any suitable shape, such as a semi-circular structure, etc.

[0082] The input sensing unit 40 can acquire coordinate information corresponding to external inputs such as touch events (e.g., a user's touch or proximity touch). The input sensing unit 40 may include sensing electrodes or touch electrodes and traces coupled to the sensing electrodes or touch electrodes. The input sensing unit 40 may be located on the display panel 10. The input sensing unit 40 can sense external inputs (e.g., a user's touch or proximity touch) using mutual capacitance or self-capacitance methods.

[0083] The input sensing unit 40 can be formed directly on the display panel 10. In some embodiments, the input sensing unit 40 can be formed separately and then bonded to the display panel 10 by an adhesive layer (such as optically clear adhesive (OCA)). In embodiments, such as Figure 2 As shown, the input sensing unit 40 can be formed directly on the display panel 10. In this case, the adhesive layer may not be between the input sensing unit 40 and the display panel 10.

[0084] The optical functional unit 50 may include a reflection-preventing layer. The reflection-preventing layer can reduce the reflectivity (e.g., reflection) of light (external light, e.g., visible light) incident from the outside through the window 60 toward the display panel 10. The reflection-preventing layer may include a retarder and a polarizer. The retarder may include a film-type retarder or a liquid crystal-type retarder. The retarder may include a half-wavelength (λ / 2) retarder and / or a quarter-wavelength (λ / 4) retarder. The polarizer may include a film-type polarizer or a liquid crystal-type polarizer. A film-type polarizer may include a stretchable synthetic resin film, and a liquid crystal-type polarizer may include a liquid crystal that is set or pre-arranged. Each of the retarder and polarizer may also independently include a protective film.

[0085] In another embodiment, the anti-reflection layer may include structures such as a black matrix and color filters. The color filters can be arranged considering the colors of various lights emitted from the pixels of the display panel 10. For example, the color filters can be arranged according to the colors of the light emitted from the pixels of the display panel 10. In another embodiment, the anti-reflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer located on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, can produce destructive interference, thus reducing the reflectivity (e.g., reflection) of external light through the destructive interference structure.

[0086] The optical functional unit 50 may include a lens layer. The lens layer can improve the emission efficiency of light emitted from the display panel 10 or reduce color deviation (e.g., undesirable color changes). The lens layer may include a layer having a concave or convex lens shape, and / or include multiple layers with different refractive indices. For example, the respective refractive indices of the multiple layers may be different from each other. The optical functional unit 50 may include both an anti-reflection layer and a lens layer, or include one of these layers.

[0087] Reference Figure 3 The display device 1 can be provided to various suitable electronic devices 2, such as mobile phones, tablet computers, laptop computers, and smartwatches. The electronic device 2 may include a housing HS having space within it. The display panel 10 may be located inside the housing HS. The window 60 may be integrated into the housing HS. As described above, the input sensing unit 40 and the optical function unit 50 may be located on the top surface of the display panel 10. The rear cover layer 20 may be located on the rear side of the display panel 10.

[0088] The component CM can be inside the housing HS and located between the display panel 10 and the bottom of the housing HS. The component CM can be located in a first region A1. The component CM can include electronic components. For example, the component CM can be an electronic component that uses light or sound (e.g., transmitting or receiving sound (e.g., ultrasound), visible light, infrared light, and / or ultraviolet light and performing operations based on the received light or sound). For example, the electronic component can be a sensor such as an infrared sensor that emits and / or receives light, a camera that receives light and captures an image, a sensor that outputs and senses light to measure distance or identify fingerprints, a small lamp that outputs light, a speaker for outputting sound, and / or a sensor for receiving sound (e.g., ultrasound). The electronic component using light can use light in various suitable wavelengths, such as visible light, infrared light, and / or ultraviolet light. In an embodiment, the first region A1 can be a transmission region through which light output from the component CM to the outside or propagating from the outside toward the component CM can pass. For example, in the case where the component CM includes a camera, the transmission rate (e.g., light transmittance) of the first region A1 in the display device 1 can be about 80% or greater. In some embodiments, where the component CM includes a sensor, the transmission rate (e.g., light transmission rate and / or sound transmission rate) of the first region A1 in the display device 1 can be a value less than 80%, for example, 50% or more, or 60% or more.

[0089] To prevent or reduce the decrease in transmission rate caused by elements in the path of light emitted from or traveling toward the component CM, at least one of the display panel 10, the input sensing unit 40, and the optical function unit 50 may include a hole. In an embodiment, Figure 2Each of the input sensing unit 40 and the optical function unit 50 is shown to include a hole.

[0090] Reference Figure 2 The input sensing unit 40 may include a first hole 40H passing through the top and bottom surfaces of the input sensing unit 40, and the optical function unit 50 may include a second hole 50H passing through the top and bottom surfaces of the optical function unit 50. The first hole 40H and the second hole 50H may be located in the first region A1 and may be stacked on top of each other.

[0091] The display panel 10 may not include holes passing through its top and bottom surfaces. In this case, a recess may be present on the rear side of the display panel 10. Because the recess itself can function as a lens due to its shape, the travel of waves (e.g., light waves and / or sound waves) traveling toward or from the component CM will be distorted due to the recess. However, according to an embodiment, because the rear cover layer 20 is configured to directly contact the rear side of the display panel 10, the aforementioned distortion problem can be prevented or reduced.

[0092] The rear cover layer 20 may include a transparent material, wherein the difference between the refractive index of the transparent material and the refractive index of the display panel 10 (e.g., the substrate of the display panel 10) is 0.5 or less. Because, as described above, the first region A1 is a transmission region in which the component CM can be arranged, in order to prevent or reduce the reduction in the transmission rate of the first region A1, the first portion 21 of the rear cover layer 20 corresponding to the first region A1 may have a thinner thickness than the other portions 22 (hereinafter referred to as the second portion).

[0093] Figure 4 This is a plan view of the display panel 10 according to an embodiment. Figure 5 This is the equivalent circuit diagram of pixel P in pixel P of display panel 10.

[0094] The diagram of display panel 10 can be referenced above. Figure 1 The diagrams of the described display device 1 are basically the same. For example, as shown... Figure 4 As shown, the display panel 10 may include a first region A1, a second region A2, a third region A3 and a fourth region A4, with the second region A2 surrounding the first region A1, the third region A3 between the first region A1 and the second region A2, and the fourth region A4 surrounding the second region A2.

[0095] Display panel 10 may include multiple pixels P in the second area A2. For example... Figure 5As shown, each pixel P includes a pixel circuit PC and an organic light-emitting diode (OLED) incorporated into the pixel circuit PC as a display element. The pixel circuit PC may include a first transistor T1, a second transistor T2, and a storage capacitor Cst. Each pixel P can emit, for example, red, green, or blue light from the OLED, or emit red, green, blue, or white light. The first transistor T1 and the second transistor T2 can be implemented as thin-film transistors.

[0096] The second transistor T2 is a switching transistor. The second transistor T2 can be coupled to the scan line SL and the data line DL, and is configured to transfer the data voltage input from the data line DL to the first transistor T1 in response to a switching voltage input from the scan line SL. A storage capacitor Cst can be coupled to the second transistor T2 and the drive voltage line PL, and can store a voltage corresponding to the difference between the voltage transferred from the second transistor T2 and the first power supply voltage ELVDD supplied through the drive voltage line PL.

[0097] The first transistor T1 is a driving transistor. The first transistor T1 can be coupled to a driving voltage line PL and a storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL through the organic light-emitting diode (OLED) in response to the voltage stored in the storage capacitor Cst. The OLED can emit light with a set or predetermined brightness by using the driving current. The opposite electrode (e.g., the cathode) of the OLED can receive a second power supply voltage ELVSS.

[0098] Despite Figure 5 The pixel circuit PC shown includes two thin-film transistors and one storage capacitor, but this disclosure is not limited thereto. For example, the number of thin-film transistors and the number of storage capacitors can be modified in various ways depending on the design of the pixel circuit PC.

[0099] Refer again Figure 4A third region A3 may surround the first region A1. The third region A3 is the area in which no display element, such as an organic light-emitting diode (OLED) emitting light, is arranged. Signal lines may pass through the third region A3, providing signals to pixels P arranged around the first region A1. A first scan driver 1100, a second scan driver 1200, a data driver 1300, and a main power line may be located in a fourth region A4. The first scan driver 1100 and the second scan driver 1200 provide scan signals to each pixel P, the data driver 1300 provides data signals to each pixel P, and the main power line provides a first power supply voltage ELVDD and a second power supply voltage ELVSS. Both the first scan driver 1100 and the second scan driver 1200 may be located in the fourth region A4 and on two opposite sides of the second region A2, with the second region A2 between them.

[0100] Despite Figure 4 The diagram shows the data driver 1300 adjacent to one side of the substrate 100, but in another embodiment, the data driver 1300 may be located on a flexible printed circuit board (FPCB) electrically bonded to a pad (also known as a "soldering pad") on one side of the display panel 10.

[0101] Figure 6 This is a plan view of a portion of the display panel 10 according to an embodiment.

[0102] Reference Figure 6 Some pixels P in the second region A2 can be separated from each other around the first region A1. For example, the first region A1 can be between two pixels P arranged along the ±x direction. Similarly, the first region A1 can be between two pixels P arranged along the ±y direction.

[0103] Two pixels P arranged in the ±y direction and having a first region A1 therebetween can be electrically coupled to the same data line DL, and the data line DL can be curved in a third region A3. For example, a portion of the data line DL can extend in the third region A3 along the edge or periphery of the first region A1 (e.g., in the periphery or arc direction of the first region A1). The data line DL can include a first portion DL-L1, a second portion DL-L2, and a third portion DL-D, the first portion DL-L1 and the second portion DL-L2 extending in the ±y direction and passing through the second region A2, and the third portion DL-D coupled to the first portion DL-L1 and the second portion DL-L2 and extending in the periphery or arc direction of the first region A1.

[0104] Two pixels P arranged in the ±x direction and having a first region A1 between them can be electrically coupled to different scan lines SL. The scan line SL on the left side of the first region A1 can be electrically coupled to the reference above. Figure 4 The first scan driver 1100 described above, the scan line SL on the right side of the first region A1 can be electrically coupled to the reference above. Figure 4 The second scan driver 1200 is described. (e.g.) Figure 4 As shown, when the display panel 10 includes two scan drivers, the pixels P arranged on two opposite sides of the first region A1 can be electrically coupled to the scan lines SL arranged on two opposite sides of the first region A1 and separated from each other.

[0105] In another embodiment, in one of the scan drives (e.g., the second scan drive 1200 (see...) Figure 4 If )) is omitted, two pixels P arranged in the ±x direction and having a first region A1 therebetween can be combined to the same scan line SL, and similar to the data line DL, the scan line SL can include a portion of the third region A3 that extends along the periphery or arc direction of the first region A1.

[0106] Figure 7A It is along Figure 4 A cross-sectional view of the display panel 10 according to the embodiment, taken by line III-III'. Figure 7B yes Figure 7A Enlarged sectional view of part VII, Figure 7C It is along Figure 4 A cross-sectional view of the display panel 10 according to the embodiment, taken by line III-III'.

[0107] Reference Figure 7A The display panel 10 may include a display layer 200 located on a substrate 100A. The substrate 100A may include a glass material. For example, the substrate 100A may include glass containing silicon oxide (SiO2) as a major component. The substrate 100A may include alkali-free glass or soda-lime glass.

[0108] Display layer 200 may include a plurality of pixels located in the second region A2. Each pixel included in display layer 200 may include pixel circuitry and a display element electrically coupled to the pixel circuitry. The pixel circuitry may include transistors and storage capacitors, and the display element may include light-emitting diodes, such as organic light-emitting diodes. Display layer 200 may include a plurality of wirings located in the third region A3.

[0109] A portion of the display layer 200 (e.g., the portion corresponding to the first region A1) can be removed. Regarding this feature, in Figure 7AThe diagram shows a display layer 200 including a fourth hole 200H. The display layer 200 may include the aforementioned pixel circuitry and display elements, and may also include an insulating layer between wirings bonded to each pixel circuitry, between electrodes, and / or between electrodes of the display elements. For example, the holes in the insulating layer of the display layer 200 may overlap each other to form the fourth hole 200H. The fourth hole 200H of the display layer 200 may extend through the top and bottom surfaces of the display layer 200. (See below for reference...) Figure 12 Example structure describing the fourth hole 200H of the display layer 200.

[0110] The display layer 200 may be covered by an encapsulation substrate 300A. The encapsulation substrate 300A may include a glass material. For example, the encapsulation substrate 300A may include a glass material containing SiO2 as a main component. The encapsulation substrate 300A may face the substrate 100A, and a sealant ST may be present between the substrate 100A and the encapsulation substrate 300A. The sealant ST may be located in a fourth region A4 and may completely (or substantially completely) surround the display layer 200 between the substrate 100A and the encapsulation substrate 300A. When viewed in a direction perpendicular to the top surface of the substrate 100A (e.g., in the z-direction or in a plan view), the second region A2 may be completely (or substantially completely) surrounded by the sealant ST.

[0111] like Figure 7B As shown in the enlarged view, the rear side 100Ar of the substrate 100A may include a recess D. The recess D may be generated or formed during the manufacturing process of the display device 1. The shape of the recess D may not be constant, and the position of each recess D may be randomly set.

[0112] The rear cover layer 20 can directly contact the rear side 100Ar of the substrate 100A. The rear cover layer 20 can have a set or predetermined thickness and at least partially fill the pits D formed in the substrate 100A. For example, the pits D can be filled with the material of the rear cover layer 20.

[0113] The back cover layer 20 may include a material in which the difference between the refractive index of the back cover layer 20 and the refractive index of the substrate 100A is 0.5 or less. If the difference between the refractive index of the back cover layer 20 and the refractive index of the substrate 100A deviates from the above value (e.g., greater than 0.5), the orientation of the component CM (see [link to component CM]) may be altered because the recess D can be used as a fine lens. Figure 3 The path of light traveling or emitted from the component CM. For example, if the component CM includes a camera, the image quality obtained by the camera will be degraded or reduced; or if the component CM includes a sensor, the sensed information will be distorted.

[0114] The back cover layer 20 may include organic materials, such as polymers. Polymers may include, for example, acrylic resins, epoxy resins, polyimides, and / or polyethylene.

[0115] The thickness of the back cover layer 20 may not be constant or uniform. The first thickness t of the first portion 21 of the back cover layer 20 corresponding to the first region A1 may be smaller than the second thickness T of the second portion 22 of the back cover layer 20 corresponding to the second region A2. The first thickness t and the second thickness T are thicknesses excluding the depth of the pits D, and the first thickness t and the second thickness T may be measured, for example, between adjacent pits D and another pit D.

[0116] Despite Figure 7A The image shows the rear cover layer 20 completely covering the rear side of the substrate 100A, but in another embodiment, such as... Figure 7C As shown, the rear cover layer 20 may be located on the rear side of the substrate 100A (e.g., only on a portion of the rear side of the substrate 100A) and locally positioned to cover the first region A1 (e.g., only covering the first region A1). For example, the rear cover layer 20 may only include the aforementioned... Figure 7A The first part 21 of the back cover layer 20.

[0117] In reference Figure 7A In the case where the described rear cover layer 20 completely covers the rear side of the substrate 100A, as shown in the figure... Figure 7C Compared to the process of locally positioning the rear cover layer 20 shown, the process can be simplified. Hereinafter, an embodiment in which the rear cover layer 20 covers not only the first region A1 but also other regions is described.

[0118] Figure 8 and Figure 9 It is along Figure 4 A cross-sectional view of the display panel 10' according to the embodiment, taken by line III-III'.

[0119] Reference Figure 8 The display panel 10' may include a display layer 200 and a rear cover layer 20. The display layer 200 is located on the top surface of the substrate 100A, and the rear cover layer 20 is located on the rear side (rear surface) of the substrate 100A, as shown above. Figures 7A to 7C Described. The back cover layer 20 may include a first portion 21 and a second portion 22, the first portion 21 corresponding to the first region A1, and the second portion 22 being thicker than the first portion 21. The back cover layer 20 may include a transparent material, wherein the difference between the refractive index of the transparent material and the refractive index of the substrate 100A is 0.5 or less, and its example material is the same as the example material described above. Set to Figure 8The display layer 200 of the display panel 10' can be covered by the thin film encapsulation layer 300B.

[0120] The thin-film encapsulation layer 300B may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, the thin-film encapsulation layer 300B may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 therebetween.

[0121] Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic insulating material. The inorganic insulating material may include alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride. The organic encapsulation layer 320 may include polymeric materials. Polymeric materials may include acrylic resins, epoxy resins, polyimide, and / or polyethylene. For example, the organic encapsulation layer 320 may include acrylic resins, such as polymethyl methacrylate and polyacrylic acid.

[0122] When the display panel 10' includes a thin-film encapsulation layer 300B as an encapsulation component covering the display layer 200, the display panel 10' can have a larger than the one described above. Figures 7A to 7C The thickness of the described display panel 10 is small.

[0123] In one embodiment, similar to a display layer 200 including a fourth aperture 200H stacked with the first region A1, a thin-film encapsulation layer 300B may include a fifth aperture 300BH stacked with the first region A1. In this case, the transmission rate of the first region A1 can be adequately or sufficiently ensured. In another embodiment, the thin-film encapsulation layer 300B may not include the fifth aperture 300BH, such as... Figure 9 As shown in the illustration. In an embodiment, the first region A1 can be covered by a first inorganic encapsulation layer 310 and a second inorganic encapsulation layer 330. Although in Figure 9 The diagram shows that the first region A1 is not covered by the organic encapsulation layer 320, but in another embodiment, the organic encapsulation layer 320 may cover the first region A1. (Refer to the above...) Figure 2 and Figure 3 As described, when the component CM does not require a relatively high transmission rate, the thin-film encapsulation layer 300B can cover the first region A1.

[0124] Figure 10 and Figure 11 It is along Figure 4 A cross-sectional view of the display panel 10” according to the embodiment, taken by line III-III'.

[0125] Reference Figure 10The display panel 10 may include a display layer 200 and a rear cover layer 20, wherein the display layer 200 is located on the top surface of the substrate 100B, and the rear cover layer 20 is located on the rear side of the substrate 100B. Figure 10 The display layer 200 of the display panel 10” can be covered by a thin-film encapsulation layer 300B. For example, the thin-film encapsulation layer 300B may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 therebetween. The thin-film encapsulation layer 300B is consistent with the above reference. Figure 8 The thin-film encapsulation layer 300B is described as the same.

[0126] The substrate 100B may include a polymer resin and may include multiple layers. For example, the substrate 100B may include a first matrix layer 101, a first barrier layer 102, a second matrix layer 103, and a second barrier layer 104 stacked in sequence.

[0127] Each of the first matrix layer 101 and the second matrix layer 103 may include a polymer resin. For example, the first matrix layer 101 and the second matrix layer 103 may include polymer resins such as polyethersulfone, polyarylate, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate and / or cellulose acetate propionate.

[0128] The first barrier layer 102 and the second barrier layer 104 are barrier layers that prevent or reduce the penetration of external foreign substances, and may include a single layer or multiple layers containing inorganic materials (such as silicon nitride, silicon oxide and / or silicon oxynitride).

[0129] When the substrate 100B of the display panel 10” includes a polymer resin and the display panel 10” includes a thin film encapsulation layer 300B, the flexibility of the display panel 10” can be improved.

[0130] The back cover layer 20 may be located on the rear side of the substrate 100B. The back cover layer 20 may include a first portion 21 and a second portion 22, the first portion 21 corresponding to the first region A1, and the second portion 22 being thicker than the first portion 21. The back cover layer 20 may include a transparent material, wherein the difference between the refractive index of the transparent material and the refractive index of the substrate 100B is 0.5 or less. For example, the back cover layer 20 may include a material whose refractive index differs from the refractive index of a layer of the substrate 100B by 0.5 or less, the latter directly contacting the back cover layer 20. The back cover layer 20 may include an organic material, such as a polymer. The polymer may include, for example, acrylic resins, epoxy resins, polyimides, and / or polyethylene.

[0131] As described above, display layer 200 may include pixel circuitry and display elements. Display layer 200 may include a fourth aperture 200H superimposed on the first region A1. Display layer 200 is the same as the display layer 200 described above.

[0132] Similar to display layer 200, thin-film encapsulation layer 300B may include a fifth hole 300BH superimposed on the first region A1, such as Figure 10 As shown in the diagram. In this case, the transmission rate of the first region A1 can be adequately or sufficiently ensured. In another embodiment, the thin-film encapsulation layer 300B may not include the fifth hole 300BH, as shown in the diagram. Figure 11 As shown in the illustration. In an embodiment, the first region A1 can be covered by a first inorganic encapsulation layer 310 and a second inorganic encapsulation layer 330. Although in Figure 11 The diagram shows that the first region A1 is not covered by the organic encapsulation layer 320, but in another embodiment, the organic encapsulation layer 320 may cover the first region A1. (Refer to the above...) Figure 2 and Figure 3 As described, when the component CM does not require a relatively high transmission rate, the thin-film encapsulation layer 300B can cover the first region A1.

[0133] Figure 12 This is a cross-sectional view of the display panel according to an embodiment.

[0134] Reference Figure 12 The first insulating layer 201, the second insulating layer 203, the third insulating layer 205, the fourth insulating layer 207, the fifth insulating layer 209, and the sixth insulating layer 211 may be located on the substrate 100A. The pixel circuit PC may include a thin-film transistor (TFT) and a storage capacitor (Cst).

[0135] A thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. Figure 12 The thin-film transistor TFT shown in the figure can be a reference. Figure 5 One of the transistors described, for example, is a driving transistor. Although this embodiment shows a top-gate thin-film transistor in which the gate electrode GE is located above the semiconductor layer Act and the second insulating layer 203 is located between them, in another embodiment, the thin-film transistor TFT may be a bottom-gate thin-film transistor in which the gate electrode GE is located below the semiconductor layer Act and the second insulating layer 203 is located between them.

[0136] The semiconductor layer Act may include polycrystalline silicon. In some embodiments, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor. The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material and may include a single layer or multiple layers, said conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), said single layer or multiple layers comprising the above-mentioned materials.

[0137] The second insulating layer 203 between the semiconductor layer Act and the gate electrode GE may include an inorganic insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and / or hafnium oxide. The second insulating layer 203 may include a single layer or multiple layers containing the above materials.

[0138] The source electrode SE and drain electrode DE can comprise materials with excellent conductivity. The source electrode SE and drain electrode DE can comprise conductive materials and can comprise single or multiple layers, said conductive materials including molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), said single or multiple layers comprising the above materials. In an embodiment, the source electrode SE and drain electrode DE can comprise a Ti / Al / Ti multilayer.

[0139] The storage capacitor Cst may include a bottom electrode CE1 and a top electrode CE2 stacked on top of each other and having a third insulating layer 205 therebetween. The storage capacitor Cst may be stacked with a thin-film transistor (TFT). Regarding this feature, Figure 12 The diagram illustrates that the gate electrode GE of the thin-film transistor TFT serves as the bottom electrode CE1 of the storage capacitor Cst. In another embodiment, the storage capacitor Cst may not be stacked with the thin-film transistor TFT. The storage capacitor Cst may be covered by a fourth insulating layer 207.

[0140] The third insulating layer 205 and the fourth insulating layer 207 may include inorganic insulating materials, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and / or hafnium oxide. The third insulating layer 205 and the fourth insulating layer 207 may include a single layer or multiple layers containing the above-mentioned materials.

[0141] The pixel circuit PC, including a thin-film transistor (TFT) and a storage capacitor (Cst), can be covered by a fifth insulating layer 209. The fifth insulating layer 209 is a planarized insulating layer and may include a generally flat top surface. The fifth insulating layer 209 may include an organic insulating material, including general polymers such as polymethyl methacrylate (PMMA) and / or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and / or blends thereof. In an embodiment, the fifth insulating layer 209 may include polyimide.

[0142] Contact metal 260 may be formed on the fifth insulating layer 209. Contact metal 260 may include a conductive material and may comprise a single layer or multiple layers, said conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), said single layer or multiple layers comprising the aforementioned materials. Contact metal 260 may include the same material as the source electrode SE or drain electrode DE of a thin-film transistor (TFT). For example, contact metal 260 may comprise a multilayer of Ti / Al / Ti.

[0143] A sixth insulating layer 211 may be formed on the contact metal 260. The sixth insulating layer 211 may include a generally flat top surface. The sixth insulating layer 211 may include an organic insulating material, including general polymers such as polymethyl methacrylate (PMMA) and / or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and / or blends thereof. In an embodiment, the sixth insulating layer 211 may include polyimide. Although not shown, an inorganic insulating layer may further be located between the fifth insulating layer 209 and the sixth insulating layer 211.

[0144] Pixel electrode 221 may be formed on the sixth insulating layer 211. Pixel electrode 221 may include conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and / or aluminum zinc oxide (AZO). In another embodiment, pixel electrode 221 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), and / or mixtures thereof. In another embodiment, pixel electrode 221 may further include layers comprising ITO, IZO, ZnO, In2O3, IGO, and / or AZO located on and / or under the reflective layer.

[0145] A pixel defining layer 215 may be formed on the pixel electrode 221. The pixel defining layer 215 may include an opening exposing the top surface of the pixel electrode 221 and cover the edge or periphery of the pixel electrode 221. The pixel defining layer 215 may include an organic insulating material. In some embodiments, the pixel defining layer 215 may include an inorganic insulating material, such as silicon oxide, silicon nitride, and / or silicon oxynitride. In some embodiments, the pixel defining layer 215 may include both organic and inorganic insulating materials.

[0146] The intermediate layer 222 may include an emitting layer 222b. The emitting layer 222b may include, for example, an organic material. The emitting layer 222b may include a polymeric organic material and / or a low molecular weight organic material that emits light of a set or predetermined color. The intermediate layer 222 may include a first functional layer 222a located below the emitting layer 222b and / or a second functional layer 222c located on the emitting layer 222b.

[0147] The first functional layer 222a may comprise a single layer or multiple layers. For example, when the first functional layer 222a comprises a polymeric organic material, it may be a hole transport layer (HTL) with a single-layer structure. The first functional layer 222a may comprise poly-(3,4)-ethylenedioxythiophene (PEDOT) and / or polyaniline (PANI). When the first functional layer 222a comprises a low molecular weight organic material, it may comprise a hole injection layer (HIL) and / or a hole transport layer (HTL).

[0148] The second functional layer 222c can be omitted. For example, if the first functional layer 222a and the emitter layer 222b comprise polymeric organic materials, the second functional layer 222c can be formed. The second functional layer 222c can comprise a single layer or multiple layers. The second functional layer 222c can comprise an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0149] The emission layer 222b of the intermediate layer 222 can be arranged for each pixel in the second region A2 (e.g., corresponding to the second region A2). The emission layer 222b can be stacked with the opening of the pixel defining layer 215 and / or the pixel electrode 221. The first functional layer 222a and the second functional layer 222c of the intermediate layer 222 are a single entity and can be disposed not only in the second region A2 but also in the third region A3.

[0150] The counter electrode 223 may include a conductive material with low work function. For example, the counter electrode 223 may include a (semi-)transparent layer comprising Ag, Mg, Al, Ni, Cr, lithium (Li), calcium (Ca), and / or alloys thereof. In some embodiments, the counter electrode 223 may also include a layer comprising ITO, IZO, ZnO, In2O3, IGO, and / or AZO located on and / or under the (semi-)transparent layer comprising the above-described materials. The counter electrode 223 is a single entity and may cover multiple pixel electrodes 221 in the second region A2. In embodiments, the counter electrode 223 may include Ag and Mg.

[0151] The coating 230 may be located on the opposing electrode 223. The coating 230 may include a LiF layer, an inorganic material layer, and / or an organic material layer. In an embodiment, the coating 230 may be omitted.

[0152] The stack located in the opening of the pixel defining layer 215 can correspond to an organic light-emitting diode (OLED). The stack can include a pixel electrode 221, an intermediate layer 222, and a counter electrode 223. Two pixels (e.g., two OLEDs and two pixel circuits PC) can be separated from each other and have a first region A1 therebetween. The OLEDs are located in a second region A2. The display layer 200 can include wiring in a third region A3. In an embodiment, Figure 12 The third part of the data line DL, DL-D, is shown (see...). Figure 6 The third part of the data line DL, DL-D, runs around the edge or part of the periphery of the first region A1 in the third region A3.

[0153] The display layer 200 may include a fourth hole 200H located in the first region A1. The fourth hole 200H may be formed while vias formed in the insulating layers of the display layer 200 are stacked on top of each other. The insulating layers of the display layer 200 (e.g., the first insulating layer 201, the second insulating layer 203, the third insulating layer 205, the fourth insulating layer 207, the fifth insulating layer 209, the sixth insulating layer 211, and the pixel defining layer 215) may each include vias 201h, 203h, 205h, 207h, 209h, and 211h, all located in the first region A1. As described above, the counter electrode 223 may be integrally disposed above the substrate 100A and may include a via 223h located in the first region A1. Some of the intermediate layers 222 (e.g., the first functional layer 222a and the second functional layer 222c) may be integrally disposed (e.g., a single unit or a whole) and may include a via 222h located in the first region A1.

[0154] The fourth hole 200H can be defined by an insulating layer within the insulating layer of the display layer 200, which defines an insulating layer having a small-sized hole. In an embodiment, Figure 12 The diagram shows that the fourth hole 200H is defined by the side surfaces of the through hole 201h of the first insulating layer 201 and the through hole 203h of the second insulating layer 203.

[0155] The encapsulation substrate 300A faces the substrate 100A. In the first region A1, there may be no material included in the display layer 200 between the bottom surface of the encapsulation substrate 300A and the top surface of the substrate 100A. For example, air, a gas (e.g., an inert gas), or a vacuum may be present in the internal space ISP between the substrate 100A and the encapsulation substrate 300A. In some embodiments, only an air layer may exist between the substrate 100A and the encapsulation substrate 300A in the first region A1, and only a transparent material layer may exist in the internal space ISP between the substrate 100A and the encapsulation substrate 300A in the first region A1. The transparent material layer may include a liquid transparent material. In embodiments, the liquid transparent material may include organic and / or inorganic materials having a refractive index similar to or substantially the same as the refractive index of the substrate 100A and the encapsulation substrate 300A. The difference between the refractive index of the liquid transparent material and the refractive index of the substrate 100A and the encapsulation substrate 300A may be 0.5 or less. In embodiments, the transparent material layer may include epoxy resin, urethane acrylate, epoxy acrylate and / or silicone resin (e.g., bisphenol A type epoxy resin (e.g., epoxy resin comprising bisphenol A or its derivatives or epoxy resin made from bisphenol A or its derivatives), alicyclic epoxy resin, phenyl silicone resin and / or rubber, acrylic epoxy resin, aliphatic urethane acrylate, etc.). In some embodiments, silicone and / or silicone oil that do not change phase and have a volume change rate of 5% or less over a temperature range of about -40°C to about 100°C may be used. For example, one of hexamethyldisiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, dodecylpentasiloxane and polydimethylsiloxane may be used.

[0156] Multiple recesses D may be present on the rear side of the substrate 100A, and the recesses D may be filled with the material of the back cover layer 20. The back cover layer 20 may include a material whose refractive index differs from that of the substrate 100A by 0.5 or less. Example materials are the same as those described above.

[0157] The thickness of the first portion 21 of the back cover layer 20 located in the first region A1 can be smaller than the thickness of the second portion 22 of the back cover layer 20 located in other regions. The first portion 21 and the second portion 22 can form a step difference. The width W2 of the first portion 21 can be equal to or greater than the width of the fourth hole 200H of the display layer 200, for example, the width W1 of the through hole 201h of the first insulating layer 201.

[0158] Figure 13 This is a cross-sectional view of the display panel according to an embodiment.

[0159] Reference Figure 13Because the various characteristics of the example structure including substrate 100A, display layer 200 and encapsulation substrate 300A, and the structure in which an air layer or transparent material layer is located in the first region A1 between substrate 100A and encapsulation substrate 300A, are the same as those described above. Figure 12 Since the various characteristics of the described display panel are the same, the following mainly describes the back cover layer 20.

[0160] The back cover layer 20 includes a first portion 21 located in the first region A1, and the thickness of the first portion 21 is less than the thickness of the second portion 22 located in the other regions. The width W2 of the first portion 21 may be equal to or greater than the width of the fourth hole 200H of the display layer 200, for example, the width W1 of the through hole 201h of the first insulating layer 201.

[0161] A step difference may exist between the first portion 21 and the second portion 22, and the step difference may have an inclined surface in a cross-sectional view. For example, the thickness of the step difference portion located between the first portion 21 and the second portion 22 may increase in the direction from the first portion 21 to the second portion 22. The inclined surface may have a slope of less than 90° relative to the rear side of the substrate 100A and / or include a curved surface. The thickness of the first portion 21 is less than the thickness of the second portion 22. The second portion 22 may be defined as a portion having a thickness of about 120% or less of the center thickness of the first portion 21, or a portion having a thickness of about 115% or less of the center thickness of the first portion 21. The width W2 of the first portion 21 may be equal to or greater than the width W1 of the through hole 201h.

[0162] The stepped difference structure between the first portion 21 and the second portion 22 of the aforementioned back cover layer 20 can be achieved by using... Figure 14 The mask shown is used to form it.

[0163] Figure 14 This is a plan view of the mask M1 used to form the back cover layer 20 according to an embodiment.

[0164] Reference Figure 14The mask M1 may include a first shielding portion B1, which includes a first rib B11 and a second rib B12 extending in the y-direction and x-direction, respectively. Multiple first ribs B11 and multiple second ribs B12 may intersect each other to form a mesh structure, and the mask M1 may include multiple first holes H1 located between adjacent ribs. The mask M1 may include second holes H2 in a defined or predetermined region (e.g., inside a virtual circle VC). The size of the second holes H2 may be larger than the size of the first holes H1. Unlike the first holes H1 adjacent in the y-direction and x-direction, the second shielding portion B2 may be located between adjacent (e.g., adjacent to each other) second holes H2, and the second shielding portion B2 has a size substantially the same as that of the second holes H2. The second holes H2 and the second shielding portion B2 may be arranged alternately in the x-direction and y-direction.

[0165] The above reference Figure 13 The described back cover layer 20 can be formed by screen printing using a mask M1. For example, a mask M1 with the above structure is located at a reference. Figure 13 On the rear side of the substrate 100A described, an organic material constituting (e.g., for forming) the rear cover layer 20 can then be coated. The organic material passing through the first pore H1 can constitute (e.g., form) the second part 22 (see...). Figure 13 Organic material passing through the second pore H2 can constitute (e.g., form) the first part 21 (see Figure 13 The amount of organic material passing through the second hole H2 via the relatively large second shielding portion B2 can be smaller than the amount of organic material passing through the first hole H1. Therefore, a back cover layer 20 with a first portion 21 and a second portion 22 can be formed, the first portion 21 having a relatively small thickness and the second portion 22 having a relatively large thickness. Because the organic material is fluid before it hardens, the step difference between the first portion 21 and the second portion 22 can have a sloping surface with curved surfaces due to the leveling phenomenon of the organic material. Figure 13 As shown in the image.

[0166] In another embodiment, such as Figure 12 As shown, the structure in which the inclined surface of the step difference between the first part 21 and the second part 22 has an inclination of approximately 90° can be formed by coating an organic material and then removing a portion of the organic material.

[0167] Despite Figure 12 and Figure 13 The image shows a first portion 21 joined to a second portion 22, but in another embodiment, the first portion 21 may be separated from the second portion 22.

[0168] Figure 15 This is a cross-sectional view of the display panel according to an embodiment.

[0169] Reference Figure 15 Because the various characteristics of the example structure including substrate 100A, display layer 200 and encapsulation substrate 300A, and the structure in which an air layer or transparent material layer is located between substrate 100A and encapsulation substrate 300A, are the same as those described above. Figure 12 Since the various characteristics of the described display panel are the same, the following mainly describes the back cover layer 20.

[0170] The back cover layer 20 includes a first portion 21 located in the first region A1, and the thickness of the first portion 21 is smaller than the thickness of the second portion 22 located in other regions (e.g., regions other than the first region A1). The width W2 of the first portion 21 may be equal to or greater than the width of the fourth hole 200H of the display layer 200, for example, the width W1 of the through hole 201h of the first insulating layer 201.

[0171] There may be a step difference between the first part 21 and the second part 22. The first part 21 may be separated from the second part 22. For example, the second part 22 may include an opening region 22OP corresponding to the first region A1, and the first part 21 may be located in the opening region 22OP. The width W3 of the opening region 22OP may be larger than the width W2 of the first part 21.

[0172] Part 21 and Part 22 may include the same or substantially the same material. As described below, this can be achieved by using... Figure 16 The mask shown is used to form a back cover layer 20 comprising a first portion 21 and a second portion 22, which have different thicknesses.

[0173] Figure 16 This is a plan view of the mask M2 for forming the back cover layer 20 according to an embodiment.

[0174] Reference Figure 16 The mask M2 may include a first shielding portion B1, which includes a first rib B11 and a second rib B12 extending in the y-direction and x-direction, respectively. A plurality of first ribs B11 and a plurality of second ribs B12 may form (e.g., create) a mesh structure, and the mask M2 may include a plurality of first holes H1 located between adjacent ribs.

[0175] Mask M2 may include a second aperture H2 in a defined or predetermined area (e.g., inside a virtual circle VC). The size of the second aperture H2 may be larger than the size of the first aperture H1. Unlike the first aperture H1 which is adjacent in both the y and x directions, a second shielding portion B2 having a size substantially the same as the second aperture H2 may be located between adjacent (e.g., adjacent or closest) second apertures H2. The second aperture H2 and the second shielding portion B2 may be arranged alternately in both the x and y directions.

[0176] The mask M2 may include a third masking portion B3 having an annular shape extending in a direction corresponding to the outer periphery (e.g., circumference) of the virtual circle VC. The second aperture H2 and the second masking portion B2 may be alternately located inside the third masking portion B3.

[0177] The above reference Figure 15 The described back cover layer 20 can be formed by screen printing using a mask M2. For example, having Figure 16 The mask M2 of the structure shown is located on a substrate 100A in which a pit D is formed (see...). Figure 15 On the rear side of the first hole H1, an organic material constituting the rear cover layer 20 can then be coated. The organic material passing through the first hole H1 can form (e.g., form) the second part 22 (see...). Figure 15 Organic material passing through the second pore H2 can constitute (e.g., form) the first part 21 (see Figure 15 A separation space can be formed between the first part 21 and the second part 22 through the third shielding part B3.

[0178] Figure 17 This is a cross-sectional view of the display panel according to an embodiment.

[0179] Reference Figure 17 Because the various characteristics of the example structure including substrate 100A, display layer 200 and encapsulation substrate 300A, and the structure in which an air layer or transparent material layer is located between substrate 100A and encapsulation substrate 300A, are the same as those described above. Figure 12 Since the various characteristics of the described display panel are the same, the following mainly describes the back cover layer 20.

[0180] The back cover layer 20 may include a first sublayer 210 and a second sublayer 220, wherein the first sublayer 210 fills the recess D while directly contacting (e.g., physically contacting) the rear side of the substrate 100A, and the second sublayer 220 contacts the first sublayer 210. The first sublayer 210 may be located between the substrate 100A and the second sublayer 220.

[0181] The back cover layer 20 may include different kinds of materials. The first sublayer 210 may include a material with relatively low viscosity and may include a transparent material, wherein the difference between the refractive index of the substrate 100A and the refractive index of the transparent material is 0.5 or less. For example, the first sublayer 210 may include an organic material.

[0182] The second sublayer 220 may include a material having a viscosity greater than that of the first sublayer 210. The thickness of the high-viscosity second sublayer 220 may be 2.5 times or greater than the thickness of the first sublayer 210, for example, three times the thickness of the first sublayer 210. The second sublayer 220 may include organic materials and particles dispersed within the organic material (e.g., silicon oxide and titanium oxide). The transmission rate (e.g., light transmission rate) of the second sublayer 220 including the particles may be lower than that of the first sublayer 210. The second sublayer 220 may include an opening 220OP corresponding to the first region A1. Therefore, the transmission rate (e.g., light transmission rate) of the first region A1 can be appropriately or sufficiently ensured.

[0183] The first portion 21 of the back cover layer 20 located in the first region A1 may correspond to the portion 210a of the first sublayer 210 that overlaps with the opening 220OP of the second sublayer 220. The second portion 22 of the back cover layer 20 may correspond to the portion 210b of the first sublayer 210 and the portion 220b of the second sublayer 220, with the portions 210b overlapping each other.

[0184] The width W2 of the first portion 21 can be defined by the width of the opening 220OP of the second sublayer 220. The width W2 of the first portion 21 can be equal to or greater than the width of the fourth hole 200H of the display layer 200, for example, the width W1 of the through hole 201h of the first insulating layer 201.

[0185] Figure 18 This is a cross-sectional view of the display panel according to an embodiment.

[0186] Reference Figure 18 The display layer 200 is located on the substrate 100A, and includes pixel circuitry (PC) and an organic light-emitting diode (OLED). Its example structure is similar to that of the reference design. Figure 12 The described example structure is the same. Display layer 200 can be covered by thin-film encapsulation layer 300B.

[0187] The thin-film encapsulation layer 300B may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, the thin-film encapsulation layer 300B may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 located therebetween. The first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330, and the organic encapsulation layer 320 may include the same materials as described above.

[0188] The thin-film encapsulation layer 300B may include a fifth hole 300BH, as shown above. Figure 8 Described. In embodiments, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each include vias 310h and 330h corresponding to the first region A1, respectively. The fifth hole 300BH of the thin-film encapsulation layer 300B may be defined by vias 310h and 330h, each of which passes through the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330, respectively. The organic encapsulation layer 320 may include a via 320h having a size larger than that of the via 310h in the first inorganic encapsulation layer 310 and the via 330h in the second inorganic encapsulation layer 330.

[0189] The ends of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 adjacent to the first region A1 may be stacked with the inorganic insulating layer (e.g., the first insulating layer 201 and the second insulating layer 203) of the display layer 200. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be in direct contact (e.g., physical contact) with the first insulating layer 201 and the second insulating layer 203.

[0190] The fourth hole 200H of the display layer 200 can be defined by a hole in the insulating layer of the display layer 200 having the minimum width. In an embodiment, in Figure 18 The image shows that the fourth hole 200H of the display layer 200 is defined by the through hole 201h of the first insulating layer 201 and the through hole 203h of the second insulating layer 203.

[0191] The fifth hole 300BH of the thin-film encapsulation layer 300B may have a size or width substantially the same as that of the fourth hole 200H of the display layer 200. In some embodiments, the fifth hole 300BH of the thin-film encapsulation layer 300B may be smaller or larger than the fourth hole 200H of the display layer 200.

[0192] The width W1, which is the smaller of the widths of the fourth hole 200H of the display layer 200 and the fifth hole 300BH of the thin-film encapsulation layer 300B, can be equal to or less than the width W2 of the first portion 21 of the rear cover layer 20. In an embodiment, Figure 18 The first width W1 is shown to be defined by a fourth aperture 200H of the display layer 200. However, in some embodiments, the first width W1 is defined by a fifth aperture 300BH of the thin-film encapsulation layer 300B.

[0193] The rear cover layer 20 may include a first portion 21 and a second portion 22, and covers the recess D formed on the rear side of the substrate 100A. The characteristics of the rear cover layer 20 are the same as those described above. Figure 12The described characteristics are the same. Although in Figure 18 The rear cover layer 20 is shown to have Figure 12 The structure shown is not limited thereto. In another embodiment, the back cover layer 20 may have a reference... Figure 13 , Figure 15 and Figure 17 The described structure. In another embodiment, as referred to Figure 7C As described, the back overlay 20 can be locally positioned to cover the first region A1.

[0194] Figure 19 and Figure 20 This is a cross-sectional view of the display panel according to an embodiment.

[0195] Reference Figure 19 The display layer 200 is located on the substrate 100B, and includes pixel circuitry (PC) and an organic light-emitting diode (OLED). The display layer 200 can be covered by a thin-film encapsulation layer 300B. Although... Figure 18 The diagram shows a display layer 200 and a thin-film encapsulation layer 300B formed on the top surface of a substrate 100A, which is a single layer, and a rear cover layer 20 formed on the rear side of the substrate 100A. Figure 19 and Figure 20 The diagram shows that substrate 100B comprises multiple layers. An example structure of display layer 200 and thin-film encapsulation layer 300B, and the relationship between the fourth hole 200H and the fifth hole 300BH are the same as described above.

[0196] The substrate 100B may include a first substrate layer 101, a first barrier layer 102, a second substrate layer 103, and a second barrier layer 104. Example materials are the same as those described above. Figure 10 The example materials described are the same. The second barrier layer 104 of the substrate 100B can be exposed through the fourth hole 200H and the fifth hole 300BH stacked on top of each other. The width W1 can correspond to the smaller of the fourth hole 200H of the display layer 200 and the fifth hole 300BH of the thin film encapsulation layer 300B. The width W1 can be equal to or less than the width W2 of the first portion 21 of the rear cover layer 20.

[0197] In another embodiment, the second barrier layer 104 of the substrate 100B may include a through-hole 104h stacked with the fourth hole 200H and the fifth hole 300BH, such as Figure 20As shown in the diagram. The through-hole 104h of the second barrier layer 104 may have the same size (or width) as the fourth hole 200H of the display layer 200 and / or the fifth hole 300BH of the thin film encapsulation layer 300B. The size (or width) of the through-hole 104h of the second barrier layer 104 may be equal to the size (or width) of the fourth hole 200H of the display layer 200, but different from the size (or width) of the fifth hole 300BH of the thin film encapsulation layer 300B.

[0198] The width W1 of the smaller of the selected via 104h of the second barrier layer 104, the fourth via 200H of the display layer 200, and the fifth via 300BH of the thin film encapsulation layer 300B can be equal to or less than the width W2 of the first portion 21 of the rear cover layer 20.

[0199] The rear cover layer 20 may include a first portion 21 and a second portion 22, and covers the recess D formed in the rear side of the substrate 100B. The characteristics of the rear cover layer 20 are the same as those described above. Figure 12 The described characteristics are the same. Although in Figure 19 and Figure 20 The rear cover layer 20 is shown to have Figure 12 The structure shown is not limited thereto. In another embodiment, reference is made to... Figure 19 and Figure 20 Each of the described overlay layers 20 may have a reference Figure 13 , Figure 15 and Figure 17 The described structure. In another embodiment, as referred to Figure 7C As described, the back overlay 20 can be locally positioned to cover the first region A1.

[0200] The display device according to the embodiment can improve the propagation of light (and / or sound) and the transmission quality of light (and / or sound) in the transmission area by including the rear cover layer.

[0201] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the claims and their equivalents.

Claims

1. A display device, the display device comprising: Base; An insulating layer is located on the top surface of the substrate; A plurality of light-emitting diodes are located on the insulating layer, including two light-emitting diodes spaced apart from each other, and a transmission region is provided between the two light-emitting diodes; Encapsulation components cover the plurality of light-emitting diodes; as well as A rear cover layer, located on the rear surface of the substrate, and including a first portion located in the transmission region. The first part includes a transparent material. Wherein, the difference between the refractive index of the first portion of the back cover layer and the refractive index of the substrate is 0.5 or less, and The back surface of the substrate includes a plurality of pits, and at least one of the plurality of pits located in the transmission region is filled with the first portion of the transparent material.

2. The display device according to claim 1, wherein The substrate comprises glass material and / or polymer resin.

3. The display device according to claim 1, wherein The insulating layer includes: A first insulating layer is located on the top surface of the substrate; A second insulating layer is located between the semiconductor layer and the gate electrode of the transistor, the transistor being situated on the first insulating layer; and A third insulating layer is located between the transistor and the plurality of light-emitting diodes. Wherein, at least one selected from the first insulating layer, the second insulating layer and the third insulating layer includes a through hole located in the transmission region.

4. The display device according to claim 3, wherein Each of the first insulating layer, the second insulating layer, and the third insulating layer includes a through-hole located in the transmission region, and The width of the smallest through-hole is smaller than the width of the first portion of the rear cover layer.

5. The display device according to any one of claims 1 to 4, wherein The rear cover layer includes the first portion and a second portion surrounding the first portion, and The second portion is thicker than the first portion, such that the first portion and the second portion together form a step difference in the back cover layer.

6. The display device of claim 5, wherein, The step difference between the first portion and the second portion has an inclined surface, and the thickness of the portion of the back cover layer constituting the inclined surface is greater than the thickness of the first portion and less than the thickness of the second portion.

7. The display device according to claim 5, wherein The first part and the second part are separated from each other.

8. The display device according to claim 5, wherein The back cover layer includes: A first sublayer, located on the rear surface of the substrate, and comprising the first portion; and The second sublayer is located on the first sublayer and includes an opening corresponding to the transmission area.

9. The display device of claim 8, wherein, The second sublayer comprises a material different from that of the first sublayer.

10. The display device according to claim 1, wherein The encapsulation component includes an encapsulation substrate made of glass material.

11. The display device of claim 10, further comprising an air layer between the substrate and the encapsulation substrate.

12. The display device of claim 10, further comprising a transparent material layer between the substrate and the encapsulation substrate.

13. The display device of claim 1, wherein, The encapsulation component includes a thin-film encapsulation layer, which includes at least one inorganic encapsulation layer and at least one organic encapsulation layer.

14. The display device of claim 13, wherein, The thin-film encapsulation layer includes holes corresponding to the transmission area.

15. A display device, the display device comprising: Base; The display layer is located on the top surface of the substrate and includes two pixels separated from each other, with a transmission area between the two pixels; as well as A rear cover layer, located on the rear surface of the substrate, and including a first portion corresponding to the transmission area. The first portion of the back cover layer includes a transparent material. Wherein, the difference between the refractive index of the first portion of the back cover layer and the refractive index of the substrate is 0.5 or less, and The rear surface of the substrate includes a plurality of pits, and at least one of the plurality of pits corresponding to the transmission area is filled with the first portion of the transparent material.

16. The display device of claim 15, wherein, The substrate comprises glass material and / or polymer resin.

17. The display device of claim 15, wherein, The display layer includes: At least one insulating layer is located on the top surface of the substrate and includes a through-hole corresponding to the transmission region; and The pixel electrode, the opposite electrode, and the intermediate layer are all located on the at least one insulating layer, with the intermediate layer between the pixel electrode and the opposite electrode.

18. The display device of claim 15, wherein, The display layer includes holes located in the transmission area.

19. The display device of claim 18, wherein, The width of the hole in the display layer is smaller than the width of the first portion of the rear cover layer.

20. A display device according to any one of claims 15 to 19, wherein, The rear cover layer includes the first portion and a second portion surrounding the first portion, and The second portion is thicker than the first portion, such that the first portion and the second portion together form a step difference in the back cover layer.

21. The display device of claim 20, wherein, The step difference between the first portion and the second portion has an inclined surface, and the thickness of the portion of the back cover layer constituting the inclined surface is greater than the thickness of the first portion and less than the thickness of the second portion.

22. The display device of claim 20, wherein, The first part and the second part are separated from each other.

23. The display device of claim 20, wherein, The back cover layer includes: A first sublayer, located on the rear surface of the substrate, and comprising the first portion; and The second sublayer is located on the first sublayer and includes an opening corresponding to the transmission area.

24. The display device of claim 23, wherein, The second sublayer comprises a material different from that of the first sublayer.

25. The display device of claim 15, further comprising an encapsulation substrate covering the display layer and comprising a glass material.

26. The display device of claim 25, further comprising an air layer between the substrate and the encapsulation substrate.

27. The display device of claim 25, further comprising a transparent material layer between the substrate and the encapsulation substrate.

28. The display device according to claim 15, further comprising a thin-film encapsulation layer covering the display layer and comprising at least one inorganic encapsulation layer and at least one organic encapsulation layer.

29. The display device of claim 28, wherein, The thin-film encapsulation layer includes holes corresponding to the transmission area.

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