Display device, electronic device, and method for manufacturing a display device

Abstract

A display device, an electronic device, and a method for manufacturing a display device that do not impair display quality and improve transmittance. The display device includes: a substrate; and a first display area and a second display area disposed on the substrate, each having a plurality of pixels. In the first display area, the substrate has a first transmittance, and in the second display area, the substrate has a second transmittance higher than the first transmittance.

Description

Technical Field

[0001] The present disclosure relates to a display device, an electronic device, and a method for manufacturing a display device. Background Art

[0002] In recent electronic devices such as smartphones, mobile phones, and PCs (Personal Computers), various sensors such as cameras are mounted on the frame (end frame) of the display panel. On the other hand, there is a demand to make the external dimensions of the electronic device as compact as possible without affecting the screen size, and the width of the end frame tends to become narrower. Against this background, the following technology has been proposed: A camera module is disposed directly below the display panel, and the camera module captures subject light passing through the display panel.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: US Patent Publication No. 2018 / 0069060 Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] The display panel requires a sealing material for preventing moisture and the like from the outside from entering. Generally, polyimide is used as the sealing material. Polyimide has excellent heat resistance and can also withstand the heat treatment process when forming the TFT.

[0008] However, since polyimide has a low visible light transmittance, when shooting through the display panel using the camera module as described above, the quality of the photographed image deteriorates.

[0009] Although the development of making polyimide transparent is being promoted, if polyimide is made transparent, the heat resistance generally deteriorates, and the electrical characteristics of the TFT formed on the display panel may deteriorate.

[0010] Therefore, in the present disclosure, there are provided a display device, an electronic device, and a method for manufacturing a display device that can improve the transmittance without impairing the display quality.

[0011] To solve the above technical problem, according to the present disclosure, there is provided a display device including:

[0012] a substrate; and

[0013] a first display area and a second display area, disposed on the substrate and each having a plurality of pixels,

[0014] In the first display area, the substrate has a first transmittance,

[0015] In the second display region, the substrate has a second transmittance that is higher than the first transmittance.

[0016] The second display region may be a region opposite to the sensing device, and the sensing device is disposed on a side of the substrate opposite to the display surface.

[0017] A first film may be provided, and the first film is disposed on a side of the first display region opposite to the display surface and has the first transmittance.

[0018] A second film may be provided, and the second film is disposed on a side of the second display region opposite to the display surface and has the second transmittance.

[0019] The second film may be disposed on a side of at least a part of the second display region opposite to the display surface, and at least a part of the second display region includes a boundary portion between adjacent pixels within the second display region.

[0020] The area of the second film may be 30% or more with respect to the area of the light-emitting region within the second display region.

[0021] The second film may have a function of blocking infrared light.

[0022] The second film may be disposed in an opening portion where a part of the first film is removed.

[0023] The transmittance of the boundary portion between the first film and the second film may be continuously or stepwise different from the first film to the second film.

[0024] The first film may contain polyimide.

[0025] The second film may contain a material having a higher transmittance than the polyimide of the first film.

[0026] The second film may have at least one of a concave portion and a convex portion.

[0027] An optical lens formed using the second film may be provided.

[0028] An anti-reflection structure layer formed using the second film may be provided.

[0029] The first film may be provided in at least a part of the second display region other than the boundary portion between adjacent pixels.

[0030] An opening portion of the first film is provided at the boundary portion between adjacent pixels within the second display region.

[0031] The first transmittance may have a transmittance of 0 to 50% for visible light with a wavelength of 400 nm,

[0032] The second transmittance has a transmittance of 51 to 100% for the visible light.

[0033] According to the present disclosure, there is provided an electronic device including:

[0034] A display device; and

[0035] A sensing device disposed on the side of the display device opposite to the display surface,

[0036] The display device includes:

[0037] A substrate; and

[0038] A first display area and a second display area, disposed on the substrate and each having a plurality of pixels,

[0039] In the first display area, the substrate has a first transmittance,

[0040] In the second display area, the substrate has a second transmittance higher than the first transmittance.

[0041] The sensing device may have an imaging sensor.

[0042] The sensing device may have a biometric information detection sensor.

[0043] It may be that the second display area is provided at a plurality of positions on the display surface,

[0044] A plurality of the sensing devices are correspondingly disposed corresponding to the second display areas at the plurality of positions.

[0045] The second transmittances of at least two of the second display areas among the second display areas at the plurality of positions may be different from each other.

[0046] According to the present disclosure, there is provided a method for manufacturing a display device, including:

[0047] A step of forming a first film with a first transmittance on a first support substrate;

[0048] A step of forming a light-emitting layer on the first film;

[0049] A step of forming a protective film on the light-emitting layer;

[0050] A step of forming a second support substrate on the protective film;

[0051] A step of removing the first support substrate; and

[0052] A process of forming an opening in the first film in cooperation with the arrangement position of the sensing device.

[0053] A second film having a second transmittance higher than the first transmittance can be formed in the opening.

[0054] According to the present disclosure, there is provided a manufacturing method, comprising:

[0055] A process of forming a first film with a first transmittance on a support substrate;

[0056] A process of forming an opening in the first film in cooperation with the arrangement position of the sensing device;

[0057] A process of filling the opening with an insulating member;

[0058] A process of forming a first protective film on the first film;

[0059] A process of forming a light-emitting layer on the first protective film;

[0060] A process of forming a second protective film on the light-emitting layer; and

[0061] A process of removing the insulating member to form the opening in the first film.

[0062] It may further include a process of forming a second film having a transmittance higher than that of the first film in the opening formed by removing the insulating member. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 It is a schematic external view of an electronic device equipped with the display device of the first embodiment.

[0064] Figure 2A It is a schematic cross-sectional view showing a part of the second display area.

[0065] Figure 2B It is a schematic cross-sectional view showing a part of the first display area.

[0066] Figure 2C It is a schematic cross-sectional view of a display device having a first display area and a second display area.

[0067] Figure 2D It is a schematic cross-sectional view of a display device in which a first film and a second film are arranged in the second display area.

[0068] Figure 3A It is a cross-sectional view showing the manufacturing process of the display device of the first embodiment.

[0069] Figure 3B NextFigure 3A Process sectional view.

[0070] Figure 3C Is then Figure 3B Process sectional view.

[0071] Figure 3D Is then Figure 3C Process sectional view.

[0072] Figure 3E Is then Figure 3D Process sectional view.

[0073] Figure 3F Is then Figure 3E Process sectional view.

[0074] Figure 4A Is a diagram showing an example in which the density of a region with low transmittance increases stepwise from the center to the circumferential edge of the transmissive member.

[0075] Figure 4B Is a diagram showing an example in which the transmittance continuously changes from the center to the circumferential edge of the transmissive member.

[0076] Figure 5A Is a sectional view showing the process of forming a lens on the transmissive member.

[0077] Figure 5B Is then Figure 5A Process sectional view.

[0078] Figure 5C Is then Figure 5B Process sectional view.

[0079] Figure 5D Is then Figure 5C Process sectional view.

[0080] Figure 5E Is then Figure 5D Process sectional view.

[0081] Figure 5F Is then Figure 5E Process sectional view.

[0082] Figure 6A Is a diagram schematically illustrating an example of the steps of an imprinting process.

[0083] Figure 6B Is then Figure 6A Process sectional view.

[0084] Figure 7A Is a sectional view showing the manufacturing process of the display device of the second embodiment.

[0085] Figure 7B is the process cross-sectional view following Figure 7A .

[0086] Figure 7C is the process cross-sectional view following Figure 7B .

[0087] Figure 7D is the process cross-sectional view following Figure 7C .

[0088] Figure 7E is the process cross-sectional view following Figure 7D .

[0089] Figure 7F is the process cross-sectional view following Figure 7E .

[0090] Figure 8A is the cross-sectional view showing the manufacturing process of the display device of the third embodiment.

[0091] Figure 8B is the process cross-sectional view following Figure 8A .

[0092] Figure 8C is the process cross-sectional view following Figure 8B .

[0093] Figure 8D is the process cross-sectional view following Figure 8C .

[0094] Figure 8E is the process cross-sectional view following Figure 8D .

[0095] Figure 8F is the process cross-sectional view following Figure 8E .

[0096] Figure 9A is the cross-sectional view showing the manufacturing process of the display device of the fourth embodiment.

[0097] Figure 9B is the process cross-sectional view following Figure 9A .

[0098] Figure 9C is the process cross-sectional view following Figure 9B .

[0099] Figure 9D is the process cross-sectional view following Figure 9C .

[0100] Figure 9E is the process cross-sectional view following Figure 9D .

[0101] Figure 9F is the sectional view of the process that follows Figure 9E

[0102] Figure 9G Figure 9F is the sectional view of the process that follows

[0103] Figure 10A Figure 9B Figure 9C is the sectional view of the process implemented in place of and

[0104] Figure 10B Figure 10A

[0105] is the sectional view of the process that follows Figure 10C Figure 10B

[0106] Figure 11A is the sectional view of the process that follows

[0107] Figure 11B Figure 11A is the sectional view showing the manufacturing process of the display device of the fifth embodiment.

[0108] Figure 11C Figure 11B is the sectional view of the process that follows

[0109] Figure 11D is the sectional view of the process that follows Figure 11C

[0110] Figure 11E is the sectional view of the process that follows Figure 11D

[0111] Figure 11F is the sectional view of the process that follows Figure 11E

[0112] Figure 11G is the sectional view of the process that follows Figure 11F

[0113] Figure 11H is the sectional view of the process that follows Figure 11G

[0114] Figure 11I is the sectional view of the process that follows Figure 11H

[0115] Figure 11J is the sectional view of the process that follows Figure 11I

[0116] Figure 12 is the plan view of the electronic device of the sixth embodiment.

[0117] ​​​​​​​​​​​​​​​Figure 13 This is a cross-sectional view of the imaging section of the camera module mounted on the electronic device of the seventh embodiment.

[0118] Figure 14 This is a plan view when the electronic devices of the first to seventh embodiments are applied to a capsule endoscope.

[0119] Figure 15 This is a rear view when the electronic devices of the first to seventh embodiments are applied to a digital single-lens reflex camera.

[0120] Figure 16A This is a plan view showing an example in which the electronic device 2 of the first to seventh embodiments is applied to an HMD.

[0121] Figure 16B This is a view showing a current HMD.

[0122] Explanation of reference numerals:

[0123] 1 Display device, 1a Display surface, 2 Electronic device, 3 Camera module, 4 Upper electrode, 5 Light-emitting layer, 6 Lower electrode, 7 Base film, 7a Opening, 7b First film, 7c Second film, 10 Resist, 11 Glass substrate, 12 Base film, 13 First protective film, 14 TFT layer, 15 EL layer, 16 Second protective film, 17 Transparent film, 18 Sacrificial layer, 19 Glass substrate, 20 Transmission member, 20a Recess, 21 Master disk, 22 Transparent resin layer, 23 Resist, 24 Lens, 25 Insulating film, 26 Blocking layer, 31 Fingerprint sensor, 31a Inner lens, 32 Adhesive layer or insulating film, 33 Pad portion, 34 Bonding lead, 50 Capsule endoscope, 51 Housing, 52 Camera, 53 Memory, 54 Antenna, 55 Wireless transmitter, 60 Digital single-lens reflex camera, 61 Head-mounted display, 64 Microlens array, 65 Microlens, 66 Light-shielding body. Detailed implementation manners

[0124] Next, embodiments of the display device will be described with reference to the drawings. In the following, the description will be centered on the main components of the display device, but there may be components and functions of the display device 1 that are not shown or described. The following description does not exclude components and functions that are not shown or described.

[0125] (First embodiment)

[0126] Figure 1 This is a schematic external view of the electronic device 2 equipped with the display device 1 of the first embodiment. Figure 1 The electronic device 2 is any electronic device 2 having both a display function and a photographing function, such as a smart phone, a mobile phone, a tablet computer, a PC, etc. Figure 1The electronic device 2 is provided with a camera module (imaging unit) 3 disposed on the side opposite to the display surface 1a of the display device 1. In Figure 1 The position where the camera module 3 is disposed is shown by a dashed line. Thus, Figure 1 In the electronic device 2, a camera module 3 is provided on the back side of the display surface 1a of the display device 1. Therefore, the camera module 3 captures images through the display device 1. In this specification, the side of the display surface 1a of the display device 1 is referred to as the front (positive) surface, and the side on which the camera module 3 is disposed is referred to as the back surface.

[0127] In the present embodiment, the transmittance of a part of the display area that overlaps with the position where the camera module 3 on the back side of the display device 1 is disposed is increased.

[0128] The display device 1 of the present embodiment includes a first display area D1 and a second display area D2 disposed on a substrate. In the first display area D1, the substrate has a first transmittance. In the second display area D2, the substrate has a second transmittance higher than the first transmittance. The second display area D2 may be an area facing a sensing device such as the camera module 3, and the sensing device such as the camera module 3 is disposed on the side of the surface opposite to the display surface on the substrate.

[0129] Figure 2A is a schematic cross-sectional view showing a part of the second display area D2, Figure 2B is a schematic cross-sectional view showing a part of the first display area D1, Figure 2C is a schematic cross-sectional view of the display device 1 having the first display area D1 and the second display area D2. Figure 2A and Figure 2B show an area of three adjacent pixels. Each pixel has an upper electrode 4, a light-emitting layer 5, and a lower electrode 6. Although it actually has a complex layer structure, it is simply shown in Figure 2A and Figure 2B for simplicity. Figure 2A and Figure 2B The upper surface of is the display surface 1a, and the camera module 3 is disposed on the lower surface side.

[0130] As Figure 2B shows, a base film 7 is disposed below the lower electrode 6 in the first display area D1. The base film 7 is formed of an opaque polyimide with a low transmittance. If the transmittance of the base film 7 is low, the light from the display surface 1a side is blocked by the base film 7, and the amount of light incident on the camera module 3 is reduced. Therefore, in the present embodiment, as Figure 2A shows, in the second display area D2, the base film 7 is not disposed below the lower electrode 6. In Figure 2A and Figure 2BIn the following example, the base film 7 is referred to as the first film 7b, and a second film 7c having a transmittance higher than that of the base film 7 (first film 7b) is disposed below the lower electrode 6 in the second display region D2. As Figure 2C shown, the second display region D2 is a region opposite to the camera module 3, and the camera module 3 is disposed on the side of the surface 1b opposite to the display surface 1a of the substrate of the display device 1.

[0131] In Figure 2A an example is shown in which the second film 7c is disposed below the lower electrode 6 throughout the entire region of the second display region D2. However, as Figure 2D shown, the first film 7b may be disposed below the lower electrode 6 in the second display region D2, and an opening 7a may be locally provided in the first film 7b, and the second film 7c may be disposed in the opening 7a. Figure 2D The second film 7c in is disposed on the side of the surface 1b opposite to the display surface 1a in at least a part of the region of the second display region D2 including the boundary portion between adjacent pixels in the second display region D2.

[0132] The opening 7a is provided at least at the boundary portion of the pixels. In order to allow sufficient light to enter the camera module 3, it is preferable that the area of the opening 7a or the second film 7c is 30% or more with respect to the area of the light-emitting region in the second display region D2.

[0133] As described later, the second film 7c may have a function of blocking infrared light. In addition, the transmittance of the boundary portion between the first film 7b and the second film 7c may be continuously or stepwise different from the first film 7b to the second film 7c.

[0134] The first transmittance has a transmittance of 0 to 50% for visible light having a wavelength of 400 nm, for example, and the second transmittance has a transmittance of 51 to 100% for visible light, for example.

[0135] On the other hand, as Figure 2B shown, in the first display region D1, the base film 7 is also disposed at the boundary portion of the pixels, and no opening is provided.

[0136] Thereby, the transmittance on the side of the camera module 3 in the second display region D2 that overlaps with the arrangement position of the camera module 3 can be further improved, and since the amount of light incident on the camera module 3 increases, the image quality of the photographed image can be improved.

[0137] The display device 1 of the present embodiment is characterized in that the transmittance on the side of the camera module 3 in the second display area D2 is further improved. Hereinafter, the configuration and manufacturing process of the display device 1 of the present embodiment will be described. The display device 1 of the present embodiment can be applied to a display device 1 including an organic EL element that emits light by itself, and can also be applied to a liquid crystal display device 1.

[0138] Since a normal camera module 3 mainly captures visible light, a component with a low transmittance of visible light is mostly referred to as opaque. However, when the camera module 3 disposed on the back side of the display device 1 captures infrared light, for example, a component with a low transmittance of infrared light becomes opaque.

[0139] Therefore, the criteria for transparent or opaque and the transmittance value are determined in consideration of the wavelength of light for which the camera module 3 disposed on the back side of the display device 1 has detection sensitivity. Hereinafter, on the premise that the camera module 3 for detecting or capturing visible light is disposed on the back side of the display device 1, a component with a high visible light transmittance is referred to as transparent, and a component with a low visible light transmittance is referred to as opaque.

[0140] Figures 3A - 3F It is a cross-sectional view showing the manufacturing process of the display device 1 of the first embodiment. Figures 3A - 3F It shows a cross-sectional structure of a part of the second display area D2 in FIG. 2. In Figure 3A ~ Figure 3F the layer configuration related to the characteristic part of the display device 1 of the present embodiment is shown, and there may be layers not shown in the actual display device 1. For example, most of the recent display devices 1 adopt a touch panel method, and a touch sensor layer is provided in the layer configuration of the display device 1, but it is Figures 3A - 3F omitted in Figures 3A - 3F In addition, the light-emitting layer 5 that causes the organic EL element to emit light is shown as the EL layer 15, but actually the light-emitting layer 5 may be composed of multiple layers. In addition, the multiple TFTs that control the light emission of the organic EL element are shown as the TFT layer 14, but actually the TFT layer 14 may be composed of multiple layers.

[0141] First, as Figure 3AAs shown, a base film 12, a first protective film 13, a TFT layer 14, an EL layer 15, a second protective film 16, and a transparent film 17 are sequentially formed on a glass substrate 11. The base film 12 functions as a sealing material and is usually formed of an opaque polyimide with excellent heat resistance. The first protective film 13 is formed of an insulating film with high transmittance such as SiN or SiO2. The TFT layer 14 is formed by injecting impurity ions into a drain region, a source region, etc. and causing them to thermally diffuse. The EL layer 15 is actually composed of multiple layers such as an electron injection layer, an electron input layer, a light-emitting layer 5, a hole transport layer, a charge generation layer, and an electron input layer. The second protective film 16 is formed of an insulating film with high transmittance such as SiN or SiO2. Figure 3A The process is the same as that of a normal organic EL display device 1.

[0142] Figure 3A The opaque layer among the layers shown is the base film 12, and the other layers (except for the sacrificial layer) are formed of materials with a transmittance higher than that of the base film 12.

[0143] Next, as Figure 3B shown, a glass substrate 19 is formed on the transparent film 17 via a sacrificial layer 18. The purpose of providing the sacrificial layer 18 is to absorb laser light and facilitate the peeling of the glass substrate 19 by laser lift-off in a subsequent process.

[0144] Next, as Figure 3C shown, the glass substrate 11 on the base film 12 is removed to expose the base film 12. The removal of the glass substrate 11 can be performed by BGR or CMP (Chemical Mechanical Polishing), or the glass substrate 11 can be peeled off by laser lift-off.

[0145] Next, as Figure 3D shown, the substrate is turned upside down, and a resist 10 is coated on the exposed base film 12, and the resist 10 is patterned by photolithography. More specifically, an opening 12a is provided in the resist 10 in accordance with the position overlapping with the arrangement position of the camera module 3. And, using the resist 10 as a mask, a part of the base film 12 located in the opening 12a of the resist 10 is etched.

[0146] Next, as Figure 3E shown, the resist 10 is peeled off to expose the base film 12. A part of the base film 12 (the region overlapping with the arrangement position of the camera module 3) is cut away by the above etching to form an opening 12a. A transmissive member 20 is formed in the opening 12a. The transmissive member 20 can be, for example, a transparent polyimide. In addition, the transmissive member 20 corresponds to the second film 7c in FIG. 2, and the base film 12 corresponds to the first film 7b.

[0147] As described above, compared with existing opaque polyimides, transparent polyimides generally have poor heat resistance. However, in the present embodiment, the transparent polyimide is formed only restrictively in the portion overlapping with the camera module 3. Since the base film 12 itself has heat resistance, high heat can be applied to perform the diffusion process, and thus the electrical characteristics of the TFTs formed in the TFT layer 14 will not deteriorate.

[0148] After Figure 3E the process of Figure 3F as shown, the glass substrate 19 is peeled off by laser lift-off. The laser irradiated onto the glass substrate 19 is absorbed by the sacrificial layer 18, and the glass substrate 19 formed on the sacrificial layer 18 can be easily peeled off. Thereby, the display device 1 in the shape of a flexible substrate with excellent flexibility is obtained. The display device 1 can also be used in a curved shape, so its utilization value is increased.

[0149] After Figure 3F the process of

[0150] the camera module 3 can be mounted in a manner facing the transmissive member 20 formed in a part of the base film 12. In addition, as will be described later, various sensor modules other than the camera module 3 can be mounted on the back side of the display device 1 in the present embodiment. For example, various biometric information detection sensors such as a fingerprint sensor can be arranged opposite to the transmissive member 20 of the base film 12. Hereinafter, any type of sensing structural member including the camera module 3 is collectively referred to as a sensing device. Figures 3A - 3F In the display device 1 manufactured through the manufacturing process of

[0151] the transmissivity (second transmissivity) on the sensing device side of the transmissive member 20 formed in a part of the base film 12 is higher than the transmissivity (first transmissivity) on the sensing device side of the base film 12. The transmissive member 20 formed in a part of the base film 12 can be formed at the boundary portion of the pixels of the display device 1. In this specification, the display area not facing the sensing device is referred to as the first display area D1, and the display area facing the sensing device is referred to as the second display area D2. The transmissivity on the side opposite to the display surface 1a within the first display area D1 is the first transmissivity, and the transmissivity on the side opposite to the display surface 1a (sensing device side) within the second display area D2 is the second transmissivity which is higher than the first transmissivity.

[0152] When the transmittance difference between the base film 12 and the transmissive member 20 is large, it is possible to visually confirm the boundary between the base film 12 and the transmissive member 20 through the display surface 1a. Therefore, as Figure 4A or shown in FIG. 4B, the transmittance of the boundary portion between the base film 12 and the transmissive member 20 can be continuously or stepwise different from the base film 12 to the transmissive member 20. In Figure 4A and Figure 4B , the portions with low transmittance are represented by black. Figure 4A Shows an example where the density of the region with low transmittance gradually increases from the center to the circumferential edge of the transmissive member 20. Figure 4B Shows an example where the transmittance continuously changes from the center to the circumferential edge of the transmissive member 20.

[0153] It is possible to form a lens for the camera module 3, for example, on the transmissive member 20 manufactured through the process of Figures 3A - 3E . Figures 5A - 5F Is a cross-sectional view of the process of forming a lens on the transmissive member 20. Figure 5A Shows the same cross-sectional structure as Figure 3E . Next, as Figure 5B shown, a part of the transmissive member 20 formed on a part of the base film 12 is removed to form a recess 20a. The recess 20a can be formed, for example, by etching or imprinting. Figure 6A and Figure 6B Are diagrams schematically illustrating an example of the steps of the imprinting process. First, as Figure 6A shown, the stamper 21 is pressed on the surface of the transmissive member 20 and heated or irradiated with light to transfer the outer shape of the stamper 21 to the transmissive member 20. Then, the stamper 21 is demolded, and heat treatment, light irradiation, etc. are performed. Thus, the surface shape of the transmissive member 20 can be made into a shape corresponding to the outer shape of the lens.

[0154] Thus, by performing the imprinting process, at least one of a recess and a protrusion can be formed on the surface of the transmissive member 20.

[0155] If the process of Figure 5B ends, then as Figure 5C shown, a transparent resin layer 22 is formed on the base film 12 including the inside of the recess 20a through the same process as the manufacturing process of the on-chip lens of the CMOS image sensor.

[0156] Next, as Figure 5D shown, a resist 23 is coated on the transparent resin layer 22 and patterned, and only the resist 23 is retained directly above the transmissive member 20. Next, as Figure 5EAs shown, using the resist 23 as a mask, the transparent resin layer 22 is partially removed by etching, and then the resist 23 is removed. Thus, a lens 24 is formed from the transparent resin layer 22 in a part of the transmissive member 20. This lens 24 is, for example, a convex lens. By matching the outer shape of the lens 24, the surface processing of the transmissive member 20 in Figure 5B and the patterning of the resist 23 in Figure 5D are performed, and a lens having a desired outer shape can be formed.

[0157] Next, as shown in Figure 5F , similar to Figure 3F , for example, the glass substrate 19 is peeled off by laser lift-off, and thus the display device 1 with a lens in the shape of a flexible substrate is obtained. This lens is used to converge light onto a sensing device such as the camera module 3.

[0158] In Figures 5A - 5F , an example of forming a convex lens by processing the surface of the transmissive member 20 is described. However, for example, by using an imprint process, the transmissive member 20 can also be processed into various shapes. For example, the transmissive member 20 can also be processed to form a moth-eye structure layer having fine irregularities. Since the moth-eye structure layer has a function of suppressing reflection, for example, by disposing the moth-eye structure layer between the light-emitting layer 5 and the lens of the camera module 3, the amount of light incident on the lens can be increased, and the quality of the captured image can be improved.

[0159] Thus, in the first embodiment, an opening 12a is provided in a part of the base film 12 formed of opaque polyimide in a manner that matches the arrangement position of a sensing device such as the camera module 3, and the transmissive member 20 is formed in the opening 12a. Therefore, sufficient light can be guided to the sensing device through the transmissive member 20, and the detection sensitivity of the sensing device can be improved.

[0160] (Second Embodiment)

[0161] In the first embodiment, the transmissive member 20 is formed in the opening 12a formed in a part of the base film 12, but the opening 12a may be maintained. Even when the opening 12a is maintained, that is, when the transmissive member 20 is not disposed inside the opening 12a, the transmittance of the sensing device side of the opening 12a is higher than the transmittance of the sensing device side of the base film 12. Therefore, by disposing the sensing device opposite to the opening 12a, the amount of light incident on the sensing device can be increased.

[0162] Figures 7A - 7F is a cross-sectional view showing the manufacturing process of the display device 1 according to the second embodiment. Figures 7A - 7D Same as Figures 3A - 3D . In Figure 3EIn [description], an opening 12a is formed in the exposed base film 12 in a manner that matches the arrangement position of the sensing device, and a transmissive member 20 is formed in the opening 12a. However, in Figure 7E In [description], the state where the opening 12a is formed is maintained, and the transmissive member 20 is not formed in the opening 12a. Then, as Figure 7F shown, the glass substrate 19 is peeled off by laser lift-off, thereby obtaining the display device 1 having a flexible substrate shape and excellent flexibility.

[0163] In Figure 7F After the process of [description], a sensing device such as a camera module 3 can be arranged in a manner opposite to the opening 12a formed in a part of the base film 12. In order to protect the base film 12, the surface of the base film 12 can be covered with a transmissive protective film while maintaining the opening 12a. In this case, the opening 12a becomes a void portion sealed by the base film 12 and the protective film, maintaining high transmissivity.

[0164] Thus, in the second embodiment, the opening 12a is formed in a part of the base film 12 in a manner that matches the arrangement position of the sensing device, so that sufficient light can enter the sensing device through the opening 12a. Since the process of forming other components in the opening 12a can be omitted, the manufacturing process can be simplified compared with the first embodiment.

[0165] (Third Embodiment)

[0166] In the third embodiment, the base film 12 made of polyimide is removed after the heating process in manufacturing the display device 1.

[0167] The reason for using an opaque polyimide as the base film 12 of the display device 1 is its excellent heat resistance. In the display device 1, it is necessary to form a TFT layer 14 using polysilicon or the like. However, in the formation of the TFT layer 14, the diffusion treatment of impurity ions is indispensable. Heat treatment is performed in the diffusion treatment. Therefore, for example, when a transparent polyimide is used as the base film 12, since too high heat cannot be applied, the electrical characteristics of the TFT may deteriorate.

[0168] Therefore, in this embodiment, before the heating process of the display device 1 ends, a base film 12 made of an opaque polyimide is formed in advance, and if the heating process ends, the base film 12 is peeled off.

[0169] Figures 8A - 8F is a cross-sectional view showing the manufacturing process of the display device 1 of the third embodiment. Figures 8A - 8C Same as Figures 3A - 3C As Figure 8DAs shown, at the stage of removing (peeling off) the glass substrate 11 to expose the base film 12, the formation of the TFT layer 14 and the EL layer 15 has been completed, and there is no subsequent process of applying high heat. Therefore, as Figure 8E shown, the base film 12 is removed by etching or the like. At this time, a protective film made of SiN or the like is used as an etching stopper layer. Next, as Figure 8F shown, the glass substrate 19 is peeled off by laser lift-off.

[0170] In the case where the protective function and the sealing function of the display device 1 become insufficient due to the removal of the base film 12, a transparent resin layer 22 or the like can be disposed on the protective film.

[0171] Thus, in the third embodiment, before the heating process in manufacturing the display device 1 is completed, the base film 12 made of opaque polyimide is formed in advance, and if the heating process is completed, the base film 12 is removed. Thereby, the transmittance of the entire second display region D2 can be increased, and sufficient light can be incident on the sensing device.

[0172] (Fourth Embodiment)

[0173] The order of the process of forming the opening 12a in a part of the base film 12 in the fourth embodiment is different from that of the first to third embodiments.

[0174] Figures 9A - 9G is a cross-sectional view showing the manufacturing process of the display device 1 according to the fourth embodiment. First, as Figure 9A shown, a base film 12 made of opaque polyimide is formed on the glass substrate 11, and an opening 12a is formed in the base film 12 in accordance with the arrangement position of the sensing device. Here, for example, a resist is applied on the base film 12 and patterned, and the opening 12a is formed by etching.

[0175] Next, as Figure 9B shown, the upper surface of the base film 12 is covered with a highly transmissive insulating film 25 such as SiO2 or SiN including the inside of the opening 12a. Next, as Figure 9C shown, for example, the insulating film 25 formed on the upper surface of the base film 12 is removed by CMP to expose the base film 12 and the insulating film 25 in the opening 12a.

[0176] Next, as Figure 9D shown, a first protective film 13, a TFT layer 14, an EL layer 15, a second protective film 16, and a transparent film 17 are sequentially formed on the base film 12.

[0177] Next, as Figure 9E shown, the glass substrate 11 is removed (peeled off) by etching or laser lift-off to expose the base film 12.

[0178] Next, as Figure 9F shown, for example, the insulating film 25 formed inside the opening 12a of the base film 12 is removed by etching. At this time, the second protective film 16 below the base film 12 functions as an etching stopper layer.

[0179] Next, as Figure 9G shown, the entire upper surface of the base film 12 is covered with the transmissive member 20 including the inside of the opening 12a. Thus, the display device 1 in the shape of a flexible substrate is obtained.

[0180] In Figures 9A - 9G , in the initial stage of the manufacturing process of the display device 1, an opening 12a is formed in the base film 12, and in a state where the insulating film 25 with high heat resistance is formed in the opening 12a, each layer of the display device 1 is sequentially formed. Finally, the insulating film 25 in the opening 12a is replaced with the original transmissive member 20.

[0181] In the above Figure 9C process, the insulating film 25 is removed by CMP or the like to expose the base film 12 and the insulating film 25 in the opening 12a, but a stopper layer may be provided on the upper surface of the base film 12 in advance.

[0182] Figures 10A - 10C is a cross-sectional view of a process implemented instead of Figure 9B and Figure 9C . First, as Figure 9A shown, after an opening 12a is formed in a part of the base film 12, as Figure 10A shown, the upper surface of the base film 12 is covered with the stopper layer 26 including the inner wall portion of the opening 12a. The stopper layer 26 is formed, for example, by ALD (Atomic Layer Deposition) or CVD (Chemical Vapor Deposition).

[0183] Next, as Figure 10B shown, the insulating film 25 is formed on the stopper layer 26. Next, the insulating film 25 on the stopper layer 26 is removed by etching to expose the stopper layer 26 and the insulating layer 25 in the opening 12a.

[0184] Accordingly, in the fourth embodiment, the opening 12a is formed in the base film 12 at an initial stage of the manufacturing process of the display device 1. Therefore, it is not necessary to dispose an etching stopper layer 26 or the like under the base film 12, and the opening 12a can be simply formed. Further, a temporary insulating film 25 having high heat resistance is formed in the opening 12a, and the insulating film 25 is replaced with the transmissive member 20 at the final stage. Therefore, high heat can be applied during the manufacture of the display device 1, and the display device 1 having excellent electrical characteristics can be manufactured.

[0185] (Fifth Embodiment)

[0186] In the display device 1 of the first to fourth embodiments described above, various sensing devices can be arranged so as to face the opening 12a formed in a part of the base film 12. Hereinafter, as an example of the sensing device for detecting biological information, an example of arranging a fingerprint sensor that does not require a lens will be described.

[0187] Figures 11A - 11J FIG. is a cross-sectional view showing a manufacturing process of the display device 1 of the fifth embodiment. Figures 11A - 11E Same as Figures 7A - 7E However, in the present embodiment, since it is assumed that the fingerprint sensor 31 is arranged, the opening size of the opening 12a formed in a part of the base film 12 is a size that is the same as the outer shape of the fingerprint sensor 31. More specifically, the opening size of the opening 12a needs to be larger than the outer dimension of the fingerprint sensor 31.

[0188] Next, as Figure 11F shown, the fingerprint sensor 31 is formed in the opening 12a formed in a part of the base film 12. The fingerprint sensor 31 does not require a lens on the outside, but an internal lens 31a is provided inside the fingerprint sensor 31.

[0189] As described above, since the opening size of the opening 12a formed in a part of the base film 12 is larger than the outer dimension of the fingerprint sensor 31, if the fingerprint sensor 31 is arranged inside the opening 12a, a gap is formed between the inner wall surface of the opening 12a and the outer wall surface of the fingerprint sensor 31. Therefore, as Figure 11G shown, an adhesive layer or an insulating film 32 is formed over the entire upper surface of the base film 12 including this gap. The insulating film 32 in this case is, for example, SiO2 or SiN.

[0190] Next, as Figure 11H shown, the adhesive layer or the insulating film 32 is removed by CMP or etching or the like to expose the base film 12. As a result, the adhesive layer or the insulating film 32 is filled between the inner wall surface of the opening 12a and the outer wall surface of the fingerprint sensor 31.

[0191] Next, asFigure 11I As shown, the adhesive layer or insulating film 32 formed on the pad portion 33 of the fingerprint sensor 31 is removed by photolithography and etching to expose the pad portion 33. Next, as Figure 11J shown, the bonding lead 34 is connected to the pad portion 33 of the fingerprint sensor 31 for wiring connection.

[0192] Thus, in the fifth embodiment, the sensing device can be directly disposed in the opening 12a formed in a part of the base film 12.

[0193] (Sixth Embodiment)

[0194] In the sixth embodiment, a plurality of sensing devices are disposed on the side of the display device 1 opposite to the display surface 1a.

[0195] Figure 12 is a plan view of the electronic device 2 of the sixth embodiment. Figure 12 The electronic device 2 has three sensing devices 30 disposed on the side of the display device 1 opposite to the display surface 1a. In addition, the number of the sensing devices 30 is not limited to three. Further, the object detected by the sensing devices 30 is arbitrary. For example, the three sensing devices 30 may all be camera modules with different focal lengths. Alternatively, a camera module and two biometric detection sensing devices may be combined and disposed.

[0196] Openings 12a are formed in the base film 12 of the display device 1 corresponding to the respective sensing devices 30. A transmissive member 20 may be disposed in the openings 12a, or the openings may be kept open. Since the optimal amount of incident light may vary depending on the type of the sensing device 30, when the transmissive member 20 is disposed in the openings 12a, it is preferable to set the transmittance of the transmissive member 20 to a value corresponding to each sensing device 30.

[0197] Thus, in the sixth embodiment, a variety of sensing devices 30 are disposed on the back side of the display device 1, and since the transmittance of the transmissive member 20 disposed at a position overlapping with each sensing device 30 is individually optimized, the detection sensitivity of all the sensing devices 30 can be improved.

[0198] (Seventh Embodiment)

[0199] The optical system of the camera module 3 of the electronic device 2 in the seventh embodiment is different from those of the first to sixth embodiments.

[0200] Figure 13 is a diagram showing a cross-sectional structure of an imaging unit of the camera module 3 mounted on the electronic device 2 of the seventh embodiment. Figure 13 The imaging unit does not have a single lens or a lens group in which a single lens is arranged in the optical axis direction, but has a microlens array 64.

[0201] More specifically, Figure 13 the imaging unit of Figure 13 has: a photoelectric conversion unit 8a disposed along the bottom surface of the housing 63; a microlens array 64 disposed above the photoelectric conversion unit 4a; a plurality of light-shielding bodies 66 disposed between adjacent microlenses 65; and a light guide plate 67 disposed above the microlens array 64. Figure 13 the imaging unit of Figure 13 can be applied to any one of the above first to eighth embodiments.

[0202] (Eighth Embodiment)

[0203] As specific alternatives to the electronic device 2 having the configurations described in the above first to seventh embodiments, various electronic devices can be considered. For example, Figure 14 is a plan view when the electronic device 2 of the first to seventh embodiments is applied to the capsule endoscope 50. Figure 14 The capsule endoscope 50 of Figure 14 includes, for example, in a housing 51 having hemispherical end faces and a cylindrical central portion: a camera (ultra-small camera) 52 for photographing an image inside the body cavity; a memory 53 for recording image data photographed by the camera 52; and a wireless transmitter 55 for transmitting the recorded image data to the outside via an antenna 54 after the capsule endoscope 50 is discharged from the subject's body.

[0204] In addition, a CPU (Central Processing Unit) 56 and a coil (magnetic / electric current conversion coil) 57 are provided in the housing 51. The CPU 56 controls the photographing performed by the camera 52 and the data storage operation to the memory 53, and controls the data transmission from the memory 53 to a data receiving device (not shown) outside the housing 51 by the wireless transmitter 55. The coil 57 supplies power to the camera 52, the memory 53, the wireless transmitter 55, the antenna 54, and a light source 52b described later.

[0205] In addition, a magnetic (reed) switch 58 for detecting the capsule endoscope 50 when it is set to the data receiving device is provided in the housing 51. The CPU 56 detects the setting of the reed switch 58 to the data receiving device, and supplies power from the coil 57 to the wireless transmitter 55 at the point in time when data transmission can be performed.

[0206] The camera 52 includes: an imaging element 52a, including an objective optical system for photographing an image inside a body cavity, for example; and a plurality of light sources 52b for illuminating the inside of the body cavity. Specifically, the camera 52 is composed of a CMOS (Complementary Metal Oxide Semiconductor) sensor, a CCD (Charge Coupled Device), etc. that include, for example, an LED (Light Emitting Diode) as the light source 52b.

[0207] The display device 1 in the electronic device 2 according to the first to seventh embodiments includes Figure 14 a concept of a light-emitting body such as the light source 52b. In Figure 14 the capsule endoscope 50, for example, has two light sources 52b, but these light sources 52b can be composed of a display panel having a plurality of light source units or an LED module having a plurality of LEDs. In this case, by disposing the imaging unit of the camera 52 below the display panel or the LED module, restrictions related to the layout configuration of the camera 52 can be reduced, and a smaller capsule endoscope 50 can be realized.

[0208] In addition, Figure 15 is a rear view when the electronic device 2 according to the first to seventh embodiments is applied to a digital single-lens reflex camera 60. The digital single-lens reflex camera 60 and the compact camera have a display device 1 for displaying a preview screen on the back opposite to the lens. The camera module 3 can also be disposed on the side opposite to the display surface of the display device 1, and the face image of the photographer can be displayed on the display surface 1a of the display device 1. In the electronic device 2 according to the first to seventh embodiments, since the camera module 3 can be disposed in an area overlapping with the display device 1, it is not necessary to provide the camera module 3 in the frame portion of the display device 1, and the size of the display device 1 can be made as large as possible.

[0209] Figure 16A is a plan view showing an example in which the electronic device 2 according to the first to seventh embodiments is applied to a head-mounted display (hereinafter referred to as HMD) 61. Figure 16A The HMD 61 is applied to VR (Virtual Reality), AR (Augmented Reality), MR (Mixed Reality), or SR (Substituional Reality), etc. As Figure 16B shown, in the current HMD, a camera 62 is mounted on the outer surface, and the wearer of the HMD can visually confirm the surrounding images. On the other hand, there is a problem that people around do not know the glasses and facial expressions of the wearer of the HMD.

[0210] Therefore, in Figure 16A Figure 16A , a display surface of the display device 1 is provided on an outer surface of the HMD 61, and a camera module 3 is provided on a side opposite to the display surface of the display device 1. Thus, it is possible to cause the display surface of the display device 1 to display an expression of the face of the wearer photographed by the camera module 3, and people around the wearer can grasp the expression of the face of the wearer and the movement of the glasses in real time.

[0211] In Figure 16A Figure 16A , since the camera module 3 is provided on the back side of the display device 1, there is no restriction on the installation position of the camera module 3, and the design freedom of the HMD 61 can be improved. In addition, since the camera can be arranged at the optimal position, it is possible to prevent problems such as a mismatch between the line of sight of the wearer displayed on the display surface.

[0212] Thus, in the eighth embodiment, the electronic device 2 of the first to seventh embodiments can be used for various purposes, and the utilization value can be improved.

[0213] In addition, the present technology can adopt the following configuration.

[0214] (1) A display device, comprising:

[0215] a substrate; and

[0216] a first display area and a second display area, which are arranged on the substrate and each have a plurality of pixels,

[0217] in the first display area, the substrate has a first transmittance,

[0218] in the second display area, the substrate has a second transmittance higher than the first transmittance.

[0219] (2) The display device according to (1), wherein the second display area is an area opposite to the sensing device, and the sensing device is arranged on a side of a surface opposite to the display surface on the substrate.

[0220] (3) The display device according to (2), further comprising a first film, which is arranged on a side of the first display area opposite to the display surface and has the first transmittance.

[0221] (4) The display device according to (3), further comprising a second film, which is arranged on a side of the second display area opposite to the display surface and has the second transmittance.

[0222] (5) The display device according to (4), wherein the second film is disposed on the side of the surface opposite to the display surface in at least a part of the second display region, and at least a part of the second display region includes a boundary portion of adjacent pixels within the second display region.

[0223] (6) The display device according to (4) or (5), wherein the area of the second film is 30% or more with respect to the area of the light-emitting region within the second display region.

[0224] (7) The display device according to any one of (4) to 6, wherein the second film has a function of blocking infrared light.

[0225] (8) The display device according to any one of (4) to (7), wherein the second film is disposed in an opening portion where a part of the first film is removed,

[0226] The transmittance of the boundary portion between the first film and the second film is continuously or stepwise different from the first film to the second film.

[0227] (9) The display device according to any one of (4) to (8), wherein the first film contains polyimide,

[0228] The second film contains a material having a transmittance higher than that of the polyimide of the first film.

[0229] (10) The display device according to any one of (4) to (9), wherein the second film has at least one of a concave portion and a convex portion.

[0230] (11) The display device according to (10), wherein an optical lens is formed using the second film.

[0231] (12) The display device according to (10), wherein an anti-reflection structure layer is formed using the second film.

[0232] (13) The display device according to any one of (3) to (12), wherein the first film is provided in at least a part of the second display region other than the boundary portion of adjacent pixels,

[0233] An opening portion of the first film is provided at the boundary portion of adjacent pixels within the second display region.

[0234] (14) The display device according to any one of (1) to (13), wherein the first transmittance has a transmittance of 0 to 50% for visible light with a wavelength of 400 nm,

[0235] The second transmittance has a transmittance of 51 to 100% with respect to the visible light.

[0236] (15) An electronic device includes:

[0237] A display device; and

[0238] A sensing device disposed on a side opposite to a display surface of the display device,

[0239] The display device includes:

[0240] A substrate; and

[0241] A first display area and a second display area disposed on the substrate and each having a plurality of pixels,

[0242] In the first display area, the substrate has a first transmittance,

[0243] In the second display area, the substrate has a second transmittance higher than the first transmittance.

[0244] (16) The electronic device according to (15), wherein the sensing device has an image sensor.

[0245] (17) The electronic device according to (15), wherein the sensing device has a biosensor.

[0246] (18) The electronic device according to any one of (15) to (17), wherein the second display area is provided at a plurality of portions of the display surface,

[0247] A plurality of the sensing devices are correspondingly arranged corresponding to the second display areas at the plurality of portions.

[0248] (19) The electronic device according to (18), wherein the second transmittances of at least two of the second display areas among the second display areas at the plurality of portions are different from each other.

[0249] (20) A method for manufacturing a display device includes:

[0250] A step of forming a first film having a first transmittance on a first support substrate;

[0251] A step of forming a light-emitting layer on the first film;

[0252] A step of forming a protective film on the light-emitting layer;

[0253] A step of forming a second support substrate on the protective film;

[0254] A step of removing the first support substrate; and

[0255] A process of forming an opening in the first film in cooperation with the arrangement position of the sensing device.

[0256] (21) The method of manufacturing a display device according to (20), wherein a second film having a second transmittance higher than the first transmittance is formed in the opening.

[0257] (22) A manufacturing method comprising:

[0258] A process of forming a first film with a first transmittance on a support substrate;

[0259] A process of forming an opening in the first film in cooperation with the arrangement position of the sensing device;

[0260] A process of filling the opening with an insulating member;

[0261] A process of forming a first protective film on the first film;

[0262] A process of forming a light-emitting layer on the first protective film;

[0263] A process of forming a second protective film on the light-emitting layer; and

[0264] A process of removing the insulating member to form the opening in the first film.

[0265] (23) The method of manufacturing a display device according to (22), further comprising a process of forming a second film having a transmittance higher than that of the first film in the opening formed by removing the insulating member.

[0266] The embodiments of the present disclosure are not limited to the above-described embodiments, and also include various modifications that can be conceived by those skilled in the art. The effects of the present disclosure are not limited to the above content. That is, various additions, changes, and partial deletions can be made without departing from the concept, idea, and purpose of the present disclosure derived from the content defined in the claims and their equivalents.

Claims

1. A display device, characterized in that, Comprising: a substrate; and a first display region and a second display region, disposed on the substrate and each having a plurality of pixels, in the first display region, the substrate has a first transmittance, in the second display region, the substrate has a second transmittance higher than the first transmittance, the second display region is a region opposite to the sensing device, and the sensing device is disposed on the side opposite to the display surface of the substrate, the second display region is provided at a plurality of portions of the display surface, a plurality of the sensing devices are correspondingly disposed corresponding to the second display regions at the plurality of portions, the display device includes a first film, the first film is disposed on the side opposite to the display surface within the first display region and has the first transmittance, the display device includes a second film, the second film is disposed on the side opposite to the display surface within the second display region and has the second transmittance, the first film is provided at at least a part of the second display region other than the boundary portions of adjacent pixels, an opening of the first film is provided at the boundary portions of adjacent pixels within the second display region, the second film is disposed within the opening.

2. The display device according to claim 1, wherein the second film is disposed on the side opposite to the display surface in at least a part of the second display region, and at least a part of the second display region includes the boundary portions of adjacent pixels within the second display region.

3. The display device according to claim 1, wherein the area of the second film is 30% or more with respect to the area of the light-emitting region within the second display region.

4. The display device according to claim 1, wherein the second film has a function of blocking infrared light.

5. The display device according to claim 1, wherein the second film is disposed in an opening formed by removing a part of the first film, the transmittance of the boundary portion between the first film and the second film is continuously or stepwise different from the first film to the second film.

6. The display device according to claim 1, wherein the first film contains polyimide, the second film contains a material having a higher transmittance than the polyimide of the first film.

7. The display device according to claim 1, wherein the second film has at least one of a concave portion and a convex portion.

8. The display device according to claim 7, wherein the display device has an optical lens formed using the second film.

9. The display device according to claim 7, wherein the display device has a moth-eye structure layer formed using the second film.

10. The display device according to claim 1, wherein the first transmittance has a transmittance of 0 to 50% for visible light with a wavelength of 400 nm, the second transmittance has a transmittance of 51 to 100% for the visible light.

11. An electronic device, characterized in that, Comprising: a display device; and a sensing device, disposed on the side opposite to the display surface of the display device, the display device includes: a substrate; and A first display area and a second display area, which are disposed on the substrate and each have a plurality of pixels. In the first display area, the substrate has a first transmittance. In the second display area, the substrate has a second transmittance higher than the first transmittance, and the second display area is provided at a plurality of positions on the display surface. A plurality of the sensing devices are correspondingly disposed corresponding to the second display areas at the plurality of positions. The display device includes a first film, which is disposed on a side of the first display area opposite to the display surface and has the first transmittance. The display device includes a second film, which is disposed on a side of the second display area opposite to the display surface and has the second transmittance. The first film is provided at least in a part of the second display area other than a boundary portion between adjacent pixels. An opening of the first film is provided at a boundary portion between adjacent pixels in the second display area. The second film is disposed in the opening.

12. The electronic device according to claim 11, wherein the sensing device has an imaging sensor.

13. The electronic device according to claim 11, wherein the sensing device has a biometric information detection sensor.

14. The electronic device according to claim 11, wherein the second transmittances of at least two of the second display areas among the second display areas at the plurality of positions are different from each other.

15. A manufacturing method of a display device, characterized in that, Comprising: a step of forming a first film having a first transmittance on a first support substrate; a step of forming a light-emitting layer on the first film; a step of forming a protective film on the light-emitting layer; a step of forming a second support substrate on the protective film; a step of removing the first support substrate; and a step of forming an opening in the first film in accordance with the arrangement position of the sensing device, The display device includes a first film, which is disposed on a side of the first display area opposite to the display surface and has the first transmittance. The display device includes a second film, which is disposed on a side of the second display area opposite to the display surface and has the second transmittance. The first film is provided at least in a part of the second display area other than a boundary portion between adjacent pixels. An opening of the first film is provided at a boundary portion between adjacent pixels in the second display area. The second film is disposed in the opening.

16. The manufacturing method of the display device according to claim 15, wherein a second film having a second transmittance higher than the first transmittance is formed in the opening.

17. A manufacturing method of a display device, characterized in that, Comprising: a step of forming a first film having a first transmittance on a support substrate; a step of forming an opening in the first film in accordance with the arrangement position of the sensing device; a step of filling an insulating member into the opening; a step of forming a first protective film on the first film; a step of forming a light-emitting layer on the first protective film; a step of forming a second protective film on the light-emitting layer; and a step of removing the insulating member to form the opening in the first film. The display device includes a first film, which is disposed on the side opposite to the display surface within the first display area and has a first transmittance. The display device includes a second film, which is disposed on the side opposite to the display surface within the second display area and has a second transmittance. The first film is provided at least in a part of the second display area other than the boundary portions of adjacent pixels. An opening of the first film is provided at the boundary portion of adjacent pixels within the second display area. The second film is disposed within the opening.

18. The method of manufacturing a display device according to claim 17, wherein it further includes a step of forming a second film having a transmittance higher than that of the first film in the opening formed by removing the insulating member.

Images