Semiconductor relay module and semiconductor relay circuit

Abstract

The present invention provides a semiconductor relay module, which can ensure stable operating characteristics and is easy to design a circuit substrate. The first input circuit and the second input circuit are connected to the first input terminal and the second input terminal in a package. The third input circuit is connected to the first input terminal and the third input terminal, or to the second input terminal and the third input terminal in the package. The first output circuit is connected to the first output terminal and the first connecting wire in the package. The second output circuit is connected to the second output terminal and the first connecting wire in the package. The third output circuit is connected to the third output terminal and the first connecting wire in the package. The first monitoring terminal is connected to the first connecting wire in the package. A portion of the first monitoring terminal is configured to be exposed to the outside of the package.

Description

Technical Field

[0001] The invention relates to a semiconductor relay module and a semiconductor relay circuit. Background Art

[0002] Patent Document 1 discloses a semiconductor relay including two output semiconductor relays and one grounding semiconductor relay. The two output semiconductor relays are connected in series with each other. The grounding semiconductor relay is provided between a connection point of the two output semiconductor relays and a grounding point.

[0003] In the semiconductor relay, the output semiconductor relay and the grounding semiconductor relay each have two MOSFETs connected in reverse series. A photodiode array is connected to the MOSFET. In addition, a first input circuit and a second input circuit are provided in the semiconductor relay. The first input circuit has a first LED. The photodiode arrays of the two output semiconductor relays are configured to generate an electromotive force by the light emission of the first LED, so that the MOSFET of each output semiconductor relay is turned on. The second input circuit has a second LED. The photodiode array of the grounding semiconductor relay is configured to generate an electromotive force by the light emission of the second LED, so that the MOSFET of the grounding semiconductor relay is turned on.

[0004] Prior art literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 7-46109 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] In the above semiconductor relay, the on / off of two output semiconductor relays is controlled by a common first input circuit. However, in such a structure, it is not easy to ensure stable operation characteristics. In addition, the first and second input circuits are connected to two input terminals, respectively. Therefore, there is a situation where wiring is complicated and the design of the circuit board becomes difficult.

[0008] Therefore, an object of the present invention is to provide a semiconductor relay module that can ensure stable operating characteristics and facilitate the design of a circuit board.

[0009] Technical solutions for solving technical problems

[0010] A semiconductor relay module according to one aspect of the present disclosure includes a first semiconductor relay, a second semiconductor relay, a third semiconductor relay, a package, a first input terminal, a second input terminal, a third input terminal, a first output terminal, a second output terminal, a third output terminal, a first connecting line, and a first monitoring terminal. The first semiconductor relay includes a first input circuit and a first output circuit. The second semiconductor relay includes a second input circuit and a second output circuit. The third semiconductor relay includes a third input circuit and a third output circuit.

[0011] The package contains a first semiconductor relay, a second semiconductor relay, and a third semiconductor relay. The first input terminal, the second input terminal, and the third input terminal are provided in the package, and are respectively configured so that a portion thereof is exposed to the outside of the package. The first output terminal, the second output terminal, and the third output terminal are provided in the package, and are respectively configured so that a portion thereof is exposed to the outside of the package. The first connecting wire connects the first output circuit with the second output circuit in the package. The first monitoring terminal is connected to the first connecting wire in the package. A portion of the first monitoring terminal is configured so as to be exposed to the outside of the package.

[0012] The first input circuit and the second input circuit are connected to the first input terminal and the second input terminal in the package. The third input circuit is connected to the first input terminal and the third input terminal, or to the second input terminal and the third input terminal in the package. The first output circuit is connected to the first output terminal and the first connection line in the package. The second output circuit is connected to the second output terminal and the first connection line in the package. The third output circuit is connected to the third output terminal and the first connection line in the package.

[0013] In a first state where current flows through the first input terminal and the second input terminal and current does not flow through the third input terminal, the first output circuit and the second output circuit are in an on state, and the third output circuit is in an off state, whereby the first output terminal and the second output terminal are conductive, and the first connection line and the third output terminal are non-conductive. In a second state where current does not flow through the first input terminal and the second input terminal and current flows through the third input terminal, the first output circuit and the second output circuit are in an off state, and the third output circuit is in an on state, whereby the first output terminal and the second output terminal are non-conductive, and the first connection line and the third output terminal are conductive.

[0014] Effects of the Invention

[0015] According to a semiconductor relay module involved in one embodiment of the present disclosure, an input circuit is provided for each of the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay. Therefore, stable operating characteristics can be ensured. In addition, the input circuit of each semiconductor relay is connected to the input terminal inside the package. Therefore, a semiconductor relay module that can easily design a circuit substrate can be realized. In addition, the voltage of the first connecting line can be monitored through the first monitoring terminal. Therefore, for example, the conduction state of the first output terminal and the second output terminal can be monitored. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram showing an example of the semiconductor relay circuit according to the first embodiment.

[0017] Figure 2 It is a structural diagram showing an example of the semiconductor relay module according to the first embodiment.

[0018] Figure 3 This is a timing chart showing an example of the operation of the semiconductor relay module.

[0019] Figure 4 This is a configuration diagram showing an example of a semiconductor relay circuit according to the second embodiment.

[0020] Figure 5 It is a structural diagram showing an example of a semiconductor relay module according to the second embodiment.

[0021] Figure 6 It is a structural diagram showing an example of a semiconductor relay module according to the second embodiment.

[0022] Figure 7 1 is a diagram showing a configuration of an example of a semiconductor relay module according to a first modification.

[0023] Figure 8 1 is a diagram showing a configuration of an example of a semiconductor relay module according to a second modification.

[0024] Fig. 9 This is a structural diagram showing another example of a semiconductor relay module.

[0025] Fig.10 This is a timing chart showing another example of the operation of the semiconductor relay module.

[0026] Explanation of symbols

[0027] 3...power supply terminal, 4...control terminal, 5...control circuit, 11...first input circuit, 12...first output circuit, 10...first semiconductor relay, 20...second semiconductor relay, 21...second input circuit, 22...second output circuit, 30...third semiconductor relay, 31...third input circuit, 32...third output circuit, 40...fourth semiconductor relay, 41...fourth input circuit, 42...fourth output circuit, 50...fifth semiconductor relay, 51...fifth input circuit circuit, 52…5th output circuit, 61…6th input circuit, 62…6th output circuit, 60…6th semiconductor relay, 70…package, 71…1st input terminal, 72…2nd input terminal, 73…3rd input terminal, 80…1st connecting wire, 81…1st output terminal, 82…2nd output terminal, 83…3rd output terminal, 84…4th output terminal, 85…5th output terminal, 86…2nd connecting wire, 87…1st monitoring terminal, 88…2nd monitoring terminal. DETAILED DESCRIPTION

[0028] Below, an example of the present disclosure is described with reference to the accompanying drawings. In addition, in the following description, terms indicating specific directions or positions are used as needed, but the use of these terms is to facilitate the understanding of the contents of the present disclosure with reference to the accompanying drawings, and the technical scope of the present disclosure is not limited by the meaning of these terms. Moreover, the following description is essentially just an example and is not intended to limit the present invention, its applications, or its uses. Furthermore, the accompanying drawings are schematic, and the ratios of various dimensions, etc. are not necessarily consistent with reality.

[0029] Figure 1 1 is a structural diagram showing an example of a semiconductor relay circuit 1a according to the first embodiment of the present disclosure. Figure 1 As shown, the semiconductor relay circuit 1a includes a semiconductor relay module 2a, a power terminal 3, a control terminal 4, and a control circuit 5. The semiconductor relay module 2a includes a first semiconductor relay 10, a second semiconductor relay 20, a third semiconductor relay 30, a package 70, a first input terminal 71, a second input terminal 72, and a third input terminal 73.

[0030] The package 70 contains the first semiconductor relay 10, the second semiconductor relay 20, and the third semiconductor relay 30. The package 70 is formed of, for example, a resin having insulating properties. However, the package 70 is not limited to resins, and may be made of other materials such as ceramics. The package 70 has, for example, a rectangular shape when viewed from above. However, the package 70 is not limited to a rectangular shape, and may be other shapes.

[0031] The first input terminal 71, the second input terminal 72, and the third input terminal 73 are provided in the package 70. The first input terminal 71, the second input terminal 72, and the third input terminal 73 are respectively configured so that a portion is exposed to the outside of the package 70. The semiconductor relay module 2a further includes a first output terminal 81, a second output terminal 82, a third output terminal 83, and a first monitoring terminal 87. The first output terminal 81, the second output terminal 82, and the third output terminal 83 are provided in the package 70. The first output terminal 81, the second output terminal 82, the third output terminal 83, and the first monitoring terminal 87 are respectively configured so that a portion is exposed to the outside of the package 70.

[0032] In the semiconductor relay module 2a, the first semiconductor relay 10, the second semiconductor relay 20 and the third semiconductor relay 30 are arranged side by side in the longitudinal direction of the package 70 inside the package 70. The third semiconductor relay 30 is arranged between the first semiconductor relay 10 and the second semiconductor relay 20 in the longitudinal direction of the package 70.

[0033] The first semiconductor relay 10 includes a first input circuit 11 and a first output circuit 12. When current flows through the first input circuit 11, the first output circuit 12 becomes an on state (ON). When current does not flow through the first input circuit 11, the first output circuit 12 becomes an off state (OFF). The second semiconductor relay 20 includes a second input circuit 21 and a second output circuit 22. When current flows through the second input circuit 21, the second output circuit 22 becomes an on state. When current does not flow through the second input circuit 21, the second output circuit 22 becomes an off state. The third semiconductor relay 30 includes a third input circuit 31 and a third output circuit 32. When current flows through the third input circuit 31, the third output circuit 32 becomes an on state. When current does not flow through the third input circuit 31, the third output circuit 32 becomes an off state. In addition, the so-called on state refers to a state in which current flows through the output circuit. The off state refers to a state in which current does not flow through the output circuit.

[0034] The first input circuit 11 is connected to the first input terminal 71 and the second input terminal 72 in the package 70 . The second input circuit 21 is connected to the first input terminal 71 and the second input terminal 72 in the package 70 . The third input circuit 31 is connected to the first input terminal 71 and the third input terminal 73 in the package 70 .

[0035] In detail, the first input circuit 11 is connected to the first input terminal 71 via a connection line 74. The first input circuit 11 is connected to the second input terminal 72 via a connection line 75. The second input circuit 21 is connected to the first input terminal 71 via a connection line 76. The second input circuit 21 is connected to the second input terminal 72 via a connection line 77. The third input circuit 31 is connected to the first input terminal 71 via a connection line 78. The third input circuit 31 is connected to the third input terminal 73 via a connection line 79. The connection lines 74 to 79 are arranged in the package 70.

[0036] The first output circuit 12 is connected to the first output terminal 81 and the first connection line 80 in the package 70. The second output circuit 22 is connected to the second output terminal 82 and the first connection line 80 in the package 70. The first output circuit 12 and the second output circuit 22 are connected in series with each other via the first connection line 80 in the package 70. The third output circuit 32 is connected to the third output terminal 83 and the first connection line 80 in the package 70. The first connection line 80 is arranged in the package 70. The first monitoring terminal 87 is connected to the first connection line 80 in the package 70.

[0037] Figure 2 2a is a structural diagram showing an example of a semiconductor relay module 2a. Figure 2 As shown, the first input circuit 11 of the first semiconductor relay 10 includes a first input part 13, a second input part 14, and a light emitting element 15. The first input part 13 is connected to the first input terminal 71. The second input part 14 is connected to the second input terminal 72. The light emitting element 15 is connected to the first input part 13 and the second input part 14. The light emitting element 15 emits light when current flows in the first input circuit 11.

[0038] The second input circuit 21 of the second semiconductor relay 20 includes a first input section 23, a second input section 24, and a light emitting element 25. The first input section 23 is connected to the first input terminal 71. The second input section 24 is connected to the second input terminal 72. The light emitting element 25 is connected to the first input section 23 and the second input section 24. The light emitting element 25 emits light when current flows in the second input circuit 21.

[0039] The third input circuit 31 of the third semiconductor relay 30 includes a first input section 33, a second input section 34, and a light emitting element 35. The first input section 33 is connected to the first input terminal 71. The second input section 34 is connected to the third input terminal 73. The light emitting element 35 is connected to the first input section 33 and the second input section 34. The light emitting element 35 emits light when current flows in the third input circuit 31.

[0040] The first output circuit 12 of the first semiconductor relay 10 includes a first output unit 16, a second output unit 17, and two MOSFETs 18 and 19. The first output unit 16 is connected to the first output terminal 81. The second output unit 17 is connected to the first connection line 80. The MOSFETs 18 and 19 are connected in series with each other in such a manner that the directions of the parasitic diodes are opposite to each other. The MOSFETs 18 and 19 are switched between an on state and an off state according to the presence or absence of light emission of the light emitting element 25. When the MOSFETs 18 and 19 are in an on state, the first output unit 16 and the second output unit 17 are conductive. When the MOSFETs 18 and 19 are in an off state, the first output unit 16 and the second output unit 17 are non-conductive.

[0041] The second output circuit 22 of the second semiconductor relay 20 includes a first output unit 26, a second output unit 27, and two MOSFETs 28 and 29. The first output unit 26 is connected to the first connection line 80. The second output unit 27 is connected to the second output terminal 82. The MOSFETs 28 and 29 are connected in series with each other in such a manner that the directions of the parasitic diodes are opposite to each other. The MOSFETs 28 and 29 are switched between an on state and an off state according to the presence or absence of light emission of the light emitting element 25. When the MOSFETs 28 and 29 are in an on state, the first output unit 26 and the second output unit 27 are conductive. When the MOSFETs 28 and 29 are in an off state, the first output unit 26 and the second output unit 27 are non-conductive.

[0042] The third output circuit 32 of the third semiconductor relay 30 includes a first output unit 36, a second output unit 37, and two MOSFETs 38 and 39. The first output unit 36 ​​is connected to the first connection line 80. The second output unit 37 is connected to the third output terminal 83. The MOSFETs 38 and 39 are connected in series with each other so that the directions of the parasitic diodes are opposite to each other. The MOSFETs 38 and 39 are switched between an on state and an off state according to the presence or absence of light emission of the light emitting element 25. When the MOSFETs 38 and 39 are in the on state, the first output unit 36 ​​and the second output unit 37 are conductive. When the MOSFETs 38 and 39 are in the off state, the first output unit 36 ​​and the second output unit 37 are non-conductive.

[0043] like Figure 1 As shown, the first input terminal 71, the second input terminal 72, and the third input terminal 73 are connected to the power supply terminal 3 and the control terminal 4 via the control circuit 5. The power supply terminal 3 is supplied with a power supply voltage, and the control terminal 4 is supplied with an input signal.

[0044] The control circuit 5 includes a first circuit 91, a second circuit 92, and a third circuit 93. The first circuit 91 connects the power supply terminal 3 to the first input terminal 71. The second circuit 92 connects the control terminal 4 to the second input terminal 72 via a transistor 94 and a resistor 95. The third circuit 93 connects the control terminal 4 to the third input terminal 73 via transistors 96 and 97 and a resistor 98. The transistor 96 is connected to the power supply terminal 3 via a resistor 99. In addition, the structure of the control circuit 5 is not limited to Figure 1 The structure shown can also be modified.

[0045] The first output terminal 81 is connected to the first external output terminal 6. The second output terminal 82 is connected to the second external output terminal 7. The third output terminal 83 is connected to the ground point GND. That is, the third output terminal 83 is a ground terminal for grounding the first connection line 80.

[0046] The control circuit 5 switches the energization state of each input terminal of the semiconductor relay module 2a to the first state and the second state according to the input signal supplied to the control terminal 4. The first state is a state in which current flows through the first input terminal 71 and the second input terminal 72, and current does not flow through the third input terminal 73. The second state is a state in which current does not flow through the first input terminal 71 and the second input terminal 72, and current flows through the third input terminal 73.

[0047] Figure 3 1 is a timing chart showing the operation of the semiconductor relay module 2a according to the voltage control of the input signal. Figure 3 A represents a change in the voltage of the input signal supplied to the control terminal 4 . Figure 3 B shows the change in the on / off state of the first output circuit 12 of the first semiconductor relay 10 and the second output circuit 22 of the second semiconductor relay 20 . Figure 3 C represents a change in the on (ON) / off (OFF) state of the third output circuit 32 of the third semiconductor relay 30 . Figure 3 D indicates a change in the state of conduction / non-conduction between the first output terminal 81 and the second output terminal 82 .

[0048] like Figure 3 As shown in FIG. 1A, if an input signal of on (+) is supplied to the control terminal 4 at time T1, the control circuit 5 sets the power supply state of each input terminal 71-73 of the semiconductor relay module 2a to the first state. That is, the current flows through the first input terminal 71 and the second input terminal 72, and the current does not flow through the third input terminal 73. As a result, the current flows through the first input circuit 11 and the second input circuit 21, and thus, as shown in FIG. Figure 3As shown in FIG. 2B, at a time T1' slightly delayed from time T1, the first output circuit 12 and the second output circuit 22 are turned on. In addition, since no current flows in the third input circuit 31, Figure 3 As shown in C, the third output circuit 32 is in the disconnected state (OFF). Figure 3 As shown in D, at time T1', the first output terminal 81 and the second output terminal 82 are electrically connected. At this time, the first connection line 80 and the third output terminal 83 are not electrically connected.

[0049] Then, if Figure 3 As shown in FIG. 1A , at time T2, if the input signal to the control terminal 4 is disconnected, the control circuit 5 sets the power supply state of each input terminal 71-73 of the semiconductor relay module 2a to the second state. That is, the current does not flow through the first input terminal 71 and the second input terminal 72, and the current flows through the third input terminal 73. As a result, the current does not flow through the first input circuit 11 and the second input circuit 21. Figure 3 As shown in FIG. 2B , the first output circuit 12 and the second output circuit 22 become disconnected (OFF) at a time T2′ slightly delayed from the time T2. Figure 3 As shown in C, at time T2' slightly delayed from time T2', the third output circuit 32 becomes ON. Figure 3 As shown in FIG. 2 , after time T2′, the first output terminal 81 and the second output terminal 82 become non-conductive. In addition, after time T2″, the first connecting line 80 and the third output terminal 83 are conductive, so that the first connecting line 80 is grounded via the third output terminal 83. Thus, good isolation characteristics can be obtained.

[0050] Next, as above, Figure 3 As shown in A, at time T3, if the control terminal 4 is supplied with an input signal that is turned on, Figure 3 As shown in C, at time T3″ slightly delayed from time T3, the third output circuit 32 becomes disconnected. Figure 3 As shown in FIG. 2B , at time T3′ slightly delayed from time T3″, the first output circuit 12 and the second output circuit 22 are turned on. Figure 3 As shown in D, the first output terminal 81 is electrically connected to the second output terminal 82. On the other hand, the first connection line 80 and the third output terminal 83 are not electrically connected.

[0051] Then, if Figure 3 As shown in A, if the input signal to the control terminal 4 is disconnected at time T4, then Figure 3 As shown in FIG. 2B , at time T4′ slightly delayed from time T4, the first output circuit 12 and the second output circuit 22 are in the disconnected state. Figure 3As shown in C, at time T4'' slightly delayed from time T4', the third output circuit 32 becomes turned on. Figure 3 D and Figure 4 As shown, after time T4', the first output terminal 81 and the second output terminal 82 become non-conductive. Also, after time T4", the first connection line 80 and the third output terminal 83 become conductive.

[0052] In the semiconductor relay module 2a of the present embodiment described above, the first output circuit 12 of the first semiconductor relay 10 and the second output circuit 22 of the second semiconductor relay 20 are connected in series with each other and are switched between the on state and the off state. In addition, when the first output terminal 81 and the second output terminal 82 are not conducting, the first connection line 80 is connected to the ground by conducting with the third output terminal 83. Thus, good isolation characteristics can be obtained between the first output terminal 81 and the second output terminal 82.

[0053] In addition, in the semiconductor relay module 2a, the input circuits 11, 21, 31 of each semiconductor relay 10, 20, 30 are connected to the input terminals 71, 72, 73, respectively, inside the package 70. In addition, the output circuits 12, 22, 32 of each semiconductor relay 10, 20, 30 are connected to the output terminals 81, 82, 83, respectively, inside the package 70. Therefore, it is possible to avoid a complex wiring structure in which wirings intersect with each other on the circuit substrate, and the wiring can be simplified. Thus, it is possible to realize a semiconductor relay module 2a that can reduce the transmission loss of high-frequency signals and can easily design the circuit substrate. In addition, the voltage of the first connecting line 80 can be monitored through the first monitoring terminal 87. Therefore, for example, the conduction state of the first output terminal 81 and the second output terminal 82 can be monitored.

[0054] In addition, the first semiconductor relay 10 and the second semiconductor relay 20 may be semiconductor relays of low on-resistance type, and the third semiconductor relay 30 may be a semiconductor relay of low inter-terminal capacitance type. That is, the output on-resistance of the first semiconductor relay 10 and the output on-resistance of the second semiconductor relay 20 may be respectively smaller than the output on-resistance of the third semiconductor relay 30, and the output inter-terminal capacitance of the third semiconductor relay 30 may be smaller than the output inter-terminal capacitance of the first semiconductor relay 10 and the output inter-terminal capacitance of the second semiconductor relay 20. Thus, good insertion loss and isolation characteristics can be achieved.

[0055] Alternatively, all of the first to third semiconductor relays 10, 20, 30 may be low-terminal capacitance semiconductor relays having an output terminal capacitance of 12 pF or less. The output terminal capacitance of the low-terminal capacitance semiconductor relay is more preferably 0.8 pF or less, and further preferably 0.2 pF or less.

[0056] Next, a semiconductor relay circuit 1 b according to a second embodiment of the present disclosure will be described. Figure 4 1 is a structural diagram showing an example of a semiconductor relay circuit 1b according to the second embodiment. Figure 4 In the second embodiment, the same reference numerals are used for the same structures as those in the first embodiment. For example, the power supply terminal 3, the control terminal 4, the control circuit 5, the first semiconductor relay 10, the second semiconductor relay 20, the third semiconductor relay 30, the package 70, the first input terminal 71, the second input terminal 72, the third input terminal 73, the first output terminal 81, the second output terminal 82, the third output terminal 83, and the first monitoring terminal 87 are the same as those in the first embodiment, and therefore detailed descriptions thereof are omitted.

[0057] The semiconductor relay circuit 1b includes a semiconductor relay module 2b. The semiconductor relay module 2b includes a fourth semiconductor relay 40, a fifth semiconductor relay 50, a sixth semiconductor relay 60, a fourth output terminal 84, a fifth output terminal 85, a second connection line 86, and a second monitoring terminal 88 in addition to the structure of the semiconductor relay module 2a described above. The fourth to sixth semiconductor relays 40, 50, 60 are arranged in parallel with the direction in which the first to third semiconductor relays 10, 20, 30 are arranged. The fourth to sixth semiconductor relays 40, 50, 60 are arranged in a direction intersecting with the direction in which the first to third semiconductor relays 10, 20, 30 are arranged relative to the first to third semiconductor relays 10, 20, 30. However, the arrangement of the fourth to sixth semiconductor relays 40, 50, 60 may also be changed. For example, the first to sixth semiconductor relays 10, 20, 30, 40, 50, 60 may also be arranged in a row in the longitudinal direction of the package 70.

[0058] The fourth semiconductor relay 40 includes a fourth input circuit 41 and a fourth output circuit 42. When current flows through the fourth input circuit 41, the fourth output circuit 42 is in an on state. When current does not flow through the fourth input circuit 41, the fourth output circuit 42 is in an off state. The fifth semiconductor relay 50 includes a fifth input circuit 51 and a fifth output circuit 52. When current flows through the fifth input circuit 51, the fifth output circuit 52 is in an on state. When current does not flow through the fifth input circuit 51, the fifth output circuit 52 is in an off state. The sixth semiconductor relay 60 includes a sixth input circuit 61 and a sixth output circuit 62. When current flows through the sixth input circuit 61, the sixth output circuit 62 is in an on state. When current does not flow through the sixth input circuit 61, the sixth output circuit 62 is in an off state.

[0059] The fourth output terminal 84, the fifth output terminal 85, and the second monitoring terminal 88 are provided in the package 70, and are respectively configured so that a portion is exposed to the outside of the package 70. The second connection line 86 connects the fourth output circuit 42 and the fifth output circuit 52 in the package 70. The fourth output terminal 84 is connected to the third external output terminal 8. The fifth output terminal 85 is connected to the fourth external output terminal 9. The second monitoring terminal 88 is connected to the second connection line 86 in the package 70.

[0060] The fourth input circuit 41 is connected to the first input terminal 71 and the second input terminal 72 in the package 70. The fifth input circuit 51 is connected to the first input terminal 71 and the second input terminal 72 in the package 70. The sixth input circuit 61 is connected to the first input terminal 71 and the third input terminal 73 in the package 70.

[0061] The fourth output circuit 42 is connected to the fourth output terminal 84 and the second connection line 86 in the package 70. The fifth output circuit 52 is connected to the fifth output terminal 85 and the second connection line 86 in the package 70. The sixth output circuit 62 is connected to the third output terminal 83 and the second connection line 86 in the package 70.

[0062] Figure 5 and Figure 6 2b is a diagram showing an example of the structure of the semiconductor relay module 2b. Figure 6 As shown, the fourth input circuit 41 of the fourth semiconductor relay 40 includes a first input section 43, a second input section 44, and a light emitting element 45. The first input section 43 is connected to the first input terminal 71. The second input section 44 is connected to the second input terminal 72. The fifth input circuit 51 of the fifth semiconductor relay 50 includes a first input section 53, a second input section 54, and a light emitting element 55. The first input section 53 is connected to the first input terminal 71. The second input section 54 is connected to the second input terminal 72. The sixth input circuit 61 of the sixth semiconductor relay 60 includes a first input section 63, a second input section 64, and a light emitting element 65. The first input section 63 is connected to the first input terminal 71. The second input section 64 is connected to the third input terminal 73. The structures of the light emitting elements 45 , 55 , 65 of the fourth to sixth semiconductor relays 40 , 50 , 60 are the same as those of the light emitting elements 15 , 25 , 35 of the first to third semiconductor relays 10 , 20 , 30 , and therefore detailed descriptions thereof will be omitted.

[0063] The fourth output circuit 42 of the fourth semiconductor relay 40 includes a first output portion 46, a second output portion 47, and two MOSFETs 48 and 49. The first output portion 46 is connected to the fourth output terminal 84. The second output portion 47 is connected to the second connection line 86. The fifth output circuit 52 of the fifth semiconductor relay 50 includes a first output portion 56, a second output portion 57, and two MOSFETs 58 and 59. The first output portion 56 is connected to the second connection line 86. The second output portion 57 is connected to the fifth output terminal 85. The sixth output circuit 62 of the sixth semiconductor relay 60 includes a first output portion 66, a second output portion 67, and two MOSFETs 68 and 69. The first output portion 66 is connected to the second connection line 86. The second output portion 67 is connected to the third output terminal 83. The configurations of the MOSFETs 48 , 49 , 58 , 59 , 68 , and 69 of the fourth to sixth semiconductor relays are the same as those of the MOSFETs 18 , 19 , 28 , 29 , 38 , and 39 of the first to third semiconductor relays described above, and therefore detailed descriptions thereof will be omitted.

[0064] In the semiconductor relay module 2b, in the first state where the current flows through the first input terminal 71 and the second input terminal 72 and the current does not flow through the third input terminal 73, the first output circuit 12, the second output circuit 22, the fourth output circuit 42, and the fifth output circuit 52 are in the on state, and the third output circuit 32 and the sixth output circuit 62 are in the off state. As a result, the first output terminal 81 and the second output terminal 82 are in conduction, the fourth output terminal 84 and the fifth output terminal 85 are in conduction, the first connection line 80 and the third output terminal 83 are in non-conduction, and the second connection line 86 and the third output terminal 83 are in non-conduction.

[0065] In the second state where the current does not flow through the first input terminal 71 and the second input terminal 72 and the current flows through the third input terminal 73, the first output circuit 12, the second output circuit 22, the fourth output circuit 42, and the fifth output circuit 52 are in the off state, and the third output circuit 32 and the sixth output circuit 62 are in the on state. As a result, the first output terminal 81 and the second output terminal 82 are in non-conduction, the fourth output terminal 84 and the fifth output terminal 85 are in non-conduction, the first connection line 80 and the third output terminal 83 are in conduction, and the second connection line 86 and the third output terminal 83 are in conduction.

[0066] The semiconductor relay module 2b of the second embodiment described above is controlled by controlling the voltage of the input signal supplied to the control terminal 4, similarly to the semiconductor relay module 2a of the first embodiment. In this case, the fourth output circuit 42 and the fifth output circuit 52 are connected to each other. Figure 3 The first output circuit 12 and the second output circuit 22 shown in B are similarly switched between the on state and the off state. Figure 3 The third output circuit 32 shown in C is similarly switched between the on state and the off state. Figure 3 The first output terminal 81 and the second output terminal 82 shown in D are similarly switched between the conductive state and the non-conductive state.

[0067] In the semiconductor relay module 2b, the first output circuit 12 of the first semiconductor relay 10 and the second output circuit 22 of the second semiconductor relay 20 are connected in series with each other, and the fourth output circuit 42 of the fourth semiconductor relay 40 and the fifth output circuit 52 of the fifth semiconductor relay 50 are connected in series with each other. Furthermore, these output circuits are switched between the on state and the off state at the same time.

[0068] The third semiconductor relay 30 controls the connection of the first connection line 80 connecting the first output circuit 12 and the second output circuit 22 to the ground point GND. In addition, the sixth semiconductor relay 60 controls the connection of the second connection line 86 connecting the fourth output circuit 42 and the fifth output circuit 52 to the ground point GND. Thus, the isolation characteristics between the first output terminal 81 and the second output terminal 82 and between the fourth output terminal 84 and the fifth output terminal 85 can be improved.

[0069] In addition, as in the semiconductor relay module 2a of the first embodiment, in the semiconductor relay module 2b of the second embodiment, it is also possible to avoid a complex wiring structure in which wirings intersect each other on the circuit substrate, and to simplify the wiring. Thus, it is possible to realize a semiconductor relay module 2b that can reduce the transmission loss of high-frequency signals and can easily design the circuit substrate. In addition, the voltage of the second connection line 86 can be monitored through the second monitoring terminal 88. Therefore, for example, the state of conduction between the fourth output terminal 84 and the fifth output terminal 85 can be monitored.

[0070] Although one embodiment has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention.

[0071] The structures of the semiconductor relay circuit, semiconductor relay module, and semiconductor relay are not limited to the above-mentioned embodiments and may be changed. The number of semiconductor relays included in the semiconductor relay module is not limited to 3 or 6. The number of semiconductor relays may be 4 or more or 7 or more.

[0072] The third input circuit 31 may be connected to the second input terminal 72 and the third input terminal 73 in the package 70 . The sixth input circuit 61 may be connected to the second input terminal 72 and the third input terminal 73 in the package 70 .

[0073] In the first embodiment described above, the second input circuit 21 is connected to the first input terminal 71 and the second input terminal 72 in parallel with the first input circuit 11. Figure 7 As in the first modification shown in FIG. 1 , the first input circuit 11 and the second input circuit 21 may be connected in series to the first input terminal 71 and the second input terminal 72 .

[0074] In the second embodiment described above, the first input circuit 11, the second input circuit 21, the fourth input circuit 41, and the fifth input circuit 51 are connected in parallel to the first input terminal 71 and the second input terminal 72. Figure 8 As in the second modified example shown, the first input circuit 11 , the second input circuit 21 , the fourth input circuit 41 , and the fifth input circuit 51 may be connected in series to the first input terminal 71 and the second input terminal 72 .

[0075] The arrangement of the first to third semiconductor relays 10, 20, 30 in the semiconductor relay module 2a of the first embodiment or the first modified example is not limited to the above-described embodiment, and may be changed. Fig. 9 As shown, the second semiconductor relay 20 may be arranged between the first semiconductor relay 10 and the third semiconductor relay 30. The same is true for the semiconductor relay module 2b of the second embodiment or the second modified example. The arrangement of the first to sixth semiconductor relays 10, 20, 30, 40, 50, 60 is not limited to the above embodiment and may be changed. The arrangement of the input terminal and / or the output terminal is not limited to the above embodiment and may be changed.

[0076] The structure of the control circuit 5 is not limited to the above-mentioned embodiment and can also be changed. For example, the control circuit 5 can also be configured to switch the power supply state of each input terminal of the semiconductor relay module 2a to the first state and the second state by controlling the current of the input signal to the second input terminal 72 and the third input terminal 73.

[0077] Fig.10 1 is a timing chart showing the operation of the semiconductor relay module 2a according to the current control of the input signal. Fig.10 A represents a change in the current of the input signal supplied to the second input terminal 72 . Fig.10 B represents a change in the current of the input signal supplied to the third input terminal 73 . Fig.10 C represents the change in the on / off state of the first output circuit 12 of the first semiconductor relay 10 and the second output circuit 22 of the second semiconductor relay 20 . Fig.10 D indicates a change in the on / off state of the third output circuit 32 of the third semiconductor relay 30 . Fig.10E indicates a change in the conduction / non-conduction state between the first output terminal 81 and the second output terminal 82 .

[0078] like Fig.10 A and Fig.10 As shown in FIG. 1B , at time T1, if the input signal is supplied to the second input terminal 72 and the input signal to the third input terminal 73 is turned off, the power supply state of each input terminal of the semiconductor relay module 2a becomes the first state. That is, the current flows through the first input terminal 71 and the second input terminal 72, and the current does not flow through the third input terminal 73. As a result, the current flows in the first input circuit 11 and the second input circuit 21, and thus, as shown in FIG. Fig.10 As shown in FIG. 3 , at a time T1′ slightly delayed from the time T1, the first output circuit 12 and the second output circuit 22 are turned on. In addition, no current flows through the third input circuit 31, so that Fig.10 As shown in D, the third output circuit 32 becomes disconnected. Fig.10 As shown in FIG. 8E, at time T1', the first output terminal 81 and the second output terminal 82 are in conduction. At this time, the first connection line 80 and the third output terminal 83 are out of conduction.

[0079] Then, if Fig.10 As shown in A, at time T2, the input signal to the second input terminal 72 is disconnected, and Fig.10 As shown in FIG. 1B, at time T3, an input signal of ON is supplied to the third input terminal 73, and the energization state of each input terminal of the semiconductor relay module 2a becomes the second state. That is, the current does not flow through the first input terminal 71 and the second input terminal 72, and the current flows through the third input terminal 73. As a result, the current does not flow through the first input circuit 11 and the second input circuit 21, and thus, as shown in FIG. Fig.10 As shown in FIG. 3 , at time T2′ slightly delayed from time T2, the first output circuit 12 and the second output circuit 22 are disconnected. Fig.10 As shown in FIG. 3 , at a time T3′ slightly delayed from time T3, the third output circuit 32 becomes turned on. Fig.10 As shown in FIG. E, after time T2', the first output terminal 81 and the second output terminal 82 become non-conductive. In addition, after time T3', the first connection line 80 and the third output terminal 83 become conductive. Fig.10 As shown in FIG. 8E , when the first output terminal 81 and the second output terminal 82 are not conductive, the first connection line 80 is grounded via the third output terminal 83 .

[0080] Next, as above, Fig.10 As shown in B, if the input signal to the third input terminal 73 is disconnected at time T4, as shown in FIG. Fig.10D, then at time T4' slightly delayed from time T4, the third output circuit 32 becomes disconnected. Fig.10 As shown in A, if an input signal is supplied to the second input terminal 72 at time T5, as shown in Fig.10 As shown in FIG. 3 , at time T5′ slightly delayed from time T5, the first output circuit 12 and the second output circuit 22 are in the on state. As a result, after time T4′, the first connection line 80 and the third output terminal 83 are in non-conduction. Fig.10 As shown in FIG. 8E, after time T5', the first output terminal 81 and the second output terminal 82 are conductively connected.

[0081] Then, if Fig.10 As shown in A, if the input signal to the second input terminal 72 is disconnected at time T6, as shown in Fig.10 C, then at time T6' slightly delayed from time T6, the first output circuit 12 and the second output circuit 22 become disconnected. Fig.10 As shown in B, if an input signal is supplied to the third input terminal 73 at time T7, as shown in FIG. Fig.10 As shown in D, at time T7' slightly delayed from time T7, the third output circuit 32 becomes turned on. Fig.10 As shown in FIG. E, after time T6', the first output terminal 81 and the second output terminal 82 become non-conductive. Also, after time T7', the first connection line 80 and the third output terminal 83 become conductive.

[0082] In addition, the semiconductor relay module 2 b of the second embodiment can also be controlled in the same manner as described above by controlling the current of the input signal to the second input terminal 72 and the third input terminal 73 .

[0083] Industrial Applicability

[0084] According to the present invention, it is possible to realize a semiconductor relay module that can ensure stable operating characteristics and facilitate the design of a circuit board.

Claims

1. A semiconductor relay module, characterized in that: have: a first semiconductor relay including a first input circuit and a first output circuit; a second semiconductor relay including a second input circuit and a second output circuit; a third semiconductor relay including a third input circuit and a third output circuit; a package that accommodates the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay therein; a first input terminal, a second input terminal, and a third input terminal, wherein the first input terminal, the second input terminal, and the third input terminal are provided in the package and are respectively configured to be partially exposed to the outside of the package; a first output terminal, a second output terminal, and a third output terminal, wherein the first output terminal, the second output terminal, and the third output terminal are provided in the package and are respectively configured to be partially exposed to the outside of the package; a first connection line connecting the first output circuit and the second output circuit in the package; a first monitoring terminal connected to the first connection line in the package and configured to be partially exposed to the outside of the package; a fourth semiconductor relay including a fourth input circuit and a fourth output circuit; a fifth semiconductor relay including a fifth input circuit and a fifth output circuit; a sixth semiconductor relay including a sixth input circuit and a sixth output circuit; a fourth output terminal and a fifth output terminal, wherein the fourth output terminal and the fifth output terminal are provided in the package and are respectively configured to be partially exposed to the outside of the package; a second connection line connecting the fourth output circuit and the fifth output circuit in the package; as well as a second monitoring terminal connected to the second connection line in the package and configured to be partially exposed to the outside of the package, wherein: The first input circuit and the second input circuit are connected to the first input terminal and the second input terminal in the package. The third input circuit is connected to the first input terminal and the third input terminal, or is connected to the second input terminal and the third input terminal in the package. The first output circuit is connected to the first output terminal and the first connection line in the package. The second output circuit is connected to the second output terminal and the first connection line in the package. The third output circuit is connected to the third output terminal and the first connection line in the package. The fourth input circuit and the fifth input circuit are connected to the first input terminal and the second input terminal in the package. The sixth input circuit is connected to the first input terminal and the third input terminal, or is connected to the second input terminal and the third input terminal in the package. The fourth output circuit is connected to the fourth output terminal and the second connection line in the package, The fifth output circuit is connected to the fifth output terminal and the second connection line in the package. The sixth output circuit is connected to the third output terminal and the second connection line in the package, In a first state where current flows through the first input terminal and the second input terminal and the current does not flow through the third input terminal, the first output circuit and the second output circuit are in an on state, and the third output circuit is in an off state, whereby the first output terminal and the second output terminal are conductive, and the first connection line and the third output terminal are non-conductive, In the second state where the current does not flow through the first input terminal and the second input terminal and the current flows through the third input terminal, the first output circuit and the second output circuit are in an off state, and the third output circuit is in an on state, whereby the first output terminal and the second output terminal are non-conductive, and the first connecting line and the third output terminal are conductive.

2. The semiconductor relay module according to claim 1, characterized in that: In the first state, the first output circuit, the second output circuit, the fourth output circuit, and the fifth output circuit are in an on state, and the third output circuit and the sixth output circuit are in an off state, so that the first output terminal and the second output terminal are conductive, the fourth output terminal and the fifth output terminal are conductive, the first connection line and the third output terminal are non-conductive, and the second connection line and the third output terminal are non-conductive, In the second state, the first output circuit, the second output circuit, the fourth output circuit and the fifth output circuit are in a disconnected state, and the third output circuit and the sixth output circuit are in a connected state, so that the first output terminal and the second output terminal are non-conductive, the fourth output terminal and the fifth output terminal are non-conductive, the first connecting line and the third output terminal are conductive, and the second connecting line and the third output terminal are conductive.

3. A semiconductor relay circuit, characterized in that: have: The semiconductor relay module according to claim 1 or 2; a power terminal connected to the first input terminal; Control terminals; as well as A control circuit connected to the control terminal, the first input terminal, the second input terminal and the third input terminal, wherein: The control circuit switches between the first state and the second state according to an input signal supplied to the control terminal.

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