Manufacturing methods of vibrating elements, vibrating elements and vibrating devices

Abstract

A method for manufacturing a vibration element, a vibration element, and a vibration device are provided, which can suppress the degradation of drive characteristics and reliability. The method for manufacturing the vibration element includes: a preparation step, preparing a vibration element having a base, a vibration arm, and a weighting membrane; the vibration arm having an arm portion extending from the base and a weighting portion located at the end of the arm portion; the weighting portion having a first main surface and a second main surface in a positive-negative relationship; the weighting membrane being disposed on the first main surface of the weighting portion; the first main surface having a plane and an inclined surface inclined relative to the plane; and a removal step, irradiating the weighting membrane with energy lines to remove a portion of the weighting membrane; in the removal step, irradiating the weighting membrane with energy lines from the normal direction of the plane; removing the weighting membrane disposed on the inclined surface but removing the weighting membrane disposed on the plane.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a vibrating element, a vibrating element, and a vibrating device. Background Technology

[0002] Patent Document 1 discloses a vibrating element comprising: a base; a vibrating arm extending from the base, having an arm portion and a weight-applying portion; and a weight-applying membrane formed on the weight-applying portion. Furthermore, the upper surface of the weight-applying portion is convex, having a first flat surface, a second flat surface located on both sides of the first flat surface and on the lower surface side of the first flat surface, and an inclined surface connecting the first and second flat surfaces. Moreover, the weight-applying membrane is formed throughout these first flat surfaces, second flat surfaces, and inclined surfaces. In such a vibrating element, the frequency of the vibrating element can be adjusted by irradiating the weight-applying membrane with a laser to remove a portion of the membrane.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-128211

[0004] However, in the vibration element described in Patent Document 1, if a laser is irradiated onto the weighting film on the inclined surface, the laser will be reflected obliquely according to the tilt angle of the inclined surface. The reflected laser may irradiate parts that are not intended to be processed. For example, if the reflected laser irradiates the weighting film or wiring on an adjacent vibrating arm and processes that part, there is a problem of deterioration in the frequency accuracy and reliability of the vibration element. Summary of the Invention

[0005] The method for manufacturing a vibration element according to the present invention includes: a preparation step, wherein a vibration element is prepared having a base, a vibration arm, and a weighting membrane, the vibration arm having an arm portion extending from the base and a weighting portion located at the end of the arm portion, the weighting portion having a first main surface and a second main surface in a positive-negative relationship, the weighting membrane being disposed on the first main surface of the weighting portion, the first main surface having a plane and an inclined surface inclined relative to the plane; and a removal step, wherein a portion of the weighting membrane is removed by irradiating the weighting membrane with energy lines, wherein in the removal step, the weighting membrane is irradiated with energy lines from the normal direction of the plane, and the weighting membrane disposed on the inclined surface is not removed, but the weighting membrane disposed on the plane is removed.

[0006] The vibration element of the present invention comprises: a base; a vibration arm having an arm portion extending from the base and a weighting portion located at the end of the arm portion, the weighting portion having a first main surface and a second main surface in a positive-negative relationship; and a weighting membrane disposed on the first main surface of the weighting portion, the first main surface having a plane and an inclined surface inclined relative to the plane, wherein a machining mark is formed on the weighting membrane, a portion of which is removed and recessed in the thickness direction of the vibration arm, the machining mark being formed on the weighting membrane disposed on the inclined surface but on the weighting membrane disposed on the plane.

[0007] The vibration device of the present invention has the above-described vibration element and a package for housing the vibration element. Attached Figure Description

[0008] Figure 1 This is a cross-sectional view showing the vibration device according to the first embodiment of the present invention.

[0009] Figure 2 It means Figure 1 A top view of the vibrating element of the vibrating device.

[0010] Figure 3 yes Figure 2 Sectional view along line AA in the diagram.

[0011] Figure 4 yes Figure 2 BB line section view.

[0012] Figure 5 This is a schematic diagram representing the driving vibration mode of a vibrating element.

[0013] Figure 6 This is a schematic diagram representing the detected vibration mode of a vibrating element.

[0014] Figure 7 It is a cross-sectional view showing the weight-bearing part of the drive arm.

[0015] Figure 8 It is a diagram showing the manufacturing process of a vibrating device.

[0016] Figure 9 This is a top view showing the vibrating element formed on a quartz wafer.

[0017] Figure 10 This is a cross-sectional view showing the vibration element according to the second embodiment of the present invention.

[0018] Label Explanation

[0019] 1: Vibrating element; 2: Vibrating plate; 3: Weighting film; 4: Electrode film; 6: Encapsulation; 7: Circuit element; 8: Support substrate; 10: Quartz wafer; 10A: Connecting beam; 10B: Frame; 21: Base; 22, 23: Detection arm; 24, 25: Connecting arm; 26, 27, 28, 29: Drive arm; 30: Machining mark; 32, 33, 36, 37, 38, 39: Weighting film; 41: Drive signal electrode; 42: Drive ground electrode; 43: First detection signal electrode; 44: First detection ground electrode; 45: Second detection signal electrode; 46: Second detection ground electrode; 61: Base; 62: Cover; 63: Connecting component; 81: Substrate; 82: Lead wire; 100: Vibrating device; 220, 230, 260 270, 280, 290: Groove; 221, 231, 261, 271, 281, 291: Arm; 222, 232, 262, 272, 282, 292: Weight-bearing section; 263: Upper surface; 264: Lower surface; 265: Thick-walled section; 266, 267: Thin-walled section; 268, 269: Inclined section; 611, 611a, 611b, 611c: Recess; C: Center; CP: Center plane; F0: Plane; F1, F11, F12: First plane; F2, F21, F22: Second plane; F3: Inclined surface; F31: First inclined surface; F32: Second inclined surface; G0, G1, G2: Center of gravity; L: Laser; S: Internal space; a, b, c: Arrow; ωz: Angular velocity. Detailed Implementation

[0020] Hereinafter, based on the embodiments shown in the accompanying drawings, the manufacturing method of the vibration element, the vibration element, and the vibration device of the present invention will be described in detail.

[0021] <First Implementation>

[0022] Figure 1 This is a cross-sectional view showing the vibration device according to the first embodiment of the present invention. Figure 2 It means Figure 1 A top view of the vibrating element of the vibrating device. Figure 3 yes Figure 2 Sectional view along line AA in the diagram. Figure 4 yes Figure 2 BB line section view. Figure 5 This is a schematic diagram representing the driving vibration mode of a vibrating element. Figure 6 This is a schematic diagram representing the detected vibration mode of a vibrating element. Figure 7 It is a cross-sectional view showing the weight-bearing part of the drive arm. Figure 8 It is a diagram showing the manufacturing process of a vibrating device. Figure 9 This is a top view showing the vibrating element formed on a quartz wafer.

[0023] It should be noted that, for ease of explanation, except for Figure 8 In the figures other than those shown, three mutually orthogonal axes are depicted: the X-axis, Y-axis, and Z-axis. The direction along the X-axis is also referred to as the "X-axis," the direction along the Y-axis as the "Y-axis," and the direction along the Z-axis as the "Z-axis." The arrow side of each axis is also referred to as the positive side, and the opposite side as the negative side. The positive side of the Z-axis is also referred to as "up," and the negative side as "down." The view from above along the Z-axis is also simply referred to as "top view." Furthermore, as explained later, the X-axis, Y-axis, and Z-axis also correspond to the crystal axes of quartz.

[0024] Furthermore, the term "parallel" as used in this application specification includes not only cases where the surfaces or lines of each other are parallel, but also cases where, from the perspective of common technical knowledge, there is a slight deviation from parallelism. Similarly, the term "orthogonal" includes not only cases where the surfaces or lines of each other are orthogonal, but also cases where, from the perspective of common technical knowledge, there is a slight deviation from orthogonality.

[0025] Figure 1 The vibration device 100 shown is a physical quantity sensor that detects the angular velocity ωz with the Z-axis as the detection axis. By applying the vibration device 100 to physical quantity sensors, it can be widely mounted in various electronic devices, mobile bodies, etc., becoming a highly demanding and convenient vibration device 100. The vibration device 100 includes a package 6, circuit elements 7 housed in the package 6, a support substrate 8, and a vibration element 1.

[0026] Package 6 includes: a base 61 having a recess 611 with an opening on its upper surface; and a cover 62 that blocks the opening of the recess 611 and is engaged with the upper surface of the base 61 via a coupling member 63. An internal space S is formed inside the package 6, which houses circuit elements 7, a support substrate 8, and a vibrating element 1. The internal space S is airtight and in a depressurized state, preferably closer to a vacuum. However, the atmosphere of the internal space S is not particularly limited; for example, it can be atmospheric pressure or pressurized.

[0027] Furthermore, the recess 611 is composed of multiple recesses, including: a recess 611a, which opens on the upper surface of the base 61; a recess 611b, which opens on the bottom surface of the recess 611a, with an opening width smaller than that of the recess 611a; and a recess 611c, which opens on the bottom surface of the recess 611b, with an opening width smaller than that of the recess 611b. A support substrate 8 is fixed to the bottom surface of the recess 611a to support the vibrating element 1, and a circuit element 7 is fixed to the bottom surface of the recess 611c.

[0028] The circuit element 7 includes a drive circuit for driving the vibrating element 1 and a detection circuit for detecting the angular velocity ωz applied to the vibrating element 1 based on the signal output from the vibrating element 1. The support substrate 8 is a substrate for mounting the vibrating element 1 to the base 61. The support substrate 8 has a frame-shaped substrate 81 and a plurality of leads 82 disposed on the substrate 81. The substrate 81 is fixed to the bottom surface of the recess 611a. In addition, the vibrating element 1 is fixed at the end of each lead 82, and the vibrating element 1 is electrically connected to the circuit element 7 via each lead 82 and internal wiring (not shown) formed in the base 61.

[0029] Vibration element 1 is an angular velocity detection element that detects angular velocity ωz. For example... Figure 2 As shown, the vibration element 1 has: a vibrating plate 2; an electrode membrane 4 disposed on the vibrating plate 2; and a weighting membrane 3 disposed on the electrode membrane 4.

[0030] The vibrating plate 2 is constructed from a Z-cut quartz substrate. The Z-cut quartz substrate has an area on the XY plane defined by the X-axis (which is the crystal axis of the quartz, serving as the electrical axis) and the Y-axis (which is the mechanical axis), and has a thickness along the Z-axis (which is the optical axis). However, the vibrating plate 2 can also be constructed from a piezoelectric material other than quartz. Examples of piezoelectric materials other than quartz include lithium tantalate, lithium niobate, lithium borate, and barium titanate. Furthermore, depending on the structure of the vibrating plate 2, it can also be constructed from a quartz plate with a cut angle other than Z-cut. Additionally, the vibrating plate 2 can also be constructed from a non-piezoelectric material, such as silicon. In this case, it is sufficient to arrange piezoelectric elements that expand and contract due to energization on each arm, as described later.

[0031] The vibrating plate 2 has: a base 21 located at the center of the element; a pair of detection arms 22 and 23 extending from the base 21 to both sides in the Y-axis direction; a pair of connecting arms 24 and 25 extending from the base 21 to both sides in the X-axis direction; a pair of drive arms 26 and 27 extending from the ends of the connecting arms 24 to both sides in the Y-axis direction; and a pair of drive arms 28 and 29 extending from the ends of the connecting arms 25 to both sides in the Y-axis direction. In this embodiment, the drive arms 26, 27, 28, and 29 correspond to the "vibrating arms" of the present invention.

[0032] The detection arm 22 has: an arm portion 221 extending from the base 21 towards the positive side in the Y-axis direction; a weighting portion 222 located at the end of the arm portion 221, and having a width in the X-axis direction greater than that of the arm portion 221; and a pair of grooves 220 formed on the upper and lower surfaces of the arm portion 221. Similarly, the detection arm 23 has: an arm portion 231 extending from the base 21 towards the negative side in the Y-axis direction; a weighting portion 232 located at the end of the arm portion 231, and having a width in the X-axis direction greater than that of the arm portion 231; and a pair of grooves 230 formed on the upper and lower surfaces of the arm portion 231. These detection arms 22 and 23 are formed symmetrically with respect to the base 21. Furthermore, the drive arm 26 has: an arm portion 261 extending from the end portion of the connecting arm 24 towards the positive side in the Y-axis direction; a weight-applying portion 262 located at the end of the arm portion 261, and having a width in the X-axis direction greater than that of the arm portion 261; and a pair of grooves 260 formed on the upper and lower surfaces of the arm portion 261. Similarly, the drive arm 27 has: an arm portion 271 extending from the end portion of the connecting arm 24 towards the negative side in the Y-axis direction; a weight-applying portion 272 located at the end of the arm portion 271, and having a width in the X-axis direction greater than that of the arm portion 271; and a pair of grooves 270 formed on the upper and lower surfaces of the arm portion 271. These drive arms 26 and 27 are formed symmetrically with respect to the connecting arm 24.

[0033] Additionally, the drive arm 28 includes: an arm portion 281 extending from the end of the connecting arm 25 towards the positive side in the Y-axis direction; a weight-applying portion 282 located at the end of the arm portion 281, with a width in the X-axis direction greater than that of the arm portion 281; and a pair of grooves 280 formed on the upper and lower surfaces of the arm portion 281. Similarly, the drive arm 29 includes: an arm portion 291 extending from the end of the connecting arm 25 towards the negative side in the Y-axis direction; a weight-applying portion 292 located at the end of the arm portion 291, with a width in the X-axis direction greater than that of the arm portion 291; and a pair of grooves 290 formed on the upper and lower surfaces of the arm portion 291. These drive arms 28 and 29 are formed symmetrically with respect to the connecting arm 25.

[0034] In addition, such as Figure 3 as well as Figure 4 As shown, the electrode film 4 formed on the surface of such a vibrating plate 2 has a drive signal electrode 41, a drive ground electrode 42, a first detection signal electrode 43, a first detection ground electrode 44, a second detection signal electrode 45, and a second detection ground electrode 46.

[0035] Drive signal electrodes 41 are disposed on both sides of arms 261 and 271 and on the upper and lower surfaces of arms 281 and 291. Drive ground electrodes 42 are disposed on the upper and lower surfaces of arms 261 and 271 and on both sides of arms 281 and 291. First detection signal electrodes 43 are disposed on the upper and lower surfaces of arm 221, and first detection ground electrodes 44 are disposed on both sides of arm 221. Second detection signal electrodes 45 are disposed on the upper and lower surfaces of arm 231, and second detection ground electrodes 46 are disposed on both sides of arm 231. Although not shown, these electrodes 41 to 46 are wound around the lower surface of the base 21 and electrically connected to corresponding leads among the plurality of leads 82.

[0036] In addition, electrode films 4 are also disposed on weighting sections 222, 232, 262, 272, 282, and 292. Furthermore, in weighting section 222, the first detection grounding electrodes 44 disposed on both sides of arm section 221 are electrically connected to each other using the electrode films 4 disposed on this section. Similarly, in weighting section 232, the second detection grounding electrodes 46 disposed on both sides of arm section 231 are electrically connected to each other using the electrode films 4 disposed on this section. Additionally, in weighting section 262, the drive signal electrodes 41 disposed on both sides of arm section 261 are electrically connected to each other using the electrode films 4 disposed on this section. Similarly, in weighting section 272, the drive signal electrodes 41 disposed on both sides of arm section 271 are electrically connected to each other using the electrode films 4 disposed on this section. In addition, in the weighting section 282, the drive grounding electrodes 42 disposed on both sides of the arm section 281 are electrically connected to each other by the electrode film 4 disposed in this section. Similarly, in the weighting section 292, the drive grounding electrodes 42 disposed on both sides of the arm section 291 are electrically connected to each other by the electrode film 4 disposed in this section.

[0037] The vibration element 1 of this structure detects the angular velocity ωz in the following manner. First, when a drive signal is applied between the drive signal electrode 41 and the drive ground electrode 42, the drive arms 26-29 move as follows: Figure 5 The vibration bends along the XY plane in the X-axis direction, as indicated by arrow a. This driving mode will be referred to hereafter as the driven vibration mode. Furthermore, when an angular velocity ωz is applied to the vibrating element 1 while it is driven in this mode, a new excitation occurs... Figure 6 The vibration detection mode is shown. In the vibration detection mode, a Coriolis force in the Y-axis direction, which is orthogonal to the X-axis (which is the vibration direction) and the Z-axis (which is the input axis), acts on the drive arms 26-29 to excite vibration in the direction shown by arrow b. In response to this vibration, the detection arms 22 and 23 generate detection vibration as bending vibration in the direction shown by arrow c.

[0038] Furthermore, the charge generated by the detection arm 22 through the detection vibration mode can be extracted as a first detection signal from between the first detection signal electrode 43 and the first detection ground electrode 44, and the charge generated by the detection arm 23 can be extracted as a second detection signal from between the second detection signal electrode 45 and the second detection ground electrode 46, and the angular velocity ωz can be detected based on these first and second detection signals.

[0039] like Figure 2 As shown, the weighting membrane 3 is disposed on the upper surface of the weighting parts 222, 232, 262, 272, 282, and 292. The weighting membrane 3 on the weighting parts 262, 272, 282, and 292 is used to adjust the resonant frequency (resonant frequency of each drive arm 26-29) and vibration balance of the driving vibration mode, while the weighting membrane 3 on the weighting parts 222 and 232 is used to adjust the resonant frequency (resonant frequency of each detection arm 22 and 23) and vibration balance of the detection vibration mode.

[0040] Next, the structures of the weight-bearing parts 262, 272, 282, and 292 will be described in detail. However, since the weight-bearing parts 262, 272, 282, and 292 have the same structure, for ease of explanation, the weight-bearing part 262 will be described representatively below, and the descriptions of the structures of the other weight-bearing parts 272, 282, and 292 will be omitted.

[0041] like Figure 7 As shown, the weight-applying part 262 has an upper surface 263, which is a first main surface, and a lower surface 264, which is a second main surface, arranged opposite each other in the Z-axis direction, which is the thickness direction of the drive arm 26. In addition, the weight-applying part 262 has: a thick-walled part 265, which is located on the extension line of the arm part 261 when viewed from above, and has the same thickness as the arm part 261; a pair of thin-walled parts 266 and 267, which are located on both sides of the thick-walled part 265 in the width direction, i.e., the X-axis direction, and have a thickness thinner than the thick-walled part 265; an inclined part 268, which is located between the thick-walled part 265 and the thin-walled part 266, and whose thickness decreases from the thick-walled part 265 side toward the thin-walled part 266 side; and an inclined part 269, which is located between the thick-walled part 265 and the thin-walled part 267, and whose thickness decreases from the thick-walled part 265 side toward the thin-walled part 267 side.

[0042] Furthermore, the thin-walled portions 266 and 267 are positioned biased towards the lower surface 264. On the lower surface 264 side, the thick-walled portions 265, 266, and 267, as well as the inclined portions 268 and 269, are continuously connected without steps. Therefore, the lower surface 264 of the weight-bearing portion 262 is formed as a flat surface composed of XY planes. In contrast, on the upper surface 263 side, a step composed of inclined portions 268 and 269 is formed between the thick-walled portions 265 and the thin-walled portions 266 and 267. Therefore, the upper surface 263 of the weight-bearing portion 262 is convex. Thus, since the thin-walled portions 266 and 267 are biased towards the lower surface 264, the center of gravity G1 of the weight-bearing portion 262 is located on the lower surface 264 side relative to the XY plane, i.e., the center plane CP, which intersects the center C in the thickness direction of the drive arm 26.

[0043] The convex upper surface 263 has a plane F0 formed by the XY plane and an inclined surface F3 inclined relative to the plane F0. Furthermore, the plane F0 has a first plane F1 that is coplanar with the upper surface of the vibrating plate 2, and a pair of second planes F21 and F22 located on either side of the first plane F1 along the X-axis and positioned below the first plane F1 on the lower surface 264. The first plane F1 is formed by the upper surface of the thick-walled portion 265, the second plane F21 by the upper surface of the thin-walled portion 266, and the second plane F22 by the upper surface of the thin-walled portion 267. These first planes F1 and second planes F21 and F22 are parallel to each other and are formed by XY planes orthogonal to the Z-axis direction, which is the thickness direction of the vibrating plate 2.

[0044] Furthermore, the inclined surface F3 has a first inclined surface F31 located between and connecting the first plane F1 and the second plane F21, and a second inclined surface F32 located between and connecting the first plane F1 and the second plane F22. The first inclined surface F31 is formed by the upper surface of the inclined portion 268, and the second inclined surface F32 is formed by the upper surface of the inclined portion 269. These first inclined surfaces F31 and second inclined surfaces F32 are each formed by at least one plane after rotating the XY plane about the Y-axis.

[0045] The manufacturing method of the vibrating device 100, described later, is also explained. The vibrating plate 2 is patterned by wet etching a quartz wafer whose thickness has been pre-adjusted to the thickness of the vibrating plate 2 through grinding, thereby forming its external shape and creating the convex shape of the upper surface 263. Therefore, in the upper surface 263, the first plane F1 is composed of a ground surface, while the other surfaces, namely the second planes F21 and F22 and the first and second inclined surfaces F31 and F32, are each composed of etched surfaces. Furthermore, these etched surfaces are quartz crystal faces that appear through wet etching. In the structure shown in the figure, the first inclined surface F31 is composed of two crystal faces with different inclinations, but the number of crystal faces appearing on the first inclined surface F31 varies depending on the etching speed and etching depth, and is not particularly limited. The same applies to the second inclined surface F32.

[0046] Next, the weighted film 3 will be explained. For example... Figure 2 As shown, the weighting membrane 3 includes: a weighting membrane 32 disposed on the weighting portion 222 of the detection arm 22; a weighting membrane 33 disposed on the weighting portion 232 of the detection arm 23; a weighting membrane 36 disposed on the weighting portion 262 of the drive arm 26; a weighting membrane 37 disposed on the weighting portion 272 of the drive arm 27; a weighting membrane 38 disposed on the weighting portion 282 of the drive arm 28; and a weighting membrane 39 disposed on the weighting portion 292 of the drive arm 29.

[0047] Weighted membranes 36, 37, 38, and 39 are used to adjust the resonant frequency and vibration balance of the driven vibration mode. A portion of these membranes is removed by irradiation with laser L, which serves as the energy line, to adjust the resonant frequency and vibration balance. Additionally, weighted membranes 32 and 33 are used to adjust the resonant frequency and vibration balance of the detected vibration mode. A portion of these membranes is removed by irradiation with laser L, which serves as the energy line, to adjust the resonant frequency and vibration balance.

[0048] Next, the structures of the weight-bearing films 36, 37, 38, and 39 will be described. However, since the weight-bearing films 36, 37, 38, and 39 have the same structure, for ease of explanation, the weight-bearing film 36 will be described representatively below, and the structures of the other weight-bearing films 37, 38, and 39 will be omitted.

[0049] like Figure 7As shown, the weighting membrane 36 is disposed on the upper surface 263 of the weighting portion 262, but not on the lower surface 264 or the side surface. Furthermore, the weighting membrane 36 is disposed over the entire area of ​​the weighting portion 262 in the width direction, i.e., the X-axis direction, except for a portion at the base end of the weighting portion 262. Therefore, the center of gravity G2 of the weighting membrane 36 is located on the upper surface 263 side relative to the center plane CP of the drive arm 26. That is, the center of gravity G2 is located on the opposite side of the center of gravity G1 of the weighting portion 262 relative to the center plane CP. This allows the center of gravity G0 of the entire structure composed of the weighting portion 262 and the weighting membrane 36 to be close to the center plane CP, preferably aligned with the center plane CP as shown in the figure. Therefore, unwanted vibrations of the drive arm 26 in the drive vibration mode, especially bending vibrations in the Z-axis direction, can be reduced, vibration leakage can be reduced, and the detection accuracy of the angular velocity ωz can be improved.

[0050] The position, size, and extent of the weight-applying membrane 36 are not limited to those shown in the illustration. For example, the weight-applying membrane 36 can be disposed not only on the upper surface 263, but also on the lower surface 264 or the side surface of the weight-applying portion 262. In this case, its thickness and arrangement can be adjusted so that the center of gravity G2 of the weight-applying membrane 36 is located on the upper surface 263 side closer than the center plane CP. Furthermore, the weight-applying membrane 36 can also be disposed throughout the entire area of ​​the weight-applying portion 262 along its length direction, i.e., the Y-axis direction.

[0051] The constituent material of the weighted film 3 is not particularly limited; for example, metals, inorganic compounds, resins, etc., can be used, but metals or inorganic compounds are preferred. Metals or inorganic compounds can be easily and precisely formed into films using vapor phase film deposition methods. Furthermore, the weighted film 3 composed of metals or inorganic compounds can be efficiently and precisely removed by irradiation with a laser L, which serves as the energy line.

[0052] In addition, the laser L can be, for example, pulsed lasers such as YAG, YVO4, and excimer lasers, or continuously oscillating lasers such as carbon dioxide lasers. Furthermore, as an energy beam, besides the laser L, ion beams such as FIB (Focused Ion Beam) and IBF (Ion Beam Figuring) can also be used. It should be noted that in this embodiment, a pulsed laser is used as the laser L. That is, the weighted film 36 is processed by continuously irradiating the laser L, which is focused into a spot shape. In this way, by using a pulsed laser as the laser L, the irradiation time and irradiation interval can be varied while keeping the intensity of the laser L constant, thereby controlling the amount of laser L irradiated per unit area (energy) relative to the weighted film 36. Therefore, the laser L is stable, and the weighted film 36 can be processed with high precision.

[0053] like Figure 7As shown, if the weighted film 36 is irradiated with laser L, part or all of the irradiated portion is removed, forming a processing mark 30 that is recessed from the surface. It should be noted that if only part of the irradiated portion is removed, the weighted film 36 in that portion is thinned, and as shown, the processing mark 30 is formed by a recess. Alternatively, if the entire irradiated portion is removed, the processing mark 30 is formed by a through-hole. The processing mark 30 can be any of these types. Furthermore, as described above, since a pulsed laser is used as the laser L, the processing mark 30 becomes a roughly circular dot. However, the top view shape of the processing mark 30 is not particularly limited.

[0054] The vibrating element 1 is characterized in terms of the location where the machining mark 30 is formed. Specifically, as follows: Figure 7 As shown, no machining marks 30 are formed on the weighted film 36 on the inclined surface F3 included in the upper surface 263, but machining marks 30 are formed on the weighted film 36 on the plane F0. If laser L is irradiated on the weighted film 36 on the inclined surface F3, the laser L is reflected in the X-axis direction according to the tilt angle of the inclined surface F3. The reflected laser L will unintentionally irradiate other parts of the vibrating element 1, forming unintentional machining marks 30 at the irradiated parts. For example, as shown, if the laser L' reflected by the weighted film 36 on the inclined surface F3 irradiates the weighted film 32 of the adjacent detection arm 22 and removes a part of the weighted film 32, the detuning frequency may deviate from the set value, or the vibration balance of the detected vibration mode may deteriorate.

[0055] Furthermore, if the laser L' reflected by the weighted film 36 on the inclined surface F3 irradiates the electrode film 4 of the adjacent detection arm 22, and a portion of the first detection signal electrode 43 and the first detection ground electrode 44 is removed, these electrodes 43 and 44 may break, making it impossible to detect the angular velocity ωz or resulting in a defective product with significantly reduced detection accuracy. Therefore, the manufacturing yield of the vibration device 100 decreases. In addition, even if the product is qualified at the time of manufacture, it is foreseeable that during use at the user's side, a break may occur starting from an unintentional machining mark 30, causing the vibration device 100 to malfunction, which also leads to a decrease in the reliability of the vibration device 100.

[0056] In particular, in this embodiment, the inclined surface F3 is formed by an etched surface, which has a larger surface roughness compared to the first plane F1, which is formed by a polished surface. Therefore, the surface roughness of the weighting film 36 on the inclined surface F3 also tends to increase. Consequently, the laser L reflected by the weighting film 36 on the inclined surface F3 undergoes not only specular reflection but also diffuse reflection in all directions, thus irradiating a wide area around the drive arm 26. Therefore, the aforementioned problems may become more pronounced. Furthermore, since the reflection direction of the laser L varies depending on the surface irregularity of the weighting film 36, it is difficult to control the direction of the irradiated laser L so that the reflected laser L does not irradiate other parts of the vibrating element 1.

[0057] Therefore, the laser L is not irradiated on the weighted film 36 on the inclined surface F3, but is irradiated on the weighted film 36 on the plane F0. That is, no machining mark 30 is formed on the weighted film 36 on the inclined surface F3, but a machining mark 30 is formed on the weighted film 36 on the plane F0. As a result, since the laser L is reflected in the thickness direction, i.e., the Z-axis direction, of the vibrating element 1, it is possible to effectively suppress the unintentional irradiation of the reflected laser L onto other parts located around the drive arm 26, thereby preventing the formation of unintentional machining marks 30 in those parts. Therefore, the vibrating element 1 becomes a vibrating element with excellent vibration characteristics and reliability.

[0058] In this embodiment, the plane F0 has a first plane F1 and second planes F21 and F22 located on both sides of it in the X-axis direction. With this structure, a larger area can be ensured for irradiating the laser L, resulting in a weighted film 36 with a larger adjustment width. Furthermore, by selecting the plane to be irradiated by the laser L from the first plane F1 and the second planes F21 and F22, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the overall mass balance of the structure in the width direction.

[0059] Furthermore, as mentioned above, the second planes F21 and F22 are formed by etched surfaces, and therefore have a larger surface roughness compared to the first plane F1, which is formed by polishing. Therefore, the surface roughness of the weighted film 36 on the second planes F21 and F22 is also prone to increase, similar to the inclined surface F3. Additionally, the second planes F21 and F22 are located at a position recessed towards the lower surface 264 of the first plane F1. Therefore, compared to the laser L reflected by the weighted film 36 on the first plane F1, the laser L reflected by the weighted film 36 on the second planes F21 and F22 is more prone to diffuse reflection, although not to the extent of reflection as much as the laser L reflected by the weighted film 36 on the inclined surface F3, but it may still irradiate other parts around the drive arm 26.

[0060] Therefore, it is particularly preferable not to irradiate the weighting film 36 on the second planes F21 and F22 with laser L, but to irradiate the weighting film 36 on the first plane F1. That is, it is preferable that no machining marks 30 are formed on the weighting film 36 on the second planes F21 and F22, but that machining marks 30 are formed on the weighting film 36 on the first plane F1. As a result, it is possible to more effectively suppress the situation where the laser L reflected by the weighting film 36 unintentionally irradiates other parts located around the drive arm 26 and forms machining marks 30 in those parts.

[0061] The structure of the vibrating device 100 has been described above. Next, the manufacturing method of the vibrating device 100 will be described, and the manufacturing method of the vibrating element 1 will also be described. Figure 8 As shown, the manufacturing method of the vibrating device 100 includes: a preparation step, preparing a vibrating element 1; a first frequency adjustment step, adjusting the frequency of the vibrating element 1 on a quartz crystal 10; an assembly step, assembling the vibrating element 1 onto a base 61; a second frequency adjustment step, adjusting the frequency of the vibrating element 1 on the base 61; and a sealing step, attaching a cover 62 to the base 61. The manufacturing method of the vibrating element 1 includes the preparation step in these steps, and a removal step consisting of the first frequency adjustment step and the second frequency adjustment step.

[0062] [Preparation Process]

[0063] First, a quartz wafer 10 is prepared, and its two main surfaces are subjected to various grinding processes such as grinding and polishing to flatten the two main surfaces of the quartz wafer 10 and make the thickness of the quartz wafer 10 the thickness of the vibrating plate 2. Next, the quartz wafer 10 is patterned by wet etching (anisotropic etching) to form multiple vibrating plates 2 on the quartz wafer 10. In the vibrating plates 2 formed in this way, the first plane F1 in the upper surface 263 of the weighting part 262 is formed by a grinding surface, and the other second planes F21, F22 and the first and second inclined surfaces F31, F32 are formed by etched surfaces.

[0064] Next, an electrode film 4 is formed on the surface of the vibrating plate 2 by sputtering or the like, and then a weighting film 3 is formed on the electrode film 4 by vapor deposition or the like. Thus, as... Figure 9 As shown, this results in a state where multiple vibrating elements 1 are integrally formed on the quartz wafer 10. It should be noted that... Figure 9 For ease of explanation, the vibration element 1 is simplified in the diagram. Each vibration element 1 is connected to the frame 10B via the connecting beam 10A.

[0065] [First Frequency Adjustment Process]

[0066] Next, the resonant frequency and vibration balance of the vibrating element 1 are adjusted on the quartz crystal 10. Specifically, laser L is irradiated onto the weighting films 36, 37, 38, and 39 to remove a portion of them, thereby reducing the mass of the drive arms 26, 27, 28, and 29. This adjusts the resonant frequency of the drive vibration mode of the vibrating element 1 and the vibration balance of the drive arms 26, 27, 28, and 29, reducing vibration leakage in the drive vibration mode. Additionally, laser L is irradiated onto the weighting films 32 and 33 to remove a portion of them, reducing the mass of the detection arms 22 and 23. This adjusts the resonant frequency of the detection vibration mode of the vibrating element 1, ensuring the detuned frequency falls within the specified range, and adjusts the vibration balance of the detection arms 22 and 23, reducing vibration leakage in the detection vibration mode. In addition, this process can be performed as needed. When performing this process, it is possible to select whether each weight film 32, 33, 36, 37, 38, and 39 needs to be removed. If removal is required, the amount to be removed and the location where the processing marks 30 are formed can be selected.

[0067] It should be noted that this step can be omitted if unnecessary. Furthermore, the resonant frequency and vibration balance of the vibrating element 1 can be adjusted using methods different from this embodiment. When using different methods, it is also preferable, as described above, not to irradiate the weighted film 3 on the inclined surface F3 with energy rays. As a different method, for example, an ion beam can be used as the energy line to remove the weighted film 3 instead of a laser. In this case, it is difficult to focus the ion beam into a point like a laser L; therefore, it is sufficient to irradiate the ion beam through a mask so that the ion beam does not irradiate the weighted film 3 on the inclined surface F3.

[0068] The irradiation method of laser L is as described above; therefore, the following will refer to the above. Figure 7 The following explanation uses the weighting film 36 as an example. In this process, laser L is irradiated from the normal direction of plane F0, i.e., the Z-axis direction. Furthermore, laser L does not irradiate the weighting film 36 on the inclined surface F3, but rather the weighting film 36 on plane F0. Therefore, it is possible to effectively prevent the laser L reflected from the weighting film 36 from irradiating unintended portions of the vibrating element 1 or other vibrating elements 1 formed on the quartz wafer 10, thus preventing unintended processing of the irradiated areas. Therefore, it is possible to effectively suppress the reduction in the vibration characteristics and reliability of the vibrating element 1.

[0069] In particular, in this embodiment, the inclined surface F3 is formed by an etched surface, which has a larger surface roughness compared to the first plane F1, which is formed by a polished surface. Therefore, the surface roughness of the weighted film 36 on the inclined surface F3 also tends to increase. Consequently, the laser L reflected by the weighted film 36 on the inclined surface F3 undergoes not only specular reflection but also diffuse reflection in all directions, thus illuminating a wide area around the drive arm 26. Therefore, the aforementioned problems become even more pronounced.

[0070] In this embodiment, plane F0 has a first plane F1 and second planes F21 and F22 located on both sides of it in the X-axis direction. Therefore, it is possible to ensure that the area irradiated by laser L is larger, resulting in a weighting film 36 with a larger adjustment range. In addition, by selecting the plane irradiated by laser L from the first plane F1 and the second planes F21 and F22, the position of the center of gravity G0 in the X-axis direction can be adjusted, and the mass balance in the width direction of the entire structure can be adjusted more easily.

[0071] It should be noted that the second planes F21 and F22 are formed by etched surfaces, and therefore have a larger surface roughness compared to the first plane F1, which is formed by polishing. Therefore, the surface roughness of the weighted film 36 on the second planes F21 and F22 is also prone to increase, similar to the inclined plane F3. Furthermore, the second planes F21 and F22 are located in a position recessed below the lower surface 264 of the first plane F1. Therefore, compared to the laser L reflected by the weighted film 36 on the first plane F1, the laser L reflected by the weighted film 36 on the second planes F21 and F22 is more prone to diffuse reflection, although not to the extent of reflection as much as the laser L reflected by the weighted film 36 on the inclined plane F3, it may still irradiate other parts around the drive arm 26.

[0072] Therefore, it is particularly preferable to irradiate the weighting film 36 on the first plane F1 with laser L instead of the weighting film 36 on the second planes F21 and F22. This can more effectively suppress the situation where the laser L reflected by the weighting film 36 unintentionally irradiates other parts around the drive arm 26 and forms machining marks 30 on those parts.

[0073] [Assembly Process]

[0074] Next, the vibrating element 1 is folded off from the quartz wafer 10, and the folded-off vibrating element 1 is joined to the base 61 via the support substrate 8.

[0075] [Second Frequency Adjustment Process]

[0076] During the assembly process, by fixing the vibrating element 1 to the base 61, the driving vibration mode, the resonant frequency of the detected vibration mode, and the vibration balance of the vibrating element 1 may change relative to these resonant frequencies and vibration balances on the quartz wafer 10. Furthermore, sometimes coarse adjustments to the resonant frequency and vibration balance are made in the first frequency adjustment process, and fine adjustments are made in this process. Therefore, in this process, a portion of the weighting film 3 is removed using the same method as in the first frequency adjustment process described above, and the resonant frequency and vibration balance of the vibrating element 1 are adjusted. It should be noted that this process can be omitted if not required. Alternatively, the resonant frequency and vibration balance of the vibrating element 1 can be adjusted using a method different from the first frequency adjustment process. When using a different method, as described above, it is preferable not to irradiate the weighting film 3 on the inclined surface F3 with energy lines.

[0077] [Sealing process]

[0078] Next, under vacuum conditions, the cover 62 is welded to the upper surface of the base 61, for example, by means of a joining member 63 consisting of a seam ring. Thus, the internal space S is hermetically sealed, resulting in the vibrating device 100.

[0079] The manufacturing method of the vibration device 100 has been described above. According to this manufacturing method, it is possible to suppress the occurrence of unintended parts of the vibration element 1 being processed by the laser L during manufacturing, thereby suppressing the reduction in the driving characteristics and reliability of the vibration element 1.

[0080] The above provides a detailed description of the vibrating device 100 and its manufacturing method. The vibrating element 1 included in this vibrating device 100, as described above, comprises: a base 21; a drive arm 26 serving as a vibrating arm, having an arm portion 261 extending from the base 21 and a weighting portion 262 located at the end of the arm portion 261, the weighting portion 262 having an upper surface 263 as a first main surface and a lower surface 264 as a second main surface, which are in opposite directions; and a weighting membrane 36 disposed on the upper surface 263 of the weighting portion 262. Furthermore, the upper surface 263 has a plane F0 and an inclined surface F3 inclined relative to the plane F0. Moreover, a machining mark 30 is formed on the weighting membrane 36, a portion of which is removed and recessed in the thickness direction of the drive arm 26. The machining mark 30 is not formed on the weighting membrane 36 disposed on the inclined surface F3, but rather on the weighting membrane 36 disposed on the plane F0.

[0081] Therefore, during the process of forming the machining mark 30, it is possible to effectively suppress the situation where the laser L reflected by the weighting film 36 irradiates the vibrating element 1 or other vibrating elements 1 formed on the quartz wafer 10 unintentionally, and the irradiated area is unintentionally machined. Thus, it is possible to effectively suppress the reduction of the vibration characteristics and reliability of the vibrating element 1.

[0082] Furthermore, as described above, plane F0 has a first plane F1 and second planes F21 and F22. The second planes F21 and F22 are connected to the first plane F1 via an inclined surface F3 and are located on the lower surface 264 side of the first plane F1, parallel to the first plane F1. Therefore, it is possible to ensure that the area irradiated by laser L is larger, resulting in a weighted film 36 with a larger adjustment range.

[0083] Furthermore, as described above, the second planes F21 and F22 are positioned relative to the first plane F1 on both sides of the width direction (X-axis) orthogonal to the extension direction of the arm 261 (Y-axis). With this structure, by selecting the surface from the first plane F1 and the second planes F21 and F22 from which the machining mark 30 is to be formed, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the overall mass balance of the structure in the width direction.

[0084] Furthermore, as described above, the machining mark 30 is not disposed on the weighting film 36 disposed at the second planes F21 and F22, but is formed on the weighting film 36 disposed at the first plane F1. Therefore, during the process of forming the machining mark 30, it is possible to more effectively suppress the situation where the laser L reflected by the weighting film 36 irradiates the vibrating element 1 or other unintentional portions of the vibrating element 1 formed on the quartz wafer 10, and the irradiated portion is unintentionally processed. Thus, it is possible to more effectively suppress the reduction in the vibration characteristics and reliability of the vibrating element 1.

[0085] Furthermore, as described above, the vibration device 100 includes a vibration element 1 and a package 6 for housing the vibration element 1. Therefore, it can enjoy the effects of the vibration element 1, becoming a vibration device 100 with excellent vibration characteristics and reliability.

[0086] Furthermore, as described above, the manufacturing method of the vibration element 1 included in the manufacturing method of the vibration device 100 includes: a preparation step, in which the vibration element 1 is prepared, the vibration element 1 having: a base 21; a drive arm 26 as a vibration arm, having an arm portion 261 extending from the base 21 and a weighting portion 262 located at the end of the arm portion 261, the weighting portion 262 having an upper surface 263 as a first main surface and a lower surface 264 as a second main surface in a positive-negative relationship; and a weighting film 36 disposed on the upper surface 263 of the weighting portion 262, the upper surface 263 having a plane F0 and an inclined surface F3 inclined relative to the plane F0; and a removal step, in which a portion of the weighting film 36 is removed by irradiating the weighting film 36 with a laser L as an energy line. Moreover, in the removal step, the weighting film 36 is irradiated with laser L from the normal direction of the plane F0, i.e., the Z-axis direction, and the weighting film 36 disposed on the plane F0 is removed without removing the weighting film 36 disposed on the inclined surface F3.

[0087] Therefore, during the removal process, it is possible to effectively prevent the laser L reflected by the weighting film 36 from irradiating unintended portions of the vibrating element 1 or other vibrating elements 1 formed on the quartz wafer 10, thus preventing unintended processing of the irradiated portions. Consequently, it is possible to effectively suppress the reduction in the vibration characteristics and reliability of the vibrating element 1.

[0088] Furthermore, as described above, plane F0 has a first plane F1 and second planes F21 and F22, which are connected to the first plane F1 via an inclined surface F3, located on the lower surface 264 side of the first plane F1 and parallel to the first plane F1. Therefore, it is possible to ensure that the area irradiated by laser L is larger, resulting in a weighting film 36 with a larger adjustment range.

[0089] Furthermore, as described above, the second planes F21 and F22 are positioned relative to the first plane F1 on both sides of the width direction (X-axis) orthogonal to the extension direction of the arm 261 (Y-axis). With this structure, by selecting the surface to be irradiated by the laser L from the first plane F1 and the second planes F21 and F22, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the overall mass balance of the structure in the width direction.

[0090] Furthermore, as described above, in the removal process, when the weighting film 36 is irradiated with laser L, the weighting film 36 disposed on the second planes F21 and F22 is not removed, but the weighting film 36 disposed on the first plane F1 is removed. Therefore, in the removal process, it is possible to more effectively suppress the situation where the laser L reflected from the weighting film 36 irradiates unintentional portions of the vibrating element 1 or other vibrating elements 1 formed on the quartz wafer 10, and the irradiated portions are unintentionally processed. Thus, it is possible to effectively suppress the reduction in the vibration characteristics and reliability of the vibrating element 1.

[0091] The above description pertains to this embodiment. It should be noted that the vibration element 1 of this embodiment includes drive arms 26, 27, 28, and 29 as vibration arms, but is not limited to this. For example, at least one of the drive arms 26, 27, 28, and 29 may be a vibration arm. Alternatively, drive arms 26, 27, 28, and 29 may be substituted, or at least one of the detection arms 22 and 23 may be a vibration arm. That is, at least one of the detection arms 22 and 23 may have the same structure as the aforementioned weighting portion 262 and weighting membrane 36. Furthermore, in the manufacturing method of the vibration element 1, the removal process includes a first frequency adjustment process and a second frequency adjustment process, but is not limited to this; it is sufficient to include at least one of the first and second frequency adjustment processes. That is, the removal process can be performed on the quartz wafer 10 or while mounted on the base 61. Furthermore, in the first and second frequency adjustment processes, vibration balance and frequency are adjusted respectively, but this is not limited to this; only one of them may be adjusted.

[0092] Furthermore, for example, in this embodiment, second planes F21 and F22 are formed on both sides of the first plane F1 in the X-axis direction, but the arrangement of the second planes F21 and F22 is not limited to this. For example, the second plane F2 can be formed on one or both sides of the first plane F1 in the Y-axis direction, or it can be formed in a frame shape that surrounds the first plane F1 when viewed from above. In addition, at least one of the second planes F21 and F22 can be omitted. Corresponding to the omission, the first plane F1 becomes wider, which has the advantage of increasing its irradiation area when only the first plane F1 is irradiated with laser L.

[0093] <Second Implementation>

[0094] Figure 10 This is a cross-sectional view showing the vibration element according to the second embodiment of the present invention.

[0095] The vibration device 100 of this embodiment is identical to the vibration device 100 of the first embodiment, except for the structural differences in the weight-applying portions 262, 272, 282, and 292 of the vibration element 1. Therefore, in the following description, the vibration device 100 of the second embodiment will be described primarily for its differences from the first embodiment, and descriptions of identical aspects will be omitted. Furthermore, in Figure 10 In this document, structures identical to those in the above-described embodiments are labeled with the same reference numerals. Furthermore, since the weight-applying parts 262, 272, 282, and 292 are identical in structure, for ease of explanation, the weight-applying part 262 will be described representatively below, while the descriptions of the weight-applying parts 272, 282, and 292 will be omitted.

[0096] like Figure 10As shown, in the weighting part 262 of this embodiment, unlike the first embodiment described above, the upper surface 263 is concave. The concave upper surface 263 has a plane F0 formed by XY planes and an inclined surface F3 inclined relative to plane F0. In addition, plane F0 has a pair of first planes F11 and F12 that are flush with the upper surface of the vibrating plate 2 and separated in the X-axis direction, and a second plane F2 located between the pair of first planes F11 and F12 and on the lower surface 264 side of the first planes F11 and F12. The first planes F11 and F12 and the second plane F2 are parallel to each other and are formed by XY planes orthogonal to the Z-axis direction, which is the thickness direction of the vibrating plate 2.

[0097] The inclined surface F3 has: a first inclined surface F31, which is located between and connects the first plane F11 and the second plane F2; and a second inclined surface F32, which is located between and connects the first plane F12 and the second plane F2. With this structure, by selecting the surface to be irradiated by the laser L from the first plane F11, F12, and the second plane F2, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the overall mass balance in the width direction of the structure. Furthermore, compared to the first embodiment described above, the mechanical strength of the outer periphery of the weighting portion 262 is improved; therefore, for example, damage to the weighting portion 262 caused by unintentional contact with other parts when excessive force is applied can be suppressed.

[0098] Furthermore, no machining marks 30 are formed on the weighted film 36 on the inclined surface F3, but machining marks 30 are formed on the weighted film 36 on the flat surface F0. That is, during the removal process, the weighted film 36 on the inclined surface F3 is not irradiated with laser L, but the weighted film 36 on the flat surface F0 is irradiated with laser L. As a result, it is possible to effectively suppress the unintentional irradiation of other parts around the drive arm 26 by laser L reflected from the weighted film 36, thereby preventing the formation of unintentional machining marks 30 in those parts. Therefore, it becomes a vibration element 1 with excellent vibration characteristics and reliability.

[0099] As described above, in the vibration element 1 of this embodiment, when viewed from above, the first planes F11 and F12 are positioned relative to the second plane F2 on both sides of the width direction (X-axis) perpendicular to the extension direction of the arm portion 261 (Y-axis). With this structure, by selecting the surface to be irradiated by the laser L from the first planes F11, F12, and the second plane F2, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the overall mass balance of the structure in the width direction. Furthermore, compared to the first embodiment described above, the mechanical strength of the outer periphery of the weight-bearing portion 262 is improved; therefore, for example, damage to the weight-bearing portion 262 caused by unintentional contact with other parts when excessive force is applied can be suppressed.

[0100] According to this second embodiment, the same effect as the first embodiment described above can also be achieved.

[0101] It should be noted that in this embodiment, first planes F11 and F12 are formed on both sides of the second plane F2 in the X-axis direction, but the arrangement of the first planes F11 and F12 is not limited to this. For example, one of the first planes F11 and F12 may be omitted. In addition, the first planes may be formed on one or both sides of the second plane F2 in the Y-axis direction, or they may be formed in a frame shape that surrounds the second plane F2 when viewed from above.

[0102] The above description, based on the illustrated embodiments, outlines the manufacturing method, vibration element, and vibration device of the present invention. However, the present invention is not limited thereto, and the structure of each part can be replaced with any structure having the same function. Furthermore, other arbitrary structural components can be added to the present invention. Additionally, the above embodiments can be appropriately combined.

[0103] Furthermore, the vibration element 1 is not limited to the embodiment described above. For example, it can also be an H-type angular velocity detection element having a pair of detection arms extending from the base towards the positive side of the Y-axis and a pair of drive arms extending from the base towards the negative side of the Y-axis. In this case, in the driven vibration mode, the pair of drive arms vibrate in opposite phases in the X-axis direction. When an angular velocity about the Y-axis is applied in this state, the Coriolis force is activated, and the pair of detection arms vibrate in opposite phases in the Z-axis direction. Therefore, the angular velocity about the Y-axis can be detected based on the signal output from the detection arms. In addition, the vibration element 1 can also be a two-legged tuning fork type, a three-legged tuning fork type, or other angular velocity detection elements. Furthermore, the vibration element 1 is not limited to an angular velocity detection element. For example, it can also be a detection element that detects physical quantities other than angular velocity, or it can be an oscillating element such as an oscillator.

Claims

1. A method of manufacturing a vibration element, characterized by, including: a preparation step of preparing a vibration element having a base, a vibration arm having an arm portion extending from at least one of the base and a link arm connected to the base and a weight application portion located at a distal side of the arm portion, the weight application portion having a first main surface and a second main surface in a front-back relationship, and a weight application film disposed on the first main surface of the weight application portion, the first main surface having a first plane, an inclined plane inclined with respect to the first plane, and a second plane connected to the first plane via the inclined plane, the second plane being on the second main surface side than the first plane and parallel to the first plane; and a removal step of removing a portion of the weight application film by irradiating the weight application film with an energy ray, in the removal step, the weight application film is irradiated with the energy ray from a normal direction of the first plane, the weight application film disposed on the inclined plane is not removed, and at least the weight application film disposed on the first plane is removed.

2. The vibration element manufacturing method according to claim 1, wherein in the removal step, the weight application film is irradiated with the energy ray, the weight application film disposed on the second plane is not removed, and the weight application film disposed on the first plane is removed.

3. The vibration element manufacturing method according to claim 1 or 2, wherein in a plan view, the second plane is disposed on both sides of a width direction orthogonal to an extension direction of the arm portion with respect to the first plane.

4. The vibration element manufacturing method according to claim 1 or 2, wherein in a plan view, the first plane is disposed on both sides of a width direction orthogonal to an extension direction of the arm portion with respect to the second plane.

5. A vibration element having: a base; a vibration arm having an arm portion extending from at least one of the base and a link arm connected to the base and a weight application portion located at a distal side of the arm portion, the weight application portion having a first main surface and a second main surface in a front-back relationship; and a weight application film disposed on the first main surface of the weight application portion, the first main surface having a first plane, an inclined plane inclined with respect to the first plane, and a second plane connected to the first plane via the inclined plane, the second plane being on the second main surface side than the first plane and parallel to the first plane, a processing mark in which a portion is removed and is recessed in a thickness direction of the vibration arm is formed at the weight application film, the processing mark is not formed in the weight application film disposed on the inclined plane, and is formed at least in the weight application film disposed on the first plane.

6. The vibration element according to claim 5, wherein the processing mark is not formed in the weight application film disposed on the second plane, and is formed in the weight application film disposed on the first plane.

7. The vibration element according to claim 5 or 6, wherein in a plan view, the second plane is disposed on both sides of a width direction orthogonal to an extension direction of the arm portion with respect to the first plane.

8. The vibration element according to claim 5 or 6, wherein ​ In a plan view, the first plane is disposed on both sides of the width direction orthogonal to the extending direction of the arm portion with respect to the second plane.

9. A vibrating device, characterized by Possessing: The vibration element according to any one of claims 5 to 8; and A package that houses the vibration element.

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