Analog optical transmission module

Abstract

The present application discloses an analog optical transmission module, comprising N bidirectional transmission optical signal receiving and transmitting combination components, a gold finger, a receiving circuit, a transmitting circuit, N transmitting transmission channels and N receiving transmission channels, each bidirectional transmission optical signal receiving and transmitting combination component comprises a transmitting TO and a receiving TO, the transmitting TO is used to convert the electrical signal input into the bidirectional transmission optical signal receiving and transmitting combination component into an optical signal output, and the receiving TO is used to convert the optical signal input into the bidirectional transmission optical signal receiving and transmitting combination component into an electrical signal output; the gold finger, the receiving circuit and the transmitting circuit are all arranged in a printed circuit board, one end of the microstrip line of the receiving circuit is electrically connected to the gold finger, and one end of the microstrip line of the transmitting circuit is electrically connected to the gold finger; one end of the Kth transmitting transmission channel is electrically connected to the other end of the microstrip line of the transmitting circuit. It can reduce signal crosstalk between multiple channels and has a small size.

Description

Technical Field

[0001] The present application relates to the field of communications, and in particular to an analog optical transmission module. Background Art

[0002] Radio-over-fiber (RoF) technology is a new wireless access technology that combines fiber-optic communication and wireless communication and has been developed to meet the needs of high-speed and large-capacity wireless communication. Microwaves are modulated onto lasers at the central station, and then the modulated light waves are transmitted through complex optical fiber links. After reaching the base station, the microwave signals are demodulated by photoelectric conversion and then transmitted through the antenna for users to use. The radio frequency (or millimeter wave) signals transmitted by optical fiber increase the wireless bandwidth, but the loss in the atmosphere after the antenna is transmitted will increase. Using optical fiber as a transmission link has the characteristics of low loss, high bandwidth and prevention of electromagnetic interference. It is precisely these advantages that make RoF technology have broad application prospects in the future fields of wireless broadband communication, satellite communication and intelligent transportation systems. Compared with traditional systems, RoF systems have the advantages of wider cellular coverage, wider bandwidth, lower cost, lower power consumption and easy installation.

[0003] Existing analog optical modules require dedicated radio frequency heads for signal transmission, which is costly and difficult to miniaturize, thus limiting the mass application of analog optical modules. Analog optical transmission modules have high requirements for isolation between channels, and there are currently no multi-channel small analog optical modules. Summary of the invention

[0004] The purpose of this application is to provide a miniaturized analog optical transmission module that can reduce signal crosstalk between multiple channels.

[0005] An analog optical transmission module, comprising N bidirectional transmission optical signal receiving and transmitting combination components, a gold finger, a receiving circuit, a transmitting circuit, N transmitting transmission channels and N receiving transmission channels, each bidirectional transmission optical signal receiving and transmitting combination component comprises a transmitting TO and a receiving TO, the transmitting TO is used to convert the electrical signal input to the bidirectional transmission optical signal receiving and transmitting combination component into an optical signal output, and the receiving TO is used to convert the optical signal input to the bidirectional transmission optical signal receiving and transmitting combination component into an electrical signal output; the gold finger, the receiving circuit, and the transmitting circuit are all arranged in a printed circuit board, and the receiving circuit is connected to the printed circuit board. One end of the microstrip line of the receiving circuit is electrically connected to the gold finger, and one end of the microstrip line of the transmitting circuit is electrically connected to the gold finger; one end of the Kth transmitting transmission channel is electrically connected to the other end of the microstrip line of the transmitting circuit, and the other end thereof is electrically connected to the output end of the transmitting TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; one end of the Kth receiving transmission channel is electrically connected to the other end of the microstrip line of the receiving circuit, and the other end thereof is electrically connected to the input end of the receiving TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; wherein N is a positive integer greater than or equal to 1, K=1, 2, …, N.

[0006] The bidirectional transmission optical signal receiving and transmitting combined component is a BOSA structure with separate transmitting and receiving.

[0007] The grounds of the gold fingers are electrically connected to each other.

[0008] The analog radio frequency signal of the gold finger is transmitted using a single-ended signal transmission method.

[0009] The size of the gold finger is compatible with the standard DSFP protocol.

[0010] The transmitting transmission channel is a transmitting flexible circuit board, and the receiving transmission channel is a receiving flexible circuit board.

[0011] The receiving TO is TO33 or TO46, and the transmitting TO is TO38 or TO56.

[0012] N=2.

[0013] It also includes a bottom shell and an upper cover. The upper and lower layers of the gold fingers are respectively arranged on two opposite surfaces of one end of the printed circuit board; two bidirectional transmission optical signal receiving and transmitting assembly components are vertically arranged side by side in the bottom shell and are respectively fixed to the two flange surface bayonet of the bottom shell through standard LC sleeves; the printed circuit board is arranged in the rear end of the bottom shell, and the upper cover is covered on the bottom shell, and is limited and fixed by the front end convex point of the upper cover and the groove of the bottom shell, and the rear end is fastened by the first fixing screw and the second fixing screw.

[0014] Also includes:

[0015] The heat sink is arranged between the transmitting TO and the bottom shell of the bidirectional transmission optical signal receiving and transmitting combined component and is in contact with the transmitting TO and the bottom shell respectively.

[0016] The beneficial technical effects of this application are:

[0017] This application adopts a BOSA solution with separated transmission and reception. Each TO signal uses a separate transmission transmission channel and a reception transmission channel to transmit the signal. At the same time, the transmission transmission channel and the reception transmission channel are directly fixed near the gold finger, which can reduce the crosstalk of the RF signal during the transmission process of the printed circuit board. This case uses gold fingers to transmit multi-channel analog signals, realizes the transmission of multi-channel analog signals under the SFP packaging size, reduces the volume and increases the transmission density, and has universal adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the electrical structure of an analog optical transmission module provided in an embodiment of the present application;

[0019] Figure 2 A structural diagram of a simulated optical transmission module provided in an embodiment of the present application;

[0020] Figure 3 A schematic diagram of a structure for compatible side-by-side placement of BOSA provided in an embodiment of the present application

[0021] Figure 4 An exploded diagram of a simulated optical transmission module provided in an embodiment of the present application;

[0022] Figure 5 A schematic diagram of the structure of an external connector of an analog optical transmission module provided in an embodiment of the present application;

[0023] Figure 6 A schematic diagram of the structure of a pluggable circuit board assembly connector with gold fingers after being paired and inserted in an embodiment of the present application;

[0024] Figure 7 A schematic diagram of the structure of a BOSA provided in an embodiment of the present application;

[0025] Figure 8 A schematic diagram of the structure of a printed circuit board for being compatible with BOSA placed side by side provided in an embodiment of the present application;

[0026] Fig. 9 A schematic diagram of an SFP+ cage, a simulated optical transmission module and an optical fiber connection provided in an embodiment of the present application;

[0027] Fig.10 This is a schematic diagram of the structure of the gold finger on the printed circuit board of this application;

[0028] Fig.11 This is a schematic diagram of the PIN pin structure of the lower layer gold finger of this application;

[0029] Fig.12 This is a schematic diagram of the PIN pin structure of the upper layer gold finger of this application;

[0030] Fig.13 This is the PIN definition table for the upper and lower layers of the gold finger of this application;

[0031] Fig.14 A schematic diagram of a performance simulation result provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The examples given below are specific descriptions of the present application. It is necessary to point out that the following examples are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In addition, the terms "first", "second", "Kth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", "Kth" may explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise specified, "plurality" means two or more, unless otherwise clearly specified.

[0035] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] The present application discloses an analog optical transmission module, which is used to transmit broadband analog signals with a frequency range of 10M to 20G. The module includes N bidirectional transmission optical signal receiving and transmitting combination components, a gold finger, a receiving circuit, a transmitting circuit, N transmitting transmission channels and N receiving transmission channels. Each bidirectional transmission optical signal receiving and transmitting combination component includes a transmitting TO and a receiving TO. The transmitting TO is used to convert an electrical signal input into the bidirectional transmission optical signal receiving and transmitting combination component into an optical signal output, and the receiving TO is used to convert an optical signal input into an electrical signal output. The gold finger, the receiving circuit, the transmitting TO and the receiving TO are connected to the bidirectional transmission optical signal receiving and transmitting combination component. The transmitting circuits are all arranged in the printed circuit board, one end of the microstrip line of the receiving circuit is electrically connected to the gold finger, and one end of the microstrip line of the transmitting circuit is electrically connected to the gold finger; one end of the Kth transmitting transmission channel is electrically connected to the other end of the microstrip line of the transmitting circuit, and the other end thereof is electrically connected to the output end of the transmitting TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; one end of the Kth receiving transmission channel is electrically connected to the other end of the microstrip line of the receiving circuit, and the other end thereof is electrically connected to the input end of the receiving TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; wherein N is a positive integer greater than or equal to 1, K=1, 2, ..., N. wherein the bidirectional transmission optical signal receiving and transmitting combination component is a BOSA structure with separate transmitting and receiving. The transmitting transmission channel is a transmitting flexible circuit board, and the receiving transmission channel is a receiving flexible circuit board.

[0038] The grounds of the gold finger 21 are electrically connected to each other. In order to further reduce the crosstalk between analog signals, the present application performs via processing on the ground of the gold finger 21, so that the ground of the upper and lower layers of the gold finger are electrically connected together through the via, which can effectively shield the channel crosstalk. The analog RF signal of the gold finger is transmitted using a single-ended signal transmission method. The size of the gold finger is compatible with the standard DSFP protocol.

[0039] The following text further illustrates this application by taking N=2 as an example.

[0040] The present application provides an analog optical transmission module that can realize the transmission of multi-channel broadband signals and achieve stable transmission of signal frequencies from 10M to 20G. Figure 1 As shown, the multi-channel analog optical module in the embodiment of the present application may include a gold finger port, two bi-direction optical signal receiving and transmitting assembly components (Bi-direction Optical Subassemblies, BOSA), a transmitting circuit, a receiving circuit, and a printed circuit board assembly. Its receiving circuit and transmitting circuit simultaneously control two BOSAs, that is, there are two signal transmitting links and two signal receiving links;

[0041] like Figure 2 As shown, the embodiment of the present application provides an analog optical transceiver module. This structure is a new small hot-swappable analog optical module. Compared with SFP / SFP+ / DSFP and other packaging forms, this structure can place two BOSA structures side by side vertically without increasing the length and width of the module, such as Figure 3 As shown; the length and width directions of the dimensions of the present application can also comply with the SFF-8432Rev5.2 protocol standard, and the height direction of the present application is about 2mm higher than the SFF-8432Rev5.2 protocol standard; the design of the rear end of the module and the height of the printed circuit board 6 comply with the SFP / SFP+ / DSFP protocol; in this way, the present application can be compatible with existing connectors and LC fiber optic jumpers in terms of structure, and has universality.

[0042] In one embodiment, Figure 2-4 As shown, the first BOSA 7 and the second BOSA 8 are fixed to the two flange surface bayonet joints of the bottom shell 1 through the standard LC sleeve 14, and the positions in the optical port are consistent, and are compatible with standard LC optical fiber connectors, which are pluggable. Fig. 9 As shown. The printed circuit board 6 is arranged in the rear end of the bottom shell 1. The upper cover 5 is covered on the bottom shell, and is limited and fixed by the front end protrusion of the upper cover 5 and the groove of the bottom shell 1. Only two screws, the first fixing screw 9 and the second fixing screw 11, are needed at the rear end to complete the fastening and fixing between the bottom shell 1 and the upper cover 5, so that the optical module structure is simple and reliable, and is convenient for assembly and rework. The EMI shielding shrapnel 2 is roughly U-shaped, and the U-shaped opening has a clamping claw that faces each other. The front end of the bottom shell 1 is located in the EMI shielding shrapnel 2, and the clamping claw of the EMI shielding shrapnel 2 buckles the upper cover 5. The EMI shielding shrapnel 2 is wrapped around the outside of the bottom shell 1 and the upper cover 5 for locking the module. The pull ring 3 is arranged at the front end of the bottom shell 1 for pulling the present application. The shell formed by the bottom shell 1 and the upper cover 5 is used to form protection for the devices inside the present application and isolate electromagnetic signals. The spring 10 is installed on the upper cover 5 for releasing the elastic force. The slider 4 is mounted on the upper cover 5 and contains a spring 10 therein, and the spring 10 provides elastic force for the slider 4 to return to its initial position after sliding. The bottom shell 1 also includes an optical port for placing the output optical end of the BOSA.

[0043] In one embodiment, the RF connection port may be a hot-pluggable structure, such as Figure 5 , 6 As shown, it is convenient to install and maintain the analog optical transmission module of the present application. One end of the plug can be a pluggable circuit board assembly 12 with gold fingers, and the other end is assembled with an external connector 13. The size of the pluggable circuit board assembly 12 is compatible with a small pluggable optical signal receiver and transmitter (Small form-factor pluggable transceiver plus, SFP+) / dual small pluggable optical signal receiver and transmitter (Dual Small form-factor pluggable transceiver, DSFP), etc. In one embodiment, the external connector 13 is compatible with a standard SFP+ / DSFP connector, which improves compatibility and ensures the versatility of the RF connector; the gold fingers 21 in the pluggable circuit board assembly 12 with gold fingers can be connected to the receiving circuit 23 and the transmitting circuit 22 through a DC current signal, and can also be connected to the first BOSA 7 and the second BOSA 8 through a broadband RF signal. As shown Fig.10 As shown, the upper and lower layers of the gold finger 21 are respectively arranged on two opposite surfaces of one end of the printed circuit board, and the upper and lower grounds are electrically connected together through vias. The PIN pins of the gold finger 21 are defined as follows: Figure 11-13 shown.

[0044] In one embodiment, the first BOSA 7 and the second BOSA 8 are respectively provided with a heat sink 18, and the heat sink 18 is arranged between the transmitting TO and the bottom shell 1 of the bidirectional transmission optical signal receiving and transmitting assembly component and is in contact with the transmitting TO and the bottom shell 1 respectively. Figure 8 As shown, the upper surface of the heat sink 18 is concave, which is used to contact the reflective TO17 of the first BOSA7. The contact part is generally filled with heat dissipation film or silica gel to improve the heat dissipation effect; the lower surface of the heat sink 18 is in contact with the bottom shell 1. Generally, the contact part is filled with heat dissipation film or silica gel to improve the heat dissipation effect. This heat sink can be a metal with different thermal conductivity to improve the heat dissipation of the module and protect the BOSA optical device. The heat sink 18 can also adjust the structure and shape according to different packaging sizes to match different optical module packages; in another embodiment, the heat sink is directly grown on the bottom shell 1 using the same material as the bottom shell to save the assembly steps. The way to set the heat sink in the second BOSA 8 is the same as that of the first BOSA7.

[0045] In one embodiment, for the first BOSA 7 and the second BOSA 8, as Figure 7, the first BOSA is composed of a first receiving TO15, a first BOSA shell 16, and a first transmitting TO17. The first receiving TO15 is TO33 (TO33 is a size standard of a TO base), and the first transmitting TO17 is TO38 (TO38 is a size standard of a TO base). The use of a small-sized TO can make the overall structure smaller and compatible with the SFP package; the first BOSA shell 16 is a metal structural part, which is used to fix the first receiving TO15 and the first transmitting TO17. At the same time, there is a filter inside the first BOSA shell 16 to achieve the light splitting and light combining effect of different wavelengths; the TO38 transmitting end has no cooling function, but it is very small and easy to assemble in the shell 1. The second BOSA is composed of a second receiving TO, a second BOSA shell, and a second transmitting TO. The connection structure of the second receiving TO, the second BOSA shell, and the second transmitting TO is the same as that of the first BOSA 7. For details, please refer to the description of the connection structure of the first BOSA 7 mentioned above.

[0046] In one embodiment, for the first BOSA 7 and the second BOSA 8, as Figure 7As shown, the first BOSA 7 is externally composed of a first transmitting flexible circuit board 19, a first receiving flexible circuit board 20 and a first BOSA optical port LC sleeve 14. One end of the first transmitting flexible circuit board 19 is fixed on the printed circuit board 6 and connected to the transmitting circuit 22. One end of the first receiving flexible circuit board 20 is fixed on the printed circuit board 6 and connected to the receiving circuit 23. The other end of the first transmitting flexible circuit board 19 is fixed on the first transmitting TO17 pin of the first BOSA 7, and the other end of the first receiving flexible circuit board 20 is fixed on the first receiving TO15 pin. Similarly, the second BOSA also has a second transmitting flexible circuit board, a second receiving flexible circuit board and a second BOSA optical port LC sleeve, which are the same as those of the first BOSA 7. The aforementioned fixing can be, but is not limited to, high-temperature soldering. The first and second transmitting flexible circuit boards and the first and second receiving flexible circuit boards can pass direct current signals or broadband radio frequency signals; the first BOSA optical port LC sleeve 14 and the second BOSA optical port LC sleeve can realize optical access and transmission, that is, single-fiber bidirectional transmission signals, and can simultaneously transmit 1270nm (1260-1280nm) transmitting optical signals and 1330nm (1320-1340nm) receiving optical signals, and can also simultaneously transmit 1330nm (1320-1340nm) transmitting optical signals and 1270nm (1260-1280nm) receiving optical signals. If the first BOSA7 transmits an emission light signal of 1270nm (1260-1280nm) and a receiving light signal of 1330nm (1320-1340nm), the second BOSA8 transmits an emission light signal of 1330nm (1320-1340nm) and a receiving light signal of 1330nm (1320-1340nm); conversely, if the second BOSA7 transmits an emission light signal of 1270nm (1260-1280nm) and a receiving light signal of 1330nm (1320-1340nm), the first BOSA8 transmits an emission light signal of 1330nm (1320-1340nm) and a receiving light signal of 1330nm (1320-1340nm).

[0047] In another embodiment, the above wavelengths may also transmit 1270nm (1260-1280nm) and 1350nm (1340-1360nm), or 12900nm (1280-1300nm) and 1350nm (1340-1360nm), and similar optical transceiver modules with wavelength intervals greater than or equal to 60nm.

[0048] In another embodiment, in order to achieve stable output of the transmitter TO, the transmitter TO can also use a TO56 with cooling (TO56 is a size standard of a TO base). Compared with the TO38 transmitter, the TO56 transmitter is larger in size and generates more heat, but has TEC temperature control, and has more stable performance output under harsh ambient temperature conditions. The TO56 transmitter can also be integrated in the BOSA and then installed in the structure of the housing 1.

[0049] In one embodiment, if the function Figure 8 The printed circuit board includes a transmitting circuit 22, a receiving circuit 23, a processor chip 24, and a gold finger 21; the transmitting circuit 22 includes a transmitting power supply function, a gain automatic equalization function, and a microstrip transmission function; the transmitting circuit 22 is connected to the first transmitting TO17 through the first transmitting flexible circuit board 19, and the other end of the transmitting circuit is connected to the external connector 13 through the gold finger; the transmitting circuit 22 provides power to the first transmitting TO17 of the first BOSA7 to realize the power supply function; when the external ambient temperature changes, the transmitting circuit 22 performs gain change feedback to realize gain equalization control, so that the gain is basically consistent under different ambient temperatures; the microstrip line in the transmitting circuit 22 transmits the broadband RF signal from the gold finger 21 to the first transmitting flexible circuit board 19. The receiving circuit 23 includes a receiving TO power supply function and a microstrip transmission function; the receiving circuit 23 is connected to the first receiving TO15 through the first receiving flexible circuit board 20, and the other end is connected to the external connector 13 through the gold finger 21; the receiving circuit 23 provides power to the first receiving TO15 of the first BOSA7 to realize the power supply function; the microstrip line in the receiving circuit 23 transmits the broadband radio frequency signal from the first receiving flexible circuit board 20 to the gold finger. The printed circuit board is connected to the second transmitting flexible circuit board and the second receiving flexible circuit board and the second BOSA8 in the same way as the first BOSA7, that is, the connection between the second BOSA8 and the transmitting circuit 22, the receiving circuit 23, the processor chip 24, and the gold finger 21 through the second transmitting flexible circuit board, the second receiving flexible circuit board is the same as the connection between the first BOSA7 and the transmitting circuit 22, the receiving circuit 23, the processor chip 24, and the gold finger 21 through the first transmitting flexible circuit board 19, the first receiving flexible circuit board 20. The processor chip 24 is used to monitor the working status of the first BOSA7 and the second BOSA8; the gold finger 21 is used for the transmission of electrical signals and broadband radio frequency signals.

[0050] Fig. 9 A schematic diagram of the connection between an SFP+ cage 26 provided in an embodiment of the present application and an analog optical transmission module 25 and an optical fiber 27 of the present application is provided.

[0051] Compared with digital optical modules, analog optical modules belong to broadband signal transmission, which needs to ensure that the gain is flat within the entire signal frequency range and the gain loss is small within the entire signal frequency range; traditional analog optical modules require special RF heads for broadband RF signal transmission. This application uses relatively inexpensive gold fingers for broadband RF signal transmission for the first time. Compared with the digital module using differential signal transmission, this application uses single-ended signal transmission to better realize the transmission of broadband RF signals.

[0052] This application realizes 10M~20G broadband analog signal transmission, with small insertion loss and reflection in 4 channels and large isolation between channels. Fig.14 .

[0053] It should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not further describe various possible combinations.

[0054] The present application has been described in detail above with reference to the embodiments, which is illustrative rather than restrictive. Changes and modifications without departing from the overall concept of the present application are within the scope of protection of the present application.

Claims

1. An analog optical transmission module, characterized in that: The invention comprises N bidirectional transmission optical signal receiving and transmitting combination components, a gold finger, a receiving circuit, a transmitting circuit, N transmitting transmission channels and N receiving transmission channels, each bidirectional transmission optical signal receiving and transmitting combination component comprises a transmitting TO and a receiving TO, the transmitting TO is used to convert the electrical signal input into the bidirectional transmission optical signal receiving and transmitting combination component into an optical signal output, and the receiving TO is used to convert the optical signal input into the bidirectional transmission optical signal receiving and transmitting combination component into an electrical signal output; the gold finger, the receiving circuit and the transmitting circuit are all arranged in a printed circuit board, one end of the microstrip line of the receiving circuit is electrically connected to the gold finger, and one end of the microstrip line of the transmitting circuit is electrically connected to the gold finger; one end of the Kth transmitting transmission channel is electrically connected to the other end of the microstrip line of the transmitting circuit, and the other end thereof is electrically connected to the output end of the transmitting TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; one end of the Kth receiving transmission channel is electrically connected to the other end of the microstrip line of the receiving circuit, and the other end thereof is electrically connected to the input end of the receiving TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; wherein N is a positive integer greater than or equal to 1, K=1, 2, ..., N; The bidirectional transmission optical signal receiving and transmitting combined component is a BOSA structure with separate transmission and reception; The grounds of the gold fingers are electrically connected to each other; The analog radio frequency signal of the gold finger is transmitted using a single-ended signal transmission method.

2. The simulated optical transmission module according to claim 1, characterized in that: The size of the gold finger is compatible with the standard DSFP protocol.

3. The simulated optical transmission module according to claim 1, characterized in that: The transmitting transmission channel is a transmitting flexible circuit board, and the receiving transmission channel is a receiving flexible circuit board.

4. The simulated optical transmission module according to claim 1, characterized in that: The receiving TO is TO33 or TO46, and the transmitting TO is TO38 or TO56.

5. The simulated optical transmission module according to claim 1, characterized in that: The analog optical transmission module is used to transmit broadband analog signals, and the frequency range is 10M-20G.

6. The analog optical transmission module according to any one of claims 1 to 5, characterized in that: N=2。 7. The simulated optical transmission module according to claim 6, characterized in that: It also includes a bottom shell and an upper cover. The upper and lower layers of the gold fingers are respectively arranged on two opposite surfaces of one end of the printed circuit board; two bidirectional transmission optical signal receiving and transmitting assembly components are vertically arranged side by side in the bottom shell and are respectively fixed to the two flange surface bayonet of the bottom shell through standard LC sleeves; the printed circuit board is arranged in the rear end of the bottom shell, and the upper cover is covered on the bottom shell, and is limited and fixed by the front end convex point of the upper cover and the groove of the bottom shell, and the rear end is fastened by the first fixing screw and the second fixing screw.

8. The simulated optical transmission module according to claim 7, characterized in that: Also includes: The heat sink is arranged between the transmitting TO and the bottom shell of the bidirectional transmission optical signal receiving and transmitting combined component and is in contact with the transmitting TO and the bottom shell respectively.

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