Display device and method of manufacturing a display device

Abstract

Exemplary embodiments of the present inventive concept relate to a display apparatus and a method of manufacturing a display apparatus, the display apparatus including a first substrate, thin film transistors disposed on a first surface of the first substrate, light emitting elements respectively connected to corresponding ones of the thin film transistors and disposed on the thin film transistors, and a lens array including lenses disposed on a second surface of the first substrate opposite the first surface of the first substrate, wherein the light emitting elements emit light toward the first substrate.

Description

Technical Field

[0001] Exemplary embodiments of the present invention relate to a display device and a method of manufacturing a display device, and more specifically to a display device including a lens array and a method of manufacturing a display device. Background Technology

[0002] With the development of the information society, the demand for display devices for displaying images is increasing in various forms. Therefore, various display devices such as liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light-emitting diodes (OLEDs) are being utilized.

[0003] Stereoscopic image display devices and viewing angle control display devices are under development. Each device segments an image displayed by a display device using a lens array and displays the segmented image in space in front of the display device. Typically, the stereoscopic image display device displays left-eye and right-eye images separately to provide a three-dimensional (3D) effect due to binocular parallax. The viewing angle control display device typically displays a first-view image and a second-view image separately to provide different images to users positioned at different viewing angles relative to the display device. Additionally, in each of the stereoscopic image display device and the viewing angle control display device, a lens array can be attached to a display panel. Summary of the Invention

[0004] According to an exemplary embodiment of the present invention, a display device includes: a first substrate; a thin-film transistor disposed on a first surface of the first substrate; a light-emitting element connected to a corresponding thin-film transistor in the thin-film transistor and disposed on the thin-film transistor; and a lens array including lenses disposed on a second surface of the first substrate opposite to the first surface of the first substrate, wherein the light-emitting element emits light toward the first substrate.

[0005] In an exemplary embodiment of the present invention, the lens array contacts the second surface of the first substrate.

[0006] In an exemplary embodiment of the present invention, the first substrate comprises a polymer resin.

[0007] In an exemplary embodiment of the present invention, the lens array comprises glass.

[0008] In an exemplary embodiment of the present invention, each of the light-emitting elements includes: a first light-emitting electrode connected to one of the thin-film transistors; a light-emitting layer disposed on the first light-emitting electrode; and a second light-emitting electrode disposed on the light-emitting layer, wherein the first light-emitting electrode comprises a conductive material that transmits light, and the second light-emitting electrode comprises a conductive material that reflects light.

[0009] In an exemplary embodiment of the present invention, the display device further includes a second substrate disposed on the second light-emitting electrode.

[0010] In an exemplary embodiment of the present invention, each of the lenses has a semi-cylindrical shape or a hemispherical shape.

[0011] In an exemplary embodiment of the present invention, each of the lenses is bent outward from the second surface of the first substrate.

[0012] According to an exemplary embodiment of the present invention, a method of manufacturing a display device includes: irradiating a predetermined position of a lens array substrate with a laser; forming a first substrate on a first surface of the lens array substrate; forming a thin-film transistor and a light-emitting element on the first surface of the first substrate; and forming a lens array by etching a second surface of the lens array substrate opposite to the first surface of the lens array substrate, wherein the lens array includes lenses.

[0013] In an exemplary embodiment of the present invention, the physical properties of the lens array substrate at the predetermined position are different from the physical properties of the lens array substrate in the region of the lens array substrate other than the predetermined position.

[0014] In an exemplary embodiment of the present invention, the lens array substrate is made of glass.

[0015] In an exemplary embodiment of the present invention, the lens array substrate includes SiO bonds at the predetermined location and SiO2 bonds in the region of the lens array substrate other than the predetermined location.

[0016] In an exemplary embodiment of the present invention, irradiating the lens array substrate with the laser includes irradiating the laser along a first lens line extending in a first direction.

[0017] In an exemplary embodiment of the present invention, the gap between adjacent first lens lines in a second direction is equal to the pitch of each lens in the second direction, which intersects the first direction.

[0018] In an exemplary embodiment of the present invention, at least one of the first lens lines corresponds to the boundary between adjacent lenses.

[0019] In an exemplary embodiment of the present invention, each of the lenses is a biconvex lens extending in the first direction.

[0020] In an exemplary embodiment of the present invention, irradiating the lens array substrate with the laser includes irradiating the laser along a first lens line having a circular or elliptical shape.

[0021] In an exemplary embodiment of the present invention, each of the lenses has a semi-cylindrical shape or a hemispherical shape.

[0022] In an exemplary embodiment of the present invention, forming the lens array by etching the second surface of the lens array substrate includes: etching the second surface of the lens array substrate using a hydrofluoric acid wet etching process.

[0023] In an exemplary embodiment of the present invention, the lens array contacts the second surface of the first substrate. Attached Figure Description

[0024] The above and other features of the inventive concept will become more apparent from the detailed description of exemplary embodiments of the inventive concept with reference to the accompanying drawings, in which:

[0025] Figure 1 This is a perspective view of a display device according to an exemplary embodiment of the present invention;

[0026] Figure 2 and Figure 3 This is a view illustrating a method for implementing a stereoscopic image and a perspective image of a display device according to an exemplary embodiment of the concept of the present invention;

[0027] Figure 4 yes Figure 1 A cross-sectional view of the display panel;

[0028] Figure 5 This is a perspective view of a display device according to an exemplary embodiment of the present invention;

[0029] Figure 6 This is a plan view showing an example of a hemispherical lens and pixels in a lens array;

[0030] Figure 7 This is a flowchart illustrating a method for manufacturing a display device according to an exemplary embodiment of the concept of the present invention;

[0031] Figure 8 , Figure 9 and Figure 10 It is shown Figure 7 A view of a method for manufacturing a display device;

[0032] Figure 11 This illustrates an example laser irradiation position when a biconvex lens array is formed on the surface of a lens array substrate; and

[0033] Figure 12 This illustrates an example laser irradiation position when a hemispherical lens array is formed on the surface of a lens array substrate. Detailed Implementation

[0034] In the following description, exemplary embodiments of the inventive concept will be described more fully with reference to the accompanying drawings. Throughout the drawings, the same reference numerals may refer to the same elements, and therefore, their descriptions may be omitted.

[0035] It will be understood that when a component, such as a membrane, region, layer, or element, is referred to as being "on," "connected to," "coupled to," or "adjacent to" another component, the component may be directly on, directly connected to, directly coupled to, or directly adjacent to the other component, or there may be intermediate components between the component and the other component. It will also be understood that when a component is referred to as being "between two components," the component may be the only component between the two components, or there may be one or more intermediate components. It will also be understood that when a component is referred to as "covering" another component, the component may be the only component covering the other component, or one or more intermediate components may also cover the other component. Other terms used to describe relationships between components can be interpreted in the same way.

[0036] It will be further understood that, unless the context clearly indicates otherwise, the description of features or aspects of each exemplary embodiment may be applied to other similar features or aspects in other exemplary embodiments.

[0037] Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” used herein are also intended to include the plural forms.

[0038] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “below,” “above,” and “upper” are used herein to describe the relationship between one element or feature and another element (or other elements) or feature (or other features) as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are also intended to cover different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as “below,” “under,” or “below” other elements or features will subsequently be oriented “above” other elements or features. Thus, the example terms “below,” “below,” and “below” can cover both orientations of “above” and “below.”

[0039] Figure 1 This is a perspective view of a display device 10 according to an exemplary embodiment of the present invention.

[0040] Reference Figure 1 The display device 10 according to this embodiment may include a display panel 100 and a lens array 200.

[0041] Display device 10 can be a stereoscopic image display device or a viewing angle control display device. A stereoscopic image display device or a viewing angle control display device uses a lens array 200 to segment the image displayed on the display panel 100 and displays the segmented image in the space in front of the display device 10. For example, when the display device 10 is a stereoscopic image display device, a left-eye image and a right-eye image can be displayed separately in the space in front of the display device 10 to provide a three-dimensional (3D) effect due to binocular parallax. When the display device 10 is a viewing angle control display device, a first-view image and a second-view image can be displayed separately in the space in front of the display device 10 to provide different images to users positioned at different viewing angles relative to the display device 10.

[0042] Display panel 100 may be a light-emitting display panel that includes light-emitting elements. For example, display panel 100 may be an organic light-emitting display panel that uses organic light-emitting diodes (OLEDs) including, for example, organic light-emitting layers; a micro light-emitting diode display panel that uses micro light-emitting diodes; a quantum dot light-emitting display panel that uses quantum dot light-emitting diodes including quantum dot light-emitting layers; or an inorganic light-emitting display panel that uses inorganic light-emitting elements that include inorganic semiconductors. The following will mainly describe the case where display panel 100 is an organic light-emitting display panel.

[0043] The display panel 100 may have a planar shape, such as a quadrilateral. The display panel 100 may have a long side in a first direction DR1 and a short side in a second direction DR2. For example, each corner where the long side extending in the first direction DR1 meets the short side extending in the second direction DR2 may be rounded with a predetermined curvature or may be a right angle. The planar shape of the display panel 100 is not limited to a quadrilateral shape, but may also be other polygonal shapes, circular shapes, or elliptical shapes.

[0044] To display an image, the display panel 100 may include data lines, scan lines, and a plurality of sub-pixels SP1, SP2, and SP3 connected to the data lines and scan lines (see example...). Figure 2 Each of sub-pixels SP1, SP2, and SP3 may be connected to at least one scan line and at least one data line. Each of sub-pixels SP1, SP2, and SP3 may include a thin-film transistor such as a driving transistor and at least one switching transistor, as well as a light-emitting element. Each of sub-pixels SP1, SP2, and SP3 may receive a data voltage via the data line in response to a scan signal transmitted from the scan line, and may emit light by supplying a driving current to the light-emitting element according to the data voltage applied to the gate electrode of the driving transistor.

[0045] The lens array 200 can be disposed on the surface of the display panel 100, for example, on the third-party DR3. For example, the lens array 200 can directly contact the surface of the display panel 100. For example, the lens array 200 can be fixed to the surface of the display panel 100 without the use of a separate adhesive member. Since the lens array 200 is formed directly on the surface of the display panel 100, it is not necessary to align and attach the lens array 200 to the display panel 100. (See below for further details.) Figure 9 and Figure 10 Describe the structure of the lens array 200 that directly contacts the surface of the display panel 100.

[0046] For example, the lens array 200 can be made of glass. However, the inventive concept is not limited thereto; for example, the lens array 200 can include a polycarbonate material. The lens array 200 can include a plurality of lenses 210. Each of the lenses 210 can be as follows: Figure 1 The biconvex lens shown extends in the fourth direction DR4. In this case, each of the lenses 210 can be a semi-cylindrical lens extending in the fourth direction DR4, but the inventive concept is not limited thereto. Each of the lenses 210 can be a Fresnel lens. Alternatively, each of the lenses 210 can be a tilting lens tilted at a predetermined angle relative to the first direction DR1 (see example...). Figure 2Lens 210 can be positioned in a fifth direction DR5 that intersects with the fourth direction DR4 (see example). Figure 2 Arranged on top.

[0047] Figure 2 and Figure 3 This is a view illustrating a method for implementing a stereoscopic image and a perspective image of a display device 10 according to an exemplary embodiment of the present invention.

[0048] Figure 2 The image shows pixel PX and lens 210 as seen in the plan view. Pixel PX includes display panel 100 (see example). Figure 1 Subpixels SP1 to SP3, and Figure 3 Show along Figure 2 The cross-section of the display panel 100 and lens 210 is taken by line I-I'. Figure 2 For ease of description, a lens 210 and a pixel PX of the display panel 100 are shown. Figure 3 For ease of description, a lens 210, a pixel PX of the display panel 100, a first substrate SUB1, a filler FL, and a second substrate SUB2 are shown.

[0049] Reference Figure 2 and Figure 3 The display panel 100 may include a first substrate SUB1, a plurality of pixels PX, a filler FL, and a second substrate SUB2.

[0050] The first substrate SUB1 may include, for example, an organic polymer material such as polyethylene, polyimide, polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, or polyester.

[0051] Pixel PX can be disposed on a first surface of the first substrate SUB1. Each of the pixels PX may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. Each of the pixels PX may be a set of sub-pixels SP1 to SP3 used to represent a white grayscale level. Each of the sub-pixels SP1 to SP3 may be the smallest unit capable of representing a grayscale level.

[0052] The first sub-pixel SP1 can emit light of a first color. The second sub-pixel SP2 can emit light of a second color, and the third sub-pixel SP3 can emit light of a third color. For example, the first color can be red, the second color can be green, and the third color can be blue, but the inventive concept is not limited thereto.

[0053] Each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can have a polygonal shape. For example, each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can have a rectangular planar shape, which has a short side in the first direction DR1 and a long side in the second direction DR2. In each pixel PX, the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can be arranged in the first direction DR1.

[0054] The second substrate SUB2 can be disposed on the pixel PX. For example, the second substrate SUB2 can be made of glass, or of an organic polymer material such as polyethylene, polyimide, polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, or polyester.

[0055] The filler FL can be disposed between the pixel PX and the second substrate SUB2. The filler FL can be made of a material with a buffering function. For example, the filler FL can be an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0056] Lens 210 can be disposed on a second surface of the first substrate SUB1 opposite to a first surface of the first substrate SUB1. Lens 210 can directly contact the second surface of the first substrate SUB1. For example, lens 210 can be fixed to the second surface of the first substrate SUB1 without the use of a separate adhesive member. For example, lens 210 can be directly formed on the second surface of the first substrate SUB1. (See below for further details.) Figures 7 to 10 The lens 210 is described as being formed on the second surface of the first substrate SUB1.

[0057] Lens 210 may extend in the fourth direction DR4. Lens 210 may be tilted at a predetermined angle relative to the long side of each of sub-pixels SP1 to SP3. For example, lens 210 may be tilted at a predetermined angle relative to the second direction DR2. As another example, lens 210 may be tilted relative to the short side of each of sub-pixels SP1 and SP3.

[0058] Since lens 210 is arranged in the first direction DR1, the pitch PIT of lens 210 can be the length of lens 210 in the fifth direction DR5, which intersects the first direction DR1. Figure 2 and Figure 3 For ease of description, three sub-pixels SP1 to SP3 are arranged in the first direction DR1 within the pitch PIT of lens 210, but the concept of the present invention is not limited thereto.

[0059] The first sub-pixel SP1 can be positioned adjacent to the first side of lens 210. The second sub-pixel SP2 can be positioned in the middle of lens 210, and the third sub-pixel SP3 can be positioned adjacent to the second side of lens 210. For example, the second sub-pixel SP2 can be positioned between the first sub-pixel SP1 and the third sub-pixel SP3. For example, as... Figure 2 As shown, the first side of lens 210 can indicate the left side of lens 210, and the second side of lens 210 can indicate the right side of lens 210.

[0060] In this case, such as Figure 3 As shown, a first view image VI1 displayed by a first sub-pixel SP1 can be refracted by lens 210 and provided to a first view area V1, which is located in front of the second side of lens 210 of display device 10. A second view image VI2 displayed by a second sub-pixel SP2 can be almost unrefracted by lens 210 and provided to a second view area V2, which is located in front of the center of lens 210 of display device 10. A third view image VI3 displayed by a third sub-pixel SP3 can be refracted by lens 210 and provided to a third view area V3, which is located in front of the first side of lens 210 of display device 10. For example, the second view area V2 can be between the first view area V1 and the third view area V3. As an additional example, the second view image VI2 can be refracted less than the first view image VI1 and / or the third view image VI3. For example, as Figure 3 As shown, the first viewpoint image VI1 displayed by the first sub-pixel SP1, the second viewpoint image VI2 displayed by the second sub-pixel SP2, and the third viewpoint image VI3 displayed by the third sub-pixel SP3 can be displayed in separate spaces in front of the display device 10.

[0061] The first viewpoint image VI1, the second viewpoint image VI2, and the third viewpoint image VI3 can be images generated taking into account binocular parallax. When the user's left and right eyes are positioned in different viewpoint regions within the first viewpoint region V1, the second viewpoint region V2, and the third viewpoint region V3, the user can experience a 3D effect due to binocular parallax.

[0062] Furthermore, the first viewpoint image VI1, the second viewpoint image VI2, and the third viewpoint image VI3 can be different images. For example, when the display device 10 is applied to a vehicle display, the first viewpoint image VI1 can be a navigation image, the second viewpoint image VI2 can be an image showing vehicle information, and the third viewpoint image VI3 can be an entertainment image showing a movie. In this case, a user positioned in the first viewpoint region V1 can only view the navigation image. Similarly, a user positioned in the second viewpoint region V2 can only view the image showing vehicle information, and a user positioned in the third viewpoint region V3 can only view the entertainment image. For example, the display device 10 can display different images to users positioned at different viewing angles.

[0063] exist Figure 2 and Figure 3 For ease of description, three viewpoint images VI1 to VI3 are provided to three viewpoint regions V1 to V3 by three sub-pixels SP1 to SP3 disposed within the pitch PIT of lens 210; however, the inventive concept is not limited thereto. For example, the number of sub-pixels disposed within the pitch PIT of lens 210, the number of viewpoint images, and the number of viewpoint regions can be determined based on the size of display device 10 and whether display device 10 will provide stereoscopic images or vantage point images.

[0064] Figure 4 yes Figure 1 This is a cross-sectional view of the display panel 100. This cross-sectional view is also along... Figure 2 It is intercepted by line I-I' in the middle.

[0065] Reference Figure 4 The display panel 100 may include a first substrate SUB1, a second substrate SUB2, and a pixel array layer. The pixel array layer may include a thin-film transistor layer (TFTL) and a light-emitting element layer (EML).

[0066] Color filters CF1 to CF3 and black matrix BM can be disposed on the surface of the first substrate SUB1 facing the second substrate SUB2, that is, disposed on the first surface of the first substrate SUB1.

[0067] The first color filter CF1 can be a first-color light transmission filter that transmits light of a first color. The second color filter CF2 can be a second-color light transmission filter that transmits light of a second color, and the third color filter CF3 can be a third-color light transmission filter that transmits light of a third color. For example, the first color can be red, the second color can be green, and the third color can be blue. For example, the peak wavelength range of red light transmitted through the first color filter CF1 can be approximately 620 nm to approximately 750 nm. Additionally, the peak wavelength range of green light transmitted through the second color filter CF2 can be approximately 500 nm to approximately 570 nm, and the peak wavelength range of blue light transmitted through the third color filter CF3 can be approximately 450 nm to approximately 490 nm.

[0068] A first color filter CF1 may overlap with a first emission region EA1 of a first sub-pixel SP1 on the third-direction DR3, and according to the first color filter CF1, light emitted from the first emission region EA1 may be output as light of a first color. A second color filter CF2 may overlap with a second emission region EA2 of a second sub-pixel SP2 on the third-direction DR3, and according to the second color filter CF2, light emitted from the second emission region EA2 may be output as light of a second color. A third color filter CF3 may overlap with a third emission region EA3 of a third sub-pixel SP3 on the third-direction DR3, and according to the third color filter CF3, light emitted from the third emission region EA3 may be output as light of a third color.

[0069] The black matrix (BM) can include materials that can block light. For example, the black matrix BM can be an organic layer comprising a black dye or pigment, or a metallic layer comprising an opaque metallic material such as chromium (Cr). The black matrix BM can be positioned between two adjacent color filters CF1, CF2, or CF3. The black matrix BM can prevent light from any sub-pixel SP1, SP2, or SP3 from traveling in the third direction DR3 to the adjacent color filter CF1, CF2, or CF3 that overlaps with the adjacent sub-pixel SP1, SP2, or SP3.

[0070] Despite Figure 4 The color filters CF1 to CF3 and the black matrix BM are disposed between the first substrate SUB1 and the first buffer layer BF1, but the positions of the color filters CF1 to CF3 and the black matrix BM are not limited thereto. For example, the color filters CF1 to CF3 and the black matrix BM may be disposed between the first organic layer 150 and the second organic layer 160, or may be disposed in place of the first organic layer 150.

[0071] A first buffer layer BF1 may be disposed on a first substrate SUB1, and a second buffer layer BF2 may be disposed on the first buffer layer BF1. The first buffer layer BF1 and the second buffer layer BF2 can protect the thin-film transistor ST of the thin-film transistor layer TFTL and the light-emitting layer 172 of the light-emitting element layer EML from moisture introduced through the first substrate SUB1, which may be susceptible to moisture penetration. Each of the first buffer layer BF1 and the second buffer layer BF2 may be a multilayer, including one or more inorganic layers, such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and / or aluminum oxide, alternately stacked in the multilayer. However, the inventive concept is not limited thereto. For example, each of the first buffer layer BF1 and the second buffer layer BF2 may be a single layer. At least one of the first buffer layer BF1 and the second buffer layer BF2 may be omitted.

[0072] A light-blocking layer BML can be disposed on the first buffer layer BF1. Each of the light-blocking layers BML can be a single layer or multiple layers comprising at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof. Additionally, each of the light-blocking layers BML can be an organic layer comprising a black dye or pigment.

[0073] The active layer ACT of each thin-film transistor ST can be disposed on the second buffer layer BF2. The active layer ACT can include, for example, polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor. When the active layer ACT includes polycrystalline silicon or oxide semiconductor material, the ion-doped region of the active layer ACT can be a conductive region with conductivity.

[0074] Each of the active layers ACT can overlap with the corresponding light-blocking layer BML on the third-direction DR3. Since the light incident through the first substrate SUB1 can be blocked by the light-blocking layer BML, it is possible to prevent leakage current caused by the light incident through the first substrate SUB1 from flowing through the active layer ACT.

[0075] The gate insulating layer 130 can be formed on the active layer ACT of each thin-film transistor ST. The gate insulating layer 130 can be an inorganic layer, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer.

[0076] The gate electrode G of each thin-film transistor ST can be disposed on the gate insulating layer 130. The gate electrode G of each thin-film transistor ST can overlap with the active layer ACT on the third-direction DR3. The portion of the active layer ACT that overlaps with the gate electrode G on the third-direction DR3 can be the channel region CHA. The gate electrode G can be a single layer or multiple layers including at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0077] The first interlayer insulating film 141 can be formed on the gate electrode G. The first interlayer insulating film 141 can be an inorganic layer, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating film 141 may include multiple inorganic layers.

[0078] The capacitor electrode CAE can be disposed on the first interlayer insulating film 141. The capacitor electrode CAE can overlap with the gate electrode G on the third-direction DR3. Each of the capacitor electrode CAEs can overlap with a first electrode to form a sensing capacitor, the first electrode corresponding to the gate electrode G. Each of the capacitor electrode CAEs can be a single layer or multiple layers comprising at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0079] The second interlayer insulating film 142 can be disposed on the capacitor electrode CAE. The second interlayer insulating film 142 can be an inorganic layer, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer. The second interlayer insulating film 142 may include multiple inorganic layers.

[0080] The first electrode S and the second electrode D of each thin-film transistor ST can be disposed on the second interlayer insulating film 142. Each of the first electrode S and the second electrode D can be a single layer or multiple layers of at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu) and alloys thereof.

[0081] The first electrode S of each thin-film transistor ST can be connected via a contact hole to a first conductive region COA1 disposed on one side of the channel region CHA of the active layer ACT. The contact hole penetrates the gate insulating layer 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The second electrode D of each thin-film transistor ST can be connected via a contact hole to a second conductive region COA2 disposed on the other side of the channel region CHA of the active layer ACT. The contact hole penetrates the gate insulating layer 130, the first interlayer insulating film 141, and the second interlayer insulating film 142.

[0082] The first organic layer 150 can be disposed on the first electrode S and the second electrode D to flatten the steps caused by the thin-film transistor ST. The first organic layer 150 can be an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin.

[0083] The first connection electrode ANDE1 can be disposed on the first organic layer 150. Each of the first connection electrodes ANDE1 can be connected to the first electrode S of the thin-film transistor ST through a corresponding contact hole penetrating the first organic layer 150. Each of the first connection electrodes ANDE1 can be a single layer or multiple layers comprising at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0084] The second organic layer 160 may be disposed on the first connecting electrode ANDE1. The second organic layer 160 may be an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin.

[0085] Although each thin-film transistor ST in Figure 4 The diagram shows a top-gate configuration where the gate electrode G is positioned above the active layer ACT; however, it should be noted that the inventive concept is not limited thereto. For example, each thin-film transistor ST can be formed as a bottom-gate configuration or a dual-gate configuration, in which the gate electrode G is positioned below the active layer ACT, and in which the gate electrode G is positioned both above and below the active layer ACT.

[0086] The light-emitting element layer (EML) is disposed on the thin-film transistor layer (TFTL). The EML may include light-emitting elements 170 and 180. Each of the light-emitting elements 170 may include a first light-emitting electrode 171, a light-emitting layer 172, and a second light-emitting electrode 173.

[0087] Subpixels SP1 to SP3 may each include emission regions EA1 to EA3 and emission drivers ED1 to ED3. The first subpixel SP1 may include a first emission region EA1 and a first emission driver ED1. The second subpixel SP2 may include a second emission region EA2 and a second emission driver ED2. The third subpixel SP3 may include a third emission region EA3 and a third emission driver ED3.

[0088] Each of the emitter drivers ED1 to ED3 may include at least one thin-film transistor ST. Each of the emitter regions EA1 to EA3 is a region in which a first light-emitting electrode 171, a light-emitting layer 172, and a second light-emitting electrode 173 are sequentially stacked such that holes from the first light-emitting electrode 171 and electrons from the second light-emitting electrode 173 combine in the light-emitting layer 172 to emit light. In this case, the first light-emitting electrode 171 may be an anode, and the second light-emitting electrode 173 may be a cathode.

[0089] The first light-emitting electrode 171 can be formed on the second organic layer 160. Each of the first light-emitting electrodes 171 can be connected to the corresponding first connection electrode ANDE1 through a corresponding contact hole penetrating the second organic layer 160.

[0090] In the bottom emitting structure (where light is emitted from each light-emitting layer 172 toward each first light-emitting electrode 171), each first light-emitting electrode 171 can be made of, for example, a transparent conductive oxide (TCO) capable of transmitting light or a semi-transparent conductive material. Transparent conductive oxides (TCOs) capable of transmitting light include indium tin oxide (ITO) or indium zinc oxide (IZO), while semi-transparent conductive materials include magnesium (Mg), silver (Ag), or alloys of Mg and Ag. When each first light-emitting electrode 171 is made of a semi-transparent conductive material, the light output efficiency can be improved through the microcavity.

[0091] The dam 180 can form the emission regions EA1 to EA3 of sub-pixels SP1 to SP3. For this purpose, the dam 180 can be formed on the second organic layer 160 to expose a portion of each first light-emitting electrode 171. The dam 180 can cover the edge of each first light-emitting electrode 171. The first light-emitting electrode 171 can be disposed in contact holes penetrating the second organic layer 160. The dam 180 can be an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0092] A light-emitting layer 172 is formed on the first light-emitting electrode 171 and the embankment 180. The light-emitting layer 172 may be a common layer shared by sub-pixels SP1 to SP3. The light-emitting layer 172 may include organic materials to emit light of a predetermined color. For example, the light-emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. The organic material layer may include a matrix and dopants. The organic material layer may include a material that emits the predetermined light and may be formed using phosphorescent or fluorescent materials.

[0093] The second light-emitting electrode 173 is formed on the light-emitting layer 172. The second light-emitting electrode 173 may be formed to cover the light-emitting layer 172. The second light-emitting electrode 173 may be a common layer shared by sub-pixels SP1 to SP3. For example, a cover layer may be formed on the second light-emitting electrode 173.

[0094] In the bottom emitting structure, the second light-emitting electrode 173 may include a conductive material that reflects light. For example, the second light-emitting electrode 173 may be a single layer of, for example, molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or may have, for example, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and indium tin oxide (ITO / APC / ITO) to increase reflectivity. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0095] Since the first light-emitting electrode 171 is made of a transparent conductive oxide (TCO) capable of transmitting light or of a semi-transparent conductive material, and the second light-emitting electrode 173 is made of an opaque metallic material with high reflectivity, the light from the light-emitting layer 172 can be emitted toward the first substrate SUB1. For example, each of the light-emitting elements 170 may have a bottom-emitting structure that emits light downwards.

[0096] An encapsulation layer 190 is formed on the light-emitting element layer EML. The encapsulation layer 190 prevents oxygen or moisture from penetrating into the light-emitting layer 172 and the second light-emitting electrode 173. For example, the encapsulation layer 190 may include at least one inorganic layer. The inorganic layer may be made of, for example, silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, and / or titanium oxide. Additionally, the encapsulation layer 190 may also include at least one organic layer. The organic layer may be formed to a sufficient thickness to prevent particles from penetrating the encapsulation layer 190 and subsequently entering the light-emitting layer 172 and the second light-emitting electrode 173. The organic layer may include at least one of epoxy resin, acrylate, and urethane acrylate.

[0097] The filler FL can be disposed between the encapsulation layer 190 and the second substrate SUB2 (see example). Figure 3 The filler FL can be made of a material with cushioning properties. For example, the filler FL can be an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0098] Additionally, the sealing material SEAL (see example) used for joining the first substrate SUB1 and the second substrate SUB2 Figure 9The filler FL can be positioned between the first substrate SUB1 and the second substrate SUB2. When viewed in a plan view, the filler FL can be surrounded by the sealing material SEAL. The sealing material SEAL can be, for example, glass frit or a sealant.

[0099] Figure 5 This is a perspective view of a display device 10 according to an exemplary embodiment of the present invention. Figure 6 This is a plan view showing an example of a hemispherical lens 210' of a lens array 200' and a pixel PX.

[0100] Figure 5 and Figure 6 Implementation examples and Figure 1 and Figure 2 The embodiment differs in that each lens 210' of the lens array 200' is a hemispherical lens, rather than a biconvex lens. Figure 5 and Figure 6 In the middle, the part with can be omitted. Figure 1 and Figure 2 The embodiments contain redundant descriptions of the same elements and features.

[0101] Reference Figure 5 and Figure 6 Each of the lenses 210' can be a hemispherical lens or a semi-ellipsoidal lens. The lenses 210' can be arranged in the first direction DR1 and the second direction DR2.

[0102] In each of the lenses 210', three sub-pixels SP1 to SP3 can be arranged in the first direction DR1. The first sub-pixel SP1 can be positioned adjacent to a first side of each lens 210'. The second sub-pixel SP2 can be positioned in the middle of each lens 210', and the third sub-pixel SP3 can be positioned adjacent to a second side of each lens 210'. For example, the second sub-pixel SP2 can be positioned between the first sub-pixel SP1 and the third sub-pixel SP3. For example, as... Figure 6 As shown, a first side of each lens 210' can indicate the left side of the lens 210', and a second side of each lens 210' can indicate the right side of the lens 210'.

[0103] When each of the lenses 210' is a hemispherical lens, the pitch PIT1 of the lens 210' in the first direction DR1 can be substantially equal to the pitch PIT2 of the lens 210' in the second direction DR2. When each of the lenses 210' is a semi-ellipsoidal lens, the pitch PIT1 of the lens 210' in the first direction DR1 can be different from the pitch PIT2 of the lens 210' in the second direction DR2.

[0104] and Figure 3The situation is similar to that shown, where each of the lenses 210' can provide the viewpoint image displayed by sub-pixels SP1 to SP3 to different viewpoint regions V1 to V3 in front of the display device 10, since it has been referenced Figure 3 It will not be described in detail.

[0105] Figure 7 This is a flowchart illustrating a method for manufacturing a display device 10 according to an exemplary embodiment of the present invention. Figure 8 , Figure 9 and Figure 10 It is shown Figure 7 A view of the method for manufacturing the display device 10.

[0106] Now refer to Figures 7 to 10 A method for manufacturing the display device 10 is described in detail.

[0107] First, the laser device LD illuminates a predetermined position on the lens array substrate 201 with a laser beam. Figure 7 Operation S110).

[0108] Reference Figure 8 The lens array substrate 201 can be a substrate used to manufacture a lens array 200 comprising a plurality of lenses 210. For example, the lens array substrate 201 can be made of glass.

[0109] The laser device LD can be moved to a predetermined position and illuminate the lens array substrate 201 with a laser beam. For example, the laser beam illuminated by the laser device LD can be a femtosecond laser. See below for further details. Figure 11 and Figure 12 Describe the laser irradiation position of the laser device LD.

[0110] When the laser device LD irradiates the lens array substrate 201 with laser light, the bonds between silicon (Si) and oxygen (O) in the glass can break, causing a change from SiO2 bonds to SiO bonds. Therefore, the physical properties of the glass in some regions of the lens array substrate 201 that have been irradiated by the laser device LD can differ from the physical properties of the glass in other regions that have not been irradiated by the laser. Figure 8 In the diagram, for ease of explanation, dashed lines CA represent regions where the physical properties of the glass have been altered by the laser irradiated by the laser device LD.

[0111] Second, a first substrate SUB1 is formed on the first surface of the lens array substrate 201, and sub-pixels SP1 to SP3, including thin-film transistor ST and light-emitting element 170, are formed on the first substrate SUB1. Figure 7 Operation S120).

[0112] Reference Figure 9 Organic polymer materials, such as polyimide, can be deposited on the first surface of the lens array substrate 201 to form the first substrate SUB1. Alternatively, instead of depositing polyimide, another organic polymer material, such as polyethylene, polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, and / or polyester, can be deposited on the first surface of the lens array substrate 201 to form the first substrate SUB1.

[0113] The first substrate SUB1 can be fixed to the first surface of the lens array substrate 201 without the use of a separate adhesive member. The first substrate SUB1 can directly contact the first surface of the lens array substrate 201.

[0114] Subpixels SP1 to SP3 can be formed on the first surface of the first substrate SUB1. For example... Figure 4 As shown, sub-pixels SP1 to SP3 may each include emission regions EA1 to EA3 and emission drivers ED1 to ED3. In each of the emission regions EA1 to EA3, a light-emitting element comprising a first light-emitting electrode 171, a light-emitting layer 172, and a second light-emitting electrode 173 may be provided. At least one thin-film transistor ST may be provided in each of the emission drivers ED1 to ED3.

[0115] Next, as Figure 4 As shown, an encapsulation layer 190 is formed to encapsulate sub-pixels SP1 to SP3. Additionally, as... Figure 9 As shown, a filler FL is formed on the encapsulation layer 190, and the first substrate SUB1 and the second substrate SUB2 are bonded by a sealing material SEAL. For example, the sealing material SEAL can be a glass frit or a sealant.

[0116] Third, the second surface of the lens array substrate 201, which is opposite to the first surface of the lens array substrate 201, is etched to form a lens array 200 including lens 210. Figure 7 Operation S130).

[0117] Reference Figure 10 The lens array substrate 201 is wet-etched using an etchant such as hydrofluoric acid (an aqueous solution of dissolved hydrogen fluoride (HF)). In some regions of the lens array substrate 201, the physical properties of the glass have been altered by the laser irradiation from the laser device LD. In regions where the physical properties of the glass have been altered by the laser, the glass may have SiO bonds, and in regions where the physical properties of the glass have not been altered due to lack of laser irradiation, the glass may have SiO2 bonds.

[0118] When the glass has SiO bonds, the etching rate of hydrofluoric acid within a predetermined time period can be higher than that when the glass has SiO2 bonds. Here, the etching rate of the glass can decrease as the distance from the region containing SiO bonds increases. Each region of the lens array substrate 201 irradiated by the laser device LD can be the boundary between lenses 210. For example... Figure 10 As shown, a lens array 200 including a lens 210 can be formed from a lens array substrate 201, the cross section of which is curved outward from the first substrate SUB1.

[0119] like Figures 7 to 10 As shown, in order to form a lens 210 using a lens array substrate 201, a lens array 200 including the lens 210 can be formed by irradiating a predetermined location on the lens array substrate 201 with a laser and then wet etching the lens array substrate 201 using an etchant such as hydrofluoric acid. For example, the lens array 200 including the lens 210 can be formed by applying a laser-induced deep etching (LIDE) technique to the lens array substrate 201. Therefore, the other surface (e.g., the second surface) of the first substrate SUB1 can be fixed to the lens 210 without the use of a separate adhesive member. Furthermore, it is not necessary to align and attach the lens array 200 to the first substrate SUB1.

[0120] Furthermore, since the lens array substrate 201 supports the display panel 100 during the manufacturing process, a separate carrier substrate or support substrate is not required.

[0121] exist Figures 7 to 10 In this process, after a laser beam is applied to the lens array substrate 201, a first substrate SUB1 and sub-pixels SP1 to SP3, including a thin-film transistor ST and a light-emitting element 170, are formed on the first surface of the lens array substrate 201, and then the lens array substrate 201 is wet-etched. However, the inventive concept is not limited thereto. For example, after the sub-pixels SP1 to SP3, including a thin-film transistor ST and a light-emitting element 170, are formed on the first surface of the lens array substrate 201, a laser beam can be applied to the lens array substrate 201, and then the lens array substrate 201 can be wet-etched.

[0122] Figure 11 An example laser irradiation position is shown when a biconvex lens array is formed on the surface of the lens array substrate 201.

[0123] Reference Figure 11When each lens 210 to be formed using the lens array substrate 201 is a biconvex lens, the laser device LD can irradiate the lens array substrate 201 with laser light along multiple first lens lines LL1. Each first lens line LL1 can be a boundary between the lenses 210 to be formed using the lens array substrate 201. For example, each first lens line LL1 can be formed between adjacent lenses 210. Since the boundary between the lenses 210 to be formed in the lens array substrate 201 extends in the fourth direction DR4, each first lens line LL1 can extend in the fourth direction DR4. In addition, since the lenses 210 to be formed in the lens array substrate 201 are arranged in a fifth direction DR5 intersecting the first direction DR1 (see example...), Figure 2 Therefore, the gap between adjacent first lens lines LL1 in the fifth direction DR5 can be substantially equal to the pitch PIT of each lens 210.

[0124] Figure 12 An example laser irradiation position is shown when a hemispherical lens array is formed on the surface of the lens array substrate 201.

[0125] Reference Figure 12 When each lens 210 to be formed using the lens array substrate 201 is a hemispherical lens or a semi-ellipsoidal lens, the laser device LD can irradiate the lens array substrate 201 with laser light along each first lens line LL1. Each first lens line LL1 can be an edge or circumference of the lens 210 to be formed in the lens array substrate 201. Therefore, when the lens 210 to be formed using the lens array substrate 201 is a hemispherical lens, the first lens line LL1 can have a circular planar shape. Alternatively, when the lens 210 to be formed using the lens array substrate 201 is a semi-ellipsoidal lens, the first lens line LL1 can have an elliptical planar shape.

[0126] In the display device and method of manufacturing the display device according to exemplary embodiments of the present invention, in order to form a lens using a lens array substrate, a laser is irradiated onto a predetermined position on the lens array substrate using a laser device. Then, the lens array substrate is wet-etched using an etchant such as hydrofluoric acid to form a lens array including the lens. Therefore, the lens can be fixed to the display panel without the use of a separate adhesive member. Furthermore, it is not necessary to align and attach the lens array to the display panel.

[0127] Furthermore, in the display device and method of manufacturing the display device according to exemplary embodiments of the present invention, the lens array substrate can support the display panel during the manufacturing process. Therefore, a separate carrier substrate or support substrate is not required.

[0128] Although the inventive concept has been described with reference to exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made to the inventive concept without departing from its spirit and scope.

Claims

1. A display device, wherein, The display device includes: First base; A thin-film transistor disposed on a first surface of the first substrate; A plurality of light-emitting elements, each connected to a corresponding thin-film transistor in the thin-film transistor, and disposed on the thin-film transistor; and A lens array comprising a plurality of lenses disposed on a second surface of the first substrate opposite to the first surface of the first substrate. The plurality of light-emitting elements emit light toward the first substrate. When viewed in a planar view, one of the plurality of lenses overlaps with N of the plurality of light-emitting elements, where N is an integer greater than or equal to 2.

2. The display device according to claim 1, wherein, The lens array contacts the second surface of the first substrate.

3. The display device according to claim 2, wherein, The first substrate comprises a polymer resin.

4. The display device according to claim 1, wherein, The lens array comprises glass.

5. The display device according to claim 1, wherein, Each of the plurality of light-emitting elements includes: A first light-emitting electrode is connected to one of the thin-film transistors; A light-emitting layer, wherein the light-emitting layer is disposed on the first light-emitting electrode; and The second light-emitting electrode is disposed on the light-emitting layer. The first light-emitting electrode comprises a conductive material that transmits light, and the second light-emitting electrode comprises a conductive material that reflects light.

6. The display device according to claim 5, wherein, The display device further includes a second substrate, which is disposed on the second light-emitting electrode.

7. The display device according to claim 1, wherein, Each of the plurality of lenses has a semi-cylindrical or hemispherical shape.

8. The display device according to claim 1, wherein, Each of the plurality of lenses bends outward from the second surface of the first substrate.

9. A method of manufacturing a display device as claimed in any one of claims 1 to 8, wherein, The method includes: The laser is directed at a predetermined location on the lens array substrate; The first substrate is formed on the first surface of the lens array substrate; The thin-film transistor and the plurality of light-emitting elements are formed on the first surface of the first substrate; and The lens array is formed by etching a second surface of the lens array substrate opposite to the first surface of the lens array substrate, wherein the lens array includes the plurality of lenses.

10. The method according to claim 9, wherein, The physical properties of the lens array substrate at the predetermined position are different from the physical properties of the lens array substrate in the region of the lens array substrate other than the predetermined position.

11. The method according to claim 10, wherein, The lens array substrate is made of glass.

12. The method according to claim 11, wherein, The lens array substrate includes SiO bonds at the predetermined location and SiO2 bonds in the region of the lens array substrate other than the predetermined location.

13. The method according to claim 9, wherein, The step of irradiating the lens array substrate with the laser includes irradiating the laser along a first lens line extending in a first direction.

14. The method according to claim 13, wherein, The gap between adjacent first lens lines in the second direction is equal to the pitch of each lens in the second direction, which intersects the first direction.

15. The method according to claim 13, wherein, At least one of the first lens lines corresponds to the boundary between adjacent lenses.

16. The method according to claim 13, wherein, Each of the plurality of lenses is a biconvex lens extending in the first direction.

17. The method according to claim 9, wherein, The step of irradiating the lens array substrate with the laser includes irradiating the laser along a first lens line having a circular or elliptical shape.

18. The method according to claim 9, wherein, The process of forming the lens array by etching the second surface of the lens array substrate includes: etching the second surface of the lens array substrate using a hydrofluoric acid wet etching process.

19. The method according to claim 9, wherein, The lens array contacts the second surface of the first substrate.

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