Camera module and assembly method

Abstract

The present invention relates to a camera module and an assembly method, wherein the camera module comprises a lens, a connector, a circuit board and a photoelectric imaging sensor arranged on the circuit board, wherein along the optical axis direction, the connector comprises a first connecting portion fixedly connected to the lens and a second connecting portion connected to the circuit board, a correction plane is provided on the side of the first connecting portion facing the second connecting portion or a correction plane is provided on the side of the second connecting portion close to the circuit board, the correction plane is parallel to the imaging surface of the lens, and a connection glue layer of a predetermined thickness is provided between the correction plane and the second connecting portion or between the correction plane and the circuit board. The camera module of the present invention can ensure that the thickness of the filled glue (connection glue layer) is consistent in the AA process, and can especially ensure that the glue thickness of all camera modules is consistent, the shrinkage of the glue is consistent, and the consistency and qualified rate of the products are improved.

Description

Technical Field

[0001] The present invention belongs to the field of optical technology, and in particular relates to a camera module and an assembling method. Background Art

[0002] With the continuous development of photoelectric imaging sensors and image processing system platforms, the demand for image processing algorithms is increasing, making the resolution of cameras higher and higher, especially in the non-consumer field, including the field of vehicle-mounted and security cameras, low pixels have been gradually eliminated. With the continuous upgrading of the pixels of photoelectric imaging sensors, the resolution of the lens in the camera is required to be higher and higher, but the resolution margin of the lens is getting smaller and smaller relative to the photoelectric imaging sensor, that is, the focal depth range of the camera module is getting smaller and smaller, which requires higher precision when assembling the camera module. In addition, non-consumer field camera modules are basically fixed-focus modules (non-autofocus). When the temperature changes, the best imaging surface of the lens will drift, and the operating temperature conditions of such modules are relatively harsh (for example, the vehicle-mounted field generally requires -40—+85℃). To keep the camera module in good performance over the full temperature range, the camera module is required to have higher precision when assembled (not only to ensure the performance at room temperature, but also to consider the temperature drift of the lens back focus under low and high temperature conditions, so the assembly margin is smaller when assembled at room temperature).

[0003] Consider the above two points: 1) With the pixel upgrade of the photoelectric imaging sensor, the resolution margin of the lens relative to the photoelectric imaging sensor becomes smaller, and the focal depth range of the module becomes smaller; 2) For a fixed-focus camera module, the position of the lens back focus (lens optimal imaging surface) is different under different temperature conditions, that is, when the temperature changes, the camera module will have a focus shift phenomenon. When assembling the camera module, it is required that the position of the lens imaging surface and the photosensitive position of the photoelectric imaging sensor should be as close as possible, and the smaller the deviation, the better, which means that the camera module assembly accuracy is required to be higher.

[0004] For cameras that require high-precision assembly, the industry generally uses the AA process for camera assembly. In the AA process, AA glue is an indispensable key factor: through AA technology, after the lens and circuit board are corrected to the best relative position, the lens and circuit board or base are connected and fixed through AA glue, so that the lens and circuit board are always kept in the best relative position (the imaging surface of the lens coincides with the photosensitive surface of the photoelectric imaging sensor on the circuit board). However, AA glue has a characteristic that it will shrink after curing, and the shrinkage amount will be different for different glue thicknesses; the thicker the glue, the greater the shrinkage. On the other hand, even if the glue thickness is the same, the glue shrinkage amount is different due to differences in curing conditions (UV exposure curing, thermal curing); the thicker the glue, the greater the difference in shrinkage. For the shrinkage of glue, this shrinkage amount is generally taken into account, and a fixed compensation amount is pre-set for compensation during AA. However, generally, the glue thickness of each camera module is different, and the glue shrinkage is also different. In this way, when AA is compensated, compensation is performed according to a fixed compensation amount. Some camera modules are compensated too much, and some are compensated too little, which will lead to inconsistent resolution of the camera modules and cannot effectively ensure that the resolution of all camera modules reaches the qualified level. Moreover, for the camera modules mentioned above that require extremely high assembly accuracy, the traditional AA glue shrinkage compensation technology no longer meets such high precision requirements. Therefore, in camera modules that require high-precision assembly, solving the inconsistency of AA glue thickness is a very critical issue. It is necessary to implement a certain method to make the glue thickness of the camera module consistent and the glue thickness small (the smaller the glue thickness, the smaller the shrinkage, and the smaller the difference in shrinkage), so as to control the glue shrinkage of each module to be basically the same, and use a fixed glue shrinkage compensation amount for compensation during AA.

[0005] The reason for the inconsistent thickness of AA glue is the deviation of various components of the camera module. The main deviation is the deviation of the optical lens (specifically manifested as optical back focus deviation and optical axis tilt deviation). The optical lens is assembled from several lenses, which also includes structural parts (spacers, lens barrels, etc.). All lenses and structural parts have tolerances, resulting in the inconsistent position of the optical focal plane of the optical lens relative to the glue bonding surface, which directly leads to inconsistent glue thickness. In addition, the height deviation of the photoelectric imaging sensor and the height deviation of the base directly affect the size of the AA gap, thereby affecting the thickness of the AA glue. Summary of the invention

[0006] The purpose of the present invention is to solve the above-mentioned problem and provide a camera module and an assembly method to solve the problem that the resolution cannot be guaranteed due to inconsistent glue thickness of the same batch of camera modules.

[0007] To achieve the above-mentioned purpose, the present invention provides a camera module, including a lens, a connector, a circuit board and a photoelectric imaging sensor arranged on the circuit board, along the optical axis direction, the connector includes a first connecting part fixedly connected to the lens and a second connecting part connected to the circuit board, a correction plane is provided on the side of the first connecting part facing the second connecting part or a correction plane is provided on the side of the second connecting part close to the circuit board, the correction plane is parallel to the imaging surface of the lens, and a connecting glue layer of predetermined thickness is provided between the correction plane and the second connecting part or between the correction plane and the circuit board.

[0008] According to one aspect of the present invention, the connecting adhesive layer is arranged between the correction surface and the second connecting portion, and the following holds: d = F + hH;

[0009] Wherein, d represents the thickness of the connecting adhesive layer, F represents the distance from the correction plane to the imaging plane, h represents the height of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board, and H represents the height of the second connecting portion.

[0010] According to one aspect of the present invention, the connecting adhesive layer is arranged between the correction plane and the circuit board, and d=F+h exists;

[0011] Wherein, d represents the thickness of the connecting adhesive layer, F represents the distance from the correction plane to the imaging plane, and h represents the height of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board.

[0012] According to one aspect of the present invention, the second connection portion is assembled with the circuit board, and a correction plane is provided on a side of the first connection portion facing the second connection portion.

[0013] According to one aspect of the present invention, the first connecting portion and the second connecting portion are integrally formed, and a correction plane is provided on a side of the second connecting portion close to the circuit board.

[0014] According to one aspect of the present invention, the first connecting part is a lens flange, the second connecting part is a lens mount, the lens is assembled with the second connecting part through a first connection, and a correction plane is provided on a side of the second connecting part close to the circuit board.

[0015] The present invention also provides an assembling method for the above-mentioned camera module, comprising:

[0016] S1. Assemble the lens and the connector with a size margin;

[0017] S2, determining the height h between the photosensitive surface of the photoelectric imaging sensor and the upper surface of the circuit board;

[0018] S3, setting the thickness d of the connecting adhesive layer;

[0019] S4, determining the imaging surface of the lens;

[0020] S5. According to the h value obtained in step S2 and the set d value, with the imaging plane of the lens as a reference, the first connecting part or the second connecting part is subjected to material removal processing to obtain a correction plane which is a free end and parallel to the imaging plane, and the first connecting part and the second connecting part are fixed by a connecting adhesive layer or the second connecting part and the circuit board are fixed by a connecting adhesive layer.

[0021] According to one aspect of the present invention, the assembling method comprises:

[0022] Measure the height H of the second connecting portion, assemble the lens with the first connecting portion along the optical axis, and assemble the circuit board with the second connecting portion into one component;

[0023] Measuring the height h between the photosensitive surface of the photoelectric imaging sensor and the upper surface of the circuit board;

[0024] Set the thickness d of the connecting adhesive layer;

[0025] Determine the imaging surface of the lens;

[0026] According to the set d, the measured H and h, and taking the imaging plane as a reference, the first connecting portion is subjected to material removal processing to obtain a correction plane parallel to the imaging plane, and the distance from the correction plane to the imaging plane is F=H+dh;

[0027] The correction plane of the first connection part is fixedly connected to the second connection part through a connection adhesive layer.

[0028] According to one aspect of the present invention, the assembling method comprises:

[0029] Along the optical axis direction, the lens and the first connecting part and the second connecting part are assembled into one component, or the first connecting part and the second connecting part are selected as a connecting piece with an integrally formed structure and the lens to form one component;

[0030] Measuring the height h between the photosensitive surface of the photoelectric imaging sensor and the upper surface of the circuit board;

[0031] Set the thickness d of the connecting adhesive layer;

[0032] Determine the imaging surface of the lens;

[0033] According to the set d and the measured h, the second connection portion is subjected to material removal processing with the imaging surface as the reference to obtain a correction plane parallel to the imaging surface, and the distance from the correction plane to the imaging surface is F=dh,

[0034] The circuit board is fixedly connected to the correction plane of the second connecting portion through a connecting adhesive layer.

[0035] According to one aspect of the present invention, the method of removing material from the first connection part or the second connection part to obtain a correction plane includes cutting, turning, cutting, milling or chemical etching.

[0036] According to one solution of the present invention, a correction plane is provided on the side of the first connection part facing the second connection part or on the side of the second connection part facing the circuit board, and the correction plane is parallel to the imaging surface of the lens and perpendicular to the actual optical axis of the lens. Thus, the spacing between the lower side of the first connection part and the second connection part (base) is consistent or the spacing between the lower side of the second connection part and the circuit board is consistent, ensuring that the thickness of the filled glue is consistent and the shrinkage of the glue is consistent in the AA process, solving the problem of poor resolution of the camera module caused by inconsistent filling glue thickness.

[0037] In one aspect of the present invention, the thickness of the connecting glue layer between the correction plane and the second connecting portion or the circuit board is set to be the same, so that the thickness of the connecting glue layer in all camera modules is the same, and the glue shrinkage of all camera modules is consistent, which is beneficial to improving product consistency.

[0038] According to one solution of the present invention, the connection portion of the present invention is provided with sufficient dimensional margin, and sufficient dimensional margin means that, according to the concept of the present invention, for different camera modules, when the connection glue layer d is set to be consistent, no matter what the optical axis deviation angle of the camera module and the lens imaging surface position deviation are, the corresponding correction plane can be found according to F=H+dh or F=dh, and then the material margin can be removed to obtain a camera module with consistent glue thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram showing the structure of a camera module according to an embodiment of the present invention;

[0040] Figure 2 A schematic diagram showing the assembly structure of the camera module under an ideal state;

[0041] Figure 3 A diagram schematically showing that there is an angle between the actual optical axis and the mechanical axis of the lens;

[0042] Figure 4 Schematically showing the assembly diagram of the camera module in actual state;

[0043] Figure 5 A diagram schematically showing a correction plane according to the invention;

[0044] Figure 6 A diagram schematically showing the deviation of the lens imaging surface;

[0045] Figure 7 Schematic representation Figure 6 The diagram shows the glue thickness required for camera module assembly corresponding to different imaging surface deviations;

[0046] Figure 8 A schematic diagram showing an assembly diagram of a camera module of the second embodiment in an ideal state;

[0047] Fig. 9 Schematically showing the assembly diagram of the camera module in actual state;

[0048] Fig.10 A diagram schematically showing a correction plane of a second embodiment;

[0049] Fig.11 A schematic diagram showing the structure of a camera module according to a second embodiment of the present invention;

[0050] Fig.12 A schematic diagram showing a camera module in an ideal state of the third embodiment;

[0051] Fig.13 A schematic diagram of a camera module in the actual state of the third embodiment;

[0052] Fig.14 Schematically showing a correction plane diagram according to a third embodiment of the present invention;

[0053] Fig.15 The structure of a camera module according to a third embodiment of the present invention is schematically shown. DETAILED DESCRIPTION

[0054] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0055] When describing the embodiments of the present invention, the orientation or positional relationship expressed by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the relevant drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0056] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments cannot be described one by one here, but the embodiments of the present invention are not therefore limited to the following embodiments.

[0057] Combination Figure 1 , Fig.11 and Fig.15 As shown, the camera module of the present invention includes a lens 1, a connector 2, a circuit board 3, a photoelectric imaging sensor arranged on the circuit board, and a correction plane 4. Along the optical axis direction, the connector 2 includes a first connecting portion 21 fixedly connected to the lens and a second connecting portion 22 connected to the circuit board 3. According to the concept of the present invention, the first connecting portion 21 and the second connecting portion 22 are connected as separate components, or the first connecting portion 21 and the second connecting portion 22 are an integrally formed structure. In the present invention, the correction plane 4 is arranged on the side of the first connecting portion 21 facing the second connecting portion 22, or on the side of the second connecting portion 22 facing the circuit board 3. In addition, the correction plane 4 of the present invention is parallel to the imaging surface of the lens 1 and is perpendicular to the optical axis of the lens 1. According to different embodiments of the present invention, a connecting glue layer A is arranged between the correction plane 4 and the second connecting portion 22, or a connecting glue layer A is arranged between the correction plane 4 and the circuit board 3. It should be noted that for all camera modules, the thickness of the set connecting glue layer A is the same, that is, when all camera modules are assembled, the thickness of the filling glue used for assembly is consistent.

[0058] Combination Figure 1-Figure 5 As shown, according to the first embodiment of the present invention, the first connecting portion 21 and the second connecting portion 22 of the connecting member 2 are both separate components. In this embodiment, the first connecting portion 21 is a connecting flange, the first connecting portion 21 is fixedly connected to the lens 1, and the second connecting portion 22 is a lens seat. Figure 2 As shown, under ideal conditions, the base is assembled with the circuit board 3, and then the lens 1 is assembled with the base and the circuit board 3 by AA. After finding the best imaging position of the lens, glue (connecting glue layer) is filled to fix the first connecting part 21 and the second connecting part 22.

[0059] Combination Figure 3 and Figure 4 As shown, however, during the actual assembly of the camera module, there is a certain angle deviation between the mechanical axis of the lens 1 and the actual optical axis, resulting in the misalignment of the mechanical axis of the lens 1 and the actual optical axis. During the assembly of the camera module, it is necessary to ensure that the actual optical axis of the lens 1 is perpendicular to the photosensitive chip on the circuit board 3 to ensure the best imaging effect. Therefore, the lens 1 needs to be tilted at a certain angle during assembly to ensure that the actual optical axis and the photosensitive chip are perpendicular. In this state, the gap between the first connecting portion 21 (connection flange) and the second connecting portion 22 (base) is inconsistent along the circumferential direction, so that the lens 1 is not aligned with the actual optical axis. Figure 4For the cross-sectional view shown, the gap between the first connection part 21 and the left side of the base 22 is d1, and the gap between the first connection part 21 and the right side of the base 22 is d2, d1>d2. As a result, when fixing the first connection part 21 and the second connection part 22, the amount of glue filled on the left and right sides is different. The different amounts of glue filling result in different shrinkage amounts, which in turn affects the resolution of the camera module.

[0060] The camera module of the present invention solves this problem well. Figure 1 and Figure 5 As shown, in this embodiment, a correction plane 4 is provided on the side of the first connecting part 21 facing the second connecting part 22, that is, the lower side of the first connecting part 21 is the correction plane 4, and the correction plane 4 is parallel to the imaging surface of the lens 1 and perpendicular to the actual optical axis of the lens 1. As a result, the spacing between the lower side of the first connecting part 21 and the second connecting part 22 (base) is consistent, so that the thickness of the glue filled between the first connecting part 21 and the second connecting part 22 is consistent, and the shrinkage of the glue is consistent, which solves the problem of poor resolution of the camera module caused by the inconsistent thickness of the glue filled between the first connecting part 21 and the second connecting part 22. On the other hand, when the camera module of the present invention is assembled, after the correction plane 4 is set, the thickness of the glue filled between the correction plane 4 and the second connecting part 22 is pre-set, that is, the thickness of the connecting glue layer A is pre-set, so that the thickness of the connecting glue layer in each camera module can be guaranteed to be consistent, which is conducive to solving the problem of poor product consistency and low qualified rate.

[0061] Combination Figure 6 and Figure 7 As shown, in addition to the deviation that the mechanical axis and the actual optical axis do not coincide, the lens 1 also has an imaging surface deviation. Figure 6 As shown, Figure 6 The middle diagram indicates the ideal position of the imaging surface B of the lens 1 , the left diagram indicates that the imaging surface B of the lens 1 has a negative deviation, and the right diagram indicates that the imaging surface B of the lens 1 has a positive deviation.

[0062] like Figure 7As shown, when there is a negative deviation in the back focus of the lens 1, the glue thickness will be small, the greater the deviation, the smaller the thickness. When the deviation reaches a certain level and the glue thickness is a negative value, it means that the lens 1 interferes with the base 22. At this time, due to the deviation of the back focus of the lens 1, the camera assembly can no longer be performed. When there is a positive deviation in the back focus of the lens 1, the glue thickness will increase, and the greater the deviation, the greater the thickness. When the glue thickness is too small, the gap between the lens 1 and the base 22 is very small, which is very likely to cause interference during AA and assembly failure. When the glue thickness is too small, the glue bonding force may not be enough, and the module stability is poor. When the glue thickness is too large, that is, the AA interval between the lens 1 and the base 22 is large, more glue is needed to fill this gap, resulting in glue waste. In addition, if the glue gap is too large, the uniformity of the glue will deteriorate, affecting the stability of the module.

[0063]

[0064]

[0065] Table 1

[0066] On the other hand, as shown in Table 1, due to the different imaging surface positions of different camera modules, the required filling glue (connecting glue layer) has different thicknesses, and the connecting glue layers of different thicknesses shrink differently during operation, which can lead to the quality of the camera module cannot be guaranteed. Specifically, the thicker the glue, the greater the shrinkage, and the greater the difference in shrinkage. For the module described in this patent, the focal depth range of the module is generally within a few microns. If the glue thickness is too large, the difference in shrinkage is already much larger than the focal depth range, and it is impossible to guarantee that the module will achieve good performance after AA assembly.

[0067] Combination Figure 1 , Figure 2 and Figure 5 As shown, in order to solve this problem, the camera module of the present invention sets the thickness of the connecting glue layer A to d for all camera modules, and satisfies: d = F + hH (F = H-h + d). Among them, d represents the thickness of the connecting glue layer A, F represents the distance from the correction plane 4 to the imaging surface, h represents the height of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board 3, and H represents the height of the second connecting part 22. In this way, for different camera modules, the same d is set, and the h value and the H value of the second connecting part 22 are measured respectively. The position of the imaging surface can be found to find the location of the correction plane 4, that is, the removal amount of the second connecting part 22 can be determined according to the above formula (F = H-h + d). The camera module of the present invention can ensure that the glue thickness is consistent, and the glue thickness is very small, and it is recommended to be less than 200um. Of course, the smaller the better, under the premise of ensuring the strength of the glue.

[0068] Combination Figure 8-Figure 11 As shown, according to the second embodiment of the present invention, the first connection part 21 and the second connection part 22 of the connector 2 are both separate components. In this embodiment, the first connection part 21 is a connection flange, which is fixedly connected to the lens 1. The second connection part 22 is a base. In this embodiment, the lens 1, the first connection part 21 and the second connection part 22 are first assembled, and then assembled with the circuit board 3 through the AA process. Fig. 9 As shown, due to the misalignment between the mechanical axis of the lens 1 and the actual optical axis, the lens 1 needs to be tilted, resulting in the second connecting portion 22 assembled with the lens 1 also being tilted, so that the gap between the second connecting portion 22 and the circuit board 3 is different. Therefore, in this embodiment, a correction plane 4 is provided on the side of the second connecting portion 22 facing the circuit board 3, that is, the lower side surface of the second connecting portion 22 is the correction plane 4, and the correction plane 4 is provided parallel to the imaging plane B of the lens 1 and perpendicular to the actual optical axis of the lens 1. As a result, the gap between the second connecting portion 22 and the circuit board 3 is consistent, and the thickness of the glue used to connect the second connecting portion 22 and the circuit board 3 is also consistent. In this embodiment, in order to avoid the influence of the back focus deviation of the lens 1 on the resolution of the camera module, as shown in Fig.10 As shown, the connecting adhesive layer A is arranged between the correction plane 4 and the circuit board 3, and d=F+h exists. Specifically, d represents the thickness of the connecting adhesive layer A, F represents the distance from the correction plane 4 to the imaging plane, and h represents the height of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board 3. In this embodiment, the correction plane 4 is located below the imaging plane, so F is a negative value. For all camera modules, the thickness d of the connecting adhesive layer A is the same. Therefore, for each camera module, its h value can be measured first, and then F (F=dh) can be obtained. Then, the position of the correction plane can be found based on the imaging plane, and then the excess of the second connecting part 22 can be cut off by cutting or the like.

[0069] Combination Figure 12-Figure 15 As shown, according to the third embodiment of the present invention, the first connecting portion 21 and the second connecting portion 22 of the connecting member 2 are an integrally formed structure. In this embodiment, after the lens 1 and the connecting portion 2 are assembled, they are assembled with the circuit board through the AA process.

[0070] like Fig.13As shown, due to the misalignment between the mechanical axis of the lens 1 and the actual optical axis, the lens 1 needs to be tilted, resulting in the second connecting portion 22 assembled with the lens 1 also being tilted, so that the gap between the second connecting portion 22 and the circuit board 3 is different. Therefore, in this embodiment, a correction plane 4 is provided on the side of the second connecting portion 22 facing the circuit board 3, that is, the lower side surface of the second connecting portion 22 is the correction plane 4, and the correction plane 4 is provided parallel to the imaging plane B of the lens 1 and perpendicular to the actual optical axis of the lens 1. As a result, the gap between the second connecting portion 22 and the circuit board 3 is consistent, and the thickness of the glue used to connect the second connecting portion 22 and the circuit board 3 is also consistent. In this embodiment, in order to avoid the influence of the back focus deviation of the lens 1 on the resolution of the camera module, as shown in Fig.14 As shown, when a portion of the material of the second connecting portion 22 is cut away along the dotted line shown in the figure to obtain the correction plane 4, the position of the correction plane 4 is determined according to the formula d=F+h (F=dh).

[0071] The present invention also provides a method for assembling the above-mentioned camera module, comprising: S1, assembling a lens and a connector with a size margin; S2, determining the height h of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board; S3, setting the thickness d of the connecting adhesive layer; S4, determining the imaging surface of the lens; S5, based on the h value obtained in step S2 and the set d value, taking the imaging surface of the lens as a reference, removing material from the first connecting part or the second connecting part to obtain a correction plane that is a free end and parallel to the imaging surface, and fixing the first connecting part to the second connecting part through the connecting adhesive layer or fixing the second connecting part to the circuit board through the connecting adhesive layer.

[0072] Specifically, according to one embodiment of the present invention, the assembly method of the present invention includes: measuring the height H of the second connecting part, assembling the circuit board and the second connecting part into a component; measuring the height h of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board; setting the thickness d of the connecting adhesive layer; determining the imaging surface of the lens, and based on the obtained H, h and d, removing material from the first connecting part with the imaging surface as a reference to obtain a correction plane parallel to the imaging surface, and making the distance F from the correction plane to the imaging surface = H + dh; fixing the correction plane of the first connecting part to the second connecting part through the connecting adhesive layer.

[0073] According to a second embodiment of the present invention, the assembly method of the present invention includes: assembling the lens and the first connecting part and the second connecting part into one component or selecting the first connecting part and the second connecting part as a connecting part with an integrally formed structure to form a component with the lens; measuring the height h of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board; setting the thickness d of the connecting glue layer, determining the imaging surface of the lens, and based on the obtained h and d, taking the imaging surface as a reference, removing material from the second connecting part to obtain a correction plane parallel to the imaging surface, and making the distance F from the correction plane to the imaging surface = dh, and fixing the circuit board and the correction plane of the second connecting part through the connecting glue layer.

[0074] It should be noted that the connection portion of the present invention is provided with sufficient dimensional margin. Sufficient dimensional margin means that, according to the concept of the present invention, for different camera modules, when the connecting glue layer d is set to be consistent, no matter what the optical axis deviation angle of the camera module and the lens imaging surface position deviation are, the corresponding correction plane can be found according to F=H+dh or F=dh, and then the material margin can be removed to obtain a camera module with consistent glue thickness.

[0075] In the camera module assembly method of the present invention, the method of removing material from the first connecting part or the second connecting part to obtain the correction plane includes cutting, turning, cutting, milling or chemical etching.

[0076] The above is only one embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A camera module, comprising a lens (1), a connecting member (2), a circuit board (3), and a photoelectric imaging sensor arranged on the circuit board (3), wherein along the optical axis direction, the connecting member (2) comprises a first connecting portion (21) fixedly connected to the lens (1) and a second connecting portion (22) connected to the circuit board (3), characterized in that: A correction plane (4) is provided on the side of the first connecting portion (21) facing the second connecting portion (22), the correction plane (4) is parallel to the imaging plane of the lens (1), a connection adhesive layer (A) of a predetermined thickness is provided between the correction plane (4) and the second connecting portion (22), and the following holds: d=F+hH; or A correction plane (4) is provided on one side of the second connection portion (22) close to the circuit board (3); the correction plane (4) is parallel to the imaging plane of the lens (1); a connection adhesive layer (A) of a predetermined thickness is provided between the correction plane (4) and the circuit board (3); and d=F+h exists; Wherein, d represents the thickness of the connecting adhesive layer (A), F represents the distance from the correction plane (4) to the imaging plane, h represents the height of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board (3), and H represents the height of the second connecting portion (22).

2. The camera module according to claim 1, characterized in that: The second connecting portion (22) is assembled with the circuit board (3), and a correction plane (4) is provided on a side of the first connecting portion (21) facing the second connecting portion (22).

3. The camera module according to claim 1, characterized in that: The first connecting portion (21) and the second connecting portion (22) are integrally formed, and a correction plane (4) is provided on a side of the second connecting portion (22) close to the circuit board (3).

4. The camera module according to claim 1, characterized in that: The first connection part (21) is a lens flange, the second connection part (22) is a lens seat, the lens (1) is assembled with the second connection part (22) via the first connection (21), and a correction plane (4) is provided on a side of the second connection part (22) close to the circuit board (3).

5. A method for assembling the camera module according to any one of claims 1 to 4, comprising: S1. Assemble the lens and the connector with a size margin; S2, determining the height h between the photosensitive surface of the photoelectric imaging sensor and the upper surface of the circuit board (3); S3, setting the thickness d of the connecting adhesive layer; S4, determining the imaging surface of the lens; S5. According to the h value obtained in step S2 and the set d value, with the imaging plane of the lens as a reference, the first connecting part or the second connecting part is subjected to material removal processing to obtain a correction plane which is a free end and parallel to the imaging plane, and the first connecting part and the second connecting part are fixed by a connecting adhesive layer or the second connecting part and the circuit board are fixed by a connecting adhesive layer.

6. The assembly method according to claim 5, characterized in that: The assembly method comprises: Measuring a height H of the second connecting portion, assembling the lens with the first connecting portion, and assembling the circuit board with the second connecting portion into one component; Measuring the height h between the photosensitive surface of the photoelectric imaging sensor and the upper surface of the circuit board (3); Set the thickness d of the connecting adhesive layer; Determine the position of the lens imaging plane; According to the set d, the measured H and h, and taking the imaging plane as a reference, the first connecting portion is subjected to material removal processing to obtain a correction plane parallel to the imaging plane, so that the distance from the correction plane to the imaging plane is F=H+dh; The correction plane of the first connection part is fixedly connected to the second connection part through a connection adhesive layer.

7. The assembly method according to claim 5, characterized in that: The assembly method comprises: The lens and the first connecting part and the second connecting part are assembled into one component, or the first connecting part and the second connecting part are selected as a connecting piece with an integrally formed structure and the lens to form one component; Measuring the height h between the photosensitive surface of the photoelectric imaging sensor and the upper surface of the circuit board (3); Set the thickness d of the connecting adhesive layer; Determine the position of the lens imaging plane; According to the set d and the measured h, the second connection portion is subjected to material removal processing with the imaging surface as the reference to obtain a correction plane parallel to the imaging surface, and the distance from the correction plane to the imaging surface is F=dh, The circuit board is fixedly connected to the correction plane of the second connecting portion through a connecting adhesive layer.

8. The assembly method according to claim 5, characterized in that: Methods of removing material from the first connection portion or the second connection portion to obtain a correction plane include cutting, turning, cutting, milling or chemical etching.

Images