Electronic equipment including sensor module

Abstract

An electronic device is disclosed. The electronic device includes a housing and a sensor module disposed in at least a portion of the housing. The sensor module includes: a fingerprint recognition sensor; a protective layer covering the fingerprint recognition sensor; a bonding member disposed on the protective layer; and a ceramic layer placed on the bonding member, wherein an edge of the ceramic layer, an edge of the bonding member, and an edge of a portion of the protective layer include a processed surface. Other embodiments are also possible.

Description

Technical Field

[0001] Various embodiments are directed to electronic devices including a sensor module. Background Art

[0002] Multipurpose electronic devices may have an authentication function that uses biometric information such as a user's fingerprint or iris as a means of personal authentication. The fingerprint recognition sensor may generally be disposed on an area or button exposed to the outside of the electronic device, and may contact the user's finger to detect the fingerprint. The fingerprint recognition sensor may be manufactured through surface treatment processes such as painting, film transfer, and ceramic attachment to protect the fingerprint recognition sensor and provide the user with a good sense of operation. Among the surface treatment methods of the fingerprint recognition sensor, the ceramic attachment method may be performed by placing a ceramic sheet on the fingerprint recognition sensor using a thermosetting adhesive, and then a thermal curing process may be performed. Summary of the invention

[0003] Technical issues

[0004] In order to attach the ceramic layer to the fingerprint recognition sensor by using a thermosetting bonding member, a heat curing bonding process should generally be performed for 2 hours at 200° C. If the fingerprint recognition sensor is exposed to high temperature for a long time during the heat curing bonding process, a die mark phenomenon in which the outer surface of the fingerprint recognition sensor is deformed may occur.

[0005] The sharp edges of the ceramic layer included in the fingerprint recognition sensor module may be affected and may cause harm to the user when the user uses it. Therefore, the fingerprint recognition sensor module may include a device for protecting the sharp edges of the ceramic layer so that the fingerprint recognition sensor having the ceramic layer attached thereto is disposed in the housing of the electronic device or on a button. The fingerprint recognition sensor disposed on the front surface or the rear surface of the electronic device may be arranged so that the edge is not exposed to the outside through the structure of the housing. However, if the fingerprint recognition sensor is mounted on the side surface of the electronic device due to space limitations, the sharp edges of the ceramic layer may be exposed to the outside.

[0006] The electronic device according to various embodiments of the present disclosure may provide a sensor module including a processed ceramic layer.

[0007] Solution to the problem

[0008] According to various embodiments, an electronic device may include a housing and a sensor module arranged in at least a portion of the housing, wherein the sensor module includes a fingerprint recognition sensor, a protective layer for enclosing the fingerprint recognition sensor, an adhesive member arranged on the protective layer, and a ceramic layer arranged on the adhesive member, wherein a periphery of the ceramic layer, a periphery of the adhesive member, and a periphery of a portion of the protective layer include processed surfaces.

[0009] According to various embodiments, the sensor module may include a fingerprint recognition sensor, a protective layer enclosing the fingerprint recognition sensor, an ultraviolet (UV) curing adhesive member disposed on the protective layer, a ceramic layer disposed on the adhesive member and allowing UV rays to pass through, and a coating disposed on the ceramic layer and forming one surface of the sensor module, wherein the one surface is substantially parallel to the fingerprint recognition sensor, and a portion of the coating, the ceramic layer, the UV curing adhesive member, and the protective layer include a processed surface.

[0010] Advantageous Effects of the Present Disclosure

[0011] The electronic device according to various embodiments can omit the high-temperature thermal curing process by using the UV curing adhesive member. Due to the characteristic that the UV curing adhesive member is instantaneously cured in response to UV rays, surface deformation caused during the thermal curing process can be prevented, and the electronic device can achieve surface flatness of the sensor module.

[0012] The electronic device according to various embodiments can remove the sharp edge of the ceramic layer by processing one surface of the sensor module. The sensor module from which the sharp edge of the ceramic layer is removed can reduce the risk of harming the user and can have durability even when exposed to the outside.

[0013] The sensor module according to various embodiments may be disposed on a front surface, a rear surface, or a side surface of an electronic device without a device for protecting a side surface of the sensor module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment.

[0015] Figure 2 is a view showing a flat state of the electronic device according to the embodiment.

[0016] Figure 3 is a view showing a folded state of the electronic device according to the embodiment.

[0017] Figure 4 is an exploded perspective view of an electronic device according to an embodiment.

[0018] Figure 5is a perspective view of an electronic device according to an embodiment.

[0019] Figure 6 is a cross-sectional view of an electronic device according to an embodiment.

[0020] Figure 7 are a top view and a cross-sectional view of a sensor module according to an embodiment.

[0021] Figure 8a is a cross-sectional view of a sensor module according to an embodiment.

[0022] Figure 8b is a cross-sectional view of a sensor module according to an embodiment.

[0023] Figure 9a is a perspective view showing an electronic device according to an embodiment when viewed from the front.

[0024] Figure 9b is a cross-sectional view of an electronic device including a sensor module according to an embodiment.

[0025] Fig.10 is a cross-sectional view of a sensor module according to an embodiment.

[0026] Fig.11a is a perspective view showing an electronic device according to an embodiment when viewed from the back.

[0027] Fig.11b is a cross-sectional view of an electronic device including an antenna module according to an embodiment.

[0028] Fig.11c is a cross-sectional view of an electronic device including a sensor module according to an embodiment.

[0029] Fig.12 is a flow chart of a sensor module manufacturing process according to an embodiment.

[0030] Fig.13a is a view showing a manufacturing process of a sensor module according to an embodiment.

[0031] Fig.13b is a view showing a manufacturing process of a sensor module according to an embodiment.

[0032] Fig.13c is a view showing a manufacturing process of a sensor module according to an embodiment.

[0033] Fig.13d is a view showing a manufacturing process of a sensor module according to an embodiment.

[0034] Fig.13e is a view showing a manufacturing process of a sensor module according to an embodiment.

[0035] Fig.13f is a view showing a manufacturing process of a sensor module according to an embodiment.

[0036] Figure 13g is a view showing a manufacturing process of a sensor module according to an embodiment. DETAILED DESCRIPTION

[0037] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0038] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0039] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the result data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0040] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0041] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0042] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0043] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0044] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0045] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0046] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0047] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0048] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0049] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0051] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0052] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0055] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0056] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0057] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via a server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be run on the electronic device 101 may be run on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of running the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may perform the requested at least part of the function or service, or perform another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology or client-server computing technology may be used, for example.

[0058] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0059] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “combined to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)” when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the one element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0060] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0061] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0062] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0063] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0064] Figure 2 is a view showing a flat state of the electronic device according to the embodiment, and Figure 3 is a view showing a folded state of the electronic device according to the embodiment.

[0065] Reference Figure 2 and Figure 3 In an embodiment, the electronic device 101 may include a foldable housing 500, a hinge cover 530 covering a foldable portion of the foldable housing, and a flexible or foldable display 200 (hereinafter referred to as “display” 200) disposed in a space formed by the foldable housing 500. The electronic device 101 may include a front surface 515 on which the display 200 is disposed, a rear surface 535 as an opposite surface to the front surface 515, and a side surface 525 surrounding a space between the front surface 515 and the rear surface 535.

[0066] In an embodiment, the foldable housing 500 may include a first housing structure 510, a second housing structure 520, a first rear surface cover 580 and a second rear surface cover 590, wherein the second housing structure 520 includes a sensor area 524. The foldable housing 500 of the electronic device 101 is not limited to Figure 2 and Figure 3 The shapes and connections shown in , and can be realized by the combination and / or connection of other shapes or parts. For example, in another embodiment, the first shell structure 510 and the first rear surface cover 580 can be formed integrally with each other, and the second shell structure 520 and the second rear surface cover 590 can be formed integrally with each other.

[0067] In the illustrated embodiment, the first housing structure 510 and the second housing structure 520 may be disposed on both sides relative to the folding axis A, and may have a substantially symmetrical shape relative to the folding axis A. As will be described below, the first housing structure 510 and the second housing structure 520 may have an angle or distance therebetween that changes depending on whether the electronic device 101 is in a flat state, a folded state, or an intermediate state. In the illustrated embodiment, unlike the first housing structure 510, the second housing structure 520 also includes a sensor region 324 in which various sensors are disposed, but may have a symmetrical shape in other regions.

[0068] In an embodiment, Figure 2 As shown, the first housing structure 510 and the second housing structure 520 can form a groove that accommodates the display 200. In the embodiment shown, due to the sensor area 524, the groove can have two or more different widths in the direction perpendicular to the folding axis A.

[0069] For example, the groove may have: (1) a first width W between a first portion 510a of the first housing structure 510 parallel to the folding axis A and a first portion 520a of the second housing structure 520 formed on an edge of the sensor region 524; 1 , and (2) a second width W formed by the second portion 510 b of the first housing structure 510 and the second portion 520 b of the second housing structure 520 that does not correspond to the sensor area 524 and is parallel to the folding axis A 2 In this case, the second width W 2 Can be greater than the first width W 1 In other words, the first portion 510a of the first housing structure 510 and the first portion 520a of the second housing structure 520 having an asymmetrical shape may form a first width W of the groove. 1 , and the second portion 510b of the first housing structure 510 and the second portion 520b of the second housing structure 520 having a symmetrical shape may form a second width W of the groove 2 In an embodiment, the first portion 520a and the second portion 520b of the second housing structure 520 may have different distances from the folding axis A. The width of the groove is not limited to the example shown. In an embodiment, the groove may have multiple widths depending on the shape of the sensor area 524 or the asymmetrically shaped portions of the first housing structure 510 and the second housing structure 520.

[0070] In an embodiment, at least a portion of the first housing structure 510 and the second housing structure 520 may be formed of a metal material or a non-metal material having a rigidity and a size selected for supporting the display 200 .

[0071] In an embodiment, the sensor area 524 may be formed as a predetermined area having a corner adjacent to the second housing structure 520. However, the arrangement, shape and size of the sensor area 524 are not limited to the example shown. For example, in another embodiment, the sensor area 524 may be provided on another corner of the second housing structure 520, or on a certain area between the upper end corner and the lower end corner. In an embodiment, components embedded in the electronic device 101 to perform various functions may be exposed to the front surface 515 of the electronic device 101 through the sensor area 524 or one or more openings provided on the sensor area 524. In an embodiment, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver and a proximity sensor.

[0072] The first rear surface cover 580 may be provided on one side of the folding axis on the rear surface 535 of the electronic device 101, and may have, for example, a substantially rectangular perimeter and may have a perimeter surrounded by the first housing structure 510. Similarly, the second rear surface cover 590 may be provided on the other side of the folding axis on the rear surface 535 of the electronic device 101, and may have a perimeter surrounded by the second housing structure 520.

[0073] In the illustrated embodiment, the first rear surface cover 580 and the second rear surface cover 590 may have a substantially symmetrical shape relative to the folding axis A. However, the first rear surface cover 580 and the second rear surface cover 590 may not necessarily have a symmetrical shape, and in another embodiment, the electronic device 101 may include various shapes of the first rear surface cover 580 and the second rear surface cover 590. In yet another embodiment, the first rear surface cover 580 may be integrally formed with the first housing structure 510, and the second rear surface cover 590 may be integrally formed with the second housing structure 520.

[0074] In an embodiment, the first rear surface cover 580, the second rear surface cover 590, the first housing structure 510 and the second housing structure 520 may form a space in which various components of the electronic device 101 (e.g., a printed circuit board or a battery) are disposed. In an embodiment, one or more components may be disposed on the rear surface 535 of the electronic device 101, or may be visibly exposed. For example, at least a portion of the sub-display 290 may be visibly exposed through the first rear surface area 582 of the first rear surface cover 580. In another embodiment, one or more components or sensors may be visibly exposed through the second rear surface area 592 of the second rear surface cover 590. In an embodiment, the sensor may include a proximity sensor and / or a rear camera.

[0075] In an embodiment, the electronic device 101 may include a key input device 517. The key input device 517 may include a function button, such as a volume control button or a power button. According to an embodiment, the key input device 517 may be provided on a side surface 525 of the electronic device 101. In another embodiment, the electronic device 101 may not include a portion of the key input device 517, and the key input device not included may be implemented on the display 200 in other forms such as soft keys. According to an embodiment, the key input device 517 may include various types of sensor modules (e.g., Figure 1 For example, the key input device 517 may include a fingerprint recognition sensor module. The fingerprint recognition sensor module may be installed in the key input device 517 so that the key input device 517 can be used as a fingerprint sensor button.

[0076] Reference Figure 3 The hinge cover 530 may be disposed between the first housing structure 510 and the second housing structure 520 and may be configured to conceal internal components (eg, the hinge structure 540 (see Figure 4 )). In an embodiment, the hinge cover 530 may be hidden by a portion of the first housing structure 510 and the second housing structure 520, or may be exposed to the outside according to the state (flat state or folded state) of the electronic device 101.

[0077] For example, when the electronic device 101 is in a Figure 2 In the flat state shown, the hinge cover 530 may be hidden by the first housing structure 510 and the second housing structure 520 and may not be exposed. Figure 3 In the folded state (e.g., fully folded state) shown, the hinge cover 530 may be exposed to the outside between the first housing structure 510 and the second housing structure 520. For example, in an intermediate state where the first housing structure 510 and the second housing structure 520 are folded at a certain angle, the hinge cover 530 may be partially exposed to the outside between the first housing structure 510 and the second housing structure 520. However, in this case, the exposed area may be smaller than the exposed area in the fully folded state. In an embodiment, the hinge cover 530 may include a curved surface.

[0078] The display 200 may be disposed in a space formed by the foldable housing 500. For example, the display 200 may be located on a groove formed by the foldable housing 500, and may form most of the front surface 515 of the electronic device 101.

[0079] Therefore, the front surface 515 of the electronic device 101 may include the display 200 and some areas of the first housing structure 510 adjacent to the display 200 and some areas of the second housing structure 520 adjacent to the display 200. In addition, the rear surface 535 of the electronic device 101 may include the first rear surface cover 580, some areas of the first housing structure 510 adjacent to the first rear surface cover 580, the second rear surface cover 590, and some areas of the second housing structure 520 adjacent to the second rear surface cover 590.

[0080] The display 200 may refer to a display having at least some areas that are deformed into a flat surface or a curved surface. In an embodiment, the display 200 may include a folding area 203, a folding area 204 disposed on one side ( Figure 2 The first area 201 is arranged on the left side of the folding area 203 shown in FIG. 1 , and the first area 201 is arranged on the other side ( Figure 2 The second area 202 is on the right side of the folding area 203 shown in FIG.

[0081] Figure 2 The divided areas of the display 200 shown are examples, and the display 200 may be divided into a plurality of areas (eg, four or more areas or two areas) depending on the structure or function of the display 200. Figure 1 In the illustrated embodiment, the display 200 may be divided into a plurality of regions by a folding region 203 extending parallel to the y-axis or folding axis A. In another embodiment, the display 200 may be divided into a plurality of regions with reference to another folding region (e.g., a folding region parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis).

[0082] The first region 201 and the second region 202 may have a substantially symmetrical shape with respect to the folding region 203. However, unlike the first region 201, the second region 202 may include a notch cut out according to the presence of the sensor region 524, but may have a shape symmetrical to the first region 201 in other regions. In other words, the first region 201 and the second region 202 may include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0083] Hereinafter, operations of the first and second case structures 510 and 520 and corresponding areas of the display 200 according to a state (eg, a flat state or a folded state) of the electronic device 101 will be described.

[0084] In an embodiment, when the electronic device 101 is in a flat state (eg, Figure 2), the first housing structure 510 and the second housing structure 520 may form an angle of 180° and may be arranged to face the same direction. The surface of the first area 201 and the surface of the second area 202 of the display 200 may form an angle of 180° with each other and may face the same direction (for example, the direction in which the front surface 515 of the electronic device 101 is located). The folding area 203 may form the same plane with the first area 201 and the second area 202.

[0085] In an embodiment, when the electronic device 101 is in a folded state (eg, Figure 3 ), the first housing structure 510 and the second housing structure 520 may be arranged to face each other. The surface of the first area 201 and the surface of the second area 202 of the display 200 may form a small angle (for example, between 0° and 10°) with each other and may face each other. At least a portion of the folding area 203 may form a curved surface having a predetermined curvature.

[0086] In an embodiment, when the electronic device 101 is in an intermediate state (partially folded state), the first housing structure 510 and the second housing structure 520 may be arranged at a certain angle. The surface of the first area 201 and the surface of the second area 202 of the display 200 may form an angle greater than that in the folded state and less than that in the flat state. At least a portion of the folding area 203 may form a curved surface having a predetermined curvature, and the curvature in this state may be less than that in the folded state.

[0087] Figure 4 is an exploded perspective view of an electronic device according to an embodiment.

[0088] Reference Figure 4 In an embodiment, the electronic device 101 may include a display unit 20, a frame assembly 30, a board unit 600, a first housing structure 510, a second housing structure 520, a first rear surface cover 580, and a second rear surface cover 590. In the present disclosure, the display unit 20 may be referred to as a display module or a display assembly.

[0089] The display unit 20 may include a display 200 and one or more panels or layers on which the display 200 is mounted. In an embodiment, the panel 240 may be disposed between the display 200 and the frame assembly 30. The display 200 may be disposed on one surface (e.g., Figure 4 The plate 240 may be formed in a shape corresponding to the display 200. For example, some areas of the plate 240 may be formed in a shape corresponding to the notch 204 of the display 200.

[0090] The frame assembly 30 may include a first frame 410, a second frame 420, a hinge structure 540, a hinge cover 530, and a wiring member 430 (e.g., a flexible printed circuit board (FPC), a flexible printed circuit), wherein the hinge structure 540 is arranged between the first frame 410 and the second frame 420, the hinge cover 530 covers the hinge structure 540 when viewed from the outside, and the wiring member 430 spans the first frame 410 and the second frame 420.

[0091] In an embodiment, the frame assembly 30 may be disposed between the board 240 and the board unit 600. For example, the first frame 410 may be disposed between the first area 201 of the display 200 and the first board 610. The second frame 420 may be disposed between the second area 202 of the display 200 and the second board 620.

[0092] In an embodiment, at least a portion of the hinge structure 540 and the wiring member 430 may be disposed in the frame assembly 30. The wiring member 430 may be disposed in a direction (e.g., an x-axis direction) across the first frame 410 and the second frame 420. The wiring member 430 may be disposed in a direction (e.g., an x-axis direction) perpendicular to the folding axis (e.g., a y-axis or Figure 2 The folding axis A) is set in the direction of the folding axis (for example, the x-axis direction).

[0093] As described above, the board unit 600 may include a first board 610 disposed on the side where the first frame 410 is located and a second board 620 disposed on the side where the second frame 420 is located. The first board 610 and the second board 620 may be disposed in a space formed by the frame assembly 30, the first housing structure 510, the second housing structure 520, the first rear surface cover 580, and the second rear surface cover 590. Components for implementing various functions of the electronic device 101 may be mounted on the first board 610 and the second board 620.

[0094] The first housing structure 510 and the second housing structure 520 may be assembled with each other to be coupled to both sides of the frame assembly 30, wherein the display unit 20 is coupled to the frame assembly 30. As will be described below, the first housing structure 510 and the second housing structure 520 may slide relative to both sides of the frame assembly 30 and may be coupled to the frame assembly 30.

[0095] In an embodiment, the first housing structure 510 may include a first rotation bearing surface 512, and the second housing structure 520 may include a second rotation bearing surface 522 corresponding to the first rotation bearing surface 512. The first rotation bearing surface 512 and the second rotation bearing surface 522 may include curved surfaces corresponding to the curved surfaces included in the hinge cover 530.

[0096] In an embodiment, when the electronic device 101 is in a flat state (eg, Figure 2 When the electronic device 101 is mounted on the first rotating support surface 512 and the second rotating support surface 522, the first rotating support surface 512 and the second rotating support surface 522 may cover the hinge cover 530 so that the hinge cover 530 is not exposed to the rear surface of the electronic device 101 (for example, Figure 2 On the other hand, when the electronic device 101 is in the folded state (e.g., Figure 3 When the electronic device 101 is mounted on the hinge cover 530, the first rotation support surface 512 and the second rotation support surface 522 can rotate along the curved surface included in the hinge cover 530, so that the hinge cover 530 is exposed to the rear surface of the electronic device 101 to the greatest extent.

[0097] Figure 5 is a perspective view of an electronic device according to an embodiment, Figure 6 is a cross-sectional view of an electronic device according to an embodiment.

[0098] Reference Figure 5 and Figure 6 , the electronic device 101 may include a sensor module 700 (eg, Figure 1 sensor module 176) and housing 550 (e.g., Figure 2 foldable housing 500).

[0099] According to an embodiment, the sensor module 700 may be provided on a portion of the housing 550 to be visible from the outside. For example, the sensor module 700 may be provided on a side surface (eg, Figure 2 and Figure 3 The sensor module 700 may include a key input device (eg, Figure 2 and Figure 3 At least a portion of the key input device 517 of the sensor module 700. For example, the sensor module 700 may be formed integrally with the key input device. According to an embodiment, the sensor module 700 may include an upper surface 701 and a first processed surface 702a having a specified slope relative to the upper surface 701. The first processed surface 702a may be formed along the periphery of the sensor module 700 while being continuously connected to the upper surface 701. For example, the first processed surface 702a may extend from the upper surface 701 of the sensor module 700.

[0100] According to an embodiment, the sensor module 700 may include a biometric sensor 710, a protective layer 720, an adhesive member 730, a ceramic layer 740, a substrate layer 760, and a flexible printed circuit board (FPCB) 770. The biometric sensor 710, the protective layer 720, the adhesive member 730, the ceramic layer 740, the substrate layer 760, and the FPCB 770 may be sequentially laminated to form the sensor module 700.

[0101] The biometric sensor 710 may include at least one of a fingerprint sensor and a heart rate measurement (HRM) sensor. The biometric sensor 710 may be disposed on the substrate layer 760. The fingerprint sensor may acquire biometric information from an external object. For example, the fingerprint sensor may detect a user's fingerprint and may generate an electrical signal or data value corresponding to the detected state. The fingerprint sensor may use at least one of an optical or capacitive method and an ultrasonic method. The fingerprint sensor may include an optical module, or may include an ultrasonic oscillation unit and a receiving unit. When using an optical method, the fingerprint sensor may acquire an image of the fingerprint by using a charge coupled device (CCD) / complementary metal oxide semiconductor (CMOS) or an optical sensor such as a photodiode. When using an ultrasonic method, the fingerprint sensor may acquire fingerprint information by converting a fingerprint image reflected by an ultrasonic wave into an electrical signal. In order to identify the valleys and ridges of the user's fingerprint, the ultrasonic sensor may generate ultrasonic waves and receive reflected waves, thereby imaging as electrical pixels. The optical fingerprint sensor may acquire a fingerprint image by photographing a fingerprint detection area. According to an embodiment, the biometric sensor 710 may include an integrated circuit for acquiring biometric information, such as a sensing circuit. The integrated circuit can be manufactured by forming a circuit pattern on a silicon wafer, which is formed by cutting a silicon ingot into thin slices and performing surface treatment processes such as grinding, oxidation, etc. through processes such as photolithography, etching, deposition, and ion implantation; and cutting the circuit pattern at a constant size. According to an embodiment, the protective layer 720 may be disposed on the substrate layer 760 and the biometric sensor 710, and may be formed to enclose the biometric sensor 710. The protective layer 720 may include an epoxy molding compound (EMC). The protective layer 720 may be formed to enclose the biometric sensor 710 and protect the biometric sensor 710 from the external environment.

[0102] According to an embodiment, an ultraviolet (UV) curing adhesive member 730 (i.e., adhesive member 730) may be disposed on the protective layer 720. The UV curing adhesive member 730 may react with UV rays at room temperature and be instantaneously cured. The UV curing adhesive member 730 may have a viscosity of 2 cps to 3000 cps before curing, and may have a hardness of 15 Shore B to 80 Shore B after curing. The UV curing adhesive member 730 may be re-adhered after separation after curing. The thickness of the UV curing adhesive member 730 may be 1 μm to 30 μm. Due to the instant curing characteristics of the UV curing adhesive member 730, the time required for processing may be less than that of a thermosetting adhesive member. Since the UV curing adhesive member 730 has a low hardness even after curing, the fracture or impact of the sensor module caused by the process after curing may be prevented. Since the thermosetting adhesive member requires a high temperature, high pressure environment to cure, the outer surface of the sensor module may be bent and / or cracked due to the high temperature environment. Since the UV curing adhesive member 730 does not require a high temperature, high pressure environment for curing, it is possible to prevent the surface deformation of the sensor module 700 caused by long-term exposure to a high temperature environment.

[0103] According to an embodiment, the ceramic layer 740 may be attached to the protective layer 720 by a UV curing adhesive member 730. The ceramic layer 740 may allow UV rays to pass therethrough to cure the UV curing adhesive member 730. For example, the ceramic layer 740 may have a UV transmittance of 0.01% to 70%. The UV curing adhesive member 730 may be cured in response to the UV rays passing through the ceramic layer 740, so that the ceramic layer 740 is attached to one surface of the protective layer 720. According to an embodiment, the ceramic layer 740 may include a metal oxide-based mineral. For example, the ceramic layer 740 may include zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ) and / or glass (SiO 2 According to an embodiment, the ceramic layer 740 may have a thickness of 0.05 mm to 0.5 mm.

[0104] According to an embodiment, the ceramic layer 740 may further include a coating 750 on one surface thereof. According to an embodiment, the coating 750 of the ceramic layer 740 may include a colored coating for indicating a color. First, the coating 750 may be deposited on the ceramic layer 740 to prevent the biometric sensor 710 from being exposed to a high temperature or high pressure environment when the coating 750 is deposited. For example, the ceramic layer 740 on which the coating 750 is deposited may be disposed on the UV curing adhesive member 730. According to another embodiment, a colored coating may be formed on one surface of the ceramic layer 740 by printing, painting, etc. The coating 750 may be coated with a thickness of 0.1 μm to 1 μm. In another example, the coating 750 may include an anti-fingerprint (AF) layer to prevent contamination. The AF layer may prevent contamination materials such as fingerprints from adhering to the sensor module 700. In an embodiment, the coating 750 may include a colored coating and / or an AF layer.

[0105] According to an embodiment, even when the coating layer 750 is applied to one surface of the ceramic layer 740, the ceramic layer 740 including the coating layer 750 may have a UV transmittance of 0.01 to 70%. Unlike the above description, the ceramic layer 740 may utilize the natural color of the ceramic and may be attached to the protective layer 720 without applying the coating layer 750.

[0106] According to an embodiment, the biometric sensor 710 and the protection layer 720 may be disposed on a substrate layer 760. The substrate layer 760 may be substantially parallel to the ceramic layer 740. According to an embodiment, the substrate layer 760 may at least partially overlap a periphery of an opening 551 formed on the housing 550.

[0107] According to an embodiment, the FPCB 770 may be attached to one surface of the substrate layer 760. The FPCB 770 of the sensor module 700 may be connected to a processor (eg, Figure 1 The processor 120 of the electronic device 101 is electrically connected. The processor and the sensor module 700 of the electronic device 101 can exchange signals or data through the FPCB 770. According to an embodiment, the FPCB 770 can be formed of a material having flexibility and can be foldable or bendable. For example, a conductive film pattern such as a copper film can be formed on a polyimide (PI) film, but this should not be considered restrictive.

[0108] According to an embodiment, the upper surface 701 of the sensor module 700 may be formed substantially in parallel with the biometric sensor 710. The upper surface 701 of the sensor module 700 may be formed using a ceramic layer 740 or a coating layer 750. For example, a layer stacked on the uppermost layer of the sensor module 700 may be a ceramic layer 740 or a coating layer 750.

[0109] According to an embodiment, the side surface of the sensor module 700 may include a first processed surface 702a and a second processed surface 702b. The first processed surface 702a may be formed by portions of the coating 750, the ceramic layer 740, the bonding member 730, and the protective layer 720. The first processed surface 702a may have a specified slope relative to the upper surface 701 of the sensor module. According to an embodiment, the first processed surface 702a may be formed along the periphery of the sensor module 700. For example, the first processed surface 702a may extend from the upper surface 701 of the sensor module at different slopes in a direction away from the center of the upper surface 701 of the sensor module. Different from the above description, when the coating 750 is not applied to the ceramic layer 740, the first processed surface 702a may be formed by portions of the ceramic layer 740, the bonding member 730, and the protective layer 720. The first processed surface 702a may have a specified slope relative to the upper surface 701 of the sensor module.

[0110] According to an embodiment, the sensor module 700 includes a first processed surface 702a on a portion of the periphery including the ceramic layer 740, so that damage caused by impact can be prevented and smooth operation can be provided to the user. For example, the first processed surface 702a can prevent the sharp edge of the ceramic layer from providing a rough contact to the user by being exposed to the outside, or can prevent the sensor module 700 from being easily broken by external impact.

[0111] According to an embodiment, the second processed surface 702b may be formed by another portion of the protective layer 720 that is not included in the first processed surface 702a. The second processed surface 702b may extend from the first processed surface 702a to the substrate layer 760 in a direction substantially perpendicular to the upper surface 701 of the sensor module. According to an embodiment, the second processed surface 702b may be spaced apart from the housing 550.

[0112] According to an embodiment, the housing 550 may include an opening 551 so that the sensor module 700 is disposed therein. The opening 551 may be formed on a side surface of the housing 550 of the electronic device 101. For example, a key input device (e.g., Figure 3The key input device 517 of the housing 550 may include the above-mentioned sensor module 700. The opening 551 may be formed in a shape corresponding to the shape of the sensor module 700, and at least a portion of the sensor module 700 may be inserted into the opening 551. The sensor module 700 having at least a portion inserted into the opening 551 may be seen from the outside of the electronic device 101 through the opening 551. For example, the sensor module 700 may be seen from the outside on the side surface of the electronic device 101 through the opening 551 formed on the side surface of the housing 550. According to an embodiment, the opening 551 may be formed to be spaced apart from the periphery of the sensor module 700. When the sensor module 700 is spaced apart from a physical button (e.g., Figure 2 When the key input device 517 of the housing 550 is formed integrally with the opening 551, the electronic device 101 can provide enhanced manipulation to the user due to the space spaced between the opening 551 and the sensor module 700. According to an embodiment, the periphery of the opening 551 can overlap with the substrate layer 760. Due to the overlapping area, the housing 550 can form a contact surface 552, wherein the substrate layer 760 and the housing 550 contact each other through the contact surface 552. The sensor module 700 can be configured to have at least a portion inserted into the opening 551, and configured to make at least a portion of the substrate layer 760 of the sensor module 700 contact with the housing 550.

[0113] According to an embodiment, the housing 550 may include a first surface 553a formed along the periphery of the opening 551, a second surface 553b extending from the first surface 553a, and a third surface 553c extending from the second surface 553b. According to an embodiment, the first surface 553a may be in contact with one surface of the substrate layer 760, and may extend from the contact surface 552 between the housing 550 and the substrate layer 760. The first surface 553a may be spaced apart from the second processed surface 702b, and may extend in a direction substantially perpendicular to the substrate layer 760. The second surface 553b may have a specified slope relative to the first surface 553a, and may extend in a direction away from the sensor module 700. The third surface 553c may extend from the second surface 553b in a direction substantially perpendicular to the first surface 553a.

[0114] According to an embodiment, when the sensor module 700 is in contact with a physical button (e.g., Figure 2 When the key input device 517 is integrally formed with the housing 550, the electronic device 101 may have a second surface 553b formed on the housing 550, thereby providing enhanced manipulation to the user.

[0115] Figure 7 are a top view and a cross-sectional view of a sensor module according to an embodiment.

[0116] Reference Figure 7, the sensor module 700 may include a biometric sensor 710, a protective layer 720, a UV-curable adhesive member 730, a ceramic layer 740, a substrate layer 760, an FPCB 770, a first processed surface 702a, and a second processed surface 702b.

[0117] According to an embodiment, the biometric sensor 710 may be disposed on the substrate layer 760 .

[0118] According to an embodiment, the protection layer 720 may be disposed on the substrate layer 760, and may be formed to enclose the biometric sensor 710. The protection layer 720 may protect the biometric sensor 710 by preventing the biometric sensor 710 from being exposed to the external environment.

[0119] According to an embodiment, a UV curing adhesive member 730 may be disposed on the protective layer 720. The UV curing adhesive member 730 may allow the ceramic layer 740 to adhere to the protective layer 720.

[0120] According to an embodiment, the ceramic layer 740 may be adhered to the protective layer 720 by the UV curing adhesive member 730. In order to cure the UV curing adhesive member 730, the ceramic layer 740 may allow UV rays to pass through. According to an embodiment, the ceramic layer 740 may further include a coating layer 750 on one surface thereof. The coating layer 750 may include an AF layer to prevent contamination and / or include a coloring coating to present a color. Different from the above description, the ceramic layer 740 may be disposed on the protective layer 720 without applying the coating layer 750.

[0121] According to an embodiment, the substrate layer 760 may be provided on one surface of the biometric sensor 710 to support the biometric sensor 710 and the protective layer 720. A portion of the peripheral surface 761 of the substrate layer 760 may be in contact with the housing (eg, Figure 6 The housing 550 has an opening (eg, Figure 6 When the sensor module 700 is viewed from above, at least a portion of the peripheral surface 761 of the substrate layer 760 may be hidden by the housing.

[0122] According to an embodiment, the FPCB 770 may be disposed on an opposite surface of the substrate layer 760 to a surface in contact with the biometric sensor 710. The FPCB 770 of the sensor module 700 may be electrically connected to a process of the electronic device 101.

[0123] According to an embodiment, the first processed surface 702a may include a peripheral surface 751 of the coating 750, a peripheral surface 741 of the ceramic layer 740, a peripheral surface 731 of the UV curing adhesive member 730, and a peripheral surface 721 of a portion of the protective layer 720. According to an embodiment, the first processed surface 702a may have a specified slope relative to the upper surface 701 of the sensor module (which includes one surface of the coating 750). The peripheral surface 751 of the coating 750, the peripheral surface 741 of the ceramic layer 740, the peripheral surface 731 of the UV curing adhesive member 730, and the peripheral surface 721 of a portion of the protective layer 720 forming the first processed surface 702a may be continuously connected. According to an embodiment, the coating 750 may be formed so that the area of ​​the contact surface between the coating 750 and the ceramic layer 740 is greater than the area of ​​the surface formed by the upper surface 701 of the sensor module. The ceramic layer 740 may be formed such that the area of ​​the contact surface between the ceramic layer 740 and the UV curing adhesive member 730 is greater than the area of ​​the contact surface between the ceramic layer 740 and the coating layer 750. The UV curing adhesive member 730 may be formed such that the area of ​​the contact surface between the UV curing adhesive member 730 and the protective layer 720 is greater than the area of ​​the contact surface between the UV curing adhesive member 730 and the ceramic layer 740. According to an embodiment, the first processed surface 702a may extend in a direction away from the center of the upper surface 701 of the sensor module. Unlike the above description, the sensor module 700 may not include the coating layer 750, and therefore, the first processed surface 702a may be formed by the peripheral surface 741 of the ceramic layer 740, the peripheral surface 731 of the UV curing adhesive member 730, and the peripheral surface 721 of a portion of the protective layer 720.

[0124] According to an embodiment, the second processed surface 702b may be formed using other peripheral surfaces of the protective layer 720 except the peripheral surface 721 of the protective layer 720. The second processed surface 702b may be connected to the first processed surface 702a in a direction substantially perpendicular to the upper surface 701 of the sensor module, and may extend to the substrate layer 760. According to an embodiment, the side surface of the sensor module 700 may include the first processed surface 702a and the second processed surface 702b.

[0125] According to an embodiment, when the sensor module 700 is observed from above, the periphery of the ceramic layer 740 may include two straight lines facing each other and other peripheries connecting the two straight lines. Other peripheries may be formed using curves. For example, other peripheries may be formed as semicircles, and the two ends of the semicircle may be connected to two straight lines to overlap with the ceramic layer 740 (the semicircular periphery is bent outward). Different from the above description, when the sensor module 700 is observed from above, the shape of the ceramic layer 740 may be an ellipse or may be a rectangle with rounded corners. When the sensor module 700 is observed from above, the shapes of the protective layer 720, the UV curing adhesive member 730, the coating 750 and the substrate layer 760 may be the same or similar to the shape of the ceramic layer 740. According to an embodiment, when the sensor module 700 is observed from above, the biometric sensor 710 may have a shape different from the ceramic layer 740.

[0126] According to an embodiment, when the sensor module 700 is observed from above, the protective layer 720, the UV-curing adhesive member 730, the ceramic layer 740 and the substrate layer 760 may have center points set at the same position, and the sensor module 700 may be formed in such a shape that the area increases linearly or nonlinearly from the upper surface 701 of the sensor module toward the substrate layer 760.

[0127] Figure 8a and Figure 8b is a cross-sectional view of a sensor module according to an embodiment.

[0128] Reference Figure 8a and Figure 8b , the sensor module 700 may include a biometric sensor 710, a protective layer 720, a UV curing adhesive member 730, a ceramic layer 740, a substrate layer 760, an FPCB 770, a chamfered surface 703a (eg, Figure 6 The first processed surface 702a) and the curved surface 703b.

[0129] According to an embodiment, the biometric sensor 710 may be disposed on the substrate layer 760 .

[0130] According to an embodiment, the protection layer 720 may be disposed on the substrate layer 760, and may be formed to enclose the biometric sensor 710. The protection layer 720 may protect the biometric sensor 710 by preventing the biometric sensor 710 from being exposed to the external environment.

[0131] According to an embodiment, a UV curing adhesive member 730 may be disposed on the protective layer 720. The UV curing adhesive member 730 may allow the ceramic layer 740 to adhere to the protective layer 720.

[0132] According to an embodiment, the ceramic layer 740 may be adhered to the protective layer 720 by the UV curing adhesive member 730. In order to cure the UV curing adhesive member 730, the ceramic layer 740 may allow UV rays to penetrate.

[0133] According to an embodiment, the ceramic layer 740 may further include a coating layer 750 on one surface thereof. The coating layer 750 may include an AF layer to prevent contamination and / or include a coloring coating to present a color. Different from the above description, the ceramic layer 740 may be disposed on the protective layer 720 without applying the coating layer 750.

[0134] According to an embodiment, the substrate layer 760 may be in contact with one surface of the biometric sensor 710 to support the biometric sensor 710 and the protection layer 720 .

[0135] According to an embodiment, the FPCB 770 may be disposed on a surface opposite to a surface of the substrate layer 760 that contacts the biometric sensor 710 .

[0136] Reference Figure 8a , the chamfered surface 703a may be formed by portions of the coating layer 750, the ceramic layer 740, the UV curing adhesive member 730, and the protective layer 720. According to an embodiment, the chamfered surface 703a may have a specified slope (or angle) θ relative to the upper surface 701 of the sensor module. For example, the specified slope θ may be 10° to 70°.

[0137] Reference Figure 8b , the curved surface 703b may be formed by portions of the coating layer 750, the ceramic layer 740, the UV-cured adhesive member 730, and the protective layer 720. According to an embodiment, the curved surface 703b may form a curved surface relative to the upper surface 701 of the sensor module. For example, the curved surface 703b may have a specified curvature radius R. The specified curvature radius R may be in the range of 0.08 mm to 0.5 mm.

[0138] Since the sensor module 700 may not include the coating layer 750 unlike the above description, the chamfered surface 703 a and the curved surface 703 b may be formed by portions of the ceramic layer 740 , the UV curing adhesive member 730 , and the protective layer 720 .

[0139] Figure 9a is a perspective view of an electronic device according to an embodiment when viewed from the front, Figure 9b is a cross-sectional view of an electronic device including a sensor module according to an embodiment.

[0140] Reference Figure 9a and Figure 9b, the electronic device 800 according to the embodiment may include a housing 810 , a display 801 , a side surface key input device 817 , a front surface key input device 815 , and a sensor module 900 .

[0141] According to an embodiment, the housing 810 may include a front surface 810A, a rear surface (not shown) opposite to the front surface 810A, and a side surface 810B surrounding a space between the front surface 810A and the rear surface (not shown). According to an embodiment, the front surface 810A may be formed by at least a portion of a substantially transparent front surface plate 802 (e.g., a glass plate or a polymer plate including various coatings).

[0142] According to an embodiment, the display 801 may be arranged to contact the front surface plate 802. The display 801 may be viewed through the main part of the front surface plate 802. According to an embodiment, the display 801 may be formed with a plurality of layers. For example, the display 801 may include a thin film transistor (TFT) layer, an electrode layer, an organic layer or a pixel layer. The display 801 may emit light for sending information to a user from a pixel, and the emitted light may be sent to the outside through the transparent front surface plate 802.

[0143] According to an embodiment, the side surface key input device 817 may be provided on the side surface 810B of the housing 810. According to an embodiment, the side surface key input device 817 may include a sensor module (eg, Figure 5 sensor module 700).

[0144] According to an embodiment, the front surface key input device 815 may be provided on the front surface 810A of the housing 810. According to an embodiment, the front surface key input device 815 may include a sensor module 900.

[0145] According to an embodiment, the sensor module 900 may include a biometric sensor 710 , a protection layer 720 , an adhesive member 730 , a ceramic layer 740 , a substrate layer 760 , and an FPCB 770 .

[0146] According to an embodiment, the biometric sensor 710 may be provided on the substrate layer 760. The biometric sensor 710 may include a fingerprint recognition sensor or a heart rate measurement sensor.

[0147] According to an embodiment, the protection layer 720 may be disposed on the substrate layer 760 and may be formed to enclose the biometric sensor 710 .

[0148] According to an embodiment, a UV curing adhesive member 730 may be disposed on the protective layer 720. The UV curing adhesive member 730 may allow the ceramic layer 740 to adhere to the protective layer 720.

[0149] According to an embodiment, the ceramic layer 740 may be adhered to the protective layer 720 by the UV curing adhesive member 730. In order to cure the UV curing adhesive member 730, the ceramic layer 740 may allow UV rays to pass through. For example, the ceramic layer 740 may have a UV transmittance of 0.01% to 70%. According to an embodiment, the ceramic layer 740 may further include a coating layer 750 on one surface thereof. The coating layer 750 may include at least one of a coloring layer that presents a color and an AF layer that prevents contamination.

[0150] According to an embodiment, the substrate layer 760 may be provided on one surface of the biometric sensor 710 to support the biometric sensor 710 and the protection layer 720. The substrate layer 760 may be provided so that at least a portion thereof contacts the housing 810.

[0151] According to an embodiment, the FPCB 770 may be disposed on an opposite surface of the substrate layer 760 to a surface in contact with the biometric sensor 710. The FPCB 770 of the sensor module 900 may be electrically connected to a processor of the electronic device 800.

[0152] According to an embodiment, the sensor module 900 may be provided on the front surface 810A of the electronic device 800. For example, the front surface key input device 815 may include the sensor module 900. The side surface of the sensor module 900 may be hidden by the front surface plate 802. A protrusion may protrude from at least one area of ​​the front surface plate 802 along the side surface of the sensor module 900 to surround the side surface of the sensor module 900. The sensor module 900 may have at least a portion inserted into an opening formed on the front surface plate 802. One surface of the coating 750 may be seen from the outside through the opening formed on the front surface plate 802.

[0153] Fig.10 is a cross-sectional view of a sensor module according to an embodiment.

[0154] Reference Fig.10 , the sensor module 700 may include a biometric sensor 710 (eg, a fingerprint sensor or an HRM sensor), a protective layer 720 , a UV-curable adhesive member 730 , a ceramic layer 740 , a substrate layer 760 , an FPCB 770 , and an additional coating 780 .

[0155] According to an embodiment, the biometric sensor 710 may be disposed on the substrate layer 760 .

[0156] According to an embodiment, the protection layer 720 may be disposed on the substrate layer 760, and may be formed to enclose the biometric sensor 710. The protection layer 720 may protect the biometric sensor 710 by preventing the biometric sensor 710 from being exposed to the external environment.

[0157] According to an embodiment, a UV curing adhesive member 730 may be disposed on the protective layer 720. The UV curing adhesive member 730 may allow the ceramic layer 740 to adhere to the protective layer 720.

[0158] According to an embodiment, the ceramic layer 740 may be adhered to the protective layer 720 by the UV curing adhesive member 730. In order to cure the UV curing adhesive member 730, the ceramic layer 740 may allow UV rays to penetrate.

[0159] According to an embodiment, the substrate layer 760 may be provided on one surface of the biometric sensor 710 to support the biometric sensor 710 and the protective layer 720. A portion of the peripheral surface 761 of the substrate layer 760 may be in contact with the housing (eg, Figure 6 The housing 550 has an opening (eg, Figure 6 The periphery of the opening 551) overlaps.

[0160] According to an embodiment, the FPCB 770 may be disposed on an opposite surface of the substrate layer 760 to a surface in contact with the biometric sensor 710. The FPCB 770 of the sensor module 700 may be electrically connected to a processor of the electronic device.

[0161] According to an embodiment, the first processed surface 702a may include a peripheral surface 741 of the ceramic layer, a peripheral surface 731 of the UV curing adhesive member, and a peripheral surface 721 of a portion of the protective layer 720. According to an embodiment, the first processed surface 702a may have a slope relative to the upper surface of the ceramic layer 740. In an embodiment, the peripheral surface 741 of the ceramic layer, the peripheral surface 731 of the UV curing adhesive member, and the peripheral surface 721 of a portion of the protective layer forming the first processed surface 702a may be continuously connected. According to an embodiment, the first processed surface 702a may be formed so that the area of ​​the contact surface between the UV curing adhesive member 730 and the protective layer 720 is greater than the area of ​​the contact surface between the UV curing adhesive member 730 and the ceramic layer 740. According to an embodiment, the first processed surface 702a may extend in a direction away from the center of the ceramic layer 740.

[0162] According to an embodiment, the second processed surface 702b may be formed on other peripheral surfaces of the protective layer 720 except the peripheral surface 721 of the protective layer. The second processed surface 702b may be connected to the first processed surface 702a in a direction substantially perpendicular to the ceramic layer 740 and may extend to the substrate layer 760.

[0163] According to an embodiment, an additional coating 780 may be applied to one surface 782 of the ceramic layer 740 and the first processed surface 702a. The upper surface of the additional coating 780 may be formed along one surface 782 of the ceramic layer 740 and the first processed surface 702a. Since no separate processing is performed after the additional coating 780 is applied, the upper surface 781 of the additional coating 780 seen from the outside may include a curved portion. According to an embodiment, the side surface of the sensor module 700 may include a second processed surface 702b. According to an embodiment, the additional coating 780 may include an AF layer to prevent contamination, or include a coloring coating to present a color. According to an embodiment, the additional coating 780 may allow UV rays to pass through. For example, even when the additional coating 780 is applied, the UV transmittance of the ceramic layer 740 and the additional coating 780 may be 0.01% to 70%.

[0164] Fig.11a is a perspective view showing an electronic device according to an embodiment when viewed from the back, Fig.11b is a cross-sectional view of an electronic device including an antenna module according to an embodiment, and Fig.11c is a cross-sectional view of an electronic device including a sensor module according to an embodiment.

[0165] Reference Fig.11a , the electronic device 1000 may include a housing 1010, a sensor module 900, and an antenna module 1020 (eg, Figure 1 Antenna module 197).

[0166] According to an embodiment, the electronic device 1000 may include a case 1010 including a front surface (not shown), a rear surface 1010A, and a side surface 1010B surrounding a space between the front surface and the rear surface 1010A.

[0167] According to an embodiment, the rear surface 1010A may be formed by a substantially opaque rear surface plate 1011. The rear surface plate 1011 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials. According to an embodiment, the rear surface plate 1011 may include a curved portion that is curved from the rear surface 1010A toward the front surface on at least one side end portion and is seamlessly extended. According to an embodiment, the rear surface plate 1011 may include an opening 1021 for mounting the antenna module 1020. A plurality of openings 1021 may be formed on the rear surface plate 1011. According to an embodiment, the opening 1021 may be formed in a shape corresponding to the shape of the antenna module 1020.

[0168] According to an embodiment, the side surface 1010B may be formed by a side surface frame structure 1018 that is coupled to the front and rear surface plates 1011 and includes metal and / or polymer. In some embodiments, the rear surface plate 1011 and the side surface frame structure 1018 may be integrally formed with each other and may include the same material (e.g., a metal material such as aluminum).

[0169] According to an embodiment, the antenna module 1020 may be provided on the rear surface 1010A of the electronic device 1000. The antenna module 1020 may transmit a signal or power to the outside of the electronic device 1000, or may receive a signal or power from the outside. According to an embodiment, the electronic device 1000 may include a plurality of antenna modules 1020.

[0170] According to an embodiment, the sensor module 900 may be provided on the rear surface 1010A of the electronic device 1000. The sensor module 900 may be a biometric sensor that acquires biometric information from an external object. For example, the sensor module 900 may include a fingerprint sensor or a heart rate sensor.

[0171] Reference Fig.11b , the antenna module 1020 may include an antenna structure 1110, a UV curable adhesive member 1120 (eg, Figure 6 UV curable adhesive member 730), ceramic layer 1130 (eg, Figure 6 The antenna module 1020 may have at least a portion inserted into and disposed in the opening 1021 formed on the rear surface plate 1011 of the housing 1010. When the antenna module 1020 is viewed from the outside of the electronic device 1000, the antenna module 1020 may have at least one surface visible from the outside. The antenna module 1020 exposed to the outside may have enhanced transmission and reception efficiency.

[0172] According to an embodiment, the antenna structure 1110 may overlap the perimeter of the opening 1021 and may be disposed in contact with the bottom surface of the rear surface plate 1011. In another example, the antenna structure 1110 may be in contact with the perimeter forming the perimeter of the opening 1021. When the antenna structure 1110 is disposed in contact with the perimeter forming the perimeter of the opening 1021, the antenna structure 1110 may not include a flange shape having a portion protruding from the antenna structure 1110.

[0173] According to an embodiment, the antenna structure 1110 may transmit a signal or power to the outside (e.g., an external electronic device), or may receive a signal or power from the outside. According to an embodiment, the antenna structure 1110 may include an antenna including a conductor formed on a substrate (e.g., a PCB) or a radiator formed as a conductive pattern. According to an embodiment, the antenna structure 1110 may include a plurality of antennas. In this case, for example, the antenna may be connected to a communication module (e.g., Figure 1 The communication module 190) selects from a plurality of antennas suitable for use in a first network such as a first network (eg, Figure 1 198) or a second network (e.g., Figure 1 At least one antenna of the communication method used in the communication network of the second network 199). Signals or power can be sent or received between the communication module and the external electronic device through the selected at least one antenna. According to some embodiments, other components (e.g., RFIC) besides the radiator can be additionally formed as part of the antenna structure 1110.

[0174] According to an embodiment, a UV curing adhesive member 1120 may be disposed on the antenna structure 1110. The UV curing adhesive member 1120 may adhere the ceramic layer 1130 to the antenna structure 1110. The UV curing adhesive member 1120 may be irradiated with UV rays that pass through the ceramic layer 1130.

[0175] According to an embodiment, ceramic layer 1130 may be adhered to antenna structure 1110 by UV curing adhesive member 1120. Ceramic layer 1130 may protect antenna structure 1110 by preventing antenna structure 1110 from being exposed to the external environment. According to an embodiment, in order to cure UV curing adhesive member 1120, ceramic layer 1130 may allow UV rays to pass through.

[0176] According to an embodiment, the connector 1140 may be disposed to contact one surface of the antenna structure 1110. The connector 1140 may be connected to a wiring member (eg, Figure 6 The antenna module 1020 may be connected to a processor (eg, FPCB 770) by a wiring member connected to the connector 1140. Figure 1 The processor 120 is electrically connected.

[0177] According to an embodiment, the first processed surface 1002a of the antenna module may include the periphery of a portion of the ceramic layer 1130, the UV curing adhesive member 1120, and the antenna structure 1110. According to an embodiment, the first processed surface 1002a of the antenna module may have a slope relative to the upper surface of the ceramic layer 1130. For example, the slope of the first processed surface 1002a of the antenna module may be formed so that the area of ​​the contact surface between the UV curing adhesive member 1120 and the antenna structure 1110 is greater than the area of ​​the contact surface between the UV curing adhesive member 1120 and the ceramic layer 1130. Different from the above description, the first processed surface 1002a may be formed only on the periphery of the ceramic layer 1130 and the UV curing adhesive member 1120.

[0178] According to an embodiment, the second processed surface 1002b of the antenna module may be formed on other peripheries of the antenna structure 1110 except for the periphery included in the first processed surface 1002a of the antenna module. The second processed surface 1002b of the antenna structure may be connected to the first processed surface 1002a of the antenna structure in a direction substantially perpendicular to the ceramic layer 1130 and may extend.

[0179] Reference Fig.11c , the electronic device 1000 may include a sensor module 900. According to an embodiment, the sensor module 900 may be provided on a rear surface 1010A of the electronic device 1000. The sensor module 900 may at least partially overlap with the rear surface plate 1011 and may be provided within the electronic device 1000. A side surface of the sensor module 900 may be hidden by the rear surface plate 1011. One surface of the coating 750 may be visible from the outside through an opening formed on the rear surface plate 1011.

[0180] According to an embodiment, the sensor module 900 may include a biometric sensor 710 , a protection layer 720 , an adhesive member 730 , a ceramic layer 740 , a substrate layer 760 , and an FPCB 770 .

[0181] According to an embodiment, the biometric sensor 710 may be provided on the substrate layer 760. The biometric sensor 710 may include a fingerprint recognition sensor or a heart rate measurement sensor.

[0182] According to an embodiment, the protection layer 720 may be disposed on the substrate layer 760 and may be formed to enclose the biometric sensor 710 .

[0183] According to an embodiment, a UV curing adhesive member 730 may be disposed on the protective layer 720. The UV curing adhesive member 730 may allow the ceramic layer 740 to adhere to the protective layer 720.

[0184] According to an embodiment, the ceramic layer 740 may be adhered to the protective layer 720 by the UV curing adhesive member 730. In order to cure the UV curing adhesive member 730, the ceramic layer may allow UV rays to pass through. For example, the ceramic layer 740 may have a UV transmittance of 0.01% to 70%. According to an embodiment, a coating layer 750 may be further provided on one surface of the ceramic layer 740. The coating layer 750 may include at least one of a coloring layer that presents a color and an AF layer that prevents contamination.

[0185] According to an embodiment, the substrate layer 760 may be provided on one surface of the biometric sensor 710 to support the biometric sensor 710 and the protection layer 720. The substrate layer 760 may be provided so that at least a portion thereof contacts the housing 810.

[0186] According to an embodiment, the FPCB 770 may be disposed on an opposite surface of the substrate layer 760 to a surface in contact with the biometric sensor 710. The FPCB 770 of the sensor module 900 may be electrically connected to a processor of the electronic device 1000.

[0187] Fig.12 is a flow chart of a sensor module manufacturing process according to an embodiment, Fig.13a , Fig.13b , Fig.13c , Fig.13d , Fig.13e , Fig.13f and 13g 2 is a view showing a manufacturing process of a sensor module according to an embodiment.

[0188] Reference Fig.12 , sequentially showing the above-mentioned sensor modules (for example, Figure 6 The manufacturing process of the sensor module 700).

[0189] In operation 1201, a land grid array (LGA) may be prepared to manufacture a sensor module. Fig.13a , the LGA may include a substrate layer 1301, a biometric sensor 1303, and a protective layer 1305. A plurality of biometric sensors 1303 (e.g., Figure 6 The biometric sensor 710) may be disposed on a substrate layer 1301 (eg, Figure 6 The protective layer 1305 (e.g., Figure 6A protective layer 720) may be stacked on the substrate layer 1301 and the biometric sensor 1303. The protective layer 1305 may be formed to enclose the biometric sensor 1303. The upper surface of the protective layer 1305 may be substantially parallel to the substrate layer 1301. The substrate layer 1301, the biometric sensor 1303, and the protective layer 1305 may be formed integrally with each other to form a land grid array (LGA).

[0190] In operation 1203, a bond may be discharged onto the LGA. Fig.13b , the UV-curable adhesive member 1307 (e.g., Figure 6 The UV curable adhesive member 1307 is applied to the protective layer 1305 to overlap with the biometric sensor 1303. The UV curable adhesive member 1307 may be discharged onto the protective layer 1305 by using a bonding agent dispenser.

[0191] In operation 1205, a ceramic layer may be placed on the LGA and the ceramic layer may be pressed. Fig.13c , ceramic layer 1309 (eg, Figure 6 The ceramic layer 740 of the UV curing adhesive member 1307 can be disposed on the UV curing adhesive member 1307 to at least partially overlap with the biometric sensor 1303. The ceramic layer 1309 can be fixed on the UV curing adhesive member 1307 by using a placement jig. The ceramic layer 1309 can be pressed on the protective layer 1305 by using a pressing jig. The pressing jig can control the time and pressure for pressing the ceramic layer 1309. The ceramic layer 1309 is pressed on the protective layer 1305 so that bubbles in the UV curing adhesive member 1307 can be removed and the UV curing adhesive member can have a uniform and thin thickness. A coating (e.g., Figure 6 coating 750).

[0192] In operation 1207, UV rays may be irradiated onto the ceramic layer. Fig.13d , the UV curing adhesive member 1307 may be cured by UV rays penetrating the ceramic layer 1309. UV rays may be irradiated onto the ceramic layer 1309 by a UVLED radiator. The ceramic layer 1309 may allow the UV rays to pass through and reach the UV curing adhesive member 1307. The UV rays reaching the UV curing adhesive member 1307 may activate the adhesive member due to a chemical reaction. The UV curing adhesive member 1307 may be cured, and the ceramic layer 1309, which may be permeable to the UV rays, may adhere to the protective layer 1305. When the sensor module is exposed to a high temperature environment for a long time, the outer surface of the sensor module may be deformed and the flatness may be reduced. In operation 1207, the UV curing adhesive member 1307 is instantaneously cured, so that deformation of the outer surface can be prevented and the flatness can be enhanced.

[0193] In operation 1209, a first machined surface may be formed on the sensor module having the ceramic layer adhered thereto by a CNC process. Fig.13e The perimeter of the ceramic layer 1309, the UV curable adhesive member 1307, and a portion of the protective layer 1305 may form a first processed surface 1313 (eg, Figure 8a The chamfered surface 703a or Figure 8b The first processed surface 1313 may be formed by a first CNC processing equipment 1311. The first CNC processing equipment 1311 may use a diamond electrodeposition tool. In the operation of manufacturing the sensor module, the first processed surface 1313 is formed so that a sharp edge portion of the ceramic layer 1309 can be removed. Since the UV-cured adhesive member 1307 has a low hardness even after curing, the sensor module can withstand the processing load of the first CNC processing equipment 1311. For example, if a high-hardness adhesive is used in the sensor module, the ceramic layer 1309 may be damaged during the processing of the first processed surface 1313 or may be detached from the adhesive, thereby possibly reducing the processing reliability.

[0194] In operation 1211, the sensor module may be separated into module forms through secondary processing. Fig.13f In operation 1211, by using the second CNC processing equipment 1312, the sensor modules in the array form can be separated into module forms respectively. The other peripheries of the protective layer 1305, except for a portion of the protective layer 1305 included in the first processed surface 1313, may include a second processed surface 1314. The second CNC processing equipment 1312 can separate the sensor modules in the form of modules, and can form a flange shape of the substrate layer 1301, wherein the flange shape is more prominent than the second processed surface 1314 and the side surface of the protective layer 1305. The second CNC processing equipment 1312 can use superhard materials or polycrystalline diamond (PCD). The second CNC processing equipment 1312 can be replaced by laser cutting equipment. The first CNC processing equipment 1311 and the second CNC processing equipment 1312 can be replaced by a single piece of equipment that can form the first processed surface 1313 and cut in module form. When the first CNC machining equipment 1311 and the second CNC machining equipment 1312 are replaced with a single piece of equipment, operations 1209 and 1211 may be performed by one operation.

[0195] In operation 1213, the separated sensor module may be mounted on the FPCB. Figure 13g In operation 1213, the separated sensor module may be disposed on an FPCB 1315 (eg, Figure 6The sensor module may be mounted on the surface of the FPCB 1315 by using a surface mount device (SMD) device. The sensor module and the FPCB 1315 may be connected using various techniques, such as anisotropic conductive film (ACF) or anisotropic conductive adhesive (ACA).

[0196] According to the electronic devices (eg, Figure 6 The electronic device 101 may include a housing (eg, Figure 6 A housing 550) and a sensor module (eg, Figure 6 The sensor module 700 may include a fingerprint recognition sensor (eg, Figure 6 A biometric sensor 710 for enclosing the fingerprint sensor (eg, Figure 6 A protective layer 720, an adhesive member (eg, Figure 6 UV-curable bonding member 730), and a ceramic layer (eg, Figure 6 The ceramic layer 740), and the periphery of the ceramic layer (e.g., Figure 7 The peripheral surface 741 of the ceramic layer), the periphery of the bonding member (for example, Figure 7 The peripheral surface 731 of the UV-curable adhesive member and the peripheral surface of a portion of the protective layer (eg, Figure 7 The peripheral surface 721 of a portion of the protective layer may include a processed surface (e.g., Figure 6 a first processed surface 702a).

[0197] According to an embodiment, the electronic device may further include a coating layer (eg, Figure 6 of the coating 750), the periphery of the coating (e.g., Figure 7 The peripheral surface 751) of the coating may include a processed surface, and the coating may include at least one of an anti-fingerprint (AF) layer and a coloring layer.

[0198] According to an embodiment, the processed surface has a specified slope (e.g., Figure 8a The slope θ).

[0199] According to an embodiment, the side surface of the protective layer may include a first region forming a processed surface and a second region substantially perpendicular to the one surface of the ceramic layer (eg, Figure 6 The second processed surface 702b), and the first area can be continuous with the second area, and the slope can be in the range of 10° to 70°.

[0200] According to an embodiment, the ceramic layer may include a lower surface in contact with the bonding member and an upper surface (eg, Figure 6 The upper surface 701 of the sensor module, and the area of ​​the lower surface may be larger than the area of ​​the upper surface.

[0201] According to an embodiment, the processed surface may have a specified radius of curvature (e.g., Figure 8b The curvature radius R), and the specified curvature radius can be in the range of 0.08mm to 0.5mm.

[0202] According to an embodiment, the electronic device may further include a substrate layer (eg, Figure 6 The substrate layer 760) is provided to support the sensor module, and the housing may include an opening (eg, Figure 6 The opening 551 is formed to be spaced apart from the periphery of the sensor module to correspond to the shape of the sensor module, and the opening may have a periphery overlapping the substrate layer.

[0203] According to an embodiment, the substrate layer may be disposed inside the housing, at least a portion of the sensor module may be received in the opening, and the sensor module may be disposed on the substrate layer so that the ceramic layer faces the outside of the housing.

[0204] According to an embodiment, the bonding member may be a UV curing bonding member.

[0205] According to an embodiment, the housing may include a first surface (eg, Figure 2 a front surface 515 facing a second direction opposite to the first direction (eg, Figure 2 535), and a side surface formed between the first surface and the second surface (eg, Figure 2 525), wherein the housing may include a hinge structure (e.g., Figure 4 The hinge structure 540), the first shell structure (eg, Figure 5 510) and a second housing structure (eg, Figure 4 The second housing structure 520), wherein the hinge structure can be converted into a folded state (for example, Figure 3 of the electronic device 101) or in an unfolded state (eg, Figure 2 The electronic device 101 is in a flat state), the first housing structure is connected to the hinge structure and includes a first side surface member, the first side surface member at least partially surrounds a space between the first surface and the second surface, the second housing structure is connected to the hinge structure, includes a second side surface member at least partially surrounds another space between the first surface and the second surface, and is folded together with the first housing structure relative to the hinge structure, wherein the first surface (e.g., Figure 2 The first area 201 of the housing structure may face the first surface of the second housing structure (eg, Figure 2 A second area 202), wherein the sensor module can be arranged on the side surface.

[0206] According to an embodiment, the electronic device may further include a flexible display (eg, Figure 2 The display 200 is formed on the first surface of the housing to cross the first housing structure and the second housing structure and can be bent by a hinge structure, and the flexible display may include a transparent plate (eg, Figure 4 plate 240) to allow light emitted from the pixel to pass through.

[0207] According to an embodiment, the protection layer may be an epoxy molding compound (EMC).

[0208] According to an embodiment, the ceramic layer may have a thickness of 0.05 mm to 0.5 mm.

[0209] According to an embodiment, the ceramic layer may include zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ) and glass (SiO 2 ) at least one of.

[0210] According to an embodiment, the ceramic layer may have a UV transmittance of 0.01% to 70%.

[0211] According to the various embodiments described above, the sensor module (eg, Figure 6 The sensor module 700 may include a fingerprint recognition sensor (eg, Figure 6 A biometric sensor 710), a protective layer surrounding the fingerprint sensor (eg, Figure 6 A protective layer 720, a UV curing adhesive member (eg, Figure 6 A UV curable bonding member 730, a ceramic layer (eg, Figure 6 A ceramic layer 740), and a surface (eg, Figure 6 The coating (e.g., Figure 6 The coating 750), wherein the one surface is substantially parallel to the fingerprint recognition sensor, and a portion of the coating, the ceramic layer, the UV curing adhesive member, and the protective layer includes a processed surface (e.g., Figure 6 a first processed surface 702a).

[0212] According to an embodiment, the processed surface has a specified slope relative to a surface of the sensor module (e.g., Figure 8a The slope θ).

[0213] According to an embodiment, the side surface of the protection layer may include a first region forming a processed surface and a second region substantially perpendicular to the one surface of the sensor module (eg, Figure 6 The second processed surface 702b), and the first area can be continuous with the second area, and the slope can be in the range of 10° to 70°.

[0214] According to an embodiment, the ceramic layer may have a UV transmittance of 0.01% to 70%.

[0215] According to an embodiment, the processed surface may have a specified radius of curvature (e.g., Figure 8b The curvature radius R), and the specified curvature radius can be 0.08mm to 0.5mm

[0216] According to an embodiment, the ceramic layer may be formed such that an area of ​​a contact surface between the ceramic layer and the UV curing adhesive member is greater than an area of ​​a contact surface between the ceramic layer and the coating layer.

[0217] In the above-mentioned specific embodiment of the present disclosure, the elements included in the present disclosure are expressed in singular or plural form according to the specific embodiment. However, the singular or plural form is appropriately selected according to the proposed situation for the convenience of explanation, and the present disclosure is not limited to a single element or multiple elements. The elements expressed in plural form can be configured in singular form, or the elements expressed in singular form can be configured in multiple.

[0218] Although specific embodiments have been described in the detailed description of the present disclosure, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims. Therefore, the scope of the various embodiments of the present disclosure is not limited by the described embodiments, but by the appended claims or the equivalents of the claims.

Claims

1. An electronic device, comprising: case; as well as a sensor module disposed in at least a portion of the housing and disposed on a surface of the electronic device such that a side surface of the sensor module is exposed to the outside, Wherein, the sensor module comprises: Fingerprint recognition sensor; A protective layer, used to seal the fingerprint recognition sensor; an adhesive member disposed on the protective layer and configured as a UV curing adhesive member; a ceramic layer disposed on the bonding member and allowing UV rays to pass therethrough; and a coating layer disposed on the ceramic layer and allowing UV rays to pass therethrough, wherein the ceramic layer is adhered to the protective layer by the bonding member being cured by UV rays penetrating the ceramic layer and the coating layer, wherein the periphery of the coating layer, the periphery of the ceramic layer, the periphery of the bonding member, and the periphery of a portion of the protective layer include processed surfaces such that sharp edges of the ceramic layer are removed, wherein the processed surface has a specified slope relative to a surface of the coating exposed to the outside, wherein the periphery of the coating layer, the periphery of the ceramic layer, the periphery of the bonding member, and the periphery of a portion of the protective layer are coplanar along the specified slope and form a side surface of the sensor module, wherein the side surface of the sensor module exposed to the outside includes a side surface of the protective layer, the side surface of the protective layer includes a first area forming the processed surface and a second area perpendicular to the one surface of the coating layer, and The first region is continuous with the second region.

2. The electronic device according to claim 1, in, The coating layer includes at least one of an anti-fingerprint layer and a coloring layer.

3. The electronic device according to claim 1, in, The specified slope is in the range of 10° to 70°.

4. The electronic device according to claim 1, in, The ceramic layer includes a lower surface in contact with the bonding member and an upper surface opposite to the lower surface, Wherein, the area of ​​the lower surface is greater than the area of ​​the upper surface.

5. The electronic device according to claim 1, in, The machined surface has a specified radius of curvature, and Wherein, the specified curvature radius is in the range of 0.08 mm to 0.5 mm.

6. The electronic device according to claim 1, further comprising: a substrate layer supporting the sensor module, wherein the housing includes an opening formed to be spaced apart from a periphery of the sensor module to correspond to a shape of the sensor module, The opening has a periphery overlapping with the substrate layer.

7. The electronic device according to claim 6, in, The substrate layer is arranged in the housing, wherein at least a portion of the sensor module is accommodated in the opening, and The sensor module is arranged on the substrate layer so that the ceramic layer faces the outside of the housing.

8. The electronic device according to claim 1, in, The housing includes a first surface facing a first direction in a flat state, a second surface facing a second direction opposite to the first direction, and a side surface formed between the first surface and the second surface. Wherein, the housing comprises: A hinge structure that can be converted into a folded state or an unfolded state; A first housing structure is connected to the hinge structure and includes at least a portion A first side of the space between the first surface and the second surface is surrounded Surface elements; and A second housing structure, connected to the hinge structure, includes at least a portion of A second surface surrounding another space between the first surface and the second surface The side surface member is connected to the hinge structure and the first housing structure Fold together. wherein the first surface of the first shell structure faces the first surface of the second shell structure in the folded state, and Wherein, the sensor module is arranged on the side surface.

9. The electronic device according to claim 8, further comprising: a flexible display formed on the first surface of the housing to extend beyond the first housing structure and the second housing structure and capable of being bent by the hinge structure, Wherein, the flexible display includes a transparent plate to allow light emitted from pixels to pass through.

10. The electronic device according to claim 1, wherein: The protective layer includes an epoxy molding compound.

11. The electronic device according to claim 1, wherein: The ceramic layer has a thickness of 0.05 mm to 0.5 mm.

12. The electronic device according to claim 1, wherein: The ceramic layer includes at least one of zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ) and glass (SiO 2 ).

13. The electronic device according to claim 1, wherein: The ceramic layer has a UV transmittance of 0.01% to 70%.

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