Driving backplane, display device and manufacturing method of driving backplane

Abstract

The present invention provides a driving backplane, a display device and a manufacturing method of the driving backplane, which belongs to the field of display technology, and can at least partially solve the problem that the existing driving backplane and the light-emitting diode have a low electrical connection yield. The driving backplane of the embodiment of the present invention includes: a substrate; a driving circuit, located on the substrate; a plurality of driving electrodes, located on the substrate and connected to the driving circuit; a binding structure of conductive material, located on a side of each driving electrode away from the substrate, and connected to the driving electrode, for inserting into the electrode of the light-emitting diode to connect the driving backplane with the light-emitting diode; wherein the binding structure is in the shape of a sheet perpendicular to the substrate; in a direction gradually away from the substrate, the cross-sectional area of ​​the binding structure in a plane parallel to the substrate gradually decreases.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular relates to a driving backplane, a display device and a manufacturing method of the driving backplane. Background Art

[0002] Current light-emitting diode (LED) display technology faces many technical challenges. For example, during the production process of Micro LED (millimeter-level light-emitting diode) products, the light-emitting diodes need to be transferred from a sapphire substrate to a driving backplane (such as a silicon substrate). Since the number of light-emitting diodes transferred each time is very large, the stability and accuracy of the transfer technology are very high.

[0003] Transferring the light-emitting diode from the sapphire substrate to the driving backplane means connecting the light-emitting diode to the driving backplane, and electrically connecting the electrodes (cathode, anode) of the light-emitting diode to the driving electrodes of the driving backplane.

[0004] One implementation method is to set a microtube (with an open upper end) on the driving electrode of the driving backplane, and to electrically connect the electrode of the light-emitting diode with the driving electrode of the driving backplane by inserting the microtube into the electrode of the light-emitting diode.

[0005] The electrodes of the light-emitting diodes are connected to the driving backplane through a microtube structure. Although the light-emitting diodes can be transferred from the sapphire substrate to the driving backplane, it is difficult for the microtube structure to vertically penetrate the electrodes of the light-emitting diodes. Most of the microtube structures are collapsed in the process of penetrating the electrodes of the light-emitting diodes, resulting in a low yield of the electrical connection between the driving backplane and the light-emitting diodes.

[0006] Another implementation method is to set a pyramid (the bottom surface is connected to the driving electrode) on the driving electrode of the driving backplane, and penetrate the pyramid into the electrode of the light-emitting diode to achieve electrical connection between the electrode of the light-emitting diode and the driving electrode of the driving backplane.

[0007] The electrodes of the LEDs are connected to the driving backplane through a pyramid structure, and the LEDs can be transferred from the sapphire substrate to the driving backplane. However, since the pyramid structure penetrates the LED electrodes only to a shallow depth, the electrical connection yield between the driving backplane and the LEDs is low. Summary of the invention

[0008] The present invention at least partially solves the problem of low electrical connection yield between the existing driving backplane and the light emitting diode, and provides a driving backplane with high electrical connection yield with the light emitting diode, a display device and a manufacturing method of the driving backplane.

[0009] A first aspect of the present invention provides a driving backplane, the driving backplane comprising:

[0010] substrate;

[0011] A driving circuit, located on the substrate;

[0012] A plurality of driving electrodes, located on the substrate and connected to the driving circuit;

[0013] A binding structure of conductive material, located on a side of each driving electrode away from the substrate and connected to the driving electrode, and used for being inserted into the electrode of the light-emitting diode to connect the driving backplane with the light-emitting diode;

[0014] The binding structure is in the shape of a sheet perpendicular to the substrate; in a direction gradually away from the substrate, the cross-sectional area of ​​the binding structure in a plane parallel to the substrate gradually decreases.

[0015] Optionally, the end of the binding structure away from the substrate is a pointed end.

[0016] Optionally, each of the driving electrodes is provided with a plurality of binding structures.

[0017] A second aspect of the present invention provides a display device, the display device comprising:

[0018] The aforementioned drive backplane;

[0019] A plurality of light emitting diodes, each of which comprises two electrodes, and the binding structure of the driving backplane is inserted into each electrode to fix the light emitting diode on the driving backplane.

[0020] Optionally, the light emitting diode is a millimeter-level light emitting diode or a sub-millimeter-level light emitting diode.

[0021] Optionally, each electrode of the light-emitting diode includes an insertion portion made of aluminum, and the binding structure of the driving backplane is inserted into the insertion portion.

[0022] A third aspect of the present invention provides a method for manufacturing a driving backplane, wherein the driving backplane is the driving backplane described above, and the manufacturing method comprises:

[0023] preparing a driving circuit and a driving electrode on a substrate;

[0024] Preparing a sheet-like structure perpendicular to the substrate on the driving electrode;

[0025] A portion of the sheet-like structure is removed so that the remaining portion forms a bound structure.

[0026] Optionally, the sheet structure is in the shape of a closed ring or a retaining wall.

[0027] Optionally, removing a portion of the sheet structure so that the remaining portion forms a binding structure comprises:

[0028] forming a photoresist layer on a substrate;

[0029] Exposing and developing the photoresist to obtain a plurality of photoresist protection structures; wherein the cross-sectional area of ​​the photoresist protection structure in a plane parallel to the substrate gradually decreases in a direction gradually away from the substrate, and the orthographic projection of the photoresist protection structure on the substrate overlaps with the orthographic projection of the sheet structure on the substrate;

[0030] removing the portion of the sheet structure that is not in contact with the photoresist protection structure;

[0031] The photoresist is removed, and the remaining portion of the sheet-like structure forms a binding structure.

[0032] Further optionally, each of the photoresist protection structures is in a strip shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic diagram of a partial cross-sectional structure of a display device according to an embodiment of the present invention;

[0034] Figure 2a A partial side view of a driving backplane according to an embodiment of the present invention;

[0035] Figure 2b A partial side view of a driving backplane according to an embodiment of the present invention;

[0036] Figure 2c A partial side view of a driving backplane according to an embodiment of the present invention;

[0037] Figure 2d A partial side view of a driving backplane according to an embodiment of the present invention;

[0038] Figure 2e A partial side view of a driving backplane according to an embodiment of the present invention;

[0039] Figure 3 This is a structural photo of a binding structure of a driving backplane according to an embodiment of the present invention;

[0040] Figure 4 is a schematic diagram of a sheet structure according to an embodiment of the present invention;

[0041] Figure 5a A schematic structural diagram of a sheet structure and a photoresist protection structure formed on a substrate according to an embodiment of the present invention;

[0042] Figure 5b A schematic structural diagram of another sheet structure and a photoresist protection structure formed on a substrate according to an embodiment of the present invention;

[0043] Figure 6A schematic flow chart of a method for manufacturing a driving backplane according to an embodiment of the present invention;

[0044] Figure 7 A schematic flow chart of another method for manufacturing a driving backplane according to an embodiment of the present invention;

[0045] Figure 8 A schematic diagram of a process of manufacturing a sheet structure according to an embodiment of the present invention;

[0046] Fig. 9 A schematic diagram of a process of manufacturing a sheet structure according to an embodiment of the present invention;

[0047] Fig.10 A schematic diagram of a process of manufacturing a sheet structure according to an embodiment of the present invention;

[0048] Fig.11 A schematic diagram of a process of manufacturing a sheet structure according to an embodiment of the present invention;

[0049] Among them, the figure markings are: 1, substrate; 2, driving circuit; 3, driving electrode; 4, binding structure; 5, light-emitting diode; 6, electrode; 61, electrode body; 62, insertion part; 7, photoresist protection structure; 8, sheet structure; 9, PLN layer; 10, metal mask; 11, conductive material layer. DETAILED DESCRIPTION

[0050] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0051] It should be understood that the specific embodiments and drawings described herein are only used to explain the present invention rather than to limit the present invention.

[0052] It can be understood that, in the absence of conflict, the various embodiments of the present invention and the various features in the embodiments can be combined with each other.

[0053] It can be understood that, for the convenience of description, the drawings of the present invention only show the parts related to the present invention, while the parts irrelevant to the present invention are not shown in the drawings.

[0054] It can be understood that, without conflict, the functions and steps marked in the flowcharts and block diagrams of the present invention may occur in an order different from that marked in the drawings.

[0055] It is understood that the flowcharts and block diagrams of the present invention illustrate the possible architectures, functions, and operations of the systems, devices, equipment, and methods according to the various embodiments of the present invention. Each box in the flowchart or block diagram may represent a unit, module, program segment, or code, which contains executable instructions for implementing the specified functions. Moreover, each box or combination of boxes in the block diagram and flowchart may be implemented by a hardware-based system that implements the specified functions, or may be implemented by a combination of hardware and computer instructions.

[0056] It can be understood that the units and modules involved in the embodiments of the present invention can be implemented by software or hardware. For example, the units and modules can be located in a processor.

[0057] Embodiment 1:

[0058] Reference Figure 1 , this embodiment provides a driving backplane, which includes:

[0059] Substrate 1;

[0060] A driving circuit 2 is located on the substrate 1;

[0061] A plurality of driving electrodes 3, located on the substrate 1 and connected to the driving circuit 2;

[0062] A binding structure 4 of conductive material, located on a side of each driving electrode 3 away from the substrate 1 and connected to the driving electrode 3, and used to be inserted into the electrode 6 of the light-emitting diode 5 to connect the driving backplane with the light-emitting diode 5;

[0063] The binding structure 4 is in the shape of a sheet perpendicular to the substrate 1 ; in a direction gradually away from the substrate 1 , the cross-sectional area of ​​the binding structure 4 in a plane parallel to the substrate 1 gradually decreases.

[0064] The driving backplane is composed of a substrate 1 (such as a glass substrate or a silicon substrate), a driving circuit 2 , a driving electrode 3 , and a binding structure 4 located on the substrate 1 .

[0065] The driving circuit 2 is connected to the driving electrode 3 and is used to provide a driving signal to the driving electrode 3 , that is, when the driving circuit 2 is running, the driving electrode 3 can obtain the driving signal.

[0066] Figure 1 to Figure 2e The layer where the driving circuit 2 is located is represented by a rectangle, but it should be understood that the actual driving circuit 2 is not a complete layer.

[0067] The binding structure 4 is located on the side of the driving electrode 3 away from the substrate 1, referring to Figure 3 , which is not limited to Figure 1The shape in the figure is specifically a sheet-like shape perpendicular to the substrate 1, or a sheet of conductive material "standing" on the driving electrode 3. Since the binding structure 4 is "sheet-like", its thickness is very small relative to the size of its side (i.e., the surface perpendicular to the substrate 1) (otherwise it is not "sheet-like"). For example, the thickness of the binding structure 4 can be less than a predetermined threshold, such as 0.5 μm.

[0068] In the direction gradually away from the substrate 1, the cross-sectional area of ​​the binding structure 4 in the plane parallel to the substrate 1 gradually decreases, that is, the cross-sectional area of ​​the end away from the substrate 1 in the plane parallel to the substrate 1 is smaller than the cross-sectional area of ​​the end close to the substrate 1 in the plane parallel to the substrate 1, or in other words, the "sheet" is larger at the bottom and smaller at the top.

[0069] Figures 2a to 2e The side views of the driving backplane composed of several binding structures 4 of different shapes are shown in different angles, which will not be described one by one here. Figures 2a to 2e The "relatively smaller" end of the light emitting diode 5 can be inserted into the electrode 6. Of course, the binding structure 4 can also be Figures 2a to 2e Other "lamellar structures" that meet the description.

[0070] The binding structure 4 is a conductive material, one end of which is close to the substrate 1 and is connected to the driving electrode 3, and the other end can be inserted into the corresponding electrode 6 (such as the cathode and the anode) of the light-emitting diode 5, so that the driving backplane can be connected to the light-emitting diode 5 through the binding structure 4. When the binding structure 4 is inserted into the electrode 6 of the light-emitting diode 5, the driving signal obtained by the driving electrode 3 from the driving circuit 2 can finally reach the electrode 6 of the light-emitting diode 5 through the binding structure 4, providing energy for the light-emitting diode 5 to work.

[0071] The binding structure 4 of the driving backplane of the present embodiment is in the form of a sheet, and is a structure that is larger at the bottom and smaller at the top. Therefore, the cross-sectional area of ​​the end thereof that is away from the substrate 1 in a plane parallel to the substrate 1 is smaller, or "sharper". Therefore, when the binding structure 4 is inserted into the electrode 6 of the light-emitting diode 5, it is equivalent to inserting from the "sharper" end. The contact area between the binding structure 4 and the electrode 6 of the light-emitting diode 5 is smaller. Under the same pressure, the pressure is greater, and the electrode 6 of the light-emitting diode 5 can be penetrated deeper. Therefore, the driving signal can better reach the electrode 6 of the light-emitting diode 5 through the binding structure 4, thereby improving the electrical connection yield between the driving backplane and the light-emitting diode 5.

[0072] Optionally, the end of the binding structure 4 away from the substrate 1 is a pointed end.

[0073] Reference Figure 3 In a direction gradually away from the substrate 1 , the cross-sectional area of ​​the binding structure 4 in a plane parallel to the substrate 1 preferably gradually decreases until an end thereof away from the substrate 1 forms a sharp tip.

[0074] The tip has the smallest contact area with the electrode 6 of the light-emitting diode 5 during the process of being inserted therein. Under the same pressure, the tip insertion pressure is greater than that of other structures. Therefore, the tip can be inserted deeper into the electrode 6 of the light-emitting diode 5, that is, the driving signal can better reach the electrode 6 of the light-emitting diode 5 through the binding structure 4, further improving the electrical connection yield between the driving backplane and the light-emitting diode 5.

[0075] Optionally, a plurality of binding structures 4 are provided on each driving electrode 3 .

[0076] In order to improve the stability of binding, a plurality of binding structures 4 may be provided on one driving electrode 3 and connected to the same electrode 6 of the light emitting diode 5. The plurality of binding structures 4 on one driving electrode 3 may be independent of each other or may be in contact with each other.

[0077] Embodiment 2:

[0078] Reference Figure 1 , this embodiment provides a display device, which specifically includes:

[0079] The aforementioned drive backplane;

[0080] There are a plurality of light emitting diodes 5, each light emitting diode 5 comprises two electrodes 6, and a binding structure 4 of a driving backplane is inserted into each electrode 6 to fix the light emitting diode 5 on the driving backplane.

[0081] The display device includes a driving backplane and a plurality of light-emitting diodes 5, wherein the light-emitting diodes 5 include two electrodes 6, and the binding structure 4 of the driving backplane can be inserted into the electrodes 6. When the binding structure 4 of the driving backplane is inserted into the electrodes 6, the light-emitting diodes 5 are fixed on the driving backplane.

[0082] Specifically, the display device may be any product or component with a display function, such as a light emitting diode (LED) display panel, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or the like.

[0083] The binding structure 4 of the driving backplane in the display device of this embodiment is in the form of a sheet, and is a structure that is larger at the bottom and smaller at the top. Therefore, the cross-sectional area of ​​the end thereof that is away from the substrate 1 in a plane parallel to the substrate 1 is smaller, or "sharper". Therefore, when the binding structure 4 is inserted into the electrode 6 of the light-emitting diode 5, it is equivalent to inserting from the "sharper" end. The contact area between the binding structure 4 and the electrode 6 of the light-emitting diode 5 is small. Under the same pressure, the pressure is greater, and the electrode 6 of the light-emitting diode 5 can be penetrated deeper. Therefore, the driving signal can better reach the electrode 6 of the light-emitting diode 5 through the binding structure 4, thereby improving the electrical connection yield between the driving backplane and the light-emitting diode 5.

[0084] Optionally, the light emitting diode 5 is a millimeter-level light emitting diode (Micro LED) or a sub-millimeter-level light emitting diode (Mini LED).

[0085] As a new generation of display technology, millimeter-level light-emitting diode technology and submillimeter-level light-emitting diode technology are smaller in size and more suitable for achieving high-resolution displays.

[0086] Since millimeter-level light-emitting diodes or submillimeter-level light-emitting diodes are smaller than other existing light-emitting diodes, the number of light-emitting diodes fixed on the driving backplane is greater, and higher requirements are placed on the stability and accuracy of the technology for fixing the light-emitting diodes on the driving backplane. However, the existing technology cannot meet the requirements for binding millimeter-level light-emitting diodes or submillimeter-level light-emitting diodes to the driving backplane, and poor electrical connection between the millimeter-level light-emitting diodes or submillimeter-level light-emitting diodes and the driving backplane may easily occur.

[0087] The binding structure 4 of the display device of the present application is in the form of a sheet, and has a larger lower portion and a smaller upper portion. The end with a smaller cross-sectional area in a plane parallel to the substrate 1 is inserted into the electrode 6 of the light-emitting diode 5. That is, when it is inserted into the electrode 6 of the light-emitting diode 5, the contact area with the electrode 6 of the light-emitting diode 5 is small. Under the same pressure, the pressure is greater, and it can penetrate deeper into the electrode 6 of the light-emitting diode 5, thereby improving the electrical connection yield between the driving backplane and the light-emitting diode 5.

[0088] Optionally, the electrode 6 of the light-emitting diode 5 includes an electrode body 61 and an insertion portion 62 made of aluminum, and the binding structure 4 of the driving backplane is inserted into the insertion portion 62 of the light-emitting diode 5 .

[0089] In order to facilitate the insertion of the binding structure 4 into the electrode 6 of the light-emitting diode 5, the electrode 6 needs to be relatively soft. However, since the material of the electrode (i.e., the electrode body 61) of the light-emitting diode 5 itself does not necessarily meet the softness requirement for the insertion of the binding structure 4, an insertion portion 62 made of aluminum can be provided on the electrode body 61, and the binding structure 4 is inserted into the softer aluminum to achieve electrical connection with the electrode body 61 through the aluminum.

[0090] Embodiment 3:

[0091] Reference Figure 6 This embodiment provides a method for manufacturing a driving backplane, the driving backplane is any one of the driving backplanes described above, and the manufacturing method includes:

[0092] S101 , preparing a driving circuit 2 and a driving electrode 3 on a substrate 1 .

[0093] A driving circuit 2 and a driving electrode 3 are prepared on a substrate 1 , and the driving circuit 2 and the driving electrode 3 are connected.

[0094] S102 , preparing a sheet structure 8 perpendicular to the substrate 1 on the driving electrode 3 .

[0095] A sheet structure 8 perpendicular to the substrate 1 is prepared on the driving electrode 3, referring to Figure 4 Optionally, the sheet structure 8 is in the shape of a closed ring or a retaining wall.

[0096] One implementation of the sheet-like structure 8 is that the projection of the sheet-like structure 8 on the substrate 1 can form a closed structure, that is, the sheet-like structure 8 is a ring-shaped or "cylindrical" structure "standing" on the substrate 1, such as a "microtube".

[0097] Among them, the specific parameters of the microtube can be shown in the following table:

[0098]

[0099]

[0100] One implementation of the sheet structure 8 is that the projection of the sheet structure 8 on the substrate 1 is a non-closed linear figure, so the sheet structure 8 is in the shape of a retaining wall. Of course, the retaining wall can be a straight line or an arc, such as a rectangular structure with a thickness less than a predetermined threshold.

[0101] It is easier to obtain a structure with a gradually decreasing cross-sectional area of ​​the tip or the like parallel to a certain plane by processing on a closed ring or retaining wall structure than on other structures.

[0102] The specific steps of preparing the sheet structure 8 perpendicular to the substrate 1 on the driving electrode 3 may be:

[0103] Reference Figure 8 A PLN layer (planarization layer) 9 is formed on the substrate 1, and a metal mask (Hard Mask-Metal) 10 is formed on the PLN layer 9 through a composition process. The metal mask 10 has an opening at a position corresponding to the driving electrode 3.

[0104] By etching the PLN layer 9, the PLN layer 9 corresponding to the opening of the metal mask 10 can be removed, and then the metal mask 10 is removed. Fig. 9 , obtaining a PLN layer 9 having grooves on the driving electrode 3.

[0105] A conductive material layer 11 (such as a metal layer) is deposited on the substrate 1. Fig.10 , wherein the conductive material layer 11 is obviously also deposited on the sidewall of the groove.

[0106] By patterning, the conductive material layer 11 at other positions other than the grooves is removed, and the PLN layer 9 is removed. Fig.11 , the remaining conductive material layer 11 on the side wall of the groove is the above sheet structure 8.

[0107] In the prior art, the sheet structure 8 is the binding structure 4, but since most of the sheet structures 8 are closed rings or other structures with a constant cross-sectional area in a plane parallel to the substrate 1, the depth of the electrode 6 inserted into the light-emitting diode 5 is relatively shallow, which easily leads to poor connection, etc. Therefore, it is necessary to continue processing based on the sheet structure 8.

[0108] S103 , removing a portion of the sheet structure 8 so that the remaining portion forms a binding structure 4 .

[0109] In the direction gradually moving away from the substrate 1 , the cross-sectional area of ​​the binding structure 4 in the plane parallel to the substrate 1 gradually decreases.

[0110] A part of the sheet structure 8 is removed by a method so that the remaining part forms a structure with a cross-sectional area gradually decreasing in a direction gradually away from the substrate 1 and in a plane parallel to the substrate 1 , and the remaining part is the binding structure 4 .

[0111] Of course, the binding structure 4 can also be made on the basis of a non-sheet structure 8 such as a pyramid, for example, by cutting off the pyramid whose thickness exceeds a predetermined threshold so that its thickness is less than the predetermined threshold.

[0112] Among them, the specific parameters of the pyramid can be shown in the following table:

[0113]

[0114] Since the thickness of the pyramid is generally large, it is easy to cause waste of raw materials. Therefore, the sheet structure 8 is generally further processed to obtain the binding structure 4.

[0115] In the manufacturing method of the driving backplane of the present embodiment, the binding structure 4 of the manufactured driving backplane is in the shape of a sheet, and has a structure that is larger at the bottom and smaller at the top. Therefore, the cross-sectional area of ​​the end thereof away from the substrate 1 in the plane parallel to the substrate 1 is smaller, or "sharper". Therefore, when the binding structure 4 is inserted into the electrode 6 of the light-emitting diode 5, it is equivalent to inserting from the "sharper" end. The contact area between the binding structure 4 and the electrode 6 of the light-emitting diode 5 is small. Under the same pressure, the pressure is greater, and the electrode 6 of the light-emitting diode 5 can be penetrated deeper. Therefore, the driving signal can better reach the electrode 6 of the light-emitting diode 5 through the binding structure 4, thereby improving the electrical connection yield between the driving backplane and the light-emitting diode 5.

[0116] Reference Figure 7 Optionally, removing a portion of the sheet structure 8 so that the remaining portion forms the binding structure 4 comprises:

[0117] S1031 , forming a photoresist layer 7 on the substrate 1 .

[0118] S1032 , exposing and developing the photoresist to obtain a plurality of photoresist protection structures 7 .

[0119] In the direction gradually away from the substrate 1 , the cross-sectional area of ​​the photoresist protection structure 7 in the plane parallel to the substrate 1 gradually decreases, and the orthographic projection of the photoresist protection structure 7 on the substrate 1 overlaps with the orthographic projection of the sheet structure 8 on the substrate 1 .

[0120] A photoresist layer is formed on the substrate 1 by coating a photoresist or the like. Figure 5a , using the exposure edge diffraction effect, a photoresist protection structure 7 with a slope is formed (the slope is formed due to edge diffraction), that is, in the direction gradually away from the substrate 1, the cross-sectional area of ​​the photoresist protection structure 7 in the plane parallel to the substrate 1 gradually decreases. And the orthographic projection of the photoresist protection structure 7 on the substrate 1 overlaps with the orthographic projection of the sheet structure 8 on the substrate 1, that is, the photoresist protection structure 7 and the sheet structure 8 have overlapping parts.

[0121] Reference Figure 5a Since the photoresist protection structure 7 is larger at the bottom and smaller at the top, and it is in contact with the sheet structure 8, the contact portion between the photoresist protection structure 7 and the sheet structure 8 is also larger at the bottom and smaller at the top, that is, Figure 3 The structure shown.

[0122] S1033 , removing the portion of the sheet structure 8 that is not in contact with the photoresist protection structure 7 .

[0123] With the photoresist as protection, the structure of the sheet structure 8 that is not protected by the photoresist, that is, the structure that is not in contact with the photoresist protection structure 7, is removed. Among them, since the portion of the sheet structure 8 that is in contact with the photoresist protection structure 7 is also larger at the bottom and smaller at the top, after the portion of the sheet structure 8 that is not in contact with the photoresist protection structure 7 (that is, the portion that is not protected by the photoresist) is removed, the remaining portion of the sheet structure 8 is also larger at the bottom and smaller at the top.

[0124] S1034 , removing the photoresist, and the remaining part of the sheet structure 8 forms a binding structure 4 .

[0125] Since the remaining part of the sheet structure 8 is also larger at the bottom and smaller at the top, that is, its cross-sectional area in a plane parallel to the substrate 1 gradually decreases, that is, it meets the requirements of the binding structure 4. Therefore, it is only necessary to remove the remaining part of the photoresist to form the binding structure 4.

[0126] The photoresist technology is a relatively mature technology in the display field. Using the photoresist to remove a portion of the sheet structure 8 so that the remaining portion forms the binding structure 4 is simple and easy to implement.

[0127] Optionally, each photoresist protection structure 7 is in a strip shape.

[0128] Reference Figure 5b , the photoresist protection structure 7 is in a strip shape, and one photoresist protection structure 7 can contact with a plurality of sheet structures 8 , that is, a plurality of binding structures 4 can be formed.

[0129] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A driving backplane, characterized in that: The driving backplane comprises: substrate; A driving circuit, located on the substrate; A plurality of driving electrodes, located on the substrate and connected to the driving circuit; A binding structure of conductive material, located on a side of each driving electrode away from the substrate and connected to the driving electrode, and used for being inserted into the electrode of the light-emitting diode to connect the driving backplane with the light-emitting diode; Among them, the binding structure is a sheet perpendicular to the substrate, the thickness of the binding structure is less than the maximum width of the side of the binding structure; the thickness of the binding structure is less than 0.5μm; in the direction gradually away from the substrate, the cross-sectional area of ​​the binding structure in the plane parallel to the substrate gradually decreases.

2. The driving backplane according to claim 1, characterized in that: The end of the binding structure away from the substrate is a pointed end.

3. The driving backplane according to claim 1, characterized in that: A plurality of binding structures are arranged on each of the driving electrodes.

4. A display device, characterized in that: The display device comprises: The driving backplane according to any one of claims 1 to 3; A plurality of light emitting diodes, each of which comprises two electrodes, and the binding structure of the driving backplane is inserted into each electrode to fix the light emitting diode on the driving backplane.

5. The display device according to claim 4, characterized in that: The light emitting diode is a millimeter-level light emitting diode or a sub-millimeter-level light emitting diode.

6. The display device according to claim 4, characterized in that: Each electrode of the light emitting diode includes an inserting portion made of aluminum, and the binding structure of the driving backplane is inserted into the inserting portion.

7. A method for manufacturing a driving backplane, characterized in that: The driving backplane is the driving backplane according to any one of claims 1 to 3, and the preparation method comprises: preparing a driving circuit and a driving electrode on a substrate; A sheet structure perpendicular to the substrate is prepared on the driving electrode; the thickness of the binding structure is less than the maximum width of the side of the binding structure; the thickness of the binding structure is less than 0.5 μm; A portion of the sheet-like structure is removed so that the remaining portion forms a bound structure.

8. The method according to claim 7, characterized in that The sheet structure is in a closed ring shape or a retaining wall shape.

9. The method according to claim 7, characterized in that: The removing of a part of the sheet structure so that the remaining part forms a binding structure comprises: forming a photoresist layer on a substrate; Exposing and developing the photoresist to obtain a plurality of photoresist protection structures; wherein the cross-sectional area of ​​the photoresist protection structure in a plane parallel to the substrate gradually decreases in a direction gradually away from the substrate, and the orthographic projection of the photoresist protection structure on the substrate overlaps with the orthographic projection of the sheet structure on the substrate; removing the portion of the sheet structure that is not in contact with the photoresist protection structure; The photoresist is removed, and the remaining portion of the sheet-like structure forms a binding structure.

10. The method according to claim 9, characterized in that Each of the photoresist protection structures is in a strip shape.

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