A thermosensitive conductive composite material and its preparation method and use

Abstract

The present invention provides a thermosensitive conductive composite material and a preparation method and use thereof. The thermosensitive conductive composite material of the present invention comprises a hot melt adhesive film, a hot melt aluminum foil Mylar and a discontinuous aluminum foil Mylar; the discontinuous aluminum foil Mylar comprises an Al layer and a PET film layer, the Al layer comprises a plurality of discontinuously arranged aluminum foil units, and a groove is formed between two adjacent aluminum foil units; the hot melt aluminum foil Mylar covers the top of the groove; the hot melt adhesive film is bonded to the top of the hot melt aluminum foil Mylar, and the two ends of the hot melt adhesive film extend and bond to the Al layer of the discontinuous aluminum foil Mylar respectively. The thermosensitive conductive composite material of the present invention has electrical conductivity and is sensitive to heat. Within 45 to 52 seconds at 65°C, the hot melt adhesive film will melt and break, causing the hot melt aluminum foil Mylar and the discontinuous aluminum foil Mylar to separate, thereby realizing self-cutting of the conductive connection, avoiding the occurrence of fire caused by continuous conductive short circuit in overload or high temperature conditions.

Description

Technical Field

[0001] The present invention belongs to the technical field of conductive composite materials, and relates to a conductive composite material and a preparation method and application thereof, and in particular to a thermosensitive conductive composite material and a preparation method and application thereof. Background Art

[0002] Conductive materials have the function of conducting electric current and eliminating accumulated static charge. At the same time, they are easy to apply and construct, have a wide range of applications, and require simple production equipment. They have very broad application prospects in many fields such as electronics, communications, automobiles, aerospace, and construction, and are highly favored by the industry.

[0003] With the continuous advancement of social science and technology, the requirements for conductive materials are getting higher and higher. Generally, although conductive materials can conduct current and eliminate accumulated static charges, they cannot cut off the conductive connection by themselves when the circuit is overloaded or at high temperature, and a short circuit is very likely to occur, thus causing a fire.

[0004] CN201465619U discloses an insulating hot melt adhesive polyimide Mylar structure of an FFC line, which is a layered structure, which is composed of a polyimide film layer, an aluminum foil layer, a polyester film layer and a fireproof insulating hot melt adhesive layer from top to bottom. It includes the functions of shielding and characteristic impedance in the material. After forming the FFC, there is no need to coat other materials, thereby saving processing costs and improving production efficiency; the shielding or characteristic impedance value of the finished wire can be changed by adjusting the thickness of the PI, aluminum foil, PET and fireproof insulating hot melt adhesive layer to meet the wire requirements.

[0005] CN207367636U discloses a hot melt adhesive film with shielding effect and an FFC line. The hot melt adhesive film includes a PET layer, a glue layer arranged on the lower surface of the PET layer, a metal shielding layer arranged on the lower surface of the glue layer, and a hot melt adhesive layer arranged on the lower surface of the metal shielding layer; the hot melt adhesive layer is compounded on the upper and lower surfaces of the flat metal conductor of the FFC line; the thickness of the PET layer is 12-50μm, the thickness of the metal shielding layer is 15-150μm; the thickness of the hot melt adhesive layer is 15-150μm. The hot melt adhesive film with shielding effect of the invention is provided with a metal shielding layer with shielding effect, and is coated on the metal foil surface of the FFC line by hot melt adhesive. The shielding effect is stable. In the process of preparing the FFC line, the hot melt adhesive film of the invention is directly compounded on the flat metal conductor, and there is no need to attach another layer of shielding film material. The process is simple and the processing cost is low.

[0006] Although the above-mentioned hot melt adhesive film has a shielding effect, it is difficult to quickly cut off the conductive connection at a relatively low temperature, thereby avoiding fires caused by short circuits.

[0007] Therefore, it is very necessary to develop a thermosensitive conductive composite material and a preparation method thereof which has excellent conductivity, excellent thermal sensitivity and can quickly cut off the conductive connection at a relatively low temperature. Summary of the invention

[0008] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a thermosensitive conductive composite material and a preparation method and use thereof. The thermosensitive conductive composite material of the present invention has excellent conductivity and excellent thermal sensitivity. At a temperature of 65°C, it can cut off the conductive connection by itself within 45 to 52 seconds, thereby avoiding fires caused by circuit short circuits.

[0009] One of the purposes of the present invention is to provide a thermosensitive conductive composite material. To achieve this purpose, the present invention adopts the following technical solutions:

[0010] A thermosensitive conductive composite material comprises a hot melt adhesive film, a hot melt aluminum foil Mylar and a discontinuous aluminum foil Mylar arranged in sequence from top to bottom;

[0011] The non-continuous aluminum foil Mylar comprises an Al layer and a PET film layer arranged in sequence from top to bottom, the Al layer comprises a plurality of non-continuously arranged aluminum foil units, and a groove is formed between two adjacent aluminum foil units;

[0012] The hot-melt aluminum foil Mylar covers the top of the groove;

[0013] The hot melt adhesive film is bonded to the top of the hot melt aluminum foil Mylar, and two ends of the hot melt adhesive film are respectively extended and bonded to the Al layer of the discontinuous aluminum foil Mylar.

[0014] In the thermosensitive conductive composite material of the present invention, under normal circumstances, the hot-melt adhesive film connects the hot-melt aluminum foil Mylar and the discontinuous aluminum foil Mylar, so that the thermosensitive conductive composite material has electrical conductivity. At the same time, the thermosensitive conductive composite material of the present invention is sensitive to heat. After exceeding a certain temperature, such as within 45 to 52 seconds under the temperature condition of 65°C, the hot-melt adhesive film will melt and break, causing the hot-melt aluminum foil Mylar and the discontinuous aluminum foil Mylar to separate, thereby realizing self-cutting of the conductive connection, avoiding the occurrence of fire caused by continuous conductive short circuit in overload or high temperature conditions.

[0015] Wherein, the melting point of the hot melt adhesive film is 60-70°C, for example, the melting point is 60°C, 61°C, 62°C, 63°C, 64°C, 65°C, 66°C, 67°C, 68°C, 69°C or 70°C.

[0016] Preferably, the hot melt adhesive film is any one of EVA, EAA and EMAA, or a mixed film of at least two of them.

[0017] The hot-melt aluminum foil Mylar comprises a hot-melt adhesive layer, a PET film and an Al layer arranged in sequence from top to bottom, the hot-melt adhesive film is bonded to the top of the hot-melt adhesive layer, and the Al layer of the hot-melt aluminum foil Mylar and the Al layer of the discontinuous aluminum foil Mylar are contacted and connected through the hot-melt adhesive film.

[0018] Among them, the softening point of the hot melt adhesive layer is 60-70°C, for example, the softening point is 60°C, 61°C, 62°C, 63°C, 64°C, 65°C, 66°C, 67°C, 68°C, 69°C or 70°C.

[0019] Preferably, the hot melt adhesive layer is any one of EVA, EAA, EMAA, PU, ​​PA, PES and PO, or a mixed layer of at least two of them.

[0020] The width of the groove is 0.03 to 10 mm, for example, the width of the groove is 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm or 10 mm.

[0021] Preferably, the thickness of the hot melt adhesive film is 25-50μm, for example, 25μm, 26μm, 27μm, 28μm, 29μm, 30μm, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, 39μm, 40μm, 41μm, 42μm, 43μm, 44μm, 45μm, 46μm, 47μm, 48μm, 49μm or 50μm, etc.

[0022] Preferably, the thickness of the hot-melt aluminum foil Mylar is 25-40 μm, for example, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm or 40 μm.

[0023] Preferably, the thickness of the discontinuous aluminum foil Mylar is 30-80 μm, for example, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm or 80 μm.

[0024] The second object of the present invention is to provide a method for preparing the thermosensitive conductive composite material as described in the first object, comprising the following steps:

[0025] 1) Material preparation: cut the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar separately for use;

[0026] 2) stacking, stacking the hot melt adhesive film, the hot melt aluminum foil Mylar, and the discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the groove of the discontinuous aluminum foil Mylar, the hot melt adhesive film is bonded to the top of the hot melt aluminum foil Mylar, and the two ends extend and bond to the Al layer of the discontinuous aluminum foil Mylar respectively;

[0027] 3) heat sealing, heat sealing the superimposed materials obtained in step 2) to obtain the thermosensitive conductive composite material.

[0028] Among them, the heat sealing temperature is 70-75°C, for example, the heat sealing temperature is 70°C, 71°C, 72°C, 73°C, 74°C or 75°C, etc., the heat sealing pressure is 0.7-3MPa, for example, the heat sealing pressure is 0.7MPa, 0.8MPa, 0.9MPa, 1MPa, 1.5MPa, 2MPa, 2.5MPa or 3MPa, etc., and the heat sealing time is 2-4s, for example, the heat sealing time is 2s, 2.5s, 3s, 3.5s or 4s, etc.

[0029] As a preferred embodiment, the method for preparing the thermosensitive conductive composite material of the present invention comprises the following steps:

[0030] 1) Material preparation,

[0031] The hot melt adhesive layer, the PET film and the Al layer are stacked in sequence from top to bottom to prepare a hot melt aluminum foil Mylar;

[0032] The Al layer and the PET film layer are stacked in sequence from top to bottom to prepare a non-continuous aluminum foil Mylar, wherein the Al layer includes a plurality of non-continuously arranged aluminum foil units, and a groove is formed between two adjacent aluminum foil units;

[0033] Cut the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar separately for use;

[0034] 2) stacking, stacking the hot melt adhesive film, the hot melt aluminum foil Mylar, and the discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the groove of the discontinuous aluminum foil Mylar, the hot melt adhesive film is bonded to the top of the hot melt adhesive layer, and the two ends extend and bond to the Al layer of the discontinuous aluminum foil Mylar respectively;

[0035] 3) heat sealing, heat sealing the superimposed materials obtained in step 2), the heat sealing temperature is 70-75° C., the heat sealing pressure is 0.7-3 MPa, and the heat sealing time is 2-4 seconds to obtain the thermosensitive conductive composite material.

[0036] The third object of the present invention is to provide a use of the thermosensitive conductive composite material as described in the first object, and to apply the thermosensitive conductive composite material to the preparation of conductive materials in the power, electronics, electrical appliances, information, automobile, aerospace, instrumentation, and construction industries.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The thermosensitive conductive composite material of the present invention has a tensile strength of 75 to 83 MPa. It is not only able to conduct electricity in a normal application environment, but also is sensitive to heat. When a certain temperature exceeds 65° C., the hot-melt adhesive film melts and breaks within 45 to 52 seconds, causing the hot-melt aluminum foil Mylar and the discontinuous aluminum foil Mylar to separate, thereby realizing the process of self-cutting the conductive connection and avoiding fire caused by short circuit in the case of circuit overload or high temperature.

[0039] The invention can prepare the thermosensitive conductive composite material by using conventional materials, and the preparation method is simple and easy. The prepared thermosensitive conductive composite material is soft and has good conformability, which is beneficial to improving the processability during application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic structural diagram of the thermosensitive conductive composite material of the present invention;

[0041] The reference numerals are as follows:

[0042] 1-hot melt adhesive film; 2-hot melt aluminum foil Mylar; 3-discontinuous aluminum foil Mylar;

[0043] 201-hot melt adhesive layer; 202-PET film; 203-Al layer;

[0044] 301 - Al layer; 302 - PET film layer; 303 - groove. DETAILED DESCRIPTION

[0045] The following is combined with Figure 1 , and further illustrate the technical solution of the present invention through specific implementation methods.

[0046] Unless otherwise specified, various raw materials of the present invention can be purchased from the market or prepared according to conventional methods in the art.

[0047] As attached Figure 1As shown, the thermosensitive conductive composite material of the present invention comprises a hot melt adhesive film 1, a hot melt aluminum foil Mylar 2 and a discontinuous aluminum foil Mylar 3 which are arranged in sequence from top to bottom; the discontinuous aluminum foil Mylar 3 comprises an Al layer 301 and a PET film layer 302 which are arranged in sequence from top to bottom, the Al layer comprises a plurality of discontinuously arranged aluminum foil units, and a groove 303 is formed between two adjacent aluminum foil units; the hot melt aluminum foil Mylar 2 covers the groove 303; the hot melt adhesive film 1 is bonded to the hot melt aluminum foil Mylar 2, and the two ends of the hot melt adhesive film 1 extend and bond to the Al layer 301 of the discontinuous aluminum foil Mylar 3 respectively.

[0048] The hot-melt aluminum foil Mylar 2 includes a hot-melt adhesive layer 201, a PET film 202 and an Al layer 203 arranged in sequence from top to bottom. The hot-melt adhesive film 1 is bonded to the top of the hot-melt adhesive layer 201, and the Al layer 203 of the hot-melt aluminum foil Mylar and the Al layer 301 of the discontinuous aluminum foil Mylar are contacted and connected through the hot-melt adhesive film 1.

[0049] Example 1

[0050] 1) Material preparation: cut the hot melt adhesive film with a melting point of 65°C into a size of 200mmx100mm, cut the hot melt aluminum foil Mylar with a softening point of 70°C into a size of 200mmx60mm, and cut the non-continuous aluminum foil Mylar with an Al layer groove width of 0.03mm into a size of 200mmx200mm respectively, and set aside;

[0051] 2) Stacking, stacking the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the Al layer groove on the discontinuous aluminum foil Mylar. Part of the hot melt adhesive film is placed on the hot melt adhesive layer of the hot melt aluminum foil Mylar, and the two ends extend and overlap on the Al layer of the discontinuous aluminum foil Mylar;

[0052] 3) heat sealing: heat sealing the superimposed materials obtained in step 2) under the conditions of 70° C., 3 MPa, and 4 s to obtain the desired thermosensitive conductive composite material.

[0053] Example 2

[0054] 1) Material preparation: cut the hot melt adhesive film with a melting point of 65°C into a size of 200mmx100mm, cut the hot melt aluminum foil Mylar with a softening point of 70°C into a size of 200mmx60mm, and cut the non-continuous aluminum foil Mylar with an Al layer groove width of 10mm into a size of 200mmx200mm respectively, and set aside;

[0055] 2) Stacking, stacking the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the Al layer groove on the discontinuous aluminum foil Mylar. Part of the hot melt adhesive film is placed on the hot melt adhesive layer of the hot melt aluminum foil Mylar, and the two ends extend and overlap on the Al layer of the discontinuous aluminum foil Mylar;

[0056] 3) heat sealing: heat sealing the superimposed materials obtained in step 2) under the conditions of 70° C., 3 MPa, and 4 s to obtain the desired thermosensitive conductive composite material.

[0057] Example 3

[0058] 1) Material preparation: cut the hot melt adhesive film with a melting point of 65°C into a size of 200mmx100mm, cut the hot melt aluminum foil Mylar with a softening point of 70°C into a size of 200mmx60mm, and cut the non-continuous aluminum foil Mylar with an Al layer groove width of 0.03mm into a size of 200mmx200mm respectively, and set aside;

[0059] 2) Stacking, stacking the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the Al layer groove on the discontinuous aluminum foil Mylar. Part of the hot melt adhesive film is placed on the hot melt adhesive layer of the hot melt aluminum foil Mylar, and the two ends extend and overlap on the Al layer of the discontinuous aluminum foil Mylar;

[0060] 3) heat sealing: heat sealing the superimposed materials obtained in step 2) under the conditions of 75° C., 0.7 MPa, and 2 s to obtain the desired thermosensitive conductive composite material.

[0061] Example 4

[0062] The difference between this embodiment and embodiment 1 is that the melting point of the hot melt adhesive film is 60° C., the softening point of the hot melt adhesive layer is 65° C., and the rest are the same as those of embodiment 1.

[0063] Example 5

[0064] The difference between this embodiment and embodiment 1 is that the melting point of the hot melt adhesive film is 70° C., the softening point of the hot melt adhesive layer is 70° C., and the rest are the same as those of embodiment 1.

[0065] Comparative Example 1

[0066] 1) Material preparation: cut the hot melt adhesive film with a melting point of 100°C into a size of 200mmx100mm, cut the hot melt aluminum foil Mylar with a softening point of 70°C into a size of 200mmx60mm, and cut the non-continuous aluminum foil Mylar with an Al layer groove width of 0.03mm into a size of 200mmx200mm respectively, and set aside;

[0067] 2) Stacking, stacking the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the Al layer groove on the discontinuous aluminum foil Mylar. Part of the hot melt adhesive film is placed on the hot melt adhesive layer of the hot melt aluminum foil Mylar, and the two ends extend and overlap on the Al layer of the discontinuous aluminum foil Mylar;

[0068] 3) heat sealing: heat sealing the superimposed materials obtained in step 2) under the conditions of 70° C., 3 MPa, and 4 s to obtain a conductive composite material.

[0069] Comparative Example 2

[0070] 1) Material preparation: cut the hot melt adhesive film with a melting point of 65°C into a size of 200mmx100mm, cut the hot melt aluminum foil Mylar with a softening point of 100°C into a size of 200mmx60mm, and cut the non-continuous aluminum foil Mylar with an Al layer groove width of 0.03mm into a size of 200mmx200mm respectively, and set aside;

[0071] 2) Stacking, stacking the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the Al layer groove on the discontinuous aluminum foil Mylar. Part of the hot melt adhesive film is placed on the hot melt adhesive layer of the hot melt aluminum foil Mylar, and the two ends extend and overlap on the Al layer of the discontinuous aluminum foil Mylar;

[0072] 3) heat sealing: heat sealing the superimposed materials obtained in step 2) under the conditions of 70° C., 3 MPa, and 4 s to obtain a conductive composite material.

[0073] Comparative Example 3

[0074] 1) Material preparation: cut the hot melt adhesive film with a melting point of 65°C into a size of 200mmx100mm, cut the hot melt aluminum foil Mylar with a hot melt adhesive layer softening point of 70°C into a size of 200mmx60mm, and cut the aluminum foil Mylar with a continuous Al layer (no grooves) into a size of 200mmx200mm respectively, and set aside;

[0075] 2) Stacking, stacking the hot melt adhesive film, the hot melt aluminum foil Mylar, and the aluminum foil Mylar with continuous Al layer in order from top to bottom. Part of the hot melt adhesive film is placed on the hot melt adhesive layer of the hot melt aluminum foil Mylar, and the two ends extend and overlap on the Al layer of the aluminum foil Mylar with continuous Al layer;

[0076] 3) heat sealing: heat sealing the superimposed materials obtained in step 2) under the conditions of 70° C., 3 MPa, and 4 s to obtain a conductive composite material.

[0077] Comparative Example 4

[0078] 1) Material preparation: cut the hot melt adhesive film with a melting point of 65°C into a size of 200mmx100mm, cut the hot melt aluminum foil Mylar with a softening point of 70°C into a size of 200mmx60mm, and cut the non-continuous aluminum foil Mylar with an Al layer groove width of 0.03mm into a size of 200mmx200mm respectively, and set aside;

[0079] 2) Stacking, stacking the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the Al layer groove on the discontinuous aluminum foil Mylar. Part of the hot melt adhesive film is placed on the hot melt adhesive layer of the hot melt aluminum foil Mylar, and the two ends extend and overlap on the Al layer of the discontinuous aluminum foil Mylar;

[0080] 3) heat sealing: heat sealing the superimposed materials obtained in step 2) under the conditions of 100° C., 3 MPa, and 4 s to obtain a conductive composite material.

[0081] Comparative Example 5

[0082] The difference between this comparative example and Example 1 is that the heat sealing temperature is 50° C., and the other aspects are the same as those of Example 1.

[0083] Comparative Example 6

[0084] The difference between this comparative example and Example 1 is that the heat sealing pressure is 0.3 MPa, and the other conditions are the same as those of Example 1.

[0085] Comparative Example 7

[0086] The difference between this comparative example and Example 1 is that the heat sealing pressure is 5 MPa, and the other conditions are the same as those of Example 1.

[0087] Comparative Example 8

[0088] The conductive material of this comparative example is a conventional conductive material, specifically an aluminum foil with a thickness of 25 μm.

[0089] The conductive composite materials obtained in Examples 1-5 and Comparative Examples 1-8 were subjected to performance tests, and the experimental results are shown in Table 1.

[0090] Among them, the test method is as follows:

[0091] Method for judging continuity before heating:

[0092] In the circuit of 12V switching power supply, clamp the conductive probes in the circuit at both ends of the product. After the circuit is powered on, check whether the indicator light in the circuit is on (the indicator light is on, indicating that the product can conduct current and has conductivity).

[0093] Method for judging conductivity after heating: first place the product on a 65°C heating plate, take it out after heating for a period of time, and then clamp the conductive probes in the circuit at both ends of the product in the circuit of a 12V switching power supply. After the circuit is powered on, check whether the indicator light in the circuit is on.

[0094] Thermal time: The starting time is when the product is placed on a heating plate at 65°C, and the ending time is when the product cannot conduct electricity due to the heat. The thermal time is obtained by subtracting the starting time from the ending time.

[0095] Table 1

[0096]

[0097] It can be seen from Table 1 that when the melting point of the hot melt adhesive film in Comparative Example 1 is too high, compared with Example 1, the hot melt adhesive film in Comparative Example 1 cannot bond the hot melt aluminum foil Mylar and the non-continuous aluminum foil Mylar together, and the Al layer of the hot melt aluminum foil Mylar cannot be tightly overlapped with the Al layer of the non-continuous aluminum foil Mylar, so the product has no electrical conductivity.

[0098] Comparative Example 2 When the softening point of the hot-melt aluminum foil Mylar is too high, compared with Example 1, the hot-melt aluminum foil Mylar in Comparative Example 2 cannot be fixed on the non-continuous aluminum foil Mylar by the hot-melt adhesive film. Similarly, the Al layer of the hot-melt aluminum foil Mylar cannot be tightly overlapped with the Al layer of the non-continuous aluminum foil Mylar, so the product has no electrical conductivity.

[0099] In Comparative Example 3, when the discontinuous aluminum foil Mylar is replaced by an aluminum foil Mylar with a continuous Al layer, compared with Example 1, it has electrical conductivity before heating. After heating, although the hot melt adhesive film will be melted, the bottom aluminum foil Mylar is not affected and still has conductivity. This is the same as the electrical conductivity of Comparative Example 8, which is a characteristic of conventional products. If the current is continuously conducted, a short circuit is likely to occur, and there is a greater risk of fire.

[0100] In Comparative Example 4, when the heat-sealing temperature is too high, the hot-melt adhesive film has melted and broken during the preparation stage, and the hot-melt aluminum foil Mylar and the non-continuous aluminum foil Mylar cannot be bonded together. The Al layer of the hot-melt aluminum foil Mylar cannot be tightly overlapped with the Al layer of the non-continuous aluminum foil Mylar, so the product has no electrical conductivity.

[0101] Comparative Example 5 When the heat-sealing temperature is too low, the hot-melt adhesive film cannot bond the hot-melt aluminum foil Mylar to the discontinuous aluminum foil Mylar, so the obtained discontinuous aluminum foil has no electrical conductivity due to the groove cross-section of the Al layer.

[0102] Comparative Example 6 When the heat-sealing pressure is too low, the Al layer of the hot-melt aluminum foil Mylar cannot be tightly overlapped on the Al layer of the discontinuous aluminum foil Mylar, that is, there is no effective Al layer conductive overlap on the Al layer groove, so the obtained product has no electrical conductivity.

[0103] In Comparative Example 7, when the heat sealing pressure is too high, the hot melt adhesive film has melted and broken in the preparation stage, and the hot melt aluminum foil Mylar and the non-continuous aluminum foil Mylar cannot be bonded together. The Al layer of the hot melt aluminum foil Mylar cannot be tightly overlapped with the Al layer of the non-continuous aluminum foil Mylar, so the product has no electrical conductivity.

[0104] It can be seen that the conductive composite material of the present invention has the same conductive conductivity as conventional conductive materials, and the conductive composite material of the present invention is more sensitive to heat. At 65°C, the hot melt adhesive film will melt and break within 45 to 52 seconds, causing the hot melt aluminum foil Mylar and the discontinuous aluminum foil Mylar to separate, thereby realizing the process of self-cutting the conductive connection, avoiding the occurrence of fire caused by continuous conductive short circuit in conventional products under overload or high temperature conditions.

[0105] The present invention illustrates the detailed process equipment and process flow of the present invention through the above-mentioned embodiments, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, that is, it does not mean that the present invention must rely on the above-mentioned detailed process equipment and process flow to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of various raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

[0106] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0107] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0108] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A thermosensitive conductive composite material, characterized in that: It includes hot melt adhesive film, hot melt aluminum foil Mylar and discontinuous aluminum foil Mylar arranged in sequence from top to bottom; The non-continuous aluminum foil Mylar comprises an Al layer and a PET film layer arranged in sequence from top to bottom, the Al layer comprises a plurality of non-continuously arranged aluminum foil units, and a groove is formed between two adjacent aluminum foil units; The hot-melt aluminum foil Mylar covers the top of the groove; The hot-melt aluminum foil Mylar comprises a hot-melt adhesive layer, a PET film and an Al layer arranged in sequence from top to bottom, the hot-melt adhesive film is bonded to the top of the hot-melt adhesive layer, and the Al layer of the hot-melt aluminum foil Mylar and the Al layer of the discontinuous aluminum foil Mylar are contacted and connected through the hot-melt adhesive film; The hot melt adhesive film is bonded to the top of the hot melt aluminum foil Mylar, and both ends of the hot melt adhesive film extend and bond to the Al layer of the discontinuous aluminum foil Mylar respectively; The melting point of the hot melt adhesive film is 60-70°C; The softening point of the hot melt adhesive layer is 60-70°C.

2. The thermosensitive conductive composite material according to claim 1, characterized in that: The hot melt adhesive film is any one of EVA, EAA and EMAA or a mixed film of at least two of them.

3. The thermosensitive conductive composite material according to claim 1, characterized in that: The hot melt adhesive layer is any one of EVA, EAA, EMAA, PU, ​​PA, PES and PO, or a mixed layer of at least two of them.

4. The thermosensitive conductive composite material according to claim 1, characterized in that: The width of the groove is 0.03-10 mm.

5. The thermosensitive conductive composite material according to claim 1, characterized in that: The thickness of the hot melt adhesive film is 25-50 μm.

6. The thermosensitive conductive composite material according to claim 1, characterized in that: The thickness of the hot-melt aluminum foil Mylar is 25-40 μm.

7. The thermosensitive conductive composite material according to claim 1, characterized in that: The thickness of the discontinuous aluminum foil Mylar is 30-80 μm.

8. The method for preparing the thermosensitive conductive composite material according to any one of claims 1 to 7, characterized in that: The preparation method comprises the following steps: 1) Material preparation: cut the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar separately for use; 2) stacking, stacking the hot melt adhesive film, the hot melt aluminum foil Mylar, and the discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the groove of the discontinuous aluminum foil Mylar, the hot melt adhesive film is bonded to the top of the hot melt aluminum foil Mylar, and the two ends extend and bond to the Al layer of the discontinuous aluminum foil Mylar respectively; 3) heat-sealing, heat-sealing the superimposed materials obtained in step 2) to obtain the thermosensitive conductive composite material; Wherein, the heat sealing temperature is 70-75° C., the heat sealing pressure is 0.7-3 MPa, and the heat sealing time is 2-4 s.

9. The preparation method according to claim 8, characterized in that: The preparation method comprises the following steps: 1) Material preparation, The hot melt adhesive layer, the PET film and the Al layer are stacked in sequence from top to bottom to prepare a hot melt aluminum foil Mylar; The Al layer and the PET film layer are stacked in sequence from top to bottom to prepare a non-continuous aluminum foil Mylar, wherein the Al layer includes a plurality of non-continuously arranged aluminum foil units, and a groove is formed between two adjacent aluminum foil units; Cut the hot melt adhesive film, hot melt aluminum foil Mylar, and discontinuous aluminum foil Mylar separately for use; 2) stacking, stacking the hot melt adhesive film, the hot melt aluminum foil Mylar, and the discontinuous aluminum foil Mylar in order from top to bottom, and the hot melt aluminum foil Mylar covers the groove of the discontinuous aluminum foil Mylar, the hot melt adhesive film is bonded to the top of the hot melt adhesive layer, and the two ends extend and bond to the Al layer of the discontinuous aluminum foil Mylar respectively; 3) heat sealing, heat sealing the superimposed materials obtained in step 2), the heat sealing temperature is 70-75° C., the heat sealing pressure is 0.7-3 MPa, and the heat sealing time is 2-4 seconds to obtain the thermosensitive conductive composite material.

10. A use of the thermosensitive conductive composite material according to any one of claims 1 to 7, characterized in that: The thermosensitive conductive composite material is applied to the preparation of conductive materials in the electric power, electronics, electrical appliances, information, automobile, aerospace, instrumentation, and construction industries.

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