Force sensor, display device including the same, and method for driving the force sensor

Abstract

A force sensor, a display device including the same, and a method of driving the force sensor are provided. The force sensor includes: first and second base substrates facing each other; first force sensor electrodes extending in a first direction on the first base substrate and arranged in a second direction crossing the first direction; second force sensor electrodes extending in the second direction on the second base substrate and arranged in the first direction; and a sensor hole configured to transmit light. Any one of the first force sensor electrodes includes a first sub force sensor electrode disposed on a first side of the sensor hole and a second sub force sensor electrode disposed on a second side of the sensor hole opposite the first side.

Description

Technical Field

[0001] Exemplary embodiments of the invention generally relate to a force sensor, a display device including the force sensor, and a method of driving the force sensor. Background Art

[0002] Display devices are devices that display images and are used not only in televisions and monitors but also in portable smartphones, tablet personal computers (PCs), and the like. In the case of portable display devices, various functions are included in the display device. For example, a camera and a fingerprint sensor may be included in the display device.

[0003] With the healthcare industry gaining recent attention, methods have been developed to more easily obtain biometric information related to health. For example, attempts have been made to replace traditional blood pressure measurement devices, such as oscillometric devices, with portable blood pressure measurement devices. However, portable blood pressure measurement devices require a separate light source, sensor, and display, and require separate transportation in addition to a portable smartphone or tablet PC, which is inconvenient.

[0004] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0005] Devices constructed in accordance with exemplary embodiments of the invention are capable of sensing force.

[0006] According to one or more embodiments of the present invention, a display device can measure blood pressure using a force sensor capable of sensing force.

[0007] Exemplary embodiments also provide a method of driving a force sensor capable of sensing force.

[0008] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0009] A force sensor according to an exemplary embodiment includes: a first base substrate and a second base substrate facing each other; a first force sensor electrode extending in a first direction on the first base substrate and arranged in a second direction intersecting the first direction; a second force sensor electrode extending in a second direction on the second base substrate and arranged in the first direction; and a sensor hole configured to transmit light. Each of the first force sensor electrodes includes a first sub-force sensor electrode disposed on a first side of the sensor hole and a second sub-force sensor electrode disposed on a second side of the sensor hole opposite the first side.

[0010] A display device according to an exemplary embodiment includes: a display panel including a display area having pixels configured to display an image; a force sensor provided on one surface of the display panel to sense a force applied from the outside and including a sensor hole that transmits light in a thickness direction of the display panel; and an optical sensor provided to overlap the sensor hole in the thickness direction of the display panel and configured to sense light incident through the sensor hole.

[0011] A method of driving a force sensor capable of sensing force according to an exemplary embodiment includes: applying a driving signal to a first force sensor electrode and detecting a sensing signal from a second force sensor electrode; analyzing the sensing signals to respectively calculate force values ​​of force sensing units disposed in intersection areas of the first force sensor electrode and the second force sensor electrode; and calculating a force value of a sensor hole using the force values ​​of the force sensing units.

[0012] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0014] Figure 1 is a schematic perspective view showing a display device according to an exemplary embodiment of the invention;

[0015] Figure 2 is an exploded perspective view showing a display device according to an exemplary embodiment of the invention;

[0016] Figure 3 is a plan view showing a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to an exemplary embodiment of the invention;

[0017] Figure 4 is a schematic perspective view showing a display device for measuring blood pressure according to an exemplary embodiment of the invention;

[0018] Figure 5 is a flowchart illustrating a method of measuring blood pressure through a display device according to an exemplary embodiment of the invention;

[0019] Figure 6 is a cross-sectional view illustrating a cover window, a display panel, a force sensor, a bottom panel cover, a light emitting unit, and an optical sensor according to an exemplary embodiment of the invention;

[0020] Figure 7is a layout diagram showing a display area and through holes of a display panel according to an exemplary embodiment of the invention;

[0021] Figure 8 It shows Figure 7 A cross-sectional view of an example of a display panel;

[0022] Figure 9 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to an exemplary embodiment of the invention;

[0023] Figure 10 and Figure 11 It shows Figure 9 A cross-sectional view of an example of a force sensor;

[0024] Figure 12 It shows Figure 9 A cross-sectional view of another example of a force sensor;

[0025] Figure 13 and Figure 14 It shows Figure 9 A cross-sectional view of yet another example of a force sensor;

[0026] Figure 15 and Figure 16 It shows Figure 9 A cross-sectional view of yet another example of a force sensor;

[0027] Figure 17 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment of the invention;

[0028] Figure 18 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment of the invention;

[0029] Figure 19 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment of the invention;

[0030] Figure 20 is a plan view showing a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to another embodiment of the invention;

[0031] Figure 21 is a cross-sectional view showing a cover window, a display panel, a force sensor, a bottom panel cover, a light emitting unit, and an optical sensor according to yet another embodiment of the invention;

[0032] Figure 22A and Figure 22B is a layout diagram showing a main display area and a sub-display area of ​​a display panel according to an exemplary embodiment of the invention;

[0033] Figure 23 It shows Figure 22B A cross-sectional view of an example of a display panel;

[0034] Figure 24 is a plan view showing a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to another embodiment of the invention;

[0035] Figure 25 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment of the invention;

[0036] Figure 26 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment of the invention;

[0037] Figure 27 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment of the invention;

[0038] Figure 28 is a plan view showing a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to another embodiment of the invention;

[0039] Figure 29 is a flowchart illustrating a method of calculating a force value of a sensor hole formed in a force sensor according to an exemplary embodiment of the invention;

[0040] Figure 30 and Figure 31 is an exemplary graph showing force values ​​sensed in a force sensing unit of a force sensor according to the presence or absence of a sensor hole; and

[0041] Figure 32 is a graph illustrating an example of a ratio of a force value of a sensor hole to a sum of force values ​​of the force sensor according to an amount of force applied to the force sensor according to an exemplary embodiment of the invention. DETAILED DESCRIPTION

[0042] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of the various exemplary embodiments or implementations of the invention. As used herein, "embodiment" and "implementation" are interchangeable words, which are non-limiting examples of devices or methods using one or more inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be put into practice without these specific details or with one or more equivalent arrangements. In other examples, well-known structures and devices are shown in block diagram form to avoid unnecessarily blurring the various exemplary embodiments. In addition, various exemplary embodiments can be different, but do not have to be exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment can be used or implemented in another exemplary embodiment.

[0043] Unless otherwise specified, the exemplary embodiments shown will be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter, individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0044] The use of cross hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. As such, unless otherwise indicated, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, ratio, commonality between the illustrated elements, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two successively described processes may be performed substantially simultaneously or in an order opposite to the order described. In addition, like reference numerals represent like elements.

[0045] When an element or layer is referred to as being "on" another element or layer, "connected to" or "bound to" another element or layer, it may be directly on, directly connected to or directly bound to the other element or layer, or there may be intermediate elements or layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly bound to" another element or layer, there are no intermediate elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection and / or a fluid connection with or without intermediate elements. In addition, the D1 axis, the D2 axis and the D3 axis are not limited to the three axes of a rectangular coordinate system (such as the x-axis, the y-axis and the z-axis) and may be interpreted in a broader sense. For example, the D1 axis, the D2 axis and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as for example XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0046] Although the terms "first," "second," etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be referred to as a second element without departing from the teachings of the disclosure.

[0047] For descriptive purposes, spatially relative terms such as "under," "beneath," "beneath," "lower," "above," "upper," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein to describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the drawings is turned over, elements described as "under" or "beneath" other elements or features would then be positioned "above" the other elements or features. Thus, the exemplary term "under" can encompass both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein should be interpreted accordingly.

[0048] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the use of the terms "including," "containing," or "comprising" in this specification is not intended to be construed so as to imply that the stated features, integers, steps, components, or elements are essential to the present disclosure, but rather to allow for the possibility that one or more features, integers, steps, components, or elements can be added or not present. It is also noted that, as used herein, the terms "substantial," "approximately," and other similar terms are used as synonyms for "about," and are not intended to be construed as degrees of exactitude.

[0049] Various example embodiments are described herein with reference to cross-sectional and / or exploded illustrations that are schematic illustrations of idealized embodiments and / or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, the example embodiments disclosed herein are not to be construed as being limited to the particular shapes of regions as illustrated and described herein but are to include deviations in shapes that result from, for example, manufacturing. In this manner, regions illustrated in the figures can have originally defined shapes such as oval, cuboid, rectangular, truncated, etc., and can become altered through manufacturing techniques into regions having altered shapes such as rounded, polygonal, irregular, irregularly shaped, etc.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0051] Figure 1 FIG. 1 is a schematic perspective view showing a display device according to an example embodiment. Figure 2 FIG. 2 is an exploded perspective view showing a display device according to an example embodiment.

[0052] Referring to Figure 1 and Figure 2, the display device 10 according to the exemplary embodiment can be applied to portable electronic devices such as mobile phones, smart phones, tablet personal computers, mobile communication terminals, electronic notepads, electronic books, portable multimedia players (PMPs), navigation systems, ultra-mobile PCs (UMPCs), etc. Optionally, the display device 10 according to the exemplary embodiment can be applied as a display unit of a television, a laptop computer, a monitor, a billboard, or an Internet of Things (IoT) terminal. Optionally, the display device 10 according to the exemplary embodiment can be applied to wearable devices such as smart watches, watch phones, glasses-type displays, or head-mounted displays (HMDs). Optionally, the display device 10 according to the exemplary embodiment can be applied to a dashboard of a vehicle, a central instrument panel of a vehicle, a central information display (CID) set on the dashboard of a vehicle, a room mirror display instead of a side mirror of a vehicle, or a display for rear-seat entertainment of a vehicle set on the rear surface of a front seat.

[0053] In the inventive concept, the first direction (X-axis direction) may be the short side direction of the display device 10, for example, the horizontal direction of the display device 10. The second direction (Y-axis direction) may be the long side direction of the display device 10, for example, the vertical direction of the display device 10. The third direction (Z-axis direction) may be the thickness direction of the display device 10.

[0054] The display device 10 may have a planar shape similar to a rectangular shape. Figure 1 As shown in , the display device 10 may have a planar shape similar to a rectangular shape having short sides along a first direction (X-axis direction) and long sides along a second direction (Y-axis direction). The corners where the short sides along the first direction (X-axis direction) and the long sides along the second direction (Y-axis direction) meet may be rounded to have a predetermined curvature or may be right angles. The planar shape of the display device 10 is not limited to a rectangular shape and may be formed in a shape similar to other polygonal shapes, a circular shape, or an elliptical shape.

[0055] The display device 10 may be formed to be flat. Alternatively, the display device 10 may be formed so that two opposing sides are bendable. For example, the display device 10 may be formed so that the left and right sides are bendable. Alternatively, the display device 10 may be formed so that all of the upper side, lower side, left side, and right side are bendable.

[0056] The display device 10 according to an exemplary embodiment includes a cover window 100 , a display panel 300 , a display circuit board 310 , a display driving circuit 320 , a force sensor 400 , a bracket 600 , a main circuit board 700 , an optical sensor 740 , and a lower cover 900 .

[0057] The cover window 100 may be disposed above the display panel 300 to cover the front surface of the display panel 300. Thus, the cover window 100 may be configured to protect the front surface of the display panel 300.

[0058] The cover window 100 may include a light-transmitting portion DA100 corresponding to the display panel 300 and a light-blocking portion NDA100 corresponding to an area other than the display panel 300. The light-blocking portion NDA100 may be formed opaquely. Alternatively, the light-blocking portion NDA100 may be formed as a decorative layer having a pattern that can be displayed to the user when no image is displayed.

[0059] The display panel 300 may be disposed under the cover window 100. The display panel 300 may include a display area DA and a non-display area NDA ( Figure 3 The display area DA may be a region including pixels displaying an image, and the non-display area NDA may be a region as a peripheral region of the display area DA in which no image is displayed. The non-display area NDA may not include pixels. Figure 3 As shown in FIG, the non-display area NDA may be disposed to surround the display area DA, but is not limited thereto. The display area DA may occupy most of the area of ​​the display panel 300.

[0060] The display panel 300 may include a through hole TH. The through hole TH may be a hole penetrating the display panel 300. The through hole TH may be arranged to be surrounded by the display area DA.

[0061] The through hole TH may overlap with the sensor hole SH corresponding to the force sensor 400, the bracket hole BTH of the bracket 600, and the optical sensor 740 in the third direction (Z-axis direction). Therefore, light passing through the through hole TH of the display panel 300 may be incident on the optical sensor 740 through the sensor hole SH and the bracket hole BTH. Therefore, although the optical sensor 740 is disposed below the display panel 300, the optical sensor 740 may sense light incident from the front surface of the display device 10.

[0062] in addition, Figure 2 The display panel 300 is shown as including one through hole TH, but the number of through holes TH is not limited thereto. A plurality of through holes TH may be provided at different positions on the display panel 300. When the display panel 300 includes a plurality of through holes TH, one of the through holes TH may overlap with the sensor hole SH, the bracket hole BTH, and the optical sensor 740 in the third direction (Z-axis direction). The other through holes TH may overlap with other sensor holes, other bracket holes, and sensor units other than the optical sensor 740. The sensor unit may be a proximity sensor, an illumination sensor, or a front camera sensor.

[0063] The display panel 300 may be a light-emitting display panel including a light-emitting element. For example, the display panel 300 may be an organic light-emitting display panel using an organic light-emitting diode including an organic light-emitting layer, a micro light-emitting diode display panel using micro-LEDs, a quantum dot light-emitting display panel using a quantum dot light-emitting diode including a quantum dot light-emitting layer, or an inorganic light-emitting display panel using an inorganic light-emitting element including an inorganic semiconductor. Hereinafter, the case where the display panel 300 is an organic light-emitting display panel will be mainly described.

[0064] In addition, the display panel 300 may include a touch electrode layer having a touch electrode configured to sense an object such as a human finger, a pen, etc. In this case, the touch electrode layer may be provided on the display layer in which pixels displaying an image are arranged. Figure 8 The display layer and the touch electrode layer are described in detail.

[0065] The display circuit board 310 and the display driving circuit 320 may be attached to one side of the display panel 300. The display circuit board 310 may be a bendable flexible printed circuit board, a strong, almost unbending rigid printed circuit board, or a composite printed circuit board having both a rigid printed circuit board and a flexible printed circuit board.

[0066] The display driver circuit 320 may receive a control signal and a power voltage through the display circuit board 310 to generate and output a signal and a voltage configured to drive the display panel 300. The display driver circuit 320 may be formed by an integrated circuit (IC) attached to the display panel 300 by a chip on glass (COG) method, a chip on plastic (COP) method, or an ultrasonic bonding method, but the inventive concept is not limited thereto. For example, the display driver circuit 320 may be attached to the display circuit board 310.

[0067] The touch drive circuit 330 and the force drive circuit 340 may be provided on the display circuit board 310. Each of the touch drive circuit 330 and the force drive circuit 340 may be formed of an IC attached to the top surface of the display circuit board 310. Alternatively, in some cases, the touch drive circuit 330 and the force drive circuit 340 may be integrally formed into one IC.

[0068] The touch driving circuit 330 may be electrically connected to the touch electrodes of the touch electrode layer of the display panel 300 through the display circuit board 310. The touch driving circuit 330 may output a touch driving signal to the touch electrodes and sense a voltage charged in the capacitance of the touch electrodes.

[0069] The touch drive circuit 330 can generate touch data based on the changes in the electrical signals sensed at each touch electrode, and transmit the touch data to the main processor 710. The main processor 710 can then analyze the touch data to generate touch coordinates. Touch can include contact touch and proximity touch. Contact touch means that an object such as a human finger or a pen is in direct contact with the cover window 100 disposed above the touch electrode layer. Proximity touch means that an object such as a human finger or a pen is positioned above the cover window 100 and is separated from it closely (such as hovering).

[0070] The force driving circuit 340 may detect electrical signals from the force sensor electrodes of the force sensor 400, convert the detected signals into force data, and transmit the force data to the main processor 710. The main processor 710 may determine whether a force has been applied to the force sensor 400, and may calculate the magnitude of the force applied to the force sensor 400 based on the force data.

[0071] Furthermore, a power supply unit may be additionally provided on the display circuit board 310 to supply a display driving voltage configured to drive the display driving circuit 320 .

[0072] The force sensor 400 may be disposed so as to overlap the display area DA of the display panel 300 in the third direction (Z-axis direction). The force sensor 400 may be disposed on one surface of the display panel 300. For example, the force sensor 400 may be disposed on the bottom surface of the display panel 300. In this case, the top surface of the force sensor 400 may be attached to the bottom surface of the display panel 300 via a transparent adhesive member. Figure 2 The force sensor 400 is shown to be disposed on the bottom surface of the display panel 300 , but the inventive concept is not limited thereto. The force sensor 400 may be disposed on the bottom surface of the bracket 600 .

[0073] The bracket 600 may be disposed below the display panel 300. The bracket 600 may include plastic, metal, or both plastic and metal. The bracket 600 may include a first camera hole CMH1 into which the first camera sensor 720 is inserted, a battery hole BH in which the battery 790 is disposed, a cable hole CAH through which the cable 314 connected to the display circuit board 310 passes, and a bracket hole BTH overlapping with the optical sensor 740 in the third direction (Z-axis direction). In this case, the optical sensor 740 may be arranged in the bracket hole BTH. Alternatively, the bracket 600 may not include the bracket hole BTH, and in this case, the bracket 600 may be formed so as not to overlap with the through hole TH of the display panel 300.

[0074] The main circuit board 700 and the battery 790 may be disposed under the bracket 600. The main circuit board 700 may be a printed circuit board or a flexible printed circuit board.

[0075] The main circuit board 700 may include a main processor 710, a first camera sensor 720, a main connector 730, and an optical sensor 740. The first camera sensor 720 may be provided on both the top and bottom surfaces of the main circuit board 700, the main processor 710 may be provided on the bottom surface of the main circuit board 700, and the main connector 730 may be provided on the bottom surface of the main circuit board 700. The optical sensor 740 may be provided on the top surface of the main circuit board 700.

[0076] The main processor 710 can control all functions of the display device 10. For example, the main processor 710 can output digital video data to the display driver circuit 320 via the display circuit board 310, causing the display panel 300 to display an image. Furthermore, the main processor 710 can receive touch data from the touch driver circuit 330, determine the user's touch coordinates, and then execute an application indicated by an icon displayed at the user's touch coordinates. Furthermore, the main processor 710 can convert first image data input from the first camera sensor 720 into digital video data and output the digital video data to the display driver circuit 320 via the display circuit board 310, thereby displaying the image captured by the first camera sensor 720 on the display panel 300. Furthermore, the main processor 710 can determine the user's blood pressure based on the sensor signal input from the optical sensor 740.

[0077] The first camera sensor 720 may process image frames of still images or videos obtained by the image sensor and output the image frames to the main processor 710. The first camera sensor 720 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) sensor. The first camera sensor 720 may be exposed to the bottom surface of the lower cover 900 through the second camera hole CMH2 to capture an image of a background or object disposed below the display device 10.

[0078] The cable 314 passing through the cable hole CAH of the bracket 600 may be connected to the main connector 730. Thus, the main circuit board 700 may be electrically connected to the display circuit board 310.

[0079] The optical sensor 740 may include a light receiving element capable of sensing light incident through the through hole TH. In this case, the light receiving element may be a photodiode or a phototransistor. For example, the optical sensor 740 may be a CMOS image sensor or a CCD sensor capable of sensing light. The optical sensor 740 may output an optical signal to the main processor 710 based on the amount of light reflected from an object disposed above the through hole TH. The main processor 710 may generate a pulse wave signal based on the optical signal, and the pulse wave signal reflects changes in blood flow based on heartbeats. The main processor 710 may measure the user's blood pressure based on the pulse wave signal. This will be referred to later. Figure 4 and Figure 5 A method of measuring a person's blood pressure using optical sensor 740 is described.

[0080] The battery 790 may be disposed so as not to overlap the main circuit board 700 in the third direction (Z-axis direction). The battery 790 may overlap the battery hole BH of the bracket 600.

[0081] In addition, the main circuit board 700 may also be equipped with a mobile communication module capable of transmitting and receiving radio signals with at least one of a base station in a mobile communication network, an external terminal, and a server. The wireless signals may include various types of data, such as voice signals, video call signals, or text / multimedia messages.

[0082] The lower cover 900 may be provided below the main circuit board 700 and the battery 790. The lower cover 900 may be fixed by being fastened to the bracket 600. The lower cover 900 may form the appearance of the bottom surface of the display device 10. The lower cover 900 may include plastic, metal, or both plastic and metal.

[0083] A second camera hole CMH2 exposing the bottom surface of the first camera sensor 720 may be formed in the lower cover 900. The position of the first camera sensor 720 and the positions of the first and second camera holes CMH1 and CMH2 corresponding to the first camera sensor 720 are not limited to Figure 2 The embodiment shown in .

[0084] Figure 3 is a plan view illustrating a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to an exemplary embodiment.

[0085] Reference Figure 3 The display panel 300 may be a rigid display panel that is not easily bent or a flexible display panel that is easily bent, folded, or rolled up. For example, the display panel 300 may be a foldable display panel that can be folded and unfolded, a curved display panel having a curved display surface, a curved display panel having a curved area other than the display surface, a rollable display panel that can be rolled up and unrolled, and a stretchable display panel that can be stretched.

[0086] In addition, the display panel 300 may be a transparent display panel that is transparently implemented to allow an object or background disposed behind the rear surface of the display panel 300 to be viewed from the front surface of the display panel 300. In addition, the display panel 300 may be a reflective display panel that is capable of reflecting an object or background located in front of the front surface of the display panel 300.

[0087] The display panel 300 may include a main area MA and a sub-area SBA protruding from one side of the main area MA. The main area MA may include a display area DA that displays an image and a non-display area NDA that is a peripheral area of ​​the display area DA. The display area DA may occupy most of the main area MA. The display area DA may be located at the center of the main area MA. The non-display area NDA may be an area outside the display area DA. The non-display area NDA may be defined as an edge area of ​​the display panel 300.

[0088] The display panel 300 may include a through hole TH. The through hole TH may be a hole penetrating the display panel 300 . Figure 3 It is illustrated that the through hole TH is a hole (ie, a physically formed hole) penetrating the display panel 300 , but the inventive concept is not limited thereto.

[0089] like Figure 2 As shown in FIG, since the through hole TH overlaps with the optical sensor 740 in the third direction (Z-axis direction), light passing through the through hole TH can be incident on the optical sensor 740. Therefore, even if the optical sensor 740 is disposed to overlap with the display panel 300 in the third direction (Z-axis direction), the optical sensor 740 can sense light incident from the front surface of the display device 10. For example, the optical sensor 740 can sense light reflected from an object disposed above the through hole TH.

[0090] The through hole TH may be arranged to be surrounded by the display area DA. Alternatively, the through hole TH may be arranged to be surrounded by the non-display area NDA, or may be arranged between the display area DA and the non-display area NDA. Figure 2 It is shown that the through hole TH is disposed adjacent to the upper center of the display panel 300 , but the arrangement position of the through hole TH is not limited thereto.

[0091] The sub-area SBA may protrude from one side of the main area MA in the second direction (Y-axis direction). Figure 2 As shown in the figure, the length of the sub-area SBA in the first direction (X-axis direction) can be smaller than the length of the main area MA in the first direction (X-axis direction), and the length of the sub-area SBA in the second direction (Y-axis direction) can be smaller than the length of the main area MA in the second direction (Y-axis direction), but the inventive concept is not limited thereto. The sub-area SBA can be foldable so as to be disposed below the main area MA. In this case, the sub-area SBA can overlap with the main area MA in the third direction (Z-axis direction).

[0092] The display circuit board 310 and the display driver circuit 320 may be attached to the sub-area SBA of the display panel 300. The display circuit board 310 may be attached to the pad (also known as "pad") of the sub-area SBA of the display panel 300 using a low-resistance, high-reliability material such as anisotropic conductive film or self-assembly anisotropic conductive paste (SAP). The touch driver circuit 330 may be provided on the display circuit board 310.

[0093] Figure 4 is a schematic perspective view illustrating a display device for measuring a biometric feature such as blood pressure according to an exemplary embodiment. Figure 5 is a flowchart illustrating a method of measuring a biometric feature element such as blood pressure through a display device according to an exemplary embodiment.

[0094] Reference Figure 4 and Figure 5 When a user's body part (eg, finger OBJ) touches the front surface of the display device 10, the display device 10 may recognize that a touch has occurred. The display device 10 may recognize the user's touch using the touch electrode layer of the display panel 300 or the force sensor 400.

[0095] When the display device 10 determines that a touch has occurred, the display device 10 can operate in the blood pressure measurement mode. For example, when the user sets the blood pressure measurement mode through the program or application of the display device 10 before measuring the blood pressure, the display device 10 can perform the blood pressure measurement according to the occurrence of the touch. Optionally, the display device 10 can be configured to automatically switch to the blood pressure measurement mode after the touch occurs, without the user's additional action for mode determination. When the user touches a position other than the blood pressure measurement position, the display device 10 can operate in the touch mode. When the user touches a position corresponding to the blood pressure measurement position, the display device 10 can operate in the blood pressure measurement mode. In addition, when the user increases the touch force, the display device 10 can operate in the blood pressure measurement mode through force analysis of the force sensor 400.

[0096] In the blood pressure measurement mode, the display device 10 can measure the user's blood pressure by using both the optical sensor 740 and the force sensor 400. Figure 6As shown in , the light output from the light emitting unit 750 can be reflected from the user's finger OBJ, and the light reflected from the user's finger OBJ can pass through the through hole TH to be sensed by the optical sensor 740. Regarding body functions, when the heart contracts, the blood discharged from the left ventricle of the heart moves to the peripheral tissues, which increases the arterial blood volume. In addition, when the heart contracts, the red blood cells carry more oxygenated hemoglobin to the peripheral tissues. When the heart relaxes, the heart receives part of the blood inflow from the peripheral tissues. When light is irradiated to the peripheral blood vessels, the irradiated light is absorbed by the peripheral tissues. Light absorption depends on the hematocrit and blood volume. Light absorption can have a maximum value when the heart contracts and a minimum value when the heart relaxes. Therefore, the light sensed by the optical sensor 740 can be the lowest amount when the heart contracts and the highest amount when the heart relaxes.

[0097] Furthermore, when a user places a finger on display device 10 in blood pressure measurement mode and lifts it off, the force (contact force) applied to force sensor 400 may gradually increase to reach a maximum value and then gradually decrease. As the contact force increases, blood vessels may narrow, causing reduced or no blood flow. When the contact force decreases, blood vessels dilate, and blood can flow again. Further reductions in contact force result in even greater blood flow. Thus, changes in the amount of light sensed by optical sensor 740 may be proportional to changes in blood flow.

[0098] Based on the force value calculated by force sensor 400 and the optical signal according to the amount of light sensed by optical sensor 740, main processor 710 can generate a pulse wave signal based on the force applied by the user. Furthermore, main processor 710 can calculate blood pressure based on the pulse wave signal. The pulse wave signal can have a waveform that oscillates according to the cardiac cycle. For example, main processor 710 can estimate the blood pressure of the blood vessels of the user's finger OBJ based on the time difference between the time point corresponding to the peak of the generated pulse wave signal and the time point corresponding to the peak of the filtered pulse wave signal. Among the estimated blood pressure values, the maximum blood pressure value can be determined as the systolic blood pressure value, and the minimum blood pressure value can be determined as the diastolic blood pressure value. Furthermore, the estimated blood pressure values ​​can be used to calculate additional blood pressure values, such as an average blood pressure value. The calculated blood pressure values ​​can be displayed on display area DA of display device 10 to be provided to the user.

[0099] The above-described method of measuring blood pressure is merely exemplary, and various other methods are disclosed in Korean Patent Application Publication No. 10-2018-0076050, Korean Patent Application Publication No. 10-2017-0049280, and Korean Patent Application Publication No. 10-2019-0040527, the disclosures of which are hereby incorporated by reference as if fully set forth herein.

[0100] in addition, Figure 4 and Figure 5 The user's finger OBJ is shown as the user's body part for measuring blood pressure, but the inventive concept is not limited thereto. For example, the user's body part for measuring blood pressure may be a wrist or other body parts.

[0101] Figure 6 is a cross-sectional view illustrating a cover window, a display panel, a force sensor, a bottom panel cover, a light emitting unit, and an optical sensor according to an exemplary embodiment.

[0102] Figure 6 Shown along Figure 4 For ease of explanation, Figure 6 The lower cover 900 is omitted.

[0103] Reference Figure 6 , the display device 10 may further include a polarizing film 500 , a light emitting unit 750 , and a bottom panel cover 800 .

[0104] The force sensor 400 may be provided on one surface of the display panel 300. For example, the force sensor 400 may be provided on the bottom surface of the display panel 300. In this case, the top surface of the force sensor 400 may be attached to the bottom surface of the display panel 300 via a transparent adhesive member.

[0105] The force sensor 400 may be disposed so as to overlap the display area DA of the display panel 300 in the third direction (Z-axis direction). For example, the force sensor 400 may completely overlap the display area DA of the display panel 300 in the third direction (Z-axis direction). Alternatively, a portion of the force sensor 400 may overlap the display area DA of the display panel 300 in the third direction (Z-axis direction), and the remaining portion may overlap the non-display area NDA of the display panel 300 in the third direction (Z-axis direction).

[0106] The force sensor 400 may include a sensor hole SH. The sensor hole SH may be a light-transmitting portion that allows light to pass through. Alternatively, the sensor hole SH may be a physically formed hole (physical hole), such as a hole that penetrates the force sensor 400. Alternatively, the sensor hole SH may have a shape that is a mixture of a physical hole and a light-transmitting portion.

[0107] The through hole TH of the display panel 300 may completely overlap with the sensor hole SH of the force sensor 400. The size of the through hole TH of the display panel 300 may be smaller than the size of the sensor hole SH of the force sensor 400. The length of the through hole TH in one direction may be smaller than the length of the sensor hole SH in the one direction. For example, Figure 6As shown in FIG, the length of the through hole TH in the first direction (X-axis direction) can be smaller than the length of the sensor hole SH in the first direction (X-axis direction). In addition, the height of the through hole TH in the third direction (Z-axis direction) can be higher than the height of the sensor hole SH in the third direction (Z-axis direction). Therefore, light passing through the through hole TH can be incident on the optical sensor 740, which overlaps with the through hole TH in the third direction (Z-axis direction), without being blocked by the force sensor 400.

[0108] The polarizing film 500 may be disposed between the display panel 300 and the cover window 100. The polarizing film 500 may include a first base member, a linear polarizing plate, a quarter-wave plate (λ / 4 plate), a half-wave plate (λ / 2 plate), and a second base member. In this case, the first base member, the λ / 4 plate, the λ / 2 plate, the linear polarizing plate, and the second base member may be sequentially stacked on the display panel 300.

[0109] The bottom panel cover 800 may be provided on one surface of the force sensor 400. The bottom panel cover 800 may be attached to the bottom surface of the force sensor 400 via an adhesive member. The adhesive member may be a pressure-sensitive adhesive (PSA). The bottom panel cover 800 may include at least one of a light blocking member (not shown) configured to absorb light incident from the outside, a buffer member (not shown) configured to absorb impact from the outside, and a heat dissipation member (not shown) configured to effectively dissipate heat from the display panel 300.

[0110] A light blocking member may be provided below the force sensor 400. The light blocking member blocks light transmission, thereby preventing components disposed below the light blocking member (e.g., the display circuit board 310, etc.) from being viewed from the top of the display panel 300. The light blocking member may include a light absorbing material such as a black pigment, a black dye, etc. The light blocking member may be omitted.

[0111] A buffer member may be provided below the light blocking member. The buffer member is configured to absorb external impact to prevent damage to the display panel 300. The buffer member may be formed of a single layer or multiple layers. For example, the buffer member may be formed of a polymer resin such as polyurethane (PU), polycarbonate (PC), polypropylene (PP), or polyethylene (PE), or may include an elastic material such as a foam sponge obtained from rubber, a urethane material, or an acrylic material.

[0112] The heat dissipation member may be disposed below the buffer member. The heat dissipation member may include a first heat dissipation layer containing graphite, carbon nanotubes, etc., and a second heat dissipation layer formed of a metal thin film containing, for example, copper, nickel, ferrite, or silver that can shield electromagnetic waves and has excellent thermal conductivity.

[0113] The bottom panel cover 800 can include a cover hole CCH. The cover hole CCH can be a light transmission portion through which light can pass. Alternatively, the cover hole CCH can be a physically formed hole (a physical hole), such as a hole that penetrates the bottom panel cover 800. Alternatively, the cover hole CCH can have a shape in which a physical hole and a light transmission portion are mixed.

[0114] The through hole TH of the display panel 300 can be completely overlapped with the cover hole CCH of the bottom panel cover 800. The size of the through hole TH of the display panel 300 can be smaller than the size of the cover hole CCH of the bottom panel cover 800. The length of the through hole TH in one direction can be smaller than the length of the cover hole CCH in the one direction. For example, as shown in FIG. 10A, the length of the through hole TH in the first direction (X-axis direction) can be smaller than the length of the cover hole CCH in the first direction (X-axis direction). Figure 6

[0115] Further, the sensor hole SH of the force sensor 400 can be completely overlapped with the cover hole CCH of the bottom panel cover 800. The size of the sensor hole SH of the force sensor 400 can be smaller than the size of the cover hole CCH of the bottom panel cover 800. The length of the sensor hole SH in one direction can be smaller than the length of the cover hole CCH in the one direction. For example, as shown in FIG. 10B, the length of the sensor hole SH in the first direction (X-axis direction) can be smaller than the length of the cover hole CCH in the first direction (X-axis direction). Figure 6

[0116] The bracket 600 can be disposed on one surface of the force sensor 400. For example, the bracket 600 can be disposed on the lower surface of the force sensor 400. The bracket 600 can include a bracket hole BTH that is a physical hole penetrating the bracket 600. Alternatively, the bracket hole BTH can be a light transmission portion through which light can pass. Alternatively, the bracket hole BTH can have a shape in which a physical hole and a light transmission portion are mixed.

[0117] The through hole TH of the display panel 300 can be completely overlapped with the bracket hole BTH of the bracket 600. The size of the through hole TH of the display panel 300 can be smaller than the size of the bracket hole BTH of the bracket 600. The length of the through hole TH in one direction can be smaller than the length of the bracket hole BTH in the one direction. For example, as shown in FIG. 11A, the length of the through hole TH in the first direction (X-axis direction) can be smaller than the length of the bracket hole BTH in the first direction (X-axis direction). Figure 6

[0118] ​​​Further, the sensor hole SH of the force sensor 400 can be completely overlapped with the bracket hole BTH of the bracket 600. The size of the sensor hole SH of the force sensor 400 can be smaller than the size of the bracket hole BTH of the bracket 600. The length of the sensor hole SH in one direction can be smaller than the length of the bracket hole BTH in the one direction. For example, as shown in FIG. 6A, the length of the sensor hole SH in the first direction (X-axis direction) can be smaller than the length of the bracket hole BTH in the first direction (X-axis direction). Figure 6

[0119] Further, the cover hole CCH of the bottom panel cover 800 can be completely overlapped with the bracket hole BTH of the bracket 600. The size of the cover hole CCH of the bottom panel cover 800 can be substantially the same as the size of the bracket hole BTH of the bracket 600. The length of the cover hole CCH in one direction can be substantially the same as the length of the bracket hole BTH in the one direction. For example, as shown in FIG. 6A, the length of the cover hole CCH in the first direction (X-axis direction) can be substantially the same as the length of the bracket hole BTH in the first direction (X-axis direction). Accordingly, light can be incident on the optical sensor 740 after passing through the through hole TH, the sensor hole SH, the cover hole CCH, and the bracket hole BTH. Figure 6

[0120] At least one of the optical sensor 740 and the light emitting unit 750 can be disposed in the bracket hole BTH of the bracket 600. Further, when the height of at least one of the optical sensor 740 and the light emitting unit 750 in the third direction (Z-axis direction) is relatively high, at least one of the optical sensor 740 and the light emitting unit 750 can also be disposed in the cover hole CCH of the bottom panel cover 800. Alternatively, at least one of the optical sensor 740 and the light emitting unit 750 can be disposed in the sensor hole SH of the force sensor 400 and the cover hole CCH of the bottom panel cover 800. Alternatively, at least one of the optical sensor 740 and the light emitting unit 750 can be disposed in the through hole TH of the display panel 300, the sensor hole SH of the force sensor 400, and the cover hole CCH of the bottom panel cover 800. In this case, the through hole TH of the display panel 300, the sensor hole SH of the force sensor 400, and the cover hole CCH of the bottom panel cover 800 can all be physical holes.

[0121] The light emitting unit 750 can include a light source that emits light. The light source can have, for example, at least one of a light emitting diode (LED), an organic light emitting diode (OLED), a laser diode (LD), a quantum dot (QD), and a phosphor.

[0122] ​​The wavelength of light emitted from the light emitting unit 750 may be an infrared wavelength, a visible wavelength, a red wavelength, or a green wavelength. Here, when the body part placed on the through hole TH is a finger OBJ whose blood vessels are thin, the wavelength of light emitted from the light emitting unit 750 may be an infrared wavelength or a red wavelength. In this case, because the infrared wavelength or the red wavelength is longer than the green wavelength or the blue wavelength, the light easily enters the blood vessels of the finger to be absorbed. In addition, when the body part placed on the through hole TH is the wrist, the artery of the wrist is thick enough. Therefore, even in the case where the wavelength of light emitted from the light emitting unit 750 is a green wavelength, the green light can enter the artery of the wrist to be absorbed. In this way, the wavelength of light emitted from the light emitting unit 750 can be determined according to the body part undergoing blood pressure measurement.

[0123] The optical sensor 740 and the light emitting unit 750 may be provided on one surface of the main processor 710. For example, the optical sensor 740 and the light emitting unit 750 may be mounted on the top surface of the main processor 710.

[0124] The optical sensor 740 and the light emitting unit 750 may overlap with the through hole TH in the third direction (Z-axis direction). The optical sensor 740 and the light emitting unit 750 may be arranged in the bracket hole BTH of the bracket 600. In addition, when the height of the optical sensor 740 and the light emitting unit 750 in the third direction (Z-axis direction) is relatively high, the optical sensor 740 and the light emitting unit 750 may be arranged in the sensor hole SH of the force sensor 400, or in both the through hole TH of the display panel 300 and the sensor hole SH of the force sensor 400. In this case, both the through hole TH of the display panel 300 and the sensor hole SH of the force sensor 400 may be physical holes.

[0125] like Figure 6 As shown in FIG, light emitted from the light emitting unit 750 may pass through the sensor hole SH of the force sensor 400 and the through hole TH of the display panel 300 to be absorbed by or reflected from the blood vessels of the user's finger OBJ. Light reflected from the blood vessels of the user's finger OBJ may pass through the through hole TH of the display panel 300 and the sensor hole SH of the force sensor 400 to be sensed by the optical sensor 740.

[0126] in addition, Figure 6 The optical sensor 740 is shown as sensing light reflected from the finger OBJ after being emitted from the light emitting unit 750, but the inventive concept is not limited thereto. For example, the optical sensor 740 may sense light reflected from the finger OBJ after being emitted from the display panel 300 instead of the light emitting unit 750. In this case, the light emitting unit 750 may be omitted.

[0127] Figure 7 is a layout diagram showing a display area and a through hole of a display panel according to an exemplary embodiment

[0128] Reference Figure 7 , the display panel 300 may include a through hole TH, a dead space area DSA, a wiring area LA, and a pixel area PXA.

[0129] The dead space area DSA may be arranged to surround the through hole TH. The pixels PX, the scan lines SL, and the data lines DL may not be disposed in the dead space area DSA. The dead space area DSA is a region configured to prevent the through hole TH from entering the wiring area LA due to a process error in the through hole formation process.

[0130] The wiring area LA (including the scan lines SL and the data lines DL) may be disposed to surround the dead space area DSA. Since the pixels PX are not disposed in the wiring area LA, the wiring area LA corresponds to a non-display area where no image is displayed.

[0131] The scan lines SL and the data lines DL bypassing the through holes TH may be disposed in the wiring area LA. The scan lines SL may include first initialization scan lines GIp to GIp+4, write scan lines GWp to GWp+4, and second initialization scan lines GBp to GBp+4.

[0132] The first initialization scan lines GIp to GIp+4, the write scan lines GWp to GWp+4, and the second initialization scan lines GBp to GBp+4 may extend in the first direction (X-axis direction). The first initialization scan lines GIp to GIp+4, the write scan lines GWp to GWp+4, and the second initialization scan lines GBp to GBp+4 may be bent in the second direction (Y-axis direction) to bypass the through hole TH. For example, among the first initialization scan lines GIp to GIp+4, the write scan lines GWp to GWp+4, and the second initialization scan lines GBp to GBp+4, the scan lines SL bypassing the through hole TH to the upper side of the through hole TH may be bent in the upper direction. Conversely, among the first initialization scan lines GIp to GIp+4, the write scan lines GWp to GWp+4, and the second initialization scan lines GBp to GBp+4, the scan lines SL bypassing the through hole TH to the lower side of the through hole TH may be bent in the lower direction. Alternatively, the first initialization scan lines GIp to GIp+4, the write scan lines GWp to GWp+4, and the second initialization scan lines GBp to GBp+4 may be bent in a step form to bypass the through holes TH.

[0133] The data line DL may extend in the second direction (Y-axis direction) and bend toward the center of the wiring area LA in the first direction (X-axis direction) to bypass the through hole TH. For example, among the data lines DL, the line that bypasses the through hole TH to the left of the through hole TH may be bent in the left direction. Conversely, among the data lines DL, the line that bypasses the through hole TH to the right of the through hole TH may be bent in the right direction. Alternatively, the data line DL may be bent in a step-like manner to bypass the through hole TH.

[0134] To minimize the size of the wiring area LA, the distance between adjacent scan lines SL in the wiring area LA may be smaller than the distance between adjacent scan lines SL in the pixel area PXA. Furthermore, the distance between adjacent data lines DL in the wiring area LA may be smaller than the distance between adjacent data lines DL in the pixel area PXA. Furthermore, in the wiring area LA, the scan lines SL may overlap with the data lines DL in the third direction (Z-axis direction).

[0135] Each of the pixels PX may overlap any one of the first initialization scan lines GIp to GIp+4, any one of the write scan lines GWp to GWp+4, any one of the second initialization scan lines GBp to GBp+4, and any one of the data lines DL.

[0136] like Figure 7 As shown in FIG, the scan lines SL and the data lines DL are designed to bypass the through holes TH in the wiring area LA, and the pixels PX are not arranged in the wiring area LA. Therefore, even if the through holes TH are provided to penetrate the display area DA of the display panel 300, the display panel 300 can stably display images.

[0137] Figure 8 It shows Figure 7 A cross-sectional view of an example of a display panel. Figure 8 Shown along Figure 7 The cross section of the display panel 300 is taken along line II-II'.

[0138] Reference Figure 8 The first buffer film BF1, the thin film transistor layer TFTL, the light emitting element layer EML, the encapsulation layer TFE, and the touch electrode layer SENL may be sequentially disposed on the substrate SUB in this order. The display layer DISL may include the substrate SUB, the first buffer film BF1, the thin film transistor layer TFTL, the light emitting element layer EML, and the encapsulation layer TFE.

[0139] The substrate SUB may be formed of an insulating material such as glass, quartz, or polymer resin. For example, the substrate SUB may include polyimide. The substrate SUB may be a flexible substrate that can be bent, folded, or rolled.

[0140] The first buffer film BF1 is a film configured to protect the thin film transistor TFT of the thin film transistor layer TFTL and the light emitting layer 172 of the light emitting element layer EML from moisture that penetrates through the substrate SUB, which is susceptible to moisture permeation. The first buffer film BF1 may be formed of a plurality of inorganic layers stacked alternately. For example, the first buffer film BF1 may be formed of a multilayer in which one or more inorganic layers of silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers are alternately stacked.

[0141] A light blocking layer (not shown) may be provided on the substrate SUB. The light blocking layer may be provided to overlap the active layer ACT of the thin film transistor TFT to prevent leakage current from occurring when light is incident on the active layer ACT of the thin film transistor TFT. The light blocking layer may be covered by a first buffer film BF1. The light blocking layer may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0142] The thin film transistor layer TFTL includes a thin film transistor TFT, a gate insulating film 130 , a first interlayer insulating film 141 , a second interlayer insulating film 142 , a first planarizing film 160 , and a second planarizing film 180 .

[0143] An active layer ACT, a source electrode S, and a drain electrode D may be formed on the first buffer film BF1. The active layer ACT may include polycrystalline silicon, single crystal silicon, low-temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. When the active layer ACT is formed of polycrystalline silicon, the active layer ACT may be made conductive by ion doping. Therefore, the source electrode S and the drain electrode D may be formed by ion doping the active layer ACT.

[0144] The gate insulating film 130 may be formed on the active layer ACT, the source electrode S, and the drain electrode D. The gate insulating film 130 may be formed of an inorganic layer (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0145] The gate electrode G and the first capacitor electrode CE1 may be formed on the gate insulating film 130. The gate electrode G and the first capacitor electrode CE1 may be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0146] A first interlayer insulating film 141 may be formed on the gate electrode G and the first capacitor electrode CE1. The first interlayer insulating film 141 may be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The first interlayer insulating film 141 may include a plurality of inorganic layers.

[0147] The second capacitor electrode CE2 may be formed on the first interlayer insulating film 141. The second capacitor electrode CE2 may be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0148] The second interlayer insulating film 142 may be formed on the second capacitor electrode CE2. The second interlayer insulating film 142 may be formed of an inorganic layer (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The second interlayer insulating film 142 may include a plurality of inorganic layers.

[0149] The first anode connection electrode ANDE1 may be formed on the second interlayer insulating film 142. The first anode connection electrode ANDE1 may be connected to the source electrode S through a contact hole penetrating the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first anode connection electrode ANDE1 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof. In addition, the data line DL may be formed on the second interlayer insulating film 142, but the inventive concept is not limited thereto.

[0150] A first planarization film 160 may be formed on the first anode connection electrode ANDE1 to planarize steps formed by the active layer ACT, the source electrode S, the drain electrode D, the gate electrode G, the first capacitor electrode CE1, the second capacitor electrode CE2, and the first anode connection electrode ANDE1. The first planarization film 160 may be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0151] A protective film (not shown) may be additionally formed between the first anode connection electrode ANDE1 and the first planarization film 160. The protective film may be formed of an inorganic layer (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0152] The second anode connection electrode ANDE2 may be formed on the first planarization film 160. The second anode connection electrode ANDE2 may be connected to the first anode connection electrode ANDE1 through a contact hole penetrating the first planarization film 160. The second anode connection electrode ANDE2 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0153] The second planarization film 180 may be formed on the second anode connection electrode ANDE2 and may be formed of an organic layer such as acrylic resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, or the like.

[0154] although Figure 8 The thin film transistor TFT is shown as being formed by a top gate method in which the gate electrode G is located above the active layer ACT, but the inventive concept is not limited thereto. That is, the thin film transistor TFT may be formed by a bottom gate method in which the gate electrode G is located below the active layer ACT, or by a dual gate method in which the gate electrode G is located both above and below the active layer ACT.

[0155] The light emitting element layer EML is formed on the thin film transistor layer TFTL. The light emitting element layer EML includes a light emitting element 170 and a bank 190.

[0156] The light emitting elements 170 and the bank 190 are formed on the second planarization film 180. Each of the light emitting elements 170 may include a first light emitting electrode 171, a light emitting layer 172, and a second light emitting electrode 173.

[0157] The first light emitting electrode 171 may be formed on the second planarization film 180. The first light emitting electrode 171 may be connected to the second anode connection electrode ANDE2 through a contact hole penetrating the second planarization film 180.

[0158] In a top emission structure in which light is emitted toward the second light emitting electrode 173 when viewed relative to the light emitting layer 172, the first light emitting electrode 171 may be formed of a metal material having high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0159] The bank 190 may be formed on the second planarization film 180 to separate the first light emitting electrode 171, thereby defining the light emitting area EMA. The bank 190 may be formed to cover the edge of the first light emitting electrode 171. The bank 190 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0160] The light emitting area EMA indicates a region where the first light emitting electrode 171 , the light emitting layer 172 , and the second light emitting electrode 173 are sequentially stacked and holes from the first light emitting electrode 171 and electrons from the second light emitting electrode 173 are combined with each other in the light emitting layer 172 to emit light.

[0161] The light emitting layer 172 is formed on the first light emitting electrode 171 and the bank 190. The light emitting layer 172 may include an organic material to emit light of a predetermined color. For example, the light emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0162] The second light emitting electrode 173 is formed on the light emitting layer 172. The second light emitting electrode 173 may be formed to cover the light emitting layer 172. The second light emitting electrode 173 may be a common layer commonly formed in sub-pixels. A covering layer may be formed on the second light emitting electrode 173.

[0163] In a top emission type structure, the second light emitting electrode 173 may be formed of a transparent conductive material (TCO) capable of transmitting light, such as ITO or IZO, or a semi-transmissive conductive material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the second light emitting electrode 173 is formed of a semi-transmissive metal material, light emission efficiency can be improved due to the microcavity effect.

[0164] The encapsulation layer TFE may be formed on the light-emitting element layer EML. The encapsulation layer TFE may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the light-emitting element layer EML. Furthermore, the encapsulation layer TFE may include at least one organic layer to protect the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation layer TFE may include a first inorganic film TFE1, an organic film TFE2, and a second inorganic film TFE3.

[0165] The first inorganic film TFE1, the organic film TFE2, and the second inorganic film TFE3 may be sequentially disposed in this order on the second light emitting electrode 173. The first inorganic film TFE1 and the second inorganic film TFE3 may be formed of a multilayer in which one or more inorganic layers of silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers are alternately stacked. The organic film TFE2 may be a single body.

[0166] The touch electrode layer SENL is disposed on the encapsulation layer TFE and includes a second buffer film BF2 , a touch electrode SE, a first touch insulating film TINS1 , and a second touch insulating film TINS2 .

[0167] The second buffer film BF2 may be disposed on the encapsulation layer TFE. The second buffer film BF2 may include at least one inorganic layer. For example, the second buffer film BF2 may be formed by a multilayer structure in which one or more inorganic layers selected from silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers are alternately stacked. The second buffer film BF2 may be omitted.

[0168] The first touch insulating film TINS1 may be disposed on the second buffer film BF2. The first touch insulating film TINS1 may be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). Alternatively, the first touch insulating film TINS1 may be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0169] The touch electrode SE may be disposed on the first touch insulating film TINS1. The touch electrode SE does not overlap the light-emitting area EMA. That is, the touch electrode SE is not disposed in the light-emitting area EMA. The touch electrode SE may be formed of a single layer containing molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or may be formed to have a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an Ag-Pd-Cu (APC) alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0170] The second touch insulating film TINS2 may be disposed on the touch electrode SE. The second touch insulating film TINS2 may include at least one of an inorganic layer and an organic layer. The inorganic layer may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0171] Figure 6 The polarizing film 500 may be disposed on the touch electrode layer SENL, and the cover window 100 may be disposed on the polarizing film 500. An impact absorbing layer may be additionally disposed between the polarizing film 500 and the cover window 100.

[0172] A dam structure DAM may be provided around the through hole TH. The dam structure DAM may include at least one of the insulating films BF1, 130, 141, 142, 160, 180, and 190 stacked between the thin film transistor layer TFTL and the light emitting element layer EML. A trench TCH, from which the insulating films BF1, 130, 141, 142, 160, 180, and 190 are removed, may be provided between the dam structure DAM and the light emitting area EMA. At least a portion of the encapsulation layer TFE may be provided in the trench TCH. For example, the organic film TFE2 of the encapsulation layer TFE may be provided up to the dam structure DAM and may not be provided between the dam structure DAM and the through hole TH. In other words, the dam structure DAM may prevent the organic film TFE2 from overflowing into the through hole TH. Figure 8 It is shown that the first and second inorganic films TFE1 and TFE3 are terminated on the dam structure DAM, but the inventive concept is not limited thereto. For example, the first and second inorganic films TFE1 and TFE3 may be terminated in a region between the dam structure DAM and the through hole TH.

[0173] The light blocking pattern 230 may be provided on one surface of the cover window 100. The light blocking pattern 230 may overlap the dam structure DAM in the third direction (Z-axis direction). The light blocking pattern 230 may overlap the edge of the through hole TH in the third direction (Z-axis direction).

[0174] At least one of the organic films 228 and 229 may be further disposed on the encapsulation layer TFE in the region between the dam structure DAM and the through hole TH. For example, the first organic film 228 may be disposed on the second inorganic film TFE3, and the second organic film 229 may be disposed on the first organic film 228. The first organic film 228 and the second organic film 229 may be used to fill the space between the dam structure DAM and the through hole TH to perform planarization.

[0175] Figure 9 is a diagram illustrating a layout of force sensor electrodes and sensor holes of a force sensor according to an exemplary embodiment. Figure 10 and Figure 11 It shows Figure 9 A cross-sectional view of an example of a force sensor. Figure 10 Shown along Figure 9 Example of a cross section of the force sensor taken along line III-III', Figure 11 Shown along Figure 9 An example of a cross section of the force sensor taken along line IV-IV'.

[0176] Reference Figures 9 to 11The force sensor 400 may include a first base substrate 410, a first force sensor electrode, a first force sensor wiring, a first force pad, a second base substrate 420, a second force sensor electrode, a second force sensor wiring, a second force pad, a force sensitive layer 430, a force sensing unit PSC and a sensor hole SH.

[0177] Each of the first base substrate 410 and the second base substrate 420 may include polyethylene, polyimide, polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, or a polyester-based material. In one embodiment, each of the first base substrate 410 and the second base substrate 420 may be made of a polyethylene terephthalate (PET) film or a polyimide film.

[0178] The first base substrate 410 and the second base substrate 420 may be bonded to each other via a bonding layer. The bonding layer may include an adhesive material. The bonding layer may be provided along the edges of the first base substrate 410 and the second base substrate 420, but the inventive concept is not limited thereto.

[0179] exist Figures 9 to 11 In the figure, for the convenience of explanation, the first force sensor electrodes correspond to the force driving electrodes TE1 to TE5 to which the driving signals are applied, and the second force sensor electrodes correspond to the force sensing electrodes RE1 to RE5 to which the sensing signals are provided. Figures 9 to 11 For ease of explanation, the first force sensor wiring corresponds to the force driving wirings TL1 to TL5, the second force sensor wiring corresponds to the force sensing wirings RL1 to RL5, the first force pad corresponds to the force driving pads TP1 to TP5, and the second force pad corresponds to the force sensing pads RP1 to RP5. Figures 9 to 11 It is illustrated that the force sensor 400 includes five force driving electrodes TE1 to TE5 and five force sensing electrodes RE1 to RE5 , but the number of the force driving electrodes TE1 to TE5 and the number of the force sensing electrodes RE1 to RE5 are not limited thereto.

[0180] The force driving electrodes TE1 to TE5 may be disposed on one surface of the first base substrate 410 facing the second base substrate 420. The force sensing electrodes RE1 to RE5 may be disposed on one surface of the second base substrate 420 facing the first base substrate 410. The force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 may include a conductive material. For example, the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 may be formed of a metal (such as silver (Ag) and copper (Cu)), a transparent conductive oxide (such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc tin oxide (ZTO)), carbon nanotubes, a conductive polymer, or the like.

[0181] The force driving electrodes TE1 to TE5 may extend in the fourth direction DR4 and may be arranged in the fifth direction DR5. The force sensing electrodes RE1 to RE5 may extend in the fifth direction DR5 and may be arranged in the fourth direction DR4. The force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 may intersect each other. The intersection areas of the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 may be arranged in a matrix.

[0182] The force-sensitive layer 430 may be disposed in the intersection regions of the force-driving electrodes TE1 to TE5 and the force-sensing electrodes RE1 to RE5, respectively. The force-sensitive layer 430 may be disposed between the force-driving electrodes TE1 to TE5 and the force-sensing electrodes RE1 to RE5, respectively. That is, the force-sensitive layer 430 may be disposed between any one of the force-driving electrodes TE1 to TE5 and any one of the force-sensing electrodes RE1 to RE5. The force-sensitive layer 430 may contact at least one of the force-driving electrodes and the force-sensing electrodes. For example, Figure 10 As shown in , the force-sensitive layer 430 can contact the force-sensing electrodes.

[0183] The force-sensitive layer 430 may include a force-sensitive material. The force-sensitive material may include metal nanoparticles or carbon formed of, for example, nickel, aluminum, tin, copper, etc. The force-sensitive material may be provided in the form of particles in a polymer resin, but the inventive concept is not limited thereto.

[0184] When force is applied to the force sensor 400, the force-sensitive layer 430 may also contact one or more force driving electrodes TE1 to TE5. Thus, at least one force driving electrode TE1 to TE5, the force-sensitive layer 430, and at least one of the force sensing electrodes may be electrically connected to each other. As the force applied to the force sensor 400 increases, the resistance of the force-sensitive layer 430 may decrease.

[0185] By applying a driving voltage to the force driving electrodes TE1 to TE5 and measuring the voltage sensed by the force sensing electrodes RE1 to RE5, the resistance of each of the force-sensitive layers 430 disposed in the intersection regions of the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 can be calculated. A force value corresponding to the magnitude of the force can be calculated based on the resistance of each of the force-sensitive layers 430. To calculate the force value, the intersection regions of the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5, in which the force-sensitive layers 430 are disposed, can each be defined as a force sensing cell PSC.

[0186] The force driving wirings TL1 to TL5 and the force driving pads TP1 to TP5 may be provided on one surface of the first base substrate 410. The force driving wirings TL1 to TL5 and the force driving pads TP1 to TP5 may include a conductive material. For example, the force driving wirings TL1 to TL5 and the force driving pads TP1 to TP5 may be formed of a metal (such as silver (Ag) or copper (Cu)), a transparent conductive oxide (such as ITO, IZO or ZTO), carbon nanotubes, a conductive polymer, etc.

[0187] The force drive wirings TL1 to TL5 can connect the force drive electrodes TE1 to TE5 to the force drive pads TP1 to TP5, respectively. For example, the first force drive wiring TL1 can connect the first force drive electrode TE1 to the first force drive pad TP1, and the second force drive wiring TL2 can connect the second force drive electrode TE2 to the second force drive pad TP2. The third force drive wiring TL3 can connect the third force drive electrode TE3 to the third force drive pad TP3, the fourth force drive wiring TL4 can connect the fourth force drive electrode TE4 to the fourth force drive pad TP4, and the fifth force drive wiring TL5 can connect the fifth force drive electrode TE5 to the fifth force drive pad TP5.

[0188] The force driving pads TP1 to TP5 may be provided on one side of the first base substrate 410. A force driving circuit board 510 may be provided on the force driving pads TP1 to TP5. The force driving circuit board 510 may be attached to the force driving pads TP1 to TP5 using an anisotropic conductive film or the like. Thus, the force driving pads TP1 to TP5 may be electrically connected to the force driving circuit board 510. Furthermore, because the force driving circuit board 510 is electrically connected to the display circuit board 310, the force sensor 400 may be electrically connected to the force driving circuit 340 of the display circuit board 310.

[0189] The force sensing wires RL1 to RL5 and the force sensing pads RP1 to RP5 may be disposed on one surface of the second base substrate 420. The force sensing wires RL1 to RL5 and the force sensing pads RP1 to RP5 may include a conductive material. For example, the force sensing wires RL1 to RL5 and the force sensing pads RP1 to RP5 may be formed of a metal (such as silver (Ag) or copper (Cu)), a transparent conductive oxide (such as ITO, IZO, or ZTO), carbon nanotubes, a conductive polymer, or the like.

[0190] Force sensing wiring lines RL1 to RL5 can connect the force sensing electrodes RE1 to RE5 to force sensing pads RP1 to RP5, respectively. For example, first force sensing wiring line RL1 can connect the first force sensing electrode RE1 to the first force sensing pad RP1, and second force sensing wiring line RL2 can connect the second force sensing electrode RE2 to the second force sensing pad RP2. Third force sensing wiring line RL3 can connect the third force sensing electrode RE3 to the third force sensing pad RP3, fourth force sensing wiring line RL4 can connect the fourth force sensing electrode RE4 to the fourth force sensing pad RP4, and fifth force sensing wiring line RL5 can connect the fifth force sensing electrode RE5 to the fifth force sensing pad RP5.

[0191] Force sensing pads RP1 to RP5 may be provided on one side of the second base substrate 420. A force sensing circuit board 520 may be provided on the force sensing pads RP1 to RP5. The force sensing circuit board 520 may be attached to the force sensing pads RP1 to RP5 using an anisotropic conductive film or the like. Thus, the force sensing pads RP1 to RP5 may be electrically connected to the force sensing circuit board 520. Furthermore, because the force sensing circuit board 520 is electrically connected to the display circuit board 310, the force sensor 400 may be electrically connected to the force driving circuit 340 of the display circuit board 310.

[0192] In addition, if Figure 9 and Figure 11 As shown in FIG, the force driving circuit board 510 may be attached to one surface of the first base substrate 410, and the force sensing circuit board 520 may be attached to one surface of the second base substrate 420. To prevent the force driving circuit board 510 from being interfered with by the second base substrate 420, the second base substrate 420 may not be disposed above the one surface of the first base substrate 410 to which the force driving circuit board 510 is attached. Furthermore, to prevent the force sensing circuit board 520 from being interfered with by the first base substrate 410, the first base substrate 410 may not be disposed above the one surface of the second base substrate 420 to which the force sensing circuit board 520 is attached.

[0193] The force driving pads TP1 to TP5 and the force sensing pads RP1 to RP5 may not overlap each other in the sixth direction DR6, which is the thickness direction of the force sensor 400. Figure 9 As shown in FIG, the force driving pads TP1 to TP5 may be disposed at the upper left side of the first base substrate 410, and the force sensing pads RP1 to RP5 may be disposed at the upper right side of the second base substrate 420. In addition, the upper left side of the first base substrate 410 may protrude in a fifth direction DR5 compared to the upper right side thereof, and the upper right side of the second base substrate 420 may protrude in the fifth direction DR5 compared to the upper left side thereof.

[0194] When the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 include an opaque conductive material or the force-sensitive layer 430 includes an opaque polymer resin, the force sensor 400 may have a relatively low light transmittance. The force sensor 400 may include a sensor hole SH to prevent light passing through the through hole TH of the display panel 300 from being blocked by the force sensor 400.

[0195] The sensor hole SH may be provided in a cross region of any one of the force driving electrodes TE1 to TE5 and any one of the force sensing electrodes RE1 to RE5 as a light transmitting portion allowing light to pass therethrough. Figure 9 As shown in , the sensor hole SH may be provided in the intersection region of the third force driving electrode TE3 and the third force sensing electrode RE3. In this case, the components including the opaque material may be removed from the third force driving electrode TE3, the third force sensing electrode RE3, and the force sensitive layer 430 provided in the intersection region of the third force driving electrode TE3 and the third force sensing electrode RE3. For example, Figure 10 As shown in , when the third force driving electrode TE3 and the third force sensing electrode RE3 include an opaque conductive material, the third force driving electrode TE3 and the third force sensing electrode RE3 may be removed from the sensor hole SH. Figure 10 As shown in , when the force-sensitive layer 430 includes an opaque polymer resin, the force-sensitive layer 430 disposed in the crossing region of the third force driving electrode TE3 and the third force sensing electrode RE3 may be removed from the sensor hole SH.

[0196] The third force drive electrode TE3 may include a first sub-force sensor electrode and a second sub-force sensor electrode separated by a sensor hole SH. The first sub-force sensor electrode may be a first sub-force drive electrode STE1 of the third force drive electrode TE3, and the second sub-force sensor electrode may be a second sub-force drive electrode STE2 of the third force drive electrode TE3. The first sub-force drive electrode STE1 may be disposed on a first side of the sensor hole SH (e.g., Figure 9 On the left side in FIG), the second sub-force driving electrode STE2 may be disposed on a second side of the sensor hole SH (eg, Figure 9 on the right side of the ).

[0197] Because the third force driving electrode TE3 is divided into the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 by the sensor hole SH, the length of the first sub-force driving electrode STE1 in the fourth direction DR4 and the length of the second sub-force driving electrode STE2 in the fourth direction DR4 can be smaller than the length of each of the force driving electrodes TE1, TE2, TE4 and TE5 except the third force driving electrode TE3 among the force driving electrodes TE1 to TE5 in the fourth direction DR4.

[0198] Because the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are separated by the sensor hole SH, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 can be connected to the first sub-force sensor wiring and the second sub-force sensor wiring, respectively. The first sub-force sensor wiring can be the first sub-force driving wiring STL1, and the second sub-force sensor wiring can be the second sub-force driving wiring STL2. The third force driving wiring TL3 can include the first sub-force driving wiring STL1 connected to the first sub-force driving electrode STE1 and the second sub-force driving wiring STL2 connected to the second sub-force driving electrode STE2.

[0199] The first sub-force driving wiring STL1 may connect the first sub-force driving electrode STE1 to the first sub-force sensor pad of the third force driving pad TP3. The second sub-force driving wiring STL2 may connect the second sub-force driving electrode STE2 to the second sub-force sensor pad of the third force driving pad TP3. The first sub-force sensor pad may be the first sub-force driving pad STP1 of the third force driving pad TP3, and the second sub-force sensor pad may be the second sub-force driving pad STP2 of the third force driving pad TP3.

[0200] The first force driving electrode TE1, the second force driving electrode TE2, the fourth force driving electrode TE4, the fifth force driving electrode TE5 and the first sub-force driving electrode STE1 may be provided at their first side ends (eg, Figure 9 On the other hand, the second sub-force driving electrode STE2 may be connected to the first force driving wiring TL1, the second force driving wiring TL2, the fourth force driving wiring TL4, the fifth force driving wiring TL5 and the first sub-force driving wiring STL1 at its second side end (for example, Figure 9 The force sensor 400 is connected to the second sub-force driving wiring STL2 at the right end thereof. Since the second sub-force driving wiring STL2 is connected to the second sub-force driving pad STP2 after passing through the right and upper portions of the force sensor 400, the second sub-force driving wiring STL2 may cross the first and second force sensing wirings RL1 and RL2, the fourth and fifth force sensing wirings RL4 and RL5, and the first sub-force sensing wiring SRL1 at the upper portion of the force sensor 400.

[0201] The third force sensing electrode RE3 may include a third sub-force sensor electrode and a fourth sub-force sensor electrode separated by a sensor hole SH. The third sub-force sensor electrode may be the first sub-force sensing electrode SRE1 of the third force sensing electrode RE3, and the fourth sub-force sensor electrode may be the second sub-force sensing electrode SRE2 of the third force sensing electrode RE3. The first sub-force sensing electrode SRE1 may be disposed on a third side of the sensor hole SH (e.g., Figure 9 On the upper side of the sensor hole SH), the second sub-force sensing electrode SRE2 may be disposed on a fourth side of the sensor hole SH (eg, Figure 9 on the lower side of the center).

[0202] Because the third force sensing electrode RE3 is divided into the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 by the sensor hole SH, the length of the first sub-force sensing electrode SRE1 and the length of the second sub-force sensing electrode SRE2 in the fifth direction DR5 may be smaller than the length of each of the force sensing electrodes RE1, RE2, RE4 and RE5 except the third force sensing electrode RE3 among the force sensing electrodes RE1 to RE5 in the fifth direction DR5.

[0203] Because the first and second sub-force sensing electrodes SRE1 and SRE2 are disconnected by the sensor hole SH, they can be connected to a third and fourth sub-force sensor wiring, respectively. The third sub-force sensor wiring may be a first sub-force sensing wiring SRL1, and the fourth sub-force sensor wiring may be a second sub-force sensing wiring SRL2. The third force sensing wiring RL3 may include a first sub-force sensing wiring SRL1 connected to the first sub-force sensing electrode SRE1 and a second sub-force sensing wiring SRL2 connected to the second sub-force sensing electrode SRE2.

[0204] The first sub-force sensing wiring SRL1 can connect the first sub-force sensing electrode SRE1 to a third sub-force sensor pad of the third force sensing pad RP3. The second sub-force sensing wiring SRL2 can connect the second sub-force sensing electrode SRE2 to a fourth sub-force sensor pad of the third force sensing pad RP3. The third sub-force sensor pad can be the first sub-force sensing pad SRP1, and the fourth sub-force sensor pad can be the second sub-force sensing pad SRP2.

[0205] The first force sensing electrode RE1, the second force sensing electrode RE2, the fourth force sensing electrode RE4, the fifth force sensing electrode RE5 and the first sub-force sensing electrode SRE1 may be formed at their third side ends (eg, Figure 9 On the contrary, the second sub-force sensing electrode SRE2 may be connected to the first force sensing wiring RL1, the second force sensing wiring RL2, the fourth force sensing wiring RL4, the fifth force sensing wiring RL5 and the first sub-force sensing wiring SRL1 at its fourth side end (e.g., Figure 9 The second sub-force sensing wiring SRL2 may be connected to the second sub-force sensing pad SRP2 after passing through the lower portion and the right portion of the force sensor 400.

[0206] The length of the force sensor 400 in the fourth direction DR4 and the length of the force sensor 400 in the fifth direction DR5 may be in the range of approximately 10 mm to 20 mm, but the inventive concept is not limited thereto. The length of each force sensing unit PSC in the fourth direction DR4 and the length of each force sensing unit PSC in the fifth direction DR5 may be approximately 1.5 mm or greater. The length of the sensor hole SH in the fourth direction DR4 and the length of the sensor hole SH in the fifth direction DR5 may be approximately 3 mm or greater.

[0207] like Figures 9 to 11 As shown in FIG, although the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are disconnected by the sensor hole SH, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are connected to the sub-force driving wirings STL1 and STL2, respectively, so that the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 can be electrically connected to the force driving circuit 340. In addition, although the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 are disconnected by the sensor hole SH, the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 are connected to the sub-force sensing wirings SRL1 and SRL2, respectively, so that the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 can be electrically connected to the force driving circuit 340.

[0208] Figure 12 It shows Figure 9 A cross-sectional view of another example of a force sensor. Figure 12 Shown along Figure 9 Another example of a cross section of the force sensor taken along line III-III'.

[0209] Figure 12 Examples and Figure 10 The difference between the embodiment of the present invention is that the sensor hole SH is a physical hole formed physically. Therefore, the embodiment of the present invention is omitted. Figure 10 The description of the embodiments is repeated to avoid redundancy.

[0210] Reference Figure 12 In the case where the sensor hole SH is provided in the intersection region of the third force driving electrode TE3 and the third force sensing electrode RE3, the sensor hole SH may be a physical hole from which not only the third force driving electrode TE3, the third force sensing electrode RE3, and the force-sensitive layer 430 provided in the intersection region of the third force driving electrode TE3 and the third force sensing electrode RE3 have been removed, but also the first base substrate 410 and the second base substrate 420 provided in the intersection region of the third force driving electrode TE3 and the third force sensing electrode RE3 have been removed. In this case, the optical sensor 740 may be disposed in the sensor hole SH.

[0211] Figure 13 and Figure 14 It shows Figure 9 A cross-sectional view of yet another example of a force sensor. Figure 13 Shown along Figure 9 Another example of a cross section of the force sensor taken along line III-III', Figure 14 Shown along Figure 9 Another example of a cross section of the force sensor taken along line IV-IV'.

[0212] Figure 13 and Figure 14 Examples and Figure 10 and Figure 11 The difference between the embodiment of FIG. 1 and FIG. 2 is that the force-sensitive layer 430' contacts the force driving electrodes TE1 to TE5 instead of the force sensing electrodes RE1 to RE5. Figure 10 and Figure 11 The description of the embodiments is repeated to avoid redundancy.

[0213] Figure 15 and Figure 16 It shows Figure 9 A cross-sectional view of yet another example of a force sensor. Figure 15 Shown along Figure 9 Another example of a cross section of the force sensor taken along line III-III', Figure 16 Shown along Figure 9 Another example of a cross section of the force sensor taken along line IV-IV'.

[0214] Figure 15 and Figure 16 Examples and Figure 10 and Figure 11 The difference of the embodiment is that the force-sensitive layer 430" contacts all the force sensing electrodes RE1 to RE5 and the force driving electrodes TE1 to TE5 respectively. Therefore, the embodiment of Figure 10 and Figure 11 The description of the embodiments is repeated to avoid redundancy.

[0215] Reference Figure 15 and Figure 16 , each of the force-sensitive layers 430" is a layer made of a dielectric constant-changing material, the dielectric constant of the dielectric constant-changing material changes according to the force applied to the force sensor 400, and various materials known in the art can be applied to the force-sensitive layer 430". In this case, because the dielectric constant of each force-sensitive layer 430" changes according to the force applied to the force sensor 400, the capacitance value between the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 is measured, thereby measuring the magnitude of the force applied to the force sensor 400.

[0216] Optionally, the force-sensitive layer 430" may include a piezoelectric material having a piezoelectric effect and an inverse piezoelectric effect, in which a voltage is generated when a mechanical force is applied and a mechanical deformation is generated when a voltage is applied. For example, the force-sensitive layer 430" may include polyvinylidene fluoride (PVDF), lead zirconate titanate (PZT), and an electroactive polymer (EAP). In this case, the voltage sensed at each of the force sensing electrodes RE1 to RE5 may vary according to the force applied to the force sensor 400 by the piezoelectric effect of each force-sensitive layer 430". Therefore, the voltage sensed at the force sensing electrodes RE1 to RE5 can be measured to measure the magnitude of the force applied to the force sensor 400.

[0217] Alternatively, the force-sensitive layer 430 may be omitted. In this case, the distance between the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 may vary according to the force applied to the force sensor 400. Therefore, the capacitance value between the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5 may be measured to measure the magnitude of the force applied to the force sensor 400.

[0218] Figure 17 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment.

[0219] Figure 17 Examples and Figure 9 The difference between the embodiment of the present invention is that the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are connected by a first force connection wiring, and the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 are connected by a second force connection wiring. Figure 9 The first force connection wiring may be a driving connection wiring TCL, and the second force connection wiring may be a sensing connection wiring RCL.

[0220] Reference Figure 17 , the third force driving electrode TE3 and the third force sensing electrode RE3 can be removed from the sensor hole SH. Therefore, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 of the third force driving electrode TE3 are disconnected from each other by the sensor hole SH, but they can be connected via the driving connection wiring TCL. In addition, the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 of the third force sensing electrode RE3 are disconnected from each other by the sensor hole SH, but they can be connected via the sensing connection wiring RCL.

[0221] The driving connection wiring TCL may be connected to a second side (eg, Figure 17) and a first side of the second sub-force driving electrode STE2 (eg, Figure 17 (left side in the figure). The drive connection wiring TCL may include multiple curved portions to bypass the sensor hole SH. For example, the drive connection wiring TCL may extend in the fourth direction DR4, may bend and extend in the fifth direction DR5, may bend and extend in the fourth direction DR4 again, may bend and extend in the fifth direction DR5 again, and may bend and extend in the fourth direction DR4 again. To prevent the area of ​​the sensor hole SH from being reduced by the drive connection wiring TCL, the width of the drive connection wiring TCL may be smaller than the widths of the first sub-force drive electrode STE1 and the second sub-force drive electrode STE2.

[0222] The sensing connection wiring RCL may be connected to a fourth side (eg, Figure 17 ) and a third side of the second sub-force sensing electrode SRE2 (eg, Figure 17 The sensing connection wiring RCL may include multiple curved portions to bypass the sensor hole SH. For example, the sensing connection wiring RCL may extend in the fifth direction DR5, may bend and extend in the fourth direction DR4, may bend and extend again in the fifth direction DR5, may bend and extend again in the fourth direction DR4, and may bend and extend again in the fifth direction DR5. To prevent the area of ​​the sensor hole SH from being reduced by the sensing connection wiring RCL, the width of the sensing connection wiring RCL may be smaller than the widths of the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2. Furthermore, the driving connection wiring TCL and the sensing connection wiring RCL may overlap each other in the sixth direction DR6, but the inventive concept is not limited thereto.

[0223] Figure 17 Examples and Figure 9 The difference of the embodiment is that the first side end (eg, Figure 17 The left end in FIG) is connected to the third force driving wiring TL3, but the second side end of the second sub-force driving electrode STE2 (eg, Figure 17 The right end in ( ) is not connected to any force driven wiring. In addition, Figure 17 Examples and Figure 9 The difference of the embodiment is that the third side end (eg, Figure 17 The upper end of the second force sensing electrode SRE2 is connected to the third force sensing wiring RL3, but the fourth side end of the second force sensing electrode SRE2 (eg, Figure 17 The lower end in the figure) is not connected to any force sensing wiring.

[0224] like Figure 17As shown in , although the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are disconnected by the sensor hole SH, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 can be electrically connected to each other through the driving connection wiring TCL. In addition, although the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 are disconnected by the sensor hole SH, the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 can be electrically connected to each other through the sensing connection wiring RCL.

[0225] Figure 18 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment.

[0226] Figure 18 Examples and Figure 9 The difference between the embodiment of the present invention is that the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are connected by a driving connection wiring TCL. Figure 9 The description of the embodiments is repeated to avoid redundancy. In addition, because Figure 18 The driving connection wiring TCL connecting the first sub-force driving electrode STE1 to the second sub-force driving electrode STE2 is the same as the reference Figure 17 The described drive connection wiring TCL is basically the same, so its description is omitted.

[0227] Figure 19 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment.

[0228] Figure 19 Examples and Figure 9 The difference between the embodiment of the present invention is that the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 are connected by a sensing connection wiring RCL. Figure 9 The description of the embodiments is repeated to avoid redundancy. In addition, because Figure 19 The sensing connection wiring RCL connecting the first sub-force sensing electrode SRE1 and the second sub-force sensing electrode SRE2 is connected to the reference Figure 17 The described sensing connection wirings RCL are basically the same, so description thereof is omitted.

[0229] Figure 20 is a plan view illustrating a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to yet another embodiment. Figure 21 is a cross-sectional view illustrating a cover window, a display panel, a force sensor, a bottom panel cover, a light emitting unit, and an optical sensor according to still another embodiment.

[0230] Figure 20 and Figure 21 Examples and Figure 3 and Figure 6 The embodiment is different in that the display panel 300 includes a subsidiary display area SDA instead of the through hole TH.

[0231] Reference Figure 20 , the display area DA of the display panel 300 may include a main display area MDA and a sub-display area SDA. The main display area MDA may occupy most of the display area DA. Figure 3 As described above, the main area MA may include a display area DA displaying an image and a non-display area NDA which is a peripheral area of ​​the display area DA.

[0232] The main display area MDA may not include a transmissive region configured to transmit light and may only include a pixel region having pixels configured to display an image. In contrast, the sub-display area SDA may include both a transmissive region configured to transmit light and a pixel region having pixels configured to display an image. In other words, the sub-display area SDA may include a transmissive region that serves as a light-transmitting portion capable of transmitting light. Therefore, the light transmittance of the sub-display area SDA may be higher than that of the main display area MDA.

[0233] The sub-display area SDA may be arranged to be surrounded by the main display area MDA. Alternatively, the sub-display area SDA may be arranged to be surrounded by the non-display area NDA, or may be arranged between the display area DA and the non-display area NDA. Figure 20 It is shown that the subsidiary display area SDA is arranged at the upper center of the display panel 300 , but the arrangement position of the subsidiary display area SDA is not limited thereto.

[0234] although Figure 20 The display panel 300 is shown as including one subsidiary display area SDA, but the number of subsidiary display areas SDA is not limited thereto. When the display panel 300 includes multiple subsidiary display areas SDA, any one of the subsidiary display areas SDA may overlap with the optical sensor 740 in the third direction (Z-axis direction), while the other subsidiary display areas SDA may overlap with a sensor unit other than the optical sensor 740. For example, the sensor unit may be a proximity sensor, an illumination sensor, or a front camera sensor.

[0235] In addition, despite Figure 20 The subsidiary display area SDA is shown to have a circular planar shape, but the inventive concept is not limited thereto. For example, the subsidiary display area SDA may have a polygonal or elliptical planar shape.

[0236] like Figure 20 and Figure 21As shown in FIG, the sub-display area SDA may overlap with the sensor hole SH of the force sensor 400, the cover hole CCH of the bottom panel cover 800, the bracket hole BTH of the bracket 600, and the optical sensor 740 in the third direction (Z-axis direction). Therefore, light passing through the sub-display area SDA of the display panel 300 may be incident on the optical sensor 740 through the sensor hole SH. Therefore, although the optical sensor 740 is disposed below the display panel 300, the optical sensor 740 may sense light incident from the front surface of the display device 10. For example, light emitted from the light emitting unit 750 may pass through the bracket hole BTH of the bracket 600, the cover hole CCH of the bottom panel cover 800, the sensor hole SH of the force sensor 400, and the sub-display area SDA of the display panel 300 to be absorbed by or reflected from the blood vessels of the user's finger OBJ. Light reflected from the blood vessels of the user's finger OBJ may pass through the sub display area SDA of the display panel 300 , the sensor hole SH of the force sensor 400 , the cover hole CCH of the bottom panel cover 800 , and the bracket hole BTH of the bracket 600 to be sensed by the optical sensor 740 .

[0237] Figure 22A is a layout diagram illustrating a main display area of ​​a display panel according to an exemplary embodiment. Figure 22B is a layout diagram illustrating a sub-display area of ​​a display panel according to an exemplary embodiment.

[0238] Reference Figure 22A and Figure 22B , the main display area MDA may include only the first to fourth pixels PX1 to PX4, while the sub-display area SDA may include a pixel area PXA including the first to fourth pixels PX1 to PX4 and a transmissive area TA that transmits light. Therefore, the number of pixels PX1 to PX4 per unit area (e.g., the number of pixels per inch (PPI)) of the main display area MDA may be greater than the number of pixels PX1 to PX4 per unit area of ​​the sub-display area SDA. For example, the unit area may be the area of ​​a region having a length of one inch in the first direction (X-axis direction) and a length of one inch in the second direction (Y-axis direction).

[0239] The pixel areas PXA and the transmission areas TA may be arranged side by side in a first direction (X-axis direction). The pixel areas PXA and the transmission areas TA may be arranged alternately in the first direction (X-axis direction). In addition, the pixel areas PXA and the transmission areas TA may be arranged side by side in a second direction (Y-axis direction). The pixel areas PXA and the transmission areas TA may be arranged alternately in the second direction (Y-axis direction).

[0240] Due to the transmissive area TA, the number of pixels PX1 to PX4 per unit area of ​​the sub-display area SDA may be smaller than the number of pixels PX1 to PX4 per unit area of ​​the main display area MDA. In addition, due to the transmissive area TA, the ratio of the area of ​​the pixels PX1 to PX4 of the sub-display area SDA to the area of ​​the sub-display area SDA may be smaller than the ratio of the area of ​​the pixels PX1 to PX4 of the main display area MDA to the area of ​​the main display area MDA.

[0241] Each pixel area PXA may include I (I is a positive integer) pixel groups PXG. For example, each pixel area PXA may include four pixel groups PXG. In this case, in each pixel area PXA, two pixel groups PXG may be arranged in a first direction (X-axis direction), and on the other hand, two pixel groups PXG may be arranged in a second direction (Y-axis direction). Each pixel group PXG may include first to fourth pixels PX1 to PX4.

[0242] The transmissive area TA is an area through which light incident on the display panel 300 passes. The transmissive area TA does not include the pixels PX1 to PX4. The transmissive area TA may be surrounded by the pixel area PXA. To increase the transmittance of the transmissive area TA, the number of pixels PX1 to PX4 in the sub-display area SDA may be half the number of pixels PX1 to PX4 in the main display area MDA excluding the sub-display area SDA. Alternatively, the number of pixels PX1 to PX4 in the sub-display area SDA may be one-quarter the number of pixels PX1 to PX4 in the main display area MDA.

[0243] like Figure 22A and Figure 22B As shown in , since the optical sensor 740 overlaps the sub-display area SDA including the transmission area TA of the display panel 300 in the third direction (Z-axis direction), the optical sensor 740 can sense light incident from the front surface of the display device 10 through the transmission area TA.

[0244] Figure 23 It shows Figure 22B A cross-sectional view of an example of a display panel. Figure 23 Shown along Figure 22B A cross section of the display panel taken along line V-V'.

[0245] exist Figure 23 In the embodiment of the present invention, except for the transmission area TA, the substrate SUB, the thin film transistor layer TFTL and the touch electrode layer SENL formed in the display area DA may be the same as those in the reference Figure 8 The substrate SUB, thin film transistor layer TFTL and touch electrode layer SENL described are substantially the same. Therefore, their description is omitted. Figure 23 The light blocking layer LBL is shown in FIG. The light blocking layer LBL may be Figure 8 The light blocking layer described is substantially the same, and therefore, its description is omitted.

[0246] Reference Figure 23 The transmission area TA may be a region where the metal layer of the thin film transistor layer TFTL, the light emitting element layer EML, and the touch electrode layer SENL are not provided to transmit light. Therefore, the transmission area TA may include a substrate SUB, a first buffer film BF1, a gate insulating film 130, a first interlayer insulating film 141, a second interlayer insulating film 142, a first inorganic film TFE1, an organic film TFE2, and a second inorganic film TFE3.

[0247] The first planarizing film 160, the second planarizing film 180, and the bank 190 may be removed from the transmission area TA. Furthermore, the encapsulation layer TFE may fill the area of ​​the transmission area TA from which the first planarizing film 160, the second planarizing film 180, and the bank 190 have been removed. For example, the first inorganic film TFE1 and the organic film TFE2 may fill the area of ​​the transmission area TA from which the first planarizing film 160, the second planarizing film 180, and the bank 190 have been removed. Therefore, the first inorganic film TFE1 and the second interlayer insulating film 142 may contact each other in the transmission area TA.

[0248] Figure 23 The first planarization film 160, the second planarization film 180, and the bank 190 are shown as being removed from the transmission area TA, but the inventive concept is not limited thereto. For example, at least one of the first buffer film BF1, the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142 may be further removed from the transmission area TA.

[0249] like Figure 23 As shown in , since the opaque material is not provided in the transmission area TA, light passing through the transmission area TA may be incident on the optical sensor 740, which overlaps the sub-display area SDA including the transmission area TA in the third direction (Z-axis direction).

[0250] Figure 24 is a plan view illustrating a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to yet another embodiment.

[0251] Figure 24 Examples and Figure 3 The difference of the embodiment is that the through hole TH of the display panel 300 is arranged to be surrounded by the non-display area NDA. Figure 3 The description of the embodiments is repeated to avoid redundancy.

[0252] Reference Figure 24 , the through hole TH may be arranged to be surrounded by the non-display area NDA. In this case, when the length of the through hole TH in the second direction (Y-axis direction) is greater than the length of the non-display area NDA in the second direction (Y-axis direction), the display area DA may include a concave portion CUA concavely bent from the area in which the through hole TH is formed, thereby avoiding the through hole TH.

[0253] Figure 25 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment.

[0254] Figure 25 Examples and Figure 9 The difference between the embodiment of FIG. 4 and FIG. 5 is that the sensor hole SH of the force sensor 400 is arranged at one edge of the force sensor 400. Therefore, the embodiment of FIG. 4 is omitted. Figure 9 The description of the embodiments is repeated to avoid redundancy.

[0255] Reference Figure 25 , when the through hole TH as Figure 24 When the force sensor 400 is arranged at one edge of the display panel 300 as shown in FIG, the sensor hole SH of the force sensor 400 may also be arranged at one edge of the force sensor 400. For example, the sensor hole SH may be arranged at a third side (eg, Figure 25 The force driving pads TP1 to TP5 and the force sensing pads RP1 to RP5 may be arranged on a fourth side of the force sensor 400 (eg, an upper side thereof). Figure 25 The sensor hole SH can be as follows Figure 10 The sensor hole SH may be a light transmitting portion that allows light to pass therethrough, but the inventive concept is not limited thereto. Figure 12 The physical pores formed by the physics shown in .

[0256] The force sensor 400 may include a first sub-force driving electrode STE1 and a second sub-force driving electrode STE2 separated from the fifth force driving electrode TE5 by a sensor hole SH instead of the third force driving electrode TE3. The first sub-force driving electrode STE1 may be disposed on a second side of the sensor hole SH (eg, Figure 25 On the right side in FIG), the second sub-force driving electrode STE2 may be disposed on a first side of the sensor hole SH (eg, Figure 25 on the left side of the ).

[0257] Because the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are disconnected by the sensor hole SH, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 can be connected to the sub-force driving wiring STL1 and STL2, respectively. For example, the fifth force driving wiring TL5 may include a first sub-force driving wiring STL1 connected to the first sub-force driving electrode STE1 and a second sub-force driving wiring STL2 connected to the second sub-force driving electrode STE2. The first sub-force driving wiring STL1 may connect the first sub-force driving electrode STE1 to the first sub-force driving pad STP1 of the fifth force driving pad TP5. The second sub-force driving wiring STL2 may connect the second sub-force driving electrode STE2 to the second sub-force driving pad STP2 of the fifth force driving pad TP5.

[0258] The first to fourth force driving electrodes TE1 to TE4 and the first sub-force driving electrode STE1 may be provided at their second side ends (eg, Figure 25 The right end in FIG. 1 is connected to the first force driving wiring TL1 to the fourth force driving wiring TL4 and the first sub-force driving wiring STL1. In contrast, the second sub-force driving electrode STE2 may be connected to the first side end (eg, Figure 25 The force sensor 400 is connected to the second sub-force driving wiring STL2 at the left end thereof. Since the second sub-force driving wiring STL2 is connected to the second sub-force driving pad STP2 after passing through the left and lower portions of the force sensor 400, the second sub-force driving wiring STL2 may cross the first to fifth force sensing wirings RL1 to RL5 at the lower side of the force sensor 400.

[0259] Because the third force sensing electrode RE3 is partially removed by the sensor hole SH, the length of the third force sensing electrode RE3 in the fifth direction DR5 may be smaller than the length of each of the force sensing electrodes RE1, RE2, RE4, and RE5 excluding the third force sensing electrode RE3 among the first to fifth force sensing electrodes RE1 to RE5 in the fifth direction DR5.

[0260] also, Figure 25 Examples and Figure 9 The difference of the embodiment is that the first force driving electrode TE1 to the fourth force driving electrode TE4 and the first sub-force driving electrode STE1 are at their second side ends (eg, Figure 25 The second sub-force driving electrode STE2 is connected to the first force driving wiring TL1 to the fourth force driving wiring TL4 and the first sub-force driving wiring STL1 at its first side end (for example, Figure 25 The left end of the middle is connected to the second sub-force driving wiring STL2. Figure 25 Examples and Figure 9The embodiment of the present invention is different in that the third force sensing electrode RE3 is not separated by the sensor hole SH, and the first force sensing electrode RE1 to the fifth force sensing electrode RE5 are at their fourth side ends (eg, Figure 25 The lower ends of the force sensing lines RL1 to RL5 are respectively connected.

[0261] like Figure 25 As shown in , although the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are disconnected by the sensor hole SH, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 can be connected to the sub-force driving wirings STL1 and STL2 respectively to be electrically connected to the force driving circuit 340.

[0262] Figure 26 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment.

[0263] Figure 26 Examples and Figure 25 The difference between the embodiment of the present invention is that the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are connected by a driving connection wiring TCL. Figure 25 The description of the embodiments is repeated to avoid redundancy.

[0264] Reference Figure 26 , the fifth force driving electrode TE5 and the third force sensing electrode RE3 can be removed from the sensor hole SH. Therefore, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 of the fifth force driving electrode TE5 are disconnected from each other by the sensor hole SH, but they can be connected through the driving connection wiring TCL.

[0265] The driving connection wiring TCL may be connected to a first side (eg, Figure 26 ) and a second side of the second sub-force driving electrode STE2 (eg, Figure 26 (right side in the figure). The drive connection wiring TCL may include multiple curved portions to bypass the sensor hole SH. For example, the drive connection wiring TCL may extend in the fourth direction DR4, may bend and extend in the fifth direction DR5, may bend and extend in the fourth direction DR4 again, may bend and extend in the fifth direction DR5 again, and may bend and extend in the fourth direction DR4 again. To prevent the area of ​​the sensor hole SH from being reduced by the drive connection wiring TCL, the width of the drive connection wiring TCL may be smaller than the widths of the first sub-force drive electrode STE1 and the second sub-force drive electrode STE2.

[0266] Figure 26 Examples and Figure 25The difference of the embodiment is that the second side end (eg, Figure 26 The right end in FIG) is connected to the fifth force driving wiring TL5, and the first side end of the second sub-force driving electrode STE2 (eg, Figure 26 ) is not connected to any force-driven routing.

[0267] like Figure 26 As shown in FIG, although the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 are disconnected by the sensor hole SH, the first sub-force driving electrode STE1 and the second sub-force driving electrode STE2 may be electrically connected through the driving connection wiring TCL.

[0268] Figure 27 FIG. 1 is a diagram showing a layout of force sensor electrodes and sensor holes of a force sensor according to yet another embodiment.

[0269] Figure 27 Examples and Figure 26 The embodiment of the present invention is different in that all of the sensor hole SH, the force driving pads TP1 to TP5, and the force sensing pads RP1 to RP5 are provided at the other side of the force sensor 400. Figure 26 The description of the embodiments is repeated to avoid redundancy.

[0270] in addition, Figures 25 to 27 The sensor hole SH shown in FIG. 4 may be replaced with a notch portion in which one side of the force sensor 400 is recessed concavely.

[0271] Figure 28 is a plan view illustrating a display panel, a display circuit board, a display driving circuit, and a touch driving circuit according to yet another embodiment.

[0272] Figure 28 Examples and Figure 20 The difference of the embodiment is that the sub-display area SDA of the display panel 300 is arranged to be surrounded by the main display area MDA and the non-display area NDA. Figure 20 The description of the embodiments is repeated to avoid redundancy.

[0273] Reference Figure 28When the optical sensor 740 is arranged across both the display area DA and the non-display area NDA at the boundary between the display area DA and the non-display area NDA, the sub-display area SDA may overlap with the area of ​​the display area DA where the optical sensor 740 is provided in the third direction (Z-axis direction). A portion of the sub-display area SDA may be adjacent to the main display area MDA, and the remaining portion of the sub-display area SDA may be adjacent to the non-display area NDA. The sub-display area SDA is shown as having a semicircular planar shape, but the inventive concept is not limited thereto. For example, the sub-display area SDA may be formed in a polygonal shape or an elliptical shape.

[0274] like Figure 28 As shown in FIG, when the auxiliary display area SDA is arranged at one edge of the display panel 300, the sensor hole SH of the force sensor 400 may also be as shown in FIG. Figures 25 to 27 As shown in FIG, it is arranged at one edge of the force sensor 400 .

[0275] Figure 29 is a flowchart illustrating a method of calculating a force value of a sensor hole formed in a force sensor according to an exemplary embodiment.

[0276] First, as in Figure 29 In the first operation S101, the force driving circuit 340 may sequentially apply driving signals to the force driving electrodes TE1 to TE5 of the force sensor 400 through the force driving circuit board 510, and may receive sensing signals from the force sensing electrodes RE1 to RE5 of the force sensor 400 through the force sensing circuit board 520.

[0277] Specifically, when force is applied to force sensor 400, force-sensitive layer 430 contacts the force-driving electrodes and the force-sensing electrodes. Therefore, current can flow from the force-driving electrodes to the force-sensing electrodes through force-sensitive layer 430. Force-driving circuit 340 can receive the current or voltage applied from the force-sensing electrodes as a sensing signal.

[0278] Second, as in Figure 29 In the second operation S102, the force driving circuit 340 may analyze the sensing signal to calculate a force value of each of the force sensing cells PSC disposed in the crossing areas of the force driving electrodes TE1 to TE5 and the force sensing electrodes RE1 to RE5.

[0279] The force driving circuit 340 may receive the current or voltage applied from each of the force sensing electrodes as a sensing signal to calculate the resistance of each of the force sensing cells PSC based on the sensing signal. Because the force value decreases as the resistance of the force sensing cell PSC increases, the force driving circuit 340 may calculate the force value based on the resistance of each force sensing cell PSC by using a pre-stored lookup table or executing an algorithm.

[0280] Third, as in Figure 29 In the third operation S103, the force driving circuit 340 may output the force value to the main processor 710. The main processor 710 may use the force value to calculate the force value of the sensor hole SH. Alternatively, the force driving circuit 340 may use the force value to calculate the force value of the sensor hole SH before outputting the force value to the main processor 710.

[0281] The force sensor 400 may include a sensor hole SH configured to guide light incident from the through hole TH or the sub display area SDA of the display panel 300 to the optical sensor 740. Since the third force driving electrode TE3 and the third force sensing electrode RE3 are removed from the sensor hole SH, the force driving circuit 340 may estimate the force value of the sensor hole SH of the force sensor 400. Figure 30 As shown in , the force driving circuit 340 can calculate the force value of the force sensing unit PSC around the sensor hole SH.

[0282] The force driving circuit 340 can calculate the force value of the sensor hole SH by considering the distribution of force values ​​of the force sensing cells PSC arranged around the sensor hole SH. For example, the force driving circuit 340 can analyze the force values ​​of the force sensing cells PSC arranged around the sensor hole SH, including force values ​​184 and 120 arranged in the fourth direction DR4, force values ​​273 and 188 arranged in the fifth direction DR5, force values ​​198 and 88 arranged in the first diagonal direction DR7, and force values ​​146 and 210 arranged in the second diagonal direction DR8 intersecting the first diagonal direction DR7. Thus, the trend of the force values ​​of the force sensing cells PSC arranged around the sensor hole SH can be grasped, thereby calculating the force value of the sensor hole SH.

[0283] Optionally, the force driving circuit 340 may calculate an average or median value of the force values ​​of the force sensing cells PSC disposed around the sensor hole SH as the force value of the sensor hole SH. Alternatively, when a user measures blood pressure, the user is likely to press the display device 10 after positioning the center of their finger OBJ above the sensor hole SH. Therefore, the force value of the sensor hole SH is likely to be greater than the force value of the force sensing cells PSC disposed around the sensor hole SH. Therefore, the force driving circuit 340 may calculate an average or median value of N (N is a positive integer equal to or greater than 2) upper force values ​​(N larger force values) of the force values ​​of the force sensing cells PSC disposed around the sensor hole SH as the force value of the sensor hole SH.

[0284] Alternatively, the force driving circuit 340 may calculate the sum of the force values ​​to determine the force value of the sensor hole SH using a lookup table storing pre-calculated force values ​​of the sensor hole SH according to the sum of the force values.

[0285] Specifically, the force value calculated by the force sensor (eg, Figure 31 The force value calculated by the force sensor 400 including the sensor hole SH (as shown in Figure 30 The sum of the force values ​​of the sensor hole SH is calculated. Figure 32 As shown in , the ratio of the force value of the sensor hole SH to the sum of the force values ​​of the force sensor 400 may vary depending on the magnitude of the force applied to the force sensor 400. Figure 32 In the figure, the X-axis represents the force (gram-force (gf)) applied by the object, and the Y-axis represents the ratio of the force value of the sensor hole SH in the force sensor 400 including the sensor hole SH to the sum of the force values ​​of the force sensors not including the sensor hole SH. Therefore, the sum of the force values ​​calculated by the force sensor 400 including the sensor hole SH and the force value of the sensor hole SH can be calculated according to the magnitude of the force applied to the force sensor 400 and stored in the lookup table.

[0286] In the force sensor and the display device including the force sensor according to the embodiment, light emitted from the light emitting unit may be absorbed by or reflected from blood vessels of a user's finger after passing through a sensor hole of the force sensor and a through-hole of a display panel. Light reflected from blood vessels of the user's finger may be sensed by an optical sensor after passing through the through-hole of the display panel and the sensor hole of the force sensor.

[0287] In the force sensor and the display device including the force sensor according to the embodiment, although the first sub-force sensor electrode and the second sub-force sensor electrode are disconnected by the sensor hole, the first sub-force sensor electrode and the second sub-force sensor electrode can be respectively connected to the sub-force sensor wiring, so that the first sub-force sensor electrode and the second sub-force sensor electrode can be electrically connected to the force driving circuit.

[0288] In the force sensor and the display device including the force sensor according to the embodiment, although the first and second sub force sensor electrodes are disconnected by the sensor hole, the first and second sub force sensor electrodes may be electrically connected through the sensor connection wiring.

[0289] In the force sensor and the display device including the force sensor according to the embodiment, the force sensor electrode is removed from the sensor hole, but the force value of the sensor hole may be calculated using the force value of the force sensing unit.

[0290] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. A force sensor, comprising: a first base substrate and a second base substrate facing each other; a first force sensor electrode extending in a first direction on the first base substrate and arranged in a second direction intersecting the first direction; a second force sensor electrode extending in the second direction on the second base substrate and arranged in the first direction; as well as The sensor hole is configured to transmit light, wherein any one of the first force sensor electrodes includes a first sub-force sensor electrode disposed on a first side of the sensor hole and a second sub-force sensor electrode disposed on a second side of the sensor hole opposite to the first side, and The first sub-force sensor electrode and the second sub-force sensor electrode are disconnected by the sensor hole.

2. The force sensor according to claim 1, further comprising: a first sub-force sensor wiring, disposed on the first base substrate and connected to a first side end of the first sub-force sensor electrode; a second sub-force sensor wiring, disposed on the first base substrate and connected to a second side end of the second sub-force sensor electrode; A first sub-force sensor pad and a second sub-force sensor pad are disposed on the first base substrate and are connected to the first sub-force sensor wiring and the second sub-force sensor wiring, respectively.

3. The force sensor according to claim 1 , further comprising: A first force connection wiring is provided on the first base substrate and is configured to bypass the sensor hole to connect the first sub-force sensor electrode to the second sub-force sensor electrode.

4. The force sensor according to claim 1, wherein Each of a length of the first sub force sensor electrode in the first direction and a length of the second sub force sensor electrode in the first direction is smaller than a length of any one of the remaining first force sensor electrodes except the first force sensor electrode in the first direction.

5. The force sensor according to claim 1, wherein Any one of the second force sensor electrodes includes a third sub-force sensor electrode disposed on a third side of the sensor hole and a fourth sub-force sensor electrode disposed on a fourth side of the sensor hole opposite to the third side, and, The third sub-force sensor electrode and the fourth sub-force sensor electrode are separated by the sensor hole.

6. The force sensor according to claim 5, further comprising: a third sub-force sensor wiring, disposed on the second base substrate and connected to a third side end of the third sub-force sensor electrode; a fourth sub-force sensor wiring, disposed on the second base substrate and connected to a fourth side end of the fourth sub-force sensor electrode; as well as A third sub-force sensor pad and a fourth sub-force sensor pad are disposed on the second base substrate and are connected to the third sub-force sensor wiring and the fourth sub-force sensor wiring, respectively.

7. The force sensor according to claim 5, further comprising: A second force connection wiring is provided on the second base substrate and is configured to bypass the sensor hole to connect the third sub-force sensor electrode to the fourth sub-force sensor electrode.

8. The force sensor according to claim 5, wherein: Each of a length of the third sub force sensor electrode in the second direction and a length of the fourth sub force sensor electrode in the second direction is smaller than a length of any one of the remaining second force sensor electrodes except the second force sensor electrode in the second direction.

9. The force sensor according to claim 1, wherein: A second force sensor electrode disposed on a third side of the sensor hole among the second force sensor electrodes has a length in the second direction that is smaller than a length in the second direction of any of the remaining second force sensor electrodes.

10. The force sensor according to claim 1, further comprising: a force-sensitive layer disposed between the first force sensor electrode and the second force sensor electrode in a thickness direction of the first base substrate, and Each of the force-sensitive layers is in contact with at least one of any one of the first force sensor electrodes and any one of the second force sensor electrodes.

11. A display device, comprising: A display panel including a display area having pixels configured to display an image; a force sensor provided on one surface of the display panel to sense a force applied from the outside and including a sensor hole that transmits light in a thickness direction of the display panel; as well as an optical sensor disposed to overlap the sensor hole in the thickness direction of the display panel and configured to sense light incident through the sensor hole, wherein the force sensor comprises: first force sensor electrodes, any one of the first force sensor electrodes comprising a first sub-force sensor electrode disposed on a first side of the sensor hole and a second sub-force sensor electrode disposed on a second side of the sensor hole opposite to the first side, and The first sub-force sensor electrode and the second sub-force sensor electrode are disconnected by the sensor hole.

12. The display device according to claim 11, further comprising: a bottom panel cover provided on one surface of the force sensor and including a cover hole provided to overlap the sensor hole in the thickness direction of the display panel, Wherein, the size of the cover hole is larger than the size of the sensor hole.

13. The display device according to claim 12, further comprising: a bracket disposed on one surface of the force sensor and including a bracket hole disposed to overlap the sensor hole in the thickness direction of the display panel, Wherein, the size of the bracket hole is larger than the size of the sensor hole.

14. The display device according to claim 13, wherein: The optical sensor is disposed in the bracket hole.

15. The display device according to claim 11, further comprising: The light emitting unit is disposed to overlap the sensor hole in the thickness direction of the display panel and is configured to emit light.

16. The display device according to claim 11, wherein The display panel further includes a through hole arranged to overlap the sensor hole in the thickness direction of the display panel, and Wherein, the size of the through hole is smaller than the size of the sensor hole.

17. The display device according to claim 11, wherein The display area includes a main display area and a sub-display area overlapping the sensor hole in the thickness direction of the display panel, and wherein the number of pixels per unit area of ​​the main display region is greater than the number of pixels per unit area of ​​the auxiliary display region, and The auxiliary display area includes a pixel area and a transmission area, the pixel area is provided with the pixels, and the transmission area is provided on at least one side of the pixel area.

18. The display device according to claim 11, further comprising: a main circuit board having the optical sensor disposed on one surface of the main circuit board; a main processor and a main connector, disposed on another surface of the main circuit board opposite to the one surface; a display circuit board attached to one side of the display panel; as well as A cable connects the display circuit board to the main connector.

19. The display device according to any one of claims 11 to 18, wherein: The force sensor further comprises: A first base substrate on which the first force sensor electrode is disposed and a second base substrate on which the second force sensor electrode is disposed face each other, wherein The first force sensor electrodes extend in a first direction and are arranged in a second direction intersecting the first direction, and The second force sensor electrodes extend in the second direction and are arranged in the first direction.

20. A method for driving a force sensor, the method comprising: applying a drive signal to the first force sensor electrode and detecting a sense signal from the second force sensor electrode; analyzing the sensing signals to respectively calculate force values ​​of force sensing units disposed in intersection regions of the first force sensor electrode and the second force sensor electrode; as well as A force value of a sensor hole of the force sensor is calculated using the force value of the force sensing unit.

21. The method according to claim 20, wherein The step of calculating the force value of the sensor hole using the force value of the force sensing unit includes: calculating the force value of the sensor hole using a lookup table storing the force values ​​of the sensor hole according to the sum of the force values ​​of the force sensing units, wherein the force value of the sensor hole stored in the lookup table is calculated by subtracting a sum of force values ​​calculated by force sensors including the sensor hole from a sum of force values ​​calculated by force sensors not including the sensor hole.

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