Millimeter wave antenna, antenna array and electronic device

Abstract

The application discloses a millimeter wave antenna, an antenna array and electronic equipment, and sets a first circuit board and a second circuit board on two sides of a wave-absorbing layer respectively; the first circuit board comprises a first radiation patch and a first dielectric substrate from top to bottom; the second circuit board comprises a second radiation patch, a second dielectric substrate, a first ground plate, a third dielectric substrate and a feed line from top to bottom, and a signal hole connecting the second radiation patch and the feed line is arranged; and a through groove is arranged on the wave-absorbing layer, so that energy of the second radiation patch can be coupled to the first radiation patch to the maximum extent. The wave-absorbing layer is arranged around the radiation patch, high-order modes generated by the ground plate on the second circuit board can be suppressed, and cross-polarization components of the millimeter wave antenna are reduced; meanwhile, the wave-absorbing layer is arranged to design the millimeter wave antenna in layers, the number of layers of the circuit board is reduced, the type of via holes is reduced, and the processing cost is reduced.

Description

Technical Field

[0001] This invention belongs to the field of antenna technology, and particularly relates to a millimeter-wave antenna, antenna array, and electronic device. Background Technology

[0002] With the evolution of fifth-generation (G5) communication technology, communication equipment needs to develop towards low latency, high reliability, and large bandwidth. Millimeter waves, due to their short wavelength and wide bandwidth, can more easily meet these requirements and have therefore gradually been pushed onto the stage of G5 communication technology. To allow millimeter-wave communication technology to exert its full advantages, millimeter-wave antennas must not only meet requirements such as wide bandwidth, high isolation, high gain, and low cross-polarization, but also achieve low-cost manufacturing.

[0003] Currently, 5G millimeter-wave antennas are typically manufactured using multi-layer PCB processes. Considering integration with RF chips, this usually requires designing multiple circuit boards and complex via types. This inevitably increases the manufacturing cost of millimeter-wave antennas significantly.

[0004] In addition, because millimeter waves have short wavelengths, millimeter wave antennas are prone to exciting higher-order modes on the ground, which in turn increases the cross-polarization components of the antenna. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a millimeter-wave antenna, antenna array and electronic device to solve the problems of high processing cost and high cross-polarization component of existing millimeter-wave antennas.

[0006] To solve the above problems, the technical solution of the present invention is as follows:

[0007] The present invention provides a millimeter-wave antenna, which, from top to bottom, comprises a first circuit board, an absorbing layer, and a second circuit board.

[0008] The first circuit board includes a first dielectric substrate and a first radiating patch, wherein the first radiating patch is disposed on the upper or lower surface of the first dielectric substrate;

[0009] The upper surface of the absorbing layer is attached to the lower surface of the first dielectric substrate, and the lower surface of the absorbing layer is attached to the upper surface of the second circuit board; and a through groove is formed on the absorbing layer, the through groove corresponding to the projection area of ​​the first radiating patch on the second circuit board;

[0010] The second circuit board includes a second radiating patch, a feed line, at least one signal hole, and a second dielectric substrate, a first ground plane, and a third dielectric substrate stacked from top to bottom; the second radiating patch is disposed on the upper surface of the second dielectric substrate; the feed line is disposed on the lower surface of the third dielectric substrate; the signal hole passes through the second dielectric substrate, the first ground plane, and the third dielectric substrate, and both ends of the signal hole are electrically connected to the second radiating patch and the feed line, respectively.

[0011] In the millimeter-wave antenna of the present invention, the upper surface of the absorbing layer is provided with a receiving groove for accommodating the first circuit board, and the receiving groove is connected to the through slot.

[0012] In the millimeter-wave antenna of the present invention, the upper surface and the lower surface of the absorbing layer are parallel.

[0013] The millimeter-wave antenna of the present invention has the first radiating patch and the second radiating patch having a polygonal or circular shape or a combination of polygonal and circular shapes.

[0014] In the millimeter-wave antenna of the present invention, the first ground plane has anti-soldering pads at the points where signal holes are inserted.

[0015] In the millimeter-wave antenna of the present invention, the projection of the first radiating patch onto the plane containing the second radiating patch partially coincides with the second radiating patch.

[0016] In the millimeter-wave antenna of the present invention, the second radiating patch has two signal holes and two feed lines corresponding to it, for achieving orthogonal radiation.

[0017] The millimeter-wave antenna of the present invention further includes a fourth dielectric substrate, a second ground plane, a third ground plane, and a plurality of ground holes in the second circuit board;

[0018] The fourth dielectric substrate is disposed between the second dielectric substrate and the third dielectric substrate;

[0019] The second ground plane is disposed on the upper surface of the second dielectric substrate; the second ground plane is in the same layer as the second radiating patch, and the second ground plane has an opening corresponding to the second radiating patch;

[0020] The third ground plane is disposed on the lower surface of the second dielectric substrate; and the third ground plane has an opening corresponding to the second radiating patch;

[0021] A plurality of the aforementioned ground holes are respectively inserted through and electrically connected to the first floor, the second floor, and the third floor, and the plurality of the aforementioned ground holes are distributed around the periphery of the second radiating patch.

[0022] The millimeter-wave antenna of the present invention further includes a fourth ground plane; the fourth ground plane is disposed on the lower surface of the third dielectric substrate and is located on the same layer as the feed line.

[0023] The millimeter-wave antenna of the present invention has a feed line that is a grounded coplanar waveguide transmission line, a microstrip line, a stripline, or a SIW transmission line.

[0024] An array antenna of the present invention includes any one of the millimeter-wave antennas described above.

[0025] An electronic device of the present invention includes the millimeter-wave antenna or the array antenna described in any one of the above claims.

[0026] Because the present invention adopts the above technical solution, it has the following advantages and positive effects compared with the prior art:

[0027] In one embodiment of the present invention, a first circuit board and a second circuit board are respectively disposed on both sides of an absorbing layer. The first circuit board includes a first radiating patch and a first dielectric substrate from top to bottom. The second circuit board includes a second radiating patch, a second dielectric substrate, a first ground plane, a third dielectric substrate, and a feed line from top to bottom, and is provided with signal vias connecting the second radiating patch and the feed line. A through-slot is provided on the absorbing layer so that the energy of the second radiating patch can be coupled to the first radiating patch to the maximum extent. The absorbing layer around the radiating patch can suppress the high-order modes generated by the ground plane on the second circuit board and reduce the cross-polarization component of the millimeter-wave antenna. At the same time, the absorbing layer allows for a layered design of the millimeter-wave antenna, reducing the number of circuit board layers and the types of vias, thereby reducing manufacturing costs. Attached Figure Description

[0028] Figure 1 This is a 3D perspective view of the millimeter-wave antenna of the present invention;

[0029] Figure 2 This is a 3D exploded view of the millimeter-wave antenna of the present invention;

[0030] Figure 3 This is a side view of the second circuit board of the millimeter-wave antenna of the present invention;

[0031] Figure 4 This is a top view of the second circuit board of the millimeter-wave antenna of the present invention;

[0032] Figure 5 This is a bottom view of the second circuit board of the millimeter-wave antenna of the present invention;

[0033] Figure 6 This is a 3D perspective view of one embodiment of the array antenna of the present invention.

[0034] Explanation of reference numerals in the attached drawings: 1: First circuit board; 101: First radiating patch; 102: First dielectric substrate; 2: Absorbing layer; 3: Second circuit board; 301: Second radiating patch; 302: Second dielectric substrate; 303: Third ground plane; 304: Fourth dielectric substrate; 305: First ground plane; 306: Third dielectric substrate; 307: Feed line; 308: First signal hole; 309: Second signal hole; 310: First feed line; 311: Second feed line; 312: Fourth ground plane; 313: Second ground plane; 314: Ground hole. Detailed Implementation

[0035] The present invention provides a millimeter-wave antenna, antenna array, and electronic device in further detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and claims.

[0036] Example 1

[0037] See Figures 1 to 3 In one embodiment, a millimeter-wave antenna includes, from top to bottom, a first circuit board 1, an absorbing layer 2, and a second circuit board 3.

[0038] The first circuit board 1 includes a first dielectric substrate 102 and a first radiating patch 101, wherein the first radiating patch 101 is disposed on the upper or lower surface of the first dielectric substrate 102.

[0039] The upper surface of the absorbing layer 2 is attached to the lower surface of the first dielectric substrate 102, and the lower surface of the absorbing layer 2 is attached to the upper surface of the second circuit board 3. A through-slot is formed on the absorbing layer 2, and the through-slot corresponds to the projection area of ​​the first radiating patch 101 on the second circuit board 3.

[0040] The second circuit board 3 includes a second radiating patch 301, a feed line 307, at least one signal hole, and a second dielectric substrate 302, a first ground plane 305, and a third dielectric substrate 306 stacked from top to bottom. The second radiating patch 301 is disposed on the upper surface of the second dielectric substrate 302. The feed line 307 is disposed on the lower surface of the third dielectric substrate 306. The signal hole passes through the second dielectric substrate 302, the first ground plane 305, and the third dielectric substrate 306, and both ends of the signal hole are electrically connected to the second radiating patch 301 and the feed line 307, respectively.

[0041] In this embodiment, a first circuit board 1 and a second circuit board 3 are respectively disposed on both sides of an absorbing layer 2. The first circuit board 1 includes a first radiating patch 101 and a first dielectric substrate 102 from top to bottom. The second circuit board 3 includes a second radiating patch 301, a second dielectric substrate 302, a third dielectric substrate 306, a first ground plane 305, and a feed line 307 from top to bottom, and is provided with signal holes connecting the second radiating patch 301 and the feed line 307. Through slots are provided on the absorbing layer 2 so that the energy of the second radiating patch 301 can be coupled to the first radiating patch 101 to the maximum extent. The absorbing layer 2 is disposed around the radiating patch to suppress the high-order modes generated by the ground plane on the second circuit board 3 and reduce the cross-polarization component of the millimeter-wave antenna; at the same time, the arrangement of the absorbing layer 2 allows for a layered design of the millimeter-wave antenna, reducing the number of circuit board layers and the types of vias, thereby reducing manufacturing costs.

[0042] The specific structure of the millimeter-wave antenna in this embodiment will be further described below:

[0043] In this embodiment, based on the through slot, a receiving groove can be formed on the upper surface of the absorbing layer 2. The first circuit board 1 can be placed in this receiving groove. The function of the receiving groove is to limit the position of the first circuit board 1 on the horizontal plane, so that the relative position of the first radiating patch 101 and the second radiating patch 301 is determined, so as to ensure that the projection of the first radiating patch 101 on the plane where the second radiating patch 301 is located partially coincides with the second radiating patch 301. At the same time, the height between the first circuit board 1 and the second circuit board 3 can be limited. By increasing or decreasing the height between the circuit board 1 and the second circuit board 3, the operating bandwidth of the antenna can be increased or decreased, and the antenna gain can also be increased or decreased. It can also maximize the suppression of the cross-polarization component caused on the second ground plane 313 of the second circuit board 3.

[0044] In this embodiment, the upper and lower surfaces of the absorbing layer 2 are parallel, and the specific location is outside the projection area of ​​the first radiating patch 101 on the second circuit board 3. The absorbing layer 2 can be made of absorbing material, specifically a dielectric material, a magnetic material, or a resistive material.

[0045] In this embodiment, the first radiating patch 101 and the second radiating patch 301 are polygonal, circular, or a combination of polygonal and circular shapes. Specifically, see [link to documentation]. Figure 1 and Figure 2 The first radiating patch 101 and the second radiating patch 301 can be square in shape. Of course, in other embodiments, the shape of the radiating patches can also be other shapes, which are not specifically limited here.

[0046] In this embodiment, the first ground plane 305 is provided with anti-solder pads at the point where the signal hole passes through, in order to prevent the signal hole and the first ground plane from being short-circuited.

[0047] In this embodiment, the first radiating patch 101 has two signal holes and two feed lines 307 for achieving orthogonal radiation. Specifically, it can be a first feed line 310, a second feed line 311, a first signal hole 308, and a second signal hole 309. The first signal hole 308 passes through the first ground plane 305 and connects the first feed line 310 and the second radiating patch 301, while the second signal hole 309 passes through the first ground plane 305 and connects the second feed line 311 and the second radiating patch 301.

[0048] Furthermore, the first feed line 310 and the second feed line 311 mentioned above can be a grounded coplanar waveguide transmission line, a microstrip line, a stripline, or a SIW transmission line.

[0049] See Figure 3 , Figure 4 and Figure 5 In this embodiment, the second circuit board 3 may further include a fourth dielectric substrate 304, a second ground plane 313, a fourth ground plane 312, and a plurality of ground vias 314. The fourth ground plane 312, together with the feed line 307, forms a grounded coplanar waveguide transmission line and is used to reduce interference from other lines to the feed line 307. The second ground plane 313 is used to reduce interference from the external environment to the second radiating patch 301.

[0050] The fourth dielectric substrate 304 is disposed between the second dielectric substrate 302 and the third dielectric substrate 306, and the second ground plane 313 is disposed on the upper surface of the second dielectric substrate 302. The second ground plane 313 is on the same layer as the second radiating patch 301, and the second ground plane 313 has an opening corresponding to the second radiating patch 301, which can be disposed in the opening. A plurality of ground holes 314 are respectively passed through and electrically connected to the first ground plane 305, the second ground plane 313 and the third ground plane 303, and the plurality of ground holes 314 are distributed around the second radiating patch 301, which serves to reduce cross-polarization and reduce mutual interference between antenna elements during arraying. The fourth ground plane 312 is disposed on the lower surface of the third dielectric substrate 306 and is on the same layer as the feed line 307.

[0051] That is, from top to bottom, the second circuit board 3 consists of a second ground plane 313, a second dielectric substrate 302, a fourth dielectric substrate 304, a first ground plane 305, a third dielectric substrate 306, and a fourth ground plane 312. The upper surface of the second ground plane 313 is attached to the lower surface of the absorbing layer 2. The second radiating patch 301 is on the same layer as the second ground plane 313. The first feed line 310 and the second feed line 311 are on the same layer as the fourth ground plane 312.

[0052] Example 2

[0053] This embodiment provides a millimeter-wave array antenna. Based on Embodiment 1, the number of millimeter-wave antennas is increased to form a linear array or a surface array.

[0054] The linear array is a 1×N (N≥2 and is a positive integer) antenna array, where N is the number of millimeter-wave antennas. The value of N can be set according to the actual situation to achieve simultaneous radiation from N antennas and form a beam scan in one dimension.

[0055] The antenna array is an N×M (N≥2, M≥2 and both N and M are positive integers) antenna array, meaning N antennas are set along the x-direction and M antennas are set along the y-direction, for a total of N×M antennas. The values ​​of N and M can be set according to the actual situation. For example... Figure 6 As shown, this is a 4×4 antenna array, with 4 antennas along the x-direction and 4 antennas along the y-direction, for a total of 16 antennas, arranged at equal intervals in both the x and y directions. This allows for higher directivity and beam scanning in 3D space.

[0056] Example 3

[0057] Based on the same concept, this embodiment provides an electronic device, including the millimeter-wave antenna in Embodiment 1 or the array antenna in Embodiment 2.

[0058] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, if these changes fall within the scope of the claims of the present invention and their equivalents, they shall still fall within the protection scope of the present invention.

Claims

1. A millimeter-wave antenna, characterized in that, From top to bottom, it includes a first circuit board, a wave-absorbing layer, and a second circuit board; The first circuit board includes a first dielectric substrate and a first radiating patch, wherein the first radiating patch is disposed on the upper or lower surface of the first dielectric substrate; The upper surface of the absorbing layer is attached to the lower surface of the first dielectric substrate, and the lower surface of the absorbing layer is attached to the upper surface of the second circuit board; and a through groove is formed on the absorbing layer, the through groove corresponding to the projection area of ​​the first radiating patch on the second circuit board; The second circuit board includes a second radiating patch, a feed line, at least one signal hole, and a second dielectric substrate, a first ground plane, and a third dielectric substrate stacked from top to bottom; the second radiating patch is disposed on the upper surface of the second dielectric substrate; The feed line is disposed on the lower surface of the third dielectric substrate; the signal hole passes through the second dielectric substrate, the first ground plane and the third dielectric substrate, and the two ends of the signal hole are electrically connected to the second radiating patch and the feed line, respectively.

2. The millimeter-wave antenna as described in claim 1, characterized in that, The upper surface of the absorbing layer is provided with a receiving groove for accommodating the first circuit board, and the receiving groove is connected to the through groove.

3. The millimeter-wave antenna as described in claim 1, characterized in that, The upper and lower surfaces of the absorbing layer are parallel.

4. The millimeter-wave antenna as described in claim 1, characterized in that, The first and second radiating patches are polygonal, circular, or a combination of polygonal and circular shapes.

5. The millimeter-wave antenna as described in claim 1, characterized in that, The first floor has anti-solder pads at the points where signal holes are inserted.

6. The millimeter-wave antenna as described in claim 1, characterized in that, The projection of the first radiating patch onto the plane where the second radiating patch is located partially coincides with the second radiating patch.

7. The millimeter-wave antenna as described in claim 1, characterized in that, The second radiating patch has two signal holes and two feed lines to achieve orthogonal radiation.

8. The millimeter-wave antenna as described in claim 1, characterized in that, The second circuit board also includes a fourth dielectric substrate, a second ground plane, a third ground plane, and several ground holes; The fourth dielectric substrate is disposed between the second dielectric substrate and the third dielectric substrate; The second ground plane is disposed on the upper surface of the second dielectric substrate; The second floor is on the same layer as the second radiant patch, and the second floor has an opening corresponding to the second radiant patch; The third ground plane is disposed on the lower surface of the second dielectric substrate; and the third ground plane has an opening corresponding to the second radiating patch; A plurality of the aforementioned ground holes are respectively inserted through and electrically connected to the first floor, the second floor, and the third floor, and the plurality of the aforementioned ground holes are distributed around the periphery of the second radiating patch.

9. The millimeter-wave antenna as described in claim 1, characterized in that, It also includes a fourth ground plane; the fourth ground plane is disposed on the lower surface of the third dielectric substrate and is located on the same layer as the feed line.

10. The millimeter-wave antenna as described in claim 1, characterized in that, The feed line is a grounded coplanar waveguide transmission line, microstrip line, stripline, or SIW transmission line.

11. An array antenna, characterized in that, Including the millimeter-wave antenna as described in any one of claims 1-10.

12. An electronic device, characterized in that, This includes the millimeter-wave antenna as described in any one of claims 1-10 or the array antenna as described in claim 11.

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