electronic devices

Abstract

The present application provides an electronic device with an infrared temperature measurement function, comprising a housing, a module bracket, an infrared lens, and an infrared temperature sensor. The housing has an inner cavity and a mounting opening, the mounting opening connecting the inner cavity with the exterior of the electronic device. The specific heat capacity of the material of the module bracket is greater than or equal to a specific heat capacity threshold, and / or the thermal conductivity of the material of the module bracket is greater than or equal to a thermal conductivity threshold. The module bracket is mounted on the housing, at least a portion of the module bracket is accommodated in the inner cavity, and the module bracket is partially exposed in the mounting opening. An infrared light hole is provided on the side of the module bracket facing away from the inner cavity, and the infrared light hole is exposed in the mounting opening. A receiving cavity is provided on the side of the module bracket facing the inner cavity, and the receiving cavity is connected to the infrared light hole. The infrared lens is located on the side of the module bracket facing away from the inner cavity and covers the infrared light hole. The infrared temperature sensor is located in the inner cavity, and at least a portion of the infrared temperature sensor is accommodated in the receiving cavity. This electronic device has high infrared temperature measurement accuracy.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0002] Several electronic devices with infrared temperature measurement capabilities are already available on the market, including ear thermometers, forehead thermometers, and mobile phones. These devices are compact and portable, making them well-suited for everyday temperature measurement. However, their measurement accuracy is poor and cannot meet demanding requirements. Summary of the Invention

[0003] The present application provides an electronic device with an infrared temperature measurement function, which can improve the accuracy of infrared temperature measurement.

[0004] In the first aspect, the present application provides an electronic device, comprising a shell, a module bracket, an infrared lens and an infrared temperature sensor; the shell has an inner cavity and a mounting opening, and the mounting opening connects the inner cavity with the outside of the electronic device; the specific heat capacity of the material of the module bracket is greater than or equal to the specific heat capacity threshold, and / or the thermal conductivity of the material of the module bracket is greater than or equal to the thermal conductivity threshold; the module bracket is installed in the shell, at least a portion of the module bracket is accommodated in the inner cavity, and the module bracket is partially exposed in the mounting opening; an infrared light hole is provided on the side of the module bracket facing away from the inner cavity, and the infrared light hole is exposed in the mounting opening; a receiving cavity is provided on the side of the module bracket facing the inner cavity, and the receiving cavity is connected to the infrared light hole; the infrared lens is located on the side of the module bracket facing away from the inner cavity, and covers the infrared light hole; the infrared temperature sensor is located in the inner cavity, and at least a portion of the infrared temperature sensor is accommodated in the receiving cavity.

[0005] In this embodiment, the housing is an external structural component of the electronic device. The housing can be a single component or assembled from multiple components. The housing encloses an inner cavity, with a mounting opening connecting the inner cavity with the outside world. The module bracket can be partially located within the inner cavity and partially extend from the mounting opening, or the module bracket can be completely housed within the inner cavity. The module bracket is partially exposed within the mounting opening, meaning that a portion of the module bracket overlaps the mounting opening (i.e., a portion of the module bracket is blocked by the mounting opening), and a portion of the module bracket is visible from the outside of the housing looking into the mounting opening. Opposite sides of the portion of the module bracket exposed within the mounting opening are provided with an infrared light port and a receiving cavity, respectively, with the infrared light port communicating with the receiving cavity. The infrared light port and the receiving cavity are both located within the boundaries of the mounting opening. The receiving cavity can be entirely within the inner cavity, partially within the inner cavity, and partially outside the inner cavity, or entirely outside the inner cavity. The infrared sensor is disposed within the inner cavity, with a portion or all of the infrared sensor located within the receiving cavity. The infrared lens is mounted on the module bracket and covers the infrared light port from the outside of the housing. Infrared radiation emitted by the target object can pass through the infrared lens, enter the receiving cavity, and be received by the infrared temperature sensor. After sensing by the infrared temperature sensor and signal processing by the electronic device, the temperature of the target object can be measured.

[0006] In this solution, the specific heat capacity and / or thermal conductivity of the material of the module bracket can be relatively large. A higher specific heat capacity results in a smaller temperature increase (or decrease) when the module bracket absorbs (or releases) a unit of heat. A larger thermal conductivity enables the module bracket to have a better thermal conductivity. The module bracket, the infrared temperature sensor and the infrared lens can constitute a thermal system, and the three can exchange heat with each other. The receiving cavity can promote heat exchange within the thermal system, so that the module bracket, the infrared temperature sensor and the infrared lens can reach a uniform temperature state in a relatively short time. The above design can meet the necessary conditions for accurate infrared temperature measurement, thereby improving the infrared temperature measurement accuracy of electronic equipment.

[0007] In one implementation, the surface of the module support facing the inner cavity is partially recessed to form a groove, the cavity of which serves as the receiving cavity; and the infrared light hole extends through the bottom wall of the groove. By forming a receiving cavity with a groove, a solution for improving infrared temperature measurement accuracy can be provided with a simple and easily manufactured structure.

[0008] In one implementation, a wall is protruding from a surface of the module support facing the inner cavity, and the space enclosed by the wall constitutes the receiving cavity. The infrared light aperture extends through the area of the surface enclosed by the wall. The design of the receiving cavity formed by the wall is simple and easy to manufacture, and can reliably improve the accuracy of infrared temperature measurement.

[0009] In one implementation, a avoidance groove is provided on the surface where the opening of the receiving cavity is located, and the avoidance groove is connected to the receiving cavity, and the depth of the avoidance groove is less than the depth of the receiving cavity. The receiving cavity can be formed by the groove or surrounded by the wall. The avoidance groove can avoid peripheral components, which are located in the inner cavity. The peripheral components can be arranged close to the infrared temperature sensor, and the peripheral components are used to assist the infrared temperature sensor in its operation. Moreover, since the avoidance groove is shallow, the avoidance groove can form a boss adjacent to the receiving cavity, and the boss can strengthen the heat exchange between the module bracket and the infrared temperature sensor, thereby helping to improve the accuracy of infrared temperature measurement.

[0010] In one embodiment, the electronic device includes an insulation ring that surrounds the infrared temperature sensor and the outer periphery of the receiving cavity. The insulation ring can be made of an insulating material, such as foam. Because the insulation ring provides thermal insulation, heat generated by a heat source within the electronic device is less likely to enter the receiving cavity. This allows the temperature of the infrared temperature sensor to remain stable, avoiding a large temperature difference between the infrared temperature sensor and the module bracket and infrared lens, thereby ensuring temperature measurement accuracy. Of course, the insulation ring also blocks heat from the external environment from entering the receiving cavity.

[0011] In one implementation, a surface of the module bracket facing the inner cavity is partially recessed to form a mounting groove, with the sidewalls of the mounting groove located at the outer periphery of the receiving cavity; the thermal insulation ring is mounted within the mounting groove. Providing the mounting groove facilitates installation of the thermal insulation ring, ensuring reliable installation of the thermal insulation ring and reducing the internal space occupied by the electronic device.

[0012] In one implementation, the electronic device includes a flexible circuit board, which is located in the inner cavity and has a copper exposed area; the infrared temperature sensor is arranged on the flexible circuit board, and the infrared temperature sensor and the copper exposed area are located on the same side of the flexible circuit board, and the infrared temperature sensor is separated from the copper exposed area; the surface of the module bracket facing the inner cavity is provided with a heat conducting portion, and the heat conducting portion is connected to the copper exposed area.

[0013] In this solution, a flexible circuit board is used to achieve signal conduction between the infrared temperature sensor and the mainboard of the electronic device. The insulating layer of the flexible circuit board in the copper-exposed area is removed, and the copper layer under the insulating layer is exposed. The thermal conductivity of the copper-exposed area is good. The shape of the heat-conducting portion is not limited, for example, it can be a closed ring. The heat-conducting portion can, for example, surround the outer periphery of the receiving cavity. The heat-conducting portion and the copper-exposed area can be in direct contact or connected through a medium (such as glue). By connecting the heat-conducting portion to the copper-exposed area, a contact heat-conducting path can be established between the flexible circuit board and the module bracket, which can promote heat exchange between the infrared temperature sensor and the module bracket, and is beneficial for the temperature difference among the infrared lens, the module bracket and the infrared temperature sensor to quickly approach zero, thereby improving the temperature measurement accuracy and speed.

[0014] In one implementation, the surface of the module bracket facing the inner cavity is partially recessed to form a mounting groove, with the sidewalls of the mounting groove positioned at the periphery of the receiving cavity. The heat conducting portion is provided on the bottom surface of the mounting groove, positioned at the periphery of the receiving cavity and the infrared temperature sensor. Providing the heat conducting portion on the bottom surface of the mounting groove improves temperature measurement accuracy and speed, while reducing the internal space occupied by the electronic device. This structural design is simple and has good manufacturability.

[0015] In one implementation, the emissivity of at least a portion of the inner wall of the receiving cavity is greater than or equal to 95%, and / or the reflectivity of at least a portion of the inner wall of the receiving cavity is less than or equal to 50%. Enabling the emissivity of at least a portion of the inner wall of the receiving cavity to be greater than or equal to 95% can enhance the thermal radiation capacity of the cavity wall of the receiving cavity; enabling the reflectivity of at least a portion of the inner wall of the receiving cavity to be less than or equal to 50% can enable the cavity wall of the receiving cavity to absorb more thermal radiation. The above designs can both ensure more complete heat exchange between the module bracket and the infrared temperature sensor, effectively and quickly reduce the temperature difference between the module bracket and the infrared temperature sensor, and help improve temperature measurement accuracy and speed.

[0016] In one implementation, a colored material layer is attached to at least a portion of the inner wall of the receiving cavity, or at least a portion of the inner wall of the receiving cavity has a non-polished surface. The colored material layer is opaque and can present a set color, such as black, other dark colors other than black (such as brown, dark blue, dark green, etc.), gray, white, etc. The non-polished surface is a non-smooth surface, for example, it can be produced by a surface roughening process (such as sandblasting or chemical etching). The design of the colored material layer or the non-polished surface can increase the emissivity of the cavity wall of the receiving cavity and reduce the reflectivity of the cavity wall of the receiving cavity in a simple and easy way.

[0017] In one implementation, the electronic device includes a flexible circuit board and a thermal insulation bracket; the flexible circuit board is located in the inner cavity; the infrared temperature sensor and the thermal insulation bracket are located at the same end of the flexible circuit board and are respectively connected to opposite sides of the flexible circuit board. In this solution, the thermal insulation bracket is located in the inner cavity. The thermal insulation bracket can be supported between the mainboard and the flexible circuit board of the electronic device, and plays the role of supporting the flexible circuit board, the infrared temperature sensor and the module bracket. The thermal insulation bracket can be made of thermal insulation material, such as plastic. The thermal insulation bracket can block heat from entering the flexible circuit board and the infrared temperature sensor, avoid heat interference with the infrared temperature sensor, avoid a large temperature difference between the infrared temperature sensor and the module bracket and the infrared lens, and ensure temperature measurement accuracy.

[0018] In one implementation, the thermal insulation bracket is provided with an insulation groove. The insulation groove can be provided on any suitable surface of the thermal insulation bracket, for example, on the surface of the thermal insulation bracket facing the motherboard of the electronic device. The shape, size, and number of the insulation grooves are not limited. Since the insulation grooves are filled with air, which is a poor conductor of heat, the insulation grooves provided in the thermal insulation bracket can enhance the thermal insulation effect of the thermal insulation bracket.

[0019] In one implementation, the module bracket protrudes from the surface of the housing facing away from the inner cavity. This allows the module bracket to fully contact the outside air, enhancing heat exchange between the module bracket and the outside air. Heat absorbed by the module bracket is released more quickly into the air, maintaining thermal balance within the thermal system and ensuring temperature measurement accuracy. This is particularly true for housings made of materials with poor thermal conductivity, such as glass, where heat exchange between the module bracket and the housing is limited, affecting the thermal balance of the thermal system. The protruding module bracket design can compensate for this shortcoming.

[0020] In one implementation, a surrounding rib is convexly provided on the surface of the module bracket on the side facing away from the inner cavity, and the surrounding rib surrounds the outer circumference of the infrared lens. The surrounding rib can be a single closed circular ring structure. Or there can be several surrounding ribs, and the several surrounding ribs can be arranged in sequence along the circumference. The surrounding rib can be basically coaxial with the infrared light hole. The inner wall of the surrounding rib can be connected flush with the hole wall of the infrared light hole. The surrounding rib and the module bracket can form an integrated structure. The material of the surrounding rib can be the same as that of the module bracket, and both are made of materials with higher specific heat capacity and larger thermal conductivity. The design of the surrounding rib can further enhance the heat exchange between the module bracket and the infrared lens, thereby ensuring the accuracy of infrared temperature measurement.

[0021] In one implementation, the module bracket is further provided with a camera hole, the camera hole and the infrared light hole are located on the same side of the module bracket, and the camera hole is separated from the infrared light hole; the electronic device includes a camera lens and a camera module; the camera lens and the infrared lens are located on the same side of the module bracket, the camera lens covers the camera hole, and a receiving through hole is provided in the area where the camera lens and the camera hole do not overlap; the camera module is located in the inner cavity, and the camera module is used to collect light passing through the camera lens and the camera hole; the infrared lens is located in the receiving through hole.

[0022] In this solution, the infrared temperature sensor and camera module share a module bracket, which also supports both the camera lens and the infrared lens. This design results in a larger module bracket. When absorbing the same amount of heat, the larger module bracket experiences a smaller temperature rise, preventing a significant temperature rise in the entire thermal system. This helps maintain thermal balance within the thermal system and ensures accurate temperature measurement.

[0023] In addition, the infrared temperature sensor and the camera module share the same module bracket, and the infrared lens is nested in the camera lens. This eliminates the need to open additional holes for the infrared lens on the shell, ensuring the integrity of the shell's appearance and integrating the infrared lens with the camera lens to create a consistent appearance.

[0024] In one implementation, a rib protrudes from the surface of the module support facing away from the inner cavity. The rib is located within the receiving through-hole and surrounds the periphery of the infrared lens. The presence of the rib separates the camera lens from the infrared lens, enhancing heat exchange between the module support and the infrared lens, ensuring infrared temperature measurement accuracy, and increasing the structural strength of the assembly of the camera lens, infrared lens, and module support.

[0025] In one implementation, there are at least two camera modules and at least two camera holes, and the at least two camera holes are spaced apart, with one camera module corresponding to each camera hole. Having multiple camera modules increases the volume of the module bracket, and when absorbing the same amount of heat from the outside, the module bracket experiences a smaller temperature rise, thereby enabling the thermal system to maintain a more stable thermal equilibrium state and improving temperature measurement accuracy. Furthermore, having multiple camera modules can enhance the imaging performance of electronic devices.

[0026] In one implementation, the specific heat capacity threshold is 0.2 kJ / (kg·°C), and the thermal conductivity threshold is 10 W / (m·K). The design of these thresholds can ensure the thermal performance of the module bracket and help ensure the accuracy of infrared temperature measurement.

[0027] In one implementation, the electronic device is a mobile phone, and the housing includes a middle frame and a rear shell. The rear shell and the middle frame are assembled to form the inner cavity, and the mounting opening is provided in the rear shell. This solution enables the mobile phone to have an infrared temperature measurement function and ensures high accuracy of infrared temperature measurement, thereby increasing product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of the three-dimensional structure of an electronic device according to an embodiment of the present application;

[0029] Figure 2 A schematic diagram of a planar structure of another electronic device according to an embodiment of the present application;

[0030] Figure 3 A schematic diagram of a planar structure of another electronic device according to an embodiment of the present application;

[0031] Figure 4 is a schematic diagram of the three-dimensional structure of another electronic device according to an embodiment of the present application;

[0032] Figure 5 yes Figure 4 AA cross-sectional structural diagram of the electronic device in FIG;

[0033] Figure 6 yes Figure 5 Schematic diagram of the local enlarged structure at B in the middle;

[0034] Figure 7 yes Figure 4 Schematic diagram of the exploded structure of the electronic equipment in;

[0035] Figure 8 yes Figure 7 Schematic diagram of the assembly structure in which the camera module and infrared module of the electronic device are installed on the main board;

[0036] Figure 9 yes Figure 8 Schematic diagram of the three-dimensional structure of the infrared module;

[0037] Figure 10 Yes Figure 7 A schematic structural diagram of the assembly relationship of the rear shell, module bracket, camera lens and infrared lens of the electronic device;

[0038] Figure 11(a) is Figure 10 A schematic diagram of a three-dimensional structure of the module bracket at one viewing angle;

[0039] Figure 11(b) is Figure 10 Another three-dimensional structural diagram of the module bracket in one viewing angle;

[0040] Figure 12 yes Figure 10 A schematic diagram of the three-dimensional structure of the module bracket in another perspective;

[0041] Figure 13 yes Figure 12 Schematic diagram of the local enlarged structure at D in the middle;

[0042] Figure 14 It is a structural diagram showing the positional relationship between the infrared temperature sensor and peripheral components in the infrared module and the module bracket;

[0043] Figure 15 yes Figure 13 A schematic structural diagram of an alternative structure to the structure shown;

[0044] Figure 16 is a schematic diagram showing the assembly structure of the module bracket, camera lens and infrared lens;

[0045] Figure 17 yes Figure 16 Schematic diagram of the local enlarged structure at E in the middle;

[0046] Figure 18 This is an exploded structural diagram showing the positional relationship of the mainboard, camera module, infrared module, module bracket, camera lens, and infrared lens in the first embodiment;

[0047] Figure 19 This is another exploded structural diagram showing the positional relationship among the mainboard, camera module, infrared module, module bracket, camera lens, and infrared lens in the first embodiment;

[0048] Figure 20 yes Figure 19 FF cross-sectional structural diagram of the assembly structure of the camera module, infrared module, module bracket, camera lens and infrared lens;

[0049] Figure 21 This is a structural diagram showing the assembly relationship between the module bracket and the thermal insulation ring in the second embodiment;

[0050] Figure 22 This is a structural diagram showing the positional relationship between the camera module, infrared module, heat insulation ring and module bracket in the second embodiment;

[0051] Figure 23 This is a structural schematic diagram of the heat conduction portion in the mounting groove of the module bracket in the third embodiment;

[0052] Figure 24 This is another structural schematic diagram of the heat conducting portion in the mounting groove of the module bracket in the third embodiment;

[0053] Figure 25is a schematic structural diagram of the exposed copper area on the flexible circuit board of the infrared module in Example 3;

[0054] Figure 26 2 is a structural diagram showing the positional relationship of the mainboard, thermal insulation bracket, camera module, infrared module and module bracket in the fourth embodiment;

[0055] Figure 27 yes Figure 26 Schematic diagram of the three-dimensional structure of the thermal insulation bracket;

[0056] Figure 28 is a schematic diagram of the three-dimensional structure of the electronic device in Example 5;

[0057] Figure 29 is a schematic diagram of the three-dimensional structure of the electronic device in Example 6;

[0058] Figure 30 yes Figure 29 Schematic diagram of the locally enlarged structure at G in the middle. DETAILED DESCRIPTION

[0059] The following embodiments of the present application provide an electronic device. The electronic device may be a device specifically used for temperature measurement, such as Figure 1 The electronic device 10 and Figure 2 The electronic devices 20 in the embodiment are two types of thermometers. Alternatively, the electronic devices may also be portable consumer electronic products, such as Figure 3 The electronic device 30 is a tablet computer, Figure 4 The electronic device 40 shown is a mobile phone. Figures 1-4 Only some specific examples of electronic devices of this embodiment are shown. In fact, the electronic devices are not limited to those described above. For example, the electronic devices may also be wearable devices, such as smart watches, wireless headphones, etc.

[0060] The electronic device of this embodiment may include a housing, a module holder, an infrared lens, and an infrared temperature sensor. The housing is a structural component of the electronic device. The housing has an inner cavity, and the infrared temperature sensor is mounted within the inner cavity. The housing may have a mounting opening connecting the inner cavity with the exterior of the electronic device. The module holder is mounted on the housing, and at least a portion of the module holder may be located within the inner cavity. A portion of the module holder may be exposed within the mounting opening, and this portion of the module holder may be aligned with the mounting opening. This may include the following scenarios: the module holder may be hidden beneath the outer surface of the housing, making it invisible to the user through the mounting opening; or the portion of the module holder may be exposed from the outer surface of the housing through the mounting opening, making it visible to the user (this portion of the module holder may or may not cover the mounting opening). The portion of the module holder exposed within the mounting opening is provided with an infrared aperture, which is covered by the infrared lens. Infrared radiation radiated by a target object can be received by the infrared temperature sensor through the infrared lens. After sensing by the infrared temperature sensor and signal processing by the electronic device, the temperature of the target object can be measured.

[0061] For example, Figure 1 The electronic device 10 includes a housing 11. A module bracket 12 is mounted on the housing 11 and exposed from a mounting opening of the housing 11. The infrared lens is mounted on the module bracket 12 and covers the infrared light hole on the module bracket 12 (due to the Figure 1 Due to viewing angle, the mounting opening, infrared aperture, and infrared lens are not shown).

[0062] or as Figure 2 As shown, the electronic device 20 includes a housing 21. The module bracket 22 is mounted on the housing 21 and exposed from the mounting opening 21a of the housing 21. The infrared lens 23 is mounted on the module bracket 22 and covers the infrared light hole ( Figure 2 In the viewing angle, the infrared light hole is covered by the infrared lens 23 and is not visible).

[0063] or as Figure 3 As shown, the electronic device 30 includes a housing 31. A module bracket 32 is mounted on the housing 31 and exposed from a mounting opening 31a of the housing 31. An infrared lens 33 is mounted on the module bracket 32 and covers the infrared light hole ( Figure 3 In the viewing angle, the infrared light hole is covered by the infrared lens 33 and is not visible).

[0064] or as Figure 4 As shown, the electronic device 40 includes a housing 41. A module bracket 42 is mounted on the housing 41 and exposed from a mounting opening 41a of the housing 41. An infrared lens 44 is mounted on the module bracket 42 and covers the infrared light hole ( Figure 4In the viewing angle, the infrared light hole is covered by the infrared lens 43 and is not visible).

[0065] The solution of this embodiment will be described in detail below by taking the electronic device 40 as an example.

[0066] Figure 4 The back structure of the electronic device 40 in the first embodiment is shown. Figure 5 yes Figure 4 AA cross-sectional view of the electronic device 40, wherein the internal structure of the electronic device 40 is appropriately simplified in order to clearly illustrate the inner cavity 41b of the shell 41 of the electronic device 40. Figure 6 yes Figure 5 Schematic diagram of the local enlarged structure at point B in the middle.

[0067] like Figure 4-Figure 6 As shown, the housing 41 of the electronic device 40 may include a middle frame 411 and a rear shell 412. The middle frame 411 may be approximately a plate-shaped component, and the peripheral portion of the middle frame 411 may be referred to as a frame 411a. One side of the frame 411a (e.g. Figure 6 The upper side of the frame 411a cooperates with the rear shell 412, so that the middle frame 411 and the rear shell 412 form an inner cavity 41b. The other side of the frame 411a (for example Figure 6 A display screen 45 can be mounted on the lower side (in the perspective view), that is, the display screen 45 and the rear housing 412 are located on opposite sides of the middle frame 411. The electronic device 40 in the first embodiment has a display screen 45, which is merely an example. In fact, the solution of this embodiment is not related to the display screen 45, and the display screen 45 is not required.

[0068] like Figure 7 and Figure 8 As shown, the electronic device 40 may further include a mainboard 46 , and a camera module 47 and an infrared module 48 arranged on the mainboard 46 .

[0069] Combine Figure 6 and Figure 7 As shown, the motherboard 46 can be mounted on the middle frame 411 and located in the inner cavity 41b. The camera module 47 and the infrared module 48 can both be located on the side of the motherboard 46 facing the rear housing 412. Both are electrically connected to the motherboard 46 to operate under the control of the signals provided by the motherboard 46.

[0070] The camera module 47 is at least one, for example Figure 8Two camera modules 47 are shown, and the two camera modules 47 can be arranged side by side. The two camera modules 47 can have different imaging capabilities. For example, one camera module 47 can be an optical zoom camera module, and the other camera module 47 can be a 3D depth sensing camera module. In this embodiment, the number of camera modules 47 can be designed according to product requirements. For example, the number of camera modules 47 can be one, three, four, or five.

[0071] like Figure 9 As shown, the infrared module 48 may include a flexible circuit board 49 and an infrared temperature sensor 50 arranged on the flexible circuit board 49 .

[0072] The two opposite ends of the flexible circuit board 49 may be a connecting end 491 and a placement end 492. The connecting end 491 may be approximately in the shape of a square plate, and may be provided with a connector C. Figure 8 and Figure 9 As shown, the connection end 491 can be electrically connected to the circuit board via the connector C, thereby achieving signal conduction between the flexible circuit board 49 and the main board 46. The arrangement end 492 can be approximately circular, for example. The above description of the specific structure of the flexible circuit board 49 is merely an example, and this embodiment is not limited thereto.

[0073] Combine Figure 7-Figure 9 As shown, the infrared temperature sensor 50 can be located on the side of the arrangement end 492 facing the rear housing 412. The infrared temperature sensor 50 can be welded to the arrangement end 492, for example. The infrared temperature sensor 50 is electrically connected to the arrangement end 492 to operate under the control of the signal transmitted by the flexible circuit board 49. The infrared temperature sensor 50 can sense infrared light to generate an electrical signal, which can be converted into temperature data after processing. Figure 9 As shown, one of the performance parameters of the infrared temperature sensor 50 is the reception angle R, which is a cone angle in space. The infrared temperature sensor 50 can only receive infrared light within the range of the reception angle R and cannot receive infrared light outside the range of the reception angle R. The reception angle R is similar to the field of view of the camera module 47 or the viewing angle of the display screen 45.

[0074] like Figure 9 As shown, the infrared module 48 may further include a peripheral component 51. The peripheral component 51 may be disposed on the same side of the arrangement end 492 as the infrared temperature sensor 50. The peripheral component 51 is electrically connected to the arrangement end 492. The peripheral component 51 is used to assist in the operation of the infrared temperature sensor 50. The peripheral component 51 may be, for example, a resistor or a capacitor. The height of the peripheral component 51 may be less than the height of the infrared temperature sensor 50.

[0075] When the infrared module 48 in the electronic device 40 is measuring temperature, the closer the difference between the temperature of the structure near the infrared temperature sensor 50 (referring to the structure in the electronic device 40) and the temperature of the infrared temperature sensor 50 is to zero, the higher the accuracy of the infrared temperature measurement. The faster the temperature difference between the structure near the infrared temperature sensor 50 and the infrared temperature sensor 50 decreases, the faster the accurate temperature is obtained, that is, the faster the temperature measurement speed of the electronic device 40. In addition, if the temperature of the structure near the infrared temperature sensor 50 and the temperature of the infrared temperature sensor 50 are both close to the temperature of the external environment in which the electronic device 40 is located, the infrared temperature measurement accuracy is higher. These are necessary conditions to ensure the accuracy and speed of infrared temperature measurement.

[0076] like Figure 10 As shown, the rear shell 412 can be approximately in the shape of a square sheet or a square plate. The periphery of the rear shell 412 can include a curved surface with an arc, so that the rear shell 412 has a rounded and smooth product appearance. A mounting opening 41a is provided on the rear shell 412. The mounting opening 41a can be, for example, close to a corner of the rear shell 412. The mounting opening 41a passes through the rear shell 412 along the wall thickness direction of the rear shell 412. The mounting opening 41a can be, for example, approximately rectangular. Combined Figure 7 and Figure 10 As shown, the mounting opening 41a is used to mount the module bracket. The rear housing 412 can be made of a metal material (such as aluminum alloy) or a non-metallic material (such as glass, ceramic, or plastic). The above description of the structure and material of the rear housing 412 is merely an example, and this embodiment is not limited thereto.

[0077] FIG11(a) is a schematic diagram of the structure of the module support 42 under a certain viewing angle. As shown in FIG11(a), the module support 42 can be approximately in the shape of a square plate. The module support 42 can include, for example, a supporting portion 422 and a skirt 421 connected as one body, wherein the skirt 421 surrounds the outer periphery of the supporting portion 422. Figure 6 、 Figure 10 As shown in FIG11( a ), the module bracket 42 can be mounted on the rear housing 412. The skirt 421 can be located in the inner cavity 41b and can be stuck on the edge of the mounting opening 41a. The bearing portion 422 can pass through the mounting opening 41a and can protrude from the surface 412a of the rear housing 412, wherein the surface 412a is the outer surface of the rear housing 412 away from the inner cavity 41b (see FIG11( a )). Figure 6 The protruding design of the supporting portion 422 can increase the structural strength of the module bracket 42 .

[0078] The structure and design of the module support 42 described above are merely examples, and the present embodiment is not limited thereto. For example, the support portion 422 may be substantially flush with the surface 412a. Alternatively, the module support 42 may be completely concealed within the inner cavity 41b, and thus not visible from the surface 412a of the rear housing 412.

[0079] As shown in FIG11( a ), two camera holes 42a can be provided on the support portion 422. Both camera holes 42a can be circular through-holes extending through the support portion 422, with the axes of both camera holes 42a surrounded by the skirt 421. The two camera holes 42a can correspond one-to-one with two camera modules 47, so that each camera module 47 can collect light incident from the corresponding camera hole 42a (described below). In this embodiment, the number of camera holes 42a is two for example only; in practice, the number of camera holes 42a is consistent with the number of camera modules 47.

[0080] As shown in Figure 11(a), the support portion 422 may also include an infrared light hole 42b. The infrared light hole 42b may be a circular stepped hole extending through the support portion 422. For aesthetic reasons, the axis of the infrared light hole 42b may be substantially parallel to the axis of the camera holes 42a, and the infrared light hole 42b may be separated from both camera holes 42a. The infrared light hole 42b may be positioned as close as possible to the edge of the support portion 422. The position of the infrared light hole 42b may also be determined based on ergonomic considerations, such that the infrared lens 53 (described below) covering the infrared light hole 42b is positioned as far as possible from human touch.

[0081] Infrared light aperture 42b corresponds to infrared temperature sensor 50, and infrared light can pass through infrared light aperture 42b to reach infrared temperature sensor 50 (described below). The aperture of infrared light aperture 42b (when infrared light aperture 42b is a stepped aperture, this aperture refers to the minimum aperture of the stepped aperture) matches the acceptance angle R of infrared temperature sensor 50, so that at least a portion of the infrared light passing through infrared light aperture 42b can enter the range of acceptance angle R. For example, the aperture of infrared light aperture 42b can be set to a critical value, so that the opening of the infrared light aperture 42b at the end facing away from the infrared temperature sensor 50 is substantially on the cone formed by acceptance angle R, thereby ensuring that all infrared light passing through infrared light aperture 42b can enter the range of acceptance angle R. Alternatively, the aperture of infrared light aperture 42b can be larger than the critical value (by a smaller increment), so that a portion of the infrared light passing through infrared light aperture 42b can enter the range of acceptance angle R, while another portion cannot. The aperture of the infrared light hole 42 b may be determined according to the receiving angle R and the distance between the infrared light hole 42 b and the infrared temperature sensor 50 .

[0082] In another embodiment, as shown in FIG11( b ), a surrounding rib 42p may be provided on the surface of the bearing portion 422. The surrounding rib 42p may be integrally connected to the bearing portion 422. The surrounding rib 42p is located on the side of the bearing portion 422 away from the skirt 421, that is, in combination with FIG11( b ) and FIG11( b ), the surrounding rib 42p may be provided on the surface of the bearing portion 422. Figure 5 As shown, the surrounding rib 42p is located on the side of the bearing portion 422 away from the inner cavity 41b. The surrounding rib 42p in Figure 11(b) can be a single closed circular ring structure. In other embodiments, there can be several surrounding ribs 42p (at least one), and several surrounding ribs 42p can be arranged in sequence along the circumference. The surrounding rib 42p can be basically coaxial with the infrared light hole 42b. The inner wall of the surrounding rib 42p can be connected flush with the hole wall of the infrared light hole 42b. The design of the surrounding rib 42p can further enhance the heat exchange between the module bracket 42 and the infrared lens 53 (to be described below). Of course, the surrounding rib 42p is not required.

[0083] As shown in Figure 11(a), Figure 11(b) and Figure 12 As shown, a heat insulation groove 42k can also be provided on the bearing portion 422. The heat insulation groove 42k is spaced apart from the camera hole 42a and the infrared light hole 42b. The specific position of the heat insulation groove 42k can be determined according to product requirements. For example, as shown in Figure 11(a), the heat insulation groove 42k can be provided on the heat transfer path. The heat can come from the external environment in which the electronic device 40 is located, or from the inside of the electronic device 40 (for example, from the camera module 47). The shape of the heat insulation groove 42k can be designed according to product requirements and is not limited to a straight groove or a curved groove. The heat insulation groove 42k may or may not pass through the bearing portion 422. The number of heat insulation grooves 42k is at least one. For example, Figures 11(a) and 11(b) show three spaced apart heat insulation grooves 42k. These three heat insulation grooves 42k are opened on the side of the bearing portion 422 away from the skirt 421, and none of these three heat insulation grooves 42k pass through the bearing portion 422. For another example Figure 12 A heat-insulating groove 42k is shown. This groove 42k is formed on one side of the support portion 422 near the skirt 421, but does not penetrate the support portion 422. In other embodiments, the heat-insulating groove 42k can also be formed on the skirt 421. The provision of the heat-insulating groove 42k can mitigate the temperature rise of the module support 42 when heated, as will be described below.

[0084] Figure 12 is a structural diagram of the module bracket 42 from another perspective, Figure 12 The structure of the module support 42 facing the inner cavity 41b is shown. Figure 6 and Figure 12As shown, the surface of the bearing portion 422 facing the inner cavity 41b can form a mounting groove 42c, which can be approximately circular. The mounting groove 42c can be open, that is, the side wall of the mounting groove 42c does not form a circle, but forms a notch. Figure 12 and Figure 9 As shown, the notch in mounting slot 42c facilitates the mating of the infrared module with the module bracket 42, allowing mounting slot 42c to accommodate the placement end 492 of the flexible circuit board 49, with the connection end 491 of the flexible circuit board 49 positioned outside of the mounting slot 42c. The side of placement end 492 where the infrared temperature sensor 50 is located can face the interior of mounting slot 42c. In other embodiments, the side of the support portion 422 facing the inner cavity 41b may not have a mounting slot 42c. The placement end 492 can be fixedly connected to the support portion 422 and spaced apart from the support portion 422 to maintain a safe distance between the infrared temperature sensor 50 and the support portion 422.

[0085] like Figure 13 As shown, the bottom surface 42d of the mounting groove 42c can be partially recessed to form a groove 42e, and the groove 42e can be spaced apart from the side wall of the mounting groove 42c. The structure of the groove 42e can be adapted to the infrared temperature sensor 50 and the peripheral device 51, and this embodiment does not impose too many restrictions. For example, the groove 42e can have a symmetrical structure, and the outline of the groove 42e can be roughly square. The four corners of the groove 42e can be arched outward to form a structure of four approximately semicircular cavities. This structural design can meet processability requirements, for example, it is convenient to use a tool (such as a milling cutter) to process the groove 42e. The infrared light hole 42b can pass through the bottom surface 42g of the groove 42e, and the infrared light hole 42b can be connected to the inner cavity 42f of the groove 42e.

[0086] In the embodiment without the mounting groove 42c, Figure 13 The difference from the design shown is that the groove 42e can be directly opened on the surface of the supporting portion 422 facing the inner cavity 41b.

[0087] like Figure 13 As shown, the bottom surface 42d of the mounting groove 42c can also be provided with an avoidance groove 42n, which is connected to the inner cavity 42f. The depth of the avoidance groove 42h is less than the depth of the inner cavity 42f, wherein the depth refers to the dimension in the direction perpendicular to the bottom surface 42d. For example, the bottom surface 42d can be downward ("downward" is in degrees). Figure 13 The material is removed by machining (taking the perspective as an example) to form a relief groove 42n. The unremoved material can form a boss 42h. The shape of the boss 42h is not limited. The boss 42h can be located outside the infrared light aperture 42b. In other embodiments, the relief groove 42n and the boss 42h may not be provided.

[0088] In the first embodiment, the inner cavity 42f of the groove 42e can be called a receiving cavity 42f. Figure 13 In the embodiment, the receiving cavity 42f can be an open cavity surrounded by the side surface 42i, the bottom surface 42g and the boss 42h of the groove 42e.

[0089] Figure 14 The figure shows the positional relationship between the infrared temperature sensor 50, the peripheral components 51 and the receiving cavity 42f when the arrangement end 492 is installed in the installation groove 42c. Figure 14 The flexible circuit board 49 is not shown.

[0090] Combine Figure 14 As shown, part of the infrared temperature sensor 50 extends into the receiving cavity 42f, that is, with the bottom surface 42d as the boundary, part of the infrared temperature sensor 50 is lower than the bottom surface 42d, and the other part is higher than the bottom surface 42d ("lower" and "higher" are both in Figure 14 In another embodiment, the infrared temperature sensor 50 may be entirely inserted into the receiving cavity 42f, that is, the infrared temperature sensor 50 is entirely lower than the bottom surface 42d.

[0091] The infrared temperature sensor 50 may have a spacing with all inner walls of the receiving chamber 42f (i.e., all inner walls of the groove 42e), including a spacing with all surfaces of the boss 42h. This spacing may be a safe distance required for the operation of the infrared temperature sensor 50. The specific value of this spacing may also be determined based on the heat exchange requirements between the infrared temperature sensor 50 and the inner wall of the receiving chamber 42f (this will be described further below). For example, Figure 14 In the viewing angle, the distance d1 between the sides of the infrared temperature sensor 50 and the corresponding inner wall of the receiving cavity 42f can be 0.5 mm. Figure 14 and Figure 13 As shown, the distance between the surface of the infrared temperature sensor 50 facing the infrared light hole 42b and the bottom surface 42g may be 0.25 mm.

[0092] Combine Figure 14 As shown, the peripheral device 51 can be higher than the bottom surface 42d, that is, the peripheral device 51 can be completely located outside the receiving cavity 42f. The projection of the peripheral device 51 in the direction perpendicular to the bottom surface 42d falls within the opening boundary of the groove 42e, and at least part of the peripheral device 51 can overlap with the boss 42h. The distance between the peripheral device 51 and the boss 42h can be the safety distance required for the operation of the peripheral device 51. In another embodiment, the difference is that at least part of the peripheral device 51 can extend into the receiving cavity 42f. The meaning of the peripheral device 51 extending into the receiving cavity 42f is the same as the meaning of the infrared temperature sensor extending into the receiving cavity 42f, and will not be repeated here.

[0093] Figure 13 and Figure 14 The structure of the receiving cavity 42f shown is only an example, and this embodiment is not limited thereto. Figure 15 In the structure shown, Figure 13 and Figure 14 The difference is that the receiving cavity 42f is not the inner cavity 42f of the groove 42e, but the bottom surface 42d of the mounting groove 42c can be provided with a circle of walls 42j, and the thickness d2 of the walls 42j can be at least 0.5mm. The boss 42h can be formed in the wall 42j, or a boss 42h can be formed. The space enclosed by the wall 42j serves as the receiving cavity 42f. The shape of the receiving cavity 42f can be designed according to actual needs, for example, it can be approximately square, or it can be similar to Figure 14 The shape is substantially the same as in FIG. The infrared light hole 42b can penetrate the area of the bottom surface 42d enclosed by the wall 42j, connecting the receiving cavity 42f with the infrared light hole 42b. Alternatively, in another embodiment, the wall 42j can be open (similar to a C-shaped structure) rather than enclosed.

[0094] In this embodiment, all inner walls of the receiving cavity 42f may be covered with a colored material layer, for example Figure 15 All inner walls of the receiving cavity 42f shown may be covered with a colored material layer (illustrated by hatching). This colored material layer is opaque and can present a predetermined color, such as black, a dark color other than black (such as brown, dark blue, dark green, etc.), gray, white, etc. The colors listed above are merely examples. In practice, the colored material layer can have any color, as long as it is not transparent, depending on product requirements.

[0095] In this embodiment, the colored material layer can be formed, for example, by electroplating or coating. Considering the small size of the receiving cavity 42f, it is inconvenient to form the colored material layer within a relatively small space. Therefore, the operating space can be expanded outward, and the colored material layer can be attached to the entire mounting groove 42c, so that at least a portion of the inner wall of the mounting groove 42c and all of the inner walls of the receiving cavity 42f are covered with the colored material layer. Of course, this is not required, and the colored material layer can be formed only within the receiving cavity 42f. In other embodiments, the colored material layer can also be attached to only a portion of the inner wall of the receiving cavity 42f, without forming the colored material layer on all inner walls.

[0096] Providing a colored material layer can increase the emissivity of the inner wall of the receiving cavity 42f. When all inner walls of the receiving cavity 42f are covered with the colored material layer, the emissivity of the entire receiving cavity 42f is increased; when a portion of the inner wall of the receiving cavity 42f is covered with the colored material layer, the emissivity of that portion of the inner wall of the receiving cavity 42f is also increased. For example, the colored material layer can make the emissivity of all or at least a portion of the inner wall of the receiving cavity 42f greater than or equal to 95%. Emissivity is used to measure the ability of an object's surface to release energy in the form of thermal radiation. The higher the emissivity, the greater the object's ability to radiate heat.

[0097] The colored material layer can also reduce the reflectivity of the inner wall of the receiving cavity 42f. When all inner walls of the receiving cavity 42f are covered with the colored material layer, the reflectivity of the entire receiving cavity 42f is reduced. When a portion of the inner wall of the receiving cavity 42f is covered with the colored material layer, the reflectivity of that portion of the inner wall is also reduced. For example, the colored material layer can have a reflectivity of less than or equal to 50% for all or at least a portion of the inner wall of the receiving cavity 42f. Reflectivity represents the ratio of the radiation energy reflected by an object's surface to the radiation energy it receives. The technical benefits of the colored material layer will be described below. Alternatively, the colored material layer can be replaced with the following design: at least a portion of the inner wall of the receiving cavity 42f is made into an unpolished surface. This polished surface is not smooth, but rather has a certain degree of roughness. For example, this unpolished surface can be created through a surface roughening process (such as sandblasting or chemical etching). The emissivity of the unpolished area of the inner wall of the receiving cavity 42f can be increased, and the reflectivity can be reduced. For example, the non-polished surface can make the emissivity of at least a portion of the inner wall of the receiving cavity 42f greater than or equal to 95%, and the reflectivity of at least a portion of the inner wall of the receiving cavity 42f less than or equal to 50%. To facilitate manufacturing, the entire surface of the mounting groove 42c can be processed so that at least a portion of the inner wall of the mounting groove 42c and all of the inner walls of the receiving cavity 42f have a non-polished surface. Of course, this is not required, and only at least a portion of the inner wall of the receiving cavity 42f can have a non-polished surface. The technical effect brought about by the non-polished surface will be further described below.

[0098] The above-described design of increasing the emissivity and reducing the reflectivity of the inner wall of the receiving cavity 42f is merely an example. This purpose can actually be achieved through other suitable means. Furthermore, in this embodiment, at least one of the two designs, increasing the emissivity and reducing the reflectivity of the inner wall of the receiving cavity 42f, is sufficient.

[0099] In this embodiment, the module bracket 42 can be an integrated structure made of metal material. The metal material can be, for example, aluminum, aluminum alloy, copper, iron, stainless steel, etc. Metal materials have a large specific heat capacity, which refers to the amount of heat absorbed (or released) by a unit mass of a substance when its temperature increases (or decreases) by a unit. The larger the specific heat capacity, the greater the amount of heat absorbed (or released) by a unit mass of a substance when its temperature increases (or decreases), or the smaller the temperature increase (or decrease) by a unit mass of a substance when its temperature increases (or decreases) by a unit amount of heat. For example, the specific heat capacity of the metal material can be greater than or equal to 0.2 kJ / (kg·℃), and typical values can be, for example, 0.2 kJ / (kg·℃), 0.385 kJ / (kg·℃), 0.46 kJ / (kg·℃), and 0.9 kJ / (kg·℃). In other embodiments, the specific heat capacity of the metal material can be greater than or equal to a specific heat capacity threshold, which is not limited to 0.2 kJ / (kg·℃) and can be determined according to actual needs.

[0100] The metal material may also have good thermal conductivity. Thermal conductivity can be characterized by thermal conductivity. The larger the thermal conductivity, the better the thermal conductivity. The thermal conductivity of the metal material may be greater than or equal to 10W / (m·k), for example. Typical values may be, for example, 10W / (m·k), 16W / (m·k), 48W / (m·k), 61W / (m·k), 230W / (m·k), and 377W / (m·k). In other embodiments, the thermal conductivity of the metal material may be greater than or equal to a thermal conductivity threshold value. The thermal conductivity threshold value is not limited to 10W / (m·k) and may be determined according to actual needs.

[0101] In this embodiment, at least one of the two material parameters, specific heat capacity and thermal conductivity, of the metal material satisfies the corresponding value ranges described above. In other embodiments, the module bracket 42 may be manufactured using materials other than metal. The specific heat capacity of the other material may be greater than or equal to a specific heat capacity threshold, such as 0.2 kJ / (kg·°C), and / or the thermal conductivity of the other material may be greater than or equal to a thermal conductivity threshold, such as 10 W / (m·K).

[0102] like Figure 10 As shown, the electronic device 40 may further include a camera lens 52 and an infrared lens 53 .

[0103] Combine Figure 10As shown in FIG11( a ) and FIG11( b ), the shape and area of the camera lens 52 can match the shape and area of the carrier portion 422. For example, the camera lens 52 can be approximately square and can substantially cover the entire carrier portion 422. The camera lens 52 can cover the camera hole 42a on the carrier portion 422. Figure 7 As shown, the camera lens 52 is located on the side of the module support 42 facing away from the middle frame 411, that is, the camera lens 52 is located on the side of the module support 42 facing away from the inner cavity 41b. The camera lens 52 is used to transmit external light. The camera lens 52 can be made of, for example, acrylic, glass, sapphire, etc.

[0104] like Figure 10 As shown, the camera lens 52 may be provided with a receiving through hole 52a, which passes through the camera lens 52 along the thickness direction of the camera lens 52. The receiving through hole 52a may be a circular through hole. Figure 10 As shown in FIG11( a ), receiving hole 52a can be aligned with infrared aperture 42b , meaning their axes coincide or nearly coincide. Because infrared aperture 42b is separated from camera aperture 42a , receiving hole 52a is located in an area of camera lens 52 that is offset from camera aperture 42a , separating the receiving hole 52a from camera aperture 42a .

[0105] Combine Figure 10 As shown in Figures 11(a) and 11(b), the infrared lens 53 can be approximately disc-shaped. The infrared lens 53 and the camera lens 52 are located on the same side of the module support 42, with the infrared lens 53 positioned within the receiving hole 52a on the camera lens 52. The infrared lens 53 is supported by the support portion 422 and covers the infrared light aperture 42b. For the module support 42 shown in Figure 11(a), the camera lens 52 can be directly adjacent to the infrared lens 53. For the module support 42 shown in Figure 11(b), the infrared lens 53 can be installed within the area enclosed by the surrounding rib 42p. The surrounding rib 42p can surround the infrared lens 53, and the infrared lens 53 and camera lens 52 can be separated by the surrounding rib 42p. The gaps between the infrared lens 53 and the surrounding rib 42p, as well as the gaps between the camera lens 52 and the surrounding rib 42p, can be small to meet product appearance requirements. The infrared lens 53 can be substantially flush with the surrounding rib 42p. The infrared lens 53 can be placed at a position that is difficult for human hands to touch.

[0106] The infrared lens 53 transmits only infrared light (e.g., far-infrared light). The infrared lens 53 can be made of, for example, single-crystal silicon or other materials that transmit only infrared light. In this embodiment, considering that the camera lens 52 and the infrared lens 53 require different optical properties, which cannot be achieved with a single lens, the camera lens 52 and the infrared lens 53 can be made of different materials and assembled together.

[0107] Figure 16 It shows the assembly structure of the camera lens 52, infrared lens 53 and module bracket 42. Figure 17 yes Figure 16 Schematic diagram of the local enlarged structure at E in the middle. Figure 16 and Figure 17 As shown, the infrared lens 53 can be sunken to a certain size compared to the camera lens 52, which makes the infrared lens 53 less susceptible to scratches and wear, and can protect the infrared lens 53. The size of the infrared lens 53 sinking can be determined according to actual needs, for example, it can be 0.1mm. In addition, in order to prevent the hole edge 52b (the hole edge 52b is the hole edge on the side of the receiving through hole 52h away from the module bracket 42) exposed after the infrared lens 53 sinks from scratching hands, the hole edge 52b can be chamfered to obtain a chamfer 52c. The size of the chamfer 52c can be, for example, 0.1mm*45°. In addition, Figure 17 The surrounding rib 42p is not shown. In practice, when the module support 42 has a surrounding rib 42p, the top surface of the surrounding rib 42p (the surface facing away from the bearing portion 422) can be no higher than the hole edge 52b. For example, the top surface of the surrounding rib 42p can be substantially flush with the lower edge of the chamfer 52c (the edge facing the interior of the receiving through hole 52h). This makes the module support 42 easier to manufacture and more aesthetically pleasing. It should be understood that the sunken infrared lens 53 and the chamfer 52c are preferred designs and are not required. Figure 18 and Figure 19 It shows the assembly relationship of the main board 46, the camera module 47, the infrared module 48, the module bracket 42, the camera lens 52 and the infrared lens 53, wherein Figure 18 In order to clearly express the positional relationship between the infrared temperature sensor 50 and the receiving cavity 42 f , the infrared temperature sensor 50 and the flexible circuit board 49 are separated.

[0108] like Figure 18 and Figure 19As shown, the camera module 47 and infrared module 48 are both located between the mainboard 46 and the module bracket 42. The camera lens 52 and infrared lens 53 are both located on the side of the module bracket 42 facing away from the mainboard 46. The optical axes of the two camera modules 47 can be aligned with the two camera holes 42a, respectively. The arrangement end 492 of the flexible circuit board 49 can be located within the mounting groove 42c of the module bracket 42. At least a portion of the infrared temperature sensor 50 on the arrangement end 492 is located within the receiving cavity 42f. The infrared temperature sensor 50 can receive infrared light that enters the receiving cavity 42f through the infrared lens 53.

[0109] In this embodiment, the module bracket 42 can be electrically connected to the ground on the mainboard 46. For example, the module bracket 42 can be connected to the ground via a conductive member such as a spring, a guide post, or a screw. This grounds the module bracket 42 and provides electrostatic protection for the camera module 47 and / or the infrared module 48. The conductive member can be connected to any suitable portion of the module bracket 42, for example, the conductive member can be connected to the skirt 421. It will be understood that grounding the module bracket 42 is merely a preferred design and is not essential.

[0110] Figure 20 yes Figure 19 FF cross-sectional view of the assembly structure of the camera module 47, infrared module 48, module bracket 42, camera lens 52 and infrared lens 53, wherein Figure 20 In order to highlight the key points, the camera module 47 is omitted. In addition, Figure 20 The surrounding rib 42p is not shown.

[0111] like Figure 20 As shown, the flexible circuit board 49, module bracket 42, and infrared lens 53 surround the periphery of the infrared temperature sensor 50. These components are all located near the receiving cavity, and thus, they are considered "structures near the infrared temperature sensor 50" as mentioned above. As mentioned above, the closer the temperature difference between the flexible circuit board 49, module bracket 42, infrared lens 53, and infrared temperature sensor 50 approaches zero, the higher the infrared temperature measurement accuracy. The faster the temperature difference between the flexible circuit board 49, module bracket 42, infrared lens 53, and infrared temperature sensor 50 approaches zero, the faster the temperature measurement speed. Furthermore, the closer the temperatures of the flexible circuit board 49, module bracket 42, infrared lens 53, and infrared temperature sensor 50 are to the ambient temperature of the electronic device 40, the higher the infrared temperature measurement accuracy.

[0112] Furthermore, because the flexible circuit board 49 and the infrared temperature sensor 50 are directly connected (e.g., welded), their temperatures can be maintained essentially identical. The temperature difference between the flexible circuit board 49 and the infrared temperature sensor 50 can be considered zero, and thus the impact of the flexible circuit board 49 on temperature measurement accuracy and speed can be ignored. Therefore, when considering temperature measurement accuracy and speed, one can focus solely on the temperature difference between the module bracket 42, the infrared lens 53, and the infrared temperature sensor 50, as well as the temperature difference between these three elements and the external environment surrounding the electronic device 40.

[0113] In actual scenarios, the electronic device 40 is exposed to thermal radiation from the external environment, causing the infrared lens 53, module bracket 42, and infrared temperature sensor 50 to rise in temperature. Various heat sources also exist within the electronic device 40, such as the camera module 47, chips, and batteries. These heat sources also radiate heat to the infrared lens 53, module bracket 42, and infrared temperature sensor 50, causing a temperature rise. The infrared lens 53, module bracket 42, and infrared temperature sensor 50 together form a thermal system, allowing for heat transfer between them. The infrared lens 53 is directly mounted on the module bracket 42, resulting in a shorter heat transfer path and a faster heat exchange rate. The infrared temperature sensor 50 is housed in the receiving chamber 42f. A gap exists between the infrared temperature sensor 50 and the inner wall of the receiving chamber 42f, slowing the heat exchange rate between the infrared temperature sensor 50 and the inner wall of the receiving chamber 42f. After a period of heat exchange, the thermal system can reach a state of thermal equilibrium, where the temperatures of the infrared lens 53, module bracket 42, and infrared temperature sensor 50 converge. In this embodiment, for example, when the temperature difference among the infrared lens 53 , the module bracket 42 and the infrared temperature sensor 50 is less than or equal to 2° C., it is considered that the temperatures of the three are consistent and the three can enter a uniform temperature state.

[0114] On the one hand, when the specific heat capacity of the material of the module bracket 42 is greater than or equal to 0.2 kJ / (kg·℃), since the temperature rise of such a module bracket 42 is small when absorbing a certain amount of heat from a heat source outside the thermal system, the module bracket 42 will not cause a large temperature rise to the infrared lens 53 and the infrared temperature sensor 50, and can avoid a large temperature difference between the thermal system and the external environment of the electronic device 40. This makes the temperature of the module bracket 42, the infrared lens 53 and the temperature sensor 50 all have a small difference from the temperature of the external environment, thereby ensuring the accuracy of infrared temperature measurement.

[0115] On the other hand, when the thermal conductivity of the material of the module bracket 42 is greater than or equal to 10W / (m·k), the module bracket 42 has better thermal conductivity, which can promote heat transfer in the thermal system and quickly make the temperature difference among the infrared lens 53, the module bracket 42 and the infrared temperature sensor 50 approach zero. This makes the temperature difference among the module bracket 42, the infrared lens 53 and the temperature sensor 50 approach zero quickly, thereby ensuring the accuracy and speed of infrared temperature measurement.

[0116] Furthermore, because the infrared temperature sensor 50 is housed in the accommodating cavity 42f, each inner wall of the accommodating cavity 42f can exchange heat with the infrared temperature sensor 50, making the heat exchange between the module bracket 42 and the infrared temperature sensor 50 more complete. This helps accelerate the heat exchange between the module bracket 42 and the infrared temperature sensor 50, ensuring that the heat exchange rate between the module bracket 42 and the infrared temperature sensor 50 matches the heat exchange rate between the module bracket 42 and the infrared temperature sensor 50 and the infrared lens 53, and allowing the temperature differences between the module bracket 42 and the infrared temperature sensor 50 and between the module bracket 42 and the infrared lens 53 to approach zero within the same relatively short period of time. In other words, the temperature-averaging cavity 42f enables the module bracket 42, the infrared temperature sensor 50, and the infrared lens 53 to reach a uniform temperature within a relatively short period of time, thereby ensuring the accuracy of infrared temperature measurement.

[0117] Boss 42h increases the heat radiation area of accommodating cavity 42f, enhancing heat exchange between the inner wall of accommodating cavity 42f and infrared temperature sensor 50, thereby improving infrared temperature measurement accuracy. Furthermore, boss 42h is spaced a certain distance from peripheral device 51, ensuring proper function of peripheral device 51. It is understood that boss 42h is a further optimization feature and is not a required feature.

[0118] Furthermore, because at least a portion of the inner wall of the receiving cavity 42f is attached with a colored material layer or has an unpolished surface, the emissivity of this portion of the inner wall of the receiving cavity 42f is increased, allowing this portion of the inner wall of the receiving cavity 42f to radiate more heat to the infrared temperature sensor 50; and the reflectivity of this portion of the inner wall of the receiving cavity 42f is reduced, allowing this portion of the inner wall of the receiving cavity 42f to absorb more heat from the infrared temperature sensor 50. This design allows for more efficient heat exchange between the module support 42 and the infrared temperature sensor 50, effectively and quickly reducing the temperature difference between the module support 42 and the infrared temperature sensor 50, and thus improving temperature measurement accuracy and speed. It is understood that the design of at least a portion of the inner wall of the receiving cavity 42f being attached with a colored material layer or having an unpolished surface is a further optimization design, rather than an essential design.

[0119] Furthermore, the bearing portion 422 of the module bracket 42 is protruded from the surface 412a of the rear shell 412. This can make the module bracket 42 fully contact with the outside air, enhance the heat exchange between the module bracket 42 and the outside air, and make the heat absorbed by the module bracket 42 be released into the air more quickly, so that the thermal system can maintain thermal balance and ensure temperature measurement accuracy. In particular, for the rear shell 412 made of materials with poor thermal conductivity such as glass, the heat exchange between the module bracket 42 and the rear shell 412 is relatively limited, which will affect the thermal balance of the thermal system, and the protruding design of the bearing portion 422 can make up for this defect. For the rear shell 412 made of materials with good thermal conductivity such as metal, since the heat exchange between the module bracket 42 and the rear shell 412 is already relatively sufficient, the bearing portion 422 can be protruding or not. It can be understood that the design of the bearing portion 422 protruding from the surface 412a is a further optimization design, rather than an indispensable design. For example, when the rear housing 412 is made of glass, the carrying portion 422 may not protrude from the surface 412 a.

[0120] Furthermore, by designing a surrounding rib 42p on the module bracket 42, the surrounding rib 42p surrounds the infrared lens 53, which is beneficial to enhancing the heat exchange between the module bracket 42 and the infrared lens 53, promoting more sufficient heat transfer in the thermal system, and helping to improve the temperature measurement accuracy and speed.

[0121] Furthermore, by providing thermal insulation grooves 42k in the module support 42, each of the thermal insulation grooves 42k is filled with air, which is a poor conductor of heat. Therefore, when the module support 42 exchanges heat with heat sources other than the heat system, the temperature rise of the module support 42 is relatively slow. This helps maintain the thermal balance of the heat system and, in turn, ensures temperature measurement accuracy. Placing the thermal insulation grooves 42k in the heat transfer path can further reduce the heat exchange efficiency of the module support 42 and slow down the temperature rise of the module support 42.

[0122] Furthermore, when the infrared lens 53 is surrounded by the camera lens 52, placing the infrared lens 53 as close as possible to the edge of the module bracket 42 can enhance heat exchange between the infrared lens 53 and the module bracket 42, effectively and quickly reducing the temperature difference between the infrared lens 53 and the module bracket 42, thereby improving temperature measurement accuracy and speed. By placing the infrared lens 53 in a position where it is difficult for human hands to touch, human hands can be prevented from interfering with the thermal system, which helps to maintain the thermal balance of the thermal system and ensure temperature measurement accuracy and speed. It is understandable that these are merely further optimization designs and are not essential features.

[0123] In addition, the infrared module 48 and the camera module 47 share the same module bracket 42, and the module bracket 42 carries the camera lens 52 and the infrared lens 53 at the same time. This design makes the module bracket 42 larger in size. When absorbing the same amount of heat, the module bracket 42 with a larger volume has a smaller temperature rise, which will not cause a large temperature rise in the entire thermal system, which is conducive to achieving thermal balance of the thermal system, thereby ensuring temperature measurement accuracy. Especially when there are multiple camera modules 47, the volume of the module bracket 42 will be larger, and the temperature rise of the module bracket 42 will be smaller when absorbing the same amount of heat from the outside, so that the thermal system can maintain a more stable thermal balance state and improve temperature measurement accuracy. The wall thickness of the module bracket 42 can be made as large as possible (for example Figure 15 The thickness of the middle wall 42j is at least 0.5 mm), which can also reduce the temperature rise of the module bracket 42 when absorbing the same amount of heat, which is beneficial to ensuring the temperature measurement accuracy.

[0124] In addition, the infrared module 48 and the camera module 47 share the same module bracket 42, and the infrared lens 53 is nested in the camera lens 52. In this way, there is no need to open an additional hole for the infrared lens 53 on the back shell 412, which can ensure the integrity of the appearance of the back shell 412 and also allow the infrared lens 53 and the camera lens 52 to be integrated to create a consistent appearance effect.

[0125] like Figure 21 and Figure 22 As shown, in embodiment 2, based on the solution of the above embodiment, the electronic device 40 may further include a thermal insulation ring 53. The thermal insulation ring 53 may be annular, and its shape may be adapted to the mounting groove 42c. For example, the shape of the thermal insulation ring 53 may be approximately a circular ring. A pair of opposite inner boundaries of the thermal insulation ring 53 may be approximately circular arcs, for example, and another pair of opposite inner boundaries may be approximately straight lines, for example. The thermal insulation ring 53 is installed in the mounting groove 42c and is located between the module bracket 42 and the flexible circuit board 49. The opposite sides of the thermal insulation ring 53 may respectively abut the bottom surface 42d of the mounting groove 42c and the flexible circuit board 49. The thermal insulation ring 53 may surround the accommodating cavity 42f and the outer periphery of the infrared temperature sensor 50. The thermal insulation ring 53 may be made of a thermal insulation material, such as foam.

[0126] In the second embodiment, due to the thermal insulation provided by the thermal insulation ring 53, heat generated by the heat source within the electronic device 40 (such as the camera module 47) is less likely to enter the receiving cavity 42f. This allows the temperature of the infrared temperature sensor 50 to remain stable, preventing a large temperature difference between the infrared temperature sensor 50 and the module bracket 42 and infrared lens 53, thereby ensuring temperature measurement accuracy. It will be appreciated that the provision of the thermal insulation ring 53 also prevents heat from the external environment from entering the receiving cavity 42f.

[0127] like Figure 23As shown, in the third embodiment, unlike the second embodiment, a heat insulating ring 53 is not provided in the mounting groove 42c, but a heat conducting portion 42l may be protruded from the bottom surface 42d of the mounting groove 42c. The heat conducting portion 42l may be integrally connected to the bottom surface 42d of the mounting groove 42c. The heat conducting portion 42l may be spaced apart from the side surface 42m of the mounting groove 42c. The heat conducting portion 42l is located on the outer periphery of the receiving cavity 42f. The heat conducting portion 42l may be a closed annular structure. The material of the heat conducting portion 42l may be the same as that of the module bracket 42. The heat conducting portion 42l is used to connect to the flexible circuit board 49.

[0128] The above description of the structure and position of the heat conducting portion 421 is only an example, and the third embodiment is not limited thereto. For example, the heat conducting portion 42 may also be an open ring structure (approximately C-shaped). Alternatively, the heat conducting portion 421 may also be one or at least two protrusions spaced apart, and a single protrusion may be columnar or block-shaped. Alternatively, Figure 23 Based on the design of the heat conducting portion 42l, Figure 24 The heat conducting portion 421 in the mounting groove 42c can also be expanded outward and connected to the side surface 42m of the mounting groove 42c. For example, the surface of the heat conducting portion 421 can be flush with the side surface 42m. The heat conducting portion 421 can also be expanded inward and connected to the side surface 42i of the receiving cavity 42f. For example, the surface of the heat conducting portion 421 can be flush with the side surface 42i. In this case, the heat conducting portion 421 can be considered to surround the outer periphery of the receiving cavity 42f. Figure 23 Taking the heat conducting portion 421 in FIG. 4 as an example, the corresponding design of the infrared module 48 will be described.

[0129] Figure 25 Schematic diagram of the structure of the infrared module 48 at a viewing angle. Figure 25 As shown, the surface of the arrangement end 492 of the flexible circuit board 49 may have an exposed copper area 49a (shown by shading). The insulating layer of the flexible circuit board 49 in the exposed copper area 49a is removed, and the copper layer under the insulating layer is exposed. The exposed copper area 49a and the infrared temperature sensor 50 are located on the same side of the arrangement end 492. The exposed copper area 49a surrounds the outer periphery of the infrared temperature sensor 50, and the two are separated from each other. The shape of the exposed copper area 49a can be the same as that of the infrared temperature sensor 50. Figure 23 The shape of the heat conducting portion 421 in the embodiment of the present invention is adapted, for example, the copper exposed area 49a can be approximately annular (for Figure 24 The heat conducting portion 421 is shaped like a special shape, and the copper exposed area 49a can have a special shape that matches the heat conducting portion 321). Figure 25 and Figure 23 As shown, when the arrangement end 492 is placed in the mounting groove 42c, the exposed copper area 49a is connected to the heat conducting portion 421 (either directly or through a connecting medium).

[0130] In the third embodiment, the exposed copper area 49a has excellent thermal conductivity. This connection between the exposed copper area 49a and the module support 42 establishes a contact-type thermal path between the flexible circuit board 49 and the module support 42. This facilitates heat exchange between the infrared temperature sensor 50 and the module support 42, helping the temperature difference between the infrared lens 53, the module support 42, and the infrared temperature sensor 50 to quickly approach zero, thereby improving temperature measurement accuracy and speed. A larger volume of the heat conducting portion 42l facilitates heat exchange between the infrared temperature sensor 50 and the module support 42, further improving temperature measurement accuracy and speed.

[0131] like Figure 26 As shown, in the fourth embodiment, based on any of the above embodiments, the electronic device 40 may further include a heat insulating bracket 54. The heat insulating bracket 54 and the infrared temperature sensor 50 are respectively connected to the opposite sides of the arrangement end 492 ( Figure 26 The mid-infrared temperature sensor 50 is obscured. The thermal insulation bracket 54 can correspond to the mounting slot 42c. The thermal insulation bracket 54 can be supported between the arrangement end 492 of the flexible circuit board 49 and the mainboard 46 to support the arrangement end 492, the infrared temperature sensor 50, and the module bracket 42, ensuring reliable assembly.

[0132] The heat insulating bracket 54 may have any suitable shape and structure. Figure 27 As shown, the heat insulation bracket 54 may include a circular portion 541 and a square portion 542 connected as one body, the circular portion 541 may be approximately in the shape of a circular plate, and the square portion 542 may be approximately in the shape of a block. Figure 27 and Figure 26 As shown, the circular portion 541 can be connected to the mounting end 492, while the square portion 542 can be connected to the circuit board. This structure of the thermal insulation bracket 54 allows for better assembly with the mounting end 492 and the mainboard 46, ensuring reliable connection. Of course, this structure of the thermal insulation bracket 54 is merely an example and is not intended to be limiting.

[0133] In the fourth embodiment, the thermal insulation bracket 54 can be made of a thermally insulating material, such as plastic. Thus, the thermal insulation bracket 54 can block heat generated by the mainboard 46 from being transmitted to the flexible circuit board 49 and the infrared temperature sensor 50, preventing heat from the mainboard 46 from interfering with the infrared temperature sensor 50 and preventing a large temperature difference between the infrared temperature sensor 50 and the module bracket 42 and infrared lens 53, thereby ensuring temperature measurement accuracy. It will be appreciated that the thermal insulation bracket 54 can also block heat from other heat sources from being transmitted to the flexible circuit board 49 from the side of the arrangement end 492 facing the mainboard 46.

[0134] like Figure 27As shown, in order to further reduce the interference of heat from the mainboard 46 or other heat sources on the infrared temperature sensor 50, the square portion 542 of the heat-insulating bracket 54 can be hollowed out. For example, the surface of the square portion 542 facing the mainboard 46 can be partially concave to form a plurality of (e.g., four) heat-insulating grooves 54a, each of which can be approximately square in shape. When the heat-insulating bracket 54 is connected to the mainboard 46, since each heat-insulating groove 54a is filled with air, and air is a poor conductor of heat, the heat exchange between the heat-insulating bracket 54 and the mainboard 46 is further suppressed. Therefore, the provision of the heat-insulating grooves 54a in the heat-insulating bracket 54 can enhance the heat-insulating effect of the heat-insulating bracket 54.

[0135] It should be understood that the heat-insulating groove 54a can be provided at any suitable location on the heat-insulating bracket 54, and is not limited to the surface of the square portion 542 facing the mainboard 46. For example, the heat-insulating groove 54a can also be provided on the circular portion 541, such as the surface of the circular portion 541 facing the arrangement end 492; or the heat-insulating groove 54a can also be provided on the peripheral side surface 542a of the square portion 542, where the peripheral side surface 542a can be a surface surrounding the axis of the circular portion 541.

[0136] In embodiment five, similar to the above embodiments, the electronic device also has relevant designs for improving temperature measurement accuracy and temperature measurement speed. For example, the specific heat capacity of the material of the module bracket is greater than or equal to 0.2 kJ / (kg·℃), and / or the thermal conductivity of the material of the module bracket is greater than or equal to 10 W / (m·k). The receiving cavity in the module bracket surrounds the infrared temperature sensor. The inner wall of the receiving cavity may be attached with a layer of colored material or have a non-polished surface. The bearing portion of the module bracket may protrude from the surface of the rear shell. A thermal insulation ring may be provided in the module bracket; or, a thermal conductive portion may be provided in the module bracket, the flexible circuit board may have a copper exposed area, and the thermal conductive portion is connected to the copper exposed area. A groove may be provided on the module bracket to slow down the temperature rise of the module bracket. A thermal insulation bracket may be used to support between the flexible circuit board and the mainboard, and the thermal insulation bracket has thermal insulation properties. The thermal insulation bracket may be hollowed out to form a groove for accommodating air.

[0137] like Figure 28As shown, the difference between the fifth embodiment and the above embodiments is that, in addition to the mounting opening 61a, the rear shell 61 of the electronic device 60 can also be provided with a camera lens mounting hole 61b, and the camera lens 64 is installed in the camera lens mounting hole 61b. The module bracket 62 located in the mounting opening 61a carries the infrared lens 63, but does not carry the camera lens 64. The positions of the infrared module and the camera module located inside can be adaptively adjusted to match the positions of the infrared lens 63 and the camera lens 64, respectively. That is, in the scheme of the fifth embodiment, the infrared lens 63 and the camera lens 64 no longer share a module bracket, so that the electronic device 60 has a different structure and appearance from the electronic device 40 in the above embodiment, which can meet the differentiated design requirements of the product.

[0138] Combine Figure 29 and Figure 30 As shown, in embodiment six, unlike the above-mentioned embodiment five, the mounting opening 72a of the electronic device 70 is not provided on the rear shell 71, but is provided on the frame 72. Correspondingly, the module bracket 73 is installed in the mounting opening 72a on the frame 72, and the module bracket 73 can be exposed from the mounting opening 72a. The infrared lens 74 is also on the frame 72. The position of the infrared module inside the electronic device 70 can be adaptively adjusted to match the position of the infrared lens 74. For example, the infrared module can be arranged close to the infrared lens 74. The electronic device 70 of embodiment six has a different structure and appearance design from the electronic device 60 in embodiment five, and can meet the differentiated design requirements of the product.

[0139] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: The electronic device includes a housing, a module bracket, an infrared lens and an infrared temperature sensor; The housing has an inner cavity and a mounting opening, wherein the mounting opening communicates with the inner cavity and the exterior of the electronic device; The specific heat capacity of the material of the module support is greater than or equal to a specific heat capacity threshold value, which is 0.2 kJ / (kg·°C), and / or the thermal conductivity of the material of the module support is greater than or equal to a thermal conductivity threshold value, which is 10 W / (m·K); The module bracket is mounted on the housing, at least a portion of the module bracket is accommodated in the inner cavity, and a portion of the module bracket is exposed in the mounting opening; An infrared light hole is provided on a side of the module bracket facing away from the inner cavity, and the infrared light hole is exposed in the mounting opening; A receiving cavity is provided on one side of the module bracket facing the inner cavity, and the receiving cavity is communicated with the infrared light hole; The infrared lens is directly mounted on the side of the module bracket facing away from the inner cavity and covers the infrared light hole; The infrared temperature sensor is located in the inner cavity, a portion of the infrared temperature sensor is accommodated in the accommodation cavity, the inner wall of the accommodation cavity surrounds the sides of the infrared temperature sensor; the other portion of the infrared temperature sensor is located outside the accommodation cavity and faces the interior of the inner cavity.

2. The electronic device according to claim 1, characterized in that ， The surface of the module bracket on one side facing the inner cavity is partially sunken to form a groove, and the cavity of the groove is the receiving cavity; the infrared light hole passes through the bottom wall of the groove.

3. The electronic device according to claim 1, wherein A wall is protruded from the surface of the module bracket on one side facing the inner cavity, and the space enclosed by the wall is the receiving cavity; the infrared light hole passes through the area of the surface enclosed by the wall.

4. The electronic device according to any one of claims 1 to 3, characterized in that: An avoidance groove is provided on the surface where the opening of the receiving cavity is located. The avoidance groove is communicated with the receiving cavity, and the depth of the avoidance groove is smaller than the depth of the receiving cavity.

5. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device includes a heat insulation ring, which surrounds the infrared temperature sensor and the outer periphery of the receiving cavity.

6. The electronic device according to claim 5, characterized in that The surface of the module bracket on one side facing the inner cavity is partially recessed to form a mounting groove, and the side wall of the mounting groove is located at the outer periphery of the receiving cavity; the heat insulation ring is installed in the mounting groove.

7. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device includes a flexible circuit board, which is located in the inner cavity and has a copper exposed area. The infrared temperature sensor is arranged on the flexible circuit board, and the infrared temperature sensor and the copper exposed area are located on the same side of the flexible circuit board, and the infrared temperature sensor is separated from the copper exposed area. The surface of the module bracket facing the inner cavity is provided with a heat conducting portion, and the heat conducting portion is connected to the copper exposed area.

8. The electronic device according to claim 7, wherein: The surface of the module bracket on one side facing the inner cavity is partially recessed to form a mounting groove, and the side wall of the mounting groove is located at the periphery of the receiving cavity; the heat conducting part is arranged on the bottom surface of the mounting groove and is located at the periphery of the receiving cavity and the infrared temperature sensor.

9. The electronic device according to any one of claims 1 to 3, characterized in that: The emissivity of at least a portion of the inner wall of the receiving cavity is greater than or equal to 95%, and / or the reflectivity of at least a portion of the inner wall of the receiving cavity is less than or equal to 50%.

10. The electronic device according to claim 9, characterized in that A colored material layer is attached to at least a portion of the inner wall of the receiving cavity, or at least a portion of the inner wall of the receiving cavity has a non-polished surface.

11. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device includes a flexible circuit board and a thermal insulation bracket; the flexible circuit board is located in the inner cavity; the infrared temperature sensor and the thermal insulation bracket are located at the same end of the flexible circuit board and are respectively connected to opposite sides of the flexible circuit board.

12. The electronic device according to claim 11, wherein: The heat insulation bracket is provided with a heat insulation groove.

13. The electronic device according to any one of claims 1 to 3, characterized in that: The module bracket protrudes from a surface of the shell facing away from the inner cavity.

14. The electronic device according to any one of claims 1 to 3, characterized in that: A surrounding rib is protruding from the surface of the module bracket on the side facing away from the inner cavity, and the surrounding rib surrounds the outer periphery of the infrared lens.

15. The electronic device according to any one of claims 1 to 3, characterized in that: The module bracket is further provided with a camera hole, the camera hole and the infrared light hole are located on the same side of the module bracket, and the camera hole is separated from the infrared light hole; The electronic device includes a camera lens and a camera module; the camera lens and the infrared lens are located on the same side of the module bracket, the camera lens covers the camera hole, and a receiving through hole is opened in the area where the camera lens and the camera hole do not overlap; the camera module is located in the inner cavity, and the camera module is used to collect light passing through the camera lens and the camera hole; the infrared lens is located in the receiving through hole.

16. The electronic device according to claim 15, characterized in that A surrounding rib is protruding from the surface of the module bracket on the side facing away from the inner cavity. The surrounding rib is located in the receiving through hole and surrounds the outer periphery of the infrared lens.

17. The electronic device according to claim 15, characterized in that There are at least two camera modules and at least two camera holes, and the at least two camera holes are distributed at intervals, with one camera module corresponding to one camera hole.

18. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device is a mobile phone, the housing comprises a middle frame and a rear shell, the rear shell and the middle frame are assembled to form the inner cavity, and the mounting opening is provided on the rear shell.

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