refrigerator

Abstract

The refrigerator has a heat-insulating box body. An equipment room is provided below the heat-insulating box body. A compressor and a substrate unit are arranged in the equipment room. A control substrate is arranged in the substrate unit. The control substrate is arranged vertically beside the compressor.

Description

Technical Field

[0001] One aspect of the present invention relates to a refrigerator having an equipment compartment. Background Art

[0002] In order to insulate the refrigerator from the surrounding, an insulating box is provided to cover the outer periphery of the storage space. An equipment room is provided below the back side of the insulating box, and a compressor constituting a refrigeration cycle is arranged in the equipment room.

[0003] In addition, the refrigerator includes a control substrate for controlling electrical components such as a compressor, etc. For example, Japanese Patent Application Laid-Open No. 2001-91138 discloses a refrigerator including an equipment room formed at the rear of a refrigerator body and a control substrate provided near the equipment room.

[0004] The control substrate is provided with electronic control components for controlling the electrical components of the refrigerator. The control substrate is located at the lower rear of the refrigerator body and is buried in a hole formed in the heat insulation wall above the equipment room. Summary of the invention

[0005] However, in the structure disclosed in Japanese Patent Application Laid-Open No. 2001-91138, a hole is formed by hollowing out a portion of the heat insulating wall. Since the control substrate is arranged inside the hole, the heat insulating wall becomes thinner in the area where the control substrate is arranged, which may lead to a decrease in heat insulating performance.

[0006] Therefore, in one aspect of the present invention, an object is to provide a refrigerator in which a control substrate can be arranged near a compressor without removing a heat-insulating box.

[0007] A refrigerator according to one aspect of the present invention includes a heat-insulating box, an equipment room provided below the heat-insulating box, a compressor arranged in the equipment room, and a control substrate arranged vertically beside the compressor.

[0008] According to a refrigerator according to one aspect of the present invention, a control substrate can be arranged near a compressor without digging out a heat-insulating box. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a plan view showing the structure of the back side portion of the refrigerator according to one embodiment of the present invention.

[0010] Figure 2 Yes means Figure 1 A cross-sectional schematic diagram of the internal structure of a refrigerator is shown.

[0011] Figure 3 It means in Figure 1 The shown refrigerator is a plan view of a state where the base unit in the equipment room is removed.

[0012] Figure 4 Yes means Figure 1 A schematic diagram showing the arrangement of each unit within the equipment room of a refrigerator is shown.

[0013] Figure 5 It means in Figure 3 This is a plan view of a state in which the exterior member of the base unit is installed in the equipment room in the state shown.

[0014] Figure 6 It means in Figure 5 This is a plan view of a state in which a resin casing is installed in an equipment room in the state shown.

[0015] Figure 7 Yes means Figure 1 A perspective view of the appearance of a substrate unit included in the refrigerator shown.

[0016] Figure 8 Yes means Figure 1 A perspective view of the appearance of a substrate unit included in the refrigerator shown.

[0017] Fig. 9 So will Figure 7 The exploded perspective view shows a state where the components of the substrate unit are exploded. DETAILED DESCRIPTION

[0018] Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the same reference numerals are assigned to the same components. Their names and functions are also the same. Therefore, their detailed description will not be repeated.

[0019] <First Embodiment>

[0020] (Overall structure of refrigerator)

[0021] First, the overall structure of the refrigerator 1 according to the first embodiment will be described. Figure 1 The structure of the back side of the refrigerator 1 is shown in FIG. Figure 2 The internal structure of the refrigerator 1 is shown in FIG. Figure 2 In the figure, components in the equipment room 30 other than the compressor 31 are omitted from the illustration.

[0022] like Figure 2 As shown, the refrigerator 1 has a first refrigerating chamber 11 at the upper layer, a freezing chamber 12 at the middle layer, and a second refrigerating chamber 13 at the lower layer. The first refrigerating chamber 11 is provided with a refrigerating chamber door 11a. The freezing chamber 12 is provided with a freezing chamber door 12a. The second refrigerating chamber 13 is provided with a refrigerating chamber door 13a.

[0023] As described above, the refrigerator 1 according to the present embodiment is divided into an upper layer, a middle layer, and a lower layer, and each storage space is provided. A partition 59 is provided between each storage space. However, the arrangement position of each storage space is not limited to this.

[0024] In this embodiment, the surface provided with the door is referred to as the front or front of the refrigerator. And, based on the front, the surfaces of the refrigerator 1 are set as the top, side, back and bottom according to the position when the refrigerator 1 is set in a normal state.

[0025] A refrigeration cycle 40 is provided inside the refrigerator 1. The refrigeration cycle 40 is composed of a compressor 31, a condenser (not shown), an expander (not shown), and a cooler (evaporator) 32 connected via a refrigerant pipe (refrigerant flow path) through which the refrigerant flows.

[0026] like Figure 2 As shown, the compressor 31 is arranged in the equipment room 30 provided on the back side of the bottom of the refrigerator 1. The cooler 32 is arranged in the cooling room 35 provided on the back side of the refrigerator 1. In addition to the cooler 32, the cooling room 35 is also provided with a cooling fan 33 and the like. The cooling fan 33 is provided to circulate air between the cooling room 35 and each storage space.

[0027] In addition, a control unit is provided inside the refrigerator 1. The control unit is, for example, arranged on a control substrate 21 described later. The control unit controls the operation of the refrigeration cycle 40. That is, the control unit starts the operation of the refrigeration cycle by driving the compressor 31, thereby circulating the refrigerant in the cycle.

[0028] Specifically, the high-temperature and high-pressure refrigerant compressed by the compressor 31 is condensed while dissipating heat in the condenser. Next, the high-pressure refrigerant expands in the expander to become low-temperature and low-pressure, and is sent to the cooler 32 as an evaporator. The refrigerant flowing into the cooler 32 exchanges heat with the cold air flowing in the cooling chamber 35, absorbs heat while evaporating, becomes a low-temperature gas refrigerant, and is sent to the compressor 31. In this way, while the refrigeration cycle is operated by the refrigerant circulation, cold air is generated by the airflow that has exchanged heat with the cooler 32.

[0029] (Structure of the heat insulation box)

[0030] In the refrigerator 1, a heat-insulating box 50 is provided as a heat-insulating structure for heat-insulating each storage space from the surroundings. The heat-insulating box 50 is provided to cover the outer periphery of the refrigerator 1. Figure 2 As shown, the heat insulating box 50 mainly includes an outer box 61 , an inner box 62 , a vacuum heat insulating material 51 , and a foam heat insulating material 56 .

[0031] The outer box 61 forms the outer peripheral surface of the heat-insulating box body 50. The outer box 61 is mainly composed of an upper surface portion 50a, a side portion 50b, a back portion 50c, and a bottom portion 50d. The inner box 62 forms the inner peripheral surface of the heat-insulating box body 50. In addition, the inner box 62 forms the boundary of the storage space (for example, the first refrigerating chamber 11, the freezing chamber 12, and the second refrigerating chamber 13) and the cooling chamber 35.

[0032] In addition, a space for arranging the equipment room 30 is formed on the back side of the bottom of the heat insulating box 50. That is, the equipment room 30 is arranged outside the heat insulating box 50. This is because the temperature in the equipment room 30 rises as the compressor 31 operates.

[0033] The vacuum insulation material 51 and the foam insulation material 56 are arranged in the space between the outer box 61 and the inner box 62. The vacuum insulation material 51 is a sheet-like or plate-like insulation material. The vacuum insulation material 51 is, for example, respectively arranged on the side, top, bottom, and back of the refrigerator 1. For example, the foam insulation material 56 can be formed of foamed polyurethane (also called hard polyurethane foam) or the like.

[0034] (Interior structure of the equipment room)

[0035] Next, refer to Figure 1 The following describes a more detailed structure of the equipment room 30 provided at the lower rear surface side of the heat insulating box body 50 . Figure 1 2 shows the back side of the heat insulating box 50 in a state where a back side cover covering the back side of the equipment room 30 is removed. Figure 3 Shown in Figure 1 The refrigerator 1 is shown in a state where the base unit 20 disposed in the equipment compartment 30 is removed. Figure 4 Schematically shows the positional relationship between the components (ie, the compressor 31 , the substrate unit 20 , and the evaporation dish 70 ) disposed in the equipment room 30 .

[0036] The back portion 50c of the heat-insulating box body 50 is mainly composed of the back plate of the outer box 61. The equipment room 30 is located below the back portion 50c. The equipment room 30 is mainly divided by the bottom plate 63 forming the bottom portion 50d of the heat-insulating box body 50. Figure 2 As shown in FIG. 1 and FIG. 2 , the rear portion of the bottom plate 63 protrudes upward. The rearmost side of the bottom plate 63 is substantially flat in the horizontal direction, and this portion forms a ceiling portion 63a of the equipment room 30.

[0037] The bottom plate 63 has a ceiling portion 63a and a riser portion 63c, which are used to divide the area of ​​the equipment room 30 (see Figure 2 The ceiling portion 63a forms the upper surface (ceiling) of the equipment room 30. The rising portion 63c forms the front surface of the equipment room 30. In addition, the side surface of the equipment room 30 is formed by the side surface portion 50b of the outer box 61.

[0038] The equipment room 30 mainly includes a compressor 31, a substrate unit 20, and an evaporating dish 70. The compressor 31 is located slightly to the right of the equipment room 30 when viewed from the back (left when viewed from the front). The substrate unit 20 is located next to the compressor 31. Figure 1 In the example shown, the substrate unit 20 is arranged on the left side of the compressor 31 (the right side of the compressor 31 when viewed from the front). However, in another example, the substrate unit 20 may be arranged on the right side of the compressor 31 (the left side of the compressor 31 when viewed from the front).

[0039] A control substrate 21 is disposed in the substrate unit 20. Figure 4 As shown, the control board 21 is arranged in the longitudinal direction (direction perpendicular to the horizontal plane). More specifically, the control board 21 is arranged substantially parallel to the side surface 50 b of the heat insulating box 50 forming the side wall of the equipment room 30 .

[0040] In addition, in the equipment room 30, a harness 38 including various wirings is arranged on the front side of the space 20A where the substrate unit 20 is arranged (see Figure 3 The wire harness 38 is connected to the electrical components in the heat-insulating box 50, the electrical components in the equipment room 30 such as the compressor 31, the control board 21, and a power supply unit (not shown).

[0041] The evaporation dish 70 is located above the compressor 31. The condensed water generated in the cooling chamber 35 is discharged from the evaporation dish 70. The condensed water generated in the cooling chamber 35 includes, for example, defrosting water generated when the cooler 32 is defrosted. Figure 4 As shown, a recessed portion 71 that is bent upward is formed on the bottom surface portion 70d of the evaporating dish 70. The recessed portion 71 is formed in a shape that follows the shape of the upper portion (head) of the compressor 31.

[0042] The evaporating dish 70 has a substantially rectangular box shape. The outer shape of the evaporating dish 70 is mainly composed of a front portion (not shown), a side portion 70b, a back portion 70c, and a bottom portion 70d. The names of the respective portions are defined according to the positions of the evaporating dish 70 when it is installed in the refrigerator 1. By having these respective portions, condensed water discharged from a drain pipe (not shown) disposed above can be stored.

[0043] The outer surface side of the evaporating dish 70 is provided with a heat dissipation groove 72 for dissipating the heat generated by the compressor 31. The groove 72 is formed from the bottom surface portion 70d to the back surface portion 70c.

[0044] The back side 70c of the evaporating dish 70 is provided with a support portion 73 extending upward. The number of the support portions 73 is not particularly limited, but in the present embodiment, two support portions 73 are provided. Figure 3 As shown, the upper end portion of the support portion 73 is supported and fixed to the back surface portion 50 c of the heat insulating box 50 .

[0045] (Construction of the substrate unit)

[0046] Next, the detailed structure of the substrate unit 20 will be described. Figure 5 and Figure 6 FIG. 2 shows an enlarged view of the equipment room 30. Figure 5 , a state in which the exterior components constituting the substrate unit 20 (ie, the housing 22 and the holding member 23) are attached is shown.

[0047] Figure 7 and Figure 8 2 shows the appearance of the substrate unit 20. Figure 7 , the appearance of the substrate unit 20 when viewed from the cover 25 side is shown. Figure 8 , the appearance of the substrate unit 20 when viewed from the housing 22 side is shown. Fig. 9 The components constituting the substrate unit 20 are shown in an exploded state.

[0048] The substrate unit 20 mainly includes a control substrate 21 , a housing (heat conduction plate) 22 , a holding member 23 , a resin case 24 , and a cover 25 .

[0049] The control substrate 21 includes various electronic components such as electronic circuits and coils. The control substrate 21 has a substantially flat plate shape. As described later, the control substrate 21 is disposed in a box-shaped resin case 24. The control substrate 21 is disposed in a longitudinal direction (i.e., in a direction perpendicular to a horizontal plane). More specifically, Figure 4 As shown, the substantially flat plate-shaped control substrate 21 is arranged substantially parallel to the side surface portion 50 b of the heat insulating box 50 forming the side wall of the equipment room 30 .

[0050] The housing 22 is formed by molding a plate (e.g., a metal plate) made of a material with high thermal conductivity into a predetermined shape. The housing 22 accommodates a resin case 24 on which the control substrate 21 is mounted. The housing 22 is mainly composed of a first side wall 22a, a second side wall 22b, a third side wall 22c, an upper surface portion 22d, and a lower surface portion 22e.

[0051] The first side wall 22a is provided at a position adjacent to the compressor 31 and the evaporation dish 70 when the substrate unit 20 is installed in the equipment room 30. That is, the first side wall 22a is arranged between the compressor 31 and the control substrate 21 (see Figure 4 ).

[0052] The second side wall 22b is provided at a position opposite to the first side wall 22a and has a face portion substantially parallel to the first side wall 22a. In addition, the second side wall 22b has a curved shape, thereby forming a space 22S. When the substrate unit 20 is installed in the equipment room 30, the space 22S is located in the front side of the equipment room 30. Therefore, the space 22S can be used as a place to place the wiring harness 38 (see Figure 3 ) space.

[0053] like Figure 8 As shown, a hole 22g for passing wiring connected to the control board 21 is formed in the second side wall 22b. A plurality of wirings in the wiring harness 38 are branched in the space 22S, and a part of them is arranged in the board unit 20 through the hole 22g.

[0054] The third side wall 22c is located on the front side of the equipment room 30 when the substrate unit 20 is installed in the equipment room 30. The upper surface portion 22d is located on the upper surface side of the equipment room 30 when the substrate unit 20 is installed in the equipment room 30. The lower surface portion 22e is located on the bottom side of the equipment room 30 when the substrate unit 20 is installed in the equipment room 30.

[0055] The third side wall 22c, the upper surface portion 22d, and the lower surface portion 22e connect the first side wall 22a and the second side wall 22b. Since the thermal conductivity of each of these parts is high, the heat conduction between the first side wall 22a and the second side wall 22b is promoted. Therefore, for example, the heat of the compressor 31 transferred to the first side wall 22a close to the compressor 31 can be effectively transferred to the second side wall 22b via any one of the third side wall 22c, the upper surface portion 22d, and the lower surface portion 22e.

[0056] When the substrate unit 20 is installed in the equipment room 30 , the back side of the housing 22 is open without any side wall. That is, the housing 22 has an opening 22F that opens on the back side of the equipment room 30 .

[0057] The resin case 24 has a substantially rectangular box shape with an opening on the side. The resin case 24 has an opening 24F. The opening 24F faces the side opposite to the side facing the compressor 31 when the resin case 24 is installed in the equipment room 30 (see FIG. 24 ). Figure 6 In the present embodiment, the resin case 24 is formed of a material having lower thermal conductivity (i.e., higher thermal insulation) than metal. In addition, the resin case 24 is formed of a material having higher electrical insulation. Examples of the material of the resin case 24 include polypropylene, polyethylene, and silicon.

[0058] Since the resin case 24 is formed of a material with relatively low thermal conductivity, the resin case 24 functions as a heat insulating member. Thus, by disposing the resin case 24 with high heat insulation between the control board 21 and the housing 22 (specifically, the first side wall 22a) on the side of the control board 21 opposite to the compressor 31, it is difficult for the heat generated by the compressor 31 to be transferred to the control board 21.

[0059] In addition, since the resin case 24 is formed of a material with high electrical insulation, the insulation distance can be ensured by the resin case 24. In the present embodiment, the housing 22 in which the resin case 24 is housed is formed of a metal plate, but by housing the control substrate 21 in the resin case 24, the insulation distance between the control substrate 21 and the housing 22 can be ensured.

[0060] The holding member 23 is installed so as to cover the opening 22F of the housing 22. Thus, the housing 22 is held by the holding member 23. The holding member 23 is located on the back side of the housing 22 when the substrate unit 20 is installed in the equipment room 30. In addition, the holding member 23 is located on the back side of the space 22S when the substrate unit 20 is installed in the equipment room 30.

[0061] The holding member 23 is formed of, for example, a resin material. A substantially rectangular opening 23F is provided on the holding member 23. As a result, a portion of the opening 22F of the housing 22 is opened on the back side through the opening 23F (see FIG. 2 ). Figure 5 ).

[0062] The cover 25 is installed in a manner covering the back side of the holding member 23. The material of the cover 25 is not particularly limited, and for example, it can be formed of a material with relatively high thermal conductivity (for example, a metal material). In one example, the cover 25 can be formed by molding the same metal plate as the metal plate forming the housing 22. The cover 25 is located on the back side of the equipment room 30 when the substrate unit 20 is installed in the equipment room 30.

[0063] As described above, the outer shape of the substrate unit 20 is formed by the housing 22, the holding member 23, and the cover 25. The control substrate 21 and the resin case 24 are arranged in a closed space formed by these components.

[0064] When the substrate unit 20 is installed in the equipment room 30, first, the space 20A (see Figure 3 ) is provided with an assembly of a housing 22 and a retaining component 23. Figure 5 The structure in the equipment room 30 at this time is shown. The resin case 24 on which the control board 21 is mounted is inserted into the housing 22 from the openings 23F and 22F.

[0065] Figure 6 The substrate unit 20 is shown with the resin case 24 mounted thereon. Since the resin case 24 has an opening 24F on the side opposite to the compressor 31, the heat generated by the control substrate 21 can be released in the direction of the arrow in the figure. The heat generated by the control substrate 21 is transferred to the second side wall 22b of the housing 22 or the metal cover 25 covering the back surface, and is discharged to the outside of the substrate unit 20.

[0066] In addition, the substrate unit 20 has a shape that is a left-right inversion of the letter "L" in a plan view, and a space 22S is provided in front of the retaining member 23 on the side adjacent to the side wall in the equipment room 30. That is, the space 22S is provided between the second side wall 22b and the side wall of the equipment room 30. The space 22S can be used as a space for arranging the wiring harness 38. In addition, by providing the space 22S, the area of ​​the third side wall 22c of the housing 22 located on the front side of the equipment room 30 can be reduced. As a result, the area of ​​the housing 22 opposite to the rising portion 63c of the bottom plate 63 forming the front of the equipment room 30 can be reduced, thereby suppressing the heat transfer from the housing 22 to the heat-insulating box 50.

[0067] On the other hand, since the area of ​​the cover 25 located on the back side of the equipment room 30 can be increased, heat can be sufficiently dissipated from the housing 22 to the back side of the equipment room 30 through the cover 25 .

[0068] In addition, in the substrate unit 20 of the present embodiment, as described above, the resin case 24 on which the control substrate 21 is mounted is installed in the housing 22 in a pluggable manner. Therefore, in the manufacturing process of the refrigerator 1, in the assembly stage or the formation stage of the heat-insulating box, the resin case 24 on which the control substrate 21 is mounted can be installed on the housing 22 without being installed. In the final process of assembling the refrigerator 1, the resin case 24 on which the control substrate 21 is mounted can be installed on the housing 22. Thus, in the manufacturing process where heat or vibration is likely to be generated, since the resin case 24 on which the control substrate 21 is mounted is removed, it is possible to prevent the microprocessor and other precision parts mounted on the control substrate 21 from malfunctioning during the manufacturing process. In addition, during the use of the refrigerator 1, when it is necessary to inspect or replace the control substrate 21, by removing the cover 25, the control substrate 21 can be easily removed together with the resin case 24, so that maintenance can be easily performed without damaging the control substrate 21.

[0069] (Summary of the First Embodiment)

[0070] As described above, the refrigerator 1 according to the present embodiment includes a heat-insulating box body 50. An equipment room 30 is provided below the heat-insulating box body 50. A compressor 31 and a substrate unit 20 are arranged in the equipment room 30. A control substrate 21 is arranged in the substrate unit 20. The control substrate 21 is arranged next to the compressor 31 in the longitudinal direction (direction perpendicular to the horizontal plane).

[0071] According to this structure, by arranging the control substrate 21 next to the compressor 31 in the equipment room 30, the control substrate 21 can be arranged near the compressor 31 without digging out the heat-insulating box 50. As a result, it is possible to avoid thinning of a part of the heat-insulating box, and to suppress the reduction of the heat-insulating performance. In addition, by arranging the control substrate 21 vertically, the control substrate 21 can be arranged in the vacant area next to the compressor 31 in the equipment room 30.

[0072] Furthermore, in this embodiment, by making efforts to improve the structure around the control substrate 21 (i.e., the structure of the substrate unit 20), the control substrate 21 is arranged in the equipment room 30, thereby reducing the influence of the heat generated by the compressor 31 on the control substrate 21.

[0073] Specifically, the control substrate 21 is covered by a metal housing 22. The housing 22 includes a first side wall 22a, a second side wall 22b, a third side wall 22c, an upper surface portion 22d, and a lower surface portion 22e, and the heat transferred from the compressor 31 to the first side wall 22a is transferred to the second side wall 22b located on the opposite side of the first side wall 22a with the control substrate 21 sandwiched therebetween. That is, the housing 22 including the first side wall 22a, the second side wall 22b, the third side wall 22c connecting them, the upper surface portion 22d, and the lower surface portion 22e functions as a heat conduction plate that sandwiches the control substrate 21 and extends to the opposite side of the compressor 31.

[0074] The control board 21 is disposed in a resin case 24. A portion of the resin case 24 is disposed between the control board 21 and the first side wall 22a of the housing 22, and functions as a heat insulating member.

[0075] With this configuration, it is possible to suppress the heat generated by the compressor 31 from being transferred to the control board 21 , and to release the heat of the compressor 31 transferred to the housing 22 toward the side wall of the equipment room 30 .

[0076] Furthermore, if a circuit or coil for converting AC to DC or a switching element for converting DC to AC is mounted on the control substrate 21, the control substrate 21 also tends to heat up. Therefore, the resin case 24 has an opening 24F opened on the side wall of the equipment room 30. Thus, for example, Figure 6As shown by the arrow in , the heat generated by the control substrate 21 can be released toward the side wall of the equipment room 30 .

[0077] <Second Embodiment>

[0078] Next, the second embodiment of the present invention will be described. In the second embodiment, the structure of the substrate unit is different from that of the first embodiment. For other structures, the same structure as that of the first embodiment can be adopted. Therefore, in the second embodiment, the description will be centered on the points that are different from the first embodiment.

[0079] In the first embodiment, the housing 22 functions as a heat conducting plate that sandwiches the control board 21 and extends from the side adjacent to the compressor 31 to the opposite side. However, in another embodiment, the heat conducting plate may not have a box shape.

[0080] In the refrigerator 1 according to the present embodiment, a plurality of metal plates are combined to form a heat conduction plate extending from the side adjacent to the compressor 31 to the opposite side thereof with the control substrate 21 interposed therebetween. The metal plates are supported by the holding member 23 .

[0081] Moreover, similarly to the first embodiment, the control board 21 is disposed in the resin case 24. Thus, the resin case 24 functions as a heat insulating member provided between the control board 21 and the metal plate.

[0082] According to this structure, the heat generated by the compressor 31 can be transferred toward the side wall of the equipment room 30 through the plurality of metal plates while avoiding direct transfer of the heat generated by the compressor 31 to the control board 21. Thus, the heat generated by the compressor 31 can be effectively released toward the side wall.

[0083] <Third Embodiment>

[0084] Next, the third embodiment of the present invention is described. In the third embodiment, the structure of the substrate unit is different from that of the first embodiment and the second embodiment. For other structures, the same structure as that of the first embodiment or the second embodiment can be adopted. Therefore, in the third embodiment, the description will be centered on the points that are different from the first embodiment.

[0085] In the first embodiment, the resin case 24 functions as a heat insulating member disposed between the heat conducting plate (specifically, the first side wall 22a) adjacent to the compressor 31 and the control board 21. However, the heat insulating member is not limited to a box-shaped member such as the resin case 24.

[0086] In the refrigerator 1 involved in this embodiment, a plate-shaped heat insulating member is arranged between the heat conducting plate (specifically, the first side wall 22a) on the side adjacent to the compressor 31 and the control substrate 21. As the material of the plate-shaped heat insulating member, for example, a conventionally known heat insulating material such as a foamed plastic-based heat insulating material formed of a foamed resin material, a fiber-based heat insulating material such as glass wool, etc. can be used. In addition, similar to the resin case 24, the heat insulating member can also be formed of a material such as polypropylene, polyethylene, silicon, etc.

[0087] According to this structure, it is possible to prevent the heat generated by the compressor 31 from being directly transferred to the control board 21. Therefore, in the structure in which the control board 21 is arranged in the equipment room 30, the influence of the heat generated by the compressor 31 on the control board 21 can be reduced.

[0088] (Summarize)

[0089] A refrigerator involved in one aspect of the present invention (e.g., refrigerator 1) includes an insulating box body (e.g., insulating box body 50), an equipment room (e.g., equipment room 30) arranged below the insulating box body, a compressor (e.g., compressor 31) arranged in the equipment room, and a control substrate (e.g., control substrate 21) arranged vertically next to the compressor.

[0090] In the refrigerator (e.g., refrigerator 1) involved in one aspect of the present invention, a heat conduction plate (e.g., housing 22) is arranged between the control substrate (e.g., control substrate 21) and the compressor (e.g., compressor 31), and the heat conduction plate can sandwich the control substrate in the middle and extend to the opposite side of the compressor.

[0091] In the refrigerator (e.g., refrigerator 1) involved in one aspect of the present invention, a heat insulating component (e.g., resin shell 24) may also be arranged between the control substrate (e.g., control substrate 21) and the heat conduction plate (e.g., first side wall 22a of the housing 22) on the side of the control substrate (e.g., control substrate 21) facing the compressor (e.g., compressor 31).

[0092] In the refrigerator (for example, refrigerator 1) according to one aspect of the present invention, the heat insulating member may be a casing (for example, resin casing 24) accommodating the control substrate (for example, control substrate 21).

[0093] In the refrigerator (e.g., refrigerator 1) according to one aspect of the present invention, the housing (e.g., resin housing 24) may have an opening on the side opposite to the side facing the compressor (e.g., compressor 31). For example, the resin housing 24 described in the first embodiment has an opening 24F.

[0094] In a refrigerator (e.g., refrigerator 1) according to one aspect of the present invention, a space (e.g., space 22S) may be provided between the heat conduction plate (e.g., second side wall 22b of chassis 22) and the side wall (e.g., side portion 50b) of the insulating box (e.g., insulating box 50) in the equipment room (e.g., equipment room 30).

[0095] The refrigerator (e.g., refrigerator 1) involved in one aspect of the present invention may also be provided with a retaining component (e.g., retaining component 23) for retaining the heat conduction plate (e.g., housing 22) on the back side of the space (e.g., space 22S) in the equipment room (e.g., equipment room 30).

[0096] The embodiments disclosed herein should be considered to be illustrative rather than restrictive in all aspects. The scope of the present invention is indicated by the description of the claims rather than the above description, and is intended to include all changes within the meaning and scope equivalent to the description of the claims. In addition, structures obtained by combining the structures of the different embodiments described herein are also included in the scope of the present invention.

Claims

1. A refrigerator, characterized in that: have: Insulated box; An equipment room, which is arranged below the heat-insulating box body; A compressor, which is arranged in the equipment room; A housing fixed beside the compressor; as well as The control substrate has a flat surface on which the electronic components are placed. The housing has an opening portion opened on the back side of the equipment room, and has an upper portion, a lower portion, and a side wall, and the upper portion, the lower portion, and the side wall constitute a storage space extending from the opening portion to the front of the equipment room; The control substrate is inserted into the housing space from the opening, and is arranged in the housing such that the mounting surface faces the left-right direction of the equipment room.

2. The refrigerator according to claim 1, characterized in that: A heat conduction plate is arranged on the side wall between the control substrate and the compressor. The control substrate is composed of a heat-insulating component and is held in a housing with an opening on one side; The housing is inserted from the opening of the casing in a state where the one side is located on the side opposite to the side facing the compressor.

3. The refrigerator according to claim 1 or 2, characterized in that: In the equipment room, a space is provided between the side wall and the side wall of the heat-insulating box body; The housing located on the back side of the space has a hole formed therein for passing wiring connected to the control substrate.

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